JP7304523B2 - lighting equipment - Google Patents

Description

The present invention relates to a lighting device having light-emitting elements such as light-emitting diodes (LEDs).

Semiconductor light-emitting devices such as LEDs are used as light sources for various products because of their small size, high efficiency, and long life. For example, lighting devices using LEDs as light sources (LED lighting) have been put to practical use.

As LED lighting, bulb-shaped LED lamps (LED bulbs) that replace conventionally known bulb-shaped fluorescent lamps and incandescent lamps, or straight-tube LED lamps that replace straight-tube fluorescent lamps with bases are known. It is In addition, lighting fixtures such as ceiling lights, downlights, and spotlights are also known as LED lighting.

For example, a conventional LED light bulb includes a light-emitting module composed of a substrate and an LED element mounted on the substrate, a globe covering the light-emitting module, a base for receiving AC power, and an AC power received by the base that causes the LED element to emit light. It includes a circuit unit that generates DC power and an outer casing that houses the circuit unit (see Patent Document 1, for example).

JP 2015-076281 A

However, in the conventional lighting device, it is difficult to standardize and share parts, and it is not possible to easily change the design.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a lighting device that facilitates design changes by standardizing and sharing parts and that can prevent a globe from falling.

In order to achieve the above object, one aspect of the lighting device according to the present invention includes a light-emitting module and a globe covering the light-emitting module, the light-emitting module having a first surface and a shape different from the first surface. a substrate having an opposite second surface; and a light-emitting element disposed on the first surface of the substrate. A projecting portion and a wall portion are provided, and a projecting portion facing the projecting portion is provided, and the projecting portion passes through a gap between the projecting portion and the wall portion. It faces the protrusion.

According to the present invention, since it is possible to standardize and share parts, it is possible to easily change the design and prevent the glove from falling.

1 is an external perspective view of an LED bulb according to an embodiment; FIG. 1 is an exploded perspective view of an LED bulb according to an embodiment; FIG. 1 is a cross-sectional view of an LED bulb according to an embodiment; FIG. 1 is a perspective view showing a state where a globe of an LED light bulb according to an embodiment is removed; FIG. 1 is a half-sectional perspective view of a globe used in an LED light bulb according to an embodiment when viewed obliquely from above; FIG. It is a half-section perspective view when the globe used for the LED electric bulb which concerns on embodiment is seen from diagonally downward. FIG. 4 is a partial cross-sectional view of the LED light bulb according to the embodiment, cut along a plane passing through the protrusion of the globe; It is a figure for demonstrating the attachment method of the globe|globe in the LED electric light bulb which concerns on embodiment. FIG. 10 is a cross-sectional view of an LED light bulb according to Modification 1; FIG. 10 is a diagram for explaining a method of attaching a globe to the LED light bulb according to Modification 2;

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below. It should be noted that each of the embodiments described below is a specific example of the present invention. Therefore, the numerical values, shapes, materials, constituent elements, arrangement positions and connection forms of constituent elements, steps and order of steps, etc. shown in the following embodiments are examples and are not intended to limit the present invention. do not have. Therefore, among the constituent elements in the following embodiments, constituent elements that are not described in independent claims representing the highest level concept of the present invention will be described as optional constituent elements.

Each figure is a schematic diagram and is not necessarily strictly illustrated. In addition, in each figure, the same reference numerals are given to the configurations having substantially the same functions, and overlapping explanations will be omitted or simplified.

In the following embodiments, as an example of a lighting device, an LED bulb, which is a substitute for a self-ballasted fluorescent lamp or an incandescent lamp, will be described.

(Embodiment)
[LED light bulb]
An overall configuration of an LED light bulb 1 according to an embodiment will be described with reference to FIGS. 1 to 4. FIG. FIG. 1 is an external perspective view of an LED light bulb 1 according to an embodiment. FIG. 2 is an exploded perspective view of the same LED light bulb 1. FIG. FIG. 3 is a cross-sectional view of the same LED light bulb 1. As shown in FIG. FIG. 4 is a perspective view showing the LED bulb 1 with the globe 20 removed.

As shown in FIGS. 1 to 4, the LED light bulb 1 includes an LED module 10, a globe 20 that covers the LED module 10, a circuit unit 30 that generates power for causing the LED module 10 to emit light, and a circuit unit 30. It is provided with an outer housing 40 to be housed and a base 50. - 特許庁As shown in FIG. 1, the LED light bulb 1 has a globe 20, an outer casing 40, and a base 50 forming an envelope.

Each component constituting the LED light bulb 1 will be described below with reference to FIGS. 1 to 4. FIG.

[LED module]
The LED module 10 is an example of a light-emitting module that emits light of a predetermined color, such as white light. The LED module 10 emits light by power supplied from the circuit unit 30 .

In this embodiment, the LED module 10 is fixed to the outer housing 40 . Specifically, the LED module 10 is fixed to the outer housing 40 so as to cover the first opening 40a of the outer housing 40 .

As shown in FIGS. 2 to 4, the LED module 10 has a substrate 11 and light emitting elements 12 arranged on the substrate 11. As shown in FIG.

The substrate 11 is a mounting substrate for mounting the light emitting element 12, and as shown in FIG. 3, a first surface (front surface) 11a on which the light emitting element 12 is mounted and a side opposite to the first surface 11a. and a second surface (back surface) 11b. That is, the second surface 11b is a surface facing the first surface 11a. The substrate 11 is, for example, a plate-shaped substrate that is substantially circular as a whole in plan view, but the shape of the substrate 11 is not limited to this, and may be polygonal such as rectangular. Also, the thickness of the substrate 11 is, for example, 0.5 mm to 5 mm, but is not particularly limited.

As shown in FIGS. 2 and 4, the edge of the substrate 11 is provided with a protrusion 11c. The protruding portion 11c is formed to protrude outward from an end portion of the substrate 11 in plan view of the substrate 11 . The protrusion 11c is a part of the substrate 11 and has a first surface 11a and a second surface 11b. Although the details will be described later, the projecting portion 11 c faces the projecting portion 21 provided on the inner surface of the globe 20 . Specifically, the second surface 11 b of the protrusion 11 c faces the protrusion 21 of the globe 20 . The planar view shape of the protrusion 11c is, for example, a rectangular shape, but is not limited to this. Any shape can be adopted for the projection 11 c as long as at least a portion of the projection 11 c faces the projection 21 of the globe 20 .

In the present embodiment, a plurality of protrusions 11c are provided. Specifically, the substrate 11 is provided with two protrusions 11c. The two protrusions 11c are provided at opposing positions. That is, the two protrusions 11c are provided at intervals of approximately 180°. A triangular mark is attached to the periphery of the protrusion 11c so that the protrusion 11c can be easily visually recognized.

As shown in FIG. 3 , the substrate 11 is fixed to the outer housing 40 with the second surface 11 b in contact with the outer housing 40 . Specifically, as shown in FIGS. 2 and 3 , a mounting portion 41 is provided in the vicinity of the first opening 40 a of the outer housing 40 , and the substrate 11 is mounted on the first opening 40 a of the outer housing 40 . It is mounted on the mounting portion 41 so as to cover the opening 40a. That is, the substrate 11 is supported by the mounting portion 41 of the outer housing 40 .

Further, the substrate 11 is provided with a through hole 11d. A screw 60 for fixing the substrate 11 and the outer housing 40 is inserted through the through hole 11d. In this embodiment, the substrate 11 and the outer housing 40 are fixed by three screws 60, so the substrate 11 is provided with three through holes 11d.

As the substrate 11, for example, a metal base substrate obtained by applying an insulating coating to a base material made of a metal material such as aluminum or copper, a ceramic substrate that is a sintered body of a ceramic material such as alumina, or a resin material. A resin substrate or the like is used. From the viewpoint of dissipating heat generated by the light emitting element 12, it is preferable to use a metal base substrate having the highest thermal conductivity among these substrates. Although the substrate 11 is a rigid substrate, it may be a flexible substrate.

Further, as shown in FIGS. 2 and 3, a connector 13 is provided as a power feeding section in the central portion of the first surface 11a of the substrate 11. As shown in FIG. The connector 13 has a pair of conductive members 13a and an insulating member 13b that holds the pair of conductive members 13a. A part of the insulating member 13b of the connector 13 penetrates the substrate 11. By inserting the connector pin 33a led out from the circuit unit 30 into the insulating member 13b, the connector pin 33a and the conductive member 13a are connected. Connected. Although not shown, metal wiring (not shown) for electrically connecting the conductive member 13a of the connector 13 and the light emitting element 12 is formed on the first surface 11a of the substrate 11 .

The light emitting element 12 is arranged on the first surface 11 a of the substrate 11 . In this embodiment, a plurality of light emitting elements 12 are mounted on substrate 11 so as to form an annular array. Although six light emitting elements 12 are mounted in this embodiment, the number of light emitting elements 12 mounted is not limited to this, and may be one.

The light emitting element 12 in the present embodiment is an individually packaged surface mount device (SMD) type LED element, and as shown in FIG. It has a primarily mounted LED chip 12b and a sealing member 12c that seals the LED chip 12b. A light emitting element 12 that is an SMD type LED element is secondarily mounted on the substrate 11 .

The container 12a is a resin molded article made of white resin or a white ceramic molded article, and has an inverted truncated cone-shaped concave portion (cavity). The inner side surface of the recess is inclined and configured to reflect upward the light from the LED chip 12b.

The LED chip 12b is mounted on the bottom surface of the recess of the container 12a. The LED chip 12b is an example of a semiconductor light emitting element that emits light with a predetermined DC power, and is a bare chip that emits monochromatic visible light. The LED chip 12b is, for example, a blue LED chip that emits blue light when energized.

The sealing member 12c is a translucent insulating resin material such as silicone resin. Sealing member 12c in the present embodiment contains a phosphor as a wavelength conversion material that converts the wavelength of light from LED chip 12b. That is, the sealing member 12c is a phosphor-containing resin in which a phosphor is contained in a translucent resin, and wavelength-converts (color-converts) the light from the LED chip 12b into a predetermined wavelength. The sealing member 12c is filled in the recess of the container 12a.

For example, when the LED chip 12b is a blue LED chip, the sealing member 12c contains YAG (yttrium-aluminum-garnet)-based yellow phosphor particles dispersed in a silicone resin to obtain white light. Resin can be used. As a result, the yellow phosphor particles are excited by the blue light from the blue LED chip and emit yellow light. White light is emitted as the combined light. A light diffusing material such as silica, a filler, and the like may be dispersed in the sealing member 12c.

A plurality of light emitting elements 12 configured in this manner are connected in series, for example, and emit light by DC power supplied from the circuit unit 30 via the connector 13 . The mode of connection of the plurality of light emitting elements 12 (series connection, parallel connection, combination of series connection and parallel connection, etc.) is not particularly limited.

[gloves]
As shown in FIGS. 2 to 4, the globe 20 is an example of a translucent cover that covers the LED module 10. FIG. The globe 20 is a hollow member having an opening 20a, and has a substantially hemispherical shape with a closed top on the side opposite to the opening 20a. The shape of the globe 20 is not limited to a substantially hemispherical shape, and may be a semi-elliptical shape or the like. , A-type, G-type, E-type, etc.).

The globe 20 is configured to extract light emitted from the LED module 10 (light emitting element 12) to the outside of the lamp. In other words, the light from the LED module 10 incident on the inner surface of the globe 20 is transmitted through the globe 20 and extracted to the outside of the globe 20 .

As a material of the globe 20, a translucent material such as a resin material such as polycarbonate or acryl or a glass material such as silica glass can be used.

Alternatively, the globe 20 may be a diffusion cover having light diffusing properties (light scattering properties). For example, by dispersing a light diffusing material such as light reflecting fine particles in a translucent resin material to fabricate the globe 20, the globe 20 can have light diffusing properties. By giving the globe 20 light diffusing properties, the light incident on the globe 20 from the LED module 10 can be diffused, so that the light distribution angle can be widened. In addition, since LED light has strong directivity, if an LED is used as the light source of the light emitting element 12, a crushing feeling (luminance unevenness) occurs due to the plurality of light emitting elements 12, but the globe 20 is provided with light diffusing properties. Thus, the squishy feeling caused by the plurality of light emitting elements 12 can be suppressed.

In addition, when the globe 20 is provided with light diffusing properties, the structure is not limited to the structure in which the light diffusing material is dispersed inside the translucent member. For example, a milky-white light diffusing film containing a light diffusing material or the like is formed on the surface (inner surface or outer surface) of the globe 20, or minute unevenness is formed on the surface of the globe 20 by texture processing or the like instead of using a light diffusing material. Alternatively, by printing a dot pattern on the surface of the globe 20, the globe 20 may have light diffusing properties.

In the present embodiment, the globe 20 is a milky-white diffusion cover formed by injection molding using a translucent resin material in which a light diffusion material is dispersed. Alternatively, the globe 20 may be made transparent so that the LED module 10 inside can be seen without giving the globe 20 a light diffusion function.

As shown in FIG. 3, in the present embodiment, globe 20 is configured to cover LED module 10 entirely. That is, the globe 20 covers the substrate 11 and the light emitting elements 12 . Specifically, the globe 20 is configured to surround the entire side surface of the substrate 11 , and the open end 20 b of the globe 20 is located beyond the substrate 11 .

Here, a specific shape of the glove 20 will be described with reference to FIGS. 5A, 5B and 6 while referring to FIG. 5A and 5B are perspective views showing half cross-sections of globe 20 used in LED light bulb 1 according to the embodiment. FIG. 5A shows the state when the globe 20 is viewed obliquely from above, and FIG. 5B shows the state when the globe 20 is viewed obliquely from below. FIG. 6 is a partial cross-sectional view of the LED bulb 1 cut along a plane passing through the projecting portion 21 of the globe 20. As shown in FIG. In addition, in FIG. 5A, the configuration around the protrusion 11c of the substrate 11 is indicated by a dashed line. Moreover, the circuit unit 30 is omitted in FIG.

As shown in FIGS. 5A and 5B, the inner surface of the globe 20 is provided with a protruding portion 21 that protrudes to a position facing the second surface 11b of the substrate 11 of the LED module 10 . As shown in FIGS. 5A and 6 , the projecting portion 21 faces the projecting portion 11 c provided on the substrate 11 . Specifically, the projecting portion 21 has a flat surface facing the second surface 11b of the projecting portion 11c.

A plurality of protrusions 21 are provided. Specifically, the projections 21 are provided in the same number as the projections 11c of the substrate 11. In the present embodiment, as shown in FIG. there is The two protrusions 21 are provided at opposing positions. That is, the two protruding portions 21 are provided at intervals of approximately 180°.

As shown in FIGS. 5A and 5B , each projecting portion 21 extends along the circumferential direction of globe 20 and is formed as a ridge on the inner surface of globe 20 . Specifically, the protruding portion 21 extends along the opening 20a of the globe 20 along the opening 20b along the circumferential direction of the opening 20a. Further, the end surface of the projecting portion 21 on the side of the substrate 11 and the end surface of the open end portion 20b of the globe 20 are flush with each other. The length of the projection 21 in the extending direction is, for example, 5 mm to 10 mm, but is not limited to this. Moreover, the length of the protrusion 21 in the extending direction is preferably longer than the width of the protrusion 11 c of the substrate 11 . As an example, the cross-sectional shape of the projecting portion 21 whose normal is the extending direction of the projecting portion 21 is a rectangular shape, but the shape is not limited to this.

As shown in FIGS. 5A and 5B, the inner surface of the globe 20 is further provided with a first wall portion 22 and a second wall portion 23 . The first wall portion 22 and the second wall portion 23 extend along the inner surface of the globe 20 in a direction away from the open end portion 20b of the globe 20 . Specifically, it extends linearly from the end face of the open end 20 b of the globe 20 toward the top of the globe 20 .

The first wall portion 22 and the second wall portion 23 are formed as protrusions on the inner surface of the globe 20 in the same manner as the projecting portion 21 . The projection amount (height) of the first wall portion 22 and the second wall portion 23 from the inner surface of the globe 20 is the same, and the projection amount (height) of the projection portion 21 from the inner surface of the globe 20 is the same. is not limited to The amount of protrusion (height) of the protrusion 21, the first wall 22, and the second wall 23 is, for example, 1 mm to 5 mm, but is not limited to this.

As shown in FIG. 5A, the first wall portion 22 is located on the side of the projection 11c of the substrate 11 of the LED module 10, and is located at one end in the extending direction of the projection 21 of the globe 20. located nearby. In the present embodiment, projecting portion 21 and first wall portion 22 are formed continuously along the inner surface of globe 20 . Specifically, the projecting portion 21 and the first wall portion 22 are integrally formed so that the projecting portion 21 and the first wall portion 22 are L-shaped in side view. Therefore, the cross-sectional shapes of the projecting portion 21 and the first wall portion 22 are the same.

The second wall portion 23 is formed to have a gap G along the circumferential direction of the globe 20 between the second wall portion 23 and the projecting portion 21 of the globe 20 . Specifically, the second wall portion 23 is formed to have a gap G between the second wall portion 23 and the other end portion in the extending direction of the projecting portion 21 . The gap G is equal to or greater than the width of the projection 11c so that the projection 11c of the substrate 11 can pass through. In this manner, a gap G that is equal to or greater than the width of the protrusion 11 c exists along the circumferential direction of the globe 20 between the second wall portion 23 and the protrusion 21 .

Although the details will be described later, the globe 20 configured in this way is combined with the LED module 10 and fixed to the outer casing 40 . In this embodiment, the globe 20 is combined with the substrate 11 by horizontally rotating the globe 20 . At this time, a protrusion 24 is provided on the outer surface of the globe 20 as shown in FIGS. In other words, it is possible to confirm whether the globe 20 is correctly combined with the LED module 10 by using the convex portion 24 provided on the outer surface of the globe 20 . Specifically, as shown in FIG. 1 , when the globe 20 is combined with the LED module 10 , the projection 24 of the globe 20 is provided at a position corresponding to the mark 43 provided on the outer housing 40 . It is As an example, the convex portion 24 is formed as a ridge extending along the outer surface of the globe 20 in a direction away from the open end 20b of the globe 20 .

[Circuit unit]
The circuit unit 30 shown in FIGS. 2 and 3 includes the LED module 10 (light emitting element 12)
is a drive circuit for emitting light. In other words, the circuit unit 30 supplies power to the LED module 10 for causing the LED module 10 to emit light. In this embodiment, the circuit unit 30 is a lighting circuit for lighting and extinguishing the LED module 10, and constitutes a power supply unit (power supply circuit). The circuit unit 30 , for example, converts AC power supplied from the base 50 into DC power and supplies the DC power to the LED module 10 . The LED module 10 (light emitting element 12) is lit or extinguished by DC power supplied from the circuit unit 30 (lighting circuit).

The circuit unit 30 has a circuit board 31 and a plurality of electronic components 32 mounted on the circuit board 31 . The circuit unit 30 is arranged between the LED module 10 and the base 50 . Specifically, the circuit unit 30 is housed in the outer housing 40 . The circuit unit 30 is held by the outer housing 40 by engaging the circuit board 31 with an engaging portion provided on the inner surface of the outer housing 40 . The means for fixing the circuit board 31 is not limited to this, and the circuit board 31 may be fixed to the outer casing 40 with screws or the like.

The circuit board 31 is a printed circuit board (PCB) having metal wiring such as copper foil formed on one surface (solder surface). A plurality of electronic components 32 mounted on the circuit board 31 are electrically connected to each other by metal wiring formed on the circuit board 31 .

The circuit board 31 is provided with an output terminal 33 and an input terminal (not shown). The output terminal 33 is provided with a connector pin 33a. The connector pin 33 a is mechanically and electrically connected to the conductive member 13 a of the connector 13 provided on the substrate 11 of the LED module 10 . On the other hand, a pair of lead wires (not shown) are connected to the input terminal. The other ends of the pair of lead wires connected to the input terminals are connected to the base 50 .

The circuit board 31 is arranged, for example, in a posture (vertically placed) substantially parallel to the cylindrical axis of the outer casing 40 . The circuit board 31 is not limited to being placed vertically, but may be placed in a posture (horizontal placement) in which the main surface of the circuit board 31 is substantially orthogonal to the cylindrical axis of the outer casing 40 . Moreover, the metal wiring formed on the circuit board 31 may be formed on both sides of the circuit board 31 instead of being formed only on one side (single side) of the circuit board 31 . That is, the circuit board 31 may be a double-sided wiring board.

The electronic components 32 mounted on the circuit board 31 are a plurality of circuit elements for lighting the LED module 10. For example, capacitive elements such as electrolytic capacitors and ceramic capacitors, resistive elements such as resistors, rectifier circuit elements, These include coil elements, choke coils (choke transformers), noise filters, semiconductor elements such as diodes and integrated circuit elements.

The circuit unit 30 configured in this manner is housed in an outer casing 40 made of an insulating resin material to ensure insulation. In order to control the light emission state of the LED module 10, the circuit unit 30 may be combined with a light control circuit such as a light control circuit or a color control circuit, or a wireless communication circuit.

[Outer casing]
As shown in FIGS. 2 and 3, the outer casing 40 is a tubular body having a first opening 40a provided on the glove 20 side and a second opening 40b provided on the base 50 side. be. The outer diameter of the first opening 40a is larger than the outer diameter of the second opening 40b, and the cylinder forming the outer casing 40 has a substantially cylindrical shape whose outer diameter gradually changes. The outer housing 40 constitutes an outer shell member of the LED light bulb 1, and the outer surface of the outer housing 40 is exposed to the outside (to the atmosphere). Note that the outer housing 40 is arranged between the globe 20 and the base 50 .

In this embodiment, the outer housing 40 also functions as a support member for supporting the LED module 10 . The LED module 10 is fixed to and supported by the outer housing 40 .

Specifically, as shown in FIGS. 2 to 4, a mounting portion 41 having a mounting surface 41a for mounting the substrate 11 of the LED module 10 is provided in the first opening 40a of the outer casing 40. is provided. The second surface 11b of the substrate 11 is in surface contact with the mounting surface 41a.

The mounting portion 41 of the outer housing 40 is provided with a screw hole 41 b extending in the axial direction of the outer housing 40 . The substrate 11 and the outer casing 40 are fixed by screwing the screws 60 inserted through the through holes 11d of the substrate 11 into the screw holes 41b. The screw 60 is, for example, a small screw made of metal.

Further, an annular groove portion 42 is formed outside the mounting portion 41 in the first opening portion 40 a of the outer casing 40 . The open end 20b of the glove 20 is inserted into the groove 42. As shown in FIG. As shown in FIG. 3 , the glove 20 and the outer housing 40 are fixed together by an adhesive 70 filled in the groove 42 . As the adhesive 70 filled in the groove 42, for example, an adhesive made of silicone resin is used.

A mark portion 43 is provided on the outer casing 40 . The mark portion 43 is provided at a position corresponding to the convex portion 24 provided on the outer surface of the globe 20, and functions as an alignment portion when combining the globe 20 and the LED module 10 (substrate 11). In the present embodiment, the mark portion 43 is a notch portion provided at the opening end portion of the outer casing 40 on the side of the first opening portion 40a, and is formed at a position visible from the outside. The mark portion 43 may be formed, for example, by laser printing after the outer housing 43 is molded, or may be formed when the outer housing 43 is injection molded. The mark portion 43 has a horizontally long slit shape, and in the present embodiment, the width of the mark portion 43 is wider than the width of the convex portion 24 of the globe 20 .

A threaded portion for mounting the base 50 is formed on the outer surface of the second opening 40b. A base 50 is screwed into the second opening 40b.

The outer housing 40 is thermally coupled with the LED module 10 at the first opening 40a. In other words, the outer housing 40 also functions as a heat dissipation member (heat sink) that dissipates heat generated by the LED module 10 . Therefore, in order to efficiently dissipate the heat generated by the LED module 10 (light emitting element 12), the outer casing 40 is preferably made of a material with high thermal conductivity such as a metal material or a high thermal conductive resin material. . For example, the outer housing 40 may be made of a material with higher thermal conductivity than the substrate 11 . In the present embodiment, the outer casing 40 is made of resin, for example, an insulating resin material such as polybutylene terephthalate (PBT). Further, the outer casing 40 is an integrally molded product.

As shown in FIG. 3 , the circuit unit 30 is arranged inside the outer casing 40 . Therefore, the outer housing 40 can also dissipate the heat generated by the circuit unit 30 . In this embodiment, the outer housing 40 directly surrounds the circuit unit 30 . In other words, the outer housing 40 also functions as a circuit case (insulating case) that insulates and protects the circuit unit 30 .

[Clasp]
A base 50 shown in FIGS. 2 and 3 is a power receiving unit that receives power for causing the LED module 10 (light emitting element 12) to emit light from the outside of the lamp. The base 50 is attached to the outer housing 40 .

A threaded portion is formed on the inner peripheral surface of the base 50 to be threaded with a threaded portion formed in the second opening 40b of the outer casing 40 . The base 50 is fitted onto the outer casing 40 by being screwed into the threaded portion of the second opening 40b.

The LED light bulb 1 is attached to the main body of the lighting fixture by attaching the base 50 to, for example, a socket of the main body of the lighting fixture. Specifically, a threaded portion is formed on the outer peripheral surface of the mouthpiece 50 for threading it into the socket of the device main body. When the base 50 is attached to the socket of the instrument body, the base 50 is ready to receive power from the instrument body. AC power is supplied to the base 50 from, for example, a commercial power source. The base 50 in this embodiment receives AC power through two contacts, and the power received by the base 50 is input to the input terminals of the circuit unit 30 via a pair of lead wires.

The mouthpiece 50 is, for example, made of metal and has a cylindrical shape with a bottom, and as shown in FIG. and an eyelet portion 53 which is formed on the outer surface. The insulating portion 52 is made of glass cullet, for example. One of the pair of lead wires connected to the circuit unit 30 is connected to the shell portion 51 of the base 50 and the other is connected to the eyelet portion 53 of the base 50 .

The type of base 50 is not particularly limited, but in the present embodiment, a screw-in Edison type (E type) base is used. For example, the base 50 may be E26 type, E17 type or E16 type. Also, the base 50 may be of the Swan type (insertion type) instead of the Edison type.

[How to attach gloves]
Next, a method for attaching the globe 20 will be described using FIG. 7 while referring to FIGS. 3 and 4. FIG. FIG. 7 is a diagram for explaining how to attach the globe 20 to the LED light bulb 1 according to the embodiment. 7, only the LED module 10 and the globe 20 are shown.

First, as shown in FIGS. 3 and 4 , after the circuit unit 30 is housed in the outer housing 40 , the LED module 10 is fixed to the outer housing 40 . Specifically, the through hole 11d of the substrate 11 of the LED module 10 and the screw hole 41b of the outer casing 40 are aligned, and the substrate 11 is placed on the mounting surface 41a of the mounting portion 41 of the outer casing 40, A screw 60 is inserted through the through hole 11 d of the substrate 11 and screwed into the screw hole 41 b of the outer housing 40 . As a result, the substrate 11 is screwed to the outer housing 40 , and the LED module 10 can be fixed to the outer housing 40 .

Next, as shown in FIGS. 7A and 7B, the substrate 11 is passed through the gap G between the projection 21 of the globe 20 and the second wall 23, and the substrate is A glove 20 is fitted to 11. At this time, as shown in FIG. 3, the open end 20b of the glove 20 is inserted into the groove 42 of the outer housing 40. As shown in FIG.

Next, as shown in (c) of FIG. 7, the globe 20 is horizontally rotated in a predetermined direction. Specifically, the globe 20 is rotated until the protrusion 21 of the globe 20 moves to a position facing the protrusion 11 c of the substrate 11 . In this embodiment, the globe 20 is horizontally rotated clockwise.

At this time, since the globe 20 is provided with the first wall portion 22 , when the globe 20 is rotated, the projecting portion 11 c of the substrate 11 comes into contact with the first wall portion 22 . In other words, the first wall portion 22 functions as a stopper that stops the rotation of the globe 20 so that the globe 20 cannot rotate more than a certain amount. Thus, the globe 20 is configured so that it can rotate only to a position where the first wall portion 22 abuts on the projection portion 11 c of the substrate 11 . Also, it can be seen that the projection 21 of the globe 20 moves to a position facing the projection 11c of the substrate 11 by rotating the globe 20 and bringing the first wall portion 22 into contact with the projection 11c of the substrate 11 . In the present embodiment, since the length of the projection 21 in the extending direction is 5 mm to 10 mm, the maximum amount of rotation (maximum rotation angle) of the globe 20 is set small. holding back.

Further, in the present embodiment, since the globe 20 is provided with the second wall portion 23 , when the globe 20 is rotated in a direction opposite to the predetermined direction, the second wall portion 23 may be bent against the substrate 11 . It abuts on the protrusion 11c. That is, the second wall portion 23 functions as a stopper that prevents the globe 20 from rotating in the reverse direction, and the globe 20 is configured so as not to rotate in the reverse direction. In this embodiment, the glove 20 cannot rotate counterclockwise.

Further, in the present embodiment, since the projections 24 are provided on the outer surface of the globe 20, the projections 24 can be used to check whether the globe 20 is rotating correctly. Specifically, if the convex portion 24 of the globe 20 is positioned within the width W of the mark portion 43 of the outer housing 40, it can be determined that the globe 20 has been rotated to the correct position.

Thus, in the LED light bulb 1 according to the present embodiment, the globe 20 is fixed using the LED module 10 . Specifically, the globe 20 is combined with the LED module 10 to determine the relative positional relationship with the LED module 10 .

Although not shown, the adhesive 70 is applied to the groove 42 of the outer housing 40 when attaching the globe 20 to the LED module 10 . As a result, the glove 20 can be fixed to the outer housing 40 with the adhesive 70 .

[Effects, etc.]
Next, the characteristic configuration and effects of the LED light bulb 1 according to the present embodiment will be described, including the circumstances leading to the present invention.

In recent years, the external size of LED light bulbs has become as small as that of incandescent light bulbs. For this reason, when developing a new product or when arranging a lineup of multiple types with different wattages, common use of the outer housing is being considered. There is a growing demand for product design.

On the other hand, if the globe comes off after the LED light bulb is attached to the lighting equipment or the like, the globe may fall. In this case, even if the glove is fixed to the outer casing with an adhesive, there is a possibility that the glove may come off due to the deterioration of the adhesive or the like, which weakens the fixing force. Therefore, in order to prevent the globe from falling, it is being considered to provide a globe drop prevention structure inside the LED light bulb. In this case, it is conceivable to provide a glove drop prevention structure in the outer casing. However, if the glove drop prevention structure is provided in the outer casing, it becomes difficult to standardize and share parts.

As a result of intensive studies, the inventors of the present invention found a structure that can prevent the globe 20 from falling while achieving commonality and sharing of parts by using the LED module 10 that covers the LED module 10 .

Specifically, in the LED light bulb 1 according to the present embodiment, as shown in FIGS. A projecting portion 21 is provided.

With this configuration, even if the globe 20 comes off after the LED bulb 1 is attached to the lighting equipment or the like, the projecting part 21 of the globe 20 is caught on the substrate 11, so that the globe 20 can be prevented from falling. In other words, the projecting portion 21 of the globe 20 is a hooking portion that is hooked on the substrate 11 and functions as a fall prevention structure for the globe 20 .

In addition, by realizing a drop prevention structure for the globe 20 with the LED module 10 and the globe 20, it is possible to easily standardize and share the parts constituting the LED light bulb 1. FIG.

Specifically, in the LED light bulb, the optical characteristics such as the light distribution characteristics are determined by the LED module 10 and the globe 20 . Therefore, when designing a product for an LED light bulb, it is only necessary to change the design of the LED module 10 and the globe 20. Therefore, the shape, size, etc. of parts other than the LED module 10 and the globe 20 (outer casing 40, etc.) Therefore, it is possible to standardize and share the parts such as the outer casing 40 and the like.

Conversely, the LED module 10 and the globe 20, which are the main factors of the optical characteristics of the LED light bulb, can be integrated into a single module to share and share parts. That is, by applying the LED module 10 and the globe 20 as one module to the outer casings 40 having different shapes or sizes, it is possible to easily obtain a plurality of types of LED light bulbs.

For example, instead of fixing the LED module 10 directly to the outer housing 40 as described above, the LED module 10 may be mounted on a cup-shaped heat sink 80 disposed within the outer housing 40A, like the LED bulb 1A shown in FIG. , the LED module 10 may be placed and fixed. An LED light bulb 1A shown in FIG. 8 uses an LED module 10 and a globe 20 similar to those of the LED light bulb 1 in the above embodiment. That is, the LED module 10 and the globe 20 are made common and shared as one module. Note that the circuit unit 30 is omitted in FIG.

As described above, according to the LED light bulb 1 according to the present embodiment, parts can be standardized and shared, so design changes can be easily made, and the globe 20 can be prevented from falling. can. Specifically, the drop prevention structure can be realized only with the LED module 10 and the globe 20 . In addition, the investment in new molds can be minimized by standardizing and communalizing parts.

Further, in the LED light bulb 1 according to the present embodiment, the globe 20 is configured to surround the entire side surface of the substrate 11, and the substrate 11 has a projecting portion 11c facing the projecting portion 21 of the globe 20. ing. Furthermore, the protrusion 21 of the globe 20 extends along the circumferential direction of the globe 20 .

With this configuration, even though the globe 20 surrounds the entire side surface of the substrate 11, the projection 11c of the substrate 11 and the projection 21 of the globe 20 can be easily made to face each other by rotating the globe 20 horizontally. can. In other words, even though the substrate 11 is entirely covered with the globe 20 , the globe 20 and the LED module 10 can easily realize a drop prevention structure for the globe 20 .

Further, in the present embodiment, a plurality of projecting portions 21 of globe 20 are provided.

With this configuration, a plurality of drop prevention structures for the globe 20 can be provided in the LED light bulb 1, so that the globe 20 can be prevented from dropping more reliably.

Further, in the present embodiment, as shown in FIG. 6, there is a gap between the protrusion 11c of the substrate 11 and the protrusion 21 of the globe 20, and the protrusion 11c of the substrate 11 and the protrusion 21 of the globe 20 are spaced apart from each other. , the protrusion 11c of the substrate 11 and the protrusion 21 of the globe 20 may be brought into contact with each other.

In this case, the globe 20 is preferably held by the substrate 11 . In other words, the globe 20 is preferably fixed to the substrate 11 . For example, the globe 20 may be fixed to the substrate 11 by forming the protrusion 21 of the globe 20 into a claw structure and engaging the protrusion 21 with the protrusion 11c of the substrate 11 .

With this configuration, it is possible to suppress variations in the optical characteristics determined by the LED module 10 and the globe 20 from one LED bulb to another. Therefore, it is possible to easily realize LED light bulbs having the same optical characteristics even when the shape or size of the outer casing or the like is different and the outer shape or the like is different.

(Modification)
Although the illumination device according to the present invention has been described above based on the embodiments, the present invention is not limited to the above embodiments.

For example, in the above-described embodiment, the protruding portion 21 of the globe 20 is provided on the inner surface of the open end portion 20b of the globe 20, but the present invention is not limited to this. Specifically, like the LED light bulb 1B shown in FIG. 9, the projecting portion 21 of the globe 20B is provided on the inner surface of the arm portion 25 extending in the thickness direction of the substrate 11 from the open end portion 20b of the globe 20B. may be In this case, the glove 20B may be combined with the substrate 11 by horizontally rotating the glove 20 in the same manner as in the above embodiment, but as shown in FIG. is pushed toward the substrate 11 and combined with the substrate 11, the end portion 11e of the substrate 11 and the protruding portion 21 of the globe 20B may be opposed to each other. Also in this modification, the globe 20B may be fixed to the substrate 11 by making the protrusion 21 of the globe 20B have a claw structure and engaging the protrusion 21 with the edge of the substrate 11 . Thereby, the glove 20B can be locked to the substrate 11 by snap-in. In this case, the end portion 11d of the substrate 11 may be formed in a protruding shape like the protruding portion 11 in the above embodiment, but may not be formed in a protruding shape. In other words, a disc-shaped substrate 11 having no irregularities at the edges may be used.

Further, in the above-described embodiment, the number of projecting portions 21 of the globe 20 is two, but the number is not limited to this. For example, the number of protrusions 21 may be one, or three or more. When a plurality of projecting portions 21 are provided, the plurality of projecting portions 21 are preferably provided at regular intervals along the circumferential direction of the globe 20 .

Further, in the above-described embodiment, in order to determine that the globe 20 has been rotated to the correct position, a notch is provided in the outer casing 40 as the mark 43 corresponding to the projection 24 of the globe 20. It is not limited to this. In other words, although the mark portion 43 for positioning the globe 20 is a notch portion, it is not limited to this. For example, the positioning mark portion of the globe 20 may be a convex portion provided on the outer casing 40, or may be a convex portion or concave portion provided on a component of the LED bulb 1 other than the outer casing 40. There may be. Further, the marking portion for positioning the globe 20 is not limited to the structure and shape of the convex portion formed on the part of the LED bulb 1, and the LED bulb may be used as long as the globe 20 can be visually recognized from the outside when the globe 20 is attached. 1 (outer housing 40, etc.), a pattern or color, a seal, or the like. That is, whether or not the globe 20 is rotating correctly can be confirmed by whether or not the convex portion 24 of the globe 20 is positioned within the range of the mark portion provided on a part of the LED bulb 1 .

In addition, in the above embodiments, an LED light bulb was used as an example of a lighting device. It can also be applied to LED lamps with other bases, such as LED lamps.

Further, in the above-described embodiment, the lighting device with a cap attached to a lighting fixture has been described as an example of the lighting device. The lighting device according to the present invention can also be realized as a lighting fixture itself. Such lighting devices include lighting fixtures such as downlights, spotlights, ceiling lights, and standlights installed on the ceiling or the like.

Further, in the above embodiment, the light emitting element 12 is an SMD type LED element, but it is not limited to this. For example, a COB (Chip On Board) type LED module in which a bare chip is directly mounted (primary mounting) on a substrate may be used. That is, the LED chip itself may be adopted as the light emitting element 12 . In this case, the plurality of LED chips may be sealed collectively or individually with the sealing member. The sealing member may contain a wavelength conversion material such as a yellow phosphor as described above.

Further, in the above embodiment, the light-emitting element 12 is a BY type white LED element that emits white light from a blue LED chip and a yellow phosphor, but is not limited to this. For example, a phosphor-containing resin containing a red phosphor and a green phosphor may be used and combined with a blue LED chip to emit white light. In addition to the yellow phosphor, a red phosphor or a green phosphor may also be mixed for the purpose of improving the color rendering properties. Alternatively, an LED chip that emits a color other than blue may be used. For example, an ultraviolet LED chip that emits ultraviolet light having a shorter wavelength than the blue light emitted by the blue LED chip is used, and is excited mainly by ultraviolet light. A blue phosphor, a green phosphor, and a red phosphor that emit blue light, red light, and green light may be used to emit white light.

Further, in the above-described embodiment, the LED module 10 may be configured to be dimming controllable and/or color toning controllable. For example, RGB control can be performed by providing the LED module 10 with a red LED light source that emits red light, a green LED light source that emits green light, and a blue LED light source that emits blue light. This makes it possible to realize an LED module capable of toning control.

In the above embodiment, an LED is used as the light source of the light emitting element 12, but other solid light emitting elements such as a semiconductor light emitting element such as a semiconductor laser, an organic EL (Electro Luminescence) or an inorganic EL may be used.

In addition, forms obtained by applying various modifications that a person skilled in the art can think of to the above embodiments and modifications, or components and functions in each of the above embodiments and modifications within the scope of the present invention The present invention also includes a form realized by arbitrarily combining the above.

1, 1A, 1B LED bulb (lighting device)
10 LED module (light emitting module)
11 substrate 11a first surface 11b second surface 11c protrusion 12 light emitting element 20, 20B globe 20b opening end 21 protrusion 22 first wall 23 second wall 24 protrusion 25 arm 30 circuit unit 40, 40A outer casing 43 mark portion 50 cap

Claims (11)

a light emitting module;
a glove covering the light emitting module;
The light-emitting module includes a substrate having a first surface and a second surface opposite to the first surface, and a light-emitting element disposed on the first surface of the substrate,
The inner surface of the globe is provided with a protruding portion and a wall portion protruding to a position facing the second surface of the substrate,
A protrusion facing the protrusion is provided,
The protrusion faces the protrusion by passing through a gap between the protrusion and the wall ,
The substrate has the protrusion,
lighting device. The globe is configured to surround the entire side surface of the substrate,
The lighting device according to claim 1 . the protrusion extends along the circumferential direction of the glove,
3. A lighting device according to claim 2. The inner surface of the glove is further provided with a first wall,
The first wall is located on the side of the protrusion and is provided near one end in the extending direction of the protrusion,
4. A lighting device according to claim 3. A second wall portion is provided as the wall portion on the inner surface of the globe,
The gap between the protrusion and the second wall is a gap equal to or larger than the width of the protrusion in the circumferential direction of the globe,
5. A lighting device according to claim 4. The protrusion is formed to partially protrude outward from a part of the edge of the substrate,
The illumination device according to any one of claims 1-5. A plurality of the protrusions are provided,
The lighting device according to any one of claims 1-6. the glove has an arm extending in the thickness direction of the substrate from an open end of the glove,
The protrusion is provided on the inner surface of the arm,
8. A lighting device according to claim 7. wherein the glove is held on the substrate;
The illumination device according to any one of claims 1-8. A convex portion is provided on the outer peripheral surface of the globe,
The convex portion is positioned within a range of a mark portion provided on a part of the lighting device,
The lighting device according to any one of claims 1-9. moreover,
a base;
a circuit unit that generates power for causing the light emitting element to emit light from the power received by the base;
A housing that houses the circuit unit,
The illumination device according to any one of claims 1-10.

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