JP2014120412A - LED lamp - Google Patents

LED lamp Download PDF

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JP2014120412A
JP2014120412A JP2012276344A JP2012276344A JP2014120412A JP 2014120412 A JP2014120412 A JP 2014120412A JP 2012276344 A JP2012276344 A JP 2012276344A JP 2012276344 A JP2012276344 A JP 2012276344A JP 2014120412 A JP2014120412 A JP 2014120412A
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mounting member
translucent cover
led lamp
heat
led
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JP2014120412A5 (en
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Hironori Waga
博憲 和賀
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Iris Ohyama Inc
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Iris Ohyama Inc
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Abstract

PROBLEM TO BE SOLVED: To provide an LED lamp in which reliability of connection between a translucent cover and a lamp body is enhanced, and in which it does not occur that the translucent cover falls or only the translucent cover is removed when removing the LED lamp from a socket, in an illumination device having a long life light emitting diode as a light source.SOLUTION: An adhesive agent is injected in an annular groove 26 formed by an outer peripheral wall 33 of a heat conduction mounting member 3 and an inner wall of a heat radiation member 4, and a locking part 52 for locking provided at an annular extension part 51 of a translucent cover 5 is positioned to cover from above at a positioning part 35 provided in the heat conduction mounting part 3, and the translucent cover 5 is rotated in a counterclockwise direction. By this rotation operation, the locking part 52 is fixed by the adhesive agent in a state where it is locked with a protrusion 38 for locking of the heat conduction mounting member 3.

Description

本発明は、発光ダイオード等の固体発光素子を用いた電球代替可能なLEDランプに関する。   The present invention relates to an LED lamp capable of replacing a light bulb using a solid light emitting element such as a light emitting diode.

近年、環境意識の高まりから、省電力化に優れたLED素子を光源に使用した照明装置が盛んに用いられるようになってきた。特に最近は、白熱電球を用いた一般照明装置においても、そのまま置き換え可能なLEDランプが急速に普及してきている。 In recent years, due to an increase in environmental awareness, lighting devices using LED elements excellent in power saving as light sources have been actively used. Particularly recently, LED lamps that can be replaced as they are in a general lighting device using an incandescent light bulb are rapidly spreading.

特開2008−91140号公報JP 2008-91140 A

特許文献1には、基板に実装された発光ダイオードと発光ダイオードを点灯させる点灯装置と、点灯装置が収容され、一方側に口金を装着し、他方側に基板を取付けているカバーと、発光ダイオードを覆うようにカバーの他方側に取付けられた透光性グローブからなるLEDランプが示されている。 Patent Document 1 discloses a light-emitting diode mounted on a substrate, a lighting device that lights the light-emitting diode, a cover that houses the lighting device, a cap attached to one side, and a substrate attached to the other side; The LED lamp which consists of a translucent glove attached to the other side of the cover so as to cover is shown.

透光性グローブは、従来の白熱電球の外観形状に近似させ透光性を必要とするので、合成樹脂またはガラスで構成されている。一方、グローブを接合する本体は、発光ダイオードの熱を放熱させて発光効率の低下を抑制するために熱伝導性の良好な、例えばアルミニウム等の金属で形成されている。   The translucent globe is made of synthetic resin or glass because it approximates the external shape of a conventional incandescent bulb and requires translucency. On the other hand, the main body to which the globe is joined is formed of a metal having a good thermal conductivity, such as aluminum, for example, in order to dissipate the heat of the light emitting diode and suppress a decrease in light emission efficiency.

このため、透光性グローブと本体との結合には、耐熱性、耐紫外線性、電気絶縁性を有し、耐湿性も考慮したシリコン樹脂やエポキシ樹脂等からなる接着剤を用いている。   For this reason, an adhesive made of a silicon resin, an epoxy resin, or the like that has heat resistance, ultraviolet resistance, electrical insulation, and moisture resistance is used to bond the translucent globe and the main body.

しかし、LEDランプは消費電力が少なく寿命が長いという特徴から長期間使用されるため、寿命末期における安全性の確保も重要となっている。例えば、発光ダイオードの寿命よりも先に接着剤が劣化する虞がある。接着剤が劣化した場合には、照明器具に装着されたLEDランプの透光性グローブが落下する虞がある。また、落下しない場合でも、電球を取り替えようとして照明器具のソケットから外す際に、透光性グローブと電球本体との接着力が低下していると透光性グローブのみが外れ、本体部分がソケットに残ってしまう虞があり、本体部分の掴み代が少なくなってソケットから外せなくなる問題が生じる。また、透光性グローブのみが外れてしまうと、発光ダイオード等の電気配線部が露出して危険である。   However, since LED lamps are used for a long time because of their low power consumption and long life, it is also important to ensure safety at the end of life. For example, the adhesive may be deteriorated before the lifetime of the light emitting diode. When the adhesive deteriorates, the translucent globe of the LED lamp mounted on the lighting fixture may fall. Even if it does not fall, when removing the light bulb from the socket of the lighting fixture in order to replace the light bulb, if the adhesive strength between the light-transmitting glove and the light bulb body is reduced, only the light-transmitting glove will be removed and the main body will be the socket. There is a problem that the gripping amount of the main body portion becomes small and cannot be removed from the socket. Moreover, if only the translucent globe is removed, the electrical wiring part such as the light emitting diode is exposed, which is dangerous.

本発明は、上記の課題に鑑みてなされたもので、長寿命の発光ダイオードを光源とする照明装置において、透光性グローブと本体との結合の信頼性を高め、透光性グローブの落下や、電球をソケットから外す際に透光性グローブだけが外れるということがないLEDランプを提供することを目的とする。   The present invention has been made in view of the above problems, and in a lighting device using a light-emitting diode having a long life as a light source, the reliability of the coupling between the translucent globe and the main body is improved, An object of the present invention is to provide an LED lamp in which only a translucent glove does not come off when the bulb is removed from the socket.

請求項1に記載の発明にあたっては、LED素子が実装されたLED基板と、前記LED基板を載置して放熱する載置部材と、点灯回路基板を収納する筒状の絶縁筐体と、該絶縁筐体を収納する筒状の放熱部材と、前記LED基板を覆うように装着された透光性カバーとを備えたLEDランプにおいて、前記載置部材を前記放熱部材の一端開口側に固定するとともに、前記透光性カバーを前記載置部材に係止させたことを特徴とするものである。 In the invention of claim 1, the LED board on which the LED element is mounted, a mounting member that mounts the LED board to dissipate heat, a cylindrical insulating housing that houses the lighting circuit board, In an LED lamp including a cylindrical heat radiating member that houses an insulating housing and a translucent cover that is mounted so as to cover the LED substrate, the mounting member is fixed to one end opening side of the heat radiating member. In addition, the translucent cover is locked to the mounting member.

請求項2に記載の発明にあたっては、前記透光性カバーは、前記載置部材に対して回転係止させるものであり、前記載置部材と放熱部材との間隙部に接着剤を装填して、前記透光性カバーと前記放熱部材を固着することを特徴とするものである。 In the invention according to claim 2, the translucent cover is rotationally locked with respect to the mounting member, and an adhesive is loaded in a gap between the mounting member and the heat dissipation member. The translucent cover and the heat radiating member are fixed to each other.

請求項3に記載の発明にあたっては、前記透光性カバーは反時計方向に回転させて、前記載置部材に係止することを特徴とするものである。 In the invention described in claim 3, the translucent cover is rotated counterclockwise to be locked to the mounting member.

請求項4に記載の発明にあたっては、前記透光性カバーの環状延出部に設けた係止部を、
前記載置部材に設けた位置決め部に位置決めして上方より被せ、該透光性カバーを反時計回りに回転させた方向に形成された載置部材の係止用突出部に、前記係止部を係止するとともに、前記載置部材の外周壁と放熱部材の内壁で形成される環状の溝に、接着剤を装填したことを特徴とするものである。
In the invention according to claim 4, the locking portion provided in the annular extending portion of the translucent cover,
Positioning on the positioning portion provided on the mounting member and covering from above, the locking portion is formed on the locking projection of the mounting member formed in a direction in which the translucent cover is rotated counterclockwise. And an adhesive is loaded into an annular groove formed by the outer peripheral wall of the mounting member and the inner wall of the heat dissipation member.

請求項1ないし2の本発明によれば、透光性カバーは載置部材と同軸で回転操作することにより載置部材に係止され、尚且つ接着剤を併用して固着したので、LEDランプの寿命末期において透光性カバーとLEDランプ本体の接着力が低下しても透光性カバーは載置部材に機械的に係止されているため、透光性カバーの落下が防止されるLEDランプを提供することができる。   According to the first and second aspects of the present invention, the translucent cover is locked to the mounting member by being rotated coaxially with the mounting member, and is fixed by using the adhesive together. LED can prevent the translucent cover from falling because the translucent cover is mechanically locked to the mounting member even if the adhesive strength between the translucent cover and the LED lamp body decreases at the end of the life of the LED A lamp can be provided.

請求項3ないし4の発明によれば、LEDランプを取り替えようとして、照明器具のソケットから外すためにLEDランプを反時計方向に回転させても、透光性カバーを反時計方向に回転させて係止しているので、透光性カバーとLEDランプ本体との接着力が低下していても透光性カバーの係止が外れる回転方向ではないので、透光性グローブのみが外れて、本体部分がソケットに残ってしまうということがないLEDランプを提供することができる。   According to the inventions of claims 3 to 4, even if the LED lamp is rotated counterclockwise in order to remove the LED lamp from the socket of the lighting fixture, the translucent cover is rotated counterclockwise. Since it is locked, even if the adhesive force between the translucent cover and the LED lamp main body is reduced, it is not the rotational direction in which the translucent cover is unlocked, so only the translucent glove is detached and the main body An LED lamp can be provided in which no part remains in the socket.

本実施形態のLEDランプを上方から見た斜視図The perspective view which looked at the LED lamp of this embodiment from the upper part 本実施形態のLEDランプを斜め上方から見た分解斜視図The exploded perspective view which looked at the LED lamp of this embodiment from diagonally upward 本実施形態のLEDランプを斜め下方から見た分解斜視図The exploded perspective view which looked at the LED lamp of this embodiment from diagonally downward 本実施形態のLEDランプの組立て方法を説明する図であり、(a)〜(c)は、その組立て手順を示す斜め上方から見た斜視図It is a figure explaining the assembly method of the LED lamp of this embodiment, (a)-(c) is the perspective view seen from diagonally upward which shows the assembly procedure. 本実施形態のLEDランプであり、(a)は正面図、(b)は(a)のA−A断面図It is the LED lamp of this embodiment, (a) is a front view, (b) is AA sectional drawing of (a). 本実施形態の透光性カバーの組立て方法を説明する図であり、(a)〜(c)は、その組立て手順を示す斜め上方から見た斜視図It is a figure explaining the assembly method of the translucent cover of this embodiment, (a)-(c) is the perspective view seen from diagonally upward which shows the assembly procedure.

以下に本発明の好適な実施の形態について、図面を参照しながら説明する。なお本実施の形態は一例であり、これに限定されるものではない。   Preferred embodiments of the present invention will be described below with reference to the drawings. Note that this embodiment is merely an example, and the present invention is not limited to this.

図1は、本実施形態に係るLEDランプ1を上方から見た斜視図で、図2は本実施形態に係るLEDランプを斜め上方から見た分解斜視図である。また、図3は本実施形態に係るLEDランプを斜め下方から見た分解斜視図である。     FIG. 1 is a perspective view of the LED lamp 1 according to the present embodiment as viewed from above, and FIG. 2 is an exploded perspective view of the LED lamp according to the present embodiment as viewed obliquely from above. FIG. 3 is an exploded perspective view of the LED lamp according to the present embodiment as viewed obliquely from below.

LEDランプ1は図2、図3に示すように、LED素子21(発光ダイオード)と、当該LED素子21を実装するLED基板2と、該LED基板2を載置する熱伝導載置部材3と、上方から該LED基板2を熱伝導載置部材3に保持するホルダ110と、前記熱伝導載置部材3を他端に備える放熱部材4(本体)と、前記LED基板2を覆う透光性カバー5(透光性グローブ)と、複数の電子部品61を実装した点灯回路基板6と、前記点灯回路基板6を収納し、且つ前記放熱部材4内に配された絶縁筐体7(回路格納部材)と、前記絶縁筐体7内に点灯回路基板6を格納し絶縁筐体7の開口部を塞ぐ絶縁蓋8と、前記放熱部材4に螺合して固定するブッシュ9と、口金部材10とを備える。   As shown in FIGS. 2 and 3, the LED lamp 1 includes an LED element 21 (light emitting diode), an LED substrate 2 on which the LED element 21 is mounted, and a heat conductive mounting member 3 on which the LED substrate 2 is mounted. The holder 110 that holds the LED substrate 2 on the heat conductive mounting member 3 from above, the heat radiating member 4 (main body) that includes the heat conductive mounting member 3 at the other end, and the translucent property that covers the LED substrate 2 A cover 5 (translucent globe), a lighting circuit board 6 on which a plurality of electronic components 61 are mounted, and an insulating housing 7 (circuit housing) that houses the lighting circuit board 6 and is disposed in the heat dissipation member 4 Members), an insulating lid 8 that houses the lighting circuit board 6 in the insulating casing 7 and closes the opening of the insulating casing 7, a bush 9 that is screwed and fixed to the heat radiating member 4, and a base member 10 With.

LED基板2は基板22と当該基板22の主面に実装されたLED素子21で構成され、当該基板22は略矩形状のガラスエポキシ基板、金属基板、セラミック基板等のプリント基板であり、本実施形態では、電気絶縁樹脂で被覆された金属基板からなるプリント基板を用いた。LED素子21は本実施形態では照明用の白色光を発光する高輝度タイプを用いている。   The LED board 2 is composed of a board 22 and an LED element 21 mounted on the main surface of the board 22. The board 22 is a printed board such as a substantially rectangular glass epoxy board, metal board, ceramic board, etc. In the embodiment, a printed board made of a metal substrate coated with an electrically insulating resin was used. In this embodiment, the LED element 21 is a high-luminance type that emits white light for illumination.

熱伝導載置部材3は熱伝導率の高い、例えばアルミニウム等の金属材料を材料とし、LED基板2を載置すると共に、両端が開口した略椀形円筒形状の放熱部材4の他端にビスによって固定される。熱伝導載置部材3は径方向外方へ延出する環状の延出部34を有する円盤状で、前記LED基板2の基板下面が面接触するように後述するホルダ110によって載置部31に押し付け固定される。   The heat conduction mounting member 3 is made of a metal material such as aluminum having a high thermal conductivity, and the LED substrate 2 is mounted on the other end of the substantially bowl-shaped cylindrical heat radiation member 4 having both ends opened. Fixed by. The heat conductive mounting member 3 has a disk shape having an annular extending portion 34 extending radially outward, and is placed on the mounting portion 31 by a holder 110 which will be described later so that the lower surface of the LED substrate 2 is in surface contact. Pressed and fixed.

熱伝導載置部材3は、厚み方向に貫通する複数のネジ止め透孔40と、点灯回路からの給電線を通すための複数の貫通部36が備えられている。また、外周壁33には、透光性カバー5を係合するために、軸心から径方向外方に向けて係止用突出部38を設けている。前記環状の延出部34の一部は前記外周壁33と直径を同じくし、前記係止用突出部38に対応して透光性カバー5を係止する際の位置決め部35を有している。   The heat conduction mounting member 3 is provided with a plurality of screwing through holes 40 penetrating in the thickness direction and a plurality of through portions 36 for passing a power supply line from the lighting circuit. Further, in order to engage the translucent cover 5, a locking projection 38 is provided on the outer peripheral wall 33 from the axial center outward in the radial direction. A part of the annular extended portion 34 has the same diameter as the outer peripheral wall 33 and has a positioning portion 35 for locking the translucent cover 5 corresponding to the locking protrusion 38. Yes.

ホルダ110は、PBT樹脂等の汎用樹脂を使用し、角孔115を備えて円盤状に形成される。ネジ止め用の透孔113を有し前記透孔113の周囲にはネジ25の頭部を収容する凹状の座部112が凹設されている。   The holder 110 is made of a general-purpose resin such as a PBT resin, and has a square hole 115 and is formed in a disk shape. A through hole 113 for screwing is provided, and a concave seat 112 that accommodates the head of the screw 25 is recessed around the through hole 113.

前記角孔115の4辺全ての縁部には内方向に向けて延出した延出部116があり、前記LED基板2の基板22の外周部を上方より押さえ、LED基板2を前記熱伝導載置部材3に位置決めし押し付ける。外周壁114は、前記熱伝導載置部材3の外周壁33よりも僅かに直径を小さく設定している。これは、後述する透光性カバー5の熱伝導載置部材3への係止をし易くするためである。   At the edges of all four sides of the square hole 115, there are extended portions 116 extending inwardly, the outer peripheral portion of the substrate 22 of the LED substrate 2 is pressed from above, and the LED substrate 2 is subjected to the heat conduction. Position and press against the mounting member 3. The outer peripheral wall 114 is set to have a slightly smaller diameter than the outer peripheral wall 33 of the heat conducting placement member 3. This is for facilitating the locking of the translucent cover 5 described later to the heat conductive mounting member 3.

放熱部材4は、図2に示すように、その円筒外殻に放射状に放熱フィン45が一体で複数形成され、両端が開口した中空の椀形円筒形状をしており、外径が大きい一端側の内壁には、前記熱伝導載置部材3の下面32の外周部を受ける熱伝導載置部材受け面46と、ネジ止め下穴43を穿設したネジ止めボス42を同一面にして形成している。前記ネジ止めボス42には、熱伝導載置部材3とLED基板2及びホルダ110がネジ止めによって固定され、LED素子21が点灯した際に発生する熱を、LED基板2の基板22から熱伝導載置部材3へ、熱伝導載置部材3からさらに放熱部材4に伝わり外気へと放熱する放熱機能を有する。   As shown in FIG. 2, the heat dissipating member 4 has a hollow bowl-shaped cylindrical shape in which a plurality of heat dissipating fins 45 are integrally formed radially on a cylindrical outer shell, and both ends are open, and one end side having a large outer diameter. The heat conduction mounting member receiving surface 46 that receives the outer peripheral portion of the lower surface 32 of the heat conduction mounting member 3 and the screwing boss 42 in which the screwing lower hole 43 is formed are formed on the same inner wall. ing. The heat conduction mounting member 3, the LED board 2, and the holder 110 are fixed to the screw boss 42 by screwing, and heat generated when the LED element 21 is lit is transmitted from the board 22 of the LED board 2 to the screw boss 42. The mounting member 3 has a heat dissipating function for transferring heat from the heat conducting mounting member 3 to the heat dissipating member 4 to dissipate heat to the outside air.

図3に示すように、放熱部材4の一端側の内壁にはネジ部47が形成され、放熱部材4の下部端面48と後述のブッシュ9(円筒状部材)の当接部98が当接するまで螺合しブッシュ9を放熱部材4に固定する。放熱部材4は内部に絶縁筐体7を収納し、この絶縁筐体7及び、ブッシュ9内に点灯回路基板6が保持される。(図4、図5) As shown in FIG. 3, a threaded portion 47 is formed on the inner wall on one end side of the heat radiating member 4 until the lower end surface 48 of the heat radiating member 4 abuts a contact portion 98 of a bush 9 (cylindrical member) described later. The bushing 9 is fixed to the heat radiating member 4 by screwing. The heat dissipating member 4 accommodates an insulating housing 7 inside, and the lighting circuit board 6 is held in the insulating housing 7 and the bush 9. (Figs. 4 and 5)

絶縁筐体7は放熱部材4よりも熱伝導性の小さな汎用樹脂を使用して、中空の略円筒状に形成されている。本実施形態ではPBT樹脂を用いたが、これに限定されるものではなく、PET,PC、ポリイミド樹脂等公知の樹脂材料が使用できる。   The insulating casing 7 is formed in a hollow, substantially cylindrical shape using a general-purpose resin having a thermal conductivity smaller than that of the heat radiating member 4. In this embodiment, the PBT resin is used. However, the present invention is not limited to this, and a known resin material such as PET, PC, polyimide resin or the like can be used.

絶縁筐体7は図2に示すように、両側が開口した中空の椀形円筒形状に形成されており、円筒部71には前記放熱部材4に形成されたネジ止めボス42との干渉を避けるための半月状逃げ部72が設けられている。 As shown in FIG. 2, the insulating housing 7 is formed in a hollow bowl-shaped cylindrical shape that is open on both sides, and the cylindrical portion 71 avoids interference with the screwing boss 42 formed on the heat radiating member 4. A half-moon shaped escape portion 72 is provided.

絶縁筐体7の円筒部71の下端(底面部)には図3に示すように、底壁75と、環状延出部76が形成されており、前記環状延出部76と後述するブッシュ9の上部端部97で、点灯回路基板6と放熱部材4の内壁との電気的な絶縁がなされる。また、円筒部71の上部開口側は後述する絶縁蓋8によって塞がれる。   As shown in FIG. 3, a bottom wall 75 and an annular extension 76 are formed at the lower end (bottom surface) of the cylindrical portion 71 of the insulating housing 7, and the annular extension 76 and a bush 9 described later. Is electrically insulated from the lighting circuit board 6 and the inner wall of the heat dissipating member 4. Further, the upper opening side of the cylindrical portion 71 is closed by an insulating lid 8 which will be described later.

図2、図3に示すように、絶縁蓋8は、絶縁筐体7同様の熱伝導性の小さな汎用樹脂を使用して蓋部81と外周縁部82とを有する有底浅皿状に形成されており、底部88が点灯回路基板6に対向する。   As shown in FIGS. 2 and 3, the insulating lid 8 is formed in a bottomed shallow dish shape having a lid portion 81 and an outer peripheral edge portion 82 using a general-purpose resin having a small thermal conductivity like the insulating housing 7. The bottom portion 88 faces the lighting circuit board 6.

絶縁蓋8の蓋部81の外周には絶縁筐体7に形成された半月状逃げ部72に対応した半月状の切り欠き86が形成され、蓋部81の主面には、前記熱伝導載置部材3に形成された貫通孔39及び、角孔37に、下面32側から挿入する丸ボス83と、角柱85が樹立している。貫通孔39に挿入する丸ボス83によって軸心を中心とした回転方向の位置決めをして、角孔37に角柱85を嵌入することによって、絶縁蓋8は熱伝導載置部材3の下面32と結合する。   A half-moon-shaped notch 86 corresponding to the half-moon-shaped relief portion 72 formed in the insulating housing 7 is formed on the outer periphery of the lid portion 81 of the insulating lid 8, and the heat conduction mount is formed on the main surface of the lid portion 81. A round boss 83 inserted from the lower surface 32 side and a rectangular column 85 are established in the through hole 39 and the square hole 37 formed in the mounting member 3. Positioning in the rotational direction around the axis center by a round boss 83 inserted into the through hole 39 and fitting the prism 85 into the square hole 37, the insulating lid 8 is connected to the lower surface 32 of the heat conduction mounting member 3. Join.

点灯回路基板6は複数の電子部品61が基板62に実装されており、電子部品61が実装されている基板62の反対側の面からはLED基板2に給電する図示しない給電線が絶縁蓋8の給電線用貫通孔87を通りLED基板2に接続される。絶縁蓋8の給電線用貫通孔87の周縁には一体で形成したリブ84が立設されており、金属材料である熱伝導載置部材3に給電線が触れないように保護している。前記リブ84は熱伝導載置部材3の貫通部36に係入される。   The lighting circuit board 6 has a plurality of electronic components 61 mounted on a board 62, and a power supply line (not shown) that feeds power to the LED board 2 from the opposite surface of the board 62 on which the electronic parts 61 are mounted is an insulating lid 8. Are connected to the LED substrate 2 through the through-hole 87 for the power supply line. An integrally formed rib 84 is erected on the periphery of the feed line through hole 87 of the insulating lid 8 to protect the feed line from touching the heat conduction mounting member 3 made of a metal material. The ribs 84 are engaged with the through portions 36 of the heat conducting placement member 3.

ブッシュ9は絶縁筐体7同様の熱伝導性の小さな汎用樹脂を使用して開口部92を有する有底円筒状に成形され、底部95には図示しない点灯回路基板6へ給電するための給電線を通す底部開口部96を設けている。ブッシュ9の円筒外殻には放熱部材4と螺合する第一のネジ部94と、口金部材と螺合する第二のネジ部91を形成し、第一のネジ部94と第二のネジ部91の間には、径方向の外方に延出する鍔部93を有しており、放熱部材4との螺合固定時のストッパ機能として当接部98(図2)を形成している。   The bush 9 is formed into a bottomed cylindrical shape having an opening 92 using a general-purpose resin having a small thermal conductivity similar to the insulating housing 7, and a power supply line for supplying power to the lighting circuit board 6 (not shown) on the bottom 95. A bottom opening 96 is provided to pass through. The cylindrical outer shell of the bush 9 is formed with a first screw portion 94 that is screwed with the heat radiating member 4 and a second screw portion 91 that is screwed with the base member, and the first screw portion 94 and the second screw. Between the portions 91, there is a flange portion 93 extending outward in the radial direction, and a contact portion 98 (FIG. 2) is formed as a stopper function when screwing and fixing to the heat radiating member 4. Yes.

口金部材10は照明器具のソケットにねじ込み、ソケットから給電を受けるためのもので、ネジ部101と先端部102とを有しブッシュ9の円筒外殻に形成された第二のネジ部91と螺合する。   The base member 10 is for screwing into a socket of a lighting fixture and receiving power from the socket. The base member 10 has a screw portion 101 and a tip portion 102 and is screwed with a second screw portion 91 formed on the cylindrical outer shell of the bush 9. Match.

透光性カバー5は、拡散材を含有したポリカーボネイト樹脂を用いてドーム状に形成されている。この透光性カバー5の開口端部には環状延出部51が設けられており、前記環状延出部51の周方向に形成した一対の係止部52を有している。前記係止用の係止部52の係止と併せて、熱伝導載置部材3の外周壁33と放熱部材4の内壁で形成される環状の溝26(図4(c))に接着剤を注入し前記環状延出部51を固着する。   The translucent cover 5 is formed in a dome shape using a polycarbonate resin containing a diffusing material. An annular extending portion 51 is provided at the opening end of the translucent cover 5, and has a pair of locking portions 52 formed in the circumferential direction of the annular extending portion 51. Along with the locking of the locking portion 52 for locking, an adhesive is applied to the annular groove 26 (FIG. 4C) formed by the outer peripheral wall 33 of the heat conduction mounting member 3 and the inner wall of the heat radiating member 4. And the annular extending portion 51 is fixed.

図2〜図5で、本実施形態に係るLED電球の組立て方法を説明する。
まず始めに、図4(a)に示すように、ブッシュ9の第一のネジ部94を放熱部材4のネジ部47に螺合させ、次に絶縁筐体7を放熱部材4の開口径が大きい開口部側から挿入する。この時、放熱部材4のネジ止めボス42と絶縁部材4の半月状逃げ部72の位置を合わせ挿入する。
The assembly method of the LED bulb according to the present embodiment will be described with reference to FIGS.
First, as shown in FIG. 4A, the first threaded portion 94 of the bush 9 is screwed into the threaded portion 47 of the heat radiating member 4, and then the insulating casing 7 has an opening diameter of the heat radiating member 4. Insert from the large opening side. At this time, the screwing boss 42 of the heat radiating member 4 and the half-moon-shaped relief portion 72 of the insulating member 4 are aligned and inserted.

この状態で、放熱部材4の内面側は絶縁材料で形成されたブッシュ9と絶縁筐体7によって覆われ、絶縁が保たれる。次に、点灯回路基板6を基板62の幅寸法が小の方から絶縁筐体7に挿入する。前記基板62が段階的に幅寸法を変化させていることと、基板62の複数の電子部品61が実装されている反対側の面に形成した凸状部63によって点灯回路基板6の絶縁筐体7内での姿勢の安定化を図っている。   In this state, the inner surface side of the heat radiating member 4 is covered with the bush 9 made of an insulating material and the insulating housing 7, and insulation is maintained. Next, the lighting circuit board 6 is inserted into the insulating casing 7 from the smaller width dimension of the board 62. The insulating casing of the lighting circuit board 6 is formed by changing the width dimension of the board 62 stepwise and the convex part 63 formed on the opposite surface of the board 62 on which the plurality of electronic components 61 are mounted. 7 is intended to stabilize the posture.

そして、口金部材10をブッシュ9の第二のネジ部91に螺合し、図示しない点灯回路へ給電するための給電線を半田付けにより口金部材10に接合し電気的に接続する。   Then, the base member 10 is screwed into the second screw portion 91 of the bush 9, and a power supply line for supplying power to a lighting circuit (not shown) is joined to the base member 10 by soldering to be electrically connected.

熱伝導載置部材3の下面32側に絶縁蓋8を位置合わせてして取り付ける。前述したように熱伝導載置部材3の角孔37と絶縁蓋に設けた角柱85が嵌入状態となって絶縁蓋8が熱伝導載置部材3の下面32に保持される。   The insulating lid 8 is positioned and attached to the lower surface 32 side of the heat conduction mounting member 3. As described above, the square hole 37 of the heat conducting placement member 3 and the square column 85 provided in the insulating lid are fitted and the insulating lid 8 is held on the lower surface 32 of the heat conducting placement member 3.

次に、LED基板2の基板22の下面を下にして熱伝導載置部材3の載置部31に置き、その上からホルダ110を被せる。ホルダ110はネジ止めするための透孔113を熱伝導載置部材3のネジ止め透孔40に位置決めし、図示しない点灯回路からの給電線を絶縁蓋9の給電線用貫通孔87を通して上方に導いておく。   Next, the lower surface of the substrate 22 of the LED substrate 2 is placed on the mounting portion 31 of the heat conductive mounting member 3 and the holder 110 is placed thereon. The holder 110 positions the through-hole 113 for screwing in the screw-through through-hole 40 of the heat conduction mounting member 3, and feeds the power supply line from the lighting circuit (not shown) upward through the power supply line through-hole 87 of the insulating lid 9. I will guide you.

この状態で放熱部材4のネジ止め下穴43と位置決めして熱伝導載置部材受け面46上に置き、ネジ25によって放熱部材4に固定する(図4(b))。ネジ25を締め付けることによって、LED基板2の下面と熱伝導載置部材3を密着させて、LED素子21からの発熱を効率よく熱伝導載置部材3に伝えることができる。固定したら、前記図示しない点灯回路からの給電線をLED基板2の基板22に半田付けにより電気的に接合する。   In this state, the heat dissipating member 4 is positioned with the screwed pilot hole 43 and placed on the heat conducting mounting member receiving surface 46, and is fixed to the heat dissipating member 4 with screws 25 (FIG. 4B). By tightening the screw 25, the lower surface of the LED substrate 2 and the heat conductive mounting member 3 can be brought into close contact with each other, and heat generated from the LED element 21 can be efficiently transmitted to the heat conductive mounting member 3. Once fixed, the feeder line from the lighting circuit (not shown) is electrically joined to the substrate 22 of the LED substrate 2 by soldering.

次に、透光性カバー5の組立て方法を図4、図6で説明する。図6では、説明し易くするために、外観上見える放熱部材4、ブッシュ9及び口金部材10は図示していない。最初に図4(c)に示す熱伝導載置部材3の外周壁33と放熱部材4の内壁で形成される環状の溝26に接着剤を注入し、図6(a)に示すように透光性カバー5の環状延出部51に設けた係止部52を熱伝導載置部材3に設けた位置決め部35に位置決めして上方より被せ透光性カバー5を反時計回り方向に回転させる。(図6(b))この回転操作により係止部52が熱伝導載置部材3の係止用突出部38と係止された状態(図6(c))になり、併せて前記接着剤によって固着される。透光性カバー5と熱伝導載置部材3とを反時計回り方向で係止するのは、接着剤が劣化してしまった際でも、LEDランプをソケットから外すために透光性カバー5を持って反時計方向に回転操作したときに透光性カバー5だけが外れることがないようにするためである。   Next, a method for assembling the translucent cover 5 will be described with reference to FIGS. In FIG. 6, the heat radiating member 4, the bush 9, and the base member 10 that are visible on the external appearance are not shown for ease of explanation. First, an adhesive is injected into an annular groove 26 formed by the outer peripheral wall 33 of the heat conduction mounting member 3 and the inner wall of the heat radiating member 4 shown in FIG. 4 (c), and as shown in FIG. 6 (a). The locking portion 52 provided on the annular extending portion 51 of the light cover 5 is positioned on the positioning portion 35 provided on the heat conducting mounting member 3 so as to cover from above and the light transmitting cover 5 is rotated counterclockwise. . (FIG. 6 (b)) By this rotation operation, the locking portion 52 is locked with the locking protrusion 38 of the heat conduction mounting member 3 (FIG. 6 (c)). Fixed by. The reason why the translucent cover 5 and the heat conductive mounting member 3 are locked in the counterclockwise direction is that the translucent cover 5 is used to remove the LED lamp from the socket even when the adhesive has deteriorated. This is to prevent only the translucent cover 5 from being detached when it is held and rotated counterclockwise.

これにより、透光性カバー5の装着が完了しLEDランプ1が完成する。   Thereby, the mounting of the translucent cover 5 is completed, and the LED lamp 1 is completed.

1 LEDランプ
2 LED基板
21 LED素子
22 基板
25 ネジ
3 熱伝導載置部材
31 載置部
32 下面
33 外周壁
34 延出部
35 位置決め部
36 貫通部
37 角孔
38 係止用突出部
39 貫通孔
4 放熱部材
40 ネジ止め透孔
41 筒壁
42 ネジ止めボス
43 ネジ止め下穴
45 フィン
46 熱伝導載置部材受け面
47 ネジ部
48 下部端面
5 透光性カバー
51 環状延出部
52 係止部
6 点灯回路基板
61 電子部品
62 基板
63 凸状部
7 絶縁筐体
71 円筒部
72 半月状逃げ部
73 内壁
74 開口側端面
75 底壁
76 環状延出部
8 絶縁蓋
81 蓋部
82 外周縁部
83 丸ボス
84 リブ
85 角柱
86 半月状切り欠き
87 給電線用貫通孔
88 底部
9 ブッシュ
91 第二にネジ部
92 開口部
93 鍔部
94 第一のネジ部
95 底部
96 底部開口部
10 口金部材
101 ネジ部
102 先端部
110 ホルダ
111 上面
112 座部
113 透孔
114 外周壁
115 角孔
116 延出部
117 下面















DESCRIPTION OF SYMBOLS 1 LED lamp 2 LED board 21 LED element 22 Board | substrate 25 Screw 3 Heat conduction mounting member 31 Mounting part 32 Lower surface 33 Outer peripheral wall 34 Extension part 35 Positioning part 36 Through part 37 Square hole 38 Locking protrusion part 39 Through hole 4 Heat-dissipating member 40 Screwing through hole 41 Tube wall 42 Screwing boss 43 Screwing pilot hole 45 Fin 46 Heat conduction mounting member receiving surface 47 Screw part 48 Lower end surface 5 Translucent cover 51 Annular extension part 52 Locking part 6 lighting circuit board 61 electronic component 62 board 63 convex part 7 insulating casing 71 cylindrical part 72 half-moon escape part 73 inner wall 74 opening side end face 75 bottom wall 76 annular extension part 8 insulating lid 81 lid part 82 outer peripheral edge part 83 Round boss 84 Rib 85 Square column 86 Half-moon notch 87 Feed wire through-hole 88 Bottom 9 Bush 91 Second threaded portion 92 Opening portion 93 Hut portion 94 First screw portion 95 Bottom portion 96 Bottom portion Mouth 10 cap member 101 threaded portion 102 tip 110 holder 111 upper surface 112 seat 113 through hole 114 outer peripheral wall 115 rectangular hole 116 extending portion 117 bottom surface















Claims (4)

LED素子が実装されたLED基板と、
前記LED基板を載置して放熱する載置部材と、
点灯回路基板を収納する筒状の絶縁筐体と、
該絶縁筐体を収納する筒状の放熱部材と、
前記LED基板を覆うように装着された透光性カバーと、
を備えたLEDランプにおいて、
前記載置部材を前記放熱部材の一端開口側に固定するとともに、
前記透光性カバーを前記載置部材に係止させたことを特徴とするLEDランプ。
An LED substrate on which an LED element is mounted;
A mounting member for mounting and dissipating heat on the LED substrate;
A cylindrical insulating housing that houses the lighting circuit board;
A cylindrical heat radiating member that houses the insulating housing;
A translucent cover mounted to cover the LED substrate;
In an LED lamp with
While fixing the mounting member on one end opening side of the heat dissipation member,
An LED lamp characterized in that the translucent cover is locked to the mounting member.
前記透光性カバーは、前記載置部材に対して回転係止させるものであり、
前記載置部材と放熱部材との間隙部に接着剤を装填して、
前記透光性カバーと前記放熱部材を固着することを特徴とする請求項1に記載のLEDランプ。
The translucent cover is intended to be rotationally locked to the mounting member described above,
Loading the adhesive in the gap between the mounting member and the heat dissipation member,
The LED lamp according to claim 1, wherein the translucent cover and the heat dissipation member are fixed.
前記透光性カバーは反時計方向に回転させて、前記載置部材に係止することを特徴とする請求項1または請求項2に記載のLEDランプ。   The LED lamp according to claim 1 or 2, wherein the translucent cover is rotated counterclockwise and locked to the mounting member. 前記透光性カバーの環状延出部に設けた係止部を、
前記載置部材に設けた位置決め部に位置決めして上方より被せ、
該透光性カバーを反時計回りに回転させた方向に形成された載置部材の係止用突出部に、
前記係止部を係止するとともに、
前記載置部材の外周壁と放熱部材の内壁で形成される環状の溝に、
接着剤を装填したことを特徴とする請求項1ないし3のいずれかに記載のLEDランプ。










A locking part provided in the annular extension part of the translucent cover,
Positioned on the positioning part provided in the mounting member and covered from above,
In the locking projection of the mounting member formed in the direction in which the translucent cover is rotated counterclockwise,
While locking the locking portion,
In the annular groove formed by the outer peripheral wall of the mounting member and the inner wall of the heat dissipation member,
The LED lamp according to any one of claims 1 to 3, wherein an adhesive is loaded.










JP2012276344A 2012-12-19 2012-12-19 LED lamp Pending JP2014120412A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019200861A (en) * 2018-05-14 2019-11-21 パナソニックIpマネジメント株式会社 Lighting device
JP2022061044A (en) * 2018-05-14 2022-04-15 パナソニックIpマネジメント株式会社 Lighting device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012043586A1 (en) * 2010-09-27 2012-04-05 東芝ライテック株式会社 Lightbulb-formed lamp and illumination apparatus
US20120106176A1 (en) * 2010-10-27 2012-05-03 Cree, Inc. Lighting apparatus
JP2012119314A (en) * 2010-11-30 2012-06-21 Lg Innotek Co Ltd Lighting system

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012043586A1 (en) * 2010-09-27 2012-04-05 東芝ライテック株式会社 Lightbulb-formed lamp and illumination apparatus
US20120106176A1 (en) * 2010-10-27 2012-05-03 Cree, Inc. Lighting apparatus
JP2012119314A (en) * 2010-11-30 2012-06-21 Lg Innotek Co Ltd Lighting system

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019200861A (en) * 2018-05-14 2019-11-21 パナソニックIpマネジメント株式会社 Lighting device
JP7038291B2 (en) 2018-05-14 2022-03-18 パナソニックIpマネジメント株式会社 Lighting equipment
JP2022061044A (en) * 2018-05-14 2022-04-15 パナソニックIpマネジメント株式会社 Lighting device
JP7304523B2 (en) 2018-05-14 2023-07-07 パナソニックIpマネジメント株式会社 lighting equipment

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