JP7285463B2 - Illumination light source and illumination device - Google Patents

Description

TECHNICAL FIELD The present invention relates to an illumination light source and an illumination device, and more particularly to an LED unit, which is an example of an illumination light source using light emitting diodes (LEDs), and an illumination device including the same.

Solid-state light-emitting devices such as LEDs are expected to serve as light sources for various products due to their small size, high efficiency, and long life. Among them, in recent years, research and development of illumination light sources using LEDs have been advanced. For example, in lighting fixtures such as downlights, replaceable LED lamps are used as lighting sources.

A flat illumination light source is known as this type of replaceable LED lamp. For example, Patent Document 1 discloses a flat LED lamp having a flat thin structure. The flat light source for illumination has a base structure such as the GX53 type, and includes an LED module, a power circuit for lighting the LED module, a flat housing that houses the power circuit, and the LED module. A translucent cover for covering and a pair of pins electrically connected to a power supply circuit are provided.

WO2012/005239

In recent years, there has been a demand for a flat light source for illumination with a smaller diameter. For example, changing the external size from φ90 mm to φ70 mm is under consideration.

However, reducing the diameter of the flat illumination light source reduces the circuit space. Therefore, there is a problem that the circuit parts of the power supply circuit are densely packed and the temperature of the power supply circuit becomes high.

Further, as for the flat light source for illumination, there is also a demand for a dimming type that corresponds to a dimmer. In this case, the lighting light source needs to be equipped with a light control circuit in addition to the power supply circuit, which further increases the density of circuit components. In particular, when the external size is reduced to reduce the diameter, the space for installing the dimming circuit is lost.

SUMMARY OF THE INVENTION It is an object of the present invention to provide an illumination light source and an illumination device having a wide circuit space.

In order to achieve the above object, one aspect of the illumination light source according to the present invention is a flat illumination light source, comprising: a light emitting module; a power supply circuit for generating power for causing the light emitting module to emit light; A housing for housing the power supply circuit, a heat sink arranged in the housing, and a circuit holder for holding the power supply circuit, wherein the power supply circuit includes a circuit board and circuit elements mounted on the circuit board. wherein the heat sink has a first portion located between the circuit board and the circuit holder, the circuit holder penetrating the first portion and supporting the circuit board It has a support.

Further, one aspect of a lighting device according to the present invention includes the lighting source described above and a lighting fixture to which the lighting light source is attached.

According to the present invention, a wide circuit space can be secured.

1 is a perspective view of an LED lamp according to an embodiment when viewed obliquely from above; FIG. It is a perspective view when the LED lamp which concerns on embodiment is seen from the diagonally downward direction. 1 is an exploded perspective view of an LED lamp according to an embodiment; FIG. 1 is a cross-sectional view of an LED lamp according to an embodiment; FIG. 1 is a cross-sectional perspective view of an LED lamp according to an embodiment; FIG. FIG. 11 is an exploded perspective view of an LED lamp according to a modification; It is a cross-sectional perspective view of the LED lamp which concerns on a modification.

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described with reference to the drawings. It should be noted that each of the embodiments described below is a specific example of the present invention. Therefore, numerical values, shapes, materials, constituent elements, arrangement positions of constituent elements, connection forms, and the like shown in the following embodiments are examples and are not intended to limit the present invention. Therefore, among constituent elements in the following embodiments, constituent elements not described in independent claims will be described as optional constituent elements.

Each figure is a schematic diagram and is not necessarily strictly illustrated. Moreover, in each figure, the same code|symbol is attached|subjected with respect to substantially the same structure, and the overlapping description may be abbreviate|omitted or simplified.

(Embodiment)
First, the overall configuration of an LED lamp 1 according to an embodiment will be described with reference to FIGS. 1A and 1B. FIG. 1A is a perspective view of an LED lamp 1 according to an embodiment when viewed obliquely from above, and FIG. 1B is a perspective view of the same LED lamp 1 when viewed obliquely from below.

As shown in FIGS. 1A and 1B, the LED lamp 1 is a flat illumination light source having a flat overall shape. The LED lamp 1 in this embodiment is an LED unit having a flat and thin structure. As an example, the external size of the LED lamp 1 is φ70 mm, but it is not limited to this.

Moreover, the LED lamp 1 is a replaceable lamp that can be attached to a socket of a lighting fixture, and is configured to be attachable and detachable to the socket of the lighting fixture. Specifically, the LED lamp 1 has a base that is fitted into a socket. The base of the LED lamp 1 in this embodiment is a GX53 base. The base of the LED lamp 1 is not limited to this, and may have other bases such as a GH76p base.

Also, the LED lamp 1 is a dimming type lamp corresponding to a dimmer. Therefore, the LED lamp 1 is configured so that the brightness of the illumination light emitted from the LED lamp 1 can be adjusted. Note that the LED lamp 1 may be a non-dimmable type lamp that cannot be dimmed.

Next, the detailed configuration of the LED lamp 1 according to this embodiment will be described with reference to FIGS. 2 to 4. FIG. FIG. 2 is an exploded perspective view of the LED lamp 1 according to the embodiment. FIG. 3 is a sectional view of the same LED lamp 1. As shown in FIG. FIG. 4 is a cross-sectional perspective view of the same LED lamp 1. As shown in FIG. 3 is a cross-sectional view taken along a plane passing through the pair of pins 80, and FIG. 4 is a cross-sectional view taken along a plane passing through the support portion 72 of the circuit holder 70. As shown in FIG. It should be noted that screws are omitted in the exploded view of FIG.

As shown in FIGS. 2 to 4, the LED lamp 1 includes an LED module 10, a module plate 20, an insulating plate 30, a power supply circuit 40, a housing 50, a heat sink 60, a circuit holder 70, pins 80 and a translucent cover 90 . The LED lamp 1 has an envelope composed of a housing 50 and a translucent cover 90 .

The LED module 10 is an example of a light-emitting module that emits light of a predetermined color, and emits white light as illumination light, for example. Light emitted from the LED module 10 passes through the translucent cover 90 and is radiated to the outside of the LED lamp 1 .

As shown in FIGS. 2 to 4, the LED module 10 has a substrate 11 and light emitting elements 12 arranged on the substrate 11. As shown in FIG. A plurality of light emitting elements 12 are mounted on the substrate 11 . Note that the number of light emitting elements 12 to be mounted is not limited to this, and may be one.

The substrate 11 is a mounting substrate for mounting the light emitting element 12 thereon. Although not shown, metal wiring electrically connected to the light emitting element 12 is formed on the substrate 11 . The substrate 11 is, for example, a plate-like substrate having a substantially circular shape in plan view. The planar shape of the substrate 11 is not limited to a shape based on a circle, and may be a shape based on a polygon such as a rectangle.

The substrate 11 may be, for example, a resin substrate made of a resin material, a metal base substrate obtained by applying an insulating coating to a base material made of a metal material such as aluminum or copper, or a sintered body of a ceramic material such as alumina. A ceramic substrate or the like is used. Although the substrate 11 is a rigid substrate, it may be a flexible substrate.

Each light emitting element 12 is an example of a light source that emits light. In this embodiment, the light emitting element 12 is a white light source that emits white light. Specifically, each light emitting element 12 is a surface mount device (SMD) type LED light source in which an LED is packaged, and includes a container (package), an LED chip mounted in the container, and an LED and a sealing member for sealing the chip.

An LED chip is an example of a semiconductor light emitting element that emits light with a predetermined DC power, and is a bare chip that emits monochromatic visible light. The LED chip is, for example, a blue LED chip that emits blue light when energized.

The sealing member is a translucent insulating resin material such as silicone resin. The sealing member in this embodiment contains a phosphor as a wavelength conversion material that converts the wavelength of light from the LED chip. That is, the sealing member is a phosphor-containing resin in which a phosphor is contained in a translucent resin, and wavelength-converts (color-converts) the light from the LED chip into a predetermined wavelength. The sealing member is filled in the recess of the container.

As the sealing member, for example, when the LED chip is a blue LED chip, in order to obtain white light, a phosphor-containing resin obtained by dispersing YAG (yttrium aluminum garnet) type yellow phosphor particles in a silicone resin is used. can be used. As a result, the yellow phosphor particles are excited by the blue light emitted from the blue LED chip and emit yellow light. White light is emitted as light. A light diffusing material such as silica, a filler, and the like may be dispersed in the sealing member.

The LED module 10 configured in this manner is held in the housing 50 . Specifically, the LED module 10 is held in the housing 50 by being supported by the module plate 20 held in the housing 50 . As shown in FIGS. 3 and 4, the module plate 20 is arranged to close the opening 50a of the housing 50. As shown in FIGS.

The module plate 20 is a support base that supports the LED module 10 . The LED module 10 is arranged on the module plate 20 . Specifically, the substrate 11 of the LED module 10 is placed on the module plate 20 .

The module plate 20 also functions as a heat sink that dissipates heat generated by the LED module 10 . Therefore, the module plate 20 is preferably made of a metal material such as aluminum or a resin material with high thermal conductivity. In this embodiment, the module plate 20 is made of metal, for example, a metal plate made of aluminum.

As shown in FIGS. 3 and 4 , the insulating plate 30 is arranged between the module plate 20 and the power supply circuit 40 . Specifically, the insulating plate 30 is arranged between the module plate 20 and the circuit board 41 of the power supply circuit 40 .

The insulating plate 30 is made of an insulating material. For example, the insulating plate 30 is an insulating sheet made of an insulating resin material such as silicon or acrylic. Moreover, the insulating plate 30 is preferably made of an insulating material with high thermal conductivity in order to efficiently conduct heat generated by the LED module 10 to the module plate 20 . The insulating plate 30 may be either a rigid plate or a flexible plate. In this embodiment, the insulating plate 30 is an insulating thermally conductive sheet having rubber elasticity made of an elastomer such as silicon having high thermal conductivity.

The LED module 10, the module plate 20 and the insulating plate 30 are fixed together by screws. Specifically, the LED module 10 and the insulating plate 30 are screwed together with the module plate 20 sandwiched between the LED module 10 and the insulating plate 30, so that the LED module 10, the module plate 20 and the insulating plate 30 are joined together. It can be fixed by tightening. The LED module 10, the module plate 20, and the insulating plate 30 are not limited to being fixed with screws, and may be fixed to each other with an adhesive.

The LED module 10 emits light by power supplied from the power supply circuit 40 . The LED module 10 and the power supply circuit 40 are connected by, for example, a pair of lead wires (not shown).

As shown in FIG. 2, the substrate 11 is provided with insertion holes 11a through which a pair of lead wires are inserted. Similarly, the module plate 20 is also provided with insertion holes 20a through which the pair of lead wires are inserted, and the insulating plate 30 is also provided with insertion holes 30a through which the pair of lead wires are inserted. These insertion holes 11a, 20a, and 30a communicate with each other when the LED module 10, module plate 20, and insulating plate 30 are overlapped.

After passing the pair of lead wires through the insertion holes 11a, 20a and 30a, the insertion holes 11a, 20a and 30a are preferably closed with silicone resin or the like. This can prevent insects from entering the LED module 10 (light emitting portion).

The power supply circuit 40 generates power for causing the LED module 10 to emit light. For example, the power supply circuit 40 converts AC power (for example, power from a 100 V AC commercial power supply) supplied from the pair of pins 80 into DC power and supplies the DC power to the LED module 10 .

As shown in FIGS. 2 to 4, the power supply circuit 40 has a circuit board 41 and circuit elements 42 mounted on the circuit board 41 . A plurality of circuit elements 42 are mounted on the circuit board 41 .

The circuit board 41 is a printed circuit board (PCB) on which metal wiring such as copper foil is patterned. In the present embodiment, the circuit board 41 is, for example, a plate-like board having a substantially circular planar shape. In addition, the planar view shape of the circuit board 41 is not limited to this, and may be a polygonal shape such as a rectangular shape.

The plurality of circuit elements 42 are, for example, capacitive elements such as electrolytic capacitors and ceramic capacitors, coil elements (inductors) such as choke coils and choke transformers, transistor elements such as FETs, resistive elements such as resistors, or diodes. be.

In addition, the plurality of circuit elements 42 includes a surface mount component, which is a surface mount type circuit component, and a lead component, which is a lead type circuit component having an element body and a pair of leads drawn out from the element body. .

The surface mount components are mounted on the solder surface of the circuit board 41 on which the metal wiring is formed. A surface mount component is, for example, a chip component such as a chip resistor or FET.

On the other hand, the lead component is arranged so that the element body is located on the side opposite to the soldering surface, and is mounted (through-hole mounting) by inserting the lead through a through hole formed in the circuit board 41 . there is The lead component is, for example, a large circuit element 42, such as a coil component having a coil such as a choke transformer or a choke coil, or an electrolytic capacitor.

Moreover, in the present embodiment, the power supply circuit 40 includes a dimming circuit for dimming the LED module 10 . In other words, the circuit element 42 includes circuit components that constitute a dimming circuit. Note that the power supply circuit 40 may include other control circuits such as a wireless communication circuit.

As shown in FIGS. 3 and 4, the housing 50 houses the power supply circuit 40. As shown in FIGS. Specifically, the power supply circuit 40 is arranged inside the housing 50 . In this embodiment, the LED module 10 , the module plate 20 , the insulating plate 30 , the heat sink 60 and the circuit holder 70 are further arranged in the housing 50 . The housing 50 has a substantially bottomed cylindrical shape with an opening 50 a and has a bottom 51 and side walls 52 .

The LED module 10, the module plate 20 and the insulating plate 30 are arranged in the opening 50a. Further, the opening 50a is covered with a translucent cover 90. As shown in FIG.

The bottom portion 51 has an inner portion 51a and an outer portion 51b located outside the inner portion 51a. In the present embodiment, the planar view shape of the inner portion 51a is circular, and the planar view shape of the outer portion 51b is an annular shape. A step is formed at the boundary between the inner portion 51a and the outer portion 51b. Specifically, the inner portion 51a is formed to protrude outward with respect to the outer portion 51b. In other words, the inner surface of the inner portion 51a is positioned further outward than the inner surface of the outer portion 51b. Thereby, the space of the inner region of the inner portion 51a can be increased.

An inner region of the inner portion 51a is a storage space for storing the power supply circuit 40. As shown in FIG. The circuit board 41 of the power supply circuit 40 is arranged closer to the LED module 10 in the inner area of the inner portion 51a.

A heat sink 60 and a circuit holder 70 are mounted on the outer portion 51b. Further, an insertion hole 51b1 through which the pin 80 is inserted is provided in the outer portion 51b. Since there are two pins 80, two insertion holes 51b1 are provided.

The side wall 52 has a cylindrical shape and stands at the outer peripheral end of the outer portion 51 b of the bottom portion 51 . In this embodiment, sidewall 52 is cylindrical.

The housing 50 is made of a resin material such as polybutylene terephthalate (PBT) or a metal material such as aluminum. In this embodiment, the housing 50 is an insulating housing made of PBT. This facilitates ensuring the insulation of the power supply circuit 40 . In other words, the housing 50 is an outer shell cover that forms the outer shell of the LED lamp 1 and an insulating cover that covers the power supply circuit 40 .

The heat sink 60 is a heat dissipation member that mainly dissipates heat generated in the LED module 10 and is thermally coupled with the LED module 10 . Therefore, the heat sink 60 is preferably made of a metal material or a resin material with high thermal conductivity in order to efficiently dissipate the heat generated by the LED module 10 . In this embodiment, the heat sink 60 is made of aluminum. Note that the heat sink 60 may radiate heat generated in the power supply circuit 40 .

As shown in FIGS. 3 and 4, the heat sink 60 is arranged inside the housing 50 . Specifically, the heat sink 60 is mounted on the outer portion 51 b of the bottom portion 51 of the housing 50 . Moreover, the heat sink 60 is configured in an annular shape so as to surround the power supply circuit 40 .

As shown in FIGS. 2-4, the heat sink 60 has a first portion 61 and a second portion 62 . Both the first portion 61 and the second portion 62 are plate-shaped plates, and both are ring-shaped. Also, the second portion 62 is erected with respect to the first portion 61 . That is, the first portion 61 and the second portion 62 are formed to have a substantially L shape in cross-section.

As shown in FIGS. 3 and 4 , the first portion 61 is positioned between the circuit board 41 of the power supply circuit 40 and the circuit holder 70 . In this embodiment, the first portion 61 is placed on the circuit holder 70 . Specifically, the first portion 61 is mounted on the main body 71 of the circuit holder 70 . Also, by inserting a heat dissipation sheet between the first portion 61 and the circuit board 41, a heat conducting path can be formed between the circuit board 41 and the heat sink 60. FIG. As a result, the heat of the power supply circuit 40 can be effectively dissipated by the heat sink 60, so that the temperature of the power supply circuit 40 can be reduced.

As shown in FIGS. 2 and 4, the first portion 61 is provided with an insertion hole 61a through which the support portion 72 of the circuit holder 70 is inserted. In this embodiment, three insertion holes 61a are provided. The three insertion holes 61 a are provided at regular intervals along the circumferential direction of the ring-shaped heat sink 60 . In addition, although the opening shape of the insertion hole 61a is rectangular as an example, it may be circular.

2 and 3, the first portion 61 is provided with an insertion hole 61b through which the pin 80 is inserted. Specifically, the projecting portion of the circuit holder 70 having an insertion hole 71a through which the pin 80 is inserted is inserted into the insertion hole 61b. As shown in FIG. 2, the insertion hole 61b is formed by cutting the first portion 61. As shown in FIG. That is, the first portion 61 has a ring shape in which a notch-like insertion hole 61b is formed in the middle of the circumferential direction.

The second portion 62 is provided along the side wall 52 of the housing 50 . In this embodiment, the side wall 52 is cylindrical, so the second portion 62 is also cylindrical. Also, the second portion 62 is preferably close to or in contact with the side wall 52 . As a result, the heat conducted to the heat sink 60 can be efficiently conducted to the side wall 52 (the housing 50 ), and the heat can be radiated from the housing 50 to the outside.

Also, the end of the second portion 62 is in contact with the module plate 20 . As a result, heat generated in the LED module 10 can be efficiently conducted to the heat sink 60 via the module plate 20 in contact with the substrate 11 of the LED module 10 . Also, the module plate 20 is mounted on the second portion 62 . The module plate 20 is thereby supported by the heat sink 60 .

A circuit holder 70 shown in FIGS. 2 to 4 is a holding member that holds the power supply circuit 40 . The circuit holder 70 can be made of a resin material such as PBT or a metal material. It is good to be comprised by the material. In this embodiment, the circuit holder 70 functions as an insulating cover made of an insulating resin material. The circuit holder 70 has a frame-shaped main body 71 and a support portion 72 that supports the power supply circuit 40 .

As shown in FIGS. 3 and 4 , the main body 71 is a holder main body arranged on the outer portion 51 b of the bottom portion 51 of the housing 50 . The main body 71 is configured in a ring shape so as to surround the power supply circuit 40 . The main body 71 is sandwiched between the outer portion 51 b of the bottom portion 51 of the housing 50 and the first portion 61 of the heat sink 60 .

As shown in FIGS. 2 and 3, the main body 71 is provided with an insertion hole 71a through which the pin 80 is inserted. In the embodiment, three insertion holes 71a are provided. The three insertion holes 71 a are provided at equal intervals along the circumferential direction of the ring-shaped main body 71 . In this embodiment, the insertion hole 71 a is provided in a protruding portion provided on the main body 71 . The protrusion provided with the insertion hole 71 a protrudes toward the LED module 10 side and is inserted through the insertion hole 61 b of the first portion 61 of the heat sink 60 . In addition, although the opening shape of the insertion hole 71a is circular as an example, it is not limited to this.

The support portion 72 is a portion that supports the power supply circuit 40 . Specifically, the support portion 72 supports the circuit board 41 of the power supply circuit 40 . As shown in FIG. 2, in the present embodiment, three support portions 72 are provided at regular intervals along the circumferential direction of a frame-shaped main body 71 .

Further, as shown in FIGS. 2 and 4 , a locking claw 72 a that locks onto the end of the circuit board 41 is provided at the tip of the support portion 72 . In other words, the support portion 72 is a locking portion that locks onto the circuit board 41 , and the circuit board 41 is supported by the support portion 72 by locking the support portion 72 and the circuit board 41 .

Further, the support portion 72 extends in the thickness direction of the LED lamp 1 . Specifically, the support portion 72 extends so as to protrude toward the LED module 10 side. In this embodiment, the support portion 72 extends from the main body 71 in the thickness direction of the LED lamp 1 . As a result, the circuit board 41 is supported by the support portion 72 extending from the main body 71 , so that the circuit board 41 is held by the circuit holder 70 while being separated from the main body 71 of the circuit holder 70 .

Further, the support portion 72 penetrates the first portion 61 of the heat sink 60, as shown in FIG. Specifically, the support portion 72 penetrates through the first portion 61 by being inserted into an insertion hole 61 a provided in the first portion 61 . That is, the tip portion of the support portion 72 is positioned closer to the LED module 10 than the first portion 62 of the heat sink 60 .

A pin 80 (base pin) shown in FIGS. 2 to 4 is a conductive lamp pin, and has a function of receiving power from the outside of the LED lamp 1 for causing the LED module 10 (light emitting element 12) to emit light. The pin 80 is electrically connected to the power supply circuit 40 , and the electrode received by the pin 80 is supplied to the power supply circuit 40 . In this embodiment, two pins 80 are provided. The pair of pins 80 are provided at opposing positions. For example, a pair of pins 80 receive predetermined AC power from the lighting fixture.

As shown in FIG. 3 , each pin 80 is inserted through an insertion hole 51 b 1 provided in the outer portion 51 b of the bottom portion 51 of the housing 50 . The pin 80 inserted through the insertion hole 51 b 1 is fixed to the outer portion 51 b of the bottom portion 51 of the housing 50 .

One end of the pin 80 is located inside the housing 50 and connected to the power supply circuit 40 . In this embodiment, one end of the pin 80 is positioned closer to the LED module 10 than the circuit board 41 of the power supply circuit 40 . Specifically, one end of the pin 80 passes through a through hole provided in the circuit board 41 . The through hole of the circuit board 41 is, for example, a notch shape obtained by notching the end of the circuit board 41 .

A conductive wire 81 is wound around the end of the pin 80 penetrating from the circuit board 41 , and the pin 80 and the circuit board 41 are connected by the conductive wire 81 . That is, the pins 80 and the circuit board 41 are connected by connecting the conductive wires 81 wound around the pins 80 to the circuit board 41 . Specifically, one end of the conductive wire 81 is wound around the pin 80 and soldered, and the other end of the conductive wire 81 is soldered to the circuit board 41 . A lead wire can be used as the conductive wire. By connecting the pins 80 and the circuit board 41 with the conductive wires 81 in this way, the AC voltage received by the pair of pins 80 is supplied to the power supply circuit 40 via the conductive wires 81 . One end of the pin 80 is exposed outside the housing 50 and connected to the lighting equipment.

The pin 80 also functions as an attachment portion for attaching the LED lamp 1 to a lighting fixture. Specifically, the LED lamp 1 is held in the lighting fixture by connecting the pin 80 to the socket of the lighting fixture.

The translucent cover 90 is a translucent member having translucency. Therefore, the light incident on the inner surface of the translucent cover 90 is transmitted through the translucent cover 90 and extracted to the outside of the translucent cover 90 . As shown in FIGS. 3 and 4 , the translucent cover 90 is attached to the housing 50 so as to cover the LED modules 10 . Specifically, the translucent cover 90 is attached to the opening end of the opening 50 a of the housing 50 .

As a material for the translucent cover 90, a translucent resin material such as acrylic or polycarbonate or a translucent material such as a glass material such as silica glass can be used. In the present embodiment, translucent cover 90 is made of a translucent resin material.

The translucent cover 90 may be a transparent cover that does not have light diffusion properties, or a diffusion cover that has light diffusion properties (light scattering properties). In the present embodiment, translucent cover 90 is a milky-white diffusion cover having a light diffusion function. For example, by forming a light diffusion film (light diffusion layer) on the inner or outer surface of the translucent cover 90, the translucent cover 90 can have a light diffusion function. As an example, a milky-white light diffusion film is formed by coating the entire inner surface or outer surface of the transparent translucent cover 90 with a resin containing a light diffusing material such as silica or calcium carbonate, a white pigment, or the like. can be formed into Alternatively, the light-transmitting cover 90 itself may be a milky-white light-transmitting cover 90 made of a resin in which a light diffusing material such as silica or calcium carbonate is dispersed. By providing the light-transmitting cover 90 with a light diffusion function in this way, the light incident on the light-transmitting cover 90 from the LED module 10 can be diffused, so that the light distribution angle can be widened.

As described above, in the LED lamp 1 according to the present embodiment, the heat sink 60 has the first portion 61 positioned between the circuit board 41 of the power supply circuit 40 and the circuit holder 70, and the circuit holder 70 has a support portion 72 that penetrates through the first portion 61 of and supports the circuit board 41 . Specifically, the support portion 72 of the circuit holder 70 extends in the direction in which the LED module 10 is positioned, which is the thickness direction of the LED lamp 1 .

With this configuration, the circuit board 41 is held by the circuit holder 70 while being separated from the first portion 61 of the heat sink 60 . That is, the circuit board 41 can be held by the circuit holder 70 while the circuit board 41 is floating in the air of the housing 50 . As a result, the space for housing the power supply circuit 40 can be widened, so that the LED lamp 1 having a wide circuit space can be realized. Therefore, since the circuit elements 42 of the power supply circuit 40 can be prevented from being densely packed, the temperature rise of the power supply circuit 40 can be suppressed. Moreover, since the space for housing the power supply circuit 40 is widened, even if the external size of the LED lamp 1 is reduced to reduce the diameter (for example, even if the external size is changed from 90 mm to 70 mm), the dimming circuit can be easily installed. can be mounted on That is, even if the external size is reduced, the dimming type LED lamp 1 can be realized. Furthermore, according to the LED lamp 1 according to the present embodiment, noise can also be reduced.

Moreover, in the LED lamp 1 according to the present embodiment, the support portion 72 of the circuit holder 70 extends from the main body 71 in the thickness direction of the LED lamp 1 .

With this configuration, the circuit board 41 is held by the circuit holder 70 while being separated from the main body 71 of the circuit holder 70 . Thereby, a large space for housing the power supply circuit 40 can be easily secured.

In addition, in the LED lamp 1 according to the present embodiment, the circuit holder 70 has a frame-shaped main body 71 arranged on the outer side portion 51b of the bottom portion 51 of the housing 50 . is provided with an insertion hole 71a through which is inserted. An end portion of the support portion 72 is provided with a locking claw 72 a that is locked to the end portion of the circuit board 41 .

With this configuration, the circuit board 41 can be easily fixed to the support portion 72 by engaging the locking claws 72 a and the end portion of the circuit board 41 . Therefore, with a simple configuration, the circuit board 41 can be held by the circuit holder 70 in a floating state.

Further, in the LED lamp 1 according to the present embodiment, the pin 80 electrically connected to the power circuit 40 passes through a through hole provided in the circuit board 41 of the power circuit 40, and the pin 80 and the circuit It is connected to the substrate 41 by connecting conductive wires 81 wound around the pins 80 to the circuit substrate 41 .

With this configuration, the pin 80 and the circuit board 41 can be easily connected compared to the case where the pin 80 is bent and connected to the circuit board 41 . Therefore, the assembly process of the LED lamp 1 is simplified.

Moreover, in the LED lamp 1 according to the present embodiment, the module plate 20 is made of metal, and the insulating plate 30 is arranged between the circuit board 41 and the module plate 20 .

With this configuration, even if the module plate 20 is made of metal, the insulation between the circuit board 41 and the module plate 20 can be ensured by the insulating plate 20 .

In addition, the LED lamp 1 according to the present embodiment includes the metal portions of the metal heat sink 60 and the metal module plate 20, and the resin portions of the bottom portion 51 of the resin housing 50 and the resin circuit holder 60. The area is divided into two areas in the thickness direction of the LED lamp 1 by the part.

By separating the metal portion and the resin portion (insulating portion) in this way, both heat dissipation and insulation can be achieved.

Moreover, the LED lamp 1 configured in this way can be used as a light source of an illumination device. Specifically, the lighting device includes an LED lamp 1 and a lighting fixture to which the LED lamp 1 is attached. The LED lamp 1 is attached to a socket provided in a lighting fixture. For example, the socket of the lighting fixture has a structure corresponding to a base such as a GX53 base or a GH76p base, and is configured to be connected to the base of the LED lamp 1 . A predetermined power is supplied to the LED lamp 1 by attaching the LED lamp 1 to the socket. The LED lamp 1 is detachably attached to the socket. Thereby, the LED lamp 1 can be replaced.

(Modification)
Although the illumination light source and the illumination device according to the present invention have been described above based on the embodiments, the present invention is not limited to the above embodiments.

For example, the illumination light source in the above embodiment is the diffusion type LED lamp 1 using the diffusion cover as the translucent cover 90, but the illumination light source is not limited to this. For example, as shown in FIGS. 5 and 6, it may be a condensing type LED lamp 1A using a condensing cover having a condensing function as the translucent cover 90A.

Specifically, a translucent cover 90A used in the LED lamp 1A shown in FIGS. 5 and 6 is provided with a Fresnel lens 91A as a condensing lens. As a result, the light from the LED module 10 can be condensed by the Fresnel lens 91A, so that the LED lamp 1A can be realized for use in a lighting device such as a spotlight that requires a narrow light distribution angle.

In the LED lamp 1 shown in FIGS. 5 and 6, a COB (Chip On Board) type light emitting module is used as the LED module 10A. The LED module 10A has a structure in which one or a plurality of LED chips (bare chips) sealed with a sealing member are directly mounted (primary mounting) on a substrate 11 . The LED module 10A used in this modification is not limited to the COB type LED module, and may be the SMD type LED module used in the LED lamp 1 of the above embodiment. Also, the LED module 10 used in the above embodiment is not limited to an SMD type LED module, and a COB type LED module may be used in the above embodiment.

Moreover, the LED lamp 1 shown in FIGS. 5 and 6 uses a module holder 100 that holds the LED module 10A. The module holder 100 is arranged to press the substrate 11 of the LED module 10A against the module plate 20 side. The module holder 100 is made of, for example, an insulating resin material such as PBT. Further, the module holder 100 is provided with a slit 100a for guiding the lead wire 200 connecting the power supply circuit 40 and the LED module 10A. The lead wire 200 is accommodated in the slit 100a. Further, the module holder 100 is provided with a pressing portion 100b for preventing the lead wires 200 accommodated in the slits 100a from floating. In addition, by passing the lead wire 200 through the slit 100a, it is possible to prevent the lead wire 200 from being caught by the Fresnel lens 91A.

Further, in the above embodiment, the light-emitting element 12 is a BY type white LED element that emits white light from a blue LED chip and a yellow phosphor, but is not limited to this. For example, a phosphor-containing resin containing a red phosphor and a green phosphor may be used and combined with a blue LED chip to emit white light. In addition to the yellow phosphor, a red phosphor or a green phosphor may also be mixed for the purpose of improving the color rendering properties. Alternatively, an LED chip that emits a color other than blue may be used. For example, an ultraviolet LED chip that emits ultraviolet light having a shorter wavelength than the blue light emitted by the blue LED chip is used, and is excited mainly by ultraviolet light. A blue phosphor, a green phosphor, and a red phosphor that emit blue light, red light, and green light may be used to emit white light.

Further, in the above-described embodiment, the LED module 10 may be configured so as to be controllable in toning. For example, RGB control can be performed by including a red LED light source that emits red light, a green LED light source that emits green light, and a blue LED light source that emits blue light as the plurality of light emitting elements. This makes it possible to realize an LED lamp having the LED module 10 capable of toning control. In this case, the power supply circuit 40 has a toning control circuit.

Moreover, although the light-emitting element 12 is configured by an LED chip in the above embodiment, it is not limited to this. For example, the light emitting element 12 may be configured using a semiconductor light emitting element such as a semiconductor laser or other solid light emitting element such as an organic EL (Electro Luminescence).

In addition, forms obtained by applying various modifications that a person skilled in the art can think of for each embodiment and modifications, and arbitrarily changing the constituent elements and functions in each embodiment and modifications without departing from the spirit of the present invention The present invention also includes forms realized by combining.

1, 1A LED lamp (illumination light source)
10, 10A LED module (light emitting module)
20 Module plate 30 Insulating plate 40 Power supply circuit 41 Circuit board 42 Circuit element 50 Case 51 Bottom 51b Outer part 51b1 Insertion hole 52 Side wall 60 Heat sink 61 First part 61a, 61b Insertion hole 62 Second part 70 Circuit holder 71 Main body 72 Support Part 72a Locking pawl 80 Pin 81 Conductive wire

Claims (10)

A flat light source for illumination,
a light emitting module;
a power supply circuit that generates power for causing the light emitting module to emit light;
a housing that houses the power supply circuit;
a heat sink disposed within the enclosure;
A circuit holder that holds the power supply circuit,
The power supply circuit has a circuit board and circuit elements mounted on the circuit board,
The heat sink has a first portion located between the circuit board and the circuit holder,
The circuit holder has a support portion that penetrates the first portion and supports the circuit board,
The support portion supports the circuit board while being separated from the first portion of the heat sink.
Light source for illumination. The support portion extends in the thickness direction of the illumination light source,
The illumination light source according to claim 1 . a pin electrically connected to the power supply circuit;
The pin is inserted through an insertion hole provided in the outer portion of the bottom of the housing,
The illumination light source according to claim 1 or 2. The pin passes through a through hole provided in the circuit board,
The pin and the circuit board are connected by connecting a conductive wire wound around the pin to the circuit board.
The illumination light source according to claim 3. The circuit holder has a frame-shaped main body arranged outside the bottom of the housing,
The main body is provided with an insertion hole through which the pin is inserted,
The support portion extends from the main body in the thickness direction of the illumination light source,
An end portion of the support portion is provided with a locking claw that locks to an end portion of the circuit board,
The illumination light source according to claim 3 or 4. The housing has a side wall,
The heat sink has a second portion provided along the side wall,
The first portion and the second portion are plate-shaped,
The second part is erected with respect to the first part,
The illumination light source according to any one of claims 1 to 5. The first part and the second part are ring-shaped,
The illumination light source according to claim 6. a metal module plate on which the light emitting module is arranged;
an insulating plate disposed between the circuit board and the module plate;
The illumination light source according to any one of claims 1 to 7. wherein the power supply circuit includes a dimming circuit for dimming the light emitting module;
The illumination light source according to any one of claims 1 to 8. A light source for illumination according to any one of claims 1 to 9;
A lighting fixture to which the lighting light source is attached,
lighting device.

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