JP2014186975A - Light source - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light source capable of efficiently radiating heat generated by a light emitting module.SOLUTION: The light source comprises: an LED module 20; a support base 30 on which the LED module 20 is located; a driving circuit 40 for emitting light on the LED module 20; a housing 60 that serves as an outline and in which the driving circuit 40 is housed; a circuit holder 50 for holding the driving circuit 40; a mouth piece 70 for receiving power from outside; and a heat sink 80 for radiating heat generated during light emission of the LED module via the support base 30. The support base 30 has a second face 31b opposite to a first face 31a on which the LED module 20 is located, and the heat sink 80 has: a main body 81 having a flat plane contacting the second face 31b of the support base 30; and a heat radiation fin part 82 communicated with the main body 81 and extending in an interior space of the housing 60 so that it does not contact the housing 60. The interior space of the housing 60 is spatially connected to the support base 30.

Description

  The present invention relates to a light source such as a light source for illumination using, for example, a light emitting diode (LED).

  Semiconductor light emitting devices such as LEDs are expected to be light sources for various products because of their small size, high efficiency, and long life. Among these, a bulb-type LED lamp (LED bulb) is being developed as an illumination light source that replaces conventionally known bulb-type fluorescent lamps and incandescent bulbs (Patent Document 1).

  The bulb-type LED lamp includes, for example, a light emitting module having an LED, a globe that covers the light emitting module, a support base on which the light emitting module is mounted, a driving circuit for causing the light emitting module to emit light, and an outer housing that houses the driving circuit. A body and a base for receiving power from the outside.

JP 2006-313717 A

  In the LED, heat is generated from the LED itself by light emission, and the temperature of the LED increases due to this heat, and the light output decreases. For this reason, for example, a structure in which heat generated in the light emitting module (LED) is dissipated by bringing a support base that supports the light emitting module into contact with the outer casing is considered.

  However, this structure alone cannot sufficiently radiate the heat generated in the light emitting module (LED).

  The present invention has been made to solve such a problem, and an object of the present invention is to provide a light source capable of efficiently dissipating heat generated in a light emitting module.

  In order to achieve the above object, one embodiment of a light source according to the present invention includes a light emitting module, a support base on which the light emitting module is mounted, a driving circuit for causing the light emitting module to emit light, and the driving circuit accommodated therein. A housing having openings at both ends; a holder provided on one opening side of the housing; and a holder for holding the drive circuit; provided on the other opening side of the housing. And a base for receiving electric power from the outside and a heat sink for dissipating heat generated during light emission of the light emitting module through the support base, the support base on which the light emitting module is mounted A first surface that is a surface and a second surface that is a surface opposite to the first surface, and the heat sink has a flat surface that is in contact with the second surface of the support base. The main body and the main body And a heat radiating fin portion extending so as not to contact the housing in the internal space of the housing, and the internal space of the housing and the support base are spatially connected. And

  Further, in one aspect of the light source according to the present invention, the support base is provided so as to close the one opening of the housing, and the main body portion of the heat sink includes the support base, the holder, It is good also as arrange | positioning so that the clearance gap connected with the internal space of the said housing | casing may exist between the said holders and the said holder.

  Further, in one aspect of the light source according to the present invention, the holder has a rib portion protruding toward the heat sink, and the heat sink has the main body portion pressed against the rib portion. Good.

  Also, in one aspect of the light source according to the present invention, the drive circuit includes a circuit board disposed substantially parallel to an axis in a direction from the one opening to the other opening of the housing. Then, a part of the front side where the heat dissipating fin portion extends may be inclined with respect to the plane of the main body portion.

  Further, in one aspect of the light source according to the present invention, one main surface of the circuit board is a surface on which a predetermined-shaped metal wiring is formed, and a part of the front side where the heat dissipating fin portion extends is It is good also as inclining so that the width | variety of the said radiation fin part may become small toward said one main surface.

  In the aspect of the light source according to the present invention, the housing may be made of resin.

  According to the present invention, the heat generated in the light emitting module can be radiated efficiently.

FIG. 1 is a side view of an LED lamp according to an embodiment of the present invention. FIG. 2 is an exploded perspective view of the LED lamp according to the embodiment of the present invention. FIG. 3 is a cross-sectional view of the LED lamp according to the embodiment of the present invention. FIG. 4 is an exploded perspective view of the support base, the heat sink, and the circuit holder in the LED lamp according to the embodiment of the present invention. FIG. 5 is a perspective view showing configurations of a heat sink, a circuit holder, and a drive circuit in the LED lamp according to the embodiment of the present invention. FIG. 6A is a top view of the LED lamp according to the embodiment of the present invention (the globe, the LED module, and the support base are not shown), and FIG. 6B is a cross-sectional view taken along line A- of FIG. FIG. 3 is a partially cutaway cross-sectional view (glove is not shown) of the LED lamp taken along line A ′. FIG. 7 is a schematic cross-sectional view of the illumination device according to the embodiment of the present invention.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. Note that each of the embodiments described below shows a preferred specific example of the present invention. Therefore, the numerical values, shapes, materials, components, component arrangement positions, connection forms, and the like shown in the following embodiments are merely examples, and are not intended to limit the present invention. Therefore, among the constituent elements in the following embodiments, constituent elements that are not described in the independent claims showing the highest concept of the present invention are described as optional constituent elements. Each figure is a schematic diagram and is not necessarily illustrated strictly.

  Hereinafter, an illumination light source will be described as an example of a light source in the present invention. In the following embodiments, a light bulb-shaped LED lamp (LED bulb) will be described as an example of an illumination light source.

(LED lamp)
First, the overall configuration of the LED lamp 1 according to the present embodiment will be described with reference to FIGS. 1 and 2. FIG. 1 is a side view of an LED lamp according to an embodiment of the present invention. FIG. 2 is an exploded perspective view of the LED lamp according to the embodiment of the present invention.

  As shown in FIG. 1, an LED lamp 1 according to the present embodiment is a bulb-type LED lamp that is a substitute for a bulb-type fluorescent lamp or an incandescent bulb, and is externally provided by a globe 10, a housing 60, and a base 70. An envelope is constructed.

  As shown in FIG. 2, the LED lamp 1 includes a globe 10, an LED module 20, a support base 30 on which the LED module 20 is mounted, a drive circuit 40 for causing the LED module 20 (LED 22) to emit light, and a drive. A circuit holder 50 for holding the circuit 40, a housing 60 configured to surround the drive circuit 40, a base 70 for receiving power from the outside, and heat generated during light emission of the LED module 20 And a heat sink 80 for radiating heat.

  Hereinafter, each component of the LED lamp 1 will be described in detail with reference to FIGS. FIG. 3 is a cross-sectional view of the LED lamp according to the embodiment of the present invention. FIG. 4 is an exploded perspective view of a support base, a heat sink, and a circuit holder in the LED lamp. FIG. 5 is a perspective view showing configurations of a heat sink, a circuit holder, and a drive circuit in the LED lamp.

  In FIG. 3, the alternate long and short dash line drawn along the vertical direction of the paper indicates the lamp axis J (center axis) of the LED lamp. In this embodiment, the lamp axis J coincides with the globe axis. Yes. The lamp axis J is an axis serving as a rotation center when the LED lamp 1 is attached to a socket of a lighting device (not shown), and coincides with the rotation axis of the base 70.

[Glove]
As shown in FIG. 3, the globe 10 is a translucent cover that covers the LED module 20, and is configured to extract light emitted from the LED module 20 to the outside of the lamp. Therefore, the light of the LED module 20 that has entered the inner surface of the globe 10 passes through the globe 10 and is extracted outside the globe 10.

  The globe 10 is a hollow rotating body having an opening 11, and is configured in a substantially hemispherical shape in which the opening 11 is narrowed in the present embodiment. As shown in FIG. 3, the opening 11 of the globe 10 is in contact with the support base 30. The opening 11, the support base 30, and the housing 60 are fixed by an adhesive (not shown) such as silicone resin.

  The globe 10 may be transparent so that the internal LED module 20 can be visually recognized, or the globe 10 may not be transparent by providing the globe 10 with a light diffusion function. When the globe 10 has a light diffusing function, for example, a milky white light diffusing film is formed by applying a resin or a white pigment containing a light diffusing material such as silica or calcium carbonate to the entire inner surface or outer surface of the globe 10. What is necessary is just to form.

  As a material of the globe 10, a glass material such as silica glass, or a resin material such as acrylic (PMMA) or polycarbonate (PC) can be used. Note that the globe 10 may have the same shape as the incandescent bulb.

[LED module]
The LED module 20 is a light emitting module having a light emitting element, and emits light of a predetermined color (wavelength) such as white. As shown in FIG. 3, the LED module 20 is mounted on the support base 30 and emits light by the power supplied from the drive circuit 40.

  As shown in FIGS. 2 and 3, the LED module 20 includes a substrate 21 and LEDs 22 mounted on the substrate 21. The LED module 20 in the present embodiment is configured using an SMD (Surface Mount Device) type LED 22.

  The substrate 21 is a mounting substrate for mounting the LEDs 22. The substrate 21 is, for example, a ceramic substrate made of ceramics such as alumina, a resin substrate, or a metal base substrate, and a plate-shaped substrate having a predetermined shape can be used. In addition, as a shape of the board | substrate 21, the planar view shape can also use a substantially rectangular or circular thing.

  The substrate 21 is attached to the support base 30 so that the back surface is in surface contact with the front surface of the support base 30. As shown in FIG. 2, electrode terminals 23 are formed at two locations on the surface of the substrate 21 as power feeding portions.

  Although not shown, a lead wire led out from the drive circuit 40 is solder-connected to each electrode terminal 23. In addition, a metal wiring for electrically connecting the electrode terminal 23 and the plurality of LEDs 22 is formed on the surface of the substrate 21 in a pattern.

  A plurality of LEDs 22 are mounted on the surface of the substrate 21. Each LED 22 is an example of a semiconductor light emitting element, and emits light with a predetermined power. The LED 22 in the present embodiment is an SMD type light emitting element. For example, a resin container having a recess, an LED chip mounted in the recess, and a sealing member (phosphor) enclosed in the recess Containing resin).

  For example, a blue LED chip that emits blue light when energized can be used as the LED chip. In this case, as the sealing member, a silicone resin containing YAG-based yellow phosphor particles can be used. As a result, part of the blue light emitted from the LED chip is converted into yellow light by the yellow phosphor particles contained in the sealing member, and the wavelength of the blue light and the yellow phosphor particles that are not absorbed by the yellow phosphor particles. The converted yellow light is mixed and emitted as white light. A hemispherical lens may be provided so as to cover the sealing member.

[Support stand]
The support table 30 (module plate) is a support member that supports the LED module 20, and the LED module 20 is placed on the support table 30 as shown in FIG. 3. The support base 30 is configured to close the first opening 60 a of the housing 60. That is, the first opening 60 a of the housing 60 is spatially closed by the support base 30.

  As shown in FIGS. 3 and 4, the support base 30 includes a flat plate portion 31 on which the LED module 20 is placed and a side wall portion 32 erected on the flat plate portion 31. The support base 30 in the present embodiment is a cap-shaped member having a flat plate portion 31 as a bottom portion and a side wall portion 32 as a peripheral portion, and is configured to cover the circuit holder 50.

  As shown in FIG. 3, the flat plate portion 31 (plane portion) has a first surface 31 a that is a surface on which the LED module 20 is placed (a surface on the globe side), and a side opposite to the first surface 31 a. And a second surface 31b which is a surface (surface on the base side). The heat sink 80 is in contact with the second surface 31b.

  In the present embodiment, the flat plate portion 31 has a disk shape, and the first surface 31 a and the second surface 31 b are orthogonal to the lamp axis J. Moreover, the 1st surface 31a and the 2nd surface 31b are comprised only by the plane without a recessed part. Thereby, since the support stand 30 can be processed easily, the support stand 30 can be produced at low cost.

  As shown in FIG. 4, the flat plate portion 31 is provided with two first through holes 33 a and two second through holes 33 b. The module substrate holding part 56 of the circuit holder 50 is inserted through the first through hole 33a. Further, the module substrate restricting portion 57 of the circuit holder 50 and the lead wire led out from the drive circuit 40 are inserted into the second through hole 33b.

  The side wall portion 32 is provided around the flat plate portion 31 so as to protrude from the flat plate portion 31 toward the drive circuit side. The side wall part 32 in this Embodiment is comprised so that it may have a level | step difference in the perimeter, and has the small diameter part 32a with a small diameter, and the large diameter part 32b with a large diameter. That is, the step of the side wall portion 32 is configured by the difference in diameter between the small diameter portion 32a and the large diameter portion 32b. As shown in FIG. 3, the opening portion 11 of the globe 10 is in contact with the step portion of the side wall portion 32 (the upper surface of the large diameter portion 32 b). As a result, the opening 11 of the globe 10 is closed by the support base 30.

  The large diameter portion 32 b is a portion connected to the first opening 60 a of the housing 60. The support base 30 is connected to the housing 60 by the outer peripheral surface of the large diameter portion 32 b being in contact with the inner peripheral surface of the first opening 60 a of the housing 60. Thereby, the heat of the LED module 20 conducted to the support base 30 can be conducted directly to the housing 60. Note that the first opening 60 a of the housing 60 is blocked by the support 30 by bringing the outer peripheral surface of the large diameter portion 32 b into contact with the inner peripheral surface of the housing 60.

  As described above, the support base 30 also functions as a heat radiating member (heat sink) for radiating heat generated in the LED module 20 (LED 22). In order to efficiently conduct heat, the support base 30 may be made of a metal material mainly composed of aluminum (Al), copper (Cu), iron (Fe), or the like, or a resin material having high thermal conductivity. preferable. In the present embodiment, the support base 30 is made of aluminum.

  The support base 30 configured as described above is positioned and fixed to the housing 60 by bringing the end of the opening of the large diameter portion 32 b into contact with the upper surface of the convex portion 61 of the housing 60.

[Drive circuit]
The drive circuit (circuit unit) 40 is a lighting circuit for causing the LED module 20 (LED 22) to emit light (lights), and supplies predetermined power to the LED module 20. The drive circuit 40 in the present embodiment is a power supply circuit, for example, converts AC power supplied from the base 70 into DC power, and supplies the DC power to the LED module 20.

  As shown in FIG. 3, the drive circuit 40 includes a circuit board 41 and a plurality of circuit elements (not shown) for driving the LED module.

  The circuit board 41 is a printed board (PCB board) in which a metal wiring such as a copper foil is patterned on one main surface (solder surface). The circuit element is mounted on the surface (component surface) opposite to the solder surface of the circuit board 41. The plurality of circuit elements mounted on the circuit board 41 are electrically connected to each other by metal wiring. The circuit board 41 has a plurality of through holes into which lead wires (legs) of circuit elements are inserted.

  In the present embodiment, the circuit board 41 has a posture in which the main surface of the circuit board 41 is substantially parallel to the lamp axis J (axis in the direction from the first opening 60a to the second opening 60b of the housing 60). It is attached to the circuit holder 50. That is, the circuit board 41 is arranged vertically in the housing 60, and the circuit holder 50 is in a posture in which the main surface of the circuit board 41 is substantially perpendicular to the main surface of the flat plate portion 51 of the circuit holder 50. Is held in.

  The circuit board 41 is configured to become wider from the second opening 60b of the housing 60 toward the first opening 60a so that a large mounting area can be obtained even in a vertical arrangement. A convex portion (step portion) 41 a is formed on the periphery of the circuit board 41. The convex portion 41a is a portion that protrudes in the lateral direction so that the outline when the main surface of the circuit board 41 is viewed in plan is a step shape, and is formed so as to face both sides of the circuit substrate 41 in the lateral direction. Has been. When the circuit board 41 is held by the circuit holder 50, the convex part 41 a is locked to the locking claw 54 a of the circuit board holding part 54 in the circuit holder 50.

  Circuit elements (circuit components) include, for example, capacitive elements such as electrolytic capacitors and ceramic capacitors, resistive elements such as resistors, rectifier circuit elements, coil elements, choke coils (choke transformers), noise filters, diodes, integrated circuit elements, etc. The semiconductor element or the like. Many of the circuit elements are mounted on one main surface of the circuit board 41.

  The drive circuit 40 and the LED module 20 are electrically connected by a pair of lead wires (output-side lead wires). The drive circuit 40 and the base 70 are electrically connected by a pair of lead wires (input side lead wires). These four lead wires are, for example, alloy copper lead wires, and are composed of a core wire made of alloy copper and an insulating resin film covering the core wire. As an example, the four lead wires are vinyl wires.

  The output-side lead wire is an electric wire for supplying electric power for lighting the LED module 20 from the drive circuit 40 to the LED module, and is inserted into the second through hole 33b provided in the support base 30, and the LED module. It is pulled out to the side (in the globe 10). Note that one end (core wire) of the output side lead wire is solder-connected to the electrode terminal 23 of the substrate 21 of the LED module 20, and the other end (core wire) is solder-connected to the metal wiring of the circuit substrate 41.

  The input-side lead wire is an electric wire for supplying power for lighting the LED module 20 from the base 70 to the drive circuit 40. One end (core wire) of the input side lead wire is electrically connected to the base 70, and the other end (core wire) is electrically connected to the power input portion (metal wiring) of the circuit board 41 by solder or the like. .

[Circuit holder]
As shown in FIGS. 2 and 3, the circuit holder 50 is a holding member for holding the drive circuit 40, and is provided on the first opening 60 a side of the housing 60. The circuit holder 50 is fixed to the housing 60.

  The circuit holder 50 in the present embodiment is configured by a cap-shaped insulating member (insulating cap member), and as shown in FIGS. 3 and 4, between the support base 30 and the heat sink 80 and the drive circuit 40. It has the flat plate part 51 arrange | positioned, the side wall part 52 standingly arranged by the flat plate part 51, and the notch part 53 provided in the side of the flat plate part 51. As shown in FIG. The circuit holder 50 configured as described above is integrally formed by resin molding using, for example, an insulating resin material such as polybutylene terephthalate (PBT).

  The flat plate portion 51 (plane portion) has a plate shape, and has a main surface that is orthogonal to the lamp axis J. As shown in FIG. 3, the flat plate portion 51 of the circuit holder 50 and the flat plate portion 31 of the support base 30 or the heat sink 80 are arranged to face each other with a predetermined interval.

  As shown in FIG. 3, the side wall portion 52 is provided so as to protrude from the peripheral edge of the flat plate portion 51 toward the drive circuit side. In the present embodiment, it is configured as a pair of opposing side wall portions 52. The circuit holder 50 is positioned by bringing the end of the side wall portion 52 on the drive circuit side into contact with the upper surface of the convex portion 61 of the housing 60. A claw portion 52 a that is locked to the locking portion 62 of the housing 60 is provided on the outer peripheral surface of the side wall portion 52.

  Moreover, the side wall part 52 in this Embodiment is comprised so that it may have a level | step difference in an outer peripheral surface, and has a small diameter part with a small diameter, and a large diameter part with a large diameter. As shown in FIG. 3, the side wall part 52 in the circuit holder 50 and the side wall part 32 in the support base 30 are arranged so that the respective steps are combined. Thereby, alignment with the circuit holder 50 and the support stand 30 can be performed, and a clearance gap can be provided between the circuit holder 50 and the support stand 30. FIG.

  The notch 53 is provided to spatially connect the support base 30 to the internal space of the housing 60. That is, by providing the notch 53, the gap (gap) between the circuit holder 50 (flat plate portion 51) and the support base 30 (flat plate portion 31) and the drive circuit side of the housing 60 relative to the circuit holder 50. The internal space (spatial region) is spatially connected. The notch 53 is a region in which a part of a predetermined shape is cut out. In the present embodiment, a part including the peripheral part of the bottomed cylindrical cap-like member is cut out so as to face each other. There are two areas. That is, in the present embodiment, the cutout portion 53 is a portion of the periphery of the flat plate portion 51 where the side wall portion 52 is not formed, and is provided at two opposing locations.

  By comprising in this way, since the heat of the LED module 20 conducted to the support base 30 can be conducted by convection to the internal space in the housing 60, the heat generated in the LED module 20 is efficiently radiated. be able to.

  As shown in FIG. 3, the flat plate portion 51 has a pair of circuit board holding portions 54 for holding the circuit board 41, and a restriction for restricting the held circuit board 41 from moving in the direction perpendicular to the main surface. A pair of circuit board restricting portions 55 is provided.

  Each of the pair of circuit board holding portions 54 is, for example, a protruding portion provided so as to protrude from the main surface of the flat plate portion 51 on the driving circuit side toward the driving circuit side. The pair of circuit board holding portions 54 is configured to sandwich the side surface of the circuit board 41 from the horizontal direction of the main surface of the circuit board 41. Further, a locking claw 54 a is formed at the tip of each of the pair of circuit board holding portions 54, and the locking claw 54 a is configured to be locked with the convex portion 41 a of the circuit board 41.

  Each of the pair of circuit board restricting portions 55 is, for example, a convex portion provided so as to protrude from the main surface of the flat plate portion 51 on the drive circuit side to the drive circuit side. The pair of circuit board restricting portions 55 are configured to sandwich the circuit board 41 from the direction perpendicular to the main surface of the circuit board 41. Thereby, since the movement of the circuit board 41 in the direction perpendicular to the main surface can be restricted, the side slip of the circuit board 41 held by the circuit holder 50 can be suppressed.

  As shown in FIGS. 3 and 4, the flat plate portion 51 includes two module substrate holding portions 56 for holding the LED module 20 (substrate 21), and the horizontal movement of the LED module (substrate 21). Are provided with two module board restricting portions 57 for restricting the above. Thus, the circuit holder 50 not only holds the circuit board 41 but also functions as a holding member for holding the board 21.

  Each of the module substrate holding portions 56 is provided so as to protrude from the main surface of the flat plate portion 51 on the globe side to the globe side, and each of the module substrate holding portions 56 is engaged with one side of the substrate 21. A pawl 56a is formed. Specifically, the two module substrate holding parts 56 are provided so as to sandwich two opposing sides of the substrate 21. Further, the locking claw 56 a is configured to abut on the end surface of one side of the substrate 21. The substrate 21 is held on the support base 30 by pressing the surface of the substrate 21 with the locking claws 56 a.

  Each of the module substrate restricting portions 57 is provided so as to protrude from the main surface on the globe side of the flat plate portion 51 toward the globe side, and each of the module substrate restricting portions 57 has the substrate 21 on the support base 30. A flat portion 57a that abuts against the side surface of the substrate 21 when placed is formed. Specifically, the two module substrate restricting portions 57 are provided so as to sandwich the other two opposite sides of the substrate 21. When the side surface of the substrate 21 is sandwiched between the two flat portions 57a, the skidding of the substrate 21 can be prevented.

  Further, each of the module substrate restricting portions 57 has an insertion hole for drawing out a lead wire (output-side lead wire) for connecting the drive circuit 40 and the LED module 20 from the drive circuit side of the circuit holder 50 to the globe side. Is provided. One output-side lead wire of the two output-side lead wires is inserted into the insertion hole of one module substrate restriction portion 57, and the other output side is inserted into the insertion hole of the other module substrate restriction portion 57. Lead wire is inserted.

  Each of the module substrate restricting portions 57 is provided with two slits 57b as lead wire restricting portions for restricting the movement of the output-side lead wire inserted through the insertion hole and pulled out to the glove side. Thus, the module board restricting portion 57 in the present embodiment not only prevents the board 21 from slipping but also has a function of holding the output-side lead wire.

  The slit 57b is formed in a groove shape, and is configured to sandwich a lead wire that connects the drive circuit 40 and the LED module 20. The groove width of the slit 57b is configured to be slightly smaller than the line width of the lead wire. Thereby, the output side lead wire can be fixed to the slit 57b by pushing the output side lead wire into the slit 57b. Therefore, the output side lead wire and the electrode terminal 23 can be easily soldered. Further, by restricting the movement of the output side lead wire, the stress load at the solder connection portion between the output side lead wire and the electrode terminal 23 can be greatly reduced, so that the disconnection between the output side lead wire and the electrode terminal 23 is performed. Defects can be prevented.

  Further, as shown in FIG. 4, a rib part (protrusion part) 58 that protrudes toward the heat sink is provided on the main surface of the flat plate part 51 on the globe side. The rib portion 58 in the present embodiment is provided at the base of the module substrate restricting portion 57. A heat sink 80 is placed on the upper surface of the rib portion 58. As a result, the heat sink 80 is connected to the circuit holder 50 so that a gap exists between the heat sink 80 and the flat plate portion 51.

  When the LED module 20 is held and fixed to the support base 30, the locking claw 56 a is attached to the substrate 21 with the substrate 21 placed on the first surface 31 a of the support base 30 and the heat sink 80 placed on the circuit holder 50. The module substrate holding portion 56 is passed through the first through hole 33a of the support base 30 so as to be hooked on the surface of one side, and the flat portion 57a is in contact with the other side of the substrate 21 so that the module substrate restricting portion 57 Is passed through the second through hole 33 b of the support base 30. Thereby, the board | substrate 21 is hold | maintained and fixed to the support base 30 so that it may be pressed by the support claw 30 by the latching claw 56a. Further, since the side surface of one side of the substrate 21 abuts on the flat portion 57 a of the module substrate restricting portion 57, the movement of the substrate 21 in the horizontal direction of the main surface is restricted by the module substrate restricting portion 57.

[Case]
As shown in FIG. 3, the housing 60 is configured to surround the drive circuit 40, the support base 30, and the circuit holder 50, and a predetermined space area (internal space) exists inside the housing 60. The housing 60 in the present embodiment is an outer housing that forms an outer shell, and the outer surface of the housing 60 is exposed to the outside of the lamp. As shown in FIG. 2, the housing 60 is provided with a convex portion 61 and a locking portion 62.

  The housing 60 is formed with openings at both ends in the axial direction of the lamp shaft J, and includes a first opening 60a that is an opening on the globe side, a second opening 60b that is an opening on the base side, It is comprised by the main-body part 60c located between the 1st opening part 60a and the 2nd opening part 60b. The housing 60 is a funnel-shaped (trumpet-shaped) rotating body with the lamp axis J as an axis, and is configured such that the opening of the first opening 60a is larger than the opening of the second opening 60b.

  The first opening 60a is configured by a substantially cylindrical member having a constant inner diameter and outer diameter. As shown in FIG. 3, the first opening 60 a is a connecting portion with the side wall 32 of the support base 30, specifically, the inner peripheral surface of the first opening 60 a and the side wall 32 (large diameter portion). 32b) is in surface contact with the outer peripheral surface. Thereby, the heat generated in the LED module 20 can be efficiently conducted to the housing 60 via the support base 30.

  The first opening 60 a is configured such that the opening is closed by the support base 30. That is, the first opening 60a of the housing 60 is closed with the support base 30 as a lid.

  The 2nd opening part 60b is comprised by the substantially cylindrical member, and as shown in FIG. 3, the nozzle | cap | die 70 is externally fitted by the 2nd opening part 60b. As a result, the second opening 60 b of the housing 60 is closed by the base 70.

  The main body 60c is configured by a substantially cylindrical member whose inner and outer diameters gradually change from the first opening 60a side to the second opening 60b side. Three convex portions 61 and two locking portions 62 are provided on the inner surface of the main body portion 60c.

  The convex portion 61 is formed in a rib shape so as to protrude inward from the inner surface of the main body portion 60c. Moreover, the convex part 61 is formed in the step shape, and has two different planes which face the 1st opening part 60a side. As shown in FIG. 3, the opening edge of the side wall portion 32 (large diameter portion 32 b) of the support base 30 abuts on one plane of the convex portion 61, and a circuit is formed on the other plane of the convex portion 61. The edge of the side wall part 52 of the holder 50 contacts. Thereby, positioning of the support stand 30, the circuit holder 50, and the housing | casing 60 can be performed.

  The locking portion 62 is configured so that the claw portion 52a of the circuit holder 50 is locked. The circuit holder 50 can be fixed to the housing 60 by rotating the circuit holder 50 and hooking the claw portion 52 a of the circuit holder 50 on the locking portion 62 of the housing 60.

  The casing 60 configured in this way is integrally formed by resin molding using an insulating resin material such as PBT, for example.

[Base]
The base 70 is a power receiving unit that receives power for causing the LED module 20 (LED 22) to emit light from the outside of the lamp. The base 70 is attached to a socket of a lighting fixture, for example. Thereby, when the base 70 lights the LED lamp 1, it can receive electric power from the socket of a lighting fixture. The base 70 in the present embodiment receives AC power (for example, commercial AC power). The AC power received by the base 70 is input to the power input unit of the drive circuit 40 via a pair of input-side lead wires.

  As shown in FIG. 3, the base 70 is attached to the second opening 60 b of the housing 60. The base 70 is a bottomed cylindrical metal cap-shaped member, and is a plug-in (swan type) base in the present embodiment. The type of the base 70 is not particularly limited, and a screw-type (Edison type) base may be used.

[heatsink]
The heat sink 80 is a heat radiating member that radiates heat generated during light emission (lighting) of the LED module via the support base 30. Therefore, the heat sink 80 is preferably made of a material having high thermal conductivity, and can be made of a metal material such as aluminum, for example. The heat sink 80 in the present embodiment is formed into a predetermined shape by performing metal processing such as cutting or bending using an aluminum plate material or the like. By using the heat sink 80, the heat of the LED module 20 conducted to the support base 30 can be efficiently radiated.

  As shown in FIG. 4, the heat sink 80 includes a main body portion 81 and a pair of radiating fin portions 82 connected to the main body portion 81. Specifically, the heat sink 80 includes a substantially rectangular plate-shaped main body portion 81 and plate-shaped heat radiation fin portions 82 provided in a wing shape at both ends of the main body portion 81. In the present embodiment, the main body portion 81 and the pair of heat radiating fin portions 82 are formed by bending two portions of a metal plate processed into a predetermined shape by 90 °. "".

  The main body 81 is a plate having a first surface 81a that contacts the second surface 31b of the flat plate portion 31 of the support base 30, and a second surface 81b that is the surface opposite to the first surface 81a. The metal plate is disposed between the support 30 and the circuit holder 50. In the present embodiment, the second surface 31b of the support base 30 and the first surface 81a of the heat sink 80 are in close contact so as to be in surface contact.

  The main body 81 is placed on the rib portion 58 formed on the flat plate portion 51 of the circuit holder 50, and the second surface 81 b of the main body 81 is in contact with the upper surface of the rib portion 58. The main body portion 81 is sandwiched between the support base 30 and the rib portion 58. In the present embodiment, the heat sink 80 is held in the housing 60 when the main body portion 81 is pressed against the rib portion 58. Thus, since the heat sink 80 and the circuit holder 50 are disposed via the rib portion 58, the housing 60 has a space between the heat sink 80 (main body portion 81) and the circuit holder 50 (flat plate portion 51). A gap (space region) connected to the internal space is formed.

  As shown in FIGS. 4 and 5, the main body portion 81 is formed with a pair of notches 81 c for allowing the pair of module board restricting portions 57 of the circuit holder 50 to pass therethrough. That is, the area of the main body 81 is made as large as possible while avoiding a collision between the heat sink 80 and the module substrate restricting portion 57. Thereby, since the contact area of the main-body part 81 and the support stand 30 can be enlarged, the thermal resistance of the heat sink 80 and the support stand 30 can be made small. Therefore, the heat generated in the LED module 20 can be efficiently conducted from the support base 30 to the heat sink 80.

  As shown in FIG. 4, the pair of radiating fin portions 82 are formed to extend in a direction perpendicular to the main surface of the second surface 81 b of the main body portion 81. In the present embodiment, the pair of radiating fin portions 82 are formed so as to face the pair of cutout portions 53 of the circuit holder 50. That is, the pair of radiating fin portions 82 are formed so as to extend in a space region between the notch portion 53 of the circuit holder 50 and the side wall portion 32 of the support base 30. Each radiating fin portion 82 preferably extends to a low temperature region of the internal space of the housing 60. Further, as will be described later, the pair of radiating fin portions 82 extend so as not to contact the housing 60 and the circuit holder 50 in the internal space of the housing 60.

  Each radiating fin portion 82 is a plate-shaped metal plate, and a part of the front side of the radiating fin portion extends with respect to the first surface 81a (or the second surface 81b) of the main body portion 81. Inclined. That is, the radiating fin portion 82 has a shape cut obliquely.

  As shown in FIG. 5, in the present embodiment, the radiating fin portion 82 has an inclined side 82 a. The inclined side 82 a is a part of the extended side of the radiating fin portion 82, and is inclined so that the width of the radiating fin portion 82 decreases toward the solder surface of the circuit board 41.

  In the present embodiment, each radiating fin portion 82 extends straight. Thereby, the heat convection in the housing | casing 60 can be generated smoothly. However, the radiating fin portion 82 may be configured to be bent once or a plurality of times. Thereby, in the limited internal space of the housing | casing 60, the area of the radiation fin part 82 can be enlarged as much as possible, and the thermal radiation effect can be heightened.

[Characteristic configuration of this embodiment]
Next, a characteristic configuration of the LED lamp 1 according to the present embodiment will be described with reference to FIG. 6A is a top view of the LED lamp according to the embodiment of the present invention (the globe, the LED module, and the support base are not shown), and FIG. 6B is an A- FIG. 3 is a partially cutaway cross-sectional view (glove not shown) of the LED lamp taken along line A ′.

  As shown in FIG. 6B, in the present embodiment, a heat sink 80 having a main body portion 81 in surface contact with the support base 30 and a heat dissipating fin portion 82 connected to the main body portion 81 is provided. The fin portion 82 extends from the housing 60 in the internal space of the housing 60.

  Thereby, the heat generated in the LED module 20 (LED 22) conducted to the main body 81 of the heat sink 80 via the support base 30 can be conducted from the radiation fin portion 82 to the internal space in the housing 60.

  Furthermore, in the present embodiment, the support base 30 and the internal space (internal region) of the housing 60 are spatially connected. Specifically, the peripheral area of the second surface 31b (see FIG. 3) of the support base 30 (the peripheral area of the portion exposed from the main body 81 of the heat sink 80) is spatially connected to the internal space of the housing 60. Yes. Thereby, the heat of the LED module 20 (LED 22) conducted to the support base 30 can be conducted from the support base 30 to the internal space in the housing 60 without passing through the heat sink 80.

  Thus, the heat conducted from the heat sink 80 (radiating fin portion 82) and the support base 30 to the internal space of the housing 60 is caused by the heat convection of the air in the internal space of the housing 60 to the LED module side in the housing 60. It moves from the high temperature region to the low temperature region toward the base side, is conducted to the housing 60 and the base 70, and is radiated to the outside of the lamp.

  As described above, since heat generated during lighting of the LED module 20 (LED 22) can be efficiently radiated, an excessive increase in the temperature of the LED 22 can be suppressed. Thereby, since deterioration by the excessive temperature rise of LED22 can be suppressed, the lifetime shortening of LED22 can be suppressed. Therefore, shortening of the life of the LED lamp 1 can be suppressed.

  Moreover, in the present embodiment, the radiating fin portion 82 is extended so as not to contact the housing 60, and the extended tip is free with respect to the housing 60. Thereby, it can prevent that the heat dissipation effect by the heat sink 80 falls.

  That is, if the radiating fin portion 82 is in contact with the housing 60, some stress is applied to the heat sink 80. As a result, the adhesion between the heat sink 80 (main body portion 81) and the support base 30 is lowered, and the thermal resistance between the heat sink 80 and the support base 30 is increased. Therefore, the heat of the LED module 20 conducted to the support base 30 is less likely to be conducted to the heat sink 80.

  On the other hand, since it is possible to prevent stress from being applied to the heat sink 80 from the housing 60 by extending the radiating fin portion 82 so as not to contact the housing 60, the heat sink 80 ( It can prevent that the adhesiveness of the main-body part 81) and the support stand 30 falls. Thereby, it can prevent that the thermal radiation effect by the heat sink 80 falls by the contact of the thermal radiation fin part 82 and the housing | casing 60. FIG.

  Furthermore, by adopting a configuration in which the radiating fin portion 82 is extended into the internal space of the housing 60 as described above, the arrangement configuration of the radiating fin portion 82 can be effectively utilized in the internal space of the housing 60. it can. Thereby, the enlargement of the housing | casing 60 can be avoided and size reduction can be achieved as a light source substituted with an incandescent lamp.

  In the present embodiment, the support base 30 is connected so as to be in contact with the casing 60 that forms the outer shell. Thereby, the heat of the LED module 20 (LED 22) conducted to the support base 30 is conducted from the support base 30 to the housing 60 and radiated to the outside of the lamp.

  As described above, in the present embodiment, the heat generated during the lighting of the LED module 20 (LED 22) is conducted from the support base 30 and the heat sink 80 (radiation fin portion 82) to the internal space of the housing 60, and is heated. The heat is not only radiated from the housing 60 to the outside of the lamp by convection, but also directly conducted from the support base 30 to the housing 60 and radiated to the outside of the lamp. Therefore, heat can be dissipated more efficiently.

  In addition, as shown in FIG. 6B, in the present embodiment, the support base 30 is provided so as to close the first opening 60a of the housing 60, and the main body 81 of the heat sink 80 is It is arrange | positioned between the support stand 30 and the holder 50, and it arrange | positions so that the clearance gap (space area | region) connected with the internal space of the housing | casing 60 may exist between the holder 50. FIG.

  Specifically, the main body portion 81 of the heat sink 80 is disposed at a predetermined distance from the flat plate portion 51 of the circuit holder 50 while being in surface contact with the flat plate portion 31 of the support base 30. There is a gap (gap) between 81 and the flat plate portion 51 of the circuit holder 50. And this clearance gap and the internal space of the housing | casing 60 are connected spatially.

  In the present embodiment, the gap and the internal space in the housing 60 are spatially connected between the heat sink 80 and the holder 50 by the notch 53 of the circuit holder 50. That is, as shown in FIG. 6A, by providing a notch 53 by cutting out a part of the bottomed cylindrical cap-shaped member, as shown in FIG. A gas flow path that spatially connects the gap and the internal space of the housing 60 is provided between the inner surface of the side wall portion 32 of the 30 and the side portion (notch portion 53) of the circuit holder 50. More specifically, before the cap-shaped member is cut out (when the cut-out portion 53 is not provided), the cap-shaped member and the support base 30 are in close contact with each other around the side wall portion. By providing the notch 53 in the member, the gas flow path can be formed.

  As described above, the gap between the heat sink 80 and the holder 50 and the internal space of the housing 60 are spatially connected, so that the heat radiated from the radiating fin portion 82 to the internal space of the housing 60 is convected by the convection. When conducting to the body 60 and the base 70, the thermal convection in the internal space of the housing 60 can be further increased. Thereby, since the heat of the LED module 20 conducted to the heat sink 80 can be moved more smoothly from the high temperature region on the LED module side in the housing 60 to the low temperature region on the base side, the heat of the LED module 20 can be obtained. Can be dissipated more effectively. As a result, an excessive increase in the temperature of the LED 22 can be further suppressed.

  In addition, by providing the notch portions 53 at a plurality of locations, air can be easily circulated between the gap between the heat sink 80 (or the support base 30) and the holder 50 and the internal region in the housing 60. . Thereby, since it is possible to easily generate thermal convection even in the closed casing 60, it is possible to efficiently dissipate heat generated in the LED module 20.

  In the present embodiment, the heat sink 80 has the main body portion 81 pressed against the rib portion 58.

  With this configuration, the heat sink 80 can be held and fixed to at least one of the support base 30 and the circuit holder 50 without separately using a fixing member such as a screw or an adhesive. Thereby, cost can be reduced and assembly can be facilitated.

  In the present embodiment, a part of the extended side of the radiating fin portion 82 is inclined with respect to the first surface 81 a (or the second surface 81 b) of the main body portion 81.

  With this configuration, it is possible to avoid the radiating fin portion 82 that is a metal plate from coming into contact with the charging portion or the circuit element (electronic component) on the solder surface of the circuit board 41 of the drive circuit 40. Thereby, a fixed insulation distance is securable between the radiation fin part 82 and the charging part or circuit element (electronic component) in a solder surface. Therefore, damage to the circuit elements of the drive circuit 40 due to dielectric breakdown can be reduced.

  For example, the heat radiation fin portion 82 and the metal pattern are formed by inclining a part of the extended side of the heat radiation fin portion 82 so that the width of the heat radiation fin portion 82 decreases toward the solder surface of the circuit board 41. In addition, an insulation distance from the solder can be ensured.

  Moreover, in this Embodiment, the housing | casing 60 is resin. When the heat of the LED module 20 (LED 22) is radiated through the casing 60, the resin casing 60 is generally inferior in thermal conductivity to the metal casing 60, and thus the heat dissipation effect is also inferior. . However, in the present embodiment, high heat dissipation is obtained as described above, and thus the temperature rise of the LED module 20 (LED 22) can be sufficiently suppressed even with the resin casing 60. Moreover, the LED lamp excellent in insulation can be implement | achieved by making the housing | casing 60 which makes an outline into resin.

  As described above, according to the LED lamp 1 according to the present embodiment, the LED module 20 includes the heat sink 80 having the main body portion 81 that is in surface contact with the support base 30 and the heat radiation fin portion 82 that extends into the internal space of the housing 60. The heat generated by (LED22) can be radiated efficiently.

  Actually, when the chip temperature Ts of the LED module 20 was measured, the configuration in which the heat sink 80 was provided was able to reduce the chip temperature Ts by 4 ° C. compared to the configuration in which the heat sink 80 was not provided. Thereby, an LED lamp corresponding to 10 W can be easily realized.

(Lighting device)
Moreover, this invention can be implement | achieved not only as such an LED lamp but as an illuminating device provided with an LED lamp. Hereinafter, a lighting device according to an embodiment of the present invention will be described with reference to FIG. FIG. 7 is a schematic cross-sectional view of the illumination device according to the embodiment of the present invention.

  As shown in FIG. 7, the illuminating device 2 which concerns on embodiment of this invention is mounted | worn with and used for the indoor ceiling, for example, and is provided with the LED lamp 1 which concerns on said embodiment, and the lighting fixture 3. As shown in FIG. .

  The lighting fixture 3 has a function of turning off and lighting the LED lamp 1 and includes a fixture main body 4 attached to the ceiling and a translucent lamp cover 5 covering the LED lamp 1.

  The instrument body 4 has a socket 4a. The base 70 of the LED lamp 1 is attached to the socket 4a. Electric power is supplied to the LED lamp 1 through the socket 4a.

  Note that the lighting fixture is not limited to the one shown in FIG. 7, and a ceiling-embedded lighting fixture that is embedded in the ceiling, such as a downlight or a spotlight, can also be used.

(Other)
As mentioned above, although the LED lamp and the illuminating device concerning this invention were demonstrated based on embodiment, this invention is not limited to these embodiment.

  For example, in the above-described embodiment, the inclined sides 82a of the pair of radiating fin portions 82 are cut in the same direction and configured in a bilaterally symmetric shape, but this is not restrictive. That is, although the opposing radiation fin part 82 is comprised so that the metal plate of the same shape may face, it is not restricted to this. In this case, the radiating fin portion 82 that faces the solder surface of the circuit board 41 is preferably configured so that the width of the radiating fin portion 82 decreases toward the circuit board 41. What is necessary is just to comprise so that the direction of the radiation fin part 82 which faces may be cut in the direction different from the inclination direction of the radiation fin part 82 which faces the solder surface of the circuit board 41. That is, the heat radiation fin portion 82 facing the component surface of the circuit board 41 may be configured such that the width of the heat radiation fin portion 82 decreases toward the circuit board 41.

  In the above embodiment, both the pair of radiating fin portions 82 are cut. However, only one of the pair of radiating fin portions 82 may be cut. In other words, the inclined side 82 a may be formed only on one of the pair of radiating fin portions 82. In addition, the inclined side 82a is not necessarily required, and the inclined side 82a may not be provided in any of the pair of radiating fin portions 82.

  Moreover, in said embodiment, although the housing | casing 60 was comprised by resin, you may comprise by metals, such as aluminum. When the metal casing 60 is used, in order to ensure the insulation of the drive circuit 40, a resin casing configured to further surround the drive circuit 40 inside the metal casing 60 is provided. It is good to arrange a body (circuit case). When the metal casing 60 is used, a resin casing configured to surround the casing 60 may be disposed as the outer casing.

  In the above embodiment, by providing the notch 53 in the circuit holder 50, the gap between the heat sink 80 and the circuit holder 50 and the internal space of the housing 60 are spatially connected. The means for spatially connecting the gap and the internal space of the housing 60 is not limited to this. For example, the clearance and the internal space of the housing 60 may be spatially connected by providing a through hole in the flat plate portion 51 of the circuit holder 50. Further, such a through hole may be further formed after the notch 53 is formed.

  In the above embodiment, the SMD type LED element packaged as the LED 22 is used. However, the present invention is not limited to this. For example, a COB (Chip On Board) structure LED module 20 configured by directly mounting a plurality of LEDs 22 (bare chips) on the substrate 21 using a bare chip as the LED 22 may be used. In this case, the plurality of bare chips are collectively sealed with the phosphor-containing resin.

  In the above embodiment, the LED module 20 is configured to emit white light by the blue LED chip and the yellow phosphor. However, the present invention is not limited to this. For example, in order to improve color rendering properties, a red phosphor or a green phosphor may be further mixed in addition to the yellow phosphor. Moreover, it is also possible to use a phosphor-containing resin containing a red phosphor and a green phosphor without using a yellow phosphor, and to emit white light by combining this with a blue LED chip. it can.

  Moreover, in said embodiment, you may use the LED chip which light-emits colors other than blue as an LED chip. For example, when an ultraviolet light emitting LED chip is used, a combination of phosphor particles that emit light in three primary colors (red, green, and blue) can be used as the phosphor particles. Furthermore, a wavelength conversion material other than the phosphor particles may be used. For example, the wavelength conversion material absorbs light of a certain wavelength such as a semiconductor, a metal complex, an organic dye, or a pigment, and has a wavelength different from the absorbed light. A material containing a substance that emits light may be used.

  In the above embodiment, the LED is exemplified as the light emitting element. However, the semiconductor light emitting element such as a semiconductor laser or the other solid light emitting element such as an EL element such as an organic EL (Electro Luminescence) or an inorganic EL is used. Also good.

  In addition, the present invention can be realized by various combinations conceived by those skilled in the art for each embodiment, or by arbitrarily combining the components and functions in each embodiment without departing from the spirit of the present invention. This form is also included in the present invention.

DESCRIPTION OF SYMBOLS 1 LED lamp 2 Illuminating device 3 Lighting fixture 4 Appliance main body 4a Socket 5 Lamp cover 10 Globe 11 Opening 20 LED module (light emitting module)
21 Substrate 22 LED
23 Electrode terminal 30 Support base 31, 51 Flat plate portion 31a, 81a First surface 31b, 81b Second surface 32, 52 Side wall portion 32a Small diameter portion 32b Large diameter portion 33a First through hole 33b Second through hole 40 Drive Circuit 41 Circuit board 41a, 61 Convex part 50 Circuit holder (holder)
52a Claw 53, 81c Notch 54 Circuit board holding part 54a, 56a Locking claw 55 Circuit board restricting part 56 Module board holding part 57 Module board restricting part 57a Flat part 57b Slit 58 Rib part 60 Housing 60a First opening Part 60b second opening 60c, 81 body part 62 locking part 70 base 80 heat sink 82 heat radiating fin part 82a inclined side

Claims (6)

A light emitting module;
A support base on which the light emitting module is mounted;
A driving circuit for causing the light emitting module to emit light;
A housing containing the drive circuit and having openings at both ends;
A holder provided on one opening side of the housing and holding the drive circuit;
A base provided on the other opening side of the casing and receiving power from the outside;
A heat sink that radiates heat generated during light emission of the light emitting module through the support,
The support base has a first surface that is a surface on which the light emitting module is placed, and a second surface that is a surface opposite to the first surface,
The heat sink includes a main body portion having a flat surface that is in contact with the second surface of the support base, and a heat radiating fin portion that is connected to the main body portion and extends in an internal space of the housing so as not to contact the housing And
A light source in which the internal space of the housing and the support base are spatially connected. The support base is provided to close the one opening of the housing,
The main body portion of the heat sink is disposed between the support base and the holder, and is disposed such that a gap connected to the internal space of the housing exists between the holder and the holder. The light source according to claim 1. The holder is formed with a rib portion protruding to the heat sink side,
The light source according to claim 2, wherein the heat sink has the main body portion pressed against the rib portion. The drive circuit has a circuit board disposed substantially parallel to an axis in a direction from the one opening to the other opening of the housing;
The light source according to any one of claims 1 to 3, wherein a part of a front side of the heat dissipating fin portion is inclined with respect to the plane of the main body portion. One main surface of the circuit board is a surface on which metal wiring of a predetermined shape is formed,
The light source according to claim 4, wherein a part of a front side of the heat radiating fin portion is inclined so that a width of the heat radiating fin portion decreases toward the one main surface. The light source according to claim 1, wherein the housing is made of resin.

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