JP2009170126A - Led light - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an LED light suppressing reductions in service life and brightness of an LED by constructing to further increase its heat radiating effect. <P>SOLUTION: The LED light 1 includes an LED module 40 with five LEDs 42 mounted on a mounting surface T of a wiring board 41, and a light body 10 with the wiring board 41 inserted. The light body 1 is formed by a first body part 11 in contact with the mounting surface T in an exposed state of the LEDs 42 from a through-hole 115 formed in an LED 42 disposed position and a second body part 12 in contact with a rear surface H opposite to the mounting surface T. The wiring board 41 is contained in a space S defined by fitting the first body part 11 and the second body part 12 together as a containing part. Peripheral edge parts 10a surrounding the wiring board 41 of the first body part 11 and the second body part 12 are in contact with each other to radiate heat transferred to the second body part 12 and then transferred to the first body part 11 from a flange part 113 exposed from a ceiling C. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an LED lamp that includes an LED module in which one or more LEDs are mounted on a mounting surface of a wiring board, and a lamp body that houses the wiring board.

  Lamps are being made into LEDs by taking advantage of low power consumption and long life from incandescent bulbs and fluorescent lamps. However, unlike incandescent bulbs and fluorescent lamps, LEDs are liable to be deteriorated and brightness to be lowered at high temperatures. Therefore, it is necessary to dissipate heat from the LED, which is a heat source, with a heat sink or the like to cool it. Patent Documents 1 and 2 describe LED lamps including such a heat sink.

The luminaire described in Patent Document 1 can be used as various illuminating lamps such as a ceiling lamp and an underground lamp, and is mainly formed of a substantially H-shaped column-shaped base made of aluminum and a base body. And an aluminum LED substrate housed in one recess of the substrate. In this luminaire, the LED substrate is pressed against the installation surface of the base by the head of the screw, and the engagement member is inserted between the corners and the protrusions of the LED substrate and pressed, so that the LED substrate is The close contact state with the installation surface is maintained, and an excellent heat dissipation effect can be exhibited.
In addition, the LED signal lamp described in Patent Document 2 has a substrate that holds the LED lamp and a plate thickness that is sufficient to conduct heat generated when the LED lamp is turned on, and the substrate passes through an insulating heat conductive sheet. The heat dissipating fins placed in this way and the resin pressure plate that doubles as a reflector are used. Is.
JP 2003-92022 A JP 2002-93206 A

  As the brightness of LEDs increases, the current consumption increases and the degree of heat generation of the LEDs also increases. The conventional LED lamps described in Patent Documents 1 and 2 suppress the temperature rise of the LED by transferring heat from the back side of the substrate on which the LED is mounted to the radiator, but this is still insufficient. I think that the. In that case, there is a concern about the problem of the lifetime of the LED and the problem of lowering the brightness.

  Then, this invention aims at providing the LED lamp which can suppress the fall of the lifetime of LED, and the fall of a brightness | luminance by setting it as the structure which can improve the heat dissipation effect further.

  The LED lamp of the present invention includes an LED module in which one or more LEDs are mounted on a mounting surface of a wiring board, and a lamp body that houses the wiring board, and the lamp body is provided at a position where the LEDs are arranged. A first main body portion that contacts the mounting surface in a state where the LED is viewed from the through-hole, and a second main body portion that contacts a back surface opposite to the mounting surface, and the wiring board includes: A space formed by combining the first main body portion and the second main body portion is stored as a storage portion, and the first main body portion and the second main body portion are in contact with peripheral portions surrounding the wiring board. It is characterized by.

  The LED lamp of the present invention has a sandwich structure in which the mounting surface of the wiring board is in contact with the first main body and the back surface of the wiring board is in contact with the second main body so that the lamp main body sandwiches the wiring board. . Therefore, the heat transmitted from the LED to the wiring board is transmitted from the mounting surface side to the first main body portion and from the back surface side to the second main body portion. And since the peripheral part surrounding a wiring board has contacted the 1st main-body part and the 2nd main-body part, it can thermally radiate in the whole 1st main-body part and 2nd main-body part. This is located behind the ceiling when the LED lamp of the present invention is installed as a ceiling lamp. Even if the heat of the LED is transferred to the second main body, a high heat dissipation effect cannot be expected behind the ceiling. By transferring the heat of the second body part from the peripheral part to the first body part, it is possible to dissipate heat from the portion of the first body part exposed in the living room. Therefore, the heat from the LED can be efficiently dissipated. That is, the LED lamp of the present invention has a structure that is not limited to the place of installation or the type of lamp. Further, since the LED lamp of the present invention has a sandwich structure in which the lamp body sandwiches the wiring board, the deformation (bending) of the wiring board due to heating can be suppressed. By preventing the decrease, it is possible to suppress a decrease in heat dissipation efficiency.

The wiring board is formed on the mounting surface so as to supply power to the LED and also transfer heat to the first main body portion, and the second main body formed in contact with the back surface. It is desirable that a heat transfer pattern for transferring heat to the part and a through-hole wiring for connecting the electrode pattern and the heat transfer pattern are provided.
The LED heats the electrode pattern formed on the mounting surface of the wiring board. The heat transmitted to the electrode pattern is transmitted to the first main body portion and to the heat transfer pattern on the back surface through the through-hole wiring. The heat transferred to the heat transfer pattern is transferred to the second main body. Therefore, the heat from the LED is transmitted by the respective patterns provided on the mounting surface and the back surface of the wiring board, so that the heat can be quickly transferred to the lamp body.

  It is desirable that an insulating heat transfer sheet or heat transfer paste is interposed between the wiring board, the first main body portion, and the second main body portion. By interposing an insulating heat transfer sheet or heat transfer paste, the adhesion between the mounting surface of the wiring board and the first main body portion or between the back surface and the second main body portion is increased, so that the heat transfer property can be improved. .

  In the present invention, the first main body portion and the second main body portion can dissipate heat in the entirety of the first main body portion and the second main body portion since the peripheral portions surrounding the wiring board are in contact with each other. Therefore, by adopting a structure that can further enhance the heat dissipation effect, it is possible to suppress a decrease in the lifetime of the LED and a decrease in luminance.

(Embodiment 1)
The LED lamp which concerns on Embodiment 1 of this invention is demonstrated based on drawing. FIG. 1 is a cross-sectional view of the LED lamp according to Embodiment 1 of the present invention installed on the ceiling. FIG. 2 is a partially enlarged view of the LED lamp 1 shown in FIG. FIG. 3 is an exploded perspective view of the LED lamp shown in FIG. FIG. 4 is a view of the LED lamp as seen from the direction of the lens portion.

  The LED lamp 1 shown in FIGS. 1 to 4 is a substantially columnar downlight provided on the ceiling C. The LED lamp 1 includes a lamp body 10, a lens unit 20, a power feeding unit 30, and an LED module 40.

  The lamp body 10 includes a first body portion 11 positioned at the lower portion, a second body portion 12 positioned at the upper portion of the first body portion 11, and an arm portion 13. The 1st main-body part 11 and the 2nd main-body part 12 are formed with aluminum with high heat conductivity and heat dissipation.

  The first main body portion 11 is formed in a mortar shape facing downward. On the inner peripheral wall surface 111 of the first main body 11, an inclined surface 112 whose diameter gradually increases in the light emitting direction is formed. A flange portion 113 exposed from the ceiling C is formed at the tip portion 11 a of the first main body portion 11. A through hole 115 is provided in a position corresponding to the LED mounted on the LED module 40 on the upper surface 114 serving as the base 11 b of the first main body 11. In the first embodiment, since five LEDs are provided, the five through holes 115 are provided at positions corresponding to the apexes so as to form a regular pentagon. The first main body portion 11 is attached to the second main body portion 12 from the inside of the second main body portion 12 with a screw that penetrates the LED module 40.

The second main body 12 has a recess 121 formed in the lower part. The concave portion 121 is a space S that is closed by the upper surface 114 of the first main body portion 11 serving as a lid that closes the opening of the concave portion 121 when the first main body portion 11 is joined. The LED module 40 is stored with the space S as a storage unit. A lid 122 that closes the opening is provided at the upper end of the second main body 12 that is open. The terminal block 31 of the power feeding unit 30 is disposed on the upper surface of the lid portion 122. In addition, the power supply unit 32 of the power supply unit 30 is housed in a space formed by closing the upper end opening of the second main body unit 12 with the lid unit 122. The lid portion 122 is provided with one wiring hole 122a for wiring an AC power supply line connecting the power source portion 32 and the terminal block 31 together with the rubber bush 122b.
The arm portions 13 are substantially V-shaped leaf springs provided at four locations on the peripheral surface of the first main body portion 11 in order to fix the LED lamp 1 to the ceiling C.

  The lens part 20 is provided with a disk part 21 serving as a lid for the opening part of the first main body part 11 and a concave part 22a for accommodating the LED at the top of the head part. The lens part 20 gradually expands in the direction in which light travels. Between the light guide part 22 and the light guide part 22 provided in the center of the disk part 21 and the mounting part 23 for fixing the lens part 20 to the first main body part 11 with screws. The leg portion 24 is provided and regulates the distance between the disc portion 21 and the upper surface 114 of the first main body portion 11.

  The power supply unit 30 includes a terminal block 31 to which an AC power line is connected, and a power supply unit 32 that supplies a constant current to the LED. The power supply unit 32 is a power supply circuit in which electronic components such as FETs, capacitors, resistors, and coils are mounted on the wiring board 321, and has a function of rectifying a 100 V AC voltage and supplying a DC constant current of about 300 mA to the LED. ing. Note that the electronic components mounted on the wiring board 321 shown in FIG. 1 are not shown in FIG.

  The LED module 40 is obtained by mounting five LEDs 42 on a wiring board 41. The LED lamp 1 is an illumination in which five LEDs 42 are mounted, but can be appropriately increased or decreased depending on the brightness of the LED or the size of the lamp. Here, the wiring board 41 will be described in detail with reference to FIG. 5A and 5B are diagrams showing the wiring board of the LED module shown in FIG. 1, wherein FIG. 5A is a view seen from the mounting surface side, and FIG. 5B is a view seen from the back side opposite to the mounting surface.

  The wiring substrate 41 is a printed circuit board in which a wiring pattern made of a metal thin film is formed on an insulating substrate 411 such as glass epoxy resin or paper epoxy resin. The wiring pattern can be formed by forming a copper foil layer on the entire surface of the insulating substrate 411 and then removing the copper foil layer into a predetermined pattern by etching. A resist film (not shown) for preventing a short circuit is provided on the wiring pattern.

  As the wiring pattern, a power supply pattern 412 formed on the mounting surface T on which the LEDs 42 are mounted and a heat transfer pattern 413 formed on the back surface H opposite to the mounting surface T are formed.

  Six power supply patterns 412 are formed between the LEDs 42 in order to connect the LEDs 42 in series. Each power supply pattern 412 is formed with an LED connection portion 41x for connecting to the cathode terminal and the anode terminal of the LED 42 by removing the resist film in a rectangular shape. These power supply patterns 412 are formed in a substantially triangular shape or a deformed square shape.

Six heat transfer patterns 413 are formed corresponding to the power supply patterns 412 on the mounting surface T. A resist film (not shown) is also provided on the heat transfer pattern 413. The heat transfer pattern 413 is formed in a substantially triangular shape or a deformed square shape. The heat transfer pattern 413 and the power supply pattern 412 are connected by a through-hole wiring 414 that penetrates the insulating substrate 411. The through-hole wiring 414 is provided on almost the entire surface of the heat transfer pattern 413 and the power supply pattern 412.
Among the heat transfer patterns 413, the power connection portion 41y is a resist film in two adjacent heat transfer patterns 413 located on the back side of the power supply pattern 412 on one end side where the LEDs 42 are connected in series and the power supply pattern 412 on the other end side. It is formed by removing in a rectangular shape. That is, the two heat transfer patterns 413 also serve as a power supply pattern for supplying power to the LED 42.

  Since the power supply patterns 412 that connect the LEDs 42 in series are arranged in a ring shape, the two heat transfer patterns 413 that also serve as the power supply patterns formed on the back surface of the wiring board 41 can be arranged adjacent to each other. Therefore, the recess 121 of the second main body portion 12 shown in FIG. 3 is provided with only one through hole 121a for inserting the DC power supply line wired to the power supply unit 30. Therefore, a wide contact area between the back surface H of the wiring board 41 and the recess 121 can be ensured.

  This LED module 40 is a sheet-like heat transfer member having viscoelasticity for improving the adhesion between the first main body portion 11 and the second main body portion 12 on both the mounting surface T and the rear surface H of the wiring board 41. 43 (see FIG. 1 and FIG. 2) is provided. The heat transfer member 43 may be a paste-like body in addition to the sheet-like body.

  The use state of the LED lamp 1 according to Embodiment 1 of the present invention configured as described above will be described with reference to the drawings.

  When a voltage from the power feeding unit 30 is applied to the wiring board 41, a current flows through each LED 42 connected in series. This current causes the LED 42 to emit light, but not all electrical energy is converted to light, and part of it becomes heat. The heat of the LED 42 is transmitted to the power supply pattern 412 on the mounting surface T side through the cathode terminal and the anode terminal. The heat transferred to the power supply pattern 412 is transferred via the heat transfer member 43 to the upper surface 114 of the first main body portion 11 in contact with the mounting surface T. Since the power supply pattern 412 is formed on almost the entire mounting surface T of the insulating substrate 411, heat can be efficiently transmitted to the first main body 11.

  Further, the heat transferred to the power supply pattern 412 is transferred from the power supply pattern 412 to the heat transfer pattern 413 through the through-hole wiring 414. The heat from the power supply pattern 412 is also transmitted to the rear surface H side through the insulating substrate 411. However, the through-hole wiring 414 formed of a metal having a higher thermal conductivity than the insulating substrate formed of resin is used. Higher heat transfer. In the first embodiment, since the through-hole wiring 414 is provided on almost the entire surface of the power supply pattern 412, high heat conductivity of the wiring board 41 can be ensured.

  Then, the heat transmitted to the back surface H side of the wiring board 41 is transmitted to the concave portion 121 of the second main body 12 through the heat transfer member 43. Then, the heat transmitted to the concave portion 121 spreads to the cylindrical portion 123 in the second main body portion 12 and is transmitted from the peripheral wall portion 121b of the concave portion 121 serving as the peripheral edge portion 10a surrounding the wiring substrate 41 to the first main body portion 11.

  Although the cylindrical portion 123 has higher heat dissipation than the first main body portion 11, the second main body portion 12 is located in the ceiling C and is covered with the heat insulating material D, so that the lamp main body 10 and the heat insulating material D are covered. When the temperature of the space between them rises, the degree of heat radiation from the second main body portion 12 gradually decreases. Therefore, a high heat dissipation effect from the second main body portion 12 cannot be expected.

  In the LED lamp 1 according to the first embodiment, the second main body 12 has the concave portion 121 connected to the upper surface 114 of the first main body 11, so the heat transmitted from the LED module 40 is positively positive. Heat can be transferred to the part 11. By doing so, it is possible to dissipate heat from the flange portion 113 of the first main body portion 11 exposed from the ceiling C to the living room, so that a high heat dissipation effect can be obtained. Accordingly, it is possible to suppress a decrease in the life of the LED 42 and a decrease in luminance.

Moreover, since the LED lamp 1 is formed in a sandwich structure in which the wiring board 41 of the LED module 40 is sandwiched between the first main body part 11 and the second main body part 12, the wiring board 41, the first main body part 11 and the second main body part 11 are provided. A decrease in adhesiveness with the main body 12 can be prevented. Therefore, high heat dissipation can be maintained.
In the first embodiment, the power supply pattern 412 of the wiring board 41 is arranged to have a substantially circular shape in accordance with the insulating substrate 411. For example, the insulating substrate is rectangular or polygonal. It may be.

(Embodiment 2)
The LED lamp which concerns on Embodiment 2 of this invention is demonstrated based on FIG. 6 and FIG. FIG. 6 is a sectional view showing an LED lamp according to Embodiment 2 of the present invention. 7A and 7B are diagrams showing the LED lamp shown in FIG. 6, in which FIG. 7A is a view seen from the lens side, FIG. 7B is a view seen from the upper end side of the lamp body, and FIG. . 6 and 7, the same components as those in FIGS. 1 to 5 are denoted by the same reference numerals and description thereof is omitted.

In the LED lamp 1x according to Embodiment 2 of the present invention, the second main body portion 12x of the lamp main body 10x is not cylindrical, has a heat radiation fin portion 12xb, and the power feeding portion is located outside the lamp main body. It is characterized by that.
The LED lamp 1x includes a lamp body 10x, a lens unit 20, an LED module 40, and an arm portion 13x that protrudes in one direction and the other direction from the lamp body 10x for mounting in the ceiling. The lamp main body 10x includes a first main body portion 11x located at the lower portion and a second main body portion 12x located at the upper portion of the first main body portion 11x, and is made of aluminum.

  The first main body portion 11x is formed in a mortar shape facing downward. A flange portion 113 exposed from the ceiling is formed at the tip portion 11xa of the first main body portion 11x. A through hole 115 is provided at a position corresponding to the LED mounted on the LED module 40 on the upper surface 114 serving as the base 11xb.

  The 2nd main-body part 12x is provided with the base part 12xa in which the recessed part 121x was formed, and the thermal radiation fin part 12xb standingly arranged by the base part 12xa. In order to make the recess 121x a space for the stepped part 121xa for positioning the base portion 11xb by fitting the base portion 11xb of the first main body portion 11x and the first main body portion 11x as a housing portion for the wiring board 41, Further, a substrate recess 121xb that is dug down by one step is provided.

  By housing the wiring board 41 of the LED module 40 in the board recess 121xb, the LED lamp 1x has a sandwich structure in which the wiring board 41 is sandwiched between the first main body portion 11x and the second main body portion 12x.

  Thus, in the LED lamp 1x according to the second embodiment, the peripheral portions 10xa surrounding the wiring substrate 41 are connected by fitting the first main body portion 11x into the concave portion 121x of the second main body portion 12x. The heat from the LED 42 transmitted from the rear surface H side of the 41 to the second main body 12x can be transmitted to the first main body 11x. In addition, since the second body portion 12x is provided with the radiation fin portion 12xb, the heat transmitted to the base portion 12xa of the second body portion 12x is transmitted to the first body portion 11x, and the radiation fin portion 12xb. Can dissipate heat.

  As mentioned above, although embodiment of this invention has been described, this invention is not limited to the said embodiment. In the present embodiment, the space formed by forming the recess in the second body part and combining the first body part is used as the wiring board storage part. However, the recess may be provided in the first body part.

  The present invention is suitable for all LED lamps using LEDs as light sources, and is particularly suitable for downlights provided on the ceiling.

It is sectional drawing of the state installed in the ceiling of the LED lamp which concerns on Embodiment 1 of this invention. It is the elements on larger scale of the LED lamp 1 shown in FIG. It is a disassembled perspective view of the LED lamp shown in FIG. It is the figure which looked at the LED lamp from the direction of the lens part. It is a figure which shows the wiring board of the LED module shown in FIG. 1, (A) is the figure seen from the mounting surface side, (B) is the figure seen from the back side opposite to a mounting surface. It is sectional drawing which shows the LED lamp which concerns on Embodiment 2 of this invention. It is a figure which shows the LED lamp shown in FIG. 6, (A) is the figure seen from the lens part side, (B) is the figure seen from the upper end side of the lamp main body, (C) is a side view.

Explanation of symbols

1,1x LED lamp 10, 10x Lamp body 10a, 10xa Peripheral part 11, 11x First body part 111 Inner peripheral wall surface 112 Inclined surface 113 Flange part 114 Upper surface 115 Through hole 11a, 11xa Tip part 11b, 11xb Base part 12, 12x First 2 Main body part 121, 121x Concave part 121xa Step part 121xb Substrate concave part 121a Through hole 121b Peripheral wall part 122 Cover part 122a Wiring hole 122b Rubber bush 123 Cylindrical part 12xa Base part 12xb Radiation fin part 13, 13x Arm part 20 Lens part 21 Disk Part 22 light guide part 22a recessed part 23 attachment part 24 leg part 30 power supply part 31 terminal block 32 power supply part 321 wiring board 40 LED module 41 wiring board 41x LED connection part 41y power supply connection part 411 insulating substrate 412 power supply pattern 413 heat transfer pattern 414 through-hole wiring 42 LED
43 Heat transfer member C Ceiling D Heat insulation material S Space T Mounting surface H Rear surface

Claims (3)

An LED module having one or more LEDs mounted on the mounting surface of the wiring board; and a lamp body that houses the wiring board;
The lamp body is in contact with a first body portion that is in contact with the mounting surface in a state where the LED is viewed from a through-hole provided at a position where the LED is disposed, and a back surface that is opposite to the mounting surface. A second body part;
The wiring board is housed as a housing portion in a space formed by combining the first body portion and the second body portion,
The LED lamp, wherein the first main body portion and the second main body portion are in contact with each other around the wiring board.   The wiring board is formed on the mounting surface so as to supply power to the LED and also transfer heat to the first main body portion, and the second main body formed in contact with the back surface. The LED lamp according to claim 1, further comprising: a heat transfer pattern that transfers heat to the portion; and a through-hole wiring that connects the electrode pattern and the heat transfer pattern.   The LED lamp according to claim 1 or 2, wherein the wiring board, the first main body portion, and the second main body portion interpose an insulating heat transfer sheet or heat transfer paste.

Images