JP2014086249A - Led lighting device - Google Patents

Led lighting device Download PDF

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Publication number
JP2014086249A
JP2014086249A JP2012233916A JP2012233916A JP2014086249A JP 2014086249 A JP2014086249 A JP 2014086249A JP 2012233916 A JP2012233916 A JP 2012233916A JP 2012233916 A JP2012233916 A JP 2012233916A JP 2014086249 A JP2014086249 A JP 2014086249A
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led
power supply
lighting device
supply box
circuit board
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JP6061220B2 (en
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Jun Sasajima
潤 笹嶋
Naoki Ashigaya
直樹 芦萱
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Iris Ohyama Inc
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Iris Ohyama Inc
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Abstract

PROBLEM TO BE SOLVED: To provide an outdoor lamp which prevents heat generated by LED elements from being transmitted to electronic components forming a lighting circuit to thereby prevent deterioration of the electronic components and efficiently radiates heat generated by the LED elements to outside the lighting device.SOLUTION: In an LED lighting device 100, an LED lamp body 10 housing an LED substrate 2 on which LED elements 1 are mounted and a lighting circuit board 5 is attached to target object by heat conductive attachment means 20. In the LED lighting device 100, one end side of the attachment means 20 is inserted into the LED lamp body 10. The LED substrate 2 is joined to the one end side of the attachment means 20 so as to conduct heat, and the lighting circuit board 5 is disposed spaced apart from the attachment means 20.

Description

本発明は、屋外の支柱等に取り付けられるLED照明装置に関し、特に放熱性に優れたLED照明装置に関する。   The present invention relates to an LED lighting device attached to an outdoor column or the like, and more particularly to an LED lighting device having excellent heat dissipation.

近年、環境意識の高まりから、省電力化に優れたLED素子を光源に使用したLED照明装置が盛んに用いられるようになってきており、屋外の支柱等に取り付けられる道路灯、駐車場灯、防犯灯などにも使用されるようになってきている。一方、このような屋外灯には、高輝度のLED素子が使用されるため、点灯時LED素子が高温になり、明るさ低下や、使用可能時間が短くなる等の問題が生じるため、LED素子の放熱を改善した照明器具が開発されている。 In recent years, with increasing environmental awareness, LED lighting devices using LED elements with excellent power savings as light sources have been actively used, such as road lights, parking lot lights, It is also used for security lights. On the other hand, such outdoor lamps use high-luminance LED elements, so that when the LED elements are turned on, the LED elements become hot, causing problems such as reduced brightness and shorter usable time. Lighting fixtures with improved heat dissipation have been developed.

特許文献1に記載されている道路用照明器具では、金属製の取付板と、前記取付板の一端部側に配置されるLEDユニットと、前記取付板の他端部側に配置される電源ユニットと、本体外側から内側に臨むように取り付けられる金属製のアームとを備え、前記取付板は、前記アームに固定されている。
また特許文献2に記載されているLED照明灯では、複数個のLED素子を有するLED光源体と、前記LED光源体が取り付けられた放熱体とを備えており、前記放熱体の全長が蛍光灯規格に対応して設定されており、前記放熱体の長手方向両端部に、既存の蛍光灯器具のソケット部に係脱可能な端子状係合部を有している。
In the road lighting apparatus described in Patent Document 1, a metal mounting plate, an LED unit disposed on one end side of the mounting plate, and a power supply unit disposed on the other end side of the mounting plate And a metal arm attached so as to face the inside from the outside of the main body, and the attachment plate is fixed to the arm.
Further, the LED illumination lamp described in Patent Document 2 includes an LED light source body having a plurality of LED elements and a heat radiating body to which the LED light source body is attached, and the total length of the heat radiating body is a fluorescent lamp. It is set in accordance with the standard, and has a terminal-like engagement portion that can be engaged with and disengaged from a socket portion of an existing fluorescent lamp fixture at both longitudinal ends of the radiator.

特開平2011−249110JP 2011-249110 A 特開平2012−9316JP 2012-9316

しかしながら、特許文献1に記載されている道路灯では、金属製の取付板の片面にLEDユニットが取り付けられ、その裏面に電源ユニットが取り付けられるため、LEDユニットから、電源ユニットに熱が伝導し、電源ユニットにある電子部品を劣化させる虞がある。
特許文献2に記載されているLED照明灯においても、同公報の段落0024や、図1から図4に示されているように、LED光源体が取り付けられた放熱体の裏側に点灯回路が取り付けられているため、LED素子からの熱が点灯回路に伝熱しやすく、電子部品の劣化を招く虞がある。
However, in the road light described in Patent Document 1, since the LED unit is attached to one side of the metal mounting plate and the power unit is attached to the back side, heat is conducted from the LED unit to the power unit, There is a risk of deteriorating electronic components in the power supply unit.
Also in the LED illuminating lamp described in Patent Document 2, the lighting circuit is attached to the back side of the heat radiating body to which the LED light source body is attached as shown in paragraph 0024 of FIG. 1 and FIG. 1 to FIG. Therefore, the heat from the LED element is likely to be transferred to the lighting circuit, which may cause deterioration of the electronic component.

本発明は、以上のような課題を解決するため鋭意検討した結果なされたものであり、LED素子で発生した熱を、点灯回路を構成する電子部品に伝熱させず、該電子部品の劣化を防ぎ、なおかつLED素子で発生した熱を、照明装置の外部に効率的に放熱させることによって、明るさが低下せず、長寿命なLED照明装置を提供するものである。 The present invention has been made as a result of intensive studies to solve the above-described problems. The heat generated in the LED elements is not transferred to the electronic components constituting the lighting circuit, and the electronic components are deteriorated. The present invention provides a long-life LED illuminating device that prevents the brightness from decreasing and efficiently dissipates heat generated in the LED element to the outside of the illuminating device.

請求項1に記載の発明にあたっては、LED素子を実装したLED基板と、点灯回路基板と、を収容したLEDランプ本体を、熱伝導性の取付手段で被取付体に取り付けるLED照明装置において、前記LEDランプ本体の内部に、前記取付手段の一端側が挿入され、
前記取付手段の一端側に、前記LED基板が熱伝導可能に接合され、前記点灯回路基板が、前記取付手段から離して配置されていることを特徴とするものである。
In the invention according to claim 1, in the LED lighting device in which the LED lamp body in which the LED board on which the LED element is mounted and the lighting circuit board are accommodated is attached to the attached body by means of thermally conductive attachment. One end side of the attachment means is inserted inside the LED lamp body,
The LED board is joined to one end side of the attaching means so as to be capable of conducting heat, and the lighting circuit board is arranged apart from the attaching means.

請求項2に記載の発明にあたっては、前記LEDランプ本体の外殻は樹脂材料で形成されており、前記点灯回路基板は、樹脂製の電源ボックスに収容され、前記電源ボックスは、前記LEDランプ本体の外郭に取り付けられており、かつ前記電源ボックスと前記取付手段との間には、空間部が形成されていることを特徴とするものである。   In the invention according to claim 2, the outer shell of the LED lamp body is formed of a resin material, the lighting circuit board is accommodated in a resin power box, and the power box is connected to the LED lamp body. And a space portion is formed between the power supply box and the attachment means.

請求項3に記載の発明にあたっては、前記点灯回路基板と、前記電源ボックスの内壁面との間に空間部が形成されていることを特徴とするものである。 According to a third aspect of the present invention, a space is formed between the lighting circuit board and an inner wall surface of the power supply box.

請求項4に記載の発明にあたっては、前記電源ボックスに、通風用の貫通孔が形成されていることを特徴とするものである。 According to a fourth aspect of the present invention, the power supply box has a through hole for ventilation.

請求項1に記載の発明によれば、LED素子で発生した熱は、熱伝導性の取付手段に伝導し、LEDランプ本体の外に放熱され、かつ該点灯回路基板と取付手段の間には断熱するための空間があり、電子部品の熱劣化が防止されるので、明るさが低下せず、長寿命なLED照明装置を提供できる。 According to the first aspect of the present invention, the heat generated in the LED element is conducted to the thermally conductive mounting means, radiated to the outside of the LED lamp body, and between the lighting circuit board and the mounting means. Since there is a space for heat insulation and thermal deterioration of the electronic components is prevented, the LED illumination device with a long life can be provided without reducing the brightness.

請求項2に記載の発明によれば、前記LEDランプ本体の樹脂製外殻に樹脂製電源ボックスが取り付けられており、なおかつ前記電源ボックスと前記取付手段との間には、断熱性の空間があるので、LEDで発生した熱が更に点灯回路基板には伝導しにくくなっており、電子部品の熱劣化が抑制される。   According to the invention described in claim 2, a resin power box is attached to the resin outer shell of the LED lamp body, and a heat insulating space is provided between the power box and the attachment means. As a result, the heat generated by the LEDs is more difficult to conduct to the lighting circuit board, and thermal degradation of the electronic components is suppressed.

請求項3の発明によれば、点灯回路基板で発生した熱が、対流と循環によって周囲の空間に放熱され、電気部品の温度上昇が抑制される。   According to invention of Claim 3, the heat which generate | occur | produced in the lighting circuit board is radiated by the surrounding space by a convection and a circulation, and the temperature rise of an electrical component is suppressed.

請求項4の発明によれば、電子部品で発生した熱で暖められた空気が上昇し、電源ボックスの上面に形成された貫通孔を通って、前記取付手段や、前記LEDランプ本体の外殻に達し放熱され、冷却された空気が下降し、電源ボックスの下面に形成された貫通孔を通って、該電源ボックスに流入し電子部品が冷却されるので、更に電子部品の温度上昇が抑制される。   According to the invention of claim 4, the air heated by the heat generated in the electronic component rises and passes through the through-hole formed in the upper surface of the power supply box, and the mounting means and the outer shell of the LED lamp body , The cooled air descends, passes through a through-hole formed in the lower surface of the power supply box, flows into the power supply box, and cools the electronic component, further suppressing the temperature rise of the electronic component. The

本実施形態に係わるLED照明装置と被取り付け手段の外観図External view of LED lighting device and attached means according to this embodiment 本実施形態に係わるLED照明装置の外観斜視図External perspective view of LED lighting device according to the present embodiment 本実施形態に係わるLEDランプ本体の背面図Rear view of the LED lamp body according to this embodiment 本実施形態に係わるLED照明装置のX−X線断面図XX sectional drawing of the LED lighting apparatus concerning this embodiment 本実施形態に係わる支持手段近傍のX−X線拡大断面斜視図XX expanded sectional perspective view of the vicinity of the support means according to the present embodiment 本実施形態に係わる電源ボックス近傍のY−Y線、Z−Z線拡大断面斜視図YY line and ZZ line enlarged sectional perspective view near the power supply box according to the present embodiment 本実施形態に係わるLED照明装置の分解斜視図The exploded perspective view of the LED lighting device concerning this embodiment

以下に本発明の好適な実施形態について、図面を参照しながら説明する。なお本実施形態は一例であり、これに限定されるものではない。図1は、本実施形態のLED照明装置100が被取付手段である支柱200に取り付けられた外観図である。図2は、本実施形態に係わるLED照明装置100の外観斜視図である。図3は、本実施形態に係わるLEDランプ本体10の背面図である。図4は、本実施形態に係わるLED照明装置100のX−X線断面図である。図5は、本実施形態に係わる支持手段近傍のX−X線拡大断面斜視図である。図6は、本実施形態に係わる電源ボックス近傍のY−Y線、Z−Z線拡大断面斜視図である。図7は、本実施形態に係わるLED照明装置100の分解斜視図である。   Preferred embodiments of the present invention will be described below with reference to the drawings. This embodiment is an example, and the present invention is not limited to this. FIG. 1 is an external view in which the LED lighting device 100 according to the present embodiment is attached to a column 200 that is an attached means. FIG. 2 is an external perspective view of the LED lighting device 100 according to the present embodiment. FIG. 3 is a rear view of the LED lamp body 10 according to the present embodiment. FIG. 4 is a sectional view taken along line XX of the LED lighting device 100 according to the present embodiment. FIG. 5 is an enlarged cross-sectional perspective view along the line XX in the vicinity of the support means according to this embodiment. FIG. 6 is an enlarged cross-sectional perspective view of the YY line and ZZ line near the power supply box according to the present embodiment. FIG. 7 is an exploded perspective view of the LED lighting device 100 according to the present embodiment.

本実施形態に係わるLED照明装置100は、被取付手段である屋外に設けられた支柱200に取り付けて使用される防犯灯であり、LEDランプ本体10と、該LEDランプ本体10を、支柱200へ取り付けるための取付手段であるアーム20とを備えている。なお被取付体は、支柱に限らず壁面、枠体等であってもよい。   The LED lighting device 100 according to the present embodiment is a security light that is used by being attached to a support column 200 provided outdoors as an attached means. The LED lamp body 10 and the LED lamp body 10 are connected to the support column 200. And an arm 20 as attachment means for attachment. In addition, a to-be-attached body may be not only a support | pillar but a wall surface, a frame, etc.

LEDランプ本体10の外郭は、下面開口の筐体11と、該下面開口を覆う透光性カバー12とから構成されている。
LEDランプ本体10の内部には、複数のLED素子1を実装したLED基板2と、LED基板2を載置する支持板3と、電子部品4が実装された点灯回路基板5を内蔵した電源ボックス6とが、概略収容されている。
The outer periphery of the LED lamp main body 10 includes a housing 11 having a lower surface opening and a translucent cover 12 that covers the lower surface opening.
Inside the LED lamp main body 10 is a power supply box containing an LED substrate 2 on which a plurality of LED elements 1 are mounted, a support plate 3 on which the LED substrate 2 is mounted, and a lighting circuit substrate 5 on which electronic components 4 are mounted. 6 is generally accommodated.

アーム20は鋼板を使用して、該アーム20の断面が、アーム下面21と2つのアーム側面22、23とからなるコの字形状で、被取付手段にヘの字状に屈曲するように成形されている。図1に示すように、アーム20の一端側は、該アーム20の開口部が上側を向くように、LEDランプ本体10挿入されて固定され、他端側は、簡易取付金具210を使用して支柱200に取り付けられる。   The arm 20 is made of a steel plate, and the cross section of the arm 20 is formed in a U shape including an arm lower surface 21 and two arm side surfaces 22 and 23, and is bent so as to be bent in a U shape on the mounting means. Has been. As shown in FIG. 1, the LED lamp body 10 is inserted and fixed at one end side of the arm 20 so that the opening of the arm 20 faces upward, and a simple mounting bracket 210 is used at the other end side. Attached to the column 200.

筐体11は、ポリブチレンテレフタレート樹脂を用いて、細長い船形に成形されている。この筐体11には、支柱200に取り付けた時に、被照射面となる路面と対向する側に、略直方体形状の枠体で囲われた開口面が形成されている。また図3に示すように、支柱200に対向する筐体11の背面側の外殻には、アーム20の断面形状に対応した上側にコの字が向いたコ字形の貫通スリット13(図3の斜線部分)が備えられている。
アーム20は、貫通スリット13に、アーム20の先端部が挿入されて、LEDランプ本体10に固定される。本実施形態では、アーム20は、筐体11の長手方向の半分程度まで挿入されているが、全長に渡るように挿入されていてもよい。
The casing 11 is formed into a long and narrow ship shape using polybutylene terephthalate resin. The housing 11 is formed with an opening surface surrounded by a substantially rectangular parallelepiped frame on the side facing the road surface that is the irradiated surface when attached to the support column 200. Further, as shown in FIG. 3, the outer shell on the back side of the casing 11 facing the support column 200 has a U-shaped through slit 13 (FIG. 3) with a U-shape facing upward corresponding to the cross-sectional shape of the arm 20. The shaded portion of FIG.
The arm 20 is fixed to the LED lamp body 10 by inserting the tip of the arm 20 into the through slit 13. In the present embodiment, the arm 20 is inserted up to about half of the longitudinal direction of the housing 11, but may be inserted over the entire length.

透光性カバー12は、ポリカーボネート樹脂を使用して船形に成形され、LED基板2を覆うように、筐体11に取り付けられている。 The translucent cover 12 is formed into a ship shape using a polycarbonate resin, and is attached to the housing 11 so as to cover the LED substrate 2.

LED素子1としては公知の種々のLEDを用いることができる。本実施形態では、照明用の白色光を発光する高輝度タイプのLED素子を用いている。またチップオンボード型のLEDモジュールを使用してもよい。 As the LED element 1, various known LEDs can be used. In this embodiment, a high-luminance type LED element that emits white light for illumination is used. A chip-on-board type LED module may be used.

LED基板2は、長尺の平板で公知のガラスエポキシ基板、金属基板、セラミックス基板等のプリント基板が用いられる。本実施形態では、電気絶縁樹脂で被覆された金属基板からなるプリント基板が用いられ、片面にLED素子1が実装されている。更に各LED素子1を覆うように、LED基板2上に、所望の配光が得られるように複数のレンズ7が配置され、レンズ固定部材8で固定されている。 The LED substrate 2 is a long flat plate and a known printed circuit board such as a glass epoxy substrate, a metal substrate, or a ceramic substrate is used. In the present embodiment, a printed circuit board made of a metal substrate coated with an electrically insulating resin is used, and the LED element 1 is mounted on one side. Further, a plurality of lenses 7 are arranged on the LED substrate 2 so as to obtain a desired light distribution so as to cover each LED element 1 and are fixed by a lens fixing member 8.

支持板3は、長尺形状のアルミニウム製の平板が使用され、図7に示すように、LED基板載置面31と、該LED基板載置面の3辺から透光性カバー側に延出した3面32とからなる下方開口の箱体として成形されている。LED基板載置面31にLED基板2が接合され、図5に示したように該支持板3の短辺側の一端が、アーム下面21の先端部に接合され、図示していないネジで固定されている。
LED素子1で発生した熱は、筐体11が樹脂製で熱伝導性が小さいので、主に高熱伝導性の支持板3を通って、同様に高熱伝導性のアーム20に伝導し、LEDランプ本体10の外に放熱される。また透光性カバー12側に延出した3面32によって、支持板3の放熱面積が増加しており、LED素子1の放熱性が増している。
The support plate 3 is a long aluminum flat plate, and as shown in FIG. 7, extends from the LED substrate placement surface 31 and the three sides of the LED substrate placement surface to the translucent cover side. It is formed as a box having a lower opening made up of three surfaces 32. The LED substrate 2 is bonded to the LED substrate mounting surface 31, and one end on the short side of the support plate 3 is bonded to the tip of the arm lower surface 21 as shown in FIG. Has been.
Since the housing 11 is made of resin and has low thermal conductivity, the heat generated in the LED element 1 is conducted mainly to the high thermal conductivity arm 20 through the high thermal conductivity support plate 3 and the LED lamp. Heat is radiated outside the main body 10. In addition, the heat radiation area of the support plate 3 is increased by the three surfaces 32 extending toward the translucent cover 12, and the heat radiation performance of the LED element 1 is increased.

点灯回路基板5は、平板状のプリント基板であり、LED基板2と平行になるように、電源ボックス6に収納されている。
電源ボックス6は略直方体のポリブチレンテレフタレート製のボックスで、点灯回路基板5が載置される電源ボックス本体61と、電源ボックス蓋体62とから構成されている。該電源ボックス6は、図5に示すように、アーム下面21と、透光性カバー12との間で、支柱200に近い側に配置されている。すなわち、支柱200に近い側の筐体11の長手方向3分の1程度の部分に、電源ボックス6が配置され、残りの3分の2程度の部分に支持板3が配置されている。なお電源ボックス本体61は、筐体11の上面内壁から起立された電源ボックス固定ボス14に設けられた孔に、図示していないネジで固定されている。
The lighting circuit board 5 is a flat printed board, and is housed in the power supply box 6 so as to be parallel to the LED board 2.
The power supply box 6 is a substantially rectangular polybutylene terephthalate box, and includes a power supply box body 61 on which the lighting circuit board 5 is placed and a power supply box lid 62. As shown in FIG. 5, the power supply box 6 is disposed between the arm lower surface 21 and the translucent cover 12 on the side close to the support column 200. That is, the power supply box 6 is arranged in a portion of about 1/3 in the longitudinal direction of the casing 11 on the side close to the support column 200, and the support plate 3 is arranged in the remaining about 2/3. The power supply box body 61 is fixed to a hole provided in the power supply box fixing boss 14 erected from the upper inner wall of the housing 11 with a screw (not shown).

図6に示すように、電源ボックス固定ボス14の軸長と、アーム20の先端側が挿入されるアーム先端挟持部15との厚みとによって、アーム20と、電源ボックス6との間には、第1の空間部Aが形成されており、電源ボックス6は、アーム20に直接接触しないようになっている。
なお、電源ボックス6の位置は、アーム下面21と、筐体11の上面内壁との間に位置していてもよく、また点灯回路基板5と電源ボックス6とが逆に配置されていてもよい。その場合も電源ボックス6は、アーム20に接触しないように固定される。
As shown in FIG. 6, there is a difference between the arm 20 and the power supply box 6 between the arm 20 and the power supply box 6 depending on the axial length of the power supply box fixing boss 14 and the thickness of the arm front end clamping portion 15 into which the front end side of the arm 20 is inserted. 1 space part A is formed, and the power supply box 6 does not contact the arm 20 directly.
The position of the power supply box 6 may be located between the arm lower surface 21 and the inner wall of the upper surface of the housing 11, and the lighting circuit board 5 and the power supply box 6 may be disposed in reverse. . Also in this case, the power supply box 6 is fixed so as not to contact the arm 20.

また、電源ボックス本体61の上面内壁から点灯回路基板支持突起63が4隅に形成されており(図6、図7に一部が示されている)、点灯回路基板4と、電源ボックス本体61との間に第2の空間Bが形成されている。
これらの第1の空間部Aと、第2の空間部Bと、樹脂製の電源ボックス6と、該電源ボックス6が樹脂製筐体11に固定されていることによって、LED素子1で発生した熱が、点灯回路基板5に実装された電子部品4に伝導されず、電子部品4の温度上昇が抑制されている。また電子部品4は、空間部A、空間部B、及び電源ボックス6内の空間に放熱されるので、温度上昇が抑えられている。
Further, lighting circuit board support protrusions 63 are formed at four corners from the inner wall of the upper surface of the power supply box body 61 (parts are shown in FIGS. 6 and 7), and the lighting circuit board 4 and the power supply box body 61 are provided. A second space B is formed between the two.
The first space portion A, the second space portion B, the resin power supply box 6, and the power supply box 6 fixed to the resin housing 11 cause the LED element 1. The heat is not conducted to the electronic component 4 mounted on the lighting circuit board 5, and the temperature rise of the electronic component 4 is suppressed. Moreover, since the electronic component 4 is radiated to the space A, the space B, and the space inside the power supply box 6, the temperature rise is suppressed.

また、アーム20の下側に電源ボックス6を配置し、更に電源ボックス本体61の上側外壁と、電源ボックス蓋体62の下側外壁に図示していない貫通孔を形成することによって、電子部品4で発生した熱で暖められた空気が上昇し、電源ボックス本体61の前記貫通孔を通ってアーム20に達し放熱し、冷却された空気が下降し、電源ボックス蓋体62の前記貫通孔を通って、電源ボックス6に流入し電子部品4が冷却されるので、更に電子部品4の温度上昇が抑制される。 Further, the power supply box 6 is disposed below the arm 20, and a through hole (not shown) is formed in the upper outer wall of the power supply box main body 61 and the lower outer wall of the power supply box lid 62, so that the electronic component 4 is provided. The air warmed by the heat generated in the air rises, reaches the arm 20 through the through hole of the power supply box body 61 and dissipates heat, and the cooled air descends and passes through the through hole of the power supply box lid 62. Then, the electronic component 4 flows into the power supply box 6 and is cooled, so that the temperature rise of the electronic component 4 is further suppressed.

このように、本発明の伝熱経路によって、LED素子1で発生した熱は、電子部品4に伝わることなく、LEDランプ本体10の外に放熱される。また電子部品4で発生した熱は対流によって放熱される。それによって、明るさが低下せず、長寿命なLED照明装置100を提供することができる。   Thus, the heat generated in the LED element 1 is dissipated outside the LED lamp body 10 without being transmitted to the electronic component 4 by the heat transfer path of the present invention. The heat generated in the electronic component 4 is radiated by convection. Thereby, it is possible to provide the LED lighting device 100 having a long life without reducing the brightness.

1:LED素子
2:LED基板
3:支持板、31:LED基板載置面、32:延出した3面
4:電子部品
5:点灯回路基板
6:電源ボックス、61:電源ボックス本体、62:電源ボックス蓋体
63:点灯回路基板支持突起
7:レンズ
8:レンズ固定部材
10:LEDランプ本体
11:筐体
12:透光性カバー
13:貫通スリット
14:電源ボックス固定ボス
15:アーム先端挟持部
20:アーム(取付手段)
21:アーム下面
22、23:アーム側面
100:LED照明装置
200:支柱(被取付手段)
210:簡易取付金具
A:第1の空間部
B:第2の空間部
1: LED element 2: LED substrate 3: support plate, 31: LED substrate mounting surface, 32: extended three surfaces 4: electronic component 5: lighting circuit substrate
6: power box 61: power box body 62: power box lid 63: lighting circuit board support protrusion 7: lens 8: lens fixing member 10: LED lamp body 11: housing 12: translucent cover 13: penetration Slit 14: Power supply box fixing boss 15: Arm tip clamping part 20: Arm (mounting means)
21: Arm lower surface 22, 23: Arm side surface 100: LED lighting device 200: Support column (attachment means)
210: Simple mounting bracket A: First space B: Second space

Claims (4)

LED素子を実装したLED基板と、点灯回路基板と、を収容したLEDランプ本体を、熱伝導性の取付手段で被取付体に取り付けるLED照明装置において、
前記LEDランプ本体の内部に、前記取付手段の一端側が挿入され、
前記取付手段の一端側に、前記LED基板が熱伝導可能に接合され、
前記点灯回路基板が、前記取付手段から離して配置されていることを特徴としたLED照明装置。
In the LED lighting device for mounting the LED lamp body that houses the LED board on which the LED element is mounted and the lighting circuit board to the body to be mounted by the thermally conductive mounting means,
One end side of the attachment means is inserted into the LED lamp body,
The LED substrate is joined to one end side of the attachment means so as to be capable of conducting heat,
The LED lighting device, wherein the lighting circuit board is disposed apart from the attachment means.
前記LEDランプ本体の外殻は樹脂材料で形成されており、
前記点灯回路基板は、樹脂製の電源ボックスに収容され、
前記電源ボックスは、前記LEDランプ本体の外郭に取り付けられており、かつ前記電源ボックスと前記取付手段との間には、空間部が形成されていることを特徴とした請求項1に記載のLED照明装置。
The outer shell of the LED lamp body is formed of a resin material,
The lighting circuit board is housed in a resin power box,
2. The LED according to claim 1, wherein the power supply box is attached to an outer periphery of the LED lamp main body, and a space is formed between the power supply box and the attachment means. Lighting device.
前記点灯回路基板と、前記電源ボックスの内壁面との間に空間部が形成されていることを特徴とした請求項2に記載のLED照明装置。   The LED lighting device according to claim 2, wherein a space is formed between the lighting circuit board and an inner wall surface of the power supply box. 前記電源ボックスに、通風用の貫通孔が形成されていることを特徴とした請求項2または3に記載のLED照明装置。
The LED lighting device according to claim 2 or 3, wherein a through hole for ventilation is formed in the power supply box.
JP2012233916A 2012-10-23 2012-10-23 LED lighting device Expired - Fee Related JP6061220B2 (en)

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JP2016149220A (en) * 2015-02-10 2016-08-18 シャープ株式会社 Luminaire
JP2016219377A (en) * 2015-05-26 2016-12-22 コイズミ照明株式会社 Luminaire
JP2017016803A (en) * 2015-06-29 2017-01-19 パナソニックIpマネジメント株式会社 Lighting device
JP2017536666A (en) * 2014-11-19 2017-12-07 ジーイー・ライティング・ソルーションズ,エルエルシー Outdoor LED luminaire with plastic housing
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JP2011076881A (en) * 2009-09-30 2011-04-14 Toshiba Lighting & Technology Corp Power supply device and luminaire
WO2012128299A1 (en) * 2011-03-21 2012-09-27 東芝ライテック株式会社 Illumination device

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JP2017536666A (en) * 2014-11-19 2017-12-07 ジーイー・ライティング・ソルーションズ,エルエルシー Outdoor LED luminaire with plastic housing
JP2016149220A (en) * 2015-02-10 2016-08-18 シャープ株式会社 Luminaire
JP2016219377A (en) * 2015-05-26 2016-12-22 コイズミ照明株式会社 Luminaire
JP2017016803A (en) * 2015-06-29 2017-01-19 パナソニックIpマネジメント株式会社 Lighting device
CN108332114A (en) * 2018-04-02 2018-07-27 四川蓝景光电技术有限责任公司 A kind of Novel LED light bar convenient for assembling

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