JP6314589B2 - Light source module, illumination lamp, and illumination device - Google Patents

Description

  The present invention relates to a light source module, an illumination lamp, and an illumination device.

  In recent years, in response to social demands for environmental considerations, a light-emitting diode (hereinafter referred to as “LED”), which is one of the solid-state light-emitting elements that has a longer life and lower power consumption than conventional incandescent bulbs and fluorescent lamps. The spread of the used illumination lamps and illumination devices is expanding.

  A part of the electric power supplied to the LED becomes heat, and this heat causes deterioration of the LED. For this reason, a light source module that releases heat generated from the LED to the heat sink by stacking and arranging a substrate on which the LED is mounted as in Patent Document 1 on a heat sink (a heat radiator corresponds to Patent Document 1) (Patent Document 1) In this case, a light source unit and a heat radiating body correspond to each other). In an illumination lamp using such an LED element, generally, the LED and the heat sink are housed in a cover formed of a resin material (a cover member corresponds in Patent Document 1). Therefore, the heat escaping to the heat sink is dissipated outside through the cover. That is, the heat generated from the LED is dissipated to the outside through the heat sink and the cover.

JP 2012-204162 PR

  However, in the configuration as in Patent Document 1, the temperature of the portion in contact with the heat sink is higher in the circumferential direction of the cover than the portion in contact with the heat sink. Therefore, a temperature difference is generated in the circumferential direction of the cover, the amount of elongation due to thermal expansion is different, and there is a problem that a large warp occurs in the cover.

  The present invention has been made in view of the above-described problems, and an object thereof is to provide an illumination lamp and an illumination device that are less likely to warp.

The light source module of the present invention is a solid light emitting element, is a long shape, the substrate on which the solid light emitting element is mounted on one surface, and the other surface of the substrate is installed on a part of one surface, A heat sink provided with a heat dissipation promoting part in at least a part of the part where the substrate on the one side is not installed, and the heat dissipation promoting part has a higher heat emissivity than the material of the heat sink, Provided only on one side surface of the heat sink , at least the one side surface of the heat sink is covered with at least the solid light-emitting element, the substrate, and the heat sink by a translucent long cover . The surface is located on the near side with respect to the light emitting direction of the solid state light emitting element with respect to the height direction center of the cover in a direction perpendicular to the substrate disposed on the one side surface. about It is characterized.

  The light source module according to the present invention is provided with a heat radiation promoting part having a higher heat emissivity than the heat sink on the side of the heat sink on which the substrate is placed. Therefore, when the cover is attached, the circumferential direction of the cover The temperature difference that occurs in the cover is suppressed, and the cover is less likely to warp.

1 is a perspective view of a lighting device according to Embodiment 1. FIG. 1 is a perspective view of an illumination lamp according to Embodiment 1. FIG. It is an AA cross-sectional perspective view of the illumination lamp according to the first embodiment. It is AA sectional drawing of the illumination lamp which concerns on Embodiment 1. FIG. FIG. 10 is a cross-sectional view of the illumination lamp according to the first modification of the first embodiment, taken along line AA. It is AA sectional drawing of the illumination lamp which concerns on the 2nd modification of Embodiment 1. FIG. It is AA sectional drawing of the illumination lamp which concerns on the 3rd modification of Embodiment 1. FIG. It is AA sectional drawing of the illumination lamp which concerns on the 4th modification of Embodiment 1. FIG. It is AA sectional drawing of the illumination lamp which concerns on the 5th modification of Embodiment 1. FIG. It is a perspective view of the illumination lamp which concerns on the 6th modification of Embodiment 1. FIG. It is BB sectional drawing of the illumination lamp which concerns on the 6th modification of Embodiment 1. FIG. It is a perspective view of the illuminating device which concerns on Embodiment 2. FIG. It is CC sectional drawing of the illuminating device which concerns on Embodiment 2. FIG. 6 is a perspective view of a lighting device according to Embodiment 3. FIG. It is DD sectional drawing of the illuminating device which concerns on Embodiment 3. FIG. It is EE sectional drawing of the illuminating device which concerns on Embodiment 3. FIG.

Embodiment 1
FIG. 1 is a perspective view of the lighting apparatus according to Embodiment 1. FIG. The illuminating device 10 has a long shape, and includes a detachable illumination lamp 11 and a luminaire 12 that supplies power to the illumination lamp 11 to light the illumination lamp 11. The illuminating device 10 is attached to a ceiling or a wall surface with the illumination lamp 11 facing the room, and illuminates the indoor space when the illumination lamp 11 is turned on.

  The lighting fixture 12 includes a power supply socket 13, a ground socket 14, and a fixture body 15. The power supply socket 13 and the earth socket 14 are provided in the instrument main body 15, respectively. The power supply socket 13 and the earth socket 14 can mechanically hold the illumination lamp 11. The power supply socket 13 and the earth socket 14 are electrically connected to the illumination lamp 11 by mechanically holding the illumination lamp 11. The earth socket 14 may be configured to mechanically hold the illumination lamp 11 and not electrically connected to the illumination lamp 11.

  The instrument body 15 is a housing that houses the power supply box 16 and has a fixture (not shown) such as a V-shaped spring or a joint. The lighting fixture 12 is attached to a ceiling or a wall surface by a fixture. The power supply box 16 is a housing that houses a switch (not shown) and a power supply device (not shown). The power supply device supplies power from an external power source to the power supply socket 13 when the switch is ON. In the state where is OFF, power supply is stopped. That is, the lighting device 10 can supply power to the lighting lamp 11 via the power supply socket 13. The power supply box 16 includes only a switch and a power supply device, and may not have a housing.

  In addition, in order to dissipate the amount of heat generated from the power supply device in the power supply box 16, generally, the instrument body 15 and the power supply box 16 are made of a material having high thermal conductivity such as metal.

  FIG. 2 is a perspective view of the illumination lamp according to the first embodiment. The illumination lamp 11 includes a cover 20, a power supply base 30, a ground base 40, and a light source module 50. The cover 20 is a cylindrical member having openings at both ends, and houses the light source module 50 therein. Further, the cover 20 is provided with a power base 30 at one end opening and a ground base 40 at the other end opening, thereby forming a cover inner space 80. In FIG. 2, a part of the configuration of the light source module 50 is shown except for a part of the cover 20.

  The cover 20 has translucency, and light emitted from the light source module 50 passes through the cover 20. The cover 20 is formed by extruding a resin material such as polycarbonate or acrylic. The resin material used for the cover 20 may be devised such as using a resin material mixed with a diffusing material according to specifications, and may have optical functions such as diffusion, reflection, and color rendering. Furthermore, it is sufficient that at least a part of the cover 20 has translucency. For example, only a part of the cover 20 is formed of a resin material having translucency, and the other part is a highly reflective resin. You may comprise with a material.

  The power supply cap 30 includes two conductive power supply terminals 31 and a power supply cap casing 32 in which the power supply terminals 31 are embedded by a manufacturing method such as insert molding and the like. The power supply cap 30 is attached so that the opening at one end of the cover 20 is covered with a power supply cap casing 32. The power supply terminal 31 can be mechanically connected to the power supply socket 13. The power supply terminal 31 is mechanically connected to the power supply socket 13 and at the same time is electrically connected to the power supply socket 13 so that power can be supplied from the power supply socket 13. When the ground base 40 and the illumination lamp 11 are not electrically connected, power is supplied from the power supply socket 13 from one of the two power supply terminals 31, and the other power supply terminal 31 is grounded. Play a role.

  The ground base 40 includes a ground terminal 41 having conductivity, and a ground base casing 42 in which the ground terminal 41 is embedded by a manufacturing method such as insert molding. The ground base 40 is attached so that the opening of the end portion of the cover 20 on the side where the power supply base 30 is not attached is covered with a ground base case 42. The ground terminal 41 is connectable to the ground socket 14 at least mechanically. In addition, when the earth socket 14 is electrically connected to the illumination lamp 11, the earth terminal 41 is mechanically connected to the earth socket 14 and is also electrically connected.

  FIG. 3 is an AA cross-sectional perspective view of the illumination lamp according to the first embodiment. 4 is a cross-sectional view of the illumination lamp according to the first embodiment, taken along line AA. For the sake of explanation, when the illumination lamp 11 is attached to the lighting fixture 12, the side facing the indoor space is referred to as the emission side, and the side facing the fixture body 15 is referred to as the fixture side.

  As shown in FIGS. 3 and 4, the cover 20 has a substantially circular cross section. The cover 20 has two surfaces, an outer peripheral surface 21 facing the outer space of the cover 20 and an inner peripheral surface 22 facing the cover inner space 80. On the inner peripheral surface 22, a pair of holding projections 23 protruding into the cover inner space 80 are formed over the entire length in the longitudinal direction of the cover 20. A light source module 50 is inserted into the cover 20 along the axial direction of the inner peripheral surface 22. The light source module 50 includes a plurality of LED light sources 51, a substantially rectangular substrate 52, and a long heat sink 53 on which at least the substrate 52 can be installed. In the first embodiment, the cover 20 has a substantially circular cross section. However, the present invention is not limited to this, and may have a rectangular shape or the like. The cover inner space 80 is formed, and the outer peripheral surface 21 and the inner peripheral surface 22 are formed. Any cross-sectional shape may be used.

  The LED light source 51 is mounted on the substrate 52 in parallel with the long side of the substrate 52. Note that the LED light source 51 may be integrated with the substrate 52. In the first embodiment, the LED light source 51 is a pseudo white LED packaged with a phosphor that converts blue light into yellow light on an LED chip that emits blue light of 440 to 480 nm. However, since the number of the LED light sources 51 to be mounted on the substrate 52, the arrangement of the LED light sources 51, and the type of the LED light sources 51 are determined according to the use of the illumination lamp 11, the number, arrangement, and types of the LED light sources 51 are limited. Not. Furthermore, the LED light source 51 is an example of a solid light emitting element in the present invention, and other solid light emitting elements such as a laser diode (LD) or an organic EL may be used instead of the LED light source 51. When these elements are used, instead of mounting a plurality of solid state light emitting elements on the substrate 52, one long solid state light emitting element whose longitudinal length is substantially the same as the long side of the substrate 52 is mounted on the substrate 52. You may do it.

  On the surface of the substrate 52 on which the LED light source 51 is mounted, for example, an electronic component (not shown) such as a diode, a capacitor, a fuse or a resistor, and each LED light source 51 and each electronic component so that the LED light source 51 is lit. A circuit pattern (not shown) for electrical connection is provided. The LED light source 51 mounted on the substrate 52 is electrically connected to the power supply terminal 31 through a circuit pattern. That is, the LED light source 51 is supplied with power from an external power source and can be turned on.

  As the base material of the substrate 52, a glass epoxy material, a paper phenol material, a composite material, or a metal material such as aluminum is selected in consideration of design matters such as material cost. The thickness of the substrate 52 is about 1 mm in the first embodiment, but is not limited to this thickness.

  The heat sink 53 includes a pair of wall portions 54, a substrate installation portion 55, a pair of attachment wing portions 56, and a screw fixing portion 57. The heat sink 53 has a role of transferring heat generated from the LED light source 51 to the cover 20 to dissipate it to the outside and a role of improving the rigidity of the illumination lamp 11. For this reason, generally, a material having good thermal conductivity and rigidity and a small linear expansion coefficient is used as the material of the heat sink 53. In the first embodiment, aluminum is used. The heat sink 53 may be formed by extrusion molding. The emission side surface of the substrate installation portion 55 and the emission side surface of the mounting wing portion 56 correspond to one side surface of the heat sink of the present invention.

  The board installation part 55 has an emission side surface and an instrument side surface. The substrate 52 has a substrate installation portion 55 such that the surface of the substrate 52 on which the LED light source 51 is not mounted and the surface of the substrate installation portion 55 on the emission side face each other so that the LED light source 51 faces the emission side. It is fixed to. As a fixing method, a method of adhering with an adhesive such as silicon resin or an adhesive member such as a double-sided tape, or a method of providing screw holes in the substrate installation portion 55 and the substrate 52 and screwing them in is used. In addition, in order to transmit heat generated from the LED light source 51 to the heat sink 53, it is desirable to select a material having good thermal conductivity when the installation is performed using an adhesive or an adhesive member. The board 52 and the board installation unit 55 may be integrated, that is, the board installation unit 55 may be provided with the circuit pattern of the board 52 and the lighting circuit element, and the LED light source 51 may be installed on the board installation unit 55. .

  A screw fixing portion 57 is formed on the surface of the substrate installation portion 55 on the device side so as to protrude toward the device side and extend in the longitudinal direction of the heat sink 53. The screw fixing portion 57 is a structure for fixing a screw inserted in the axial direction of the cover 20 through the power supply base 30 and the ground base 40. That is, the screw fixing portion 57 is a structure necessary for fixing the heat sink 53 with the power supply base 30 and the ground base 40 using screws. The screw fixing portion 57 is formed with a screw hole 58 for screwing the screw. The screw fixing portion 57 of the first embodiment has an opening on the instrument side. This is provided for manufacturing the heat sink 53 by extrusion molding, and the screw fixing portion 57 may not have an opening. Further, the screw fixing portion 57 is a structure necessary for fixing the heat sink 53 to the power supply base 30 and the ground base 40 using screws. Therefore, the heat sink 53 is fixed to the power supply base 30 and the ground base 40 with an adhesive. In the case of fixing by a method that does not use a screw, such as that, the screw fixing portion 57 may be omitted.

  In the substrate installation portion 55, a pair of wall portions 54 are formed perpendicular to the substrate installation portion 55 at both ends in a direction parallel to the short side direction of the substrate installation portion 55. Further, the wall portion 54 protrudes on both the emission side and the instrument side with respect to the substrate installation portion 55. The portion of the wall 54 protruding to the light exit side is a role of positioning when the substrate 52 is set on the substrate setting portion 55, and the circuit pattern and the lighting circuit element provided on the substrate 52 and the substrate 52 are outside the cover 20. It has a role to prevent it from being visually recognized. Further, since the LED light source 51 emits light radially, the emission side of the wall portion 54 is formed to protrude with a length that does not shield the light of the LED light source 51 unless there is a special reason. Further, the portion protruding to the instrument side is formed in order to improve the rigidity of the heat sink 53.

  A mounting wing 56 extends from the end of the wall 54 on the surface side where the substrate 52 is installed to extend toward the instrument. Further, a stepped portion 56 a is formed at the end opposite to the side in contact with the wall portion 54 of the mounting wing portion 56. When the light source module 50 is inserted into the cover 20, the surface on the emission side of the stepped portion 56 a of the heat sink 53 is attached so as to face the holding projection 23 of the cover 20. At this time, the end portion of the stepped portion 56a opposite to the wall portion 54 is in contact with the inner peripheral surface 22, and the end portion has a shape along the inner peripheral surface 22 in contact therewith. For this reason, when the light source module 50 is inserted into the cover 20, the stepped portion 56 a comes into contact with the holding projection 23 and the inner peripheral surface 22, whereby the light source module 50 is held in the cover 20.

  In the first embodiment, the light source module 50 is held only by the structure of the step portion 56a. However, the present invention is not limited to this. Fixing by contacting the surface 22 and forming a shape along the inner peripheral surface 22 in contact with the end portion, or by applying an adhesive to a portion of the light source module 50 in contact with the inner peripheral surface 22 There is a way to do it.

  Further, since the light source module 50 is arranged in order of the solid light emitting element 51, the substrate 52, and the heat sink 53 from the emission side, the emission side is the solid light emitting element side and the instrument side is the heat sink side when the substrate 52 is used as a reference. Become.

  In the state where the light source module 50 is inserted into the cover 20, the cover inner space 80 in the cover 20 is separated by the light source module 50 into the emission side space 81 (the solid light emitting element of the light source module with reference to the inner surface of the cover, the base and the substrate of the present invention). And a device side space 82 (corresponding to a space formed by the heat sink side surface of the light source module with reference to the inner surface of the cover, the base and the substrate of the present invention). The The exit side space 81 is a space formed on the exit side of the divided in-cover space 80, and the LED light source 51 and the substrate 52 face the exit side space 81. For this reason, the light emitted from the LED light source 51 passes through the emission side space 81. The instrument side space 82 is a space formed on the instrument side of the divided in-cover space 80, and the screw fixing portion 57 faces the instrument side space 82. Since the appliance-side space 82 is at a position opposite to the light emission direction of the LED light source 51, the light emitted from the LED light source 51 does not pass through the appliance-side space 82.

  A heat radiation promoting portion 59 is provided on the surface of the attachment wing portion 56 facing the emission side space 81. The heat dissipation promotion part 59 is anodized and is formed by performing anodized processing. Generally, the thermal emissivity of an aluminum surface that has not been anodized is about 0.05. In contrast, the thermal emissivity of the alumite surface is about 0.8-0.95. That is, the heat emissivity of the surface of the heat sink 53 on which the heat dissipation promotion part 59 is provided has a heat emissivity of about 16 to 19 times that of the surface on which the heat dissipation promotion part 59 is not provided. ing.

  In general, the amount of heat radiated from the object surface to the air is expressed by the mathematical formula (1).

  It can be seen from Equation 1 that the amount of heat radiated from the object surface to the air is proportional to the thermal emissivity. For this reason, the amount of heat radiated from the heat radiation promoting unit 59 per unit area is radiated by about 16 to 19 times the amount of heat radiated from the surface of the heat sink 53 other than the heat radiation promoting unit 59.

  In addition, since the surface of the heat sink 53 facing the emission side space 81 is attached to the emission side surface of the substrate installation portion 55, the surface that actually contributes to heat radiation is the mounting wing portion. Only the surface provided with 56 heat radiation promoting portions 59 is provided. However, among the surfaces of the heat sink 53, the surface facing the instrument side space 82 extends over the instrument side surface of the attachment wing part 56, the wall part 54, the instrument side surface of the board installation part 55, and the screw fixing part 57. . For this reason, the surface area of the heat sink 53 facing the instrument side space 82 is larger than the surface area facing the emission side space 81.

  Furthermore, as shown in FIG. 4, the volume of the instrument side space 82 is smaller than the emission side space 81. Generally, the heat capacity of a certain space depends on the volume, and the smaller the volume, the smaller the heat capacity. That is, the appliance-side space 82 has a smaller heat capacity than the emission-side space 81, and the temperature of the appliance-side space 82 rises even when the same amount of heat is applied.

  A point located directly in front of the LED light source 51 in the circumferential direction of the cover 20 (a point located closest to the emission side) is a point A, and a point located directly behind the LED light source 51 (a point located closest to the appliance side) is a point B. To do. When a temperature difference occurs between point A and point B, the longitudinal extension amount of the cover 20 due to thermal expansion at the point A and the longitudinal extension amount of the cover 20 due to thermal expansion at the point B are different, and the illumination lamp 11 is warped. Will occur. Here, the temperatures of point A and point B in the conventional illumination lamp not provided with the heat dissipation promotion part 59 and the illumination lamp 11 of the first embodiment provided with the heat dissipation promotion part 59 will be described.

  First, in the case of an illumination lamp that is not provided with the conventional heat radiation promoting portion 59, the surface facing the instrument side space 82 is wider than the surface facing the output side space 81. The amount of heat radiated to the appliance-side space 82 is greater than the amount of heat radiated to. Furthermore, since the instrument side space 82 has a smaller volume than the exit side space 81, the temperature of the instrument side space 82 is higher than that of the exit side space 81. Further, the temperature of the emission side space 81 is related to the temperature of the point A of the cover 20, and the temperature of the instrument side space 82 is related to the temperature of the point B of the cover 20. For this reason, since the temperature of the point B becomes higher at the point A and the point B, the illumination lamp is warped.

  However, when the heat radiation promoting portion 59 is provided on the surface of the mounting wing portion 56 facing the emission side space 81 as in the illumination lamp 11 of the present invention, the heat radiation rate of the heat radiation promoting portion 59 is the heat sink 53, that is, the light source. Since the thermal emissivity of the surface of the module 50 facing the instrument side space 82 is higher, the amount of heat radiated to the emission side space 81 is larger than in the conventional case. For this reason, the temperature difference between the emission side space 81 and the instrument side space 82 is suppressed as compared with the conventional case. As a result, the temperature difference generated between the points A and B of the cover 20 is also suppressed, and the illumination lamp 11 is less likely to warp.

  Further, in the illumination lamp 11 of the first embodiment, the heat quantity of the heat sink 53 is radiated to the emission side space 81 and the instrument side space 82, and from the inner peripheral surface 22 and the holding projection 23 that are in contact with the mounting wing 56. There is heat transferred to the cover 20. In general, heat is directly transmitted from the heat sink 53 to the cover 20 at a portion where the attachment wing portion 56 and the inner peripheral surface 22 are in contact with each other, so that the temperature of the cover 20 is the highest. Further, at point A and point B of the cover 20, the point B is closer to the portion where the mounting blade portion 56 and the inner peripheral surface 22 are in contact with each other, so that a temperature difference occurs between the point A and the point B of the cover 20. Become. However, in the illumination lamp 11 according to the first embodiment, since the heat dissipation promotion part 59 is provided, the amount of heat radiated to the emission side space 81 is larger than when the heat dissipation promotion part 59 is not provided. For this reason, the amount of heat transferred to the cover 20 from the portion where the mounting blade portion 56 and the inner peripheral surface 22 are relatively in contact with each other is smaller than when the heat radiation promoting portion 59 is not provided. The temperature difference at point B is also suppressed, and the illumination lamp 11 is less likely to warp.

  Furthermore, since the heat radiation promotion part 59 is formed by performing alumite processing, it is not necessary to add a new member or take a special structure. For this reason, it is possible to obtain an illumination lamp that has a simple structure and hardly warps.

  In the first embodiment, the heat radiation promoting portion 59 is provided on the entire surface of the attachment wing portion 56 facing the emission side space 81, but not limited thereto, the surface of the surface facing the emission side space 81 is not limited thereto. The heat dissipation promoting part 59 may be provided only in a part.

  The surface on which the heat radiation promoting portion 59 is provided may be a surface facing the emission side space 81 among the surfaces of the heat sink 53. For example, even if the substrate 52 is placed on the substrate installation portion 55, the emission side space is provided. If there is a surface exposed at 81, the heat radiation promoting portion 59 may be provided on the exposed surface.

  Further, the heat radiation promoting portion 59 only needs to have a higher thermal emissivity than the heat sink 53, and in addition to the anodizing process, the application of a heat radiating paint having a higher thermal emissivity compared to the thermal emissivity of the constituent material of the heat sink 53, Or you may provide by the method of mounting a thermal radiation sheet. In this case, in addition to aluminum as the material of the heat sink 53, for example, a highly heat conductive resin mixed with other metal materials such as iron, ceramic, or heat conductive filler can be selected, and design matters such as cost or emissivity can be selected. The material of the heat sink 53 can be selected in consideration. Moreover, it is not necessary to add a new member or take a special structure for the application of the heat radiating paint or the placement of the heat radiating sheet in the same manner as the alumite processing.

  In particular, the area where the heat radiation promoting portion 59 is provided and the emissivity of the heat radiation promoting portion 59 are the ratio of the surface of the heat sink 53 facing the exit side space 81 to the surface facing the instrument side space 82, the exit side space 81 and the instrument side. It is set in consideration of design matters such as a volume ratio with the space 82. For example, as in Equation 2, the ratio of the amount of heat radiated from the heat sink 53 to the exit side space 81 and the amount of heat radiated to the instrument side space 82 with respect to the volume ratio of the exit side space 81 and the instrument side space 82 is By setting the area of the heat radiation promoting portion 59 and the emissivity of the heat radiation promoting portion 59 so as to be equal, the temperatures of the emission side space 81 and the instrument side space 82 become equal, so that warpage due to the temperature difference is unlikely to occur. The illumination lamp 11 can be obtained. However, since the amount of heat transmitted from the portion where the mounting wing portion 56 of the heat sink 53 and the inner peripheral surface 22 are in contact is not included in the equation (2), the point A and the point B of the cover 20 are actually the same. It is necessary to consider the amount of heat in order to reach temperature.

  Furthermore, by setting the heat dissipation promoting part 59 to have a high reflectance, the light directed from the LED light source 51 to the heat dissipation promoting part 59 is reflected without being absorbed and irradiated to the outside, so that the luminous intensity of the illumination lamp 11 is improved. An example of such a high-reflectance heat dissipation promoting portion 59 is white alumite.

  Moreover, the illumination lamp 11 of Embodiment 1 can be attached to and detached from the lighting fixture 12, but is not limited thereto, and for example, the power supply base case 32 and the power supply socket 13 are integrally formed, and the ground base case The illumination lamp 11 and the lighting fixture 12 in which the 42 and the earth socket 14 are also integrally formed may be integrated. In the case where the illumination lamp 11 and the lighting fixture 12 are integrated, instead of the power supply terminal 31 and the ground terminal 41, the switch of the fixture body 15 and the circuit pattern of the substrate 52 are directly electrically connected. You may supply the electric power from the lighting fixture 12 to the illumination lamp 11. FIG.

  Next, first to sixth modifications of the first embodiment will be described. Among these modifications, the first to fifth modifications of the first embodiment describe illumination lamps when the shape of the heat sink 53 is different from that of the first embodiment. The sixth modification of the first embodiment describes an illumination lamp that houses a power supply box. For this reason, a description of points that are not changed from the first embodiment is omitted.

First Modification of First Embodiment FIG. 5 is a cross-sectional view of an illumination lamp according to a first modification of the first embodiment. In the first modification, the heat sink 53 has a rectangular flat plate shape, and has only a structure corresponding to the substrate installation portion 55 in the first embodiment. Further, the holding projection 23 is not formed on the inner peripheral surface 22 of the cover 20, and instead, a holding recess 24 for holding the heat sink 53 is formed on the inner peripheral surface 22 in contact with the heat sink 53. The holding recess 24 communicates with at least one of the openings at both ends of the cover 20, and the heat sink 53 can be inserted from the openings at both ends of the cover 20 along the end of the heat sink 53 along the holding recess 24. Further, since the heat sink 53 does not have the screw hole 58, the fixing method of the power supply base 30 and the ground base 40 is limited to a method that does not use screws.

  Even in the first modification of the first embodiment, the heat sink 53 divides the cover inner space 80 into the emission side space 81 and the instrument side space 82. A substrate 52 is installed on the surface of the heat sink 53 facing the emission side space 81. Further, in the heat sink 53, the substrate 52 is not installed, and a heat radiation promoting portion 59 is provided on a part of the surface facing the emission side space 81. Further, as in the first embodiment, the point located directly in front of the LED light source 51 in the circumferential direction of the cover 20 (the point located closest to the emission side) is a point A, and the point located directly behind the LED light source 51 (most toward the instrument side). A point B) is a point B.

  Even in the case of the first modification of the first embodiment, since the substrate 52 is installed on the surface of the heat sink 53 that faces the emission side space 81, the surface that actually contributes to heat radiation is the surface of the heat sink 53. It is narrower than the surface facing the instrument side space 82. For this reason, a temperature difference occurs between the point A and the point B of the cover 20 as in the first embodiment. However, by providing the heat radiation promoting portion 59, the amount of heat radiated from the heat sink 53 to the emission side space 81 is increased, and the temperature difference between the emission side space 81 and the instrument side space 82 is suppressed. As a result, the temperature difference between the point A and the point B of the cover 20 is also suppressed, and the illumination lamp 11 that hardly warps is obtained. Further, the case where the thermal emissivity and the surface area of the heat radiation promoting portion 59 are determined so that the temperatures of the emission side space 81 and the appliance side space 82 are equal can be calculated by the same equation as in the first embodiment.

Second Modification Example of First Embodiment FIG. 6 is a cross-sectional view of an illumination lamp according to a second modification example of the first embodiment. The heat sink 53 of the illumination lamp 11 in the second modified example does not have a structure corresponding to the attachment wing portion 56. Further, the wall portion 54 is in contact with the inner peripheral surface 22 of the cover 20 and the holding projection 23, and the portions in contact with each other are formed in a shape along the inner peripheral surface 22 or the holding projection 23. Further, the screw fixing portion 57 is in contact with the inner peripheral surface 22 of the cover 20, and the contacting portion is formed in a shape along the inner peripheral surface 22. Further, similarly to the first embodiment, the screw fixing portion 57 is provided with a screw hole 58.

  Even in the case of the second modified example of the first embodiment, the heat sink 53 divides the cover inner space 80 into the emission side space 81 and the instrument side space 82 as in the first embodiment. However, unlike Embodiment 1, the instrument side space 82 is divided into a first instrument side space 82 a and a second instrument side space 82 b by the screw fixing portion 57. A substrate 52 is installed on the surface of the substrate installation unit 55 facing the emission side space 81. In addition, the substrate 52 is not installed on the surface of the substrate installation part 55, and the heat radiation promoting part 59 is provided on a part of the surface facing the emission side space 81. Further, as in the first embodiment, the point located directly in front of the LED light source 51 in the circumferential direction of the cover 20 (the point located closest to the emission side) is a point A, and the point located directly behind the LED light source 51 (most toward the instrument side). A point B) is a point B.

  In the case of the second modification of the first embodiment, the inner peripheral surface 22 is in contact with both wall portions 54 and the screw fixing portion 57 of the heat sink 53. For this reason, the portion in contact with the wall portion 54 or the screw fixing portion 57 is the portion with the highest temperature in the cover 20 because the heat of the heat sink 53 is directly transmitted. In particular, since the screw fixing portion 57 is in contact with the point B of the cover 20, a larger temperature difference is generated between the point A and the point B than in the case of the first embodiment. However, by providing the heat radiation promoting portion 59, the amount of heat radiated from the heat sink 53 to the emission side space 81 is increased, and the amount of heat directly transmitted from the heat sink 53 to the point B is relatively decreased. The difference is suppressed, and the illumination lamp 11 that hardly warps is obtained. Further, in the case of determining the thermal emissivity and the surface area of the heat dissipation promoting part 59 so that the temperatures of the points A and B are equal, unlike the first and first modifications of the first embodiment, Equation 2 cannot be derived. However, by determining the thermal emissivity and surface area of the heat radiation promoting portion 59 so that the amount of heat directly transmitted from the heat sink 53 to the point B is equal to the amount of heat transmitted from the heat sink 53 to the point A via the emission side space 81, the point A is determined. And the temperature at point B are equal.

Third Modification of First Embodiment FIG. 7 is a cross-sectional view of an illumination lamp according to a third modification of the first embodiment. The heat sink 53 of the illumination lamp 11 in the third modification does not have a structure corresponding to the attachment wing portion 56 and the wall portion 54. Further, a projection insertion groove 60 into which the holding projection 23 is inserted is newly provided between the substrate installation portion 55 and the screw fixing portion 57. Further, the screw fixing portion 57 is in contact with the inner peripheral surface 22 of the cover 20, and the contacting portion is formed in a shape along the inner peripheral surface 22. As in the first embodiment, the heat sink 53 is provided with a screw hole 58.

  Even in the case of the third modification of the first embodiment, the heat sink 53 divides the cover inner space 80 into the emission side space 81 and the instrument side space 82, as in the second modification of the first embodiment. The instrument side space 82 is divided into a first instrument side space 82 a and a second instrument side space 82 b by the screw fixing portion 57. Further, a substrate 52 is installed on the surface of the substrate installation unit 55 facing the emission side space 81. In addition, the substrate 52 is not installed on the surface of the substrate installation part 55, and the heat radiation promoting part 59 is provided on a part of the surface facing the emission side space 81. Further, as in the first embodiment, the point located directly in front of the LED light source 51 in the circumferential direction of the cover 20 (the point located closest to the emission side) is a point A, and the point located directly behind the LED light source 51 (most toward the instrument side). A point B) is a point B.

  Also in the case of the third modification of the first embodiment, the screw fixing portion 57 is in contact with the point B of the cover 20 as in the case of the second modification of the first embodiment. A larger temperature difference is produced in B than in the first embodiment. For this reason, by providing the heat radiation promoting portion 59, the amount of heat radiated from the heat sink 53 to the emission side space 81 is increased, and the amount of heat directly transmitted from the heat sink 53 directly to the point B is decreased. The temperature difference is suppressed, and the illumination lamp 11 that hardly warps is obtained. Further, in the case where the thermal emissivity and the surface area of the heat radiation promoting portion 59 are determined so that the temperatures of the points A and B are equal, the points from the heat sink 53 are the same as in the second modification of the first embodiment. The heat emissivity and the surface area of the heat radiation promoting portion 59 may be determined so that the amount of heat directly transmitted to B and the amount of heat transmitted from the heat sink 53 to the point A via the emission side space 81 are equal.

Fourth Modification of First Embodiment FIG. 8 is a cross-sectional view of an illumination lamp 11 according to a fourth modification of the first embodiment. The heat sink 53 of the illumination lamp 11 in the fourth modified example has a flat semicircular shape composed of a substrate installation portion 55 and a heat sink arc portion 61, and a heat sink inner space 83 is formed therein. The heat sink arc portion 61 is in contact with the inner peripheral surface 22 of the cover 20, and the heat sink arc portion 61 has a shape along the inner peripheral surface 22. The holding projection 23 is locked to the upper surface of the substrate installation portion 55. Further, since the heat sink 53 does not have the screw hole 58, the fixing method of the power supply base 30 and the ground base 40 is limited to a method that does not use screws.

  In the case of the fourth modified example of the first embodiment, unlike the first embodiment, the cover inner space 80 is not divided by the heat sink 53, only the emission side space 81 is formed, and the configuration corresponds to the instrument side space 82. Does not exist. However, the substrate 52 is installed on the surface of the substrate installation unit 55 facing the emission side space 81. Of the surfaces of the substrate installation unit 55, the substrate 52 is not installed, and the substrate installation unit 55 faces the emission side space 81. This is the same as the first modification of the first embodiment in that a heat radiation promoting portion 59 is provided on a part of the surface. In addition, as in the first embodiment, the point located directly in front of the LED light source 51 in the circumferential direction of the cover 20 (the point closest to the emission side) is a point A, and the point located directly behind the LED light source 51 (most on the appliance side). A point B) is a point B.

  Also in the case of the fourth modification of the first embodiment, the screw fixing portion 57 is in contact with the point B of the cover 20 as in the case of the second modification of the first embodiment. A larger temperature difference is produced in B than in the first embodiment. For this reason, by providing the heat radiation promoting portion 59, the amount of heat radiated from the heat sink 53 to the emission side space 81 is increased, and the amount of heat directly transmitted from the heat sink 53 directly to the point B is decreased. The temperature difference is suppressed, and the illumination lamp 11 that hardly warps is obtained. Further, in the case where the thermal emissivity and the surface area of the heat radiation promoting portion 59 are determined so that the temperatures of the points A and B are equal, the points from the heat sink 53 are the same as in the second modification of the first embodiment. The heat emissivity and the surface area of the heat radiation promoting portion 59 may be determined so that the amount of heat directly transmitted to B and the amount of heat transmitted from the heat sink 53 to the point A via the emission side space 81 are equal.

Fifth Modification of First Embodiment FIG. 9 is a cross-sectional view of an illumination lamp 11 according to a fifth modification of the first embodiment. The heat sink 53 of the illumination lamp 11 in the fifth modified example has a flat semicircular shape as in the fifth modified example of the first embodiment, but the heat sink inner space 83 is not formed inside. The heat sink 53 has a planar substrate mounting surface 62 and an arcuate arc surface 63, and the arc surface 63 has a shape along the inner peripheral surface 22. The holding projection 23 is engaged with the upper surface of the substrate installation surface 62. As in the first embodiment, the heat sink 53 is provided with a screw hole 58.

  In the case of the fifth modification of the first embodiment, as in the fourth modification of the first embodiment, the cover inner space 80 is not divided by the heat sink 53, and only the emission side space 81 is formed, and the instrument side There is no configuration corresponding to the space 82. However, the substrate 52 is installed on the substrate installation surface 62, which is the surface facing the emission side space 81, and the substrate installation surface 62 corresponds to the substrate installation unit 55 of the first embodiment. Further, in the same manner as in the first embodiment, the substrate 52 is not installed on the surface of the substrate installation surface 62 and the heat radiation promoting portion 59 is provided on a part of the surface facing the emission side space 81. It is. In addition, as in the first embodiment, the point located directly in front of the LED light source 51 in the circumferential direction of the cover 20 (the point closest to the emission side) is a point A, and the point located directly behind the LED light source 51 (most on the appliance side). A point B) is a point B.

  Also in the case of the fifth modification of the first embodiment, the heat sink 53 is in contact with the point B of the cover 20 as in the case of the second modification of the first embodiment. Has a larger temperature difference than in the first embodiment. For this reason, by providing the heat radiation promoting portion 59, the amount of heat radiated from the heat sink 53 to the emission side space 81 is increased, and the amount of heat directly transmitted from the heat sink 53 directly to the point B is decreased. The temperature difference is suppressed, and the illumination lamp 11 that hardly warps is obtained. Further, in the case where the thermal emissivity and the surface area of the heat radiation promoting portion 59 are determined so that the temperatures of the points A and B are equal, the points from the heat sink 53 are the same as in the second modification of the first embodiment. The heat emissivity and the surface area of the heat radiation promoting portion 59 may be determined so that the amount of heat directly transmitted to B and the amount of heat transmitted from the heat sink 53 to the point A via the emission side space 81 are equal.

  As described above, in addition to the first embodiment, even if the heat sink has the shape as in the first to fifth modifications, it is simple by providing the heat radiation promoting portion on the surface of the heat sink that faces the emission side space. With this configuration, the illumination lamp 11 is unlikely to warp.

Sixth Modification of First Embodiment FIG. 10 is a perspective view of an illumination lamp according to a sixth modification of the first embodiment. FIG. 11 is a cross-sectional view taken along line B-B of the illumination lamp according to the sixth modification of the first embodiment. Note that the AA cross-sectional view of FIG. 10 is the same as that of the first embodiment, and is omitted.

  In the illumination lamp 11 according to the sixth modification of the first embodiment, the power supply box 16 housed in the fixture body 15 is housed inside the cover 20 as a part of the light source module 50. Specifically, the power supply box 16 is installed on the power supply base 30 side in the longitudinal direction on the surface of the heat sink 53 on the instrument side of the board installation portion 55. In addition, the wall portion 54 and the screw fixing portion 57 are not formed at the place where the power supply box 16 is installed on the surface of the heat sink 53 on the appliance side of the board installation portion 55, so that the power supply box 16 can be installed. It has become.

  The power supply box 16 includes a switch and a power supply device as in the first embodiment, and the switch and the power supply device are electrically connected to at least the power supply terminal 31 and the circuit pattern of the substrate 52. Further, when the earth socket 14 is electrically connected to the illumination lamp 11, the earth terminal 41, the switch in the power supply box 16 and the power supply device are electrically connected.

  A path for supplying power from the external power source to the LED light source 51 will be described. First, the external power supply directly supplies power to the power supply socket 13. The power supplied to the power supply socket 13 is supplied to the power supply device in the power supply box 16 through the power supply terminal 31. Similarly, the power supply device supplies power to the circuit pattern of the substrate 52 when the switch in the power supply box 16 is ON, and stops supplying power when the switch is OFF. Since the LED light source 51 is electrically connected to the electronic component so that the LED light source 51 is lit, the LED light source 51 is lit when power is supplied to the circuit pattern.

  Further, in order to dissipate the amount of heat generated in the power supply device in the power supply box 16, the material of the power supply box 16 is a material with high thermal conductivity that can transmit heat generated by the power supply device to the heat sink 53, such as a metal material. Is used. Note that the thermal emissivity of the casing of the power supply box 16 needs to be smaller than the thermal emissivity of the heat dissipation promoting portion 59.

  Even in the case of the sixth modification of the first embodiment, the heat sink 53 divides the cover inner space 80 into the emission side space 81 and the instrument side space 82. A substrate 52 is installed on the surface of the heat sink 53 facing the emission side space 81. Further, in the heat sink 53, the substrate 52 is not installed, and a heat radiation promoting portion 59 is provided on a part of the surface facing the emission side space 81. Further, as in the first embodiment, the point located directly in front of the LED light source 51 in the circumferential direction of the cover 20 (the point located closest to the emission side) is a point A, and the point located directly behind the LED light source 51 (most toward the instrument side). A point B) is a point B.

  In the case of the sixth modification of the first embodiment, unlike the first embodiment, the power supply box 16 is installed in the vicinity of the power supply cap 30, so the surface of the heat sink 53 facing the appliance side space 82 is attached. Only the surface of the wing portion 56 on the instrument side, and the surface area of the heat sink 53 facing the emission side space 81 and the surface area facing the instrument side space 82 are substantially the same. However, as described above, since the casing of the power supply box 16 is made of a material having high thermal conductivity, the surface of the power supply box 16 facing the appliance side space 82 also contributes to heat radiation. Further, the volume of the appliance side space 82 is reduced by the volume of the power supply box 16. For this reason, as in the first embodiment, the amount of heat radiated to the appliance-side space 82 is greater than the amount of heat radiated to the emission-side space 81, and the point B is the point A and the point B of the cover 20. Since the temperature becomes high, the illumination lamp 11 is warped.

  However, the portion of the light source module 50 facing the emission side space 81 is provided with a heat radiation promoting portion 59 having a higher heat emissivity than the heat sink 53 and the power supply box 16, that is, the portion of the light source module 50 facing the instrument side space 82. It has been. For this reason, the amount of heat dissipated from the heat sink 53 to the emission side space 81 increases, and the temperature difference between the emission side space 81 and the instrument side space 82 is suppressed. As a result, the temperature difference between the point A and the point B of the cover 20 is suppressed, and the illumination lamp 11 that hardly warps is obtained. Further, also in the case of determining the thermal emissivity and the surface area of the heat radiation promoting part 59 so that the temperatures of the point A and the point B are equal, the heat sink 53 has a volume ratio of the emission side space 81 and the instrument side space 82. It is obtained by setting the area of the heat radiation promoting part 59 and the emissivity of the heat radiation promoting part 59 so that the ratio of the heat quantity radiated to the emission side space 81 and the heat quantity radiated to the appliance side space 82 becomes equal. However, in the case of the sixth modification of the first embodiment, the surface area of the part facing the instrument side space 82 and the thermal emissivity of the casing of the power supply box 16 among the surfaces of the casing of the power supply box 16 are calculated. It is necessary to consider.

  Thus, even if the power supply box is an illumination lamp housed in the cover, it is possible to obtain an illumination lamp that has a simple structure and is less likely to warp by providing the heat dissipation promoting portion.

  Further, in the structure of the illumination lamp 11 according to the sixth modification of the first embodiment, since the power supply box 16 is installed on the heat sink 53, the heat generated by the LED light source 51 is transmitted to the power supply box 16 via the heat sink 53. End up. For this reason, the heat generated by the LED light source 51 raises the temperature in the power supply box 16 and adversely affects the power supply device. However, as the amount of heat radiated to the emission side space 81 by the heat radiation promoting portion 59 increases, the amount of heat transferred to the power supply box 16 relatively decreases. As a result, by providing the heat radiation promoting portion 59, an effect that the influence of the heat generated by the LED light source 51 on the power supply device can be reduced.

  The illumination lamp 11 according to the sixth modification of the first embodiment includes the power supply box 16, but is not limited thereto, and the power supply device and the switch are directly placed on the surface facing the appliance side space 82 of the heat sink 53. May be installed. However, in this case, the portion to which the power supply device and the switch are attached does not contribute to the heat radiation from the heat sink 53 to the appliance side space 82, and therefore the heat emissivity of the heat radiation promoting portion 59 and the temperature at the point A and the point B are equal. When determining the surface area, it is necessary to consider the surface area of the portion to which the power supply device and the switch are attached.

Embodiment 2
FIG. 12 is a perspective view of the lighting apparatus according to Embodiment 2. FIG. FIG. 13 is a cross-sectional view taken along the line CC of the illumination device according to the second embodiment. The illumination device 110 according to the second embodiment includes an instrument main body 15, a cover 20, and a light source module 50.

  The light source module 50 includes an LED light source 51, a substrate 52, and a heat sink 53, as in the first embodiment. The configurations of the LED light source 51 and the substrate 52 are the same as those in the first embodiment. The heat sink 53 protrudes perpendicularly to the substrate installation portion 55 from the substrate installation portion 55 having an emission side surface and an appliance side surface, and from the appliance side surface of the substrate installation portion 55, and extends in the longitudinal direction of the heat sink 53. It is comprised from a pair of wall part 54 formed so that it might extend. Each wall 54 has a protrusion 64 on the surface facing each other. The heat sink 53 of the second embodiment is the same as the heat sink 53 of the first embodiment except for the shape.

  The instrument body 15 houses a power supply box 16 on one end side with respect to the longitudinal direction. The power supply box 16 has a switch and a power supply device as in the first embodiment. Moreover, the instrument main body 15 has a fixture similarly to Embodiment 1, and the illuminating device 110 can fix to the ceiling or a wall surface with the output side of the light source module 50 facing indoors by the fixture. . The wall portion 54 of the heat sink 53 is in contact with a side surface parallel to the longitudinal direction of the instrument body 15. Also, the side surface is provided with a fitting hole 17 at a position corresponding to the protruding portion 64 of the wall portion 54, and the fixture body 15 and the light source module 50 are fitted by fitting the fitting hole 17 and the protruding portion 64. Fixed. In addition, you may fix more firmly by methods, such as apply | coating an adhesive agent to the part which the instrument main body 15 and the light source module 50 are contacting.

  The power supply device of the power supply box 16 is connected to an external power supply. When the switch is ON, power is supplied to the LED light source 51 via the circuit pattern of the substrate 52, and when the switch is OFF, the power supply is stopped. . That is, as compared with the first embodiment, the power supply device supplies power to the LED light source 51 without passing through the power supply socket 13 and the power supply terminal 31.

  The cover 20 has a substantially semicircular cross section. The cover 20 of the second embodiment is the same as the cover 20 of the first embodiment except for the shape. When the light source module 50 is attached, the surface that contacts the light emission side has an arc shape, and this arc portion is referred to as a cover arc portion 25. The surface that hits the appliance side has a planar shape, and this plane portion is referred to as a cover plane portion 26. A cover opening 27 is formed in the cover flat part 26 so as to extend from the center in the short direction of the cover flat part 26 in the longitudinal direction of the cover flat part 26. The width of the cover opening 27 in the short direction is longer than the distance between the pair of wall portions 54 of the heat sink 53 and shorter than the width of the substrate installation portion 55 in the short direction. Further, the cover arc portion 25 is provided with a pair of holding projections 23 extending in the longitudinal direction of the cover 20 so as to extend inside the cover 20, and the width between the holding projection 23 and the cover flat portion 26 is as follows. The thickness is substantially the same as the thickness of the substrate installation portion 55. For this reason, the board installation part 55 can be inserted between the holding projection part 23 and the cover flat part 26, and the heat sink 53 can be attached to the cover 20 so that the cover 20 covers the light source module 50.

  The illumination device 110 is formed with an emission side space 81 (corresponding to the first space of the present invention) surrounded by the light source module 50 and the cover 20. Of the heat sink 53, the substrate 52 is not installed, and a heat radiation promoting portion 59 is provided on a part of the surface facing the emission side space 81. The heat radiation promoting part 59 of the second embodiment is provided by the same method as the heat radiation promoting part 59 of the first embodiment, and has a higher heat emissivity than the heat sink 53.

  A point that is located in front of the LED light source 51 in the circumferential direction of the cover 20 (a point that is closest to the emission side) is defined as a point A. Further, a point that is in contact with the heat sink 53 in the circumferential direction of the cover 20 is a point B. The temperature in the circumferential direction of the cover 20 is the highest at the portion in contact with the heat sink 53, that is, the point B, and the temperature decreases in proportion to the distance from the point B. In FIG. 13, the point A is the point farthest from the point B in the circumferential direction of the cover 20, so the temperature is low, and a large temperature difference occurs between the point A and the point B of the cover 20. Further, the point B is also a point located closest to the instrument side in the cover 20. For this reason, when a temperature difference occurs between the points A and B, a temperature difference is generated between the emission side of the cover 20 and the instrument side, and the cover 20 is warped in the same manner as the illumination lamp 11 of the first embodiment. End up.

  However, by providing the heat radiation promoting portion 59, the amount of heat radiated from the heat sink 53 to the emission side space 81 increases, and the amount of heat directly transmitted from the heat sink 53 directly to the cover 20 decreases. In addition, the amount of heat radiated to the cover inner space 80 contributes to the temperature rise of the entire cover 20, so that the temperature change proportional to the distance from the point B also becomes gentle. For this reason, the temperature difference between the points A and B is relaxed, and the warpage of the cover 20 is less likely to occur.

  As described above, in the configuration as in the second embodiment, the cover is warped with a simple configuration by providing the heat radiation promoting portion on a part of the surface of the heat sink where the substrate is not installed and faces the emission side space. It is possible to obtain a lighting device that is less likely to cause

  In addition, the amount of heat radiated from the heat sink 53 to the emission side space 81 by the heat radiation promoting portion 59 increases, so that the amount of heat transferred from the heat sink 53 to the power supply box 16 relatively decreases. As a result, by providing the heat radiation promoting part 59, an effect of reducing the influence of the heat generated by the LED light source 51 on the power supply device can be obtained.

  In the illumination device 110 of the second embodiment, in FIG. 13, the surface on which the power supply box 16 of the instrument main body 15 is installed and the substrate installation portion 55 of the heat sink 53 are in contact with each other. Alternatively, the substrate installation part 55 may be released. By disposing the instrument main body 15 and the board installation portion 55, the area of contact between the instrument main body 15 and the heat sink 53 is reduced, so that the amount of heat transferred from the heat sink 53 to the instrument main body 15 is also reduced. For this reason, the influence which the heat_generation | fever of the LED light source 51 has on the power supply device in the power supply box 16 can be reduced.

  In addition, the lighting device 110 according to the second embodiment includes the power supply box 16, but the power supply device and the switch may not be housed in the power supply box 16 and may be provided directly on the instrument body 15.

Embodiment 3
FIG. 14 is a perspective view of a lighting apparatus according to Embodiment 3. FIG. 15 is a DD cross-sectional view of the lighting apparatus according to Embodiment 3. FIG. 16 is an EE cross-sectional view of the lighting apparatus according to Embodiment 3. The illumination device 210 according to the third embodiment is different from the illumination device 110 according to the second embodiment in that a cover inner space 80 is formed in the cover 20, and the light source module 50 and the power supply box 16 are inserted into the cover inner space 80. Since it is substantially the same except that the power supply box 16 is in contact with the heat sink 53, the description thereof is omitted.

  Compared to the cover 20 of the second embodiment, the cover 20 of the third embodiment does not have the cover opening 27 and instead extends perpendicularly from the short side end of the cover flat portion 26 to the emission side. The cover side wall portion 28 is connected to the cover arc portion 25. Further, a cover inner space 80 surrounded by the cover arc part 25, the cover flat part 26 and the cover side wall part 28 is provided. In addition, a pair of insertion holes 29 are formed in the cover plane portion 26 at substantially the same interval as the interval between the side surfaces parallel to the longitudinal direction of the instrument body 15 so that a part of the instrument body 15 can be accommodated. ing. Further, each cover side wall 28 is provided with a holding projection 23 extending in the longitudinal direction of the cover 20 so as to protrude into the cover inner space 80. Two holding projections 23 are provided for one cover side wall 28, and the intervals between the holding projections 23 are arranged at an interval substantially equal to the thickness of the substrate installation portion 55 of the heat sink 53.

  The light source module 50 is accommodated in the cover inner space 80 by inserting the heat sink 53 along the holding protrusion 23. Further, at this time, the cover inner space 80 is formed by the heat sink 53 and the holding projection 23 with respect to the emission side space 81 (corresponding to the first space of the present invention) and the instrument side space 82 (corresponding to the second space of the present invention). ).

  By inserting a side surface parallel to the longitudinal direction of the instrument body 15 into the insertion hole 29 of the cover 20, a part of the instrument body 15 is accommodated in the cover inner space 80 of the cover 20. At this time, the instrument side space 82 is divided into a first instrument side space 82 a, a second instrument side space 82 b, and a third instrument side space 82 c by the side surface of the instrument body 15.

  The power supply box 16 is accommodated in the second instrument side space 82b. Further, the power supply box 16 is disposed so as to be in contact with a surface of the heat sink 53 on the instrument side of the board installation portion 55. Generally, the instrument main body 15 and the power supply box 16 are made of a material having high thermal conductivity, such as a metal material, which can transmit heat generated by the power supply device to the heat sink 53. Further, the thermal emissivity of the instrument main body 15 and the power supply box 16 needs to be smaller than the thermal emissivity of the heat dissipation promoting part 59.

  In the third embodiment, the substrate 52 is not installed in the heat sink 53, and the heat radiation promoting portion 59 is provided on a part of the surface facing the emission side space 81. Furthermore, a point located directly in front of the LED light source 51 in the circumferential direction of the cover 20 (a point located closest to the emission side) is a point A, and a point located directly behind the LED light source 51 (a point located closest to the appliance side) B.

  The temperature of the exit side space 81 that affects the temperature at the point A and the temperature of the second instrument side space 82b that affects the temperature at the point B are compared. In the heat sink 53, the surface that radiates heat to the emission side space 81 corresponds to a portion of the emission side surface of the substrate installation unit 55 where the substrate 52 is not installed. On the other hand, the surface that radiates heat to the second instrument side space 82b corresponds to the surface of the power supply box 16 that faces the second instrument side space 82b and the surface of the instrument body 15 that faces the second instrument side space 82b. . For this reason, in the area to which heat is radiated, the second instrument side space 82b is wider than the exit side space 81, and the amount of heat radiated to the second instrument side space 82b is larger. Further, in the emission side space 81 and the second instrument side space 82b, the volume is smaller in the second instrument side space 82b, and the heat capacity is smaller in the second instrument side space 82b. As a result, the temperature of the second instrument side space 82 b is higher than the temperature of the emission side space 81, and a temperature difference occurs between the points A and B.

  However, a part of the surface facing the emission side space 81 has a heat radiation promoting part having a higher heat emissivity than the heat sink 53, the power supply box 16, and the instrument body 15, that is, the part facing the instrument side space 82 excluding the cover 20. 59 is provided. For this reason, the amount of heat radiated from the heat sink 53 to the emission side space 81 increases, and the temperature difference between the emission side space 81 and the second instrument side space 82b is suppressed. As a result, the temperature difference between the points A and B of the cover 20 is also suppressed, and the warpage of the cover 20 is difficult to occur.

  As described above, even in the configuration as in the third embodiment, the heat sink is provided on a part of the surface of the heat sink where the substrate is not installed and faces the inner space on the emission side. Thus, it is possible to obtain an illuminating device in which the cover is hardly warped.

  In addition, the amount of heat radiated from the heat sink 53 to the emission side space 81 by the heat radiation promoting portion 59 increases, so that the amount of heat transferred from the heat sink 53 to the power supply box 16 relatively decreases. For this reason, the effect which reduces the influence which the heat_generation | fever of the LED light source 51 has on the power supply device in the power supply box 16 can be acquired.

  In FIG. 16, the illumination device 210 according to the third embodiment is in contact with the surface on which the power supply box 16 of the instrument main body 15 is installed and the substrate installation portion 55 of the heat sink 53. Alternatively, the substrate installation part 55 may be released.

  The lighting device 210 according to the third embodiment includes the power supply box 16, but is not limited thereto, and the power supply device and the switch directly face the second appliance side space 82 b of the substrate installation portion 55 of the heat sink 53. It may be installed on the surface. In this case, the portion where the power supply device and the switch are installed does not contribute to heat radiation from the heat sink 53 to the second instrument side space 82b, but is radiated from the surface of the instrument body 15 to the second instrument side space 82b. Therefore, the same effect as when the power supply box 16 is provided by the heat radiation promoting portion 59 can be obtained.

DESCRIPTION OF SYMBOLS 10 Lighting device, 11 Lighting lamp, 12 Lighting fixture, 13 Power supply socket, 14 Ground socket, 15 Appliance main body, 16 Power supply box, 17 Fitting hole, 20 Cover, 21 Outer peripheral surface, 22 Inner peripheral surface, 23 Holding protrusion, 24 holding recess, 25 cover arc portion, 26 cover flat surface portion, 27 cover opening portion, 28 cover side wall portion, 29 insertion hole, 30 power supply base, 31 power supply terminal, 32 power supply base case, 40 ground base, 41 ground terminal, 42 Ground cap housing, 50 light source module, 51 LED light source, 52 substrate, 53 heat sink, 54 wall portion, 55 substrate installation portion, 56 mounting wing portion, 56a step portion, 57 screw fixing portion, 58 screw hole, 59 heat dissipation promotion Part, 60 protrusion insertion groove, 61 heat sink arc part, 62 substrate mounting surface, 63 arc surface, 64 protrusions , 80 cover inner space, 81 exit side space, 82 instrument side space, 82a first instrument side space, 82b second instrument side space, 82c third instrument side space, 83 heat sink inner space, 110 lighting device, 210 , Lighting equipment

Claims (11)

A solid state light emitting device;
A substrate having a long shape and having the solid light-emitting element mounted on one surface;
A heat sink provided with a heat radiation promoting part at least in a part where the other surface of the substrate is installed on a part of one surface and the substrate on the one surface is not installed;
The heat dissipation promoting part has a higher heat emissivity than the material of the heat sink, and is provided only on the one surface of the heat sink.
At least the solid light emitting element, the substrate, and the one side surface of the heat sink are covered with a long cover having translucency ,
The one side surface of the heat sink is closer to the front side than the center in the height direction of the cover in the direction perpendicular to the substrate installed on the one side surface with respect to the light emitting direction of the solid light emitting element. A light source module that is biased . The heat sink material is aluminum,
The light source module according to claim 1, wherein the heat dissipation promoting part is an alumite layer. The light source module according to claim 2, wherein the heat dissipation promoting part is a white alumite layer. The light source module according to claim 1, wherein the heat dissipation promoting part is a layer formed of a heat dissipation paint. The light source module according to claim 1, wherein the heat dissipation promoting unit is a heat dissipation sheet. The light source module according to any one of claims 1 to 5,
A cover having a light-transmitting property, which is cylindrical and accommodates the light source module therein;
A base attached to both ends of the cover,
In the light source module, the volume of a space formed by the inner surface of the cover, the base, and the surface of the light source module on the side of the solid light emitting element is used as a reference, and the inner surface of the cover, the base, and the substrate The illumination lamp housed in the cover so as to be larger than the volume of the space formed by the heat sink side surface of the light source module. The illumination lamp according to claim 6, wherein a power supply device that is electrically connected to the solid-state light emitting element is installed on a surface of the light source module on the heat sink side. A power supply box that houses the power supply device is installed on the heat sink side surface of the light source module,
The illumination lamp according to claim 7, wherein a heat emissivity of the power supply box is lower than a heat emissivity of the heat dissipation promoting unit. The light source module according to any one of claims 1 to 5,
A cover having translucency, covering at least a surface of the light source module on the solid light emitting element side;
A power supply device electrically connected to the solid state light emitting device;
A lighting device. The cover forms an internal space for housing the light source module and the power supply device,
The internal space is divided by the light source module into a space on the solid light emitting element side and a space on the heat sink side based on the substrate,
The lighting device according to claim 9, wherein the power supply device is installed on the heat sink so as to face a space on the heat sink side. Power box that houses the power supply device is disposed on the heat sink to face the space before Symbol sink side,
The lighting device according to claim 10, wherein a thermal emissivity of the power supply box is lower than a thermal emissivity of the heat dissipation promoting unit.

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