JP2013069441A - Bulb type lighting device - Google Patents

Bulb type lighting device Download PDF

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JP2013069441A
JP2013069441A JP2011205493A JP2011205493A JP2013069441A JP 2013069441 A JP2013069441 A JP 2013069441A JP 2011205493 A JP2011205493 A JP 2011205493A JP 2011205493 A JP2011205493 A JP 2011205493A JP 2013069441 A JP2013069441 A JP 2013069441A
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light
cover
light emitter
heat
heat radiating
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JP5802497B2 (en
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Kazuo Nomura
和男 野村
Hiroshi Akai
寛 赤井
Norio Nakazato
典生 中里
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Hitachi Appliances Inc
日立アプライアンス株式会社
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Abstract

PROBLEM TO BE SOLVED: To provide a bulb type lighting device capable of effectively emitting heat generated from a light-emitting body.SOLUTION: A bulb type lighting device 10 includes a light-emitting body 12 having an LED 11, a cover member 15 for covering the light-emitting body 12, and a radiator 20 for mounting an opening end 16 of the cover member 15 and discharging heat generated from the light-emitting body 12. A heat radiation member 80 extended from the radiator 20 into the cover member 15 is also provided in the bulb type lighting device.

Description

本発明は、電球型照明装置に関し、特に、LED(Light Emitting Diode)等の半導体発光素子を備えた発光体を有する電球型照明装置に関する。   The present invention relates to a light bulb-type illumination device, and more particularly, to a light bulb-type illumination device having a light emitter including a semiconductor light emitting element such as an LED (Light Emitting Diode).
LED等の半導体発光素子を備えた発光体を有する電球型照明装置は、白熱電球と比較して長寿命化、省エネルギー化を図ることができるため、近年注目が集まっている。一方、LEDは、温度上昇に伴って発光効率が低下すると共に、寿命が短くなることが知られており、LEDで発生する熱を外部に放出する必要がある。   2. Description of the Related Art In recent years, a light bulb-type illuminating device having a light emitter including a semiconductor light emitting element such as an LED has been attracting attention since it can have a longer life and energy saving than an incandescent light bulb. On the other hand, it is known that the LED has a light emitting efficiency that decreases as the temperature rises, and the lifetime is shortened, and it is necessary to release heat generated by the LED to the outside.
例えば、特許文献1には、外部に露出する周部、この周部に一体に形成された光源取付部、及び前記周部の内側に形成された凹部を有する金属製の外郭部材を備えた電球型ランプが開示されている。この技術では、金属製の外郭部材の光源取付部に伝導された点状光源の熱が、外郭部材の周部に伝導して、この周部から外部に放出される。   For example, Patent Document 1 discloses a light bulb including a peripheral portion exposed to the outside, a light source mounting portion formed integrally with the peripheral portion, and a metal outer member having a recess formed inside the peripheral portion. A mold lamp is disclosed. In this technique, the heat of the point light source conducted to the light source mounting portion of the metal outer member is conducted to the peripheral portion of the outer member and is released to the outside from this peripheral portion.
特許第4465640号公報Japanese Patent No. 4465640
ところで、特許文献1に記載の技術では、LEDからの熱は放熱体としての金属製の外郭部材のみに伝わることになる。このため、LEDの熱の熱容量(伝熱機能)の観点から見れば改善の余地があり、放熱体全体としての放熱性能のさらなる向上が望まれる。   By the way, in the technique described in Patent Document 1, heat from the LED is transmitted only to a metal outer member as a heat radiating body. For this reason, there is room for improvement from the viewpoint of the heat capacity (heat transfer function) of the heat of the LED, and further improvement of the heat dissipation performance of the entire radiator is desired.
本発明は、このような事情に鑑みてなされたものであり、発光体で発生する熱を効果的に放出することができる電球型照明装置を提供することを目的とする。   This invention is made | formed in view of such a situation, and it aims at providing the light bulb type illuminating device which can discharge | release the heat | fever which generate | occur | produces with a light-emitting body effectively.
前記目的を達成するために、本発明は、半導体発光素子を備えた発光体と、前記発光体を覆うカバー部材と、前記カバー部材の開口端部が取り付けられると共に前記発光体で発生する熱を放出する放熱体と、を有し、前記放熱体からカバー部材内に延在する当該放熱部材を備えていることを特徴とする。   In order to achieve the above object, the present invention provides a light emitter including a semiconductor light emitting element, a cover member that covers the light emitter, and an open end of the cover member and heat generated by the light emitter. And a heat radiating member that emits the heat radiating member, the heat radiating member extending from the heat radiating member into the cover member.
あるいは、前記目的を達成するために、本発明は、半導体発光素子を備えた発光体と、前記発光体を覆うカバー部材と、前記カバー部材の開口端部が取り付けられると共に前記発光体で発生する熱を放出する放熱体と、前記カバー部材内に設けられると共に一端が前記放熱体に接続されている放熱部材と、を有することを特徴とする。   Alternatively, in order to achieve the above object, the present invention generates a light emitter including a semiconductor light emitting element, a cover member that covers the light emitter, and an opening end of the cover member and is generated in the light emitter. And a heat dissipating member for releasing heat and a heat dissipating member provided in the cover member and having one end connected to the heat dissipating member.
本発明によれば、半導体発光素子を備えた発光体と、前記発光体を覆うカバー部材と、前記カバー部材の開口端部が取り付けられると共に前記発光体で発生する熱を放出する放熱体と、を有し、前記放熱体からカバー部材内に延在する当該放熱部材を備えていることにより発光体で発生する熱を効果的に放出することができる電球型照明装置を提供できる。   According to the present invention, a light emitting body including a semiconductor light emitting element, a cover member that covers the light emitting body, an open end of the cover member, and a heat radiator that releases heat generated by the light emitting body, It is possible to provide a light bulb-type lighting device that can effectively release heat generated in the light emitter by including the heat radiating member extending from the heat radiating member into the cover member.
または、半導体発光素子を備えた発光体と、前記発光体を覆うカバー部材と、前記カバー部材の開口端部が取り付けられると共に前記発光体で発生する熱を放出する放熱体と、前記カバー部材内に設けられると共に一端が前記放熱体に接続されている放熱部材と、を有することにより発光体で発生する熱を効果的に放出することができる電球型照明装置を提供できる。   Alternatively, a light emitting body including a semiconductor light emitting element, a cover member that covers the light emitting body, an open end of the cover member, and a heat radiator that releases heat generated by the light emitting body, and in the cover member And a heat radiating member having one end connected to the heat radiating body, thereby providing a light bulb-type lighting device capable of effectively releasing heat generated by the light emitting body.
本発明の実施形態に係る電球型照明装置の外観正面図である。It is an external appearance front view of the lightbulb type illuminating device which concerns on embodiment of this invention. 図1に示される電球型照明装置の分解斜視図である。It is a disassembled perspective view of the lightbulb-type illuminating device shown by FIG. 図2のIII−III線に沿う電球型照明装置の縦断面図である。It is a longitudinal cross-sectional view of the lightbulb type illuminating device along the III-III line of FIG. 図2のIV−IV線に沿う電球型照明装置の縦断面図である。It is a longitudinal cross-sectional view of the lightbulb type illuminating device which follows the IV-IV line of FIG. 発光体が載置された発光体取付部を本体部に取り付ける様子を示す斜視図である。It is a perspective view which shows a mode that the light-emitting body attachment part in which the light-emitting body was mounted is attached to a main-body part. 電球型照明装置の配光特性を説明するための模式図である。It is a schematic diagram for demonstrating the light distribution characteristic of an electric light bulb type illuminating device. 実施形態に係る放熱体周辺の斜視図である。It is a perspective view around a radiator according to an embodiment. 図7に示される放熱部材を示す分解斜視図である。It is a disassembled perspective view which shows the heat radiating member shown by FIG. 実施形態の変形例に係る放熱体の斜視図である。It is a perspective view of the heat radiator which concerns on the modification of embodiment.
以下、本発明の実施形態について適宜図面を参照しながら詳細に説明する。   Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings as appropriate.
(実施形態)
図1は、本発明の実施形態に係る電球型照明装置の外観正面図である。図2は、図1に示される電球型照明装置の分解斜視図である。図3は、図2のIII−III線に沿う電球型照明装置の縦断面図である。図4は、図2のIV−IV線に沿う電球型照明装置の縦断面図である。
(Embodiment)
FIG. 1 is an external front view of a light bulb type illumination device according to an embodiment of the present invention. FIG. 2 is an exploded perspective view of the light bulb type lighting device shown in FIG. FIG. 3 is a longitudinal sectional view of the light bulb type illumination device taken along line III-III in FIG. FIG. 4 is a longitudinal sectional view of the light bulb-type lighting device taken along line IV-IV in FIG.
図1に示すように、実施形態に係る電球型照明装置10は、半導体発光素子としてのLED11を備えた発光体12(図2参照)と、発光体12を覆うカバー部材15と、カバー部材15の開口端部16が取り付けられると共に発光体12で発生する熱を放出する放熱体20とを有している。   As shown in FIG. 1, the bulb-type lighting device 10 according to the embodiment includes a light emitter 12 (see FIG. 2) that includes an LED 11 as a semiconductor light emitting element, a cover member 15 that covers the light emitter 12, and a cover member 15. The opening end 16 is attached, and a heat radiating body 20 that releases heat generated in the light emitting body 12 is provided.
また、電球型照明装置10は、室内の天井等の外部に設置された一般照明電球用のソケット(図示せず)にねじ込むことにより商用電源に電気的に接続するための口金50と、この口金50と放熱体20との間に配設された電気絶縁性を有する絶縁リング51とを有している。   In addition, the light bulb-type lighting device 10 includes a base 50 for electrically connecting to a commercial power source by screwing into a socket (not shown) for a general lighting bulb installed outside the indoor ceiling or the like. 50 and an insulating ring 51 having electrical insulation disposed between the radiator 20 and the radiator 20.
図2〜図4に示すように、発光体12は、例えば矩形形状の基板13を有しており、当該基板13の一方の面である実装面の中央に、複数のLED11(チップ)が例えばマトリクス状に配列されて実装されている。   As shown in FIGS. 2 to 4, the light emitter 12 has, for example, a rectangular substrate 13, and a plurality of LEDs 11 (chips) are provided at the center of the mounting surface, which is one surface of the substrate 13, for example. It is arranged in a matrix and mounted.
LED11としては、例えば青色光を発するものが使用される。複数のLED11は、例えばシリコーン樹脂等の透明の封止樹脂により被覆されている。この封止樹脂内には、LED11から出射される光を色変換する蛍光体が混入されている。蛍光体としては、例えば黄色発光のものが用いられ、当該蛍光体によってLED11からの青色光が色変換されて、白色光となる。   As LED11, what emits blue light is used, for example. The plurality of LEDs 11 are covered with a transparent sealing resin such as a silicone resin. In this sealing resin, a phosphor for color-converting light emitted from the LED 11 is mixed. As the fluorescent material, for example, a yellow light emitting material is used, and the blue light from the LED 11 is color-converted by the fluorescent material to become white light.
カバー部材15は、透光性を有する例えば乳白色の、ガラス製又はPC(ポリカーボネイト)等の樹脂製であり、発光体12を覆うように、ここでは略球面状に形成されている。カバー部材15は放熱体20に向けて開口しており、この開口端部16が、放熱体20のカバー部材取付部21に当接され、接着剤等によって固定されている。   The cover member 15 is made of a translucent resin such as milky white glass or PC (polycarbonate), and is formed in a substantially spherical shape here so as to cover the light emitter 12. The cover member 15 opens toward the heat radiating body 20, and the opening end portion 16 abuts on the cover member mounting portion 21 of the heat radiating body 20 and is fixed by an adhesive or the like.
カバー部材15には、発光体12からの光を拡散させる光拡散部材が含有されていてもよい。このように構成すれば、発光体12のLED11からの光は、指向性の強いものであるが、カバー部材15を透過する際に拡散されるため、配光特性が広くなる。   The cover member 15 may contain a light diffusion member that diffuses light from the light emitter 12. If comprised in this way, although the light from LED11 of the light-emitting body 12 is a thing with strong directivity, since it diffuses when it permeate | transmits the cover member 15, a light distribution characteristic becomes wide.
放熱体20は、発光体12が取り付けられる発光体取付部22と、当該発光体取付部22が接続される筒状の本体部23とを備えており、本体部23と発光体取付部22とは別体で構成されている(図2参照)。ここで、発光体取付部22と本体部23とは、面接触することにより熱伝導可能に接続される。   The radiator 20 includes a light emitter attachment portion 22 to which the light emitter 12 is attached and a cylindrical main body portion 23 to which the light emitter attachment portion 22 is connected. Is configured separately (see FIG. 2). Here, the light emitter attachment portion 22 and the main body portion 23 are connected so as to be able to conduct heat by surface contact.
本体部23は、熱伝導率の高い材料から形成されている。本体部23の材料としては、例えばアルミニウム(合金を含む)等の金属材料が挙げられる。アルミニウムは、軽量で熱伝導率が高く、しかも耐食性、加工性に優れ、強固でコストも低く外観も美麗であるため好ましい。また、発光体取付部22は、本体部23よりも熱伝導率の高い材料から形成されている。発光体取付部22の材料としては、例えば銅や銀(合金を含む)等の金属材料が挙げられる。   The main body 23 is made of a material having high thermal conductivity. Examples of the material of the main body 23 include metal materials such as aluminum (including an alloy). Aluminum is preferable because it is lightweight, has high thermal conductivity, is excellent in corrosion resistance and workability, is strong, has low cost, and has a beautiful appearance. The light emitter attachment portion 22 is made of a material having a higher thermal conductivity than the main body portion 23. Examples of the material of the light emitter mounting portion 22 include metal materials such as copper and silver (including alloys).
これにより、発光体12で発生する熱は、発光体取付部22を介して本体部23に効率的に伝導され、本体部23の外周面37から外部の空気に放出されることになる。なお、本体部23の外周面37に、複数の放熱フィン(図示せず)が放射状に外方に突出して形成されていてもよい。また、本体部23の外面に、放熱性を高めるための放熱塗料が塗布されていてもよい。   As a result, heat generated in the light emitter 12 is efficiently conducted to the main body portion 23 via the light emitter attachment portion 22 and is released from the outer peripheral surface 37 of the main body portion 23 to the outside air. A plurality of heat radiating fins (not shown) may be formed on the outer peripheral surface 37 of the main body 23 so as to project radially outward. Further, a heat dissipating paint for improving heat dissipation may be applied to the outer surface of the main body 23.
発光体取付部22は、発光体12が載置される載置部24と、載置部24の外縁から本体部23側に延伸し本体部23の内面36に接触する延伸部25とを備えている。延伸部25は、本体部23の内面36と接触する際に、所定の弾性力で本体部23の内面36に付勢して接触圧を付与すべく、弾性を有することが好ましい。この意味において、発光体取付部22は、例えばばね性を有するばね用ベリリウム銅から形成されてもよい。   The light emitter mounting portion 22 includes a mounting portion 24 on which the light emitter 12 is mounted, and an extending portion 25 that extends from the outer edge of the mounting portion 24 toward the main body portion 23 side and contacts the inner surface 36 of the main body portion 23. ing. When the extending portion 25 comes into contact with the inner surface 36 of the main body portion 23, the extending portion 25 preferably has elasticity so as to urge the inner surface 36 of the main body portion 23 with a predetermined elastic force to apply a contact pressure. In this sense, the light emitter attachment portion 22 may be formed of, for example, spring beryllium copper having spring properties.
放熱体20の筒状を呈する本体部23の内部には、リード線66(図3参照、但し図4では図示省略)を介して発光体12のLED11に所定の電力を供給するための電源回路基板35と、電源回路基板35を収納する樹脂製の収納ケース39とが配設される。なお、電源回路基板35と口金50とは、商用電源を電源回路基板35に供給するためのリード線(図示せず)で接続される。   A power supply circuit for supplying predetermined power to the LED 11 of the light emitter 12 through a lead wire 66 (see FIG. 3, but not shown in FIG. 4) is provided inside the body portion 23 of the radiator 20 that has a cylindrical shape. A substrate 35 and a resin storage case 39 for storing the power circuit board 35 are disposed. The power supply circuit board 35 and the base 50 are connected by lead wires (not shown) for supplying commercial power to the power supply circuit board 35.
電源回路基板35は、複数の電子部品(図示せず)が基板に実装されたものである。電源回路基板35は、例えば、商用電源からの交流電力を直流電力に整流する回路、整流後の直流電力の電圧を調整する回路等を備えている。   The power supply circuit board 35 is obtained by mounting a plurality of electronic components (not shown) on the board. The power supply circuit board 35 includes, for example, a circuit that rectifies AC power from a commercial power source into DC power, a circuit that adjusts the voltage of the DC power after rectification, and the like.
収納ケース39の発光体12側の開口端近傍には、係合片40が形成されている。係合片40が本体部23に形成された切欠き部46の底面に相当する係合面47に当接された状態で、収納ケース39が本体部23の内部に設置される。収納ケース39の発光体12と反対側の端部41には、口金50が嵌合されて接着剤等によって固定される。   An engaging piece 40 is formed in the vicinity of the opening end of the storage case 39 on the light emitter 12 side. The storage case 39 is installed inside the main body 23 in a state where the engagement piece 40 is in contact with an engagement surface 47 corresponding to the bottom surface of the notch 46 formed in the main body 23. A base 50 is fitted to the end 41 of the storage case 39 opposite to the light emitter 12 and is fixed by an adhesive or the like.
収納ケース39に収納された電源回路基板35の周囲には、熱伝導性が良好で電気絶縁性が高い樹脂(図示せず)が充填され、電源回路基板35で発生した熱を放熱体20の本体部23や口金50に効率良く伝導できるようになっている。なお、電源回路基板35の周囲への樹脂の充填は、本体部23内及び口金50側における配線が終了して口金50が取り付けられた状態で行われる。   The power circuit board 35 housed in the housing case 39 is filled with a resin (not shown) having good thermal conductivity and high electrical insulation, and the heat generated in the power circuit board 35 is transferred to the radiator 20. The main body 23 and the base 50 can be efficiently conducted. The filling of the resin around the power circuit board 35 is performed in a state where the wiring in the main body portion 23 and the base 50 side is completed and the base 50 is attached.
放熱体20の本体部23は、カバー部材15の開口端部16が取り付けられるカバー部材取付部21を備える基部42と、当該基部42に連設されカバー部材取付部21よりも発光体12側に延出する台座部43とを備えている。基部42と台座部43とは一体に構成されており、例えばダイカスト法により形成される。   The main body portion 23 of the radiator 20 includes a base portion 42 having a cover member attachment portion 21 to which the opening end portion 16 of the cover member 15 is attached, and the light emitter 12 side of the cover member attachment portion 21 connected to the base portion 42. And a pedestal portion 43 that extends. The base portion 42 and the pedestal portion 43 are integrally formed and formed by, for example, a die casting method.
発光体12は、伝熱シート60を介して発光体取付部22の載置部24上に載置されている。伝熱シート60は、シリコーンゴム等の熱伝導性が良好で電気絶縁性が高いシート状の材料から形成されている。但し、伝熱シート60に代えて、熱伝導性が良好で電気絶縁性が高いグリスが使用されてもよい。   The light emitter 12 is placed on the placement portion 24 of the light emitter attachment portion 22 via the heat transfer sheet 60. The heat transfer sheet 60 is formed of a sheet-like material having good thermal conductivity and high electrical insulation, such as silicone rubber. However, instead of the heat transfer sheet 60, grease having good thermal conductivity and high electrical insulation may be used.
載置部24上に載置された発光体12の上面端縁に当接して覆うように、略矩形枠形状のホルダ61が配置される。ホルダ61の中央部には開口62が形成されており、LED11が外部に露呈するようになっている。ホルダ61は、PBT(ポリブチレンテレフタレート)やPC(ポリカーボネイト)等の耐熱性及び電気絶縁性を有する樹脂材料から形成されている。   A holder 61 having a substantially rectangular frame shape is disposed so as to contact and cover the upper surface edge of the light emitter 12 placed on the placement unit 24. An opening 62 is formed in the center of the holder 61 so that the LED 11 is exposed to the outside. The holder 61 is formed of a heat-resistant and electrically insulating resin material such as PBT (polybutylene terephthalate) or PC (polycarbonate).
ホルダ61の対向する二辺には、LED11と電源回路基板35とを接続するリード線66(図3参照)をガイドする一対のガイド部65が形成されている。また、ホルダ61の対向する他方の二辺には、ホルダ61を本体部23に固定する際にねじ部材64が挿通される貫通孔63が形成されている。   On two opposite sides of the holder 61, a pair of guide portions 65 for guiding a lead wire 66 (see FIG. 3) that connects the LED 11 and the power supply circuit board 35 are formed. Further, on the other two opposite sides of the holder 61, a through hole 63 is formed through which the screw member 64 is inserted when the holder 61 is fixed to the main body portion 23.
発光体12の発光体取付部22と反対側には、発光体12からの光を口金50に近付ける方向を含む角度範囲に配光するレンズ部材70が配置されている。レンズ部材70は係合部71を備えており、係合部71がホルダ61に係合されることにより、レンズ部材70がホルダ61に保持される。   A lens member 70 that distributes light from the light emitter 12 in an angle range including a direction in which the light from the light emitter 12 approaches the base 50 is disposed on the side opposite to the light emitter attachment portion 22 of the light emitter 12. The lens member 70 includes an engaging portion 71, and the lens member 70 is held by the holder 61 when the engaging portion 71 is engaged with the holder 61.
次に、電球型照明装置10の組立方法について説明する。   Next, a method for assembling the bulb-type lighting device 10 will be described.
図2に示すように、収納ケース39を本体部23の内部に台座部43側から嵌め込み、収納ケース39の係合片40が放熱体20の係合面47に当接した状態で収納ケース39を本体部23内に取り付ける。   As shown in FIG. 2, the storage case 39 is fitted into the main body portion 23 from the side of the pedestal 43, and the storage case 39 is in contact with the engagement surface 47 of the radiator 20. Is mounted in the main body 23.
続いて、電源回路基板35を、長手方向を縦にして収納ケース39内に挿入し、収納ケース39内の係合部(図示せず)に係合させて収納する。電源回路基板35に予め接続されているリード線66(図3参照)の先端は、このとき収納ケース39内から外に引き出された状態とされる。   Subsequently, the power supply circuit board 35 is inserted into the storage case 39 with the longitudinal direction thereof being vertical, and is engaged with an engaging portion (not shown) in the storage case 39 for storage. At this time, the tip of the lead wire 66 (see FIG. 3) connected in advance to the power circuit board 35 is drawn out from the storage case 39.
一方、電源回路基板35に予め接続されている入力用のリード線(図示せず)を口金50の所定箇所に接続する。そして、放熱体20と口金50との間に絶縁リング51を介在させるようにして、口金50を収納ケース39の端部41に嵌合して取り付ける。   On the other hand, an input lead wire (not shown) connected in advance to the power circuit board 35 is connected to a predetermined portion of the base 50. Then, the base 50 is fitted and attached to the end portion 41 of the storage case 39 so that the insulating ring 51 is interposed between the radiator 20 and the base 50.
続いて、発光体12が載置された発光体取付部22を本体部23に取り付ける。   Subsequently, the light emitter attachment portion 22 on which the light emitter 12 is mounted is attached to the main body portion 23.
図5は、発光体が載置された発光体取付部を本体部に取り付ける様子を示す斜視図である。なお、図5では、収納ケース39、電源回路基板35等の部品は、説明の都合上、図示省略している。   FIG. 5 is a perspective view showing a state where the light emitter mounting portion on which the light emitter is mounted is attached to the main body. In FIG. 5, components such as the storage case 39 and the power supply circuit board 35 are not shown for convenience of explanation.
図5に示すように、発光体12が載置された発光体取付部22は、発光体取付部22の延伸部25が本体部23の内面36に接触して本体部23の軸方向に摺動するようにして、本体部23の内部に挿入される。ここで、発光体取付部22の延伸部25の先端は、内面36の口金50側の終端45(図4参照)に当接して移動が規制される。この状態において、発光体12は、台座部43の端面48(図2参照)と略同一面上あるいは当該端面48よりも台座部43の延出方向に離間した位置に配置される。   As shown in FIG. 5, the light emitter mounting portion 22 on which the light emitter 12 is placed is slid in the axial direction of the main body portion 23 when the extending portion 25 of the light emitter mounting portion 22 contacts the inner surface 36 of the main body portion 23. It is inserted into the main body 23 so as to move. Here, the distal end of the extending portion 25 of the light emitter mounting portion 22 is brought into contact with the terminal end 45 (see FIG. 4) on the base 50 side of the inner surface 36 to restrict movement. In this state, the light emitter 12 is disposed substantially on the same surface as the end surface 48 (see FIG. 2) of the pedestal portion 43 or at a position separated from the end surface 48 in the extending direction of the pedestal portion 43.
そして、ねじ部材64をホルダ61の貫通孔63(図2参照)に挿通させて本体部23の台座部43の端面48に形成されたねじ孔44にねじ込むことにより、発光体12及び発光体取付部22が本体部23に組み付けられる。このとき、ホルダ61のガイド部65は、本体部23に形成された切欠き部46内に収容される。   Then, the screw member 64 is inserted into the through hole 63 (see FIG. 2) of the holder 61 and screwed into the screw hole 44 formed in the end surface 48 of the pedestal portion 43 of the main body 23, whereby the light emitter 12 and the light emitter are attached. The part 22 is assembled to the main body part 23. At this time, the guide part 65 of the holder 61 is accommodated in the notch part 46 formed in the main body part 23.
続いて、収納ケース39内から外に引き出されているリード線66(図3参照)をホルダ61のガイド部65に沿わせて這い回し、リード線66の先端を発光体12のLED11に半田付けやコネクタ等によって接続する。   Subsequently, the lead wire 66 (see FIG. 3) drawn out from the inside of the storage case 39 is wound around the guide portion 65 of the holder 61, and the tip of the lead wire 66 is soldered to the LED 11 of the light emitter 12. Connect with a connector.
最後に、カバー部材15が、発光体12を覆うようにして、放熱体20のカバー部材取付部21に取り付けられて、電球型照明装置10の組立が完了する。但し、電球型照明装置10の組立方法は、前記した方法に限定されるものではなく変更が可能である。   Finally, the cover member 15 is attached to the cover member attachment portion 21 of the heat radiating body 20 so as to cover the light emitter 12, and the assembly of the bulb-type lighting device 10 is completed. However, the method for assembling the bulb-type lighting device 10 is not limited to the above-described method, and can be changed.
次に、電球型照明装置10の配光特性について説明する。   Next, the light distribution characteristic of the light bulb type illumination device 10 will be described.
図6は、電球型照明装置の配光特性を説明するための模式図である。図6に示すように、電球型照明装置10の放熱体20の本体部23は、基部42と、当該基部42に連設されカバー部材取付部21よりも発光体12側に延出する台座部43とを備えている。また、発光体12のLED11の実装面側には、レンズ部材70が配置されている。   FIG. 6 is a schematic diagram for explaining the light distribution characteristics of the bulb-type lighting device. As shown in FIG. 6, the main body portion 23 of the radiator 20 of the bulb-type lighting device 10 includes a base portion 42 and a base portion that is connected to the base portion 42 and extends toward the light emitter 12 with respect to the cover member mounting portion 21. 43. A lens member 70 is disposed on the LED 11 mounting surface side of the light emitter 12.
このような構成によれば、発光体12は、台座部43の端面48と略同一面上に配置されるため、カバー部材15の内部に所定距離だけ入り込んだ位置に設置される。ここで、仮に発光体12がカバー部材取付部21と略同一面上の平面部に取り付けられるような場合には、発光体12からの光が前記平面部の外周縁部によって遮られて口金50側へ配光されないという課題がある。これに対して、第1実施形態では、カバー部材取付部21よりもカバー部材15の内方に設置された発光体12からの光は、放熱体20に遮られることが抑制され、口金50に近付く方向Aを含む例えば約300度の角度範囲αに配光され得る。   According to such a configuration, since the light emitter 12 is disposed on substantially the same plane as the end surface 48 of the pedestal portion 43, the light emitter 12 is installed at a position entering the cover member 15 by a predetermined distance. Here, if the light emitter 12 is attached to a flat surface on substantially the same plane as the cover member attachment portion 21, the light from the light emitter 12 is blocked by the outer peripheral edge of the flat portion and the base 50. There is a problem that light is not distributed to the side. On the other hand, in the first embodiment, the light from the light emitting body 12 installed on the inner side of the cover member 15 than the cover member mounting portion 21 is suppressed from being blocked by the heat radiating body 20. For example, the light can be distributed in an angle range α of about 300 degrees including the approaching direction A.
また、放熱体20の本体部23は、カバー部材15の内部に位置する台座部43を備えるようにしたので、製品(電球型照明装置10)の全長に影響を与えることなく、台座部43の分だけ熱容量を大きくすることができる。したがって、放熱性能が向上し、LEDの発光効率を高めることが可能となる。   Moreover, since the main-body part 23 of the heat radiator 20 was provided with the base part 43 located in the inside of the cover member 15, without affecting the full length of a product (bulb-type illuminating device 10), The heat capacity can be increased by that amount. Therefore, the heat dissipation performance is improved, and the light emission efficiency of the LED can be increased.
なお、レンズ部材70は省略することも可能である。この場合、発光体12からの光は、カバー部材15の内面で反射したり、カバー部材15を通過する際に拡散したりすることによって、口金50に近付く方向にもある程度配光され得る。また、台座部43を省略して、その高さ分だけ発光体取付部22の延伸部25の延伸方向の長さLを延長するように構成することも可能である。   The lens member 70 can be omitted. In this case, the light from the light emitter 12 can be distributed to some extent in the direction approaching the base 50 by reflecting on the inner surface of the cover member 15 or diffusing when passing through the cover member 15. Further, it is possible to omit the pedestal portion 43 and extend the length L in the extending direction of the extending portion 25 of the light emitter mounting portion 22 by the height thereof.
図7は、実施形態に係る放熱体周辺の斜視図である。図8は、図7に示される放熱部材80を示す分解斜視図である。   FIG. 7 is a perspective view of the periphery of the radiator according to the embodiment. FIG. 8 is an exploded perspective view showing the heat radiating member 80 shown in FIG.
図7に示すように、実施形態に係る放熱体20aは、発光体取付部22(図2参照)と、筒状の本体部23aと、本体部23aの台座部43aに接続される放熱部材80とを備えている。ここで、放熱部材80は、台座部43aの延伸方向(図7における上下方向)に沿って延在しており、カバー部材15(図3等参照)の内部に配置される。   As shown in FIG. 7, the heat dissipating body 20a according to the embodiment includes a light emitter mounting portion 22 (see FIG. 2), a cylindrical main body portion 23a, and a heat dissipating member 80 connected to the pedestal portion 43a of the main body portion 23a. And. Here, the heat radiating member 80 extends along the extending direction of the pedestal portion 43a (vertical direction in FIG. 7), and is disposed inside the cover member 15 (see FIG. 3 and the like).
図8に示すように、放熱部材80は、一対の逆U字形状の板部材81,82から構成されている。一方の板部材81には、中間部85の内側縁部から外方に向けてスリット83が形成されており、他方の板部材82には、中間部86の外側縁部から内方に向けてスリット84が形成されている。スリット83とスリット84とを同一直線上に位置させて板部材81,82を互いに接近させることにより、板部材81,82がスリット84,83にそれぞれ嵌入されて放熱部材80が形成される。そして、板部材81,82の側方支持部87,88が、台座部43aの外周面に円周上等間隔に放射状に形成された取付溝49内に圧入等によって固定される。なお、放熱部材80が発光体12からの配光に影響を与えてしまうことが考えられるため、放熱部材80には光拡散部材が塗布されることが好ましい。また前記光拡散部材にたとえば酸化チタンなどの熱エネルギーを赤外線以降の長波長側の電磁波に変換して輻射熱として放出しやすいフィラを採用した塗料を利用されることが好ましい。また発光体12からも蛍光材料から輻射熱が放出されており、放熱部材80が発光体12に接近しすぎると輻射熱が入射され、放熱効果が少なくなるため、図には示していないが、図7においてレンズ70がない場合においても相応のスペースを確保することが好ましい。さらにこの間隙は2ミリメートル以上あることが好ましい。また、放熱部材80が発光体12からの配光への影響を軽減するために放熱部材80の表面上の塗装のベース樹脂にはたとえばアクリル樹脂やシリコーン樹脂などの光透過率の高い材料を採用し樹脂層内を導光しやすくし、放熱部材80の端部より出射しやすくすることが好ましい。   As shown in FIG. 8, the heat radiating member 80 is composed of a pair of inverted U-shaped plate members 81 and 82. One plate member 81 has a slit 83 formed outward from the inner edge of the intermediate portion 85, and the other plate member 82 has an inner edge from the outer edge of the intermediate portion 86 inward. A slit 84 is formed. By placing the slit 83 and the slit 84 on the same straight line and bringing the plate members 81 and 82 closer to each other, the plate members 81 and 82 are fitted into the slits 84 and 83, respectively, and the heat radiating member 80 is formed. Then, the side support portions 87 and 88 of the plate members 81 and 82 are fixed by press-fitting or the like into the mounting grooves 49 formed radially at equal intervals on the outer peripheral surface of the pedestal portion 43a. In addition, since it is possible that the heat radiating member 80 will affect the light distribution from the light-emitting body 12, it is preferable that a light diffusing member is applied to the heat radiating member 80. Further, it is preferable to use a coating material that employs a filler that easily converts heat energy such as titanium oxide into electromagnetic waves on the long wavelength side after infrared rays and emits it as radiant heat. Radiant heat is also emitted from the phosphor material from the light emitter 12, and if the heat dissipation member 80 is too close to the light emitter 12, radiant heat is incident and the heat dissipation effect is reduced, which is not shown in FIG. In this case, it is preferable to secure a corresponding space even when the lens 70 is not provided. Further, this gap is preferably 2 millimeters or more. Further, in order to reduce the influence of the heat dissipation member 80 on the light distribution from the light emitter 12, a material having high light transmittance such as an acrylic resin or a silicone resin is used for the base resin of the coating on the surface of the heat dissipation member 80. It is preferable that the inside of the resin layer be easily guided and emitted from the end of the heat dissipation member 80.
このような実施形態によれば、カバー部材15(図3等参照)の内部において放熱体20aに放熱部材80を接続することにより、製品の全長に影響を与えることなく、製品全体の熱容量を大きくすることができる。ここで、発光体12から本体部23aの台座部43aに伝導された熱の一部は、放熱部材80からもカバー部材15を介して外部の空気に放出され得る。したがって、放熱性能がさらに向上し、LEDの発光効率をより高めることが可能となる。   According to such an embodiment, the heat capacity of the entire product is increased without affecting the overall length of the product by connecting the heat radiating member 80 to the heat radiating body 20a inside the cover member 15 (see FIG. 3 and the like). can do. Here, a part of the heat conducted from the light emitter 12 to the pedestal 43 a of the main body 23 a can be released from the heat radiating member 80 to the outside air via the cover member 15. Therefore, the heat dissipation performance is further improved, and the light emission efficiency of the LED can be further increased.
但し、放熱部材80の形状は、図7及び図8に示したものに限定されるものではない。図9は、実施形態の変形例に係る放熱体の斜視図である。図9に示す放熱体20bにおいて、実施形態の変形例に係る放熱部材80aは、本体部23bの台座部43bの外側面から半径方向外方に突出する複数の板状部89から構成されている。板状部89は略矩形形状を呈しており、台座部43bの外周面に円周上等間隔に放射状に形成された取付溝49a内に圧入等によって固定される。   However, the shape of the heat dissipation member 80 is not limited to that shown in FIGS. 7 and 8. FIG. 9 is a perspective view of a radiator according to a modification of the embodiment. In the heat dissipating body 20b shown in FIG. 9, the heat dissipating member 80a according to the modification of the embodiment is composed of a plurality of plate-like parts 89 protruding outward in the radial direction from the outer surface of the pedestal part 43b of the main body part 23b. . The plate-like portion 89 has a substantially rectangular shape, and is fixed by press-fitting or the like into mounting grooves 49a that are radially formed on the outer peripheral surface of the pedestal portion 43b at equal intervals on the circumference.
なお、複数の板状部89における図9中の上側、下側、又は半径方向外側の各端縁が一つのリング状部材に固定されていてもよい。このようにすれば、板状部89の取付溝49a内への設置作業を迅速に行うことができる。あるいは、複数の板状部89は、放熱体20bの製造時において、放熱体20bに一体的に形成されてもよい。   Note that the upper, lower, or radially outer edges of the plurality of plate-like portions 89 in FIG. 9 may be fixed to one ring-shaped member. In this way, the installation work of the plate-like portion 89 in the mounting groove 49a can be quickly performed. Or the some plate-shaped part 89 may be integrally formed in the heat radiator 20b at the time of manufacture of the heat radiator 20b.
この変形例では、放熱部材80aは、本体部23bの軸方向において、台座部43bの端面48と、基部42のカバー部材取付部21との間に配置されている。このように構成すれば、放熱部材80aが発光体12(図7参照)からの配光に影響を与えることを抑制することができる。   In this modification, the heat radiating member 80a is disposed between the end surface 48 of the base portion 43b and the cover member mounting portion 21 of the base portion 42 in the axial direction of the main body portion 23b. If comprised in this way, it can suppress that the heat radiating member 80a affects the light distribution from the light-emitting body 12 (refer FIG. 7).
以上、本発明について、実施形態に基づいて説明したが、本発明は、前記実施形態に記載した構成に限定されるものではなく、各実施形態に記載した構成を適宜組み合わせ乃至選択することを含め、その趣旨を逸脱しない範囲において適宜その構成を変更することができるものである。   As mentioned above, although this invention was demonstrated based on embodiment, this invention is not limited to the structure described in the said embodiment, The combination thru | or selecting suitably the structure described in each embodiment is included. The configuration can be changed as appropriate without departing from the spirit of the invention.
例えば、前記実施形態では、複数のLED11がマトリクス状に配置されているが、放射状等の他の形状に配置されていてもよい。また、発光体12からの光は、白色に限定されるものではなく、発光色の異なるLEDや蛍光体を用いて所望の色に設定可能である。さらに、LED11の実装方式は、前記実施形態に限定されるものではなく、発光体12は1個以上のLED11を備えるものであればよい。   For example, in the embodiment, the plurality of LEDs 11 are arranged in a matrix shape, but may be arranged in another shape such as a radial shape. Moreover, the light from the light emitter 12 is not limited to white, and can be set to a desired color using LEDs or phosphors having different emission colors. Furthermore, the mounting method of the LED 11 is not limited to the above-described embodiment, and the light emitter 12 may be any one provided with one or more LEDs 11.
また、前記実施形態では、発光体12にLED11が備えられているが、例えばEL(Electro-Luminescence)等の他の半導体発光素子が備えられていてもよい。   Moreover, in the said embodiment, although LED11 is provided in the light-emitting body 12, other semiconductor light-emitting elements, such as EL (Electro-Luminescence), may be provided, for example.
10 電球型照明装置
11 LED(半導体発光素子)
12 発光体
15 カバー部材
16 開口端部
20,20a,20b 放熱体
22,22a〜22c 発光体取付部
23,23a,23b 本体部
24,24a,24c 載置部
25,25a〜25c 延伸部
26 帯板
28 中央部
29 脚部
30 門状板部材
32 底部
33 円筒部
36 内面
10 Light Bulb Lighting Device 11 LED (Semiconductor Light Emitting Element)
12 Light Emitting Body 15 Cover Member 16 Open Ends 20, 20a, 20b Heat Dissipators 22, 22a-22c Light Emitting Mounting Parts 23, 23a, 23b Body Parts 24, 24a, 24c Mounting Parts 25, 25a-25c Extending Parts 26 Bands Plate 28 Central portion 29 Leg portion 30 Portal plate member 32 Bottom portion 33 Cylindrical portion 36 Inner surface

Claims (6)

  1. 半導体発光素子を備えた発光体と、
    前記発光体を覆うカバー部材と、
    前記カバー部材の開口端部が取り付けられると共に前記発光体で発生する熱を放出する放熱体と、を有し、
    前記放熱体からカバー部材内に延在する放熱部材を備えていることを特徴とする電球型照明装置。
    A light emitter including a semiconductor light emitting element;
    A cover member covering the light emitter;
    An opening end of the cover member is attached and a heat radiating body that emits heat generated in the light emitter, and
    A light bulb-type lighting device comprising a heat radiating member extending from the heat radiating body into a cover member.
  2. 半導体発光素子を備えた発光体と、
    前記発光体を覆うカバー部材と、
    前記カバー部材の開口端部が取り付けられると共に前記発光体で発生する熱を放出する放熱体と、
    前記カバー部材内に設けられると共に一端が前記放熱体に接続されている放熱部材と、を有することを特徴とする電球型照明装置。
    A light emitter including a semiconductor light emitting element;
    A cover member covering the light emitter;
    A heat dissipating body that attaches an opening end of the cover member and emits heat generated in the light emitter, and
    A light bulb-type lighting device comprising: a heat radiating member provided in the cover member and having one end connected to the heat radiating body.
  3. 前記放熱部材と前記発光体との間に間隙があることを特徴とする請求項1又は2に記載の電球型照明装置。   The bulb-type lighting device according to claim 1, wherein there is a gap between the heat radiating member and the light emitter.
  4. 前記放熱部材の表面に光散乱塗装材料あるいは放熱塗装材料が塗布されていることを特徴とする請求項1又は2に記載の電球型照明装置。   The light bulb-type lighting device according to claim 1, wherein a light scattering coating material or a heat radiation coating material is applied to a surface of the heat radiation member.
  5. 前記光散乱塗装材料あるいは放熱塗装材料の中に酸化チタン粒子ないしアクリル系樹脂ないしシリコーン系樹脂のいずれか又は複数が含まれていることを特徴とする請求項4に記載の電球型照明装置。   The bulb-type lighting device according to claim 4, wherein the light scattering coating material or the heat radiation coating material contains one or more of titanium oxide particles, acrylic resin, or silicone resin.
  6. 前記放熱部材の表面に導光作用を有する樹脂で形成される塗膜層を設け、前記放熱部材の端部が前記塗膜層の光出射部を構成することを特徴とする請求項1又は2に記載の電球型照明装置。   The coating film layer formed with the resin which has a light guide action is provided in the surface of the said heat radiating member, and the edge part of the said heat radiating member comprises the light-projection part of the said coating film layer. The light bulb type lighting device described in 1.
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