JP5802497B2 - Light bulb type lighting device - Google Patents

Description

  The present invention relates to a light bulb-type illumination device, and more particularly, to a light bulb-type illumination device having a light emitter including a semiconductor light emitting element such as an LED (Light Emitting Diode).

  2. Description of the Related Art In recent years, a light bulb-type illuminating device having a light emitter including a semiconductor light emitting element such as an LED has been attracting attention since it can have a longer life and energy saving than an incandescent light bulb. On the other hand, it is known that the LED has a light emitting efficiency that decreases as the temperature rises, and the lifetime is shortened, and it is necessary to release heat generated by the LED to the outside.

  For example, Patent Document 1 discloses a light bulb including a peripheral portion exposed to the outside, a light source mounting portion formed integrally with the peripheral portion, and a metal outer member having a recess formed inside the peripheral portion. A mold lamp is disclosed. In this technique, the heat of the point light source conducted to the light source mounting portion of the metal outer member is conducted to the peripheral portion of the outer member and is released to the outside from this peripheral portion.

Japanese Patent No. 4465640

  By the way, in the technique described in Patent Document 1, heat from the LED is transmitted only to a metal outer member as a heat radiating body. For this reason, there is room for improvement from the viewpoint of the heat capacity (heat transfer function) of the heat of the LED, and further improvement of the heat dissipation performance of the entire radiator is desired.

  This invention is made | formed in view of such a situation, and it aims at providing the light bulb type illuminating device which can discharge | release the heat | fever which generate | occur | produces with a light-emitting body effectively.

In order to achieve the above object, the present invention provides a light emitter including a semiconductor light emitting element, a cover member that covers the light emitter, and an open end of the cover member and heat generated by the light emitter. And a radiation heat dissipating member that extends from the heat dissipating member into the cover member, the radiation heat dissipating member being disposed in the cover member , A coating layer in which a light scattering coating material or a heat radiation coating material is applied to the surface is formed , and the light scattering coating material or the heat radiation coating material is one of titanium oxide particles, an acrylic resin, a silicone resin, or includes plurality of said radiation heat radiating member is formed on the surface of the resin used with a guiding action to the base resin of the coating layer, the light emitting portion end of the coating layer of the radiation heat radiating member And said that you configure.

Alternatively, in order to achieve the above object, the present invention generates a light emitter including a semiconductor light emitting element, a cover member that covers the light emitter, and an opening end of the cover member and is generated in the light emitter. a heat radiator for releasing heat, the possess a heat radiation member with one end provided in the cover member is connected to the radiator, and the heat radiating member is disposed away from the cover member, A coating layer formed of a resin having a light guide function is provided on the surface of the heat radiating member, and an end portion of the heat radiating member constitutes a light emitting portion of the coating layer .

  According to the present invention, a light emitting body including a semiconductor light emitting element, a cover member that covers the light emitting body, an open end of the cover member, and a heat radiator that releases heat generated by the light emitting body, It is possible to provide a light bulb-type lighting device that can effectively release heat generated in the light emitter by including the heat radiating member extending from the heat radiating member into the cover member.

  Alternatively, a light emitting body including a semiconductor light emitting element, a cover member that covers the light emitting body, an open end of the cover member, and a heat radiator that releases heat generated by the light emitting body, and in the cover member And a heat radiating member having one end connected to the heat radiating body, thereby providing a light bulb-type lighting device capable of effectively releasing heat generated by the light emitting body.

It is an external appearance front view of the lightbulb type illuminating device which concerns on embodiment of this invention. It is a disassembled perspective view of the lightbulb-type illuminating device shown by FIG. It is a longitudinal cross-sectional view of the lightbulb type illuminating device along the III-III line of FIG. It is a longitudinal cross-sectional view of the lightbulb type illuminating device which follows the IV-IV line of FIG. It is a perspective view which shows a mode that the light-emitting body attachment part in which the light-emitting body was mounted is attached to a main-body part. It is a schematic diagram for demonstrating the light distribution characteristic of an electric light bulb type illuminating device. It is a perspective view around a radiator according to an embodiment. It is a disassembled perspective view which shows the heat radiating member shown by FIG. It is a perspective view of the heat radiator which concerns on the modification of embodiment.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings as appropriate.

(Embodiment)
FIG. 1 is an external front view of a light bulb type illumination device according to an embodiment of the present invention. FIG. 2 is an exploded perspective view of the light bulb type lighting device shown in FIG. FIG. 3 is a longitudinal sectional view of the light bulb type illumination device taken along line III-III in FIG. FIG. 4 is a longitudinal sectional view of the light bulb-type lighting device taken along line IV-IV in FIG.

  As shown in FIG. 1, the bulb-type lighting device 10 according to the embodiment includes a light emitter 12 (see FIG. 2) that includes an LED 11 as a semiconductor light emitting element, a cover member 15 that covers the light emitter 12, and a cover member 15. The opening end 16 is attached, and a heat radiating body 20 that releases heat generated in the light emitting body 12 is provided.

  In addition, the light bulb-type lighting device 10 includes a base 50 for electrically connecting to a commercial power source by screwing into a socket (not shown) for a general lighting bulb installed outside the indoor ceiling or the like. 50 and an insulating ring 51 having electrical insulation disposed between the radiator 20 and the radiator 20.

  As shown in FIGS. 2 to 4, the light emitter 12 has, for example, a rectangular substrate 13, and a plurality of LEDs 11 (chips) are provided at the center of the mounting surface, which is one surface of the substrate 13, for example. It is arranged in a matrix and mounted.

  As LED11, what emits blue light is used, for example. The plurality of LEDs 11 are covered with a transparent sealing resin such as a silicone resin. In this sealing resin, a phosphor for color-converting light emitted from the LED 11 is mixed. As the fluorescent material, for example, a yellow light emitting material is used, and the blue light from the LED 11 is color-converted by the fluorescent material to become white light.

  The cover member 15 is made of a translucent resin such as milky white glass or PC (polycarbonate), and is formed in a substantially spherical shape here so as to cover the light emitter 12. The cover member 15 opens toward the heat radiating body 20, and the opening end portion 16 abuts on the cover member mounting portion 21 of the heat radiating body 20 and is fixed by an adhesive or the like.

  The cover member 15 may contain a light diffusion member that diffuses light from the light emitter 12. If comprised in this way, although the light from LED11 of the light-emitting body 12 is a thing with strong directivity, since it diffuses when it permeate | transmits the cover member 15, a light distribution characteristic becomes wide.

  The radiator 20 includes a light emitter attachment portion 22 to which the light emitter 12 is attached and a cylindrical main body portion 23 to which the light emitter attachment portion 22 is connected. Is configured separately (see FIG. 2). Here, the light emitter attachment portion 22 and the main body portion 23 are connected so as to be able to conduct heat by surface contact.

  The main body 23 is made of a material having high thermal conductivity. Examples of the material of the main body 23 include metal materials such as aluminum (including an alloy). Aluminum is preferable because it is lightweight, has high thermal conductivity, is excellent in corrosion resistance and workability, is strong, has low cost, and has a beautiful appearance. The light emitter attachment portion 22 is made of a material having a higher thermal conductivity than the main body portion 23. Examples of the material of the light emitter mounting portion 22 include metal materials such as copper and silver (including alloys).

  As a result, heat generated in the light emitter 12 is efficiently conducted to the main body portion 23 via the light emitter attachment portion 22 and is released from the outer peripheral surface 37 of the main body portion 23 to the outside air. A plurality of heat radiating fins (not shown) may be formed on the outer peripheral surface 37 of the main body 23 so as to project radially outward. Further, a heat dissipating paint for improving heat dissipation may be applied to the outer surface of the main body 23.

  The light emitter mounting portion 22 includes a mounting portion 24 on which the light emitter 12 is mounted, and an extending portion 25 that extends from the outer edge of the mounting portion 24 toward the main body portion 23 side and contacts the inner surface 36 of the main body portion 23. ing. When the extending portion 25 comes into contact with the inner surface 36 of the main body portion 23, the extending portion 25 preferably has elasticity so as to urge the inner surface 36 of the main body portion 23 with a predetermined elastic force to apply a contact pressure. In this sense, the light emitter attachment portion 22 may be formed of, for example, spring beryllium copper having spring properties.

  A power supply circuit for supplying predetermined power to the LED 11 of the light emitter 12 through a lead wire 66 (see FIG. 3, but not shown in FIG. 4) is provided inside the body portion 23 of the radiator 20 that has a cylindrical shape. A substrate 35 and a resin storage case 39 for storing the power circuit board 35 are disposed. The power supply circuit board 35 and the base 50 are connected by lead wires (not shown) for supplying commercial power to the power supply circuit board 35.

  The power supply circuit board 35 is obtained by mounting a plurality of electronic components (not shown) on the board. The power supply circuit board 35 includes, for example, a circuit that rectifies AC power from a commercial power source into DC power, a circuit that adjusts the voltage of the DC power after rectification, and the like.

  An engaging piece 40 is formed in the vicinity of the opening end of the storage case 39 on the light emitter 12 side. The storage case 39 is installed inside the main body 23 in a state where the engagement piece 40 is in contact with an engagement surface 47 corresponding to the bottom surface of the notch 46 formed in the main body 23. A base 50 is fitted to the end 41 of the storage case 39 opposite to the light emitter 12 and is fixed by an adhesive or the like.

  The power circuit board 35 housed in the housing case 39 is filled with a resin (not shown) having good thermal conductivity and high electrical insulation, and the heat generated in the power circuit board 35 is transferred to the radiator 20. The main body 23 and the base 50 can be efficiently conducted. The filling of the resin around the power circuit board 35 is performed in a state where the wiring in the main body portion 23 and the base 50 side is completed and the base 50 is attached.

  The main body portion 23 of the radiator 20 includes a base portion 42 having a cover member attachment portion 21 to which the opening end portion 16 of the cover member 15 is attached, and the light emitter 12 side of the cover member attachment portion 21 connected to the base portion 42. And a pedestal portion 43 that extends. The base portion 42 and the pedestal portion 43 are integrally formed and formed by, for example, a die casting method.

  The light emitter 12 is placed on the placement portion 24 of the light emitter attachment portion 22 via the heat transfer sheet 60. The heat transfer sheet 60 is formed of a sheet-like material having good thermal conductivity and high electrical insulation, such as silicone rubber. However, instead of the heat transfer sheet 60, grease having good thermal conductivity and high electrical insulation may be used.

  A holder 61 having a substantially rectangular frame shape is disposed so as to contact and cover the upper surface edge of the light emitter 12 placed on the placement unit 24. An opening 62 is formed in the center of the holder 61 so that the LED 11 is exposed to the outside. The holder 61 is formed of a heat-resistant and electrically insulating resin material such as PBT (polybutylene terephthalate) or PC (polycarbonate).

  On two opposite sides of the holder 61, a pair of guide portions 65 for guiding a lead wire 66 (see FIG. 3) that connects the LED 11 and the power supply circuit board 35 are formed. Further, on the other two opposite sides of the holder 61, a through hole 63 is formed through which the screw member 64 is inserted when the holder 61 is fixed to the main body portion 23.

  A lens member 70 that distributes light from the light emitter 12 in an angle range including a direction in which the light from the light emitter 12 approaches the base 50 is disposed on the side opposite to the light emitter attachment portion 22 of the light emitter 12. The lens member 70 includes an engaging portion 71, and the lens member 70 is held by the holder 61 when the engaging portion 71 is engaged with the holder 61.

  Next, a method for assembling the bulb-type lighting device 10 will be described.

  As shown in FIG. 2, the storage case 39 is fitted into the main body portion 23 from the side of the pedestal 43, and the storage case 39 is in contact with the engagement surface 47 of the radiator 20. Is mounted in the main body 23.

  Subsequently, the power supply circuit board 35 is inserted into the storage case 39 with the longitudinal direction thereof being vertical, and is engaged with an engaging portion (not shown) in the storage case 39 for storage. At this time, the tip of the lead wire 66 (see FIG. 3) connected in advance to the power circuit board 35 is drawn out from the storage case 39.

  On the other hand, an input lead wire (not shown) connected in advance to the power circuit board 35 is connected to a predetermined portion of the base 50. Then, the base 50 is fitted and attached to the end portion 41 of the storage case 39 so that the insulating ring 51 is interposed between the radiator 20 and the base 50.

  Subsequently, the light emitter attachment portion 22 on which the light emitter 12 is mounted is attached to the main body portion 23.

  FIG. 5 is a perspective view showing a state where the light emitter mounting portion on which the light emitter is mounted is attached to the main body. In FIG. 5, components such as the storage case 39 and the power supply circuit board 35 are not shown for convenience of explanation.

  As shown in FIG. 5, the light emitter mounting portion 22 on which the light emitter 12 is placed is slid in the axial direction of the main body portion 23 when the extending portion 25 of the light emitter mounting portion 22 contacts the inner surface 36 of the main body portion 23. It is inserted into the main body 23 so as to move. Here, the distal end of the extending portion 25 of the light emitter mounting portion 22 is brought into contact with the terminal end 45 (see FIG. 4) on the base 50 side of the inner surface 36 to restrict movement. In this state, the light emitter 12 is disposed substantially on the same surface as the end surface 48 (see FIG. 2) of the pedestal portion 43 or at a position separated from the end surface 48 in the extending direction of the pedestal portion 43.

  Then, the screw member 64 is inserted into the through hole 63 (see FIG. 2) of the holder 61 and screwed into the screw hole 44 formed in the end surface 48 of the pedestal portion 43 of the main body 23, whereby the light emitter 12 and the light emitter are attached. The part 22 is assembled to the main body part 23. At this time, the guide part 65 of the holder 61 is accommodated in the notch part 46 formed in the main body part 23.

  Subsequently, the lead wire 66 (see FIG. 3) drawn out from the inside of the storage case 39 is wound around the guide portion 65 of the holder 61, and the tip of the lead wire 66 is soldered to the LED 11 of the light emitter 12. Connect with a connector.

  Finally, the cover member 15 is attached to the cover member attachment portion 21 of the heat radiating body 20 so as to cover the light emitter 12, and the assembly of the bulb-type lighting device 10 is completed. However, the method for assembling the bulb-type lighting device 10 is not limited to the above-described method, and can be changed.

  Next, the light distribution characteristic of the light bulb type illumination device 10 will be described.

  FIG. 6 is a schematic diagram for explaining the light distribution characteristics of the bulb-type lighting device. As shown in FIG. 6, the main body portion 23 of the radiator 20 of the bulb-type lighting device 10 includes a base portion 42 and a base portion that is connected to the base portion 42 and extends toward the light emitter 12 with respect to the cover member mounting portion 21. 43. A lens member 70 is disposed on the LED 11 mounting surface side of the light emitter 12.

  According to such a configuration, since the light emitter 12 is disposed on substantially the same plane as the end surface 48 of the pedestal portion 43, the light emitter 12 is installed at a position entering the cover member 15 by a predetermined distance. Here, if the light emitter 12 is attached to a flat surface on substantially the same plane as the cover member attachment portion 21, the light from the light emitter 12 is blocked by the outer peripheral edge of the flat portion and the base 50. There is a problem that light is not distributed to the side. On the other hand, in the first embodiment, the light from the light emitting body 12 installed on the inner side of the cover member 15 than the cover member mounting portion 21 is suppressed from being blocked by the heat radiating body 20. For example, the light can be distributed in an angle range α of about 300 degrees including the approaching direction A.

  Moreover, since the main-body part 23 of the heat radiator 20 was provided with the base part 43 located in the inside of the cover member 15, without affecting the full length of a product (bulb-type illuminating device 10), The heat capacity can be increased by that amount. Therefore, the heat dissipation performance is improved, and the light emission efficiency of the LED can be increased.

  The lens member 70 can be omitted. In this case, the light from the light emitter 12 can be distributed to some extent in the direction approaching the base 50 by reflecting on the inner surface of the cover member 15 or diffusing when passing through the cover member 15. Further, it is possible to omit the pedestal portion 43 and extend the length L in the extending direction of the extending portion 25 of the light emitter mounting portion 22 by the height thereof.

  FIG. 7 is a perspective view of the periphery of the radiator according to the embodiment. FIG. 8 is an exploded perspective view showing the heat radiating member 80 shown in FIG.

  As shown in FIG. 7, the heat dissipating body 20a according to the embodiment includes a light emitter mounting portion 22 (see FIG. 2), a cylindrical main body portion 23a, and a heat dissipating member 80 connected to the pedestal portion 43a of the main body portion 23a. And. Here, the heat radiating member 80 extends along the extending direction of the pedestal portion 43a (vertical direction in FIG. 7), and is disposed inside the cover member 15 (see FIG. 3 and the like).

  As shown in FIG. 8, the heat radiating member 80 is composed of a pair of inverted U-shaped plate members 81 and 82. One plate member 81 has a slit 83 formed outward from the inner edge of the intermediate portion 85, and the other plate member 82 has an inner edge from the outer edge of the intermediate portion 86 inward. A slit 84 is formed. By placing the slit 83 and the slit 84 on the same straight line and bringing the plate members 81 and 82 closer to each other, the plate members 81 and 82 are fitted into the slits 84 and 83, respectively, and the heat radiating member 80 is formed. Then, the side support portions 87 and 88 of the plate members 81 and 82 are fixed by press-fitting or the like into the mounting grooves 49 formed radially at equal intervals on the outer peripheral surface of the pedestal portion 43a. In addition, since it is possible that the heat radiating member 80 will affect the light distribution from the light-emitting body 12, it is preferable that a light diffusing member is applied to the heat radiating member 80. Further, it is preferable to use a coating material that employs a filler that easily converts heat energy such as titanium oxide into electromagnetic waves on the long wavelength side after infrared rays and emits it as radiant heat. Radiant heat is also emitted from the phosphor material from the light emitter 12, and if the heat dissipation member 80 is too close to the light emitter 12, radiant heat is incident and the heat dissipation effect is reduced, which is not shown in FIG. In this case, it is preferable to secure a corresponding space even when the lens 70 is not provided. Further, this gap is preferably 2 millimeters or more. Further, in order to reduce the influence of the heat dissipation member 80 on the light distribution from the light emitter 12, a material having high light transmittance such as an acrylic resin or a silicone resin is used for the base resin of the coating on the surface of the heat dissipation member 80. It is preferable that the inside of the resin layer be easily guided and emitted from the end of the heat dissipation member 80.

  According to such an embodiment, the heat capacity of the entire product is increased without affecting the overall length of the product by connecting the heat radiating member 80 to the heat radiating body 20a inside the cover member 15 (see FIG. 3 and the like). can do. Here, a part of the heat conducted from the light emitter 12 to the pedestal 43 a of the main body 23 a can be released from the heat radiating member 80 to the outside air via the cover member 15. Therefore, the heat dissipation performance is further improved, and the light emission efficiency of the LED can be further increased.

  However, the shape of the heat dissipation member 80 is not limited to that shown in FIGS. 7 and 8. FIG. 9 is a perspective view of a radiator according to a modification of the embodiment. In the heat dissipating body 20b shown in FIG. 9, the heat dissipating member 80a according to the modification of the embodiment is composed of a plurality of plate-like parts 89 protruding outward in the radial direction from the outer surface of the pedestal part 43b of the main body part 23b. . The plate-like portion 89 has a substantially rectangular shape, and is fixed by press-fitting or the like into mounting grooves 49a that are radially formed on the outer peripheral surface of the pedestal portion 43b at equal intervals on the circumference.

  Note that the upper, lower, or radially outer edges of the plurality of plate-like portions 89 in FIG. 9 may be fixed to one ring-shaped member. In this way, the installation work of the plate-like portion 89 in the mounting groove 49a can be quickly performed. Or the some plate-shaped part 89 may be integrally formed in the heat radiator 20b at the time of manufacture of the heat radiator 20b.

  In this modification, the heat radiating member 80a is disposed between the end surface 48 of the base portion 43b and the cover member mounting portion 21 of the base portion 42 in the axial direction of the main body portion 23b. If comprised in this way, it can suppress that the heat radiating member 80a affects the light distribution from the light-emitting body 12 (refer FIG. 7).

  As mentioned above, although this invention was demonstrated based on embodiment, this invention is not limited to the structure described in the said embodiment, The combination thru | or selecting suitably the structure described in each embodiment is included. The configuration can be changed as appropriate without departing from the spirit of the invention.

  For example, in the embodiment, the plurality of LEDs 11 are arranged in a matrix shape, but may be arranged in another shape such as a radial shape. Moreover, the light from the light emitter 12 is not limited to white, and can be set to a desired color using LEDs or phosphors having different emission colors. Furthermore, the mounting method of the LED 11 is not limited to the above-described embodiment, and the light emitter 12 may be any one provided with one or more LEDs 11.

  Moreover, in the said embodiment, although LED11 is provided in the light-emitting body 12, other semiconductor light-emitting elements, such as EL (Electro-Luminescence), may be provided, for example.

10 Light Bulb Lighting Device 11 LED (Semiconductor Light Emitting Element)
12 Light Emitting Body 15 Cover Member 16 Open Ends 20, 20a, 20b Heat Dissipators 22, 22a-22c Light Emitting Mounting Parts 23, 23a, 23b Body Parts 24, 24a, 24c Mounting Parts 25, 25a-25c Extending Parts 26 Bands Plate 28 Central portion 29 Leg portion 30 Portal plate member 32 Bottom portion 33 Cylindrical portion 36 Inner surface

Claims (2)

A light emitter including a semiconductor light emitting element;
A cover member covering the light emitter;
An opening end of the cover member is attached and a heat radiating body that emits heat generated in the light emitter, and
A radiation heat radiating member extending from the heat radiating body into the cover member is provided,
The radiation heat dissipating member is disposed in the cover member,
Forming a coating layer in which a light scattering coating material or a heat radiation coating material is applied to the surface of the radiation heat radiation member,
The light scattering coating material or the heat radiation coating material contains any one or more of titanium oxide particles or acrylic resin or silicone resin,
A resin having a light guide function is used as a base resin of the coating layer formed on the surface of the radiation heat radiating member, and an end portion of the radiation heat radiating member constitutes a light emitting portion of the coating layer. A light bulb type lighting device.   The light bulb-type lighting device according to claim 1, wherein a gap is provided between the radiation heat dissipating member formed of a pair of inverted U-shaped plate members and the light emitter.