JP5081746B2 - lamp - Google Patents

Description

  The present invention relates to a lamp using a semiconductor light emitting element as a light source.

  In recent years, with the improvement of the luminous efficiency and light output of semiconductor light emitting devices, for example, LED devices, application to illumination light sources has been promoted, and incandescent bulbs, light bulb-type fluorescent lamps, compact fluorescent lamps that have been conventionally used Etc. (hereinafter referred to as “incandescent light bulbs”) is being studied (hereinafter, this lamp using an LED element is simply referred to as “lamp”) (Patent Documents 1 and 2). reference).

  For example, in a lamp intended to replace an incandescent bulb or a bulb-type fluorescent lamp, as its basic configuration, an LED module in which an LED element is mounted on a substrate, and a lighting circuit for emitting (lighting) the LED element, And an envelope that houses the LED module and the lighting circuit and includes a glass bulb and a cover, and a cap that is attached to the cover and connected to the lighting device side.

When trying to secure the luminous flux equivalent to that of an incandescent light bulb with the lamp having the above configuration, the input power to the LED element becomes large, the temperature of the LED element at the time of lighting becomes excessively high, and the heat of the LED element is dissipated. A heat sink is required.
If the temperature of the LED element is excessively increased, the luminous efficiency of the LED element is lowered. If the input power to the LED element is further increased to compensate for the reduced amount, the temperature of the LED element further increases, and the bulb There is a risk of cracking due to thermal shrinkage.
JP 2001-243807 A JP 2008-123737 A

As described above, a lamp that requires a large amount of input power to the LED element and requires a heat sink has a large heat sink for dissipating heat from the LED element during lighting, and thus the lamp itself becomes large. There arises a problem that it cannot be applied to a conventional lighting device that has been used by mounting.
The present invention has been made in view of the above problems, and provides a lamp capable of efficiently releasing heat from a semiconductor light emitting element such as an LED element as a light source to reduce the overall size. With the goal.

  To achieve the above object, a lamp according to the present invention includes a heat sink, a substrate mounted on the heat sink, a semiconductor light emitting device mounted on the main surface of the substrate opposite to the heat sink, and the heat sink. And a bulb made of glass covering the substrate including the semiconductor light emitting element, and the inner surface of the bulb is made of a translucent material having a thermal conductivity higher than the thermal conductivity of the bulb. A light-transmitting layer is formed, and a part of the light-transmitting layer is interposed through a heat transfer portion made of a heat transfer material having a thermal conductivity equal to or higher than that of the light-transmitting layer. It is characterized by being connected to a heat sink.

Since the lamp | ramp which concerns on this invention can escape efficiently the heat | fever emitted from a semiconductor light-emitting device, it can suppress the luminous efficiency fall by the heat | fever of a semiconductor light-emitting device, and can make the volume of a heat sink small.
In addition, the heat transfer portion has a ring shape, and a portion of the translucent layer formed in the peripheral portion of the opening of the valve is in contact with the ring-shaped heat transfer portion over substantially the entire circumference. Alternatively, the heat transfer portion has a ring shape, and a portion of the light transmissive layer formed in the peripheral portion of the opening of the bulb is substantially between the ring heat transfer portion and the heat sink. It is characterized by contact over the entire circumference.

Further, the translucent material is characterized by comprising a metal oxide and a silicone resin, or the thermal emissivity of the material of the valve is in the range of 0.8 to 1.0. Yes.
Further, the thermal conductivity of the bulb is in the range of 0.1 W / m · K or more and 1.0 W / m · K or less, and the thermal conductivity of the translucent layer is 2.0 W / m · K or more. , 200 W / m · K or less, or the inside of the bulb is in an airtight state, and further, the bulb and the heat sink have the light-transmitting property. It is characterized by being fixed by the material.

  Further, the outer layer surface of the bulb is satin, or the thickness of the translucent layer is in the range of 10 μm or more and 300 μm or less.

<First Embodiment>
Hereinafter, an example of the lamp according to the first embodiment of the present invention will be described with reference to the drawings.
1. Structure (1) Overall FIG. 1 is an overall view of the lamp 1 according to the first embodiment, in which a part of a bulb or the like is cut away so that the inside can be seen.

A lamp 1 according to the present embodiment is a lamp intended to replace an incandescent bulb, and includes an LED module 3 on which a plurality of LED elements are mounted, a heat sink 5 on which the LED module 3 is mounted, and an LED element. A lighting circuit 7 that emits light (lights), a glass bulb 9 that covers the LED module 3 mounted on the heat sink 5, a cover 11 that is mounted on the heat sink 5, and the lighting circuit 7 that is mounted on the cover 11 and the lighting circuit 7 A light-transmitting layer 35 is formed on the entire inner peripheral surface of the bulb 9, and a part 35a of the light-transmitting layer 35 is directly connected to the heat sink. And connected to the heat sink 5 via the heat transfer section 37.
(2) LED Module The LED module 3 is formed by mounting a plurality of LED elements, in this example, 36 LED elements, on the substrate 15 in a matrix of 6 rows and 6 columns, for example. Here, the symbol of the LED element is “Dnm”, “n” of Dnm indicates the number of rows, and “m” indicates the number of columns, both of which are integers of 1 to 6, When it is not necessary to specify the position and the like, “Dnm” is used as the symbol of the LED element.

FIG. 2 is a cross-sectional view of the LED module at a portion where the LED elements in the n-th row are arranged in a column.
As shown in the figure, the LED module 3 includes a substrate 15, an LED element Dnm, and a sealing body 17 that seals the LED element.
The substrate 15 has, for example, a square shape in plan view, and wiring patterns 19a and 19b that are electrically connected to the LED elements Dnm mounted in the regions are formed in the mounting region of the LED elements Dnm.

As shown in FIG. 2, the substrate 15 here has a two-layer structure of an insulating layer 21 and a metal layer 23, and the wiring patterns 19 a and 19 b are formed on the main surface of the insulating layer 21. The wiring patterns 19a and 19b are formed such that all 36 LED elements Dnm are connected in series, for example.
The LED element Dnm is, for example, a single-sided electrode type having both electrodes of a P-type electrode and an N-type electrode on the upper surface, bonded to a predetermined location in the mounting region of the substrate 15, and as shown in the enlarged view of FIG. Gold wires 25a and 25b are connected to the wiring patterns 19a and 19b. In addition, the wiring patterns 19a and 19b are electrically connected to the lighting circuit 7 by conducting wires (not shown).

As shown in FIGS. 1 and 2, the sealing body 17 covers 36 LED elements Dnm with a resin (for example, a silicone resin), and the shape in plan view has a square shape like the shape of the substrate 15. doing. In the resin constituting the encapsulant 17, phosphor particles that convert light from the LED element Dnm into a desired light color are mixed. In addition, although silicone resin is used for resin of a sealing body, other resin may be used, for example, resin, such as a polyimide, an epoxy, and a fluororesin, can be utilized.
(3) Heat Sink As shown in FIG. 1, the heat sink 5 has a frustoconical shape having end faces 5a and 5b parallel to each other, and the LED module 3 has a surface of the metal layer 23 (an insulating layer in the metal layer). Is attached to the end surface 5a via known attachment means (for example, an adhesive, a screw, etc.) in a state of being in close contact with the end surface 5a.
(4) Cover, Base, and Lighting Circuit As shown in FIG. 1, the cover 11 is attached to the end surface 5 b on the small diameter side of the heat sink 5 via known attachment means (for example, an adhesive, a screw, etc.). The base 13 is attached to the cover 11. A lighting circuit 7 to be described later is stored inside the cover 11 and the base 13.

  The lighting circuit 7 has a plurality of electronic components 27, 29, 31, and the like mounted on the substrate 33, and the substrate 33 is attached to the cover 11 by, for example, locking means and fixing means, and is covered by the base 13. It has been broken. The lighting circuit 7 is a known circuit that causes the LED element Dnm to emit light using a commercial power source. For example, a rectifier circuit that rectifies AC power supplied from the commercial power source into DC power, and is rectified by the rectifier circuit. A voltage adjusting circuit for adjusting the voltage value of the DC power.

The substrate 33 is attached to the cover 11 using, for example, a locking unit, a fixing unit, or the like.
As the base 13, for example, E26 which is E-shaped (so-called Edison type) is used, and is connected to the lighting circuit 7 through a lead wire (not shown).
(5) Valve The valve 9 is made of a glass material, for example, hemispherical, and the end surface of the valve 9 is attached to the heat sink 5 in an airtight state using the same material as the light-transmitting layer 35. Yes.

The inside of the valve 9 may be in a negative pressure state (vacuum state) or may be filled with an inert gas (for example, nitrogen). By making the inside of the bulb 9 an airtight body, it is possible to prevent the resin (silicone resin) and phosphor particles constituting the sealing body 17 from being deteriorated by oxidation.
As shown in FIG. 1, a translucent layer 35 made of a translucent material having a thermal conductivity higher than that of the bulb 9 is formed on the entire inner peripheral surface of the bulb 9. ing.

A part 35 a of the translucent layer 35, here, an end surface is directly connected to the heat sink 5, and an inner peripheral surface is connected to the heat sink 5 via the heat transfer portion 37. The heat transfer part 37 is made of a heat transfer material having a thermal conductivity higher than that of the bulb 9 and is fixed to the heat sink 5 by a fixing means (for example, an adhesive).
The translucent layer 35 is composed of a silicone resin and a metal oxide dispersed in the resin. The metal oxide is, for example, at least one of aluminum oxide (alumina) and titanium oxide. The weight ratio between the silicone resin and the metal oxide will be described later.
2. Manufacturing Method A forming method for forming the translucent layer 35 on the lamp 1 having the above-described configuration, in particular, the inner peripheral surface 9a of the bulb 9 will be described. Here, an example in which alumina is used as the metal oxide will be described.

FIG. 3 is a diagram for explaining a method of forming the translucent layer 35.
First, a glass bulb 51 and a forming resin 53 in which alumina and a silicone resin are mixed are prepared. Then, the valve 51 is arranged so that the opening is on the upper side, and the forming resin 53 is caused to flow into the valve 51 from the opening of the valve 51 (step 1).
Next, the forming resin 53 is applied to substantially the entire inner peripheral surface 51 a of the valve 51. As a coating method, for example, the valve 51 is rotated or swung (step 2). When application of the forming resin 53 to the inner peripheral surface 51a is completed, the valve 51 to which the forming resin 53 is applied is heated to cure the forming resin 53.

Thereby, the translucent layer based on this invention can be shape | molded in a valve | bulb. The thickness and the like of the translucent layer can be adjusted by the viscosity of the forming resin, the temperature of the valve when the forming resin is applied, the number of times of application, and the like.
3. Heat Dissipation State FIG. 4 is a diagram showing a heat dissipation state when the lamp 1 is turned on.

First, when the lamp 1 is turned on, light emitted from the LED element Dnm in the LED module 3 is desired by the phosphor particles in the sealing body 17 when passing through the sealing body 17 in the same LED module 3. Is emitted from the lamp 1 through the light-transmitting layer 35 and the bulb 9.
The heat at the time of light emission of the LED element Dnm is transmitted from the substrate 15 to the heat sink 5, the temperature of the heat sink 5 rises, and as shown in FIG. 4, by natural air cooling due to contact between the heat sink 5 and the outside air, and the surface layer of the heat sink 5 It is dissipated by the heat radiation from.

The heat of the heat sink 5 is also transmitted to the valve 9, the temperature of the valve 9 rises, and as shown in FIG. 4, by natural air cooling due to contact between the valve 9 and the outside air, and heat from the surface of the valve 9 Heat is dissipated by radiation.
Further, in the lamp 1 according to the present embodiment, a light transmissive layer 35 is formed in the bulb 9. Since the translucent layer 35 has a higher thermal conductivity than the glass bulb 9, the amount of heat transferred from the heat sink 5 to the translucent layer 35 is larger than the amount of heat transferred from the heat sink 5 to the bulb 9. As a result, heat transferred from the heat sink 5 to the valve 9 via the light-transmitting layer 35 is added, and as a result, the amount of heat transferred from the heat sink 5 to the valve 9 increases.

As described above, the heat transmitted to the valve 9 is radiated by natural air cooling due to contact between the valve 9 and the outside air and by heat radiation from the surface layer of the valve 9.
4). Example An example of the lamp 1 having the above-described configuration will be described.
The lamp 1 according to the example is an incandescent bulb equivalent to the 40 (W) type, and the luminous flux is 450 (lm).

The substrate 15 uses an insulating white resist as the insulating layer 21 and an aluminum plate as the metal layer 23, and has a square shape with a side of 25 (mm) in plan view. The thickness of the insulating layer 21 is 0.1 (mm), and the thickness of the metal layer 23 is 1.0 (mm).
The wiring patterns 19a and 19b formed on the main surface of the insulating layer 21 have a predetermined pattern by etching a copper foil of about 10 (μm), for example.

The LED element Dnm is, for example, a square with a bottom of 1.0 (mm) × 1.0 (mm), a substantially rectangular parallelepiped shape with a height of 0.2 (mm), and an InGaN-based light emitting color. Is used. The pitch between the LED elements Dnm arranged in the row direction and the column direction (the distance between the centers of the LED elements Dnm) is approximately 3.0 (mm).
The sealing body 17 is made of a resin material and a phosphor material. For example, a silicone resin is used as the resin material, and a phosphor material that emits yellow light is used as the phosphor material. Thereby, the blue light emitted from the LED element Dnm is color-converted by the phosphor, and white light is emitted from the lamp 1 by these.

The heat sink 5 is made of aluminum, has an outer diameter on the large diameter portion side of 36 (mm), an outer diameter on the small diameter portion side of 25 (mm), and a height (length in the lamp axis direction) of 20 (mm). It is.
The cover 11 is made of resin, for example, is made of PES resin, and a base 13 of E26 is attached.
The bulb 9 is made of hard glass and has a hemispherical shape (dome shape) having an outer diameter of about 40 (mm) and a height of 21 (mm). The thermal conductivity is 1 (W / m · K). is there. The translucent layer 35 has a composition ratio (weight ratio) between the silicone resin and alumina of 50:50, and a thermal conductivity of 50 (W / m · K). When the weight ratio of the silicone resin to alumina is 50 (wt%), the silicone resin alone (no alumina mixed therein) is transmitted through the translucent layer and the bulb. The amount of light (translucency) decreases by about 5 (%).

The thickness of the bulb 9 is 1.5 (mm), and the thickness of the translucent layer 35 is 150 (μm). The valve 9 is fixed to the heat sink with a silicone resin.
As in the translucent layer 35, the heat transfer portion 37 has a composition ratio (weight ratio) between the silicone resin and alumina of 50:50 and a thermal conductivity of 50 (W / m · K). . The height of the heat transfer portion (the dimension in the direction perpendicular to the end surface 5a of the heat sink 5 as a reference) is 0.5 (mm), which is lower than the height of the substrate 15.

As shown in FIG. 1, the lamp 1 has a maximum outer diameter D of 40 (mm) and a total length H of 70 (mm). This size is substantially the same size as the incandescent bulb 40 (W) type.
In the lamp 1 of the above embodiment, the junction temperature of the LED element Dnm at the time of lighting is 90 (° C.). On the other hand, in a lamp that does not include a translucent layer and a heat transfer portion, the junction temperature of the LED element Dnm at the time of lighting becomes 100 (° C.), and the LED element is provided by including the translucent layer and the heat transfer portion. The junction temperature of Dnm can be lowered by about 10 (° C.). In other words, by providing the light-transmitting layer and the heat transfer section, the heat dissipation performance as a lamp can be improved, and the heat sink can be reduced accordingly, and the lamp can be downsized as a result. .
<Second Embodiment>
In the first embodiment, the valve 9 is attached to the heat sink 5 with the peripheral edge of the opening being in contact with the heat sink 5. However, the valve may be attached to the heat sink by other methods. The second embodiment will be described below. Note that members and the like having the same configurations as those in the first embodiment use the same reference numerals used in the first embodiment.

FIG. 5 is an overall view of the lamp 101 according to the second embodiment, and a part of a bulb or the like is cut away so that the inside can be seen.
As shown in FIG. 5, the lamp 101 is mounted on the LED module 3, the heat sink 103 on which the LED module 3 is mounted, the lighting circuit 7 that emits the LED element Dnm in the LED module 3, and the heat sink 103. A glass bulb 105 covering the LED module 3, a cover 11 attached to the heat sink 103, and a base 13 attached to the cover 11 and electrically connected to the lighting circuit 7. Similar to the first embodiment, a light-transmitting layer 107 is formed on the inner surface, and a part 107 a of the light-transmitting layer 107 is directly connected to the heat sink 103 via the heat transfer portion 109. .

The bulb 105 has a hemispherical shape and opens on a surface that is substantially perpendicular to the central axis of the lamp (vertical direction in FIG. 5).
The heat transfer portion 109 is projected on one end surface 103a of the heat sink 103, and its outer peripheral surface is close to the inner peripheral surface of the opening portion of the bulb 105, and has a ring shape whose central axis coincides with the central axis of the lamp. Yes. The outer peripheral surface of the heat transfer unit 109 is an inclined surface that approaches the lamp center as it approaches the end surface 103 a of the heat sink 103.

  The translucent layer 107 is formed on the entire inner surface of the bulb 105, and corresponds to an opening end portion corresponding to the opening of the bulb 105 (in the “translucent layer, the portion around the opening of the bulb in the present invention”). Is a direction parallel to the center axis of the lamp from the opening end of the bulb 105 and projects toward the base 13 side, and the outside / inside thereof (perpendicular to the center axis of the lamp). Projecting outward and inward in the direction).

That is, the opening end portion is an outward projecting portion 107a that projects outward (on a side perpendicular to the central axis of the lamp and away from the central axis) on the bulb 105 side, and the center of the lamp 101. And an inward projecting portion 107b projecting inward (in a direction perpendicular to the central axis of the lamp and close to the central axis) on the shaft side.
The outer peripheral surface of the portion protruding outward of the outward projecting portion 107 a is located between the outer peripheral surface of the end portion of the valve 105 and the outer peripheral surface of the heat sink 103, and the outer peripheral surface of the end portion of the valve 105 and the heat sink 103. (The outer peripheral surface of the end portion of the bulb 105, the outer peripheral surface of the outward projecting portion 107a, and the outer peripheral surface of the heat sink 103 have a continuous curved surface). .

  The inner peripheral surface of the portion protruding inward of the inward protruding portion 107 b corresponds to the outer peripheral surface (inclined surface) of the heat transfer portion 109 and approaches the center of the lamp as it approaches the end surface 103 a of the heat sink 103. It is an inclined surface. As a result, when the bulb 105 (including the translucent layer) is attached to the heat sink 103, the inward protruding portion 107b is locked to the heat transfer portion 109, and the bulb 9 is indirectly attached to the heat sink 103. .

As described above, in the state where the bulb 105 is mounted on the heat sink 103, the contact area between the translucent layer 107 and the heat sink 103 can be increased. From the LED element Dnm at the time of lighting, the substrate 15, the heat sink 103, The amount of heat transferred to the translucent layer 107 and the bulb 105 can be increased.
Further, by making the inner peripheral surface of the portion protruding inward of the inward protruding portion 107b into an inclined surface, the contact area with the heat transfer portion 109 can be increased, and the light transmission from the heat transfer portion 109 can be increased. The amount of heat transferred to the layer 107 can be increased.

In the present embodiment, as shown in FIG. 5, the heat sink 103 includes a large number of fins 103c, which improves heat dissipation compared to the first embodiment, and has a hollow portion 103b inside. Therefore, the weight of the lamp 101 is reduced.
<Modification>
1. Light Emitting Light Source In the first embodiment, a plurality (36) of LED elements Dnm are sealed by one sealing body 17, but one LED element Dnm is sealed by one sealing body. A structure for sealing may be used.

  Furthermore, although the plurality of LED elements Dnm in the embodiment are arranged in a positive matrix shape, they may be arranged in other shapes, for example, arranged on a plurality of concentric circles having the same center and different radii. You may be made to do. Moreover, about LED elements, you may use LED elements other than having demonstrated in the Example, and you may make it emit a desired light color using the LED element and fluorescent substance particle from which luminescent color differs.

Further, in addition to the LED element, for example, a laser diode (LD) may be used.
2. Heat Transfer Part In the first embodiment, the heat transfer part 37 is provided on the large-diameter end face 5a of the heat sink 5 in a ring shape so as to protrude from the end face 5a, and the heat transfer part 37 is translucent. Although the layer 35 is connected (contacted), it may be connected in other forms, and will be described as a modified example below.
(1) Modification 1
FIG. 6A is a cross-sectional view showing a part of the lamp according to the first modification.

The lamp 151 according to Modification 1 is provided in a ring shape on the heat sink 153 so that the outer peripheral surface 153a of the heat sink 153 and the outer peripheral surface 155a of the heat transfer unit 155 are substantially flush with each other. A valve 157 is coupled via an adhesive.
The translucent layer 159 projects from the peripheral edge of the bulb 157 toward the lamp axis and toward the base (downward in the figure), and the outer peripheral surface of the projecting portion 159a has a ring shape. Connect to the inner peripheral surface of the heat transfer section 155.

That is, here, the outer peripheral surface of the portion formed in the periphery of the opening of the bulb 157 in the light transmitting layer 159 is in contact with the ring-shaped heat transfer portion 155 over substantially the entire periphery, and the light transmitting layer An end surface of a portion formed around the opening of the valve 157 in 159 is in contact with the heat sink 153 over substantially the entire circumference.
(2) Modification 2
FIG. 6B is a cross-sectional view illustrating a part of the lamp according to the second modification.

In the lamp 161 according to the second modification, the one end surface 163a of the heat sink 163 and the one end surface of the heat transfer portion 165 (the upper surface in FIG. 6B) are substantially flush with the heat sink 163. It is buried in a ring shape.
The translucent layer 169 is formed over the entire inner peripheral surface of the bulb 167. The outer peripheral surface of the heat transfer section 165 is an inclined surface that approaches the lamp axis in the direction of the center axis of the lamp and moves toward the base. Further, in the peripheral portion of the opening of the bulb 167, the shape is closer to the center axis of the lamp as it moves toward the base side of the lamp (the opening diameter becomes smaller as it moves toward the base side). Yes.

  The bulb 167 formed with the light-transmitting layer 169 is attached to the heat sink 163 by aligning the opening end of the bulb 167 with the outer peripheral surface of the heat transfer portion 165 and further along the central axis of the lamp. Is pressed to the heat sink 163 side (or the heat sink 163 is pressed to the valve side). At the time of this pressing, the translucent layer 169 formed in the bulb 167 is deformed, and as a result, the bulb 167 is fitted on the outer periphery of the heat transfer section 165. Thereby, the translucent layer 169 and the heat transfer part 165 are connected, and the valve 167 is attached to the heat sink 163.

That is, the inner peripheral surface of the portion formed around the opening of the bulb 167 in the light transmissive layer 169 is in contact with the ring-shaped heat transfer portion 165 over substantially the entire circumference, and in the light transmissive layer 169. The end surface of the portion formed in the peripheral portion of the opening of the bulb 167 is in contact with the heat sink 163 over substantially the entire circumference.
(3) Modification 3
The heat transfer part in the embodiment and the modification has a ring shape continuous in the circumferential direction and is connected to the light transmissive layer over the entire circumference. The connection need not be made over the entire circumference of the periphery of the opening of the valve. For example, the connection may be made at a plurality of locations at intervals in the circumferential direction.
3. In the valve examples, hard glass was used as the material of the valve and its thermal conductivity was 1 (W / m · K). However, materials other than the hard glass can be used as the material of the valve. Thus, when using a glass material for the bulb, the thermal conductivity is preferably in the range of 0.1 (W / m · K) to 1 (W / m · K). This is to ensure that heat is sufficiently transferred to the glass itself.

The material of the valve is preferably a material having a thermal emissivity in the range of 0.8 to 1.0. This is to efficiently release the heat transferred to the glass.
Although the surface of the bulb is satin, the light diffusing effect can be obtained by including a metal oxide in the translucent layer. It is done.
4). Translucent material and heat transfer material The thickness of the translucent layer is preferably in the range of 10 (μm) to 300 (μm). This is because if the film thickness is thin, the effect of heat dissipation is small, and if the film thickness is thick, the effect of heat dissipation is improved, but the light transmittance decreases and the light extraction decreases.
5. Lamp The lamp 1 in the first embodiment is a lamp intended to replace an incandescent bulb, and a lighting circuit and a screw type (Edison type) so that the lamp 1 can be applied to an appliance used with the incandescent bulb. Was equipped with a base. The lamp according to the present embodiment can be used as an alternative to a so-called bulb-type fluorescent lamp that is used as an alternative to an incandescent bulb.

However, the lamp according to the present invention can be applied not only to the purpose of replacing incandescent bulbs and bulb-type fluorescent lamps, but also to lamps that are used as substitutes for so-called compact fluorescent lamps that do not include a lighting circuit. Hereinafter, this lamp will be described as a fourth modification.
FIG. 7 is an overall view of a lamp according to Modification 4.
The lamp 171 includes an LED module 3, a heat sink 5 on which the LED module 3 is mounted, a glass bulb 9 covering the LED module 3 mounted on the heat sink 5, and a base 173 mounted on the heat sink 5. As in the first embodiment, a light-transmitting layer 35 is formed on the inner surface of the bulb 9, and a part of the light-transmitting layer 35 is connected to the heat sink 5 via the heat transfer portion 137. Has been.

The base 173 is a so-called single base (for example, GX10q type) that is fitted into a socket on the apparatus side and receives power supply, and includes base pins 175 and 175.
6). Others The present invention has been variously described in the embodiments and modifications. However, the configuration described in each embodiment may be applied (added or diverted) to other embodiments or other modifications. The configuration described in the modification may be applied (added or diverted) to other embodiments or other modifications.

  INDUSTRIAL APPLICABILITY The present invention can be used to improve heat dissipation characteristics in a lamp that uses a semiconductor light emitting element as a light source and includes a heat sink for heat dissipation.

1 is an overall view of a lamp according to a first embodiment, and a part of a bulb or the like is cut away so that an internal state can be seen. It is sectional drawing of the LED module in the part by which the LED element of the n-th row was arranged in the column form. It is a figure explaining the shaping | molding method of a translucent layer. It is a figure which shows the thermal radiation state at the time of making a lamp light. It is a general view of the lamp | ramp which concerns on 2nd Embodiment, and some parts, such as a valve | bulb, are notched so that the inside state may be understood. (A) is sectional drawing which shows a part of lamp | ramp which concerns on the modification 1, (b) is sectional drawing which shows a part of lamp | ramp which concerns on the modification 2. FIG. FIG. 10 is an overall view of a lamp according to modification example 4;

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Lamp 3 LED module 5 Heat sink 7 Lighting circuit 9 Bulb 11 Cover 13 Base 35 Translucent layer 37 Heat-transfer part Dnm LED element

Claims (10)

A heat sink,
A substrate mounted on the heat sink;
A semiconductor light emitting device mounted on the main surface opposite to the heat sink in the substrate;
A glass bulb mounted on the heat sink and covering the substrate including the semiconductor light emitting element;
On the inner surface of the bulb, a translucent layer made of a translucent material having a thermal conductivity higher than that of the bulb is formed,
A part of the translucent layer is connected to the heat sink via a heat transfer part made of a heat transfer material having a thermal conductivity equal to or higher than that of the translucent layer. Features a lamp. The heat transfer part has a ring shape,
The lamp | ramp of Claim 1 with which the part currently formed in the opening peripheral part of the said bulb | bulb in the said translucent layer is contacting the said ring-shaped heat-transfer part over the perimeter. . The heat transfer part has a ring shape,
The part formed in the opening peripheral part of the said valve | bulb in the said translucent layer is contacting the said ring-shaped heat-transfer part and the said heat sink over the perimeter. Lamp described in. The said translucent material consists of a metal oxide and a silicone resin. The lamp | ramp of any one of Claims 1-3 characterized by the above-mentioned. The lamp according to any one of claims 1 to 4, wherein the heat emissivity of the material of the bulb is in the range of 0.8 to 1.0. The bulb has a thermal conductivity in the range of 0.1 W / m · K to 1.0 W / m · K, and the translucent layer has a thermal conductivity of 2.0 W / m · K to 200 W. It is in the range below / m * K. The lamp | ramp in any one of Claims 1-5 characterized by the above-mentioned. The lamp according to any one of claims 1 to 6, wherein the inside of the bulb is in an airtight state. The lamp according to any one of claims 1 to 7, wherein the bulb and the heat sink are fixed by the translucent material. The lamp according to any one of claims 1 to 8, wherein the outer surface of the bulb is satin. The lamp according to claim 1, wherein the translucent layer has a thickness in the range of 10 μm to 300 μm.

Images