US9234655B2 - Lamp with remote LED light source and heat dissipating elements - Google Patents

Lamp with remote LED light source and heat dissipating elements Download PDF

Info

Publication number
US9234655B2
US9234655B2 US13607300 US201213607300A US9234655B2 US 9234655 B2 US9234655 B2 US 9234655B2 US 13607300 US13607300 US 13607300 US 201213607300 A US201213607300 A US 201213607300A US 9234655 B2 US9234655 B2 US 9234655B2
Authority
US
Grant status
Grant
Patent type
Prior art keywords
heat
lamp
light
leds
led
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active, expires
Application number
US13607300
Other versions
US20130113358A1 (en )
Inventor
Curt Progl
Praneet Athalye
Gerald Negley
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Cree Inc
Original Assignee
Cree Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Grant date

Links

Images

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/002Cooling arrangements
    • F21V29/004Natural cooling, i.e. by natural convection, conduction or radiation
    • F21K9/135
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/23Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V15/00Protecting lighting devices from damage
    • F21V15/02Cages
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/002Cooling arrangements
    • F21V29/006Cooling devices or systems using condensation or evaporation of a fluid, e.g. heat pipes or two phase cooling systems
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/502Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/505Cooling arrangements characterised by the adaptation for cooling of specific components of reflectors
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/51Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/86Ceramics or glass
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/87Organic material, e.g. filled polymer composites; Thermo-conductive additives or coatings therefor
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89Metals
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00Globes; Bowls; Cover glasses
    • F21V3/04Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/502Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/506Cooling arrangements characterised by the adaptation for cooling of specific components of globes, bowls or cover glasses
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/56Cooling arrangements using liquid coolants
    • F21V29/58Cooling arrangements using liquid coolants characterised by the coolants
    • F21Y2101/02
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

Abstract

LED based lamps and bulbs are disclosed that comprise an elevating element to arrange LEDs above the lamp or bulb base. The elevating element can at least partially comprise a thermally conductive material. A heat sink structure is included, with the elevating element thermally coupled to the heat sink structure. A diffuser can be arranged in relation to the LEDs so at least some light from the LEDs passes through the diffuser and is dispersed into the desired emission pattern. Some lamps and bulbs utilize a heat pipe for the elevating elements, with heat from the LEDs conducting through the heat pipe to the heat sink structure where it can dissipate in the ambient. The LED lamps can include other features to aid in thermal management and to produce the desired emission pattern, such as internal optically transmissive and thermally conductive materials, and heat sinks with different heat fin arrangements.

Description

This application is a continuation in part of and claims the benefit of U.S. patent application Ser. No. 13/022,142, filed on Feb. 7, 2011, and is also a continuation-in-part of and claims the benefit of U.S. patent application Ser. No. 13/358,901, filed on Jan. 16, 2012.

BACKGROUND OF THE INVENTION

1. Field of the Invention

This invention relates to solid state lamps and bulbs and in particular to light emitting diode (LED) based lamps and bulbs capable of providing omnidirectional emission patterns similar to those of filament based light sources.

2. Description of the Related Art

Light emitting diodes (LED or LEDs) are solid state devices that convert electric energy to light, and generally comprise one or more active layers of semiconductor material sandwiched between oppositely doped layers. When a bias is applied across the doped layers, holes and electrons are injected into the active layer where they recombine to generate light. Light is emitted from the active layer and from all surfaces of the LED.

In order to use an LED chip in a circuit or other like arrangement, it is known to enclose an LED chip in a package to provide environmental and/or mechanical protection, color selection, light focusing and the like. An LED package also includes electrical leads, contacts or traces for electrically connecting the LED package to an external circuit. In a typical LED package 10 illustrated in FIG. 1, a single LED chip 12 is mounted on a reflective cup 13 by means of a solder bond or conductive epoxy. One or more wire bonds 11 connect the ohmic contacts of the LED chip 12 to leads 15A and/or 15B, which may be attached to or integral with the reflective cup 13. The reflective cup 13 may be filled with an encapsulant material 16 which may contain a wavelength conversion material such as a phosphor. Light emitted by the LED at a first wavelength may be absorbed by the phosphor, which may responsively emit light at a second wavelength. The entire assembly is then encapsulated in a clear protective resin 14, which may be molded in the shape of a lens to collimate the light emitted from the LED chip 12. While the reflective cup 13 may direct light in an upward direction, optical losses may occur when the light is reflected (i.e. some light may be absorbed by the reflector cup due to the less than 100% reflectivity of practical reflector surfaces). In addition, heat retention may be an issue for a package such as the package 10 shown in FIG. 1, since it may be difficult to extract heat through the leads 15A, 15B.

A conventional LED package 20 illustrated in FIG. 2 may be more suited for high power operations which may generate more heat. In the LED package 20, one or more LED chips 22 are mounted onto a carrier such as a printed circuit board (PCB) carrier, substrate or submount 23. A metal reflector 24 mounted on the submount 23 surrounds the LED chip(s) 22 and reflects light emitted by the LED chips 22 away from the package 20. The reflector 24 also provides mechanical protection to the LED chips 22. One or more wirebond connections 11 are made between ohmic contacts on the LED chips 22 and electrical traces 25A, 25B on the submount 23. The mounted LED chips 22 are then covered with an encapsulant 26, which may provide environmental and mechanical protection to the chips while also acting as a lens. The metal reflector 24 is typically attached to the carrier by means of a solder or epoxy bond.

LED chips, such as those found in the LED package 20 of FIG. 2 can be coated by conversion material comprising one or more phosphors, with the phosphors absorbing at least some of the LED light. The LED chip can emit a different wavelength of light such that it emits a combination of light from the LED and the phosphor. The LED chip(s) can be coated with a phosphor using many different methods, with one suitable method being described in U.S. patent application Ser. Nos. 11/656,759 and 11/899,790, both to Chitnis et al. and both entitled “Wafer Level Phosphor Coating Method and Devices Fabricated Utilizing Method”. Alternatively, the LEDs can be coated using other methods such as electrophoretic deposition (EPD), with a suitable EPD method described in U.S. patent application Ser. No. 11/473,089 to Tarsa et al. entitled “Close Loop Electrophoretic Deposition of Semiconductor Devices”.

Lamps have been developed utilizing solid state light sources, such as LEDs, with a conversion material that is separated from or remote to the LEDs. Such arrangements are disclosed in U.S. Pat. No. 6,350,041 to Tarsa et al., entitled “High Output Radial Dispersing Lamp Using a Solid State Light Source.” The lamps described in this patent can comprise a solid state light source that transmits light through a separator to a disperser having a phosphor. The disperser can disperse the light in a desired pattern and/or changes its color by converting at least some of the light through a phosphor. In some embodiments, the separator spaces the light source a sufficient distance from the disperser such that heat from the light source will not transfer to the disperser when the light source is carrying elevated currents necessary for room illumination.

Different LED based bulbs have been developed that utilize large numbers of low brightness LEDs (e.g. 5 mm LEDs) mounted to a three-dimensional surface to achieve wide-angle illumination. These designs, however, do not provide optimized omnidirectional emission that falls within standard uniformity requirements. These bulbs also contain a large number of interconnected LEDs making them prohibitively complex, expensive and unreliable. This makes these LED bulbs generally impractical for most illumination purposes.

Other LED bulbs have also been developed that use a mesa-type design for the light source with one LED on the top surface and seven more on the sidewalls of the mesa. (see GeoBulb®-II provided by C. Crane). This arrangement, however, does not provide omnidirectional emission patterns, but instead provides a pattern that is substantially forward biased. The mesa for this bulb also comprises a hollow shell, which can limit its ability to thermally dissipate heat from the emitters. This can limit the drive current that can be applied to the LEDs. This design is also relatively complex, using several LEDs, and not compatible with large volume manufacturing of low-cost LED bulbs.

SUMMARY OF THE INVENTION

The present invention provides various embodiments of solid state lamps and bulbs that are efficient, reliable and cost effective and can be arranged to provide omnidirectional emission patterns. The different embodiments comprise elements to elevate the solid state light source(s) above the lamp base, with the elevating element also being thermally conductive to conduct heat from the light source to the lamp base. The elevating element can comprise many different materials or devices arranged in different ways, with some lamps comprising heat pipe elevating elements. The LED lamps according to the present invention can also include other features to aid in thermal management and to produce the desired emission pattern, such as internal optically transmissive materials and heat sinks with different heat fin arrangements.

One embodiment of a solid state lamp according to the present invention comprises a solid state light source and a lamp base at least partially comprising a heat conductive material. An elongated elevating element is mounted to the lamp with the light source mounted to the elevating element such that the solid state light source is above the lamp base. The elevating element can be made of a material that is at least partially heat conductive. A diffuser is included to diffuse light emitting from lamp into the desired emission pattern, and an optically transmissive material is included in the diffuser.

Another embodiment of a solid state lamp according to the present invention comprises a solid state light source and an elongated elevating element mounted to a lamp base with the light source mounted to the elevating element such that the light source is above the lamp base. The lamp base at least partially comprising a heat conductive material, and further comprises heat fins. At least some of the heat fins extend above the top surface of said lamp base to at least partially surround the elevating elements and LEDs.

Another embodiment of a solid state lamp according to the present invention comprises a thermally conductive elongated elevating element and a solid state light source mounted to the elevating element. A lamp base is included, with the elevating element mounted to the lamp base so that the solid state light source is above the lamp base. An outer enclosure is included that at least partially surrounds the elevating element and the solid state light source. An optically transmissive material is included at least partially filling the outer enclosure.

Still another embodiment of a solid state lamp according to the present invention comprises a solid state light source and an elongated elevating element mounted to a lamp base with the light source mounted to the elevating element. A lamp base at least partially comprising a heat conductive material, and further comprising heat fins, at least some of which widen moving down said lamp base.

These and other further features and advantages of the invention would be apparent to those skilled in the art from the following detailed description, taken together with the following accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 shows a sectional view of one embodiment of a related LED lamp;

FIG. 2 shows a sectional view of another embodiment of a related LED lamp;

FIG. 3 shows the size envelope for a standard A19 replacement bulb;

FIG. 4 is a perspective view of one embodiment of an LED lamp according to the present invention;

FIG. 5 is a side elevation view of the LED lamp shown in FIG. 4;

FIG. 6 is a side sectional view of the LED lamp shown in FIG. 4;

FIG. 7 is a perspective view of another embodiment of an LED lamp according to the present invention;

FIG. 8 is perspective view of the LED lamp in FIG. 7, without a diffuser dome;

FIG. 9 is a perspective sectional view of the LED lamp shown in FIG. 7;

FIG. 10 is a side sectional view of the LED lamp shown in FIG. 7;

FIG. 11 is a perspective view of another embodiment of an LED lamp according to the present invention;

FIG. 12 is a side view of another embodiment of an LED lamp according to the present invention;

FIG. 13 is a side sectional view of another embodiment of an LED lamp according to the present invention;

FIG. 14 is a side sectional view of another embodiment of an LED lamp according to the present invention;

FIG. 15 is a side sectional view of another embodiment of an LED lamp according to the present invention;

FIG. 16 is a side sectional view of another embodiment of an LED lamp according to the present invention;

FIG. 17 is a side sectional view of another embodiment of an LED lamp according to the present invention;

FIG. 18 is a perspective view of another embodiment of an LED lamp according to the present invention;

FIG. 19 is a perspective view of another embodiment of an LED lamp according to the present invention; and

FIG. 20 is a side view of another embodiment of an LED lamp according to the present invention.

DETAILED DESCRIPTION OF THE INVENTION

The present invention is directed to different embodiments of solid state lamp structures that in some embodiments provide elevating elements to mount LED chips or packages (“LEDs”) above the lamp base. The elevating elements can comprise many different thermally conductive materials, as well as multiple material devices arranged to conduct heat. In some embodiments, the elements can comprise one or more heat pipes, with the LEDs mounted to the one end of and in thermal contact with the heat pipe. The other end of the heat pipe can be mounted to the lamp base with the heat pipe in an orientation to elevate the LEDs above the base. The heat pipes also conduct heat from the LEDs to the lamp base where the heat can efficiently radiate into the ambient. This arrangement allows for the LEDs to operate at a lower temperature, while allowing the LEDs to remain remote to the lamp base, which can be one of the lamp's primary heat dissipation features. This in turn allows for the LEDs to be driven with a higher drive signal to produce a higher luminous flux. Operating at lower temperatures can provide the additional advantage of improving the LED emission and increase the LED lifespan.

Heat pipes are generally known in the art and are only briefly discussed herein. Heat pipes can comprise a heat-transfer device that combines the principles of both thermal conductivity and phase transition to efficiently manage the transfer of heat between two interfaces. At the hot interface (i.e. interface with LEDs) within a heat pipe, a liquid in contact with a thermally conductive solid surface turns into a vapor by absorbing heat from that surface. The vapor condenses back into a liquid at the cold interface, releasing the latent heat. The liquid then returns to the hot interface through either capillary action or gravity action where it evaporates once more and repeats the cycle. In addition, the internal pressure of the heat pipe can be set or adjusted to facilitate the phase change depending on the demands of the working conditions of the thermally managed system.

A typical heat pipe includes a sealed pipe or tube made of a material with high thermal conductivity, such as copper or aluminum at least at both the hot and cold ends. A vacuum pump can be used to remove air from the empty heat pipe, and the pipe can then be filled with a volume of working fluid (or coolant) chosen to match the operating temperature. Examples of such fluids include water, ethanol, acetone, sodium, or mercury. Due to the partial vacuum that can be near or below the vapor pressure of the fluid, some of the fluid can be in the liquid phase and some will be in the gas phase.

This arrangement of elevating the LEDs on a heat pipe can provide a number of additional advantages beyond those mentioned above. Remote placement of the LEDs on a heat pipe can allow for a concentrated LED light source that more closely resembles a point source. The LEDs can be mounted close to one another on the heat pipe, with little dead space between adjacent LEDs. This can result in a light source where the individual LEDs are less visible and can provide overall lamp emission with enhanced color mixing. By elevating the LED light source, greater angles of light distribution are also available, particularly emission in the down direction (compared to planar source on base). This allows the lamps to produce more omnidirectional emission pattern, with some embodiments comprising an emission pattern with intensity variation of approximately ±20 percent or less. Still other embodiments can comprise an emission pattern having an omnidirectional emission pattern with intensity variation of approximately ±15 percent or less.

In some embodiments the emission patterns can meet the requirements of the ENERGY STAR® Program Requirements for Integral LED Lamps, amended Mar. 22, 2010, herein incorporated by reference. The elevated LEDs along with the relative geometries of the lamp elements can allow light to disperse within 20% of mean value from 0 to 135 degrees with greater than 5% of total luminous flux in the 135 to 180 degree zone (measurement at 0, 45 and 90 azimuth angles). The relative geometries can include the lamp mounting width, height, head dissipation devices width and unique downward chamfered angle. Combined with a diffuser dome, the geometries can allow light to disperse within these stringent ENERGY STAR® requirements.

The present invention can reduce the surface areas needed to dissipate LED and power electronics thermal energy and still allow the lamps to comply with ANSI A19 lamp profiles 30 as shown in FIG. 3. This makes the lamps particularly useful as replacements for conventional incandescent and fluorescent lamps or bulbs, with lamps according to the present invention experiencing the reduced energy consumption and long life provided from their solid state light sources. The lamps according to the present invention can also fit other types of standard size profiles including but not limited to A21 and A23.

Different embodiments can be used with diffuser domes and by concentrating the light source on the heat pipe within the diffuser dome, there can be an increased distance between the light source and the diffuser. This allows for greater color mixing as the light emits from the LEDs and as the light passes through the diffuser dome. LED lamps according to the present invention can also have power supply units that generate heat and are typically located in the lamp base. Elevating of the LEDs above the base on heat pipe separates the heat generating LEDs from the heat generating power supply units. This reduces thermal “cross-talk” between the two and allows for both to operate at lower temperatures. The remote arrangement can also allow for directional positioning of the LEDs on the heat pipe to provide the desired lamp emission pattern. This directional emission can be provided from LEDs mounted to different up and down angled surfaces to provide the desired emission.

In the embodiments utilizing a diffuser, the diffuser not only serves to mask the internal components of the lamp from the view by the lamp user, but can also disperse or redistribute the light from the remote phosphor and/or the lamp's light source into a desired emission pattern. In some embodiments the diffuser can be arranged to assist in disperse light from the LEDs on the heat pipe into a desired omnidirectional emission pattern.

The properties of the diffuser, such as geometry, scattering properties of the scattering layer, surface roughness or smoothness, and spatial distribution of the scattering layer properties may be used to control various lamp properties such as color uniformity and light intensity distribution as a function of viewing angle. By masking the internal lamp features, the diffuser can provide a desired overall lamp appearance when the lamp or bulb is not illuminated.

In some embodiments, The diffuser or other optically transmissive elements can form an enclosure around that fully or partially surrounds the lamp's heat pipe and/or elevated LEDs. The enclosure can be fully or partially filled with an optically transmissive material that can also be thermally conductive. The material can further assist in conducting heat away from the LEDs to dissipate into the ambient, and can also include conversion or scattering material to form the desired emission pattern. In still other embodiments, the enclosure can be arranged with different compartments or envelopes, some of which can have an optically transmissive material. In other embodiments there can be multiple compartments or envelopes holding different materials.

The lamp base can also comprise a heat sink structure with the heat pipe arranged in thermal contact with the heat sink structure. In some embodiments, the heat sink structure can comprise heat dissipating fins to radiate heat from the heat sink structure to the ambient. The fins can be arranged in many different ways, with some embodiments having fins connected primarily to the base of the lamp in alignment with the longitudinal axis of the lamp. In some of these embodiments, some or all of the fins can extend above the lamp base to fully or partially surround the lamp's heat pipe or elevated LEDs. In some embodiments, some or all of the fins can extend around the lamp's elevated LEDs to form a fin structure around the LEDs that resembles a “bird cage” type structure. It is understood that the heat fins of the lamps according to the present invention can be located in many different locations and in many different orientation. In some embodiments, the heat fins can comprise structures connected to the heat pipe or base that widen from the heat pipe or base moving down the LED lamp. This can provide a heat fin arrangement that reduces the amount of LED light that can be blocked by the heat fin structure. The lamp base can also comprise a means for connecting the lamp to a power source, such as a connector to connect to an Edison type socket, etc.

The features of the different lamp embodiments described herein can provide a solid state lamp that produces an emission pattern that more closely matches a traditional incandescent light bulb in form and function. These features also allow for emission with the intensity, temperature and color rendering index (CRI) that also resembles those of a traditional incandescent light bulb. This allows some lamp embodiments having the advantages of a solid state light source, such as LEDs, that are particularly applicable to uses as replacement bulbs for incandescent bulbs.

Lamps have been developed that utilize a larger shaped remote phosphor that can convert some the LED light. These larger phosphors, however, can result in higher material costs for the larger remote phosphor, and an envelope for the lamp. The present invention is arranged such that white emitting LEDs providing the desired CRI and color temperature can be mounted to the heat sink to provide the desired lamp emission. This allows for some lamps according to the present invention to operate without the complexity and expense of a remote phosphor, such as a phosphor globe.

It is understood, however, that other embodiments of LED lamps according to the present invention can be used in combination with a shaped remote phosphor, with the remote phosphor also being mounted to the heat sink. The remote phosphor can take many different shapes, such as a general globe-shape with the heat pipe at least partially arranged within the globe shaped phosphor. This can provide an arrangement with the desired color uniformity by the heat pipe and its emitters providing an approximate point light source within the remote phosphor. Many different remote phosphors are described in U.S. patent application Ser. No. 13/018,245, titled “LED Lamp with Remote Phosphor and Diffuser Configuration”, filed on Jan. 31, 2011, which is incorporated herein by reference. In some embodiments, the remote phosphor can comprise an envelope or compartment within the lamp that can hold an optically transmissive and/or thermally conductive material. When used in combination with a diffuser dome, the envelope formed between the remote phosphor and diffuser dome can form an envelope that may or may not have an optically transmissive and/or thermally conductive material.

The present invention is described herein with reference to certain embodiments, but it is understood that the invention can be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. In particular, the present invention is described below in regards to certain lamps or lighting components having LEDs, LED chips or LED components (“LEDs”) in different configurations, but it is understood that the present invention can be used for many other lamps having many different configurations. The components can have different shapes and sizes beyond those shown and different numbers of LEDs or LED chips can be included. Many different commercially available LEDs can be used such as those commercially available LEDs from Cree, Inc. These can include, but are not limited to Cree's XLamp® XP-E LEDs or XLamp® XP-G LEDs.

It is also understood that when an element such as a layer, region or substrate is referred to as being “on” another element, it can be directly on the other element or intervening elements may also be present. Furthermore, relative terms such as “inner”, “outer”, “upper”, “above”, “lower”, “beneath”, and “below”, and similar terms, may be used herein to describe a relationship of one layer or another region. It is understood that these terms are intended to encompass different orientations of the device in addition to the orientation depicted in the figures.

Embodiments of the invention are described herein with reference to cross-sectional view illustrations that are schematic illustrations of embodiments of the invention. As such, the actual thickness of the layers can be different, and variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and/or tolerances are expected. Embodiments of the invention should not be construed as limited to the particular shapes of the regions illustrated herein but are to include deviations in shapes that result, for example, from manufacturing. A region illustrated or described as square or rectangular will typically have rounded or curved features due to normal manufacturing tolerances. Thus, the regions illustrated in the figures are schematic in nature and their shapes are not intended to illustrate the precise shape of a region of a device and are not intended to limit the scope of the invention.

FIGS. 4-6 show one embodiment of a solid state lamp 40 according to the present invention that can comprise a lamp base 42, heat pipe 44 and LEDs 46, with heat pipe 44 mounted vertically to the lamp base 42 and with the LEDs 46 mounted to the end of the heat pipe 44 opposite the lamp base 42. A diffuser dome 48 can also be mounted to the lamp base over the heat pipe 44 and LEDs 46. The lamp base 42 can be arranged in many different ways, with many different features, in the embodiment shown it comprises a heat sink structure 50 and electrical connector 52 for connecting to a source of electrical power. The heat sink structure 50 can at least partially comprise a thermally conductive material, and many different thermally conductive materials can be used including different metals such as copper or aluminum, or metal alloys. Copper can have a thermal conductivity of up to 400 W/m-k or more. In some embodiments the heat sink can comprise high purity aluminum that can have a thermal conductivity at room temperature of approximately 210 W/m-k. In other embodiments the heat sink structure can comprise die cast aluminum having a thermal conductivity of approximately 200 W/m-k.

The heat sink structure 50 can also comprise a smooth outer surface and in other embodiments can comprise other heat dissipation features such as heat fins that increase the surface area of the heat sink to facilitate more efficient dissipation into the ambient. In some embodiments, the heat fins can be made of same material or a material with higher thermal conductivity than the remainder of the heat sink structure. The heat fins have a generally vertical orientation, but it is understood that in other embodiments the fins can have a horizontal or angled orientation, or combinations of different orientations. In still other embodiments, the heat sink can comprise active cooling elements, such as fans, to lower the convective thermal resistance within the lamp.

The lamp base 42 can also comprise different areas of solid heat conducting material and different open areas to house lamp features such as a power supply unit as described below. In some embodiments the portion above the electrical connector 52 can comprise a substantially solid heat conducting material, with some embodiments having heat fins that radiate out from the solid material. The heat pipe 44 can be mounted to the lamp base using many different mounting methods and materials. As best shown in FIG. 6, some lamp embodiments can comprise a countersunk hole 54 in the heat conductive solid portion of the base, with the countersunk hole 54 provided at the desired angle of the heat pipe 44 and in the desired location of the heat pipe. In the embodiment shown, the countersunk hole 54 has a generally vertical orientation and is located in general alignment with the longitudinal axis of the lamp base 42.

The heat pipe 44 can be held in place using many different material and mechanisms, and in the embodiment shown be bonded in countersunk hole 54 using different materials, such as thermally conductive materials that allow heat to spread from the heat pipe 44 to the lamp base 42. One suitable binding material comprises a thermal epoxy, but it is understood that many different thermally conductive materials can be used such as thermally conductive grease. Conventional thermally conductive grease can contain ceramic materials such as beryllium oxide and aluminum nitride or metal particles such as colloidal silver. In one embodiment a thermal grease layer is used having a thickness of approximately 100 μm and thermal conductivity of k=0.2 W/m-k. This arrangement provides an efficient thermally conductive path for conducting heat from the heat pipe 44 to the heat sink structure 50.

It is also understood that the arrangement shown in FIG. 6 is only one of the many mounting arrangements that can be used in LED lamps according to the present invention. In other embodiments the heat pipe 44 can be mounted to the heat sink structure 50 by thermal conductive devices such as by clamping mechanisms, brackets, or screws. These devices can hold the heat pipe tightly to the heat sink structure 50 to maximize thermal conductivity.

The electrical connector 52 is included on the lamp base 42 to allow for the solid state lamp 40 to connect to a source of electricity such as to different electrical receptacles. In some embodiments, such as the one shown in FIGS. 4-6, the lamp base 42 can comprise a feature of the type to fit in and mount to a conventional standard Edison socket, which can comprise a screw-threaded portion which can be screwed into an Edison socket. In other embodiments, it can include a standard plug and the electrical receptacle can be a standard outlet, or can comprise a GU24 base unit, or it can be a clip and the electrical receptacle can be a receptacle which receives and retains the clip (e.g., as used in many fluorescent lights). These are only a few of the options for heat sink structures and receptacles, and other arrangements can also be used that safely deliver electricity from the receptacle to the solid state lamp 40.

As best shown in FIG. 6, the lamps according to the present invention can also comprise an internal power supply unit (or power conversion unit) 55. In the embodiment shown, the internal power supply unit 55 can comprise a driver to allow the lamp to run from an AC line voltage/current and to provide light source dimming capabilities. In some embodiments, the power supply can comprise an offline constant-current LED driver using a non-isolated quasi-resonant flyback topology. The internal power supply unit 55 can fit within the lamp base 42 and in the embodiment shown is generally arranged in the electrical connector 52. In some embodiments the power supply unit 55 can comprise a less than cubic centimeter volume, while in other embodiments it can comprise an approximately 20 cubic centimeter volume. In still other embodiments the power supply unit can be non-dimmable but is low cost. It is understood that the power supply used can have different topology or geometry and can be dimmable as well.

As mentioned above, the LEDs 46 can be mounted to the heat pipe 44 at different locations, with a suitable location being at or near the end of the heat pipe 44 opposite the lamp base 42. The LEDs 46 can be mounted in many different ways, but should be mounted such that there is an efficient thermal path from the LEDs 46 to the heat pipe 44. In some embodiments, the LEDs 46 can be mounted directly to the heat pipe 44 by a thermally conductive material such as a solder. In the embodiment shown, a conductive block 56 of conductive material is provided at or near the top of the heat pipe 44, with the conductive block 56 being in thermal contact with the heat pipe 44. The conductive block 56 can be made of many different thermally conductive materials such as copper, conductive plastic, or aluminum, and can be bonded with a conductive material to provide the efficient conductive path between the conductive block 56 and the heat pipe 44. The conductive block 56 provides planar surfaces that can be compatible with mounting LEDs and LED packages.

The lamps according to the present invention can utilize different numbers of LEDs or LED packages, with the embodiment shown having two LEDs 46 mounted to opposing sides of the conductive block 56. It is understood that other embodiments can have more LEDs, and in some embodiments it may be advantageous to have an LED mounted to the top of the conductive block 56 or on more than two surfaces of the conductive block 56 to provide the desired emission pattern. The conductive block 56 has a cube shape, but it is understood that the conductive block 56 can have different shapes that have more or less side surfaces, or can have surfaces angled in one direction, such as up in the case of a pyramid, or having surfaces angled in both up and down directions, such as in the case of a diamond. It is understood that the block can take many different shapes having different numbers of up or down angled surfaces, with different embodiments having four or more planar surfaces, including the bottom facing surface.

In the embodiment shown the conductive block 56 is arranged to hold two LEDs 46, with each on opposing sides of the block 56. The conductive block 56 is thinner on the uncovered side surfaces to bring the back-to-back LEDs 46 in closer proximity to one another so that the overall light source more closely resembles a point light source. The LEDs are arranged at a height within the diffuser dome to provide the desired lamp emission pattern. By raising the LEDs 46 above the lamp base on the heat pipe 44, the LEDs 46 can directly emit light in the down direction past the lamp base 42. This is best shown by representative light ray 59 shown in FIG. 5. This direct downward emission allows for the lamp 40 to more easily provide a desired omnidirectional lamp emission pattern.

As mentioned above, the diffuser 48 can be arranged to disperse light from the phosphor carrier and LED into the desired lamp emission pattern, and can have many different shapes and sizes. In some embodiments, the diffuser also can be arranged over the phosphor carrier to mask the phosphor carrier when the lamp is not emitting. The diffuser can have materials to give a substantially white appearance to give the bulb a white appearance when the lamp is not emitting.

Many different diffusers with different shapes and attributes can be used with solid state lamp 40 as well as the lamps described below, such as those described in U.S. patent application Ser. No. 13/018,245, which is incorporated by reference above. This patent is titled “LED Lamp With Remote Phosphor and Diffuser Configuration”, and was filed on Jan. 31, 2011. The diffuser can also take different shapes, including but not limited to generally asymmetric “squat” as in U.S. patent application Ser. No. 12/901,405, titled “Non-uniform Diffuser to Scatter Light into Uniform Emission Pattern,” filed on Oct. 8, 2010, and incorporated herein by reference.

A reflective layer(s) or materials can also be included on surfaces of the heat sink structure 50 and on the heat pipe 44 to reflect light from the LEDs 46. In one embodiment, the top surface 58 of the heat sink structure 50 around the heat pipe 44 can comprise a reflective layer 60 that can be made of many different materials deposited and formed on the heat sink structure using known methods. These reflective layers 60 allow for the optical cavity to effectively recycle photons, and increase the emission efficiency of the lamp. In some embodiments the surfaces can be coated with a material having a reflectivity of approximately 75% or more to the lamp visible wavelengths of light emitted by the LEDs 46, while in other embodiments the material can have a reflectivity of approximately 85% or more to the LED light. In still other embodiments the material can have a reflectivity to the LED light of approximately 95% or more. It is understood that the reflective layer can comprise many different materials and structures including but not limited to reflective metals or multiple layer reflective structures such as distributed Bragg reflectors.

During operation of the solid state lamp 40, an electrical signal from the electrical connector 52 can be conducted to the power supply unit 55, and a drive signal can then be conducted to the LEDs 46 causing them to emit light. The signal from the power supply unit 55 can be conducted to the LEDs 46 using known conductors that can run to the LEDs along the heat pipe 44. In some embodiments a sleeve can be included around the heat pipe in which the conductors can run, with some sleeve embodiments having a reflective surface. In still other embodiments, a drive circuit or drive board (not shown) can be included between the power supply unit and the LEDs 46 to compensate for changes in LED emission over time and at different temperatures. This drive circuit can be in many different locations in the LED lamp 40 such as on the top surface 58 of the heat sink structure 50.

As the LEDs 46 emit light, they generate heat that can be conducted to the conductive block 56, and on to the top portion of the heat pipe 44. The heat pipe 44 then conducts heat to the lamp base 42 and its heat sink structure 50, where the heat can dissipate into the ambient. This provides efficient management of the heat generated by the LEDs 46, and allows for the LEDs to operate at cooler temperatures.

FIGS. 7-10 show another embodiment of an LED lamp 100 according to the present invention that is similar to the solid state lamp 40 shown in FIGS. 4-6, and for the same or similar features the same reference numbers are used with the understanding the description above for these elements applies to this embodiment. The LED lamp 100 can comprise a lamp base 42, heat pipe 44, LEDs 46 and diffuser dome 48. The base 42 also comprises a heat sink structure 50 and electrical connector 52, with the heat sink structure 50 having a countersunk hole for the heat pipe 44. The heat sink structure 50 can also comprise a reflective layer 60 on the heat sink structure's top surface, and the heat pipe can also be covered by a reflective layer.

The LED lamp 100 also comprises a conductive block 102 that can be made of the same materials as conductive block 56 shown in FIGS. 4-6, but has a somewhat different shape and arranged to accommodate different numbers of LEDs, with the embodiment shown accommodating four LEDs 46. The conductive block 102 has four side surfaces 104 that are substantially the same size with each capable of holding one of the LEDs 46. The side surfaces should be sized so that the LEDs 46 are close to one another while still allowing for the necessary electrical connection to the LEDs 46, as well as the desired thermal dissipation of heat away from the LEDs 46 and into the heat pipe. As discussed above, by bringing the LEDs 46 close to one another, the LEDs 46 can more closely approximate a point light source.

The heat sink structure 50 can also comprise heat fins 105 that are aligned with the lamp's longitudinal axis and radiate out from a center heat conductive core 106, with the heat fins 105 increasing the surface area for heat to dissipate. Heat from the heat pipe 44 spreads into the conductive core 106 and then spreads into the heat fins 105, where it spreads into the ambient. The heat fins 105 can take many different shapes and can be arranged in many different ways, with the heat fins 105 arranged vertically on the conductive core 106. The fins angle out and become larger moving up the heat sink structure 50 from the electrical connector 52, and then angle back toward the top of the heat sink structure 50. The lower portion can angle out in a way to allow the LED lamp 100 to fit within a particular lighting size envelope, such as A19 size envelopes. The fins angle back in to allow for light from the LEDs to emit down at the desired angle without being blocked be the heat fins 105.

The top of the heat fins 105 also comprise a slot 108 (best shown in FIG. 8) for holding the bottom edge of the diffuser dome 48. As best shown in FIG. 10, the fins 105 begin at the heat conductive core 106 at a point within the diffuser dome 48 so that a portion of the heat fins 105 are within the bottom edge of the diffuser dome 48. This provides opening between the fins to allow air to pass from the interior of the diffuser dome 48 to along the spaces between the heat fins 105, and vice versa. This allows for heated air to pass from within the diffuser dome, also assisting in keeping the LEDs 46 operating at the desired temperature.

The different LED lamps according to the present invention can be arranged in many different ways, with many different features. FIG. 11 shows another embodiment of an LED lamp 120 according to the present invention also having base 42, heat pipe 44, and LEDs 46, and is arranged to accommodate a diffuser dome (not shown). In this embodiment, the base comprises a heat sink structure 50 and electrical connector 52 similar to those shown in FIGS. 4-6, but also comprises a conductive block 102 having side surfaces to accommodate four LED chips, as described above with reference to FIGS. 7-10.

FIG. 12 shows still another embodiment of an LED lamp 150 according to the present invention, heat pipe 44, LEDs 46 and diffuser dome (or lens) 48. This embodiment comprises a lamp base 152 having an electrical connector 154 to connect to a source of electrical power. The lamp base 152 further comprises an active cooling element 156 such as a fan that actively moves air around the LED lamp to keep the lamp element at the desired temperature. It is understood that the LED lamp 150 can also comprise a heat sink structure that operates in cooperation with the active cooling element 156, and in some embodiments the heat sink structure can comprise heat fins as described above that allow air flow to the interior of the diffuser dome. Different active cooling LED lamp active cooling elements are described in U.S. patent application Ser. No. 12/985,275, titled “LED Bulb with Integrated Fan Element for Enhanced Convective Heat Dissipation,” filed on Jan. 5, 2011, and in U.S. patent application Ser. No. 13/022,490, titled “LED Lamp with Active Cooling Element,” filed on Feb. 7, 2011, both of which are incorporated herein by reference.

The LED lamp 150 also comprises a conductive block 158 that is mounted to the top of and in thermal contact with the heat pipe 44. The conductive block 158 is arranged such that its top surface 160 is available for mounting an LED 46. The conductive block 158 can accommodate LEDs 46 on its top surface 160 as well as its side surfaces 162. If each surface held a single LED 46, the block 158 can hold up to five LEDs, but it is understood that each surface can hold more than one LED.

As mentioned above, the heat pipes can be mounted to their lamp base using many different mechanisms and materials. FIG. 13 shows still another embodiment of an LED lamp 170 according to the present invention, having a lamp base 42 and a heat pipe 44. In the embodiment shown in FIGS. 4-6 and described above, the heat pipe was mounted within a longitudinal (vertical) hole using a conductive bonding material. In LED lamp 170, the heat pipe 44 has an angled section 172 mounted within the base. The angled section 172 provides a greater portion of the heat pipe 44 that can be held within the lamp base 42 providing a greater surface area for conducting heat from the heat pipe 44 into the lamp base 42. This can allow for the lamp base 42 to dissipate a higher level of heat from the heat pipe 44. This is only one of the many different shapes that the heat pipe 44 can take in the lamp base 42.

Embodiments of the present invention can be arranged in many different ways beyond those described above. By way of example, FIG. 14 shows another embodiment of an LED lamp 200 according to the present invention that can comprise two heat pipes 202, 204, arranged in the same way as the heat pipes above, with each heat pipe having one or more LEDs 206 mounted on a conductive block 208. Each of the LEDs 206 is also mounted to its respective conductive block such that its emission is directed out from the longitudinal axis of the lamp toward the diffuser dome 210. By having more than one heat pipe, this arrangement may provide enhanced heat dissipation capabilities, and may provide additional flexibility in generating the desired lamp emission pattern. It is also understood that the heat pipes according to the present invention can have many different shapes, sizes and angles, and can be mounted within the lamps in many different ways and locations.

FIG. 15 shows still another embodiment of LED lamp 220 according to the present invention that is similar to LED lamp 40 described above and shown in FIGS. 4-6. The LED lamp 220 can comprise a lamp base 222, heat pipe 224 and LEDs 226, with heat pipe 224 mounted vertically to the lamp base 222. The LEDs 226 can be mounted to the end of the heat pipe 224 opposite the lamp base 222. A diffuser dome or other optically transmissive enclosure 228 can also be mounted to the lamp base 222 over the heat pipe 224 and LEDs 226. In the embodiment shown, a conductive block 230 of conductive material is provided at or near the top of the heat pipe 224, with the conductive block 230 being in thermal contact with the heat pipe 224. The LEDs 226 can then be mounted to the conductive block 230, with heat from the LEDs 226 conducting through the conductive block 230 and into the heat pipe 224. The features of the LED lamp 220 can be made of the same materials and can have the same or similar characteristics to the corresponding features of the solid state lamp 40 described above.

In this embodiment, the LED lamp 220 the diffuser 228 can form an enclosure to hold an optically transmissive material 232 that can aid in the lamp's thermal management and can comprise materials to assist in generating the desired lamp emission pattern. Many different materials can be used, with some embodiments utilizing a liquid, gel, or other material that has moderate to highly thermal conductivity, is moderate to highly convective, or both.

Many different optically transmissive material can be used in the different embodiments according to the present invention, with some being a liquid, gel, or other material that is either moderate to highly thermally conductive, moderate to highly convective, or both, can be used. In some embodiments, the transmissive material can comprise a non-gaseous, formable material. As used herein, a “gel” includes a medium having a solid structure and a liquid permeating the solid structure. A gel can include a liquid, which is a fluid and surrounds the LEDs 226 in the diffuser 228. In other embodiments, the optically transmissive material can have low to moderate thermal expansion, or a thermal expansion that substantially matches that of one or more of the other components of the lamp. The optically transmissive material in at least some embodiments is also inert and does not readily decompose.

In still other embodiments, the optically transmissive material can comprise an oil. The oil can be petroleum-based, such as mineral oil, or can be organic in nature, such as vegetable oil. In still other embodiments the optically transmissive material can comprise perfluorinated polyether (PEPE) liquid, or other fluorinated or halogenated liquid, or gel. An appropriate propylene carbonate liquid or gel having at least some of the above-discussed properties might also be used. Suitable PFPE-based liquids are commercially available, for example, from Solvay Solexis S.p.A. of Italy. In other embodiments where a phase change material is used for the fluid medium, chloromethane, alcohol, methylene chloride or trichloromonofluoromethane can be used. Flourinert™ manufactured by the 3M Company in St. Paul, Minn., U.S.A. can also be used as coolant and/or a phase change material.

In at least some embodiments, the optically transmissive material can have a refractive index that provides for efficient light transfer with minimal reflection and refraction from the LEDs through the enclosure. The material can have the same or a similar refractive index as the material of the enclosure, the LED device package material or the LED's substrate material. In some embodiments, material can have a refractive index that is between the indices of two of these materials. As an example, if unpackaged LEDs are used in a centralized LED array, a fluid with a refractive index between that of the LED substrates and the enclosure and/or inner envelope can be used. LEDs with a transparent substrate can be used so that light passes through the substrate and can be radiated from the light emitting layers of the chips in all directions. If the LED substrate is silicon carbide, the refractive index of the substrates is approximately 2.6. If glass is used for the enclosure or envelope, the glass would typically have a refractive index of approximately 1.5. Thus an optically transmissive material with a refractive index of approximately 2.0-2.1 could be used as the index matching fluid medium. LEDs with a sapphire substrate can also be used with the refractive index of sapphire being approximately 1.7. If glass is again used for the enclosure or envelope, the material medium could have a refractive index of approximately 1.6. It is understood that in different embodiments the optically transmissive material can fully fill the enclosure, while in other embodiments it can partially fill the enclosure.

FIG. 16 shows still another embodiment of LED lamp 240 according to the present invention that is similar to LED lamp 220 described above and shown in FIG. 15. The LED lamp 240 can also comprise a lamp base 222, heat pipe 224 and LEDs 226, with heat pipe 224 mounted vertically to the lamp base 222. The LEDs 226 can be mounted to the end of the heat pipe 224 opposite the lamp base 222. A diffuser dome 228 can also be included along with a conductive block 230 at or near the top of the heat pipe 224. The LEDs 226 can then be mounted to the conductive block 230, with heat from the LEDs 226 conducting through the conductive block and into the heat pipe 224. The features of the lamp 220 can be made of the same materials and can have the same or similar characteristics to the corresponding features of the lamps 220 and 40 described above.

In this embodiment, an internal light transmissive dome or enclosure 242 is included within the diffuser 228, and over the heat pipe 224 and LEDs 226. The internal dome 242 optically transmissive material 244 that can aid in the lamp's thermal management and can comprise materials to assist in generating the desired lamp emission pattern. This arrangement provides a void 246 between the internal dome 242 and the diffuser dome 228 that can be substantially or partially evacuated, be filled with air or an inert gas, or can be filled or partly filed with a fluid medium having characteristics either the same or different from that of the fluid medium inside the inner envelope. It should be noted that a lamp according to the embodiments of the invention may include multiple inner envelopes, which can take the form of spheres, tubes or any other shapes. Any or all of these inner envelopes could provide for index matching to optimize the volume of fluid medium needed for proper operation of the lamp. One or more of these inner envelopes could be diffusive and could be made of gels, silicone, plastic, glass or any other suitable material. It is also understood that in some embodiments the internal dome 242 can also as a remote phosphor carrier, and is coated or impregnated with phosphor to provide remote wavelength conversion.

It should also be noted that in this or any of the embodiments shown here, the optically transmissive enclosure or a portion of the optically transmissive enclosure can be coated or impregnated with phosphor. In the different embodiments described herein, the optically transmissive material and also include phosphor particles disbursed and/or suspended therein to convert LED light passing through the material. This allows for the optically transmissive material assist. In the embodiments having one or more inner envelope, the optically transmissive material in the inner envelopes could include suspended phosphor particles while additional materials in other areas, such as between the inner envelope and the optical enclosure could be substantially free of suspended phosphor, or vice versa. The different embodiments can also comprise scattering particles arranged in the different envelope to help scatter and mix the light emitting from the LED lamp.

Many different LEDs can be used in the lamps according to the present invention, with LED devices that typically include a local phosphor. LED devices can be used with a red phosphor or in the optically transmissive enclosure or inner envelope to create substantially white light, or combined with red emitted LED devices in the array to create substantially white light. Such embodiments can produce light with a CRI of at least 70, at least 80, at least 90, or at least 95. By use of the term substantially white light, one could be referring to a chromacity diagram including a blackbody locus of points, where the point for the source falls within four, six or ten MacAdam ellipses of any point in the blackbody locus of points.

A lighting system using the combination of blues shifted yellow (BSY) and red LED devices referred to above to make substantially white light can be referred to as a BSY plus red or “BSY+R” system. In such a system, the LED devices used include LEDs operable to emit light of two different colors. In one example embodiment, the LED devices include a group of LEDs, wherein each LED, if and when illuminated, emits light having dominant wavelength from 440 to 480 nm. The LED devices include another group of LEDs, wherein each LED, if and when illuminated, emits light having a dominant wavelength from 605 to 630 nm. A phosphor can be used that, when excited, emits light having a dominant wavelength from 560 to 580 nm, so as to form a BSY light from light from the former LED devices. In another example embodiment, one group of LEDs emits light having a dominant wavelength of from 435 to 490 nm and the other group emits light having a dominant wavelength of from 600 to 640 nm. The phosphor, when excited, emits light having a dominant wavelength of from 540 to 585 nm. A further detailed example of using groups of LEDs emitting light of different wavelengths to produce substantially white light can be found in issued U.S. Pat. No. 7,213,940, which is incorporated herein by reference.

The present invention can be arranged in many different ways and with many different features beyond those described above. Some additional embodiments can comprise heat sinks arranged in different ways to further assist in thermal management. FIG. 17 shows another embodiment of an LED lamp 260 according to the present invention that is similar to LED lamps 220 and 240 described above and shown in FIGS. 15 and 16, respectively. The lamp 260 can also comprise a lamp base 222, heat pipe 224 and LEDs 226, with heat pipe 224 mounted vertically to the lamp base 222. The LEDs 226 can be mounted to a conductive block 230 at the end of the heat pipe 224 opposite the lamp base 222. A diffuser dome 228 can also be mounted to the lamp base over the heat pipe 224 and LEDs 226. In this embodiment, the lamp base comprises heat fins 262 similar to those described above but in this embodiment the heat fins 262 that extend up the diffuser dome diffuser dome 228 to a point approximately midway up the diffuser dome 228. The allows for the heat fins to form a cup-like structure around said heat pipe 224 and LEDs 226 The heat fins 262 can be made of a thermally conductive material and provide a greater surface area for dissipating heat. In some embodiments, heat from the LEDs 226 not only passes through the heat pipe 224, but the heat can also radiate through the diffuser dome 228. The heat fins 262 can draw heat away from the diffuser dome 228, spread the heat, and radiate it into the ambient.

This is just one example of the many ways that heat fins can be arranged according to the present invention. In other embodiments the heat fins can extend a longer or shorter distance up the diffuser dome. In still other embodiments, the heat fins can have different lengths. In one such embodiment, the heat fins can have alternating longer and shorter heat fins. The heat fins 262 can be made of many different thermally conductive materials such as aluminum, copper, other metals, or combinations thereof. The fins 262 can be oriented in relation to the LEDs 226 to minimize the blocking of light emitting from the LEDs 226. For example, the heat fin can be oriented generally orthogonal to the LEDs 226 to minimize the cross-section of the heat fins seen by the LEDs 226. The heat fins 226 can also be coated with a white or reflective material to minimize absorption of light that encounters the heat fins 226.

FIG. 18 shows still another embodiment of a LED lamp 280 that can also comprise a lamp base 222, heat pipe 224 and LEDs 226, with heat pipe 224 mounted vertically to the lamp base 222. The LEDs 226 can be mounted to the end of the heat pipe 224 opposite the lamp base 222. Like the embodiments above, a conductive block 230 is provided at or near the top of the heat pipe 224, with the conductive block 230 being in thermal contact with the heat pipe 224. The LED lamp 280 also comprises heat fins 282 that are aligned with the lamp's longitudinal axis and in this embodiment extend up from the lamp base 222 and above the LEDs 226. The heat fins 282 form a “bird cage” around the LEDs 226. Bird cage structures used in LED lamps are generally described in U.S. patent application Ser. No. 13/022,142, titled “Lighting Device With Heat Dissipation Elements,” filed on Feb. 7, 2011, and which is incorporated herein by reference.

and serve multiple purposes. The heat fins 282 can form a mechanical barrier to coming in contact with the LEDs to not only protect the LEDs from damage, but also to protect against burns that could occur of a user can in contact with the LEDs 226.

The heat fins 282 can also be made of a thermally conductive material such as those describe above, so that heat from the LEDs 226 conducts into the heat fins 282 and radiates into the lamp base 222 or the ambient. The heat fins 282 can be aligned with the LEDs 226 to minimize the cross-section seen be the LEDs 226, which in turn can minimize the light from the LEDs 226 that might be blocked by the heat fins 282. Like the embodiment above, the heat fins can also be covered with a white or reflective material to minimize absorption of LED light. The heat fins can also comprise axial elements 284, 286 that provide support to hold the heat fins in the desired location.

Bird cage heat fins can be arranged in many different ways in different embodiments according to the present invention. In some embodiments the heat fins can be different shapes or different lengths, and can cover different areas particularly in those areas where blocking of light is to be minimized. FIG. 19 shows still another embodiment of an LED lamp 300 according to the present invention that is similar to the LED lamp 280 in FIG. 18, and also comprises heat fins 302 in a bird cage arrangement around the heat pipe 224 and the LEDs 226. Axial elements 304, 306 are included to support the heat fins 302. In this embodiment, however, alternating heat fins do not extend past axial element 304. This results in fewer heat fins 302 in the area above axial element 304, and reduced blocking of light in that area. This is only one of the many different alternative heat fin arrangements according to the present invention.

Different embodiments can also have LEDs, conductive blocks and heat pipes arranged in many different ways. In the embodiments shown in FIGS. 18 and 19, the conductive block 230 is generally square shaped with four LEDs 226 mounted on the block's side surfaces and facing out. A fifth LED 226 is also mounted on the block's top surface. The conductive block 230 can have many different shapes, including hexagon and octagon, with the LEDs 226 mounted on the surfaces in different orientations. Other embodiments can have multiple heat pipe arrangements as discussed above, or can have heat pipes in different shapes or with multiple branches. On one such arrangement, the heat pipe can have a Y-shape with LEDs at the ends of each branch. LEDs can be mounted directly to the heat pipe or can have conductive blocks as described above mounted in different locations such as at the end of the branches.

It is understood that the bird cage embodiments described above can also be used with diffuser domes or remote phosphors as described above. The diffuser can be inside or outside the bird cage in different embodiments and in other embodiments diffusers can be utilized that cover less than the entire bird cage. It is also understood that these embodiments can be used with optically transmissive material 232 that can aid in the lamp's thermal management and can comprise materials to assist in generating the desired lamp emission pattern.

FIG. 20 shows still another embodiment of an LED lamp 320 with an alternative heat sink design. This embodiment also comprises and LED lamp base 222, heat pipe 224 and LEDs 226, with heat pipe 224 mounted vertically to the lamp base 222. The lamp can also comprise a diffuser dome 322 surrounding the heat pipe and the LEDs, with some embodiments arranged to hold an optically transmissive material as described above. The lamp base 222 also comprises heat fins 324 to assist radiating heat from the lamp base 222. In this embodiment, the heat fins 324 are narrowest near the heat pipe and diffuser dome, and then widen moving further down the lamp. This heat fin shape can help minimize the amount of down emitting light that encounters the heat fins, thereby reducing the amount of light that is blocked by the heat fins. This in turn can result in a more uniform and omnidirectional emission pattern for the LED lamp.

Although the present invention has been described in detail with reference to certain preferred configurations thereof, other versions are possible. Therefore, the spirit and scope of the invention should not be limited to the versions described above.

Claims (58)

We claim:
1. A solid state lamp, comprising:
a solid state light source;
a lamp base at least partially comprising a heat conductive material;
an elongated elevating element mounted to said lamp base with said light source mounted to said elevating element such that said solid state light source is above said lamp base, said elevating element being at least partially heat conductive;
a diffuser to diffuse light emitting from said lamp into a desired emission pattern, and
an optically transmissive material in said diffuser, wherein said optically transmissive material is thermally conductive.
2. The lamp of claim 1, wherein said optically transmissive material conducts heat from said solid state light source to the ambient.
3. The lamp of claim 1, wherein said optically transmissive material comprises one or more conversion materials.
4. The lamp of claim 1, wherein said optically transmissive material comprises scattering particles.
5. The lamp of claim 1, further comprising an internal light transmissive enclosure forming an inner envelope within said diffuser.
6. The lamp of claim 5, wherein said optically transmissive material is within said inner envelope.
7. The lamp of claim 1, wherein said solid state light source comprises a plurality of light emitting diodes (LEDs).
8. The lamp of claim 1, wherein said solid state light source comprises a plurality of LEDs, each of which is emitting in a different direction.
9. The lamp of claim 1, wherein said elevating element comprises a heat pipe.
10. The lamp of claim 1, wherein said light source comprises one or more LEDs.
11. The lamp of claim 1, wherein said light sources are in thermal contact with said elevating element, and said elevating element is in thermal contact with said lamp base.
12. The lamp of claim 1, comprising a thermally conductive path from said light source, through said elevating element, to said lamp base and to the ambient.
13. The lamp of claim 1, wherein said emission pattern is omnidirectional.
14. The lamp of claim 1, wherein said lamp base comprises a heat sink.
15. The lamp of claim 14, wherein said lamp base comprises heat fins.
16. The lamp of claim 15, wherein at least some of said heat fins extend from said lamp base to at least partially surround said elevating element and/or said solid state light source.
17. The lamp of claim 15, wherein said heat fins extend along the surface of said diffuser.
18. The lamp of claim 15, wherein said heat fins comprise a bird cage structure around said elevating element and/or said solid state light source.
19. The lamp of claim 15, wherein said heat fins widen moving down said lamp base away from said light source.
20. The lamp of claim 15, wherein said heat fins widen moving down said lamp.
21. The lamp of claim 1, wherein said lamp base comprises an electrical connector and/or a power supply unit.
22. The lamp of claim 1, wherein said light source is mounted to said elevating element with the other end of said elevating element mounted to said lamp base.
23. The lamp of claim 1, further comprising a conductive block mounted to and in thermal contact with said elevating element, said light source mounted to said conductive block.
24. The lamp of claim 23, wherein said solid state light source comprises a plurality of LEDs, with at least some of said LEDs mounted on different surfaces of said conductive block.
25. The lamp of claim 1, wherein said emission pattern comprises intensity variation of approximately +20 percent or less.
26. The lamp of claim 1, wherein said emission pattern comprises an intensity variation of approximately +15 percent or less.
27. The lamp of claim 1, wherein said elongating element comprises more than one heat pipe.
28. The lamp of claim 1, wherein said emission pattern comprises intensity variation of approximately +20 percent or less.
29. A solid state lamp, comprising:
a solid state light source;
an elongated elevating element mounted to a lamp base with said light source mounted to said elevating element such that said light source is above said lamp base, said elevating element being at least partially heat conductive;
a lamp base at least partially comprising a heat conductive material, said lamp base further comprising heat fins, at least some of which extend above the top surface of said lamp base to at least partially surround said elevating elements and said light source.
30. The lamp of claim 29, wherein said fins form a bird cage structure around said light source.
31. The lamp of claim 30, wherein said heat fins extend different distances above the top surface of said lamp base.
32. The lamp of claim 29, wherein said heat fins extend above said lamp base to form a cup-like structure around said elevating element and said light source.
33. The lamp of claim 29, further comprising an optically transparent enclosure holding an optically transmissive material.
34. The lamp of claim 33, wherein said optically transmissive material is thermally conductive.
35. The lamp of claim 33, wherein said optically transmissive material comprises one or more conversion materials.
36. The lamp of claim 33, wherein said optically transmissive material comprises scattering particles.
37. The lamp of claim 33, further comprising an internal light transmissive enclosure forming an inner envelope within said optically transparent enclosure.
38. The lamp of claim 37, wherein said optically transmissive material is within said inner envelope.
39. The lamp of claim 33, wherein said elevating element comprises a heat pipe.
40. The lamp of claim 29, wherein said light sources are in thermal contact with said elevating element, and said elevating element is in thermal contact with said lamp base.
41. The lamp of claim 29, further comprising a conductive block mounted to and in thermal contact with said elevating element, said light source mounted to said conductive block.
42. A solid state lamp, comprising:
a thermally conductive elongated elevating element and a solid state light source mounted to said elevating element;
a lamp base, said elevating element mounted to said lamp base such that said solid state light source is above said lamp base;
an outer enclosure at least partially surrounding said elevating element and said solid state light source; and
an optically transmissive material at least partially filling said outer enclosure, wherein said optically transmissive material is thermally conductive.
43. The lamp of claim 42, wherein said optically transmissive material conducts heat from said solid state light source to said ambient.
44. The lamp of claim 42, wherein said optically transmissive material comprises one or more conversion materials.
45. The lamp of claim 42, wherein said optically transmissive material comprises scattering particles.
46. The lamp of claim 42, further comprising an internal enclosure forming an inner envelope within said outer enclosure.
47. The lamp of claim 46, wherein said optically transmissive material is within said inner envelope.
48. The lamp of claim 42, wherein said lamp base comprises heat fins.
49. The lamp of claim 48, wherein at least some of said heat fins extend from said lamp base to at least partially surround said elevating element and/or said solid state light source.
50. The lamp of claim 48, wherein said heat fins extend along the surface of said outer enclosure.
51. The lamp of claim 48, wherein said heat fins comprise a bird cage structure around said elevating element and/or said solid state light source.
52. A solid state lamp, comprising:
a solid state light source;
an elongated elevating element mounted to said lamp with said light source mounted to said elevating element, said elevating element being at least partially heat conductive;
a lamp base at least partially comprising a heat conductive material, said lamp base further comprising heat fins, at least some of which widen moving down said lamp base.
53. The lamp of claim 52, further comprising an outer enclosure at least partially surrounding said elevating element and said solid state light source, and an optically transmissive material at least partially filling said outer enclosure.
54. The lamp of claim 53, wherein said optically transmissive material is thermally conductive.
55. The lamp of claim 53, wherein said optically transmissive material conducts heat from said solid state light source to the ambient.
56. The lamp of claim 53, wherein said optically transmissive material comprises one or more conversion materials.
57. The lamp of claim 53, further comprising an internal enclosure forming an inner envelope within said outer enclosure.
58. The lamp of claim 53, wherein said optically transmissive material is within said inner envelope.
US13607300 2010-02-12 2012-09-07 Lamp with remote LED light source and heat dissipating elements Active 2032-02-08 US9234655B2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US13022142 US20110267821A1 (en) 2010-02-12 2011-02-07 Lighting device with heat dissipation elements
US13358901 US9068701B2 (en) 2012-01-26 2012-01-26 Lamp structure with remote LED light source
US13607300 US9234655B2 (en) 2011-02-07 2012-09-07 Lamp with remote LED light source and heat dissipating elements

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13607300 US9234655B2 (en) 2011-02-07 2012-09-07 Lamp with remote LED light source and heat dissipating elements
EP20130762957 EP2893254A1 (en) 2012-09-07 2013-08-30 Lamp with remote led light source and heat dissipating elements
PCT/US2013/057712 WO2014039405A1 (en) 2012-09-07 2013-08-30 Lamp with remote led light source and heat dissipating elements

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US13022142 Continuation-In-Part US20110267821A1 (en) 2010-02-12 2011-02-07 Lighting device with heat dissipation elements

Publications (2)

Publication Number Publication Date
US20130113358A1 true US20130113358A1 (en) 2013-05-09
US9234655B2 true US9234655B2 (en) 2016-01-12

Family

ID=48223236

Family Applications (1)

Application Number Title Priority Date Filing Date
US13607300 Active 2032-02-08 US9234655B2 (en) 2010-02-12 2012-09-07 Lamp with remote LED light source and heat dissipating elements

Country Status (1)

Country Link
US (1) US9234655B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150098223A1 (en) * 2014-01-03 2015-04-09 Chin-Feng Su Omnidirectional LED bulb
US9412925B2 (en) * 2013-06-25 2016-08-09 Zhiming Chen High-power LED lamp cooling device and method for manufacturing the same

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9052093B2 (en) * 2013-03-14 2015-06-09 Cree, Inc. LED lamp and heat sink
WO2014190304A9 (en) * 2013-05-24 2015-01-29 Anderson Deloren E Led light bulb
US8967837B2 (en) 2013-08-01 2015-03-03 3M Innovative Properties Company Solid state light with features for controlling light distribution and air cooling channels
WO2015030502A1 (en) * 2013-08-28 2015-03-05 Kang Seong Jin Lamp comprising envelope having vent
US9267674B2 (en) 2013-10-18 2016-02-23 3M Innovative Properties Company Solid state light with enclosed light guide and integrated thermal guide
US9354386B2 (en) 2013-10-25 2016-05-31 3M Innovative Properties Company Solid state area light and spotlight with light guide and integrated thermal guide
USD735368S1 (en) 2013-12-04 2015-07-28 3M Innovative Properties Company Solid state light assembly
US9255673B2 (en) * 2013-12-27 2016-02-09 Switch Bulb Company, Inc. LED bulb having an adjustable light-distribution profile
USD736966S1 (en) 2014-03-28 2015-08-18 3M Innovative Properties Company Solid state light assembly
CN106461168A (en) * 2014-05-22 2017-02-22 飞利浦照明控股有限公司 Thermo-optical enclosure for led lighting applications
KR101658901B1 (en) * 2014-06-12 2016-09-22 최재빈 Optical semiconductor illuminating apparatus
US20170198875A1 (en) * 2014-07-15 2017-07-13 Koninklijke Philips N.V. Retrofit lamp for automotive headlights
US9534741B2 (en) 2014-07-23 2017-01-03 Cree, Inc. Lighting devices with illumination regions having different gamut properties
JP1535104S (en) * 2014-09-25 2015-10-13
US9401468B2 (en) 2014-12-24 2016-07-26 GE Lighting Solutions, LLC Lamp with LED chips cooled by a phase transformation loop
USD768316S1 (en) 2015-04-03 2016-10-04 3M Innovative Properties Company Solid state luminaire with dome reflector
JP6179570B2 (en) * 2015-08-28 2017-08-16 三菱電機株式会社 lamp

Citations (356)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2394992A (en) 1943-06-30 1946-02-19 Holophane Co Inc Lighting unit
US3143592A (en) 1961-11-14 1964-08-04 Inland Electronics Products Co Heat dissipating mounting structure for semiconductor devices
US3581162A (en) 1969-07-01 1971-05-25 Rca Corp Optical semiconductor device
GB1423011A (en) 1972-02-22 1976-01-28 Northern Electric Co Light emitting devices
US4204246A (en) 1976-02-14 1980-05-20 Sony Corporation Cooling assembly for cooling electrical parts wherein a heat pipe is attached to a heat conducting portion of a heat conductive block
US4727289A (en) 1985-07-22 1988-02-23 Stanley Electric Co., Ltd. LED lamp
JPH0381903A (en) 1989-08-24 1991-04-08 Fuji Electric Co Ltd Display device
US5140220A (en) 1985-12-02 1992-08-18 Yumi Sakai Light diffusion type light emitting diode
JPH06283006A (en) 1993-03-26 1994-10-07 Toshiba Lighting & Technol Corp Glass globe for illumination and lighting fixture
DE4311937A1 (en) 1993-04-10 1994-10-13 Telefunken Microelectron Light-emitting device
US5463280A (en) 1994-03-03 1995-10-31 National Service Industries, Inc. Light emitting diode retrofit lamp
US5519596A (en) 1995-05-16 1996-05-21 Hewlett-Packard Company Moldable nesting frame for light emitting diode array
US5535230A (en) 1994-04-06 1996-07-09 Shogo Tzuzuki Illuminating light source device using semiconductor laser element
US5561346A (en) 1994-08-10 1996-10-01 Byrne; David J. LED lamp construction
US5581683A (en) 1994-04-07 1996-12-03 Northern Telecom Limited Light diffusing apparatus with U-shaped light guide
US5585783A (en) 1994-06-28 1996-12-17 Hall; Roger E. Marker light utilizing light emitting diodes disposed on a flexible circuit board
US5655830A (en) 1993-12-01 1997-08-12 General Signal Corporation Lighting device
JPH09265807A (en) 1996-03-29 1997-10-07 Toshiba Lighting & Technol Corp Led light source, led signal lamp, and traffic signal
US5688042A (en) 1995-11-17 1997-11-18 Lumacell, Inc. LED lamp
US5806965A (en) 1996-01-30 1998-09-15 R&M Deese, Inc. LED beacon light
EP0876085A2 (en) 1997-04-24 1998-11-04 Incerti & Simonini di Incerti Edda & C. S.n.c. A low tension lighting device
US5838101A (en) 1992-10-28 1998-11-17 Gte Products Corporation Fluorescent lamp with improved CRI and brightness
US5850126A (en) 1997-04-11 1998-12-15 Kanbar; Maurice S. Screw-in led lamp
EP0890059A1 (en) 1997-01-23 1999-01-13 Philips Electronics N.V. Luminaire
US5890794A (en) 1996-04-03 1999-04-06 Abtahi; Homayoon Lighting units
JPH11177149A (en) 1997-12-10 1999-07-02 Hiyoshi Denshi Kk Electric lamp
US5931570A (en) 1996-05-20 1999-08-03 Hiyoshi Electric Co., Ltd. Light emitting diode lamp
JPH11213730A (en) 1998-01-26 1999-08-06 Mitsubishi Electric Corp Luminaire
US5934798A (en) 1997-03-07 1999-08-10 Truck-Lite Co., Inc. Light emitting diode license lamp
EP0936682A1 (en) 1996-07-29 1999-08-18 Nichia Chemical Industries, Ltd. Light emitting device and display device
US5947588A (en) 1997-10-06 1999-09-07 Grand General Accessories Manufacturing Inc. Light fixture with an LED light bulb having a conventional connection post
US5949347A (en) 1996-09-11 1999-09-07 Leotek Electronics Corporation Light emitting diode retrofitting lamps for illuminated signs
US5956106A (en) 1993-07-27 1999-09-21 Physical Optics Corporation Illuminated display with light source destructuring and shaping device
JPH11260125A (en) 1998-03-13 1999-09-24 Omron Corp Light source module
US5959316A (en) 1998-09-01 1999-09-28 Hewlett-Packard Company Multiple encapsulation of phosphor-LED devices
JP2000022222A (en) 1998-07-07 2000-01-21 Stanley Electric Co Ltd Light emitting diode
WO2000017569A1 (en) 1998-09-17 2000-03-30 Koninklijke Philips Electronics N.V. Led lamp
JP2000173304A (en) 1998-11-30 2000-06-23 Toshiba Lighting & Technology Corp Aviation marker lamp
GB2345954A (en) 1999-01-20 2000-07-26 Ian Lennox Crawford Light bulb with a plastic bulb mounting portion and LED light source.
US6147367A (en) 1997-12-10 2000-11-14 Industrial Technology Research Institute Packaging design for light emitting diode
EP1058221A2 (en) 1999-06-03 2000-12-06 Leotek Electronics Corporation Method and apparatus for retro-fitting a traffic signal light with a light-emitting diode lamp module
JP3138653B2 (en) 1997-02-25 2001-02-26 三山化成株式会社 Injection molding machine
WO2001024583A1 (en) 1999-09-29 2001-04-05 Transportation And Environment Research Institute Ltd. Light emitting diode (led) lamp
US6218785B1 (en) 1999-03-19 2001-04-17 Incerti & Simonini Di Incerti Edda & C. S.N.C. Low-tension lighting device
US6220731B1 (en) 1998-11-10 2001-04-24 Altman Stage Lighting Co., Inc. Cyclorama light
JP2001118403A (en) 1999-10-18 2001-04-27 Tokiwa Dengyo Kk Light-emitting body and signal lamp
US6227679B1 (en) 1999-09-16 2001-05-08 Mule Lighting Inc Led light bulb
US6234648B1 (en) 1998-09-28 2001-05-22 U.S. Philips Corporation Lighting system
WO2001040702A1 (en) 1999-12-03 2001-06-07 Cree Lighting Company Solid state lamp
US6270722B1 (en) * 1999-03-31 2001-08-07 Nalco Chemical Company Stabilized bromine solutions, method of manufacture and uses thereof for biofouling control
WO2001060119A2 (en) 2000-02-11 2001-08-16 Gerhard Abler Lighting body
US6276822B1 (en) 1998-02-20 2001-08-21 Yerchanik Bedrosian Method of replacing a conventional vehicle light bulb with a light-emitting diode array
GB2366610A (en) 2000-09-06 2002-03-13 Mark Shaffer Electroluminscent lamp
US20020047516A1 (en) 2000-10-24 2002-04-25 Tadanobu Iwasa Fluorescent tube
US6404131B1 (en) 1999-08-09 2002-06-11 Yoshichu Mannequin Co., Ltd. Light emitting display
US6465961B1 (en) 2001-08-24 2002-10-15 Cao Group, Inc. Semiconductor light source using a heat sink with a plurality of panels
US20030021113A1 (en) 1998-09-17 2003-01-30 U. S. Philips Corporation LED lamp
US6517221B1 (en) 1999-06-18 2003-02-11 Ciena Corporation Heat pipe heat sink for cooling a laser diode
US6523978B1 (en) 2000-10-27 2003-02-25 Shining Blick Enterprises Co., Ltd. Lamp bulb with stretchable lamp beads therein
US20030038291A1 (en) 2001-08-24 2003-02-27 Densen Cao Semiconductor light source
US6550953B1 (en) 1999-08-20 2003-04-22 Toyoda Gosei Co. Ltd. Light emitting diode lamp device
US20030185005A1 (en) 2002-04-01 2003-10-02 Gelcore, Llc Light emitting diode-based signal light
US6634770B2 (en) 2001-08-24 2003-10-21 Densen Cao Light source using semiconductor devices mounted on a heat sink
US6659632B2 (en) 2001-11-09 2003-12-09 Solidlite Corporation Light emitting diode lamp
CN1465106A (en) 2001-07-26 2003-12-31 松下电工株式会社 Light emitting device using led
US20040021629A1 (en) 2002-07-18 2004-02-05 Citizen Electronics Co., Ltd. Light emitting diode device
US6709132B2 (en) 2001-08-13 2004-03-23 Atex Co., Ltd. LED bulb
DE10251955A1 (en) 2002-11-08 2004-05-19 Hella Kg Hueck & Co. High-power LED insert module for motor vehicle, has dielectric in flat contact with heat sink and conductive track structure
JP2004146225A (en) 2002-10-25 2004-05-20 Kurabe Ind Co Ltd Illumination lighting device
US6746885B2 (en) 2001-08-24 2004-06-08 Densen Cao Method for making a semiconductor light source
US6764202B1 (en) 2002-09-25 2004-07-20 Larry Herring Illuminator
WO2004068599A1 (en) 2003-01-27 2004-08-12 3M Innovative Properties Company Phosphor based light sources having a non-planar short pass reflector and method of making
US20040159846A1 (en) 2003-02-18 2004-08-19 Doxsee Daniel Darcy White light LED device
JP2004241318A (en) 2003-02-07 2004-08-26 Seiwa Electric Mfg Co Ltd Spot lighting fixture
US6803607B1 (en) 2003-06-13 2004-10-12 Cotco Holdings Limited Surface mountable light emitting device
US20040201990A1 (en) 2003-04-10 2004-10-14 Meyer William E. LED lamp
US20040223315A1 (en) 2003-03-03 2004-11-11 Toyoda Gosei Co., Ltd. Light emitting apparatus and method of making same
WO2004100213A2 (en) 2003-05-05 2004-11-18 Gelcore Llc Led-based light bulb
JP2005021635A (en) 2003-07-04 2005-01-27 Amada Insatsu Kako Kk Freely derricking assembly ornamental body
US6848819B1 (en) 1999-05-12 2005-02-01 Osram Opto Semiconductors Gmbh Light-emitting diode arrangement
US6860620B2 (en) 2003-05-09 2005-03-01 Agilent Technologies, Inc. Light unit having light emitting diodes
US6864513B2 (en) 2003-05-07 2005-03-08 Kaylu Industrial Corporation Light emitting diode bulb having high heat dissipating efficiency
US20050068776A1 (en) 2001-12-29 2005-03-31 Shichao Ge Led and led lamp
JP2005093097A (en) 2003-09-12 2005-04-07 Sanyo Electric Co Ltd Lighting system
JP2005108700A (en) 2003-09-30 2005-04-21 Toshiba Lighting & Technology Corp Light source
US6910794B2 (en) 2003-04-25 2005-06-28 Guide Corporation Automotive lighting assembly cooling system
US20050168990A1 (en) 2004-01-13 2005-08-04 Seiko Epson Corporation Light source apparatus and projection display apparatus
US20050174780A1 (en) 2004-02-06 2005-08-11 Daejin Dmp Co., Ltd. LED light
US20050184638A1 (en) 2004-02-23 2005-08-25 Lumileds Lighting, U.S., Llc Wavelength converted semiconductor light emitting devices
US6948829B2 (en) 2004-01-28 2005-09-27 Dialight Corporation Light emitting diode (LED) light bulbs
JP2005277127A (en) 2004-03-25 2005-10-06 Stanley Electric Co Ltd Light-emitting device
US20050219060A1 (en) 2004-04-01 2005-10-06 Curran John W Method and apparatus for providing a notification appliance with a light emitting diode
JP2005286267A (en) 2004-03-31 2005-10-13 Hitachi Lighting Ltd Light emitting diode lamp
US20050225988A1 (en) 2003-05-13 2005-10-13 Light Prescriptions Innovators, Llc Optical device for LED-based lamp
US20050242711A1 (en) 2004-04-30 2005-11-03 Joseph Bloomfield Multi-color solid state light emitting device
WO2005107420A2 (en) 2004-05-05 2005-11-17 Rensselaer Polytechnic Institute High efficiency light source using solid-state emitter and down-conversion material
US20050276053A1 (en) 2003-12-11 2005-12-15 Color Kinetics, Incorporated Thermal management methods and apparatus for lighting devices
US6982518B2 (en) 2003-10-01 2006-01-03 Enertron, Inc. Methods and apparatus for an LED light
JP2006019676A (en) 2003-10-15 2006-01-19 Nichia Chem Ind Ltd Heat sink and semiconductor device equipped with the same
CN1726410A (en) 2002-10-11 2006-01-25 光处方革新有限公司 Compact folded-optics illumination lens
WO2006012043A1 (en) 2004-06-30 2006-02-02 3M Innovative Properties Company Phosphor based illumination system having a short pass reflector and method of making same
JP2006040850A (en) 2004-07-23 2006-02-09 Shuji Fukuya Lighting system using ultraviolet light emitting diode
US6997580B2 (en) 2003-09-19 2006-02-14 Mattel, Inc. Multidirectional light emitting diode unit
JP2006108661A (en) 2004-09-30 2006-04-20 Agilent Technol Inc Light source utilizing wavelength converting material
DE102004051382A1 (en) 2004-10-21 2006-04-27 Oec Ag Microlens array
US20060097385A1 (en) 2004-10-25 2006-05-11 Negley Gerald H Solid metal block semiconductor light emitting device mounting substrates and packages including cavities and heat sinks, and methods of packaging same
US20060097245A1 (en) 2002-08-30 2006-05-11 Aanegola Srinath K Light emitting diode component
US20060105482A1 (en) 2004-11-12 2006-05-18 Lumileds Lighting U.S., Llc Array of light emitting devices to produce a white light source
US7048412B2 (en) 2002-06-10 2006-05-23 Lumileds Lighting U.S., Llc Axial LED source
WO2006059535A2 (en) 2004-11-30 2006-06-08 Matsushita Electric Industrial Co., Ltd. Semiconductor light emitting device, lighting module, illumination apparatus, surface mount led, and bullet led
JP2006148147A (en) 2004-11-15 2006-06-08 Lumileds Lighting Us Llc Overmold lens on led die
JP2006156187A (en) 2004-11-30 2006-06-15 Mitsubishi Electric Corp Led light source device and led electric bulb
US20060138435A1 (en) 2003-05-01 2006-06-29 Cree, Inc. Multiple component solid state white light
US20060152140A1 (en) 2005-01-10 2006-07-13 Brandes George R Light emission device
US20060152820A1 (en) 2005-01-10 2006-07-13 Shi-Hwa Huang Lens and light-emitting device including the lens
US7080924B2 (en) 2002-12-02 2006-07-25 Harvatek Corporation LED light source with reflecting side wall
WO2006065558A3 (en) 2004-12-14 2006-08-03 Cree Inc Semiconductor light emitting device mounting substrates and packages including cavities and cover plates, and methods of packaging same
US7086767B2 (en) 2004-05-12 2006-08-08 Osram Sylvania Inc. Thermally efficient LED bulb
US7086756B2 (en) 2004-03-18 2006-08-08 Lighting Science Group Corporation Lighting element using electronically activated light emitting elements and method of making same
US20060180774A1 (en) 2000-07-28 2006-08-17 Canon Kabushiki Kaisha Photoelectric conversion device, radiation detection apparatus, image processing system and driving method thereof
US7094362B2 (en) 2003-10-29 2006-08-22 General Electric Company Garnet phosphor materials having enhanced spectral characteristics
US20060227558A1 (en) 2005-04-08 2006-10-12 Toshiba Lighting & Technology Corporation Lamp having outer shell to radiate heat of light source
US7140753B2 (en) 2004-08-11 2006-11-28 Harvatek Corporation Water-cooling heat dissipation device adopted for modulized LEDs
US7144135B2 (en) 2003-11-26 2006-12-05 Philips Lumileds Lighting Company, Llc LED lamp heat sink
JP2006331683A (en) 2005-05-23 2006-12-07 Sharp Corp Backlight module, backlight panel, and display device
US7160120B2 (en) 2004-11-18 2007-01-09 Hon Hai Precision Ind. Co., Ltd. Electrical connector having strengthened members
US7160012B2 (en) 2002-01-07 2007-01-09 Patent-Treuhand-Gesellschaft für elektrische Glëhlapen mbH Lamp
US7165866B2 (en) 2004-11-01 2007-01-23 Chia Mao Li Light enhanced and heat dissipating bulb
US7172314B2 (en) 2003-07-29 2007-02-06 Plastic Inventions & Patents, Llc Solid state electric light bulb
JP2007049019A (en) 2005-08-11 2007-02-22 Koha Co Ltd Light emitting device
US20070047232A1 (en) 2005-08-30 2007-03-01 Samsung Electro-Mechanics Co., Ltd. Led lens for backlight
JP2007059930A (en) 2001-08-09 2007-03-08 Matsushita Electric Ind Co Ltd Led lighting fixture and card type led lighting light source
JP2007059911A (en) 2005-08-23 2007-03-08 Avago Technologies Ecbu Ip (Singapore) Pte Ltd Light source with uvled and uv reflector
JP2007081090A (en) 2005-09-14 2007-03-29 Fujikura Ltd White light emitter and lighting device
US20070090737A1 (en) 2005-10-20 2007-04-26 Foxconn Technology Co., Ltd. Light-emitting diode assembly and method of fabrication
US20070091633A1 (en) 2005-10-03 2007-04-26 Kevin Harrity Light apparatus
US7213940B1 (en) 2005-12-21 2007-05-08 Led Lighting Fixtures, Inc. Lighting device and lighting method
JP2006525648T5 (en) 2007-06-21
US20070139949A1 (en) 2005-12-16 2007-06-21 Nichia Corporation Light emitting device
US20070139938A1 (en) 2003-03-31 2007-06-21 Lumination, Llc Led light with active cooling
US20070158668A1 (en) 2005-08-25 2007-07-12 Cree, Inc. Close loop electrophoretic deposition of semiconductor devices
USD546980S1 (en) 2006-10-25 2007-07-17 Hsin-Chih Chung Lee LED bulb
JP2007184330A (en) 2006-01-04 2007-07-19 Rohm Co Ltd Light-emitting device and manufacturing method therefor
US20070206375A1 (en) 2000-04-24 2007-09-06 Color Kinetics Incorporated Light emitting diode based products
US7270446B2 (en) 2005-05-09 2007-09-18 Lighthouse Technology Co., Ltd Light module with combined heat transferring plate and heat transferring pipes
US20070215890A1 (en) 2006-03-17 2007-09-20 Philips Lumileds Lighting Company, Llc White LED for backlight with phosphor plates
US20070223219A1 (en) 2005-01-10 2007-09-27 Cree, Inc. Multi-chip light emitting device lamps for providing high-cri warm white light and light fixtures including the same
USD553267S1 (en) 2007-02-09 2007-10-16 Wellion Asia Limited LED light bulb
WO2007130358A2 (en) 2006-05-02 2007-11-15 Superbulbs, Inc. Plastic led bulb
US20070263405A1 (en) 2006-05-11 2007-11-15 Ng Kee Y Semiconductor light source configured as a light tube
US20070274080A1 (en) 2006-05-23 2007-11-29 Led Lighting Fixtures, Inc. Lighting device
US20070285924A1 (en) 2002-12-18 2007-12-13 General Electric Company Integral ballast lamp thermal management method and apparatus
WO2007146566A2 (en) 2006-06-08 2007-12-21 Lighting Science Group Corporation Apparatus with a packed circuitry within a lightbulb
US20070297183A1 (en) 2006-06-21 2007-12-27 Coushaine Charles M Heat sink
JP2008028183A (en) 2006-07-21 2008-02-07 Tokyo Seimitsu Co Ltd Method for storing wafer
US20080037257A1 (en) 2002-12-11 2008-02-14 Charles Bolta Light emitting diode (L.E.D.) lighting fixtures with emergency back-up and scotopic enhancement
WO2008018002A2 (en) 2006-08-09 2008-02-14 Koninklijke Philips Electronics N.V. Illumination device with wavelength converting element side holding heat sink
CN101128695A (en) 2005-02-24 2008-02-20 莱特浩斯科技有限公司 Light emitting device and light emitting object using the same
US20080055908A1 (en) 2006-08-30 2008-03-06 Chung Wu Assembled structure of large-sized led lamp
US20080062694A1 (en) 2006-09-07 2008-03-13 Foxconn Technology Co., Ltd. Heat dissipation device for light emitting diode module
US7350936B2 (en) 1999-11-18 2008-04-01 Philips Solid-State Lighting Solutions, Inc. Conventionally-shaped light bulbs employing white LEDs
US20080080165A1 (en) 2006-10-02 2008-04-03 Samsung Electro-Mechanics Co. Ltd. Surface light source device using light emitting diodes
US7354174B1 (en) 2005-12-05 2008-04-08 Technical Consumer Products, Inc. Energy efficient festive lamp
JP2008091140A (en) 2006-09-29 2008-04-17 Toshiba Lighting & Technology Corp Led bulb and lighting equipment
US20080093615A1 (en) 2006-10-23 2008-04-24 Chang Gung University Method for obtaining a better color rendering with a photoluminescence plate
US20080106893A1 (en) 2006-04-25 2008-05-08 S. C. Johnson & Son, Inc. Lamp and bulb for illumination and ambiance lighting
WO2008052318A1 (en) 2006-10-31 2008-05-08 Tir Technology Lp Light source comprising a light-excitable medium
JP2008108835A (en) 2006-10-24 2008-05-08 Harison Toshiba Lighting Corp Semiconductor light emitting device and method for manufacturing the same
US20080117620A1 (en) 2004-12-17 2008-05-22 Nichia Corporation Light emitting device
US7377674B2 (en) 2005-10-28 2008-05-27 Advanced Accessory Systems, Llc Low profile light for article carrier system
US20080128735A1 (en) 2006-12-05 2008-06-05 Samsung Electro-Mechanics Co., Ltd. White light emitting device and white light source module using the same
US20080149166A1 (en) 2006-12-21 2008-06-26 Goldeneye, Inc. Compact light conversion device and light source with high thermal conductivity wavelength conversion material
DE102006061164A1 (en) 2006-12-22 2008-06-26 Osram Opto Semiconductors Gmbh The light emitting device
US7396142B2 (en) 2005-03-25 2008-07-08 Five Star Import Group, L.L.C. LED light bulb
US20080173884A1 (en) 2007-01-22 2008-07-24 Cree, Inc. Wafer level phosphor coating method and devices fabricated utilizing method
US7405857B2 (en) 2001-01-17 2008-07-29 3M Innovative Properties Company Light emitting diode (LED) device and method of making same
US20080179611A1 (en) 2007-01-22 2008-07-31 Cree, Inc. Wafer level phosphor coating method and devices fabricated utilizing method
US7413325B2 (en) 2005-12-28 2008-08-19 International Development Corporation LED bulb
CN101262032A (en) 2007-03-07 2008-09-10 光宝科技股份有限公司 White light LED
US20080232119A1 (en) 2007-03-21 2008-09-25 Thomas Ribarich Led lamp assembly with temperature control and method of making the same
WO2008117211A1 (en) 2007-03-26 2008-10-02 Koninklijke Philips Electronics N.V. Lighting device
JP2008262765A (en) 2007-04-11 2008-10-30 Stanley Electric Co Ltd Light-emitting diode lamp fitting with wave length conversion layer
DE102007037862A1 (en) 2007-08-10 2008-10-30 Siemens Ag Heating arrangement, used on LED arrays, improved cooling performances at high oscillation frequencies
WO2008134056A1 (en) 2007-04-26 2008-11-06 Deak-Lam Inc. Photon energy coversion structure
US20080285279A1 (en) 2007-04-23 2008-11-20 Kai Kong Ng Light emitting diode (LED) light bulb
USD581556S1 (en) 2007-10-19 2008-11-25 Koninklijke Philips Electronics N.V. Solid state lighting spot
JP2008288409A (en) 2007-05-18 2008-11-27 Toshiba Corp Light-emitting device, and manufacturing method thereof
WO2008146229A2 (en) 2007-05-29 2008-12-04 Koninklijke Philips Electronics N.V. Illumination system, luminaire and backlighting unit
JP2008300117A (en) 2007-05-30 2008-12-11 Toshiba Lighting & Technology Corp Light emitting diode lighting system
JP2008300203A (en) 2007-05-31 2008-12-11 Toshiba Lighting & Technology Corp Luminaire
JP2008300570A (en) 2007-05-30 2008-12-11 Panasonic Electric Works Co Ltd Light emitting device
JP2008300460A (en) 2007-05-29 2008-12-11 Toshiba Corp Optical semiconductor device
DE202008013667U1 (en) 2008-10-15 2008-12-18 Li, Chia-Mao Multi-shell reflector cup
US20080308825A1 (en) 2007-06-14 2008-12-18 Cree, Inc. Encapsulant with scatterer to tailor spatial emission pattern and color uniformity in light emitting diodes
US20090001399A1 (en) 2007-06-27 2009-01-01 The Regents Of The University Of California Optical designs for high-efficacy white-light emitting diodes
US20090015137A1 (en) 2007-07-13 2009-01-15 Lite-On Technology Corporation Light emitting apparatus with open loop control
JP2009016153A (en) 2007-07-04 2009-01-22 Yohohama Electron Kk Led lamp for illumination
JP2009016058A (en) 2007-06-29 2009-01-22 Toshiba Lighting & Technology Corp Illumination device, and illumination fixture using this
JP2009021264A (en) 2008-10-17 2009-01-29 Sanyo Electric Co Ltd Illuminating device
US20090040760A1 (en) 2007-08-10 2009-02-12 Kuo-Hsin Chen Illumination device having unidirectional heat-dissipating route
US20090046473A1 (en) 2007-08-13 2009-02-19 Topco Technologies Corp. Light-emitting diode lamp
WO2009024952A2 (en) 2007-08-23 2009-02-26 Koninklijke Philips Electronics N.V. Light source including reflective wavelength-converting layer
US20090059559A1 (en) 2007-08-28 2009-03-05 Wolfgang Pabst Led lamp
US20090058256A1 (en) 2007-08-31 2009-03-05 Iwao Mitsuishi Light-emitting device
US20090067180A1 (en) 2006-02-28 2009-03-12 Ghollam Tahmosybayat Lens assembly
US20090086492A1 (en) 2007-09-27 2009-04-02 Osram Sylvania Inc LED lamp with heat sink optic
US20090095960A1 (en) 2003-10-15 2009-04-16 Nichia Corporation Heat dissipation member, semiconductor apparatus and semiconductor light emitting apparatus
WO2009052099A1 (en) 2007-10-17 2009-04-23 Xicato, Inc. Illumination device with light emitting diodes and movable light adjustment member
US20090103296A1 (en) 2007-10-17 2009-04-23 Xicato, Inc. Illumination Device with Light Emitting Diodes
US20090101930A1 (en) 2007-10-17 2009-04-23 Intematix Corporation Light emitting device with phosphor wavelength conversion
US20090113296A1 (en) 2007-10-26 2009-04-30 Microsoft Corporation Displaying a map and associated symbolic context information
US20090116217A1 (en) 2007-11-06 2009-05-07 Prodisc Technology Inc. LED lighting apparatus having separate wavelength conversion unit
JP2009117346A (en) 2007-10-16 2009-05-28 Momo Alliance Co Ltd Illuminating device
US7547124B2 (en) 2006-11-17 2009-06-16 Foxconn Technology Co., Ltd. LED lamp cooling apparatus with pulsating heat pipe
US7553047B2 (en) 2006-06-01 2009-06-30 Samsung Electronics Co., Ltd. Lighting device
US20090175041A1 (en) 2007-01-07 2009-07-09 Pui Hang Yuen High efficiency low cost safety light emitting diode illumination device
US20090184618A1 (en) 2008-01-18 2009-07-23 Sanyo Electric Co., Ltd. Light-emitting device and lighting apparatus incorporating same
WO2009091562A2 (en) 2008-01-15 2009-07-23 Philip Premysler Omnidirectional led light bulb
WO2009093163A2 (en) 2008-01-22 2009-07-30 Koninklijke Philips Electronics N.V. Illumination device with led and a transmissive support comprising a luminescent material
US20090190353A1 (en) 2005-03-22 2009-07-30 Tom Barker Modular display system
US20090195186A1 (en) 2008-02-06 2009-08-06 C. Crane Company, Inc. Light emitting diode lighting device
US20090201679A1 (en) 2006-09-20 2009-08-13 Daijiro Konaka Led lamp
WO2009107052A1 (en) 2008-02-27 2009-09-03 Koninklijke Philips Electronics N.V. Illumination device with led and one or more transmissive windows
US20090217970A1 (en) 2008-03-01 2009-09-03 Goldeneye, Inc. Fixtures for large area directional and isotropic solid state lighting panels
WO2009119038A2 (en) 2008-03-28 2009-10-01 Panasonic Corporation Molded resin product, semiconductor light-emitting source, lighting device, and method for manufacturing molded resin product
US7600882B1 (en) 2009-01-20 2009-10-13 Lednovation, Inc. High efficiency incandescent bulb replacement lamp
WO2009125314A2 (en) 2008-04-08 2009-10-15 Koninklijke Philips Electronics N.V. Illumination device with led and a transmissive support comprising a luminescent material
US20090262516A1 (en) 2008-01-17 2009-10-22 Intematix Corporation Light emitting device with phosphor wavelength conversion
WO2009128004A1 (en) 2008-04-17 2009-10-22 Koninklijke Philips Electronics N.V. Led based light source
US7607802B2 (en) 2007-07-23 2009-10-27 Tamkang University LED lamp instantly dissipating heat as effected by multiple-layer substrates
WO2009131627A1 (en) 2008-04-25 2009-10-29 Cree, Inc. Semiconductor light emitting devices with separated wavelength conversion materials and methods of forming the same
US20090273924A1 (en) * 2006-07-17 2009-11-05 Liquidleds Lighting Corp. High power LED lamp with heat dissipation enhancement
US20090273727A1 (en) 2004-12-03 2009-11-05 Sony Corporation Light-emission lens, light-emitting element assembly, sheet-shaped light source device and color liquid crystal display assembly
US7614759B2 (en) 2005-12-22 2009-11-10 Cree Led Lighting Solutions, Inc. Lighting device
JP2009266780A (en) 2008-04-30 2009-11-12 Toshiba Lighting & Technology Corp Luminous body and luminaire
US7618157B1 (en) 2008-06-25 2009-11-17 Osram Sylvania Inc. Tubular blue LED lamp with remote phosphor
US20090283779A1 (en) 2007-06-14 2009-11-19 Cree, Inc. Light source with near field mixing
JP2009277586A (en) 2008-05-16 2009-11-26 San Corporation Kk Electric lamp type led luminaire
WO2009143047A2 (en) 2008-05-23 2009-11-26 Altair Engineering, Inc. Electric shock resistant l.e.d. based light
US20090296387A1 (en) 2008-05-27 2009-12-03 Sea Gull Lighting Products, Llc Led retrofit light engine
US20090310368A1 (en) 2006-04-28 2009-12-17 Edda Incerti Device for Redirecting the Luminous Flux Emitted by One or More LED
JP2009295299A (en) 2008-06-02 2009-12-17 Tamura Seisakusho Co Ltd Illumination body
US20090316383A1 (en) 2008-06-20 2009-12-24 Seoul Semiconductor Co., Ltd. Lighting apparatus
US20090316073A1 (en) 2006-01-20 2009-12-24 Au Optronics Corporation Light Diffusion Module and a Back Light Module Using the Same
WO2009158422A1 (en) 2008-06-26 2009-12-30 Osram Sylvania, Inc. Led lamp with remote phosphor coating and method of making the lamp
US20090322208A1 (en) 2008-06-30 2009-12-31 Alex Shaikevitch Light emitting device having a refractory phosphor layer
US20090322197A1 (en) 2008-06-30 2009-12-31 Rene Helbing Light emitting device having a transparent thermally conductive layer
US20090323333A1 (en) 2008-06-25 2009-12-31 Foxconn Technology Co., Ltd. Led lamp
US20090322800A1 (en) 2008-06-25 2009-12-31 Dolby Laboratories Licensing Corporation Method and apparatus in various embodiments for hdr implementation in display devices
EP2146135A2 (en) 2008-07-09 2010-01-20 Ushiodenki Kabushiki Kaisha Light emitting device and method for producing the light emitting device
US20100014839A1 (en) 2006-09-14 2010-01-21 Koninklijke Philips Electronics N.V. Lighting assembly and method for providing cooling of a light source
JP2010016223A (en) 2008-07-04 2010-01-21 Panasonic Corp Lamp
US20100020547A1 (en) 2005-02-10 2010-01-28 Deepsea Power & Light Company Led illumination device with cubic zirconia lens
CN101641623A (en) 2007-02-12 2010-02-03 英特曼帝克司公司 Light emitting diode lighting system
WO2010013893A1 (en) 2008-07-29 2010-02-04 Seoul Semiconductor Co., Ltd. Warm white light emitting apparatus and back light module comprising the same
WO2010012999A2 (en) 2008-07-30 2010-02-04 Photonstar Led Limited Tunable colour led module
US20100027258A1 (en) * 2008-07-31 2010-02-04 Maxik Fredric S Illumination apparatus for conducting and dissipating heat from a light source
US20100026185A1 (en) 2008-07-31 2010-02-04 Toshiba Lighting & Technology Corporation Self-ballasted lamp
US7663315B1 (en) 2007-07-24 2010-02-16 Ilight Technologies, Inc. Spherical bulb for light-emitting diode with spherical inner cavity
EP2154420A1 (en) 2008-08-13 2010-02-17 GE Investment Co., Ltd. Light-emitting diode illumination apparatus
US20100038660A1 (en) 2008-08-13 2010-02-18 Progressive Cooling Solutions, Inc. Two-phase cooling for light-emitting devices
JP2010040494A (en) 2008-08-07 2010-02-18 Msm Tech Co Ltd Fluorescent lamp type led lamp capable of attaching and detaching led driving device
KR100944181B1 (en) 2009-04-07 2010-02-24 용남순 Led lamp with a radial shape
US20100046231A1 (en) 2007-03-01 2010-02-25 Medinis David M Led cooling system
US20100060144A1 (en) 2002-03-25 2010-03-11 Koninklijke Philips Electronics N.V. Tri-color white light led lamp
US7686478B1 (en) 2007-01-12 2010-03-30 Ilight Technologies, Inc. Bulb for light-emitting diode with color-converting insert
KR20100037353A (en) 2008-10-01 2010-04-09 주식회사 아모럭스 Radiator and bulb type led lighting apparatus using the same
US20100091487A1 (en) 2008-10-13 2010-04-15 Hyundai Telecommunication Co., Ltd. Heat dissipation member having variable heat dissipation paths and led lighting flood lamp using the same
US20100102707A1 (en) 2008-10-29 2010-04-29 Kabushiki Kaisha Toshiba Red fluorescent substance and light-emitting device employing the same
WO2010052640A1 (en) 2008-11-06 2010-05-14 Koninklijke Philips Electronics N.V. Illumination device
US7726836B2 (en) 2007-11-23 2010-06-01 Taiming Chen Light bulb with light emitting elements for use in conventional incandescent light bulb sockets
US20100134047A1 (en) 2009-05-15 2010-06-03 Ghulam Hasnain Modular LED Light Bulb
US20100140655A1 (en) 2009-02-26 2010-06-10 Wei Shi Transparent heat spreader for leds
JP2010129300A (en) 2008-11-26 2010-06-10 Hideki Iimura Semiconductor light-emitting lamp and electric-bulb-shaped semiconductor light-emitting lamp
US20100149783A1 (en) 2008-12-12 2010-06-17 Toshiba Lighting & Technology Corporation Light-emitting module and illumination apparatus
US20100149814A1 (en) 2008-12-17 2010-06-17 Lednovation, Inc. Semiconductor Lighting Device With Wavelength Conversion on Back-Transferred Light Path
US7740365B2 (en) 2005-09-03 2010-06-22 Osram Opto Semiconductors Gmbh Backlighting arrangement with semiconductor light sources arranged in light groups and lighting device
US20100170075A1 (en) 2007-06-05 2010-07-08 I2Ic Corporation Method of Manufacturing Multicolored Illuminator
US7753568B2 (en) 2007-01-23 2010-07-13 Foxconn Technology Co., Ltd. Light-emitting diode assembly and method of fabrication
US20100177522A1 (en) 2009-01-15 2010-07-15 Yeh-Chiang Technology Corp. Led lamp
FR2941346A1 (en) 2009-01-21 2010-07-23 Cassiopee Decoration Lighting device for illuminating lamp, has electrical power supplying units having rigid pins and electric wire for supplying electrical power to LEDs and extending in conduit when plate is installed on free end of support part
US20100201284A1 (en) 2007-09-24 2010-08-12 Osram Gesellschaft Mit Beschraenkter Haftung Illuminating device with light buffer
US20100207502A1 (en) * 2009-02-17 2010-08-19 Densen Cao LED Light Bulbs for Space Lighting
US20100219735A1 (en) 2009-02-27 2010-09-02 Toshiba Lighting & Technology Corporation Lighting device and lighting fixture
KR100980588B1 (en) 2009-08-27 2010-09-06 윤인숙 Led lamp
US20100232134A1 (en) 2009-03-10 2010-09-16 Nepes Led, Inc. Light emitting device and lamp-cover structure containing luminescent material
US20100246165A1 (en) 2009-03-31 2010-09-30 Diaz Edmundo B Invisible and/ or non-invisible designed inflatables combined with electric black ultra-violet lights and inflator nozzle fixture accessories
US20100244729A1 (en) 2009-03-30 2010-09-30 Amerihua International Enterprises Inc. Gazing Ball Having A Battery-Powered LED Device
US7810954B2 (en) 2007-12-03 2010-10-12 Lumination Llc LED-based changeable color light lamp
US20100264799A1 (en) 2009-04-20 2010-10-21 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Led lamp
WO2010119618A1 (en) 2009-04-13 2010-10-21 日東光学株式会社 Light emitting device and bulb-type led lamp
US7824065B2 (en) 2004-03-18 2010-11-02 Lighting Science Group Corporation System and method for providing multi-functional lighting using high-efficiency lighting elements in an environment
WO2010128419A1 (en) 2009-05-04 2010-11-11 Koninklijke Philips Electronics N.V. Light source comprising a light emitter arranged inside a translucent outer envelope
JP2010267826A (en) 2009-05-15 2010-11-25 Rohm Co Ltd Led lighting system and liquid crystal display device
USD629928S1 (en) 2010-04-05 2010-12-28 Foxconn Technology Co., Ltd. LED lamp
US20100327745A1 (en) 2009-06-24 2010-12-30 Mahendra Dassanayake Opto-thermal solution for multi-utility solid state lighting device using conic section geometries
KR20110008445A (en) 2009-07-20 2011-01-27 백일선 Connector having a portion for grounding
US20110037368A1 (en) 2009-08-14 2011-02-17 Risun Expanse Corp. Lamp structure
US20110044022A1 (en) 2009-08-20 2011-02-24 Illumitex, Inc. System and method for a phosphor coated lens
US20110058379A1 (en) 2008-05-08 2011-03-10 Lok-F Gmbh Lamp Device
US20110074296A1 (en) 2009-09-28 2011-03-31 Yu-Nung Shen Light-Emitting Diode Illumination Apparatuses
US20110074271A1 (en) 2009-09-25 2011-03-31 Toshiba Lighting & Technology Corporation Lamp and lighting equipment
US20110080096A1 (en) 2009-10-02 2011-04-07 Lumination Llc Led lamp
US20110080740A1 (en) 2009-10-02 2011-04-07 Lumination Llc Led lamp with uniform omnidirectional light intensity output
US20110089830A1 (en) 2009-10-20 2011-04-21 Cree Led Lighting Solutions, Inc. Heat sinks and lamp incorporating same
US20110089804A1 (en) 2008-07-15 2011-04-21 Nuventix Inc. Thermal management of led-based illumination devices with synthetic jet ejectors
US20110095686A1 (en) 2009-10-22 2011-04-28 Light Prescriptions Innovators, Llc Solid-state light bulb
US7976335B2 (en) 2007-05-01 2011-07-12 Tyco Electronics Corporation LED connector assembly with heat sink
US20110176316A1 (en) 2011-03-18 2011-07-21 Phipps J Michael Semiconductor lamp with thermal handling system
US20110175528A1 (en) 2010-02-01 2011-07-21 Renaissance Lighting, Inc. Lamp using solid state source and doped semiconductor nanophosphor
US7989236B2 (en) 2007-12-27 2011-08-02 Toyoda Gosei Co., Ltd. Method of making phosphor containing glass plate, method of making light emitting device
WO2011100193A1 (en) 2010-02-12 2011-08-18 Cree, Inc. Lighting device with heat dissipation elements
US20110215699A1 (en) 2010-03-03 2011-09-08 Cree, Inc. Solid state lamp and bulb
US20110215696A1 (en) 2010-03-03 2011-09-08 Cree, Inc. Led based pedestal-type lighting structure
US20110216523A1 (en) 2010-03-03 2011-09-08 Tao Tong Non-uniform diffuser to scatter light into uniform emission pattern
WO2011109098A2 (en) 2010-03-03 2011-09-09 Cree, Inc. Solid state lamp and bulb
US20110242816A1 (en) * 2010-04-02 2011-10-06 GE Lighting Solutions, LLC Lightweight heat sinks and led lamps employing same
US20110267835A1 (en) 2009-01-09 2011-11-03 Koninklijke Philips Electronics N.V. Light source
US20110273072A1 (en) 2010-05-10 2011-11-10 Yadent Co., Ltd. Light bulb
US20110291560A1 (en) 2010-06-01 2011-12-01 Young Lighting Technology Corporation Illuminating device
US20110298371A1 (en) 2010-06-08 2011-12-08 Cree, Inc. Led light bulbs
WO2012011279A1 (en) 2010-07-20 2012-01-26 パナソニック株式会社 Lightbulb shaped lamp
US20120040585A1 (en) 2010-08-10 2012-02-16 David Huang Method of Assembling An Airtight LED Light Bulb
WO2012031533A1 (en) 2010-09-08 2012-03-15 浙江锐迪生光电有限公司 Led lamp bulb and led lighting bar capable of emitting light over 4π
EP2469154A1 (en) 2010-01-14 2012-06-27 Toshiba Lighting&Technology Corporation Light bulb-shaped lamp and lighting fixture
US20120161626A1 (en) 2010-12-22 2012-06-28 Cree, Inc. Led lamp with high color rendering index
US8235571B2 (en) 2004-06-30 2012-08-07 Lg Display Co., Ltd. Backlight unit of liquid crystal display device and liquid crystal display device using the same
US8253316B2 (en) 2009-05-13 2012-08-28 Light Prescriptions Innovators, Llc Dimmable LED lamp
DE102011004718A1 (en) 2011-02-25 2012-08-30 Osram Ag Method for manufacturing transparent cover of incandescent lamp-retrofit lamp, involves inserting inner piston wall into outer piston wall so that hollow space is formed between walls, and introducing heat conducting filling into space
US8272762B2 (en) 2010-09-28 2012-09-25 Lighting Science Group Corporation LED luminaire
US8282250B1 (en) 2011-06-09 2012-10-09 Elumigen Llc Solid state lighting device using heat channels in a housing
US8292468B2 (en) 2009-06-10 2012-10-23 Rensselaer Polytechnic Institute Solid state light source light bulb
US8309969B2 (en) 2008-11-20 2012-11-13 Toyoda Gosei Co., Ltd. Light emitting device and method of making same
US8314537B2 (en) 2008-11-18 2012-11-20 Koninklijke Philips Electronics N.V. Electric lamp
US20120320591A1 (en) 2011-06-17 2012-12-20 Enlight Corporation Light bulb
US8348470B2 (en) 2009-07-28 2013-01-08 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. LED illuminating device
US8371722B2 (en) 2009-11-04 2013-02-12 Forever Bulb, Llc LED-based light bulb device with Kelvin corrective features
US20130049018A1 (en) 2011-08-30 2013-02-28 Abl Ip Holding Llc Optical/electrical transducer using semiconductor nanowire wicking structure in a thermal conductivity and phase transition heat transfer mechanism
US20130063945A1 (en) 2011-09-12 2013-03-14 Chaun-Choung Technology Corp. Bulb-type led lamp having replaceable light source module
US8410512B2 (en) 2009-11-25 2013-04-02 Cree, Inc. Solid state light emitting apparatus with thermal management structures and methods of manufacturing
US8415865B2 (en) 2011-01-18 2013-04-09 Silitek Electronic (Guangzhou) Co., Ltd. Light-guide type illumination device
US8421320B2 (en) 2011-01-24 2013-04-16 Sheng-Yi CHUANG LED light bulb equipped with light transparent shell fastening structure
US8421321B2 (en) 2011-01-24 2013-04-16 Sheng-Yi CHUANG LED light bulb
US8421322B2 (en) 2008-06-04 2013-04-16 Forever Bulb, Llc LED-based light bulb device
US20130119280A1 (en) 2010-07-12 2013-05-16 National University Corporation Nagoya University Broadband infrared light emitting device
US8449154B2 (en) 2009-09-30 2013-05-28 Panasonic Corporation Illumination device including a light-emitting module fastened to mount member with a constant orientation
US8502468B2 (en) 2010-09-06 2013-08-06 Lite-On Electronics (Guangzhou) Limited Light emitting bulb, luminary and illumination device using LED
US20130249374A1 (en) 2012-03-26 2013-09-26 Cree, Inc. Passive phase change radiators for led lamps and fixtures
US8568009B2 (en) 2010-08-20 2013-10-29 Dicon Fiberoptics Inc. Compact high brightness LED aquarium light apparatus, using an extended point source LED array with light emitting diodes
US20130293098A1 (en) 2006-08-03 2013-11-07 Intematix Corporation Solid-state linear lighting arrangements including light emitting phosphor
US8641237B2 (en) 2012-02-09 2014-02-04 Sheng-Yi CHUANG LED light bulb providing high heat dissipation efficiency
US8696168B2 (en) 2011-04-26 2014-04-15 Lite-On Electronics (Guangzhou) Limited Illumination device
US8740415B2 (en) 2011-07-08 2014-06-03 Switch Bulb Company, Inc. Partitioned heatsink for improved cooling of an LED bulb
US8750671B1 (en) 2009-04-16 2014-06-10 Fusion Optix, Inc Light bulb with omnidirectional output
US8752984B2 (en) 2007-10-03 2014-06-17 Switch Bulb Company, Inc. Glass LED light bulbs
US8922106B2 (en) 2009-06-02 2014-12-30 Bridgelux, Inc. Light source with optics to produce a spherical emission pattern

Patent Citations (395)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006525648T5 (en) 2007-06-21
JP2008508742T5 (en) 2008-08-21
JP2003515899T5 (en) 2007-12-20
US2394992A (en) 1943-06-30 1946-02-19 Holophane Co Inc Lighting unit
US3143592A (en) 1961-11-14 1964-08-04 Inland Electronics Products Co Heat dissipating mounting structure for semiconductor devices
US3581162A (en) 1969-07-01 1971-05-25 Rca Corp Optical semiconductor device
GB1423011A (en) 1972-02-22 1976-01-28 Northern Electric Co Light emitting devices
US4204246A (en) 1976-02-14 1980-05-20 Sony Corporation Cooling assembly for cooling electrical parts wherein a heat pipe is attached to a heat conducting portion of a heat conductive block
US4727289A (en) 1985-07-22 1988-02-23 Stanley Electric Co., Ltd. LED lamp
US5140220A (en) 1985-12-02 1992-08-18 Yumi Sakai Light diffusion type light emitting diode
JPH0381903A (en) 1989-08-24 1991-04-08 Fuji Electric Co Ltd Display device
US5838101A (en) 1992-10-28 1998-11-17 Gte Products Corporation Fluorescent lamp with improved CRI and brightness
JPH06283006A (en) 1993-03-26 1994-10-07 Toshiba Lighting & Technol Corp Glass globe for illumination and lighting fixture
DE4311937A1 (en) 1993-04-10 1994-10-13 Telefunken Microelectron Light-emitting device
US5956106A (en) 1993-07-27 1999-09-21 Physical Optics Corporation Illuminated display with light source destructuring and shaping device
US5655830A (en) 1993-12-01 1997-08-12 General Signal Corporation Lighting device
US5463280A (en) 1994-03-03 1995-10-31 National Service Industries, Inc. Light emitting diode retrofit lamp
US5535230A (en) 1994-04-06 1996-07-09 Shogo Tzuzuki Illuminating light source device using semiconductor laser element
US5581683A (en) 1994-04-07 1996-12-03 Northern Telecom Limited Light diffusing apparatus with U-shaped light guide
US5585783A (en) 1994-06-28 1996-12-17 Hall; Roger E. Marker light utilizing light emitting diodes disposed on a flexible circuit board
US5561346A (en) 1994-08-10 1996-10-01 Byrne; David J. LED lamp construction
US5519596A (en) 1995-05-16 1996-05-21 Hewlett-Packard Company Moldable nesting frame for light emitting diode array
US5688042A (en) 1995-11-17 1997-11-18 Lumacell, Inc. LED lamp
US5806965A (en) 1996-01-30 1998-09-15 R&M Deese, Inc. LED beacon light
JPH09265807A (en) 1996-03-29 1997-10-07 Toshiba Lighting & Technol Corp Led light source, led signal lamp, and traffic signal
US5890794A (en) 1996-04-03 1999-04-06 Abtahi; Homayoon Lighting units
US5931570A (en) 1996-05-20 1999-08-03 Hiyoshi Electric Co., Ltd. Light emitting diode lamp
EP0936682A1 (en) 1996-07-29 1999-08-18 Nichia Chemical Industries, Ltd. Light emitting device and display device
US5949347A (en) 1996-09-11 1999-09-07 Leotek Electronics Corporation Light emitting diode retrofitting lamps for illuminated signs
EP0890059A1 (en) 1997-01-23 1999-01-13 Philips Electronics N.V. Luminaire
US6250774B1 (en) 1997-01-23 2001-06-26 U.S. Philips Corp. Luminaire
JP3138653B2 (en) 1997-02-25 2001-02-26 三山化成株式会社 Injection molding machine
US5934798A (en) 1997-03-07 1999-08-10 Truck-Lite Co., Inc. Light emitting diode license lamp
US5850126A (en) 1997-04-11 1998-12-15 Kanbar; Maurice S. Screw-in led lamp
EP0876085A2 (en) 1997-04-24 1998-11-04 Incerti & Simonini di Incerti Edda & C. S.n.c. A low tension lighting device
EP0876085B1 (en) 1997-04-24 2004-02-25 Incerti & Simonini di Incerti Edda & C. S.n.c. A low tension lighting device
US5947588A (en) 1997-10-06 1999-09-07 Grand General Accessories Manufacturing Inc. Light fixture with an LED light bulb having a conventional connection post
JPH11177149A (en) 1997-12-10 1999-07-02 Hiyoshi Denshi Kk Electric lamp
US6147367A (en) 1997-12-10 2000-11-14 Industrial Technology Research Institute Packaging design for light emitting diode
JPH11213730A (en) 1998-01-26 1999-08-06 Mitsubishi Electric Corp Luminaire
US6276822B1 (en) 1998-02-20 2001-08-21 Yerchanik Bedrosian Method of replacing a conventional vehicle light bulb with a light-emitting diode array
JPH11260125A (en) 1998-03-13 1999-09-24 Omron Corp Light source module
JP2000022222A (en) 1998-07-07 2000-01-21 Stanley Electric Co Ltd Light emitting diode
US5959316A (en) 1998-09-01 1999-09-28 Hewlett-Packard Company Multiple encapsulation of phosphor-LED devices
US6220722B1 (en) 1998-09-17 2001-04-24 U.S. Philips Corporation Led lamp
US20030021113A1 (en) 1998-09-17 2003-01-30 U. S. Philips Corporation LED lamp
WO2000017569A1 (en) 1998-09-17 2000-03-30 Koninklijke Philips Electronics N.V. Led lamp
JP2002525814A (en) 1998-09-17 2002-08-13 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ Led light bulb
US6234648B1 (en) 1998-09-28 2001-05-22 U.S. Philips Corporation Lighting system
US6220731B1 (en) 1998-11-10 2001-04-24 Altman Stage Lighting Co., Inc. Cyclorama light
JP2000173304A (en) 1998-11-30 2000-06-23 Toshiba Lighting & Technology Corp Aviation marker lamp
GB2345954A (en) 1999-01-20 2000-07-26 Ian Lennox Crawford Light bulb with a plastic bulb mounting portion and LED light source.
US6218785B1 (en) 1999-03-19 2001-04-17 Incerti & Simonini Di Incerti Edda & C. S.N.C. Low-tension lighting device
US6270722B1 (en) * 1999-03-31 2001-08-07 Nalco Chemical Company Stabilized bromine solutions, method of manufacture and uses thereof for biofouling control
US6848819B1 (en) 1999-05-12 2005-02-01 Osram Opto Semiconductors Gmbh Light-emitting diode arrangement
EP1058221A2 (en) 1999-06-03 2000-12-06 Leotek Electronics Corporation Method and apparatus for retro-fitting a traffic signal light with a light-emitting diode lamp module
US6517221B1 (en) 1999-06-18 2003-02-11 Ciena Corporation Heat pipe heat sink for cooling a laser diode
US6404131B1 (en) 1999-08-09 2002-06-11 Yoshichu Mannequin Co., Ltd. Light emitting display
US6550953B1 (en) 1999-08-20 2003-04-22 Toyoda Gosei Co. Ltd. Light emitting diode lamp device
US6227679B1 (en) 1999-09-16 2001-05-08 Mule Lighting Inc Led light bulb
WO2001024583A1 (en) 1999-09-29 2001-04-05 Transportation And Environment Research Institute Ltd. Light emitting diode (led) lamp
JP2001118403A (en) 1999-10-18 2001-04-27 Tokiwa Dengyo Kk Light-emitting body and signal lamp
US7350936B2 (en) 1999-11-18 2008-04-01 Philips Solid-State Lighting Solutions, Inc. Conventionally-shaped light bulbs employing white LEDs
CN1425117A (en) 1999-12-03 2003-06-18 美商克立光学公司 Solid state lamp
US6350041B1 (en) 1999-12-03 2002-02-26 Cree Lighting Company High output radial dispersing lamp using a solid state light source
WO2001040702A1 (en) 1999-12-03 2001-06-07 Cree Lighting Company Solid state lamp
WO2001060119A2 (en) 2000-02-11 2001-08-16 Gerhard Abler Lighting body
US20070206375A1 (en) 2000-04-24 2007-09-06 Color Kinetics Incorporated Light emitting diode based products
US20060180774A1 (en) 2000-07-28 2006-08-17 Canon Kabushiki Kaisha Photoelectric conversion device, radiation detection apparatus, image processing system and driving method thereof
GB2366610A (en) 2000-09-06 2002-03-13 Mark Shaffer Electroluminscent lamp
US20020047516A1 (en) 2000-10-24 2002-04-25 Tadanobu Iwasa Fluorescent tube
US6523978B1 (en) 2000-10-27 2003-02-25 Shining Blick Enterprises Co., Ltd. Lamp bulb with stretchable lamp beads therein
US7405857B2 (en) 2001-01-17 2008-07-29 3M Innovative Properties Company Light emitting diode (LED) device and method of making same
CN1465106A (en) 2001-07-26 2003-12-31 松下电工株式会社 Light emitting device using led
JP2007059930A (en) 2001-08-09 2007-03-08 Matsushita Electric Ind Co Ltd Led lighting fixture and card type led lighting light source
US6709132B2 (en) 2001-08-13 2004-03-23 Atex Co., Ltd. LED bulb
US6746885B2 (en) 2001-08-24 2004-06-08 Densen Cao Method for making a semiconductor light source
US6634770B2 (en) 2001-08-24 2003-10-21 Densen Cao Light source using semiconductor devices mounted on a heat sink
US20030038291A1 (en) 2001-08-24 2003-02-27 Densen Cao Semiconductor light source
US6465961B1 (en) 2001-08-24 2002-10-15 Cao Group, Inc. Semiconductor light source using a heat sink with a plurality of panels
US6659632B2 (en) 2001-11-09 2003-12-09 Solidlite Corporation Light emitting diode lamp
US20050068776A1 (en) 2001-12-29 2005-03-31 Shichao Ge Led and led lamp
JP2010050473A (en) 2001-12-29 2010-03-04 Hangzhou Fuyang Xinying Electronics Co Ltd Light emitting diode plane light source
CN1608326A (en) 2001-12-29 2005-04-20 杭州富阳新颖电子有限公司 LED and LED lamp thereof
US7160012B2 (en) 2002-01-07 2007-01-09 Patent-Treuhand-Gesellschaft für elektrische Glëhlapen mbH Lamp
US20100060144A1 (en) 2002-03-25 2010-03-11 Koninklijke Philips Electronics N.V. Tri-color white light led lamp
US20030185005A1 (en) 2002-04-01 2003-10-02 Gelcore, Llc Light emitting diode-based signal light
US7048412B2 (en) 2002-06-10 2006-05-23 Lumileds Lighting U.S., Llc Axial LED source
US20040021629A1 (en) 2002-07-18 2004-02-05 Citizen Electronics Co., Ltd. Light emitting diode device
US20060097245A1 (en) 2002-08-30 2006-05-11 Aanegola Srinath K Light emitting diode component
US6764202B1 (en) 2002-09-25 2004-07-20 Larry Herring Illuminator
CN1726410A (en) 2002-10-11 2006-01-25 光处方革新有限公司 Compact folded-optics illumination lens
JP2004146225A (en) 2002-10-25 2004-05-20 Kurabe Ind Co Ltd Illumination lighting device
DE10251955A1 (en) 2002-11-08 2004-05-19 Hella Kg Hueck & Co. High-power LED insert module for motor vehicle, has dielectric in flat contact with heat sink and conductive track structure
US7080924B2 (en) 2002-12-02 2006-07-25 Harvatek Corporation LED light source with reflecting side wall
US20080037257A1 (en) 2002-12-11 2008-02-14 Charles Bolta Light emitting diode (L.E.D.) lighting fixtures with emergency back-up and scotopic enhancement
US20070285924A1 (en) 2002-12-18 2007-12-13 General Electric Company Integral ballast lamp thermal management method and apparatus
WO2004068599A1 (en) 2003-01-27 2004-08-12 3M Innovative Properties Company Phosphor based light sources having a non-planar short pass reflector and method of making
JP2004241318A (en) 2003-02-07 2004-08-26 Seiwa Electric Mfg Co Ltd Spot lighting fixture
US20040159846A1 (en) 2003-02-18 2004-08-19 Doxsee Daniel Darcy White light LED device
US20040223315A1 (en) 2003-03-03 2004-11-11 Toyoda Gosei Co., Ltd. Light emitting apparatus and method of making same
US20070139938A1 (en) 2003-03-31 2007-06-21 Lumination, Llc Led light with active cooling
US20040201990A1 (en) 2003-04-10 2004-10-14 Meyer William E. LED lamp
US6910794B2 (en) 2003-04-25 2005-06-28 Guide Corporation Automotive lighting assembly cooling system
US20060138435A1 (en) 2003-05-01 2006-06-29 Cree, Inc. Multiple component solid state white light
WO2004100213A2 (en) 2003-05-05 2004-11-18 Gelcore Llc Led-based light bulb
US20070267976A1 (en) 2003-05-05 2007-11-22 Bohler Christopher L Led-Based Light Bulb
WO2004100213A3 (en) 2003-05-05 2005-06-30 Gelcore Llc Led-based light bulb
CN1802533B (en) 2003-05-05 2010-11-24 吉尔科有限公司 LED-based light bulb
US6864513B2 (en) 2003-05-07 2005-03-08 Kaylu Industrial Corporation Light emitting diode bulb having high heat dissipating efficiency
US6860620B2 (en) 2003-05-09 2005-03-01 Agilent Technologies, Inc. Light unit having light emitting diodes
US20050225988A1 (en) 2003-05-13 2005-10-13 Light Prescriptions Innovators, Llc Optical device for LED-based lamp
US6803607B1 (en) 2003-06-13 2004-10-12 Cotco Holdings Limited Surface mountable light emitting device
JP2005021635A (en) 2003-07-04 2005-01-27 Amada Insatsu Kako Kk Freely derricking assembly ornamental body
US7172314B2 (en) 2003-07-29 2007-02-06 Plastic Inventions & Patents, Llc Solid state electric light bulb
JP2005093097A (en) 2003-09-12 2005-04-07 Sanyo Electric Co Ltd Lighting system
US6997580B2 (en) 2003-09-19 2006-02-14 Mattel, Inc. Multidirectional light emitting diode unit
JP2005108700A (en) 2003-09-30 2005-04-21 Toshiba Lighting & Technology Corp Light source
US6982518B2 (en) 2003-10-01 2006-01-03 Enertron, Inc. Methods and apparatus for an LED light
JP2006019676A (en) 2003-10-15 2006-01-19 Nichia Chem Ind Ltd Heat sink and semiconductor device equipped with the same
US20090095960A1 (en) 2003-10-15 2009-04-16 Nichia Corporation Heat dissipation member, semiconductor apparatus and semiconductor light emitting apparatus
US7094362B2 (en) 2003-10-29 2006-08-22 General Electric Company Garnet phosphor materials having enhanced spectral characteristics
US7144135B2 (en) 2003-11-26 2006-12-05 Philips Lumileds Lighting Company, Llc LED lamp heat sink
US20050276053A1 (en) 2003-12-11 2005-12-15 Color Kinetics, Incorporated Thermal management methods and apparatus for lighting devices
US20050168990A1 (en) 2004-01-13 2005-08-04 Seiko Epson Corporation Light source apparatus and projection display apparatus
US6948829B2 (en) 2004-01-28 2005-09-27 Dialight Corporation Light emitting diode (LED) light bulbs
US20050174780A1 (en) 2004-02-06 2005-08-11 Daejin Dmp Co., Ltd. LED light
JP2005244226A (en) 2004-02-23 2005-09-08 Lumileds Lighting Us Llc Wavelength conversion type semiconductor light emitting device
US20050184638A1 (en) 2004-02-23 2005-08-25 Lumileds Lighting, U.S., Llc Wavelength converted semiconductor light emitting devices
US7824065B2 (en) 2004-03-18 2010-11-02 Lighting Science Group Corporation System and method for providing multi-functional lighting using high-efficiency lighting elements in an environment
US7086756B2 (en) 2004-03-18 2006-08-08 Lighting Science Group Corporation Lighting element using electronically activated light emitting elements and method of making same
JP2005277127A (en) 2004-03-25 2005-10-06 Stanley Electric Co Ltd Light-emitting device
JP2005286267A (en) 2004-03-31 2005-10-13 Hitachi Lighting Ltd Light emitting diode lamp
US20050219060A1 (en) 2004-04-01 2005-10-06 Curran John W Method and apparatus for providing a notification appliance with a light emitting diode
US20050242711A1 (en) 2004-04-30 2005-11-03 Joseph Bloomfield Multi-color solid state light emitting device
WO2005107420A2 (en) 2004-05-05 2005-11-17 Rensselaer Polytechnic Institute High efficiency light source using solid-state emitter and down-conversion material
US7086767B2 (en) 2004-05-12 2006-08-08 Osram Sylvania Inc. Thermally efficient LED bulb
WO2006012043A1 (en) 2004-06-30 2006-02-02 3M Innovative Properties Company Phosphor based illumination system having a short pass reflector and method of making same
JP2008505448A (en) 2004-06-30 2008-02-21 スリーエム イノベイティブ プロパティズ カンパニー The illumination system and a manufacturing method according to the phosphor having a short pass reflector
US8235571B2 (en) 2004-06-30 2012-08-07 Lg Display Co., Ltd. Backlight unit of liquid crystal display device and liquid crystal display device using the same
JP2006040850A (en) 2004-07-23 2006-02-09 Shuji Fukuya Lighting system using ultraviolet light emitting diode
US7140753B2 (en) 2004-08-11 2006-11-28 Harvatek Corporation Water-cooling heat dissipation device adopted for modulized LEDs
JP2006108661A (en) 2004-09-30 2006-04-20 Agilent Technol Inc Light source utilizing wavelength converting material
DE102004051382A1 (en) 2004-10-21 2006-04-27 Oec Ag Microlens array
US20060097385A1 (en) 2004-10-25 2006-05-11 Negley Gerald H Solid metal block semiconductor light emitting device mounting substrates and packages including cavities and heat sinks, and methods of packaging same
US7165866B2 (en) 2004-11-01 2007-01-23 Chia Mao Li Light enhanced and heat dissipating bulb
US20060105482A1 (en) 2004-11-12 2006-05-18 Lumileds Lighting U.S., Llc Array of light emitting devices to produce a white light source
JP2006148147A (en) 2004-11-15 2006-06-08 Lumileds Lighting Us Llc Overmold lens on led die
US7160120B2 (en) 2004-11-18 2007-01-09 Hon Hai Precision Ind. Co., Ltd. Electrical connector having strengthened members
JP2006156187A (en) 2004-11-30 2006-06-15 Mitsubishi Electric Corp Led light source device and led electric bulb
WO2006059535A2 (en) 2004-11-30 2006-06-08 Matsushita Electric Industrial Co., Ltd. Semiconductor light emitting device, lighting module, illumination apparatus, surface mount led, and bullet led
US20090273727A1 (en) 2004-12-03 2009-11-05 Sony Corporation Light-emission lens, light-emitting element assembly, sheet-shaped light source device and color liquid crystal display assembly
WO2006065558A3 (en) 2004-12-14 2006-08-03 Cree Inc Semiconductor light emitting device mounting substrates and packages including cavities and cover plates, and methods of packaging same
JP2008523639A (en) 2004-12-14 2008-07-03 クリー インコーポレイテッドCree Inc. Package comprising a semiconductor light-emitting device mounting substrate, the cavities and the cover plate, and mounting method thereof
US20080117620A1 (en) 2004-12-17 2008-05-22 Nichia Corporation Light emitting device
US20070223219A1 (en) 2005-01-10 2007-09-27 Cree, Inc. Multi-chip light emitting device lamps for providing high-cri warm white light and light fixtures including the same
US20060152820A1 (en) 2005-01-10 2006-07-13 Shi-Hwa Huang Lens and light-emitting device including the lens
US20060152140A1 (en) 2005-01-10 2006-07-13 Brandes George R Light emission device
US20100020547A1 (en) 2005-02-10 2010-01-28 Deepsea Power & Light Company Led illumination device with cubic zirconia lens
CN101128695A (en) 2005-02-24 2008-02-20 莱特浩斯科技有限公司 Light emitting device and light emitting object using the same
US20090190353A1 (en) 2005-03-22 2009-07-30 Tom Barker Modular display system
US7396142B2 (en) 2005-03-25 2008-07-08 Five Star Import Group, L.L.C. LED light bulb
US20060227558A1 (en) 2005-04-08 2006-10-12 Toshiba Lighting & Technology Corporation Lamp having outer shell to radiate heat of light source
US7270446B2 (en) 2005-05-09 2007-09-18 Lighthouse Technology Co., Ltd Light module with combined heat transferring plate and heat transferring pipes
JP2006331683A (en) 2005-05-23 2006-12-07 Sharp Corp Backlight module, backlight panel, and display device
JP2007049019A (en) 2005-08-11 2007-02-22 Koha Co Ltd Light emitting device
JP2007059911A (en) 2005-08-23 2007-03-08 Avago Technologies Ecbu Ip (Singapore) Pte Ltd Light source with uvled and uv reflector
US20070158668A1 (en) 2005-08-25 2007-07-12 Cree, Inc. Close loop electrophoretic deposition of semiconductor devices
US20070047232A1 (en) 2005-08-30 2007-03-01 Samsung Electro-Mechanics Co., Ltd. Led lens for backlight
US7740365B2 (en) 2005-09-03 2010-06-22 Osram Opto Semiconductors Gmbh Backlighting arrangement with semiconductor light sources arranged in light groups and lighting device
JP2007081090A (en) 2005-09-14 2007-03-29 Fujikura Ltd White light emitter and lighting device
US20070091633A1 (en) 2005-10-03 2007-04-26 Kevin Harrity Light apparatus
US20070090737A1 (en) 2005-10-20 2007-04-26 Foxconn Technology Co., Ltd. Light-emitting diode assembly and method of fabrication
US7377674B2 (en) 2005-10-28 2008-05-27 Advanced Accessory Systems, Llc Low profile light for article carrier system
US7354174B1 (en) 2005-12-05 2008-04-08 Technical Consumer Products, Inc. Energy efficient festive lamp
US20070139949A1 (en) 2005-12-16 2007-06-21 Nichia Corporation Light emitting device
US7213940B1 (en) 2005-12-21 2007-05-08 Led Lighting Fixtures, Inc. Lighting device and lighting method
US7614759B2 (en) 2005-12-22 2009-11-10 Cree Led Lighting Solutions, Inc. Lighting device
US7413325B2 (en) 2005-12-28 2008-08-19 International Development Corporation LED bulb
JP2007184330A (en) 2006-01-04 2007-07-19 Rohm Co Ltd Light-emitting device and manufacturing method therefor
US20090316073A1 (en) 2006-01-20 2009-12-24 Au Optronics Corporation Light Diffusion Module and a Back Light Module Using the Same
US20090067180A1 (en) 2006-02-28 2009-03-12 Ghollam Tahmosybayat Lens assembly
US20070215890A1 (en) 2006-03-17 2007-09-20 Philips Lumileds Lighting Company, Llc White LED for backlight with phosphor plates
US20080106893A1 (en) 2006-04-25 2008-05-08 S. C. Johnson & Son, Inc. Lamp and bulb for illumination and ambiance lighting
US20090310368A1 (en) 2006-04-28 2009-12-17 Edda Incerti Device for Redirecting the Luminous Flux Emitted by One or More LED
WO2007130358A2 (en) 2006-05-02 2007-11-15 Superbulbs, Inc. Plastic led bulb
US20070263405A1 (en) 2006-05-11 2007-11-15 Ng Kee Y Semiconductor light source configured as a light tube
US7549782B2 (en) 2006-05-11 2009-06-23 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Semiconductor light source configured as a light tube
US20070274080A1 (en) 2006-05-23 2007-11-29 Led Lighting Fixtures, Inc. Lighting device
US7553047B2 (en) 2006-06-01 2009-06-30 Samsung Electronics Co., Ltd. Lighting device
WO2007146566A2 (en) 2006-06-08 2007-12-21 Lighting Science Group Corporation Apparatus with a packed circuitry within a lightbulb
US20070297183A1 (en) 2006-06-21 2007-12-27 Coushaine Charles M Heat sink
EP1881259B1 (en) 2006-07-17 2010-03-03 Liquidleds Lighting Co., Ltd. High power LED lamp with heat dissipation enhancement
US20090273924A1 (en) * 2006-07-17 2009-11-05 Liquidleds Lighting Corp. High power LED lamp with heat dissipation enhancement
JP2008028183A (en) 2006-07-21 2008-02-07 Tokyo Seimitsu Co Ltd Method for storing wafer
US20130293098A1 (en) 2006-08-03 2013-11-07 Intematix Corporation Solid-state linear lighting arrangements including light emitting phosphor
WO2008018002A2 (en) 2006-08-09 2008-02-14 Koninklijke Philips Electronics N.V. Illumination device with wavelength converting element side holding heat sink
US20080055908A1 (en) 2006-08-30 2008-03-06 Chung Wu Assembled structure of large-sized led lamp
US20080062694A1 (en) 2006-09-07 2008-03-13 Foxconn Technology Co., Ltd. Heat dissipation device for light emitting diode module
US20100014839A1 (en) 2006-09-14 2010-01-21 Koninklijke Philips Electronics N.V. Lighting assembly and method for providing cooling of a light source
US20090201679A1 (en) 2006-09-20 2009-08-13 Daijiro Konaka Led lamp
JP2008091140A (en) 2006-09-29 2008-04-17 Toshiba Lighting & Technology Corp Led bulb and lighting equipment
US20080080165A1 (en) 2006-10-02 2008-04-03 Samsung Electro-Mechanics Co. Ltd. Surface light source device using light emitting diodes
US20080093615A1 (en) 2006-10-23 2008-04-24 Chang Gung University Method for obtaining a better color rendering with a photoluminescence plate
JP2008108835A (en) 2006-10-24 2008-05-08 Harison Toshiba Lighting Corp Semiconductor light emitting device and method for manufacturing the same
USD546980S1 (en) 2006-10-25 2007-07-17 Hsin-Chih Chung Lee LED bulb
WO2008052318A1 (en) 2006-10-31 2008-05-08 Tir Technology Lp Light source comprising a light-excitable medium
US7547124B2 (en) 2006-11-17 2009-06-16 Foxconn Technology Co., Ltd. LED lamp cooling apparatus with pulsating heat pipe
JP2008187195A (en) 2006-12-05 2008-08-14 Samsung Electro-Mechanics Co Ltd White led and white light source module using the same
US20080128735A1 (en) 2006-12-05 2008-06-05 Samsung Electro-Mechanics Co., Ltd. White light emitting device and white light source module using the same
US20080149166A1 (en) 2006-12-21 2008-06-26 Goldeneye, Inc. Compact light conversion device and light source with high thermal conductivity wavelength conversion material
DE102006061164A1 (en) 2006-12-22 2008-06-26 Osram Opto Semiconductors Gmbh The light emitting device
US20090175041A1 (en) 2007-01-07 2009-07-09 Pui Hang Yuen High efficiency low cost safety light emitting diode illumination device
US7686478B1 (en) 2007-01-12 2010-03-30 Ilight Technologies, Inc. Bulb for light-emitting diode with color-converting insert
US20080179611A1 (en) 2007-01-22 2008-07-31 Cree, Inc. Wafer level phosphor coating method and devices fabricated utilizing method
US20080173884A1 (en) 2007-01-22 2008-07-24 Cree, Inc. Wafer level phosphor coating method and devices fabricated utilizing method
US7753568B2 (en) 2007-01-23 2010-07-13 Foxconn Technology Co., Ltd. Light-emitting diode assembly and method of fabrication
USD553267S1 (en) 2007-02-09 2007-10-16 Wellion Asia Limited LED light bulb
CN101641623A (en) 2007-02-12 2010-02-03 英特曼帝克司公司 Light emitting diode lighting system
US20100046231A1 (en) 2007-03-01 2010-02-25 Medinis David M Led cooling system
CN101262032A (en) 2007-03-07 2008-09-10 光宝科技股份有限公司 White light LED
US20080232119A1 (en) 2007-03-21 2008-09-25 Thomas Ribarich Led lamp assembly with temperature control and method of making the same
WO2008117211A1 (en) 2007-03-26 2008-10-02 Koninklijke Philips Electronics N.V. Lighting device
US20100096967A1 (en) 2007-03-26 2010-04-22 Koninklijke Philips Electronics N.V. Lighting device
JP2008262765A (en) 2007-04-11 2008-10-30 Stanley Electric Co Ltd Light-emitting diode lamp fitting with wave length conversion layer
US20080285279A1 (en) 2007-04-23 2008-11-20 Kai Kong Ng Light emitting diode (LED) light bulb
WO2008134056A1 (en) 2007-04-26 2008-11-06 Deak-Lam Inc. Photon energy coversion structure
US7976335B2 (en) 2007-05-01 2011-07-12 Tyco Electronics Corporation LED connector assembly with heat sink
JP2008288409A (en) 2007-05-18 2008-11-27 Toshiba Corp Light-emitting device, and manufacturing method thereof
JP2008300460A (en) 2007-05-29 2008-12-11 Toshiba Corp Optical semiconductor device
WO2008146229A2 (en) 2007-05-29 2008-12-04 Koninklijke Philips Electronics N.V. Illumination system, luminaire and backlighting unit
JP2008300570A (en) 2007-05-30 2008-12-11 Panasonic Electric Works Co Ltd Light emitting device
JP2008300117A (en) 2007-05-30 2008-12-11 Toshiba Lighting & Technology Corp Light emitting diode lighting system
JP2008300203A (en) 2007-05-31 2008-12-11 Toshiba Lighting & Technology Corp Luminaire
US20100170075A1 (en) 2007-06-05 2010-07-08 I2Ic Corporation Method of Manufacturing Multicolored Illuminator
US20090283779A1 (en) 2007-06-14 2009-11-19 Cree, Inc. Light source with near field mixing
US20080308825A1 (en) 2007-06-14 2008-12-18 Cree, Inc. Encapsulant with scatterer to tailor spatial emission pattern and color uniformity in light emitting diodes
US20090001399A1 (en) 2007-06-27 2009-01-01 The Regents Of The University Of California Optical designs for high-efficacy white-light emitting diodes
JP2009016058A (en) 2007-06-29 2009-01-22 Toshiba Lighting & Technology Corp Illumination device, and illumination fixture using this
JP2009016153A (en) 2007-07-04 2009-01-22 Yohohama Electron Kk Led lamp for illumination
US20090015137A1 (en) 2007-07-13 2009-01-15 Lite-On Technology Corporation Light emitting apparatus with open loop control
US7607802B2 (en) 2007-07-23 2009-10-27 Tamkang University LED lamp instantly dissipating heat as effected by multiple-layer substrates
US7663315B1 (en) 2007-07-24 2010-02-16 Ilight Technologies, Inc. Spherical bulb for light-emitting diode with spherical inner cavity
US20090040760A1 (en) 2007-08-10 2009-02-12 Kuo-Hsin Chen Illumination device having unidirectional heat-dissipating route
DE102007037862A1 (en) 2007-08-10 2008-10-30 Siemens Ag Heating arrangement, used on LED arrays, improved cooling performances at high oscillation frequencies
US20090046473A1 (en) 2007-08-13 2009-02-19 Topco Technologies Corp. Light-emitting diode lamp
WO2009024952A2 (en) 2007-08-23 2009-02-26 Koninklijke Philips Electronics N.V. Light source including reflective wavelength-converting layer
US20090059559A1 (en) 2007-08-28 2009-03-05 Wolfgang Pabst Led lamp
US7884538B2 (en) 2007-08-31 2011-02-08 Kabushiki Kaisha Toshiba Light-emitting device
JP2009059896A (en) 2007-08-31 2009-03-19 Toshiba Corp Light-emitting device
US20090058256A1 (en) 2007-08-31 2009-03-05 Iwao Mitsuishi Light-emitting device
US20100201284A1 (en) 2007-09-24 2010-08-12 Osram Gesellschaft Mit Beschraenkter Haftung Illuminating device with light buffer
US20090086492A1 (en) 2007-09-27 2009-04-02 Osram Sylvania Inc LED lamp with heat sink optic
US8752984B2 (en) 2007-10-03 2014-06-17 Switch Bulb Company, Inc. Glass LED light bulbs
JP2009117346A (en) 2007-10-16 2009-05-28 Momo Alliance Co Ltd Illuminating device
US20090103296A1 (en) 2007-10-17 2009-04-23 Xicato, Inc. Illumination Device with Light Emitting Diodes
US20090103293A1 (en) 2007-10-17 2009-04-23 Xicato, Inc. Illumination Device with Light Emitting Diodes and Moveable Light Adjustment Member
US20090101930A1 (en) 2007-10-17 2009-04-23 Intematix Corporation Light emitting device with phosphor wavelength conversion
WO2009052099A1 (en) 2007-10-17 2009-04-23 Xicato, Inc. Illumination device with light emitting diodes and movable light adjustment member
USD581556S1 (en) 2007-10-19 2008-11-25 Koninklijke Philips Electronics N.V. Solid state lighting spot
US20090113296A1 (en) 2007-10-26 2009-04-30 Microsoft Corporation Displaying a map and associated symbolic context information
US20090116217A1 (en) 2007-11-06 2009-05-07 Prodisc Technology Inc. LED lighting apparatus having separate wavelength conversion unit
US7726836B2 (en) 2007-11-23 2010-06-01 Taiming Chen Light bulb with light emitting elements for use in conventional incandescent light bulb sockets
US7810954B2 (en) 2007-12-03 2010-10-12 Lumination Llc LED-based changeable color light lamp
US7989236B2 (en) 2007-12-27 2011-08-02 Toyoda Gosei Co., Ltd. Method of making phosphor containing glass plate, method of making light emitting device
WO2009091562A2 (en) 2008-01-15 2009-07-23 Philip Premysler Omnidirectional led light bulb
US20100314985A1 (en) 2008-01-15 2010-12-16 Philip Premysler Omnidirectional LED Light Bulb
US20090262516A1 (en) 2008-01-17 2009-10-22 Intematix Corporation Light emitting device with phosphor wavelength conversion
US20090184618A1 (en) 2008-01-18 2009-07-23 Sanyo Electric Co., Ltd. Light-emitting device and lighting apparatus incorporating same
US8400051B2 (en) 2008-01-18 2013-03-19 Sanyo Electric Co., Ltd. Light-emitting device and lighting apparatus incorporating same
US20100328925A1 (en) 2008-01-22 2010-12-30 Koninklijke Philips Electronics N.V. Illumination device with led and a transmissive support comprising a luminescent material
WO2009093163A2 (en) 2008-01-22 2009-07-30 Koninklijke Philips Electronics N.V. Illumination device with led and a transmissive support comprising a luminescent material
WO2009093163A3 (en) 2008-01-22 2009-09-17 Koninklijke Philips Electronics N.V. Illumination device with led and a transmissive support comprising a luminescent material
US20090195186A1 (en) 2008-02-06 2009-08-06 C. Crane Company, Inc. Light emitting diode lighting device
US8274241B2 (en) 2008-02-06 2012-09-25 C. Crane Company, Inc. Light emitting diode lighting device
WO2009107052A1 (en) 2008-02-27 2009-09-03 Koninklijke Philips Electronics N.V. Illumination device with led and one or more transmissive windows
US20090217970A1 (en) 2008-03-01 2009-09-03 Goldeneye, Inc. Fixtures for large area directional and isotropic solid state lighting panels
WO2009119038A2 (en) 2008-03-28 2009-10-01 Panasonic Corporation Molded resin product, semiconductor light-emitting source, lighting device, and method for manufacturing molded resin product
WO2009125314A2 (en) 2008-04-08 2009-10-15 Koninklijke Philips Electronics N.V. Illumination device with led and a transmissive support comprising a luminescent material
WO2009128004A1 (en) 2008-04-17 2009-10-22 Koninklijke Philips Electronics N.V. Led based light source
WO2009131627A1 (en) 2008-04-25 2009-10-29 Cree, Inc. Semiconductor light emitting devices with separated wavelength conversion materials and methods of forming the same
JP2009266780A (en) 2008-04-30 2009-11-12 Toshiba Lighting & Technology Corp Luminous body and luminaire
US20110058379A1 (en) 2008-05-08 2011-03-10 Lok-F Gmbh Lamp Device
JP2009277586A (en) 2008-05-16 2009-11-26 San Corporation Kk Electric lamp type led luminaire
WO2009143047A2 (en) 2008-05-23 2009-11-26 Altair Engineering, Inc. Electric shock resistant l.e.d. based light
US20090296387A1 (en) 2008-05-27 2009-12-03 Sea Gull Lighting Products, Llc Led retrofit light engine
JP2009295299A (en) 2008-06-02 2009-12-17 Tamura Seisakusho Co Ltd Illumination body
US8421322B2 (en) 2008-06-04 2013-04-16 Forever Bulb, Llc LED-based light bulb device
US20090316383A1 (en) 2008-06-20 2009-12-24 Seoul Semiconductor Co., Ltd. Lighting apparatus
US20090322800A1 (en) 2008-06-25 2009-12-31 Dolby Laboratories Licensing Corporation Method and apparatus in various embodiments for hdr implementation in display devices
US20090323333A1 (en) 2008-06-25 2009-12-31 Foxconn Technology Co., Ltd. Led lamp
US7618157B1 (en) 2008-06-25 2009-11-17 Osram Sylvania Inc. Tubular blue LED lamp with remote phosphor
US20110133222A1 (en) 2008-06-26 2011-06-09 Osram Sylvania Inc. Led lamp with remote phosphor coating and method of making the lamp
CN102077011B (en) 2008-06-26 2014-12-10 奥斯兰姆施尔凡尼亚公司 LED lamp with remote phosphor coating and method of making the lamp
WO2009158422A1 (en) 2008-06-26 2009-12-30 Osram Sylvania, Inc. Led lamp with remote phosphor coating and method of making the lamp
US20090322197A1 (en) 2008-06-30 2009-12-31 Rene Helbing Light emitting device having a transparent thermally conductive layer
US20090322208A1 (en) 2008-06-30 2009-12-31 Alex Shaikevitch Light emitting device having a refractory phosphor layer
JP2010016223A (en) 2008-07-04 2010-01-21 Panasonic Corp Lamp
EP2146135A2 (en) 2008-07-09 2010-01-20 Ushiodenki Kabushiki Kaisha Light emitting device and method for producing the light emitting device
US20110089804A1 (en) 2008-07-15 2011-04-21 Nuventix Inc. Thermal management of led-based illumination devices with synthetic jet ejectors
US20100025700A1 (en) 2008-07-29 2010-02-04 Seoul Semiconductor Co., Ltd. Warm white light emitting apparatus and back light module comprising the same
WO2010013893A1 (en) 2008-07-29 2010-02-04 Seoul Semiconductor Co., Ltd. Warm white light emitting apparatus and back light module comprising the same
WO2010012999A2 (en) 2008-07-30 2010-02-04 Photonstar Led Limited Tunable colour led module
US20100027258A1 (en) * 2008-07-31 2010-02-04 Maxik Fredric S Illumination apparatus for conducting and dissipating heat from a light source
US20100026185A1 (en) 2008-07-31 2010-02-04 Toshiba Lighting & Technology Corporation Self-ballasted lamp
JP2010040494A (en) 2008-08-07 2010-02-18 Msm Tech Co Ltd Fluorescent lamp type led lamp capable of attaching and detaching led driving device
EP2154420A1 (en) 2008-08-13 2010-02-17 GE Investment Co., Ltd. Light-emitting diode illumination apparatus
US20100038660A1 (en) 2008-08-13 2010-02-18 Progressive Cooling Solutions, Inc. Two-phase cooling for light-emitting devices
KR20100037353A (en) 2008-10-01 2010-04-09 주식회사 아모럭스 Radiator and bulb type led lighting apparatus using the same
US20100091487A1 (en) 2008-10-13 2010-04-15 Hyundai Telecommunication Co., Ltd. Heat dissipation member having variable heat dissipation paths and led lighting flood lamp using the same
DE202008013667U1 (en) 2008-10-15 2008-12-18 Li, Chia-Mao Multi-shell reflector cup
JP2009021264A (en) 2008-10-17 2009-01-29 Sanyo Electric Co Ltd Illuminating device
US20100102707A1 (en) 2008-10-29 2010-04-29 Kabushiki Kaisha Toshiba Red fluorescent substance and light-emitting device employing the same
WO2010052640A1 (en) 2008-11-06 2010-05-14 Koninklijke Philips Electronics N.V. Illumination device
US20110205733A1 (en) 2008-11-06 2011-08-25 Koninklijke Philips Electronics N.V. Illumination device
US8314537B2 (en) 2008-11-18 2012-11-20 Koninklijke Philips Electronics N.V. Electric lamp
US8309969B2 (en) 2008-11-20 2012-11-13 Toyoda Gosei Co., Ltd. Light emitting device and method of making same
JP2010129300A (en) 2008-11-26 2010-06-10 Hideki Iimura Semiconductor light-emitting lamp and electric-bulb-shaped semiconductor light-emitting lamp
US20100149783A1 (en) 2008-12-12 2010-06-17 Toshiba Lighting & Technology Corporation Light-emitting module and illumination apparatus
US20100149814A1 (en) 2008-12-17 2010-06-17 Lednovation, Inc. Semiconductor Lighting Device With Wavelength Conversion on Back-Transferred Light Path
US20110267835A1 (en) 2009-01-09 2011-11-03 Koninklijke Philips Electronics N.V. Light source
US20100177522A1 (en) 2009-01-15 2010-07-15 Yeh-Chiang Technology Corp. Led lamp
US8021025B2 (en) 2009-01-15 2011-09-20 Yeh-Chiang Technology Corp. LED lamp
US7600882B1 (en) 2009-01-20 2009-10-13 Lednovation, Inc. High efficiency incandescent bulb replacement lamp
FR2941346A1 (en) 2009-01-21 2010-07-23 Cassiopee Decoration Lighting device for illuminating lamp, has electrical power supplying units having rigid pins and electric wire for supplying electrical power to LEDs and extending in conduit when plate is installed on free end of support part
US20100207502A1 (en) * 2009-02-17 2010-08-19 Densen Cao LED Light Bulbs for Space Lighting
US8653723B2 (en) 2009-02-17 2014-02-18 Cao Group, Inc. LED light bulbs for space lighting
US20100140655A1 (en) 2009-02-26 2010-06-10 Wei Shi Transparent heat spreader for leds
US8760042B2 (en) 2009-02-27 2014-06-24 Toshiba Lighting & Technology Corporation Lighting device having a through-hole and a groove portion formed in the thermally conductive main body
US20100219735A1 (en) 2009-02-27 2010-09-02 Toshiba Lighting & Technology Corporation Lighting device and lighting fixture
US20100232134A1 (en) 2009-03-10 2010-09-16 Nepes Led, Inc. Light emitting device and lamp-cover structure containing luminescent material
US20100244729A1 (en) 2009-03-30 2010-09-30 Amerihua International Enterprises Inc. Gazing Ball Having A Battery-Powered LED Device
US20100246165A1 (en) 2009-03-31 2010-09-30 Diaz Edmundo B Invisible and/ or non-invisible designed inflatables combined with electric black ultra-violet lights and inflator nozzle fixture accessories
KR100944181B1 (en) 2009-04-07 2010-02-24 용남순 Led lamp with a radial shape
WO2010119618A1 (en) 2009-04-13 2010-10-21 日東光学株式会社 Light emitting device and bulb-type led lamp
US8750671B1 (en) 2009-04-16 2014-06-10 Fusion Optix, Inc Light bulb with omnidirectional output
US20100264799A1 (en) 2009-04-20 2010-10-21 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Led lamp
WO2010128419A1 (en) 2009-05-04 2010-11-11 Koninklijke Philips Electronics N.V. Light source comprising a light emitter arranged inside a translucent outer envelope
US20120155059A1 (en) 2009-05-04 2012-06-21 Koninklijke Philips Electronics N.V. Light source comprising a light emitter arranged inside a translucent outer envelope
US8253316B2 (en) 2009-05-13 2012-08-28 Light Prescriptions Innovators, Llc Dimmable LED lamp
JP2010267826A (en) 2009-05-15 2010-11-25 Rohm Co Ltd Led lighting system and liquid crystal display device
US20100134047A1 (en) 2009-05-15 2010-06-03 Ghulam Hasnain Modular LED Light Bulb
US8922106B2 (en) 2009-06-02 2014-12-30 Bridgelux, Inc. Light source with optics to produce a spherical emission pattern
US8292468B2 (en) 2009-06-10 2012-10-23 Rensselaer Polytechnic Institute Solid state light source light bulb
US8277082B2 (en) 2009-06-24 2012-10-02 Elumigen Llc Solid state light assembly having light redirection elements
US20100327745A1 (en) 2009-06-24 2010-12-30 Mahendra Dassanayake Opto-thermal solution for multi-utility solid state lighting device using conic section geometries
KR20110008445A (en) 2009-07-20 2011-01-27 백일선 Connector having a portion for grounding
US8348470B2 (en) 2009-07-28 2013-01-08 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. LED illuminating device
US20110037368A1 (en) 2009-08-14 2011-02-17 Risun Expanse Corp. Lamp structure
US20110044022A1 (en) 2009-08-20 2011-02-24 Illumitex, Inc. System and method for a phosphor coated lens
KR100980588B1 (en) 2009-08-27 2010-09-06 윤인숙 Led lamp
US20110074271A1 (en) 2009-09-25 2011-03-31 Toshiba Lighting & Technology Corporation Lamp and lighting equipment
US20110074296A1 (en) 2009-09-28 2011-03-31 Yu-Nung Shen Light-Emitting Diode Illumination Apparatuses
US8449154B2 (en) 2009-09-30 2013-05-28 Panasonic Corporation Illumination device including a light-emitting module fastened to mount member with a constant orientation
US20110080096A1 (en) 2009-10-02 2011-04-07 Lumination Llc Led lamp
US20110080740A1 (en) 2009-10-02 2011-04-07 Lumination Llc Led lamp with uniform omnidirectional light intensity output
US20110089830A1 (en) 2009-10-20 2011-04-21 Cree Led Lighting Solutions, Inc. Heat sinks and lamp incorporating same
US8322896B2 (en) 2009-10-22 2012-12-04 Light Prescriptions Innovators, Llc Solid-state light bulb
US20110095686A1 (en) 2009-10-22 2011-04-28 Light Prescriptions Innovators, Llc Solid-state light bulb
US8371722B2 (en) 2009-11-04 2013-02-12 Forever Bulb, Llc LED-based light bulb device with Kelvin corrective features
US8410512B2 (en) 2009-11-25 2013-04-02 Cree, Inc. Solid state light emitting apparatus with thermal management structures and methods of manufacturing
EP2469154A1 (en) 2010-01-14 2012-06-27 Toshiba Lighting&Technology Corporation Light bulb-shaped lamp and lighting fixture
US20110175528A1 (en) 2010-02-01 2011-07-21 Renaissance Lighting, Inc. Lamp using solid state source and doped semiconductor nanophosphor
WO2011100193A1 (en) 2010-02-12 2011-08-18 Cree, Inc. Lighting device with heat dissipation elements
WO2011109091A1 (en) 2010-03-03 2011-09-09 Cree, Inc. Led based pedestal-type lighting structure
US20110216523A1 (en) 2010-03-03 2011-09-08 Tao Tong Non-uniform diffuser to scatter light into uniform emission pattern
US20110215696A1 (en) 2010-03-03 2011-09-08 Cree, Inc. Led based pedestal-type lighting structure
US20110215699A1 (en) 2010-03-03 2011-09-08 Cree, Inc. Solid state lamp and bulb
WO2011109098A2 (en) 2010-03-03 2011-09-09 Cree, Inc. Solid state lamp and bulb
US20110242816A1 (en) * 2010-04-02 2011-10-06 GE Lighting Solutions, LLC Lightweight heat sinks and led lamps employing same
USD629928S1 (en) 2010-04-05 2010-12-28 Foxconn Technology Co., Ltd. LED lamp
US20110273072A1 (en) 2010-05-10 2011-11-10 Yadent Co., Ltd. Light bulb
US20110291560A1 (en) 2010-06-01 2011-12-01 Young Lighting Technology Corporation Illuminating device
US20110298371A1 (en) 2010-06-08 2011-12-08 Cree, Inc. Led light bulbs
US20130119280A1 (en) 2010-07-12 2013-05-16 National University Corporation Nagoya University Broadband infrared light emitting device
WO2012011279A1 (en) 2010-07-20 2012-01-26 パナソニック株式会社 Lightbulb shaped lamp
US20120040585A1 (en) 2010-08-10 2012-02-16 David Huang Method of Assembling An Airtight LED Light Bulb
US8568009B2 (en) 2010-08-20 2013-10-29 Dicon Fiberoptics Inc. Compact high brightness LED aquarium light apparatus, using an extended point source LED array with light emitting diodes
US8502468B2 (en) 2010-09-06 2013-08-06 Lite-On Electronics (Guangzhou) Limited Light emitting bulb, luminary and illumination device using LED
WO2012031533A1 (en) 2010-09-08 2012-03-15 浙江锐迪生光电有限公司 Led lamp bulb and led lighting bar capable of emitting light over 4π
US8272762B2 (en) 2010-09-28 2012-09-25 Lighting Science Group Corporation LED luminaire
US20120161626A1 (en) 2010-12-22 2012-06-28 Cree, Inc. Led lamp with high color rendering index
US8415865B2 (en) 2011-01-18 2013-04-09 Silitek Electronic (Guangzhou) Co., Ltd. Light-guide type illumination device
US8421320B2 (en) 2011-01-24 2013-04-16 Sheng-Yi CHUANG LED light bulb equipped with light transparent shell fastening structure
US8421321B2 (en) 2011-01-24 2013-04-16 Sheng-Yi CHUANG LED light bulb
DE102011004718A1 (en) 2011-02-25 2012-08-30 Osram Ag Method for manufacturing transparent cover of incandescent lamp-retrofit lamp, involves inserting inner piston wall into outer piston wall so that hollow space is formed between walls, and introducing heat conducting filling into space
US20110176316A1 (en) 2011-03-18 2011-07-21 Phipps J Michael Semiconductor lamp with thermal handling system
US8696168B2 (en) 2011-04-26 2014-04-15 Lite-On Electronics (Guangzhou) Limited Illumination device
US8282250B1 (en) 2011-06-09 2012-10-09 Elumigen Llc Solid state lighting device using heat channels in a housing
US20120320591A1 (en) 2011-06-17 2012-12-20 Enlight Corporation Light bulb
US8740415B2 (en) 2011-07-08 2014-06-03 Switch Bulb Company, Inc. Partitioned heatsink for improved cooling of an LED bulb
US20130049018A1 (en) 2011-08-30 2013-02-28 Abl Ip Holding Llc Optical/electrical transducer using semiconductor nanowire wicking structure in a thermal conductivity and phase transition heat transfer mechanism
US20130063945A1 (en) 2011-09-12 2013-03-14 Chaun-Choung Technology Corp. Bulb-type led lamp having replaceable light source module
US8641237B2 (en) 2012-02-09 2014-02-04 Sheng-Yi CHUANG LED light bulb providing high heat dissipation efficiency
US20130249374A1 (en) 2012-03-26 2013-09-26 Cree, Inc. Passive phase change radiators for led lamps and fixtures

Non-Patent Citations (226)

* Cited by examiner, † Cited by third party
Title
Appeal Decision from Japanese Appl. No. 2011-231319, dated Jan. 13. 2015.
C.Crane Geobulb® -II LED Light Bulb, Item #2SW, Description, p. 1-2.
Comments on the Written Opinion and Amendment of the Application from European Patent appl. No. 12740244.4, dated Feb. 20, 2014.
Communication from European Appl. No. 12816621.2-1757, dated Sep. 25, 2014.
Communication from European Patent Appl. No. 13762957.2-1757, dated Apr. 30, 2015.
Cree LR4, 4″ and 6″ Recessed Architectural Downlight, Product Info p. 1-2.
Cree. Xlamp® LEDS, Product Info and Data Sheets, 34 PAGES.
Decision for Final Rejection for Japanese Patent Application No. 2001-542133 mailed Jun. 28, 2011.
Decision of Board of Appeal and Minutes of Oral Proceedings from European Appl. No. 09152962, dated Jun. 2. 2015.
Decision of Dismissal of Amendment, Decision of Rejection from Japanese Patent Appl. No. 2011-231319, dated Oct. 15, 2013.
Decision of Rejection from Japanese Patent Appl. No. 2012-556064. dated Jun. 6. 2014.
Decision of Rejection from Japanese Patent Appl. No. 2012-566065, dated Aug. 18, 2015.
Decision to Grant from Chinese Patent Appl. No. 201080062056.X, dated Jul. 6, 2015.
Decision to Grant from Japanese Appl. No. 2012-556062, dated Nov. 27, 2014.
Decision to Grant from Japanese Patent Appl. No. 2012-556066, dated Jul. 4, 2014.
Decision to Refuse a European Patent Application for EP 09 152 962.8 dated Jul. 6, 2011.
Energy Star® Program Requirements for Integral LED Lamps, amended Mar. 22, 2010.
Examination Report from European Patent Appl. No. 11 710 348.1-1757. dated Feb. 18, 2015.
Examination Report from European Patent Appl. No. 11 710 906.6-1757. dated Feb. 18, 2015.
Examination Report from European Patent Appl. No. 12 740 244.4-1757, dated Feb. 9, 2015.
First Office Action and Search Report from Chinese Appl. No. 2011800223856, dated Aug. 1, 2014.
First Office Action and Search Report from Chinese Patent Appl. No. 201180022620X. dated Jul. 1, 2014.
First Office Action from Chinese Appl. No. 201180022626.7, dated Nov. 15. 2014.
First Office Action from Chinese Patent Appl. No. 201080062056.X, dated Feb. 12, 2014.
First Office Action from Chinese Patent Appl. No. 201180020709.2, dated May 4, 2014.
First Office Action from Chinese Patent Appl. No. 2011800223837, dated Jul. 24, 2014.
First Office Action from Chinese Patent Appl. No. 2011800223856, dated Aug. 1, 2014.
First Office Action from Chinese Patent Appl. No. 2011800225832, dated Jan. 20. 2015.
First Office Action from Chinese Patent Appl. No. 2011800226214, dated Dec. 25, 2014.
First Office Action from Chinese Patent Appl. No. 2011800226248, dated Aug, 25, 2014.
First Office Action from Chinese Patent Application No. 2011800207069, dated May 5, 2014.
First Office Action from Chinese Patent Application No. 201180022606, dated May 4, 2014.
International Preliminary Report on Patentability and Written Opinion from PCT/US2012/044705 dated Jan. 7, 2014.
International Preliminary Report on Patentability from PCT/US2011/000390, dated May 8. 2013.
International Preliminary Report on Patentability from PCT/US2011/00389, dated May 8. 2013.
International Search Report and Written Opinion for counterpart PCT Application No. PCT/US2011/000397 mailed May 24, 2011.
International Search Report and Written Opinion for PCT Application No. PCT/US2010/003146 mailed Jun. 7, 2011.
International Search Report and Written Opinion for PCT Application No. PCT/US2011/000391 mailed Oct. 6, 2011.
International Search Report and Written Opinion for PCT Application No. PCT/US2011/000399 mailed Jul. 12, 2011.
International Search Report and Written Opinion for PCT Application No. PCT/US2011/000402 mailed Sep. 30, 2011.
International Search Report and Written Opinion for PCT Patent Application No. PCT/US2011/000405 mailed Nov. 2, 2011.
International Search Report and Written Opinion for PCT/US2011/000398 mailed Aug. 30, 2011.
International Search Report and Written Opinion for PCT/US2011/000400 mailed May 2, 2011.
International Search Report and Written Opinion for PCT/US2011/000403 mailed Aug. 23, 2011.
International Search Report and Written Opinion for PCT/US2011/000404 mailed Aug. 25, 2011.
International Search Report and Written Opinion for PCT/US2011/000406 mailed Sep. 15, 2011.
International Search Report and Written Opinion for PCT/US2011/000407 mailed Nov. 16, 2011.
International Search Report and Written Opinion from PCT Application No. PCT/US2011/000389, dated May 6. 2013.
International Search Report and Written Opinion from PCT Application No. PCT/US2011/000390, dated May 6. 2013.
International Search Report and Written Opinion from PCT Application No. PCT/US2012/044705 dated Oct. 9, 2012.
International Search Report and Written Opinion from PCT/US2013/057712 dated Feb. 4, 2014.
International Search Report and Written Opinion, PCT/US2009/063804, Mailed on Feb. 26, 2010.
Nichia Corp Part Spec, High Brightness LEDS, (May 1999). 15 PGS EA. (NSPW 300BS. NSPW 312BS, Etc).
Notice of Allowance from Japanese Patent Appl. No. 2014-122643. dated Sep. 3, 2015.
Notice of Decline of Amendments and Final Office Action from Japanese Appl. No. 2012-556065.
Notice of Reasons for Rejection from Japanese Patent Appl No. 2012-543086, dated Dec. 24, 2013.
Notice of Reasons for Rejection from Japanese Patent Appl. No. 2012-543086, dated Aug. 27, 2013.
Notice to Submit a Response from Korean Design Patent Application No. 30-2011-0024961, dated Sep. 10. 2012.
Notice to Submit a Response from Korean Patent Application No. 30-2011-0008445, dated Apr. 16. 2012.
Notice to Submit a Response from Korean Patent Application No. 30-2011-0008446, dated Apr. 16, 2012.
Notice to Submit a Response from Korean Patent Application No. 30-2011-0008446, dated Oct. 22. 2012.
Notice to Submit a Response from Korean Patent Application No. 30-2011-0008448, dated Apr. 16, 2012.
Notification of the Fourth Office Action from Chinese Patent Appl. No. 2011800207069. dated Aug. 24. 2015.
Office Action and Search Report from Taiwanese Patent Appl. No. 100107051, dated May 12, 2015.
Office Action for Taiwanese Patent Application No. 100300961, dated May 7. 2012.
Office Action from European Patent Appl. No. 11710906.6-1757, dated Sep. 10, 2014.
Office Action from Japanese Patent Appl No. 2012-556063, dated Oct 11, 2013.
Office Action from Japanese Patent Appl. No, 2014-122643, dated Apr. 10, 2015.
Office Action from Japanese Patent Appl. No. 2012-556062, dated Aug. 5, 2014.
Office Action from Japanese Patent Appl. No. 2012-556062, dated Dec. 20, 2013.
Office Action from Japanese Patent appl. No. 2012-556063, dated Jan. 28, 2014.
Office Action from Japanese Patent Appl. No. 2012-556064, dated Oct. 29. 2013.
Office Action from Japanese Patent Appl. No. 2012-556065, dated Aug. 5, 2014.
Office Action from Japanese Patent Appl. No. 2012-556065, dated Oct. 25, 2013.
Office Action from Japanese Patent Appl. No. 2012-556066, dated Mar. 14. 2014.
Office Action from Japanese Patent Appl. No. 2012-556066, dated Oct. 25, 2013.
Office Action from Taiwanese Appl. No. 100107040, dated Jun. 5, 2015.
Office Action from Taiwanese Appl. No. 100107047, dated Jun. 5, 2015.
Office Action from Taiwanese Appl. No. 101107038, dated Jul. 21, 2015.
Office Action from Taiwanese Patent Appl. No. 100107012, dated Jul. 22, 2015.
Office Action from Taiwanese Patent Appl. No. 100107040, dated Jun. 2, 2015.
Office Action from Taiwanese Patent Appl. No. 100107042, dated Jun. 2, 2015.
Office Action from Taiwanese Patent Appl. No. 100107044, dated Jun. 1, 2015.
Office Action from Taiwanese Patent Appl. No. 100107047, dated Jun. 2, 2015.
Office Action from Taiwanese Patent Appl. No. 100107048, dated Apr. 24, 2015.
Office Action from Taiwanese Patent Appl. No. 10420724800, dated Jun. 2, 2015.
Office Action from Taiwanese Patent Application No. 100300960, dated May 7, 2012.
Office Action from U.S. Appl. No. 11/149,999, dated Jan. 15, 2014.
Office Action from U.S. Appl. No. 11/149,999, dated Mar. 31, 2015.
Office Action from U.S. Appl. No. 11/149,999, dated May 13, 2013.
Office Action from U.S. Appl. No. 11/149.999, dated Oct. 1, 2015.
Office Action from U.S. Appl. No. 12/636,958, dated Jul. 19, 2012.
Office Action from U.S. Appl. No. 12/848,825, dated Nov. 5, 2012.
Office Action from U.S. Appl. No. 12/901,405, dated Aug. 7, 2014.
Office Action from U.S. Appl. No. 12/901,405, dated Feb. 4, 2015.
Office Action from U.S. Appl. No. 12/901,405, dated Jan. 9, 2013.
Office Action from U.S. Appl. No. 12/901,405, dated Jul. 1, 2013.
Office Action from U.S. Appl. No. 12/985,275, dated Apr. 10, 2014.
Office Action from U.S. Appl. No. 12/985,275, dated Aug. 27, 2013.
Office Action from U.S. Appl. No. 12/985,275, dated Aug. 7, 2014.
Office Action from U.S. Appl. No. 12/985,275, dated Dec. 29, 2014.
Office Action from U.S. Appl. No. 12/985,275, dated Feb. 28, 2013.
Office Action from U.S. Appl. No. 12/985,275, dated Sep. 2, 2015.
Office Action from U.S. Appl. No. 12/985.275, dated Apr. 3, 2015.
Office Action from U.S. Appl. No. 13/018,245, dated Dec. 11, 2014.
Office Action from U.S. Appl. No. 13/018,245, dated Jun. 10, 2014.
Office Action from U.S. Appl. No. 13/018,245, dated May 28, 2015.
Office Action from U.S. Appl. No. 13/018,291, dated Mar. 20, 2013.
Office Action from U.S. Appl. No. 13/018,291, dated Mar. 7, 2014.
Office Action from U.S. Appl. No. 13/018,291, dated May 31, 2013.
Office Action from U.S. Appl. No. 13/018,291, dated Oct. 10, 2012.
Office Action from U.S. Appl. No. 13/022,490, dated Apr. 2, 2013.
Office Action from U.S. Appl. No. 13/022,490, dated May 6, 2014.
Office Action from U.S. Appl. No. 13/022,490, dated Nov. 7, 2012.
Office Action from U.S. Appl. No. 13/022,490, dated Oct. 17, 2013.
Office Action from U.S. Appl. No. 13/028,863, dated Jul. 30, 2013.
Office Action from U.S. Appl. No. 13/028,863, dated Jun. 3, 2015.
Office Action from U.S. Appl. No. 13/028,863, dated Mar. 4, 2014.
Office Action from U.S. Appl. No. 13/028,863, dated May 9, 2014.
Office Action from U.S. Appl. No. 13/028,863, dated Nov. 10, 2014.
Office Action from U.S. Appl. No. 13/028,913, dated Apr. 29, 2013.
Office Action from U.S. Appl. No. 13/028,913, dated Feb. 19, 2014.
Office Action from U.S. Appl. No. 13/028,913, dated May 22, 2014.
Office Action from U.S. Appl. No. 13/028,946, dated Dec. 4, 2012.
Office Action from U.S. Appl. No. 13/028,946, dated Jul. 16, 2012.
Office Action from U.S. Appl. No. 13/028,946, dated May 27, 2014.
Office Action from U.S. Appl. No. 13/028,946, dated Oct. 31, 2013.
Office Action from U.S. Appl. No. 13/028,946, filed Apr. 11, 2013.
Office Action from U.S. Appl. No. 13/028.913, dated Nov. 4, 2013.
Office Action from U.S. Appl. No. 13/029,005, dated Jan. 24, 2013.
Office Action from U.S. Appl. No. 13/029,005, dated Jan. 4, 2013.
Office Action from U.S. Appl. No. 13/029,005, dated Jun. 11, 2013.
Office Action from U.S. Appl. No. 13/029,025, dated Aug. 17, 2015.
Office Action from U.S. Appl. No. 13/029,025, dated Aug. 6, 2014.
Office Action from U.S. Appl. No. 13/029,025, dated Dec. 11, 2014.
Office Action from U.S. Appl. No. 13/029,025, dated Dec. 6, 2013.
Office Action from U.S. Appl. No. 13/029,025, dated Jul. 16, 2013.
Office Action from U.S. Appl. No. 13/029,025. dated Apr. 29, 2015.
Office Action from U.S. Appl. No. 13/029,063, dated Apr. 1, 2014.
Office Action from U.S. Appl. No. 13/029,063, dated Jan. 13, 2015.
Office Action from U.S. Appl. No. 13/029,063, dated Oct. 23, 2013.
Office Action from U.S. Appl. No. 13/029,063, dated Sep. 17, 2015.
Office Action from U.S. Appl. No. 13/029,068, dated Apr. 24, 2014.
Office Action from U.S. Appl. No. 13/029,068, dated Dec. 23, 2014.
Office Action from U.S. Appl. No. 13/029,068, dated Jun. 13, 2014.
Office Action from U.S. Appl. No. 13/029,068, dated Mar. 31, 2015.
Office Action from U.S. Appl. No. 13/029,068, dated Nov. 15, 2013.
Office Action from U.S. Appl. No. 13/029,068, dated Sep. 8, 2015.
Office Action from U.S. Appl. No. 13/029.025, dated Mar. 19, 2014.
Office Action from U.S. Appl. No. 13/029.068, dated Sep. 26, 2014.
Office Action from U.S. Appl. No. 13/034,501, dated Dec. 3, 2012.
Office Action from U.S. Appl. No. 13/034,501, dated Jan. 23, 2014.
Office Action from U.S. Appl. No. 13/034,501, dated May 5, 2014.
Office Action from U.S. Appl. No. 13/034,501, dated Nov. 5, 2014.
Office Action from U.S. Appl. No. 13/054,501, dated May 31, 2013.
Office Action from U.S. Appl. No. 13/340,478, dated Jul. 23, 2014.
Office Action from U.S. Appl. No. 13/358,901, dated Jul. 15, 2014.
Office Action from U.S. Appl. No. 13/358,901, dated Mar. 6, 2014.
Office Action from U.S. Appl. No. 13/358,901, dated Oct. 31, 2014.
Office Action from U.S. Appl. No. 13/358,901, dated Oct. 9, 2013.
Office Action from U.S. Appl. No. 13/430,478, dated Apr. 22, 2015.
Office Action from U.S. Appl. No. 13/430,478, dated Feb. 21, 2014.
Office Action from U.S. Appl. No. 13/430,478, dated Nov. 5, 2014.
Office Action from U.S. Appl. No. 13/430.478, dated Aug. 27, 2015.
Office Action from U.S. Appl. No. 13/430.478, dated Jun. 18, 2013.
Office Action from U.S. Appl. No. 13/758,763, dated Jun. 5, 2015.
Office Action from U.S. Appl. No. 14/014,272, dated Jan. 14, 2015.
Office Action from U.S. Appl. No. 14/014,272, dated Jul. 29, 2014.
Office Action from U.S. Appl. No. 14/185.123, dated Jun. 9, 2015.
Office Action of the IPO for Taiwan Patent Application No. TW 100300960 issued Nov. 15, 2011.
Office Action of the IPO for Taiwan Patent Application No. TW 100300961 issued Nov. 16, 2011.
Office Action of the IPO for Taiwan Patent Application No. TW 100300962 issued Nov. 21, 2011.
Office Action of the IPO for Taiwan Patent Application No. TW 100302770 issued Jan. 13, 2012.
Official Action from European Patent Appl. No. 11710348.1-1757, dated Oct. 9. 2014.
Pretrial Report from Japanese Patent Appl. No. 2011-231319, dated Apr. 14, 2014.
Reasons for Rejection from Japanese Patent Appl. No. 2011-198454, dated Mar. 7, 2013.
Response to OA from U.S. Appl. No. 11/149,999, filed Sep. 13, 2013.
Response to OA from U.S. Appl. No. 12/636,958, filed Nov. 19, 2012.
Response to OA from U.S. Appl. No. 12/848,825, filed Feb. 5, 2013.
Response to OA from U.S. Appl. No. 12/901,405, filed Apr. 29, 2013.
Response to OA from U.S. Appl. No. 12/985,275, filed May 28, 2013.
Response to OA from U.S. Appl. No. 13/018,291, filed Jan. 7, 2013.
Response to OA from U.S. Appl. No. 13/018,291, filed May 20, 2013.
Response to OA from U.S. Appl. No. 13/022,490, filed Feb. 1, 2013.
Response to OA from U.S. Appl. No. 13/028,946, filed Jan. 29, 2013.
Response to OA from U.S. Appl. No. 13/028,946, filed Oct. 8, 2012.
Response to OA from U.S. Appl. No. 13/029,005, filed Apr. 17, 2013.
Response to OA from U.S. Appl. No. 13/029,068, filed Nov. 18, 2014.
Response to OA from U.S. Appl. No. 13/034,501, filed Apr. 3, 2013.
Response to OA from U.S. Appl. No. 13/358,901, filed Aug. 21, 2014.
Response to OA from U.S. Appl. No. 14/014,272, filed Mar. 3, 2015.
Search Report and Office Action from Taiwanese Patent Appl. No. 099143827, dated Jun. 12, 2015.
Search Report and Written Opinion from PCT Application No. PCT/US2012/072108, dated Feb. 27, 2013.
Second Office Action and Search Report from Chinese Patent Appl. No. 2011800207092, dated Jan. 22. 2015.
Second Office Action from Chinese Appl. No. 201080062056.X, dated Sep. 29, 2014.
Second Office Action from Chinese Appl. No. 201180022606X, dated Dec. 23. 2014.
Second Office Action from Chinese Appl. No. 201180022620X, dated Apr. 20, 2015.
Second Office Action from Chinese Patent Appl. No. 2011800207069, dated Dec. 5. 2014.
Second Office Action from Chinese Patent Appl. No. 2011800223837, dated Apr. 13, 2015.
Second Office Action from Chinese Patent Appl. No. 2011800223856, dated Apr. 16, 2015.
Second Office Action from Chinese Patent Appl. No. 2011800226248, dated May 4, 2015.
Second Office Action from Chinese Patent Appl. No. 2011800226267, dated Aug. 3, 2015.
Summons to Oral Proceedings from European Patent Appl. No. 09152962/2166580, dated Jan. 29, 2015.
Third Office Action from Chinese Patent Appl. No. 2011800207069, dated Apr. 13, 2015.
Third Office Action from Chinese Patent Appl. No. 2011800207092. dated Jul. 13, 2015.
Third Office Action from Chinese Patent Appl. No. 201180022606X, dated Jun. 10. 2015.
U.S Appl. No. 12/757,179, filed Apr. 9, 2010. Yuan, et al.
U.S. Appl. No. 12/566,195, Van De Ven, filed Sep. 24, 2009.
U.S. Appl. No. 12/704,730, Van De Ven, filed Feb. 12, 2010.
U.S. Appl. No. 12/757,179, filed Apr. 9, 2010, Yuan, et al.
U.S. Appl. No. 12/848.825, filed Aug. 2, 2010, Tong.
U.S. Appl. No. 12/901,405, filed Oct. 8, 2010, Tong.
U.S. Appl. No. 12/975,820, Van De Ven.
U.S. Appl. No. 13/017.778, filed Jan. 31, 2011, Andrews.
U.S. Appl. No. 13/018,245, filed Jan. 31, 2011, Tong.
U.S. Appl. No. 13/022,490, Feb. 7, 2011, Tong.
U.S. Appl. No. 13/029.063, filed Feb. 16, 2011, Hussell.
U.S. Appl. No. 13/358,901, filed Jan. 26, 2012, Progl. et al.
U.S. Appl. No. 13/358,901, filed Jan. 26,2012, Progl, et al.
U.S. Appl. No. 13/358,901, Jan. 26, 2012. Progl. et al.
U.S. Appl. No. 61/339,515, filed Mar. 3, 2010. Tong.
U.S. Appl. No. 61/339,516, filed Mar. 3, 2010 Tong.
U.S. Appl. No. 61/339.515, filed Mar. 3, 2010, Tong.
U.S. Appl. No. 61/424,670, filed Dec. 19, 2010, Zongjie Yuan.
U.S. Appl. No. 61/435.759, filed Jan. 24, 2011, Le.
US Publication No. 2010/0155763, Filing Date Jun. 24, 2010 Donofrio.

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9412925B2 (en) * 2013-06-25 2016-08-09 Zhiming Chen High-power LED lamp cooling device and method for manufacturing the same
US20150098223A1 (en) * 2014-01-03 2015-04-09 Chin-Feng Su Omnidirectional LED bulb
US9482391B2 (en) * 2014-01-03 2016-11-01 Chin-Feng Su Omnidirectional LED bulb

Also Published As

Publication number Publication date Type
US20130113358A1 (en) 2013-05-09 application

Similar Documents

Publication Publication Date Title
US6634770B2 (en) Light source using semiconductor devices mounted on a heat sink
US7224001B2 (en) Semiconductor light source
US8227962B1 (en) LED light bulb having an LED light engine with illuminated curved surfaces
US8297798B1 (en) LED lighting fixture
US7267461B2 (en) Directly viewable luminaire
US7722220B2 (en) Lighting device
US20120080699A1 (en) Lightweight heat sinks and led lamps employing same
US8277082B2 (en) Solid state light assembly having light redirection elements
US20110216523A1 (en) Non-uniform diffuser to scatter light into uniform emission pattern
US20110228514A1 (en) Enhanced color rendering index emitter through phosphor separation
US20120187830A1 (en) High Intensity Light Source
US20140003044A1 (en) Integrated led based illumination device
US20110215696A1 (en) Led based pedestal-type lighting structure
US20060193130A1 (en) LED lighting system
US20090262530A1 (en) Light Emitting Diode Lamp Source
EP1881259A1 (en) High power LED lamp with heat dissipation enhancement
US7575354B2 (en) Thermal management system for solid state automotive lighting
US20110080740A1 (en) Led lamp with uniform omnidirectional light intensity output
US20090080187A1 (en) Method and Apparatus for Providing an Omni-Directional Lamp Having a Light Emitting Diode Light Engine
US20100103678A1 (en) Lighting device, heat transfer structure and heat transfer element
US20110080742A1 (en) Light emitting diode (led) based lamp
US20110204780A1 (en) Modular LED Lamp and Manufacturing Methods
US8143769B2 (en) Light emitting diode (LED) lighting device
US20130058080A1 (en) Led light bulb and led light-emitting strip being capable of emitting 4tt light
US20110198979A1 (en) Illumination Source with Reduced Inner Core Size

Legal Events

Date Code Title Description
AS Assignment

Owner name: CREE, INC., NORTH CAROLINA

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:PROGL, CURT;ATHALYE, PRANEET;NEGLEY, GERALD;SIGNING DATES FROM 20121219 TO 20130118;REEL/FRAME:029751/0928