JP2001243809A - Led electric bulb - Google Patents

Led electric bulb

Info

Publication number
JP2001243809A
JP2001243809A JP2000051709A JP2000051709A JP2001243809A JP 2001243809 A JP2001243809 A JP 2001243809A JP 2000051709 A JP2000051709 A JP 2000051709A JP 2000051709 A JP2000051709 A JP 2000051709A JP 2001243809 A JP2001243809 A JP 2001243809A
Authority
JP
Japan
Prior art keywords
led
metal substrate
trumpet
heat radiating
led element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000051709A
Other languages
Japanese (ja)
Inventor
Chiharu Makihara
千晴 牧原
Kenichi Ishii
健一 石井
Yasuo Imai
康雄 今井
Kenichi Yamada
健一 山田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Lighting Corp
Original Assignee
Mitsubishi Electric Lighting Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Lighting Corp filed Critical Mitsubishi Electric Lighting Corp
Priority to JP2000051709A priority Critical patent/JP2001243809A/en
Publication of JP2001243809A publication Critical patent/JP2001243809A/en
Pending legal-status Critical Current

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/23Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89Metals
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00Globes; Bowls; Cover glasses
    • F21V3/02Globes; Bowls; Cover glasses characterised by the shape
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/30Light sources with three-dimensionally disposed light-generating elements on the outer surface of cylindrical surfaces, e.g. rod-shaped supports having a circular or a polygonal cross section
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/40Light sources with three-dimensionally disposed light-generating elements on the sides of polyhedrons, e.g. cubes or pyramids
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Device Packages (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide an LED electric bulb of high luminous efficiency and a long life by suppressing heat generation of LED elements with a simple cooling structure. SOLUTION: This electric bulb is provided with a base 1 on one end, a bugle shaped metal heat radiation part 2 expanding like a bugle toward an opening part on the other end, a translucent cover 6 attached to an opening part of the bugle shaped metal heat radiation part 2, a substrate 3 provided inside of a nearly spherical body 7 formed by the shaped metal heat radiation part 2 and the translucent cover 6, and LED elements 5 packaged on an outer surface of a metal substrate 3 facing the translucent cover 6.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】この発明は、LED素子を光
源に使用したLED電球の放熱構造に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat radiating structure for an LED bulb using an LED element as a light source.

【0002】[0002]

【従来の技術】図5は、例えば実登3034744号公
報(従来例1)に示された従来のLED素子を使用した
電球の側面図である。図において4はLED素子、13
は電球体、14は電子回路を収納した電子回路収納部で
ある。これにより寿命の長い光源を構成することができ
る。
2. Description of the Related Art FIG. 5 is a side view of a conventional light bulb using an LED element disclosed in Japanese Utility Model Publication No. 3034744 (conventional example 1). In the figure, 4 is an LED element, 13
Denotes a light bulb body, and 14 denotes an electronic circuit storage unit that stores an electronic circuit. Thereby, a light source having a long life can be configured.

【0003】また、図6は、例えば特開平09−265
807号公報(従来例2)に示されたLED信号灯であ
る。図において、21は反射鏡、22はLED光源であ
り六角筒に配置された回路基板23に複数のLED素子
24が実装されている。このLED素子24は全て青,
黄,赤のいずれかに発光する。25は無色透明の前面ガ
ラス、26は筒状の支持筒、1は口金、27は点灯回路
基板、28は投光用開口側に設けられた円板状回路基
板、29は円板状回路基板28に設けられた直射用の複
数のLED素子である。
FIG. 6 shows, for example, Japanese Patent Application Laid-Open No. 09-265.
807 (conventional example 2). In the figure, 21 is a reflecting mirror, 22 is an LED light source, and a plurality of LED elements 24 are mounted on a circuit board 23 arranged in a hexagonal cylinder. The LED elements 24 are all blue,
Emit either yellow or red light. Reference numeral 25 denotes a colorless and transparent front glass, 26 denotes a cylindrical support tube, 1 denotes a base, 27 denotes a lighting circuit board, 28 denotes a disc-shaped circuit board provided on the light emitting opening side, and 29 denotes a disc-shaped circuit board. 28 are a plurality of direct-emitting LED elements provided on the LED device 28.

【0004】このように構成され、複数のLED素子2
4は反射鏡21に対向させているので、LED素子24
の光を有効に利用でき、LED光源22の前方には直射
用LED素子29を配設したので、前面ガラス25のほ
ぼ全面の輝度均斉度を高めることができ、視認性がよい
ものである。
A plurality of LED elements 2 configured as described above
4 is opposed to the reflecting mirror 21, so that the LED element 24
Since the direct light LED element 29 is disposed in front of the LED light source 22, the brightness uniformity of almost the entire surface of the front glass 25 can be increased, and the visibility is good.

【0005】[0005]

【発明が解決しようとする課題】LED素子は、一般に
図7に示すように温度上昇に従い光出力が低下し、ま
た、図8に示すように周囲温度が高い(B)方が周囲温
度が低(A)い方より光出力の低下が大きく、寿命が短
い。しかし、上記の従来例1、2はいずれもLED素子
の発熱に対する記載がなく、LED素子の冷却はLED
素子からの放射と、電球体13内または反射鏡21と前
面ガラス25で囲まれた内部の空気の対流によるものが
主と考えられる。従って、温度上昇により発光効率が低
下し、寿命が短くなるという問題が考えられる。特に、
従来例2は輝度を均一にするためLED素子の数を多く
しているが発熱量も多くなり、発光効率が低下し、寿命
が短くなることが考えられる。
In general, the light output of an LED element decreases as the temperature rises as shown in FIG. 7, and the ambient temperature becomes lower when the ambient temperature is higher (B) as shown in FIG. (A) The optical output is greatly reduced and the life is shorter than in the case of (A). However, none of the above conventional examples 1 and 2 has any description of the heat generation of the LED element, and the cooling of the LED element is performed by using the LED.
It is considered that radiation from the element and convection of air inside the bulb 13 or inside the reflector 21 and the front glass 25 are mainly caused. Therefore, there is a problem that the luminous efficiency is reduced due to the temperature rise and the life is shortened. In particular,
In Conventional Example 2, the number of LED elements is increased in order to make the luminance uniform, but the amount of heat generated is also increased, the luminous efficiency is reduced, and the life is shortened.

【0006】この発明は上記のような問題点を解決する
ためになされたもので、簡単な冷却構造により、LED
素子の発熱を抑制して高い発光効率で長寿命のLED電
球を提供することを目的とする。
SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and has a simple cooling structure for an LED.
It is an object of the present invention to provide a long-life LED bulb with high luminous efficiency by suppressing heat generation of an element.

【0007】[0007]

【課題を解決するための手段】この発明に係るLED電
球は、一端に口金が設けられ、他端の開口部に向けてラ
ッパ状に拡がるラッパ状金属放熱部と、このラッパ状金
属放熱部の開口部に取付けられた透光性カバーと、前記
ラッパ状金属放熱部と前記透光性カバーにより形成され
た略球体の内部に設けられた金属基板と、この金属基板
の前記透光性カバーに対向する外面に実装されたLED
素子と、を備える。
An LED bulb according to the present invention is provided with a base at one end and a flared metal heat radiating portion extending in a trumpet shape toward an opening at the other end. A light-transmitting cover attached to the opening, a metal substrate provided inside a substantially spherical body formed by the trumpet-shaped metal heat radiating portion and the light-transmitting cover, and a light-transmitting cover of the metal substrate. LEDs mounted on opposing outer surfaces
And an element.

【0008】また、金属基板を板状にし、ラッパ状金属
放熱部の開口部に絶縁性を有する高熱伝導部材を介して
固着したものである。
Further, the metal substrate is formed in a plate shape and is fixed to the opening of the trumpet-shaped metal heat radiating portion via a high heat conductive member having an insulating property.

【0009】また、金属基板を一端が口金側に開口し他
端が閉塞された筒状とし、この筒状の金属基板の開口部
をラッパ状金属放熱部の口金側に絶縁性を有する高熱伝
導部材を介して固着したものである。
Further, the metal substrate is formed in a cylindrical shape having one end opened to the base and the other end closed, and the opening of the cylindrical metal substrate is provided on the base side of the trumpet-shaped metal heat radiating portion with high thermal conductivity having insulation. It is fixed via a member.

【0010】また、筒状の金属基板に、LED素子が実
装された部分から口金側の周囲に突設され、前記LED
素子からの放射光を透光カバー方向に反射させるととも
に放熱を行う反射・放熱板を備える。
[0010] Further, the LED is provided on a cylindrical metal substrate so as to protrude from a portion on which the LED element is mounted on the base side.
A reflecting / radiating plate is provided for reflecting radiation light from the element in the direction of the light-transmitting cover and radiating heat.

【0011】[0011]

【発明の実施の形態】実施の形態1.図1はこの発明の
実施の形態1を示すLED電球の断面図である。図にお
いて1は給電機能を有する円筒状の口金、2は口金の開
口端から内部側壁に沿うように配置されたリング状の絶
縁体16の内側壁に治って、一端が取付けられ、他端の
開口部に向けてラッパ状に拡がるラッパ状金属放熱部、
3はラッパ状金属放熱部2の開口部に絶縁性を有する高
熱伝導部材4を介して固着された金属基板、5は金属基
板3の外面に実装されたLED素子である。6は金属基
板3を覆うようにしてラッパ状金属放熱部2の開口部に
取付けられた透光性カバー、7はラッパ状金属放熱部2
と透光カバー6とで形成された略球体である。
DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiment 1 FIG. 1 is a cross-sectional view of an LED bulb according to Embodiment 1 of the present invention. In the figure, reference numeral 1 denotes a cylindrical base having a power supply function, and 2 denotes an inner wall of a ring-shaped insulator 16 arranged along the inner side wall from the open end of the base, one end of which is attached, and the other end of which is attached. A trumpet-shaped metal heat radiating part that spreads like a trumpet toward the opening,
Reference numeral 3 denotes a metal substrate fixed to the opening of the trumpet-shaped metal heat radiating portion 2 via a high heat conductive member 4 having an insulating property. Reference numeral 5 denotes an LED element mounted on the outer surface of the metal substrate 3. Reference numeral 6 denotes a translucent cover attached to the opening of the trumpet-shaped metal heat radiating portion 2 so as to cover the metal substrate 3, and 7 denotes a trumpet-shaped metal heat radiating portion 2.
And a translucent cover 6.

【0012】この構成において、まず、口金1から直流
電源が供給されるとLED素子4が放射光を放射する。
このときLED素子4に発生した熱は略球体7内での対
流による冷却などに加えて、金属基板3から高熱伝導部
材4を介してラッパ状金属放熱部2に流れ、ラッパ状金
属放熱部2から外部の空気に放熱される。
In this configuration, first, when DC power is supplied from the base 1, the LED element 4 emits radiated light.
At this time, the heat generated in the LED element 4 flows from the metal substrate 3 to the trumpet-shaped metal heat radiating section 2 through the high heat conduction member 4 in addition to cooling by convection in the substantially spherical body 7. From the outside to the outside air.

【0013】以上のように、簡単な冷却構造により、L
ED素子の発熱を抑制して発光効率を高くすることがで
き、寿命を長くすることができる。
As described above, with a simple cooling structure, L
The luminous efficiency can be increased by suppressing the heat generation of the ED element, and the life can be prolonged.

【0014】実施の形態2.図2は実施の形態2を示す
LED電球の断面図である。図において実施の形態1の
図1と同等の部品には同じ符号を付し説明を省略する。
8は一端が口金1側に開口し他端が閉塞された筒状の金
属基板であり、この金属基板8のLED電球の軸方向に
沿い透光カバー6に対向する外側壁と軸方向に直角な外
側面にLED素子5を実装し、この筒状金属基板8の内
側に交流を直流に変換する電源回路9を取付け板10を
介して実装したものである。
Embodiment 2 FIG. FIG. 2 is a cross-sectional view of an LED bulb according to the second embodiment. In the figure, the same reference numerals are given to the same components as those in FIG.
Reference numeral 8 denotes a cylindrical metal substrate having one end opened toward the base 1 and the other end closed. The metal substrate 8 extends in the axial direction of the LED bulb and is perpendicular to the outer wall facing the light-transmitting cover 6. An LED element 5 is mounted on the outer surface of the main body, and a power supply circuit 9 for converting alternating current to direct current is mounted via a mounting plate 10 inside the cylindrical metal substrate 8.

【0015】この構成において、LED素子5に発生し
た熱は略球体7内での対流などにより放熱されるほか、
金属基板8から高熱伝導部材4を介してラッパ状金属放
熱部2に流れ、ラッパ状金属放熱部2から外部の空気に
放熱される。
In this configuration, the heat generated in the LED element 5 is radiated by convection in the substantially spherical body 7 and the like.
The metal flows from the metal substrate 8 to the trumpet-shaped metal heat radiating section 2 via the high thermal conductive member 4 and is radiated from the trumpet-shaped metal heat radiating section 2 to the outside air.

【0016】以上のように、簡単な冷却構造により、多
数のLED素子を実装可能としつつ、効率を高くするこ
とができ、寿命を長くすることができる。また、一般商
用電源での点灯を可能にし、一般的な白熱電球と同様な
使い方ができる。
As described above, with a simple cooling structure, a large number of LED elements can be mounted, the efficiency can be increased, and the life can be prolonged. In addition, it can be turned on with a general commercial power supply, and can be used in the same manner as a general incandescent lamp.

【0017】実施の形態3.図3は実施の形態3を示す
LED電球の断面図である。図において実施の形態2の
図2と同等の部品には同じ符号を付し説明を省略する。
11は一端が口金1側に開口し他端が多角錐または円錐
状に閉塞された筒状の金属基板であり、この金属基板1
1の多角錐または円錐部11aにLED素子5を実装し
たものである。
Embodiment 3 FIG. 3 is a cross-sectional view of an LED bulb according to the third embodiment. In the figure, parts that are the same as those in FIG. 2 of the second embodiment are given the same reference numerals, and descriptions thereof are omitted.
Reference numeral 11 denotes a cylindrical metal substrate having one end open to the base 1 and the other end closed in a polygonal pyramid or conical shape.
The LED element 5 is mounted on one polygonal pyramid or conical portion 11a.

【0018】この構成により、前記の実施の形態2にお
ける効果に加えて、LED電球の軸に対して斜め前方
(図では斜め下方向)への放射を大きくすることができ
る。
With this configuration, in addition to the effects of the second embodiment, it is possible to increase the radiation obliquely forward (in the figure, obliquely downward) with respect to the axis of the LED bulb.

【0019】以上のように、簡単な冷却構造により、L
ED素子の発熱を抑制して発光効率を高くすることがで
き、寿命を長くすることができるとともに、LED電球
の配光を変更することができる。
As described above, with a simple cooling structure, L
The luminous efficiency can be increased by suppressing the heat generation of the ED element, the life can be prolonged, and the light distribution of the LED bulb can be changed.

【0020】実施の形態4.図4は実施の形態4を示す
LED電球の断面図である。図において実施の形態1の
図2と同等の部品には同じ符号を付し説明を省略する。
12は金属基板8にLED素子5が実装された部分から
口金側の金属基板8の周囲に突設され、LED素子5か
らの放射光を透光カバー6方向に反射させるとともに放
熱を行う反射・放熱板である。
Embodiment 4 FIG. 4 is a cross-sectional view of an LED bulb according to the fourth embodiment. In the figure, parts that are the same as those in FIG. 2 of Embodiment 1 are given the same reference numerals, and descriptions thereof are omitted.
Reference numeral 12 denotes a reflection / projection member which protrudes from a portion where the LED element 5 is mounted on the metal substrate 8 to the periphery of the metal substrate 8 on the base side, reflects radiation emitted from the LED element 5 in the direction of the light transmitting cover 6 and performs heat dissipation. It is a heat sink.

【0021】この構成において、LED素子5に発生し
た熱の一部は、放熱金属基板8から反射・放熱板12を
介して略球体7内での対流により放熱される。さらに、
金属基板8から高熱伝導部材4を介してラッパ状金属放
熱部2に流れ、ラッパ状金属放熱部2から外部の空気に
放熱される。一方、LED素子5から口金1方向に向か
う光や放射された熱は、反射板12により透光カバー6
方向に反射させ、LED素子5に戻る量を少なくさせ
る。
In this configuration, part of the heat generated in the LED element 5 is radiated from the radiating metal substrate 8 through the reflection / radiating plate 12 by convection in the substantially spherical body 7. further,
The metal flows from the metal substrate 8 to the trumpet-shaped metal heat radiating section 2 via the high thermal conductive member 4 and is radiated from the trumpet-shaped metal heat radiating section 2 to the outside air. On the other hand, the light and the heat radiated from the LED element 5 in the direction of the base 1 are transmitted to the light transmitting cover 6 by the reflection plate 12.
The light is reflected in the direction, and the amount returned to the LED element 5 is reduced.

【0022】以上のように、簡単な冷却構造により、L
ED素子の発熱をより一層抑制して、発光効率を高くす
ることができ、寿命を長くすることができるとともに、
反射板12によりLED電球の発光効率をさらに高める
ことができる。
As described above, with a simple cooling structure, L
The heat generation of the ED element can be further suppressed, the luminous efficiency can be increased, and the life can be prolonged.
The luminous efficiency of the LED bulb can be further increased by the reflection plate 12.

【0023】[0023]

【発明の効果】以上のように、この発明によれば、一端
に口金が設けられ、他端の開口部に向けてラッパ状に拡
がるラッパ状金属放熱部と、このラッパ状金属放熱部の
開口部に取付けられた透光性カバーと、前記ラッパ状金
属放熱部と前記透光性カバーにより形成された略球体の
内部に設けられた金属基板と、この金属基板の前記透光
性カバーに対向する外面に実装されたLED素子と、を
備えたので、簡単な冷却構造により、LED素子の発熱
を抑制して発光効率を高くすることができ、寿命を長く
することができる。
As described above, according to the present invention, a base is provided at one end, and a flared metal heat radiating portion extending in a trumpet shape toward the opening at the other end, and an opening of the flared metal heat radiating portion is provided. A light-transmitting cover attached to the portion, a metal substrate provided inside a substantially spherical body formed by the trumpet-shaped metal heat radiating portion and the light-transmitting cover, and a metal substrate facing the light-transmitting cover. And an LED element mounted on the outer surface of the LED element, so that the simple cooling structure can suppress the heat generation of the LED element, increase the luminous efficiency, and extend the life.

【0024】また、金属基板を板状にし、ラッパ状金属
放熱部の開口部に絶縁性を有する高熱伝導部材を介して
固着したので、簡単な冷却構造により、LED素子の発
熱を抑制して発光効率を高くすることができ、寿命を長
くすることができるとともに、LED素子の実装を容易
にすることができる。
Further, since the metal substrate is formed in a plate shape and is fixed to the opening of the trumpet-shaped metal heat radiating portion via a high heat conductive member having an insulating property, a simple cooling structure suppresses heat generation of the LED element and emits light. Efficiency can be increased, life can be extended, and mounting of the LED element can be facilitated.

【0025】また、金属基板を一端が口金側に開口し他
端が閉塞された筒状とし、この筒状の金属基板の開口部
をラッパ状金属放熱部の口金側に絶縁性を有する高熱伝
導部材を介して固着したので、簡単な冷却構造により、
多数のLED素子を実装可能としつつ、効率を高くする
ことができ、寿命を長くすることができる。
Further, the metal substrate is formed in a cylindrical shape having one end opened to the base and the other end closed, and the opening of the cylindrical metal substrate is provided on the base side of the trumpet-shaped metal heat radiating portion with high thermal conductivity having insulation. Since it is fixed via members, a simple cooling structure
Efficiency can be increased while a large number of LED elements can be mounted, and the life can be prolonged.

【0026】また、筒状の金属基板に、LED素子が実
装された部分から口金側の周囲に突設され、前記LED
素子からの放射光を透光カバー方向に反射させるととも
に放熱を行う反射・放熱板を備えたので、簡単な冷却構
造により、LED素子の発熱をより一層抑制して、発光
効率を高くすることができ、寿命を長くすることができ
る。また、反射板によりLED電球の発光効率をさらに
高めることができる。
Also, the LED element is provided on a cylindrical metal substrate so as to protrude from the portion where the LED element is mounted on the base side.
With a reflector / radiator plate that reflects emitted light from the element in the direction of the translucent cover and dissipates heat, the simple cooling structure further suppresses heat generation of the LED element and increases luminous efficiency. Can extend the life. Further, the luminous efficiency of the LED bulb can be further increased by the reflector.

【図面の簡単な説明】[Brief description of the drawings]

【図1】 この発明の実施の形態1を示すLED電球の
断面図である。
FIG. 1 is a cross-sectional view of an LED bulb according to Embodiment 1 of the present invention.

【図2】 この発明の実施の形態2を示すLED電球の
断面図である。
FIG. 2 is a cross-sectional view of an LED bulb according to a second embodiment of the present invention.

【図3】 この発明の実施の形態3を示すLED電球の
断面図である。
FIG. 3 is a sectional view of an LED bulb showing a third embodiment of the present invention.

【図4】 この発明の実施の形態4を示すLED電球の
断面図である。
FIG. 4 is a cross-sectional view of an LED bulb showing a fourth embodiment of the present invention.

【図5】 従来のLED素子を使用した電球の断面図で
ある。
FIG. 5 is a cross-sectional view of a light bulb using a conventional LED element.

【図6】 従来のLED素子を使用した信号灯の断面図
である。
FIG. 6 is a cross-sectional view of a signal light using a conventional LED element.

【図7】 LED素子の温度と光出力の特性図である。FIG. 7 is a characteristic diagram of temperature and light output of an LED element.

【図8】 LED素子の温度による点灯時間に対する光
出力の特性図である。
FIG. 8 is a characteristic diagram of a light output with respect to a lighting time depending on a temperature of an LED element.

【符号の説明】[Explanation of symbols]

1 口金、2 ラッパ状金属放熱部、3、8、11 金
属基板、12 反射・放熱板、5 LED素子、6 透
光性カバー、7 略球体。
1 cap, 2 horn-shaped metal radiator, 3, 8, 11 metal substrate, 12 reflector / radiator plate, 5 LED element, 6 translucent cover, 7 substantially spherical body.

フロントページの続き (72)発明者 今井 康雄 神奈川県鎌倉市大船二丁目14番40号 三菱 電機照明株式会社内 (72)発明者 山田 健一 神奈川県鎌倉市大船二丁目14番40号 三菱 電機照明株式会社内 Fターム(参考) 5F041 AA33 DA13 DA73 DA75 DA78 DC82 FF11 Continued on the front page (72) Inventor Yasuo Imai 2--14-40 Ofuna, Kamakura City, Kanagawa Prefecture Inside Mitsubishi Electric Lighting Co., Ltd. (72) Inventor Kenichi Yamada 2--14-40 Ofuna, Kamakura City, Kanagawa Prefecture Mitsubishi Electric Lighting Stock In-house F term (reference) 5F041 AA33 DA13 DA73 DA75 DA78 DC82 FF11

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】 一端に口金が設けられ、他端の開口部に
向けてラッパ状に拡がるラッパ状金属放熱部と、 このラッパ状金属放熱部の開口部に取付けられた透光性
カバーと、 前記ラッパ状金属放熱部と前記透光性カバーにより形成
された略球体の内部に設けられた金属基板と、 この金属基板の前記透光性カバーに対向する外面に実装
されたLED素子と、 を備えたことを特徴とするLED電球。
1. A flared metal heat radiating portion provided with a base at one end and expanding in a trumpet shape toward an opening at the other end; a translucent cover attached to the opening of the flared metal heat radiating portion; A metal substrate provided inside a substantially spherical body formed by the trumpet-shaped metal heat radiating portion and the translucent cover; and an LED element mounted on an outer surface of the metal substrate facing the translucent cover. An LED bulb characterized by comprising:
【請求項2】 金属基板を板状にし、ラッパ状金属放熱
部の開口部に絶縁性を有する高熱伝導部材を介して固着
したことを特徴とする請求項1記載のLED電球。
2. The LED bulb according to claim 1, wherein the metal substrate is formed in a plate shape, and is fixed to the opening of the trumpet-shaped metal heat radiating portion via a high heat conductive member having an insulating property.
【請求項3】 金属基板を一端が口金側に開口し他端が
閉塞された筒状とし、この筒状の金属基板の開口部をラ
ッパ状金属放熱部の口金側に絶縁性を有する高熱伝導部
材を介して固着したことを特徴とする請求項1記載のL
ED電球。
3. A metal substrate having one end opened to the base and the other end closed in a cylindrical shape, and the opening of the cylindrical metal substrate is provided on the base side of the trumpet-shaped metal heat radiating portion with high thermal conductivity having insulation. The L according to claim 1, wherein the L is fixed via a member.
ED bulb.
【請求項4】 筒状の金属基板に、LED素子が実装さ
れた部分から口金側の周囲に突設され、前記LED素子
からの放射光を透光カバー方向に反射させるとともに放
熱を行う反射・放熱板を備えたことを特徴とする請求項
3記載のLED電球。
4. A reflection / projection protruding from a portion on which a LED element is mounted on a cylindrical metal substrate to a periphery of a base and reflecting radiation light from the LED element in a direction of a light transmitting cover and radiating heat. The LED light bulb according to claim 3, further comprising a radiator plate.
JP2000051709A 2000-02-28 2000-02-28 Led electric bulb Pending JP2001243809A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000051709A JP2001243809A (en) 2000-02-28 2000-02-28 Led electric bulb

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000051709A JP2001243809A (en) 2000-02-28 2000-02-28 Led electric bulb

Publications (1)

Publication Number Publication Date
JP2001243809A true JP2001243809A (en) 2001-09-07

Family

ID=18573325

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000051709A Pending JP2001243809A (en) 2000-02-28 2000-02-28 Led electric bulb

Country Status (1)

Country Link
JP (1) JP2001243809A (en)

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EP2623847A1 (en) * 2009-05-28 2013-08-07 Koninklijke Philips Electronics N.V. Illumination device and method for assembly of an illumination device
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JP2011003340A (en) * 2009-06-17 2011-01-06 Wun Song Hu Effective heat radiation structure of light-emitting diode, led smd bulb, and lamp
KR101824729B1 (en) 2009-06-24 2018-02-01 이루미겐, 엘엘씨 Opto-thermal solution for multi-utility solid state lighting device using conic section geometries
US8382325B2 (en) 2009-06-30 2013-02-26 Toshiba Lighting & Technology Corporation Lamp and lighting equipment using the same
KR20120052963A (en) 2009-07-06 2012-05-24 스미토모 게이 긴조쿠 고교 가부시키가이샤 Heat dissipating member for led light bulb
US8415889B2 (en) 2009-07-29 2013-04-09 Toshiba Lighting & Technology Corporation LED lighting equipment
US8047688B2 (en) 2009-09-09 2011-11-01 Panasonic Corporation Bulb-shaped lamp and lighting device
CN102518950B (en) * 2009-09-09 2015-01-14 松下电器产业株式会社 Bulb-shaped lamp and lighting device
CN102518950A (en) * 2009-09-09 2012-06-27 松下电器产业株式会社 Bulb-shaped lamp and lighting device
EP2530373A3 (en) * 2009-09-09 2013-08-07 Panasonic Corporation Bulb-shaped lamp and lighting device
US8439527B2 (en) 2009-09-09 2013-05-14 Panasonic Corporation Bulb-type lamp and lighting device
EP2341277A4 (en) * 2009-09-09 2012-08-22 Panasonic Corp Bulb-shaped lamp and lighting device
JP4612121B1 (en) * 2009-09-09 2011-01-12 パナソニック株式会社 Light bulb shaped lamp and lighting device
EP2341277A1 (en) * 2009-09-09 2011-07-06 Panasonic Corporation Bulb-shaped lamp and lighting device
JP2011138785A (en) * 2009-09-09 2011-07-14 Panasonic Corp Lamp
WO2011030479A1 (en) * 2009-09-09 2011-03-17 パナソニック株式会社 Bulb-shaped lamp and lighting device
US8360606B2 (en) 2009-09-14 2013-01-29 Toshiba Lighting & Technology Corporation Light-emitting device and illumination device
US8354783B2 (en) 2009-09-24 2013-01-15 Toshiba Lighting & Technology Corporation Light-emitting device.having a frame member surrounding light-emitting elements and illumination device utilizing light-emitting device
US8324789B2 (en) 2009-09-25 2012-12-04 Toshiba Lighting & Technology Corporation Self-ballasted lamp and lighting equipment
US8998457B2 (en) 2009-09-25 2015-04-07 Toshiba Lighting & Technology Corporation Self-ballasted lamp and lighting equipment having a support portion in contact with an inner circumference of a base body
US8376562B2 (en) 2009-09-25 2013-02-19 Toshiba Lighting & Technology Corporation Light-emitting module, self-ballasted lamp and lighting equipment
US8678618B2 (en) 2009-09-25 2014-03-25 Toshiba Lighting & Technology Corporation Self-ballasted lamp having a light-transmissive member in contact with light emitting elements and lighting equipment incorporating the same
US8395304B2 (en) 2009-09-25 2013-03-12 Toshiba Lighting & Technology Corporation Lamp and lighting equipment with thermally conductive substrate and body
JP2011091037A (en) * 2009-09-25 2011-05-06 Toshiba Lighting & Technology Corp Lamp with cap and luminaire
US9951938B2 (en) 2009-10-02 2018-04-24 GE Lighting Solutions, LLC LED lamp
JP2011086615A (en) * 2009-10-16 2011-04-28 Foxsemicon Integrated Technology Inc Illumination device
JP2011175916A (en) * 2010-02-25 2011-09-08 Olympia Shomei Co Ltd Luminaire
US8500316B2 (en) 2010-02-26 2013-08-06 Toshiba Lighting & Technology Corporation Self-ballasted lamp and lighting equipment
JP2011181384A (en) * 2010-03-02 2011-09-15 Axia Co Ltd Lighting apparatus
KR20130018747A (en) * 2010-03-03 2013-02-25 필립스 루미리즈 라이팅 캄파니 엘엘씨 Electric lamp having reflector for transferring heat from light source
KR102071338B1 (en) * 2010-03-03 2020-01-30 시그니파이 홀딩 비.브이. Electric lamp having reflector for transferring heat from light source
JP2011249310A (en) * 2010-04-30 2011-12-08 Toshiba Lighting & Technology Corp Lamp with base and lighting fixture
JP2011238580A (en) * 2010-05-10 2011-11-24 Yadent Co Ltd Lighting system
JP2012015083A (en) * 2010-05-31 2012-01-19 Sumitomo Light Metal Ind Ltd Member for led bulb, and method of manufacturing the same
CN102261586A (en) * 2010-05-31 2011-11-30 住友轻金属工业株式会社 Part used for LED bulb and manufacturing method thereof
JP5376102B1 (en) * 2012-03-15 2013-12-25 パナソニック株式会社 LED substrate, LED module, and LED bulb
WO2013136758A1 (en) * 2012-03-15 2013-09-19 パナソニック株式会社 Substrate for led, led module, and led bulb
US9166133B2 (en) 2012-03-15 2015-10-20 Panasonic Intellectual Property Management Co., Ltd. Substrate for LED, LED module, and LED bulb
CN104170106A (en) * 2012-03-15 2014-11-26 松下电器产业株式会社 Substrate for LED, LED module, and LED bulb
JP2012142314A (en) * 2012-04-27 2012-07-26 Sanyo Electric Co Ltd Lighting device
US9841175B2 (en) 2012-05-04 2017-12-12 GE Lighting Solutions, LLC Optics system for solid state lighting apparatus
US10139095B2 (en) 2012-05-04 2018-11-27 GE Lighting Solutions, LLC Reflector and lamp comprised thereof
JP2013140807A (en) * 2013-03-07 2013-07-18 Toshiba Lighting & Technology Corp Bulb type lamp and lighting fixture

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