JP2004055800A - Led lighting device - Google Patents

Led lighting device Download PDF

Info

Publication number
JP2004055800A
JP2004055800A JP2002210817A JP2002210817A JP2004055800A JP 2004055800 A JP2004055800 A JP 2004055800A JP 2002210817 A JP2002210817 A JP 2002210817A JP 2002210817 A JP2002210817 A JP 2002210817A JP 2004055800 A JP2004055800 A JP 2004055800A
Authority
JP
Japan
Prior art keywords
heat
led
power supply
cover
lighting device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2002210817A
Other languages
Japanese (ja)
Other versions
JP4337310B2 (en
Inventor
Hiroyuki Sako
迫　浩行
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP2002210817A priority Critical patent/JP4337310B2/en
Publication of JP2004055800A publication Critical patent/JP2004055800A/en
Application granted granted Critical
Publication of JP4337310B2 publication Critical patent/JP4337310B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/507—Cooling arrangements characterised by the adaptation for cooling of specific components of means for protecting lighting devices from damage, e.g. housings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide an LED lighting device which can more efficiently radiate heat generated from an LED element to an outer part and which can relieve influence of heat to a DC power source circuit. <P>SOLUTION: The LED lighting device is provided with an LED mounting substrate on which the LED element is mounted; a radiating means installed on the LED mounting substrate; a DC power circuit outputting prescribed DC voltage by receiving main power; and a cover storing the LED mounting substrate, the heating means, and the DC power circuit. The device is also provided with a heat transmission means for transmitting heat of the radiating means to the cover. <P>COPYRIGHT: (C)2004,JPO

Description

【０００１】
【発明の属する技術分野】
本発明は、ＬＥＤ素子を光源として使用したＬＥＤ点灯装置に関する。
【０００２】
【従来の技術】
この種のＬＥＤ点灯装置としては、特開２００１−２４３８０９に開示されたものがあり、図９はその一部を切り欠いた側面図である。このＬＥＤ点灯装置は、給電機能を備え、開口部を有した有底円筒状の口金１１と、基端の開口部から先端の開口部にむけてラッパ状に広がり、基端の開口部が口金１１の開口部の内部壁面に絶縁体を介して取付けられた放熱手段、具体的には、ラッパ状金属放熱部１２と、ラッパ状金属放熱部１２の基端の開口部よりやや先端側の内面にリング状に設けられた絶縁性を有する高熱伝導部材１４と、高熱伝導部材１４に基端が固着されラッパ状金属放熱部１２の内側に設けられたＬＥＤ実装基板、具体的には、筒状金属基板１８と、筒状金属基板１８に実装されたＬＥＤ素子１と、筒状金属基板１８の内側に設けられた交流を直流に変換する直流電源回路４と、直流電源回路４が取付けられ筒状金属基板１８に固定された取付け板１０と、ＬＥＤ素子１を覆うようにしてラッパ状金属放熱部１２の先端の開口部に取付けられた透光性の透光性カバー１６と、を備えて構成されている。
【０００３】
筒状金属基板１８を詳しく述べると、筒状金属基板１８は、基端が口金１１に開口した有底筒状をなした金属基板であり、この筒状金属基板１８の先端部分の外面にＬＥＤ素子１が実装されている。
【０００４】
このＬＥＤ点灯装置を点灯させるとＬＥＤ素子１が光を放射し所定の照度が得られる。また、これと同時にＬＥＤ素子１や直流電源回路４からは、熱が発生する。しかし、ＬＥＤ素子１から発生した熱は、透光性カバー１６やラッパ状金属放熱部１２と筒状金属基板１８の間に形成された空間Ｙで生じる気体の対流により、透光性カバー１６やラッパ状金属放熱部１２を介して外部に放熱されるほか、筒状金属基板１８から高熱伝導部材１４を介してラッパ状金属放熱部１２に伝達され外部に放熱される。また、直流電源回路４から発生した熱は、筒状金属基板１８から高熱伝導部材１４を介してラッパ状金属放熱部１２に伝達され外部に放熱されるほか、筒状金属基板１８の内部の空間Ｘで生じる気体の対流により口金１を通じて外部に放熱されたり、筒状金属基板１８から空間Ｙに放熱されたりする。このようにして、ＬＥＤ素子１や直流電源回路４の熱が外部に放出され、ＬＥＤ素子１や直流電源回路４に使われている部品の許容温度を超えない範囲で使用されている。
【０００５】
また、このものを電球形状からスポットライトの形状にした場合は、図１０のようなものが考えられる。このＬＥＤ点灯装置は、ＬＥＤ素子１が実装されたＬＥＤ実装基板２と、商用電源を受けて所定の直流電圧を出力する直流電源回路４と、ＬＥＤ実装基板２と直流電源回路４とを収納する片面に開口を有した円筒状のカバー５とカバーの開口面に取付けられたレンズ７と、を備えて構成させている。
【０００６】
このＬＥＤ点灯装置を点灯させるとＬＥＤ素子１が光を放射し所定の光束が得られる。また、これと同時にＬＥＤ素子１や直流電源回路４からは、熱が発生する。しかし、ＬＥＤ素子１から発生した熱は、レンズ７とカバー５とＬＥＤ実装基板２との間に形成された空間で生じる気体の対流により、レンズ７とカバー５を介して外部に放熱されるほか、ＬＥＤ実装基板２からカバー５に伝達され外部に放熱されたり、ＬＥＤ実装基板２とカバー５と直流電源回路４との間に形成された空間Ｘで生じる気体の対流により、外部に放熱される。また、直流電源回路４から発生した熱は、前記と同様に空間Ｘで生じる気体の対流により、外部に放熱されるほか、直流電源回路４からカバー５に伝達され外部に放熱される。このようにして、ＬＥＤ素子１や直流電源回路４から発生した熱が外部に放出され、ＬＥＤ素子１や直流電源回路４に使われている部品の温度を所定の値に下げている。
【０００７】
さらに、直流電源回路４は、備えてはいないが、ＬＥＤ素子１から生じた熱を放熱するものとしては、特開２００２−９３２０６に開示されたもののように、ＬＥＤ素子１が実装されたプリント基板の裏面に絶縁シートを介して、アルミ放熱フィンなどの放熱手段を設けた構成のものがある。
【０００８】
【発明が解決しようとする課題】
ところが、上記したＬＥＤ点灯装置は、ＬＥＤ素子１と直流電源回路４とが、空間Ｘを介して互いに熱的に影響を及ぼしあっている。例えば、ＬＥＤ点灯装置の光出力を増加させるために、ＬＥＤ素子１の数を増やすことやＬＥＤ素子１に流す電流を増やすことなどを行うと、ＬＥＤ素子１の発熱量が増え、この熱が直流電源回路４に影響を及ぼすことがあった。また、直流電源回路４は、ＬＥＤ素子１に供給する電流を増加させる必要があるため、自身の発熱量が増え、この熱が、空間Ｘを介し金属基板１８やＬＥＤ実装基板２に伝わり、それに実装されたＬＥＤ素子１の温度を上げることがあった。
【０００９】
さらに、図１０のものにおいては、ＬＥＤ素子１の温度を下げるためにＬＥＤ実装基板２にアルミ放熱フィンなどの放熱手段を設けても空間Ｘの温度が上がってしまう。このため直流電源回路４の温度も上がってしまうので、直流電源回路４は、より熱的ストレスの強いものを使用する必要があった。
【００１０】
このようにＬＥＤ素子１の発熱量が増えるとその熱は、直流電源回路４に影響を及ぼし、また、直流電源回路４からの熱もＬＥＤ素子１に影響を及ぼし合ってしまう。従って、ＬＥＤ素子１から発生した熱を効率よく外部に放熱し、さらに、ＬＥＤ素子１と直流電源回路４とが、お互いに影響を及ぼしあうことの少ないものに改善する余地があった。
【００１１】
本発明は、上記事由に鑑みてなしたもので、その目的とするところは、ＬＥＤ素子から発生する熱をより効率良く外部に放熱することができ、直流電源回路への熱の影響も緩和できるＬＥＤ点灯装置を供給することにある。
【００１２】
【課題を解決するための手段】
請求項１に係る発明は、ＬＥＤ素子が実装されたＬＥＤ実装基板と、ＬＥＤ実装基板に設けられた放熱手段と、商用電源を受けて所定の直流電圧を出力する直流電源回路と、前記ＬＥＤ実装基板と放熱手段と直流電源回路とを収納するカバーと、を備えたＬＥＤ点灯装置において、前記放熱手段の熱をカバーに伝達し得る熱伝達手段を設けたことを特徴とする。
【００１３】
請求項２に係る発明は、請求項１において、前記熱伝達手段は、放熱手段の近傍に位置するカバーから連設された連設部であることを特徴とする。
【００１４】
請求項３に係る発明は、請求項１又は２において、前記カバーは、ＬＥＤ実装基板と放熱手段とを収納する光源部収納カバーと、直流電源回路を収納する電源部収納カバーと、により構成され、光源部収納カバーが熱伝達手段であることを特徴とする。
【００１５】
請求項４に係る発明は、請求項３において、前記光源部収納カバーの一部が放熱手段であることを特徴とする。
【００１６】
請求項５に係る発明は、請求項１乃至請求項４のいずれかにおいて、前記熱伝達手段は、ＬＥＤ実装基板に直接取付けられたことを特徴とする。
【００１７】
請求項６に係る発明は、至請求項５において、前記放熱手段とＬＥＤ素子とは、熱伝導性のよい接着剤を介して接合させたことを特徴とする。
【００１８】
【発明の実施の形態】
（第１の実施の形態）
本発明の第１の実施の形態を図１〜図４を用いて説明する。図１はＬＥＤ点灯装置の断面図、図２は熱伝達手段の図で図２（ａ）は正面図、図２（ｂ）はその一部を切り欠いた側面図、図３はレンズの正面図、図４はＬＥＤ実装基板で図４（ａ）は正面図、図４（ｂ）は側面図である。
【００１９】
このＬＥＤ点灯装置は、ＬＥＤ素子１が実装されたＬＥＤ実装基板２と、ＬＥＤ実装基板２に設けられた放熱手段３と、商用電源を受けて所定の直流電圧を出力する直流電源回路４と、ＬＥＤ実装基板２と放熱手段３と直流電源回路４とを収納するカバー５とカバーの開口面に取付けられたレンズ７と、を備えて構成されている。
【００２０】
ＬＥＤ素子１は、チップ素子とワイヤーボンディングと蛍光体とからなる、順方向のＯＮ電圧が３．６Ｖの青色発光ダイオードである。チップ素子は、底面が０．５ｍｍ×０．５ｍｍで高さ０．３ｍｍの直方体で、下層の絶縁層と上層の半導体層とで形成されている。上層の半導体層には、その対角方向にアノードとカソードの電極が配置され、その各々からワイヤーボンディングにより、ＬＥＤ実装基板２に配線がなされている。
【００２１】
ＬＥＤ実装基板２は、熱伝導のよいプリント配線板を円板状に加工したもので１２ケのＬＥＤ素子１とこれを制御する電子部品２０（トランジスタ、抵抗、コンデンサ、ダイオードなどのチップ部品）がその一面に図４のように実装されている。このＬＥＤ実装基板２へのＬＥＤ素子１の実装をさらに詳しく述べると、ＬＥＤ素子１は、ＬＥＤ実装基板２に、チップ素子よりも深く、すり鉢状に設けられた窪みの底の部分に、接着剤を介して実装されている。つまりチップ素子の絶縁層が接着剤と接合されて実装される。そして、チップ素子を覆うように、光を青から白に変えることのできる蛍光体が、ＬＥＤ実装基板２に設けられた窪みに充填されている。
【００２２】
放熱手段３は、アルミなどの金属材料をＬＥＤ実装基板２と略同等の円板状に加工したもので、ＬＥＤ素子１が放熱されやすいよう、ＬＥＤ実装基板２の裏面にＬＥＤ実装基板２と一体化して取付けられている。
【００２３】
直流電源回路４は、商用電源のＡＣ１００Ｖを入力して直流の２４Ｖを出力するもので、ＬＥＤ実装基板２と略同等の円板状をなしたプリント配線板に実装されている。また、カバー５は、樹脂材料により上方に開口部を有した略有底円筒状に形成され、その底面部の下側には商用電源を受ける電源端子台が設けられており、底面部の中央には、電源端子台からの電源線を引き込む孔が設けられている。そして、カバー５の底面部と開口との略中間部分には、直流電源回路４が取付けられ、その上方には、ＬＥＤ実装基板２と放熱手段３とがＬＥＤ実装面を上にして取付けられている。そして、カバー５の開口部には、レンズ７が取付けられている。
【００２４】
ここで重要なことは、放熱手段３の熱をカバーに伝達し得る熱伝達手段６を設けたことである。具体的には、この熱伝達手段６は、アルミなどの金属材料を加工したもので放熱手段３と直流電源回路４との間に設けている。そして、熱伝達手段６は、図２に示すように、放熱手段３より一回り大きい円板状をなし、その中央には直流電源回路４からの電源供給線を通すための孔が設けられた底板６ａと、底板６ａの周囲に立ち上がった壁部６ｂと、壁部６ｂの対向する位置に設けられたカバー５への取付け固定部６ｃと、により構成している。そして、熱伝達手段６の壁部６ｂ側の底板６ａには、ＬＥＤ実装基板２と一体化された放熱手段３を取付けている。
【００２５】
このように構成したＬＥＤ点灯装置を点灯させると、ＬＥＤ素子１が光を放射し所定の光束が得られる。また、これと同時にＬＥＤ素子１や直流電源回路４からは、熱が発生する。しかし、ＬＥＤ素子１から発生した熱は、レンズ７とカバー５とＬＥＤ実装基板２との間に形成された空間で生じる気体の対流により、レンズ７とカバー５を介して外部に放熱されるほか、ＬＥＤ実装基板２から放熱手段３を経由して、熱伝達手段６に伝わり、熱伝達手段６の壁部６ｂ並びに取付け固定部６ｃよりカバー５を通じて外部に放熱されたり、熱伝達手段６とカバー５と直流電源回路４との間に形成された空間Ｘで生じる気体の対流により、外部に放熱される。
【００２６】
この実施の形態によると、底板６ａの周囲に立ち上がった壁部６ｂを有した熱伝達手段６を取付け固定部６ｃによりカバー５に取付けることにより、従来、ＬＥＤ実装基板２を直接カバー５に取付けしていたものに比べ、カバー５との接触面積が増加するので、ＬＥＤ実装基板２からの熱は、より効率よくカバー５に伝達され放熱される、また、壁部６ｂをＬＥＤ素子側に設けたこと並びに放熱手段３と直流電源回路４との間に熱伝達手段６を設けたことにより、ＬＥＤ素子１からの熱が直流電源回路４に伝わりにくくなっている。この結果、ＬＥＤ素子１から発生する熱をより効率良く外部に放熱することができるので、ＬＥＤ素子１の温度が下がり、直流電源回路４への熱の影響も緩和できる。
なお、ＬＥＤ実装基板２にＬＥＤ素子１が貫通するＬＥＤ実装孔を設け、ＬＥＤ素子１を熱伝導性のよい接着剤を介して放熱手段３に接合し、実装してもよい。これにより、ＬＥＤ素子１の熱がよりすみやかに放熱手段３に伝わり、よりＬＥＤ素子１の温度を低くすることができる。
【００２７】
また、図５は、第１の実施の形態の応用例で、図はＬＥＤ点灯装置の断面図である。この応用例は、前述した、熱伝達手段６の構成を変えたものである。すなわち熱伝達手段６は、放熱手段３の近傍に位置するカバー５から連設された連設部により形成されている。そして、カバー５全体を熱伝導のよいアルミ材などの金属材料で構成している。この応用例によると、構成部材の部品点数が削減でき、カバー５全体をアルミ材などの金属材料で構成したので、第１の実施の形態で説明したものよりＬＥＤ点灯装置としての放熱性が上がるので、ＬＥＤ素子１と直流電源回路４との温度をさらに下げることができる。
【００２８】
（第２の実施の形態）
本発明の第２の実施の形態を図６、図７を用いて説明する。図６はＬＥＤ点灯装置の断面図、図７は、このものを分離した側面図である。このものは、第１の実施の形態におけるカバー５の形状を変えたものである。図において、カバー５は、ＬＥＤ実装基板２と放熱手段３とを収納する光源部収納カバー５ａと、直流電源回路４を収納する電源部収納カバー５ｂと、により構成され、熱伝達手段６を光源部収納カバー５ａにて形成している。
【００２９】
光源部収納カバー５ａは、熱伝導のよいアルミ材などの金属材料により上方に開口部を有した略有底円筒状に形成され、その底面部の中央には直流電源回路４からの電源供給線を通すための孔が設けられている。そして、この底面部にＬＥＤ実装基板２と一体化された放熱手段３がＬＥＤ実装面を上にして取付けられている。また光源部収納カバー５ａの開口部には、レンズ７が取付けられている。
【００３０】
電源部収納カバー５ｂは、樹脂材料により上面部と底面部を有した略円筒状に形成され、底面部の下側には商用電源を受ける電源端子台が設けられており、その中央には、電源端子台からの電源線を引き込む孔が設けられている。そして、カバー５の内部、上方には、直流電源回路４が取付けられており、その中央には直流電源回路４の電源供給線を通すための孔が設けられている。その他の第１の実施の形態と同一の構成部材には同一符号を付すことにより説明を省略する。
【００３１】
このように構成されたＬＥＤ点灯装置を点灯させるとＬＥＤ素子１が光を放射し所定の照度が得られる。また、これと同時にＬＥＤ素子１や直流電源回路４からは、熱が発生する。しかし、ＬＥＤ素子１から発生した熱は、レンズ７とカバー５とＬＥＤ実装基板２との間に形成された空間で生じる気体の対流により、レンズ７とカバー５を介して外部に放熱されるほか、ＬＥＤ実装基板２から放熱手段３を経由して、光源部収納カバー５ａの底面部で形成された熱伝達手段６に伝わり、光源部収納カバー５ａを通じて外部に放熱される。
【００３２】
この実施の形態によると、従来、ＬＥＤ実装基板２を直接カバー５に取付けしていたものに比べ、カバー５との接触面積が増加するので、ＬＥＤ実装基板２からの熱は、より効率よくカバー５に伝達され外部に放熱される、従って、ＬＥＤ素子１の温度が下がり、直流電源回路４への熱の影響も緩和できる。また、ケース５をＬＥＤ実装基板２と放熱手段３とを収納する光源部収納カバー５ａと、直流電源回路４を収納する電源部収納カバー５ｂと、に分離したことにより、第１の実施の形態で説明したものよりもさらに、ＬＥＤ素子１からの熱が直流電源回路４に伝わりにくくなっている。
【００３３】
なお、図８は第２の実施の形態の応用例で、図はＬＥＤ点灯装置の断面図である。この応用例は、前述した、光源部収納カバー５ａの底面部を変えたものである。図において、光源部収納カバー５ａの底面部は、放熱手段３により構成され、これが光源部収納カバー５ａの側面に固定されている。
【００３４】
この応用例によると、光源部収納カバー５ａの放熱部材の使用量を削減できる。
【００３５】
【発明の効果】
請求項１記載の発明にあっては、ＬＥＤ素子が実装されたＬＥＤ実装基板と、ＬＥＤ実装基板に設けられた放熱手段と、商用電源を受けて所定の直流電圧を出力する直流電源回路と、前記ＬＥＤ実装基板と放熱手段と直流電源回路とを収納するカバーと、を備えたＬＥＤ点灯装置において、前記放熱手段の熱をカバーに伝達し得る熱伝達手段を設けたことにより、ＬＥＤ実装基板とカバーとの接触面積が増加するので、ＬＥＤ素子から発生する熱がより効率よく外部に放熱される、この結果、ＬＥＤ素子の温度が下がり、直流電源回路への熱の影響も緩和することができる。
【００３６】
請求項２記載の発明にあっては、前記熱伝達手段は、放熱手段の近傍に位置するカバーから連設された連設部であることにより、請求項１に記載の効果を奏するうえに、構成部材の部品点数が削減できできる。
【００３７】
請求項３記載の発明にあっては、前記カバーは、ＬＥＤ実装基板と放熱手段とを収納する光源部収納カバーと、直流電源回路を収納する電源部収納カバーと、により構成され、光源部収納カバーが熱伝達手段であることにより、請求項１又は請求項２に記載の効果を奏するうえに、ＬＥＤ素子からの熱が直流電源回路に伝わりにくくなり、直流電源回路への熱の影響が緩和できる。
【００３８】
請求項４記載の発明にあっては、前記光源部収納カバーの一部が放熱手段であることにより、請求項３に記載の効果を奏するうえに、構成部材の部品点数が削減できできる。
【００３９】
請求項５記載の発明にあっては、前記熱伝達手段は、ＬＥＤ実装基板に直接取付けられたことにより、請求項１乃至請求項４に記載の効果を奏するうえにＬＥＤ素子からの熱の放熱性をさらに改善できる。
【００４０】
請求項６記載の発明にあっては、前記放熱手段とＬＥＤ素子とは、熱伝導性のよい接着剤を介して接合させたことにより、請求項５に記載した効果を奏するうえに、ＬＥＤ素子の熱がよりすみやかに放熱手段に伝わるようになる。
【図面の簡単な説明】
【図１】本発明の第１の実施の形態に係るＬＥＤ点灯装置の断面図である。
【図２】同上のＬＥＤ点灯装置の熱伝達手段を示す図で、図２（ａ）は正面図、図２（ｂ）は一部を切り欠いた側面図である。
【図３】同上のＬＥＤ点灯装置のレンズの正面図である。
【図４】同上のＬＥＤ点灯装置のＬＥＤ実装基板を示す図で、図４（ａ）は正面図、図４（ｂ）は側面図である。
【図５】同上のＬＥＤ点灯装置の応用例を示す断面図である。
【図６】本発明の第２の実施の形態に係るＬＥＤ点灯装置の断面図である。
【図７】同上のＬＥＤ点灯装置を分離した側面図である。
【図８】同上のＬＥＤ点灯装置の応用例を示す断面図である。
【図９】第１の従来例に係るＬＥＤ点灯装置の一部を切り欠いた側面図である。
【図１０】第２の従来例に係るＬＥＤ点灯装置の断面図である。
【符号の説明】
１　　　ＬＥＤ素子
２　　　ＬＥＤ実装基板
３　　　放熱手段
４　　　直流電源回路
５　　　カバー
５ａ　　光源部収納カバー
５ｂ　　電源部収納カバー
６　　　熱伝達手段
７　　　レンズ[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an LED lighting device using an LED element as a light source.
[0002]
[Prior art]
As this type of LED lighting device, there is one disclosed in Japanese Patent Application Laid-Open No. 2001-243809, and FIG. 9 is a side view with a part thereof cut away. This LED lighting device has a power supply function and has a bottomed cylindrical base 11 having an opening, and a trumpet shape extending from the base end opening to the front end opening, and the base end opening is provided with a base. A heat dissipating means attached to the inner wall surface of the opening of the opening 11 via an insulator, specifically, a trumpet-shaped metal heat dissipating portion 12; A high heat conductive member 14 having an insulating property provided in a ring shape on the LED, and an LED mounting board having a base end fixed to the high heat conductive member 14 and provided inside the trumpet-shaped metal heat radiating portion 12, specifically, a cylindrical shape A metal substrate 18; an LED element 1 mounted on the cylindrical metal substrate 18; a DC power supply circuit 4 provided inside the cylindrical metal substrate 18 for converting alternating current to direct current; A mounting plate 10 fixed to the metal substrate 18; So as to cover the D element 1 is configured to include a trumpet shape metal heat radiation part transparent translucent cover 16 attached to the opening at the tip of 12.
[0003]
The cylindrical metal substrate 18 will be described in detail. The cylindrical metal substrate 18 is a metal substrate having a bottomed cylindrical shape whose base end is open to the base 11, and an LED on the outer surface of the distal end portion of the cylindrical metal substrate 18. Element 1 is mounted.
[0004]
When this LED lighting device is turned on, the LED element 1 emits light and a predetermined illuminance is obtained. At the same time, heat is generated from the LED element 1 and the DC power supply circuit 4. However, the heat generated from the LED element 1 is generated by the convection of the gas generated in the translucent cover 16 and the space Y formed between the trumpet-shaped metal heat radiating portion 12 and the cylindrical metal substrate 18, so that the translucent cover 16 and In addition to being radiated to the outside through the trumpet-shaped metal heat radiating section 12, the heat is transmitted from the tubular metal substrate 18 to the trumpet-shaped metal heat radiating section 12 through the high heat conduction member 14 and radiated to the outside. In addition, heat generated from the DC power supply circuit 4 is transmitted from the tubular metal substrate 18 to the flared metal radiating portion 12 via the high thermal conductive member 14 and is radiated to the outside. The heat is radiated to the outside through the base 1 by the convection of the gas generated in X, or is radiated to the space Y from the cylindrical metal substrate 18. In this manner, the heat of the LED element 1 and the DC power supply circuit 4 is released to the outside, and the LED element 1 and the DC power supply circuit 4 are used within a range that does not exceed the allowable temperature of the components used.
[0005]
When this is changed from a bulb shape to a spotlight shape, a shape as shown in FIG. 10 can be considered. This LED lighting device houses an LED mounting board 2 on which an LED element 1 is mounted, a DC power supply circuit 4 for receiving a commercial power supply and outputting a predetermined DC voltage, and an LED mounting board 2 and a DC power supply circuit 4. It comprises a cylindrical cover 5 having an opening on one side and a lens 7 attached to the opening of the cover.
[0006]
When this LED lighting device is turned on, the LED element 1 emits light and a predetermined light flux is obtained. At the same time, heat is generated from the LED element 1 and the DC power supply circuit 4. However, heat generated from the LED element 1 is radiated to the outside via the lens 7 and the cover 5 due to convection of gas generated in a space formed between the lens 7 and the cover 5 and the LED mounting board 2. Is transmitted from the LED mounting board 2 to the cover 5 and radiated to the outside, or is radiated to the outside by convection of gas generated in the space X formed between the LED mounting board 2 and the cover 5 and the DC power supply circuit 4. . Further, the heat generated from the DC power supply circuit 4 is radiated to the outside by the convection of the gas generated in the space X in the same manner as described above, and is also transmitted from the DC power supply circuit 4 to the cover 5 and radiated to the outside. Thus, the heat generated from the LED element 1 and the DC power supply circuit 4 is released to the outside, and the temperature of the components used in the LED element 1 and the DC power supply circuit 4 is reduced to a predetermined value.
[0007]
Further, although the DC power supply circuit 4 is not provided, as a device for radiating heat generated from the LED element 1, a printed circuit board on which the LED element 1 is mounted is disclosed in Japanese Patent Application Laid-Open No. 2002-93206. There is a configuration in which a heat dissipating means such as an aluminum heat dissipating fin is provided on the back surface of the device through an insulating sheet.
[0008]
[Problems to be solved by the invention]
However, in the above-mentioned LED lighting device, the LED element 1 and the DC power supply circuit 4 thermally influence each other via the space X. For example, if the number of the LED elements 1 is increased or the current flowing through the LED elements 1 is increased to increase the light output of the LED lighting device, the calorific value of the LED elements 1 increases, and this heat is The power supply circuit 4 was sometimes affected. In addition, the DC power supply circuit 4 needs to increase the current supplied to the LED element 1, so that its own calorific value increases, and this heat is transmitted to the metal board 18 and the LED mounting board 2 via the space X, and The temperature of the mounted LED element 1 may be increased.
[0009]
Further, in the case of FIG. 10, even if a heat radiating means such as an aluminum radiating fin is provided on the LED mounting board 2 to lower the temperature of the LED element 1, the temperature of the space X rises. For this reason, the temperature of the DC power supply circuit 4 also increases, so that it is necessary to use a DC power supply circuit 4 having a higher thermal stress.
[0010]
When the amount of heat generated by the LED element 1 increases in this manner, the heat affects the DC power supply circuit 4, and the heat from the DC power supply circuit 4 also affects the LED element 1. Therefore, there is room for improving the heat generated from the LED element 1 to be efficiently radiated to the outside, and further improving the LED element 1 and the DC power supply circuit 4 so as not to affect each other.
[0011]
The present invention has been made in view of the above circumstances, and an object of the present invention is to be able to more efficiently radiate heat generated from an LED element to the outside and to reduce the influence of heat on a DC power supply circuit. To provide an LED lighting device.
[0012]
[Means for Solving the Problems]
The invention according to claim 1 is an LED mounting board on which an LED element is mounted, a heat dissipating means provided on the LED mounting board, a DC power supply circuit receiving a commercial power supply and outputting a predetermined DC voltage, and the LED mounting board. An LED lighting device comprising a substrate, a heat radiating means, and a cover for accommodating a DC power supply circuit, wherein a heat transfer means capable of transmitting heat of the heat radiating means to the cover is provided.
[0013]
The invention according to claim 2 is characterized in that, in claim 1, the heat transfer means is a continuous portion provided continuously from a cover located near the heat radiating means.
[0014]
According to a third aspect of the present invention, in the first or second aspect, the cover includes a light source unit storage cover that stores the LED mounting board and the heat radiating unit, and a power supply unit storage cover that stores the DC power supply circuit. The light source unit storage cover is a heat transfer unit.
[0015]
The invention according to claim 4 is characterized in that, in claim 3, a part of the light source unit storage cover is a heat radiating unit.
[0016]
According to a fifth aspect of the present invention, in any one of the first to fourth aspects, the heat transfer means is directly attached to the LED mounting board.
[0017]
The invention according to claim 6 is the invention according to claim 5, wherein the heat radiating means and the LED element are joined via an adhesive having good heat conductivity.
[0018]
BEST MODE FOR CARRYING OUT THE INVENTION
(First Embodiment)
A first embodiment of the present invention will be described with reference to FIGS. 1 is a sectional view of an LED lighting device, FIG. 2 is a view of a heat transfer means, FIG. 2 (a) is a front view, FIG. 2 (b) is a side view with a part thereof cut away, and FIG. 4A and 4B show the LED mounting board, FIG. 4A is a front view, and FIG. 4B is a side view.
[0019]
The LED lighting device includes an LED mounting board 2 on which an LED element 1 is mounted, a heat radiating means 3 provided on the LED mounting board 2, a DC power supply circuit 4 receiving a commercial power supply and outputting a predetermined DC voltage, It comprises a cover 5 for accommodating the LED mounting board 2, the heat radiating means 3, and the DC power supply circuit 4, and a lens 7 attached to the opening of the cover.
[0020]
The LED element 1 is a blue light emitting diode including a chip element, wire bonding, and a phosphor and having a forward ON voltage of 3.6 V. The chip element is a rectangular solid having a bottom surface of 0.5 mm × 0.5 mm and a height of 0.3 mm, and is formed of a lower insulating layer and an upper semiconductor layer. An anode and a cathode are arranged in the upper semiconductor layer in the diagonal direction, and wiring is made to the LED mounting board 2 by wire bonding from each of them.
[0021]
The LED mounting board 2 is obtained by processing a printed wiring board having good heat conductivity into a disk shape, and includes 12 LED elements 1 and electronic components 20 (chip parts such as transistors, resistors, capacitors, and diodes) for controlling the LED elements. It is mounted on one side as shown in FIG. The mounting of the LED element 1 on the LED mounting board 2 will be described in more detail. The LED element 1 is provided with an adhesive on the LED mounting board 2 at the bottom of the mortar provided deeper than the chip element. Has been implemented via That is, the insulating layer of the chip element is bonded to the adhesive and mounted. Then, a phosphor capable of changing light from blue to white is filled in the recess provided in the LED mounting board 2 so as to cover the chip element.
[0022]
The heat dissipating means 3 is formed by processing a metal material such as aluminum into a disk shape substantially equivalent to that of the LED mounting board 2. And installed.
[0023]
The DC power supply circuit 4 receives a commercial power supply of AC 100 V and outputs DC 24 V, and is mounted on a printed wiring board having a disk shape substantially equivalent to the LED mounting board 2. The cover 5 is formed in a substantially cylindrical shape with a bottom having an opening at the top by a resin material, and a power terminal block for receiving commercial power is provided below the bottom of the cover 5. Is provided with a hole for drawing a power supply line from a power supply terminal block. A DC power supply circuit 4 is attached to a substantially intermediate portion between the bottom surface and the opening of the cover 5, and an LED mounting board 2 and a heat radiating means 3 are attached above the DC power supply circuit 4 with the LED mounting surface facing upward. I have. The lens 7 is attached to the opening of the cover 5.
[0024]
What is important here is that the heat transfer means 6 that can transfer the heat of the heat radiation means 3 to the cover is provided. Specifically, the heat transfer means 6 is formed by processing a metal material such as aluminum, and is provided between the heat radiating means 3 and the DC power supply circuit 4. As shown in FIG. 2, the heat transfer means 6 has a disk shape slightly larger than the heat radiating means 3, and a hole for passing a power supply line from the DC power supply circuit 4 is provided at the center thereof. It comprises a bottom plate 6a, a wall portion 6b rising up around the bottom plate 6a, and a fixing portion 6c attached to the cover 5 provided at a position facing the wall portion 6b. The heat dissipating means 3 integrated with the LED mounting board 2 is attached to the bottom plate 6a of the heat transfer means 6 on the wall 6b side.
[0025]
When the thus-configured LED lighting device is turned on, the LED element 1 emits light and a predetermined light flux is obtained. At the same time, heat is generated from the LED element 1 and the DC power supply circuit 4. However, heat generated from the LED element 1 is radiated to the outside via the lens 7 and the cover 5 due to convection of gas generated in a space formed between the lens 7 and the cover 5 and the LED mounting board 2. The heat is transmitted from the LED mounting board 2 to the heat transfer means 6 via the heat radiating means 3, and is radiated to the outside through the cover 5 from the wall 6 b of the heat transfer means 6 and the mounting and fixing portion 6 c. The heat is radiated to the outside by the convection of the gas generated in the space X formed between the DC power supply circuit 5 and the DC power supply circuit 4.
[0026]
According to this embodiment, the LED mounting board 2 is directly attached to the cover 5 by attaching the heat transfer means 6 having the wall 6b rising up around the bottom plate 6a to the cover 5 by the attachment fixing portion 6c. Since the contact area with the cover 5 is increased as compared with the conventional one, heat from the LED mounting board 2 is more efficiently transmitted to the cover 5 and radiated, and the wall 6b is provided on the LED element side. In addition, since the heat transfer means 6 is provided between the heat radiating means 3 and the DC power supply circuit 4, heat from the LED element 1 is hardly transmitted to the DC power supply circuit 4. As a result, the heat generated from the LED element 1 can be more efficiently radiated to the outside, so that the temperature of the LED element 1 decreases and the influence of the heat on the DC power supply circuit 4 can be reduced.
The LED mounting board 2 may be provided with an LED mounting hole through which the LED element 1 penetrates, and the LED element 1 may be bonded to the heat dissipating means 3 via an adhesive having good heat conductivity and mounted. Thereby, the heat of the LED element 1 is transmitted to the heat radiating means 3 more quickly, and the temperature of the LED element 1 can be further reduced.
[0027]
FIG. 5 is an application example of the first embodiment, and is a cross-sectional view of the LED lighting device. In this application example, the configuration of the heat transfer means 6 described above is changed. That is, the heat transfer means 6 is formed by a continuous portion continuously provided from the cover 5 located near the heat radiating means 3. The entire cover 5 is made of a metal material such as an aluminum material having good heat conductivity. According to this application example, the number of components can be reduced, and the entire cover 5 is made of a metal material such as aluminum, so that the heat radiation as an LED lighting device is higher than that described in the first embodiment. Therefore, the temperatures of the LED element 1 and the DC power supply circuit 4 can be further reduced.
[0028]
(Second embodiment)
A second embodiment of the present invention will be described with reference to FIGS. FIG. 6 is a sectional view of the LED lighting device, and FIG. 7 is a side view of the LED lighting device separated therefrom. This is a modification of the cover 5 in the first embodiment. In the figure, a cover 5 is composed of a light source unit storage cover 5a that stores the LED mounting board 2 and the heat radiating unit 3, and a power unit storage cover 5b that stores the DC power supply circuit 4. It is formed by the section storage cover 5a.
[0029]
The light source unit storage cover 5a is formed of a metal material such as aluminum having good heat conductivity and is formed in a substantially cylindrical shape having an opening at an upper part, and a power supply line from the DC power supply circuit 4 is provided at the center of the bottom surface. There is a hole for passing through. The heat dissipating means 3 integrated with the LED mounting board 2 is attached to the bottom surface with the LED mounting surface facing upward. A lens 7 is attached to the opening of the light source unit storage cover 5a.
[0030]
The power supply unit storage cover 5b is formed in a substantially cylindrical shape having a top surface and a bottom surface with a resin material, and a power supply terminal block for receiving commercial power is provided below the bottom surface. A hole for drawing a power line from the power terminal block is provided. The DC power supply circuit 4 is mounted inside and above the cover 5, and a hole for passing a power supply line of the DC power supply circuit 4 is provided at the center thereof. The description of the same components as in the first embodiment will be omitted by retaining the same reference numerals.
[0031]
When the LED lighting device thus configured is turned on, the LED element 1 emits light, and a predetermined illuminance is obtained. At the same time, heat is generated from the LED element 1 and the DC power supply circuit 4. However, heat generated from the LED element 1 is radiated to the outside via the lens 7 and the cover 5 due to convection of gas generated in a space formed between the lens 7 and the cover 5 and the LED mounting board 2. Then, the heat is transmitted from the LED mounting board 2 to the heat transfer means 6 formed on the bottom surface of the light source unit storage cover 5a via the heat radiation unit 3, and is radiated to the outside through the light source unit storage cover 5a.
[0032]
According to this embodiment, since the contact area with the cover 5 is increased as compared with the conventional case where the LED mounting board 2 is directly attached to the cover 5, the heat from the LED mounting board 2 is more efficiently covered. 5 and is radiated to the outside. Therefore, the temperature of the LED element 1 decreases, and the influence of heat on the DC power supply circuit 4 can be reduced. In addition, the case 5 is separated into a light source unit housing cover 5a that houses the LED mounting board 2 and the heat radiating unit 3 and a power unit housing cover 5b that houses the DC power supply circuit 4, thereby providing the first embodiment. Further, the heat from the LED element 1 is less likely to be transmitted to the DC power supply circuit 4 than that described in the above.
[0033]
FIG. 8 is an application example of the second embodiment, and FIG. 8 is a sectional view of an LED lighting device. In this application example, the bottom surface of the light source unit storage cover 5a is changed. In the figure, the bottom surface of the light source unit storage cover 5a is constituted by heat radiating means 3, and this is fixed to the side surface of the light source unit storage cover 5a.
[0034]
According to this application example, the amount of the heat dissipating member of the light source unit storage cover 5a can be reduced.
[0035]
【The invention's effect】
In the invention according to claim 1, an LED mounting board on which an LED element is mounted, a heat radiating means provided on the LED mounting board, a DC power supply circuit for receiving a commercial power supply and outputting a predetermined DC voltage, In an LED lighting device comprising the LED mounting board, a heat radiating means, and a cover accommodating a DC power supply circuit, by providing a heat transfer means capable of transmitting heat of the heat radiating means to the cover, Since the contact area with the cover increases, the heat generated from the LED element is more efficiently radiated to the outside. As a result, the temperature of the LED element decreases, and the influence of the heat on the DC power supply circuit can be reduced. .
[0036]
According to the second aspect of the present invention, the heat transfer means is a continuous portion continuously provided from a cover located near the heat radiating means. The number of components of the constituent members can be reduced.
[0037]
According to the third aspect of the invention, the cover includes a light source unit storage cover that stores the LED mounting board and the heat radiating unit, and a power supply unit storage cover that stores the DC power supply circuit. Since the cover is a heat transfer means, in addition to the effects described in claim 1 or claim 2, heat from the LED element is less likely to be transmitted to the DC power supply circuit, and the influence of heat on the DC power supply circuit is reduced. it can.
[0038]
According to the fourth aspect of the present invention, since a part of the light source unit storage cover is a heat radiating means, the effect of the third aspect can be obtained, and the number of components of the constituent member can be reduced.
[0039]
According to the fifth aspect of the invention, the heat transfer means is directly attached to the LED mounting board, so that the heat transfer means has the effects of the first to fourth aspects and further radiates heat from the LED element. Performance can be further improved.
[0040]
In the invention according to claim 6, the heat dissipation means and the LED element are joined via an adhesive having good thermal conductivity, so that the effect described in claim 5 can be obtained and the LED element can be obtained. Heat is more quickly transferred to the heat radiating means.
[Brief description of the drawings]
FIG. 1 is a sectional view of an LED lighting device according to a first embodiment of the present invention.
FIGS. 2A and 2B are views showing a heat transfer means of the LED lighting device, and FIG. 2A is a front view, and FIG.
FIG. 3 is a front view of a lens of the LED lighting device.
4A and 4B are diagrams showing an LED mounting board of the LED lighting device of the above, wherein FIG. 4A is a front view and FIG. 4B is a side view.
FIG. 5 is a cross-sectional view showing an application example of the above LED lighting device.
FIG. 6 is a sectional view of an LED lighting device according to a second embodiment of the present invention.
FIG. 7 is a side view in which the LED lighting device is separated.
FIG. 8 is a cross-sectional view showing an application example of the above LED lighting device.
FIG. 9 is a partially cutaway side view of the LED lighting device according to the first conventional example.
FIG. 10 is a sectional view of an LED lighting device according to a second conventional example.
[Explanation of symbols]
REFERENCE SIGNS LIST 1 LED element 2 LED mounting board 3 heat radiating means 4 DC power supply circuit 5 cover 5 a light source unit housing cover 5 b power unit housing cover 6 heat transfer unit 7 lens

Claims (6)

ＬＥＤ素子が実装されたＬＥＤ実装基板と、ＬＥＤ実装基板に設けられた放熱手段と、商用電源を受けて所定の直流電圧を出力する直流電源回路と、前記ＬＥＤ実装基板と放熱手段と直流電源回路とを収納するカバーと、を備えたＬＥＤ点灯装置において、前記放熱手段の熱をカバーに伝達し得る熱伝達手段を設けたことを特徴とするＬＥＤ点灯装置。LED mounting board on which LED elements are mounted, heat dissipating means provided on the LED mounting board, a DC power supply circuit for receiving a commercial power supply and outputting a predetermined DC voltage, the LED mounting board, heat dissipating means and DC power supply circuit And a cover for accommodating the heat-dissipating means, wherein a heat transfer means capable of transmitting heat of the heat radiating means to the cover is provided. 前記熱伝達手段は、放熱手段の近傍に位置するカバーから連設された連設部であることを特徴とする請求項１記載のＬＥＤ点灯装置。The LED lighting device according to claim 1, wherein the heat transfer unit is a connecting portion provided continuously from a cover located near the heat radiating unit. 前記カバーは、ＬＥＤ実装基板と放熱手段とを収納する光源部収納カバーと、直流電源回路を収納する電源部収納カバーと、により構成され、光源部収納カバーが熱伝達手段であることを特徴とする請求項１又は２記載のＬＥＤ点灯装置。The cover includes a light source unit storage cover that stores the LED mounting board and the heat radiation unit, and a power supply unit storage cover that stores the DC power supply circuit, wherein the light source unit storage cover is a heat transfer unit. The LED lighting device according to claim 1 or 2, wherein 前記光源部収納カバーの一部が放熱手段であることを特徴とする請求項３記載のＬＥＤ点灯装置。The LED lighting device according to claim 3, wherein a part of the light source unit storage cover is a heat radiating unit. 前記熱伝達手段は、ＬＥＤ実装基板に直接取付けられたことを特徴とする請求項１乃至４記載のＬＥＤ点灯装置。The LED lighting device according to claim 1, wherein the heat transfer unit is directly attached to an LED mounting board. 前記放熱手段とＬＥＤ素子とは、熱伝導性のよい接着剤を介して接合させたことを特徴とする請求項５記載のＬＥＤ点灯装置。The LED lighting device according to claim 5, wherein the heat radiating means and the LED element are joined via an adhesive having good heat conductivity.
JP2002210817A 2002-07-19 2002-07-19 LED lighting device Expired - Lifetime JP4337310B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002210817A JP4337310B2 (en) 2002-07-19 2002-07-19 LED lighting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002210817A JP4337310B2 (en) 2002-07-19 2002-07-19 LED lighting device

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2008185088A Division JP2008252141A (en) 2008-07-16 2008-07-16 Led-lighting device

Publications (2)

Publication Number Publication Date
JP2004055800A true JP2004055800A (en) 2004-02-19
JP4337310B2 JP4337310B2 (en) 2009-09-30

Family

ID=31934221

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002210817A Expired - Lifetime JP4337310B2 (en) 2002-07-19 2002-07-19 LED lighting device

Country Status (1)

Country Link
JP (1) JP4337310B2 (en)

Cited By (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006251149A (en) * 2005-03-09 2006-09-21 Fujinon Corp Illumination device and projection type picture display device
JP2007074195A (en) * 2005-09-06 2007-03-22 Sharp Corp Low-noise down-converter and antenna system having the same
JP2007250341A (en) * 2006-03-15 2007-09-27 Toshiba Lighting & Technology Corp Self-ballasted fluorescent lamp device
JP2008053695A (en) * 2006-07-25 2008-03-06 Toshiba Lighting & Technology Corp Drive device and lighting fixture for light-emitting diode
JP2008204692A (en) * 2007-02-19 2008-09-04 Toshiba Lighting & Technology Corp Luminaire
JP2008226708A (en) * 2007-03-14 2008-09-25 Kyocera Corp Light emitting device
JP2008258066A (en) * 2007-04-06 2008-10-23 Koizumi Lighting Technology Corp Led luminaire
JP2008311237A (en) * 2008-08-28 2008-12-25 Toshiba Lighting & Technology Corp Lighting fixture
JP2009064781A (en) * 2008-09-30 2009-03-26 Toshiba Lighting & Technology Corp Illuminating device
JP2009099627A (en) * 2007-10-12 2009-05-07 Panasonic Electric Works Co Ltd Led luminaire
JP2010034545A (en) * 2008-06-27 2010-02-12 Toshiba Lighting & Technology Corp Light-emitting element lamp and luminaire
EP2213932A1 (en) 2009-01-30 2010-08-04 Panasonic Electric Works Co., Ltd. LED illumination fixture
WO2011040633A1 (en) * 2009-09-30 2011-04-07 三洋電機株式会社 Light-emitting module
JP2011096416A (en) * 2009-10-27 2011-05-12 Panasonic Electric Works Co Ltd Led lighting fixture
JP2011097047A (en) * 2009-10-29 2011-05-12 Foxsemicon Integrated Technology Inc Illumination device
JP2012054181A (en) * 2010-09-03 2012-03-15 Toshiba Lighting & Technology Corp Led lighting device
JP2012069359A (en) * 2010-09-22 2012-04-05 Panasonic Corp Lighting device and lighting fixture
JP2012216443A (en) * 2011-04-01 2012-11-08 Kyocera Corp Light emitting device
JP2015195160A (en) * 2014-03-27 2015-11-05 アイリスオーヤマ株式会社 Lighting device
JP2016021336A (en) * 2014-07-15 2016-02-04 三菱電機株式会社 Lighting device and emergency lighting device
JP2017084810A (en) * 2016-12-27 2017-05-18 東芝ライテック株式会社 Luminaire
DE102016203810A1 (en) * 2016-03-09 2017-09-14 Osram Gmbh Luminaire for uniform illumination

Cited By (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006251149A (en) * 2005-03-09 2006-09-21 Fujinon Corp Illumination device and projection type picture display device
JP2007074195A (en) * 2005-09-06 2007-03-22 Sharp Corp Low-noise down-converter and antenna system having the same
JP4535009B2 (en) * 2006-03-15 2010-09-01 東芝ライテック株式会社 Light bulb type fluorescent lamp device
JP2007250341A (en) * 2006-03-15 2007-09-27 Toshiba Lighting & Technology Corp Self-ballasted fluorescent lamp device
JP2008053695A (en) * 2006-07-25 2008-03-06 Toshiba Lighting & Technology Corp Drive device and lighting fixture for light-emitting diode
JP2008204692A (en) * 2007-02-19 2008-09-04 Toshiba Lighting & Technology Corp Luminaire
JP2008226708A (en) * 2007-03-14 2008-09-25 Kyocera Corp Light emitting device
JP2008258066A (en) * 2007-04-06 2008-10-23 Koizumi Lighting Technology Corp Led luminaire
JP2009099627A (en) * 2007-10-12 2009-05-07 Panasonic Electric Works Co Ltd Led luminaire
JP2010034545A (en) * 2008-06-27 2010-02-12 Toshiba Lighting & Technology Corp Light-emitting element lamp and luminaire
JP2008311237A (en) * 2008-08-28 2008-12-25 Toshiba Lighting & Technology Corp Lighting fixture
JP4671064B2 (en) * 2008-08-28 2011-04-13 東芝ライテック株式会社 lighting equipment
JP2009064781A (en) * 2008-09-30 2009-03-26 Toshiba Lighting & Technology Corp Illuminating device
EP2213932A1 (en) 2009-01-30 2010-08-04 Panasonic Electric Works Co., Ltd. LED illumination fixture
WO2011040633A1 (en) * 2009-09-30 2011-04-07 三洋電機株式会社 Light-emitting module
JP2011096416A (en) * 2009-10-27 2011-05-12 Panasonic Electric Works Co Ltd Led lighting fixture
JP2011097047A (en) * 2009-10-29 2011-05-12 Foxsemicon Integrated Technology Inc Illumination device
US8333486B2 (en) 2009-10-29 2012-12-18 Foxsemicon Integrated Technology, Inc. Illumination device with heat dissipation structure
JP2012054181A (en) * 2010-09-03 2012-03-15 Toshiba Lighting & Technology Corp Led lighting device
JP2012069359A (en) * 2010-09-22 2012-04-05 Panasonic Corp Lighting device and lighting fixture
JP2012216443A (en) * 2011-04-01 2012-11-08 Kyocera Corp Light emitting device
JP2015195160A (en) * 2014-03-27 2015-11-05 アイリスオーヤマ株式会社 Lighting device
JP2016021336A (en) * 2014-07-15 2016-02-04 三菱電機株式会社 Lighting device and emergency lighting device
DE102016203810A1 (en) * 2016-03-09 2017-09-14 Osram Gmbh Luminaire for uniform illumination
US10648630B2 (en) 2016-03-09 2020-05-12 Osram Gmbh Luminaire for uniform illumination
JP2017084810A (en) * 2016-12-27 2017-05-18 東芝ライテック株式会社 Luminaire

Also Published As

Publication number Publication date
JP4337310B2 (en) 2009-09-30

Similar Documents

Publication Publication Date Title
JP4337310B2 (en) LED lighting device
JP5101578B2 (en) Light emitting diode lighting device
EP2228587B1 (en) Led bulb and lighting apparatus
JP5152698B2 (en) LIGHT EMITTING ELEMENT LAMP AND LIGHTING DEVICE
US8525396B2 (en) Illumination source with direct die placement
WO2009157285A1 (en) Light-emitting element lamp and lighting fixture
JP5029822B2 (en) Light source and lighting device
US20130020941A1 (en) Semiconductor Lamp
JP2008034140A (en) Led lighting device
JP5964354B2 (en) lamp
TW201102577A (en) Bulb-shaped lamp and illumination device
JP2014007154A (en) Lighting device
JP2009301810A (en) Illuminating device
JP5333488B2 (en) LED lighting device
JP2010010134A (en) Light emitting element lamp, and luminaire
JP2007311760A (en) Led module
JP4602477B1 (en) Lighting device
JP2015076281A (en) Lighting device
JP5582899B2 (en) Lamp and lighting device
JP2012022855A (en) Lighting device
JP2008252141A (en) Led-lighting device
JP2009064833A (en) Light-emitting device and lighting device with the same
JP2012104860A (en) Led lighting device
JP2011181252A (en) Lighting fixture
JP2013020813A (en) Electric bulb

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20050520

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20080115

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20080205

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20080227

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20080520

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20080717

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20081111

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20090109

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20090609

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20090622

R151 Written notification of patent or utility model registration

Ref document number: 4337310

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R151

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120710

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120710

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130710

Year of fee payment: 4

EXPY Cancellation because of completion of term