JP2004055800A - Led lighting device - Google Patents

Led lighting device Download PDF

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Publication number
JP2004055800A
JP2004055800A JP2002210817A JP2002210817A JP2004055800A JP 2004055800 A JP2004055800 A JP 2004055800A JP 2002210817 A JP2002210817 A JP 2002210817A JP 2002210817 A JP2002210817 A JP 2002210817A JP 2004055800 A JP2004055800 A JP 2004055800A
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Prior art keywords
led
heat
cover
power supply
supply circuit
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JP2002210817A
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JP4337310B2 (en
Inventor
Hiroyuki Sako
迫 浩行
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Matsushita Electric Works Ltd
松下電工株式会社
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/502Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/507Cooling arrangements characterised by the adaptation for cooling of specific components of means for protecting lighting devices from damage, e.g. housings
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00Arrangement of electric circuit elements in or on lighting devices
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

Abstract

<P>PROBLEM TO BE SOLVED: To provide an LED lighting device which can more efficiently radiate heat generated from an LED element to an outer part and which can relieve influence of heat to a DC power source circuit. <P>SOLUTION: The LED lighting device is provided with an LED mounting substrate on which the LED element is mounted; a radiating means installed on the LED mounting substrate; a DC power circuit outputting prescribed DC voltage by receiving main power; and a cover storing the LED mounting substrate, the heating means, and the DC power circuit. The device is also provided with a heat transmission means for transmitting heat of the radiating means to the cover. <P>COPYRIGHT: (C)2004,JPO

Description

【0001】
【発明の属する技術分野】
本発明は、LED素子を光源として使用したLED点灯装置に関する。
【0002】
【従来の技術】
この種のLED点灯装置としては、特開2001−243809に開示されたものがあり、図9はその一部を切り欠いた側面図である。このLED点灯装置は、給電機能を備え、開口部を有した有底円筒状の口金11と、基端の開口部から先端の開口部にむけてラッパ状に広がり、基端の開口部が口金11の開口部の内部壁面に絶縁体を介して取付けられた放熱手段、具体的には、ラッパ状金属放熱部12と、ラッパ状金属放熱部12の基端の開口部よりやや先端側の内面にリング状に設けられた絶縁性を有する高熱伝導部材14と、高熱伝導部材14に基端が固着されラッパ状金属放熱部12の内側に設けられたLED実装基板、具体的には、筒状金属基板18と、筒状金属基板18に実装されたLED素子1と、筒状金属基板18の内側に設けられた交流を直流に変換する直流電源回路4と、直流電源回路4が取付けられ筒状金属基板18に固定された取付け板10と、LED素子1を覆うようにしてラッパ状金属放熱部12の先端の開口部に取付けられた透光性の透光性カバー16と、を備えて構成されている。
【0003】
筒状金属基板18を詳しく述べると、筒状金属基板18は、基端が口金11に開口した有底筒状をなした金属基板であり、この筒状金属基板18の先端部分の外面にLED素子1が実装されている。
【0004】
このLED点灯装置を点灯させるとLED素子1が光を放射し所定の照度が得られる。また、これと同時にLED素子1や直流電源回路4からは、熱が発生する。しかし、LED素子1から発生した熱は、透光性カバー16やラッパ状金属放熱部12と筒状金属基板18の間に形成された空間Yで生じる気体の対流により、透光性カバー16やラッパ状金属放熱部12を介して外部に放熱されるほか、筒状金属基板18から高熱伝導部材14を介してラッパ状金属放熱部12に伝達され外部に放熱される。また、直流電源回路4から発生した熱は、筒状金属基板18から高熱伝導部材14を介してラッパ状金属放熱部12に伝達され外部に放熱されるほか、筒状金属基板18の内部の空間Xで生じる気体の対流により口金1を通じて外部に放熱されたり、筒状金属基板18から空間Yに放熱されたりする。このようにして、LED素子1や直流電源回路4の熱が外部に放出され、LED素子1や直流電源回路4に使われている部品の許容温度を超えない範囲で使用されている。
【0005】
また、このものを電球形状からスポットライトの形状にした場合は、図10のようなものが考えられる。このLED点灯装置は、LED素子1が実装されたLED実装基板2と、商用電源を受けて所定の直流電圧を出力する直流電源回路4と、LED実装基板2と直流電源回路4とを収納する片面に開口を有した円筒状のカバー5とカバーの開口面に取付けられたレンズ7と、を備えて構成させている。
【0006】
このLED点灯装置を点灯させるとLED素子1が光を放射し所定の光束が得られる。また、これと同時にLED素子1や直流電源回路4からは、熱が発生する。しかし、LED素子1から発生した熱は、レンズ7とカバー5とLED実装基板2との間に形成された空間で生じる気体の対流により、レンズ7とカバー5を介して外部に放熱されるほか、LED実装基板2からカバー5に伝達され外部に放熱されたり、LED実装基板2とカバー5と直流電源回路4との間に形成された空間Xで生じる気体の対流により、外部に放熱される。また、直流電源回路4から発生した熱は、前記と同様に空間Xで生じる気体の対流により、外部に放熱されるほか、直流電源回路4からカバー5に伝達され外部に放熱される。このようにして、LED素子1や直流電源回路4から発生した熱が外部に放出され、LED素子1や直流電源回路4に使われている部品の温度を所定の値に下げている。
【0007】
さらに、直流電源回路4は、備えてはいないが、LED素子1から生じた熱を放熱するものとしては、特開2002−93206に開示されたもののように、LED素子1が実装されたプリント基板の裏面に絶縁シートを介して、アルミ放熱フィンなどの放熱手段を設けた構成のものがある。
【0008】
【発明が解決しようとする課題】
ところが、上記したLED点灯装置は、LED素子1と直流電源回路4とが、空間Xを介して互いに熱的に影響を及ぼしあっている。例えば、LED点灯装置の光出力を増加させるために、LED素子1の数を増やすことやLED素子1に流す電流を増やすことなどを行うと、LED素子1の発熱量が増え、この熱が直流電源回路4に影響を及ぼすことがあった。また、直流電源回路4は、LED素子1に供給する電流を増加させる必要があるため、自身の発熱量が増え、この熱が、空間Xを介し金属基板18やLED実装基板2に伝わり、それに実装されたLED素子1の温度を上げることがあった。
【0009】
さらに、図10のものにおいては、LED素子1の温度を下げるためにLED実装基板2にアルミ放熱フィンなどの放熱手段を設けても空間Xの温度が上がってしまう。このため直流電源回路4の温度も上がってしまうので、直流電源回路4は、より熱的ストレスの強いものを使用する必要があった。
【0010】
このようにLED素子1の発熱量が増えるとその熱は、直流電源回路4に影響を及ぼし、また、直流電源回路4からの熱もLED素子1に影響を及ぼし合ってしまう。従って、LED素子1から発生した熱を効率よく外部に放熱し、さらに、LED素子1と直流電源回路4とが、お互いに影響を及ぼしあうことの少ないものに改善する余地があった。
【0011】
本発明は、上記事由に鑑みてなしたもので、その目的とするところは、LED素子から発生する熱をより効率良く外部に放熱することができ、直流電源回路への熱の影響も緩和できるLED点灯装置を供給することにある。
【0012】
【課題を解決するための手段】
請求項1に係る発明は、LED素子が実装されたLED実装基板と、LED実装基板に設けられた放熱手段と、商用電源を受けて所定の直流電圧を出力する直流電源回路と、前記LED実装基板と放熱手段と直流電源回路とを収納するカバーと、を備えたLED点灯装置において、前記放熱手段の熱をカバーに伝達し得る熱伝達手段を設けたことを特徴とする。
【0013】
請求項2に係る発明は、請求項1において、前記熱伝達手段は、放熱手段の近傍に位置するカバーから連設された連設部であることを特徴とする。
【0014】
請求項3に係る発明は、請求項1又は2において、前記カバーは、LED実装基板と放熱手段とを収納する光源部収納カバーと、直流電源回路を収納する電源部収納カバーと、により構成され、光源部収納カバーが熱伝達手段であることを特徴とする。
【0015】
請求項4に係る発明は、請求項3において、前記光源部収納カバーの一部が放熱手段であることを特徴とする。
【0016】
請求項5に係る発明は、請求項1乃至請求項4のいずれかにおいて、前記熱伝達手段は、LED実装基板に直接取付けられたことを特徴とする。
【0017】
請求項6に係る発明は、至請求項5において、前記放熱手段とLED素子とは、熱伝導性のよい接着剤を介して接合させたことを特徴とする。
【0018】
【発明の実施の形態】
(第1の実施の形態)
本発明の第1の実施の形態を図1〜図4を用いて説明する。図1はLED点灯装置の断面図、図2は熱伝達手段の図で図2(a)は正面図、図2(b)はその一部を切り欠いた側面図、図3はレンズの正面図、図4はLED実装基板で図4(a)は正面図、図4(b)は側面図である。
【0019】
このLED点灯装置は、LED素子1が実装されたLED実装基板2と、LED実装基板2に設けられた放熱手段3と、商用電源を受けて所定の直流電圧を出力する直流電源回路4と、LED実装基板2と放熱手段3と直流電源回路4とを収納するカバー5とカバーの開口面に取付けられたレンズ7と、を備えて構成されている。
【0020】
LED素子1は、チップ素子とワイヤーボンディングと蛍光体とからなる、順方向のON電圧が3.6Vの青色発光ダイオードである。チップ素子は、底面が0.5mm×0.5mmで高さ0.3mmの直方体で、下層の絶縁層と上層の半導体層とで形成されている。上層の半導体層には、その対角方向にアノードとカソードの電極が配置され、その各々からワイヤーボンディングにより、LED実装基板2に配線がなされている。
【0021】
LED実装基板2は、熱伝導のよいプリント配線板を円板状に加工したもので12ケのLED素子1とこれを制御する電子部品20(トランジスタ、抵抗、コンデンサ、ダイオードなどのチップ部品)がその一面に図4のように実装されている。このLED実装基板2へのLED素子1の実装をさらに詳しく述べると、LED素子1は、LED実装基板2に、チップ素子よりも深く、すり鉢状に設けられた窪みの底の部分に、接着剤を介して実装されている。つまりチップ素子の絶縁層が接着剤と接合されて実装される。そして、チップ素子を覆うように、光を青から白に変えることのできる蛍光体が、LED実装基板2に設けられた窪みに充填されている。
【0022】
放熱手段3は、アルミなどの金属材料をLED実装基板2と略同等の円板状に加工したもので、LED素子1が放熱されやすいよう、LED実装基板2の裏面にLED実装基板2と一体化して取付けられている。
【0023】
直流電源回路4は、商用電源のAC100Vを入力して直流の24Vを出力するもので、LED実装基板2と略同等の円板状をなしたプリント配線板に実装されている。また、カバー5は、樹脂材料により上方に開口部を有した略有底円筒状に形成され、その底面部の下側には商用電源を受ける電源端子台が設けられており、底面部の中央には、電源端子台からの電源線を引き込む孔が設けられている。そして、カバー5の底面部と開口との略中間部分には、直流電源回路4が取付けられ、その上方には、LED実装基板2と放熱手段3とがLED実装面を上にして取付けられている。そして、カバー5の開口部には、レンズ7が取付けられている。
【0024】
ここで重要なことは、放熱手段3の熱をカバーに伝達し得る熱伝達手段6を設けたことである。具体的には、この熱伝達手段6は、アルミなどの金属材料を加工したもので放熱手段3と直流電源回路4との間に設けている。そして、熱伝達手段6は、図2に示すように、放熱手段3より一回り大きい円板状をなし、その中央には直流電源回路4からの電源供給線を通すための孔が設けられた底板6aと、底板6aの周囲に立ち上がった壁部6bと、壁部6bの対向する位置に設けられたカバー5への取付け固定部6cと、により構成している。そして、熱伝達手段6の壁部6b側の底板6aには、LED実装基板2と一体化された放熱手段3を取付けている。
【0025】
このように構成したLED点灯装置を点灯させると、LED素子1が光を放射し所定の光束が得られる。また、これと同時にLED素子1や直流電源回路4からは、熱が発生する。しかし、LED素子1から発生した熱は、レンズ7とカバー5とLED実装基板2との間に形成された空間で生じる気体の対流により、レンズ7とカバー5を介して外部に放熱されるほか、LED実装基板2から放熱手段3を経由して、熱伝達手段6に伝わり、熱伝達手段6の壁部6b並びに取付け固定部6cよりカバー5を通じて外部に放熱されたり、熱伝達手段6とカバー5と直流電源回路4との間に形成された空間Xで生じる気体の対流により、外部に放熱される。
【0026】
この実施の形態によると、底板6aの周囲に立ち上がった壁部6bを有した熱伝達手段6を取付け固定部6cによりカバー5に取付けることにより、従来、LED実装基板2を直接カバー5に取付けしていたものに比べ、カバー5との接触面積が増加するので、LED実装基板2からの熱は、より効率よくカバー5に伝達され放熱される、また、壁部6bをLED素子側に設けたこと並びに放熱手段3と直流電源回路4との間に熱伝達手段6を設けたことにより、LED素子1からの熱が直流電源回路4に伝わりにくくなっている。この結果、LED素子1から発生する熱をより効率良く外部に放熱することができるので、LED素子1の温度が下がり、直流電源回路4への熱の影響も緩和できる。
なお、LED実装基板2にLED素子1が貫通するLED実装孔を設け、LED素子1を熱伝導性のよい接着剤を介して放熱手段3に接合し、実装してもよい。これにより、LED素子1の熱がよりすみやかに放熱手段3に伝わり、よりLED素子1の温度を低くすることができる。
【0027】
また、図5は、第1の実施の形態の応用例で、図はLED点灯装置の断面図である。この応用例は、前述した、熱伝達手段6の構成を変えたものである。すなわち熱伝達手段6は、放熱手段3の近傍に位置するカバー5から連設された連設部により形成されている。そして、カバー5全体を熱伝導のよいアルミ材などの金属材料で構成している。この応用例によると、構成部材の部品点数が削減でき、カバー5全体をアルミ材などの金属材料で構成したので、第1の実施の形態で説明したものよりLED点灯装置としての放熱性が上がるので、LED素子1と直流電源回路4との温度をさらに下げることができる。
【0028】
(第2の実施の形態)
本発明の第2の実施の形態を図6、図7を用いて説明する。図6はLED点灯装置の断面図、図7は、このものを分離した側面図である。このものは、第1の実施の形態におけるカバー5の形状を変えたものである。図において、カバー5は、LED実装基板2と放熱手段3とを収納する光源部収納カバー5aと、直流電源回路4を収納する電源部収納カバー5bと、により構成され、熱伝達手段6を光源部収納カバー5aにて形成している。
【0029】
光源部収納カバー5aは、熱伝導のよいアルミ材などの金属材料により上方に開口部を有した略有底円筒状に形成され、その底面部の中央には直流電源回路4からの電源供給線を通すための孔が設けられている。そして、この底面部にLED実装基板2と一体化された放熱手段3がLED実装面を上にして取付けられている。また光源部収納カバー5aの開口部には、レンズ7が取付けられている。
【0030】
電源部収納カバー5bは、樹脂材料により上面部と底面部を有した略円筒状に形成され、底面部の下側には商用電源を受ける電源端子台が設けられており、その中央には、電源端子台からの電源線を引き込む孔が設けられている。そして、カバー5の内部、上方には、直流電源回路4が取付けられており、その中央には直流電源回路4の電源供給線を通すための孔が設けられている。その他の第1の実施の形態と同一の構成部材には同一符号を付すことにより説明を省略する。
【0031】
このように構成されたLED点灯装置を点灯させるとLED素子1が光を放射し所定の照度が得られる。また、これと同時にLED素子1や直流電源回路4からは、熱が発生する。しかし、LED素子1から発生した熱は、レンズ7とカバー5とLED実装基板2との間に形成された空間で生じる気体の対流により、レンズ7とカバー5を介して外部に放熱されるほか、LED実装基板2から放熱手段3を経由して、光源部収納カバー5aの底面部で形成された熱伝達手段6に伝わり、光源部収納カバー5aを通じて外部に放熱される。
【0032】
この実施の形態によると、従来、LED実装基板2を直接カバー5に取付けしていたものに比べ、カバー5との接触面積が増加するので、LED実装基板2からの熱は、より効率よくカバー5に伝達され外部に放熱される、従って、LED素子1の温度が下がり、直流電源回路4への熱の影響も緩和できる。また、ケース5をLED実装基板2と放熱手段3とを収納する光源部収納カバー5aと、直流電源回路4を収納する電源部収納カバー5bと、に分離したことにより、第1の実施の形態で説明したものよりもさらに、LED素子1からの熱が直流電源回路4に伝わりにくくなっている。
【0033】
なお、図8は第2の実施の形態の応用例で、図はLED点灯装置の断面図である。この応用例は、前述した、光源部収納カバー5aの底面部を変えたものである。図において、光源部収納カバー5aの底面部は、放熱手段3により構成され、これが光源部収納カバー5aの側面に固定されている。
【0034】
この応用例によると、光源部収納カバー5aの放熱部材の使用量を削減できる。
【0035】
【発明の効果】
請求項1記載の発明にあっては、LED素子が実装されたLED実装基板と、LED実装基板に設けられた放熱手段と、商用電源を受けて所定の直流電圧を出力する直流電源回路と、前記LED実装基板と放熱手段と直流電源回路とを収納するカバーと、を備えたLED点灯装置において、前記放熱手段の熱をカバーに伝達し得る熱伝達手段を設けたことにより、LED実装基板とカバーとの接触面積が増加するので、LED素子から発生する熱がより効率よく外部に放熱される、この結果、LED素子の温度が下がり、直流電源回路への熱の影響も緩和することができる。
【0036】
請求項2記載の発明にあっては、前記熱伝達手段は、放熱手段の近傍に位置するカバーから連設された連設部であることにより、請求項1に記載の効果を奏するうえに、構成部材の部品点数が削減できできる。
【0037】
請求項3記載の発明にあっては、前記カバーは、LED実装基板と放熱手段とを収納する光源部収納カバーと、直流電源回路を収納する電源部収納カバーと、により構成され、光源部収納カバーが熱伝達手段であることにより、請求項1又は請求項2に記載の効果を奏するうえに、LED素子からの熱が直流電源回路に伝わりにくくなり、直流電源回路への熱の影響が緩和できる。
【0038】
請求項4記載の発明にあっては、前記光源部収納カバーの一部が放熱手段であることにより、請求項3に記載の効果を奏するうえに、構成部材の部品点数が削減できできる。
【0039】
請求項5記載の発明にあっては、前記熱伝達手段は、LED実装基板に直接取付けられたことにより、請求項1乃至請求項4に記載の効果を奏するうえにLED素子からの熱の放熱性をさらに改善できる。
【0040】
請求項6記載の発明にあっては、前記放熱手段とLED素子とは、熱伝導性のよい接着剤を介して接合させたことにより、請求項5に記載した効果を奏するうえに、LED素子の熱がよりすみやかに放熱手段に伝わるようになる。
【図面の簡単な説明】
【図1】本発明の第1の実施の形態に係るLED点灯装置の断面図である。
【図2】同上のLED点灯装置の熱伝達手段を示す図で、図2(a)は正面図、図2(b)は一部を切り欠いた側面図である。
【図3】同上のLED点灯装置のレンズの正面図である。
【図4】同上のLED点灯装置のLED実装基板を示す図で、図4(a)は正面図、図4(b)は側面図である。
【図5】同上のLED点灯装置の応用例を示す断面図である。
【図6】本発明の第2の実施の形態に係るLED点灯装置の断面図である。
【図7】同上のLED点灯装置を分離した側面図である。
【図8】同上のLED点灯装置の応用例を示す断面図である。
【図9】第1の従来例に係るLED点灯装置の一部を切り欠いた側面図である。
【図10】第2の従来例に係るLED点灯装置の断面図である。
【符号の説明】
1   LED素子
2   LED実装基板
3   放熱手段
4   直流電源回路
5   カバー
5a  光源部収納カバー
5b  電源部収納カバー
6   熱伝達手段
7   レンズ
[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an LED lighting device using an LED element as a light source.
[0002]
[Prior art]
As this type of LED lighting device, there is one disclosed in Japanese Patent Application Laid-Open No. 2001-243809, and FIG. 9 is a side view with a part thereof cut away. This LED lighting device has a power supply function and has a bottomed cylindrical base 11 having an opening, and a trumpet shape extending from the base end opening to the front end opening, and the base end opening is provided with a base. A heat dissipating means attached to the inner wall surface of the opening of the opening 11 via an insulator, specifically, a trumpet-shaped metal heat dissipating portion 12; A high heat conductive member 14 having an insulating property provided in a ring shape on the LED, and an LED mounting board having a base end fixed to the high heat conductive member 14 and provided inside the trumpet-shaped metal heat radiating portion 12, specifically, a cylindrical shape A metal substrate 18; an LED element 1 mounted on the cylindrical metal substrate 18; a DC power supply circuit 4 provided inside the cylindrical metal substrate 18 for converting alternating current to direct current; A mounting plate 10 fixed to the metal substrate 18; So as to cover the D element 1 is configured to include a trumpet shape metal heat radiation part transparent translucent cover 16 attached to the opening at the tip of 12.
[0003]
The cylindrical metal substrate 18 will be described in detail. The cylindrical metal substrate 18 is a metal substrate having a bottomed cylindrical shape whose base end is open to the base 11, and an LED on the outer surface of the distal end portion of the cylindrical metal substrate 18. Element 1 is mounted.
[0004]
When this LED lighting device is turned on, the LED element 1 emits light and a predetermined illuminance is obtained. At the same time, heat is generated from the LED element 1 and the DC power supply circuit 4. However, the heat generated from the LED element 1 is generated by the convection of the gas generated in the translucent cover 16 and the space Y formed between the trumpet-shaped metal heat radiating portion 12 and the cylindrical metal substrate 18, so that the translucent cover 16 and In addition to being radiated to the outside through the trumpet-shaped metal heat radiating section 12, the heat is transmitted from the tubular metal substrate 18 to the trumpet-shaped metal heat radiating section 12 through the high heat conduction member 14 and radiated to the outside. In addition, heat generated from the DC power supply circuit 4 is transmitted from the tubular metal substrate 18 to the flared metal radiating portion 12 via the high thermal conductive member 14 and is radiated to the outside. The heat is radiated to the outside through the base 1 by the convection of the gas generated in X, or is radiated to the space Y from the cylindrical metal substrate 18. In this manner, the heat of the LED element 1 and the DC power supply circuit 4 is released to the outside, and the LED element 1 and the DC power supply circuit 4 are used within a range that does not exceed the allowable temperature of the components used.
[0005]
When this is changed from a bulb shape to a spotlight shape, a shape as shown in FIG. 10 can be considered. This LED lighting device houses an LED mounting board 2 on which an LED element 1 is mounted, a DC power supply circuit 4 for receiving a commercial power supply and outputting a predetermined DC voltage, and an LED mounting board 2 and a DC power supply circuit 4. It comprises a cylindrical cover 5 having an opening on one side and a lens 7 attached to the opening of the cover.
[0006]
When this LED lighting device is turned on, the LED element 1 emits light and a predetermined light flux is obtained. At the same time, heat is generated from the LED element 1 and the DC power supply circuit 4. However, heat generated from the LED element 1 is radiated to the outside via the lens 7 and the cover 5 due to convection of gas generated in a space formed between the lens 7 and the cover 5 and the LED mounting board 2. Is transmitted from the LED mounting board 2 to the cover 5 and radiated to the outside, or is radiated to the outside by convection of gas generated in the space X formed between the LED mounting board 2 and the cover 5 and the DC power supply circuit 4. . Further, the heat generated from the DC power supply circuit 4 is radiated to the outside by the convection of the gas generated in the space X in the same manner as described above, and is also transmitted from the DC power supply circuit 4 to the cover 5 and radiated to the outside. Thus, the heat generated from the LED element 1 and the DC power supply circuit 4 is released to the outside, and the temperature of the components used in the LED element 1 and the DC power supply circuit 4 is reduced to a predetermined value.
[0007]
Further, although the DC power supply circuit 4 is not provided, as a device for radiating heat generated from the LED element 1, a printed circuit board on which the LED element 1 is mounted is disclosed in Japanese Patent Application Laid-Open No. 2002-93206. There is a configuration in which a heat dissipating means such as an aluminum heat dissipating fin is provided on the back surface of the device through an insulating sheet.
[0008]
[Problems to be solved by the invention]
However, in the above-mentioned LED lighting device, the LED element 1 and the DC power supply circuit 4 thermally influence each other via the space X. For example, if the number of the LED elements 1 is increased or the current flowing through the LED elements 1 is increased to increase the light output of the LED lighting device, the calorific value of the LED elements 1 increases, and this heat is The power supply circuit 4 was sometimes affected. In addition, the DC power supply circuit 4 needs to increase the current supplied to the LED element 1, so that its own calorific value increases, and this heat is transmitted to the metal board 18 and the LED mounting board 2 via the space X, and The temperature of the mounted LED element 1 may be increased.
[0009]
Further, in the case of FIG. 10, even if a heat radiating means such as an aluminum radiating fin is provided on the LED mounting board 2 to lower the temperature of the LED element 1, the temperature of the space X rises. For this reason, the temperature of the DC power supply circuit 4 also increases, so that it is necessary to use a DC power supply circuit 4 having a higher thermal stress.
[0010]
When the amount of heat generated by the LED element 1 increases in this manner, the heat affects the DC power supply circuit 4, and the heat from the DC power supply circuit 4 also affects the LED element 1. Therefore, there is room for improving the heat generated from the LED element 1 to be efficiently radiated to the outside, and further improving the LED element 1 and the DC power supply circuit 4 so as not to affect each other.
[0011]
The present invention has been made in view of the above circumstances, and an object of the present invention is to be able to more efficiently radiate heat generated from an LED element to the outside and to reduce the influence of heat on a DC power supply circuit. To provide an LED lighting device.
[0012]
[Means for Solving the Problems]
The invention according to claim 1 is an LED mounting board on which an LED element is mounted, a heat dissipating means provided on the LED mounting board, a DC power supply circuit receiving a commercial power supply and outputting a predetermined DC voltage, and the LED mounting board. An LED lighting device comprising a substrate, a heat radiating means, and a cover for accommodating a DC power supply circuit, wherein a heat transfer means capable of transmitting heat of the heat radiating means to the cover is provided.
[0013]
The invention according to claim 2 is characterized in that, in claim 1, the heat transfer means is a continuous portion provided continuously from a cover located near the heat radiating means.
[0014]
According to a third aspect of the present invention, in the first or second aspect, the cover includes a light source unit storage cover that stores the LED mounting board and the heat radiating unit, and a power supply unit storage cover that stores the DC power supply circuit. The light source unit storage cover is a heat transfer unit.
[0015]
The invention according to claim 4 is characterized in that, in claim 3, a part of the light source unit storage cover is a heat radiating unit.
[0016]
According to a fifth aspect of the present invention, in any one of the first to fourth aspects, the heat transfer means is directly attached to the LED mounting board.
[0017]
The invention according to claim 6 is the invention according to claim 5, wherein the heat radiating means and the LED element are joined via an adhesive having good heat conductivity.
[0018]
BEST MODE FOR CARRYING OUT THE INVENTION
(First Embodiment)
A first embodiment of the present invention will be described with reference to FIGS. 1 is a sectional view of an LED lighting device, FIG. 2 is a view of a heat transfer means, FIG. 2 (a) is a front view, FIG. 2 (b) is a side view with a part thereof cut away, and FIG. 4A and 4B show the LED mounting board, FIG. 4A is a front view, and FIG. 4B is a side view.
[0019]
The LED lighting device includes an LED mounting board 2 on which an LED element 1 is mounted, a heat radiating means 3 provided on the LED mounting board 2, a DC power supply circuit 4 receiving a commercial power supply and outputting a predetermined DC voltage, It comprises a cover 5 for accommodating the LED mounting board 2, the heat radiating means 3, and the DC power supply circuit 4, and a lens 7 attached to the opening of the cover.
[0020]
The LED element 1 is a blue light emitting diode including a chip element, wire bonding, and a phosphor and having a forward ON voltage of 3.6 V. The chip element is a rectangular solid having a bottom surface of 0.5 mm × 0.5 mm and a height of 0.3 mm, and is formed of a lower insulating layer and an upper semiconductor layer. An anode and a cathode are arranged in the upper semiconductor layer in the diagonal direction, and wiring is made to the LED mounting board 2 by wire bonding from each of them.
[0021]
The LED mounting board 2 is obtained by processing a printed wiring board having good heat conductivity into a disk shape, and includes 12 LED elements 1 and electronic components 20 (chip parts such as transistors, resistors, capacitors, and diodes) for controlling the LED elements. It is mounted on one side as shown in FIG. The mounting of the LED element 1 on the LED mounting board 2 will be described in more detail. The LED element 1 is provided with an adhesive on the LED mounting board 2 at the bottom of the mortar provided deeper than the chip element. Has been implemented via That is, the insulating layer of the chip element is bonded to the adhesive and mounted. Then, a phosphor capable of changing light from blue to white is filled in the recess provided in the LED mounting board 2 so as to cover the chip element.
[0022]
The heat dissipating means 3 is formed by processing a metal material such as aluminum into a disk shape substantially equivalent to that of the LED mounting board 2. And installed.
[0023]
The DC power supply circuit 4 receives a commercial power supply of AC 100 V and outputs DC 24 V, and is mounted on a printed wiring board having a disk shape substantially equivalent to the LED mounting board 2. The cover 5 is formed in a substantially cylindrical shape with a bottom having an opening at the top by a resin material, and a power terminal block for receiving commercial power is provided below the bottom of the cover 5. Is provided with a hole for drawing a power supply line from a power supply terminal block. A DC power supply circuit 4 is attached to a substantially intermediate portion between the bottom surface and the opening of the cover 5, and an LED mounting board 2 and a heat radiating means 3 are attached above the DC power supply circuit 4 with the LED mounting surface facing upward. I have. The lens 7 is attached to the opening of the cover 5.
[0024]
What is important here is that the heat transfer means 6 that can transfer the heat of the heat radiation means 3 to the cover is provided. Specifically, the heat transfer means 6 is formed by processing a metal material such as aluminum, and is provided between the heat radiating means 3 and the DC power supply circuit 4. As shown in FIG. 2, the heat transfer means 6 has a disk shape slightly larger than the heat radiating means 3, and a hole for passing a power supply line from the DC power supply circuit 4 is provided at the center thereof. It comprises a bottom plate 6a, a wall portion 6b rising up around the bottom plate 6a, and a fixing portion 6c attached to the cover 5 provided at a position facing the wall portion 6b. The heat dissipating means 3 integrated with the LED mounting board 2 is attached to the bottom plate 6a of the heat transfer means 6 on the wall 6b side.
[0025]
When the thus-configured LED lighting device is turned on, the LED element 1 emits light and a predetermined light flux is obtained. At the same time, heat is generated from the LED element 1 and the DC power supply circuit 4. However, heat generated from the LED element 1 is radiated to the outside via the lens 7 and the cover 5 due to convection of gas generated in a space formed between the lens 7 and the cover 5 and the LED mounting board 2. The heat is transmitted from the LED mounting board 2 to the heat transfer means 6 via the heat radiating means 3, and is radiated to the outside through the cover 5 from the wall 6 b of the heat transfer means 6 and the mounting and fixing portion 6 c. The heat is radiated to the outside by the convection of the gas generated in the space X formed between the DC power supply circuit 5 and the DC power supply circuit 4.
[0026]
According to this embodiment, the LED mounting board 2 is directly attached to the cover 5 by attaching the heat transfer means 6 having the wall 6b rising up around the bottom plate 6a to the cover 5 by the attachment fixing portion 6c. Since the contact area with the cover 5 is increased as compared with the conventional one, heat from the LED mounting board 2 is more efficiently transmitted to the cover 5 and radiated, and the wall 6b is provided on the LED element side. In addition, since the heat transfer means 6 is provided between the heat radiating means 3 and the DC power supply circuit 4, heat from the LED element 1 is hardly transmitted to the DC power supply circuit 4. As a result, the heat generated from the LED element 1 can be more efficiently radiated to the outside, so that the temperature of the LED element 1 decreases and the influence of the heat on the DC power supply circuit 4 can be reduced.
The LED mounting board 2 may be provided with an LED mounting hole through which the LED element 1 penetrates, and the LED element 1 may be bonded to the heat dissipating means 3 via an adhesive having good heat conductivity and mounted. Thereby, the heat of the LED element 1 is transmitted to the heat radiating means 3 more quickly, and the temperature of the LED element 1 can be further reduced.
[0027]
FIG. 5 is an application example of the first embodiment, and is a cross-sectional view of the LED lighting device. In this application example, the configuration of the heat transfer means 6 described above is changed. That is, the heat transfer means 6 is formed by a continuous portion continuously provided from the cover 5 located near the heat radiating means 3. The entire cover 5 is made of a metal material such as an aluminum material having good heat conductivity. According to this application example, the number of components can be reduced, and the entire cover 5 is made of a metal material such as aluminum, so that the heat radiation as an LED lighting device is higher than that described in the first embodiment. Therefore, the temperatures of the LED element 1 and the DC power supply circuit 4 can be further reduced.
[0028]
(Second embodiment)
A second embodiment of the present invention will be described with reference to FIGS. FIG. 6 is a sectional view of the LED lighting device, and FIG. 7 is a side view of the LED lighting device separated therefrom. This is a modification of the cover 5 in the first embodiment. In the figure, a cover 5 is composed of a light source unit storage cover 5a that stores the LED mounting board 2 and the heat radiating unit 3, and a power unit storage cover 5b that stores the DC power supply circuit 4. It is formed by the section storage cover 5a.
[0029]
The light source unit storage cover 5a is formed of a metal material such as aluminum having good heat conductivity and is formed in a substantially cylindrical shape having an opening at an upper part, and a power supply line from the DC power supply circuit 4 is provided at the center of the bottom surface. There is a hole for passing through. The heat dissipating means 3 integrated with the LED mounting board 2 is attached to the bottom surface with the LED mounting surface facing upward. A lens 7 is attached to the opening of the light source unit storage cover 5a.
[0030]
The power supply unit storage cover 5b is formed in a substantially cylindrical shape having a top surface and a bottom surface with a resin material, and a power supply terminal block for receiving commercial power is provided below the bottom surface. A hole for drawing a power line from the power terminal block is provided. The DC power supply circuit 4 is mounted inside and above the cover 5, and a hole for passing a power supply line of the DC power supply circuit 4 is provided at the center thereof. The description of the same components as in the first embodiment will be omitted by retaining the same reference numerals.
[0031]
When the LED lighting device thus configured is turned on, the LED element 1 emits light, and a predetermined illuminance is obtained. At the same time, heat is generated from the LED element 1 and the DC power supply circuit 4. However, heat generated from the LED element 1 is radiated to the outside via the lens 7 and the cover 5 due to convection of gas generated in a space formed between the lens 7 and the cover 5 and the LED mounting board 2. Then, the heat is transmitted from the LED mounting board 2 to the heat transfer means 6 formed on the bottom surface of the light source unit storage cover 5a via the heat radiation unit 3, and is radiated to the outside through the light source unit storage cover 5a.
[0032]
According to this embodiment, since the contact area with the cover 5 is increased as compared with the conventional case where the LED mounting board 2 is directly attached to the cover 5, the heat from the LED mounting board 2 is more efficiently covered. 5 and is radiated to the outside. Therefore, the temperature of the LED element 1 decreases, and the influence of heat on the DC power supply circuit 4 can be reduced. In addition, the case 5 is separated into a light source unit housing cover 5a that houses the LED mounting board 2 and the heat radiating unit 3 and a power unit housing cover 5b that houses the DC power supply circuit 4, thereby providing the first embodiment. Further, the heat from the LED element 1 is less likely to be transmitted to the DC power supply circuit 4 than that described in the above.
[0033]
FIG. 8 is an application example of the second embodiment, and FIG. 8 is a sectional view of an LED lighting device. In this application example, the bottom surface of the light source unit storage cover 5a is changed. In the figure, the bottom surface of the light source unit storage cover 5a is constituted by heat radiating means 3, and this is fixed to the side surface of the light source unit storage cover 5a.
[0034]
According to this application example, the amount of the heat dissipating member of the light source unit storage cover 5a can be reduced.
[0035]
【The invention's effect】
In the invention according to claim 1, an LED mounting board on which an LED element is mounted, a heat radiating means provided on the LED mounting board, a DC power supply circuit for receiving a commercial power supply and outputting a predetermined DC voltage, In an LED lighting device comprising the LED mounting board, a heat radiating means, and a cover accommodating a DC power supply circuit, by providing a heat transfer means capable of transmitting heat of the heat radiating means to the cover, Since the contact area with the cover increases, the heat generated from the LED element is more efficiently radiated to the outside. As a result, the temperature of the LED element decreases, and the influence of the heat on the DC power supply circuit can be reduced. .
[0036]
According to the second aspect of the present invention, the heat transfer means is a continuous portion continuously provided from a cover located near the heat radiating means. The number of components of the constituent members can be reduced.
[0037]
According to the third aspect of the invention, the cover includes a light source unit storage cover that stores the LED mounting board and the heat radiating unit, and a power supply unit storage cover that stores the DC power supply circuit. Since the cover is a heat transfer means, in addition to the effects described in claim 1 or claim 2, heat from the LED element is less likely to be transmitted to the DC power supply circuit, and the influence of heat on the DC power supply circuit is reduced. it can.
[0038]
According to the fourth aspect of the present invention, since a part of the light source unit storage cover is a heat radiating means, the effect of the third aspect can be obtained, and the number of components of the constituent member can be reduced.
[0039]
According to the fifth aspect of the invention, the heat transfer means is directly attached to the LED mounting board, so that the heat transfer means has the effects of the first to fourth aspects and further radiates heat from the LED element. Performance can be further improved.
[0040]
In the invention according to claim 6, the heat dissipation means and the LED element are joined via an adhesive having good thermal conductivity, so that the effect described in claim 5 can be obtained and the LED element can be obtained. Heat is more quickly transferred to the heat radiating means.
[Brief description of the drawings]
FIG. 1 is a sectional view of an LED lighting device according to a first embodiment of the present invention.
FIGS. 2A and 2B are views showing a heat transfer means of the LED lighting device, and FIG. 2A is a front view, and FIG.
FIG. 3 is a front view of a lens of the LED lighting device.
4A and 4B are diagrams showing an LED mounting board of the LED lighting device of the above, wherein FIG. 4A is a front view and FIG. 4B is a side view.
FIG. 5 is a cross-sectional view showing an application example of the above LED lighting device.
FIG. 6 is a sectional view of an LED lighting device according to a second embodiment of the present invention.
FIG. 7 is a side view in which the LED lighting device is separated.
FIG. 8 is a cross-sectional view showing an application example of the above LED lighting device.
FIG. 9 is a partially cutaway side view of the LED lighting device according to the first conventional example.
FIG. 10 is a sectional view of an LED lighting device according to a second conventional example.
[Explanation of symbols]
REFERENCE SIGNS LIST 1 LED element 2 LED mounting board 3 heat radiating means 4 DC power supply circuit 5 cover 5 a light source unit housing cover 5 b power unit housing cover 6 heat transfer unit 7 lens

Claims (6)

  1. LED素子が実装されたLED実装基板と、LED実装基板に設けられた放熱手段と、商用電源を受けて所定の直流電圧を出力する直流電源回路と、前記LED実装基板と放熱手段と直流電源回路とを収納するカバーと、を備えたLED点灯装置において、前記放熱手段の熱をカバーに伝達し得る熱伝達手段を設けたことを特徴とするLED点灯装置。LED mounting board on which LED elements are mounted, heat dissipating means provided on the LED mounting board, a DC power supply circuit for receiving a commercial power supply and outputting a predetermined DC voltage, the LED mounting board, heat dissipating means and DC power supply circuit And a cover for accommodating the heat-dissipating means, wherein a heat transfer means capable of transmitting heat of the heat radiating means to the cover is provided.
  2. 前記熱伝達手段は、放熱手段の近傍に位置するカバーから連設された連設部であることを特徴とする請求項1記載のLED点灯装置。The LED lighting device according to claim 1, wherein the heat transfer unit is a connecting portion provided continuously from a cover located near the heat radiating unit.
  3. 前記カバーは、LED実装基板と放熱手段とを収納する光源部収納カバーと、直流電源回路を収納する電源部収納カバーと、により構成され、光源部収納カバーが熱伝達手段であることを特徴とする請求項1又は2記載のLED点灯装置。The cover includes a light source unit storage cover that stores the LED mounting board and the heat radiation unit, and a power supply unit storage cover that stores the DC power supply circuit, wherein the light source unit storage cover is a heat transfer unit. The LED lighting device according to claim 1 or 2, wherein
  4. 前記光源部収納カバーの一部が放熱手段であることを特徴とする請求項3記載のLED点灯装置。The LED lighting device according to claim 3, wherein a part of the light source unit storage cover is a heat radiating unit.
  5. 前記熱伝達手段は、LED実装基板に直接取付けられたことを特徴とする請求項1乃至4記載のLED点灯装置。The LED lighting device according to claim 1, wherein the heat transfer unit is directly attached to an LED mounting board.
  6. 前記放熱手段とLED素子とは、熱伝導性のよい接着剤を介して接合させたことを特徴とする請求項5記載のLED点灯装置。The LED lighting device according to claim 5, wherein the heat radiating means and the LED element are joined via an adhesive having good heat conductivity.
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