JP4602477B1 - Lighting device - Google Patents

Lighting device Download PDF

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JP4602477B1
JP4602477B1 JP2010137478A JP2010137478A JP4602477B1 JP 4602477 B1 JP4602477 B1 JP 4602477B1 JP 2010137478 A JP2010137478 A JP 2010137478A JP 2010137478 A JP2010137478 A JP 2010137478A JP 4602477 B1 JP4602477 B1 JP 4602477B1
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terminal
main
plate
radiator
led
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JP2012003932A (en
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隆泰 佐藤
大鳳 河
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隆泰 佐藤
大鳳 河
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/23Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/233Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating a spot light distribution, e.g. for substitution of reflector lamps
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

Abstract

【課題】高出力化を図りながら、小型化、軽量化、そしてコスト減の実現を目標として、LED素子を用いた照明装置における新たな冷却手段を提供する。
【解決手段】発光本体21に正極端子22及び負極端子23を備えたLED素子2を用いた照明装置1において、正極端子22及び負極端子23は、端子放熱体15と熱的及び電気的に接続し、前記端子放熱体15を給電線に接続し、発光本体21は、端子放熱体15に対して電気的に絶縁された本体放熱体14と熱的に接続し、前記本体放熱体14に支持させた照明装置1である。
【選択図】図1
Provided is a new cooling means in a lighting device using LED elements with the aim of realizing miniaturization, weight reduction, and cost reduction while achieving high output.
In a lighting device 1 using an LED element 2 having a positive electrode terminal 22 and a negative electrode terminal 23 in a light emitting body 21, the positive electrode terminal 22 and the negative electrode terminal 23 are thermally and electrically connected to a terminal radiator 15. The terminal radiator 15 is connected to a power supply line, and the light emitting body 21 is thermally connected to the body radiator 14 electrically insulated from the terminal radiator 15 and supported by the body radiator 14 It is the made lighting device 1.
[Selection] Figure 1

Description

本発明は、発光本体に正極端子及び負極端子を備えたLED素子を用いた照明装置に関する。   The present invention relates to an illuminating device using an LED element including a positive electrode terminal and a negative electrode terminal in a light emitting body.
LED素子を用いた照明装置は、直流駆動又は交流駆動に大別される。直流駆動のLED素子は、供給される商用交流電圧を直流電圧に変換する交流-直流変換ICやLED素子の駆動IC等から構成される駆動回路が別途に必要になるが、交流駆動のLED素子は、前記駆動回路が必要ないことから、照明装置への利用が期待されている。いずれの駆動方式においても、照明装置として高出力化を目指すには、LED素子の発光量を増やさざるを得ず、この場合、LED素子の発光本体に発生する熱が無視できなくなる。LED素子は、発光本体の熱が高くなると、発光効率(供給された電力に対する発光割合)が低下するばかりか、LED素子そのものの寿命が短くなることから、LED素子を用いた照明装置では熱対策が求められる。   Lighting devices using LED elements are roughly classified into direct current drive and alternating current drive. DC-driven LED elements require a separate drive circuit consisting of an AC-DC converter IC that converts the supplied commercial AC voltage into DC voltage, LED element driver ICs, etc. Since the drive circuit is not necessary, it is expected to be used for a lighting device. In any driving method, in order to achieve high output as a lighting device, the amount of light emitted from the LED element must be increased. In this case, the heat generated in the light emitting body of the LED element cannot be ignored. LED elements, when the heat of the light emitting body increases, not only the luminous efficiency (light emission ratio to the supplied power) decreases, but also the life of the LED element itself is shortened. Is required.
特許文献1は、LED素子を用いた照明装置について、放熱を考慮して金属基板(PCB)にLED素子を取付け、更に前記金属基板に対してヒートシンクを装着する照明装置の従来技術(特許文献1[0008]〜[0011]、[図11])を紹介した上で、更に水冷手段(水冷ジャケット)を追加した照明装置(特許文献1[請求項1])を提案している。LED素子の発光本体は、水冷手段の熱媒体(冷媒液)に熱を移し、前記熱媒体がラジエータで冷却され、放熱することを繰り返して、前記LED素子の熱本体を冷却する(特許文献1[0026])。これにより、LED素子の発光効率の低下が抑制され、長寿命化できるほか、照明装置として高出力化が実現できるとしている(特許文献1[0027])。   Patent Document 1 discloses a conventional lighting device that uses LED elements to attach LED elements to a metal substrate (PCB) in consideration of heat dissipation, and further attaches a heat sink to the metal substrate (Patent Document 1). [0008] to [0011] and [FIG. 11]), and a lighting device (Patent Document 1 [Claim 1]) to which a water cooling means (water cooling jacket) is further added is proposed. The light emitting body of the LED element transfers heat to the heat medium (refrigerant liquid) of the water cooling means, and the heat medium is cooled by the radiator and repeatedly dissipated to cool the heat body of the LED element (Patent Document 1). [0026]). As a result, a decrease in the luminous efficiency of the LED element is suppressed, and the lifetime can be extended, and higher output can be realized as a lighting device (Patent Document 1 [0027]).
特開2009-129642号公報JP 2009-129642 A
上述のように、LED素子を用いた照明装置を高出力化する場合、LED素子に対して何らかの熱対策が求められ、簡易に金属基板とヒートシンクとを組み合わせたり、更に水冷手段までもが利用される。しかし、ヒートシンクは、LED素子を用いた照明装置の大型化及び重量化するもので好ましくなく、部品点数の増加は製造コスト及び組立コストを増大させる。更に、ヒートシンクから更に外部への放熱が不十分になると、金属基板やヒートシンクに熱が蓄積してしまう問題が引き起こされかねない。   As described above, when increasing the output of a lighting device using an LED element, some measures against heat are required for the LED element, and a simple combination of a metal substrate and a heat sink or even a water cooling means is used. The However, the heat sink is not preferable because it increases the size and weight of the lighting device using the LED element, and the increase in the number of parts increases the manufacturing cost and the assembly cost. Furthermore, if the heat dissipation from the heat sink further to the outside is insufficient, there may be a problem that heat accumulates on the metal substrate or the heat sink.
これに対し、水冷手段を利用すれば、LED素子の冷却については問題がなくなるが、ヒートシンクを用いる場合以上に、照明装置の大型化、重量増、そしてコスト増を招いてしまう。近年、既存の照明装置の代替手段として、LED素子を用いた照明装置が注目されつつあるが、更なる普及のためには高出力化が避けられない。そこで、高出力化を図りながら、小型化、軽量化、そしてコスト減の実現を目標として、LED素子を用いた照明装置における新たな冷却手段を開発するため、検討した。   On the other hand, if the water cooling means is used, there is no problem in cooling the LED elements, but the lighting device is increased in size, weight, and cost as compared with the case where a heat sink is used. In recent years, lighting devices using LED elements have been attracting attention as an alternative to existing lighting devices, but higher output is inevitable for further spread. Therefore, we studied to develop a new cooling means in the lighting device using LED elements, aiming to reduce the size, weight and cost while increasing the output.
検討の結果開発したものが、発光本体に正極端子及び負極端子を備えたLED素子を用いた照明装置において、発光本体と熱的に本体放熱体を接続し、給電線を備えた通常基板又は金属基板と正極端子及び負極端子との間に介在させて前記正極端子及び負極端子と熱的及び電気的に端子放熱体を接続してなり、本体放熱体は、平板状の本体接続板と、前記本体接続板の外周縁から延びる筒状の本体放散板とからなり、本体接続板にLED素子の発光本体を載せた照明装置である。本発明の照明装置は、金属基板を省略し、給電線を備えた通常基板(別段金属基板でも構わない)と正極端子及び負極端子との間に端子放熱体を介在させ、更に発光本体に本体放熱体を接続した構成である。 As a result of the study, we developed a lighting device that uses LED elements with a positive terminal and a negative terminal on the light-emitting body, and connects the heat-dissipating body with the light-emitting body and a normal substrate or metal with a power supply line. A terminal radiator is thermally and electrically connected to the positive terminal and the negative terminal interposed between the substrate, the positive terminal, and the negative terminal, and the main body radiator includes a flat body connecting plate, The lighting device includes a cylindrical main body diffusion plate extending from the outer peripheral edge of the main body connection plate, and the light emitting main body of the LED element is mounted on the main body connection plate . In the lighting device of the present invention, a metal substrate is omitted, a terminal radiator is interposed between a normal substrate (which may be a separate metal substrate) provided with a power supply line, and a positive electrode terminal and a negative electrode terminal. It is the structure which connected the heat radiator.
本発明の照明装置は、LED素子の正極端子及び負極端子を端子放熱体と熱的及び電気的に接続し、前記LED素子の発光本体に発生した熱を正極端子及び負極端子から端子放熱体を介して間接的に放熱すると共に、前記発光本体を本体放熱体と熱的に接続し、発光本体に発生した熱を本体放熱体から直接的に放熱する。すなわち、LED素子全体が端子放熱体又は本体放熱体のいずれかと熱的に接続しており、高い放熱作用を実現し、照明装置としての高出力化を図った場合でも、LED素子の温度上昇を抑制又は防止できる。   In the lighting device of the present invention, the positive electrode terminal and the negative electrode terminal of the LED element are thermally and electrically connected to the terminal radiator, and the heat generated in the light emitting body of the LED element is transferred from the positive electrode terminal and the negative electrode terminal to the terminal radiator. And indirectly radiating heat, and the light emitting body is thermally connected to the main body heat radiator, and the heat generated in the light emitting main body is directly radiated from the main body heat radiator. In other words, the entire LED element is thermally connected to either the terminal heat sink or the main body heat sink, realizing high heat dissipation and increasing the temperature of the LED element even when high output is achieved as a lighting device. Can be suppressed or prevented.
ここで、「熱的に」接続するとは、発光本体から正極端子及び負極端子を介して間接的又は発光本体から直接的に伝熱される接続形態を意味し、「電気的に」接続するとは、給電線を通じて駆動電力を給電できる接続形態を意味する。これから、端子放熱体は、正極端子及び負極端子と熱的に接続され、前記正極端子及び負極端子と給電線とを接続する関係から、金属体、好ましくは金属板、具体的に銅板又は銀板とする。また、本体放熱体は、何かを発光本体と電気的に接続する必要がないことから、例えば熱伝導率の高いセラミクッス体でもよいが、端子放熱体に合わせて金属体、好ましくは金属板、具体的に銅板又は銀板とする。   Here, “thermally” connected means a connection form in which heat is transferred indirectly from the light emitting body through the positive electrode terminal and the negative electrode terminal or directly from the light emitting body, and “electrically” is connected. It means a connection form in which driving power can be supplied through a power supply line. From this, the terminal radiator is thermally connected to the positive electrode terminal and the negative electrode terminal, and from the relationship of connecting the positive electrode terminal and the negative electrode terminal to the power supply line, a metal body, preferably a metal plate, specifically a copper plate or a silver plate. And In addition, since the main body heat radiator does not need to be electrically connected to the light emitting main body, for example, a ceramic body having a high thermal conductivity may be used, but a metal body, preferably a metal plate, according to the terminal heat radiator, Specifically, a copper plate or a silver plate is used.
発熱する発光本体は、ダイヤモンド層を介して本体放熱板に載せると、発光本体から本体放熱体に熱が移動しやすくなり、本体放熱体の温度上昇を抑制又は防止しやすくなる。ダイヤモンド層は、ダイヤモンド粉末を堆積させて形成すればよい。具体的に、ダイヤモンド粉末を本体放熱体の表面に直接堆積させ、ダイヤモンド層を形成したり、熱伝導率の優れたセラミックスにダイヤモンド粉末を混入させ、前記セラミックスを本体放熱体の表面に塗布し、硬化させることにより、ダイヤモンド粉末を混在させたセラミックス層をダイヤモンド層として形成したりする。 Emitting body that generates heat, when Ru placed on body heat dissipation plate through a diamond layer, heat is likely to move to the main heat radiator from the light emitting body, it becomes easy to suppress or prevent the temperature rise of the main heat radiating body. The diamond layer may be formed by depositing diamond powder. Specifically, diamond powder is directly deposited on the surface of the main body heat sink to form a diamond layer, or diamond powder is mixed into a ceramic having excellent thermal conductivity, and the ceramic is applied to the surface of the main body heat sink. By curing, a ceramic layer mixed with diamond powder is formed as a diamond layer.
体放熱体は、発光本体を熱的に接続する本体接続板と、前記本体接続板と熱的に繋がる本体放散板とから構成される。本体放熱体を板材として構成すると、比表面積(単位質量当たりの表面積の割合)が増大し、放熱しやすくなる。また、本体接続板と本体放散板とに分けて本体放熱体を構成することにより、本体接続板は発光本体を支持しやすい構造にし、また本体放散板は放熱に適し(例えば外部に露出させる)、かつ照明装置本体に位置固定しやすい構造にできる。これは、発光本体が本体放散板、本体接続板を介して照明装置本体に支持され、端子放熱体に接触する虞をなくすこと(絶縁性を確保すること)を意味する。 Main body radiator body includes a main body connecting plate for connecting the light emitting body of heat-form, is composed of a main body dissipation plate connected to the body connecting plate thermally. When the main body heat sink is configured as a plate material, the specific surface area (the ratio of the surface area per unit mass) increases, and heat dissipation becomes easier. In addition, the main body heat sink is composed of a main body connection plate and a main body diffusion plate so that the main body connection plate can easily support the light emitting main body, and the main body diffusion plate is suitable for heat dissipation (for example, exposed to the outside). In addition, the structure can be easily fixed to the illuminating device main body. This means that the light emitting main body is supported by the lighting device main body via the main body diffusion plate and the main body connection plate, and eliminates the possibility of contact with the terminal radiator (to ensure insulation).
端子放熱体は、本体接続板に設けられた開口より小さい平板状の端子接続板と、前記端子接続板から本体放散板の内部に延びる平板状の端子放散板とからなり、本体接続板に設けられた開口から覗かせた端子接続板にLED素子の正極端子及び負極端子を接続し、前記開口と端子接続板との間に形成される絶縁スリットに絶縁部材を介装し、給電線を備えた通常基板又は金属基板に前記端子放散板を接続するとよい。端子放熱体を板材として構成すると、比表面積が増大し、放熱しやすくなる。また、端子接続板と端子放散板とに分けて端子放熱体を構成することにより、端子接続板は正極端子及び負極端子に接続しやすい構造にし、また端子放散板は放熱に適し、かつ照明装置本体に位置固定しやすい構造にできる。これは、正極端子及び負極端子が端子放散板、端子接続板を介して照明装置本体に支持され、本体放熱体に接触する虞をなくすこと(絶縁性を確保すること)を意味する。 Terminal heat radiator is composed of a main body connecting plate to provided an opening smaller than plate-shaped terminal connecting plate, the plate-like terminal dissipating plates extending from the terminal connecting plate in the body dissipating plate, provided in the main body connection plate A positive electrode terminal and a negative electrode terminal of the LED element are connected to a terminal connection plate viewed through the formed opening, an insulating member is interposed in an insulating slit formed between the opening and the terminal connection plate, and a power supply line is provided. Usually Tying the terminal dissipating plate to a substrate or a metal substrate. When the terminal radiator is configured as a plate material, the specific surface area is increased and heat dissipation is facilitated. In addition, by configuring the terminal heat dissipator separately for the terminal connection plate and the terminal diffusion plate, the terminal connection plate can be easily connected to the positive electrode terminal and the negative electrode terminal, the terminal diffusion plate is suitable for heat dissipation, and the lighting device The structure can be easily fixed to the body. This means that the positive electrode terminal and the negative electrode terminal are supported by the illuminating device main body via the terminal diffusing plate and the terminal connection plate, thereby eliminating the possibility of contacting the main body heat dissipating member (ensuring insulation).
本発明の照明装置は、LED素子から本体放熱体及び端子放熱体を通じて直接的に放熱することにより、LED素子に発生する熱を放熱しやすくして、金属基板を介してヒートシンクから放熱する従来に比べ、LED素子の温度上昇を抑制又は防止できる。特に、発光本体と本体放熱体との間に介装されるダイヤモンド層は、発光本体から本体放熱体へ伝熱しやすし、更に本体放熱体における熱の拡散を促して、発光本体の温度上昇を抑制又は防止できる。こうして、本発明の照明装置は、発熱によるLED素子の発光効率の低下や寿命が短くなることを防止し、LED素子を用いた照明装置の高出力化を可能にし、LED素子を用いた照明装置の利用範囲を拡大する。   The illuminating device of the present invention has a conventional structure in which heat generated in the LED element is easily radiated from the heat sink via the metal substrate by directly radiating heat from the LED element through the main body radiator and the terminal radiator. In comparison, the temperature rise of the LED element can be suppressed or prevented. In particular, the diamond layer interposed between the light emitting body and the main body heat sink facilitates heat transfer from the light emitting main body to the main body heat sink, and further promotes the diffusion of heat in the main body heat sink to suppress the temperature rise of the light emitting main body. Or it can be prevented. Thus, the illuminating device of the present invention prevents a decrease in luminous efficiency and life of the LED element due to heat generation, enables a higher output of the illuminating device using the LED element, and the illuminating device using the LED element. Expand the range of use.
本体放熱体や端子放熱体は、LED素子から直接的に熱を受け取り、放熱することから、従来同種の照明装置におけるヒートシンクに比較して小さくてもLED素子を十分に冷却できるようになり、照明装置を小型化や軽量化できる。照明装置の小型化や軽量化は、板材で構成して比表面積を大きくし、接続板及び放散板の役割分担を設けることで本体放熱体や端子放熱体を小型化したり、ダイヤモンド層を介装して本体放熱体の熱を本体放熱体から放熱しやすくすることにより前記本体放熱体を小型化することでも実現される。   The main body heatsink and terminal heatsink directly receive heat from the LED element and dissipate it, so that the LED element can be cooled sufficiently even if it is smaller than the heatsink in the same type of lighting device. The device can be reduced in size and weight. To reduce the size and weight of the lighting device, increase the specific surface area by using a plate material, and reduce the size of the main body heatsink and terminal heatsink by providing the roles of the connection plate and the diffusion plate, or insert a diamond layer. In addition, it is also realized by reducing the size of the main body heat sink by facilitating heat dissipation from the main body heat sink.
また、本体放熱体や端子放熱体は、金属板、具体的に銅板又は銀板で構成すると、伝熱及び放熱がよくなるほか、成形に必要な材料の量を少なくし、そして加工を容易にすることから、材料コストや製造コストを抑えることができる。更に、照明装置全体で見た場合でも、金属基板が省略できることも、材料コストや製造コストの低減をもたらす。このようにして、本発明の照明装置は、照明装置の小型化、軽量化、そしてコスト増の抑制又はコスト減という効果をもたらす。   In addition, if the main body heatsink and terminal heatsink are made of metal plates, specifically copper plates or silver plates, heat transfer and heat dissipation will be improved, and the amount of material required for molding will be reduced and processing will be facilitated. Therefore, material cost and manufacturing cost can be suppressed. Furthermore, even when viewed as a whole lighting device, the fact that the metal substrate can be omitted brings about reduction of material cost and manufacturing cost. In this manner, the lighting device of the present invention brings about the effects of reducing the size and weight of the lighting device, and suppressing the cost increase or reducing the cost.
本発明を適用した照明装置の一例を表す斜視図である。It is a perspective view showing an example of the illuminating device to which this invention is applied. 本例の照明装置の垂直断面図である。It is a vertical sectional view of the illumination device of this example. 本例の照明装置の分解斜視図である。It is a disassembled perspective view of the illuminating device of this example. 本例の照明装置におけるLED素子、放熱体保持モジュール、本体放熱体及び端子放熱体の組付前斜視図である。It is a perspective view before the assembly | attachment of the LED element in the illuminating device of this example, a heat radiator holding module, a main body heat radiator, and a terminal heat radiator. 下方から見た放熱体保持モジュール、本体放熱体及び端子放熱体の組付前斜視図である。It is the perspective view before the assembly | attachment of the heat radiator holding | maintenance module, the main body heat sink, and the terminal heat sink seen from the downward direction. 本例の照明装置におけるLED素子、放熱体保持モジュール、本体放熱体及び端子放熱体の組付後斜視図である。It is a perspective view after the assembly of the LED element, the radiator holding module, the main body radiator and the terminal radiator in the lighting device of this example.
以下、本発明を実施するための形態について説明する。本発明は、例えば図1に見られるように、交流駆動される照明装置1に適用できる。本例の照明装置1は、図2(ネジの図示を省略)及び図3に見られるように、カバーモジュール11、導光体モジュール12、放熱体保持モジュール13、本体放熱体14、端子放熱体15,15、ソケットモジュール16及び給電線を備えた通常基板17から構成され、LED素子2を前記放熱体保持モジュール13に保持させ、発光本体21を本体放熱体14の本体接続板141に熱的に接続し、また正極端子22及び負極端子23をそれぞれ別の端子放熱体15の各端子接続板151に熱的及び電気的に接続して、構成される。   Hereinafter, modes for carrying out the present invention will be described. For example, as shown in FIG. 1, the present invention can be applied to an illuminating device 1 driven by alternating current. As shown in FIG. 2 (screw illustration is omitted) and FIG. 3, the illumination device 1 of this example includes a cover module 11, a light guide module 12, a radiator holding module 13, a main body radiator 14, and a terminal radiator. 15, 15, a normal module 17 having a socket module 16 and a power supply line, the LED element 2 is held by the radiator holding module 13, and the light emitting body 21 is thermally applied to the body connecting plate 141 of the body radiator 14. In addition, the positive terminal 22 and the negative terminal 23 are thermally and electrically connected to the respective terminal connection plates 151 of the separate terminal radiators 15, respectively.
カバーモジュール11は、導光体モジュール12を覆って保護する樹脂製部材で、例えばポリブチレンテレフタレート(PBT)を用いて形成される。先端開口111は、周縁を前記導光体モジュール12の半球状導光体121の上面に当接させ、下端となる嵌合周縁112は、放熱体保持モジュール12の保持ベース131の外周面に嵌合させる。導光体モジュール12に代えてLED素子2を底部中心に配置した椀状反射材からなる反射材モジュールを用いた場合、前記先端開口111に透光製素材(ガラスや透明な樹脂板)からなる透光板又はレンズを装着する。   The cover module 11 is a resin member that covers and protects the light guide module 12, and is formed using, for example, polybutylene terephthalate (PBT). The front end opening 111 makes the periphery contact the upper surface of the hemispherical light guide 121 of the light guide module 12, and the fitting periphery 112 serving as the lower end is fitted to the outer peripheral surface of the holding base 131 of the radiator holding module 12. Combine. When a reflector module made of a bowl-shaped reflector having the LED element 2 arranged at the bottom center is used instead of the light guide module 12, the tip opening 111 is made of a translucent material (glass or transparent resin plate). A translucent plate or lens is attached.
導光体モジュール12は、LED素子2の発光本体21から発光されたLED光を導いて、上記カバーモジュール11の先端開口111から照射させる半球状導光体121と、前記半球状導光体121を支持する平板状の支持ベース122とを一体に成形した樹脂製部材であり、例えばポリブチレンテレフタレート(PBT)を用いて形成される。半球状導光体121は、支持ベース122を貫通して設けたられた光導入穴123にLED素子2の発光本体21を差し込ませ、LED光を屈折又は反射させながら上面に向けて拡散させる。本例の導光体モジュール12は、支持ベース122の周面の一部を放熱体保持モジュール13の保持ベース131に設けた補強リブ136に内接して位置決めされ、前記保持ベース131とカバーモジュール11の先端開口111を形成する周縁とに挟まれて位置固定される。   The light guide module 12 guides the LED light emitted from the light emitting body 21 of the LED element 2 and irradiates it from the front end opening 111 of the cover module 11, and the hemispherical light guide 121. Is a resin member integrally formed with a flat support base 122 that supports the substrate, and is formed using, for example, polybutylene terephthalate (PBT). The hemispherical light guide 121 inserts the light emitting body 21 of the LED element 2 into a light introducing hole 123 provided through the support base 122, and diffuses the LED light toward the upper surface while refracting or reflecting the LED light. The light guide module 12 of this example is positioned with a part of the peripheral surface of the support base 122 inscribed in a reinforcing rib 136 provided on the holding base 131 of the radiator holding module 13, and the holding base 131 and the cover module 11 are positioned. The position is fixed by being sandwiched between the peripheral edge forming the front end opening 111 of the front end.
放熱体保持モジュール13は、本体放熱体14及び端子放熱体15を絶縁状態で保持する樹脂製部材で、例えばポリブチレンテレフタレート(PBT)を用いて形成される。具体的には、本体放熱体14の平面視円形である本体接続板141に載る一回り小さな平面視円形の保持ベース131と、前記保持ベース131の底面から下方に降ろされる一対の組付ポスト132,132とから構成される。組付ポスト132は、ソケットモジュール16のポストネジ止め部162にネジ止めされて放熱体保持モジュール13からソケットモジュール16までを一体にするほか、本体接続板141及び端子接続板151の各ポスト掛合切欠143,153に係合して、本体放熱体14及び端子放熱体15の接触を防止し、かつ位置決めする。 The radiator holding module 13 is a resin member that holds the main body radiator 14 and the terminal radiator 15 in an insulating state, and is formed using, for example, polybutylene terephthalate (PBT). Specifically, the body connection plate flat face view circular holding base 131 having a small round resting on 141 is a circular shape in plan view of the main heat radiating body 14, with a pair of sets is lowered downwardly from the bottom surface of the holding base 131 It is composed of posts 132 and 132. The assembly post 132 is screwed to the post screw fixing portion 162 of the socket module 16 to integrate the heat radiator holding module 13 to the socket module 16, and the post engagement notches 143 and 153 of the main body connection plate 141 and the terminal connection plate 151. To prevent contact between the main body radiator 14 and the terminal radiator 15 and to position them.
保持ベース131は、上面周縁に環状の補強リブ136を設けた円盤で、平面視中央に、本体接続板141の架橋部分に相似な平面視長方形の発光本体用開口133を設け、前記発光本体用開口133を挟んで一対の端子挿通孔135,135を設けている。また、前記発光本体用開口133の長手方向側縁に沿って底面側に絶縁梁134,134を設けている(図4及び図5参照。図5は説明の便宜上、本体放散板142及び端子放散板152を図示略)。絶縁梁134は、本体接続板141及び端子接続板151の間に形成される絶縁スリット18に差し込まれ、本体放熱体14及び端子放熱体15の接触を防止し、かつ位置決めする。   The holding base 131 is a disk provided with an annular reinforcing rib 136 on the periphery of the upper surface, and is provided with a light emitting main body opening 133 having a rectangular shape in plan view similar to the bridging portion of the main body connecting plate 141 in the center in plan view. A pair of terminal insertion holes 135, 135 are provided across the opening 133. Insulating beams 134 and 134 are provided on the bottom side along the longitudinal side edge of the light emitting main body opening 133 (see FIGS. 4 and 5. FIG. 5 shows the main body diffusion plate 142 and the terminal diffusion plate 152 for convenience of explanation. (Not shown). The insulating beam 134 is inserted into an insulating slit 18 formed between the main body connection plate 141 and the terminal connection plate 151, and prevents and positions the main body heat radiator 14 and the terminal heat radiator 15 from contacting each other.
本体放熱体14は、厚さ0.1mm〜0.5mmの銅(又は銀)製の本体接続板141及び本体放散板142から構成される。本体接続板141は、放熱体保持モジュール13の基準板131の裏面に接面する円形銅板から、端子放熱体15の端子接続板151より絶縁スリット18の幅だけ大きな開口を設けた板材で、放熱体保持モジュール13から延びる組付ポスト132に半径外側から当接するポスト掛合切欠143を、開口の円弧部分中央に設けている。本体接続板141は、開口の直線部分の絶縁スリット18に差し込まれた絶縁梁134と前記組付ポスト132とを開口の内側から押し当てられて位置決めされ、放熱体保持モジュール13の保持ベース131の裏面に本体接続板141を接面させ、かつ本体放散板142の下端をソケットモジュール16の本体放散板嵌合リブ161に外嵌して位置固定される。   The main body radiator 14 includes a main body connection plate 141 and a main body diffusion plate 142 made of copper (or silver) having a thickness of 0.1 mm to 0.5 mm. The main body connection plate 141 is a plate material provided with an opening that is larger than the terminal connection plate 151 of the terminal radiator 15 by the width of the insulating slit 18 from the circular copper plate that contacts the back surface of the reference plate 131 of the radiator holding module 13. A post-engagement notch 143 that abuts the assembly post 132 extending from the body holding module 13 from the outside of the radius is provided at the center of the arc portion of the opening. The main body connecting plate 141 is positioned by pressing the insulating beam 134 inserted into the insulating slit 18 in the linear portion of the opening and the assembly post 132 from the inside of the opening, and the holding base 131 of the radiator holding module 13 is positioned. The main body connection plate 141 is brought into contact with the back surface, and the lower end of the main body diffusion plate 142 is externally fitted to the main body diffusion plate fitting rib 161 of the socket module 16 to fix the position.
本例の本体接続板141は、LED素子2の発光本体21と熱的に接続するため、前記発光本体21を載せる部分に、ダイヤモンド粉末を混入させたセラミックスペースト(例えば酸化チタン(TiO2)9wt%〜15wt%、セラミックビーズ(Ceramic bead、空隙率(Porosity)12%〜20%)10wt%〜15wt%、ダイヤモンド粉末0.5wt%〜1wt%、その他灯油(White sprit)又は鉱油(Mineral oil)等)を塗布、焼結させて、ダイヤモンド層144を形成している。こうしたダイヤモンド層144を介して発光本体21と本体接続板141とを熱的に接続することにより、発光本体21から本体接続板14への熱伝導率を向上させる。 Since the main body connection plate 141 of this example is thermally connected to the light emitting body 21 of the LED element 2, a ceramic paste (for example, titanium oxide (TiO 2 ) 9 wt. % To 15wt%, ceramic beads (Ceramic bead, Porosity 12% to 20%) 10wt% to 15wt%, diamond powder 0.5wt% to 1wt%, other kerosene (White sprit) or mineral oil (Mineral oil), etc. ) Is applied and sintered to form the diamond layer 144. By thermally connecting the light emitting body 21 and the main body connecting plate 141 via the diamond layer 144, the thermal conductivity from the light emitting main body 21 to the main body connecting plate 14 is improved.
本体放散板142は、本体接続板141の外周縁から下方に向けて延びる円筒であり、ソケットモジュール16の本体放散板嵌合リブ161に外嵌することにより位置決め及び位置固定される。本例の本体放散板142は、外部に露出しており(図1及び図2参照)、発光本体21から伝えられた熱を円滑に外部へ放散させる。既述したように、ダイヤモンド層144を介することにより、発光本体21から本体接続板141へは熱伝導率が向上しており、また本体放散板142が円筒であることから比表面積が大きく、しかも外部に露出しているため、放熱性が優れている。こうして、発光本体21の冷却効率を高めている。   The main body diffusion plate 142 is a cylinder extending downward from the outer peripheral edge of the main body connection plate 141, and is positioned and fixed by being externally fitted to the main body diffusion plate fitting rib 161 of the socket module 16. The main body diffusion plate 142 of this example is exposed to the outside (see FIGS. 1 and 2), and smoothly dissipates the heat transmitted from the light emitting main body 21 to the outside. As described above, through the diamond layer 144, the thermal conductivity is improved from the light emitting body 21 to the body connecting plate 141, and the specific surface area is large because the body diffusion plate 142 is cylindrical. Because it is exposed to the outside, heat dissipation is excellent. Thus, the cooling efficiency of the light emitting body 21 is increased.
端子放熱体15は、厚さ0.1mm〜0.5mmの銅(又は銀)製の端子接続板151及び端子放散板152から構成される。端子接続板151は、上記本体接続板141に設けられた開口より絶縁スリット18の溝幅だけ小さい半円弧状の板材で、上記本体接続板141に設けられたポスト掛合切欠143と対になり、放熱体保持モジュール13から延びる組付ポスト132に半径内側から当接するポスト掛合切欠153を、円弧部分中央に設けている。端子接続板151は、本体接続板141に設けられた開口から覗かせた状態で、直線部分の絶縁スリット18に差し込まれた絶縁梁134と前記組付ポスト132とに挟まれて位置決めされ、放熱体保持モジュール13の保持ベース131の裏面に端子接続板151を接面させ、ソケットモジュール16に位置固定された通常基板17の差し込み孔171に端子放散板152の位置決め突起154を差し込むことにより位置固定される。 The terminal radiator 15 is composed of a copper (or silver) terminal connection plate 151 and a terminal diffusion plate 152 having a thickness of 0.1 mm to 0.5 mm. The terminal connection plate 151 is a semi-arc-shaped plate material that is smaller by the groove width of the insulating slit 18 than the opening provided in the main body connection plate 141, and is paired with a post hooking notch 143 provided in the main body connection plate 141. A post-engagement notch 153 that abuts the assembly post 132 extending from the radiator holding module 13 from the inside of the radius is provided at the center of the arc portion. The terminal connecting plate 151 is positioned by being sandwiched between the insulating beam 134 inserted into the insulating slit 18 in the straight portion and the assembly post 132 in a state where the terminal connecting plate 151 is viewed from the opening provided in the main body connecting plate 141, and heat is dissipated. The terminal connection plate 151 is brought into contact with the back surface of the holding base 131 of the body holding module 13, and the positioning is fixed by inserting the positioning protrusion 154 of the terminal diffusion plate 152 into the insertion hole 171 of the normal board 17 positioned in the socket module 16. Is done.
端子放散板152は、前記端子接続板151の半径内側に位置する直線部分から下方に折り曲げられて延びる板面である。端子放散板152から放出される熱は、円筒状の本体放散板142の内部空間へ一旦放出され、前記本体放散板142に吸熱され、改めて本体放散板142から外部へ放出されることになるが、正極端子22及び負極端子23を通じて伝わる熱は少ないので、問題はない。   The terminal diffusion plate 152 is a plate surface that is bent downward and extends from a straight line portion located on the radius inside of the terminal connection plate 151. The heat released from the terminal diffusion plate 152 is once released into the internal space of the cylindrical main body diffusion plate 142, absorbed by the main body diffusion plate 142, and released again from the main body diffusion plate 142 to the outside. There is no problem because the heat transmitted through the positive terminal 22 and the negative terminal 23 is small.
本例の端子放散板152は、組付ポスト132によりソケットモジュール16に対して位置固定される通常基板17に設けた差し込み孔164に差し込む位置決め突起154を下縁中央に設けている。これにより、端子放散板152は、放熱体保持モジュール13の組付ポスト132と絶縁梁134とに挟まれた端子接続板151により上縁が位置固定され、前記位置決め突起154が通常基板17の差し込み孔171に差し込まれることにより下縁が位置固定されて、本体放熱体14に接触しなくなる。   The terminal dissipating plate 152 of this example is provided with a positioning projection 154 at the center of the lower edge to be inserted into the insertion hole 164 provided in the normal board 17 that is fixed to the socket module 16 by the assembly post 132. Thereby, the terminal radiating plate 152 is fixed at the upper edge by the terminal connecting plate 151 sandwiched between the assembly post 132 and the insulating beam 134 of the radiator holding module 13, and the positioning protrusion 154 is inserted into the normal board 17. The lower edge is fixed in position by being inserted into the hole 171, and does not come into contact with the main body radiator 14.
ソケットモジュール16は、雄ねじ状のソケット163を備えた部材であり、例えば全体をポリブチレンテレフタレート(PBT)で形成しながら、前記ソケット16のみを金属部材で構成する。本例のソケットモジュール16は、既述したように、上端周縁に形成した本体放散板嵌合リブ161に本体放散板142を嵌合させて本体放熱体14を位置決めし、ポストネジ止め部162に組付ポスト132をネジ止めすることにより放熱体保持モジュール13を位置決めして、前記放熱体保持モジュール13を介して本体放熱体14及び端子放熱体15を位置決めし、かつ位置固定する。   The socket module 16 is a member provided with a male screw-shaped socket 163. For example, while the whole is formed of polybutylene terephthalate (PBT), only the socket 16 is formed of a metal member. As described above, the socket module 16 of the present example is configured so that the main body heat dissipation plate 142 is fitted to the main body heat dissipating plate fitting rib 161 formed on the periphery of the upper end to position the main body heat dissipating body 14 and assembled to the post screw fixing portion 162. The radiator holding module 13 is positioned by screwing the post 132, and the main body radiator 14 and the terminal radiator 15 are positioned and fixed in position via the radiator holding module 13.
通常基板17は、給電線(図示略)を備えた基板(PCB)又は金属基板(メタルPCB)である。本例の通常基板17は、差し込み孔171に給電線を繋ぎ、前記差し込み孔171に差し込まれる端子放散板152の位置決め突起154と給電線とを電気的に接続する。給電線は、リード線172を介してソケット163に繋がる。また、本例の通常基板17は、差し込み孔171に差し込まれる位置決め突起154を介して端子放散板152を位置固定できるように、通常基板17そのものを位置固定するため、ソケットモジュール16のポストネジ止め部162にネジ止めされる組付ポスト132をポスト貫通孔173に嵌合させている。ソケットモジュール16のソケット163を介して供給される交流電圧は、リード線172、給電線、そして各端子放熱体15,15を経てLED素子2の正極端子22及び負極端子23に印加される。   The normal substrate 17 is a substrate (PCB) or a metal substrate (metal PCB) provided with a power supply line (not shown). The normal board 17 of this example connects a feeding line to the insertion hole 171 and electrically connects the positioning protrusion 154 of the terminal diffusion plate 152 inserted into the insertion hole 171 and the feeding line. The power supply line is connected to the socket 163 via the lead wire 172. In addition, the normal board 17 of the present example is designed to fix the position of the normal board 17 itself so that the terminal dissipating plate 152 can be fixed via the positioning protrusion 154 inserted into the insertion hole 171. An assembly post 132 screwed to 162 is fitted into the post through hole 173. The AC voltage supplied through the socket 163 of the socket module 16 is applied to the positive electrode terminal 22 and the negative electrode terminal 23 of the LED element 2 through the lead wire 172, the power supply line, and the terminal radiators 15 and 15.
これまでの説明から理解されるように、放熱体保持モジュール13の組付ポスト132及び絶縁梁134、ソケットモジュール16の本体放散板嵌合リブ161や通常基板17により、本体放熱体14及び端子放熱体15は、互いに絶縁された状態で位置決めされ、かつ位置固定されている。これにより、LED素子2は、図6(説明の便宜上、放熱体保持モジュール13の図示略)に見られるように、発光本体21を本体接続板21に圧接し、熱的に接続しながら、前記発光本体21から張り出した正極端子22及び負極端子23を、本体接続板141に設けられた開口から覗かせた端子接続板151にそれぞれ接触させ、例えばハンダ付けにより、電気的及び熱的に接続される。 As can be understood from the above description, the main body radiator 14 and terminal heat dissipation are achieved by the assembly post 132 and insulating beam 134 of the radiator holder module 13, the main body radiation plate fitting rib 161 of the socket module 16, and the normal substrate 17. The body 15 is positioned and fixed in a state of being insulated from each other. Thereby, as seen in FIG. 6 (for convenience of explanation, illustration of the radiator holding module 13 is omitted), the LED element 2 presses the light emitting body 21 against the body connecting plate 21 and thermally connects the above- The positive electrode terminal 22 and the negative electrode terminal 23 projecting from the light emitting main body 21 are brought into contact with the terminal connection plate 151 seen through the opening provided in the main body connection plate 141, and are electrically and thermally connected, for example, by soldering. The
本体放熱体14及び端子放熱体15は、本例のように銅板で構成すると比表面積が極めて大きくでき、熱的な観点から、LED素子2に直結するヒートシンクと見ることもできる。この場合、本体放熱体14及び端子放熱体15は、本例のように本体接続板141及び端子接続板151と本体放散板142及び端子放散板152とに分けて構成すると、本体接続板141及び端子接続板151を発光本体21や正極端子22及び負極端子23が接続しやすい構造とし、本体放散板142及び端子放散板152を放熱や位置決め及び位置固定に適した構造とすることができる。このように、本発明における本体放熱体14及び端子放熱体15は、LED素子2に対するヒートシンクとしても優れている。   If the main body radiator 14 and the terminal radiator 15 are made of a copper plate as in this example, the specific surface area can be extremely large, and it can be regarded as a heat sink directly connected to the LED element 2 from a thermal viewpoint. In this case, when the main body radiator 14 and the terminal radiator 15 are divided into the main body connection plate 141, the terminal connection plate 151, the main body diffusion plate 142, and the terminal diffusion plate 152 as in this example, the main body connection plate 141 and The terminal connection plate 151 can be configured to easily connect the light emitting body 21, the positive electrode terminal 22, and the negative electrode terminal 23, and the main body diffusion plate 142 and the terminal diffusion plate 152 can be configured to be suitable for heat dissipation, positioning, and position fixing. Thus, the main body radiator 14 and the terminal radiator 15 in the present invention are also excellent as a heat sink for the LED element 2.
1 照明装置
11 カバーモジュール
12 導光体モジュール
13 放熱体保持モジュール
14 本体放熱体
141 本体接続板
142 本体放散板
15 端子放熱体
151 端子接続板
152 端子放散板
16 ソケットモジュール
17 通常基板
18 絶縁スリット
2 LED素子
21 発光本体
22 正極端子
23 負極端子
1 Lighting device
11 Cover module
12 Light guide module
13 Radiator holding module
14 Heat sink
141 Main unit connection plate
142 Body diffuser
15 Terminal radiator
151 Terminal connection plate
152 Terminal diffuser
16 socket module
17 Normal board
18 Insulating slit 2 LED element
21 Light emitting body
22 Positive terminal
23 Negative terminal

Claims (3)

  1. 発光本体に正極端子及び負極端子を備えたLED素子を用いた照明装置において、
    発光本体と熱的に本体放熱体を接続し、給電線を備えた通常基板又は金属基板と正極端子及び負極端子との間に介在させて前記正極端子及び負極端子と熱的及び電気的に端子放熱体を接続してなり、
    本体放熱体は、平板状の本体接続板と、前記本体接続板の外周縁から延びる筒状の本体放散板とからなり、本体接続板にLED素子の発光本体を載せたことを特徴とする照明装置。
    In the lighting device using the LED element having the positive electrode terminal and the negative electrode terminal in the light emitting body,
    A main body heat radiator is thermally connected to the light emitting body, and is interposed between a normal substrate or a metal substrate provided with a power supply line and a positive electrode terminal and a negative electrode terminal, and thermally and electrically connected to the positive electrode terminal and the negative electrode terminal. Connecting a heatsink,
    The main body radiator is composed of a flat main body connection plate and a cylindrical main body diffusion plate extending from the outer peripheral edge of the main body connection plate, and the light emitting main body of the LED element is mounted on the main body connection plate. apparatus.
  2. 発光本体は、ダイヤモンド層を介して本体接続板に載せる請求項1記載の照明装置。 Emitting body, the illumination apparatus according to claim 1, wherein Ru placed on the main body connecting plate through the diamond layer.
  3. 端子放熱体は、本体接続板に設けられた開口より小さい平板状の端子接続板と、前記端子接続板から本体放散板の内部に延びる平板状の端子放散板とからなり、本体接続板に設けられた開口から覗かせた端子接続板にLED素子の正極端子及び負極端子を接続し、前記開口と端子接続板との間に形成される絶縁スリットに絶縁部材を介装し、給電線を備えた通常基板又は金属基板に前記端子放散板を接続した請求項1又は2いずれか記載の照明装置。 Terminal heat radiator is composed of a main body connecting plate to provided an opening smaller than plate-shaped terminal connecting plate, the plate-like terminal dissipating plates extending from the terminal connecting plate in the body dissipating plate, provided in the main body connection plate A positive electrode terminal and a negative electrode terminal of the LED element are connected to a terminal connection plate viewed through the formed opening, an insulating member is interposed in an insulating slit formed between the opening and the terminal connection plate, and a power supply line is provided. lighting device according to any one of claims 1 or 2 normally connected to the terminal dissipating plate to a substrate or a metal substrate.
JP2010137478A 2010-06-16 2010-06-16 Lighting device Expired - Fee Related JP4602477B1 (en)

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KR1020117003010A KR101071665B1 (en) 2010-06-16 2010-11-24 Illuminating device
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