JP4135485B2 - Light emitting diode light source and light emitting diode lighting fixture - Google Patents

Light emitting diode light source and light emitting diode lighting fixture Download PDF

Info

Publication number
JP4135485B2
JP4135485B2 JP2002354829A JP2002354829A JP4135485B2 JP 4135485 B2 JP4135485 B2 JP 4135485B2 JP 2002354829 A JP2002354829 A JP 2002354829A JP 2002354829 A JP2002354829 A JP 2002354829A JP 4135485 B2 JP4135485 B2 JP 4135485B2
Authority
JP
Japan
Prior art keywords
emitting diode
light
light emitting
base
light source
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2002354829A
Other languages
Japanese (ja)
Other versions
JP2004186109A (en
Inventor
厳與 森山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Lighting and Technology Corp
Original Assignee
Toshiba Lighting and Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Lighting and Technology Corp filed Critical Toshiba Lighting and Technology Corp
Priority to JP2002354829A priority Critical patent/JP4135485B2/en
Publication of JP2004186109A publication Critical patent/JP2004186109A/en
Application granted granted Critical
Publication of JP4135485B2 publication Critical patent/JP4135485B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/23Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00Globes; Bowls; Cover glasses
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00Globes; Bowls; Cover glasses
    • F21V3/02Globes; Bowls; Cover glasses characterised by the shape
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Description

【0001】
【発明の属する技術分野】
本発明は、口金に封着された外囲器内に設けた発光ダイオードを発光させる発光ダイオード光源及び発光ダイオード照明器具に関する。
【0002】
【従来の技術】
従来、口金に封着された外囲器内に設けた発光ダイオードを発光させる発光ダイオード光源が知られている(特許文献1、特許文献2参照)。
【0003】
【特許文献1】
実公平4−16455号公報
【特許文献2】
特表2002−525814公報
【発明が解決しようとする課題】
特許文献1及び特許文献2に記載された発光ダイオード光源は、バルブなどと称される外囲器に複数の発光ダイオードを具備する構造であるため、発光ダイオードの配光を、その発光ダイオードの表面積より大きな表面積の拡散面(外囲器の内面)に投影する場合、輝度ムラを生じ、外囲器を均等拡散発光させることは容易ではない。
【0004】
また、発光ダイオードの単位面積(容積)当りの発熱量が大きくなると、密閉された外囲器内部の温度が上昇し、その結果、発光ダイオードのジャンクション温度の最大定格値を越え、最悪の場合には発光ダイオードを発光させることができない。
【0005】
本発明の目的は、外囲器を均等拡散発光させることができ、さらに、定格電流を通電するために簡単な構造で発光ダイオードからの熱を放熱させ得る発光ダイオード光源を提供することである。
【0006】
本発明の目的は、発光ダイオード光源の放熱作用をさらに促進し、発光ダイオード光源に定格電流以上の電流を通電し得る発光ダイオード照明器具を提供することである。
【0007】
【課題を解決するための手段】
請求項1記載の発光ダイオード光源は、口金と;前記口金から前記口金の中心線上に突出するように配置された発光ダイオード支持体と;前記口金と電気的に接続され、前記発光ダイオード支持体の前記口金とは反対側に配置された発光ダイオードと;前記口金から突出している前記発光ダイオード支持体を覆うように固定されるネック部、前記発光ダイオードから発光される光を拡散する拡散領域部、及び前記ネック部と前記拡散領域部との間に形成される境界部を有してなる透光性の外囲器と;を具備し、前記発光ダイオードは前記口金の中心線に近いほど光の強度が高くなる方向のランバーシャンの配光曲線を有し、前記外囲器の前記拡散領域部の外形形状は前記発光ダイオードの配光曲線に相似する略球形の形状に定められ、前記発光ダイオードは前記境界部近傍に配置されている。
【0008】
ここで、透光性の外囲器は、合成樹脂、ガラス、陶器などにより形成されたものを含む。また、境界部近傍とは、発光ダイオードから発光される光を略均等に拡散させることができる範囲を言う。
【0009】
したがって、ランバーシャンの配光曲線を有する発光ダイオードの出力をそのまま外囲器上に投影させることが可能となるため、外囲器を略均等拡散発光させることが可能となる。
【0010】
請求項2記載の発明は、請求項1記載の発光ダイオード光源において、前記発光ダイオード支持体は熱伝導性材料により形成され、一端が前記口金に熱的に接続され他端が前記発光ダイオードに熱的に接続されている。
【0011】
ここで、口金及び発光ダイオード支持体は、アルミニウムや銅などの金属、又はアルミニウムや銅の何れか一つを組み合わせた合金により形成されたものを含む。また、口金と発光ダイオード支持体とを熱的に接続する手段は、両者の間を熱伝導材料を介して接続する手段と、両者を直接接触させる手段とを含む。後者の場合は両者に螺子を形成して螺合させる構造を採用して接触面積を拡大することが熱伝導性の面で好ましい。さらに、発光ダイオード支持体と発光ダイオードとを熱的に接続する手段は、両者の間を熱伝導材料を介して接続する手段を含む。口金と発光ダイオード支持体との間、及び発光ダイオード支持体と発光ダイオードとの間を熱的に接続する熱伝導材料は、ジメチルシリコン、メチルフェニルシリコン、アルキル変性シリコン又はフロロシリコンに、熱伝導性に優れた亜鉛華などの金属酸化物を配合した熱伝導性シリコンを含む。
【0012】
したがって、発光ダイオードの熱を発光ダイオード支持体を介して口金に伝導させる簡単な構造で発光ダイオードの温度を下げることが可能となる。
【0013】
請求項3記載の発光ダイオード照明器具は、請求項1又は2記載の発光ダイオード光源と;電源に接続される点灯回路と;前記発光ダイオード光源の前記口金を前記点灯回路に接続する接続部と;前記発光ダイオード光源の前記発光ダイオードから前記口金を介して前記接続部に伝導される熱を放熱するヒートシンクと;前記接続部に接続される前記発光ダイオード光源と前記ヒートシンクと前記点灯回路とを収容する器具本体と;を具備する。
【0014】
ここで、ヒートシンクは、発光ダイオード光源からの光を反射する反射板と同一材料により一体に形成された構成を含む。
【0015】
したがって、発光ダイオード光源の放熱を促進し、定格電流以上の電流を発光ダイオード光源に通電することが可能となる。
【0016】
【発明の実施の形態】
本発明の一実施の形態を図面に基づいて説明する。図1は発光ダイオード照明器具の縦断側面図、図2は一部を断面にして示す発光ダイオード光源の側面図、図3は一部を断面にして示す発光ダイオード光源の側面図である。
【0017】
発光ダイオード照明器具1の一構成部品である板金製の器具本体2は、天井3の開口部4に装着し得るように下面が開口された筒状の形状に形成されている。この器具本体2には天井3の開口部4の周縁に当接される化粧枠5が着脱可能に設けられ、また、外周面にはこの器具本体2を天井3に固定するための複数の板ばね6が取り付けられている。これらの板ばね6は、図1において仮想線で示すように内方に撓まされた状態で器具本体2とともに天井3の開口部4に挿入され、その挿入後は自らの弾性により外側に復帰して開口部4の内面を圧接し、その圧接力により器具本体2を天井3に固定するように構成されている。
【0018】
器具本体2の内部には、端子台7と、点灯回路8と、電池9とが組み込まれている。前述の化粧枠5は、発光ダイオード光源Lとその上部空間との間を遮蔽する遮光板を兼ねた反射板5aと、この反射板5aの裏面に配設された複数のフィン5bとを一体に有し、放熱性の優れた合成樹脂やアルミニウムなどの金属材により形成されている。すなわち、背面にフィン5bが一体に形成された反射板5a及び化粧枠5は、発光ダイオード光源Lが発熱する熱が伝導されたときに、その熱を放熱するヒートシンクでもある。もちろん、反射板5aに対して熱的に接続されたヒートシンクを別個に設けても構わない。反射板5aの一面には、発光ダイオード光源Lからの光を器具本体2の開口面側に向けて反射する反射面5cが形成されている。また、反射板5aの下面には、熱伝導性が良好な材料により形成された筒状の熱伝導部10が設けられ、この熱伝導部10の内部には、発光ダイオード光源Lを点灯回路8又は電池9に選択的に接続するための接続部であるソケット11が熱伝導部10に対して熱的に接続された状態で設けられている。なお、熱伝導部10は、反射板5aと同一材料によって一体に連続させて形成してもよく、或いは、熱伝導性の高い材料により別個に形成されて反射板5aとは熱的に接続した構成でもよい。
【0019】
次に、図2を参照して発光ダイオード光源Lの構成について説明する。発光ダイオード光源Lは、前述したソケット11に螺合される螺子12が外周に形成された口金13と、この口金13の中心線上に配置された棒状の発光ダイオード支持体14と、口金13とは電気的に接続され発光ダイオード支持体14の口金13とは反対側の端面中心部に支持された一つの発光ダイオード15と、発光ダイオード15から発光される光を拡散する拡散領域部16を有する外囲器であるグローブ17とを具備する。このグローブ17は、拡散領域部16の頂部16aとは反対側の境界部16bから連続して形成したネック部16cにより口金13を封着状態で固定するように構成されている。
【0020】
本実施の形態における発光ダイオード支持体14は、例えばアルミニウムや銅など金属、それらを含む合金などの熱伝導性材料により形成され、口金13に対しては熱伝導性シリコン18により熱的に接続され、発光ダイオード15に対しては熱伝導性シリコン19により熱的に接続されている。
【0021】
ここで、発光ダイオード15はランバーシャンの配光曲線を有する。すなわち、図2において、発光ダイオード15から放射方向に示す矢印の長さは光の強度を示すもので、放射方向が口金13の中心線に近いほど光の強度が高く、放射方向の中心線に対する角度が広がるほど弱くなる。グローブ17の拡散領域部16の外形形状は発光ダイオード15の配光曲線に相似する略球形の形状に定められている。この拡散領域部16の内面には光の拡散面を得るために梨地処理が施されている。そして、発光ダイオード15は、ネック部16cと拡散領域部16との間に形成される境界部16bに配置されている。
【0022】
口金13と発光ダイオード支持体14とを熱的に接続する手段は、図2に示すように、両者の間を例えば熱伝導性シリコン18などの熱伝導材料を介して接続する手段の他に、両者を直接接触させる手段を含む。後者の場合は、図3に示すように、口金13の螺子12に螺合する螺子14aを発光ダイオード支持体14に形成することにより、口金13と発光ダイオード支持体14との接触面積を拡大する構成を採用することが熱伝導性の面で好ましい。
【0023】
本実施の形態におけるグローブ17は、口金13に固定されるためのネック部16cが長い円筒形状の部分を有するために洋梨型の形状となっているが、ネック部16cは口金13に固定されるためのものであるため、円筒形状の部分を有しないネック部を拡散領域部16の境界部16bに連続して形成した略球形形状のグローブを用いてもよい。この場合でも発光ダイオード15をネック部16cと拡散領域部16との間に形成される境界部16bの近傍に配置するように、発光ダイオード支持体14の長さを決定する。
【0024】
このような構成において、発光ダイオード光源Lの口金13は発光ダイオード照明器具1のソケット11に接続され、点灯回路8を介して商用電源に接続されて発光するが、停電などの非常時には電池9に接続されて発光する。
【0025】
この場合、発光ダイオード15はランバーシャンの配光曲線を有し、グローブ17の拡散領域部16の外形形状は発光ダイオード15の配光曲線に相似する略球形の形状に定められ、発光ダイオード15はネック部16cと拡散領域部16との境界部16bの近傍に配置されているので、ランバーシャンの配光曲線を有する発光ダイオード15の出力がそのままグローブ17上に投影される。したがって、グローブ17の拡散領域部16を略均等拡散発光させることができる。
【0026】
さらに、発光ダイオード支持体14は熱伝導性材料により形成され、一端が口金13に熱的に接続され他端が発光ダイオード15に熱的に接続されているので、発光ダイオード15の熱を発光ダイオード支持体14を介して口金13に伝導させる簡単な構造で発光ダイオード15の温度を下げることができる。これにより、発光ダイオード15を、そのジャンクション温度の最大定格値内で、一定温度で発光させることができる。さらに、口金13に伝導された熱を反射板5aでもあるヒートシンクに伝導して放熱させることができ、反射板5aから化粧枠5を介して板金製の器具本体2に伝導して放熱させることができるので、発光ダイオード15に生ずる熱の放熱作用をさらに促進することができ、したがって、定格電流以上の電流を発光ダイオード光源Lに通電して照明のための光量を高めることができる。
【0027】
【発明の効果】
請求項1記載の発光ダイオード光源によれば、発光ダイオードはランバーシャンの配光曲線を有し、外囲器の拡散領域部の外形形状は発光ダイオードの配光曲線に相似する略球形の形状に定められ、発光ダイオードはネック部と拡散領域部との間に形成された境界部近傍に配置されているので、ランバーシャンの配光曲線を有する発光ダイオードの出力そのまま外囲器上に投影されるため、外囲器を略均等拡散発光させることができる。
【0028】
請求項2記載の発明によれば、請求項1記載の発光ダイオード光源において、発光ダイオード支持体は熱伝導性材料により形成され、一端が口金に熱的に接続され他端が発光ダイオードに熱的に接続されているので、発光ダイオードの熱を発光ダイオード支持体を介して口金に伝導させる簡単な構造で発光ダイオードの温度を下げることができる。これにより、発光ダイオードを、そのジャンクション温度の最大定格値内で、一定温度で発光させることができ、したがって、発光ダイオード光源の出力を安定させ、寿命を延長させることができる。
【0029】
請求項3記載の発光ダイオード照明器具によれば、請求項1又は2記載の発光ダイオード光源の発光ダイオードから口金を介して接続部に伝導される熱を放熱するヒートシンクを具備するので、発光ダイオード光源の放熱をさらに促進することができ、したがって、定格電流以上の電流を発光ダイオード光源に通電して照明のための光量を高めることができる。
【図面の簡単な説明】
【図1】本発明の一実施の形態における発光ダイオード照明器具の縦断側面図である。
【図2】一部を断面にして示す発光ダイオード光源の側面図である。
【図3】一部を断面にして示す発光ダイオード光源の側面図である。
【符号の説明】
2:器具本体、5,5a:ヒートシンク、8:点灯回路、11:接続部、13:口金、14:発光ダイオード支持体、15:発光ダイオード、16:拡散領域部、16b:境界部、16c:ネック部、17:外囲器、L:発光ダイオード光源
[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a light-emitting diode light source and a light-emitting diode illuminator that emit light from a light-emitting diode provided in an envelope sealed to a base.
[0002]
[Prior art]
Conventionally, a light emitting diode light source that emits light from a light emitting diode provided in an envelope sealed to a base is known (see Patent Document 1 and Patent Document 2).
[0003]
[Patent Document 1]
Japanese Utility Model Publication No. 4-16455 [Patent Document 2]
JP-T-2002-525814 [Problems to be Solved by the Invention]
Since the light-emitting diode light sources described in Patent Document 1 and Patent Document 2 have a structure including a plurality of light-emitting diodes in an envelope called a bulb or the like, the light distribution of the light-emitting diodes is determined by the surface area of the light-emitting diodes. When projecting onto a diffusing surface having a larger surface area (inner surface of the envelope), uneven brightness occurs and it is not easy to cause the envelope to uniformly diffuse light emission.
[0004]
In addition, when the amount of heat generated per unit area (volume) of the light emitting diode increases, the temperature inside the sealed envelope rises, and as a result, the maximum rated value of the junction temperature of the light emitting diode is exceeded. Cannot light up the light emitting diode.
[0005]
An object of the present invention is to provide a light-emitting diode light source that can uniformly diffuse light emission in an envelope and that can dissipate heat from the light-emitting diode with a simple structure to pass a rated current.
[0006]
An object of the present invention is to provide a light-emitting diode illuminating device that further promotes the heat radiation action of a light-emitting diode light source and can pass a current higher than a rated current to the light-emitting diode light source.
[0007]
[Means for Solving the Problems]
The light-emitting diode light source according to claim 1, a base; a light-emitting diode support disposed so as to project from the base onto a center line of the base; and electrically connected to the base; A light emitting diode disposed on the opposite side of the base; a neck portion fixed so as to cover the light emitting diode support protruding from the base; a diffusion region portion for diffusing light emitted from the light emitting diode; And a translucent envelope having a boundary portion formed between the neck portion and the diffusion region portion; and the light-emitting diode is closer to the center line of the base and emits light. A light distribution curve of a Lambertian in a direction of increasing strength, and an outer shape of the diffusion region portion of the envelope is determined to be a substantially spherical shape similar to the light distribution curve of the light emitting diode; The ode is disposed in the vicinity of the boundary portion.
[0008]
Here, the translucent envelope includes those formed of synthetic resin, glass, earthenware, or the like. Further, the vicinity of the boundary means a range in which light emitted from the light emitting diodes can be diffused substantially uniformly.
[0009]
Therefore, since the output of the light emitting diode having the Lambertian light distribution curve can be projected onto the envelope as it is, the envelope can be caused to emit light substantially uniformly.
[0010]
According to a second aspect of the present invention, in the light emitting diode light source according to the first aspect, the light emitting diode support is formed of a heat conductive material, one end is thermally connected to the base, and the other end is heated to the light emitting diode. Connected.
[0011]
Here, the base and the light emitting diode support include those formed of a metal such as aluminum or copper, or an alloy combining any one of aluminum and copper. The means for thermally connecting the base and the light emitting diode support includes means for connecting the two via a heat conductive material, and means for bringing both into direct contact. In the latter case, it is preferable in terms of thermal conductivity to adopt a structure in which screws are formed and screwed together to expand the contact area. Further, the means for thermally connecting the light emitting diode support and the light emitting diode includes means for connecting the two via a heat conducting material. Thermally conductive material that thermally connects between the base and the light emitting diode support and between the light emitting diode support and the light emitting diode is dimethyl silicon, methylphenyl silicon, alkyl-modified silicon or fluorosilicon, It contains thermally conductive silicon containing a metal oxide such as zinc oxide.
[0012]
Therefore, the temperature of the light emitting diode can be lowered with a simple structure in which the heat of the light emitting diode is conducted to the base via the light emitting diode support.
[0013]
A light-emitting diode illuminator according to claim 3 is the light-emitting diode light source according to claim 1 or 2; a lighting circuit connected to a power source; and a connection part for connecting the base of the light-emitting diode light source to the lighting circuit; A heat sink that dissipates heat conducted from the light emitting diode of the light emitting diode light source to the connecting portion through the base; and contains the light emitting diode light source connected to the connecting portion, the heat sink, and the lighting circuit. An instrument body;
[0014]
Here, the heat sink includes a structure integrally formed of the same material as that of the reflection plate that reflects light from the light-emitting diode light source.
[0015]
Therefore, heat dissipation of the light emitting diode light source can be promoted, and a current exceeding the rated current can be supplied to the light emitting diode light source.
[0016]
DETAILED DESCRIPTION OF THE INVENTION
An embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a longitudinal side view of a light-emitting diode illuminating device, FIG. 2 is a side view of a light-emitting diode light source shown in partial cross-section, and FIG. 3 is a side view of the light-emitting diode light source shown in partial cross-section.
[0017]
An instrument body 2 made of sheet metal, which is one component of the light-emitting diode illuminator 1, is formed in a cylindrical shape having an open lower surface so that it can be attached to the opening 4 of the ceiling 3. The appliance body 2 is detachably provided with a decorative frame 5 that is in contact with the periphery of the opening 4 of the ceiling 3, and a plurality of plates for fixing the appliance body 2 to the ceiling 3 on the outer peripheral surface. A spring 6 is attached. These leaf springs 6 are inserted into the opening 4 of the ceiling 3 together with the instrument body 2 in a state of being bent inward as indicated by phantom lines in FIG. Then, the inner surface of the opening 4 is pressed and the instrument main body 2 is fixed to the ceiling 3 by the pressing force.
[0018]
A terminal block 7, a lighting circuit 8, and a battery 9 are incorporated in the appliance body 2. The decorative frame 5 includes a reflector 5a that also serves as a light-shielding plate that shields between the light-emitting diode light source L and its upper space, and a plurality of fins 5b that are disposed on the back surface of the reflector 5a. It is made of a metal material such as synthetic resin or aluminum having excellent heat dissipation. That is, the reflector 5a and the decorative frame 5 in which the fins 5b are integrally formed on the back surface are heat sinks that dissipate heat when heat generated by the light emitting diode light source L is conducted. Of course, you may provide the heat sink thermally connected with respect to the reflecting plate 5a separately. On one surface of the reflection plate 5a, a reflection surface 5c that reflects light from the light-emitting diode light source L toward the opening surface side of the instrument body 2 is formed. Further, a cylindrical heat conduction part 10 made of a material having good heat conductivity is provided on the lower surface of the reflecting plate 5a. Inside the heat conduction part 10, a light emitting diode light source L is connected to the lighting circuit 8. Or the socket 11 which is a connection part for selectively connecting with the battery 9 is provided in the state thermally connected with respect to the heat conductive part 10. FIG. The heat conduction part 10 may be integrally formed of the same material as that of the reflector 5a, or may be separately formed of a material having high heat conductivity and thermally connected to the reflector 5a. It may be configured.
[0019]
Next, the configuration of the light-emitting diode light source L will be described with reference to FIG. The light-emitting diode light source L includes a base 13 in which a screw 12 screwed into the socket 11 described above is formed on the outer periphery, a bar-shaped light-emitting diode support 14 disposed on the center line of the base 13, and the base 13. One light emitting diode 15 that is electrically connected and supported at the center of the end surface opposite to the base 13 of the light emitting diode support 14, and a diffusion region portion 16 that diffuses light emitted from the light emitting diode 15. And a glove 17 serving as an envelope. The globe 17 is configured to fix the base 13 in a sealed state by a neck portion 16 c formed continuously from a boundary portion 16 b opposite to the top portion 16 a of the diffusion region portion 16.
[0020]
The light emitting diode support 14 in the present embodiment is formed of a heat conductive material such as a metal such as aluminum or copper, or an alloy containing them, and is thermally connected to the base 13 by a heat conductive silicon 18. The light-emitting diode 15 is thermally connected by a heat conductive silicon 19.
[0021]
Here, the light emitting diode 15 has a Lambertian light distribution curve. That is, in FIG. 2, the length of the arrow from the light emitting diode 15 in the radiation direction indicates the light intensity. The closer the radiation direction is to the center line of the base 13, the higher the light intensity is. It becomes weaker as the angle increases. The outer shape of the diffusion region portion 16 of the globe 17 is determined to be a substantially spherical shape similar to the light distribution curve of the light emitting diode 15. The inner surface of the diffusion region 16 is subjected to a satin finish to obtain a light diffusion surface. The light emitting diode 15 is disposed at a boundary portion 16 b formed between the neck portion 16 c and the diffusion region portion 16.
[0022]
As shown in FIG. 2, the means for thermally connecting the base 13 and the light-emitting diode support 14 includes a means for connecting the two via a thermally conductive material such as thermally conductive silicon 18, for example. Means for bringing them into direct contact. In the latter case, as shown in FIG. 3, the contact area between the base 13 and the light emitting diode support 14 is increased by forming a screw 14 a that engages with the screw 12 of the base 13 on the light emitting diode support 14. It is preferable in terms of thermal conductivity to adopt the configuration.
[0023]
The glove 17 in the present embodiment has a pear-shaped shape because the neck portion 16 c for fixing to the base 13 has a long cylindrical portion, but the neck portion 16 c is fixed to the base 13. Therefore, a substantially spherical glove in which a neck portion having no cylindrical portion is formed continuously with the boundary portion 16b of the diffusion region portion 16 may be used. Even in this case, the length of the light emitting diode support 14 is determined so that the light emitting diode 15 is disposed in the vicinity of the boundary portion 16b formed between the neck portion 16c and the diffusion region portion 16.
[0024]
In such a configuration, the base 13 of the light-emitting diode light source L is connected to the socket 11 of the light-emitting diode illuminator 1 and is connected to a commercial power source via the lighting circuit 8 to emit light. Connected and emits light.
[0025]
In this case, the light emitting diode 15 has a Lambertian light distribution curve, and the outer shape of the diffusion region portion 16 of the globe 17 is determined to be a substantially spherical shape similar to the light distribution curve of the light emitting diode 15. Since it is arranged in the vicinity of the boundary portion 16b between the neck portion 16c and the diffusion region portion 16, the output of the light emitting diode 15 having a Lambertian light distribution curve is projected onto the globe 17 as it is. Therefore, the diffusion region portion 16 of the globe 17 can emit light with substantially uniform diffusion.
[0026]
Further, the light emitting diode support 14 is made of a heat conductive material, and one end is thermally connected to the base 13 and the other end is thermally connected to the light emitting diode 15. The temperature of the light emitting diode 15 can be lowered with a simple structure conducted to the base 13 through the support 14. Thereby, the light emitting diode 15 can be made to emit light at a constant temperature within the maximum rated value of the junction temperature. Furthermore, the heat conducted to the base 13 can be conducted to the heat sink which is also the reflector 5a to be dissipated, and can be conducted from the reflector 5a through the decorative frame 5 to the sheet metal fixture body 2 to be dissipated. Therefore, the heat radiation effect of the heat generated in the light-emitting diode 15 can be further promoted, and therefore, the light amount for illumination can be increased by supplying a current equal to or higher than the rated current to the light-emitting diode light source L.
[0027]
【The invention's effect】
According to the light emitting diode light source of claim 1, the light emitting diode has a Lambertian light distribution curve, and the outer shape of the diffusion region portion of the envelope has a substantially spherical shape similar to the light distribution curve of the light emitting diode. Since the light emitting diode is arranged in the vicinity of the boundary formed between the neck portion and the diffusion region portion, the output of the light emitting diode having the Lambertian light distribution curve is projected directly onto the envelope. Therefore, the envelope can emit light with substantially uniform diffusion.
[0028]
According to a second aspect of the present invention, in the light emitting diode light source according to the first aspect, the light emitting diode support is formed of a thermally conductive material, one end is thermally connected to the base, and the other end is thermally connected to the light emitting diode. Therefore, the temperature of the light emitting diode can be lowered with a simple structure in which the heat of the light emitting diode is conducted to the base via the light emitting diode support. Accordingly, the light emitting diode can emit light at a constant temperature within the maximum rated value of the junction temperature, and thus the output of the light emitting diode light source can be stabilized and the life can be extended.
[0029]
According to the light-emitting diode illuminator according to claim 3, the light-emitting diode light source includes the heat sink that dissipates heat conducted from the light-emitting diode of the light-emitting diode light source according to claim 1 to the connection portion through the base. Therefore, it is possible to further increase the amount of light for illumination by energizing the light emitting diode light source with a current equal to or higher than the rated current.
[Brief description of the drawings]
FIG. 1 is a longitudinal side view of a light-emitting diode luminaire according to an embodiment of the present invention.
FIG. 2 is a side view of a light-emitting diode light source partially shown in cross section.
FIG. 3 is a side view of a light emitting diode light source partially shown in cross section.
[Explanation of symbols]
2: instrument body, 5, 5a: heat sink, 8: lighting circuit, 11: connection part, 13: base, 14: light emitting diode support, 15: light emitting diode, 16: diffusion region part, 16b: boundary part, 16c: Neck part, 17: envelope, L: light emitting diode light source

Claims (3)

口金と;
前記口金から前記口金の中心線上に突出するように配置された発光ダイオード支持体と;
前記口金と電気的に接続され、前記発光ダイオード支持体の前記口金とは反対側に配置された発光ダイオードと;
前記口金から突出している前記発光ダイオード支持体を覆うように固定されるネック部、前記発光ダイオードから発光される光を拡散する拡散領域部、及び前記ネック部と前記拡散領域部との間に形成される境界部を有してなる透光性の外囲器と;
を具備し、
前記発光ダイオードは前記口金の中心線に近いほど光の強度が高くなる方向のランバーシャンの配光曲線を有し、
前記外囲器の前記拡散領域部の外形形状は前記発光ダイオードの配光曲線に相似する略球形の形状に定められ、
前記発光ダイオードは前記境界部近傍に配置されていることを特徴とする発光ダイオード光源。
With a base;
A light emitting diode support disposed so as to protrude from the base to a center line of the base ;
A light emitting diode electrically connected to the base and disposed on the opposite side of the light emitting diode support from the base;
A neck portion that is fixed so as to cover the light emitting diode support protruding from the base, a diffusion region portion that diffuses light emitted from the light emitting diode, and a portion formed between the neck portion and the diffusion region portion A translucent envelope having a bounded boundary;
Comprising
The light emitting diode has a Lambertian light distribution curve in a direction in which the intensity of light increases as it approaches the center line of the base ,
The outer shape of the diffusion region portion of the envelope is determined to be a substantially spherical shape similar to the light distribution curve of the light emitting diode,
The light emitting diode light source, wherein the light emitting diode is disposed in the vicinity of the boundary portion.
前記発光ダイオード支持体は熱伝導性材料により形成され、一端が前記口金に熱的に接続され他端が前記発光ダイオードに熱的に接続されている請求項1記載の発光ダイオード光源。  The light emitting diode light source according to claim 1, wherein the light emitting diode support is formed of a heat conductive material, and one end is thermally connected to the base and the other end is thermally connected to the light emitting diode. 請求項1又は2記載の発光ダイオード光源と;
電源に接続される点灯回路と;
前記発光ダイオード光源の前記口金を前記点灯回路に接続する接続部と;
前記発光ダイオード光源の前記発光ダイオードから前記口金を介して前記接続部に伝導される熱を放熱するヒートシンクと;
前記接続部に接続される前記発光ダイオード光源と前記ヒートシンクと前記点灯回路とを収容する器具本体と;
を具備する発光ダイオード照明器具。
A light-emitting diode light source according to claim 1 or 2;
A lighting circuit connected to the power supply;
A connecting portion for connecting the base of the light emitting diode light source to the lighting circuit;
A heat sink that dissipates heat conducted from the light emitting diode of the light emitting diode light source to the connecting portion through the base;
An instrument body that houses the light-emitting diode light source, the heat sink, and the lighting circuit connected to the connection portion;
A light-emitting diode luminaire comprising:
JP2002354829A 2002-12-06 2002-12-06 Light emitting diode light source and light emitting diode lighting fixture Expired - Fee Related JP4135485B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002354829A JP4135485B2 (en) 2002-12-06 2002-12-06 Light emitting diode light source and light emitting diode lighting fixture

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002354829A JP4135485B2 (en) 2002-12-06 2002-12-06 Light emitting diode light source and light emitting diode lighting fixture

Publications (2)

Publication Number Publication Date
JP2004186109A JP2004186109A (en) 2004-07-02
JP4135485B2 true JP4135485B2 (en) 2008-08-20

Family

ID=32755695

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002354829A Expired - Fee Related JP4135485B2 (en) 2002-12-06 2002-12-06 Light emitting diode light source and light emitting diode lighting fixture

Country Status (1)

Country Link
JP (1) JP4135485B2 (en)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10340424B2 (en) 2002-08-30 2019-07-02 GE Lighting Solutions, LLC Light emitting diode component
JP4684140B2 (en) * 2005-04-26 2011-05-18 株式会社デンネツ Illumination device
US9412926B2 (en) 2005-06-10 2016-08-09 Cree, Inc. High power solid-state lamp
JP2007042938A (en) * 2005-08-04 2007-02-15 Nichia Chem Ind Ltd Optical device
JP4702063B2 (en) * 2006-01-11 2011-06-15 パナソニック電工株式会社 Luminescent panel unit
JP5019264B2 (en) * 2008-02-29 2012-09-05 東芝ライテック株式会社 Light emitting element lamp and lighting apparatus
JP5290670B2 (en) * 2008-09-04 2013-09-18 パナソニック株式会社 lamp
US8430534B2 (en) 2008-09-16 2013-04-30 Koninklijke Philips Electronics N.V. LED lamp and method for producing the same
TW201018842A (en) * 2008-11-13 2010-05-16 Yeh Chiang Technology Corp LED lamp
US8491162B2 (en) 2009-01-14 2013-07-23 Zhongshan Weiqiang Technology Co., Ltd. LED lamp
JP5360965B2 (en) * 2009-01-27 2013-12-04 パナソニック株式会社 lighting equipment
TW201041426A (en) * 2009-05-08 2010-11-16 zhi-ming You LED lamp and manufacturing method thereof
JP2011044412A (en) * 2009-08-24 2011-03-03 Toshiba Lighting & Technology Corp Lighting fixture
US8593040B2 (en) 2009-10-02 2013-11-26 Ge Lighting Solutions Llc LED lamp with surface area enhancing fins
US8414151B2 (en) 2009-10-02 2013-04-09 GE Lighting Solutions, LLC Light emitting diode (LED) based lamp
US9103507B2 (en) 2009-10-02 2015-08-11 GE Lighting Solutions, LLC LED lamp with uniform omnidirectional light intensity output
JP5066753B2 (en) * 2009-10-19 2012-11-07 業強科技股▲分▼有限公司 Light emitting diode downlight
US8541933B2 (en) * 2010-01-12 2013-09-24 GE Lighting Solutions, LLC Transparent thermally conductive polymer composites for light source thermal management
US20130147348A1 (en) * 2010-10-22 2013-06-13 Panasonic Corporation Mounting board, light emitting device and lamp
JP5826503B2 (en) * 2011-03-04 2015-12-02 株式会社小糸製作所 LED bulb
US9500355B2 (en) 2012-05-04 2016-11-22 GE Lighting Solutions, LLC Lamp with light emitting elements surrounding active cooling device
JP2014139954A (en) * 2014-05-07 2014-07-31 zhi-ming You Led light and production method thereof
CN116314096B (en) * 2023-02-16 2023-12-08 滨海治润电子有限公司 High-precision diode

Also Published As

Publication number Publication date
JP2004186109A (en) 2004-07-02

Similar Documents

Publication Publication Date Title
JP4135485B2 (en) Light emitting diode light source and light emitting diode lighting fixture
JP5030661B2 (en) Lighting device
US20060193130A1 (en) LED lighting system
JP3197657U (en) Car led light
JP2001243809A (en) Led electric bulb
KR20110108269A (en) Led lighting module and lighting lamp using the same
JP2004179048A (en) Led lighting unit and led lighting device
JP2009170114A (en) Led bulb and luminaire
KR101049162B1 (en) Tube type led lamp assembly
TWM423207U (en) Heat-dissipation structure for light bulb
TW201105898A (en) Luminous module and lighting apparatus
JP4286528B2 (en) LED lighting device
KR20100118136A (en) Semiconductor solid illuminator and the method thereof
KR20100020748A (en) Illuminating systems
GB2432416A (en) Improved desk lamp with heat dissipation means
KR101020623B1 (en) Led lighting apparatus
JP2014524116A (en) Lighting device with carrier and envelope
KR200479710Y1 (en) Multicolor interior light using LED
JP2011181252A (en) Lighting fixture
JP5469398B2 (en) LED lighting fixtures
KR100938888B1 (en) One body type led light apparatus
KR100972981B1 (en) Head lamp module using LED and head lamp apparatus having the same
JP2013008582A (en) Lamp device
JP2010123552A (en) Luminaire
TWM325448U (en) Improved structure on LED projecting lamp

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20050311

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20071114

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20071122

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20080118

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20080513

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20080526

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110613

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110613

Year of fee payment: 3

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110613

Year of fee payment: 3

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110613

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120613

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120613

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130613

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130613

Year of fee payment: 5

LAPS Cancellation because of no payment of annual fees