JP2014139954A - Led light and production method thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an LED light and a production method thereof.SOLUTION: An LED light which can directly replace a traditional tungsten, halogen, and energy bulb includes a light core having at least one LED device, a heat conductive insulation material which is filled in a hollow of a base, and one electrode which is mechanically in contact with the light core and the base. When power of the LED device is turned on, the heat conductive insulation material provides a thermal passage and radiates heat by transmitting the thermal energy from the light core to the electrode. The LED light can be directly inserted into a bulb socket of a general lighting fixture, and it is not necessary to exchange the original lighting fixture system and add an adapter.

Description

  The present invention relates to a lamp, and more particularly, to a light emitting diode (LED) light that can directly replace traditional tungsten, halogen, and energy saving bulbs.

  An LED light having a direct current LED device as a light core material has to convert alternating current power into direct current power using a rectifier or a converter (power converter) and supply the direct current LED device to the direct current LED device. Cost is high. Also, due to the large volume of the converter, it is very difficult to hide completely in the standard base of a traditional bulb, and a separate mold has been developed, and different components from the traditional bulb Need to make. Therefore, the cost is increased and the volume of the LED light is increased. When the DC LED device is energized, heat energy is generated. Therefore, it is necessary to design a heat dissipation mechanism and process the heat energy. When effective heat dissipation is not possible, due to the high temperature, disadvantageous effects such as a decrease in light emission efficiency of LED, a reduction in lifetime, and a wavelength shift are caused. The converter also generates thermal energy in the process of converting AC power to DC power. In particular, when an inductor and an integrated circuit (IC) in the converter are damaged by high temperatures, May stop working. In high-efficiency applications, for example, lighting applications, the problem caused by insufficient heat dissipation is even more serious because the thermal energy produced by the DC LED device is relatively high. Some products use two low-efficiency lamp type LEDs and a simple bridge rectifier to facilitate adaptation to traditional small-volume bases. However, low-efficiency LEDs usually have low brightness, limited market acceptance, and this type of product often has poor heat dissipation, so the light decay phenomenon is severe.

  In recent years, technology using an AC LED device has matured day by day, and its brightness has been increasing day by day, and has already been provided with commercial use value. An AC LED device is a series of parallel LED devices manufactured on the same epitaxial chip, and after the epitaxial chip is packaged, a series resistor having a certain resist value has a high resistance such as 110 volts or 220 volts. Directly accepting voltage usage eliminates the need for converters or rectifiers required by DC LED devices, effectively reducing cost and reducing circuit quality problems. Although AC LED devices can be conveniently applied in small volume spaces, there are still heat dissipation problems to be solved. Particularly in high-efficiency applications, for example, the heat energy generated by lights for lighting use is relatively high, and if a heat sink is added, the volume and cost of the LED lights will be increased. Failing to support the heat dissipation of the AC LED device would reduce the luminous efficiency of the LED, reduce its lifetime, shift the wavelength, and in severe cases damage the LED epitaxial chip with heat.

  One of the objects of the present invention is to provide an LED light that enhances the heat dissipation of the LED device.

  Another object of the present invention is to provide an LED light that can directly replace traditional tungsten, halogen, and energy saving bulbs.

  It is a further object of the present invention to provide a method for manufacturing an LED light. An LED light according to the present invention includes a light core provided with at least one LED device, a base provided with a cavity, and a thermally conductive insulator, which is filled in the light core. And one electrode in mechanical contact with the base. When the LED device is energized, the thermally conductive insulating material provides a thermal channel and dissipates heat energy transferred from the light core to the electrode.

  Since the base of the present invention uses a traditional light bulb base, the LED light is directly inserted into a socket of a general light fixture, and there is no need to replace the original light fixture system or install an additional adapter. .

The present invention also provides several methods for manufacturing LED lights. It includes solder joints for circuit members to the base and filling to make the heat-conducting insulating material in the cavity of the base. The heat conductive insulating material is brought into mechanical contact with one electrode of the light core and the base.

  The LED light and the manufacturing method thereof according to the present invention are particularly effective in directly replacing traditional tungsten, halogen, and energy saving bulbs.

It is a 1st Example figure of this invention. It is an equivalent circuit schematic of the LED light of FIG. It is several types of alternating current LED epitaxial chip diagrams. It is a 2nd Example figure of this invention. It is a 3rd Example figure of this invention. It is a light core figure of many epitaxial chips. It is a 4th Example figure of this invention. It is a 5th Example figure of this invention. It is a 6th Example figure of this invention. It is a 7th Example figure of this invention. It is an 8th Example figure of this invention. FIG. 12 is an equivalent circuit diagram of the LED light of FIG. 11. It is a 9th Example figure of this invention. FIG. 14 is an equivalent circuit diagram of the LED light of FIG. 13.

  FIG. 1 shows a first embodiment of the present invention. In order to clarify the characteristics of the present invention, in the present embodiment, a standard cap 10 for a small light bulb is used, and the electrode 12 and the electrode 14 provided for it are connected to an AC power source. As those skilled in the art are familiar, the electrode 12 is a metal shell with a helical profile 16 with a hollow 18 inside. In this embodiment, an AC LED device 20 having a light core is used, which fixes an AC LED epitaxial chip 22 on a support portion 24 and covers a seal 26 thereon. The package of the LED is a known technology, and in order to simplify the drawing, the details of the package structure of the AC LED device 20 are not shown here. One end of the resistor 30 is soldered to the electrode 14, the other end is soldered to the LED device 20 by the lead-in wire 32, and both ends of the lead-in wire 34 are soldered to the electrode 12 and the AC LED device 20, respectively. The equivalent circuit of the LED light is as shown in FIG. 2, and the AC LED epitaxial chip 22 and the resistor 30 are connected in parallel between the electrode 12 and the electrode 14. As those skilled in the art are familiar with, so-called AC LED epitaxial chips have two LEDs arranged in opposite directions in parallel between two joint legs, with at least one in each direction. Two LEDs provided with LEDs and arranged in opposite directions are caused to emit light in the positive and negative half cycles of the AC power supply. The size of the resist value R of the register 30 is selected based on the current value required by the design. The resistor 30 also has a function of protecting the AC LED epitaxial chip 22, and when the AC power source connected to the electrode 12 and the electrode 14 is exceeded, the resistor 30 absorbs most of the surge voltage. Returning to FIG. 1, one of the features of the present invention is that the hollow 18 is filled with a heat conductive insulating material 36, which is in mechanical contact with the support 24 and the electrode 12, provides a heat path, and AC. The LED epitaxial chip 22 transmits heat energy generated by energized light emission to the electrode 12 to dissipate heat. As those skilled in the art are familiar with, the support portion 24 typically includes a piece of metal that aids heat dissipation in the AC LED epitaxial chip 22. Then, the support part 24 is bonded on the heat conductive insulating material 36, and a favorable heat conduction effect is acquired. In addition to helping heat dissipation of the AC LED epitaxial chip 22, the heat conductive insulating material 36 also helps heat dissipation of the register 30, so that the resistor 30 is embedded in the heat conductive insulating material 36.

The heat conductive insulating material 36 is an epoxy resin, for example, aluminum oxide, aluminum nitride, boron nitride, or other heat conductive powder of heat conductive material, or epoxy resin and heat. A mixture of conductive powders. Table 1 shows the results actually measured using three different heat conductive materials for the LED light of FIG.

  As can be seen from the measurement results in Table 1, the heat conduction insulating material 36 employing an epoxy resin has a poor heat conduction coefficient, so that the overall temperature after energization is relatively high. Since the heat conduction insulating material 36 in which the epoxy resin and the heat conduction powder are mixed has a good heat conduction effect, no abnormality was found in the lighting test. The heat conductive insulating material 36, which was directly filled with the heat conductive powder, had a good heat conductive effect. Overall, the LED light has a good brightness of the output light, and no abnormalities are found even when it is lit for 1000 hours continuously. It is also possible to select other materials as the heat conductive insulating material 36, and their thermal conductivity is between 0.25 and 30 W / mk.

Traditional bulbs use standard caps, for example E12, E14, E17, E26 and E27 are the caps of traditional tungsten bulbs, MR16 and GU10 are the traditional halogen bulbs. (bulb). Table 2 shows the actual measurement results using the standard bases E12 and E27 in the LED light of FIG.

  As shown in Table 2, the LED light shown in FIG. 1 has good brightness of the output light in either the E12 base having a relatively small volume or the E27 base having a relatively large volume. No abnormalities were observed when the lamp was lit for 1000 hours. Therefore, the thermal energy generated by the AC LED epitaxial chip 22 is effectively transmitted to the electrode 12 and is radiated. As shown in FIG. 1, the size of the LED light is almost the same as that of the standard base 10, has a good heat dissipation capability, and realizes a high-efficiency application that cannot be achieved by a known technique. In the base of a traditional halogen bulb, one electrode is a columnar metal shell that separates the object to be insulated from the other electrode. Some standard caps use two pin electrodes that are insulated from each other. Traditional tungsten light bulbs, halogen light bulb bases or other standard bases are both hollow and can be filled with a heat-conducting insulation so that at least one electrode helps dissipate the light core of the LED light. The electrode of the base is exposed in the outward direction and provides a good heat dissipation effect.

  The LED light of FIG. 1 is manufactured using various processes. In one embodiment, first, all the circuit components are soldered, and then the heat conductive insulating material 36 is further filled in the hollow 18. The dose of the heat conductive insulating material 36 is filled up to the bottom of the support portion 24, and can be slightly increased until it exceeds the plane of the bottom of the support portion 24. If an epoxy resin or a mixture of epoxy resin and heat conductive powder is selected as the heat conductive insulating material 36, it is injected into the hollow 18 and then heated to be cured. If the heat conductive powder is selected as the heat conductive insulating material 36, after filling it into the hollow 18, it is made tight by applying pressure, and the heat conductive powder is mixed with silicon adhesive to make an adhesive body, It is also possible to heat and solidify after injecting into the hollow 18. In another embodiment, the lead wire 34 and the resistor 30 are first soldered to the electrode 12 and the electrode 14, and then the heat conductive insulating material 36 is filled into the hollow 18. The lead wire 32 and the end of the lead wire 34 are exposed to the outside of the heat conductive insulating material 36, and the AC LED device 20 is bonded to the upper surface of the heat conductive insulating material 36. Finally, the lead wire 32 and the lead wire 32 are introduced. The wire 34 is soldered to the AC LED device 20. When it is necessary to solidify the heat conductive insulating material 36, heating can be performed before or after bonding to the AC LED device 20.

  It is also possible to improve the brightness of the LED light by selecting the AC LED epitaxial chip 22 containing a large amount of LEDs. FIG. 3 shows several types of AC LED epitaxial chips 22. In the first type, two LEDs in opposite directions are juxtaposed between two joint legs, each having two or more LEDs. In the second type, two or more pairs of LEDs are connected in series between two joint legs, and two LEDs in opposite directions are juxtaposed together on each pair of LEDs. In the third type, five or more LEDs are arranged in a bridge structure. These commodities that are all commercialized can be selected and used.

  FIG. 4 is a second embodiment of the present invention. The light core of the present embodiment includes a circuit board 28 and an AC LED device 20 thereon, and the AC LED device 20 includes at least one AC LED epitaxial chip 22. A series resistor 38 is modified and mounted on the circuit board 28, and the circuit board 28 is connected between the electrode 12 and the electrode 14 by an introduction line 34 and an introduction line 32. The circuit board 28 can select the member of a reinforced glass fiber (FR4) or a metal substrate (IMS). The AC LED device 20 and the series register 38 are selected from a surface mounted device (SMD) and mounted on the circuit board 28 by using a surface mounting technology (SMT). Since the resistor 38 is soldered on the circuit board 28, the elasticity of the application can be expanded by using a variable resistor, for example, conveniently adjusting the current value passing through the AC LED device 20. When manufacturing the LED light, first, the AC LED device 20 and the series register 38 are soldered on the circuit board 28 and further joined to the base 10. In one embodiment, first, the lead-in wire 34 and lead-in wire 32 are soldered to the electrode 12, the electrode 14, and the circuit board 28, and the heat conductive insulating material 36 is filled in the hollow 18. The filling amount of the heat conductive insulating material 36 can be slightly increased until it contacts the bottom of the circuit board 28 and exceeds the plane of the bottom of the circuit board 28. If necessary, the heat conductive insulating material 36 is further heated and solidified. In another embodiment, first, the lead-in wire 34 and the lead-in wire 32 are soldered to the electrode 12 and the electrode 14, and then the heat conductive insulating material 36 is filled in the hollow 18. The ends of the lead wires 32 and 34 are exposed to the outside of the heat conductive insulating material 36, and the circuit board 28 is bonded to the upper surface of the heat conductive insulating material 36. Finally, the lead wires 32 and 34 are connected to each other. Solder to circuit board 28. If necessary, the heat conductive insulating material 36 can be solidified by heating before or after the circuit board 28 is bonded. The selection and manufacture of the heat conductive insulating material 36 is the same as in the embodiment of FIG. As those skilled in the art are familiar with, the bottom of the circuit board 28 usually includes a metal layer that helps dissipate heat. A heat conduction effect can be exhibited.

After the light core and the base 10 are joined, the light cover 40 is further added. The light cover 40 is selected from a glass cap, a plastic cap, an epoxy resin, and silicon. When a glass cap or a plastic cap is selected, it is bonded onto the end of the standard die 10 by a mechanical method such as adhesive bonding, knitting, or thread. If epoxy resin or silicon is selected, apply it on the light core. If the dose is sufficient, the circuit board 28 and all components on it can be completely encased. If necessary, heat and solidify. The light cover 40 is for the purpose of protection, and prevents external force applied to moisture, dust, or internal components of the LED light. The light cover 40 has a function of an optical component, and generates various necessary optical effects through methods such as atomization and geometric shape design. The foggy structure of the light cover 40 is manufactured by sand blasting, etching, electro-static powder coating, silicon coating, spray painting, or injection molding. Is done. Table 3 shows the results obtained by actually measuring the light cover 40 of several different materials.

  As shown in Table 3, good light output can be obtained even if any of glass cap, plastic cap, epoxy resin, and silicon is used for the light cover 40, and no abnormality is observed in the lighting test. Obviously understood. This is because the heat energy generated by the AC LED epitaxial chip 22 after energization is effectively transmitted to the outside through the heat conductive insulating material 36 and the electrode 12, and even if the light cover 40 is attached, there is no obvious influence on the heat dissipation. Is shown.

  FIG. 5 shows a third embodiment of the present invention. The light core of the LED light of the present embodiment includes an AC LED device 20, a circuit board 28, and a heat conductive component 50 (thermally conductive member). The AC LED device 20, the register 38, and the circuit board 28 are the same as those in the embodiment of FIG. 4, and the board surface provided at one end of the heat conducting component 50 is bonded onto the bottom surface of the circuit board 28, and the other end is heat conducting. It is embedded in the insulating material 36. The axial length of the heat conducting component 50 is 0.1 to 10 cm, and the best is 0.5 to 3.0 cm. The height of AC LED device 20 is adjusted using the depth in which it is embedded in heat conductive insulating material 36. The heat conducting component 50 is made of a high heat conductivity material. For example, it may be copper or other metal, and the shape thereof may be a columnar shape, a strip shape, or other shape. For the light cover 40, a glass cap or a plastic cap is selected. Regarding the manufacturing process of the LED light of this embodiment, first, the lead-in wire 34 and the lead-in wire 32 are soldered to the electrode 12 and the electrode 14, and then the heat conductive insulating material 36 is injected into the hollow 18. The end of the lead-in wire 32 is exposed to the outside of the heat conductive insulating material 36, and one end of the heat conductive component 50 is inserted into the heat conductive insulating material 36, and if necessary, heat is added to solidify the heat conductive insulating material 36. . Further, the circuit board 28 to which the AC LED device 20 and the register 38 are already attached is soldered on the surface of the heat conducting component 50, the lead-in wire 34 and the lead-in wire 32 are soldered to the circuit board 28, and finally the light cover. 40 is bonded onto the end of the base 10.

  If it is desired to improve the brightness of the LED light, more AC LED devices 20 can be connected in series, in parallel, or in series. The many epitaxial chip light cores shown in FIG. 6 have three rows of AC LED devices 20 arranged in parallel between the solder pads 52 and the solder pads 54 of the circuit board 28, and each row has three AC LED devices 20. ing. If the power of each AC LED device 20 is 1W, this light core reaches 9W.

  4, 5, and 6, the AC LED device 20 is bonded to the circuit board 28. However, the light core is changed, and AC is exchanged on the circuit board 28 using a chip on board (COB). It is also possible to mount the LED epitaxial chip 22. That is, the bare chip of the AC LED epitaxial chip 22 is directly bonded onto the circuit board 28, and the seal 26 is further covered after wire bonding.

  In the fourth embodiment of the present invention shown in FIG. 7, in addition to the resistor 30, a resistor 38 attached on the circuit board 28 is added, and the resistor 30 and the AC LED device 20 are arranged in parallel. The circuit board 28, the register 38, and the AC LED device 20 are made into one module, the size of the resist value of the register 38 is made to correspond to the design of the AC LED device 20, and the register 30 and the base 10 are connected to other modules. To do. If the module coupling is different, LED lights of different standards can be obtained. For example, if a similar register 30 and base 10 module are used, LED lights having different brightness and current values can be manufactured by simply combining different light cores and register 38 modules. The register 38 can also employ a variable register, and adjusts its registration value according to demand.

In the fifth embodiment of the present invention shown in FIG. 8, the AC LED device 20 is soldered on the surface of the heat conducting component 50, and the other end of the heat conducting component 50 is embedded in the heat conducting insulating material 36. The height of the AC LED device 20 is adjusted by the depth in which it is embedded in the heat conductive insulating material 36. In Table 4, the effect of using a copper column and a copper piece for the heat conductive component 50 was compared.

  As understood from the test results in Table 4, the design with the addition of copper pillars or copper pieces can transmit the heat energy generated by energization of the AC LED device 20 to the outside more quickly, and the brightness that the light source outputs can be increased. No abnormality was found even after lighting for 1000 hours continuously. In the LED light manufacturing method, first, the lead wire 34 and the resistor 30 are soldered to the electrode 12 and the electrode 14, and then the heat conductive insulating material 36 is injected into the hollow 18, and the ends of the lead wire 34 and the lead wire 32 are connected. Exposed outside the heat conductive insulating material 36, one end of the heat conductive component 50 is inserted into the heat conductive insulating material 36, and if necessary, the heat conductive insulating material 36 is solidified by adding heat. Further, after the AC LED device 20 has already been soldered on the surface of the heat conducting component 50, the lead-in wire 34 and the lead-in wire 32 are soldered to the joint foot portion 66 of the AC LED device 20, and finally the light cover 40 is attached. Join onto the end of the base 10. In another embodiment, the AC LED device 20 can be first soldered on the surface of the heat conductive component 50 before the heat conductive component 50 is inserted into the heat conductive insulating material 36.

  In the sixth embodiment of the present invention shown in FIG. 9, a circuit board 28 having a through hole 60 is used, one end of the heat conducting component 50 is disposed above the circuit board 28, and the other end is disposed. The AC LED device 20 is embedded in the heat conductive insulating material 36 through the perforations 60 and soldered onto the exposed end of the heat conductive component 50. The heat-conducting component 50 is provided with a long strip 56 and side wings 58. The long piece 56 has an axial length of 0.1 to 10 centimeters and a best of 0.5 to 3.0 centimeters. The side wing 58 is disposed between the AC LED device 20 and the circuit board 28. The joint foot (pin) 66 of the AC LED device 20 is joined to the through hole 62 of the circuit board 28 using the solder 68, and the through hole 64 of the circuit board 28 is joined to the electrode 12 using the solder 70. The through holes 62 and the through holes 64 can be changed to blind vias or other structures, which are within the well-known art of circuit boards. In order to solder the resistor 30 between the electrode 14 and the circuit board 28, the resistor 30 and the AC LED device 20 are in series between the electrode 12 and the electrode 14. The circuit board 28 can be a reinforced glass fiber or metal substrate member, but the good thing is that the circuit board 28 is also in mechanical contact with the thermally conductive insulation 36. In other embodiments, it is possible to change the register 30 to a register on the circuit board 28, or to add a register 30 added to the circuit board 28 and the register 30 in series, which is similar to the previous embodiment. is there. If necessary, a light cover can be additionally attached, which is the same as in the previous embodiment. When manufacturing this LED light, first, the resistor 30 is soldered to the electrode 14 and the circuit board 28, and the circuit board 28 is further soldered to the electrode 12, and then the heat conductive insulating material 36 is inserted into the hollow 18 from the perforations 60. Then, one end of the heat conducting component is embedded in the heat conducting insulating material 36 through the perforations 60 and then soldered to the AC LED device 20. If necessary, the heat conductive insulating material 36 is solidified by heating.

  In the seventh embodiment of the present invention shown in FIG. 10, a circuit board 28 having a metal substrate is bonded onto the heat conductive insulating material 36. The aluminum layer 28a, the copper layer 28c, and the heat conductive layer 28b provided in this type of circuit board 28 are disposed between the two, and the heat dissipation capability exceeds that of the reinforced glass fiber substrate. The AC LED device 20 is soldered on the circuit board 28 by the COB package structure, the solder solders the circuit board 28 to the electrode 12, and the resistor 30 solders between the electrode 14 and the circuit board 28. 30 and the AC LED device 20 are connected in series between the electrode 12 and the electrode 14. In another embodiment, it is possible to change the resistor 30 to be soldered to the resistor on the circuit board 28, or to add the resistor 30 added to the circuit board 28 and the resistor 30 in series. It is the same. If necessary, a light cover can be attached, and these are the same as the above-described embodiment. In the manufacturing method of the LED light of this embodiment, first, the resistor 30 is soldered to the electrode 14, the heat conductive insulating material 36 is filled in the hollow 18, and then the resistor 30 is soldered to the circuit board 28. 28 is soldered to the electrode 12, and finally the AC LED device 20 is packaged on the circuit board 28. If necessary, the heat conductive insulating material 36 is solidified by heating. When the AC LED device 20 is packaged, the AC LED epitaxial chip 22 is first soldered on the circuit board 28, then wire-bonded, and a seal 26 is applied. If a light cover is to be added, the application of the seal 26 is not necessary.

  In each of the above-described embodiments, the power of the AC LED device 20 to be adopted is between 0.3 and 5 W based on the actual application, and is preferably 1 to 3 W, 50 to 50000 Ω resistor 30 or register 38 is selected. The operating voltage of the AC LED device 20 is between 12 and 240 volts. When a single AC LED device 20 is used, the operating voltage is selected from 110V or 220V based on the AC power supply. When a large number of AC LED devices 20 are connected in series, a relatively low voltage such as 12V can be selected.

  FIG. 11 shows an eighth embodiment of the present invention, and FIG. 12 shows an equivalent circuit diagram. In this embodiment, the DC LED device 72 is changed to a light core, and a bridge type rectifier 74 is added. Both the resistor 38 and the bridge rectifier 74 are soldered onto the circuit board 28. As shown in FIG. 12, the direct current LED epitaxial chip 76 in the direct current LED device 72 includes one LED or LED string, and the good thing is that the direct current LED device 72 becomes a high voltage direct current LED device. is there. The bridge-type rectifier 74 includes two input ends 78 and 80, which are respectively connected to the electrode 12 and the electrode 14. The two output ends 82 and 84 are connected to a DC LED in which a rectified power source is connected in series. Supply to device 72 and register 38.

  FIG. 13 shows a ninth embodiment of the present invention, and FIG. 14 shows an equivalent circuit diagram. The light core of this embodiment also uses a DC LED device 72. Resistor 30 is embedded in thermally conductive insulation 36 and bridge rectifier 74 is soldered onto circuit board 28. As shown in FIG. 14, the resistor 30 moves between 14 and the input terminal 80 of the bridge rectifier 74, and the DC LED epitaxial chip 76 is connected between the output terminal 82 and the output terminal 84 of the bridge rectifier 74. It is also possible to change the resistor 30 between the electrode 12 and the input end 78 of the bridge rectifier 74, or to exchange the positions of the epitaxial chip 76 and the resistor 30. In addition to the embodiments of FIGS. 11 to 14, LED lights using DC LED devices constitute different embodiments based on the various structures and arrangements disclosed in FIGS. 1, 5, and 8 to 10. It is also possible.

  The AC LED device 20 and the DC LED device 72 of each of the embodiments described above only show a shell-type component, a plastic lead chip carrier (PLCC), a surface mount structure (SMD), and a chip on board (COB). Various other types or packages of AC LED devices and DC LED devices are also applicable to the present invention.

10 base 12 electrode 14 electrode 16 spiral outer shape 18 hollow 20 AC LED device 22 AC LED epitaxial chip 24 support portion 26 seal 28 circuit board 28a aluminum layer 28b heat conductive layer 28c copper layer 30 resistor 32 lead wire 34 lead wire 36 heat conduction Insulating material 38 Resistor 40 Light cover 50 Thermal conduction component 52 Solder pad 54 Solder pad 56 Long piece 58 Side wing 60 Perforation 62 Through hole 64 Through hole 66 Joint foot 68 Solder 70 Solder 72 DC LED device 74 Bridge type rectifier 76 Epitaxial chip 78 Bridge type rectifier input terminal 80 Bridge type rectifier input terminal 82 Bridge type rectifier output terminal 84 Bridge type rectifier output terminal

Claims (22)

In the light core provided in the LED light, including at least one AC LED device,
In the base including the first electrode and the second electrode, the first electrode includes a spiral shape, a columnar shape, or a needle-shaped outer shape, and a hollow is provided inside the first electrode.
A resistor and the light core are connected in series between the first electrode and the second electrode,
The hollow is filled with the heat conductive insulating material so that the first electrode covers the whole of the heat conductive insulating material, the heat conductive insulating material is brought into contact with the entire inner wall of the first electrode, and the light An LED light characterized in that a core is laminated on the heat-conducting insulating material, and a heat passage is provided to assist heat dissipation of the light core to the entire side wall of the first electrode.   The LED light according to claim 1, wherein the light core includes a circuit board on which the at least one AC LED device is mounted, and mechanically contacts the heat conductive insulating material.   2. The LED light according to claim 1, wherein the light core includes a heat conductive component for soldering the at least one AC LED device, and one end is embedded in the heat conductive insulating material. In the light core,
A circuit board comprising perforations and mounting said at least one AC LED device;
2. The LED light according to claim 1, comprising: a heat conductive component having a first end soldered to the AC LED device and a second end embedded in the heat conductive insulating material through the perforations. .   The LED light according to claim 4, wherein the circuit board is in mechanical contact with the thermally conductive insulating material.   The LED light according to claim 4, wherein the register is soldered to the circuit board.   The LED light according to claim 1, wherein the heat conductive insulating material includes any one of an epoxy resin, a heat conductive powder, and a mixture of the two.   The LED light according to claim 1, wherein the base is a standard base of a traditional tungsten light bulb.   2. The LED light according to claim 1, wherein the base is a standard base of a traditional halogen bulb.   The LED light according to claim 1, wherein the AC LED device uses a voltage including 12 to 240 volts.   The LED light according to claim 1, wherein the power of the AC LED device is 1 to 3W. In the light core provided in the LED light, including at least one DC LED device,
In a base comprising a resistor and the light core in series and having a first electrode and a second electrode, the first electrode has a spiral, columnar, or needle-shaped outer shape, and a hollow is formed inside the first electrode. Provided,
Two input ends of the bridge rectifier are connected to the first electrode and the second electrode, respectively, and two output ends provide a rectified power source to the at least one DC LED device,
The hollow is filled with a heat conductive insulating material so that the first electrode covers the entire heat conductive insulating material, the heat conductive insulating material is brought into contact with the entire inner wall of the first electrode, and the light core An LED light characterized in that a heat passage is provided to help heat radiation of the light core to the entire side wall of the first electrode.   The LED light according to claim 12, wherein the light core includes a circuit board on which the at least one DC LED device is mounted, and mechanically contacts the heat conductive insulating material.   The LED light according to claim 12, wherein the light core includes a heat conductive component for soldering the at least one DC LED device, and one end is embedded in the heat conductive insulating material. In the light core,
A circuit board comprising perforations and mounting said at least one DC LED device;
The LED light according to claim 12, further comprising: a heat conductive component having a first end soldered to the DC LED device and a second end embedded in the heat conductive insulating material through the perforations. .   16. The LED light of claim 15, wherein the circuit board is in mechanical contact with the thermally conductive insulating material.   16. The LED light of claim 15, wherein the resistor and bridge rectifier are soldered on the circuit board.   The LED light according to claim 12, wherein the heat conductive insulating material includes any one of an epoxy resin, a heat conductive powder, and a mixture of the two.   The LED light according to claim 12, wherein the base is a standard base of a traditional tungsten light bulb.   The LED light according to claim 12, wherein the base is a standard base of a traditional halogen light bulb.   The LED light of claim 12, wherein the DC LED device uses a voltage including 14 to 240 volts.   The LED light according to claim 12, wherein the power of the DC LED device is 1 to 3W.

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