M383090 五、新型說明： 【新型所屬之技術領域】 本創作係有關一種電燈，特別是關於一種可直接替換傳統 鶴絲、鹵素或省電燈泡的發光二極體(led)燈。 【先前技術】 使用直流電LED裝置作為燈芯的led燈，必須使用電源 轉換器將交流電轉換成直流電供應該直流電LED裝置，因 此會增加LED燈的成本。此外，電源轉換器很難完全藏放 在傳統燈泡的標準燈頭内，因此需要另行開發模具製作不 同於傳統燈泡的機構件’不但更增加成本，也增加Led 燈的體積。直流電LED裝置在通電時會產生熱能，故必須 額外設計散熱機構處理這些熱能。若無法有效散熱，高溫 會造成LED的發光效率降低、壽命減少及波長偏移等不利 效果。電源轉換器在將交流電轉換成直流電的過程中，也 會產生熱能，特別是其中的電感與積體電路，高溫也會損 壞此類元件，造成產品無法運作。特別是在高功率的應用 上，例如照明用途的燈具，直流電LED裝置產生的熱能較 高，因此散熱不足而引起的情況更嚴重。有些產品採用多 顆低功率的砲彈型（lamp type)LED，並且使用簡單的橋式 整流電路，以便適應小體積的傳統燈頭。但是低功率的 led亮度普遍過低，市場接受度有限，而且此類產品往 3 往因為散熱不佳，光衰現象嚴重。 近年來，使用交流電的LED裝置的技術日漸成熟，亮度也 日益提升，已具有商業利用價值。交流電lED裝置係將 串、並聯的多個LED製作在同一個磊晶片上’此磊晶片封 裝後串聯具有某個電阻值的電阻器，可以直接承受市電如 110伏特或220伏特等高電壓使用，因此省去直流電LED 裝置所需的電源轉換器或整流電路，有效降低成本及減少 電路造成的品質問題。雖然交流電LED裝置方便應用在小 體積的空間内’但是仍有散熱的問題必須處理。尤其是在 尚功率的應用上，例如照明用途的燈具，其產生的熱能較 南’如果增設散熱器，會加大led燈的體積與成本，如果 不幫助交流電LED裝置散熱，又會造成LED的發光效率 降低、哥命減少及波長偏移，甚至燒毁LED蟲晶片。 【新型内容】 本創作的目的之一，在於提出一種強化LED燈芯散熱的 LED 燈。 本創作的目的之一，在於提出一種可直接替換傳統鎢絲、 鹵素或省電燈泡的LED燈。 根據本創作，一種強化散熱的LED燈包括含有交流電led 裝置的燈芯，該交流電LED裝置包含交流電led磊晶片， 電阻器和該交流電LED磊晶片包裝在同一封裝内，且二者 M383090M383090 V. New Description: [New Technology Field] This creation is about an electric lamp, especially a light-emitting diode (LED) lamp that can directly replace traditional crane wire, halogen or energy-saving light bulb. [Prior Art] A led lamp using a direct current LED device as a wick must be converted into a direct current to supply the direct current LED device using a power converter, thereby increasing the cost of the LED lamp. In addition, the power converter is difficult to completely hide in the standard lamp holder of the conventional bulb, so it is necessary to separately develop a mold member that is different from the conventional bulb. This not only increases the cost but also increases the volume of the Led lamp. The DC LED device generates heat when it is energized, so an additional heat sink must be designed to handle this heat. If it is not possible to dissipate heat efficiently, high temperatures can cause adverse effects such as reduced luminous efficiency, reduced lifetime, and wavelength shift of the LED. In the process of converting AC power into DC power, the power converter also generates heat energy, especially the inductors and integrated circuits. High temperatures can also damage such components, making the product inoperable. Especially in high-power applications, such as lighting fixtures, DC LED devices generate higher thermal energy, so the situation caused by insufficient heat dissipation is more serious. Some products use multiple low-power lamp type LEDs and use simple bridge rectifiers to accommodate small, traditional lamp heads. However, the low-power led brightness is generally too low, the market acceptance is limited, and such products go to 3 because of poor heat dissipation, and the phenomenon of light decay is serious. In recent years, the technology of LED devices using alternating current has become increasingly mature and the brightness has been increasing, which has commercial value. The AC lED device is used to make a plurality of LEDs connected in series and in parallel on the same epitaxial wafer. After the epitaxial wafer package, a resistor having a certain resistance value is connected in series, and can directly withstand a high voltage such as 110 volts or 220 volts. Therefore, the power converter or rectifier circuit required for the DC LED device is omitted, which effectively reduces the cost and reduces the quality problems caused by the circuit. Although the AC LED device is convenient for use in a small volume of space, the problem of heat dissipation must be dealt with. Especially in the application of power, for example, the lighting used in lighting, the heat energy generated by the south is increased. If the radiator is added, the volume and cost of the LED lamp will be increased. If the LED device is not helped to dissipate heat, the LED will be caused. Reduced luminous efficiency, reduced fate and wavelength shift, and even burned LED insect wafers. [New content] One of the purposes of this creation is to propose an LED lamp that enhances the heat dissipation of LED wicks. One of the aims of this creation is to propose an LED lamp that can directly replace a conventional tungsten wire, a halogen or a power saving bulb. According to the present invention, a heat-dissipating LED lamp includes a wick including an alternating current LED device, the alternating current LED device includes an alternating current led-leaf chip, and the resistor and the alternating current LED epi-chip are packaged in the same package, and both M383090
該燈頭可以使用傳統燈泡的緩頭， 入—般燈具之燈泡插座，毋需 接器。 頭’因此該LED燈可|操摊 更換原有燈具系统或如嚴轉 【實施方式】 圖1係本創作的第一實施例的示意圖。為了凸顯本劍作的 特點，此實施例使用小燈泡用的標準燈碩10，其具有電棰 12和14供連接交流電源。如本技術領域之具有2常妒識 者所熟悉的，電極12係具有螺旋紋外形16的金屬毅，其 内有腔室18。此實施例使用一顆交流電led裝置2〇作爲 燈芯，其係將交流電LED磊晶片22固定在支架24上，炎 於其上覆蓋封膠26。LED的封裝係習知技術，為了簡彳b _ 式’此處未繪出交流電LED裝置20的詳細封裝構造。電 阻器30的一端焊接至電極14,另一端藉導線32焯接炱 LED裝置20’導線34的兩端分別焊接至電極12及交流電 LED裝置20。此LED燈的等效電路如圊2所示，交流電 LED磊晶片22和電阻器30係串聯在電極12和14之間。 如本技術領域之具有通常知識者所熟悉的，所謂交流電 LED磊晶片’含有兩個相反的方向配置的LED並聯在兩 5 M383090 支接腳之間，每一該方向上具有至少一個LED，該兩個相 反的方向配置的LED分別在交流電源的正、負半週期被點 亮。電阻器30的電阻值R的大小係根據設計需求的電流 值而選擇的。電阻器30也具有保護交流電LED磊晶片 22的功能，在連接至電極12和14的交流電源發生突波 時，電阻器30會吸收大部分的突波電壓。回到圖1，本創 作的特點之一，係在腔室18中填充導熱絕緣材料36，其 機械性地接觸支架24和電極12,提供熱通道將交流電LED 磊晶片22因為通電發光產生的熱能傳導至電極12進行散 熱。如本技術領域之具有通常知識者所熟悉的，支架24 通常含有幫助交流電LED磊晶片22散熱的金屬片，因此， 支架24貼在導熱絕緣材料36上，會有良好的熱導效果。 除了幫助交流電LED磊晶片22散熱，導熱絕緣材料36 也幫助電阻器30散熱，因為電阻器30埋在導熱絕緣材料 36中。 導熱絕緣材料36可以選用環氧樹酯，或者導熱粉末，例 如氧化鋁、氮化鋁、氮化硼或其他導熱材料，或者二者的 混合物。表1係使用三種不同導熱材料在圖1的LED燈 中，實際測得的結果。 表1 導熱絕緣 父流電源 LED裝置20的 輸出受度 連續點亮 材料36 的電壓 消耗功率(W) ㈣ 1000小時 6 環氧樹酯 110V 1 65 無異常 但溫度較高 環氧樹酯+ 氧化鋁粉末 110V 1 68 無異常 氧化鋁粉末 110V 1 68 無異常 從表1的測試結果可知，採用環氧樹酯的導熱絕緣材料 36，因導熱係數較差，故通電後整體溫度較高；將環氧樹 酯與導熱粉末混合的導熱絕緣材料36，因導熱效果較佳， 點亮測試中無異常狀況發生；直接使用導熱粉末壓實充填 的導熱絕緣材料36，亦可得到良好導熱效果。整體而言， LED燈可獲得良好的光輸出亮度，連續點亮1000小時無 異常發生。也可以選用其他材料作為導熱絕緣材料36，較 佳者，其導熱係數介於0.25至30W/mK之間。 傳統燈泡使用的是標準燈頭，例如E12、E14、E17、E26 及E27是傳統鎢絲燈泡的燈頭，MR16及GU10是傳統鹵 素燈泡的燈頭。表2係使用標準燈頭E12及E27於圖1的 LED燈中，實際測得的結果。 表2 燈頭10的 種類 交流電源 的電壓 LED裝置20的 消耗功率(W) 輸出亮度 ㈣ 連續點亮 1000小時 E12 110V 1 72 無異常 E12 220V 1 70 無異常 E27 110V 1 67 無異常 E27 220V 1 73 無異常 M383090 如表2的内容所示，圖1的LED燈無論是使用常見體積較 小的E12燈頭或是體積較大的E27燈頭，皆可獲得良好的 光輸出亮度，而且連續點亮1〇〇〇小時無異常發生，表示 交流電LED磊晶片22產生的熱能有效地傳導至電極12 進行散熱。如圖1所示，此LED燈的大小約與燈頭10相同， 又具有良好的散熱能力，可以達成習知技術做不到的高功 率應用。在傳統鹵素燈泡的燈頭中，一個電極是柱狀金屬 殼，被絕緣物與另一個電極分隔開。某些標準燈頭則是使 用兩根彼此絕緣的針狀電極。不論是傳統鎢絲燈泡、傳統 鹵素燈泡的燈頭或其他標準燈頭，都有腔室可以填充導熱 絕緣材料，因此至少有一個電極可以用來幫助LED燈的燈 芯散熱。因為燈頭的電極是向外曝露的，所以可以提供不 錯的散熱效果。 可以選用内含較多LED數量的交流電LED磊晶片22來提 高LED燈的亮度。圖3係幾種交流電LED磊晶片22的示 意圖，第一種係在兩支接腳之間並聯兩串方向相反的 LED，每一串包含兩個以上的LED ;第二種係在兩支接腳 之間串聯兩對以上的LED對，每一對LED對含有兩個方向 相反的LED並聯在一起；第三種係五個以上的LED配置成 橋式結構。這些都已經有商品化的產品可以選用。 8 M383090 圖4係本創作的第二實施例的示意圖。此實施例的燈芯包 含電路板28及其上的交流電LED裝置20，交流電LED 裝置20含有至少一個交流電LED磊晶片22。串聯電阻器 38改為安裝在電路板28上，並藉導線34及32將電路板 28連接在電極12和14之間。電路板28可以選用強化玻 璃纖維(FR4)或金屬基板(IMS)的元件；交流電LED裝置 20和串聯電阻器38可以選用表面安裝型元件（SMD)，使 用表面黏著技術（SMT)安裝在電路板28上。因為電阻器38 係焊接在電路板28上，因此可以使用可變電阻器增加應 用的彈性，例如方便調整通過交流電LED裝置20的電流 值。如本技術領域之具有通常知識者所熟悉的，電路板28 的底部通常含有幫助散熱的金屬層，因此，電路板28貼 在導熱絕緣材料36上，會有良好的熱導效果。 接合燈芯與燈頭10以後，再加上燈罩40。燈罩40可以選 用玻璃蓋、塑膠蓋、環氧樹酯或矽膠。如果選用玻璃蓋或 塑膠蓋’可以使用膠合、卡榫或螺牙等機械方式將其接合 在燈頭10的末端上。如果選用環氧樹酯或矽膠，則將其 塗佈在燈芯上，其用量足夠完全包住電路板28及其上的 所有元件。燈罩40作為保護蓋，防止水氣、灰塵或外力 施加在LED燈的内部元件上。燈罩40亦有光學元件的功 能，可透過霧化、幾何形狀設計等方式產生各種所需的光 學效果。燈罩40的霧狀結構可以利用喷砂、餘刻、靜電 9 M383090 粉體塗裝、塗佈矽膠、喷漆或射出成型方式製作。表3係 幾種不同材質的燈罩40實際測得的結果。 表3 燈罩40的 種類 父流電源 的電壓 LED裝置20的 消耗功率(W) 輸出免度 (lm) 連續點亮 1000小時 玻璃蓋 110V 1 58 無異常 塑膠蓋 110V 1 55 無異常 環氧樹醋 110V 1 59 無異常 矽膠 110V 1 57 無異常 表3的内容顯示，不論燈罩40採用玻璃蓋、塑膠蓋、環氧 樹酯或矽膠，皆可獲得良好的光輸出，點亮測試中亦無異 常發生，表示通電後交流電LED磊晶片22產生的熱能有 效透過導熱絕緣材料36及電極12傳導至外部，並未因為 加封燈罩40而明顯影響散熱。 圖5係本創作的第三實施例的示意圖。此LED燈的燈芯包 含交流電LED裝置20、電路板28及導熱件50。交流電 LED裝置20、電阻器38和電路板28與圖4的實施例相同， 導熱件50的一端具有盤面貼在電路板28的底部表面上， 另一端埋入導熱絕緣材料36中。導熱件50的軸向長度介 於0. 1至10公分之間，較佳者為0. 5至3. 0公分，利用 其埋入導熱絕緣材料36的深淺來調整交流電LED裝置20 的高度。導熱件50係由高導熱率的材料製成，例如銅或 10 其他金屬，其形狀為柱狀、片狀或其他形狀。燈罩40選 用玻璃蓋或塑膠蓋。 如果要提高LED燈的亮度，可以使用更多交流電LED裝置 20串聯、並聯或串並聯。例如圖6所示的多磊晶片燈芯， 係在電路板28的焊墊52及54之間並聯三排交流電LED 裝置20，每一排含有三個交流電LED裝置20。如果每一 個交流電LED裝置20的功率為1瓦的話，則此燈芯可以 達到9瓦。 圖4、圖5及圖6的燈芯係將交流電LED裝置20貼在電路 板28上，也可以改為在電路板28上封裝交流電磊晶片 2 2 *其係將父流電蟲晶片2 2的裸晶直接貼在電路板2 8 上，打線後再覆蓋封膠26。 圖7係本創作的第四實施例的示意圖，除了電阻器30以 外，增加一個安裝在電路板28上的電阻器38串聯在電阻 器30及交流電LED裝置20之間。電路板28、電阻器38 及交流電LED裝置20可以作成一個模組，電阻器38的電 阻值大小係配合交流電LED裝置20設計的，電阻器30及 燈頭10是另一個模組。不同模組的結合可以得到不同規 格的LED燈。例如使用相同的電阻器30及燈頭10模組， 只要搭配不同的燈芯及電阻器38模組，就可以製造不同 亮度或電流值的LED燈。電阻器38也可以採用可變電阻 器，根據需求調整其電阻值。 M383090 圖8係本創作的第五實施例的示意圖，交流電LED裝置20 焊接在導熱件50的盤面上，導熱件50的另一端埋入導熱 絕緣材料36中，利用其埋入導熱絕緣材料36中的深淺來 調整交流電LED裝置20的高度。表4係比較導熱件50使 用銅柱及銅片的效果。 表4 導熱件的 型態 交流電源 的電壓 LED裝置20的 消耗功率(W) 輸出亮度 ㈣ 連續點亮 1000小時 銅柱 110 V 1 70 無異常 銅片 110 V 1 71 無異常 從表4的測試結果可知，增加銅柱或銅片的設計可以讓交 流電LED裝置20通電產生的熱能更快速傳導至外部，獲 得良好的光輸出亮度，連續點亮1〇〇〇小時無異常發生。 圖9係本創作的第六實施例的示意圖，使用具有穿孔60 的電路板28，導熱件50的一端在電路板28的上方，另一 端經過穿孔60埋入導熱絕緣材料36中，交流電LED裝置 20焊接在導熱件50露出的一端上。導熱件50具有片狀結 構56及側翼58，片狀結構56的軸向長度介於0.1至10 公分之間，較佳者介於0.5至3.0公分之間，側翼58介於 交流電LED裝置20與電路板28之間。交流電LED裝置 20的接腳66藉焊錫68焊接至電路板28的貫孔62，焊錫 70將電路板28的貫孔64焊接至電極12。貫孔62及64 12 M383090 可以改用盲孔或其他結構，這些是電路板的習知技術。電 阻器30焊接在電極14及電路板28之間，因此電阻器30 與交流電LED裝置20串聯在電極12和14之間❶電路板 28可以選用強化玻璃纖維或金屬基板的元件。較佳者，電 路板28也機械性地接觸導熱絕緣材料36❶在不同的實施 例中，也可以將電阻器30改為焊接在電路板28上的電阻 器，或增加在電路板28上的電阻器與電阻器3〇串聯，如 前述的實施例一樣。需要的話，可以加裝燈罩，這些和前 述的實施例一樣。 圖10係本創作的第七實施例的示意圖，使用具有金屬基 板的電路板28貼在導熱絕緣材料36上《這種電路板28 具有鋁層72、銅層76及導熱層74介於二者之間，散熱能 力高於強化玻璃纖維基板。交流電LED裝置20以 封裝結構焊接在電路板28上，焊錫將電路板28焊接至電 極12 ’電阻器30焊接在電極14及電路板28之間，因此 電阻器30與交流電LED裝置20串聯在電極12和14之 間。在不同的實施例中’也可以將電阻器3〇改為焊接在 電路板28上的電阻器，或在電路板28上增加電阻器與電 阻器30串聯，如前述的實施例一樣。需要的話，可以加 裝燈罩’這些和前述的實施例一樣。如果加裝燈罩的話， 可以免除施加封膠26。 圖11係本創作的第八實施例的示意圖。交流電LED裝置 13 M383090 20的内部構造如圖12所示，其係將交流電lEd磊晶片22 和晶片電阻器90包裝在同一封裝内，交流電LED磊晶片 22和兩個晶片電阻器90貼在墊片88上，接合線92連接 交流電LED磊晶片22和晶片電阻器9〇，接合線94連接 接腳66和晶片電阻器9〇,封膠26包覆所有的電路結構， 其等效電路如圖13所示。參照圖u，交流電LED裝置2〇 貼附在導減緣材料36上，烊錫7Q將交流電㈣裝置The lamp head can use the light bulb of the traditional light bulb, into the bulb socket of the general lamp, and the connector is needed. The head is thus the LED lamp can be replaced with the original lamp system or if it is strictly rotated. [Embodiment] FIG. 1 is a schematic view of a first embodiment of the present invention. In order to highlight the features of this sword, this embodiment uses a standard lamp 10 for small bulbs having an electric raft 12 and 14 for connection to an AC power source. As is well known to those of ordinary skill in the art, the electrode 12 has a metallic shape of a spiral profile 16 with a chamber 18 therein. This embodiment uses an alternating current LED device 2 as a wick which secures the alternating current LED panel 22 to the holder 24, which is overlaid with the encapsulant 26. LED packaging is a conventional technique, and the detailed package configuration of the AC LED device 20 is not depicted here for b). One end of the resistor 30 is soldered to the electrode 14, and the other end is connected by a wire 32. The two ends of the LED device 20' are soldered to the electrode 12 and the AC LED device 20, respectively. The equivalent circuit of this LED lamp is shown as 圊2, and the alternating current LED epitaxial wafer 22 and the resistor 30 are connected in series between the electrodes 12 and 14. As is well known to those of ordinary skill in the art, an so-called alternating current LED epitaxial wafer 'an LED having two opposite directional configurations is connected in parallel between two 5 M383090 legs, each having at least one LED in the direction, which Two LEDs arranged in opposite directions are illuminated in the positive and negative half cycles of the AC power source. The magnitude of the resistance value R of the resistor 30 is selected according to the current value required by the design. The resistor 30 also functions to protect the alternating current LED epitaxial wafer 22, which absorbs most of the surge voltage when a surge occurs in the alternating current source connected to the electrodes 12 and 14. Returning to Fig. 1, one of the features of the present invention is to fill the chamber 18 with a thermally conductive insulating material 36 that mechanically contacts the bracket 24 and the electrode 12 to provide a thermal path for the thermal energy generated by the alternating current LED epitaxial wafer 22 due to energization. Conducted to the electrode 12 for heat dissipation. As is well known to those of ordinary skill in the art, the bracket 24 typically contains a metal sheet that assists in dissipating heat from the AC LED epitaxial wafer 22. Thus, the bracket 24 is attached to the thermally conductive insulating material 36 for good thermal conductivity. In addition to helping the AC LED epitaxial wafer 22 to dissipate heat, the thermally conductive insulating material 36 also helps the resistor 30 to dissipate heat because the resistor 30 is buried in the thermally conductive insulating material 36. The thermally conductive insulating material 36 may be selected from epoxy resins, or thermally conductive powders such as alumina, aluminum nitride, boron nitride or other thermally conductive materials, or a mixture of the two. Table 1 shows the actual measured results using the three different thermally conductive materials in the LED lamp of Figure 1. Table 1 Thermal Conductive Insulation Parent Flow Power Supply LED Device 20 Output Acceptance Continuous Lighting Material 36 Voltage Consumption Power (W) (4) 1000 hours 6 Epoxy Resin 110V 1 65 No abnormality but higher temperature epoxy resin + alumina Powder 110V 1 68 No abnormal alumina powder 110V 1 68 No abnormality From the test results of Table 1, it can be known that the thermal conductive insulating material 36 using epoxy resin has a higher thermal conductivity, so the overall temperature is higher after energization; The thermal conductive insulating material 36 mixed with the thermal conductive powder has better heat conduction effect, and no abnormal condition occurs in the lighting test; the thermal conductive insulating material 36 which is directly filled with the thermal conductive powder can also obtain a good thermal conductive effect. Overall, the LED lamp can achieve good light output brightness, and it can be lit for 1000 hours without abnormality. Other materials may also be used as the thermally conductive insulating material 36. Preferably, the thermal conductivity is between 0.25 and 30 W/mK. Conventional bulbs use standard bases. For example, E12, E14, E17, E26 and E27 are the bases of conventional tungsten bulbs, and MR16 and GU10 are the bases of conventional halogen bulbs. Table 2 shows the actual measured results using the standard lamp heads E12 and E27 in the LED lamp of Fig. 1. Table 2 Types of lamp caps 10 Voltage of AC power supply Power consumption of LED device 20 (W) Output brightness (4) Continuous lighting for 1000 hours E12 110V 1 72 No abnormality E12 220V 1 70 No abnormality E27 110V 1 67 No abnormality E27 220V 1 73 None Abnormal M383090 As shown in Table 2, the LED lamp of Figure 1 can obtain good light output brightness, whether it is using a common E12 lamp head or a large E27 lamp head, and it can be continuously lit 1〇〇. No abnormality occurs in the hour, indicating that the heat generated by the alternating current LED panel 22 is effectively conducted to the electrode 12 for heat dissipation. As shown in Fig. 1, the LED lamp has the same size as the lamp cap 10, and has good heat dissipation capability, and can achieve high power applications which cannot be achieved by conventional techniques. In the lamp head of a conventional halogen bulb, one of the electrodes is a columnar metal shell separated by an insulator from the other electrode. Some standard lamp caps use two needle electrodes that are insulated from each other. Whether it is a conventional tungsten filament bulb, a conventional halogen bulb head or other standard lamp caps, the chamber can be filled with a thermally conductive insulating material, so at least one electrode can be used to help dissipate the wick of the LED lamp. Since the electrode of the lamp cap is exposed to the outside, it can provide an accurate heat dissipation effect. An alternating current LED epitaxial wafer 22 containing a larger number of LEDs can be used to increase the brightness of the LED lamps. 3 is a schematic diagram of several alternating current LED epitaxial wafers 22, the first type is two parallel strings of LEDs in parallel between two legs, each string comprising more than two LEDs; the second is in two branches Two pairs of LED pairs are connected in series between the legs, and each pair of LED pairs are connected in parallel with two LEDs in opposite directions; the third system is configured with a bridge structure of five or more LEDs. These are already commercially available products. 8 M383090 Figure 4 is a schematic illustration of a second embodiment of the present invention. The wick of this embodiment includes a circuit board 28 and an alternating current LED device 20 thereon, and the alternating current LED device 20 includes at least one alternating current LED epitaxial wafer 22. The series resistor 38 is instead mounted on the circuit board 28 and the circuit board 28 is connected between the electrodes 12 and 14 by wires 34 and 32. The circuit board 28 may be a reinforced fiberglass (FR4) or metal substrate (IMS) component; the AC LED device 20 and the series resistor 38 may be surface mounted components (SMD) mounted on the circuit board using surface mount technology (SMT). 28 on. Since the resistor 38 is soldered to the circuit board 28, a variable resistor can be used to increase the flexibility of the application, e.g., to facilitate adjustment of the current through the AC LED device 20. As is well known to those of ordinary skill in the art, the bottom of circuit board 28 typically contains a metal layer that aids in heat dissipation. Therefore, circuit board 28 is attached to thermally conductive insulating material 36 for good thermal conductivity. After the wick and the base 10 are joined, the lamp cover 40 is added. The cover 40 can be a glass cover, a plastic cover, an epoxy resin or silicone. If a glass cover or plastic cover is used, it can be joined to the end of the base 10 by mechanical means such as gluing, snapping or threading. If epoxy resin or silicone is used, it is applied to the wick in an amount sufficient to completely enclose the circuit board 28 and all of its components. The lamp cover 40 serves as a protective cover to prevent moisture, dust or external force from being applied to the internal components of the LED lamp. The lampshade 40 also has the function of an optical component to produce various desired optical effects through atomization, geometric design, and the like. The mist structure of the lampshade 40 can be produced by sand blasting, engraving, electrostatic 9 M383090 powder coating, coating silicone, painting or injection molding. Table 3 shows the actual measured results of the lampshades 40 of several different materials. Table 3 Types of Shade 40 Voltage of the parent current power supply LED device 20 Power consumption (W) Output exemption (lm) Continuous lighting 1000 hours Glass cover 110V 1 58 No abnormal plastic cover 110V 1 55 No abnormal epoxy tree vinegar 110V 1 59 No abnormal silicone 110V 1 57 No abnormality Table 3 shows that no matter whether the lamp cover 40 is made of glass cover, plastic cover, epoxy resin or silicone rubber, good light output can be obtained, and no abnormality occurs in the lighting test. It indicates that the heat generated by the AC LED epitaxial wafer 22 after being energized is effectively transmitted to the outside through the thermally conductive insulating material 36 and the electrode 12, and the heat dissipation is not significantly affected by the sealing of the lamp cover 40. Figure 5 is a schematic illustration of a third embodiment of the present creation. The wick of this LED lamp comprises an alternating current LED device 20, a circuit board 28 and a heat conducting member 50. The alternating current LED device 20, the resistor 38 and the circuit board 28 are the same as the embodiment of Fig. 4. One end of the heat conducting member 50 has a disk surface attached to the bottom surface of the circuit board 28, and the other end is buried in the thermally conductive insulating material 36. The axial length of the heat conducting member 50 is between 0.1 and 10 cm, preferably 0.5 to 3.0 cm, and the height of the alternating current LED device 20 is adjusted by the depth of the thermally conductive insulating material 36. The heat conducting member 50 is made of a material having a high thermal conductivity such as copper or other metal, and its shape is a columnar shape, a sheet shape or the like. The cover 40 is provided with a glass cover or a plastic cover. If you want to increase the brightness of the LED lights, you can use more AC LED devices 20 in series, parallel or series and parallel. For example, the multi-leaf wafer wick shown in FIG. 6 is connected in parallel with three rows of alternating current LED devices 20 between pads 52 and 54 of circuit board 28, each row containing three alternating current LED devices 20. If the power of each of the AC LED devices 20 is 1 watt, the wick can reach 9 watts. The wick of FIG. 4, FIG. 5 and FIG. 6 attaches the alternating current LED device 20 to the circuit board 28. Alternatively, the alternating current epitaxial wafer 2 2 can be packaged on the circuit board 28. The bare crystal is directly attached to the circuit board 28, and then the sealing compound 26 is covered after the wire is applied. Figure 7 is a schematic illustration of a fourth embodiment of the present invention in which, in addition to the resistor 30, a resistor 38 mounted on the circuit board 28 is added in series between the resistor 30 and the AC LED device 20. The circuit board 28, the resistor 38 and the AC LED device 20 can be formed as a module. The resistance of the resistor 38 is designed to match the AC LED device 20. The resistor 30 and the lamp cap 10 are another module. Different modules can be combined to obtain different specifications of LED lights. For example, using the same resistor 30 and the lamp cap 10 module, LED lamps of different brightness or current values can be manufactured by using different wicks and resistors 38 modules. Resistor 38 can also be a variable resistor that adjusts its resistance as needed. M383090 is a schematic view of a fifth embodiment of the present invention. The alternating current LED device 20 is soldered to the surface of the heat conducting member 50, and the other end of the heat conducting member 50 is embedded in the thermally conductive insulating material 36, and is buried in the thermally conductive insulating material 36. The depth of the alternating current LED device 20 is adjusted. Table 4 compares the effect of the heat conductive member 50 using copper posts and copper sheets. Table 4 Heat-conducting type AC power supply voltage LED device 20 power consumption (W) Output brightness (4) Continuous lighting 1000 hours copper column 110 V 1 70 No abnormal copper piece 110 V 1 71 No abnormality Test results from Table 4 It can be seen that the design of the copper pillar or the copper piece can increase the heat energy generated by the alternating current LED device 20 to the outside, and obtain a good light output brightness, and the illumination is continuously illuminated for 1 hour without abnormality. Figure 9 is a schematic view of a sixth embodiment of the present invention, using a circuit board 28 having a perforation 60 with one end of the heat conducting member 50 above the circuit board 28 and the other end buried in the thermally conductive insulating material 36 through the perforations 60, the alternating current LED device 20 is welded to the exposed end of the heat conducting member 50. The heat conducting member 50 has a sheet-like structure 56 and a side wing 58. The axial length of the sheet-like structure 56 is between 0.1 and 10 cm, preferably between 0.5 and 3.0 cm, and the side wing 58 is interposed between the alternating current LED device 20 and Between the boards 28. The pin 66 of the AC LED device 20 is soldered to the through hole 62 of the circuit board 28 by solder 68 which solders the through hole 64 of the circuit board 28 to the electrode 12. Through Holes 62 and 64 12 M383090 can be used with blind holes or other structures, which are well known in the art of circuit boards. The resistor 30 is soldered between the electrode 14 and the circuit board 28, so that the resistor 30 is connected in series with the alternating current LED device 20 between the electrodes 12 and 14. The circuit board 28 may be a member of a reinforced glass fiber or metal substrate. Preferably, the circuit board 28 is also in mechanical contact with the thermally conductive insulating material 36. In various embodiments, the resistor 30 can be replaced with a resistor soldered to the circuit board 28, or the resistor on the circuit board 28 can be added. The resistor is connected in series with the resistor 3〇 as in the previous embodiment. If necessary, a lampshade can be added, which is the same as the previously described embodiment. Figure 10 is a schematic view of a seventh embodiment of the present invention, using a circuit board 28 having a metal substrate attached to a thermally conductive insulating material 36. Such a circuit board 28 has an aluminum layer 72, a copper layer 76 and a thermally conductive layer 74 interposed therebetween. The heat dissipation capability is higher than that of the reinforced glass fiber substrate. The AC LED device 20 is soldered to the circuit board 28 in a package structure, and the solder solders the circuit board 28 to the electrode 12'. The resistor 30 is soldered between the electrode 14 and the circuit board 28. Thus, the resistor 30 is connected in series with the AC LED device 20 at the electrode. Between 12 and 14. In a different embodiment, the resistor 3 can also be changed to a resistor soldered to the circuit board 28, or a resistor can be added to the circuit board 28 in series with the resistor 30, as in the previous embodiment. If necessary, a lampshade can be added. These are the same as the previous embodiments. If the lamp cover is added, the application of the sealant 26 can be dispensed with. Figure 11 is a schematic illustration of an eighth embodiment of the present invention. The internal structure of the AC LED device 13 M383090 20 is as shown in FIG. 12, which packs the AC 1Ed epitaxial wafer 22 and the wafer resistor 90 in the same package, and the AC LED epitaxial wafer 22 and the two wafer resistors 90 are attached to the spacer. 88, the bonding wire 92 is connected to the alternating current LED epitaxial wafer 22 and the chip resistor 9A, the bonding wire 94 is connected to the pin 66 and the chip resistor 9A, and the sealing 26 covers all the circuit structures, and the equivalent circuit is shown in FIG. Shown. Referring to Figure u, the AC LED device 2 is attached to the lead-in material 36, and the Y-S7-Q will be an AC (4) device.
20的接腳66焊接到電極，另一接腳66藉導線42連接到 電極14。在其他實施例中，也可以將接腳㈣直接焊接到 電極U。需要的話，可以加裝鮮，這些和前述的實施例 一樣。此實施例可以將LED燈的零組件數量減少到最少數 量，也因此讓組裝簡單一些。Pin 66 of 20 is soldered to the electrode and the other pin 66 is connected to electrode 14 by wire 42. In other embodiments, the pins (4) can also be soldered directly to the electrodes U. If necessary, it can be fresh, as in the previous embodiment. This embodiment can reduce the number of components of the LED lamp to a minimum, and thus makes the assembly simpler.
在上述各實施例中’根據實際的應用，採用的交流電㈣ 跋置20,其功率介於0.3 i5W之間較佳者為丨至^， 選擇50至50000歐姆的電阻器3〇或38。交流電咖裝 置2〇的使用電壓介於12至伏特之間，如果使用單一 交流電LED裝置20的話，丨甘麻m 則/、使用電壓依據交流電源選 擇為110伏特或220伏特者；如果电 禾爭聯多個交流電LED裝 置2〇的話，則其使㈣電壓可简用較低者，例如12伏 特。 雖然上述各實施例的交流電裝置2g僅例示炮彈型元 件及塑料線晶片載体封裝結構(PLCC)、表面黏著封装結 14 構(SMD)、及直接晶片載板封裝結構(c〇b卜但是其他各 種不同型態或封t的交流電LED裝置亦可適用本創作。 【圖式簡單說明】 圖1係本創作的第一實施例的示意圖； 圖2係圖1的LED燈的等效電路的示意圖； 圖3係幾種交流電LED磊晶片的示意圖； 圖4係本創作的第二實施例的示意圖； 圖5係本創作的第三實施例的示意圖； 圖6係多蟲晶片燈芯的示意圖； 圖7係本創作的第四實施例的示意圖； 圖8係本創作的第五實施例的示意圖； 圖9係本創作的第六實施例的示意圖； 圖係本創作的第七實施例的示意圖； 圖11係本創作的第八實施例的示意圖； 圖12係將交流電led磊晶片和晶片電阻器包裝在同一封 裝内的結構；以及 圖13係圖12的元件的等效電路的不意圖。 【主要元件符號說明】 1〇 燈頭 12 電極 15 M383090In the above embodiments, the alternating current (four) device 20 is used according to the actual application, and the power is between 0.3 i5 W, preferably 丨 to ^, and the resistor 3 〇 or 38 of 50 to 50000 ohm is selected. The AC coffee device 2〇 uses a voltage between 12 and volts. If a single AC LED device 20 is used, the voltage is based on the AC power source and is 110 volts or 220 volts. When a plurality of AC LED devices are connected, the voltage of (4) can be simplified to a lower one, for example, 12 volts. Although the alternating current device 2g of each of the above embodiments is exemplified only as a bullet-type component and a plastic wire wafer carrier package structure (PLCC), a surface mount package structure (SMD), and a direct wafer carrier package structure (c〇b, but various other types) The present invention is also applicable to the alternating current LED device of different types or seals. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view of a first embodiment of the present invention; FIG. 2 is a schematic diagram of an equivalent circuit of the LED lamp of FIG. Figure 3 is a schematic view of a plurality of alternating current LED epitaxial wafers; Figure 4 is a schematic view of a second embodiment of the present invention; Figure 5 is a schematic view of a third embodiment of the present invention; Figure 6 is a schematic view of a multi-worm wafer wick; A schematic view of a fourth embodiment of the present invention; FIG. 8 is a schematic view of a fifth embodiment of the present invention; FIG. 9 is a schematic view of a sixth embodiment of the present invention; 11 is a schematic view of an eighth embodiment of the present invention; FIG. 12 is a structure in which an alternating current LED panel and a chip resistor are packaged in the same package; and FIG. 13 is a schematic diagram of an equivalent circuit of the element of FIG. REFERENCE SIGNS 1〇 base member 12 electrode 15 M383090
14 電極 16 螺旋紋外形 18 腔室 20 交流電LED裝置 22 交流電LED磊晶片 24 支架 26 封膠 30 電阻器 32 導線 34 導線 36 導熱絕緣材料 38 電阻器 40 燈罩 50 導熱件 52 焊墊 54 焊墊 56 軸向片 58 側翼 60 穿孔 62 貫孔 64 貫孔 66 接腳 M383090 68 焊錫 70 焊錫 88 墊片 90 晶片電阻器 92 接合線 94 接合線14 Electrode 16 Helical profile 18 Chamber 20 AC LED device 22 AC LED epitaxial wafer 24 Bracket 26 Sealant 30 Resistor 32 Conductor 34 Conductor 36 Thermally Conductive Material 38 Resistor 40 Lampshade 50 Heat Conductor 52 Pad 54 Pad 56 Shaft To the piece 58 side wing 60 perforation 62 through hole 64 through hole 66 pin M383090 68 solder 70 solder 88 pad 90 wafer resistor 92 bonding wire 94 bonding wire