EP2249078B1 - Heat dissipation enhanced LED lamp - Google Patents
Heat dissipation enhanced LED lamp Download PDFInfo
- Publication number
- EP2249078B1 EP2249078B1 EP20100159411 EP10159411A EP2249078B1 EP 2249078 B1 EP2249078 B1 EP 2249078B1 EP 20100159411 EP20100159411 EP 20100159411 EP 10159411 A EP10159411 A EP 10159411A EP 2249078 B1 EP2249078 B1 EP 2249078B1
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- EP
- European Patent Office
- Prior art keywords
- led
- thermally conductive
- lamp
- led lamp
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/80—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with pins or wires
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
- F21V3/02—Globes; Bowls; Cover glasses characterised by the shape
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
- F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
- F21V3/049—Patterns or structured surfaces for diffusing light, e.g. frosted surfaces
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
- F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
- F21V3/10—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by coatings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Definitions
- the present invention is related generally to electric lamps and, more particularly, to a LED lamp which could directly replace an ordinary tungsten, halogen, or electricity-saving light bulb.
- a light emitting diode (LED) lamp using a direct current (DC) LED device as the filament must be equipped with a power converter for converting the alternating current (AC) power voltage into a DC input voltage for the DC LED device.
- the power converter not only requires additional component cost for the LED lamp, but also cannot fit entirely into the standard lamp bases of ordinary light bulbs.
- For a LED lamp to be equipped with a power converter it is necessary to develop special molds to produce containers and corresponding mechanism different from those of ordinary light bulbs to fit the power converter therewithin, which nevertheless increases the cost and volume of the LED lamp.
- a DC LED device generates heat when it is powered on and therefore, an additional heat dissipation mechanism is required to handle the heat.
- the resulting high temperature will reduce the emissive efficiency and service life of the DC LED device and produce other adverse effects such as wavelength shift.
- the power converter particularly the inductor and integrated circuit therein, also generates heat during power conversion, and the consequent high temperature may damage the inductor and integrated circuit and cause failure of the LED lamp accordingly.
- the problems caused by insufficient heat dissipation are aggravated especially in high power applications, such as in lighting fixtures for illumination purposes, where the DC LED device generates relatively more heat.
- some LED lamps use a plurality of low power lamp type LED devices in conjunction with a simple bridge rectifier circuit.
- low power LED devices are poorly accepted in the market due to their generally low brightness, and these LED lamps tend to have serious light attenuation problems as a result of poor heat dissipation.
- An AC LED device includes a plurality of serially and/or parallel connected LED electronic elements manufactured on an epitaxial chip.
- the epitaxial chip is packaged and then connected in series with a resistor having a particular resistance so as to withstand high voltage, e.g., 110 V or 220 V, mains electricity, thus dispensing with the power converter or rectifier circuit required for a DC LED device.
- high voltage e.g. 110 V or 220 V
- GB 2098714 A discloses an LED cluster assembly comprising several light emitting diodes assembled with their necessary circuitry and current limiting resistors into a plastic molding which itself is arranged in and connected to a miniature lamp cap.
- An object of the present invention is to provide a LED lamp which enhances the heat dissipation of the AC LED device in the LED lamp.
- Another object of the present invention is to provide a LED lamp which could directly replace an ordinary tungsten, halogen, or electricity-saving light bulb.
- a LED lamp according to the present invention comprises a filament, a lamp base and a thermally conductive electric insulator.
- the filament includes at least one AC LED device, and the thermally conductive electric insulator is filled in a cavity of the lamp base to mechanically contact with the filament and an electrode of the lamp base.
- the thermally conductive electric insulator provides a thermal channel to transfer heat from the filament to the electrode for heat dissipation enhancement.
- Standard lamp bases for ordinary light bulbs can be selected for the lamp base of a LED lamp according to the present invention, and thus the LED lamp could be inserted into the ordinary bulb sockets that generally used in lighting fixtures, without having to modify the system of the lighting fixtures or use an additional adapter.
- Fig. 1 provides a first embodiment, in which a standard lamp base 10 for use with a small light bulb is used to accentuate the features of the present invention.
- the lamp base 10 has two electrodes 12 and 14 for receiving an AC power source.
- the electrode 12 is a metal housing having a spiral-threaded configuration 16 and a cavity 18 therein.
- an AC LED device 20 is used as the filament of the LED lamp, which includes an AC LED epitaxial chip 22 bounded on a leadframe 24 and covered with an encapsulant 26.
- the LED packaging is a well-known technique, the package structure of the AC LED device 20 is not detailed in the drawing for the sake of simplicity.
- a resistor 30 has one end soldered to the electrode 14 and an opposite end connected to a wire 32 that is soldered to the AC LED device 20.
- Another wire 34 has its two ends soldered to the electrode 12 and the AC LED device 20, respectively.
- This LED lamp has the equivalent circuit shown in Fig. 2 , in which the AC LED epitaxial chip 22 and the resistor 30 are connected in series between the electrodes 12 and 14.
- a so-called AC LED epitaxial chip includes LED electronic elements oriented in two opposite directions and connected in parallel between two pins, with at least one LED electronic element in each direction. The LED electronic elements oriented in the two opposite directions are lit during the positive and negative half cycles of the AC power source, respectively.
- the resistor 30 has a resistance R chosen according to the current intensity required by design.
- the resistor 30 also serves to protect the AC LED epitaxial chip 22. More specifically, when a surge occurs in the AC power source connected to the electrodes 12 and 14, the resistor 30 will absorb most of the surge voltage.
- a major feature is to fill the cavity 18 with a thermally conductive electric insulator 36 such that the thermally conductive electric insulator 36 is in mechanical contact with the electrode 12 and the filament, i.e. the leadframe 24 in this case, to provide a thermal channel to transfer the heat generated by the AC LED epitaxial chip 22 to the electrode 12 when the AC LED epitaxial chip 22 is powered on to emit light, thereby enhancing the heat dissipation therefrom.
- the leadframe 24 typically includes a metal plate for facilitating heat dissipation from the AC LED epitaxial chip 22.
- the thermally conductive electric insulator 36 also assists in heat dissipation from the resistor 30 because the resistor 30 is buried therein.
- thermally conductive electric insulator 36 it may select epoxy resin, or thermal conductor powder such as aluminum oxide, aluminum nitride, boron nitride, or any other thermally conductive materials in powder form, or a mixture thereof.
- Table 1 shows experiment results of using three different thermally conductive materials in the LED lamp of Fig. 1 .
- Table 1 Thermally conductive electric insulator 36 Voltage of AC power source Power consumed AC LED device 20 Output by brightness (lm) Condition after being lit continuously for 1000 hours
- thermally conductive electric insulator 36 As shown in Table 1, when epoxy resin, which has a lower thermal conductivity, was used as the thermally conductive electric insulator 36, a higher temperature was detected after the LED lamp was powered on. On the other hand, the mixture of epoxy resin and thermal conductor powder has a higher thermal conductivity, and therefore no abnormality was found during the lighting test. Good thermal conduction effect was also obtained by directly using thermal conductor powder, filled into the cavity 18 and compacted, as the thermally conductive electric insulator 36. In general, the LED lamp under test had satisfactory output brightness, and substantially no abnormality was detected after the LED lamp was lit continuously for 1000 hours. Other materials may also be used as the thermally conductive electric insulator 36, which preferably has a thermal conductivity ranging from 0.25 to 30 W/mK.
- the LED lamp has approximately the same size as the lamp base 10, possesses good heat dissipation ability, and is capable of high power applications that are unachievable by the prior art devices.
- Ordinary light bulbs are equipped with standard lamp bases.
- lamp bases under the standards E12, E14, E17, E26 and E27 are for the ordinary tungsten light bulbs
- MR16 and GU10 lamp bases are for the ordinary halogen light bulbs.
- the lamp base of an ordinary halogen light bulb has an electrode formed as a columnar metal housing and separated from the other electrode by an electric insulator.
- Some other standard lamp bases use two needle-like electrodes that are insulated from each other.
- the lamp base for a LED lamp according to the present invention can be one of ordinary tungsten or halogen light bulbs or other standard lamp bases where there is always a cavity to be filled with the thermally conductive electric insulator 36, and in consequence at least one electrode serves to facilitate heat dissipation from the filament of the LED lamp. As the electrodes of standard lamp bases are exposed outside, fair heat dissipation effect is attainable.
- a lamp cover 40 may be further added to the LED lamp, depending on demands.
- the lamp cover 40 can be a glass cap, a plastic cap, an epoxy resin cap, or a silicone cap. If a glass cap or a plastic cap is selected, it is bounded to an end of the lamp base 10 by a mechanical means such as gluing, mortise-and-tenon engagement, or screw thread engagement. If an epoxy resin cap or a silicone cap is selected, it is dispensed over the filament in an amount sufficient to completely cover the filament, and the epoxy resin or silicone is heated and cured if necessary.
- the lamp cover 40 functions as a protective shell for preventing moisture, dust, or external force from affecting internal components of the LED lamp.
- the lamp cover 40 also serves as an optical component. More specifically, the lamp cover 40 may be frosted or configured with geometric patterns so as to produce the desired optical effects.
- the frosted structure of the lamp cover 40 can be formed by sand blasting, etching, electrostatic powder coating, coating with silicone, spraying with paint, or injection molding.
- the filament may include a circuit board to be bounded with the AC LED epitaxial chip 22 thereon.
- the circuit board is attached on the thermally conductive electric insulator 36, and the AC LED epitaxial chip 22 may be a surface mounting device (SMD) or have a chip on board (COB) package structure, in addition to the lamp type LED device 22 shown in Fig. 1 .
- SMD surface mounting device
- COB chip on board
- An AC LED epitaxial chip including more than two LED electronic elements may be used for the AC LED epitaxial chip 22 to provide brighter illumination.
- Fig. 3 provides three such AC LED epitaxial chips 22.
- the first one in the left includes two LED strings parallel connected in opposite directions between two pins of the AC LED epitaxial chips 22, each LED string having two or more LED electronic elements.
- the second case in the middle includes two or more pairs of LED electronic elements serially connected between two pins of the AC LED epitaxial chips 22, each pair of LED electronic elements parallel connected in opposite directions to each other.
- the last case in the right includes five or more LED electronic elements having a bridge configuration between two pins of the AC LED epitaxial chips 22. There have been commercial products can be selected for these cases.
- a filament includes nine AC LED devices 20 bounded on a circuit board 28 in such a manner that three rows of AC LED devices 20 are connected in parallel between solder pads 52 and 54 on the circuit board 28, and each row includes three AC LED devices 20. If each of the AC LED devices 20 operates at a power of 1 W, the filament shown in Fig. 4 can operate at a power as high as 9 W.
- Fig. 5 provides a second embodiment according to the present invention, in which a circuit board 28 has a through hole 60, a thermally conductive member 50 passes through the through hole 60 and has a first end above the circuit board 28 and a second end buried in a thermally conductive electric insulator 36, and an AC LED device 20 having a plastic leaded chip carrier (PLCC) package structure is bounded to the first end of the thermally conductive member 50.
- the thermally conductive member 50 has two strips 56 and two flanges 58. Each of the strips 56 has an axial length ranging from 0.1 to 10 cm, preferably ranging from 0.5 to 3.0 cm. The flanges 58 are sandwiched between the AC LED device 20 and the circuit board 28.
- the circuit board 28 has through holes 62 to be soldered with the pins of the AC LED device 20 by means of solder 68, and through holes 64 to be soldered to an electrode 12 by means of solder 70.
- the through holes 62 and 64 may be replaced by blind holes or other structures, as is well known in the art of circuit board.
- a resistor 30 is soldered between an electrode 14 and the circuit board 28 such that the resistor 30 and the AC LED device 20 are connected in series between the electrodes 12 and 14.
- the circuit board 28 has a glass fiber reinforced substrate or a metal substrate.
- the circuit board 28 is also in mechanical contact with the thermally conductive electric insulator 36.
- the resistor 30 is bounded on the circuit board 28.
- a second resistor is bounded on the circuit board 28 and connected with the first resistor 30 in series.
- the resistor bounded on the circuit board 28 may be a variable resistor.
- the LED lamp in this embodiment is provided with a lamp cover 40, as in the previous embodiment.
- Fig. 6 provides a third embodiment, in which an AC LED device 20 is bounded to a circuit board 28 with a COB package structure, and the circuit board 28 is attached on a thermally conductive electric insulator 36.
- the circuit board 28 has an aluminum metal layer 72, a copper metal layer 76, and a thermally conductive layer 74 sandwiched therebetween, and this structure exhibits better heat dissipation capability than a glass fiber reinforced substrate.
- the circuit board 28 is soldered to an electrode 12 by solder 70, and a resistor 30 is soldered between an electrode 14 and the circuit board 28, such that the resistor 30 and the AC LED device 20 are connected in series between the electrodes 12 and 14.
- the resistor 30 is bounded on the circuit board 28.
- a second resistor is bounded on the circuit board 28 and serially connected to the first resistor 30.
- the resistor bounded on the circuit board 28 may be a variable resistor.
- the LED lamp is provided with a lamp cover, as in the previous embodiment.
- the AC LED device 20 may be a SMD that is bounded on the circuit board 28 by surface mounting technology (SMT).
- the AC LED device 20 having a rated power ranging from 0.3 to 5 W, preferably from 1 to 3 W, and the resistor 30 preferably having a resistance ranging from 50 to 50,000 ⁇ .
- the AC LED device 20 having a rated input voltage ranging from 12 to 240 V.
- the rated input voltage of the AC LED device 20 is selected to be 110 or 220 V, depending on the power lines in its application.
- the rated input voltage of each AC LED device 20 is selected to be smaller, for example 12 V.
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Description
- The present invention is related generally to electric lamps and, more particularly, to a LED lamp which could directly replace an ordinary tungsten, halogen, or electricity-saving light bulb.
- A light emitting diode (LED) lamp using a direct current (DC) LED device as the filament must be equipped with a power converter for converting the alternating current (AC) power voltage into a DC input voltage for the DC LED device. The power converter not only requires additional component cost for the LED lamp, but also cannot fit entirely into the standard lamp bases of ordinary light bulbs. For a LED lamp to be equipped with a power converter, it is necessary to develop special molds to produce containers and corresponding mechanism different from those of ordinary light bulbs to fit the power converter therewithin, which nevertheless increases the cost and volume of the LED lamp. On the other hand, a DC LED device generates heat when it is powered on and therefore, an additional heat dissipation mechanism is required to handle the heat. If the heat is not effectively dissipated, the resulting high temperature will reduce the emissive efficiency and service life of the DC LED device and produce other adverse effects such as wavelength shift. Moreover, the power converter, particularly the inductor and integrated circuit therein, also generates heat during power conversion, and the consequent high temperature may damage the inductor and integrated circuit and cause failure of the LED lamp accordingly. The problems caused by insufficient heat dissipation are aggravated especially in high power applications, such as in lighting fixtures for illumination purposes, where the DC LED device generates relatively more heat. To adapt to the relatively small space within ordinary lamp bases, some LED lamps use a plurality of low power lamp type LED devices in conjunction with a simple bridge rectifier circuit. However, low power LED devices are poorly accepted in the market due to their generally low brightness, and these LED lamps tend to have serious light attenuation problems as a result of poor heat dissipation.
- In recent years, AC LED devices are maturing technically, have improved in brightness, and therefore have had commercial value. An AC LED device includes a plurality of serially and/or parallel connected LED electronic elements manufactured on an epitaxial chip. The epitaxial chip is packaged and then connected in series with a resistor having a particular resistance so as to withstand high voltage, e.g., 110 V or 220 V, mains electricity, thus dispensing with the power converter or rectifier circuit required for a DC LED device. In consequence, the cost of an AC LED lamp is lowered in comparison with its DC counterpart, and the circuit related quality issues reduced. An AC LED device, though conveniently applicable in small spaces, still demands heat dissipation. This is especially true in high power applications, such as lighting fixtures for illumination purposes, where the AC LED device generates relatively more heat. If a heat dissipating device is added, the resultant LED lamp will be bulky and costly. However, if no additional assistance is provided to enhance heat dissipation from the AC LED device, the emissive efficiency and service life of the AC LED device will be reduced, wavelength shift is likely to happen, and even worse, the LED epitaxial chip may be burned out.
-
GB 2098714 A - An object of the present invention is to provide a LED lamp which enhances the heat dissipation of the AC LED device in the LED lamp.
- Another object of the present invention is to provide a LED lamp which could directly replace an ordinary tungsten, halogen, or electricity-saving light bulb.
- These objects are solved by the LED lamp according to the independent claim. Advantageous improvements of the LED lamp are given by the dependent claims.
- A LED lamp according to the present invention comprises a filament, a lamp base and a thermally conductive electric insulator. The filament includes at least one AC LED device, and the thermally conductive electric insulator is filled in a cavity of the lamp base to mechanically contact with the filament and an electrode of the lamp base. When the AC LED device is powered on, the thermally conductive electric insulator provides a thermal channel to transfer heat from the filament to the electrode for heat dissipation enhancement.
- Standard lamp bases for ordinary light bulbs can be selected for the lamp base of a LED lamp according to the present invention, and thus the LED lamp could be inserted into the ordinary bulb sockets that generally used in lighting fixtures, without having to modify the system of the lighting fixtures or use an additional adapter.
- These and other objects, features and advantages of the present invention will become apparent to those skilled in the art upon consideration of the following description of the preferred embodiments of the present invention taken in conjunction with the accompanying drawings, in which:
-
Fig. 1 is a cross-sectional view of a LED lamp in a first embodiment not covered by claim 1. -
Fig. 2 shows an equivalent circuit of the LED lamp depicted inFig. 1 ; -
Fig. 3 provides three AC LED epitaxial chips; -
Fig. 4 is a top view of a filament using multiple LED epitaxial chips; -
Fig. 5 is a cross-sectional view of a LED lamp in a second embodiment according the present invention; and -
Fig. 6 is a cross-sectional view of a LED lamp in a third embodiment not covered by claim 1. -
Fig. 1 provides a first embodiment, in which astandard lamp base 10 for use with a small light bulb is used to accentuate the features of the present invention. Thelamp base 10 has twoelectrodes electrode 12 is a metal housing having a spiral-threadedconfiguration 16 and acavity 18 therein. In this embodiment, anAC LED device 20 is used as the filament of the LED lamp, which includes an AC LEDepitaxial chip 22 bounded on aleadframe 24 and covered with anencapsulant 26. As the LED packaging is a well-known technique, the package structure of theAC LED device 20 is not detailed in the drawing for the sake of simplicity. Aresistor 30 has one end soldered to theelectrode 14 and an opposite end connected to awire 32 that is soldered to theAC LED device 20. Anotherwire 34 has its two ends soldered to theelectrode 12 and theAC LED device 20, respectively. This LED lamp has the equivalent circuit shown inFig. 2 , in which the AC LEDepitaxial chip 22 and theresistor 30 are connected in series between theelectrodes resistor 30 has a resistance R chosen according to the current intensity required by design. Theresistor 30 also serves to protect the AC LEDepitaxial chip 22. More specifically, when a surge occurs in the AC power source connected to theelectrodes resistor 30 will absorb most of the surge voltage. - Referring back to
Fig. 1 , a major feature is to fill thecavity 18 with a thermally conductiveelectric insulator 36 such that the thermally conductiveelectric insulator 36 is in mechanical contact with theelectrode 12 and the filament, i.e. theleadframe 24 in this case, to provide a thermal channel to transfer the heat generated by the AC LEDepitaxial chip 22 to theelectrode 12 when the AC LEDepitaxial chip 22 is powered on to emit light, thereby enhancing the heat dissipation therefrom. As would be understood by a person of ordinary skill in the art, theleadframe 24 typically includes a metal plate for facilitating heat dissipation from the AC LEDepitaxial chip 22. Therefore, by attaching theleadframe 24 to the thermally conductiveelectric insulator 36, good thermal conduction effect can be achieved. In addition to enhance the heat dissipation from the AC LEDepitaxial chip 22, the thermally conductiveelectric insulator 36 also assists in heat dissipation from theresistor 30 because theresistor 30 is buried therein. - For the thermally conductive
electric insulator 36, it may select epoxy resin, or thermal conductor powder such as aluminum oxide, aluminum nitride, boron nitride, or any other thermally conductive materials in powder form, or a mixture thereof. Table 1 shows experiment results of using three different thermally conductive materials in the LED lamp ofFig. 1 .Table 1 Thermally conductive electric insulator 36Voltage of AC power source Power consumed AC LED device 20Output by brightness (lm) Condition after being lit continuously for 1000 hours Epoxy resin 110 V 1 65 No abnormality detected, except for relatively high temperature Epoxy resin+ aluminum oxide powder 110 V 1 68 No abnormality detected Aluminum oxide powder 110 V 1 68 No abnormality detected - As shown in Table 1, when epoxy resin, which has a lower thermal conductivity, was used as the thermally conductive
electric insulator 36, a higher temperature was detected after the LED lamp was powered on. On the other hand, the mixture of epoxy resin and thermal conductor powder has a higher thermal conductivity, and therefore no abnormality was found during the lighting test. Good thermal conduction effect was also obtained by directly using thermal conductor powder, filled into thecavity 18 and compacted, as the thermally conductiveelectric insulator 36. In general, the LED lamp under test had satisfactory output brightness, and substantially no abnormality was detected after the LED lamp was lit continuously for 1000 hours. Other materials may also be used as the thermally conductiveelectric insulator 36, which preferably has a thermal conductivity ranging from 0.25 to 30 W/mK. - As shown in
Fig. 1 , the LED lamp has approximately the same size as thelamp base 10, possesses good heat dissipation ability, and is capable of high power applications that are unachievable by the prior art devices. Ordinary light bulbs are equipped with standard lamp bases. For example, lamp bases under the standards E12, E14, E17, E26 and E27 are for the ordinary tungsten light bulbs, and MR16 and GU10 lamp bases are for the ordinary halogen light bulbs. The lamp base of an ordinary halogen light bulb has an electrode formed as a columnar metal housing and separated from the other electrode by an electric insulator. Some other standard lamp bases use two needle-like electrodes that are insulated from each other. The lamp base for a LED lamp according to the present invention can be one of ordinary tungsten or halogen light bulbs or other standard lamp bases where there is always a cavity to be filled with the thermally conductiveelectric insulator 36, and in consequence at least one electrode serves to facilitate heat dissipation from the filament of the LED lamp. As the electrodes of standard lamp bases are exposed outside, fair heat dissipation effect is attainable. - Referring to
Fig. 1 , alamp cover 40 may be further added to the LED lamp, depending on demands. Thelamp cover 40 can be a glass cap, a plastic cap, an epoxy resin cap, or a silicone cap. If a glass cap or a plastic cap is selected, it is bounded to an end of thelamp base 10 by a mechanical means such as gluing, mortise-and-tenon engagement, or screw thread engagement. If an epoxy resin cap or a silicone cap is selected, it is dispensed over the filament in an amount sufficient to completely cover the filament, and the epoxy resin or silicone is heated and cured if necessary. The lamp cover 40 functions as a protective shell for preventing moisture, dust, or external force from affecting internal components of the LED lamp. Besides, thelamp cover 40 also serves as an optical component. More specifically, thelamp cover 40 may be frosted or configured with geometric patterns so as to produce the desired optical effects. The frosted structure of thelamp cover 40 can be formed by sand blasting, etching, electrostatic powder coating, coating with silicone, spraying with paint, or injection molding. - Alternatively, the filament may include a circuit board to be bounded with the AC
LED epitaxial chip 22 thereon. In this case, the circuit board is attached on the thermally conductiveelectric insulator 36, and the ACLED epitaxial chip 22 may be a surface mounting device (SMD) or have a chip on board (COB) package structure, in addition to the lamptype LED device 22 shown inFig. 1 . - An AC LED epitaxial chip including more than two LED electronic elements may be used for the AC
LED epitaxial chip 22 to provide brighter illumination.Fig. 3 provides three such AC LED epitaxial chips 22. The first one in the left includes two LED strings parallel connected in opposite directions between two pins of the AC LEDepitaxial chips 22, each LED string having two or more LED electronic elements. The second case in the middle includes two or more pairs of LED electronic elements serially connected between two pins of the AC LEDepitaxial chips 22, each pair of LED electronic elements parallel connected in opposite directions to each other. The last case in the right includes five or more LED electronic elements having a bridge configuration between two pins of the AC LED epitaxial chips 22. There have been commercial products can be selected for these cases. - If it is desired to increase the brightness of a LED lamp, more
AC LED devices 20 can be connected in series, in parallel, or in series and parallel in the filament. For example, as shown inFig. 4 , a filament includes nineAC LED devices 20 bounded on acircuit board 28 in such a manner that three rows ofAC LED devices 20 are connected in parallel betweensolder pads circuit board 28, and each row includes threeAC LED devices 20. If each of theAC LED devices 20 operates at a power of 1 W, the filament shown inFig. 4 can operate at a power as high as 9 W. -
Fig. 5 provides a second embodiment according to the present invention, in which acircuit board 28 has a throughhole 60, a thermallyconductive member 50 passes through the throughhole 60 and has a first end above thecircuit board 28 and a second end buried in a thermally conductiveelectric insulator 36, and anAC LED device 20 having a plastic leaded chip carrier (PLCC) package structure is bounded to the first end of the thermallyconductive member 50. The thermallyconductive member 50 has twostrips 56 and twoflanges 58. Each of thestrips 56 has an axial length ranging from 0.1 to 10 cm, preferably ranging from 0.5 to 3.0 cm. Theflanges 58 are sandwiched between theAC LED device 20 and thecircuit board 28. Thecircuit board 28 has throughholes 62 to be soldered with the pins of theAC LED device 20 by means ofsolder 68, and throughholes 64 to be soldered to anelectrode 12 by means ofsolder 70. The through holes 62 and 64 may be replaced by blind holes or other structures, as is well known in the art of circuit board. Aresistor 30 is soldered between anelectrode 14 and thecircuit board 28 such that theresistor 30 and theAC LED device 20 are connected in series between theelectrodes circuit board 28 has a glass fiber reinforced substrate or a metal substrate. Preferably, thecircuit board 28 is also in mechanical contact with the thermally conductiveelectric insulator 36. Alternatively, theresistor 30 is bounded on thecircuit board 28. In some other embodiments, a second resistor is bounded on thecircuit board 28 and connected with thefirst resistor 30 in series. In these two cases, the resistor bounded on thecircuit board 28 may be a variable resistor. If necessary, the LED lamp in this embodiment is provided with alamp cover 40, as in the previous embodiment. -
Fig. 6 provides a third embodiment, in which anAC LED device 20 is bounded to acircuit board 28 with a COB package structure, and thecircuit board 28 is attached on a thermally conductiveelectric insulator 36. Thecircuit board 28 has analuminum metal layer 72, acopper metal layer 76, and a thermallyconductive layer 74 sandwiched therebetween, and this structure exhibits better heat dissipation capability than a glass fiber reinforced substrate. Thecircuit board 28 is soldered to anelectrode 12 bysolder 70, and aresistor 30 is soldered between anelectrode 14 and thecircuit board 28, such that theresistor 30 and theAC LED device 20 are connected in series between theelectrodes resistor 30 is bounded on thecircuit board 28. In some other embodiments, a second resistor is bounded on thecircuit board 28 and serially connected to thefirst resistor 30. In these two cases, the resistor bounded on thecircuit board 28 may be a variable resistor. If necessary, the LED lamp is provided with a lamp cover, as in the previous embodiment. In other embodiments, theAC LED device 20 may be a SMD that is bounded on thecircuit board 28 by surface mounting technology (SMT). - Depending on practice applications, it is selected the
AC LED device 20 having a rated power ranging from 0.3 to 5 W, preferably from 1 to 3 W, and theresistor 30 preferably having a resistance ranging from 50 to 50,000 Ω. In addition, it is selected theAC LED device 20 having a rated input voltage ranging from 12 to 240 V. For a LED lamp using a singleAC LED device 20, the rated input voltage of theAC LED device 20 is selected to be 110 or 220 V, depending on the power lines in its application. For a LED lamp using serially connectedAC LED devices 20, the rated input voltage of eachAC LED device 20 is selected to be smaller, for example 12 V.
Claims (10)
- A LED lamp, comprising:a LED filament including an AC LED device (20) having a rated power ranging from 0.3 to 5 W, a circuit board (28) having a through hole (60) and soldered with the AC LED device (20);a lamp base (10) having two electrodes (12, 14) and a cavity (18), the first electrode (12) having a spiral-threaded, columnar, or needle-like configuration;a resistor (30) having a resistance ranging from 50 to 50,000 Ohm, connected in series with the AC LED device (20) between the two electrodes (12, 14); anda thermally conductive electric insulator (36) having a thermal conductivity ranging from 0.25 to 30 W/mK, filled in the cavity (18) and mechanically contacting with the LED filament and the first electrode (12) to provide a thermal channel to transfer heat from the AC LED device (20) to the first electrode (12) for heat dissipation enhancement when the AC LED device (20) is powered on,wherein the LED filament further comprises a thermally conductive member (50) passing through the through hole (60), having a first end having the AC LED device (20) bounded thereon and a second end buried in the thermally conductive electric insulator (36), and wherein the second end of the thermally conductive member (50) has two strips (56), each of the strips has an axial length ranging from 0.1 to 10 cm, and wherein the thermally conductive member (50) has two flanges, the flanges being sandwiched between the AC LED device (20) and the circuit board (28).
- The LED lamp of claim 1, wherein the circuit board (28) is soldered to the first electrode (12).
- The LED lamp of claim 1, wherein the circuit board (28) has a glass fiber reinforced substrate.
- The LED lamp of claim 1, wherein the LED device (20) has a plastic leaded chip carrier package structure.
- The LED lamp of claim 1, wherein the resistor (30) is bounded on the circuit board (28).
- The LED lamp of claim 1, wherein the circuit board (28) comprises:an aluminum metal layer (72) in mechanical contact with the thermally conductive electric insulator (36);a copper metal layer (76) having the LED device (20) soldered thereon; anda thermally conductive layer (74) sandwiched between the aluminum metal layer (72) and the copper metal layer (76).
- The LED lamp of claim 1, wherein the LED device (20)has a chip on board package structure.
- The LED lamp of claim 1, wherein the thermally conductive electric insulator (36) comprises an epoxy resin, thermal conductor powder, or a mixture thereof.
- The LED lamp of claim 1, wherein the resistor (30) is buried in the thermally conductive electric insulator (36).
- The LED lamp of claim 1, further comprising a lamp cover (40) encapsulating the filament.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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TW098115441A TW201041426A (en) | 2009-05-08 | 2009-05-08 | LED lamp and manufacturing method thereof |
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EP2249078A1 EP2249078A1 (en) | 2010-11-10 |
EP2249078B1 true EP2249078B1 (en) | 2015-04-29 |
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EP20100159411 Active EP2249078B1 (en) | 2009-05-08 | 2010-04-08 | Heat dissipation enhanced LED lamp |
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TW (1) | TW201041426A (en) |
Families Citing this family (6)
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US10158057B2 (en) | 2010-10-28 | 2018-12-18 | Corning Incorporated | LED lighting devices |
TW201245613A (en) * | 2011-05-03 | 2012-11-16 | Gixia Group Co Tw | Dual-component plastic lamp holder for LED light bulb and light bulb assembly having the same |
US9202996B2 (en) | 2012-11-30 | 2015-12-01 | Corning Incorporated | LED lighting devices with quantum dot glass containment plates |
CN203743927U (en) * | 2014-03-05 | 2014-07-30 | 游宇 | LED lamp bulb |
CN107339300B (en) * | 2014-09-28 | 2022-02-08 | 嘉兴山蒲照明电器有限公司 | External heating equipment for manufacturing LED straight lamp |
WO2024040763A1 (en) * | 2022-08-26 | 2024-02-29 | 深圳市神牛摄影器材有限公司 | Lamp for photography and video recording |
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GB2098714B (en) * | 1980-06-04 | 1984-08-22 | Tranilamp Ltd | Led cluster assembly |
GB0000511D0 (en) * | 2000-01-12 | 2000-03-01 | Oxley Dev Co Ltd | Led package |
JP4135485B2 (en) * | 2002-12-06 | 2008-08-20 | 東芝ライテック株式会社 | Light emitting diode light source and light emitting diode lighting fixture |
CN100480577C (en) * | 2004-10-01 | 2009-04-22 | 沈锦祥 | LED spot light |
CN1859821A (en) * | 2005-05-08 | 2006-11-08 | 卢国文 | Alternative current directly driving light emitting diode lighting device |
JP4922607B2 (en) * | 2005-12-08 | 2012-04-25 | スタンレー電気株式会社 | LED light source device |
FR2922711B1 (en) * | 2007-10-23 | 2009-12-11 | Mafelec | ELECTROLUMINESCENT DIODE LAMP. |
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TWI507633B (en) | 2015-11-11 |
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