TWM514655U - Illumination element and illumination device - Google Patents

Abstract

An illumination element includes a glass substrate, having a first conductive contact and a second conductive contact disposed thereon. A silver paste layer is disposed on the glass substrate, having a first area covering the first conductive contact, a second area covering the second conductive contact and a third area covering an area excluding the first conductive contact and the second conductive contact. A plurality of illumination units disposed on the silver paste substrate. In addition, a phosphor layer covers the illumination unit and a portion of the silver paste layer, wherein another portion of the silver paste layer which is not covered with the phosphor layer provides a function of heat dissipation for the illumination units.

Description

Light-emitting element and light-emitting device

This creation is mainly about a light-emitting device, especially a light bulb.

Light-emitting diodes have gradually replaced traditional incandescent light bulbs as light sources because of their long life and low power consumption. However, in order to be able to cooperate with existing lamps, the light source with the light-emitting diode is also designed in the form of a conventional light bulb.

However, the conventional light-emitting diode bulb is difficult to assemble, and the manufacturing cost is high, and it is difficult to popularize it in a large amount. Therefore, there are still many challenges in how to simplify assembly and reduce manufacturing costs.

The present invention provides a light-emitting device having excellent thermal conductivity to extend the life of the light-emitting device.

According to some embodiments of the present invention, a light emitting device includes a glass substrate having a first conductive contact and a second conductive contact disposed on the glass substrate; the silver paste layer is disposed on the glass substrate and has a first conductive contact The first region, the second region and the third region covering the second conductive contact are located on a region other than the first conductive contact and the second conductive contact; the plurality of light emitting units are disposed on the silver paste layer; and the fluorescent layer Covering a portion of the light emitting unit, wherein another portion of the silver paste layer not covered by the phosphor layer has a function of dissipating heat from the light emitting unit.

According to some embodiments of the present invention, a light emitting device is provided, comprising a light source socket having a top surface, a light source socket formed on the top surface, and a fixing groove formed on the top surface and connected to the light source socket; the conductive component is embedded in the light source In the socket, wherein the conductive component has a conductive end protruding from the sidewall of the light source socket; and the above-mentioned light-emitting component is inserted into the light source socket and contacts the conductive end.

The present invention is to apply a layer of silver paste on the circuit board of the light-emitting element of the light-emitting device, and the layer of silver paste having a good thermal conductivity can quickly derive the heat generated by the light-emitting unit of the light-emitting element during use to achieve Extend the life of the illuminator.

1‧‧‧Lighting device

10‧‧‧Electrical connector

11‧‧‧ thread

12‧‧‧Connection slot

20‧‧‧ Pedestal

21‧‧‧Installation slot

30‧‧‧Power Module

31‧‧‧Power body

311‧‧‧Transformer

312‧‧‧Rectifier

32‧‧‧electrode terminal

40‧‧‧Light source socket

41‧‧‧ top surface

42‧‧‧Light source slot

421‧‧‧Light source opening

422‧‧‧First side wall

423‧‧‧ second side wall

43‧‧‧ fixing slot

431‧‧‧Fixed opening

44‧‧‧Ring stop

441‧‧‧ accommodating slots

50‧‧‧ Conductive components

51‧‧‧Conducting components

511‧‧‧Connecting Department

512‧‧‧conductive end

513‧‧‧ conductive end

514‧‧‧ electrode end

60‧‧‧Lighting elements

61‧‧‧ boards

62‧‧‧Lighting unit

63‧‧‧Fluorescent layer

64‧‧‧ Silver layer

641‧‧‧The first zone of the silver paste layer

642‧‧‧Second area of the silver paste layer

643‧‧‧The third zone of the silver paste layer

651‧‧‧First conductive contact

652‧‧‧Second conductive contacts

66‧‧‧Wire

70‧‧‧ Cover

C1‧‧ Center

D1‧‧‧ portrait

D2‧‧‧Drop direction

Fig. 1 is a perspective view of the light-emitting device of the present invention.

Fig. 2 is an exploded view of the light-emitting device of the present invention.

Fig. 3 is a plan view of the light source socket and the light-emitting element of the present invention, in which only two light-emitting elements are drawn for the purpose of clear display.

4A to 4C are plan views showing light-emitting elements according to different embodiments in the present creation.

5A to 5C are plan views of light-emitting elements according to different embodiments of the present creation.

6A to 6C are schematic cross-sectional views showing the light-emitting element of the present invention inserted into a light source socket.

The illuminating device of the present invention will be described in detail below. It should be understood that the following description provides many different embodiments or examples for implementing the present invention. The creation is not the same. The specific components and arrangements described below are intended to provide a brief description of the creation. Of course, these are by way of example only and not by the definition of the present invention. Moreover, repeated numbers or labels may be used in different embodiments. These repetitions are merely for the purpose of simplicity and clarity of the present invention and are not intended to be any limitation of the various embodiments and/or structures discussed. Furthermore, when the first material layer is on or above the second material layer, the first material layer is in direct contact with the second material layer. Alternatively, it is also possible to have one or more layers of other materials interposed, in which case there may be no direct contact between the first layer of material and the second layer of material.

Fig. 1 is a perspective view of the light-emitting device 1 of the present invention. Figure 2 is the current An exploded view of the illuminating device 1 created. Fig. 3 is a plan view of the light source socket 40 and the light-emitting element 60 of the present invention. For the purpose of clear display, only two light-emitting elements 60 are drawn in Fig. 3. The illuminating device 1 can be a bulb for insertion in a luminaire (not shown).

Referring to Figures 1-3, the light-emitting device 1 includes a conductive joint 10 and a base. 20. A power module 30, a light source socket 40, a conductive component 50, a plurality of light emitting elements 60, and a cover 70. The conductive joint 10 can be a metal housing for insertion into a luminaire. The outer side wall of the conductive joint 10 may have a thread 11 for locking to a power socket (not shown) of the lamp. In addition, the conductive joint 10 is disposed below the light source socket 40 and has a connection groove 12.

The susceptor 20 is disposed above the conductive joint 10, in this embodiment, The bottom of the susceptor 20 is inserted into the connection groove 12 of the conductive joint 10. The base 20 can be made of an insulating material such as plastic. In some embodiments, a thermal conductive powder such as a carbon material, inorganic thermally conductive particles, or metal particles may be added to the insulating material to increase the heat conduction effect. The top of the base 20 has a mounting groove 21.

The power module 30 is disposed under the light source socket 40 and located at the base 20 inside the installation slot 21. In other words, the power module 30 can be located between the base 20 and the light source socket 40. In some embodiments, the power module 30 can be disposed in the connecting slot 12 of the conductive connector 10.

The power module 30 is configured to electrically connect the conductive joint 10 and the conductive component The power module 30 includes a power source body 31 and a plurality of electrode terminals 32. The power source body 31 is disposed in the mounting slot 21 of the base 20, and the power source body 31 is electrically connected to the conductive connector 10. The electrode terminal 32 is connected to the power source body 31 and passes through the bottom of the light source socket 40 to be electrically connected to the conductive component 50.

In general, the power supply provided by the power socket of the lamp is voltage. The alternating current of 110V or 220V allows the power source body 31 to convert the alternating current into a direct current and a voltage suitable for the light-emitting element 60. In some embodiments, the power supply body 31 includes electronic components such as a transformer 311 and a rectifier 312.

The light source socket 40 is disposed in the mounting groove 21 of the base 20. Light source socket 40 can be made of an insulating material such as plastic. In some embodiments, a thermal conductive powder such as a carbon material, inorganic thermally conductive particles, or metal particles may be added to the insulating material to increase the heat conduction effect.

The conductive component 50 (shown in FIG. 3) is embedded in the light source socket 40 The conductive component 50 is electrically connected to the conductive connector 10, the power module 30, and the light emitting component 60. The light emitting element 60 is inserted into the light source socket 40 and is substantially perpendicular to the light source socket 40. The light-emitting element 60 acts as a light source for generating light.

The cover 70 is disposed on the mounting groove 21 of the base 20 and covers the light source The holder 40 and the light emitting element 60. In other words, the light source socket 40 and the light emitting element 60 are located inside the cover 70, and the cover 70 is disposed above the base 20. The cover 70 can be transparent Made of bright materials, such as glass. The outer surface of the bottom of the cover 70 may be fixed to the inner side wall of the mounting groove 21, in other words, the bottom of the cover 70 is located between the inner side wall of the mounting groove 21 and the light source socket 40. In the present embodiment, the cover 70 can be spaced apart from the light source socket 40 and the light-emitting element 60.

As shown in FIG. 3, the light source socket 40 has a top surface 41 and a plurality of light sources. The slot 42 and the plurality of fixing slots 43. The number of the light source slots 42 may be two or more. In this embodiment, the number of the light source slots 42 is four. The fixing groove 43 is formed on the top surface 41 and is connected to the light source socket 42. In the embodiment, each light source slot 42 is connected to two fixing slots 43.

Each light source slot 42 has a light source opening on the top surface 41 421, the light source opening 421 can be elongated. In some embodiments, the light source opening 421 is rectangular, each fixing groove 43 has a fixed opening 431 at the top surface 41, and the fixed opening 431 extends substantially perpendicular to the longitudinal direction D1 of the light source opening 421. .

In the present embodiment, the light source socket 40 includes an annular stop portion 44 disposed on the top surface 41, and a receiving groove 441 is formed between the annular stop portion 44 and the top surface 41. The accommodating groove 441 is connected to the light source slot 42 and the fixing groove 43.

The light-emitting element 60 is inserted into the light source socket 42 of the light source socket 40 via the accommodating groove 441, and the light-emitting element 60 can be substantially perpendicular to the top surface 41 of the light source socket 40. 4A-4C is a plan view of some embodiments of the light-emitting element 60 of the present invention. The light-emitting element 60 includes a circuit board 61, a plurality of light-emitting units 62, a phosphor layer 63, a silver paste layer 64, and wires 66. The circuit board 61 is for inserting into the light source socket 42 of the light source socket 40. In the embodiment, the circuit board 61 is an elongated flat plate structure and can extend substantially in the plugging direction D2.

In some embodiments, circuit board 61 can be a transparent glass substrate. Therefore, the light generated by the light emitting unit 62 can penetrate the circuit board 61, thereby increasing the overall brightness of the light emitting device 1. In some embodiments, the substrate of circuit board 61 can be a glass substrate. In some embodiments, the glass substrate may be cerium oxide glass, borosilicate glass, alkali-free borosilicate glass or silicate glass.

The circuit board 61 has a first conductive contact 651 and a second conductive contact 652. As shown in FIG. 4A, the first conductive contact 651 and the second conductive contact 652 are disposed at the bottom of the circuit board 61. In some embodiments, the first conductive contact 651 is a negative conductive contact, and the second conductive connection Point 652 is the positive conductive contact.

As shown in Figure 4A, the silver paste layer 64 has three sections, respectively The first region 641 covering the first conductive contact 651 covers the second region 642 of the second conductive contact 652 and the third region 643 covering the region other than the first conductive contact 651 and the second conductive contact 652. The constituent material of the silver paste layer 64 comprises nano silver particles and an adhesive, wherein the adhesive may be epoxy resin or low temperature glass, since the silver paste layer 64 contains a large amount of nano silver particles, which is opposite to the circuit composed of the glass substrate. The plate 61 has a better thermal conductivity (the thermal conductivity of the glass is 0.7-5 W/mK, and the thermal conductivity of silver is 429 W/mK), so the silver paste layer 64 can serve as a thermally conductive substrate for the light-emitting unit 62, and the light-emitting unit 62 can be used. The heat generated is quickly exported. In some embodiments, the thickness of the silver paste layer 64 is between about 0.01 mm and 2 mm. In some embodiments, the silver paste layer 64 is applied to the circuit board 61 and formed by sintering at a temperature of 150-850 ° C for 10-60 minutes.

The light emitting unit 62 can be a light emitting diode for generating light. hair The light unit 62 is disposed on the circuit board 61, and the light emitting unit 62 is arranged on the circuit board 61 substantially along the plugging direction D2, and is electrically connected to the first conductive contact 651 and the second conductive contact 652 by wires 66.

As shown in FIG. 4A, in some embodiments, the light emitting unit 62 can The light-emitting unit 62 is disposed on the third region 643 of the silver paste layer 64, and each of the light-emitting units 62 is disposed on the third region 643 of the silver paste layer 64. In this embodiment, since the light-emitting unit 62 is in direct contact with the silver paste layer 64. Therefore, the heat generated by the light-emitting unit 62 during use can also be directly transmitted to the silver paste layer 64, and the heat is derived by the good thermal conductivity of the silver paste layer 64.

As shown in FIG. 4B, in some embodiments, the light emitting unit 62 can The circuit board 61 is disposed on the circuit board 61 and spaced apart from the third area 643 of the silver paste layer 64. The third area 643 of the silver paste layer 64 may be two blocks respectively disposed on opposite sides of the area where the light emitting unit 62 is located. For example, the circuit board 61 is disposed on the circuit board 61 above and below the area where the light-emitting units 62 are located (as shown in FIG. 4B), or may be disposed on the left and right circuit boards 61 in the area where the light-emitting units 62 are located. The upper portion (not shown), or the third region 643 of the silver paste layer 64 may also be disposed in a rectangular shape or an annular shape of another shape (not shown) to surround the light emitting units 62 so that the circuit board around the light emitting unit 62 The 61 is covered with a layer of silver paste 64. In some embodiments, although the light-emitting unit 62 does not directly contact the silver paste layer 64, the circuit board 61 around it is covered with a silver paste layer 64 of good thermal conductivity, and thus still has the ability to generate the light-emitting unit 62. The effect of heat quickly exporting.

As shown in FIG. 4C, in some embodiments, the light emitting unit 62 can The third zone 643 of the silver paste layer 64 is disposed on the third zone 643 of the silver paste layer 64, and the third zone 643 of the silver paste layer 64 is coupled to the first zone 641. In this embodiment, since the region covered by the silver paste layer 64 has a large area, the heat conduction effect is better than that of the embodiments of FIGS. 4A and 4B, and the silver paste layer 64 has electrical conductivity properties, and thus is located on the circuit board. The lowermost light-emitting unit 62 can directly connect the wire 66 to the third zone 643 of the silver paste layer 64. The light-emitting unit 62 and the first conductive contact 651 are electrically connected without connecting the wire 66 to the first conductive contact 651. Compared with the embodiments of FIGS. 4A and 4B, the embodiment illustrated in FIG. 4C is more capable. The technical effect of simply configuring the wire 66 is achieved.

The phosphor layer 63 covers the light-emitting unit 62 and a portion of the silver paste layer, and Different phosphor layer materials are selected according to light of different wavelength bands emitted by the light emitting unit 62. In some embodiments, the phosphor layer 63 does not cover the first conductive contact 651 and the second conductive contact 652 and all of the wires 66. In some embodiments, the phosphor layer 63 covers the first conductive contact 651 and the second conductive contact 652 and all of the wires 66. In some embodiments, the circuit board 61 is a transparent glass substrate, and the light emitting unit 62 is a light emitting diode that emits blue light. The blue light emitted by the light emitting unit 62 is excited by the fluorescent layer 63 to be light of another wavelength (for example, yellow light or white light), wherein a portion of the silver paste layer 64 not covered by the fluorescent layer 63 has heat dissipation for the light emitting unit. Features.

5A to 5C are diagrams shown in FIG. 4A The schematic diagram of the electrical connection of the light-emitting units in the light-emitting elements of the different embodiments of the present invention is omitted, and the fluorescent layer 63 is omitted in FIGS. 5A to 5C for the purpose of clear display. As shown in FIG. 5A, the wires 66 connecting the light-emitting units 62 may be in a state of being all connected in series. As shown in FIG. 5B, the wire 66 connecting the light-emitting unit 62 can be in the form of a combination of two series and two parallel connections. As shown in FIG. 5C, the wires 66 connected to the light-emitting unit 62 may be in the form of a combination of four series and four parallels. The light-emitting device 1 having a light-emitting power of 4 watts can use the light-emitting elements 60 all in series, two in series, two in parallel, or a combination thereof. The light-emitting device 1 having a luminous power of 6 watts or 8 watts can use two light-emitting elements 60 in series two-parallel, four-series four-parallel or a combination thereof. In some embodiments, the illuminating device 1 having a luminous power of 4 watts is two full series and two two The two parallel light-emitting elements 60 are connected in series. In other embodiments, the illuminating device 1 having an illuminating power of 8 watts is composed of four four-series four-parallel illuminating elements 60.

In addition, as shown in FIG. 3 and FIG. 6A, the conductive component 50 includes a plurality of The conductive elements 51 are arranged in a ring shape at the center C1 of the light source socket 40. In some embodiments, the conductive elements 51 are located on the same plane.

In still other embodiments, each of the conductive elements 51 includes a connection portion 511, conductive ends 512, 513, and electrode ends 514. The connecting portion 511 is embedded in the light source socket 40 and substantially perpendicular to the light emitting element 60. The connecting portion 511 is connected to the conductive ends 512, 513 and the electrode end 514. The connecting portion 511, the conductive ends 512, 513, and the electrode end 514 are plate-like structures. . In other embodiments, as shown in FIG. 3, a portion of the conductive element 51 does not include a conductive end 512 or a conductive end 513.

The conductive end 512 of the same conductive element 51 is located in a light source Within the slot 42, the conductive end 513 is located within the other light source slot 42. As shown in FIGS. 3 and 6A, the conductive ends 512, 513 protrude from the first side wall 422 of the light source socket 42. The conductive ends 512, 513 located in the same light source slot 42 may be a positive conductive end and a negative conductive end, respectively. The conductive ends 512, 513 are spaced apart from the second sidewall 423 of the light source socket 42 and the second sidewall 423 faces and is opposite the first sidewall 422.

6A to 6C are diagrams showing the assembly stage of the illuminating device 1 of the present invention Schematic diagram of the segment. As shown in FIGS. 6A and 6B, the light-emitting element 60 is moved to the inside of the light source slot 42 via the light source opening 421 in the plugging direction D2, and the light source slot 42 is extendable in the plugging direction D2. The conductive end 512 and the connecting portion 511 are substantially perpendicular to the circuit board 61. In other words, the conductive end 512 and the connecting portion 511 are substantially perpendicular to the plugging direction D2.

As shown in FIG. 6B and FIG. 6C, the circuit board 61 is inserted into the light. During the process of the source slot 42, after the circuit board 61 contacts the conductive ends 512, 513, the circuit board 61 continues to move along the plugging direction D2 to push the conductive ends 512, 513 to elastically deform the conductive ends 512, 513. Or bent, the conductive end 512 is elastically deformed or bent to form a rounded corner.

When the circuit board 61 is inserted in the plugged position as shown in FIG. 6C, The elastic force generated by the elastic deformation of the conductive ends 512, 513 causes the conductive ends 512, 513 to abut the first conductive contact 651 and the second conductive contact 652 respectively, so that the circuit board 61 abuts against the second sidewall 423. And spaced apart from the first side wall 422. In other words, the circuit board 61 is clamped between the second side wall 423 and the conductive ends 512, 513 by the above elastic force. Therefore, the light-emitting element 60 can be fixed to the light source socket 40 by the elastic force described above, and the light-emitting element 60 is not easily pulled out of the light source socket 42 of the light source socket 40.

The light-emitting element 60 is inserted into the light source socket in an interposed manner 40, the assembly of the light-emitting device 1 can be simplified. In addition, by inserting only the bottom of the circuit board 61 into the light source socket 40, a good heat dissipation effect can be obtained, so that a large-volume metal heat sink is not required, and the manufacturing cost can be saved.

In summary, the creation is based on the circuit board of the light-emitting device. Coating a layer of silver paste, by using a layer of silver paste with good thermal conductivity, the heat generated by the light-emitting unit during use can be quickly derived to extend the service life of the light-emitting device.

Although the present invention is disclosed above in various embodiments, it is only a van. For example, and not to limit the scope of the present invention, anyone skilled in the art can make some changes and refinements without departing from the spirit and scope of the present invention. Therefore, the above embodiments are not intended to limit the scope of the present invention, and the scope of protection of the present invention This is subject to the definition of the scope of the patent application.

60‧‧‧Lighting elements

61‧‧‧ boards

62‧‧‧Lighting unit

63‧‧‧Fluorescent layer

64‧‧‧ Silver layer

641‧‧‧The first zone of the silver paste layer

642‧‧‧Second area of the silver paste layer

643‧‧‧The third zone of the silver paste layer

651‧‧‧First conductive contact

652‧‧‧Second conductive contacts

66‧‧‧Wire

D2‧‧‧Drop direction

Claims (9)

A light-emitting component includes: a glass substrate having a first conductive contact and a second conductive contact disposed on the glass substrate; a silver paste layer disposed on the glass substrate and covering the first conductive connection a first region of the dot, a second region covering the second conductive contact, and a third region are located on the region other than the first conductive contact and the second conductive contact; a plurality of light emitting units are disposed On the silver paste layer; and a phosphor layer covering the light-emitting units and a portion of the silver paste layer, wherein another portion of the silver paste layer not covered by the phosphor layer has heat dissipation for the light-emitting units Features. The illuminating element of claim 1, wherein the illuminating units are in direct contact and are located above the third region of the silver paste layer. The light-emitting element of claim 2, wherein the first region of the silver paste layer is connected to the third region. The illuminating element of claim 2, wherein the first zone of the silver paste layer is separated from the third zone. The light-emitting element of claim 1, wherein the light-emitting units comprise a plurality of light-emitting diodes connected in series, in parallel, or a combination thereof. A light-emitting device includes: a light source socket having a top surface, a light source socket formed on the top surface, and a fixing groove formed on the top surface and connected to the light source socket; a conductive component embedded In the light source socket, wherein the conductive component has a conductive end protruding from a side wall of the light source slot; and a light-emitting element as described in claim 1 is inserted into the light source socket and contacts the conductive end. The illuminating device of claim 6, wherein the light source socket comprises an annular stop portion disposed on the top surface, and a receiving groove is formed between the annular stop portion and the top surface, and The accommodating slot connects the light source slot and the fixing slot. The light-emitting device of claim 6, wherein the light source slot has a light source opening on the top surface, the fixing groove has a fixed opening on the top surface, and the fixed opening is perpendicular to the light source opening Longitudinal extension. The illuminating device of claim 6 is a light bulb for inserting into a luminaire, and further comprising a cover disposed above the light source socket and covering the illuminating element.