JP2006303396A - Surface-mounting light-emitting device - Google Patents

Surface-mounting light-emitting device Download PDF

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JP2006303396A
JP2006303396A JP2005127184A JP2005127184A JP2006303396A JP 2006303396 A JP2006303396 A JP 2006303396A JP 2005127184 A JP2005127184 A JP 2005127184A JP 2005127184 A JP2005127184 A JP 2005127184A JP 2006303396 A JP2006303396 A JP 2006303396A
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emitting device
external connection
connection electrode
led chip
mounting substrate
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JP4674487B2 (en
Inventor
Satoru Mori
哲 森
Masaru Sugimoto
勝 杉本
Hideyoshi Kimura
秀吉 木村
Ryoji Yokoya
良二 横谷
Yutaka Iwabori
裕 岩堀
Takuma Hashimoto
拓磨 橋本
Shinya Ishizaki
真也 石崎
Takashi Fujino
崇史 藤野
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Panasonic Electric Works Co Ltd
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Matsushita Electric Works Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Led Devices (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a surface-mounting light-emitting device for preventing cracks from being generated at a junction for connecting an electrode for external connection in a package to a circuit pattern, in a wiring board caused by the difference in the thermal coefficient of expansion between the packaging substrate of the package and the wiring board. <P>SOLUTION: The surface-mounting light-emitting device 1 comprises an LED chip 10, and a ceramic packaging substrate 20 in which a storage recess 21 for storing the LED chip 10 is formed on one surface in a thickness direction. The package comprises the package substrate 20, wiring patterns 22, 22 formed on the package substrate 20, electrodes 23, 23 for external connection electrically connected to respective wiring patterns 22, 22, and a heat radiator 24 made of a metal plate provided on the other surface of the package substrate 20. The respective electrodes 23, 23 for external connection are formed so that it can be deformed elastically. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、表面実装型発光装置に関するものである。   The present invention relates to a surface mount light emitting device.

従来から、ＬＥＤチップとＬＥＤチップから放射された光によって励起されてＬＥＤチップとは異なる発光色の光を放射する波長変換材料としての蛍光体（蛍光顔料、蛍光染料など）とを組み合わせてＬＥＤチップの発光色とは異なる色合いの光を出す発光装置の研究開発が各所で行われている。この種の発光装置としては、例えば、青色光あるいは紫外光を放射するＬＥＤチップと蛍光体とを組み合わせて白色の光（白色光の発光スペクトル）を得る白色発光装置（一般的に白色ＬＥＤと呼ばれている）の商品化がなされている。   Conventionally, LED chips are combined with LED chips and phosphors (fluorescent pigments, fluorescent dyes, etc.) as wavelength conversion materials that are excited by light emitted from the LED chips and emit light of a different emission color from the LED chips. Research and development of light-emitting devices that emit light of a color different from the color of the light is being conducted in various places. As this type of light-emitting device, for example, a white light-emitting device (generally called a white LED) that obtains white light (white light emission spectrum) by combining an LED chip that emits blue light or ultraviolet light and a phosphor. Has been commercialized.

上述のような発光装置において表面実装型の発光装置としては種々の構造のものがある。例えば、図１９に表面実装型発光装置では、ＬＥＤチップ１０と、透明樹脂を成形したモールド部１２０とを備え、ＬＥＤチップ１０をリードフレームにより形成したリード端子１２１，１２２とボンディングワイヤＷを介して電気的に接続している。ここに、図１９の表面実装型発光装置におけるＬＥＤチップ１０は、リード端子１２１の前端部に設けられたカップ部１２３の内底面にダイボンドによって接合されており、白色発光装置の場合には、例えば、ＬＥＤチップ１０として青色光を発光するＧａＮ系青色ＬＥＤチップを用い、シリコーン樹脂などの透明樹脂中に黄色蛍光体を分散させた色変換部を設けてある。図１９に示した構成の表面実装型発光装置のモールド部１２０は、ＬＥＤチップ１０の前方にドーム状のレンズ部１２０ａが一体成形されている。また、表面実装型発光装置としては、図２０に示すように、ＬＥＤチップ１０を収納するカップ部１２３をリード端子１２１とは別体とした構成のものも知られている。   In the light emitting device as described above, there are various types of surface mounted light emitting devices. For example, in the surface-mounted light emitting device shown in FIG. 19, the LED chip 10 and a mold part 120 formed of a transparent resin are provided, and the LED chip 10 is formed by a lead frame via lead terminals 121 and 122 and bonding wires W. Electrically connected. Here, the LED chip 10 in the surface mounted light emitting device of FIG. 19 is bonded to the inner bottom surface of the cup portion 123 provided at the front end portion of the lead terminal 121 by die bonding, and in the case of a white light emitting device, for example, A GaN-based blue LED chip that emits blue light is used as the LED chip 10, and a color conversion unit in which a yellow phosphor is dispersed in a transparent resin such as a silicone resin is provided. In the mold part 120 of the surface mount light emitting device having the configuration shown in FIG. 19, a dome-shaped lens part 120 a is integrally formed in front of the LED chip 10. As a surface mount type light emitting device, as shown in FIG. 20, there is known a configuration in which a cup portion 123 that houses an LED chip 10 is separated from a lead terminal 121.

図１９や図２０に示した構成の表面実装型発光装置においては、リード端子１２１，１２２の一部がモールド部１２０内部の配線を兼ねており、モールド部１２０に埋設された部分があるので、モールド部１２０の材料とリード端子１２１，１２２の材料との熱膨張率の違いに起因して発生する応力が、モールド部１２０とリード端子１２１，１２２との境界付近に亀裂を発生させたり、リード端子１２１，１２２を通してモールド部１２０内に伝わってボンディングワイヤＷのボンディング部に断線を発生させたりする場合があり、耐応力性という点で課題が残っていた。さらに、図２０に示した構成の表面実装型発光装置では、リード端子１２１，１２２がモールド部１２０の側方に突出しているので、製造工程において、複数個の発光装置を一体成形した後に、個々の発光装置に分断する製造方法の採用が難しく、量産性に課題があった。   In the surface mount light emitting device having the configuration shown in FIG. 19 or FIG. 20, part of the lead terminals 121 and 122 also serves as wiring inside the mold part 120, and there is a part embedded in the mold part 120. Stress generated due to a difference in thermal expansion coefficient between the material of the mold part 120 and the material of the lead terminals 121 and 122 may cause a crack near the boundary between the mold part 120 and the lead terminals 121 and 122, In some cases, a wire breakage may occur in the bonding portion of the bonding wire W by being transmitted into the mold portion 120 through the terminals 121 and 122, and a problem remains in terms of stress resistance. Furthermore, in the surface mount type light emitting device having the configuration shown in FIG. 20, since the lead terminals 121 and 122 protrude to the side of the mold part 120, after the plurality of light emitting devices are integrally formed in the manufacturing process, each of the lead terminals 121 and 122 is individually formed. However, it is difficult to adopt a manufacturing method that divides the light emitting device, and there is a problem in mass productivity.

また、図１９や図２０の表面実装型発光装置に比べて、実装性、放熱性、耐応力性、量産性の優れた形態として、図２１に示す構成の表面実装型発光装置１’が提案されている（例えば、特許文献１参照）。図２１に示した構成の表面実装型発光装置１’は、ＬＥＤチップ１０’と、ＬＥＤチップ１０’を収納する収納凹所２１’が前面に形成されたセラミック製の実装基板２０’と、実装基板２０’に形成されＬＥＤチップ１０’の各パッドが接続される配線パターン２２’、２２’と、収納凹所２１’内に充填された封止樹脂からなる封止部（図示せず）と、実装基板２０’の前面側で収納凹所２１’を閉塞するシート状の色変換部２６’とを備えている。ここにおいて、各配線パターン２２’，２２’は、実装基板２０’の収納凹所２１’の内底面上に形成された一端部がチップ接続部２２ａ’，２２ａ’を構成し、実装基板２０’の他表面側の周部に形成された他端部が外部接続用電極２２ｂ’，２２ｂ’を構成しており、各外部接続用電極２２ｂ’，２２ｂ’がろう材（例えば、半田）からなる接合部４’，４’を介して配線基板３’の回路パターン３３’，３３’と接続される。要するに、図２１に示した構成の表面実装型発光装置１’では、実装基板２０’と配線パターン２２’，２２’と上記封止部とでパッケージを構成している。   Further, as a form excellent in mountability, heat dissipation, stress resistance, and mass productivity as compared with the surface mount light emitting device of FIG. 19 and FIG. 20, the surface mount light emitting device 1 ′ having the configuration shown in FIG. 21 is proposed. (For example, refer to Patent Document 1). The surface-mounted light-emitting device 1 ′ having the configuration shown in FIG. 21 includes an LED chip 10 ′, a ceramic mounting substrate 20 ′ having a housing recess 21 ′ for housing the LED chip 10 ′ formed on the front surface, Wiring patterns 22 ′ and 22 ′ formed on the substrate 20 ′ to which the pads of the LED chip 10 ′ are connected, and a sealing portion (not shown) made of a sealing resin filled in the housing recess 21 ′ And a sheet-like color conversion portion 26 ′ that closes the housing recess 21 ′ on the front side of the mounting substrate 20 ′. Here, in each wiring pattern 22 ′, 22 ′, one end portion formed on the inner bottom surface of the housing recess 21 ′ of the mounting substrate 20 ′ constitutes the chip connection portion 22a ′, 22a ′, and the mounting substrate 20 ′. The other end formed on the peripheral portion on the other surface side constitutes external connection electrodes 22b ′ and 22b ′, and each of the external connection electrodes 22b ′ and 22b ′ is made of a brazing material (for example, solder). The circuit patterns 33 ′ and 33 ′ of the wiring board 3 ′ are connected via the joints 4 ′ and 4 ′. In short, in the surface-mounted light emitting device 1 ′ having the configuration shown in FIG. 21, a package is configured by the mounting substrate 20 ′, the wiring patterns 22 ′ and 22 ′, and the sealing portion.

ところで、上述のような発光装置は、白色発光装置に限らず、従来の白熱電球や蛍光灯などに比べて、小型化、軽量化、省電力化を図れるといった長所があり、現在、表示用光源、ディスプレイ用光源、小型電球（白熱電球、ハロゲン電球など）の代替の光源、携帯電話の液晶パネル用光源（液晶パネル用バックライト）などとして広く用いられている。   By the way, the light emitting device as described above is not limited to a white light emitting device, but has advantages such as a reduction in size, weight, and power saving as compared with conventional incandescent bulbs and fluorescent lamps. It is widely used as a light source for display, an alternative light source for small light bulbs (incandescent light bulbs, halogen light bulbs, etc.), and a light source for liquid crystal panels for mobile phones (backlights for liquid crystal panels).

また、最近の白色発光装置の高出力化に伴い、白色発光装置を照明用途に展開する研究開発が盛んになってきているが、上述の白色発光装置を一般照明などのように比較的大きな光出力を必要とする用途に用いる場合、１つの白色発光装置では所望の光出力を得ることができないので、複数個の表面実装型の白色発光装置を１つの配線基板上に搭載したＬＥＤユニットを構成し、ＬＥＤユニット全体で所望の光出力を確保するようにしているのが一般的である。
特開２００５−１２１５５号公報 In addition, with the recent increase in output of white light emitting devices, research and development for expanding the use of white light emitting devices for lighting applications has become active. When used in applications that require output, a single white light emitting device cannot obtain a desired light output, so that an LED unit having a plurality of surface-mounted white light emitting devices mounted on one wiring board is configured. In general, a desired light output is ensured in the entire LED unit.
JP 2005-12155 A

ところで、上述のように複数個の表面実装型発光装置１’を１つの配線基板３’上に搭載したＬＥＤユニットでは、個々の表面実装型発光装置１’の発熱量は比較的少ないものの、表面実装型発光装置１’の数の増加に伴って発熱量が多くなるので、配線基板３’に熱が蓄積されやすく、ＬＥＤユニット全体の温度が上昇しやすい傾向にある。   By the way, in the LED unit in which a plurality of surface-mounted light emitting devices 1 ′ are mounted on one wiring board 3 ′ as described above, although the amount of heat generated by each surface-mounted light emitting device 1 ′ is relatively small, Since the amount of heat generation increases as the number of the mounting type light emitting devices 1 ′ increases, heat tends to be accumulated in the wiring board 3 ′, and the temperature of the entire LED unit tends to increase.

また、上述のＬＥＤユニットを用いた照明器具では、ＬＥＤの小型という利点を生かそうとして器具本体も従来の照明器具の器具本体に比べて小型化を目指す傾向にあり、ＬＥＤユニットの周囲に、電源部や制御部などの他の回路構成部品も近接して配置されるが、これら回路構成部品がＬＥＤユニットに対する熱源として作用するので、ＬＥＤユニットの周囲の熱源により、ＬＥＤユニットが更に暖められるといった状況が起こる。   In addition, in the lighting fixture using the above-mentioned LED unit, the fixture main body tends to be smaller than the fixture main body of the conventional lighting fixture in order to take advantage of the small size of the LED. Other circuit components such as the control unit and the control unit are also arranged close to each other, but since these circuit components act as a heat source for the LED unit, the LED unit is further heated by the heat source around the LED unit. Happens.

上述のようにＬＥＤユニットを照明用途などに利用した場合には、点灯開始後の温度上昇と消灯後の温度下降との繰り返しによりＬＥＤユニットの膨張収縮が繰り返されるが、図２１に示した表面実装型発光装置１’であっても、実装基板２０’と配線基板３’との熱膨張係数差に起因して接合部４’，４’にクラックが生じてしまうことがあり、ＬＥＤユニットの、さらに改善すべき信頼性上の課題があることが分かった。   As described above, when the LED unit is used for lighting or the like, the LED unit expands and contracts repeatedly by repeating the temperature increase after starting lighting and the temperature decreasing after extinguishing, but the surface mounting shown in FIG. Even in the case of the type light emitting device 1 ′, cracks may occur in the joints 4 ′ and 4 ′ due to the difference in thermal expansion coefficient between the mounting substrate 20 ′ and the wiring substrate 3 ′. It was found that there were further reliability issues to be improved.

本発明は上記事由に鑑みて為されたものであり、その目的は、パッケージの実装基板と配線基板との熱膨張率の差に起因して、パッケージの外部接続用電極と配線基板の回路パターンとの間を接続している接合部にクラックが生じるのを防止することができる表面実装型発光装置を提供することにある。   The present invention has been made in view of the above-mentioned reasons, and the purpose thereof is due to the difference in thermal expansion coefficient between the package mounting substrate and the wiring substrate, and the circuit pattern of the external connection electrode of the package and the wiring substrate. It is an object of the present invention to provide a surface-mount light-emitting device that can prevent cracks from occurring in a joint portion connecting the two.

請求項１の発明は、ＬＥＤチップと、厚み方向の一表面にＬＥＤチップを収納する収納凹所が形成された実装基板を有するパッケージとを備え、パッケージは、実装基板に形成されＬＥＤチップに電気的に接続される配線パターンと、配線パターンを介してＬＥＤチップに電気的に接続され配線基板の回路パターン上にろう材からなる接合部を介して固着される外部接続用電極とを有し、外部接続用電極は、配線パターンとは別体であって弾性変形可能な形状に形成されてなることを特徴とする。   The invention of claim 1 comprises an LED chip and a package having a mounting substrate in which a housing recess for storing the LED chip is formed on one surface in the thickness direction, and the package is formed on the mounting substrate and electrically connected to the LED chip. A wiring pattern that is electrically connected, and an external connection electrode that is electrically connected to the LED chip via the wiring pattern and is fixed to the circuit pattern of the wiring board via a joint made of a brazing material, The external connection electrode is formed separately from the wiring pattern and formed in a shape that can be elastically deformed.

この発明によれば、外部接続用電極が弾性変形可能となっているので、パッケージの実装基板と配線基板との熱膨張率の差に起因して接合部に発生する応力を緩和するように外部接続用電極が弾性変形することにより、パッケージの外部接続用電極と配線基板の回路パターンとの間を接続している接合部にクラックが生じるのを防止することができる。   According to the present invention, since the external connection electrode is elastically deformable, the external connection electrode is relieved to relieve the stress generated in the joint due to the difference in thermal expansion coefficient between the package mounting board and the wiring board. Due to the elastic deformation of the connection electrode, it is possible to prevent the occurrence of cracks in the joint portion connecting the external connection electrode of the package and the circuit pattern of the wiring board.

請求項２の発明は、請求項１の発明において、前記外部接続用電極は、前記実装基板における前記厚み方向の他表面側に設けられてなることを特徴とする。   According to a second aspect of the present invention, in the first aspect of the invention, the external connection electrode is provided on the other surface side of the mounting substrate in the thickness direction.

この発明によれば、前記配線基板への実装面積を小さくすることができる。   According to the present invention, the mounting area on the wiring board can be reduced.

請求項３の発明は、請求項２の発明において、前記外部接続用電極は、前記厚み方向に離間した一対の脚片を有するコ字状に形成され、前記実装基板に近い側の脚片が前記配線パターンに固着されており、前記実装基板から遠い側の脚片が前記回路パターンと固着する端子片を構成していることを特徴とする。   According to a third aspect of the present invention, in the second aspect of the invention, the external connection electrode is formed in a U shape having a pair of leg pieces spaced apart in the thickness direction, and the leg piece closer to the mounting board is It is fixed to the said wiring pattern, The leg piece on the side far from the said mounting board comprises the terminal piece fixed to the said circuit pattern.

この発明によれば、前記外部接続用電極が前記実装基板の側方に突出しないようにして前記配線基板への実装面積を小さくすることができる。   According to the present invention, the mounting area on the wiring board can be reduced by preventing the external connection electrodes from projecting to the side of the mounting board.

請求項４の発明は、請求項２の発明において、前記外部接続用電極は、導電性を有する板ばねからなることを特徴とする。   According to a fourth aspect of the present invention, in the second aspect of the invention, the external connection electrode is formed of a conductive leaf spring.

この発明によれば、請求項３の発明に比べて前記外部接続用電極が弾性変形しやすくなり、前記接合部にクラックが発生するのをより確実に防止することができる。   According to this invention, the external connection electrode is more easily elastically deformed than the invention of claim 3, and it is possible to more reliably prevent the occurrence of cracks in the joint portion.

請求項５の発明は、請求項１の発明において、前記外部接続用電極は、前記実装基板の前記厚み方向に沿って前記実装基板の側方に配置する金属板の一端部をＵ字状に曲成して前記実装基板の前記一表面側で前記配線パターンに固着する連絡片が形成され、他端部をＬ字状に曲成して前記回路パターンに固着する端子片が形成されてなることを特徴とする。   According to a fifth aspect of the present invention, in the first aspect of the invention, the external connection electrode has a U-shaped end portion of a metal plate disposed on the side of the mounting substrate along the thickness direction of the mounting substrate. A connecting piece that is bent and fixed to the wiring pattern is formed on the one surface side of the mounting substrate, and a terminal piece that is bent in an L shape at the other end and fixed to the circuit pattern is formed. It is characterized by that.

この発明によれば、請求項３の発明に比べて前記外部接続用電極が弾性変形しやすくなり、前記接合部にクラックが発生するのをより確実に防止することができる。   According to this invention, the external connection electrode is more easily elastically deformed than the invention of claim 3, and it is possible to more reliably prevent the occurrence of cracks in the joint portion.

請求項６の発明は、請求項１ないし請求項５の発明において、前記実装基板は、前記厚み方向の他表面において前記収納凹所の内底面に対応する部位に、前記ＬＥＤチップで発生した熱を放熱させる放熱部が設けられてなるとを特徴とする。   According to a sixth aspect of the present invention, in the first to fifth aspects of the present invention, the mounting substrate has heat generated by the LED chip at a portion corresponding to the inner bottom surface of the housing recess on the other surface in the thickness direction. It is characterized in that a heat radiating part for radiating heat is provided.

この発明によれば、前記ＬＥＤチップへの通電時に前記ＬＥＤチップで発生した熱を放熱部を通して前記配線基板へ伝熱させることが可能となり、前記ＬＥＤチップの温度上昇を抑制することができる。   According to this invention, it becomes possible to transfer the heat generated in the LED chip when the LED chip is energized to the wiring substrate through the heat radiating portion, and the temperature rise of the LED chip can be suppressed.

請求項７の発明は、請求項６の発明において、前記放熱部は、外周縁に開放された複数のスリットが周方向に離間して形成されてなることを特徴とする。   A seventh aspect of the invention is characterized in that, in the sixth aspect of the invention, the heat dissipating part is formed by a plurality of slits opened to the outer peripheral edge being spaced apart in the circumferential direction.

この発明によれば、前記実装基板と前記配線基板との熱膨張率の差に起因して前記接合部に発生する応力を前記放熱部が変形することにより緩和することができる。   According to this invention, the stress generated in the joint due to the difference in coefficient of thermal expansion between the mounting board and the wiring board can be reduced by the deformation of the heat radiating part.

請求項８の発明は、請求項６の発明において、前記放熱部は、前記実装基板の前記他表面の法線方向に突出するピン状に形成されてなることを特徴とする。   The invention of claim 8 is characterized in that, in the invention of claim 6, the heat radiating portion is formed in a pin shape protruding in a normal direction of the other surface of the mounting substrate.

この発明によれば、前記配線基板に前記放熱部を嵌入する嵌入孔を設ければ、半田などのろう材を用いることなく前記放熱部と前記配線基板とを熱的に結合することが可能となる。   According to the present invention, if the insertion hole for inserting the heat dissipation portion is provided in the wiring board, the heat dissipation portion and the wiring substrate can be thermally coupled without using a brazing material such as solder. Become.

請求項１の発明では、パッケージの実装基板と配線基板との熱膨張率の差に起因して接合部に発生する応力を緩和するように外部接続用電極が弾性変形することにより、パッケージの外部接続用電極と配線基板の回路パターンとの間を接続している接合部にクラックが生じるのを防止することができるという効果がある。   In the first aspect of the present invention, the external connection electrode is elastically deformed so as to relieve the stress generated in the joint due to the difference in thermal expansion coefficient between the package mounting board and the wiring board. There is an effect that it is possible to prevent the occurrence of cracks in the joint portion connecting the connection electrode and the circuit pattern of the wiring board.

（実施形態１）
本実施形態の表面実装型発光装置１は、図１に示すように、ＬＥＤチップ１０と、ＬＥＤチップ１０を収納する収納凹所２１が厚み方向の一表面に形成されたセラミック（例えば、アルミナ）製の実装基板２０とを備えている。実装基板２０には、ＬＥＤチップ１０の各パッド（図示せず）が電気的に接続される導電性材料からなる２つの配線パターン２２，２２が形成されている。ここで、各配線パターン２２は、実装基板２０の収納凹所２１の内底面に沿って形成された一端部がチップ接続部を構成しており、他端部が実装基板２０の他表面に配置される外部接続用電極２３と電気的に接続されている。実装基板２０は、外周形状が矩形状であって、厚み方向の他表面において図１の左右両端部に上述の外部接続用電極２３が配置されている。また、実装基板２０の上記他表面において収納凹所２１の内底面に対応する中央部には、放熱用の金属板からなる放熱部２４が設けられている。つまり、放熱部２４は、実装基板２０において薄肉となっている部位に設けられている。なお、本実施形態では、実装基板２０と、各配線パターン２２と各外部接続用電極２３，２３と放熱部２４とでパッケージを構成している。なお、実装基板２０における収納凹所２１は、当該収納凹所２１の内底面から離れるほど開口面積が大きくなっている。 (Embodiment 1)
As shown in FIG. 1, the surface-mount light-emitting device 1 of the present embodiment is a ceramic (for example, alumina) in which an LED chip 10 and a housing recess 21 that houses the LED chip 10 are formed on one surface in the thickness direction. And a mounting board 20 made of metal. On the mounting substrate 20, two wiring patterns 22, 22 made of a conductive material to which each pad (not shown) of the LED chip 10 is electrically connected are formed. Here, in each wiring pattern 22, one end portion formed along the inner bottom surface of the housing recess 21 of the mounting substrate 20 constitutes a chip connection portion, and the other end portion is disposed on the other surface of the mounting substrate 20. The external connection electrode 23 is electrically connected. The mounting board 20 has a rectangular outer peripheral shape, and the above-described external connection electrodes 23 are arranged on the left and right ends of FIG. 1 on the other surface in the thickness direction. In addition, a heat radiating portion 24 made of a heat radiating metal plate is provided in a central portion corresponding to the inner bottom surface of the housing recess 21 on the other surface of the mounting substrate 20. That is, the heat radiating part 24 is provided in a thin portion of the mounting substrate 20. In the present embodiment, the mounting substrate 20, each wiring pattern 22, each external connection electrode 23, 23, and the heat radiation part 24 constitute a package. In addition, the opening area of the storage recess 21 in the mounting substrate 20 increases as the distance from the inner bottom surface of the storage recess 21 increases.

ＬＥＤチップ１０は、青色の波長域の光を放射するＧａＮ系青色ＬＥＤチップであり、ＧａＮ系化合物半導体材料からなる発光部が当該発光部にて発光する光に対して透明なベース基板であるサファイア基板の一表面側に形成されており、上記発光部を実装基板２０の収納凹所２１の内底面に対向させた形でフリップチップ実装されている。要するに、ＬＥＤチップ１０は、各パッド（図示せず）が金属材料（例えば、金など）からなるバンプ１２，１２を介して配線パターン２２，２２のチップ接続部と電気的に接続され且つ上記サファイア基板の他表面が光取り出し面となるように実装基板２０に実装されており、ＬＥＤチップ１０の発光部にて発光した光が上記サファイア基板を通して取り出される。   The LED chip 10 is a GaN-based blue LED chip that emits light in a blue wavelength range, and sapphire whose light-emitting portion made of a GaN-based compound semiconductor material is a base substrate that is transparent to the light emitted from the light-emitting portion. It is formed on one surface side of the substrate, and is flip-chip mounted with the light emitting portion facing the inner bottom surface of the housing recess 21 of the mounting substrate 20. In short, the LED chip 10 is such that each pad (not shown) is electrically connected to the chip connecting portion of the wiring patterns 22 and 22 via the bumps 12 and 12 made of a metal material (for example, gold) and the sapphire. The other surface of the substrate is mounted on the mounting substrate 20 so as to be a light extraction surface, and light emitted from the light emitting portion of the LED chip 10 is extracted through the sapphire substrate.

また、表面実装型発光装置１は、ＬＥＤチップ１０から放射された光によって励起されて発光する粒子状の黄色蛍光体を有する色変換部（図示せず）を備えており、ＬＥＤチップ１０から放射された光と黄色蛍光体から放射された光との合成光からなる白色の光が得られる。なお、上述の色変換部は、実装基板２０の収納凹所２１内でＬＥＤチップ１０を封止するシリコーン樹脂などの透明樹脂中に黄色蛍光体を分散させることにより構成してもよいし、シリコーン樹脂と黄色蛍光体とを混合した混合物をシート状に成形して、収納凹所２１の開口面を閉塞するように実装基板２０に対して固着してもよい。   Further, the surface-mount light-emitting device 1 includes a color conversion unit (not shown) having a particulate yellow phosphor that emits light when excited by light emitted from the LED chip 10, and radiates from the LED chip 10. White light composed of the combined light of the emitted light and the light emitted from the yellow phosphor is obtained. In addition, the above-described color conversion unit may be configured by dispersing a yellow phosphor in a transparent resin such as a silicone resin that seals the LED chip 10 in the housing recess 21 of the mounting substrate 20. A mixture of resin and yellow phosphor may be formed into a sheet shape and fixed to the mounting substrate 20 so as to close the opening surface of the storage recess 21.

したがって、表面実装型発光装置１では、外部接続用電極２３，２３間に図示しない電源部から電力を供給することにより、ＬＥＤチップ１０が発光するとともに上記色変換部の黄色蛍光体が発光するので、白色光が出力される。ここにおいて、電源部としては、例えば、交流電源を整流平滑するダイオードブリッジからなる整流回路と、整流回路の出力を平滑する平滑コンデンサとを備えた構成のものを採用すればよい。   Therefore, in the surface-mounted light-emitting device 1, when power is supplied from the power supply unit (not shown) between the external connection electrodes 23 and 23, the LED chip 10 emits light and the yellow phosphor of the color conversion unit emits light. , White light is output. Here, as the power supply unit, for example, a configuration including a rectifier circuit including a diode bridge that rectifies and smoothes an AC power supply and a smoothing capacitor that smoothes the output of the rectifier circuit may be employed.

以上説明した表面実装型発光装置１は、例えば、図２に示すような配線基板３に搭載され、配線基板３とともにＬＥＤユニットを構成する。配線基板３は、例えば銅やアルミニウムなどの高熱伝導性を有する金属材料からなる金属ベース基板３１の一表面上にガラスエポキシ樹脂などの絶縁性を有する樹脂からなる樹脂層３２を介して導体パターンからなる回路パターン３３ａ，３３ａおよび放熱用パターン３３ｂが形成されている。ここで、表面実装型発光装置１は、上述の外部接続用電極２３が配線基板３の回路パターン３３ａ上にろう材（半田など）からなる接合部４を介して固着され、放熱部２４が放熱用パターン３３ｂ上にろう材（半田など）からなる接合部５を介して固着される。要するに、表面実装型発光装置１は、各外部接続用電極２３が配線基板３の各回路パターン３３ａと接合部４を介して電気的に接続される一方で、放熱部２４が配線基板３の放熱用パターン３３ｂと接合部５を介して熱的に結合されているので、ＬＥＤチップ１で発生した熱を放熱部２４および接合部５を通して配線基板３へ伝熱して放熱することができるので、表面実装型発光装置１の温度上昇を抑えることができる。   The surface-mounted light-emitting device 1 described above is mounted on a wiring board 3 as shown in FIG. 2, for example, and constitutes an LED unit together with the wiring board 3. The wiring board 3 is formed from a conductor pattern via a resin layer 32 made of an insulating resin such as a glass epoxy resin on one surface of a metal base board 31 made of a metal material having a high thermal conductivity such as copper or aluminum. Circuit patterns 33a, 33a and a heat radiation pattern 33b are formed. Here, in the surface-mounted light-emitting device 1, the external connection electrode 23 is fixed onto the circuit pattern 33 a of the wiring board 3 via the joint portion 4 made of a brazing material (solder or the like), and the heat dissipation portion 24 dissipates heat. It is fixed on the pattern 33b via a joint portion 5 made of a brazing material (solder or the like). In short, in the surface-mount light-emitting device 1, each external connection electrode 23 is electrically connected to each circuit pattern 33 a of the wiring substrate 3 through the joint portion 4, while the heat dissipation portion 24 is radiated by the wiring substrate 3. Since the heat generated in the LED chip 1 can be transferred to the wiring board 3 through the heat dissipating part 24 and the joining part 5 and can be dissipated by being thermally coupled to the pattern 33b and the joining part 5. The temperature rise of the mounting type light emitting device 1 can be suppressed.

ところで、本実施形態の発光装置１における各外部接続用電極２３は、実装基板２０の厚み方向に離間した一対の脚片を有するコ字状に形成され、実装基板２０に近い側の脚片が配線パターン２２に固着される連絡片２３ａを構成し、実装基板２０から遠い側の脚片が回路パターン３３ａと接合部４を介して固着する端子片２３ｂを構成している。ここにおいて、各外部接続用電極２３は両脚片それぞれの先端面同士が対向するような向きで実装基板２０の上記他表面に配置されている。   By the way, each of the external connection electrodes 23 in the light emitting device 1 of the present embodiment is formed in a U shape having a pair of leg pieces spaced in the thickness direction of the mounting board 20, and the leg piece on the side close to the mounting board 20 is formed. A connecting piece 23 a fixed to the wiring pattern 22 is formed, and a leg piece far from the mounting substrate 20 forms a terminal piece 23 b fixed to the circuit pattern 33 a via the joint 4. Here, each external connection electrode 23 is arranged on the other surface of the mounting substrate 20 in such a direction that the front end surfaces of both leg pieces face each other.

しかして、本実施形態の表面実装型発光装置１では、各外部接続用電極２３が弾性変形可能な形状となっているので、パッケージの実装基板２０と配線基板３との熱膨張率の差に起因して接合部４に発生する応力（金属ベース基板３１の熱膨張率の方が実装基板２０の熱膨張率よりも大きいので、発光装置１の点灯時には接合部４に引張応力が発生する）を緩和するように各外部接続用電極２３，２３が弾性変形することにより、パッケージの外部接続用電極２３，２３と配線基板３の回路パターン３３ａ，３３ａとの間を接続している接合部４にクラックが生じるのを防止することができる。さらに、パッケージの外部接続用電極２３と実装基板２０に埋設された配線パターン２２とが一体でないため、外部接続用電極２３付近で発生した応力がパッケージ内部へ伝わりにくく、ＬＥＤチップ１をフェースアップさせた形で収納凹所２１内に収納してＬＥＤチップ１のパッドと配線パターン２２とをボンディングワイヤを介して接続するような場合でもボンディング部の断線を防ぐことができる。また、各外部接続用電極２３が実装基板２０の上記他表面に設けられ、各外部接続用電極２３，２３が実装基板２０の側方に突出しないようにしてあるので、配線基板３への実装面積を小さくすることができる。また、本実施形態の表面実装型発光装置１では、各外部接続用電極２３が実装基板２０の上記他表面に設けられ、各配線パターン２２，２２が実装基板２０に埋設されているので、複数個のパッケージをまとめてシート状に成形してから、個々のパッケージに切断するような製造方法を採用することができる。一例として、複数個の実装基板２０を取り出すことができる積層セラミック型のシート状部材を図３に示す。図３に示したシート状部材では同図（ａ）中に矢印で示したところから、同図中の縦横に分断することにより、図１に示した表面実装型発光装置１用の実装基板２０を２０個得ることができる。また、外部接続用電極２３の長手方向（図１（ａ）の紙面に直交する方向）の幅寸法が、当該長手方向における実装基板２０の幅寸法と同じになっているので、長手方向には隙間を空けずにパッケージを作り込むことができる。本実施形態の表面実装型発光装置１は、図２０に示した構成の表面実装型発光装置とは異なり、外部接続用電極２３が実装基板２０の側方に突出しない構造であるため、複数個のパッケージをまとめてシート状に成形した際、隣り合うパッケージ間の隙間ｄを加工上問題が生じない程度に狭くできる。故に、シート状部材中で実装基板２０に利用できず無駄になる部分の割合を少なくでき、量産性が向上する効果がある。   Therefore, in the surface-mount light-emitting device 1 of the present embodiment, each external connection electrode 23 has a shape that can be elastically deformed, and therefore the difference in thermal expansion coefficient between the package mounting board 20 and the wiring board 3 is caused. Stress generated in the joint 4 due to the thermal expansion coefficient of the metal base substrate 31 is larger than the thermal expansion coefficient of the mounting substrate 20, so that a tensile stress is generated in the joint 4 when the light emitting device 1 is turned on. The external connection electrodes 23 and 23 are elastically deformed so as to alleviate the above, so that the joint portions 4 connecting the external connection electrodes 23 and 23 of the package and the circuit patterns 33a and 33a of the wiring board 3 are connected. It is possible to prevent cracks from occurring. Further, since the external connection electrode 23 of the package and the wiring pattern 22 embedded in the mounting substrate 20 are not integrated, the stress generated near the external connection electrode 23 is not easily transmitted to the inside of the package, and the LED chip 1 is faced up. Even when the pad of the LED chip 1 and the wiring pattern 22 are connected to each other through a bonding wire after being stored in the storage recess 21 in a shape, disconnection of the bonding portion can be prevented. Further, each external connection electrode 23 is provided on the other surface of the mounting substrate 20 so that each external connection electrode 23, 23 does not protrude to the side of the mounting substrate 20. The area can be reduced. Further, in the surface mount type light emitting device 1 of the present embodiment, each external connection electrode 23 is provided on the other surface of the mounting substrate 20, and each wiring pattern 22, 22 is embedded in the mounting substrate 20. A manufacturing method in which individual packages are collectively formed into a sheet shape and then cut into individual packages can be employed. As an example, FIG. 3 shows a multilayer ceramic sheet-like member from which a plurality of mounting boards 20 can be taken out. In the sheet-like member shown in FIG. 3, the mounting substrate 20 for the surface-mounted light-emitting device 1 shown in FIG. 1 is obtained by dividing the sheet-like member in the vertical and horizontal directions in FIG. 20 can be obtained. Further, since the width dimension of the external connection electrode 23 in the longitudinal direction (the direction perpendicular to the paper surface of FIG. 1A) is the same as the width dimension of the mounting substrate 20 in the longitudinal direction, You can make a package without leaving a gap. Unlike the surface-mounted light-emitting device having the configuration shown in FIG. 20, the surface-mounted light-emitting device 1 of this embodiment has a structure in which the external connection electrode 23 does not protrude to the side of the mounting substrate 20. When the packages are collectively formed into a sheet shape, the gap d between adjacent packages can be narrowed to such an extent that no processing problems occur. Therefore, the proportion of the sheet member that cannot be used for the mounting substrate 20 and is wasted can be reduced, and the mass productivity is improved.

なお、上述の放熱部２４は必ずしも設ける必要はないが、表面実装型発光装置１に放熱部２４を設けることにより、ＬＥＤチップ１で発生した熱を放熱部２４および配線基板３を通して放熱することが可能となるので、ＬＥＤチップ１０の温度上昇を抑制するとともに、ＬＥＤユニットの温度上昇を抑制することが可能となり、接合部４にクラックが生じるのをより確実に防止することができる。   Although the above-described heat radiating portion 24 is not necessarily provided, the heat generated by the LED chip 1 can be radiated through the heat radiating portion 24 and the wiring board 3 by providing the heat radiating portion 24 in the surface mount light emitting device 1. Therefore, it is possible to suppress the temperature rise of the LED chip 10 and to suppress the temperature rise of the LED unit, and it is possible to more reliably prevent the joint portion 4 from being cracked.

なお、上述の例では、図１および図２に示したように、各外部接続用電極２３の両脚片それぞれの先端面同士が対向するような向きで実装基板２０の上記他表面に配置してあるが、各外部接続用電極２３は、図４に示すように、各外部接続用電極２３を逆向きにして配置してもよい。   In the above example, as shown in FIG. 1 and FIG. 2, it is arranged on the other surface of the mounting substrate 20 so that the front end surfaces of both leg pieces of each external connection electrode 23 face each other. However, as shown in FIG. 4, each external connection electrode 23 may be arranged with each external connection electrode 23 facing in the reverse direction.

（実施形態２）
本実施形態の表面実装型発光装置１の基本構成は実施形態１と略同じであって、実施形態１にて説明した金属板からなる放熱部２４を設ける代わりに、図５に示すように、実装基板２０の上記他表面から連続一体に突出する放熱用凸部２０ａを設け、放熱用凸部２０ａの先端面（図５における下面）に金属材料からなる放熱用パッド２５を設けてある点が相違する。ここにおいて、放熱用凸部２０ａの側面と外部接続用電極２３において両脚片を連結している部位とは接合されていない（後述の実施形態３，４についても同様）ので、外部接続用電極２３が表面実装型発光装置１の側方に引張応力を受けた場合、外部接続用電極２３は自由に変形することができる。なお、実施形態１と同様の構成要素には同一の符号を付して説明を省略する。 (Embodiment 2)
The basic configuration of the surface-mount light-emitting device 1 of the present embodiment is substantially the same as that of the first embodiment, and instead of providing the heat dissipating part 24 made of the metal plate described in the first embodiment, as shown in FIG. The heat radiation convex part 20a which protrudes from the said other surface of the mounting substrate 20 continuously and integrally is provided, and the heat radiation pad 25 which consists of metal materials is provided in the front end surface (lower surface in FIG. 5) of the heat radiation convex part 20a. Is different. Here, the side surface of the heat radiation convex portion 20a and the portion connecting the both leg pieces in the external connection electrode 23 are not joined (the same applies to Embodiments 3 and 4 to be described later). When the surface mounting type light emitting device 1 receives a tensile stress laterally, the external connection electrode 23 can be freely deformed. In addition, the same code | symbol is attached | subjected to the component similar to Embodiment 1, and description is abbreviate | omitted.

本実施形態の表面実装型発光装置１では、配線基板３に実装する際に、実装基板２０における放熱用凸部２０ａの先端面に設けた放熱用パッド２５を配線基板３の放熱用パターン３３ｂ上に接合部５を介して固着すればよいので、実施形態１に比べて部品点数を削減することができる。   In the surface-mounted light-emitting device 1 of the present embodiment, when mounted on the wiring board 3, the heat-dissipating pad 25 provided on the front end surface of the heat-radiating protrusion 20 a on the mounting board 20 is disposed on the heat-dissipating pattern 33 b of the wiring board 3. Therefore, the number of parts can be reduced as compared with the first embodiment.

（実施形態３）
本実施形態の表面実装型発光装置１の基本構成は実施形態２と略同じであって、図６に示すように、放熱用凸部２０ｂの突出寸法と実装基板２０の厚み方向における各外部接続用電極２３の外形寸法とを揃えてパッケージにおける配線基板３との対向面をフラットにしている点が相違する。なお、実施形態１と同様の構成要素には同一の符号を付して説明を省略する。 (Embodiment 3)
The basic configuration of the surface mount light emitting device 1 of the present embodiment is substantially the same as that of the second embodiment, and as shown in FIG. The difference is that the surface of the package facing the wiring board 3 is flattened with the outer dimensions of the electrodes 23 for use. In addition, the same code | symbol is attached | subjected to the component similar to Embodiment 1, and description is abbreviate | omitted.

本実施形態の表面実装型発光装置１では、実装基板２０における放熱用凸部２０ａが配線基板３の放熱用パターン３３ｂ上に接合部５を介して固着される。   In the surface-mounted light-emitting device 1 of the present embodiment, the heat radiating protrusion 20 a on the mounting substrate 20 is fixed onto the heat radiating pattern 33 b of the wiring substrate 3 via the joint 5.

しかして、本実施形態の表面実装型発光装置１では、放熱用凸部２０ａと配線基板３の放熱用パターン３３ａとの間に介在する接合部５の厚みを、各外部接続用電極２３と配線基板３の各回路パターン３３ａとの間に介在する接合部４の厚みと揃えることがで可能となり、実施形態２に比べて、配線基板３への実装が容易になる。   Thus, in the surface mount light emitting device 1 of the present embodiment, the thickness of the joint portion 5 interposed between the heat radiation convex portion 20a and the heat radiation pattern 33a of the wiring board 3 is set to each external connection electrode 23 and the wiring. It becomes possible to make it equal to the thickness of the joint portion 4 interposed between each circuit pattern 33a of the substrate 3 and mounting on the wiring substrate 3 becomes easier as compared with the second embodiment.

（実施形態４）
本実施形態の表面実装型発光装置１の基本構成は実施形態３と略同じであって、図７および図８に示すように、放熱用凸部２０ａの突出寸法を実施形態３よりも大きくしてある。ここにおいて、本実施形態の表面実装型発光装置１は、放熱用凸部２０ａの突出寸法が、実装基板２０の厚み方向における各外部接続用電極２３の外形寸法よりも大きくなっている点が相違する。また、本実施形態の表面実装型発光装置１では、図８に示すように、実装基板２０の上記他表面に平行な面内において外部接続用電極２３の長手方向の幅寸法Ｗ１が当該長手方向における実装基板２０の幅Ｗ２よりも狭くなっている。なお、実施形態３と同様の構成要素には同一の符号を付して説明を省略する。 (Embodiment 4)
The basic configuration of the surface mount light emitting device 1 of the present embodiment is substantially the same as that of the third embodiment. As shown in FIGS. It is. Here, the surface-mounted light-emitting device 1 of the present embodiment is different in that the protruding dimension of the heat-dissipating protrusion 20a is larger than the outer dimension of each external connection electrode 23 in the thickness direction of the mounting substrate 20. To do. Further, in the surface-mounted light-emitting device 1 of the present embodiment, as shown in FIG. 8, the width dimension W1 in the longitudinal direction of the external connection electrode 23 in the plane parallel to the other surface of the mounting substrate 20 is the longitudinal direction. It is narrower than the width W2 of the mounting substrate 20 in FIG. In addition, the same code | symbol is attached | subjected to the component similar to Embodiment 3, and description is abbreviate | omitted.

しかして、本実施形態の表面実装型発光装置１では、放熱用パッド２５を配線基板３において金属ベース基板３１を露出させた部位と接合部５を介して固着することにより、放熱性を向上させることができる。また、複数個のパッケージをシート状に一体成形するには、実施形態１と同様に外部接続用電極２３の長手方向の幅寸法Ｗ１が当該長手方向における実装基板２０の幅Ｗ２と同じにするか、実装基板２０の幅Ｗ２よりも狭ければよい。本実施形態では、図８に示すように、外部接続用電極２３の長手方向の幅寸法Ｗ１を、当該長手方向における実装基板２０の幅Ｗ２よりも狭くした。   Thus, in the surface-mount light-emitting device 1 of the present embodiment, the heat dissipation is improved by fixing the heat dissipation pad 25 to the portion of the wiring board 3 where the metal base substrate 31 is exposed through the joint portion 5. be able to. Further, in order to integrally form a plurality of packages into a sheet shape, whether the width dimension W1 in the longitudinal direction of the external connection electrode 23 is the same as the width W2 of the mounting substrate 20 in the longitudinal direction as in the first embodiment. The width may be narrower than the width W2 of the mounting substrate 20. In the present embodiment, as shown in FIG. 8, the width dimension W1 in the longitudinal direction of the external connection electrode 23 is made narrower than the width W2 of the mounting substrate 20 in the longitudinal direction.

以上説明した実施形態１〜４の外部接続用電極２３の構造では、両脚片の長さを、収納凹所２１の内底面の端部と実装基板２０の側面との間隔よりも短くすることが可能である。そのため、特に図７に示した表面実装型発光装置１において顕著であるが、収納凹所２１の内底面よりも高い位置に外部接続用電極３３の上面を配置することで表面実装型発光装置１の厚みを薄くすることができ、表面実装型発光装置１をよりコンパクトにすることができる効果がある。   In the structure of the external connection electrode 23 of the first to fourth embodiments described above, the length of both leg pieces can be made shorter than the distance between the end of the inner bottom surface of the storage recess 21 and the side surface of the mounting substrate 20. Is possible. Therefore, this is particularly noticeable in the surface-mounted light-emitting device 1 shown in FIG. 7, but by disposing the upper surface of the external connection electrode 33 at a position higher than the inner bottom surface of the housing recess 21, the surface-mounted light-emitting device 1. Thus, the surface-mounted light-emitting device 1 can be made more compact.

（実施形態５）
本実施形態の表面実装型発光装置１の基本構成は実施形態１と略同じであって、図９および図１０に示すように、実装基板２０における配線パターン２２の形成位置および各外部接続用電極２３，２３の形状などが相違する。なお、実施形態１と同様の構成要素には同一の符号を付して説明を省略する。 (Embodiment 5)
The basic configuration of the surface-mounted light-emitting device 1 of the present embodiment is substantially the same as that of the first embodiment. As shown in FIGS. 9 and 10, the formation position of the wiring pattern 22 on the mounting substrate 20 and each external connection electrode The shapes of 23 and 23 are different. In addition, the same code | symbol is attached | subjected to the component similar to Embodiment 1, and description is abbreviate | omitted.

外部接続用電極２３は、実装基板２０の厚み方向に沿って実装基板２０の側方に配置する金属板の一端部をＵ字状に曲成して実装基板２０の一表面側で配線パターン２２に固着する連絡片２３ａが形成され、他端部をＬ字状に曲成して回路パターン３３ａに接合部４を介して固着する端子片２３ｂが形成されている。また、実装基板２０の上記一表面における収納凹所２１の周部には、各外部接続用電極２３の連絡片２３ａを嵌入する２つの溝部２０ｂが形成されており、溝部２０ｂの内底面には、配線パターン２２の一部が露出している。   The external connection electrode 23 is formed by bending one end of a metal plate disposed on the side of the mounting substrate 20 along the thickness direction of the mounting substrate 20 into a U-shape and wiring pattern 22 on one surface side of the mounting substrate 20. A connecting piece 23a is formed which is fixed to the circuit pattern 33a, and a terminal piece 23b which is fixed to the circuit pattern 33a via the joint portion 4 is formed. In addition, two grooves 20b into which the connecting pieces 23a of the respective external connection electrodes 23 are fitted are formed in the peripheral portion of the storage recess 21 on the one surface of the mounting substrate 20, and the inner bottom surface of the groove 20b is formed on the inner bottom surface of the groove 20b. A part of the wiring pattern 22 is exposed.

しかして、本実施形態の表面実装型発光装置１では、実装基板２０の厚み方向における各外部接続用電極２３の長さが上記各実施形態の外部接続用電極２３に比べて長くなって、弾性変形しやすくなり、実装基板２０と配線基板３の金属ベース基板３１の熱膨張率の差に起因して接合部４に発生する応力をより緩和することができ、接合部４にクラックが発生するのをより確実に防止することができる。   Therefore, in the surface-mounted light-emitting device 1 of the present embodiment, the length of each external connection electrode 23 in the thickness direction of the mounting substrate 20 is longer than that of the external connection electrode 23 of each of the above-described embodiments. It becomes easy to deform | transform, the stress which generate | occur | produces in the junction part 4 resulting from the difference of the thermal expansion coefficient of the mounting substrate 20 and the metal base substrate 31 of the wiring board 3 can be relieve | moderated more, and a crack generate | occur | produces in the junction part 4. Can be more reliably prevented.

（実施形態６）
本実施形態の表面実装型発光装置１の基本構成は実施形態１と略同じであって、図１１に示すように、各外部接続用電極２３が導電性を有する短冊状の板ばねにより構成されている点などが相違する。なお、実施形態１と同様の構成要素には同一の符号を付して説明を省略する。 (Embodiment 6)
The basic configuration of the surface-mounted light-emitting device 1 of the present embodiment is substantially the same as that of the first embodiment. As shown in FIG. 11, each external connection electrode 23 is composed of a strip-shaped leaf spring having conductivity. Is different. In addition, the same code | symbol is attached | subjected to the component similar to Embodiment 1, and description is abbreviate | omitted.

各外部接続用電極２３は、長手方向の寸法を図１１（ｂ）における実装基板２０の左右方向の幅寸法よりもやや長く設定し、実装基板２０の上記他表面に対して傾けて配置されており、長手方向の一端部が実装基板２０の回路パターン（図示せず）と固着され、他端部が接合部４を介して配線基板３の回路パターン３３ａ上に固着される。   Each external connection electrode 23 has a longitudinal dimension set slightly longer than the lateral dimension of the mounting board 20 in FIG. 11B and is inclined with respect to the other surface of the mounting board 20. In addition, one end portion in the longitudinal direction is fixed to a circuit pattern (not shown) of the mounting substrate 20, and the other end portion is fixed to the circuit pattern 33 a of the wiring substrate 3 through the joint portion 4.

しかして、本実施形態では、実施形態１に比べて外部接続用電極２３が弾性変形しやすくなり、接合部４にクラックが発生するのをより確実に防止することができる。   Therefore, in the present embodiment, the external connection electrode 23 is more easily elastically deformed than in the first embodiment, and the occurrence of cracks in the joint portion 4 can be more reliably prevented.

なお、図１１に示した例では、板ばねからなる外部接続用電極２３の長手方向の一端部を実装基板２０の配線パターンと固着し、他端部を配線基板３の回路パターン３３ａと固着しているが、図１２に示すように、外部接続用電極２３を湾曲させておき、長手方向の中央部を実装基板２０の配線パターン（図示せず）と固着し、長手方向の両端部を配線基板３の回路パターン３３ａと接合部４を介して固着するようにしてもよいし、図１３に示すように、長手方向の両端部を実装基板２０の配線パターン（図示せず）と固着し、長手方向の中央部を配線基板３の回路パターン３３ａと接合部４を介して固着するようにしてもよい。   In the example shown in FIG. 11, one end in the longitudinal direction of the external connection electrode 23 made of a leaf spring is fixed to the wiring pattern of the mounting substrate 20, and the other end is fixed to the circuit pattern 33 a of the wiring substrate 3. However, as shown in FIG. 12, the external connection electrode 23 is curved, the central portion in the longitudinal direction is fixed to the wiring pattern (not shown) of the mounting substrate 20, and both end portions in the longitudinal direction are wired. It may be fixed to the circuit pattern 33a of the substrate 3 via the bonding portion 4, or both ends in the longitudinal direction are fixed to a wiring pattern (not shown) of the mounting substrate 20, as shown in FIG. The central portion in the longitudinal direction may be fixed to the circuit pattern 33 a of the wiring board 3 via the joint portion 4.

（実施形態７）
本実施形態の表面実装型発光装置１の基本構成は実施形態１と略同じであって、図１４に示すように、金属板からなる放熱部２４の形状が相違する。本実施形態における放熱部２４は、外周縁に開放された複数のＶ字状のスリット２４ａが周方向に離間して形成されている。ここに、図１４に示した例では矩形板状の放熱部２４の外周縁を構成する４辺それぞれの中央部にスリット２４ａを形成してある。他の構成は実施形態１と同じである。 (Embodiment 7)
The basic configuration of the surface-mount light-emitting device 1 of the present embodiment is substantially the same as that of the first embodiment, and as shown in FIG. 14, the shape of the heat dissipation portion 24 made of a metal plate is different. In the present embodiment, the heat dissipating part 24 is formed with a plurality of V-shaped slits 24a opened to the outer peripheral edge so as to be spaced apart in the circumferential direction. Here, in the example shown in FIG. 14, a slit 24 a is formed at the center of each of the four sides constituting the outer peripheral edge of the rectangular plate-like heat radiating portion 24. Other configurations are the same as those of the first embodiment.

しかして、本実施形態の表面実装型発光装置１では、実装基板２０と配線基板３（図２参照）との熱膨張率の差に起因して接合部４（図２参照）に発生する応力を、コ字状の外部接続用電極２３が弾性変形することによって緩和できるだけでなく、放熱部２４が変形することによっても緩和することができる。なお、図１４（ｂ）中の矢印は、表面実装型発光装置１を配線基板３（図２参照）に搭載して点灯させた場合に放熱部２４が変形しようとする向きを示してある。   Thus, in the surface-mounted light-emitting device 1 of the present embodiment, the stress generated in the joint 4 (see FIG. 2) due to the difference in thermal expansion coefficient between the mounting substrate 20 and the wiring substrate 3 (see FIG. 2). This can be mitigated not only by the elastic deformation of the U-shaped external connection electrode 23 but also by the deformation of the heat radiating portion 24. In addition, the arrow in FIG.14 (b) has shown the direction which the thermal radiation part 24 tends to deform | transform when the surface mount type light-emitting device 1 is mounted on the wiring board 3 (refer FIG. 2), and is lighted.

（実施形態８）
本実施形態の表面実装型発光装置１の基本構成は実施形態７と略同じであって、図１５に示すように、コ字状の外部接続用電極２３の向きが逆になっている点が相違するだけである。 (Embodiment 8)
The basic configuration of the surface mount light emitting device 1 of the present embodiment is substantially the same as that of the seventh embodiment, and the direction of the U-shaped external connection electrode 23 is reversed as shown in FIG. Only the difference.

（実施形態９）
本実施形態の表面実装型発光装置１の基本構成は実施形態６と略同じであって、図１６に示すように、実施形態７と同様の放熱部２４を設けた点が相違するだけである。なお、他の実施形態において同様の放熱部２４を設けてもよい。 (Embodiment 9)
The basic configuration of the surface-mounted light-emitting device 1 of the present embodiment is substantially the same as that of the sixth embodiment, except that a heat radiating part 24 similar to that of the seventh embodiment is provided as shown in FIG. . In addition, you may provide the same thermal radiation part 24 in other embodiment.

（実施形態１０）
本実施形態の表面実装型発光装置１の基本構成は実施形態１と略同じであって、図１７に示すように、放熱部２４を実装基板２０の上記他表面の法線方向に突出するピン状の形状に形成して、複数本設けている点が相違する。 (Embodiment 10)
The basic configuration of the surface-mounted light-emitting device 1 of this embodiment is substantially the same as that of the first embodiment, and as shown in FIG. It is different in that it is formed into a shape and provided with a plurality.

しかして、本実施形態の表面実装型発光装置１では、配線基板３に各放熱部２４を嵌入する嵌入孔３４を設ければ、半田などのろう材を用いることなく放熱部２４と配線基板３とを熱的に結合することが可能となる。なお、他の実施形態においてもピン状の放熱部２４を設けてもよい。   Thus, in the surface-mount light-emitting device 1 of the present embodiment, if the insertion holes 34 into which the respective heat radiating portions 24 are inserted are provided in the wiring board 3, the heat radiating portions 24 and the wiring substrate 3 can be used without using a brazing material such as solder. Can be thermally coupled. In other embodiments, the pin-shaped heat radiation portion 24 may be provided.

（実施形態１１）
本実施形態の表面実装型発光装置１の基本構成は実施形態１０と略同じであって、図１８に示すように、ピン状の放熱部２４の外径を実施形態１０に比べて大きくして１本だけにしている点が相違する。 (Embodiment 11)
The basic configuration of the surface-mounted light-emitting device 1 of the present embodiment is substantially the same as that of the tenth embodiment. As shown in FIG. The difference is that only one is used.

しかして、本実施形態の表面実装型発光装置１では、例えば、図１８に示すように、配線基板３に、放熱部２４を挿入する貫通孔３５を貫設しておき、貫通孔３５の内周面と放熱部２４の外周面とをろう材（半田）からなる接合部３６を介して接合するようにすれば、放熱部２４と配線基板３との接合面積を広くすることができ、放熱性が向上する。   Thus, in the surface-mounted light-emitting device 1 of the present embodiment, for example, as shown in FIG. 18, a through-hole 35 into which the heat radiating part 24 is inserted is provided in the wiring board 3. If the peripheral surface and the outer peripheral surface of the heat radiating portion 24 are joined via a joint portion 36 made of brazing material (solder), the joint area between the heat radiating portion 24 and the wiring board 3 can be increased, and the heat radiated. Improves.

実施形態１を示し、（ａ）は概略断面図、（ｂ）は概略斜視図である。Embodiment 1 is shown, (a) is a schematic sectional view, and (b) is a schematic perspective view. 同上を示し、配線基板に搭載した状態の概略断面図である。It is a schematic sectional drawing of the state which showed the same and was mounted in the wiring board. 同上におけるパッケージを複数個まとめたシート状部材を示し、（ａ）は概略平面図、（ｂ）は概略横断面図、（ｃ）は概略縦断面図である。The sheet-like member which put together the package in the same as the above is shown, (a) is a schematic plan view, (b) is a schematic cross-sectional view, (c) is a schematic vertical cross-sectional view. 同上の他の構成例を示し、（ａ）は概略断面図、（ｂ）は概略斜視図である。The other structural example same as the above is shown, (a) is a schematic sectional view, (b) is a schematic perspective view. 実施形態２を示し、（ａ）は概略断面図、（ｂ）は概略斜視図である。Embodiment 2 is shown, (a) is a schematic sectional view, and (b) is a schematic perspective view. 実施形態３を示し、配線基板に搭載した状態の概略断面図である。FIG. 9 is a schematic cross-sectional view showing the third embodiment and mounted on a wiring board. 実施形態４を示し、配線基板に搭載した状態の概略断面図である。FIG. 9 is a schematic cross-sectional view showing a fourth embodiment and mounted on a wiring board. 同上を示す下面図である。It is a bottom view showing the same. 実施形態５を示し、概略分解断面図である。FIG. 10 is a schematic exploded sectional view showing a fifth embodiment. 同上を示し、配線基板に搭載した状態の概略断面図である。It is a schematic sectional drawing of the state which showed the same and was mounted in the wiring board. 実施形態６を示し、（ａ）は配線基板に搭載した状態の正面図、（ｂ）は（ａ）のＡ−Ａ’概略断面図である。Embodiment 6 is shown, (a) is a front view of a state mounted on a wiring board, and (b) is a schematic cross-sectional view taken along line A-A ′ of (a). 同上の他の構成例を示し、（ａ）は配線基板に搭載した状態の正面図、（ｂ）は（ａ）のＡ−Ａ’概略断面図である。The other example of a structure same as the above is shown, (a) is a front view of the state mounted in the wiring board, (b) is A-A 'schematic sectional drawing of (a). 同上の他の構成例を示し、（ａ）は配線基板に搭載した状態の正面図、（ｂ）は（ａ）のＡ−Ａ’概略断面図である。The other example of a structure same as the above is shown, (a) is a front view of the state mounted in the wiring board, (b) is A-A 'schematic sectional drawing of (a). 実施形態７を示し、（ａ）は概略正面図、（ｂ）は概略下面図である。Embodiment 7 is shown, (a) is a schematic front view, (b) is a schematic bottom view. 実施形態８を示し、（ａ）は概略正面図、（ｂ）は概略下面図である。Embodiment 8 is shown, (a) is a schematic front view, (b) is a schematic bottom view. 実施形態９を示し、（ａ）は概略正面図、（ｂ）は概略下面図である。Embodiment 9 is shown, (a) is a schematic front view, (b) is a schematic bottom view. 実施形態１０を示し、配線基板への搭載方法の説明図である。FIG. 10 is a diagram illustrating a mounting method on a wiring board according to the tenth embodiment. 実施形態１１を示し、配線基板への搭載方法の説明図である。FIG. 18 is a diagram illustrating a method for mounting on a wiring board according to an eleventh embodiment. 従来例を示す概略断面図である。It is a schematic sectional drawing which shows a prior art example. 他の従来例を示す概略断面図である。It is a schematic sectional drawing which shows another prior art example. 他の従来例を示し、配線基板に搭載した状態の概略断面図である。It is a schematic sectional drawing of the state mounted in the wiring board which shows another prior art example.

符号の説明Explanation of symbols

１ 表面実装型発光装置
４ 接合部
１０ ＬＥＤチップ
１２ バンプ
２０ 実装基板
２１ 収納凹所
２２ 配線パターン
２３ 外部接続用電極 DESCRIPTION OF SYMBOLS 1 Surface mount type light-emitting device 4 Junction part 10 LED chip 12 Bump 20 Mounting board 21 Storage recess 22 Wiring pattern 23 External connection electrode

Claims (8)

ＬＥＤチップと、厚み方向の一表面にＬＥＤチップを収納する収納凹所が形成された実装基板を有するパッケージとを備え、パッケージは、実装基板に形成されＬＥＤチップに電気的に接続される配線パターンと、配線パターンを介してＬＥＤチップに電気的に接続され配線基板の回路パターン上にろう材からなる接合部を介して固着される外部接続用電極とを有し、外部接続用電極は、配線パターンとは別体であって弾性変形可能な形状に形成されてなることを特徴とする表面実装型発光装置。   A wiring pattern including an LED chip and a package having a mounting substrate in which a housing recess for storing the LED chip is formed on one surface in the thickness direction, and the package is formed on the mounting substrate and electrically connected to the LED chip And an external connection electrode that is electrically connected to the LED chip via the wiring pattern and is fixed to the circuit pattern of the wiring board via a joint made of a brazing material. The external connection electrode is a wiring A surface-mounted light-emitting device that is formed separately from a pattern and is elastically deformable. 前記外部接続用電極は、前記実装基板における前記厚み方向の他表面側に設けられてなることを特徴とする請求項１記載の表面実装型発光装置。   The surface-mount light-emitting device according to claim 1, wherein the external connection electrode is provided on the other surface side of the mounting substrate in the thickness direction. 前記外部接続用電極は、前記厚み方向に離間した一対の脚片を有するコ字状に形成され、前記実装基板に近い側の脚片が前記配線パターンに固着されており、前記実装基板から遠い側の脚片が前記回路パターンと固着する端子片を構成していることを特徴とする請求項２記載の表面実装型発光装置。   The external connection electrode is formed in a U shape having a pair of leg pieces spaced apart in the thickness direction, and a leg piece closer to the mounting board is fixed to the wiring pattern, and is far from the mounting board. 3. The surface mount type light emitting device according to claim 2, wherein a leg piece on the side constitutes a terminal piece fixed to the circuit pattern. 前記外部接続用電極は、導電性を有する板ばねからなることを特徴とする請求項２記載の表面実装型発光装置。   3. The surface mount light emitting device according to claim 2, wherein the external connection electrode is made of a conductive leaf spring. 前記外部接続用電極は、前記実装基板の前記厚み方向に沿って前記実装基板の側方に配置する金属板の一端部をＵ字状に曲成して前記実装基板の前記一表面側で前記配線パターンに固着する連絡片が形成され、他端部をＬ字状に曲成して前記回路パターンに固着する端子片が形成されてなることを特徴とする請求項１記載の表面実装型発光装置。   The external connection electrode is formed by bending one end of a metal plate disposed on the side of the mounting board along the thickness direction of the mounting board in a U-shape and on the one surface side of the mounting board. 2. A surface-mounted light emitting device according to claim 1, wherein a connecting piece fixed to the wiring pattern is formed, and a terminal piece fixed to the circuit pattern is formed by bending the other end portion into an L shape. apparatus. 前記実装基板は、前記厚み方向の他表面において前記収納凹所の内底面に対応する部位に、前記ＬＥＤチップで発生した熱を放熱させる放熱部が設けられてなるとを特徴とする請求項１ないし請求項５のいずれかに記載の表面実装型発光装置。   2. The mounting board according to claim 1, wherein a heat radiating part for radiating heat generated by the LED chip is provided at a portion corresponding to the inner bottom surface of the housing recess on the other surface in the thickness direction. The surface-mount light-emitting device according to claim 5. 前記放熱部は、外周縁に開放された複数のスリットが周方向に離間して形成されてなることを特徴とする請求項６記載の表面実装型発光装置。   The surface mount type light emitting device according to claim 6, wherein the heat dissipating part is formed by a plurality of slits opened in an outer peripheral edge so as to be spaced apart in the circumferential direction. 前記放熱部は、前記実装基板の前記他表面の法線方向に突出するピン状に形成されてなることを特徴とする請求項６記載の表面実装型発光装置。   The surface mounted light emitting device according to claim 6, wherein the heat radiating portion is formed in a pin shape protruding in a normal direction of the other surface of the mounting substrate.
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WO2015097955A1 (en) * 2013-12-26 2015-07-02 アピックヤマダ株式会社 Lead frame, substrate for led package, reflector member, led package, light emitting device, light emitting system, method for manufacturing substrate for led package, and method for manufacturing led package

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