JP2009289841A - Package for housing light emitting element - Google Patents

Package for housing light emitting element Download PDF

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JP2009289841A
JP2009289841A JP2008138835A JP2008138835A JP2009289841A JP 2009289841 A JP2009289841 A JP 2009289841A JP 2008138835 A JP2008138835 A JP 2008138835A JP 2008138835 A JP2008138835 A JP 2008138835A JP 2009289841 A JP2009289841 A JP 2009289841A
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emitting element
ceramic substrate
light emitting
storage package
heat
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Japanese (ja)
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Akihiro Hidaka
明弘 日高
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Sumitomo Metal SMI Electronics Device Inc
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Sumitomo Metal SMI Electronics Device Inc
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Priority to JP2008138835A priority Critical patent/JP2009289841A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H01L2924/15192—Resurf arrangement of the internal vias

Abstract

<P>PROBLEM TO BE SOLVED: To provide an inexpensive package for housing a light emitting element, which does not impede light emission from a light emitting element and effectively dissipates heat generated therefrom. <P>SOLUTION: The package 10 for housing the light emitting element, including a reflector 14 enclosing the light emitting element 12 mounted on the upper surface of a ceramic substrate 11 to reflect light therefrom, and a heat sink 16 for dissipating the heat from the light emitting element 12 on a lower surface, has a plurality of through-holes 17 in the ceramic substrate 11 at outside peripheral parts of the reflector 14, caulking pins 18 which are erected on the heat sink 16 and are inserted into the through-holes 17, and insertion holes 19 into which tip ends thereof are inserted from the upper surface of the heat sink 16. The caulking pins 18 are inserted into the through-holes 17 to bring the ceramic substrate 11 into contact with the upper part of the heat sink 16, and bent to be led out of the ceramic substrate 11, and the tip ends are pressed into the insertion holes 19 to join the ceramic substrate 11 onto the heat sink 16 by caulking. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

本発明は、ＬＥＤ（Ｌｉｇｈｔ Ｅｍｉｔｔｉｎｇ Ｄｉｏｄｅ）等の発光素子を収納するための発光素子収納用パッケージに関し、より詳細には、発光素子をセラミック基板の上面に実装して、発光素子からの発光を反射体で反射させると共に、発光素子からの発熱を放熱させるための放熱体をセラミック基板の下面に設ける発光素子収納用パッケージに関する。   The present invention relates to a light emitting element storage package for storing a light emitting element such as an LED (Light Emitting Diode), and more specifically, the light emitting element is mounted on an upper surface of a ceramic substrate to reflect light emitted from the light emitting element. The present invention relates to a light emitting element storage package in which a heat radiating body is provided on a lower surface of a ceramic substrate while being reflected by a body and radiating heat generated from the light emitting element.

発光素子は、その照度を向上させるために入力電力を上げて対応する場合がある。しかしながら、発光素子は、この入力電力の上昇によって照度は上がるものの、温度が上昇して大量の発熱が起こり、この発熱によって逆に照度が低下するという問題を抱えている。従って、従来からこのような発光素子を搭載させるための発光素子収納用パッケージには、発光素子からの発熱を速やかに放熱させることができる構造のパッケージが求められている。   In some cases, a light emitting element responds by increasing input power in order to improve its illuminance. However, although the illuminance increases due to the increase in input power, the light emitting element has a problem that the temperature rises and a large amount of heat is generated, and the illuminance decreases conversely due to this heat generation. Therefore, conventionally, a light emitting element storage package for mounting such a light emitting element is required to have a structure that can quickly dissipate heat generated from the light emitting element.

図３（Ａ）、（Ｂ）を参照しながら、従来の発光素子収納用パッケージを説明する。ここで、図３（Ａ）、（Ｂ）はそれぞれ従来の発光素子収納用パッケージの平面図、Ｂ−Ｂ’線縦断面図である。
図３（Ａ）、（Ｂ）に示すように、従来の発光素子収納用パッケージ５０は、発光素子５１を載置するための基板に、セラミックや、樹脂が用いられている。しかしながら、樹脂は、セラミックに比較して熱伝導率が低いので、放熱性を要求される発光素子収納用パッケージ５０には不向きとなっている。そこで、基板には、例えば、樹脂に比較して熱伝導率が高く、比較的安価なアルミナ（Ａｌ２Ｏ３）製等のセラミック基板５２を用いることが多くなってきている。このセラミック基板５２は、先ず、アルミナからなる複数枚のセラミックグリーンシートを作製し、それぞれのセラミックグリーンシートにタングステン（Ｗ）や、モリブデン（Ｍｏ）等の高融点金属を用いてスクリーン印刷して導体印刷配線パターンを形成している。更に、それぞれのセラミックグリーンシートは、重ね合わせて積層した後、焼成して導体配線パターン５３を備えたセラミック多層基板からなるセラミック基板５２を形成している。そして、このセラミック基板５２の上面には、発光素子５１をワイヤボンド方式や、フリップチップ方式で実装させることができるようにしている。 With reference to FIGS. 3A and 3B, a conventional light emitting element storage package will be described. Here, FIGS. 3A and 3B are a plan view and a vertical cross-sectional view taken along line BB ′, respectively, of a conventional light emitting element storage package.
As shown in FIGS. 3A and 3B, the conventional light-emitting element storage package 50 uses ceramic or resin for a substrate on which the light-emitting element 51 is placed. However, since resin has a lower thermal conductivity than ceramic, it is not suitable for the light emitting element storage package 50 that requires heat dissipation. Therefore, for example, a ceramic substrate 52 made of alumina (Al 2 O 3 ), which has a higher thermal conductivity than a resin and is relatively inexpensive, is often used as the substrate. For this ceramic substrate 52, first, a plurality of ceramic green sheets made of alumina are produced, and each ceramic green sheet is screen-printed using a refractory metal such as tungsten (W) or molybdenum (Mo) to be a conductor. A printed wiring pattern is formed. Further, each ceramic green sheet is laminated and laminated, and then fired to form a ceramic substrate 52 made of a ceramic multilayer substrate having a conductor wiring pattern 53. The light emitting element 51 can be mounted on the upper surface of the ceramic substrate 52 by a wire bond method or a flip chip method.

上記の発光素子収納用パッケージ５０には、セラミック基板５２の上面に発光素子５１を囲繞して発光素子５１からの発光を反射させるためのセラミックや、金属等からなる枠状の反射体５４が形成されている。また、この発光素子収納用パッケージ５０には、セラミック基板５２の上面の反射体５４の外側周辺部に接続させて、導体配線パターン５３を介して発光素子５１と電気的に導通状態となる外部接続端子５５が設けられている。更に、この発光素子収納用パッケージ５０には、発光素子５１からの発熱を放熱させるための、熱伝導率に優れる、例えば、アルミニウム等を用いてフィン状に形成された放熱体５６が、セラミック基板５２の下面に設ける接続用導体パターン５７を介して直接半田５８で接合して設けられている。   In the light emitting element storage package 50, a frame-like reflector 54 made of ceramic, metal or the like is formed on the upper surface of the ceramic substrate 52 so as to surround the light emitting element 51 and reflect light emitted from the light emitting element 51. Has been. The light emitting element storage package 50 is connected to the outer peripheral portion of the reflector 54 on the upper surface of the ceramic substrate 52 and is electrically connected to the light emitting element 51 through the conductor wiring pattern 53. A terminal 55 is provided. Further, the light emitting element storage package 50 is provided with a heat dissipation body 56 that is excellent in thermal conductivity for radiating heat generated from the light emitting element 51, for example, formed in a fin shape using aluminum or the like. They are directly joined by solder 58 via connecting conductor patterns 57 provided on the lower surface of 52.

しかしながら、上記の発光素子収納用パッケージ５０は、それぞれの熱膨張係数の異なるセラミック基板５２と、放熱体５６を半田５８で接合しているので、繰り返しの加熱、冷却によって接合部材間のそれぞれの熱膨張係数の差からの歪みで半田５８に疲労劣化によるクラック等が発生し、接合信頼性の低下となり、ひいては照度の低下となっている。   However, in the light emitting element storage package 50, since the ceramic substrate 52 and the radiator 56 having different thermal expansion coefficients are joined by the solder 58, the heat between the joining members is repeatedly heated and cooled. Cracks or the like due to fatigue deterioration occur in the solder 58 due to distortion due to the difference in expansion coefficient, resulting in a decrease in bonding reliability and, in turn, a decrease in illuminance.

半導体装置と称する従来の発光素子収納用パッケージには、半導体素子の収納されたセラミック基板からなる容器を封止するＵ字型金属キャップの端部が、放熱体に設けられた孔に挿入され、端部を折り曲げることによって放熱体が金属キャップに固定されてなるものが提案されている（例えば、特許文献１参照）。
セラミックパッケージと称する従来の発光素子収納用パッケージには、セラミック基板にヒートシンク（放熱体）取り付けねじを取付け、これによってヒートシンクを取り付けるものが提案されている（例えば、特許文献２参照）。
セラミックス基板構造体と称する従来の発光素子収納用パッケージには、窒化アルミニウムからなるセラミック基板をヒートシンク（放熱体）に半田で接合し、このヒートシンクを鋼鉄製のフレームにボルトで取り付けるものが提案されている（例えば、特許文献３参照）。
パワーモジュール用基板と称する従来の発光素子収納用パッケージには、セラミック基板に設ける貫通孔に弾性体とカラーを備えさせ、そこに雄ねじを挿通させてヒートシンク（放熱体）に設ける雌ねじに螺合させて締め付けることで、セラミック基板と、ヒートシンクを直接接合させるものが提案されている（例えば、特許文献４参照）。 In a conventional light emitting element storage package called a semiconductor device, an end portion of a U-shaped metal cap that seals a container made of a ceramic substrate in which a semiconductor element is stored is inserted into a hole provided in a radiator, There has been proposed a structure in which a heat radiating body is fixed to a metal cap by bending an end (see, for example, Patent Document 1).
A conventional light emitting element storage package called a ceramic package has been proposed in which a heat sink (heat radiating body) mounting screw is attached to a ceramic substrate, thereby attaching the heat sink (see, for example, Patent Document 2).
A conventional light emitting element housing package called a ceramic substrate structure has been proposed in which a ceramic substrate made of aluminum nitride is joined to a heat sink (heat radiating body) with solder, and the heat sink is attached to a steel frame with bolts. (For example, see Patent Document 3).
In a conventional light emitting element storage package called a power module substrate, an elastic body and a collar are provided in a through hole provided in a ceramic substrate, and a male screw is inserted therethrough and screwed into a female screw provided in a heat sink (heat radiator). There has been proposed a structure in which a ceramic substrate and a heat sink are directly joined by tightening (see, for example, Patent Document 4).

実公昭６２−３３３３１号公報Japanese Utility Model Publication No. 62-33331 特開平６−２１２８８号公報Japanese Patent Laid-Open No. 6-21288 特開平６−１３５１０号公報JP-A-6-13510 特開２０００−２０８６８２号公報JP 2000-208682 A

しかしながら、前述したような従来の発光素子収納用パッケージは、次のような問題がある。
（１）実公昭６２−３３３３１号公報で開示されるような発光素子収納用パッケージは、放熱体を強固に保持することができるものの、発光素子を載置させたセラミック基板からの発熱を効率的に放熱させることができない構造となっている。また、この構造の発光素子収納用パッケージは、金属キャップの上面に放熱体が取り付けられるので、発光素子からの発光を外部に取り出すことができない構造となっている。
（２）特開平６−２１２８８号公報で開示されるような発光素子収納用パッケージは、セラミック基板の裏面に放熱体を直接取り付けることで、発光素子からの発光を外部に取り出すことができると共に、発光素子を載置させたセラミック基板からの発熱を効率的に放熱させることができるものの、放熱体を取り付けるためのねじをセラミック基板に直接接合する必要があり、パッケージのコストアップとなっている。また、この構造の発光素子収納用パッケージは、放熱体を取り付けねじに締め付けて取り付けるので、締め付け程度によって、脆性材料であるセラミック基板に破壊をもたらす問題を有すると共に、セラミック基板と、取り付けねじとの間に強い接合強度を必要とし、接合信頼性に問題を有している。
（３）特開平６−１３５１０号公報で開示されるような発光素子収納用パッケージは、ボルトを締め付けても金属板同士の締め付けであるので、セラミック基板とボルトとの間に接合強度を必要としないものの、セラミック基板と放熱体との間が半田接合であるので、繰り返しの加熱、冷却によって接合部材間のそれぞれの熱膨張係数の差からの歪みで半田に疲労劣化によるクラック等が発生し、接合信頼性の低下となっている。
（４）特開２０００−２０８６８２号公報で開示されるような発光素子収納用パッケージは、セラミック基板と放熱体を雄ねじで締め付けてもセラミック基板の貫通孔に設けたカラーと弾性体でセラミック基板に破壊を与えることなく取り付けることができるものの、カラーと、弾性体によってセラミック基板と放熱体との密着力が弱く、発光素子を載置させたセラミック基板からの発熱を効率的に放熱させることができなくなっている。また、この構造の発光素子収納用パッケージは、カラーと、弾性体を必要とし、パッケージのコストアップとなっている。 However, the conventional light emitting element storage package as described above has the following problems.
(1) Although the light emitting element storage package as disclosed in Japanese Utility Model Publication No. 62-33331 can hold the heat sink firmly, it efficiently generates heat from the ceramic substrate on which the light emitting element is mounted. It has a structure that cannot dissipate heat. In addition, the light emitting element storage package having this structure has a structure in which light emitted from the light emitting element cannot be extracted to the outside because a heat radiator is attached to the upper surface of the metal cap.
(2) The light emitting element storage package as disclosed in Japanese Patent Application Laid-Open No. 6-21288 can take out light emitted from the light emitting element to the outside by directly attaching a heat radiator to the back surface of the ceramic substrate. Although heat generated from the ceramic substrate on which the light emitting element is mounted can be efficiently radiated, it is necessary to directly join a screw for attaching the heat radiating member to the ceramic substrate, which increases the cost of the package. In addition, the light emitting element storage package having this structure has a problem in that the ceramic substrate, which is a brittle material, may be broken depending on the degree of tightening because the radiator is fastened to the mounting screw. A strong bonding strength is required between them, and there is a problem in bonding reliability.
(3) Since the light emitting element storage package as disclosed in JP-A-6-13510 is tightened between metal plates even when bolts are tightened, a bonding strength is required between the ceramic substrate and the bolts. Although it is not, since the ceramic substrate and the heat sink are solder joints, cracks due to fatigue deterioration occur in the solder due to distortion from the difference in thermal expansion coefficient between the joint members due to repeated heating and cooling, Bonding reliability is reduced.
(4) A light emitting element storage package as disclosed in Japanese Patent Application Laid-Open No. 2000-208682 has a collar and an elastic body provided in a through hole of a ceramic substrate even when the ceramic substrate and a heat radiating body are tightened with male screws. Although it can be mounted without causing damage, the collar and elastic body make the adhesive force between the ceramic substrate and the heat sink weak, and can efficiently dissipate heat generated from the ceramic substrate on which the light-emitting element is placed. It is gone. In addition, the light emitting element storage package having this structure requires a collar and an elastic body, which increases the cost of the package.

本発明は、かかる事情に鑑みてなされたものであって、発光素子からの発光を妨げることなく発光させることができると共に、発光素子からの発熱を効率的に放熱させることができる安価な発光素子収納用パッケージを提供することを目的とする。   The present invention has been made in view of such circumstances, and is an inexpensive light-emitting element that can emit light without hindering light emission from the light-emitting element and can efficiently dissipate heat generated from the light-emitting element. An object is to provide a storage package.

前記目的に沿う本発明に係る発光素子収納用パッケージは、セラミック基板の上面の中央部に搭載される発光素子を囲繞して発光素子からの発光を反射させるための反射体と、セラミック基板の下面に発光素子からの発熱を放熱させるための放熱体を有する発光素子収納用パッケージにおいて、反射体の外側周辺部のセラミック基板にセラミック基板を貫通する複数の貫通孔と、放熱体に放熱体の上面から立設して貫通孔に挿入できるカシメ用ピンと、カシメ用ピンの先端部を放熱体の上面から挿入できる挿入穴を有し、貫通孔にカシメ用ピンを挿入してセラミック基板を放熱体上に当接すると共に、カシメ用ピンをセラミック基板の上面で屈曲させてセラミック基板の外側に導出し先端部を挿入穴に圧入してセラミック基板を放熱体上にカシメ接合して有する。   The light-emitting element storage package according to the present invention that meets the above-described object includes a reflector for reflecting the light emitted from the light-emitting element by surrounding the light-emitting element mounted at the center of the upper surface of the ceramic substrate, and the lower surface of the ceramic substrate. A light-emitting element storage package having a heat dissipator for dissipating heat generated from the light-emitting element, a plurality of through-holes penetrating the ceramic substrate in the outer peripheral portion of the reflector, and an upper surface of the heat dissipator There are crimping pins that can be inserted into the through-holes standing from the top, and insertion holes into which the tip of the crimping pin can be inserted from the top surface of the heat sink. Insert the caulking pins into the through-holes and place the ceramic substrate on the heat sink. The caulking pin is bent at the upper surface of the ceramic substrate and led to the outside of the ceramic substrate, and the tip is press-fitted into the insertion hole so that the ceramic substrate is placed on the radiator. Have in main junction.

ここで、上記の発光素子収納用パッケージは、挿入穴の放熱体の上面から穴底までの空洞がセラミック基板の中央部側に向かっての傾斜を有するのがよい。   Here, in the light emitting element storage package described above, it is preferable that the cavity from the upper surface of the heat sink of the insertion hole to the bottom of the hole has an inclination toward the center of the ceramic substrate.

また、上記の発光素子収納用パッケージは、放熱体の上面と、セラミック基板の下面の間に、熱伝導性を備えた弾性体からなる隙間シートを密着させて有するのがよい。   The light emitting element storage package preferably includes a gap sheet made of an elastic body having thermal conductivity in close contact between the upper surface of the radiator and the lower surface of the ceramic substrate.

請求項１又はこれに従属する請求項２又は３記載の発光素子収納用パッケージは、反射体の外側周辺部のセラミック基板にセラミック基板を貫通する複数の貫通孔と、放熱体に放熱体の上面から立設して貫通孔に挿入できるカシメ用ピンと、カシメ用ピンの先端部を放熱体の上面から挿入できる挿入穴を有し、貫通孔にカシメ用ピンを挿入してセラミック基板を放熱体上に当接すると共に、カシメ用ピンをセラミック基板の上面で屈曲させてセラミック基板の外側に導出し先端部を挿入穴に圧入してセラミック基板を放熱体上にカシメ接合して有するので、搭載させる発光素子からの発光を妨げることなく前方に発光させることができると共に、セラミック基板と、放熱体を半田を用いることなく接合して、繰り返しの加熱、冷却によって接合部材間のそれぞれの熱膨張係数の差からの歪みによる半田の疲労劣化から発生するクラック等の発生を防止でき、接合信頼性を向上させて効率的に発光素子からの発熱を放熱させることができる。また、セラミック基板と、放熱体の接合は、ねじ等を用いた締め付けでなく、カシメ用ピンでのカシメ接合であるので、締め付けによるセラミック基板の破壊や、締め付け不足による接合信頼性の低下を防止することができる。更に、セラミック基板と、放熱体の接合は、特段の接合用の部材を用いることなく、カシメ用ピンによるカシメ接合であるので、安価なパッケージを提供することができる。   The light emitting element storage package according to claim 1 or claim 2 or 3 dependent thereon, the ceramic substrate in the outer peripheral portion of the reflector, a plurality of through holes penetrating the ceramic substrate, and the heat radiator to the upper surface of the heat radiator. There are crimping pins that can be inserted into the through-holes standing from the top, and insertion holes into which the tip of the crimping pin can be inserted from the top surface of the heat sink. Insert the caulking pins into the through-holes and place the ceramic substrate on the heat sink. The caulking pin is bent on the upper surface of the ceramic substrate and led to the outside of the ceramic substrate, and the tip is press-fitted into the insertion hole so that the ceramic substrate is caulked and joined to the radiator, so that the light emission to be mounted Light can be emitted forward without interfering with light emission from the element, and the ceramic substrate and the heatsink can be joined without using solder and contacted by repeated heating and cooling. It is possible to prevent the occurrence of cracks and the like resulting from solder fatigue deterioration due to distortion due to the difference in thermal expansion coefficient between members, and to improve heat dissipation from the light emitting element by improving the bonding reliability. . In addition, the ceramic substrate and heat sink are not clamped with screws etc., but with caulking pins to prevent destruction of the ceramic substrate due to tightening and deterioration of bonding reliability due to insufficient tightening. can do. Furthermore, since the ceramic substrate and the heat radiating member are joined by caulking pins without using a special joining member, an inexpensive package can be provided.

特に、請求項２記載の発光素子収納用パッケージは、挿入穴の放熱体の上面から穴底までの空洞がセラミック基板の中央部側に向かっての傾斜を有するので、カシメ用ピンの先端部を圧入させるだけで、カシメ用ピンでセラミック基板を抱え込むようにして容易且つ強固にセラミック基板と、放熱体を接合させることができる。   Particularly, in the light emitting element storage package according to claim 2, since the cavity from the upper surface of the heat sink of the insertion hole to the bottom of the hole has an inclination toward the center portion side of the ceramic substrate, the tip portion of the caulking pin is By simply press-fitting, the ceramic substrate and the heat dissipating member can be joined easily and firmly so as to hold the ceramic substrate with caulking pins.

また、特に、請求項３記載の発光素子収納用パッケージは、放熱体の上面と、セラミック基板の下面の間に、熱伝導性を備えた弾性体からなる隙間シートを密着させて有するので、セラミック基板と、放熱体との間に僅かな隙間も作ることなく密接させ、しかも、隙間シートでの熱伝導率を低下させることなく発光素子からの発熱を放熱体に伝熱させて効率的に放熱体から放熱させることができる。   In particular, the light emitting element storage package according to claim 3 has a gap sheet made of an elastic body having thermal conductivity in close contact between the upper surface of the radiator and the lower surface of the ceramic substrate. Efficiently dissipates heat by causing heat generated from the light emitting element to be transferred to the radiator without lowering the thermal conductivity in the gap sheet without making a slight gap between the substrate and the radiator. Heat can be dissipated from the body.

続いて、添付した図面を参照しつつ、本発明を具体化した実施の形態について説明し、本発明の理解に供する。
ここに、図１（Ａ）、（Ｂ）はそれぞれ本発明の一実施の形態に係る発光素子収納用パッケージの平面図、Ａ−Ａ’線縦断面図、図２は同発光素子収納用パッケージのセラミック基板と放熱体の間に隙間シートを取り付ける説明図である。 Subsequently, embodiments of the present invention will be described with reference to the accompanying drawings to provide an understanding of the present invention.
1A and 1B are a plan view of a light-emitting element storage package according to an embodiment of the present invention, a longitudinal sectional view taken along line AA ′, and FIG. 2 is a light-emitting element storage package, respectively. It is explanatory drawing which attaches a gap | interval sheet | seat between the ceramic substrate and heat radiator.

図１（Ａ）、（Ｂ）に示すように、本発明の一実施の形態に係る発光素子収納用パッケージ１０は、形状を限定するものではないが、例えば、四角形からなるセラミック基板１１をＬＥＤ等の発光素子１２を搭載させるための基体としている。このセラミック基板１１には、例えば、アルミナ（Ａｌ２Ｏ３）や、窒化アルミニウム（ＡｌＮ）等のセラミックが用いられている。 As shown in FIGS. 1A and 1B, the light emitting element storage package 10 according to an embodiment of the present invention is not limited in shape, but, for example, a ceramic substrate 11 made of a square is connected to an LED. As a base for mounting a light emitting element 12 such as the above. For the ceramic substrate 11, for example, a ceramic such as alumina (Al 2 O 3 ) or aluminum nitride (AlN) is used.

ここで、このセラミック基板１１がアルミナを用いて形成される場合について簡単に説明する。セラミック基板１１は、先ず、アルミナ粉末に焼結助剤を適当量加えた粉末に、可塑剤と、バインダー、及び溶剤を加え、十分に混練し、脱泡してスラリーを作製し、ドクターブレード法等によって、所望の厚みのシート状にしている。そして、シート状からは、適当なサイズの矩形状に切断した必要枚数のセラミックグリーンシートを作製している。次いで、セラミックグリーンシートには、上、下層の電気的導通のためのビア用貫通孔等を打ち抜きプレス等で成形した後、それぞれのセラミックグリーンシートにタングステン（Ｗ）や、モリブデン（Ｍｏ）等の高融点金属からなる導体ペーストを用いてスクリーン印刷でビア導体や、導体印刷配線パターンを形成している。更に、それぞれのセラミックグリーンシートは、重ね合わせて温度と圧力をかけて一体化して積層体を形成している。次いで、積層体は、還元性雰囲気中の１５５０℃程度の高温で焼成して導体配線パターン１３を備えたセラミック多層基板からなるセラミック基板１１が形成されるようになっている。   Here, the case where this ceramic substrate 11 is formed using an alumina is demonstrated easily. The ceramic substrate 11 is prepared by first adding a plasticizer, a binder, and a solvent to a powder obtained by adding an appropriate amount of a sintering aid to alumina powder, and kneading and defoaming to prepare a slurry. For example, a sheet having a desired thickness is formed. From the sheet shape, the required number of ceramic green sheets cut into a rectangular shape of an appropriate size are produced. Next, the ceramic green sheets are formed with via holes for electrical conduction in the upper and lower layers by punching press or the like, and then each ceramic green sheet is made of tungsten (W), molybdenum (Mo), or the like. Via conductors and conductor printed wiring patterns are formed by screen printing using a conductive paste made of a refractory metal. Further, each ceramic green sheet is superposed and integrated by applying temperature and pressure to form a laminate. Next, the laminate is fired at a high temperature of about 1550 ° C. in a reducing atmosphere to form a ceramic substrate 11 made of a ceramic multilayer substrate having the conductor wiring pattern 13.

この発光素子収納用パッケージ１０は、セラミック基板１１の上面の中央部に搭載される発光素子１２を囲繞してこの発光素子１２からの発光を反射させるための反射体１４を有している。この反射体１４は、セラミックや、金属等からなると共に、形状を限定するものではないが、例えば、平面視して内周面を円形とし、この内周面に傾斜を持たせたりして反射効率を向上できるようにしている。セラミック基板１１と反射体１３の接合には、樹脂や、ガラスや、ろう材等が用いられたり、あるいはセラミック基板１１と反射体１３が積層、焼成されて一体的に形成されたりしている。発光素子収納用パッケージ１０は、セラミック基板１１の上面に、発光素子１２をワイヤボンド方式や、フリップチップ方式で実装させることができるようにしている。また、この発光素子収納用パッケージ１０には、セラミック基板１１の上面の反射体１４の外側周辺部に接続させて、導体配線パターン１３を介して発光素子１２と電気的に導通状態となる外部接続端子１５がろう付け接合されて設けられている。なお、この外部接続端子１５は、セラミック基板１１と熱膨張係数が近似するＫＶ（Ｆｅ−Ｎｉ−Ｃｏ系合金、商品名「Ｋｏｖａｒ（コバール）」）や、４２アロイ（Ｆｅ−Ｎｉ系合金）等の金属から形成されている。   The light emitting element storage package 10 includes a reflector 14 that surrounds the light emitting element 12 mounted at the center of the upper surface of the ceramic substrate 11 and reflects light emitted from the light emitting element 12. The reflector 14 is made of ceramic, metal, or the like and is not limited in shape. For example, the reflector 14 has a circular inner peripheral surface in plan view and is reflected by giving an inclination to the inner peripheral surface. To improve efficiency. For joining the ceramic substrate 11 and the reflector 13, resin, glass, brazing material, or the like is used, or the ceramic substrate 11 and the reflector 13 are laminated and fired to be integrally formed. The light emitting element storage package 10 is configured such that the light emitting element 12 can be mounted on the upper surface of the ceramic substrate 11 by a wire bond method or a flip chip method. The light emitting element storage package 10 is connected to the outer peripheral portion of the reflector 14 on the upper surface of the ceramic substrate 11 and is electrically connected to the light emitting element 12 through the conductor wiring pattern 13. The terminal 15 is provided by brazing. The external connection terminal 15 is composed of KV (Fe—Ni—Co alloy, trade name “Kovar”), 42 alloy (Fe—Ni alloy) or the like whose thermal expansion coefficient approximates that of the ceramic substrate 11. Made of metal.

また、この発光素子収納用パッケージ１０は、セラミック基板１１の下面に当接して、セラミック基板１１の上面の中央部に搭載される発光素子１２からの発熱を放熱させるための放熱体１６を有している。この放熱体１６は、通常、熱伝導率が高く、軽量であるアルミニウム等の金属を用い、例えば、外部に突出するフィンを有した形状からなっている。   The light emitting element storage package 10 has a heat radiator 16 that contacts the lower surface of the ceramic substrate 11 and dissipates heat generated from the light emitting element 12 mounted on the center of the upper surface of the ceramic substrate 11. ing. The heat radiating body 16 is usually made of a metal having a high thermal conductivity and a light weight such as aluminum, and has a shape having fins protruding outward, for example.

上記の発光素子収納用パッケージ１０のセラミック基板１１には、このセラミック基板１１の上面に有する反射体１４の外側周辺部の部位に、セラミック基板１１を貫通する複数の貫通孔１７を有している。この貫通孔１７は、セラミックグリーンシートにビア用貫通孔を打ち抜きプレス等で成形する場合と同様にして成形し、セラミックグリーンシートの積層体を焼成することで形成することができる。これと共に、上記の発光素子収納用パッケージ１０の放熱体１６には、この放熱体１６の上面から立設してセラミック基板１１に形成する貫通孔１７に挿入できるカシメ用ピン１８を有している。また、上記の発光素子収納用パッケージ１０の放熱体１６には、カシメ用ピン１８と共に、このカシメ用ピン１８の先端部を上面から挿入できる挿入穴１９を有している。   The ceramic substrate 11 of the light emitting element storage package 10 has a plurality of through-holes 17 penetrating the ceramic substrate 11 at the outer peripheral portion of the reflector 14 on the upper surface of the ceramic substrate 11. . This through hole 17 can be formed by forming a through hole for vias in a ceramic green sheet in the same manner as punching press or the like, and firing a laminated body of ceramic green sheets. At the same time, the heat dissipating body 16 of the light emitting element housing package 10 has a caulking pin 18 which stands up from the upper surface of the heat dissipating body 16 and can be inserted into a through hole 17 formed in the ceramic substrate 11. . In addition, the radiator 16 of the light emitting element storage package 10 has an insertion hole 19 into which the tip of the caulking pin 18 can be inserted from the upper surface together with the caulking pin 18.

そして、発光素子収納用パッケージ１０は、放熱体１６に形成されたカシメ用ピン１８をセラミック基板１１に形成された貫通孔１７に挿入してセラミック基板１１が放熱体１６の上面に当接させている。更に、発光素子収納用パッケージ１０は、カシメ用ピン１８をセラミック基板１１の上面で屈曲させてセラミック基板１１の外側に導出させて先端部を挿入穴１９に圧入させることで、セラミック基板１１が放熱体１６にカシメ接合されている。このカシメ用ピン１８、及びこれに対応する挿入穴１９は、少なくともセラミック基板１１の対向する２辺のそれぞれの中央に当たる部分にそれぞれ１個を設ける必要がある。また、挿入穴１９の穴底までの距離は、カシメ用ピン１８の先端が最大の締め付けで穴底に到達する長さより長くしておくことで、カシメ用ピン１８によるセラミック基板１１の締め付け固定度合いを弾力的に調整でき、セラミック基板１１の破壊を防止することができる。   In the light emitting element storage package 10, the caulking pins 18 formed on the radiator 16 are inserted into the through holes 17 formed on the ceramic substrate 11, and the ceramic substrate 11 is brought into contact with the upper surface of the radiator 16. Yes. Further, in the light emitting element storage package 10, the caulking pins 18 are bent on the upper surface of the ceramic substrate 11, led out to the outside of the ceramic substrate 11, and the tip portion is press-fitted into the insertion hole 19. It is crimped to the body 16. It is necessary to provide one caulking pin 18 and corresponding insertion hole 19 at least in a portion corresponding to the center of each of two opposing sides of the ceramic substrate 11. The distance to the bottom of the insertion hole 19 is longer than the length at which the tip of the caulking pin 18 reaches the hole bottom with the maximum tightening, so that the ceramic substrate 11 is fastened and fixed by the caulking pin 18. Can be adjusted elastically, and destruction of the ceramic substrate 11 can be prevented.

なお、カシメ用ピン１８が放熱体１６に立設される形態は、特に限定するものではないが、放熱体１６と一体的に形成されたり、放熱体１６に接合されたり、取り付けられて形成されている。また、カシメ用ピン１８の材質は、特に限定するものではないが、放熱体１６と同一、又は異なるものであってもよいが、屈曲や、圧入等で折れるような極端に硬度の高いものや、逆に、カシメの締め付けが効かないような極端に硬度の低いものは好ましくない。更に、カシメ用ピン１８の断面形状や、これが挿入される貫通孔１７、挿入穴１９の形状は、特に限定されるものではなく、丸形、角形等いずれであってもよい。   The form in which the caulking pin 18 is erected on the radiator 16 is not particularly limited, but is formed integrally with the radiator 16, joined to the radiator 16, or attached. ing. The material of the caulking pin 18 is not particularly limited, but may be the same as or different from that of the heat radiating body 16, but it may be extremely hard such as bending or being pressed and pressed. On the other hand, an extremely low hardness that does not work with caulking is not preferable. Furthermore, the cross-sectional shape of the crimping pin 18 and the shapes of the through hole 17 and the insertion hole 19 into which the crimping pin 18 is inserted are not particularly limited, and may be any shape such as a round shape and a square shape.

上記の発光素子収納用パッケージ１０は、発光素子１２をセラミック基板１１の上面にワイヤボンド方式や、フリップチップ方式で搭載し、反射体１４の上面に透明からなる蓋体（図示せず）を接合して封止した後、外部接続端子１５を介して外部と電気的に導通状態としている。そして、発光素子１２が実装された発光素子収納用パッケージ１０は、発光素子１２からの発光を反射体１４で反射させて輝度を向上させると共に、発光に伴って発生する発熱を放熱体１６から外部に速やかに放熱させて発光素子１２の輝度を維持させている。この発光素子収納用パッケージ１０には、外部接続端子１５からの発光素子１２への電気的接続による加熱、電気的切断による冷却の繰り返しが発生するが、セラミック基板１１と、放熱体１６の接合がカシメ接合であるので、接合部にダメージを与えることなく接合信頼性を向上させることができる。   In the light emitting element storage package 10, the light emitting element 12 is mounted on the upper surface of the ceramic substrate 11 by a wire bond method or a flip chip method, and a transparent lid (not shown) is bonded to the upper surface of the reflector 14. After sealing, the external connection terminal 15 is electrically connected to the outside. The light emitting element storage package 10 on which the light emitting element 12 is mounted reflects the light emitted from the light emitting element 12 by the reflector 14 to improve the luminance, and generates heat generated by the light emission from the radiator 16 to the outside. The brightness of the light emitting element 12 is maintained by quickly dissipating heat. In the light emitting element storage package 10, heating due to electrical connection from the external connection terminal 15 to the light emitting element 12 and cooling due to electrical disconnection are repeated, but the bonding between the ceramic substrate 11 and the radiator 16 is performed. Since it is caulking joining, joining reliability can be improved, without damaging a joined part.

上記の発光素子収納用パッケージ１０は、挿入穴１９の放熱体１６の上面から穴底までの空洞がセラミック基板１１の中央部側に向かって傾斜を有しているのがよい。この空洞の傾斜形状は、特に、限定するものではなく、直線状であってもよく、途中で傾斜Ｌ字状や、傾斜Ｊ字状に湾曲等していてもよい。この挿入穴１９の傾斜によって、放熱体１６は、これに設けたカシメ用ピン１８でセラミック基板１１を強固に抱き込むことができ、接合信頼性を向上させることができる。   In the light emitting element storage package 10 described above, it is preferable that the cavity from the upper surface of the radiator 16 of the insertion hole 19 to the bottom of the hole has an inclination toward the center of the ceramic substrate 11. The inclined shape of the cavity is not particularly limited, and may be linear, or may be curved in an inclined L shape or an inclined J shape in the middle. Due to the inclination of the insertion hole 19, the radiator 16 can firmly hold the ceramic substrate 11 with the caulking pin 18 provided on the heat sink 16, thereby improving the bonding reliability.

次いで、図２に示すように、上記の発光素子収納用パッケージ１０の変形例の発光素子収納用パッケージ１０ａは、放熱体１６の上面と、セラミック基板１１の下面との間に、隙間シート２０を密着させて有している。この隙間シート２０は、熱伝導率がセラミック基板１１の熱伝導率に近似するような熱伝導性に優れた弾性体からなるシートであるのがよい。放熱体１６の上面と、セラミック基板１１の下面との間は、セラミック基板１１の下面の僅かなうねりによって放熱体１６の上面との間に僅かな空隙を有することとなるが、この空隙を弾性体である隙間シート２０で塞ぐことができる。従って、この発光素子収納用パッケージ１０ａは、空隙による熱伝導性の低下を防止して発光素子１２からの発熱をセラミック基板１１及び隙間シート２０を介して速やかに放熱体１６に伝熱でき、放熱体１６から大気中に放熱させることができる。また、隙間シート２０は、弾力性を有しているので、カシメ接合時の締め付け力の緩衝となり、セラミック基板１１の破壊を防止させることができる。   Next, as shown in FIG. 2, the light emitting element storage package 10 a of the modified example of the light emitting element storage package 10 includes a gap sheet 20 between the upper surface of the radiator 16 and the lower surface of the ceramic substrate 11. Have close contact. The gap sheet 20 is preferably a sheet made of an elastic body having excellent thermal conductivity such that the thermal conductivity approximates the thermal conductivity of the ceramic substrate 11. Between the upper surface of the radiator 16 and the lower surface of the ceramic substrate 11, there is a slight gap between the upper surface of the radiator 16 due to slight undulations on the lower surface of the ceramic substrate 11. It can be closed with the gap sheet 20 which is a body. Therefore, the light emitting element storage package 10a can prevent heat from being lowered due to the air gap, and can quickly transfer the heat generated from the light emitting element 12 to the radiator 16 via the ceramic substrate 11 and the gap sheet 20. Heat can be dissipated from the body 16 into the atmosphere. Further, since the gap sheet 20 has elasticity, the gap sheet 20 serves as a buffer for the clamping force at the time of caulking and can prevent the ceramic substrate 11 from being broken.

本発明の発光素子収納用パッケージは、電気的オン、オフが繰り返される各種発光装置等のランプや、自動車用ヘッドランプや、街路灯等のランプや、パソコン、テレビ等のバックライト用等のような高い発光効率と、高い信頼性品質を求められるものに用いることができる。   The light-emitting element storage package of the present invention is used for lamps of various light-emitting devices that are repeatedly turned on and off, for headlamps for automobiles, lamps for street lights, etc., and for backlights of personal computers, televisions, etc. It can be used for those requiring high luminous efficiency and high reliability quality.

（Ａ）、（Ｂ）はそれぞれ本発明の一実施の形態に係る発光素子収納用パッケージの平面図、Ａ−Ａ’線縦断面図である。(A), (B) is a top view of the light emitting element storage package which concerns on one embodiment of this invention, respectively, and an A-A 'line longitudinal cross-sectional view. 同発光素子収納用パッケージのセラミック基板と放熱体の間に隙間シートを取り付ける説明図である。It is explanatory drawing which attaches a gap | interval sheet | seat between the ceramic substrate and heat radiator of the light emitting element storage package. （Ａ）、（Ｂ）は従来の発光素子収納用パッケージの平面図、Ｂ−Ｂ’線縦断面図である。(A), (B) is the top view of the conventional package for light emitting element accommodation, and a B-B 'line longitudinal cross-sectional view.

符号の説明Explanation of symbols

１０、１０ａ：発光素子収納用パッケージ、１１：セラミック基板、１２：発光素子、１３：導体配線パターン、１４：反射体、１５：外部接続端子、１６：放熱体、１７：貫通孔、１８：カシメ用ピン、１９：挿入穴、２０：隙間シート   10, 10a: Light emitting element storage package, 11: Ceramic substrate, 12: Light emitting element, 13: Conductor wiring pattern, 14: Reflector, 15: External connection terminal, 16: Heat radiator, 17: Through hole, 18: Caulking Pins, 19: insertion hole, 20: gap sheet

Claims (3)

セラミック基板の上面の中央部に搭載される発光素子を囲繞して該発光素子からの発光を反射させるための反射体と、前記セラミック基板の下面に前記発光素子からの発熱を放熱させるための放熱体を有する発光素子収納用パッケージにおいて、
前記反射体の外側周辺部の前記セラミック基板に該セラミック基板を貫通する複数の貫通孔と、前記放熱体に該放熱体の上面から立設して前記貫通孔に挿入できるカシメ用ピンと、該カシメ用ピンの先端部を前記放熱体の上面から挿入できる挿入穴を有し、前記貫通孔に前記カシメ用ピンを挿入して前記セラミック基板を前記放熱体上に当接すると共に、前記カシメ用ピンを前記セラミック基板の上面で屈曲させて前記セラミック基板の外側に導出し前記先端部を前記挿入穴に圧入して前記セラミック基板を前記放熱体上にカシメ接合して有することを特徴とする発光素子収納用パッケージ。 A reflector for reflecting a light emitted from the light emitting element by surrounding a light emitting element mounted on the center of the upper surface of the ceramic substrate, and a heat dissipation for dissipating heat generated from the light emitting element on the lower surface of the ceramic substrate In a light emitting element storage package having a body,
A plurality of through-holes penetrating the ceramic substrate in the outer peripheral portion of the reflector, a caulking pin standing on an upper surface of the radiator and inserted into the through-hole, and the caulking A front end portion of the pin for insertion from the upper surface of the radiator, and the caulking pin is inserted into the through hole to bring the ceramic substrate into contact with the radiator, and the caulking pin A light emitting device housing comprising: a ceramic substrate bent on an upper surface of the ceramic substrate, led out to the outside of the ceramic substrate, the tip portion is press-fitted into the insertion hole, and the ceramic substrate is crimped and joined to the radiator. For package. 請求項１記載の発光素子収納用パッケージにおいて、前記挿入穴の前記放熱体の上面から穴底までの空洞がセラミック基板の中央部側に向かっての傾斜を有することを特徴とする発光素子収納用パッケージ。   2. The light emitting element storage package according to claim 1, wherein a cavity from the upper surface of the heat dissipating body to the bottom of the insertion hole has an inclination toward the center of the ceramic substrate. package. 請求項１又は２記載の発光素子収納用パッケージにおいて、前記放熱体の上面と、前記セラミック基板の下面の間に、熱伝導性を備えた弾性体からなる隙間シートを密着させて有することを特徴とする発光素子収納用パッケージ。   3. The light emitting element storage package according to claim 1, wherein a gap sheet made of an elastic body having thermal conductivity is adhered between an upper surface of the heat radiating body and a lower surface of the ceramic substrate. The light emitting element storage package.
JP2008138835A 2008-05-28 2008-05-28 Package for housing light emitting element Pending JP2009289841A (en)

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Cited By (4)

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Publication number Priority date Publication date Assignee Title
JP2012124409A (en) * 2010-12-10 2012-06-28 Elite Trading Co Ltd Reflection and heat dissipation structures of led light source
WO2015008555A1 (en) * 2013-07-19 2015-01-22 シャープ株式会社 Light-emitting device
US9054484B2 (en) 2012-04-04 2015-06-09 Mitsubishi Electric Corporation Packaged optical semiconductor device
WO2019012787A1 (en) * 2017-07-12 2019-01-17 日本電気硝子株式会社 Laminated ceramic substrate and laminated ceramic package

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012124409A (en) * 2010-12-10 2012-06-28 Elite Trading Co Ltd Reflection and heat dissipation structures of led light source
US9054484B2 (en) 2012-04-04 2015-06-09 Mitsubishi Electric Corporation Packaged optical semiconductor device
JPWO2013150616A1 (en) * 2012-04-04 2015-12-14 三菱電機株式会社 Semiconductor package
WO2015008555A1 (en) * 2013-07-19 2015-01-22 シャープ株式会社 Light-emitting device
CN105830242A (en) * 2013-07-19 2016-08-03 夏普株式会社 Light-emitting device
JP5985755B2 (en) * 2013-07-19 2016-09-06 シャープ株式会社 Light emitting device
CN105830242B (en) * 2013-07-19 2018-04-17 夏普株式会社 Light-emitting device
US10260727B2 (en) 2013-07-19 2019-04-16 Sharp Kabushiki Kaisha Light-emitting device having ceramic materials for improving performance thereof
WO2019012787A1 (en) * 2017-07-12 2019-01-17 日本電気硝子株式会社 Laminated ceramic substrate and laminated ceramic package

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