JP2010272736A - Light-emitting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light-emitting device which makes soldering of a feeding terminal unnecessary, and increases an input power through disuse of soldering to enhance a light emission intensity of an LED chip and miniaturize a heat dissipating structure. <P>SOLUTION: A DCB substrate is used as a substrate 12 on which an LED chip 13 is mounted. The DCB substrate is made by joining metal materials 22 and 23 to a ceramic base material 21 directly or by soldering. Part of the metal material 22 is projected from the ceramic base material 21 to form a feeding unit 27. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a light emitting device using a semiconductor light emitting element as a light source.

  Conventionally, in a light-emitting device that uses an LED as a semiconductor light-emitting element and lights the LED with a power of 1 W or more, along with the increase in output and miniaturization, the Joule heat of the wiring pattern of the substrate on which the LED is mounted increases. The heat flow density increases with respect to the heat generation, and the heat cannot be completely dissipated.

  For this reason, it is necessary to increase the heat resistance of the substrate and to increase the thickness of the wiring pattern. As a substrate capable of this, there is a DCB (Direct Copper Bonding) substrate in which a metal material such as copper is directly bonded to a ceramic base material. The metal material of the DCB substrate is patterned into a predetermined wiring pattern by etching, and an LED is mounted on the metal material and electrically connected thereto. Further, a terminal is used for power supply to the LED from the outside, and this terminal is soldered to a metal material (see, for example, Patent Document 1).

Japanese Patent Laying-Open No. 2005-79593 (page 5-6, FIG. 2-3)

  In a conventional light emitting device, a DCB substrate is used in response to higher heat resistance of the substrate and a thicker wiring pattern. However, a power supply terminal is connected by soldering to a metal material of the substrate. The melting temperature of the lead-free type is about 230 ° even in the case of the lead-free type, so it is lower than the heat resistance temperature such as the adhesive that bonds the substrate and LED to the substrate. Degradation such as cracks may occur in the solder.

  Therefore, in the light emitting device, when using solder, compared with the case where solder is not used, the input power is suppressed so that the temperature does not increase in consideration of the deterioration of the solder. If the conditions are the same, the power supplied to the LED cannot be increased to increase the brightness, and if the conditions are the same, the heat dissipation structure is large in order to ensure high heat dissipation performance. Problem arises.

  The present invention has been made in view of the above points, and eliminates the need for soldering such as power supply terminals and does not use solder, thereby increasing the input power and increasing the light emission intensity of the semiconductor light emitting element. An object of the present invention is to provide a light-emitting device that can reduce the size of a heat dissipation structure.

  The light emitting device according to claim 1 is a ceramic base material, a metal material joined to the ceramic base material by either direct bonding or brazing, and a power supply formed by protruding a part of the metal material from the ceramic base material. And a semiconductor light emitting element mounted on the substrate and electrically connected to a metal material.

  The substrate is a DCB (Direct Copper Bonding) substrate in which plate-like copper is directly bonded to a ceramic substrate, and DBA (Direct Brazing Aluminum) is bonded to a ceramic substrate by brazing plate-like aluminum as a metal material. There are AMC (Active Metal Brazed Copper) substrates in which plate-like copper is brazed and bonded to a substrate or a ceramic substrate, and any of them may be used.

Any material such as Al ₂ O ₃ , ALN, and SiN may be used for the ceramic substrate.

  The metal material may be formed in a plate shape and bonded to the surface of the ceramic substrate on which the semiconductor light emitting element is mounted, but the surface opposite to the surface is also used for heat dissipation and for preventing warping of the substrate. You may join. In order to make the metal material into a predetermined pattern, a metal material previously punched and formed into a predetermined pattern with a mold or the like is joined to a ceramic substrate, and then supported between the necessary portions of the metal material. An unnecessary portion such as a bridge may be cut off, or a single metal material may be bonded to a ceramic substrate and then formed into a predetermined pattern by etching.

  Even if the power feeding part protrudes outward from the peripheral part of the ceramic base material, a hole or a groove may be provided in a part of the inside of the ceramic base material, and may protrude from the hole or groove part. What is necessary is just to comprise so that it can electrically connect with an external terminal etc., without interfering with a base material.

  Examples of the semiconductor light emitting element include an LED and an organic EL.

  The light-emitting device according to claim 2 is the light-emitting device according to claim 1, wherein the power feeding portion is formed so as to protrude from the ceramic substrate in a range not blocking light emitted by the semiconductor light-emitting element.

  The range that does not block the light emitted by the semiconductor light emitting element is, for example, the range that does not protrude from the surface of the ceramic base material to which the metal material is bonded, or the semiconductor light emission even if it protrudes from the surface of the ceramic base material to which the metal material is bonded. For example, when a reflection frame that reflects light emitted from the semiconductor light emitting element is used, a range that is blocked by the reflection frame is also included.

  The light emitting device according to claim 3 is the light emitting device according to claim 1 or 2, wherein the metal material holds a sealing resin for sealing the semiconductor light emitting element and reflects the light emitted by the semiconductor light emitting element. It also serves as.

  For example, a transparent silicone resin is used as the sealing resin, and a phosphor that is excited by light of the semiconductor light emitting element may be mixed to emit light of a predetermined color.

  The reflective frame is disposed so as to surround the semiconductor light emitting element, for example, so that the coating liquid of the sealing resin does not leak out, and also reflects the light from the semiconductor light emitting element in a desired direction. You may form in a shape.

  The light-emitting device according to claim 4 is the light-emitting device according to any one of claims 1 to 3, wherein the metal material is a first metal layer bonded to the ceramic substrate either directly or brazed. And a second metal layer bonded on the first metal layer, wherein the thickness of the first metal layer is less than the thickness of the second metal layer.

  For the first metal layer, for example, plate-like copper or aluminum is used. The second metal layer is made of, for example, nickel, copper, silver, etc., and is laminated on the first metal layer by a plating process and joined.

  As an example, the thicknesses of the first metal layer and the second metal layer are 0.1 mm for the first metal layer and 0.5 mm for the second metal layer, but are not limited thereto.

  According to the light emitting device of the first aspect, a substrate in which a metal material is directly bonded or brazed to a ceramic base material is used, and a part of the metal material of the substrate protrudes from the ceramic base material to supply power. Since the part is formed, soldering such as terminals for power feeding is not necessary, and by using no solder, if the heat dissipation performance is the same, the input power is increased to increase the light emission intensity of the semiconductor light emitting device. In addition, when the brightness is the same, the heat dissipation structure can be miniaturized. Furthermore, heat can be efficiently radiated from the projecting power supply portion.

  According to the light emitting device of the second aspect, in addition to the effect of the light emitting device of the first aspect, the power feeding portion is formed so as to protrude from the ceramic substrate in a range that does not block the light emitted by the semiconductor light emitting element. The light extraction efficiency for extracting the light to the outside can be improved.

  According to the light emitting device of claim 3, in addition to the effect of the light emitting device of claim 1 or 2, the metal material holds the sealing resin for sealing the semiconductor light emitting element and the semiconductor light emitting element emits. It can also serve as a reflection frame that reflects light, and the configuration can be simplified.

  According to the light emitting device of the fourth aspect, in addition to the effect of the light emitting device according to any one of the first to third aspects, either the thin first metal layer is directly bonded or brazed to the ceramic substrate. Bonding and bonding the second metal layer on the first metal layer improves the manufacturability of the first metal layer and relieves stress on the ceramic substrate when the first metal layer is bonded. This can reduce manufacturing defects.

It is sectional drawing of the light-emitting device which shows the 1st Embodiment of this invention. It is sectional drawing to which some light emitting devices same as the above were expanded. It is the front view which abbreviate | omitted the fluorescent substance part of the light-emitting device same as the above. It is sectional drawing of the light-emitting device which shows the 2nd Embodiment of this invention. It is sectional drawing of the light-emitting device which shows the 3rd Embodiment of this invention. It is sectional drawing of the light-emitting device which shows the 4th Embodiment of this invention. It is sectional drawing of the light-emitting device which shows the 5th Embodiment of this invention. It is sectional drawing of the light-emitting device which shows the 6th Embodiment of this invention. It is sectional drawing of the light-emitting device which shows the 7th Embodiment of this invention. It is sectional drawing of the light-emitting device which shows the 8th Embodiment of this invention. It is sectional drawing of the light-emitting device which shows the 9th Embodiment of this invention. It is sectional drawing of the light-emitting device which shows the 10th Embodiment of this invention. It is sectional drawing of the light-emitting device which shows the 11th Embodiment of this invention. It is sectional drawing of the light-emitting device which shows the 12th Embodiment of this invention. It is sectional drawing of the light-emitting device which shows the 13th Embodiment of this invention. It is sectional drawing of the light-emitting device which shows the 14th Embodiment of this invention. It is sectional drawing to which a part of light-emitting device which shows 15th Embodiment of this invention was expanded.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  1 to 3 show a first embodiment, FIG. 1 is a sectional view of a light emitting device, FIG. 2 is an enlarged sectional view of a part of the light emitting device, and FIG. 3 omits a phosphor portion of the light emitting device. It is a front view.

  In FIG. 1 to FIG. 3, 11 is a light emitting device which is a light emitting module used for an illumination device for general illumination that emits white light, for example, and this light emitting device 11 includes a rectangular substrate 12 in front view and this substrate. LED chips 13 as a plurality of semiconductor light emitting elements mounted in a matrix on 12 and phosphor portions 14 formed on a substrate 12 on which the LED chips 13 are mounted are provided.

The front surface which is one surface of the substrate 12 is a mounting surface 12a on which the LED chip 13 is mounted, and the other surface opposite to the mounting surface 12a is a back surface 12b. The substrate 12 is a DCB (Direct Copper Bonding) substrate. The DCB substrate includes, for example, a ceramic substrate 21 formed in a square plate shape using, for example, Al ₂ O ₃ , ALN, SiN, etc., and both the mounting surface 12a side and the back surface 12b side of the ceramic substrate 21. A metal material 22 as a first metal material and a metal material 23 as a second metal material which are copper plates directly joined by the DCB method are provided.

  In direct bonding by the DCB method, a copper oxide film is formed on one surface of a copper plate, the copper plate is placed on the ceramic substrate 21 with the copper oxide film facing the ceramic substrate 21, and the copper plate and the ceramic substrate are heated. A eutectic melt is formed at the joint interface with 21, and the copper plate and the ceramic substrate 21 are directly joined by this eutectic melt.

  The metal material 22 on the mounting surface 12a side is formed with a pattern portion 26 divided into a plurality of matrix shapes corresponding to the mounting positions of the LED chips 13, and one arrangement direction of these pattern portions 26 ( Feeding portions 27 are formed on both ends along the horizontal direction in FIG. One end of the power feeding portion 27 is directly joined to the ceramic base material 21, and the other end projects linearly from the peripheral portion of the ceramic base material 21 toward the outside parallel to the mounting surface 12a. In FIG. 2, when the LED chip 13 is a plurality of LED series circuits connected in series in one arrangement direction, the power feeding unit 27 that feeds power for each LED series circuit is formed separately. When these LED series circuits are connected in parallel to supply power, the power supply unit 27 may be formed integrally, and when all the LED chips 13 are connected in series, the pattern portions at both ends of the series connection A power feeding unit 27 may be formed adjacent to 26.

  As shown in FIG. 2, the metal material 22 on the mounting surface 12a side has a pattern portion 26 and a power feeding portion 27 as a thick first metal layer 28 which is a metal plate, and a plating layer is formed on the first metal layer 28. A thin second metal layer 29 is laminated and bonded. The second metal layer 29 is formed on the first metal layer 28 with a thickness of about 3 μm, for example, a plating layer 30 such as nickel plating, and on the plating layer 30 with a thickness of about 0.3 μm. For example, a plating layer 31 such as copper plating, silver plating, and gold plating is provided.

  In order to form the metal material 22 on the mounting surface 12a side in a predetermined pattern, a single metal material 22 previously punched into a predetermined pattern with a mold or the like is directly joined to the ceramic substrate 21 and plated. After applying, after cutting unnecessary parts such as a bridge that supported between the necessary parts of the metal material 22, or after directly joining one metal material 22 to the ceramic substrate 21, A predetermined pattern is formed by etching and plating is performed.

  The metal material 23 on the back surface 12b side is directly bonded to the ceramic substrate 21 for heat dissipation and for preventing warping of the substrate 12.

  The LED chip 13 is, for example, a blue LED chip, and is fixed to each pattern portion 26 of the metal material 22 with a die bond material 34 such as a silicone resin or a silver paste. The LED chip 13 is not fixed to the power feeding unit 27.

  The LED chip 13 is a semiconductor in which a blue monochromatic light emitting semiconductor light emitting layer is laminated on an element substrate such as a sapphire substrate fixed by a die bond material 34, and a pair of electrodes are arranged on the semiconductor light emitting layer so as to be separated from each other. Chip. The electrode of each LED chip 13 and the pattern part 26 of the metal material 22 are electrically connected by a bonding wire 35, and are connected in series between the power supply parts 27 at both ends in one arrangement direction of the LED chip 13. Alternatively, all the LED chips 13 may be connected in series.

  The phosphor portion 14 includes a frame portion 38 disposed so as to surround the peripheral portion of the mounting surface 12a of the substrate 12, and a sealing resin 39 filled inside the frame portion 38 and covering the LED chip 13 and the like. I have.

  As the sealing resin 39, for example, a phosphor coating liquid formed of a transparent silicone resin mixed with phosphors (not shown) corresponding to a plurality of colors is used, and this phosphor coating liquid is filled inside the frame portion 38. It is formed after being cured. The phosphor emits light of a predetermined color by being excited by part of the light emitted from the blue LED chip. For example, the phosphor emits yellow light, red light, or green light with respect to the blue light. A yellow phosphor, a red phosphor, or a green phosphor is blended at a preset blending ratio.

  Next, the light-emitting device 11 configured in this manner is incorporated into a lighting device (not shown), and is electrically connected to the socket portion of the lighting device using the power feeding unit 27 protruding from the substrate 12. To electrically connect the power feeding part 27 to the socket part, the tip of the power feeding part 27 is brought into contact with the terminal of the socket part, screwed to the terminal of the socket part, brazed to the terminal of the socket part or You may weld. Further, a heat radiating structure such as a heat sink is joined to the metal member 23 on the back surface 12b side of the substrate 12 connected to the socket portion so that heat conduction is possible.

  By supplying power to the light emitting device 11 from the power supply unit of the lighting device through the power supply unit 27, the LED chip 13 is turned on, and the phosphor of the sealing resin 39 is excited by the light emitted from the LED chip 13, and light of a predetermined color is emitted. For example, white light is emitted from the surface of the sealing resin 39.

  Further, when the LED chip 13 is turned on, the LED chip 13 generates heat and the phosphor excited by the sealing resin 39 generates heat. The heat generated from these is thermally conducted to the substrate 12, is conducted to the heat dissipation structure such as a heat sink joined to the substrate 12, and is dissipated, so that the power feeding unit 27 also contacts the power feeding unit 27 protruding from the board 12. Heat is dissipated in the terminal and air.

  In the light emitting device 11, a substrate 12 in which metal materials 22 and 23 are directly bonded to a ceramic base material 21 is used, and a part of the metal material 22 on the mounting surface 12a side of the substrate 12 protrudes from the ceramic base material 21 to supply power. Since the portion 27 is formed, it is not necessary to solder a terminal for power supply. By not using solder, if the heat dissipation performance is the same, it is possible to increase the input power and increase the light emission intensity of the LED chip 13, and if the brightness is the same, It is possible to reduce the size of the heat dissipation structure.

  Further, since heat can be efficiently radiated from the power feeding portion 27 protruding from the substrate 12, the input power can be further increased, and the heat dissipation structure such as a heat sink can be further miniaturized. In particular, since the LED chip 13 is not mounted on the power feeding unit 27, the temperature of the power feeding unit 27 is low, and the heat of the substrate 12 can be efficiently conducted and dissipated.

  In addition, the power feeding unit 27 protrudes linearly from the peripheral part of the ceramic base material 21 to the outside parallel to the mounting surface 12a, that is, within a range where the light emitted from the LED chip 13 is not blocked. Since the power feeding portion 27 is formed so as to protrude from the material 21, the light extraction efficiency for extracting light to the outside can be improved. Note that the range in which the light emitted from the LED chip 13 is not blocked is a range in which the power feeding portion 27 does not protrude from the mounting surface 12a of the substrate 12, or no light is emitted from the LED chip 13 even if protruding from the mounting surface 12a of the substrate 12. If the frame portion 38 of the phosphor portion 14 is used on the mounting surface 12a of the substrate 12, or if a reflection frame that reflects light emitted from the LED chip 13 is used, these frames are used. The range obstructed by is also included.

  Next, FIG. 4 shows a second embodiment, and FIG. 4 is a cross-sectional view of the light emitting device.

  The front end side of the power feeding portion 27 protruding from the substrate 12 is bent so as to protrude toward the mounting surface 12a side of the substrate 12.

  With this configuration, when the light emitting device 11 is mounted on the socket portion of the lighting device from the back surface 12b side of the substrate 12, the power feeding portion 27 can be connected to the socket portion terminal with one-touch connection, and the power feeding portion 27 is elastically connected to the terminal of the socket portion. It is possible to hold the electrical connection securely.

  Next, FIG. 5 shows a third embodiment, and FIG. 5 is a cross-sectional view of the light emitting device.

  The front end side of the power feeding portion 27 protruding from the substrate 12 is bent in an inclined manner toward the back surface 12b side of the substrate 12, and an elastic body 42 such as rubber is provided between the inside of the power feeding portion 27 and the peripheral portion of the substrate 12. Is arranged.

  With this configuration, the power supply unit 27 can be pressed against the terminal of the socket unit by the elastic body 42, and the electrical connection can be reliably maintained.

  Next, FIG. 6 shows a fourth embodiment, and FIG. 6 is a cross-sectional view of the light emitting device.

  The front end side of the power feeding portion 27 protruding from the substrate 12 is bent in a substantially U-shaped cross section on the back surface 12 b side of the substrate 12.

  The socket part 46 of the lighting device 45 is provided with a terminal 47 to which each power feeding part 27 is electrically connected when the light emitting device 11 is mounted on the socket part 46. The terminal 47 is configured by a leaf spring and is in pressure contact with the outer peripheral surface of the power feeding portion 27 of the substrate 12 attached to the socket portion 46.

  With this configuration, the light emitting device 11 can be easily attached to and detached from the socket portion 46 of the lighting device 45, and in the mounted state, the terminal 47 is pressed against the power feeding portion 27, and the electrical connection can be reliably maintained.

  Further, the socket portion 46 is provided with a heat dissipation structure 48 such as a heat sink that is bonded to the metal member 23 on the back surface 12b side of the substrate 12 so as to be thermally conductive and radiates heat.

  Next, FIG. 7 shows a fifth embodiment, and FIG. 7 is a cross-sectional view of the light emitting device.

  The metal material 23 on the back surface 12b side of the substrate 12 is formed in such a size that the peripheral portion of the metal material 23 protrudes from the peripheral portion of the ceramic base material 21, and the protruding portion of the metal material 23 is fixed to the lighting device. A plurality of fixing holes 51 are formed. And it can fix to a illuminating device through fixing tools, such as a volt | bolt and a rivet, to the fixing hole 51 of the protrusion part of this metal material 23. FIG.

  With this configuration, there is no need to provide a separate fixing structure, and the protruding portion of the metal material 23 directly bonded to the ceramic base material 21 of the substrate 12 can be used for fixing, and the ceramic base material 21 with low mechanical strength can be used. Can be fixed without load.

  Further, heat can be efficiently radiated from the protruding portion of the metal material 23, and the heat dissipation can be improved. In order to improve heat dissipation from the protruding portion of the metal material 23, a fin structure may be used for the protruding portion of the metal material 23.

  In addition, the tip of the power feeding portion 27 is bent into a substantially L-shaped cross section so that the gap with the protruding portion of the metal material 23 is widened, and a connection space for the power feeding portion 27 and a fixing space for the protruding portion of the metal material 23 are secured. Has been.

  Next, FIG. 8 shows a sixth embodiment, and FIG. 8 is a cross-sectional view of the light emitting device.

  A reflective frame 53 is formed on the metal material 22 on the mounting surface 12a side of the substrate 12 so as to surround the LED chip 13 mounted on the substrate 12, instead of the pattern portion 26 on which the LED chip 13 is mounted. A part of the wiring pattern 53a is formed inside the reflection frame 53.

  The LED chip 13 is mounted on the mounting surface 12a of the ceramic substrate 21 inside the reflection frame 53, and the LED chip 13 is electrically connected to the reflection frame 53 and the power feeding unit 27 by the bonding wire 35. Is filled with a sealing resin 39 covering the LED chip 13. The inner peripheral surface of the reflection frame 53 is configured as a reflection surface that reflects light emitted from the LED chip 13. The reflecting surface may be an inclined surface that reflects light emitted from the LED chip 13 in a predetermined light distribution direction.

  With this configuration, the metal material 22 can also serve as a reflective frame 53 that reflects the light emitted by the LED chip 13, along with the function of the frame portion 38 that holds the coating liquid of the sealing resin 39 so as not to leak out, The configuration can be simplified.

  Next, FIG. 9 shows a seventh embodiment, and FIG. 9 is a cross-sectional view of the light emitting device. The phosphor part 14 and the like are not shown.

  In each of the above embodiments, the power feeding unit 27 protrudes from the ceramic base material 21 in the outer region of the substrate 12, but in this embodiment, the power feeding unit from the ceramic base material 21 in the inner region of the substrate 12. 27 has a protruding configuration.

  A plurality of holes 56 are formed in a part of the inside of the ceramic base 21 of the substrate 12, and the metal material 22 on the mounting surface 12 a side of the substrate 12 is also formed on the holes 56, and protrudes over the holes 56. A power feeding portion 27 that protrudes from the ceramic base material 21 is formed in the portion of the metal material 22 to be performed. The power feeding portion 27 is formed with an insertion hole 57 having the same central axis as the hole portion 56 and having a smaller diameter than the hole portion 56. The metal material 23 on the back surface 12 b side of the substrate 12 is opened corresponding to the hole 56 of the ceramic base material 21.

  Then, the substrate 12 has the metal material 23 on the back surface 12b side disposed in a heat dissipation structure 48 such as a heat sink, and the screw 60 is screwed into a nut 61 provided in the heat dissipation structure 48 through the insertion hole 57 of the power feeding unit 27 and fixed. To do. The nut 61 is provided in an insulated state with respect to the heat dissipation structure 48, is electrically connected to the power supply unit of the lighting device, and can supply power to the power supply unit 27 through the screw 60.

  Thus, even in the configuration in which the power feeding portion 27 protrudes from the ceramic base material 21 in the inner region of the substrate 12, the power feeding is the same as the configuration in which the power feeding portion 27 projects from the ceramic base material 21 in the outer region of the substrate 12. By eliminating the need for soldering such as terminals and using no solder, it is possible to increase the input power to increase the light emission intensity of the LED chip 13 and to reduce the heat dissipation structure 48 such as a heat sink. . Furthermore, there is no need to provide a separate fixing structure, and it is possible to fix using the power feeding portion 27 of the metal material 22 directly bonded to the ceramic base material 21 of the substrate 12, and the ceramic base material has low mechanical strength. 21 can be fixed without being loaded, and electrical connection with the power feeding section 27 can be achieved.

  Next, FIG. 10 shows an eighth embodiment, and FIG. 10 is a cross-sectional view of the light emitting device.

  As the substrate 12, the substrate 12 of the seventh embodiment shown in FIG. 9 is used.

  A rivet 64 is electrically connected and fixed through the insertion hole 57 of the power feeding section 27, and a power feeding line 65 is connected to the rivet 64.

  With this configuration, it is possible to achieve electrical connection with the power feeding unit 27 without applying a load to the ceramic base material 21 with low mechanical strength.

  Next, FIG. 11 shows a ninth embodiment, and FIG. 11 is a cross-sectional view of the light emitting device.

  As the substrate 12, the substrate 12 of the seventh embodiment shown in FIG. 9 is used.

  A shaft member 68 made of, for example, resin is disposed through the insertion hole 57 of the power feeding unit 27, and a metal ring 70 to which the power feeding wire 69 is connected, and a spring 71 that presses the metal ring 70 against the metal material 22 are connected to the shaft member 68. Is fitted.

  With this configuration, it is possible to achieve electrical connection with the power feeding unit 27 without applying a load to the ceramic base material 21 with low mechanical strength.

  Next, FIG. 12 shows a tenth embodiment, and FIG. 12 is a cross-sectional view of the light emitting device.

  As the substrate 12, the substrate 12 of the seventh embodiment shown in FIG. 9 is used.

  A pin-shaped terminal 74 is passed through the insertion hole 57 of the power feeding unit 27 and brazed to the power feeding unit 27 with a brazing material 75. The protruding dimension of the terminal 74 from the mounting surface 12a of the substrate 12 is preferably 5 mm or less so as not to block the light emitted from the LED chip 13.

  With this configuration, electrical connection can be achieved on the back surface 12b side of the substrate 12.

  The terminal 74 may be brazed to the power feeding unit 27 in the hole 56 without inserting the terminal 74 into the power feeding unit 27.

  Next, FIG. 13 shows an eleventh embodiment, and FIG. 13 is a cross-sectional view of the light emitting device.

  The substrate 12 is the same as the substrate 12 of the seventh embodiment shown in FIG. 9, but the hole 56 is not formed in the power feeding unit 27.

  By placing a metal spring 78 inside the hole 56 of the board 12 and placing the board 12 on the heat dissipation structure 48, the spring 78 is compressed and crimped between the power feeding part 27 and the heat dissipation structure 48. .

  With this configuration, electrical connection can be achieved on the back surface 12b side of the substrate 12.

  Next, FIG. 14 shows a twelfth embodiment, and FIG. 14 is a cross-sectional view of the light emitting device.

  The substrate 12 is the same as the substrate 12 of the seventh embodiment shown in FIG. 9, but the power feeding portion 27 and the hole portion 56 are formed in one central portion of the substrate 12.

  A socket part 81 is fixed to the surface of the heat dissipation structure 48 on which the substrate 12 is disposed. The socket part 81 has a cup-shaped insulating part 82 disposed on the surface of the heat dissipation structure 48 and a connector part 83 disposed in the insulating part 82.

  Then, the socket portion 81 is accommodated in the hole portion 56 of the substrate 12, the back surface 12b side of the substrate 12 is disposed in the heat dissipation structure 48, and the screw 84 is inserted through the insertion hole 57 of the power feeding portion 27 into the connector portion of the socket portion 81. Screw to 83. As a result, the substrate 12 is fixed to the heat dissipation structure 48 via the socket part 81, and the power feeding part 27 contacts the connector part 83 and is electrically connected, or is electrically connected via the screw 84. The

  With this configuration, there is no need to provide a separate fixing structure, and it is possible to fix using the power feeding portion 27 of the metal material 22 directly bonded to the ceramic base material 21 of the substrate 12, and ceramics with low mechanical strength. While being able to fix to the base material 21 without applying a load, electrical connection with the electric power feeding part 27 can be aimed at. Furthermore, since power can be supplied from the central portion of the substrate 12, when the plurality of light emitting devices 11 are arranged adjacent to each other to form a large light emitting surface, the adjacent substrates 12 can be arranged without gaps.

  Next, FIG. 15 shows a thirteenth embodiment, and FIG. 15 is a cross-sectional view of the light emitting device.

  The substrate 12 is the same as the substrate 12 shown in FIG. 14 in the twelfth embodiment, but the power feeding portion 27 is bent so as to protrude toward the mounting surface 12a of the substrate 12.

  The socket part 81 fixed to the surface of the heat dissipation structure 48 has a connector part 83 protruding from a cup-shaped insulating part 82.

  The socket portion 81 is accommodated in the hole portion 56 of the substrate 12, and the connector portion 83 of the socket portion 81 is fitted into the hole portion 56 of the power feeding portion 27 so that the back surface 12b side of the substrate 12 is dissipated. The screw 84 is screwed onto the side surface of the connector portion 83 of the socket portion 81 through the power feeding portion 27. As a result, the substrate 12 is fixed to the heat dissipation structure 48 via the socket part 81, and the power feeding part 27 contacts the connector part 83 and is electrically connected, or is electrically connected via the screw 84. ing.

  With this configuration, the same effect as that of the twelfth embodiment can be obtained.

  Next, FIG. 16 shows a fourteenth embodiment, and FIG. 16 is a cross-sectional view of the light emitting device.

  The substrate 12 and the socket part 81 are the same as the substrate 12 shown in FIG. 15 in the thirteenth embodiment.

  Then, the socket portion 81 is accommodated in the hole portion 56 of the substrate 12, and the connector portion 83 of the socket portion 81 is passed through the hole portion 56 of the power feeding portion 27 so that the back surface 12b side of the substrate 12 is disposed on the heat dissipation structure 48. The tip of the connector part 83 protruding from the power feeding part 27 is caulked to the power feeding part 27. As a result, the substrate 12 is fixed to the heat dissipation structure 48 via the socket portion 81, and the power feeding portion 27 is in contact with and electrically connected to the connector portion 83.

  With this configuration, the same effect as that of the twelfth embodiment can be obtained.

  Next, FIG. 17 shows a fifteenth embodiment, and FIG. 17 is an enlarged sectional view of a part of the light emitting device.

  In the first embodiment, the metal material 22 includes a thick first metal layer 28 that is a metal plate and a thin second metal layer 29 that is a plating layer on the first metal layer 28. In the present embodiment, the first metal layer 28 is a thin metal plate having a thickness of 0.1 mm or less, and the second metal layer 29 is a thickness having a thickness of 0.5 mm or less. A desired thickness of 0.6 mm or less is formed by using a plated layer.

  Thereby, the manufacturability of the first metal layer 28 which is a thin metal plate can be improved, and the stress acting on the ceramic substrate 21 when the first metal layer 28 is joined by direct joining or brazing is reduced. It is possible to alleviate the manufacturing problems such as cracking of the ceramic substrate 21.

  In each of the above embodiments, the substrate 12 is a DCB substrate in which plate-like copper is directly joined to the ceramic base material 21 as the metal base material 22, 23. DBA (Direct Brazing Aluminum) substrate joined by brazing plate-like aluminum as 22 and 23, or AMC (Active Metal) joined by brazing plate-like copper as metal materials 22 and 23 to the ceramic base material 21 Brazed Copper) substrate or the like may be used, and the same effect is obtained. For brazing, a brazing material containing Ti or the like in an active metal is used.

  In the case of a DBA substrate, aluminum having a high reflectance is used, so that a desired reflectance can be obtained without plating. In addition, since a mirror surface treatment etc. can be easily given with respect to the surface of aluminum, the improvement of the further reflectance can be aimed at by performing this mirror surface treatment.

11 Light emitting device
12 Board
13 LED chips as semiconductor light emitting devices
21 Ceramic substrate
22 Metal material
27 Feeder
28 First metal layer
29 Second metal layer
53 Reflection frame

Claims (4)

A ceramic substrate, a metal material directly bonded to the ceramic substrate, or a substrate having a power feeding portion formed by protruding a part of the metal material from the ceramic substrate;
A semiconductor light emitting device mounted on a substrate and electrically connected to a metal material;
A light-emitting device comprising: The light-emitting device according to claim 1, wherein the power feeding unit is formed so as to protrude from the ceramic base material in a range that does not block light emitted by the semiconductor light-emitting element. The light emitting device according to claim 1, wherein the metal material also serves as a reflection frame that holds the sealing resin for sealing the semiconductor light emitting element and reflects light emitted from the semiconductor light emitting element. The metal material has a first metal layer bonded to the ceramic substrate either directly or brazed, and a second metal layer bonded to the first metal layer, The thickness of a metal layer has a relationship thinner than the thickness of a 2nd metal layer. The light-emitting device as described in any one of Claim 1 thru | or 3 characterized by the above-mentioned.

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