JP2010034262A - Package for housing light-emitting element - Google Patents

Package for housing light-emitting element Download PDF

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JP2010034262A
JP2010034262A JP2008194515A JP2008194515A JP2010034262A JP 2010034262 A JP2010034262 A JP 2010034262A JP 2008194515 A JP2008194515 A JP 2008194515A JP 2008194515 A JP2008194515 A JP 2008194515A JP 2010034262 A JP2010034262 A JP 2010034262A
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emitting element
light emitting
insulating base
hole
light
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Norikazu Fukunaga
憲和 福永
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Sumitomo Metal SMI Electronics Device Inc
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Sumitomo Metal SMI Electronics Device Inc
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Priority to JP2008194515A priority Critical patent/JP2010034262A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H01L2924/15192—Resurf arrangement of the internal vias

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Abstract

<P>PROBLEM TO BE SOLVED: To provide a package for housing a light-emitting element, capable of improving the reliability between the contact portions of an insulation substrate and a heat sink body, and efficiently radiating heat generated from the light-emitting element. <P>SOLUTION: The package 10 for housing a light-emitting element has an insulation substrate 11, a reflector 12 and a heat sink body 13. The package 10 includes a through-hole 15 provided on the center portion of an insulation substrate 11 on the bottom surface of a cavity portion 16 formed of the upper surface of the insulation substrate 11 and an inclined inner circumferential wall surface of the reflector 12 and used to house a light-emitting element 14, a metallic screw body 20 provided upright to the lower surface of the insulation substrate 11 by being engaged and bonded to the wall surface, allowing the tip side end surface of one side to be the same plane or protruding parallel surface to the upper surface of the insulation substrate 11 and providing male screw 21 on the other tip side from the lower surface of the insulation substrate 11, and a heat sink body 13 screwed with the male screw 21 via the female screw hole 23 and radiate heat from the light-emitting element 14 placed on the end surface of the screw body 20. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

本発明は、ＬＥＤ（Ｌｉｇｈｔ Ｅｍｉｔｔｉｎｇ Ｄｉｏｄｅ）等の発光素子を収納するための発光素子収納用パッケージに関し、より詳細には、発光素子からの発熱を効率的に放熱させるための発光素子収納用パッケージに関する。   The present invention relates to a light emitting element storage package for storing a light emitting element such as an LED (Light Emitting Diode), and more particularly to a light emitting element storage package for efficiently dissipating heat generated from a light emitting element. .

発光素子は、従来から照度を向上させるための手段の一つとして入力電流を上げることで対応されている。しかしながら、発光素子は、入力電流を上げることで照度はあがるものの、高温となり大量の熱を発生させることとなっている。この発熱と共に、発光素子は、逆に照度の低下が発生するという問題を抱えている。   Conventionally, a light emitting element is supported by increasing an input current as one of means for improving illuminance. However, although the illuminance of the light emitting element is increased by increasing the input current, the light emitting element is heated to generate a large amount of heat. Along with this heat generation, the light emitting element has a problem that the illuminance is decreased.

図３（Ａ）、（Ｂ）を参照しながら、従来の発光素子収納用パッケージを説明する。ここで、図３（Ａ）、（Ｂ）はそれぞれ従来の発光素子収納用パッケージの平面図、Ｃ−Ｃ’線縦断面図である。
図３（Ａ）、（Ｂ）に示すように、従来の発光素子収納用パッケージ５０は、発光素子５１を載置するための基体にセラミックや、樹脂等からなる平板状の絶縁基体５２が用いられてきた。この絶縁基体５２に載置される発光素子５１は、輝度を向上させるために電圧を上昇させることで対応させる方法がある。しかしながら、発光素子５１は、電圧の上昇で発熱も上昇し、温度上昇によって逆に輝度の低下が発生するという問題がある。そこで、絶縁基体５２には、絶縁基体５２からの放熱を向上させることが重要な課題となっている。この発光素子５１の輝度を向上させるために特段の放熱性を要求される場合の基体には、樹脂に比較して熱伝導率が高く放熱性に優れるアルミナ（Ａｌ２Ｏ３）や、窒化アルミニウム（ＡｌＮ）等からなるセラミックを用いることが好ましい。 With reference to FIGS. 3A and 3B, a conventional light emitting element storage package will be described. Here, FIGS. 3A and 3B are a plan view and a CC ′ line longitudinal sectional view of a conventional light emitting element storage package, respectively.
As shown in FIGS. 3A and 3B, a conventional light emitting element storage package 50 uses a flat insulating base 52 made of ceramic, resin, or the like as a base on which the light emitting element 51 is placed. Has been. There is a method in which the light emitting element 51 placed on the insulating base 52 is made to respond by increasing the voltage in order to improve the luminance. However, the light emitting element 51 has a problem in that heat generation increases as the voltage increases, and luminance decreases conversely as the temperature increases. Therefore, improving the heat dissipation from the insulating base 52 is an important issue for the insulating base 52. As a substrate for which special heat dissipation is required in order to improve the luminance of the light emitting element 51, alumina (Al 2 O 3 ), which has a higher thermal conductivity than a resin, and excellent heat dissipation, aluminum nitride It is preferable to use a ceramic made of (AlN) or the like.

また、発光素子収納用パッケージ５０は、発光素子５１からの発光を前方となる上方側に反射させて集中させることで輝度を向上させるために、絶縁基体５２の上面に上方側の開口径を下方側の開口径より大きくする傾斜内周壁面とする筒状の反射体５３を有している。この反射体５３は、特に、材料を限定するものではなく、金属製や、セラミック製等からなり、通常、絶縁基体５２に接合されて設けられている。
更に、発光素子収納用パッケージ５０は、発光素子５１からの発熱を絶縁基体５２を介して下方側に速やかに放熱させるために、絶縁基体５２の下面に熱伝導率の高い金属、例えば、アルミニウム等からなるヒートシンク体５４を有している。このヒートシンク体５４は、絶縁基体５２の下面に形成する高融点金属からなる導体パターン５５との間を半田５６で接合させて設けている。 Further, the light emitting element storage package 50 reflects the light emitted from the light emitting element 51 to the upper side which is the front side and concentrates it, so that the upper opening diameter is lowered on the upper surface of the insulating base 52. It has a cylindrical reflector 53 as an inclined inner peripheral wall surface that is larger than the opening diameter on the side. The reflector 53 is not particularly limited in material, and is made of metal, ceramic, or the like, and is usually provided bonded to the insulating base 52.
Further, the light-emitting element storage package 50 has a metal having a high thermal conductivity, such as aluminum, on the lower surface of the insulating base 52 in order to quickly dissipate the heat generated from the light-emitting element 51 downward through the insulating base 52. The heat sink body 54 is made of. This heat sink body 54 is provided by joining with a solder 56 between a conductive pattern 55 made of a refractory metal formed on the lower surface of the insulating base 52.

なお、上記の絶縁基体５２は、例えば、アルミナのセラミックを用いる場合には、先ず、アルミナからなる複数枚のセラミックグリーンシートを作製している。そして、それぞれのセラミックグリーンシートには、タングステン（Ｗ）や、モリブデン（Ｍｏ）等の高融点金属からなる導体ペーストを用いてスクリーン印刷して導体印刷パターンを形成している。更に、それぞれのセラミックグリーンシートは、重ね合わせて積層した後、セラミックと、高融点金属を高温で同時焼成して導体パターン５５や、導体配線パターン５７等を設けた絶縁基体５２を形成している。この絶縁基体５２を用いた発光素子収納用パッケージ５０は、絶縁基体５２の上面と反射体５３の傾斜内周壁面で形成されるキャビティ部５８に搭載される発光素子５１と、ボンディングワイヤ５９や導体配線パターン５７等を介して電気的に導通状態とする外部接続端子６０を有している。この外部接続端子６０は、絶縁基体５２の上面、下面、又は端面に延設する導体配線パターン５７にろう付け接合されて設けられている。   For example, in the case where alumina ceramic is used as the insulating base 52, first, a plurality of ceramic green sheets made of alumina are produced. Each ceramic green sheet is screen-printed with a conductive paste made of a refractory metal such as tungsten (W) or molybdenum (Mo) to form a conductor print pattern. Further, each ceramic green sheet is laminated and laminated, and then the ceramic and the refractory metal are simultaneously fired at a high temperature to form the insulating base 52 provided with the conductor pattern 55, the conductor wiring pattern 57, and the like. . The light emitting element storage package 50 using the insulating base 52 includes a light emitting element 51 mounted on a cavity 58 formed by the upper surface of the insulating base 52 and the inclined inner peripheral wall surface of the reflector 53, a bonding wire 59 and a conductor. An external connection terminal 60 is provided for electrical connection via the wiring pattern 57 and the like. The external connection terminal 60 is provided by brazing and bonding to a conductor wiring pattern 57 extending on the upper surface, the lower surface, or the end surface of the insulating base 52.

しかしながら、この発光素子収納用パッケージ５０は、絶縁基体５２の下面に熱膨張係数の異なるヒートシンク体５４を半田５６で接合しているので、発光素子５１の発光時の温度上昇と、停止時の温度降下の繰り返し等で曲げ応力が接合部である半田５６に集中し、半田５６にクラックが発生するという問題が生じている。また、この発光素子収納用パッケージ５０は、絶縁基体５２にセラミックを用い、この下面にヒートシンク体５４を半田５６で接合させたとしても、発光素子５１の載置部がセラミックで熱伝導率に限界があり、発光素子５１からの発熱をヒートシンク体５４へ伝熱させヒートシンク体５４からの放熱が限界となっている。   However, in the light emitting element storage package 50, the heat sink body 54 having a different thermal expansion coefficient is joined to the lower surface of the insulating base 52 with the solder 56. Therefore, the temperature rise at the time of light emission of the light emitting element 51 and the temperature at the time of stop. There is a problem that bending stress concentrates on the solder 56 which is a joint due to repeated descent and the like, causing cracks in the solder 56. Further, in this light emitting element storage package 50, even if ceramic is used for the insulating base 52 and the heat sink body 54 is joined to the lower surface with solder 56, the mounting portion of the light emitting element 51 is ceramic and the thermal conductivity is limited. The heat generated from the light emitting element 51 is transferred to the heat sink body 54, and the heat dissipation from the heat sink body 54 is limited.

発光素子収納用パッケージに用いることが可能な、従来のセラミックパッケージには、絶縁基体にボルト型の取付けねじの頭部をろう付け接合して、この取付けねじでヒートシンク体に相当する放熱フィンに設けた凹部にボルト型の頭部を嵌め込むようにしてヒートシンク体を締め付けて取り付け固定するものが提案されている（例えば、特許文献１参照）。このセラミックパッケージのような発光素子収納用パッケージは、絶縁基体とヒートシンク体との当接部に半田を用いることなく当接させることができ、発光素子の発光時の温度上昇と、停止時の温度降下の繰り返し等が発生したとしても、曲げ応力が集中して働く箇所が存在しないので、半田クラックの発生を防止して当接部の信頼性を向上させることができるように作用する。
また、従来の発光素子収納用パッケージには、上側主面の中央部に発光素子が搭載される搭載部を有する金属からなる基体と、基体の上側主面の外周部に搭載部を囲むように取着された、外形寸法が基体よりも大きい枠状の絶縁体からなると共に、搭載部の近傍から外側にかけて導出する配線導体が形成された第１枠体と、第１枠体の上面に搭載部を囲むように取着された、内周面が上方に向かって広がる傾斜面とされた金属からなる第２枠体とを具備しているものが提案されている（例えば、特許文献２参照）。この発光素子収納用パッケージは、発光素子からの発熱を金属からなる基体から速やかに下方に放熱させることができ、発光素子の輝度の低下を防止できるように作用する。 In a conventional ceramic package that can be used for a light emitting element storage package, the head of a bolt-type mounting screw is brazed to an insulating substrate, and this mounting screw is provided on a heat radiation fin corresponding to a heat sink body. There has been proposed a structure in which a heat sink body is fastened and fixed so that a bolt-shaped head is fitted in the recessed portion (see, for example, Patent Document 1). The light emitting element storage package such as the ceramic package can be brought into contact with the contact portion between the insulating substrate and the heat sink body without using solder, and the temperature rise at the time of light emission of the light emitting element and the temperature at the time of stop. Even if the descending is repeated, there is no portion where the bending stress is concentrated, so that the solder cracks can be prevented and the contact portion can be improved in reliability.
In addition, the conventional light emitting element storage package includes a base made of metal having a mounting portion on which the light emitting element is mounted at the center of the upper main surface, and an outer peripheral portion of the upper main surface of the base so as to surround the mounting portion. Mounted on the upper surface of the first frame body, which is made of an attached frame-like insulator having an outer dimension larger than that of the base body and formed with a wiring conductor leading out from the vicinity of the mounting portion to the outside. There has been proposed one including a second frame made of metal, which is attached so as to surround the portion and has an inclined surface whose inner peripheral surface expands upward (see, for example, Patent Document 2). ). This light emitting element storage package can quickly dissipate the heat generated from the light emitting element downward from the metal base, and acts to prevent a decrease in luminance of the light emitting element.

特開平６−２１２８８号公報Japanese Patent Laid-Open No. 6-21288 特開２００４−２２８２４０号公報JP 2004-228240 A

しかしながら、前述したような従来の発光素子収納用パッケージは、次のような問題がある。
（１）特開平６−２１２８８号公報で開示されるようなセラミックパッケージを用いることができる発光素子収納用パッケージは、ヒートシンク体に設ける凹部の壁面と、ボルト型の取付けねじの頭部の壁面との間に隙間ができるので、発光素子からの発熱を絶縁基体を介して放熱させるのに、ヒートシンク体や、取付けねじへの伝熱効率が低下し、放熱効果の低下となっている。また、この発光素子収納用パッケージは、絶縁基体の下面にヒートシンク体を設けたとしても、発光素子の載置部が絶縁基体であり、例え、この絶縁基体に比較的熱伝導率の高いセラミックを用いたとしても熱伝導率に限界があり、発光素子からの発熱をヒートシンク体へ伝熱させる妨げとなって効率的な放熱ができなくなっている。
（２）特開２００４−２２８２４０号公報で開示されるような発光素子収納用パッケージは、発光素子の載置部が金属からなる基体であり、発光素子からの発熱をこの基体を介して放熱させることができるものの、この金属からなる基体の外形寸法が絶縁体からなる第１枠体の大きさより小さいので、発光素子からの放熱効果が制限されるものとなっている。
本発明は、かかる事情に鑑みてなされたものであって、絶縁基体と、ヒートシンク体の当接部の信頼性を向上させることができると共に、発光素子からの発熱を効率的に放熱させることができる発光素子収納用パッケージを提供することを目的とする。 However, the conventional light emitting element storage package as described above has the following problems.
(1) A light emitting element storage package that can use a ceramic package as disclosed in JP-A-6-21288 includes a wall surface of a recess provided in a heat sink body, and a wall surface of a head of a bolt-type mounting screw. Therefore, in order to dissipate the heat generated from the light emitting element through the insulating base, the heat transfer efficiency to the heat sink body and the mounting screw is reduced, and the heat dissipation effect is reduced. Further, in this light emitting element storage package, even if a heat sink body is provided on the lower surface of the insulating base, the mounting portion of the light emitting element is an insulating base. For example, a ceramic having a relatively high thermal conductivity is provided on the insulating base. Even if it is used, there is a limit to the thermal conductivity, which prevents the heat generated from the light emitting element from being transferred to the heat sink body, making it impossible to efficiently radiate heat.
(2) A light emitting element storage package as disclosed in Japanese Patent Application Laid-Open No. 2004-228240 is a base body in which a light emitting element mounting portion is made of metal, and heat generated from the light emitting element is radiated through the base body. However, since the external dimension of the base made of metal is smaller than the size of the first frame made of an insulator, the heat dissipation effect from the light emitting element is limited.
The present invention has been made in view of such circumstances, and can improve the reliability of the contact portion between the insulating base and the heat sink body, and can efficiently dissipate heat generated from the light emitting element. An object of the present invention is to provide a package for accommodating a light emitting element.

前記目的に沿う本発明に係る発光素子収納用パッケージは、平板状の絶縁基体と、絶縁基体の上面に上方側の開口径を下方側より大きくする傾斜内周壁面を備える筒状の反射体と、絶縁基体の下面にヒートシンク体を有する発光素子収納用パッケージにおいて、絶縁基体の上面と反射体の傾斜内周壁面で形成される発光素子を収納するためのキャビティ部底面の絶縁基体の中央部に貫通孔と、貫通孔の壁面に嵌合して接合させ一方の先端側の端面を絶縁基体の上面に対して同一面、又は突出する平行面にし絶縁基体の下面から他方の先端側に雄ネジを設けて絶縁基体の下面に対して垂直に立設する金属製のネジ体と、ネジ体の雄ネジに雌ネジ穴を介してネジ締めされネジ体の端面に載置される発光素子からの発熱を放熱させるためのヒートシンク体を有する。   The light-emitting element storage package according to the present invention that meets the above-described object includes a flat insulating base, and a cylindrical reflector that includes an upper surface of the insulating base and an inclined inner peripheral wall surface that has a larger opening diameter on the upper side than the lower side. In the light emitting element storage package having the heat sink body on the lower surface of the insulating substrate, the central portion of the insulating substrate on the bottom surface of the cavity for storing the light emitting element formed by the upper surface of the insulating substrate and the inclined inner peripheral wall surface of the reflector The through hole and the wall surface of the through hole are fitted and joined, and the end surface on one end side is the same surface as the upper surface of the insulating base, or a parallel projecting surface. From a light-emitting element mounted on the end surface of the screw body by being screwed through a female screw hole to the male screw of the screw body. Heat sheath to dissipate heat With a click body.

ここで、上記の発光素子収納用パッケージは、貫通孔の外径寸法、及び雄ネジの外径寸法が発光素子の大きさより大きいのがよい。   Here, in the light emitting element storage package, the outer diameter of the through hole and the outer diameter of the male screw are preferably larger than the size of the light emitting element.

前記目的に沿う本発明に係る他の発光素子収納用パッケージは、平板状の絶縁基体と、絶縁基体の上面に上方側の開口径を下方側より大きくする傾斜内周壁面を備える筒状の反射体と、絶縁基体の下面にヒートシンク体を有する発光素子収納用パッケージにおいて、絶縁基体の上面と反射体の傾斜内周壁面で形成される発光素子を収納するためのキャビティ部底面の絶縁基体の中央部に貫通孔と、貫通孔の壁面に嵌合及び周縁部に当接して接合させ一方の先端側の端部に設けるフランジ部を絶縁基体から突出させ、且つ上面を絶縁基体の上面に対して突出する平行面にし絶縁基体の下面から他方の先端側に雄ネジを設けて絶縁基体の下面に対して垂直に立設する金属製のネジ体と、ネジ体の雄ネジに雌ネジ穴を介してネジ締めされフランジ部の上面に載置される発光素子からの発熱を放熱させるためのヒートシンク体を有する。   Another light-emitting element storage package according to the present invention that meets the above-described object is a cylindrical reflection base including a flat insulating base and an inclined inner peripheral wall surface having an upper opening diameter larger than a lower side on the upper surface of the insulating base. And a light emitting element storage package having a heat sink body on the lower surface of the insulating base, and the center of the insulating base at the bottom of the cavity for storing the light emitting element formed by the upper surface of the insulating base and the inclined inner peripheral wall surface of the reflector A flange that is fitted to and joined to the wall surface of the through-hole and a peripheral edge, protrudes from the insulating base, and has an upper surface with respect to the upper surface of the insulating base. A metal screw body that is provided with a male screw on the other end side from the lower surface of the insulating base to the projecting parallel surface and stands perpendicular to the lower surface of the insulating base, and a male screw through the female screw hole Screwed flange part Having a heat sink member for dissipating heat generated from the light emitting element is placed on the upper surface.

ここで、上記の他の発光素子収納用パッケージは、フランジ部の外径寸法が貫通孔の外径寸法より大きく、貫通孔の外径寸法が発光素子の大きさより大きいと共に、雄ネジの外径寸法より大きく、雄ネジの外径寸法が発光素子の大きさより大きいのがよい。   Here, in the other light emitting element storage package, the outer diameter of the flange portion is larger than the outer diameter of the through hole, the outer diameter of the through hole is larger than the size of the light emitting element, and the outer diameter of the male screw. The outer diameter of the male screw is preferably larger than the size of the light emitting element.

請求項１又はこれに従属する請求項２記載の発光素子収納用パッケージは、絶縁基体の上面と反射体の傾斜内周壁面で形成される発光素子を収納するためのキャビティ部底面の絶縁基体の中央部に貫通孔と、貫通孔の壁面に嵌合して接合させ一方の先端側の端面を絶縁基体の上面に対して同一面、又は突出する平行面にし絶縁基体の下面から他方の先端側に雄ネジを設けて絶縁基体の下面に対して垂直に立設する金属製のネジ体と、ネジ体の雄ネジに雌ネジ穴を介してネジ締めされネジ体の端面に載置される発光素子からの発熱を放熱させるためのヒートシンク体を有するので、絶縁基体に設ける貫通孔に取り付けたネジ体によって、ヒートシンク体を絶縁基体に密接させて取り付け固定できると共に、絶縁基体の貫通孔に露出するネジ体の一方の先端側の端面に発光素子を載置し、発光素子からの発熱を絶縁基体とヒートシンク体の当接部の信頼性を向上させながら金属製のネジ体を介して伝熱効率を向上させながらヒートシンク体に速やかに伝熱でき、ヒートシンク体から効率的に放熱させることができる。   The light emitting element storage package according to claim 1 or claim 2 dependent thereon is an insulating substrate on the bottom surface of the cavity for housing the light emitting element formed by the upper surface of the insulating substrate and the inclined inner peripheral wall surface of the reflector. A through hole in the center and the wall surface of the through hole are fitted and joined, and the end surface on one end side is the same surface as the upper surface of the insulating base, or a parallel surface that protrudes. A metal screw body that is provided with a male screw on the vertical surface of the insulating base and vertically mounted on the lower surface of the insulating base, and a light-emitting element that is mounted on the male screw of the screw body through a female screw hole and placed on the end surface of the screw body Since it has a heat sink body for dissipating heat generated from the element, the heat sink body can be attached and fixed in close contact with the insulating base by a screw body attached to the through hole provided in the insulating base, and exposed to the through hole of the insulating base. Screw body A light emitting element is placed on the end face on the other side, and heat generation efficiency is improved through a metal screw body while improving the reliability of the contact portion between the insulating base and the heat sink body. Heat can be quickly transferred to the heat sink body, and heat can be efficiently radiated from the heat sink body.

特に、請求項２記載の発光素子収納用パッケージは、貫通孔の外径寸法、及び雄ネジの外径寸法が発光素子の大きさより大きいので、全ての部分が発光素子の大きさより大きい外径寸法からなるネジ体を介して発光素子からの発熱を速やかにヒートシンク体に伝熱でき、放熱効率を向上させることができる。   Particularly, in the light emitting element storage package according to claim 2, since the outer diameter dimension of the through hole and the outer diameter dimension of the male screw are larger than the size of the light emitting element, the outer diameter dimension is larger than the size of the light emitting element. Heat generated from the light emitting element can be quickly transferred to the heat sink body through the screw body made of the above, and the heat radiation efficiency can be improved.

請求項３又はこれに従属する請求項４記載の発光素子収納用パッケージは、絶縁基体の上面と反射体の傾斜内周壁面で形成される発光素子を収納するためのキャビティ部底面の絶縁基体の中央部に貫通孔と、貫通孔の壁面に嵌合及び周縁部に当接して接合させ一方の先端側の端部に設けるフランジ部を絶縁基体から突出させ、且つ上面を絶縁基体の上面に対して突出する平行面にし絶縁基体の下面から他方の先端側に雄ネジを設けて絶縁基体の下面に対して垂直に立設する金属製のネジ体と、ネジ体の雄ネジに雌ネジ穴を介してネジ締めされフランジ部の上面に載置される発光素子からの発熱を放熱させるためのヒートシンク体を有するので、絶縁基体に設ける貫通孔に取り付けたフランジ部を備えたネジ体によって、ヒートシンク体を絶縁基体に密接させて取り付け固定できると共に、絶縁基体の貫通孔に露出するフランジ部の上面に発光素子を載置し、発光素子からの発熱を絶縁基体とヒートシンク体の当接部の信頼性を向上させながら金属製のネジ体を介して伝熱効率を向上させながらヒートシンク体に速やかに伝熱でき、ヒートシンク体から効率的に放熱させることができる。   The light-emitting element storage package according to claim 3 or a dependent claim 4 is a package of the insulating base on the bottom surface of the cavity for storing the light-emitting element formed by the upper surface of the insulating base and the inclined inner peripheral wall surface of the reflector. A through hole at the center, a flange provided at the end of one tip side that is fitted and joined to the wall surface of the through hole and joined to the peripheral edge, protrudes from the insulating base, and the upper surface with respect to the upper surface of the insulating base A metal screw body that is provided with a male screw on the other tip side from the lower surface of the insulating base to a parallel surface that protrudes in the vertical direction, and a female screw hole is formed in the male screw of the screw body. And a heat sink body for dissipating heat generated from the light emitting element mounted on the upper surface of the flange portion, so that the heat sink body is provided with a screw body having a flange portion attached to a through hole provided in the insulating base. Isolated It can be mounted and fixed in close contact with the body, and a light emitting element is placed on the upper surface of the flange exposed in the through hole of the insulating base, improving the reliability of the contact between the insulating base and the heat sink body In this way, heat can be transferred quickly to the heat sink body through the metal screw body while improving heat transfer efficiency, and heat can be efficiently radiated from the heat sink body.

特に、請求項４記載の発光素子収納用パッケージは、フランジ部の外径寸法が貫通孔の外径寸法より大きく、貫通孔の外径寸法が発光素子の大きさより大きいと共に、雄ネジの外径寸法より大きく、雄ネジの外径寸法が発光素子の大きさより大きいので、フランジ部を備え、全ての部分が発光素子の大きさより大きい外径寸法からなるネジ体を介して発光素子からの発熱を速やかにヒートシンク体に伝熱でき、放熱効率を向上させることができる。   In particular, in the light emitting element storage package according to claim 4, the outer diameter of the flange portion is larger than the outer diameter of the through hole, the outer diameter of the through hole is larger than the size of the light emitting element, and the outer diameter of the male screw. Since the outer diameter of the male screw is larger than the size of the light-emitting element, the flange portion is provided, and all the portions generate heat from the light-emitting element through the screw body having an outer diameter larger than the size of the light-emitting element. Heat can be quickly transferred to the heat sink body, and the heat dissipation efficiency can be improved.

続いて、添付した図面を参照しつつ、本発明を具体化した実施の形態について説明し、本発明の理解に供する。
ここに、図１（Ａ）、（Ｂ）はそれぞれ本発明の一実施の形態に係る発光素子収納用パッケージの平面図、Ａ−Ａ’線縦断面図、図２（Ａ）、（Ｂ）はそれぞれ本発明の一実施の形態に係る他の発光素子収納用パッケージの平面図、Ｂ−Ｂ’線縦断面図である。 Next, embodiments of the present invention will be described with reference to the accompanying drawings to provide an understanding of the present invention.
1A and 1B are a plan view, a longitudinal sectional view taken along line AA ′, and FIGS. 2A and 2B, respectively, of the light emitting element storage package according to the embodiment of the present invention. These are the top view of the other light emitting element storage package which concerns on one embodiment of this invention, respectively, and a BB 'line longitudinal cross-sectional view.

図１（Ａ）、（Ｂ）に示すように、本発明の一実施の形態に係る発光素子収納用パッケージ１０は、基体として、特に形状を限定するものではないが、例えば四角形からなる平板状の絶縁基体１１を有している。また、発光素子収納用パッケージ１０は、絶縁基体１１の上面に上方側の開口径を下方側の開口径より大きくし傾斜内周壁面を備える筒状の反射体１２を有している。更に、発光素子収納用パッケージ１０は、絶縁基体１１の下面に、特に形状を限定するものではないが、例えばブロック状や、外側方向に放熱フィンを設けるようなヒートシンク体１３を有している。   As shown in FIGS. 1A and 1B, the light-emitting element storage package 10 according to an embodiment of the present invention is not particularly limited in shape as a base, but is, for example, a rectangular flat plate shape. The insulating base 11 is provided. The light emitting element storage package 10 has a cylindrical reflector 12 on the upper surface of the insulating base 11 and having an upper opening diameter larger than a lower opening diameter and having an inclined inner peripheral wall surface. Further, the light emitting element storage package 10 has a heat sink body 13 on the lower surface of the insulating substrate 11, although the shape is not particularly limited, for example, a block shape or a heat radiating fin provided in the outer direction.

上記の発光素子収納用パッケージ１０は、絶縁基体１１にＢＴ樹脂（ビスマレイミドトリアジンを主成分とする樹脂）やポリイミド等の樹脂や、高温で焼成されるアルミナや窒化アルミニウム等のセラミック等で作製されるものを用いることができる。しかしながら、この絶縁基体１１には、特に材料を限定するものではないが、発光素子収納用パッケージ１０に収納される発光素子１４からの発熱が高く、この熱を効率的に放熱させるために熱伝導率が樹脂より優れるセラミックを用いるものが好ましくなっている。   The light emitting element storage package 10 is made of an insulating base 11 made of a resin such as BT resin (resin having bismaleimide triazine as a main component) or polyimide, ceramic such as alumina or aluminum nitride fired at high temperature, and the like. Can be used. However, the insulating base 11 is not particularly limited in material, but heat generation from the light emitting element 14 housed in the light emitting element housing package 10 is high, and heat conduction is performed to efficiently dissipate this heat. What uses a ceramic whose rate is superior to resin is preferred.

上記の絶縁基体１１は、例えば、セラミック製からなる場合には、先ず、アルミナや、窒化アルミニウム等のセラミック粉末に焼結助剤と、可塑剤と、バインダー、及び溶剤を加え、十分に混練し、脱泡してスラリーを作製し、ドクターブレード法等によって、所望の厚みのシート状のセラミックグリーシートを作製している。次に、それぞれのセラミックグリーンシートには、タングステンや、モリブデン等の高融点金属からなる導体ペーストを用いてスクリーン印刷して所望の導体印刷パターンを形成している。次に、それぞれのセラミックグリーンシートは、重ね合わせて積層する前、又は積層した後に絶縁基体１１の中央部となる所定位置に後述する貫通孔１５用の打ち抜き孔を形成し、更に打ち抜き孔の壁面、及び／又は上面外周部に導体印刷パターンを形成している。そして、それぞれのセラミックグリーンシートを積層した後の積層体は、セラミックと、高融点金属を非酸化性雰囲気中の高温で同時焼成して多層構造に形成している。この同時焼成は、例えば、セラミックがアルミナの場合には、タングステンや、モリブデン等の高融点金属と、１５５０℃程度の水素、窒素の還元性雰囲気中の高温で行われている。あるいは、この同時焼成は、例えば、セラミックが窒化アルミニウムの場合には、タングステンや、モリブデン等の高融点金属と、１７００℃程度の窒素雰囲気中の高温で行われている。   When the insulating base 11 is made of, for example, ceramic, first, a sintering aid, a plasticizer, a binder, and a solvent are added to ceramic powder such as alumina or aluminum nitride and kneaded sufficiently. The slurry is defoamed to produce a slurry, and a sheet-like ceramic green sheet having a desired thickness is produced by a doctor blade method or the like. Next, each ceramic green sheet is screen-printed with a conductive paste made of a refractory metal such as tungsten or molybdenum to form a desired conductive print pattern. Next, each ceramic green sheet is formed with a punching hole for a through-hole 15 to be described later at a predetermined position that becomes the central portion of the insulating substrate 11 before or after being stacked and stacked, and further, the wall surface of the punching hole And / or a conductor print pattern is formed on the outer periphery of the upper surface. And the laminated body after laminating | stacking each ceramic green sheet forms the multilayer structure by baking simultaneously a ceramic and a high melting point metal at high temperature in non-oxidizing atmosphere. For example, when the ceramic is alumina, this co-firing is performed at a high temperature in a reducing atmosphere of refractory metal such as tungsten or molybdenum and hydrogen and nitrogen at about 1550 ° C. Alternatively, for example, when the ceramic is aluminum nitride, this co-firing is performed at a high temperature in a nitrogen atmosphere of about 1700 ° C. with a refractory metal such as tungsten or molybdenum.

上記の発光素子収納用パッケージ１０は、絶縁基体１１の上面と、反射体１２の傾斜内周壁面で形成されるＬＥＤ等の発光素子１４を収納するためのキャビティ部１６底面の絶縁基体１１の中央部に貫通孔１５を有している。また、発光素子収納用パッケージ１０の絶縁基体１１には、それぞれの部位に所望のパターンからなるワイヤボンドパッド１７や、外部接続端子パッド１８や、これらを電気的に接続するための導体配線パターン１９や、図示しないが貫通孔１５の壁面に導体膜が設けられることとなる。なお、上記の反射体１２は、セラミックや、金属や、樹脂等からなり、絶縁基体１１に通常、ガラスや、樹脂や、ろう材等の接合材を用いて接合されるようになっている。また、キャビティ部１６に搭載される発光素子１４からの発光は、発光素子１４を傾斜内周壁面で囲繞する反射体１２によって前方に集中でき、輝度を向上させることができるようになっている。   The light emitting element storage package 10 includes the center of the insulating base 11 on the bottom surface of the cavity 16 for storing the light emitting elements 14 such as LEDs formed by the top surface of the insulating base 11 and the inclined inner peripheral wall surface of the reflector 12. The part has a through hole 15. The insulating substrate 11 of the light emitting element storage package 10 has a wire bond pad 17 having a desired pattern, an external connection terminal pad 18 and a conductor wiring pattern 19 for electrically connecting them to each part. Alternatively, although not shown, a conductor film is provided on the wall surface of the through hole 15. The reflector 12 is made of ceramic, metal, resin, or the like, and is usually bonded to the insulating base 11 using a bonding material such as glass, resin, or brazing material. Further, the light emitted from the light emitting element 14 mounted on the cavity portion 16 can be concentrated forward by the reflector 12 surrounding the light emitting element 14 with the inclined inner peripheral wall surface, so that the luminance can be improved.

上記の発光素子収納用パッケージ１０は、絶縁基体１１の貫通孔１５の壁面に嵌合して接合される金属製からなるネジ体２０を有している。このネジ体２０は、一方の先端側の端面を絶縁基体１１の上面に対して同一面、又は突出する平行面にして絶縁基体１１に接合されている。また、このネジ体２０は、他方の先端側を絶縁基体１１の下面に対して垂直に立設させ、絶縁基体１１の下面から他方の先端側に雄ネジ２１を設けている。この接合には、例えば、貫通孔１５の壁面に設けられた導体膜に更にＮｉめっき被膜を形成し、このＮｉめっき被膜とネジ体２０の間にＡｇろう等のろう材を介して加熱してろう付け接合することで絶縁基体１１の貫通孔１５の壁面にネジ体２０の一方の先端側を嵌合して強固に接合させる方法を用いることができる。なお、絶縁基体１１が樹脂からなる場合には、ネジ体２０を接着用樹脂を用いて接合させることができる。ネジ体２０は、特に金属材料を限定するものではないが、例えば、セラミックと熱膨張係数が近似するＫＶ（Ｆｅ−Ｎｉ−Ｃｏ系合金、商品名「Ｋｏｖａｒ（コバール）」）や、４２アロイ（Ｆｅ−Ｎｉ系合金）、あるいは、セラミックと熱膨張係数が近似すると共に、比較的熱伝導率が高いＣｕ−Ｗ（銅タングステン）等からなる金属を用いることができる。発光素子収納用パッケージ１０は、このネジ体２０の一方の先端側の端面に発光素子１４が載置できるようになっている。なお、発光素子収納用パッケージ１０は、絶縁基体１１に、図示しないが、通常、外部に露出するワイヤボンドパッド１７や、外部接続端子パッド１８や、導体配線パターン１９の金属部分にＮｉめっき被膜が施されている。そして、外部接続端子パッド１８には、セラミックと熱膨張係数が近似するＫＶや、４２アロイ等の金属からなる外部接続端子２２がＡｇろう等のろう材でろう付け接合されている。   The light emitting element storage package 10 has a screw body 20 made of metal that is fitted and joined to the wall surface of the through hole 15 of the insulating base 11. The screw body 20 is bonded to the insulating base 11 with one end face on the same side as the upper surface of the insulating base 11 or a parallel surface protruding. In addition, the screw body 20 has the other tip side erected perpendicularly to the bottom surface of the insulating base 11, and a male screw 21 is provided from the bottom surface of the insulating base 11 to the other tip side. For this bonding, for example, a Ni plating film is further formed on the conductor film provided on the wall surface of the through-hole 15, and heating is performed between the Ni plating film and the screw body 20 via a brazing material such as Ag brazing. It is possible to use a method in which one end side of the screw body 20 is fitted to the wall surface of the through hole 15 of the insulating base 11 and is firmly joined by brazing. When the insulating base 11 is made of a resin, the screw body 20 can be bonded using an adhesive resin. The screw body 20 is not particularly limited to a metal material. For example, KV (Fe—Ni—Co alloy having a thermal expansion coefficient approximate to that of ceramic, trade name “Kovar”), 42 alloy ( Fe-Ni alloy) or a metal made of Cu-W (copper tungsten) or the like having a thermal expansion coefficient approximate to that of ceramic and having a relatively high thermal conductivity can be used. The light emitting element storage package 10 is configured such that the light emitting element 14 can be placed on one end face of the screw body 20. In the light emitting element storage package 10, although not shown, an Ni plating film is usually applied to the metal portion of the wire bond pad 17, the external connection terminal pad 18, and the conductor wiring pattern 19 that are exposed to the outside on the insulating substrate 11. It has been subjected. The external connection terminal pad 18 is brazed and joined to an external connection terminal 22 made of a metal such as KV having a thermal expansion coefficient approximate to that of ceramic or 42 alloy, by brazing material such as Ag brazing.

上記の発光素子収納用パッケージ１０は、ネジ体２０の雄ネジ２１に雌ネジ穴２３を介してネジ締めされてネジ体２０の一方の先端側の端面に載置される発光素子１４からの発熱を放熱させるためのヒートシンク体１３を有している。このヒートシンク体１３は、絶縁基体１１に取り付けられたネジ体２０の雄ネジ２１と、ヒートシンク体１３に設けられた雌ネジ穴２３で締め付けることで絶縁基体１１の下面に当接するようになっている。ヒートシンク体１３は、特に材料を限定するものではないが、熱伝導率が良好であるアルミニウムや、銅等からなる金属を用いて形成されている。   The light emitting element storage package 10 is heated by the male screw 21 of the screw body 20 via the female screw hole 23 and is heated from the light emitting element 14 placed on one end face of the screw body 20. Has a heat sink body 13 for radiating heat. The heat sink body 13 comes into contact with the lower surface of the insulating base body 11 by tightening with the male screw 21 of the screw body 20 attached to the insulating base body 11 and the female screw hole 23 provided in the heat sink body 13. . The heat sink body 13 is not particularly limited in material, but is formed using a metal made of aluminum, copper, or the like having good thermal conductivity.

発光素子収納用パッケージ１０は、絶縁基体１１に設けられた貫通孔１５に取り付けられたネジ体２０の雄ネジ２１によってヒートシンク体１３を絶縁基体１１や、雄ネジ２１に歪みを発生させることなく密接させて取り付け固定できる。従って、絶縁基体１１と、ヒートシンク体１３の当接部は、破壊の発生を防止して、信頼性を向上させることができる。また、発光素子収納用パッケージ１０は、ネジ体２０の一方の先端側の端面に載置される発光素子１４からの発熱をネジ体２０を介して速やかにヒートシンク体１３に伝熱させ、熱伝導率の良好なヒートシンク体１３から外部に放熱させることができる。なお、発光素子収納用パッケージ１０は、セラミック製の絶縁基体１１と、ヒートシンク体１３の間にはアンダーフィル等の熱伝導性に優れる樹脂を挟み込んで密接させ、熱伝導率が比較的高いセラミックを介してヒートシンク体１３に伝熱させて外部に放熱させることもできる。   In the light emitting element storage package 10, the heat sink body 13 is brought into close contact with the insulating base 11 and the male screw 21 without causing distortion by the male screw 21 of the screw body 20 attached to the through hole 15 provided in the insulating base 11. Can be fixed. Therefore, the contact portion between the insulating base 11 and the heat sink body 13 can prevent the occurrence of destruction and improve the reliability. In addition, the light emitting element storage package 10 quickly transfers heat from the light emitting element 14 placed on one end face of the screw body 20 to the heat sink body 13 via the screw body 20 to conduct heat conduction. The heat sink body 13 having a good rate can be radiated to the outside. The light emitting element storage package 10 is made of a ceramic having a relatively high thermal conductivity by sandwiching a resin having excellent thermal conductivity such as underfill between the ceramic insulating base 11 and the heat sink body 13. It is also possible to transfer heat to the heat sink body 13 and dissipate heat to the outside.

上記の発光素子収納用パッケージ１０は、絶縁基体１１に設ける貫通孔１５の外径寸法である直径の大きさが発光素子１４の大きさより大きいのがよい。また、これと併せて、発光素子収納用パッケージ１０は、ネジ体２０の雄ネジ２１の外径寸法である直径の大きさが発光素子１４の大きさより大きいのがよい。このような発光素子収納用パッケージ１０は、発光素子１４がネジ体２０の全ての外径寸法である直径の中に収まっているので、発光素子１４の全体からの発熱をネジ体２０を介して速やかにヒートシンク体１３に伝熱させ、熱伝導率の良好なヒートシンク体１３から外部に放熱させることができる。従って、発光素子収納用パッケージ１０に収納される発光素子１４は、放熱効果を向上させることができるので、発光素子１４の高輝度を維持させることができる。   In the light emitting element storage package 10 described above, the diameter, which is the outer diameter of the through hole 15 provided in the insulating base 11, is preferably larger than the light emitting element 14. In addition, in the light emitting element storage package 10, the outer diameter of the male screw 21 of the screw body 20 is preferably larger than the light emitting element 14. In such a light emitting element storage package 10, since the light emitting element 14 is accommodated in the diameter of all the outer diameters of the screw body 20, heat generated from the entire light emitting element 14 is transmitted through the screw body 20. Heat can be quickly transferred to the heat sink body 13, and heat can be radiated to the outside from the heat sink body 13 having good thermal conductivity. Therefore, since the light emitting element 14 accommodated in the light emitting element accommodating package 10 can improve the heat dissipation effect, the high luminance of the light emitting element 14 can be maintained.

なお、発光素子収納用パッケージ１０の外部接続端子パッド１８は、絶縁基体１１の下面側に設けて、ボード基板等に半田で直接接合させることもできる。また、発光素子収納用パッケージ１０のネジ体２０の雄ネジ２１は、ヒートシンク体１３を突き抜け、突き抜けた部分をナット等で締め付けることもできる。更に、発光素子収納用パッケージ１０のワイヤボンドパッド１７は、発光素子１４とボンディングワイヤ２４を介して電気的に導通状態するための接続用パッドとして設けている。   The external connection terminal pads 18 of the light emitting element storage package 10 may be provided on the lower surface side of the insulating base 11 and directly bonded to a board substrate or the like with solder. Further, the male screw 21 of the screw body 20 of the light emitting element storage package 10 can penetrate the heat sink body 13 and tighten the projecting portion with a nut or the like. Further, the wire bond pad 17 of the light emitting element storage package 10 is provided as a connection pad for electrical conduction through the light emitting element 14 and the bonding wire 24.

次いで、図２（Ａ）、（Ｂ）に示すように、本発明の一実施の形態に係る他の発光素子収納用パッケージ１０ａは、上記の発光素子収納用パッケージ１０と同様に、基体として、特に形状を限定するものではないが、例えば四角形からなる平板状の絶縁基体１１を有している。また、発光素子収納用パッケージ１０ａは、上記の発光素子収納用パッケージ１０と同様に、絶縁基体１１の上面に上方側の開口径を下方側の開口径より大きくし傾斜内周壁面を備える筒状の反射体１２を有している。更に、発光素子収納用パッケージ１０ａは、上記の発光素子収納用パッケージ１０と同様に、絶縁基体１１の下面に、特に形状を限定するものではないが、例えばブロック状や、外側方向に放熱フィンを設けるようなヒートシンク体１３を有している。   Next, as shown in FIGS. 2A and 2B, another light-emitting element storage package 10a according to one embodiment of the present invention is used as a base, similar to the light-emitting element storage package 10 described above. Although the shape is not particularly limited, for example, it has a flat plate-like insulating base 11 made of a square. Similarly to the light emitting element accommodation package 10 described above, the light emitting element accommodation package 10a has a cylindrical shape provided with an inclined inner peripheral wall surface on the upper surface of the insulating base 11 with an upper opening diameter larger than a lower opening diameter. The reflector 12 is provided. Further, the light-emitting element storage package 10a is not particularly limited in shape on the lower surface of the insulating base 11, like the light-emitting element storage package 10 described above. The heat sink body 13 is provided.

上記の発光素子収納用パッケージ１０ａは、絶縁基体１１の上面と、反射体１２の傾斜内周壁面で形成されるＬＥＤ等の発光素子１４を収納するためのキャビティ部１６底面の絶縁基体１１の中央部に貫通孔１５ａを有している。また、発光素子収納用パッケージ１０ａの絶縁基体１１には、それぞれの部位に所望のパターンからなるワイヤボンドパッド１７や、外部接続端子パッド１８や、これらを電気的に接続するための導体配線パターン１９や、図示しないが貫通孔１５ａの壁面、及び上面周縁部に導体膜等が設けられることとなる。なお、上記の反射体１２は、セラミックや、金属や、樹脂等からなり、絶縁基体１１に通常、ガラスや、樹脂や、ろう材等の接合材を用いて接合されるようになっている。また、キャビティ部１６に搭載される発光素子１４からの発光は、発光素子１４を傾斜内周壁面で囲繞する反射体１２によって前方に集中でき、輝度を向上させることができるようになっている。   The light emitting element storage package 10a includes the center of the insulating base 11 on the bottom surface of the cavity 16 for storing the light emitting elements 14 such as LEDs formed by the upper surface of the insulating base 11 and the inclined inner peripheral wall surface of the reflector 12. The part has a through hole 15a. The insulating substrate 11 of the light emitting element storage package 10a has a wire bond pad 17 having a desired pattern, an external connection terminal pad 18, and a conductor wiring pattern 19 for electrically connecting them to each part. Or although not shown in figure, a conductor film etc. will be provided in the wall surface of the through-hole 15a, and an upper surface peripheral part. The reflector 12 is made of ceramic, metal, resin, or the like, and is usually bonded to the insulating base 11 using a bonding material such as glass, resin, or brazing material. Further, the light emitted from the light emitting element 14 mounted on the cavity portion 16 can be concentrated forward by the reflector 12 surrounding the light emitting element 14 with the inclined inner peripheral wall surface, so that the luminance can be improved.

上記の発光素子収納用パッケージ１０は、絶縁基体１１の貫通孔１５ａの壁面に嵌合し、上面周縁部に当接して接合される金属製からなるネジ体２０ａを有している。このネジ体２０ａは、一方の先端側の端部にフランジ部２５を設け、このフランジ部２５を絶縁基体１１から突出させ、且つ上面を絶縁基体１１の上面に対して突出する平行面にして絶縁基体１１に接合されている。また、このネジ体２０ａは、他方の先端側を絶縁基体１１の下面に対して垂直に立設させ、絶縁基体１１の下面から他方の先端側に雄ネジ２１ａを設けている。この接合には、例えば、貫通孔１５ａの壁面、及び上面周縁部に設けられた導体膜に更にＮｉめっき被膜を形成し、このＮｉめっき被膜とネジ体２０ａの間にＡｇろう等のろう材を介して加熱してろう付け接合することで絶縁基体１１の貫通孔１５ａの壁面にネジ体２０ａの一方の先端側を嵌合、及びフランジ部２５を当接させて極めて強固に接合させる方法を用いることができる。ネジ体２０ａは、特に金属材料を限定するものではないが、例えば、セラミックと熱膨張係数が近似するＫＶ（Ｆｅ−Ｎｉ−Ｃｏ系合金、商品名「Ｋｏｖａｒ（コバール）」）や、４２アロイ（Ｆｅ−Ｎｉ系合金）、あるいは、セラミックと熱膨張係数が近似すると共に、比較的熱伝導率が高いＣｕ−Ｗ（銅タングステン）等からなる金属を用いることができる。発光素子収納用パッケージ１０ａは、このネジ体２０ａの一方の先端側のフランジ部２５の広い上面に発光素子１４が安定して載置できるようになっている。なお、発光素子収納用パッケージ１０ａは、上記の発光素子収納用パッケージ１０と同様に、絶縁基体１１に、図示しないが、通常、外部に露出するワイヤボンドパッド１７や、外部接続端子パッド１８や、導体配線パターン１９の金属部分にＮｉめっき被膜が施されている。そして、外部接続端子パッド１８には、セラミックと熱膨張係数が近似するＫＶや、４２アロイ等の金属からなる外部接続端子２２がＡｇろう等のろう材でろう付け接合されている。   The light emitting element storage package 10 has a screw body 20a made of metal that fits into the wall surface of the through hole 15a of the insulating base 11 and is joined in contact with the peripheral edge of the upper surface. The screw body 20a is provided with a flange portion 25 at one end on one end side, the flange portion 25 is protruded from the insulating base 11, and the upper surface is parallel to the upper surface of the insulating base 11 to be insulated. Bonded to the substrate 11. In addition, the screw body 20 a has the other tip side erected perpendicularly to the bottom surface of the insulating base 11, and a male screw 21 a is provided from the bottom surface of the insulating base 11 to the other tip side. For this joining, for example, a Ni plating film is further formed on the wall surface of the through-hole 15a and the conductor film provided on the periphery of the upper surface, and a brazing material such as Ag brazing is provided between the Ni plating film and the screw body 20a. By using a method in which one end side of the screw body 20a is fitted to the wall surface of the through-hole 15a of the insulating base 11 and the flange portion 25 is brought into contact with the wall surface of the through hole 15a of the insulating base 11 to be bonded extremely firmly. be able to. The screw body 20a is not particularly limited to a metal material, but, for example, KV (Fe—Ni—Co based alloy, trade name “Kovar”) whose thermal expansion coefficient is close to that of ceramic, 42 alloy ( Fe-Ni alloy) or a metal made of Cu-W (copper tungsten) or the like having a thermal expansion coefficient approximate to that of ceramic and having a relatively high thermal conductivity can be used. The light emitting element storage package 10a is configured so that the light emitting element 14 can be stably placed on the wide upper surface of the flange portion 25 on one end side of the screw body 20a. Although the light emitting element storage package 10a is not shown in the figure, the wire bond pad 17 exposed to the outside, the external connection terminal pad 18, and the like are generally not shown in the figure, similarly to the light emitting element storage package 10 described above. A Ni plating film is applied to the metal portion of the conductor wiring pattern 19. The external connection terminal pad 18 is brazed and joined to an external connection terminal 22 made of a metal such as KV having a thermal expansion coefficient approximate to that of ceramic or 42 alloy, by brazing material such as Ag brazing.

上記の発光素子収納用パッケージ１０ａは、ネジ体２０ａの雄ネジ２１ａに雌ネジ穴２３を介してネジ締めされてネジ体２０ａの一方の先端側の端面に載置される発光素子１４からの発熱を放熱させるためのヒートシンク体１３を有している。このヒートシンク体１３は、絶縁基体１１に取り付けられたネジ体２０ａの雄ネジ２１ａと、ヒートシンク体１３に設けられた雌ネジ穴２３で締め付けることで絶縁基体１１の下面に当接するようになっている。ヒートシンク体１３は、特に材料を限定するものではないが、熱伝導率が良好であるアルミニウムや、銅等からなる金属を用いて形成されている。   The light emitting element storage package 10a is heated by the male screw 21a of the screw body 20a through the female screw hole 23, and the heat generated from the light emitting element 14 placed on one end face of the screw body 20a. Has a heat sink body 13 for radiating heat. The heat sink body 13 is brought into contact with the lower surface of the insulating base body 11 by being tightened by a male screw 21 a of a screw body 20 a attached to the insulating base body 11 and a female screw hole 23 provided in the heat sink body 13. . The heat sink body 13 is not particularly limited in material, but is formed using a metal made of aluminum, copper, or the like having good thermal conductivity.

発光素子収納用パッケージ１０ａは、上記の発光素子収納用パッケージ１０と同様に、絶縁基体１１に設けられた貫通孔１５ａに取り付けられたネジ体２０ａの雄ネジ２１ａによってヒートシンク体１３を絶縁基体１１や、雄ネジ２１ａに歪みを発生させることなく密接させて取り付け固定できる。従って、絶縁基体１１と、ヒートシンク体１３の当接部は、破壊の発生を防止して、信頼性を向上させることができる。また、発光素子収納用パッケージ１０ａは、上記の発光素子収納用パッケージ１０と同様に、ネジ体２０ａの一方の先端側のフランジ部２５の上面に載置される発光素子１４からの発熱をネジ体２０ａを介して速やかにヒートシンク体１３に伝熱させ、熱伝導率の良好なヒートシンク体１３から外部に放熱させることができる。なお、発光素子収納用パッケージ１０ａは、上記の発光素子収納用パッケージ１０と同様に、セラミック製の絶縁基体１１と、ヒートシンク体１３の間にはアンダーフィル等の熱伝導性に優れる樹脂を挟み込んで密接させ、熱伝導率が比較的高いセラミックを介してヒートシンク体１３に伝熱させて外部に放熱させることもできる。   In the same manner as the light emitting element storage package 10 described above, the light emitting element storage package 10a is configured such that the heat sink body 13 is connected to the insulating base body 11 by the male screw 21a of the screw body 20a attached to the through hole 15a provided in the insulating base body 11. The male screw 21a can be attached and fixed in close contact without causing distortion. Therefore, the contact portion between the insulating base 11 and the heat sink body 13 can prevent the occurrence of destruction and improve the reliability. Similarly to the light emitting element housing package 10, the light emitting element housing package 10 a is a screw body that generates heat from the light emitting element 14 placed on the upper surface of the flange portion 25 on the one end side of the screw body 20 a. Heat can be quickly transferred to the heat sink body 13 through 20a, and heat can be radiated to the outside from the heat sink body 13 having good thermal conductivity. In the light emitting element storage package 10a, a resin having excellent thermal conductivity such as underfill is sandwiched between the ceramic insulating substrate 11 and the heat sink body 13 in the same manner as the light emitting element storage package 10 described above. It is also possible to dissipate heat to the outside by transferring heat to the heat sink body 13 through a ceramic having a relatively high thermal conductivity.

上記の発光素子収納用パッケージ１０ａは、フランジ部２５の外径寸法である直径の大きさが貫通孔１５ａの外径寸法である直径の大きさより大きいのがよい。また、これと併せて、発光素子収納用パッケージ１０ａは、貫通孔１５ａの外径寸法である直径の大きさが発光素子１４の大きさより大きいと共に、ネジ体２０ａの雄ネジ２１ａの外径寸法である直径の大きさより大きいのがよい。更に、発光素子収納用パッケージ１０ａは、雄ネジ２１ａの外径寸法である直径の大きさが発光素子１４の大きさより大きいのがよい。このような発光素子収納用パッケージ１０ａは、発光素子１４がネジ体２０ａの全ての外径寸法である直径の中に収まっているので、発光素子１４の全体からの発熱をネジ体２０ａを介して速やかにヒートシンク体１３に伝熱させ、熱伝導率の良好なヒートシンク体１３から外部に放熱させることができる。従って、発光素子収納用パッケージ１０ａに収納される発光素子１４は、放熱効果を向上させることができるので、発光素子１４の高輝度を維持させることができる。   In the light emitting element storage package 10a, it is preferable that the diameter, which is the outer diameter of the flange portion 25, is larger than the diameter, which is the outer diameter of the through hole 15a. In addition to this, the light emitting element storage package 10a has a diameter larger than that of the light emitting element 14 and an outer diameter of the male screw 21a of the screw body 20a. It should be larger than a certain diameter. Further, in the light emitting element storage package 10 a, the diameter of the external diameter of the male screw 21 a is preferably larger than that of the light emitting element 14. In such a light emitting element storage package 10a, since the light emitting element 14 is accommodated in the diameter of all the outer diameters of the screw body 20a, heat generated from the entire light emitting element 14 is transmitted through the screw body 20a. Heat can be quickly transferred to the heat sink body 13, and heat can be radiated to the outside from the heat sink body 13 having good thermal conductivity. Therefore, since the light emitting element 14 accommodated in the light emitting element accommodating package 10a can improve the heat dissipation effect, the high luminance of the light emitting element 14 can be maintained.

なお、発光素子収納用パッケージ１０ａの外部接続端子パッド１８は、絶縁基体１１の下面側に設けて、ボード基板等に半田で直接接合させることもできる。また、発光素子収納用パッケージ１０ａのネジ体２０ａの雄ネジ２１ａは、ヒートシンク体１３を突き抜け、突き抜けた部分をナット等で締め付けることもできる。更に、発光素子収納用パッケージ１０ａのワイヤボンドパッド１７は、発光素子１４とボンディングワイヤ２４を介して電気的に導通状態するための接続用パッドとして設けている。   The external connection terminal pads 18 of the light emitting element storage package 10a can be provided on the lower surface side of the insulating base 11 and directly bonded to the board substrate or the like by solder. Further, the male screw 21a of the screw body 20a of the light emitting element storage package 10a can penetrate the heat sink body 13, and the projecting portion can be tightened with a nut or the like. Further, the wire bond pad 17 of the light emitting element storage package 10 a is provided as a connection pad for electrical connection through the light emitting element 14 and the bonding wire 24.

本発明の発光素子収納用パッケージ、他の発光素子収納用パッケージは、大きな発光効率と、高い接合信頼性が求められ、発熱量が大きい自動車用ヘッドランプや、街路灯等のランプとして用いることができる。   The light-emitting element storage package of the present invention and other light-emitting element storage packages are required to have high luminous efficiency and high bonding reliability, and can be used as lamps for automobile headlamps and street lamps that generate large amounts of heat. it can.

（Ａ）、（Ｂ）はそれぞれ本発明の一実施の形態に係る発光素子収納用パッケージの平面図、Ａ−Ａ’線縦断面図である。(A), (B) is a top view of the light emitting element storage package which concerns on one embodiment of this invention, respectively, and an A-A 'line longitudinal cross-sectional view. （Ａ）、（Ｂ）はそれぞれ本発明の一実施の形態に係る他の発光素子収納用パッケージの平面図、Ｂ−Ｂ’線縦断面図である。(A), (B) is the top view of the other light emitting element storage package which concerns on one embodiment of this invention, respectively, and a B-B 'line longitudinal cross-sectional view. （Ａ）、（Ｂ）はそれぞれ従来の発光素子収納用パッケージの平面図、Ｃ−Ｃ’線縦断面図である。(A), (B) is the top view of the conventional light emitting element storage package, respectively, and the C-C 'line longitudinal cross-sectional view.

符号の説明Explanation of symbols

１０、１０ａ：発光素子収納用パッケージ、１１：絶縁基体、１２：反射体、１３：ヒートシンク体、１４：発光素子、１５、１５ａ：貫通孔、１６：キャビティ部、１７：ワイヤボンドパッド、１８：外部接続端子パッド、１９：導体配線パターン、２０、２０ａ：ネジ体、２１、２１ａ：雄ネジ、２２：外部接続端子、２３：雌ネジ穴、２４：ボンディングワイヤ、２５：フランジ部   10, 10a: Package for housing light emitting element, 11: Insulating substrate, 12: Reflector, 13: Heat sink body, 14: Light emitting element, 15, 15a: Through hole, 16: Cavity, 17: Wire bond pad, 18: External connection terminal pad, 19: Conductor wiring pattern, 20, 20a: Screw body, 21, 21a: Male screw, 22: External connection terminal, 23: Female screw hole, 24: Bonding wire, 25: Flange

Claims (4)

平板状の絶縁基体と、該絶縁基体の上面に上方側の開口径を下方側より大きくする傾斜内周壁面を備える筒状の反射体と、前記絶縁基体の下面にヒートシンク体を有する発光素子収納用パッケージにおいて、
前記絶縁基体の上面と前記反射体の前記傾斜内周壁面で形成される発光素子を収納するためのキャビティ部底面の前記絶縁基体の中央部に貫通孔と、該貫通孔の壁面に嵌合して接合させ一方の先端側の端面を前記絶縁基体の上面に対して同一面、又は突出する平行面にし前記絶縁基体の下面から他方の先端側に雄ネジを設けて前記絶縁基体の下面に対して垂直に立設する金属製のネジ体と、該ネジ体の前記雄ネジに雌ネジ穴を介してネジ締めされ前記ネジ体の前記端面に載置される前記発光素子からの発熱を放熱させるための前記ヒートシンク体を有することを特徴とする発光素子収納用パッケージ。 A light-emitting element housing having a flat insulating base, a cylindrical reflector having an inclined inner wall surface whose upper opening diameter is larger than the lower side on the upper surface of the insulating base, and a heat sink body on the lower surface of the insulating base In the package for
A through-hole is fitted in the central portion of the insulating substrate on the bottom surface of the cavity portion for housing the light emitting element formed by the upper surface of the insulating substrate and the inclined inner peripheral wall surface of the reflector, and is fitted to the wall surface of the through-hole. The end surface of one end side is made flush with the upper surface of the insulating base or a parallel surface protruding, and a male screw is provided from the lower surface of the insulating base to the other end side to the lower surface of the insulating base. A metal screw body erected vertically and the male screw of the screw body screwed through a female screw hole to dissipate heat generated from the light emitting element placed on the end face of the screw body A light-emitting element storage package comprising the heat sink body. 請求項１記載の発光素子収納用パッケージにおいて、前記貫通孔の外径寸法、及び前記雄ネジの外径寸法が前記発光素子の大きさより大きいことを特徴とする発光素子収納用パッケージ。   The light emitting element storage package according to claim 1, wherein an outer diameter of the through hole and an outer diameter of the male screw are larger than a size of the light emitting element. 平板状の絶縁基体と、該絶縁基体の上面に上方側の開口径を下方側より大きくする傾斜内周壁面を備える筒状の反射体と、前記絶縁基体の下面にヒートシンク体を有する発光素子収納用パッケージにおいて、
前記絶縁基体の上面と前記反射体の前記傾斜内周壁面で形成される発光素子を収納するためのキャビティ部底面の前記絶縁基体の中央部に貫通孔と、該貫通孔の壁面に嵌合及び周縁部に当接して接合させ一方の先端側の端部に設けるフランジ部を前記絶縁基体から突出させ、且つ上面を前記絶縁基体の上面に対して突出する平行面にし前記絶縁基体の下面から他方の先端側に雄ネジを設けて前記絶縁基体の下面に対して垂直に立設する金属製のネジ体と、該ネジ体の前記雄ネジに雌ネジ穴を介してネジ締めされ前記フランジ部の上面に載置される前記発光素子からの発熱を放熱させるための前記ヒートシンク体を有することを特徴とする発光素子収納用パッケージ。 A light-emitting element housing having a flat insulating base, a cylindrical reflector having an inclined inner wall surface whose upper opening diameter is larger than the lower side on the upper surface of the insulating base, and a heat sink body on the lower surface of the insulating base In the package for
A through-hole is fitted in the central portion of the insulating base on the bottom surface of the cavity for housing the light emitting element formed by the top surface of the insulating base and the inclined inner peripheral wall surface of the reflector, A flange portion that is brought into contact with and joined to the peripheral edge and is provided at an end on one tip side protrudes from the insulating base, and the upper surface is a parallel surface protruding with respect to the upper surface of the insulating base, and the other from the lower surface of the insulating base A metal screw body that is provided with a male screw on the distal end side thereof and is erected perpendicularly to the lower surface of the insulating base, and is screwed to the male screw of the screw body through a female screw hole. A light-emitting element storage package comprising the heat sink body for dissipating heat generated from the light-emitting element placed on an upper surface. 請求項３記載の発光素子収納用パッケージにおいて、前記フランジ部の外径寸法が前記貫通孔の外径寸法より大きく、前記貫通孔の外径寸法が前記発光素子の大きさより大きいと共に、前記雄ネジの外径寸法より大きく、前記雄ネジの外径寸法が前記発光素子の大きさより大きいことを特徴とする発光素子収納用パッケージ。   4. The light emitting element storage package according to claim 3, wherein an outer diameter of the flange portion is larger than an outer diameter of the through hole, an outer diameter of the through hole is larger than a size of the light emitting element, and the male screw. A package for storing a light emitting element, wherein the outer diameter of the male screw is larger than the size of the light emitting element.
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US9111778B2 (en) 2009-06-05 2015-08-18 Cree, Inc. Light emitting diode (LED) devices, systems, and methods
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US8610140B2 (en) 2010-12-15 2013-12-17 Cree, Inc. Light emitting diode (LED) packages, systems, devices and related methods
US9859471B2 (en) 2011-01-31 2018-01-02 Cree, Inc. High brightness light emitting diode (LED) packages, systems and methods with improved resin filling and high adhesion
US11101408B2 (en) 2011-02-07 2021-08-24 Creeled, Inc. Components and methods for light emitting diode (LED) lighting
US10591124B2 (en) 2012-08-30 2020-03-17 Sabic Global Technologies B.V. Heat dissipating system for a light, headlamp assembly comprising the same, and method of dissipating heat
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