JP2005116990A - Light emitting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light emitting device which can effectively dissipate heat of a light emitting device which is generated accompanying increase of output. <P>SOLUTION: An LED element 14 of a flip chip type is mounted on a submount 13 which is mounted on a copper metal base part 11 which functions as a heat dissipator. A metal reflector 12 is joined to the metal base part 11 in which a trench for leading lead portions 16a, 16b outside is formed. In the trench, the lead portions 16a, 16b insulated with insulated sealing glasses 15a, 15b, 17a, 17b are arranged, and tip parts of the lead portions 16a, 16b are connected to an electrode and a wiring layer of the submount 13 in the state of mounting on a step-difference part of the submount 13. A reflecting surface 12a of a recessed part of an earthenware mortar shape is formed in the metal reflector 12 which functions as a reflector and a heat dissipating object, and the inside of the recessed part is filled with a sealing member 18 formed of a translucent resin etc. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a light-emitting device, and more particularly to a light-emitting device that can effectively dissipate heat generated by a light-emitting element due to high output.

  In recent years, high-power LEDs (light-emitting diodes) have been developed, and a high-power type of several watts has already been commercialized. LEDs are characterized by low heat generation, but high power (high brightness) type LED elements generate a large amount of current, and therefore generate heat that cannot be ignored.

  Conventionally, since the LED element has not been high output, no heat dissipation measures have been taken, and heat has been radiated from the lead portion. And when heat_generation | fever becomes a problem, measures, such as attaching a copper heat sink to the lower surface of the member which mounts the LED element, were taken (for example, refer patent document 1).

  The LED package described in Patent Document 1 is inserted into a lead frame having an embedded plastic material formed by insert molding a slag to be a heat sink. A light emitting diode die (LED die) is directly or indirectly attached to the slag via a sub-base having excellent thermal conductivity, and the LED is mounted on the LED die. The LED and light emitting diode die and the lead frame are connected by wires.

In such a configuration, the LED die is thermally bonded to the slug, so that the LED die is maintained at a lower junction temperature than the conventional package. By lowering the temperature, the LED die is not subjected to large thermal stress, and the reliability and good characteristics in high power operation can be maintained.
Japanese Unexamined Patent Publication No. 2000-150967 ([0008], FIG. 2)

  However, according to the conventional light emitting device, since the slag is inserted into a lead frame which is insert-molded with a plastic material, the heat conduction from the LED die to the slag is not sufficient, and thus a sufficient heat dissipation effect can be obtained. Therefore, there is a problem that it is impossible to cope with the high output of the LED element.

  Accordingly, an object of the present invention is to provide a light-emitting device that can effectively dissipate heat generated by a light-emitting element due to an increase in output.

  To achieve the above object, the present invention provides a light emitting element, a lead having one end electrically connected to the light emitting element and functioning as a terminal for supplying power to the light emitting element, and the light emitting element. An element is mounted, and includes a metal base portion that dissipates heat of the light emitting element, and a sealing member made of translucent resin or glass that covers the light emitting element, and the lead is attached to the metal base portion, Provided is a light-emitting device that is held by a heat-resistant insulating member having a thermal expansion coefficient equivalent to that of the metal base portion.

  Preferably, the light emitting device includes a submount for connecting the light emitting element and the lead through an electrode or a wiring layer, and the light emitting device is mounted on the metal base portion through the submount.

  The heat-resistant insulating member that holds the lead on the metal base portion is preferably a glass material, and the lead is preferably a metal plate material.

  The heat-resistant insulating member that holds the lead on the metal base portion may be a ceramic material, and the lead may be a metal pattern formed on the ceramic material.

  You may have the metallic reflector part joined so that it might overlap with the said metal base part, or was integrally processed by the said metal base part.

  A radiating fin may be formed on at least one of the metal base portion or the reflecting mirror portion.

  The metal base portion may be provided with a sheet-like heat sink.

  According to the light-emitting device of the present invention, the submount is mounted on the metal base portion, and the metal reflector is joined to the metal base portion, so that the heat from the light-emitting element is transmitted to the metal base portion and the metal reflector. Therefore, high heat dissipation efficiency can be obtained, heat generated in the high output type light emitting element can be effectively dissipated, and high output of the light emitting element can be dealt with. Moreover, since the holding member is comprised with the heat resistant member, it has the heat resistance which can perform the reflow furnace process of lead-free solder.

  1A and 1B are diagrams illustrating a configuration of a light emitting device according to a first embodiment of the present invention, in which FIG. 1A is a plan view, FIG. 1B is a cross-sectional view along AA, and FIG. 1C is a cross-sectional view along BB. FIG. Usually, the lead frame is provided with a belt-like portion connecting the outer side of each lead portion on both sides, but the illustration is omitted here. In addition, a plurality of LED elements (light emitting elements) are usually mounted on the lead frame, but only one is shown here.

  The light emitting device 10 includes a metal base portion 11 as a radiator, a metal reflecting mirror 12 (reflecting mirror portion) superimposed on the metal base portion 11, and a submount 13 mounted at a predetermined position of the metal base portion 11. The LED element 14 mounted on the submount 13 is embedded in a groove (not shown) formed in the metal base portion 11 and arranged on both sides of the submount 13 so as to be in a straight line. The insulating sealing glasses 15a and 15b, the lead portions (metal leads) 16a and 16b disposed so as to overlap the insulating sealing glasses 15a and 15b, and the lead portions 16a and 16b are provided. The insulating sealing glass 17a, 17b, and translucent glass or resin are used, and the sealing member 18 filled in the concave portion of the metal reflecting mirror 12 is provided. The light emitting device 10 has a short cylindrical outer shape as a whole.

  The metal base portion 11 is made of a metal having excellent thermal conductivity, such as copper or aluminum, and has a thickness and a size that can provide a sufficient heat dissipation effect according to the power consumption of the LED element 14.

  Further, the metal base portion 11 has a groove (not shown) formed in a straight line with the LED element 14 as the center. The groove has a depth sufficient to embed the insulating sealing glasses 15a and 15b, the lead portions 16a and 16b, and the insulating sealing glasses 17a and 17b. Since the lead portions 16a and 16b are disposed in the grooves while being sandwiched between the insulating sealing glasses 15a and 15b and 17a and 17b, the lead portions 16a and 16b are insulated from the metal base portion 11 and electrically Never connected. In addition, although the metal base part 11 is made the same size as the metal reflecting mirror 12, it can be made larger than the metal reflecting mirror 12 or can have another shape such as a quadrangle.

  The metal reflector 12 is made of a metal having excellent thermal conductivity, such as copper or aluminum. A mortar-shaped recess is formed in the center, and the inner surface thereof is silver-deposited, chrome or silver plated, silver or white. The reflective surface 12a is formed by finishing in a mirror surface state by surface treatment or the like. Thereby, the light emitted from the lateral direction of the metal reflecting mirror 12 can be effectively guided to the front surface. In addition, since the metal reflector 12 uses a metal having good thermal conductivity such as copper (Cu), the metal reflector 12 functions as a radiator in addition to the function as a reflector.

  For example, high thermal conductivity AlN (aluminum nitride) is used for the submount 13, and a zener diode or the like for preventing element breakdown is provided therein as needed. The submount 13 has a quadrangular outer shape having a step, the LED element 14 is mounted on the uppermost surface, and the tip portions of the lead portions 16a and 16b are mounted on the upper surfaces on both sides of the lower stage. The submount 13 has electrodes (both not shown) on the upper surface and side surfaces. The connection between the electrode on the upper surface and the electrode on the side surface can be made by a wiring layer or a through hole, but the illustration thereof is omitted here.

  The LED element 14 is a high output type made using a material such as GaN or AlInGaP, and its chip size is 0.3 × 0.3 mm (standard size), 1 × 1 mm (large size), or the like. . The LED element 14 is a flip chip (FC) type (here, illustration of the connection portion on the lower surface of the element is omitted) having electrodes or bumps as connection elements, and the sealing member 18 has a high viscosity. Suitable when using glass material. In addition, there is a face-up type using a wire as a connecting element, and it is preferable to use a resin material having a low viscosity for the sealing member 18 when there is a possibility that the wire is deformed in glass sealing.

  The insulating sealing glass 15a, 15b, 17a, 17b may be made of a glass material having a thermal expansion coefficient equivalent to that of the metal base portion 11 and the lead portions 16a, 16b, although it does not matter whether or not it has translucency. The sealing member 18 is made of a translucent silicon resin or a translucent and low-melting glass material.

  Next, assembly of the light emitting device 10 will be described.

  First, the submount 13 is mounted at the center of the metal base 11 and fixed with an adhesive or the like. Next, the insulating sealing glasses 15a and 15b processed into a rod shape are placed in the grooves on the metal base portion 11, and the lead portions 16a and 16b and the insulating sealing glasses 17a and 17b are placed on the insulating sealing glass 15. Are placed on top of each other. Further, the metal reflecting mirror 12 is placed on the exposed surfaces of the insulating sealing glasses 17 a and 17 b and the metal base portion 11. In this state, pressure pressing is performed in a high-temperature atmosphere to fix the insulating sealing glasses 15a, 15b, 17a, 17b, the lead portions 16a, 16b, and the metal reflector 12 to each other.

  Since the lead portions 16a and 16b are insulated at the side surfaces and the upper and lower surfaces other than the tip portions by the insulating sealing glasses 15a, 15b, 17a and 17b, they do not contact the metal base portion 11 and the metal reflector 12. Next, the LED element 14 is mounted on the uppermost surface of the submount 13 and reflowing is performed, whereby solder connection and fixing of the electrode or wiring layer of the submount 13 and the bump or electrode of the LED element 14 are performed. Finally, the sealing member 18 made of a silicone resin material is filled into the mortar-shaped recess of the metal reflector 12. Thus, the light emitting device 10 is completed.

  For example, assuming that the lead portion 16a is connected to the anode side of the LED element 14, the plus side of a DC power source (not shown) is connected to the lead portion 16a, and the minus side is connected to the lead portion 16b. Along with the power supply, the current flows through the path of the lead part 16a → the submount 13 → the LED element 14 → the submount 13 → the lead part 16b, whereby the LED element 14 emits light. The light emitted from the upper surface of the LED element 14 passes through the sealing member 18 and is emitted to the outside. The light emitted from the side surface of the LED element 14 is reflected by the reflecting surface 12a of the metal reflecting mirror 12, and then sealed. The light passes through the member 18 and is emitted to the outside.

According to the first embodiment described above, the following effects are obtained.
(1) Since the lead portions 16a and 16b are insulated by the insulating sealing glasses 15a, 15b, 17a and 17b made of a glass material, the lead portions 16a and 16b are brought into contact with the metal base portion 11 and the metal reflecting mirror 12. Can be prevented.
(2) Since the metal base portion 11 and the metal reflecting mirror 12 are directly joined to the other portions except the laying portions of the lead portions 16a and 16b, the LED element 14 is connected to the submount 13 and the lead portions 16a and 16b. The conducted heat is effectively transferred to the metal base portion 11 and the metal reflector 12 and is radiated by the metal base portion 11 and the metal reflector 12. Therefore, even if the LED element 14 is a high-power type, the thermal efficiency is increased, and the LED element 14, the insulating sealing glass 15a, 15b, 17a, 17b, and the sealing member 18 are not damaged. This effect is particularly remarkable in a large-sized light emitting device.
(3) The light emitting device does not use a resin material having low heat resistance for the holding portion, and the lead portions 16a and 16b are attached to the metal base portion 11 with a glass material. For this reason, it can withstand the reflow furnace treatment for lead-free solder.

  2A and 2B are diagrams illustrating a configuration of a light emitting device according to the second embodiment, in which FIG. 2A is a plan view, FIG. 2B is a cross-sectional view taken along line AA, and FIG. 2C is a cross-sectional view taken along line BB. In addition, common reference numerals are given to portions that are the same as those in the first embodiment.

  The light emitting device 20 according to the second embodiment is different from the light emitting device 10 according to the first embodiment in terms of how to take out the lead portion and the structure of the metal base portion in which the metal reflector is integrated. In other words, the anode and cathode lead portions are taken out from the same direction, and the reflecting mirror portion and the radiator portion are integrally processed by a die or a milling machine or the like.

  The light emitting device 20 includes a metal base portion 21 serving as a radiator and a reflecting mirror, a submount 22 mounted at a predetermined position of the metal base portion 21, an LED element 14 mounted on the submount 22, and a metal base portion. Groove-shaped notch 23 formed in 21, lead parts 24 a and 24 b arranged while securing a predetermined space in the notch 23, and sealing filled in the recess of the metal base 21 The member 18 includes an insulating sealing glass 25 which is processed into a square bar shape and insulates the lead portions 24a and 24b from the metal base portion 11.

  The metal base part 21 is made of the same material as the metal base part 11 and the metal reflecting mirror 12 of the first embodiment. A mortar-shaped reflecting surface 21a is formed on the metal base portion 21 so that the LED element 14 is at the center, and a longitudinal groove-shaped notch portion 23 for arranging the lead portions 24a and 24b in an insulated state is provided. Is formed. An insulating sealing glass 25 is installed at the bottom of the notch 23, and lead parts 24 a and 24 b are installed on the upper surface of the insulating sealing glass 25.

  The submount 22 is made of highly heat-conductive AlN (aluminum nitride), and incorporates a zener diode or the like for preventing element breakdown as required. As shown in FIG. 3B, the step portion of the submount 22 is formed only on one side (the right side in FIG. 2), and on the upper surface of this step portion, the lead portions 24a and 24b in an aligned state are formed. Each tip portion is placed, and the tip surface or the lower surface thereof is connected to an electrode (not shown) on the submount 22 side by soldering or the like.

  Next, a manufacturing procedure of the light emitting device 20 will be described. First, the submount 22 is mounted on the central portion on the metal base portion 21 and fixed with an adhesive or the like. Next, the tip portions of the lead portions 24a and 24b are arranged side by side with the step portion of the submount 22, and in this state, the tip portions of the lead portions 24a and 24b and the electrodes of the submount 22 (or the wiring layer) A predetermined portion) with a heating furnace or the like. Next, the LED element 14 is mounted on the uppermost surface of the submount 22, and reflow is performed to electrically and physically connect the LED element 14 and the circuit portion (electrode, wiring layer, etc.) of the submount 22. In addition, after the LED element 14 is first mounted on the submount 22, the order in which the lead portions 24a and 24b are mounted and connected to the submount 22 may be used.

According to the second embodiment described above, the following effects are obtained.
(1) Since only the lead portions 24a and 24b are disposed in the notch portion 23 and the upper portion is a space, the notch portion 23 does not have the reflecting surface 21a of the metal base portion 21. Therefore, when the LED element 14 is turned on, it is inevitable that slight unevenness in the irradiation light occurs, but the metal base 21 integrates the metal base 11 and the metal reflector 12 of the first embodiment. Because of the structure, the manufacturing process can be reduced, the processing becomes easy, and the cost can be reduced.

  FIG. 3 is a cross-sectional view illustrating a configuration of a light emitting device according to the third embodiment. The third embodiment is characterized in that, in the configuration of the first embodiment, a light emitting device 30 having a heat radiating fin on the upper surface of the metal reflector is used.

  In the light emitting device 30, the metal reflecting mirror 31 bonded to the metal base portion 11 has a plurality of heat radiation fins 32 formed on the uppermost surface portion. The radiation fins 32 are formed at regular intervals in the circumferential direction of the metal reflector 31 with the LED element 14 as the center.

  According to the third embodiment described above, the provision of the radiation fins 32 increases the contact area between the metal reflector 31 and the outside air, and allows effective heat radiation from the side surface. Thus, as a result of increasing the heat dissipation area, a good heat dissipation effect is obtained.

  FIG. 4 is a cross-sectional view showing a configuration of a light emitting device according to the fourth embodiment. The light emitting device 40 of the fourth embodiment is characterized in that the function of the metal base portion and the function of the metal reflector in each of the above embodiments are integrated.

  The light emitting device 40 has a heat sink 41 having a stepped portion, insulators 42a and 42b disposed at positions where the lead portions of the stepped portions are attached, and a tip interposed on the horizontal portion of the insulators 42a and 42b. Lead portions 43a and 43b, a submount 43 mounted on the bottom surface of a mortar-shaped portion (concave portion) formed on the heat sink 41, and an LED element 44 mounted on the top surface of the submount 43. The LED element 44 is configured to include a sealing member 45 made of translucent glass or resin filled in the recess of the submount 43.

  The heat sink 41 is formed using Cu, and a heat radiating fin 41a is formed below the stepped portion, and an outer shape is cylindrical and a mortar-shaped reflecting surface 41b is formed on the inner surface above the stepped portion. The reflecting mirror portion 41c is formed.

  The insulators 42a and 42b have an “L” -shaped cross-sectional shape and are disposed so as to be in close contact with the outer peripheral surface of the reflecting mirror portion 41c. Here, the insulators 42a and 42b are composed of two “L” -shaped parts, but may be a ring having an “L” -shaped cross section. The insulators 42a and 42b are preferably made of a material having heat resistance and insulation, such as glass or ceramic, and have a thermal expansion coefficient equivalent to that of the lead portions 16a and 16b and the heat sink 41.

  The submount 43 uses the same material as the submounts 13 and 23. Here, in order to simplify the drawing, a configuration (wiring conductors, electrodes, through holes, etc.) for connecting the lead portions 16a, 16b and the LED element 44 through the submount 43 is omitted.

  In the light emitting device 40, heat during operation by the LED element 44 is transferred to the heat sink 41 through the submount 43, most of the heat is radiated by the heat radiating fins 41a, and the other part is radiated by the reflecting mirror portion 41c. Since the radiation fin 41a has a large contact area with the outside air, heat exchange is effectively performed.

  According to the fourth embodiment described above, since the heat radiation fins 41a and the reflection surface 41b are integrated, there is no portion that hinders heat transfer, and therefore the heat radiation of the light emitting device 40 compared to the other embodiments. The effect can be enhanced. Furthermore, since the structure is simple, the assembly can be simplified.

  The heat sink 41 described above may be formed of a metal having excellent thermal conductivity other than Cu, and for example, Al, AlN (aluminum nitride), or the like can be used.

  Further, in the fourth embodiment, the heat sink 41 is formed by integrating the metal base portion 11 and the metal reflector 12 in the other embodiments, and the heat dissipating fins 41a are provided on the lower surface thereof. Similarly to the embodiment, the metal base portion 11 and the metal reflecting mirror 12 may be divided and the metal base portion 11 may be provided with the radiation fins 41a.

  FIG. 5 is a diagram illustrating a configuration of a light emitting device according to the fifth embodiment. While each of the above embodiments performs heat dissipation with a metal base and a metal reflector or heat sink, the light emitting device 50 according to the fifth embodiment is configured such that the additional device bears most of the heat dissipation. There is a feature. As the additional device, a heat pipe or a device based on the same principle can be used.

  The light emitting device 50 has the same basic configuration as that of the first embodiment, but the insulating sealing glasses 15a, 15b, 17a, 17b and the lead portions 16a, 16b are not shown. The shape of the submount is simplified.

  In the light emitting device 50, a sheet-like heat sink 51 is used to transfer heat generated by the LED element 14 to the outside. As the sheet-shaped heat sink 51, for example, “Peraflex” (registered trademark) can be used. This sheet heat sink 51 is suitable when the light emitting device 50 cannot be enlarged, when a sufficient heat radiation space cannot be secured in the heat generating portion, or when heat must be radiated outside the housing. Further, the sheet-like heat sink 51 has a feature that it can be used for heat dissipation up to about 10 watts while having a thickness of about 0.6 mm, a width of about 20 mm, and a length of about 150 mm.

  One end of the sheet-shaped heat sink 51 is installed on the upper surface of the metal base 11 (the surface in contact with the submount 13), and a radiator 52 is attached to the other end. Instead of the radiator 52, another member, for example, a housing of an electronic device to which the light emitting device 50 is applied can be used. Further, although the sheet-like heat sink 51 is disposed on the upper surface of the metal base portion 11, it may be disposed on the lower surface of the metal base portion 11.

  According to the fifth embodiment described above, since the sheet-like heat sink 51 is provided on the metal base portion 11, the heat radiation efficiency can be increased even if the thickness of the metal base portion 11 is reduced. Moreover, the temperature rise of the light-emitting device 50 by the LED element 14 lighting for a long time can be prevented. Therefore, it is suitable for a high-output heat generating device.

  In the fifth embodiment, the radiating fins 12a that are not provided in the light emitting device 10 are provided in the metal reflecting mirror. However, a configuration in which the radiating fins 12a are not provided may be used.

  FIG. 6 is a diagram illustrating a configuration of a light emitting device according to a sixth embodiment. In the light emitting device 60, the lead portion 26 is formed of a multilayer ceramic substrate, and the metal base portion 21 and the metal reflection are made of brazing material. The point fixed to the mirror 12 is different from the first embodiment.

  7A and 7B partially show a lead portion according to the sixth embodiment, where FIG. 7A is a side view, FIG. 7B is a plan view of the AA portion of FIG. 7A, and FIG. Sectional drawing in the BB part of (a), (d) is a bottom view in the CC part of (a).

The lead portion 26 is a two-layer substrate made of glass-containing Al ₂ O ₃ (thermal expansion coefficient: 13.2 × 10 ⁻⁶ / ° C.), and has patterns 26a, 26b, 26c, and 26d made of metal. The patterns 26a and 26b are for supplying electric power to the LED element 14, and the contacts with the submount 22 and the external terminal portions are exposed on the surface, but most of them pass through the substrate. The patterns 26c and 26d are not intended for electrical connection, but are intended to be bonded and fixed to the metal base portion 21 or the metal reflector 12 via a brazing material. As the brazing material, an Au—Si-based material (melting temperature: 360 ° C., coefficient of thermal expansion: 13.9 × 10 ⁻⁶ / ° C.) is used.

Since the actual patterns 26a and 26b serving as leads pass through the ceramic which is a heat-resistant insulating member, even if the lead part 26 is fixed using a conductive material, an electrical short circuit does not occur. In addition, since the ceramic member has a thermal expansion coefficient equivalent to that of copper (thermal expansion coefficient: 16 × 10 ⁻⁶ / ° C.), peeling or cracking occurs due to the difference in thermal expansion coefficient even when processing at high temperatures. You can do what you don't.

  Even if the anode and the cathode are pulled out from the same direction, the circuit pattern can be formed on the substrate with high accuracy, so that it is possible to prevent the patterns 26a and 26b from coming into contact and causing an electrical short circuit.

  Furthermore, when the external terminals are electrically connected, heat is difficult to escape from the pattern of the glass-containing Al 2 O 3 substrate that is not high in thermal conductivity, so that soldering is easy.

  In each of the above-described embodiments, the phosphor layer can be installed in the sealing members 18 and 45 to perform wavelength conversion. For example, when the LED layer emits blue light, the phosphor layer is made of Ce (cerium): YAG (yttrium, aluminum, garnet) having a property of emitting yellow light when excited by the blue light. Use.

  In each of the embodiments, the reflecting surfaces of the metal reflecting mirrors 12 and 22, the insulating sealing glasses 17a and 17b at the bottom of the reflecting surface 41b, and the surfaces of the submounts 13, 23 and 43 by plating or vapor deposition with silver or aluminum. To improve the light emission efficiency.

  Further, in each embodiment, the number of LED elements disposed in one sealing member is one, but a multi-light emitting type light emitting device having two or more LED elements may be used. it can. The plurality of LED elements to be mounted may have a configuration in which a plurality of LED elements having different emission colors are provided or a configuration in which a plurality of LED elements having the same emission color are provided. Furthermore, as a drive form of the LED element, all of the plurality of LED elements may be connected in parallel or in parallel in units of groups, or may be connected in series in a plurality of units, or all in series.

  In addition, the sealing members 18 and 45 have a flat upper surface, but may have other shapes, for example, a hemispherical lens shape.

  In each of the above embodiments, the LED elements 14 and 44 have been described as being flip-chip mounted. However, the face-up type (having an anode and a cathode electrode on the upper surface and electrically connected by a wire), an anode The cathode electrodes may be respectively formed on the upper and lower surfaces, and the upper electrode may be electrically connected by a wire. If the flip chip type is not used, the submounts 13, 22, and 43 may be directly mounted on the metal base portions 11 and 21 and the heat sink 41. In addition, although the direction which provided the submount can reduce the stress which arises by the thermal expansion coefficient difference of an LED element, a metal base part, and a heat sink with the heat | fever which an LED element emits, on the other hand, the heat dissipation is more excellent in the direct mount.

It is a figure which shows the structure of the light-emitting device which concerns on the 1st Embodiment of this invention, (a) is a top view, (b) is AA sectional drawing, (c) is BB sectional drawing. It is a figure which shows the structure of the light-emitting device which concerns on 2nd Embodiment, (a) is a top view, (b) is AA sectional drawing, (c) is BB sectional drawing. It is a top view which shows the structure of the light-emitting device which concerns on 3rd Embodiment. It is sectional drawing which shows the structure of the light-emitting device which concerns on 4th Embodiment. It is a figure which shows the structure of the light-emitting device which concerns on 5th Embodiment. It is a figure which shows the structure of the light-emitting device which concerns on 6th Embodiment, (a) is a top view, (b) is AA sectional drawing, (c) is BB sectional drawing. The lead part which concerns on 6th Embodiment is shown partially, (a) is a side view, (b) is a top view in the AA part of (a), (c) is BB of (a). (D) is a bottom view in CC section of (a).

Explanation of symbols

10, 20, 30, 40, 50 Light emitting device 11 Metal base portion 12 Metal reflector 12a Reflecting surface 13 Submount 14 LED element 15a, 15b, 17a, 17b Insulating sealing glass 16a, 16b Lead portion 18 Sealing member 21 Metal Base part 22 Submount 23 Notch part 24a, 24b Lead part (metal lead)
25 Insulating sealing glass 31 Metal reflector 32 Radiation fin 41 Heat sink 41a Radiation fin 41b Reflective surface 41c Reflective mirror part 42a, 42b Insulator 43 Submount 43a, 43b Lead part 44 LED element 45 Sealing member 51 Sheet-like heat sink 52 Heat radiation vessel

Claims (7)

A light emitting element;
One end is electrically connected to the light emitting element, and the lead functions as a terminal for supplying power to the light emitting element.
The light emitting element is mounted, and a metal base portion that dissipates heat of the light emitting element;
A sealing member made of translucent resin or glass covering the light emitting element,
The light-emitting device, wherein the lead is held on the metal base portion by a heat-resistant insulating member having a thermal expansion coefficient equivalent to that of the metal base portion. A submount for connecting the light emitting element and the lead via an electrode or a wiring layer;
The light emitting device according to claim 1, wherein the light emitting element is mounted on the metal base portion via the submount.   The light-emitting device according to claim 1, wherein the heat-resistant insulating member that holds the lead on the metal base portion is a glass material, and the lead is a metal plate material.   The heat-resistant insulating member that holds the lead on the metal base portion is a ceramic material, and the lead is a metal pattern formed on the ceramic material. Light emitting device.   5. The light-emitting device according to claim 1, further comprising a metal reflecting mirror portion that is joined so as to overlap the metal base portion or is integrally processed with the metal base portion.   6. The light emitting device according to claim 1, wherein a heat radiating fin is formed on at least one of the metal base portion and the reflecting mirror portion. 6. The light emitting device according to claim 1, wherein a sheet-shaped heat sink is attached to the metal base portion.