WO2015097955A1 - Lead frame, substrate for led package, reflector member, led package, light emitting device, light emitting system, method for manufacturing substrate for led package, and method for manufacturing led package - Google Patents

Lead frame, substrate for led package, reflector member, led package, light emitting device, light emitting system, method for manufacturing substrate for led package, and method for manufacturing led package Download PDF

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Publication number
WO2015097955A1
WO2015097955A1 PCT/JP2014/005329 JP2014005329W WO2015097955A1 WO 2015097955 A1 WO2015097955 A1 WO 2015097955A1 JP 2014005329 W JP2014005329 W JP 2014005329W WO 2015097955 A1 WO2015097955 A1 WO 2015097955A1
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Prior art keywords
electrode
external connection
led
led package
resin
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PCT/JP2014/005329
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French (fr)
Japanese (ja)
Inventor
佐藤　寿
佳一 柴田
高志 斉藤
小林　一彦
健司 木田
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アピックヤマダ株式会社
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Publication of WO2015097955A1 publication Critical patent/WO2015097955A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Definitions

  • an electrode is provided on the lower surface side of the existing LED package as in the configuration of Patent Document 1, an anode electrode and a cathode electrode (external connection terminal) are provided on the upper surface side of the LED package, that is, the LED chip mounting surface side of the lead frame. ) Is not provided. In this case, since electrical connection to an external device and heat dissipation are required on the same lower surface side, a light emitting device using these LED chips is required to have a complicated configuration in the package arrangement area.
  • the present invention provides a lead frame, an LED package substrate, a reflector member, an LED package, a light emitting device, and an LED package that are easily used by providing external connection terminals of the LED package on the upper surface side (LED chip mounting surface side) of the LED package. , A light emitting system, and a manufacturing method thereof.
  • a lead frame as one aspect of the present invention includes a die pad for mounting an LED chip, a first electrode portion for electrical connection with a first electrode of the LED chip, and a second of the LED chip.
  • a second electrode part for electrical connection with the electrode of the LED, and the first electrode part is bent so as to be exposed from the main surface on the LED chip mounting side of the resin constituting the LED package It has a 1st external connection terminal,
  • the 2nd electrode part has the 2nd external connection terminal bent so that it might be exposed from the principal surface of the LED chip mounting side of the resin.
  • a light emitting system as another aspect of the present invention includes the light emitting device and a heat dissipation structure for performing heat dissipation of the light emitting device.
  • a second external connection terminal is formed, and the resin is molded to expose the first external connection terminal and the second external connection terminal on a main surface of the resin on the LED chip mounting side.
  • a method for manufacturing an LED package comprising: a die pad; a first electrode portion for electrical connection with the first electrode of the LED chip; and an electrical connection with the second electrode of the LED chip.
  • FIG. 6 is a manufacturing process diagram of an LED package substrate in Example 1.
  • FIG. 6 is a manufacturing process diagram of an LED package substrate in Example 1.
  • FIG. 6 is a manufacturing process diagram of an LED package substrate in Example 1.
  • FIG. 4 is a manufacturing process diagram for the LED package in Example 1;
  • FIG. 4 is a manufacturing process diagram for the LED package in Example 1;
  • FIG. 4 is a manufacturing process diagram for the LED package in Example 1;
  • FIG. 12 is a flowchart showing manufacturing steps of an LED package in Example 4.
  • 6 is a plan view of a lead frame in Embodiment 4.
  • FIG. 6 is an enlarged plan view of a lead frame in Example 4.
  • FIG. It is a top view of the board
  • FIG. 6 is an enlarged plan view of an LED package substrate in Example 4.
  • FIG. It is a top view of the board
  • FIG. It is an enlarged plan view of the board
  • FIG. 10 is a manufacturing process diagram for the LED package in Example 5;
  • FIG. 10 is a manufacturing process diagram for the LED package in Example 5; It is a figure which shows the example which mounted the LED package in Example 5 on the board
  • FIG. 9 is an overall plan view of a lead frame in Example 5.
  • 10 is an enlarged cross-sectional view of a lead frame in Example 5.
  • FIG. It is a manufacturing process figure of the LED package in Example 6. It is a manufacturing process figure of the LED package in Example 6. It is a manufacturing process figure of the LED package in Example 6. It is a manufacturing process figure of the LED package in Example 6. It is a manufacturing process figure of the LED package in Example 6.
  • FIG. 16 is a manufacturing process diagram of an LED package as a modification in Example 6;
  • FIG. 16 is a manufacturing process diagram of an LED package as a modification in Example 6;
  • FIG. 10 is a plan view of an LED package as a modified example in Example 9.
  • FIG. 12 is a cross-sectional view of an LED package in Example 10.
  • FIG. 14 is a perspective view of a lead frame in Example 11.
  • FIG. 14 is a perspective view of an LED package substrate in Example 11.
  • FIG. 44 is a manufacturing process diagram of an LED package as a modification of Example 11.
  • FIG. 44 is a manufacturing process diagram of an LED package as a modification of Example 11.
  • FIG. 44 is a manufacturing process diagram of an LED package as a modification of Example 11.
  • FIG. 44 is a manufacturing process diagram of an LED package as a modification of Example 11.
  • FIG. 44 is a manufacturing process diagram of an LED package as a modification of Example 11.
  • FIG. 38 is a plan view of an LED package as another modification example in Example 11.
  • FIG. 38 is a plan view of an LED package as another modification example in Example 11.
  • the lead frame 10 includes a die pad 11 and electrode portions 12 and 13 that are disposed with respect to the die pad 11 via a gap portion G having a predetermined width.
  • the die pad 11 is provided for arranging (mounting) a plurality of LED chips (light emitting chips) as described later.
  • the die pad 11 is provided with portions 14 and 15 whose positions are increased by a predetermined height. The reason why the positions of the parts 14 and 15 are increased is to prevent the die pad 11 from falling off by causing a resin 20 described later to wrap around the parts 14 and 15 below. Of course, when such a countermeasure is unnecessary, the parts 14 and 15 do not need to be raised. In this case, the parts 14 and 15 can also be exposed from the lower surface of the LED package, which will be described later, and the heat dissipation surface can be expanded to improve the heat dissipation.
  • a portion connected to the die pad 11 may be bent and used as a terminal for heat dissipation.
  • the width of the part to be bent and the width of the part to be exposed can be increased for efficient heat dissipation.
  • the electrode portion 12 (first electrode portion) of the lead frame 10 is a region for electrically connecting, for example, an anode electrode (first electrode) as one electrode of the plurality of LED chips.
  • the electrode portion 12 is provided with an external connection terminal 16 (first external connection terminal).
  • the electrode portion 13 (second electrode portion) of the lead frame 10 is a region for electrically connecting, for example, a cathode electrode (second electrode) as the other electrode of the plurality of LED chips.
  • the electrode portion 13 is provided with an external connection terminal 17 (second external connection terminal).
  • FIGS. 2A to 2C and FIGS. 3A to 3D are manufacturing process diagrams of the LED package. The manufacturing process until the LED package 100 is completed is shown in the order of FIGS. 2A to 2C and FIGS. 3A to 3D.
  • a reflector (resin 20) is formed on the lead frame 10 shown in FIG. 1 using a mold that includes one mold 50 and the other mold 60. For this reason, the lead frame 10 is placed on the other mold 60 as shown in FIG. 2A.
  • 4A and 4B are perspective views of the mold (reflector molding mold) in the present embodiment.
  • FIG. 4A shows only the area of the unit lead frame in one mold 50 and FIG. Show.
  • the other mold 60 is used for placing (supporting) the flat portion 62 for placing the die pad 11 of the lead frame 10 and the electrode portions 12 and 13 of the lead frame.
  • An annular projection 66 (support), a projection 64 (support) for placing (supporting) the external connection terminals 16 and 17, and a projection 64a for placing (supporting) the external exposed portion 18 are provided.
  • the protrusions 64, 64a, 66 may not necessarily be formed and may be used in a deformed manner as in the embodiments described later.
  • the lead frame 10 is clamped from the upper surface and the lower surface using the one mold 50 and the other mold 60.
  • the one mold 50 includes a convex portion 52 that mainly presses the die pad 11 of the lead frame 10, and a bottom portion 54 that presses the external connection terminals 16 and 17 of the lead frame 10. Yes.
  • the convex portion 52 is provided with an annular step portion 56 positioned on the bottom 54 side on the outer periphery in order to press the electrode portions 12 and 13 of the lead frame 10. In this case, inner edge portions (inner lead portions) of the electrode portions 12 and 13 are clamped by the annular step portion 56 and the annular protrusion 66.
  • the mold surface of the other mold 60 may be covered with a release film (not shown). Further, as the above-mentioned release film, a film having adhesiveness on the surface directed to the lead frame 10 may be used to prevent flash flash by adhering to the external connection terminals 16 and 17.
  • the space between the one mold 50 and the other mold 60 is filled with the resin 20.
  • a thermosetting resin such as an epoxy resin or a silicone resin
  • the resin 20 contains a filler.
  • the filler may include white pigment such as titanium oxide (TiO 2 or the like), aluminum nitride (AlN), or alumina (Al 203), silica, or the like for light reflection and heat dissipation.
  • the color of the resin 20 is white as a whole (white resin), and the light from the LED chip 30 is effectively reflected and the thermal conductivity is high. Therefore, the heat generated by the LED chip 30 can be efficiently conducted to the outside and radiated.
  • the filler is not described above, and the resin 20 may contain another filler.
  • the color of the resin 20 is not limited to white, and may have another color.
  • FIGS. 3A, 5A, and 5B are perspective views of the LED package substrate (after reflector molding), as seen from the front surface side (first main surface side) and the back surface side (second main surface side). Each figure is shown.
  • the LED chip 30 is a semiconductor chip (LED chip) that emits light of a specific color by applying a forward bias between a pair of electrodes of an anode electrode and a cathode electrode.
  • the emission color varies depending on the material used for the LED chip 30. For example, AlGaAs that emits red light, GaP that emits green light, GaN that emits blue light, and the like are used.
  • the “LED chip” in this specification may be not only an LED chip that emits visible light but also a chip that emits light outside the visible light region such as ultraviolet light and infrared light. Furthermore, instead of the “LED chip”, a chip that receives various kinds of light may be used.
  • a translucent resin 40 is filled in the LED chip mounting region 25 in which the plurality of LED chips 30 are mounted.
  • the liquid translucent resin 40 is dispensed using a dispenser (not shown). Supply.
  • the translucent resin molding die (not shown) is closed, and the LED package substrate is clamped.
  • the liquid translucent resin 40 is pumped, and the translucent resin 40 is supplied to and filled in the LED chip mounting region 25.
  • LED package 100 is manufactured.
  • a blade-type cutting device that cuts along a straight cutting line (dicing line) with a disk-shaped cutting blade can be used.
  • a plurality of sets in which a plurality of LED chips 30 are connected in series can be arranged.
  • an LED package 100 having 96 LED chips 30 mounted thereon can be obtained by connecting eight sets of the same number (12) of LED chips 30 connected in series to each other in parallel. it can. Since the electrode parts 12 and 13 are exposed from the resin 20 at a wide angle (about 170 °) of the edge portion of the LED chip mounting region 25 as in this embodiment, the LED chip 30 is formed as in this embodiment. Wiring can be easily performed when a plurality of sets connected in series are arranged.
  • the wiring of the LED chip 30 not only arranges a plurality of groups connected in series, but also disconnects the wire 35 by connecting two adjacent LED chips 30 in a series connected in series. However, it is possible to avoid a situation in which all the LED chips 30 in the set connected in series do not emit light.
  • the externally exposed portion 18 connected to the die pad 11 is exposed on the same surface as the external connection terminals 16 and 17, it is covered with the translucent resin 40 by measuring the temperature of the externally exposed portion 18.
  • the temperature of the die pad 11 is measured and the temperature of the die pad 11 exceeds the allowable value, the current and voltage flowing to the external connection terminals 16 and 17 can be reduced or the current can be stopped. It is also possible to prevent damage or deterioration due to overheating of the photopolymer 40.
  • a “+” mark and a “ ⁇ ” mark may be printed on the surface of the LED package 100 as polar marks intended to be connected.
  • a polar mark can be given to this surface.
  • a through hole for fixing to the external mounting surface may be provided at a pair of corners where the external connection terminals 16 and 17 are not formed.
  • the other mold 60 is provided with a convex portion having such a length as to contact the bottom 54 of the one mold 50 when the mold is closed, and the through hole through which the convex portion passes is formed in the electrode portion 12 of the lead frame 10. , 13 can be used to form a through hole when the resin 20 is molded.
  • the external mounting surface may be fixed by screwing so that it can be easily and stably fixed at a desired position.
  • the lower surfaces of the external connection terminals 16 and 17 are positioned so as to be separated from the back surface of the LED package 100 through the recesses 26, and the electrode portions 12 and 13 are annular projections 66. Since the LED package 100 is exposed on the back surface of the recessed groove 26b formed by (see FIG. 4B), even if the portion on which the LED package is mounted is made of a conductive metal, the LED chip 30 is made to flow. Since a high voltage does not flow, the area where the LED package 100 is mounted can be a simple heat dissipation structure, and the light-emitting device can be inexpensive.
  • the die pad 11 since the die pad 11 is exposed on the lower surface of the LED package substrate, the die pad 11 can be in close contact with the heat dissipation structure, and can efficiently dissipate heat from the heat dissipation structure at the site where the LED package is mounted.
  • it is a copper alloy with relatively high thermal conductivity compared to a light emitting chip mounted on an aluminum substrate, such as a CoB type high power LED package on which about 100 LED chips are mounted,
  • the thickness can be reduced to about 0.25 to 0.3 mm, the thermal resistance can be lowered, which can contribute to the improvement of heat dissipation.
  • the lead frame 10c includes a die pad 11c, an electrode part 12c (first electrode part) provided on the left side of the die pad 11c, and an electrode part 13c (first electrode) provided on the right side of the die pad 11c. 2 electrode portions).
  • the electrode part 12c has an external connection terminal 16c (first external connection terminal)
  • the electrode part 13c has an external connection terminal 17c (second external connection terminal).
  • a lead 19j for fixing the LED package substrate 21 to the outside is disposed on the outer side of the external connection terminals 16c and 17c disposed on both sides of the die pad 11c, and is exposed to the side surface from the LED package substrate 21. ing. Thereby, when used as a vertically long LED package, the fixing lead 19j can be easily and reliably fixed with a bolt or the like. Further, the fixing lead 19j can be electrically connected to the fixing lead 19j by being connected to the external connection terminals 16c and 17c.
  • a section bar is preferably provided between the die pads 11c.
  • FIGS. 10A to 10D are manufacturing process diagrams of the LED package substrate in this embodiment.
  • the manufacturing process until the completion of the LED package substrate is shown in the order of FIGS. 10A to 10D.
  • the description after the mounting step of the LED chip 30 performed after this step is omitted in this embodiment.
  • a reflector (resin 20) is formed on the lead frame 10a by using a mold including the one mold 50a and the other mold 60a. For this reason, as shown in FIG. 10A, the lead frame 10a is placed on the other mold 60a.
  • the other mold 60a includes a flat portion 62a for mounting the die pad 11a of the lead frame 10a and the electrode portions 12a and 13a.
  • the other mold 60a since both ends of the external connection terminals 16a and 17a are supported by inclined portions connected to the electrode portions 12a and 13a and the suspension leads 19k, the other mold 60a has external connection terminals 16a and 17a.
  • the protrusion 66 (supporting part) for supporting is not provided.
  • the die pad 11 and the electrode portions 12a and 13a are positioned on the same plane, and the projection portion 66 (for supporting (supporting) the electrode portions 12a and 13a on the other mold 60a as in the first embodiment) ( Support section is not provided.
  • FIG. 11 is an explanatory diagram for explaining the configuration of the lead frame and the LED package substrate according to this modification.
  • FIG. 12 is an enlarged perspective view of the LED package substrate of the present modification. In the figure, the area of one LED package is enlarged.
  • the lead frames 10 d ′ and 10 d and the LED package substrate 21 d are shown in the order of processes. In addition, this figure has shown the state in the process of a different progress condition side by side, in order to make an understanding of a process easy.
  • the lead frame 10d ' is a lead frame before processing of the external connection terminals, and has a planar shape.
  • the lead frame 10d has a three-dimensional shape in which the external connection terminals 16d and 17d are formed by bending so as to push up the area for external connection terminals sandwiched between the electrode portions 12d and 13d of the lead frame 10d '. As described above, the region for the external connection terminal is connected to the electrode portions 12d and 13d via the curved connection portion. By extending the connection portion, the external connection terminals 16d and 17d are connected to the electrode portions 12d and 13d. Can be projected.
  • the concave portion 26 and the concave groove 26b opened on the back surface of the LED package can be eliminated.
  • it may be configured to easily withstand the pressure applied to the external connection terminals 16d and 17d.
  • FIG. 13 is a perspective view of the lead frame 10e in the present embodiment.
  • FIG. 14 is a perspective view (surface perspective view) of the reflector member in the present embodiment.
  • FIG. 15 is a perspective view (back perspective view) of the reflector member.
  • a reflector member used for eWLB is used as a member in which one area is arranged in a plurality of rows and a plurality of columns. Become the Lord.
  • the lead frame 10e of this embodiment is configured to include the electrode portions 12e and 13e, and does not include the die pad having the configuration in the above-described embodiment.
  • the electrode part 12e has an external connection terminal 16e configured by bending a part thereof.
  • the electrode part 13e has the external connection terminal 17e comprised by bending the part.
  • the reflector member 22 is formed by molding the resin 20 on the lead frame 10e.
  • the external connection terminals 16e and 17e are not exposed on the back surface as in the first embodiment, and are not supported by the pair of inclined portions as in the second embodiment. For this reason, it is conceivable that the external connection terminals 16e and 17e are sealed in a state where they are not completely exposed from the resin 20. In this case, on the main surface including the external connection terminals 16e and 17e, these can be exposed by removing the resin 20 on the external connection terminals 16e and 17e by grinding or blasting.
  • the reflector member 22 has the electrode portions 12e and 13e exposed on the back surface (second main surface) thereof.
  • the reflector 22 of the present embodiment does not have a portion corresponding to the die pad in each of the embodiments, it is possible to manufacture a thinner LED package.
  • the LED chip molding process in this embodiment is a process equivalent to a process used for eWLB (embedded Wafer level BGA) molding, for example, a reflector member 22 on a carrier that is a plate-like member such as stainless steel, Affixing via an adhesive layer, the necessary number of LED chips are arranged and adhered inside the reflector so that the anode electrode and the cathode electrode are directed to the carrier side.
  • the LED chip is sealed and cured with a translucent resin 40 by transfer molding, compression molding, potting, or the like.
  • the reflector member 22 thus sealed with the LED chip is peeled off from the carrier, so that the electrode portions 12e and 13e and the electrode of the LED chip are exposed on the same surface.
  • a carrier having a high heat dissipation property is used, so that the carrier peeling and rewiring process is performed.
  • the LED package having a heat dissipation structure with high heat dissipation can be manufactured as it is without performing a wiring process or the like by a simple process of dividing into appropriate regions. That is, as described in detail in the present embodiment, the die pad is not an essential configuration in the invention disclosed in this specification, and the back surfaces of the electrode portions 12e and 13e of the lead frame 10e are exposed so as to be electrically connectable. You can see that
  • step S102 a protection element (the Zener diode 32 in FIG. 22A) that protects the LED chip from overcurrent is mounted on the lead frame 10f (die pad 11f).
  • the electrodes may be connected to each other by die-bonding to either of the electrode portions 12f and 13f.
  • step S103 a reflector (resin 20) having a reflective surface R is molded as shown in FIGS.
  • FIG. 19 is a plan view of the LED package substrate (before the primary cut).
  • FIG. 20 is an enlarged plan view of the LED package substrate.
  • the reflector is formed by molding the resin 20 so as to protrude from the lead frame 10f at a position corresponding to one LED package at the upper left shown in each of FIGS.
  • the part to be painted is shown in a solid color.
  • the resin 20 having the same thickness as that of the lead frame 10f is filled in the inside of the dam bar 19i and the gap portion G between the die pad 11f and the electrode portions 12f and 13f as unfilled portions.
  • the resin 20 supplied from the pot and plunger (not shown) via the runner passes through a through gate (not shown) that can be placed on the suspension lead 19g or 19h to form a cavity for forming a reflector. It will be filled.
  • the electrode portions 12f and 13f are formed with communication grooves 12f1 and 13f1 extending from the gap portion G toward the outside of the package. According to this, when the gap 20 is filled with the resin 20 from the cavity for molding the reflector, the gap 20 is filled not only from both ends of the gap G but also from the communication grooves 12f1 and 13f1. Therefore, it is possible to prevent occurrence of unfilling even when the size of the gap G is increased due to a large package.
  • the communication grooves 12f1 and 13f1 are arranged two by two assuming that the resin 20 is filled via the suspension leads 19g, but one or more may be provided. You may arrange.
  • the resin 20 filled inside the dam bar 19i is also cut at the same time, so that a primary cut is made so as to leave the region of the resin 20 filled in FIGS. 19 and 20 and the suspension leads 19h.
  • the external shape of the LED package in a present Example is shape
  • FIG. 21 is a plan view of the LED package substrate (after the primary cut). As shown in FIG. 21, after the primary cutting of the lead frame 10f, adjacent unit lead frames (lead frame portions corresponding to one LED package) are connected only by the suspension leads 19h. For this reason, in the figure, the unit lead frames adjacent only in the vertical direction are connected to each other. Since this hanging lead 19h connects the die pads 11f electrically separated from the electrode portions 12f and 13f, an electrical test using the external connection terminals 16f and 17f for a region corresponding to one LED package. This enables testing more efficiently than testing individualized packages.
  • step S105 a plurality of LED chips 30 are mounted on each die pad 11f (see FIGS. 22A and 22B). As shown in FIGS. 22A and 22B, a plurality of LED chips 30 are mounted on the die pad 11f.
  • the electrode portions 12f and 13f are divided by the communication grooves 12f1 and 13f1, but since they are integrated inside the resin 20, wire bonding can be performed at an arbitrary position even if separated by the communication grooves 12f1 and 13f1. can do.
  • step S106 the LED package substrate after the LED chip is mounted properly emits light when a desired current is passed, whether each LED chip emits light uniformly, or has a predetermined current / voltage characteristic. Perform basic tests that can be performed before sealing. In this case, when some of the LED chips do not emit light appropriately, it is possible to take measures such as exchanging the LED chips or correcting the wiring, thereby improving the yield.
  • step S107 the translucent resin 40 is molded (lens molding is performed).
  • a test may be performed after this step 107.
  • an additional test that can be performed after sealing (lens molding) is performed to determine whether the light emitted through the lens has a desired luminance or color. Can do.
  • the test and the test in step S106 may be performed, or only one of them may be performed. However, the test and the correction are performed as necessary before the final cutting of the lead frame 10f. And the manufacturing process can be carried out easily and efficiently. Note that both of these tests may not be performed, or may be performed after singulation.
  • step S108 the remaining suspension leads 19h are cut in a state where the plurality of LED packages are integrally formed, so that the LED packages are separated into pieces. Thereby, an LED package is manufactured.
  • FIG. 22A is a plan view of the LED package 100f after the secondary cut
  • FIG. 22B is an equivalent circuit of the LED package 100f shown in FIG. 22A.
  • a plurality of LED chips 30 connected in series are connected in parallel
  • a zener diode 32 is connected in parallel.
  • Embodiment 5 of the present invention will be described with reference to FIGS. 23A to 23E to FIGS. 26A and 26B.
  • the LED chip molding process in the present embodiment is similar to the molding process shown in the third embodiment and is characterized by the formation of the reflector. Therefore, this characteristic point will be mainly described.
  • FIGS. 23A to 23E to 25A to 25E are manufacturing process diagrams of the LED package in this example.
  • FIGS. 23A to 23E, FIGS. 24A and 24B, and FIGS. 25A to 25E the LED package 100g is completed.
  • the manufacturing process is shown.
  • 26A and 26B are configuration diagrams of the lead frame 10g in the present embodiment
  • FIG. 26A is an overall plan view of the lead frame 10g
  • FIG. 26B is an enlarged sectional view taken along line BB in FIG. 26A. .
  • the carrier 70 on which the LED chip 30 and the lead frame 10g of FIG. 23A are mounted is clamped using a mold (one mold 50g, the other mold 60g).
  • the carrier 70 is placed in the recess 62g of the other mold 60g.
  • the mold 50g is provided with a cull 151, a runner 152, a gate 153, and cavities 154 and 161.
  • a resin tablet 20a in which a thermosetting resin or the like is formed into a tablet (columnar shape) is disposed inside the pot 69.
  • the cavity 154 is formed as a grid-like groove having a width and depth that can accommodate the lead frame 10g, and the resin 20 is filled by connecting the gate 153.
  • the cavity 161 is configured as a rectangular recess capable of accommodating the LED chip 30, but the gate 153 is not connected and the resin 20 is not filled.
  • the resin tablet 20a in the pot 69 of the other pre-molded mold 60g is melted and the plunger 68 is moved upward to pump the melted resin 20.
  • the resin 20 is sequentially filled into the cull 151, the runner 152, the gate 153, and the cavity 154.
  • the cavity 161 is configured independently from the passage of the resin 20, the inside of the cavity 161 is not filled with the resin 20.
  • the space between the one mold 50g and the other mold 60g is filled with the resin 20.
  • the present embodiment is different from the third embodiment in that the reflector member is not formed in a separate process as in the third embodiment but in a series of forming processes.
  • the translucent resin 40 is supplied into the LED chip mounting region 25g from the dispenser of the translucent resin 40 through the nozzle 82 so as to cover the plurality of LED chips 30.
  • the lens molding may be completed by supplying the translucent resin 40 and curing the LED chip 30 with the translucent resin 40 covered.
  • the process shown by FIG. 24A and 24B is performed.
  • the one mold 55 g and the other mold 65 g are closed to clamp the carrier 70.
  • the lens molding is completed by heating and pressurizing the translucent resin 40 to the cavity piece 57g.
  • the one die 55g and the other die 65g are removed (released) from the LED package substrate, whereby the LED chip 30 after lens molding (after filling with the translucent resin 40) as shown in FIG. 25A.
  • the reflector member are formed on the carrier 70.
  • the rewiring layer 80 is formed on the lower surface of the LED chip 30 by turning upside down as shown in FIG. 25B.
  • the rewiring layer 80 includes a wiring layer that connects the electrodes of the LED chip 30 and connects the electrodes of the LED chip 30 and the electrode portion 12g, and an insulating layer (dielectric layer) that is interposed therebetween to insulate the wiring layer.
  • the external connection terminal on the inner side is cut by using a blade-type cutting device so as to be separated at the center (predetermined position) of the external connection terminal 16g of the lead frame 10g. 16g1 and the external connection terminal 16g2 on the outside can be formed.
  • the external connection terminal 16g may be cut so as to be divided, and the entire resin 20 is not cut.
  • the LED package is obtained by cutting the resin 20 wider than the width of the suspension lead 19l at the position of the suspension lead 19l (position indicated by D). Thereby, an LED package 100g as an example as shown in FIG. 25E is manufactured.
  • a large number of external connection terminals 16g1 and 16g2 can be arranged with high density, and the light emission state of the LED package 100g can be finely controlled. Is also possible.
  • the number and connection pattern of the LED chips connected to the pair of external connection terminals 16g1 and 16g2 can be freely changed according to the configuration of the rewiring layer 80.
  • one LED chip 30 is connected to a pair of external connection terminals. By connecting to the terminals 16g1 and 16g2, all the LED chips 30 can be driven individually.
  • the external connection terminal 16 can be used as one external connection terminal 16 without being cut into a pair of external connection terminals 16g1 and 16g2.
  • the external connection terminal 16 uses a region formed in a rectangular shape by the suspension leads 19l as one package.
  • the external connection terminal 16 has not only a configuration in which the electrode portions 12g are provided on all the suspension leads 19l on four sides, but also two opposing sides.
  • the electrode portion 12g may be provided only on the suspension lead 19l.
  • FIGS. 27A to 27D are manufacturing process diagrams of the LED package in this embodiment, which are shown in time series in the order of FIGS. 27A to 27D.
  • the LED package of the present embodiment can use an appropriate LED package substrate having a die pad among the embodiments described above, and is configured to electrically connect the LED chip without using a wire.
  • the lead frame 10h includes a die pad 11h and electrode portions 12h and 13h.
  • the electrode portions 12h and 13h are provided with external connection terminals 16h and 17h, respectively.
  • the LED package substrate is obtained by molding the resin 20 on the lead frame 10h thus processed.
  • an insulating layer 201 is formed on at least a part of the electrode portions 12h and 13h and the die pad 11h.
  • the insulating layer 201 can be used as a die attach material in a semi-cured state.
  • the insulating layer 201 is preferably transparent or translucent.
  • the insulating layer 201 is, for example, a silicone resin containing an insulating and thermally conductive filler.
  • the insulating layer 201 may not contain a thermally conductive filler, and is not limited to a silicone resin. It is not something.
  • an insulating layer 203 is formed.
  • the insulating layer 203 is formed in a linear shape or a planar shape under the position of the wiring layer 351 to be formed in a subsequent process.
  • the insulating layer 203 is suitably a translucent silicone resin, but is not limited thereto.
  • wiring is performed so as to electrically connect one electrode of one LED chip 30 and the other electrode of the other LED chip 30 among the two adjacent LED chips 30.
  • a layer 351 (a conductive layer) is formed.
  • the wiring layer 351 electrically connects the electrodes of the LED chip 30 located at the end of the plurality of LED chips 30 connected in series to the electrode portion 12h of the lead frame 10h.
  • the light-transmitting resin (lens resin) is molded and separated into pieces as in the above-described embodiment, thereby completing the LED package.
  • FIGS. 28A to 28C are manufacturing process diagrams of an LED package as a modification of the present embodiment, which are shown in time series in the order of FIGS. 28A to 28C.
  • FIG. 28A shows a configuration similar to FIG. 27A, and an insulating layer 201 is formed on the die pad 11h.
  • a plurality of wiring layers 352 are formed on the die pad 11h with the insulating layer 201 interposed therebetween.
  • a plurality of LED chips 30 are mounted.
  • the mounting of the LED chip 30 is completed by mounting the LED chip 30 with the electrodes facing downward (with the electrode surface of the LED chip 30 facing the die pad 11h). At this time, the electrode of the LED chip 30 is electrically connected to the corresponding wiring layer 352.
  • the electrodes of the LED chip 30 and the electrode portions 12h and 13h of the lead frame 10h and the electrodes of the LED chip 30 are electrically connected.
  • a light-transmitting resin (lens resin) is molded and separated into pieces, thereby completing an LED package.
  • the LED chip has an LED chip having two electrodes on the upper surface (first main surface) and the lower surface (second main surface) (two electrodes are provided on different main surfaces).
  • the manufacturing process described with reference to FIGS. 27A to 27D and FIGS. 28A to 28C may be used in combination.
  • FIGS. 29A and 29B to FIG. 29A and 29B and FIGS. 30A and 30B are manufacturing process diagrams (plan views) of the LED package in this example, which are shown in time series in the order of FIGS. 29A and 29B and FIGS. 30A and 30B.
  • wirings functioning as either a common line or a drive line are formed above and below the LED chip 30a.
  • the LED chip 30a By forming one wiring on the lower side and forming the other wiring on the upper side of the LED chip 30a, it is possible to function as a display device using the common line and the drive line.
  • This common line is connected to one electrode of the LED chip 30a and is used, for example, to select a line through which a drive current flows.
  • the drive line is connected to the other electrode of the LED chip 30a in order to connect to each drive power source for flowing a drive current at an arbitrary current or voltage, for example.
  • the LED package having the wiring structure shown in this embodiment can be used appropriately.
  • FIG. 29A shows a plan view of an LED package substrate before LED chip mounting.
  • a plurality of electrode portions 12h and 13h having external connection terminals 16h and 17h, respectively, are formed.
  • a plurality of electrode portions 12h are arranged along the upper side and the lower side of the rectangular die pad 11h.
  • a plurality of electrode portions 13h are arranged along the right and left sides of the die pad 11h.
  • the die pad 11h has a mounting area formed in a rectangular shape so that the LED chips 30a arranged in n rows and m columns can be mounted without waste, and is supported by being connected to the outside at four corners. ing.
  • the electrode portions 12h and 13h are arranged so as to be exposed at opposite sides across the die pad 11h, and can be connected to the LED chip 30a.
  • the plurality of electrode portions 12h are disposed on the side adjacent to the side on which the plurality of electrode portions 13h are disposed.
  • the insulating layer and the wiring layer are continuously formed to form a wiring layer that connects the opposing electrode portions 12h while straddling the insulating layer.
  • a wiring layer 352 as a common line (or drive line) is formed.
  • the LED chip 30 a is mounted so as to be electrically connected to the wiring layer 352.
  • the 1st electrode of LED chip 30a is connected with wiring layer 352 (in this case common line).
  • a wiring layer 351 as a drive line is formed on the upper surface of the LED chip 30a.
  • the second electrode of the LED chip 30a is connected to the wiring layer 351 formed as a drive line (or common line).
  • an insulating layer is preferably formed in the same manner as in FIG. 27C.
  • FIG. 31 is a perspective view of the LED package of the present example.
  • the LED package configured as described above can be used as a display device by connecting to a plurality of external connection terminals 16h and 17h, respectively, on a substrate side terminal having an external drive circuit.
  • the display device can be driven with fewer terminals than in the case where the wiring for connecting the LED chip 30a is not shared, and a package capable of displaying information can be manufactured at low cost.
  • the wiring layer and the insulating layer can be formed by electrostatic spraying or electrostatic coating, for example.
  • the present embodiment is not limited to this, and the wiring layer and the insulating layer may be formed by another coating method that does not use electrostatic force.
  • the wiring layer for example, gold, silver, or an alloy thereof can be used, but the reflectance of light from the LED chip can be improved by using silver.
  • the wiring layer is used regardless of the wire, it is possible to prevent the light emitted from the LED chip 30a from being irregularly reflected by the wire stretched so as to be bent, and to improve the display quality. You can also.
  • the LED package substrate described in the present embodiment may be connected not only to the wiring structure as described above but also to LED chips arranged in a line by a wiring structure using wires. Further, the LED chips mounted on the LED package substrate as shown in FIG. 31 may be connected by wirings other than the wiring constituted by the drive line and the common line. For example, the light emission control may be performed for each area as an area division configuration having a plurality of areas constituted by a plurality of LED chips.
  • each electrode part is provided in the vicinity of each vertex of the hexagon.
  • each electrode portion is provided on the inner side of the hexagonal apex (the end portion of the apex on the plane), and the external connection terminals are electrically connected to each other even if each LED package is contacted on the side surface. It is configured to be arranged so as not to be connected. Thereby, the LED package which can comprise freely the light emitting apparatus of a high density and a high output can be provided.
  • FIG. 32A is a plan view of the lead frame 10k in this embodiment
  • FIG. 32B is a plan view of the LED package substrate in this embodiment
  • FIG. 33 is a perspective view of the LED package substrate in the present embodiment.
  • the hexagonal lead frame 10k (unit lead frame) includes a die pad 11k and electrode portions 12k and 13k.
  • a plurality of external connection terminals 16k (three external connection terminals 16k in this embodiment) are formed on the electrode portion 12k.
  • a plurality of external connection terminals 17k are formed on the electrode portion 13k.
  • the LED packages 100k can be arranged and connected in a one-dimensional manner to be used as the light emitting device 200b.
  • the light emitting device 200b only needs to connect the adjacent external connection terminals 16k and 17k among the adjacent LED packages 100k. That is, the external connection terminals 16k (electrode parts 12k) are connected to each other, and the external connection terminals 17k (electrode parts 13k) are connected to each other. Thereby, the three LED packages 100k are connected in parallel, and a parallel circuit in which current flows from the terminal A to the terminal B in FIG. 34B can be configured.
  • the light emitting devices 200a and 200b have the same number of LED packages 100k arranged in the same manner.
  • the external connection terminals 16k and 17k are provided away from the vertices, the external connection terminals to be wired are selected.
  • the circuit configuration can be easily switched according to the luminance required for the lighting device or the like, the area of the light emitting surface, and the like.
  • FIG. 1 As a structure which provides an external connection terminal in each of each vertex, it can comprise not only a hexagon but another regular polygon package, and it exists in the resin 20 in the square LED package 100 as mentioned above. It can implement similarly by exposing the corner
  • FIG. 1 As a structure which provides an external connection terminal in each of each vertex, it can comprise not only a hexagon but another regular polygon package, and it exists in the resin 20 in the square LED package 100 as mentioned above. It can implement similarly by exposing the corner
  • the external connection terminals 16k and 17k are isosceles triangles and are separated by the same distance from the two sides constituting each vertex, the desired sides of these two sides are sandwiched between them. It can be connected to the external connection terminals 16k and 17k of the arranged LED package 100k. This allows free connection.
  • a through hole for fixing a bolt is formed in the external connection terminals 16k and 17k, a desired arrangement can be performed by a very simple operation such as tightening the wiring with the bolt.
  • the wiring may be connected using solder and copper wire, or may be arranged and used via a fixing member having a wiring structure and a fixing structure.
  • the strength as a light emitting device can be improved by connecting the external connection terminals 16k and 17k which are not electrically connected by a connection means without electrical connection, and separation of LED packages in the light emitting device, etc. Can also be prevented.
  • FIG. 36 is a configuration diagram of an LED package as a modification of the present embodiment.
  • a three-dimensional light-emitting device 200d can be configured by three-dimensionally connecting LED packages 100k at 20 hexagonal positions on a truncated icosahedron that is nearly spherical.
  • the light emitting device 200d is suitably used for a lighting device such as a park or an amusement facility.
  • a total of 32 LED packages can be made to emit light, and a very high luminous flux It can also be set as a light emitting device.
  • a lead frame having a die pad integrated with one electrode portion and the other electrode portion may be manufactured by molding the resin 20 with a mold having a pentagonal cavity. it can.
  • the external connection terminals are arranged at three vertices as one electrode part, and the external connection terminals are arranged at two vertices as the other electrode part, thereby selectively connecting like the hexagonal LED package 100k. Possible LED packages can be obtained.
  • FIG. 37 is a configuration diagram of a light emitting system 300 including the light emitting device 200d in the present embodiment.
  • the light emitting system 300 includes a light emitting device 200d configured as illustrated in FIG. 36 by arranging the LED packages 100k in a three-dimensional manner.
  • the light emitting system 300 includes a heat dissipation structure for radiating heat from the light emitting device 200d.
  • this heat dissipation structure it is preferable to provide the first heat dissipation member 301 inside the LED package 100k in order to suppress the temperature rise of the light emitting device 200d.
  • the light emitting device 200d is accommodated in the reflection cup member 302 (reflector), and the light emitted from the main surface of each LED package 100k is reflected in a predetermined direction to be emitted in a certain direction. Can do.
  • the light-emitting system 300 can also be used for applications such as spotlights and high-lights that require high-luminance and narrow-angle light emission.
  • the reflection cup member 302 is not necessarily required as the light emitting system, and by using this, the light emitting system can be used as a light emitting system capable of emitting light at a wide angle.
  • the heat radiated from the LED package 100k by the first heat radiating member 301 is transferred to the second heat radiating member 304 having a heat radiating structure such as a heat radiating fin configured as irregularities via an arbitrary medium 303 (gas or liquid). Further, by forcibly radiating heat with the heat radiating fan 305, heat can be radiated even when a large number of LED packages 100k with large heat generation are arranged. With such a configuration, it is possible to provide a high luminous flux light emitting system 300 using a high density and high output LED package.
  • FIG. 38 is an explanatory diagram of an example of the arrangement of LED packages and the connection configuration thereof in the light emitting system 300 of the present embodiment.
  • a development view of the LED package 100k when 20 LED packages 100k are connected in parallel is shown.
  • a two-point difference line shown to be connected between the external connection terminals 16k and 17k and a portion indicated by a hatched rectangular area mean an electrical wiring.
  • a connector or the like can be used for this electrical connection.
  • the light emitting diode structures Dg1 to Dg20 constituted by a group of LED chips included in each of the 20 LED packages 100k are connected to the electrode parts 12k and 13k and the hatched rectangular areas in FIG. Are connected between the high-voltage side common wires H1 to H5 and the low-voltage side common wires L1 to L5.
  • the common wiring L1 on the low voltage side includes the electrode portion 13k including the external connection terminal 17k in the two LED packages 100k in the leftmost column in FIG. In the second LED package 100k in the second column from the left, the electrode portion 12k including the external connection terminal 16k and the wiring are configured.
  • 40A and 40B are cutting process diagrams of the LED package substrate in the present embodiment shown as an example.
  • a case will be described in which each of the six sides of the LED package 100k is processed so as to have an inclined surface with a predetermined angle on the side surface.
  • the angle on the smaller corner side formed by the main surfaces of the adjacent LED packages 100k is It will be about 138.2 degrees.
  • the angle between the main surface and the side surface of the LED package 100k is set to 69.1 degrees so that the gap between the LED packages 100k is eliminated and the LED packages 100k are assembled to be supported by the side surfaces.
  • the light emitting device 200d can be manufactured with a high strength structure.
  • the LED package 100k may be arranged to emit light not only when the light emitting surface faces the outer surface but also toward the inner surface.
  • the acute angle side angle between the main surface and the side surface on the back surface of each of the six sides of the LED package 100k may be 69.1 degrees.
  • the suspension leads exposed from the side surface of the package can be prevented from accidentally contacting each other.
  • the suspension lead portion may be cut with a thick blade so that the end portion of the suspension lead is recessed from the side surface of the package by providing a step on the side surface.
  • FIG. 41A and 41B are plan views of a lead frame and an LED package as modifications of the present embodiment.
  • FIG. 41A is a plan view of the lead frame 101 in the present modification
  • FIG. 41B is a plan view of an LED package substrate in the present modification.
  • a hexagonal lead frame 101 (unit lead frame) includes a die pad 11l and electrode portions 121 and 13l. Three external connection terminals 16l and 17l are formed on the electrode portions 12l and 13l, respectively.
  • the LED package substrate according to the present modification has a plurality of LED chip mounting regions, so that the types of LED chips mounted in these regions can be changed, or lenses can be molded to the LED chips.
  • the kind of translucent resin 40 can be changed.
  • the divided shape of the LED chip mounting region may be provided with a plurality of parallel separating portions 21 or may be divided into three or four or more by providing the separating portions so as to cross each other like a cross shape. However, it may be further divided. In such a case, the shape of the lead frame may be such that the pair of electrode portions 12l and 13l are exposed in each of the divided LED chip mounting regions.
  • the central external connection terminals 16l and 17l among the external connection terminals 16l and 17l are divided into external connection terminals 16l1, 16l2, 17l1, and 17l2. For this reason, even when separating by the separating portion 21, the connection terminals 16 l 1, 16 l 2, 17 l 1, 17 l 2 can be arranged without being exposed from the side surface of the resin 20.
  • the light emitting devices 200a, 200b, 200c, and 200d specifically described as described above include a plurality of LED packages 100k that are formed in a polygonal plate shape in plan view and on which the LED chip 30 is mounted.
  • the LED package 100k is electrically connected to the external connection terminal 16k electrically connected to the first electrode of the LED chip 30 and the second electrode of the LED chip, as shown in FIG.
  • the external connection terminals 16k and 17k (at least one of the external connection terminals 16k and 17k) of the external connection terminals 17k are selectively arranged at each corner on the same main surface.
  • the plurality of LED packages 100k are arranged in a one-dimensional shape, a two-dimensional shape, or a three-dimensional shape by arranging the sides close to or in contact with each other.
  • a plurality of LED packages 100k are electrically connected by selectively electrically connecting the external connection terminals 16k and the external connection terminals 17k of the LED packages 100k arranged adjacent to each other across each side.
  • the light emitting devices 200a, 200b, 200c, and 200d are configured.
  • a light-emitting device including the LED packages 100k arranged in a one-dimensional shape, a two-dimensional shape, or a three-dimensional shape is efficiently manufactured and provided. Can do.
  • LED packages can be arranged at high density just by being present. Furthermore, the structure which does not use a lead frame may be sufficient, and the LED package provided with the external connection terminal by mounting a light emitting chip on the metal substrate in which the wiring pattern was formed may be sufficient.
  • the LED package used in the light-emitting device is not limited to that shown in the above-described embodiment, and an LED package that is freely changed may be used as long as it has a configuration necessary to achieve the effect. it can.
  • FIGS. 42A and 42B and FIGS. 43A and 43B are configuration diagrams of the LED package in the present embodiment.
  • FIGS. 43A and 43B are cross-sectional views for explaining a usage form of the LED package in the present embodiment. Note that the cross sections shown in FIG. 42B and FIGS. 43A and 43B show the cross-sectional shapes in the cross section indicated by the arrow in FIG. 42A. Note that the basic shapes of the lead frame 10k and the LED package substrate in this embodiment are the same as those shown in FIG. The description about is omitted.
  • the N pole is a side indicated by hatching of parallel lines
  • the S pole is a side indicated by hatching of crossing lines.
  • each of the six sides of the LED package 100k in the present embodiment two magnets M are arranged so that the same magnetic pole is directed to the side surface of the LED package 100k. Further, by arranging the opposite magnetic poles on the pair of opposite sides of the six sides of the LED package 100k so as to face the side of the package, a plurality of LED packages 100k are connected as shown in FIG. When used, as shown in FIG. 43A, the magnets M arranged on opposite sides in the adjacent LED package 100k attract each other, so that they can be easily arranged and used in a fixed state. In this case, since the magnets M arranged on the opposite sides in the adjacent LED package 100k are not fixed when they have the same magnetic pole, they can be used for preventing erroneous connection.
  • the same effect can be obtained when the LED package 100k is connected and used in a one-dimensional manner.
  • 36 when the LED package 100k is arranged and connected in a three-dimensional manner as shown in FIG. 36, the LED package 100k is cut so that the side surface of the LED package 100k becomes an inclined surface as shown in FIG. 43B.
  • the LED package 100k can be easily assembled in a three-dimensional manner.
  • the example in which the two magnets M are arranged so that the same magnetic pole is directed to the package side surface on one side of the LED package 100k has been described. Even if these two magnets M are directed to opposite magnetic poles, the LED package 100k can be easily arranged and used in a fixed state.
  • the example of the hexagonal LED package 100k has been described. However, even in the case of a square LED package, two magnets M are arranged on one side so that the LED package can be connected in the same manner as in the above example. Can be easily arranged.
  • the electrodes of the LED packages 100k adjacent to each other can be connected by coupling the magnets M to each other.
  • the die pad 11m is provided with a pair of recesses 11m1 and 11m2 at the outer edge, for example, toward the external connection terminals 16m and 17m.
  • the electrode part 12m is formed with an internal connection part 12m1 whose edge part is a convex part so as to be inserted into the concave part 11m1.
  • the electrode part 13m is formed with an internal connection part 13m1 whose edge part is a convex part so as to be inserted into the concave part 11m2.
  • an LED package substrate (an area corresponding to one LED package) having the reflective surface R as shown in FIG. 44B is formed.
  • a step portion R1 is formed except for the positions of the internal connection portions 12m1 and 13m1 in the electrode portions 12m and 13m.
  • the contact area between the die pad 11m and the resin 20 can be increased.
  • step portions R1 are formed on the reflection surface R with the internal connection portions 12m1 and 13m1 being sandwiched therebetween.
  • a wiring pattern P (wiring layer) is formed on the step portion R1 and the internal connection portions 12m1 and 13m1.
  • the wiring pattern P is formed so as to connect any one of the step portions R1 and any one of the internal connection portions 12m1 and 13m1, the wiring from the LED chip is connected to the wiring pattern P.
  • the LED chip can be connected to the external connection terminals 16m and 17m.
  • the contact area between the die pad 11m and the resin 20 can be increased. That is, not only the side surface of the die pad 11m but also the upper surface thereof can be brought into contact with the resin 20. For example, peeling that may occur between the resin 20 and the die pad 11m due to relatively large thermal expansion when the die pad 11m is enlarged. And the size of the LED package can be increased.
  • the step portion R1 may have a height equivalent to that of the LED chip. Further, by providing a plurality of step portions R1, it is possible to arrange a plurality of wiring patterns P and connect the LED chip to a plurality of different external connection terminals. Further, the stepped portion is not necessarily provided, and the wiring pattern P may be formed on the inclined surface of the reflecting surface R. In this case, the wiring pattern P may be formed on the inclined surface by electrostatic coating. The wiring pattern P may be formed by attaching a foil material.
  • a lead frame 10n (unit lead frame) shown in FIG. 45A includes a die pad 11n and three sets of electrode portions 12n and 13n. External connection terminals 16n and 17n are formed on the electrode portions 12n and 13n, respectively.
  • the die pad 11n has a rectangular shape with a recessed edge at a position where the electrode portions 12n and 13n are close to each other.
  • an opening 22 provided for each of the electrode portions 12n and 13n and a pair of wiring pattern molding portions 23 are formed.
  • the opening 22 can be formed, for example, by providing a protrusion for clamping the tip positions of the electrode portions 12n and 13n on a mold for molding the resin 20, and the electrode portions 12n and 13n can be formed on the rectangular reflecting surface R. An opening is formed so that the tip position is exposed.
  • the wiring pattern forming part 23 can be formed, for example, by providing a surface separated from the die pad 11n in a mold for forming the resin 20, and is formed into a shape in which the upper surface of the die pad 11n is covered with the resin 20.
  • each wiring pattern P1 to P3 is formed in three sets of electrode portions 12n and 13n, respectively. Connecting.
  • the LED package substrate is completed.
  • the three primary color LED chips 30R, 30G, and 30B are connected in series to the three rows of wiring patterns P1 to P3, so that the brightness of the three primary color LED chips can be individually varied.
  • LED package 100n can be manufactured. As shown in the figure, by providing the rows of the three primary color LED chips 30R, 30G, and 30B alternately, the color can be uniformly changed over the entire surface of the LED package 100n.
  • three sets of electrode portions 12n and 13n are provided in order to individually change the luminance of the three primary color LED chips. It may be the above.
  • two sets of electrode portions 12n and 13n and two rows of wiring patterns can be provided, and two series of LED chip rows connected in series can be connected to any wiring pattern.
  • a current is supplied to one set of electrode portions 12n and 13n, and when a strong light emission is applied, a current is supplied to both sets of electrode portions 12n and 13n, so that the brightness as an LED package is obtained.
  • a group of LED chips for emitting white light and a group of LED chips for emitting reddish light may be provided, and the color temperature may be adjusted by controlling the amount of current.
  • a configuration such as an LED package 100p shown in FIG. 46 may be used.
  • the electrode portion functioning as the anode side is configured by a pair of electrode portions 12P1 and 12P2
  • the electrode portion functioning as the cathode side is configured by a pair of electrode portions 13P1 and 13P2.
  • a current is supplied only between the external connection terminals 16P1 and 17P1 of the first system connected thereto. Current can also flow between the external connection terminals 16P2 and 17P2 of the second system.
  • the wiring pattern forming portion 23a can be formed as in the LED package 100q shown in FIG.
  • the wiring pattern forming portion 23a extends in the vertical direction in the figure so as to cross between adjacent LED chips so as to be orthogonal to the direction in which the LED chip current flows between the electrode portions 12 and 13. Is done.
  • the wiring pattern molding portion 23a is provided with a plurality of groove portions so as to be separated from the die pad 11n in a mold for molding the resin 20, thereby filling the resin 20 and molding a plurality of rectangular regions in the reflection surface R. be able to.
  • the wiring pattern P By forming the wiring pattern P on the upper surface of the wiring pattern forming portion 23a, the wires 35 connected from the LED chips 30 are connected, and wiring is performed without directly connecting the wires 35 between the LED chips 30. Is possible.
  • the wiring pattern P may be molded so as to connect a plurality of LED chips 30 as shown in the figure, or may be molded so as to connect only a pair of LED chips.
  • money and silver can be used for the wiring pattern P, the light from an LED chip can be reflected efficiently by using silver.
  • the wiring pattern forming portion 23a may be formed separately from the forming of the reflector by electrostatic coating.
  • the first electrode portion has a first external connection terminal that is bent so as to be exposed from the main surface on the LED chip mounting side of the resin that constitutes the LED package.
  • the second electrode portion has a second external connection terminal that is bent so as to be exposed from the main surface (first main surface) on the resin LED chip mounting side.
  • the die pad has a first main surface and a second main surface, and is configured to mount an LED chip on the first main surface, from the second main surface to the first main surface.
  • the first external connection terminal and the second external connection terminal are formed by bending the first electrode portion and the second electrode portion in the first direction, respectively. Is formed.
  • a lead frame, an LED package substrate, a reflector member, an LED package, and an LED package that can be easily used by providing external connection terminals of the LED package on the upper surface side (LED chip mounting surface side) of the LED package; And manufacturing methods thereof.
  • a configuration in which the die pad and any of the electrode portions are connected may be used.
  • the positions of the lead frames 12 and 13 of the lead frame that are bent are half-etched and thinned so that they can be easily bent. By doing so, it can be bent into the shape as described above. Further, the folding position can be thinned by a coining process for thinning by crushing using a die and a punch. In these cases, a separate process for bending the lead frame is not required, and the LED package can be manufactured at low cost.
  • the example in which the externally exposed portion 18 is configured to be connected to the die pad 11 and not electrically connected to the LED chip 30 has been described.
  • An exposed terminal may be provided for testing. In this case, by exposing the electrode parts 12 and 13 to the back side, connection to an external device can be performed using the electrode parts 12 and 13 on the back side.
  • the case where the phosphor is included as the translucent resin 40 or the case where the phosphor is not included has been described.
  • the LED chip 30 is formed with the colorless and transparent translucent resin 40 that does not include the phosphor.
  • a single-layer or multi-layer phosphor layer may be molded, or a single-layer or multi-layer phosphor layer may be formed on the LED chip 30 and then sealed with a colorless and transparent translucent resin 40.
  • the resin 20 used for reflector molding and the translucent resin 40 used for lens molding may be thermoplastic resins instead of thermosetting resins.
  • the resin 20 may enter the concave portion to prevent the resin 20 from falling off.
  • a Zener diode but also an IC chip for a constant current circuit and an electronic component may be mounted on the pad portion and the electrode portions 12 and 13 and connected in parallel.
  • the IC chip and electronic component for the constant current circuit may be connected in series to the LED chip.
  • one of the electrode parts 12 and 13 is divided, and a pad part for connecting an electronic component or an IC chip for driving the LED chip with a constant current, such as a constant current diode or a resistor, is arranged between them.
  • these electronic components for a constant current circuit can be connected in series to the LED chip.
  • FIG. These electronic components may be mounted on the electrode portions 12 and 13 for use.
  • the electronic components for the LED drive circuit described above can be sealed and protected by being placed in the resin 20 of the LED package. In this case, it is not necessary to provide these functions in the external device. Further, it is possible to prevent deterioration due to ultraviolet rays contained in light emitted from the LED chip. Further, for example, it may be sufficient if a driving power source is provided outside, and the LED package can appropriately emit light by simple connection. In this case, it is not necessary to separately design the drive circuit, and an LED chip that can be easily used for a light bulb product can be provided.
  • an example in which one lead frame is appropriately cut into one LED package to form an electrode portion or a die pad portion has been described.
  • a lead frame for a die pad and a lead frame for an electrode portion are described.
  • Two lead frames can also be used.
  • an LED package can be formed by clamping the two lead frames in a separated state with one mold 50 and the other mold 60 and molding the reflector with the resin 20. That is, the lead frame for the electrode part can be pressed against the one mold 50 side by the protrusions 64 and 66 of the other mold 60. Further, the lead frame for the die pad can be pressed against the other mold 60 side by the convex portion 52 of the one mold 50.
  • the lead frame for the electrode part and the lead frame for the die pad can be arranged in a stacked state in the LED package, and these can be used as separate members.
  • the area occupied by the lead frame for the die pad in one package can be increased, and the exposed area of the die pad can be increased, so that the heat dissipation of the LED package can be improved.
  • the example which makes a spherical shape was demonstrated as an example which arrange
  • the external connection terminal may have the same effect even if it is not exposed on the upper surface.
  • the configuration in which the external connection terminals are exposed on the upper surface is not necessarily required, and the external connection terminals may be exposed on the lower surface and connectable to an external device.
  • the external connection terminals are exposed on the upper surface when it is assumed that the wiring configuration can be easily changed or connected to an external heat dissipation structure.
  • the invention should be understood from the correspondence with the effects in the individual configurations.

Abstract

Provided are: an LED package that can be easily used by providing an external connection terminal of the LED package on the upper surface side (LED chip mounting surface side) of the LED package; and a member or the like to be used for the LED package. This lead frame has: a die pad for mounting an LED chip; a first electrode section for electrically connecting to a first electrode of the LED chip; and a second electrode section for electrically connecting to a second electrode of the LED chip. The first electrode section has a first external connecting terminal that is bent to be exposed from a resin main surface on the LED chip mounting side, said resin constituting the LED package, and the second electrode section has a second external connecting terminal that is bent to be exposed from the resin main surface on the LED chip mounting side.

Description

リードフレーム、ＬＥＤパッケージ用基板、リフレクタ部材、ＬＥＤパッケージ、発光装置、発光システム、並びに、ＬＥＤパッケージ用基板及びＬＥＤパッケージの製造方法Lead frame, LED package substrate, reflector member, LED package, light emitting device, light emitting system, and LED package substrate and LED package manufacturing method
本発明は、リードフレーム、ＬＥＤパッケージ用基板、リフレクタ部材、ＬＥＤパッケージ、発光装置、発光システム、並びに、ＬＥＤパッケージ用基板及びＬＥＤパッケージの製造方法に関する。 The present invention relates to a lead frame, an LED package substrate, a reflector member, an LED package, a light emitting device, a light emitting system, and an LED package substrate and an LED package manufacturing method.
従来から、アノード電極とカソード電極との一対の電極間に順バイアスを印加することにより光を放出する発光ダイオード（ＬＥＤ）が知られている。 Conventionally, a light emitting diode (LED) that emits light by applying a forward bias between a pair of electrodes of an anode electrode and a cathode electrode is known.
特許文献１には、平面状のリードフレームにアノード電極及びカソード電極（外部接続端子）を設け、ＬＥＤパッケージの下面側、すなわちリードフレームのＬＥＤチップ実装面とは反対側から外部との電気的接続を可能にするための構成が開示されている。 In Patent Document 1, an anode electrode and a cathode electrode (external connection terminal) are provided on a planar lead frame, and electrical connection is made from the lower surface side of the LED package, that is, the side opposite to the LED chip mounting surface of the lead frame to the outside. A configuration for enabling the above is disclosed.
特開２００９－２０６３７０号公報JP 2009-206370 A
しかしながら、特許文献１の構成のように既存のＬＥＤパッケージとしては下面側に電極が設けられるため、ＬＥＤパッケージの上面側、すなわちリードフレームのＬＥＤチップ実装面側にアノード電極及びカソード電極（外部接続端子）を設けることは行われていない。この場合、外部装置への電気的な接続と放熱とが同じ下面側に必要となるため、これらのＬＥＤチップを利用する発光装置などではパッケージの配置エリアに複雑な構成が求められていた。 However, since an electrode is provided on the lower surface side of the existing LED package as in the configuration of Patent Document 1, an anode electrode and a cathode electrode (external connection terminal) are provided on the upper surface side of the LED package, that is, the LED chip mounting surface side of the lead frame. ) Is not provided. In this case, since electrical connection to an external device and heat dissipation are required on the same lower surface side, a light emitting device using these LED chips is required to have a complicated configuration in the package arrangement area.
一方、発光ダイオードを用いた照明装置などの高出力化の要請に伴い、例えば配線パターンが形成された平坦なアルミ基板上に多数の発光チップを実装し外部接続可能としたＣｏＢ（Ｃｈｉｐ　ｏｎ　Ｂｏａｒｄ）製品も登場してきた。 On the other hand, in response to the demand for higher output of lighting devices using light emitting diodes, for example, CoB (Chip on Board), which allows a number of light emitting chips to be mounted on a flat aluminum substrate on which a wiring pattern is formed and is externally connectable. Products have also appeared.
そこで本発明は、ＬＥＤパッケージの外部接続端子をＬＥＤパッケージの上面側（ＬＥＤチップ実装面側）に設けることで利用が容易なリードフレーム、ＬＥＤパッケージ用基板、リフレクタ部材、ＬＥＤパッケージ、発光装置、及び、発光システム、及び、それらの製造方法を提供する。 Accordingly, the present invention provides a lead frame, an LED package substrate, a reflector member, an LED package, a light emitting device, and an LED package that are easily used by providing external connection terminals of the LED package on the upper surface side (LED chip mounting surface side) of the LED package. , A light emitting system, and a manufacturing method thereof.
本発明の一側面としてのリードフレームは、ＬＥＤチップを搭載するためのダイパッドと、前記ＬＥＤチップの第１の電極と電気的に接続するための第１の電極部と、前記ＬＥＤチップの第２の電極と電気的に接続するための第２の電極部とを有し、前記第１の電極部は、ＬＥＤパッケージを構成する樹脂のＬＥＤチップ搭載側の主面から露出するように折り曲げられた第１の外部接続端子を有し、前記第２の電極部は、前記樹脂の前記ＬＥＤチップ搭載側の主面から露出するように折り曲げられた第２の外部接続端子を有する。 A lead frame as one aspect of the present invention includes a die pad for mounting an LED chip, a first electrode portion for electrical connection with a first electrode of the LED chip, and a second of the LED chip. A second electrode part for electrical connection with the electrode of the LED, and the first electrode part is bent so as to be exposed from the main surface on the LED chip mounting side of the resin constituting the LED package It has a 1st external connection terminal, The 2nd electrode part has the 2nd external connection terminal bent so that it might be exposed from the principal surface of the LED chip mounting side of the resin.
本発明の他の側面としてのＬＥＤパッケージ用基板は、前記リードフレームと、前記第１の電極部及び前記第２の電極部のそれぞれ少なくとも一部の上に成形された樹脂とを有する。 An LED package substrate according to another aspect of the present invention includes the lead frame and a resin molded on at least a part of each of the first electrode portion and the second electrode portion.
本発明の他の側面としてのリフレクタ部材は、ＬＥＤチップからの光を反射するリフレクタを樹脂によって形成されたリフレクタ部材であって、前記ＬＥＤチップの第１の電極と電気的に接続するための第１の電極部と、前記ＬＥＤチップの第２の電極と電気的に接続するための第２の電極部とを有し、前記第１の電極部は、一方の主面において前記樹脂から露出して前記ＬＥＤチップに電気的に接続されるとともに、他方の主面において前記樹脂から露出するように折り曲げられた第１の外部接続端子を有し、前記第２の電極部は、一方の主面において前記樹脂から露出して前記ＬＥＤチップに電気的に接続されるとともに、他方の主面において前記樹脂から露出するように折り曲げられた第２の外部接続端子を有する。 A reflector member according to another aspect of the present invention is a reflector member formed of a resin that reflects light from an LED chip, and is a first member for electrically connecting the first electrode of the LED chip. 1 electrode portion and a second electrode portion for electrically connecting to the second electrode of the LED chip, and the first electrode portion is exposed from the resin on one main surface. And having a first external connection terminal which is electrically connected to the LED chip and is bent so as to be exposed from the resin on the other main surface, and the second electrode portion has one main surface The second external connection terminal is exposed from the resin and electrically connected to the LED chip, and is bent to be exposed from the resin on the other main surface.
本発明の他の側面としてのＬＥＤパッケージは、ダイパッド、第１の電極部、及び、第２の電極部を有するリードフレームと、前記ダイパッドの上に搭載されたＬＥＤチップと、前記第１の電極部及び前記第２の電極部のそれぞれ少なくとも一部の上に成形された樹脂とを有し、前記第１の電極部は、前記ＬＥＤチップの第１の電極と電気的に接続されており、折り曲げて形成された第１の外部接続端子を有し、前記第２の電極部は、前記ＬＥＤチップの第２の電極と電気的に接続されており、折り曲げて形成された第２の外部接続端子を有し、前記第１の外部接続端子及び前記第２の外部接続端子は、前記樹脂のＬＥＤチップ搭載側の主面から露出している。 An LED package as another aspect of the present invention includes a die frame, a lead frame having a first electrode portion and a second electrode portion, an LED chip mounted on the die pad, and the first electrode. And a resin molded on at least a part of each of the second electrode part and the second electrode part, and the first electrode part is electrically connected to the first electrode of the LED chip, A second external connection terminal formed by bending, wherein the second electrode portion is electrically connected to the second electrode of the LED chip, and is bent; The first external connection terminal and the second external connection terminal are exposed from the main surface of the resin on the LED chip mounting side.
本発明の他の側面としてのＬＥＤパッケージは、第１の電極部及び第２の電極部を有するリードフレームと、配線層を介して基板の上に実装されたＬＥＤチップと、前記第１の電極部及び前記第２の電極部のそれぞれ少なくとも一部の上に成形された樹脂とを有し、前記第１の電極部は、前記ＬＥＤチップの第１の電極と電気的に接続されており、折り曲げて形成された第１の外部接続端子を有し、前記第２の電極部は、前記ＬＥＤチップの第２の電極と電気的に接続されており、折り曲げて形成された第２の外部接続端子を有し、前記第１の外部接続端子及び前記第２の外部接続端子は、前記樹脂の主面から露出している。 An LED package according to another aspect of the present invention includes a lead frame having a first electrode portion and a second electrode portion, an LED chip mounted on a substrate via a wiring layer, and the first electrode And a resin molded on at least a part of each of the second electrode part and the second electrode part, and the first electrode part is electrically connected to the first electrode of the LED chip, A second external connection terminal formed by bending, wherein the second electrode portion is electrically connected to the second electrode of the LED chip, and is bent; The first external connection terminal and the second external connection terminal are exposed from the main surface of the resin.
本発明の他の側面としての発光装置は、平面視で多角形の板状に形成されると共にＬＥＤチップが実装された複数のＬＥＤパッケージを備え、前記ＬＥＤパッケージは、前記ＬＥＤチップの第１の電極と電気的に接続された第１の外部接続端子と、該ＬＥＤチップの第２の電極と電気的に接続された第２の外部接続端子との少なくとも一方の外部接続端子が同一の主面における各角部に選択的に配置されて構成され、前記複数のＬＥＤパッケージは該ＬＥＤパッケージの辺同士を近接又は接触させて並べることで一次元状、二次元状または三次元状に配列され、各辺を挟んで隣接して配列された前記ＬＥＤパッケージの前記第１の外部接続端子と前記第２の外部接続端子とを選択的に電気接続することで、前記複数のＬＥＤパッケージが電気的に接続されて構成される。 A light-emitting device according to another aspect of the present invention includes a plurality of LED packages that are formed in a polygonal plate shape in plan view and on which LED chips are mounted, and the LED package includes a first of the LED chips. Main surface having at least one external connection terminal of the first external connection terminal electrically connected to the electrode and the second external connection terminal electrically connected to the second electrode of the LED chip is the same The plurality of LED packages are arranged in a one-dimensional shape, a two-dimensional shape or a three-dimensional shape by arranging the sides of the LED packages close to or in contact with each other. The plurality of LED packages are electrically connected by selectively electrically connecting the first external connection terminals and the second external connection terminals of the LED packages arranged adjacent to each other across each side. Connected configured to.
本発明の他の側面としての発光システムは、前記発光装置と、当該発光装置の放熱を行うための放熱構造とを有する。 A light emitting system as another aspect of the present invention includes the light emitting device and a heat dissipation structure for performing heat dissipation of the light emitting device.
本発明の他の側面としてのＬＥＤパッケージ用基板の製造方法は、ＬＥＤチップを搭載するためのダイパッド、該ＬＥＤチップの第１の電極と電気的に接続するための第１の電極部、及び、該ＬＥＤチップの第２の電極と電気的に接続するための第２の電極部、を有するリードフレームを加工するステップと、前記第１の電極部及び前記第２の電極部のそれぞれ少なくとも一部の上に樹脂を成形するステップとを有し、前記リードフレームを加工する際に、前記第１の電極部を折り曲げて第１の外部接続端子を形成し、前記第２の電極部を折り曲げて第２の外部接続端子を形成し、前記樹脂は、該樹脂のＬＥＤチップ搭載側の主面において、前記第１の外部接続端子及び前記第２の外部接続端子を露出するように成形される。 According to another aspect of the present invention, there is provided a manufacturing method of a substrate for an LED package, a die pad for mounting an LED chip, a first electrode portion for electrically connecting with a first electrode of the LED chip, and Processing a lead frame having a second electrode portion electrically connected to the second electrode of the LED chip; and at least a part of each of the first electrode portion and the second electrode portion Forming a resin on the substrate, and when processing the lead frame, the first electrode portion is bent to form a first external connection terminal, and the second electrode portion is bent. A second external connection terminal is formed, and the resin is molded to expose the first external connection terminal and the second external connection terminal on a main surface of the resin on the LED chip mounting side.
本発明の他の側面としてのＬＥＤパッケージの製造方法は、ダイパッド、ＬＥＤチップの第１の電極と電気的に接続するための第１の電極部、及び、該ＬＥＤチップの第２の電極と電気的に接続するための第２の電極部、を有するリードフレームを加工するステップと、前記第１の電極部及び前記第２の電極部のそれぞれ少なくとも一部の上に樹脂を成形するステップと、前記ダイパッドの上に前記ＬＥＤチップを搭載するステップとを有し、前記リードフレームを加工する際に、前記第１の電極部を折り曲げて第１の外部接続端子を形成し、前記第２の電極部を折り曲げて第２の外部接続端子を形成し、前記樹脂は、該樹脂のＬＥＤチップ搭載側の主面において、前記第１の外部接続端子及び前記第２の外部接続端子を露出するように成形される。 According to another aspect of the present invention, there is provided a method for manufacturing an LED package, comprising: a die pad; a first electrode portion for electrical connection with the first electrode of the LED chip; and an electrical connection with the second electrode of the LED chip. Processing a lead frame having a second electrode part for connecting to each other, molding a resin on at least a part of each of the first electrode part and the second electrode part, Mounting the LED chip on the die pad, and when processing the lead frame, the first electrode portion is bent to form a first external connection terminal, and the second electrode A second external connection terminal is formed by bending a portion, and the resin exposes the first external connection terminal and the second external connection terminal on the main surface of the resin on the LED chip mounting side. Molding It is.
本発明のその他の目的及び効果は以下の実施例において説明される。 Other objects and advantages of the present invention are illustrated in the following examples.
本発明によれば、ＬＥＤパッケージの外部接続端子をＬＥＤパッケージの上面側（ＬＥＤチップ搭載面側）に設けることで利用が容易なリードフレーム、ＬＥＤパッケージ用基板、リフレクタ部材、ＬＥＤパッケージ、発光装置、発光システム、及び、それらの製造方法を提供することができる。 According to the present invention, the lead frame, the LED package substrate, the reflector member, the LED package, the light emitting device, which can be easily used by providing the external connection terminal of the LED package on the upper surface side (LED chip mounting surface side) of the LED package, Light emitting systems and methods for manufacturing them can be provided.
実施例１におけるリードフレームの斜視図である。2 is a perspective view of a lead frame in Embodiment 1. FIG. 実施例１におけるＬＥＤパッケージ用基板の製造工程図である。6 is a manufacturing process diagram of an LED package substrate in Example 1. FIG. 実施例１におけるＬＥＤパッケージ用基板の製造工程図である。6 is a manufacturing process diagram of an LED package substrate in Example 1. FIG. 実施例１におけるＬＥＤパッケージ用基板の製造工程図である。6 is a manufacturing process diagram of an LED package substrate in Example 1. FIG. 実施例１におけるＬＥＤパッケージの製造工程図である。FIG. 4 is a manufacturing process diagram for the LED package in Example 1; 実施例１におけるＬＥＤパッケージの製造工程図である。FIG. 4 is a manufacturing process diagram for the LED package in Example 1; 実施例１におけるＬＥＤパッケージの製造工程図である。FIG. 4 is a manufacturing process diagram for the LED package in Example 1; 実施例１におけるＬＥＤパッケージの製造工程図である。FIG. 4 is a manufacturing process diagram for the LED package in Example 1; 実施例１における金型（リフレクタ成形用金型、一方金型）の斜視図である。It is a perspective view of the metal mold | die (reflector shaping | molding metal mold | die, one metal mold | die) in Example 1. FIG. 実施例１における金型（リフレクタ成形用金型、他方金型）の斜視図である。It is a perspective view of the metal mold | die (reflector shaping | molding metal mold | die, the other metal mold | die) in Example 1. FIG. 実施例１におけるＬＥＤパッケージ用基板（リフレクタ成形後）の斜視図（表面側）である。It is a perspective view (surface side) of the board | substrate for LED packages (after reflector shaping | molding) in Example 1. FIG. 実施例１におけるＬＥＤパッケージ用基板（リフレクタ成形後）の斜視図（裏面側）である。It is a perspective view (back surface side) of the board | substrate for LED packages (after reflector shaping | molding) in Example 1. FIG. 実施例１におけるＬＥＤパッケージの斜視図である。1 is a perspective view of an LED package in Example 1. FIG. 実施例１におけるＬＥＤパッケージの平面図（表面側）である。3 is a plan view (front side) of an LED package in Example 1. FIG. 実施例１におけるＬＥＤパッケージの平面図（裏面側）である。3 is a plan view (back side) of an LED package in Example 1. FIG. 実施例１の変形例としてのリードフレームの平面図である。6 is a plan view of a lead frame as a modification of Example 1. FIG. 実施例１の変形例としてのＬＥＤパッケージ用基板の平面図である。7 is a plan view of an LED package substrate as a modification of Example 1. FIG. 実施例１の別の変形例としてのリードフレーム及びＬＥＤパッケージ用基板の構成を説明するための説明図である。FIG. 6 is an explanatory diagram for explaining a configuration of a lead frame and an LED package substrate as another modification of Example 1; 実施例２におけるＬＥＤパッケージ（ＬＥＤパッケージ用基板）の製造工程図である。6 is a manufacturing process diagram of an LED package (LED package substrate) in Example 2. FIG. 実施例２におけるＬＥＤパッケージ（ＬＥＤパッケージ用基板）の製造工程図である。6 is a manufacturing process diagram of an LED package (LED package substrate) in Example 2. FIG. 実施例２におけるＬＥＤパッケージ（ＬＥＤパッケージ用基板）の製造工程図である。6 is a manufacturing process diagram of an LED package (LED package substrate) in Example 2. FIG. 実施例２におけるＬＥＤパッケージ（ＬＥＤパッケージ用基板）の製造工程図である。6 is a manufacturing process diagram of an LED package (LED package substrate) in Example 2. FIG. 実施例２の変形例としてのリードフレーム及びＬＥＤパッケージ用基板の構成を説明するための説明図である。FIG. 11 is an explanatory diagram for explaining a configuration of a lead frame and an LED package substrate as a modification of Example 2; 実施例２の変形例としてのＬＥＤパッケージ用基板の拡大斜視図である。12 is an enlarged perspective view of an LED package substrate as a modification of Example 2. FIG. 実施例３におけるリードフレームの斜視図である。6 is a perspective view of a lead frame in Embodiment 3. FIG. 実施例３におけるリフレクタ部材の斜視図（表面斜視図）である。It is a perspective view (surface perspective view) of the reflector member in Example 3. 実施例３におけるリフレクタ部材の斜視図（裏面斜視図）である。It is a perspective view (back surface perspective view) of the reflector member in Example 3. FIG. 実施例４におけるＬＥＤパッケージの製造工程を示すフローチャートである。12 is a flowchart showing manufacturing steps of an LED package in Example 4. 実施例４におけるリードフレームの平面図である。6 is a plan view of a lead frame in Embodiment 4. FIG. 実施例４におけるリードフレームの拡大平面図である。6 is an enlarged plan view of a lead frame in Example 4. FIG. 実施例４におけるＬＥＤパッケージ用基板（一次カット前）の平面図である。It is a top view of the board | substrate for LED packages (before a primary cut) in Example 4. FIG. 実施例４におけるＬＥＤパッケージ用基板の拡大平面図である。6 is an enlarged plan view of an LED package substrate in Example 4. FIG. 実施例４におけるＬＥＤパッケージ用基板（一次カット後）の平面図である。It is a top view of the board | substrate for LED packages (after a primary cut) in Example 4. FIG. 実施例４におけるＬＥＤパッケージ用基板（ＬＥＤチップ実装後）の拡大平面図である。It is an enlarged plan view of the board | substrate for LED packages (after LED chip mounting) in Example 4. FIG. 実施例４におけるＬＥＤパッケージ用基板（ＬＥＤチップ実装後）の等価回路図である。It is an equivalent circuit schematic of the board | substrate for LED packages (after LED chip mounting) in Example 4. FIG. 実施例５におけるＬＥＤパッケージの製造工程図である。FIG. 10 is a manufacturing process diagram for the LED package in Example 5; 実施例５におけるＬＥＤパッケージの製造工程図である。FIG. 10 is a manufacturing process diagram for the LED package in Example 5; 実施例５におけるＬＥＤパッケージの製造工程図である。FIG. 10 is a manufacturing process diagram for the LED package in Example 5; 実施例５におけるＬＥＤパッケージの製造工程図である。FIG. 10 is a manufacturing process diagram for the LED package in Example 5; 実施例５におけるＬＥＤパッケージの製造工程図である。FIG. 10 is a manufacturing process diagram for the LED package in Example 5; 実施例５におけるＬＥＤパッケージの製造工程図である。FIG. 10 is a manufacturing process diagram for the LED package in Example 5; 実施例５におけるＬＥＤパッケージの製造工程図である。FIG. 10 is a manufacturing process diagram for the LED package in Example 5; 実施例５におけるＬＥＤパッケージの製造工程図である。FIG. 10 is a manufacturing process diagram for the LED package in Example 5; 実施例５におけるＬＥＤパッケージの製造工程図である。FIG. 10 is a manufacturing process diagram for the LED package in Example 5; 実施例５におけるＬＥＤパッケージの製造工程図である。FIG. 10 is a manufacturing process diagram for the LED package in Example 5; 実施例５におけるＬＥＤパッケージの製造工程図である。FIG. 10 is a manufacturing process diagram for the LED package in Example 5; 実施例５におけるＬＥＤパッケージを基板に実装した例を示す図である。It is a figure which shows the example which mounted the LED package in Example 5 on the board | substrate. 実施例５におけるリードフレームの全体平面図である。FIG. 9 is an overall plan view of a lead frame in Example 5. 実施例５におけるリードフレームの拡大断面図である。10 is an enlarged cross-sectional view of a lead frame in Example 5. FIG. 実施例６におけるＬＥＤパッケージの製造工程図である。It is a manufacturing process figure of the LED package in Example 6. 実施例６におけるＬＥＤパッケージの製造工程図である。It is a manufacturing process figure of the LED package in Example 6. 実施例６におけるＬＥＤパッケージの製造工程図である。It is a manufacturing process figure of the LED package in Example 6. 実施例６におけるＬＥＤパッケージの製造工程図である。It is a manufacturing process figure of the LED package in Example 6. 実施例６における変形例としてのＬＥＤパッケージの製造工程図である。FIG. 16 is a manufacturing process diagram of an LED package as a modification in Example 6; 実施例６における変形例としてのＬＥＤパッケージの製造工程図である。FIG. 16 is a manufacturing process diagram of an LED package as a modification in Example 6; 実施例６における変形例としてのＬＥＤパッケージの製造工程図である。FIG. 16 is a manufacturing process diagram of an LED package as a modification in Example 6; 実施例７におけるＬＥＤパッケージの製造工程図である。It is a manufacturing process figure of the LED package in Example 7. 実施例７におけるＬＥＤパッケージの製造工程図である。It is a manufacturing process figure of the LED package in Example 7. 実施例７におけるＬＥＤパッケージの製造工程図である。It is a manufacturing process figure of the LED package in Example 7. 実施例７におけるＬＥＤパッケージの製造工程図である。It is a manufacturing process figure of the LED package in Example 7. 実施例７におけるＬＥＤパッケージの斜視図である。12 is a perspective view of an LED package in Example 7. FIG. 実施例８におけるリードフレームの平面図である。FIG. 10 is a plan view of a lead frame in Example 8. 実施例８におけるＬＥＤパッケージ用基板の平面図である。10 is a plan view of an LED package substrate in Example 8. FIG. 実施例８におけるＬＥＤパッケージ用基板の斜視図である。10 is a perspective view of an LED package substrate in Example 8. FIG. 実施例８におけるＬＥＤパッケージの利用形態を説明するための平面図である。It is a top view for demonstrating the utilization form of the LED package in Example 8. FIG. 実施例８におけるＬＥＤパッケージの利用形態を説明するための平面図である。It is a top view for demonstrating the utilization form of the LED package in Example 8. FIG. 実施例８におけるＬＥＤパッケージの利用形態を説明するための平面図である。It is a top view for demonstrating the utilization form of the LED package in Example 8. FIG. 実施例９におけるＬＥＤパッケージの利用形態を説明するための斜視図である。It is a perspective view for demonstrating the utilization form of the LED package in Example 9. FIG. 実施例９における発光装置を備えた発光システムの構成図である。FIG. 10 is a configuration diagram of a light emitting system including a light emitting device in Example 9. 実施例９におけるＬＥＤパッケージの配列の一例とその接続構成の説明図である。It is explanatory drawing of an example of the arrangement | sequence of the LED package in Example 9, and its connection structure. 実施例９における発光装置（発光システム）の回路図である。FIG. 10 is a circuit diagram of a light emitting device (light emitting system) in Example 9. 実施例９におけるＬＥＤパッケージ用基板の切断工程図である。It is a cutting process figure of the board | substrate for LED packages in Example 9. FIG. 実施例９におけるＬＥＤパッケージの断面図である。10 is a cross-sectional view of an LED package in Example 9. FIG. 実施例９における変形例としてのリードフレームの平面図である。FIG. 10A is a plan view of a lead frame as a modification example in Example 9. 実施例９における変形例としてのＬＥＤパッケージの平面図である。10 is a plan view of an LED package as a modified example in Example 9. FIG. 実施例１０におけるＬＥＤパッケージの構成図である。It is a block diagram of the LED package in Example 10. FIG. 実施例１０におけるＬＥＤパッケージの断面図である。12 is a cross-sectional view of an LED package in Example 10. FIG. 実施例１０におけるＬＥＤパッケージの利用形態を説明するための断面図である。It is sectional drawing for demonstrating the utilization form of the LED package in Example 10. FIG. 実施例１０におけるＬＥＤパッケージの利用形態を説明するための断面図である。It is sectional drawing for demonstrating the utilization form of the LED package in Example 10. FIG. 実施例１１におけるリードフレームの斜視図である。14 is a perspective view of a lead frame in Example 11. FIG. 実施例１１におけるＬＥＤパッケージ用基板の斜視図である。14 is a perspective view of an LED package substrate in Example 11. FIG. 実施例１１における変形例としてのＬＥＤパッケージの製造工程図である。FIG. 44 is a manufacturing process diagram of an LED package as a modification of Example 11. 実施例１１における変形例としてのＬＥＤパッケージの製造工程図である。FIG. 44 is a manufacturing process diagram of an LED package as a modification of Example 11. 実施例１１における変形例としてのＬＥＤパッケージの製造工程図である。FIG. 44 is a manufacturing process diagram of an LED package as a modification of Example 11. 実施例１１における他の変形例としてのＬＥＤパッケージの平面図である。FIG. 38 is a plan view of an LED package as another modification example in Example 11. 実施例１１における他の変形例としてのＬＥＤパッケージの平面図である。FIG. 38 is a plan view of an LED package as another modification example in Example 11.
以下、本発明の実施例について、図面を参照しながら詳細に説明する。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
まず、図１を参照して、本発明の実施例１におけるリードフレームについて説明する。図１は、本実施例におけるリードフレーム１０の斜視図である。リードフレーム１０は、例えば、銀や金やパラジウムなどにより構成されるメッキ層が表面に形成された銅合金からなる。なお、このメッキ層は、後述する樹脂によるリフレクタを成形した後に成形してもよい。なお、１つのリードフレーム１０は、本図に示す矩形の単位領域（単位リードフレーム）が同じ向きでｎ行ｍ列に配列して接続され、その外周が矩形枠状のフレーム部分（図１７参照）で支持された構造となっている。また、単位リードフレーム間には、領域間のひずみの影響を伝達しないために設けるセクションバーなどを配置してもよい。 First, with reference to FIG. 1, the lead frame in Example 1 of this invention is demonstrated. FIG. 1 is a perspective view of a lead frame 10 in the present embodiment. The lead frame 10 is made of, for example, a copper alloy having a plating layer made of silver, gold, palladium, or the like formed on the surface. In addition, you may shape | mold this plating layer, after shape | molding the reflector by resin mentioned later. One lead frame 10 is connected by arranging the rectangular unit regions (unit lead frames) shown in the figure in the same direction and arranged in n rows and m columns, and the outer periphery of the lead frame 10 has a rectangular frame shape (see FIG. 17). ). Further, a section bar or the like provided in order not to transmit the influence of strain between regions may be disposed between the unit lead frames.
なお、後述する説明においては、ＬＥＤパッケージとして発光する面側を「表面」や「上面」と称し、この反対の面を「裏面」、「下面」と称して説明しているが、「表」、「上」、「裏」、「下」の定義が絶対的な方向を示すわけではない。 In the following description, the surface side that emits light as the LED package is referred to as “front surface” or “upper surface”, and the opposite surface is referred to as “back surface” or “lower surface”. , “Up”, “back”, and “down” do not indicate absolute directions.
本実施例において、リードフレーム１０は、ダイパッド１１、及び、ダイパッド１１に対して所定幅のギャップ部Ｇを介して配置された電極部１２、１３を備えて構成されている。ダイパッド１１は、後述のように複数のＬＥＤチップ（発光チップ）を配列して実装（搭載）するために設けられる。ダイパッド１１には、所定の高さだけ位置を高くした部位１４、１５が設けられている。なお、部位１４、１５の位置を高くするのは、後述する樹脂２０を部位１４、１５の下側に回りこませ、ダイパッド１１の脱落を防止するためである。勿論、このような対応が不要な場合は部位１４、１５を高くしなくてもよい。この場合、部位１４、１５も後述するＬＥＤパッケージの下面から露出させることができ、放熱面を拡げて放熱性を向上させることができる。 In the present embodiment, the lead frame 10 includes a die pad 11 and electrode portions 12 and 13 that are disposed with respect to the die pad 11 via a gap portion G having a predetermined width. The die pad 11 is provided for arranging (mounting) a plurality of LED chips (light emitting chips) as described later. The die pad 11 is provided with portions 14 and 15 whose positions are increased by a predetermined height. The reason why the positions of the parts 14 and 15 are increased is to prevent the die pad 11 from falling off by causing a resin 20 described later to wrap around the parts 14 and 15 below. Of course, when such a countermeasure is unnecessary, the parts 14 and 15 do not need to be raised. In this case, the parts 14 and 15 can also be exposed from the lower surface of the LED package, which will be described later, and the heat dissipation surface can be expanded to improve the heat dissipation.
部位１４には、例えば、過電流からＬＥＤチップを保護する保護素子としてのツェナーダイオード（不図示）が実装される。ツェナーダイオードは、例えば、電極部１２、１３との間をワイヤボンディングにより電気的に接続する。部位１５には、部位１５よりも高い位置に延びた外部露出部１８が設けられている。外部露出部１８は、後述の樹脂２０（ＬＥＤパッケージ）から露出するように設けられる。このようにダイパッド１１には、樹脂２０におけるＬＥＤチップ搭載側の主面から露出するように折り曲げられた外部露出部１８（第３の外部接続端子）が設けられている。外部露出部１８は、例えば、温度測定端子として用いることが可能である。また、外部露出部１８と同様にダイパッド１１に連結する部位を折り曲げて放熱用の端子として用いてもよい。この場合、折り曲げる部分の幅と露出させる部分の幅を広くすることで効率的に放熱に用いることもできる。 For example, a Zener diode (not shown) as a protection element that protects the LED chip from an overcurrent is mounted on the portion 14. For example, the Zener diode is electrically connected to the electrode portions 12 and 13 by wire bonding. The part 15 is provided with an externally exposed portion 18 that extends to a position higher than the part 15. The external exposed portion 18 is provided so as to be exposed from a resin 20 (LED package) described later. Thus, the die pad 11 is provided with the external exposed portion 18 (third external connection terminal) that is bent so as to be exposed from the main surface of the resin 20 on the LED chip mounting side. The external exposure part 18 can be used as a temperature measurement terminal, for example. Further, similarly to the externally exposed portion 18, a portion connected to the die pad 11 may be bent and used as a terminal for heat dissipation. In this case, the width of the part to be bent and the width of the part to be exposed can be increased for efficient heat dissipation.
リードフレーム１０の電極部１２（第１の電極部）は、複数のＬＥＤチップの一方の電極として例えばアノード電極（第１の電極）を電気的に接続するための領域である。電極部１２には、外部接続端子１６（第１の外部接続端子）が設けられている。リードフレーム１０の電極部１３（第２の電極部）は、複数のＬＥＤチップの他方の電極として例えばカソード電極（第２の電極）を電気的に接続するための領域である。電極部１３には、外部接続端子１７（第２の外部接続端子）が設けられている。 The electrode portion 12 (first electrode portion) of the lead frame 10 is a region for electrically connecting, for example, an anode electrode (first electrode) as one electrode of the plurality of LED chips. The electrode portion 12 is provided with an external connection terminal 16 (first external connection terminal). The electrode portion 13 (second electrode portion) of the lead frame 10 is a region for electrically connecting, for example, a cathode electrode (second electrode) as the other electrode of the plurality of LED chips. The electrode portion 13 is provided with an external connection terminal 17 (second external connection terminal).
外部接続端子１６、１７は、アウターリードとして機能し、電極部１２、１３のそれぞれに対して所定の高さだけ上側に位置するように折り曲げられて形成されている。後述のように、外部接続端子１６、１７は、ＬＥＤパッケージを構成する樹脂のＬＥＤチップ搭載側の主面（第１の主面）において露出するように折り曲げられており、かつ、外部装置と電気的な接続が可能に構成されている。なお、外部接続端子１６、１７には、外部接続を確実又は／及び容易に行うため、貫通孔が形成されていてもよい。また、この貫通孔には雌ねじが形成されていてもよい。これらの貫通孔は後述する樹脂２０を成形する工程においては金型にクランプする場合には、その貫通孔に樹脂２０が充填されず、樹脂２０の除去工程を不要とすることができる。 The external connection terminals 16 and 17 function as outer leads, and are formed to be bent so as to be positioned above the electrode portions 12 and 13 by a predetermined height. As will be described later, the external connection terminals 16 and 17 are bent so as to be exposed on the main surface (first main surface) on the LED chip mounting side of the resin constituting the LED package, and are electrically connected to the external device. Connection is possible. Note that through holes may be formed in the external connection terminals 16 and 17 in order to reliably or / and easily perform external connection. Moreover, the internal thread may be formed in this through-hole. When these through-holes are clamped in a mold in the step of molding the resin 20 described later, the through-holes are not filled with the resin 20, and the resin 20 removal step can be made unnecessary.
なお、電極部１２、１３の折り曲げ方法については、同図に示すように、直角以下の角度で起立させるように折り曲げた後に反対向きに同等の角度に折り返してもよいし、一回起立させるように折り曲げた後に同じ方向に再度折り曲げることにより、第１の主面において露出するように折り曲げてもよい。この場合、後述する樹脂２０（図５Ａ，５Ｂ参照）の側面から露出させるように延在させて成形した後に、露出した電極部１２、１３を樹脂２０の側面で上方に折り返して樹脂２０上に外部接続端子を配置して接続可能としてもよいし、樹脂２０の内部で折り曲がった構造となるようにしてもよい。なお、本明細書におけるリードフレームの「折り曲げ」とは、同図に示すように、角ばらせるように屈曲させるだけではなく曲線状に折り曲げる概念も含むものとし、外部接続端子１６、１７を支持する構成などに応じて折り曲げ形状は任意に選択することができる。 As for the bending method of the electrode portions 12 and 13, as shown in the figure, the electrode portions 12 and 13 may be folded so as to stand up at an angle equal to or less than a right angle, and then folded back to the same angle in the opposite direction, or may be raised once. It is also possible to bend it so that it is exposed at the first main surface by bending it again in the same direction. In this case, after being formed so as to be exposed from the side surface of the resin 20 (see FIGS. 5A and 5B), which will be described later, the exposed electrode portions 12 and 13 are folded upward on the side surface of the resin 20 and placed on the resin 20. An external connection terminal may be arranged so as to be connectable, or may be bent inside the resin 20. In the present specification, “bending” of the lead frame includes not only a bent shape but also a bent shape as shown in the figure, and supports the external connection terminals 16 and 17. The bent shape can be arbitrarily selected according to the configuration and the like.
電極部１２には、吊りリード（タイバー）１９ａ、１９ｂ、１９ｃが設けられている。また電極部１３には、吊りリード１９ｄ、１９ｅ、１９ｆが設けられている。リードフレーム１０（１つのＬＥＤパッケージを構成する単位リードフレーム）は、各々の吊りリード１９ａ～１９ｆを介して、隣接するリードフレーム（不図示）と接続されている。このため、後述のリフレクタ成形の際には、複数の単位リードフレームが一体的に金型にクランプされ、樹脂成形が行われることで、いわゆるＭＡＰ（Ｍｏｌｄ　Ａｒｒａｙ　Ｐａｃｋａｇｅ）成形が可能である。ただし本実施例はこれに限定されるものではなく、図１に示されるリードフレーム１０（一つのＬＥＤパッケージを構成する単位リードフレーム）を金型にクランプして樹脂成形を行うように構成してもよい。 The electrode portion 12 is provided with suspension leads (tie bars) 19a, 19b, and 19c. The electrode portion 13 is provided with suspension leads 19d, 19e, and 19f. The lead frame 10 (unit lead frame constituting one LED package) is connected to an adjacent lead frame (not shown) via the respective suspension leads 19a to 19f. For this reason, in the later-described reflector molding, a plurality of unit lead frames are integrally clamped to a mold and resin molding is performed, so that so-called MAP (Mold Array Package) molding is possible. However, the present embodiment is not limited to this, and the lead frame 10 (unit lead frame constituting one LED package) shown in FIG. 1 is clamped to a mold and resin molding is performed. Also good.
次に、図２Ａ～２Ｃ及び図３Ａ～３Ｄを参照して、本実施例におけるＬＥＤパッケージ（ＬＥＤパッケージ）の製造工程について説明する。図２Ａ～２Ｃ及び図３Ａ～３Ｄは、ＬＥＤパッケージの製造工程図であり、図２Ａ～２Ｃ、図３Ａ～３Ｄの順にＬＥＤパッケージ１００の完成までの製造工程が示されている。 Next, with reference to FIGS. 2A to 2C and FIGS. 3A to 3D, the manufacturing process of the LED package (LED package) in this embodiment will be described. 2A to 2C and FIGS. 3A to 3D are manufacturing process diagrams of the LED package. The manufacturing process until the LED package 100 is completed is shown in the order of FIGS. 2A to 2C and FIGS. 3A to 3D.
まず、一方金型５０及び他方金型６０を備えて構成される金型を用いて、図１に示されるリードフレーム１０にリフレクタ（樹脂２０）を成形する。このため、図２Ａに示されるように、リードフレーム１０を他方金型６０の上に載置する。図４Ａ，４Ｂは、本実施例における金型（リフレクタ成形用金型）の斜視図であり、図４Ａは一方金型５０、図４Ｂは他方金型６０における単位リードフレームの領域分のみをそれぞれ示している。 First, a reflector (resin 20) is formed on the lead frame 10 shown in FIG. 1 using a mold that includes one mold 50 and the other mold 60. For this reason, the lead frame 10 is placed on the other mold 60 as shown in FIG. 2A. 4A and 4B are perspective views of the mold (reflector molding mold) in the present embodiment. FIG. 4A shows only the area of the unit lead frame in one mold 50 and FIG. Show.
図２Ａ及び図４Ｂに示されるように、他方金型６０は、リードフレーム１０のダイパッド１１を載置するための平面部６２、リードフレームの電極部１２、１３を載置（支持）するための環状の突起部６６（支持部）、外部接続端子１６、１７を載置（支持）するための突起部６４（支持部）、及び、外部露出部１８を載置（支持）する突起部６４ａを備えている。なお、要求される仕様や対応する部材構成に応じて、後述する実施例のように、突起部６４、６４ａ、６６は、必ずしも形成されていなくてもよく、変形されて用いられてもよい。 As shown in FIGS. 2A and 4B, the other mold 60 is used for placing (supporting) the flat portion 62 for placing the die pad 11 of the lead frame 10 and the electrode portions 12 and 13 of the lead frame. An annular projection 66 (support), a projection 64 (support) for placing (supporting) the external connection terminals 16 and 17, and a projection 64a for placing (supporting) the external exposed portion 18 are provided. I have. Depending on the required specifications and the corresponding member configuration, the protrusions 64, 64a, 66 may not necessarily be formed and may be used in a deformed manner as in the embodiments described later.
続いて、図２Ｂに示されるように、一方金型５０及び他方金型６０を用いてリードフレーム１０を上面及び下面側からクランプする。図２Ｂ及び図４Ａに示されるように、一方金型５０は、リードフレーム１０のうち主としてダイパッド１１を押し付ける凸部５２、及び、リードフレーム１０の外部接続端子１６、１７を押し付ける底部５４を備えている。また、凸部５２には、リードフレーム１０の電極部１２、１３を押し付けるために外周において底部５４側に位置する環状段部５６が設けられている。この場合、電極部１２、１３の内側の縁部分（インナーリード部）が環状段部５６と環状の突起部６６とによってクランプされる。また、外部接続端子１６、１７が底部５４と突起部６４とによってクランプされる。さらに、外部露出部１８は底部５４と突起部６４ａとによってクランプされる。なお、要求される仕様や対応する部材構成に応じて、後述する実施例のように、この環状段部５６は必ずしも形成されていなくてもよく、電極部１２、１３の内側の縁部分（インナーリード部）のみに設けてもよい。さらに、一方金型５０には、突起部６４と重なる位置に突起部を設けて、この突起部と突起部６４とで外部接続端子１６、１７を設けるように構成してもよい。この場合、外部接続端子１６、１７は樹脂２０の表側の面から若干凹まされた位置で露出されることになる。このように、外部接続端子１６、１７は、それが樹脂２０の表面に露出していれば、外部接続端子１６、１７に接続される外部装置の端子構造により、凹んだ位置に配置されていても、突起した位置に配置されていても、樹脂２０の表面から外部装置に接続することは可能である。 Subsequently, as shown in FIG. 2B, the lead frame 10 is clamped from the upper surface and the lower surface using the one mold 50 and the other mold 60. As shown in FIGS. 2B and 4A, the one mold 50 includes a convex portion 52 that mainly presses the die pad 11 of the lead frame 10, and a bottom portion 54 that presses the external connection terminals 16 and 17 of the lead frame 10. Yes. The convex portion 52 is provided with an annular step portion 56 positioned on the bottom 54 side on the outer periphery in order to press the electrode portions 12 and 13 of the lead frame 10. In this case, inner edge portions (inner lead portions) of the electrode portions 12 and 13 are clamped by the annular step portion 56 and the annular protrusion 66. In addition, the external connection terminals 16 and 17 are clamped by the bottom 54 and the protrusion 64. Further, the externally exposed portion 18 is clamped by the bottom portion 54 and the protruding portion 64a. Depending on the required specifications and the corresponding member configuration, the annular step portion 56 does not necessarily have to be formed as in the embodiments described later, and the inner edge portions (inner portions of the electrode portions 12 and 13). You may provide only in a lead part. Further, the mold 50 may be configured such that a protrusion is provided at a position overlapping with the protrusion 64, and the external connection terminals 16 and 17 are provided by the protrusion and the protrusion 64. In this case, the external connection terminals 16 and 17 are exposed at a position slightly recessed from the front surface of the resin 20. Thus, if the external connection terminals 16 and 17 are exposed on the surface of the resin 20, the external connection terminals 16 and 17 are arranged at recessed positions due to the terminal structure of the external device connected to the external connection terminals 16 and 17. However, even if it is arranged at the protruding position, it is possible to connect to the external device from the surface of the resin 20.
凸部５２の形状は、図４Ａ，４Ｂに示されるように、平面視で外形円形に構成されるほかにも、楕円形状、四角形状、六角形状、または、八角形状のような一般的な多角形の他にも、任意の形状とすることができる。また、突起部６４の形状は、外部接続端子１６、１７の形状に合わせて二等辺三角形とする例について図示したが、任意に設定できる。例えば、突起部６４の形状は、外部接続端子１６、１７に接続用の貫通孔を形成するときは、ナットやボルトを挿入可能な穴部を形成するために、六角形としてもよい。 As shown in FIGS. 4A and 4B, the shape of the convex portion 52 is not limited to a circular shape in plan view, but may be a general many shape such as an elliptical shape, a rectangular shape, a hexagonal shape, or an octagonal shape. In addition to the square shape, any shape can be used. Moreover, although the shape of the protrusion part 64 illustrated about the example made into an isosceles triangle according to the shape of the external connection terminals 16 and 17, it can set arbitrarily. For example, the protrusion 64 may have a hexagonal shape in order to form a hole into which a nut or bolt can be inserted when a through hole for connection is formed in the external connection terminals 16 and 17.
続いて、図２Ｃに示されるように、リードフレーム１０の外部接続端子１６、１７を一方金型５０のクランプ面で押し付けた状態で樹脂２０を成形する。このとき樹脂２０は、外部接続端子１６、１７を他方金型６０に設けられた突起部６４（支持部）で支持した状態で成形される。 Subsequently, as shown in FIG. 2C, the resin 20 is molded in a state where the external connection terminals 16 and 17 of the lead frame 10 are pressed against the clamp surface of the one mold 50. At this time, the resin 20 is molded in a state where the external connection terminals 16 and 17 are supported by the protrusions 64 (support portions) provided on the other mold 60.
樹脂２０は、熱硬化性樹脂等をタブレット（円柱）状に成形した樹脂タブレットを、トランスファ機構を用いて溶融させて圧送することにより、一方金型５０と他方金型６０との間が樹脂２０で充填される。本実施例において、一方金型５０の金型面を適度な弾性を有し樹脂２０の離型性の高いリリースフィルム（不図示）で覆ってから、リリースフィルムを介して一方金型５０及び他方金型６０でリードフレーム１０をクランプすることもできる。これによれば、ダイパッド１１、後述するようにＬＥＤチップ３０からワイヤ３５が接続される電極部１２、１３の内周部分、及び、外部接続端子１６、１７を、弾性のあるリリースフィルムに押し付けることで、フラッシュばりの発生を防止し、確実に露出させることが可能となる。この場合、例えばデフラッシュ工程を省略することもできる。なお、他方金型６０の金型面をリリースフィルム（不図示）で覆ってもよい。また、上述のリリースフィルムとしては、リードフレーム１０に向けられる面に粘着性を有するものを用いることで、外部接続端子１６、１７に接着させることでフラッシュばりの発生を防止してもよい。 The resin 20 is obtained by melting and pumping a resin tablet obtained by molding a thermosetting resin or the like into a tablet (cylindrical) shape using a transfer mechanism, so that the resin 20 is between the one mold 50 and the other mold 60. Filled with. In the present embodiment, the mold surface of the one mold 50 is covered with a release film (not shown) having moderate elasticity and high releasability of the resin 20, and then the one mold 50 and the other through the release film. The lead frame 10 can also be clamped with the mold 60. According to this, the die pad 11, the inner peripheral portions of the electrode portions 12 and 13 to which the wires 35 are connected from the LED chip 30 and the external connection terminals 16 and 17 are pressed against an elastic release film as will be described later. Thus, it is possible to prevent flash flash and to reliably expose the flash. In this case, for example, the deflash process can be omitted. The mold surface of the other mold 60 may be covered with a release film (not shown). Further, as the above-mentioned release film, a film having adhesiveness on the surface directed to the lead frame 10 may be used to prevent flash flash by adhering to the external connection terminals 16 and 17.
本実施例では、ポット（不図示）に供給された樹脂２０がトランスファ機構に設けられたプランジャ（不図示）によって圧送されることにより、溶融した樹脂２０は、図示しないランナやゲートを介して圧送され、一方金型５０と他方金型６０との間に形成される図２Ｂに図示の空間（キャビティ）へ供給される。また、樹脂２０は、ダイパッド１１と電極部１２、１３との間のギャップ部Ｇにも充填される。このように、樹脂タブレットが溶融して樹脂２０となり、一方金型５０と他方金型６０で形成された空間に注入される。 In this embodiment, the resin 20 supplied to the pot (not shown) is pumped by a plunger (not shown) provided in the transfer mechanism, so that the molten resin 20 is pumped via a runner or gate (not shown). And supplied to the space (cavity) shown in FIG. 2B formed between the one mold 50 and the other mold 60. The resin 20 is also filled in the gap portion G between the die pad 11 and the electrode portions 12 and 13. In this way, the resin tablet is melted to become the resin 20 and is injected into the space formed by the one mold 50 and the other mold 60.
この結果、図２Ｃに示されるように、一方金型５０と他方金型６０との間の空間は、樹脂２０により充填される。本実施例の樹脂２０としては、例えば、エポキシ樹脂やシリコーン樹脂などの熱硬化性樹脂が用いられる。好ましくは、樹脂２０には、フィラーが含有されている。このフィラーとしては、例えば、光の反射及び放熱のために酸化チタン（ＴｉＯ２等）、窒化アルミ（ＡｌＮ）、またはアルミナ（Ａｌ２０３）などの白色顔料やシリカ等を含むことができる。酸化チタンや窒化アルミのような白色顔料を含有している場合、樹脂２０の色は全体として白色（白樹脂）となり、ＬＥＤチップ３０からの光が効果的に反射されるとともに、熱伝導性が高いため、ＬＥＤチップ３０によって発せられた熱を効率的に外部に伝導して放熱することが可能となる。ただし、フィラーは上述したものではなく、樹脂２０に他のフィラーを含有させてもよい。また、樹脂２０の色は白色に限定されるものではなく、他の色を有するものであってもよい。 As a result, as shown in FIG. 2C, the space between the one mold 50 and the other mold 60 is filled with the resin 20. As the resin 20 of this embodiment, for example, a thermosetting resin such as an epoxy resin or a silicone resin is used. Preferably, the resin 20 contains a filler. Examples of the filler may include white pigment such as titanium oxide (TiO 2 or the like), aluminum nitride (AlN), or alumina (Al 203), silica, or the like for light reflection and heat dissipation. When a white pigment such as titanium oxide or aluminum nitride is contained, the color of the resin 20 is white as a whole (white resin), and the light from the LED chip 30 is effectively reflected and the thermal conductivity is high. Therefore, the heat generated by the LED chip 30 can be efficiently conducted to the outside and radiated. However, the filler is not described above, and the resin 20 may contain another filler. Moreover, the color of the resin 20 is not limited to white, and may have another color.
樹脂成形後、一方金型５０及び他方金型６０からリードフレーム１０を取り外す（離型する）と、図３Ａ、図５Ａ、及び、図５Ｂに示されるように、リフレクタ成形後のＬＥＤパッケージ用基板が得られる。以上のような工程により、ＬＥＤチップの実装用領域を複数有するＬＥＤパッケージ用基板の一形態を成形することができる。図５Ａ、５Ｂは、ＬＥＤパッケージ用基板（リフレクタ成形後）の斜視図であり、ＬＥＤパッケージ用基板を表面側（第１の主面側）及び裏面側（第２の主面側）から見た図をそれぞれ示している。 After the resin molding, when the lead frame 10 is removed (released) from the one mold 50 and the other mold 60, as shown in FIGS. 3A, 5A, and 5B, the LED package substrate after the reflector molding Is obtained. Through the steps as described above, one form of the LED package substrate having a plurality of LED chip mounting regions can be formed. 5A and 5B are perspective views of the LED package substrate (after reflector molding), as seen from the front surface side (first main surface side) and the back surface side (second main surface side). Each figure is shown.
ＬＥＤパッケージ用基板において、樹脂２０が形成されていない露出した部分（ダイパッド１１から電極部１２、１３の縁部分まで）は、ＬＥＤチップ実装用領域２５を構成する。また、本実施例の樹脂２０はＬＥＤパッケージ用基板及びＬＥＤパッケージの外形を構成すると共に、内面に反射面Ｒを有するリフレクタを構成する。リフレクタは、リードフレーム１０におけるＬＥＤチップ３０の搭載面（図３Ａ中の上側面、図５Ａに示される面）に形成され、ＬＥＤチップ３０からの光を上方に反射させる機能を有する。また、この部位は、別の機能として考えれば、後述する透光性樹脂４０を樹脂２０内に溜め込むダム部としての機能も有する。また、樹脂２０は、外部接続端子１６、１７を支持する機能も有する。 In the LED package substrate, an exposed portion where the resin 20 is not formed (from the die pad 11 to the edge portions of the electrode portions 12 and 13) constitutes an LED chip mounting region 25. In addition, the resin 20 of this embodiment constitutes an LED package substrate and the outer shape of the LED package, and constitutes a reflector having a reflection surface R on the inner surface. The reflector is formed on the mounting surface (the upper surface in FIG. 3A, the surface shown in FIG. 5A) of the LED chip 30 in the lead frame 10, and has a function of reflecting light from the LED chip 30 upward. In addition, when considered as another function, this part also has a function as a dam part for storing a translucent resin 40 described later in the resin 20. The resin 20 also has a function of supporting the external connection terminals 16 and 17.
本実施例において、樹脂２０で構成されるリフレクタは、リードフレーム１０の上面において、内側がすり鉢形状となる円環状に形成されている。本実施例のリフレクタは、その内周が円環状であるが、これに限定されるものではない。上述したとおり、凸部５２の形状に応じた形状に形成でき、リフレクタの内周を矩形状等にしてもよい。また、リフレクタの内周及び外周の両方を円形状または矩形状にすることもできる。 In the present embodiment, the reflector made of the resin 20 is formed in an annular shape in which the inner side has a mortar shape on the upper surface of the lead frame 10. The reflector of the present embodiment has an annular inner periphery, but is not limited to this. As described above, it can be formed in a shape corresponding to the shape of the convex portion 52, and the inner periphery of the reflector may be rectangular or the like. Moreover, both the inner periphery and outer periphery of a reflector can also be made into circular shape or a rectangular shape.
また、図３ＡのＬＥＤパッケージ用基板の下面には、他方金型６０の突起部６４、６４ａに対応する位置に凹部２６、２６ａが形成されている。凹部２６が形成されているため、図３Ａに示されるＬＥＤパッケージ用基板において、外部接続端子１６、１７の上面及び下面の両面が外部に露出している。また、環状の突起部６６の位置には凹溝２６ｂが形成されるため、電極部１２、１３は、凹溝２６ｂを介して、下面において外部に露出することになる。 In addition, on the lower surface of the LED package substrate in FIG. 3A, recesses 26 and 26 a are formed at positions corresponding to the protrusions 64 and 64 a of the other mold 60. Since the recess 26 is formed, in the LED package substrate shown in FIG. 3A, both the upper and lower surfaces of the external connection terminals 16 and 17 are exposed to the outside. Further, since the concave groove 26b is formed at the position of the annular protrusion 66, the electrode portions 12 and 13 are exposed to the outside on the lower surface via the concave groove 26b.
続いて、図３Ｂに示されるように、リードフレーム１０のダイパッド１１の上（ＬＥＤチップ実装用領域２５）に複数のＬＥＤチップ３０を実装する。ＬＥＤチップ３０は、アノード電極とカソード電極との一対の電極間に順バイアスを印加することにより、特定の色の光を放出する半導体チップ（ＬＥＤチップ）である。発光色は、ＬＥＤチップ３０に用いられる材料により異なる。例えば、赤色光を放出するＡｌＧａＡｓ、緑色光を放出するＧａＰ、青色光を放出するＧａＮなどが用いられる。さらに、本明細書における「ＬＥＤチップ」とは、可視光を放出するＬＥＤチップのみならず、紫外光や赤外光のような可視光領域外の光を放出するチップであってもよい。さらに、「ＬＥＤチップ」に替えて、各種の光を受光するチップを用いてもよい。 Subsequently, as shown in FIG. 3B, a plurality of LED chips 30 are mounted on the die pad 11 (LED chip mounting region 25) of the lead frame 10. The LED chip 30 is a semiconductor chip (LED chip) that emits light of a specific color by applying a forward bias between a pair of electrodes of an anode electrode and a cathode electrode. The emission color varies depending on the material used for the LED chip 30. For example, AlGaAs that emits red light, GaP that emits green light, GaN that emits blue light, and the like are used. Further, the “LED chip” in this specification may be not only an LED chip that emits visible light but also a chip that emits light outside the visible light region such as ultraviolet light and infrared light. Furthermore, instead of the “LED chip”, a chip that receives various kinds of light may be used.
複数のＬＥＤチップ３０は、一例として、金等の複数のワイヤ３５を用いて（ワイヤボンディングにより）、それらの上面に設けられたアノード電極、カソード電極及びリードフレーム１０の電極部１２、１３に電気的に接続される。ＬＥＤチップ３０同士が接続される部位では、例えばアノード電極とカソード電極とが接続され、ＬＥＤチップ３０とリードフレーム１０の電極部１２、１３とが接続される部位では、他のＬＥＤチップ３０に接続されていないＬＥＤチップ３０の一方の電極が一方の電極部１２に接続され、他方の電極が他方の電極部１３に接続される。 As an example, the plurality of LED chips 30 use a plurality of wires 35 such as gold (by wire bonding) to electrically connect the anode electrode, the cathode electrode, and the electrode portions 12 and 13 of the lead frame 10 provided on the upper surfaces thereof. Connected. For example, an anode electrode and a cathode electrode are connected at a portion where the LED chips 30 are connected to each other, and connected to another LED chip 30 at a portion where the LED chip 30 and the electrode portions 12 and 13 of the lead frame 10 are connected. One electrode of the LED chip 30 that is not connected is connected to one electrode portion 12, and the other electrode is connected to the other electrode portion 13.
このような構成により、複数のＬＥＤチップ３０のアノード電極及びカソード電極は、電極部１２、１３の一部である外部接続端子１６、１７とそれぞれ電気的に接続される。なお本実施例において、一つのＬＥＤパッケージを構成するＬＥＤパッケージ用基板には、複数のＬＥＤチップ３０が実装されている。 With such a configuration, the anode electrodes and the cathode electrodes of the plurality of LED chips 30 are electrically connected to the external connection terminals 16 and 17 that are part of the electrode portions 12 and 13, respectively. In this embodiment, a plurality of LED chips 30 are mounted on an LED package substrate constituting one LED package.
続いて、図３Ｃに示されるように、複数のＬＥＤチップ３０が実装されたＬＥＤチップ実装用領域２５に透光性樹脂４０を充填する。このとき、ＬＥＤチップ３０が実装されたＬＥＤパッケージ用基板を金型（透光性樹脂成形用金型）に載置した状態で、液状の透光性樹脂４０を、ディスペンサ（不図示）を用いて供給する。そして、透光性樹脂成形用金型（不図示）を型閉じして、ＬＥＤパッケージ用基板をクランプする。そして、液状の透光性樹脂４０を圧送し、透光性樹脂４０をＬＥＤチップ実装用領域２５に供給して充填する。その後、ＬＥＤチップ実装用領域２５に充填された透光性樹脂４０を硬化させることにより、ＬＥＤチップ３０及びワイヤ３５を保護しレンズ部としても機能する透光性樹脂４０が形成されて、その内部にＬＥＤチップ３０等が封止される。以上のようにトランスファ成形によって透光性樹脂４０を形成してもよいが、透光性樹脂４０は圧縮成形で形成してもよい。また、透光性樹脂４０をディスペンサでＬＥＤチップ実装用領域２５に直接供給することで金型を用いずに透光性樹脂４０を形成してもよい。 Subsequently, as shown in FIG. 3C, a translucent resin 40 is filled in the LED chip mounting region 25 in which the plurality of LED chips 30 are mounted. At this time, in a state where the LED package substrate on which the LED chip 30 is mounted is placed on a mold (translucent resin molding mold), the liquid translucent resin 40 is dispensed using a dispenser (not shown). Supply. Then, the translucent resin molding die (not shown) is closed, and the LED package substrate is clamped. Then, the liquid translucent resin 40 is pumped, and the translucent resin 40 is supplied to and filled in the LED chip mounting region 25. Thereafter, the translucent resin 40 filled in the LED chip mounting area 25 is cured, thereby forming the translucent resin 40 that protects the LED chip 30 and the wire 35 and also functions as a lens portion. The LED chip 30 and the like are sealed. Although the translucent resin 40 may be formed by transfer molding as described above, the translucent resin 40 may be formed by compression molding. Moreover, you may form the translucent resin 40 without using a metal mold | die by supplying the translucent resin 40 directly to the LED chip mounting area | region 25 with a dispenser.
本実施例において、透光性樹脂４０としては、例えば透光性及び熱硬化性を有するシリコーン樹脂が用いられる。なお、本実施例における「透光性」とは、ＬＥＤチップ３０から放出された光を少なくとも外部に放出可能なことをいい、内部の構造が明瞭に視認可能ないわゆる「無色透明」である必要は無い。透光性樹脂４０には、各種の蛍光体（波長変換材）や燐光体を含有させることもできる。本実施例のように一対の外部端子を有する場合には、青色発光するＬＥＤチップ３０を用い、入射された光を黄色に波長変換する蛍光体を含有した透光性樹脂４０を用いることで、白色発光可能なＬＥＤパッケージを製造することができる。また、入射された光を赤色及び緑色に波長変換できるように２種の蛍光体を含有した透光性樹脂４０を用いることもできる。さらに、透光性樹脂４０には、拡散材として用いる樹脂２０と同様の白色顔料を含有させてもよい。なお、シリコーン樹脂は、例えばエポキシ樹脂よりも紫外線や熱によって透光性が低下し難い性質を有するため、ＬＥＤチップ３０を封止するには好適である。ただし、透光性樹脂４０としては、エポキシ樹脂などの他の熱硬化性樹脂を用いてもよい。 In this embodiment, as the translucent resin 40, for example, a silicone resin having translucency and thermosetting is used. The “translucency” in the present embodiment means that light emitted from the LED chip 30 can be emitted at least to the outside, and it is necessary to be so-called “colorless and transparent” in which the internal structure is clearly visible. There is no. The translucent resin 40 may contain various phosphors (wavelength conversion materials) and phosphors. In the case of having a pair of external terminals as in the present embodiment, by using the LED chip 30 that emits blue light and using the translucent resin 40 that contains a phosphor that converts the wavelength of incident light to yellow, An LED package capable of emitting white light can be manufactured. Moreover, the translucent resin 40 containing 2 types of fluorescent substance can also be used so that incident light can be wavelength-converted into red and green. Further, the translucent resin 40 may contain a white pigment similar to the resin 20 used as the diffusing material. The silicone resin is suitable for sealing the LED chip 30 because the translucency is less likely to be lowered by ultraviolet rays or heat than, for example, an epoxy resin. However, as the translucent resin 40, another thermosetting resin such as an epoxy resin may be used.
最後に、リードフレーム１０の吊りリード１９ａ～１９ｅや隣接するダイパッド１１同士を接続する部位１４、１５の間を含めて樹脂２０を切断することにより、複数のＬＥＤパッケージに分離され、図３Ｄに示されるＬＥＤパッケージ１００が製造される。この場合、この工程を行うための切断装置としては、円盤状の切断用ブレードにより直線的な切断線（ダイシングライン）で切断するブレード式切断装置を用いることができる。 Finally, by cutting the resin 20 including between the suspension leads 19a to 19e of the lead frame 10 and the portions 14 and 15 connecting the adjacent die pads 11, the plurality of LED packages are separated, as shown in FIG. 3D. LED package 100 is manufactured. In this case, as a cutting device for performing this process, a blade-type cutting device that cuts along a straight cutting line (dicing line) with a disk-shaped cutting blade can be used.
図６は、本実施例におけるＬＥＤパッケージ１００の斜視図である。なお、図６では、ＬＥＤチップ３０の接続構成の理解の容易化ために、透光性樹脂４０の図示を省略している。また、同図ではＬＥＤチップ３０やワイヤ３５を図示しているが後述するＬＥＤパッケージの図においてこれらを省略する場合がある。 FIG. 6 is a perspective view of the LED package 100 in the present embodiment. In FIG. 6, the translucent resin 40 is not shown in order to facilitate understanding of the connection configuration of the LED chip 30. Moreover, although the LED chip 30 and the wire 35 are shown in the same figure, these may be abbreviate | omitted in the figure of LED package mentioned later.
図６に示されるように、複数のＬＥＤチップ３０を直列に接続した組を複数並べた構成とすることができる。同図に示される構成例では、同数（１２個）のＬＥＤチップ３０を直列に接続した組を８組並列に接続することにより、９６個のＬＥＤチップ３０を搭載したＬＥＤパッケージ１００とすることができる。本実施例のように、ＬＥＤチップ実装用領域２５の縁部分の広い角度（約１７０°）において電極部１２、１３が樹脂２０から露出しているため、本実施例のようにＬＥＤチップ３０を直列に接続した組を複数配列するときに、配線を容易に行うことができる。なお、ＬＥＤチップ３０の配線は、直列に接続した組を複数配列するだけでなく、２列の直列に接続した組の隣接するＬＥＤチップ３０同士を接続することにより、ワイヤ３５の切断などが起こっても直列に接続された組の全てのＬＥＤチップ３０が発光しなくなるような事態を回避することもできる。 As shown in FIG. 6, a plurality of sets in which a plurality of LED chips 30 are connected in series can be arranged. In the configuration example shown in the figure, an LED package 100 having 96 LED chips 30 mounted thereon can be obtained by connecting eight sets of the same number (12) of LED chips 30 connected in series to each other in parallel. it can. Since the electrode parts 12 and 13 are exposed from the resin 20 at a wide angle (about 170 °) of the edge portion of the LED chip mounting region 25 as in this embodiment, the LED chip 30 is formed as in this embodiment. Wiring can be easily performed when a plurality of sets connected in series are arranged. In addition, the wiring of the LED chip 30 not only arranges a plurality of groups connected in series, but also disconnects the wire 35 by connecting two adjacent LED chips 30 in a series connected in series. However, it is possible to avoid a situation in which all the LED chips 30 in the set connected in series do not emit light.
また、外部接続端子１６、１７と同一の面にダイパッド１１に接続された外部露出部１８が露出しているため、外部露出部１８の温度を測定することで、透光性樹脂４０に覆われたダイパッド１１の温度を測定し、ダイパッド１１の温度が許容値を超えたときには、外部接続端子１６、１７に流す電流や電圧を低下または電流を停止させなどすることができ、ＬＥＤチップ３０や透光性樹脂４０の過熱による破損や劣化を防止することもできる。 Further, since the externally exposed portion 18 connected to the die pad 11 is exposed on the same surface as the external connection terminals 16 and 17, it is covered with the translucent resin 40 by measuring the temperature of the externally exposed portion 18. When the temperature of the die pad 11 is measured and the temperature of the die pad 11 exceeds the allowable value, the current and voltage flowing to the external connection terminals 16 and 17 can be reduced or the current can be stopped. It is also possible to prevent damage or deterioration due to overheating of the photopolymer 40.
なお、ＬＥＤパッケージ１００の表面には、接続させることを意図した極性のマークとして、例えば、「＋」印と「－」印とを、印字してもよい。又は、このマーク状の凹凸を一方金型５０の底部５４に形成することにより、この面に極性のマークを付与することもできる。さらに、外部接続端子１６、１７が形成されていない一対の角部に外部実装面に対する固定用の貫通孔を設けてもよい。この場合、型閉じしたときに一方金型５０の底部５４に当接するような長さの凸部を他方金型６０に設けると共に、この凸部が貫通する貫通孔をリードフレーム１０の電極部１２、１３に設けることで、樹脂２０を成形する際に貫通孔を構成することもできる。これにより、外部実装面に対してネジ止めにより固定するようにして、所望の位置に簡易かつ安定的に固定できるようにしてもよい。 For example, a “+” mark and a “−” mark may be printed on the surface of the LED package 100 as polar marks intended to be connected. Alternatively, by forming the mark-like irregularities on the bottom portion 54 of the one mold 50, a polar mark can be given to this surface. Further, a through hole for fixing to the external mounting surface may be provided at a pair of corners where the external connection terminals 16 and 17 are not formed. In this case, the other mold 60 is provided with a convex portion having such a length as to contact the bottom 54 of the one mold 50 when the mold is closed, and the through hole through which the convex portion passes is formed in the electrode portion 12 of the lead frame 10. , 13 can be used to form a through hole when the resin 20 is molded. Thus, the external mounting surface may be fixed by screwing so that it can be easily and stably fixed at a desired position.
図７Ａ，７Ｂは、ＬＥＤパッケージ１００の平面図である。図７ＡはＬＥＤパッケージ１００を表面側（ＬＥＤチップ搭載側、第１の主面側）から図５Ａで斜視されている面を見た図、図７ＢはＬＥＤパッケージ１００を裏面側（ＬＥＤチップ搭載側とは反対側、第２の主面側）から図５Ｂで斜視されている面を見た図をそれぞれ示している。図７Ａ，７Ｂ中において、破線は樹脂２０で覆われたリードフレーム１０（電極部１２、１３）を示している。なお、図７Ａ中のＡ－Ａ線の断面は、図３Ｄを含む上述した断面図の断面位置に相当する。また、ＬＥＤチップ実装用領域２５内に実装された構成については図示を省略している。 7A and 7B are plan views of the LED package 100. FIG. 7A is a view of the LED package 100 as seen from the front side (LED chip mounting side, first main surface side) as viewed in FIG. 5A, and FIG. 7B is the back side of the LED package 100 (LED chip mounting side). The figure which looked at the surface by which FIG. 7A and 7B, the broken lines indicate the lead frame 10 (electrode portions 12 and 13) covered with the resin 20. Note that the cross section taken along the line AA in FIG. 7A corresponds to the cross sectional position of the above-described cross sectional view including FIG. 3D. Further, the illustration of the configuration mounted in the LED chip mounting area 25 is omitted.
同図に示されるように、外部接続端子１６、１７の下面は、凹部２６を介してＬＥＤパッケージ１００の裏面からは離間するように位置しており、電極部１２、１３は環状の突起部６６（図４Ｂ参照）によって形成される凹溝２６ｂを挟んでＬＥＤパッケージ１００の裏面に露出しているため、ＬＥＤパッケージを搭載する部位が導電性の金属で構成されていてもＬＥＤチップ３０に流される高電圧が流れてしまうことがないため、ＬＥＤパッケージ１００が実装されるエリアを単純な放熱構造とすることができ、発光装置を安価な構成とすることができる。 As shown in the figure, the lower surfaces of the external connection terminals 16 and 17 are positioned so as to be separated from the back surface of the LED package 100 through the recesses 26, and the electrode portions 12 and 13 are annular projections 66. Since the LED package 100 is exposed on the back surface of the recessed groove 26b formed by (see FIG. 4B), even if the portion on which the LED package is mounted is made of a conductive metal, the LED chip 30 is made to flow. Since a high voltage does not flow, the area where the LED package 100 is mounted can be a simple heat dissipation structure, and the light-emitting device can be inexpensive.
一方、ダイパッド１１は、ＬＥＤパッケージ用基板の下面において露出するため、放熱構造に密着させることができ、ＬＥＤパッケージを搭載する部位の放熱構造から効率的に放熱することができる。例えば、１００個程度ＬＥＤチップが搭載されているＣｏＢ型の高出力ＬＥＤパッケージのように、アルミ基板上に発光チップが実装されているものに比べ、比較的熱伝導率の高い銅合金であり、かつ、厚みも０．２５～０．３ｍｍ程度と薄くすることができるため熱抵抗を下げることもでき、放熱性向上に貢献することができる。 On the other hand, since the die pad 11 is exposed on the lower surface of the LED package substrate, the die pad 11 can be in close contact with the heat dissipation structure, and can efficiently dissipate heat from the heat dissipation structure at the site where the LED package is mounted. For example, it is a copper alloy with relatively high thermal conductivity compared to a light emitting chip mounted on an aluminum substrate, such as a CoB type high power LED package on which about 100 LED chips are mounted, In addition, since the thickness can be reduced to about 0.25 to 0.3 mm, the thermal resistance can be lowered, which can contribute to the improvement of heat dissipation.
また、図８Ａ，８Ｂを参照して、本実施例の変形例について説明する。図８Ａ，８Ｂは、本実施例における変形例としてのリードフレーム及びＬＥＤパッケージ用基板の平面図であり、図８Ａはリードフレーム１０ｂ、図８ＢはＬＥＤパッケージ用基板の構成をそれぞれ示している。 A modification of this embodiment will be described with reference to FIGS. 8A and 8B. 8A and 8B are plan views of a lead frame and an LED package substrate as modified examples of the present embodiment. FIG. 8A shows the configuration of the lead frame 10b and FIG. 8B shows the configuration of the LED package substrate.
図８Ａにおいて、周囲の破線１５０は、一つのＬＥＤパッケージに対応するリードフレーム１０ｂの範囲を示している。図８Ａ、８Ｂに示されるように、本変形例のリードフレーム１０ｂは、図中の左側に示す一方の電極部を二つに分割し、それぞれの電極部に外部接続端子を設けている。すなわち、図中の左下に、外部接続端子１６ｂ（第１の外部接続端子）を有する電極部１２ｂ（第１の電極部）が設けられている。また、図中の左上に、外部接続端子１７ｂ（第２の外部接続端子）を有する電極部１３ｂ（第２の電極部）が設けられている。ダイパッド１１ｂを挟んで、電極部１２ｂ、１３ｂと反対側には、リード部１１３が設けられている。 In FIG. 8A, a surrounding broken line 150 indicates a range of the lead frame 10b corresponding to one LED package. As shown in FIGS. 8A and 8B, in the lead frame 10b of this modification, one electrode portion shown on the left side in the drawing is divided into two, and an external connection terminal is provided in each electrode portion. That is, an electrode part 12b (first electrode part) having an external connection terminal 16b (first external connection terminal) is provided at the lower left in the drawing. In addition, an electrode portion 13b (second electrode portion) having an external connection terminal 17b (second external connection terminal) is provided on the upper left in the drawing. A lead portion 113 is provided on the opposite side of the electrode portions 12b and 13b across the die pad 11b.
このように本変形例では、樹脂２０のＬＥＤチップ実装側の主面に露出した外部接続端子１６ｂ、１７ｂは、両方とも図中の左側（左下、左上）に位置する。このような構成において、ＬＥＤパッケージには、外部接続端子１６ｂ、電極部１２ｂ、直列または並列に接続された上流側のＬＥＤチップ３０の第１のグループ（例えば同図における下側に配置される）、リード部１１３、直列または並列に接続された下流側のＬＥＤチップ３０の第２のグループ（例えば同図における上側に配置される）、電極部１３ｂ、及び、外部接続端子１７ｂの順に電流が流れる。または、この逆の順に電流が流れるように構成してもよい。このようにリード部１１３を介して、ＬＥＤチップ３０の２つのグループを配置することができる。 Thus, in this modification, the external connection terminals 16b and 17b exposed on the main surface of the resin 20 on the LED chip mounting side are both positioned on the left side (lower left and upper left) in the drawing. In such a configuration, the LED package includes an external connection terminal 16b, an electrode portion 12b, and a first group of upstream LED chips 30 connected in series or in parallel (for example, arranged on the lower side in the figure). The current flows in the order of the lead portion 113, the second group of LED chips 30 on the downstream side connected in series or in parallel (for example, arranged on the upper side in the figure), the electrode portion 13b, and the external connection terminal 17b. . Or you may comprise so that an electric current may flow in the reverse order. In this way, two groups of LED chips 30 can be arranged via the lead portion 113.
また、図９を参照して、本実施例の別の変形例について説明する。図９は、本変形例のリードフレーム１０ｃ及びＬＥＤパッケージ用基板２１の構成を説明するための説明図である。図９において、左側にリードフレーム１０ｃを示し、右側にＬＥＤパッケージ用基板２１を示している。 Further, another modification of the present embodiment will be described with reference to FIG. FIG. 9 is an explanatory diagram for explaining the configuration of the lead frame 10c and the LED package substrate 21 of this modification. In FIG. 9, the lead frame 10c is shown on the left side, and the LED package substrate 21 is shown on the right side.
図９に示されるように、リードフレーム１０ｃは、ダイパッド１１ｃ、ダイパッド１１ｃの左側に設けられた電極部１２ｃ（第１の電極部）、及び、ダイパッド１１ｃの右側に設けられた電極部１３ｃ（第２の電極部）を有する。電極部１２ｃは外部接続端子１６ｃ（第１の外部接続端子）を有し、電極部１３ｃは外部接続端子１７ｃ（第２の外部接続端子）を有する。図９中の左側に示されるリードフレーム１０ｃに樹脂２０を成形することにより、図９中の右側に示されるＬＥＤパッケージ用基板２１が形成される。本変形例においても、外部接続端子１６ｃ、１７ｃは、樹脂２０のＬＥＤチップ搭載側の主面に露出している。 As shown in FIG. 9, the lead frame 10c includes a die pad 11c, an electrode part 12c (first electrode part) provided on the left side of the die pad 11c, and an electrode part 13c (first electrode) provided on the right side of the die pad 11c. 2 electrode portions). The electrode part 12c has an external connection terminal 16c (first external connection terminal), and the electrode part 13c has an external connection terminal 17c (second external connection terminal). By molding the resin 20 on the lead frame 10c shown on the left side in FIG. 9, the LED package substrate 21 shown on the right side in FIG. 9 is formed. Also in this modification, the external connection terminals 16c and 17c are exposed on the main surface of the resin 20 on the LED chip mounting side.
ダイパッド１１ｃを挟んで両側に配置される外部接続端子１６ｃ、１７ｃの更に外側には、ＬＥＤパッケージ用基板２１の外部への固定用リード１９ｊが配置されて、ＬＥＤパッケージ用基板２１から側面に露出されている。これにより、縦長のＬＥＤパッケージとして用いたときに、固定用リード１９ｊをボルトなどにより簡易かつ確実に固定することができる。また、この固定用リード１９ｊは、外部接続端子１６ｃ、１７ｃに接続された構造にすることで、固定用リード１９ｊからも電気的に接続することができる。なお、ダイパッド１１ｃの間にはセクションバーを設けるのが好ましい。 A lead 19j for fixing the LED package substrate 21 to the outside is disposed on the outer side of the external connection terminals 16c and 17c disposed on both sides of the die pad 11c, and is exposed to the side surface from the LED package substrate 21. ing. Thereby, when used as a vertically long LED package, the fixing lead 19j can be easily and reliably fixed with a bolt or the like. Further, the fixing lead 19j can be electrically connected to the fixing lead 19j by being connected to the external connection terminals 16c and 17c. A section bar is preferably provided between the die pads 11c.
このように、ＬＥＤチップ実装用領域が１列に複数配置されるように封止されるＬＥＤパッケージ用基板２１においては、固定用リード１９ｊを樹脂に覆われないように配置できるため、固定用の構造を簡易に形成することができる。 In this way, in the LED package substrate 21 that is sealed so that a plurality of LED chip mounting regions are arranged in one row, the fixing leads 19j can be arranged so as not to be covered with resin. The structure can be easily formed.
次に、本発明の実施例２について説明する。本実施例以降の実施例においては、上記した実施例と異なる部分を主として、必要に応じて比較しながら説明し、同一の部分の説明は基本的に省略する。 Next, a second embodiment of the present invention will be described. In the embodiments after this embodiment, portions different from the above-described embodiments will be mainly described while being compared as necessary, and description of the same portions will be basically omitted.
図１０Ａ～１０Ｄは、本実施例におけるＬＥＤパッケージ用基板の製造工程図である。図１０Ａ～１０Ｄの順にＬＥＤパッケージ用基板の完成までの製造工程が示されている。この工程の後に行われるＬＥＤチップ３０の実装工程以降の説明は本実施例では省略する。 10A to 10D are manufacturing process diagrams of the LED package substrate in this embodiment. The manufacturing process until the completion of the LED package substrate is shown in the order of FIGS. 10A to 10D. The description after the mounting step of the LED chip 30 performed after this step is omitted in this embodiment.
まず、一方金型５０ａ及び他方金型６０ａを備えて構成される金型を用いて、リードフレーム１０ａにリフレクタ（樹脂２０）を成形する。このため、図１０Ａに示されるように、リードフレーム１０ａを他方金型６０ａの上に載置する。 First, a reflector (resin 20) is formed on the lead frame 10a by using a mold including the one mold 50a and the other mold 60a. For this reason, as shown in FIG. 10A, the lead frame 10a is placed on the other mold 60a.
本実施例のリードフレーム１０ａにおいては、電極部１２ａ、１３ａにおいて外部接続端子１６ａ、１７ａの位置を凸状に折り曲げて突起させることにより、ダイパッド１１と異なる位置（高さ）に外部接続端子１６ａ、１７ａが設けられている。この点において、本実施例のリードフレーム１０ａは、電極部１２、１３の端部を起立させて片持ち状となるように折り曲げることにより外部接続端子１６、１７が設けられている実施例１のリードフレーム１０と異なっている。同図に示される構成では、２点鎖線を挟んで同様の構成が並べられるため、この断面において隣接する領域においては、一の領域の電極部１２と、隣接する領域の電極部１３とは吊りリード１９ｋによって接続されることになる。 In the lead frame 10a of the present embodiment, the external connection terminals 16a, 13a are bent at the positions of the electrode portions 12a, 13a so that the external connection terminals 16a, 17a are protruded. 17a is provided. In this respect, the lead frame 10a according to the present embodiment is provided with the external connection terminals 16 and 17 by bending the end portions of the electrode portions 12 and 13 so as to be cantilevered. Different from the lead frame 10. In the configuration shown in the figure, the same configuration is arranged across the two-dot chain line. Therefore, in the adjacent region in this cross section, the electrode portion 12 in one region and the electrode portion 13 in the adjacent region are suspended. The connection is made by the lead 19k.
図１０Ａに示されるように、他方金型６０ａは、リードフレーム１０ａのダイパッド１１ａ及び電極部１２ａ、１３ａを載置するための平面部６２ａを備えている。一方、外部接続端子１６ａ、１７ａのそれぞれの両端は電極部１２ａ、１３ａと吊りリード１９ｋとにそれぞれ接続された傾斜部で支持されているため、他方金型６０ａには、外部接続端子１６ａ、１７ａを支持するための突起部６６（支持部）を設けていない。また、ダイパッド１１と電極部１２ａ、１３ａは同一平面上に位置するよう、他方金型６０ａには、実施例１のように電極部１２ａ、１３ａを載置（支持）するための突起部６６（支持部）が設けられていない。 As shown in FIG. 10A, the other mold 60a includes a flat portion 62a for mounting the die pad 11a of the lead frame 10a and the electrode portions 12a and 13a. On the other hand, since both ends of the external connection terminals 16a and 17a are supported by inclined portions connected to the electrode portions 12a and 13a and the suspension leads 19k, the other mold 60a has external connection terminals 16a and 17a. The protrusion 66 (supporting part) for supporting is not provided. Further, the die pad 11 and the electrode portions 12a and 13a are positioned on the same plane, and the projection portion 66 (for supporting (supporting) the electrode portions 12a and 13a on the other mold 60a as in the first embodiment) ( Support section is not provided.
続いて、図１０Ｂに示されるように、一方金型５０ａ及び他方金型６０ａを用いてリードフレーム１０ａを上面及び下面側からクランプする。図１０Ｂに示されるように、一方金型５０ａは、リードフレーム１０ａのダイパッド１１ａを押し付ける凸部５２ａ、及び、リードフレーム１０ａの外部接続端子１６ａ、１７ａを押し付ける底部５４を備えている。この場合、外部接続端子１６ａ、１７ａは、傾斜部によって一方金型５０ａの底部５４に押し付けられた状態で樹脂２０を成形することができる。 Subsequently, as shown in FIG. 10B, the lead frame 10a is clamped from the upper surface and the lower surface using the one mold 50a and the other mold 60a. As shown in FIG. 10B, the one mold 50a includes a convex portion 52a that presses the die pad 11a of the lead frame 10a, and a bottom portion 54 that presses the external connection terminals 16a and 17a of the lead frame 10a. In this case, the external connection terminals 16a and 17a can mold the resin 20 in a state where the external connection terminals 16a and 17a are pressed against the bottom 54 of the one mold 50a by the inclined portion.
続いて、図１０Ｃに示されるように、金型でリードフレーム１０ａをクランプした状態で、実施例１と同様に樹脂２０を成形する。この結果、一方金型５０ａと他方金型６０ａとの間の空間は、樹脂２０により充填される。樹脂成形後、一方金型５０ａ及び他方金型６０ａからリードフレーム１０ａを取り外す（離型する）と、図１０Ｄに示されるように、リフレクタ成形後のＬＥＤパッケージ用基板が得られる。 Subsequently, as shown in FIG. 10C, the resin 20 is molded in the same manner as in Example 1 with the lead frame 10a clamped by a mold. As a result, the space between the one mold 50 a and the other mold 60 a is filled with the resin 20. After the resin molding, when the lead frame 10a is removed (released) from the one mold 50a and the other mold 60a, the LED package substrate after the reflector molding is obtained as shown in FIG. 10D.
次に、図１１及び図１２を参照して、本実施例の変形例について説明する。図１１は、本変形例のリードフレーム及びＬＥＤパッケージ用基板の構成を説明するための説明図である。図１２は、本変形例のＬＥＤパッケージ用基板の拡大斜視図である。なお、同図では、１個のＬＥＤパッケージの領域を拡大して示している。 Next, a modification of the present embodiment will be described with reference to FIGS. FIG. 11 is an explanatory diagram for explaining the configuration of the lead frame and the LED package substrate according to this modification. FIG. 12 is an enlarged perspective view of the LED package substrate of the present modification. In the figure, the area of one LED package is enlarged.
図１１において、リードフレーム１０ｄ’、１０ｄ、及び、ＬＥＤパッケージ用基板２１ｄを工程順にそれぞれ示している。なお、本図は工程の理解を容易とするために、異なった進捗状況の工程における状態を並べて示している。リードフレーム１０ｄ’は、外部接続端子の加工前のリードフレームであり、平面状である。リードフレーム１０ｄは、リードフレーム１０ｄ’の電極部１２ｄ、１３ｄ間に挟まれた外部接続端子用の領域を押し上げるように折り曲げ加工し、外部接続端子１６ｄ、１７ｄを形成した立体的形状を有する。このように、外部接続端子用の領域は曲線状の接続部を介して電極部１２ｄ、１３ｄに接続されており、この接続部を伸ばすことで、外部接続端子１６ｄ、１７ｄを電極部１２ｄ、１３ｄに対して突起させることができる。 In FIG. 11, the lead frames 10 d ′ and 10 d and the LED package substrate 21 d are shown in the order of processes. In addition, this figure has shown the state in the process of a different progress condition side by side, in order to make an understanding of a process easy. The lead frame 10d 'is a lead frame before processing of the external connection terminals, and has a planar shape. The lead frame 10d has a three-dimensional shape in which the external connection terminals 16d and 17d are formed by bending so as to push up the area for external connection terminals sandwiched between the electrode portions 12d and 13d of the lead frame 10d '. As described above, the region for the external connection terminal is connected to the electrode portions 12d and 13d via the curved connection portion. By extending the connection portion, the external connection terminals 16d and 17d are connected to the electrode portions 12d and 13d. Can be projected.
次いで、リードフレーム１０ｄに樹脂２０でリフレクタを成形することにより、ＬＥＤパッケージ用基板２１ｄが形成される。なお本変形例において、ダイパッド１１ｄは、電極部１２ｄと電気的に接続されているため、ダイパッド１１ｄは第１の電極部（電極部１２ｄ）の一部を構成するともいえる。 Next, the LED package substrate 21d is formed by forming a reflector with the resin 20 on the lead frame 10d. In addition, in this modification, since the die pad 11d is electrically connected to the electrode part 12d, it can be said that the die pad 11d constitutes a part of the first electrode part (electrode part 12d).
図１２は、図１１のＬＥＤパッケージ用基板２１ｄのうち一つのＬＥＤパッケージに相当する領域（または、個片化したＬＥＤパッケージ用基板）を示している。ＬＥＤパッケージ用基板２１ｄを外部接続端子１６ｄ、１７ｄにて切断して個片化することにより、個片化前において一つの外部接続端子は、隣接するＬＥＤパッケージ用基板（ＬＥＤパッケージ）の両方（二つの外部接続端子）に分離される。このように、外部接続端子１６ｄ、１７ｄは、一のＬＥＤパッケージにおける角部に三角形に成形するだけでなく、辺部に四角形状に配置してもよい。以上のように、本実施例では、他方金型６０ａにおいて、外部接続端子１６ｄ、１７ｄを露出させるための突起が不要となり、簡易な金型構造により成形が可能となる。また、上述の実施例において、ＬＥＤパッケージの裏面に開口する凹部２６や凹溝２６ｂを無くすこともできる。この場合、例えば外部接続端子１６ｄ、１７ｄに対する加圧に耐え易い構成とすることもできる。 FIG. 12 shows a region corresponding to one LED package (or an individual LED package substrate) of the LED package substrate 21d of FIG. By cutting the LED package substrate 21d into pieces by cutting the external connection terminals 16d and 17d, one external connection terminal is separated from both adjacent LED package substrates (LED packages) (two Two external connection terminals). As described above, the external connection terminals 16d and 17d may be arranged not only in a triangular shape in the corner portion of one LED package but also in a square shape in the side portion. As described above, in this embodiment, the other mold 60a does not require a protrusion for exposing the external connection terminals 16d and 17d, and can be molded with a simple mold structure. Further, in the above-described embodiment, the concave portion 26 and the concave groove 26b opened on the back surface of the LED package can be eliminated. In this case, for example, it may be configured to easily withstand the pressure applied to the external connection terminals 16d and 17d.
次に、図１３乃至図１５を参照して、本発明の実施例３について説明する。本実施例は、例えばｅＷＬＢパッケージ製造する際に用いられる半導体チップのモールド工程を利用してＬＥＤパッケージを成形する際に利用可能なリフレクタ（リフレクタ部材）の構成及びその成形方法に関する。図１３は、本実施例におけるリードフレーム１０ｅの斜視図である。図１４は、本実施例におけるリフレクタ部材の斜視図（表面斜視図）である。図１５は、リフレクタ部材の斜視図（裏面斜視図）である。これらの図では、１つのＬＥＤパッケージ分の領域のみ示して説明しているが、例えば、ｅＷＬＢに使用されるリフレクタ部材は、１つの領域が複数行複数列に並べられた部材として用いられるのが主となる。 Next, a third embodiment of the present invention will be described with reference to FIGS. The present embodiment relates to a configuration of a reflector (reflector member) that can be used when forming an LED package by using a semiconductor chip molding process that is used when, for example, an eWLB package is manufactured, and a molding method thereof. FIG. 13 is a perspective view of the lead frame 10e in the present embodiment. FIG. 14 is a perspective view (surface perspective view) of the reflector member in the present embodiment. FIG. 15 is a perspective view (back perspective view) of the reflector member. In these figures, only one LED package area is shown and described. For example, a reflector member used for eWLB is used as a member in which one area is arranged in a plurality of rows and a plurality of columns. Become the Lord.
図１３に示されるように、本実施例のリードフレーム１０ｅは、電極部１２ｅ、１３ｅを備えて構成されており、前述の実施例における構成のダイパッドを含まない構成となっている。電極部１２ｅは、その一部を折り曲げて構成された外部接続端子１６ｅを有する。また、電極部１３ｅは、その一部を折り曲げて構成された外部接続端子１７ｅを有する。リードフレーム１０ｅに対して樹脂２０を成形することにより、リフレクタ部材２２が形成される。この場合、外部接続端子１６ｅ、１７ｅは実施例１のように裏面で露出をしておらず、また、実施例２のように一対の傾斜部で支持されているわけでもない。このため、外部接続端子１６ｅ、１７ｅは、樹脂２０から完全に露出していない状態で封止されることになることも考えられる。この場合、外部接続端子１６ｅ、１７ｅを含む主面において、研削処理やブラスト処理により外部接続端子１６ｅ、１７ｅ上の樹脂２０を除去することでこれらを露出させることができる。 As shown in FIG. 13, the lead frame 10e of this embodiment is configured to include the electrode portions 12e and 13e, and does not include the die pad having the configuration in the above-described embodiment. The electrode part 12e has an external connection terminal 16e configured by bending a part thereof. Moreover, the electrode part 13e has the external connection terminal 17e comprised by bending the part. The reflector member 22 is formed by molding the resin 20 on the lead frame 10e. In this case, the external connection terminals 16e and 17e are not exposed on the back surface as in the first embodiment, and are not supported by the pair of inclined portions as in the second embodiment. For this reason, it is conceivable that the external connection terminals 16e and 17e are sealed in a state where they are not completely exposed from the resin 20. In this case, on the main surface including the external connection terminals 16e and 17e, these can be exposed by removing the resin 20 on the external connection terminals 16e and 17e by grinding or blasting.
図１４に示されるように、リフレクタ部材２２は、その表面（第１の主面）において、外部接続端子１６ｅ、１７ｅが樹脂２０から露出している。すなわち、電極部１２ｅ（第１の電極部）はＬＥＤチップの第１の電極と電気的に接続するように構成され、電極部１３ｅ（第２の電極部）は、ＬＥＤチップの第２の電極と電気的に接続するように構成されている。電極部１２ｅは、ＬＥＤチップからの光を反射面Ｒで反射するリフレクタを形成する樹脂２０から露出するように折り曲げられた外部接続端子１６ｅ（第１の外部接続端子）を有する。また、電極部１３ｅは、樹脂２０から露出するように折り曲げられた外部接続端子１７ｅ（第２の外部接続端子）を有する。 As shown in FIG. 14, the external connection terminals 16 e and 17 e are exposed from the resin 20 on the surface (first main surface) of the reflector member 22. That is, the electrode portion 12e (first electrode portion) is configured to be electrically connected to the first electrode of the LED chip, and the electrode portion 13e (second electrode portion) is configured to be the second electrode of the LED chip. It is comprised so that it may electrically connect with. The electrode portion 12e has an external connection terminal 16e (first external connection terminal) that is bent so as to be exposed from the resin 20 that forms the reflector that reflects the light from the LED chip at the reflection surface R. The electrode portion 13e has an external connection terminal 17e (second external connection terminal) that is bent so as to be exposed from the resin 20.
図１５に示されるように、リフレクタ部材２２は、その裏面（第２の主面）において、電極部１２ｅ、１３ｅが露出している。なお、本実施例のリフレクタ２２は、前記各実施例におけるダイパッドに相当する部位は存在しないため、その分薄いＬＥＤパッケージを製造することが可能となる。 As shown in FIG. 15, the reflector member 22 has the electrode portions 12e and 13e exposed on the back surface (second main surface) thereof. In addition, since the reflector 22 of the present embodiment does not have a portion corresponding to the die pad in each of the embodiments, it is possible to manufacture a thinner LED package.
本実施例におけるＬＥＤチップのモールド工程としては、ｅＷＬＢ（ｅｍｂｅｄｄｅｄ　Ｗａｆｅｒ　ｌｅｖｅｌ　ＢＧＡ）成形に用いられる工程と同等の工程であって、例えばステンレス等の板状の部材であるキャリア上にリフレクタ部材２２を、接着層を介して貼り付けると共に、リフレクタの内側に必要数のＬＥＤチップをアノード電極及びカソード電極がキャリア側に向けられるように配置し接着する。次いで、ＬＥＤチップをトランスファ成形、圧縮成形またはポッティングなどで透光性樹脂４０により封止し硬化させる。次いで、このようにＬＥＤチップが封止されたリフレクタ部材２２をキャリアから剥離させることで、電極部１２ｅ、１３ｅとＬＥＤチップの電極とが同一面に露出された状態となる。次いで、これらを適宜接続するように配線層と絶縁層とを形成する再配線工程を行うことにより、外部接続端子１６ｅ、１７ｅとＬＥＤチップの電極とを接続することができる。この後、必要に応じて適宜に分割することによって、外部接続端子１６ｅ、１７ｅを有するＬＥＤパッケージを製造することができる。 The LED chip molding process in this embodiment is a process equivalent to a process used for eWLB (embedded Wafer level BGA) molding, for example, a reflector member 22 on a carrier that is a plate-like member such as stainless steel, Affixing via an adhesive layer, the necessary number of LED chips are arranged and adhered inside the reflector so that the anode electrode and the cathode electrode are directed to the carrier side. Next, the LED chip is sealed and cured with a translucent resin 40 by transfer molding, compression molding, potting, or the like. Next, the reflector member 22 thus sealed with the LED chip is peeled off from the carrier, so that the electrode portions 12e and 13e and the electrode of the LED chip are exposed on the same surface. Next, the external connection terminals 16e and 17e and the electrode of the LED chip can be connected by performing a rewiring process for forming a wiring layer and an insulating layer so as to connect them appropriately. Thereafter, the LED package having the external connection terminals 16e and 17e can be manufactured by appropriately dividing as necessary.
また、リードフレーム１０ｅの電極部１２ｅ、１３ｅとＬＥＤチップの電極とを接続するような配線構造を有する接着層を用いると共に放熱性の高い材質のキャリアを用いることで、キャリアの剥離と再配線工程を行わなくてもよく、適宜の領域に切り分けるだけの簡易な工程で配線工程などを行うことなくそのまま放熱性の高い放熱構造を有するＬＥＤパッケージを製造することができる。即ち、本実施例において詳述したとおり、本明細書に開示される発明においてダイパッドは必須の構成ではなく、リードフレーム１０ｅの電極部１２ｅ、１３ｅの裏面が電気的に接続可能に露出していてもよいことがわかる。 Further, by using an adhesive layer having a wiring structure that connects the electrode portions 12e and 13e of the lead frame 10e and the electrode of the LED chip, a carrier having a high heat dissipation property is used, so that the carrier peeling and rewiring process is performed. The LED package having a heat dissipation structure with high heat dissipation can be manufactured as it is without performing a wiring process or the like by a simple process of dividing into appropriate regions. That is, as described in detail in the present embodiment, the die pad is not an essential configuration in the invention disclosed in this specification, and the back surfaces of the electrode portions 12e and 13e of the lead frame 10e are exposed so as to be electrically connectable. You can see that
次に、図１６乃至図２２Ａ，２２Ｂを参照して、本発明の実施例４として六角形のＬＥＤパッケージ１００ｆの製造工程の一例について説明する。図１６は、本実施例のＬＥＤパッケージ１００ｆの製造工程を示すフローチャートである。 Next, with reference to FIGS. 16 to 22A and 22B, an example of a manufacturing process of the hexagonal LED package 100f will be described as a fourth embodiment of the present invention. FIG. 16 is a flowchart showing a manufacturing process of the LED package 100f of the present embodiment.
まず、図１６のステップＳ１０１において、図１７及び図１８に示されるようにリードフレーム１０ｆを成形する。図１７はリードフレーム１０ｆの平面図であり、図１８はリードフレーム１０ｆの拡大平面図である。リードフレーム１０ｆは、複数の単位リードフレームを配列して構成されている。具体的には、リードフレーム１０ｆは、図１７に示されるように、その長手方向に沿って複数（７個または８個）のＬＥＤチップ実装用領域（パッケージ領域）が並べられた列を交互に複数列（同図では４列）配置した構成となっている。この場合、１列にＬＥＤチップ実装用領域を並べる個数は同数であってもよいが、例えば六角形のパッケージを成形するときには、隣接する列のパッケージ領域を半ピッチ分ずらして配置することにより高密度に配置することができ、１個のリードフレーム１０ｆでより多くのパッケージを製造することができ、安価に多数のパッケージを成形できる。 First, in step S101 of FIG. 16, the lead frame 10f is formed as shown in FIGS. FIG. 17 is a plan view of the lead frame 10f, and FIG. 18 is an enlarged plan view of the lead frame 10f. The lead frame 10f is configured by arranging a plurality of unit lead frames. Specifically, as shown in FIG. 17, the lead frame 10 f has alternating rows in which a plurality (7 or 8) of LED chip mounting regions (package regions) are arranged along the longitudinal direction. A plurality of rows (4 rows in the figure) are arranged. In this case, the number of LED chip mounting regions arranged in a row may be the same. However, when forming a hexagonal package, for example, the package regions in adjacent rows are shifted by a half pitch to increase the number of LED chip mounting regions. More than one package can be manufactured by one lead frame 10f, and many packages can be formed at low cost.
リードフレーム１０ｆ（各単位リードフレーム）は、ダイパッド１１ｆ及び電極部１２ｆ、１３ｆを備えて構成されている。電極部１２ｆ、１３ｆは、折り曲げられて形成された外部接続端子１６ｆ、１７ｆを有する。この外部接続端子１６ｆ、１７ｆは、六角形のパッケージ内における対向する角部で露出するように配置されている。また、図１８に示されるように、隣接するパッケージ領域を構成するダイパッド１１ｆ及び電極部１２ｆ、１３ｆを接続するための吊りリード１９ｇ、１９ｈが設けられている。吊りリード１９ｈはダイパッド１１ｆ間を接続し、吊りリード１９ｇは隣接するパッケージ領域の電極部１２ｆ、１３ｆ間を接続する。また、吊りリード１９ｇ、１９ｈの間にはパッケージの外周形状に沿うようにダムバー１９ｉが配置されている。さらに、吊りリード１９ｈの中間位置には貫通孔１９ｈ１を形成してもよい。 The lead frame 10f (each unit lead frame) includes a die pad 11f and electrode portions 12f and 13f. The electrode portions 12f and 13f have external connection terminals 16f and 17f formed by being bent. The external connection terminals 16f and 17f are arranged so as to be exposed at opposing corners in the hexagonal package. Further, as shown in FIG. 18, suspension leads 19g and 19h for connecting the die pad 11f and the electrode portions 12f and 13f constituting the adjacent package region are provided. The suspension lead 19h connects between the die pads 11f, and the suspension lead 19g connects between the electrode portions 12f and 13f in the adjacent package region. A dam bar 19i is arranged between the suspension leads 19g and 19h so as to follow the outer peripheral shape of the package. Further, a through hole 19h1 may be formed at an intermediate position of the suspension lead 19h.
続いて、ステップＳ１０２において、リードフレーム１０ｆ（ダイパッド１１ｆ）上に過電流からＬＥＤチップを保護する保護素子（図２２Ａ中のツェナーダイオード３２）を実装する。なお、ツェナーダイオードの構造によっては、電極部１２ｆ、１３ｆのいずれかにダイボンドして電極間を接続してもよい。そしてステップＳ１０３において、図１９及び図２０に示されるように反射面Ｒを有するリフレクタ（樹脂２０）を成形する。図１９は、ＬＥＤパッケージ用基板（一次カット前）の平面図である。図２０は、ＬＥＤパッケージ用基板の拡大平面図である。理解を容易にするため、図１９及び図２０のそれぞれに示される左上の１つのＬＥＤパッケージに対応する位置において、樹脂２０をリードフレーム１０ｆに対して突起するように成形されることでリフレクタを構成する部位を、塗りつぶして示している。この場合、塗りつぶしはしていない部分として、ダムバー１９ｉの内側や、ダイパッド１１ｆと電極部１２ｆ、１３ｆとの間のギャップ部Ｇにもリードフレーム１０ｆと同じ厚みの樹脂２０が充填される。この場合、図外のポット及びプランジャからランナを介して供給された樹脂２０は、吊りリード１９ｇまたは１９ｈ上に配置可能なスルーゲート（図示せず）を介して、リフレクタを形成するためのキャビティに充填されていく。 Subsequently, in step S102, a protection element (the Zener diode 32 in FIG. 22A) that protects the LED chip from overcurrent is mounted on the lead frame 10f (die pad 11f). Depending on the structure of the Zener diode, the electrodes may be connected to each other by die-bonding to either of the electrode portions 12f and 13f. In step S103, a reflector (resin 20) having a reflective surface R is molded as shown in FIGS. FIG. 19 is a plan view of the LED package substrate (before the primary cut). FIG. 20 is an enlarged plan view of the LED package substrate. In order to facilitate understanding, the reflector is formed by molding the resin 20 so as to protrude from the lead frame 10f at a position corresponding to one LED package at the upper left shown in each of FIGS. The part to be painted is shown in a solid color. In this case, the resin 20 having the same thickness as that of the lead frame 10f is filled in the inside of the dam bar 19i and the gap portion G between the die pad 11f and the electrode portions 12f and 13f as unfilled portions. In this case, the resin 20 supplied from the pot and plunger (not shown) via the runner passes through a through gate (not shown) that can be placed on the suspension lead 19g or 19h to form a cavity for forming a reflector. It will be filled.
この場合、ギャップ部Ｇへの樹脂２０の充填を容易にするために、電極部１２ｆ、１３ｆには、ギャップ部Ｇからパッケージ外側に向かって延在する連通溝１２ｆ１、１３ｆ１が形成されている。これによれば、リフレクタを成形するためのキャビティからギャップ部Ｇに樹脂２０が充填される際に、ギャップ部Ｇの両端からだけでなく連通溝１２ｆ１、１３ｆ１からも樹脂２０がギャップＧに充填されるため、大型のパッケージとなってギャップＧの長さが長くなっても未充填の発生を防止することができる。なお、本実施例では、連通溝１２ｆ１、１３ｆ１は、吊りリード１９ｇ上を介して樹脂２０が充填される場合を想定して、各２個ずつ配置しているが、１個でもよいしそれ以上配置してもよい。 In this case, in order to facilitate filling of the gap 20 with the resin 20, the electrode portions 12f and 13f are formed with communication grooves 12f1 and 13f1 extending from the gap portion G toward the outside of the package. According to this, when the gap 20 is filled with the resin 20 from the cavity for molding the reflector, the gap 20 is filled not only from both ends of the gap G but also from the communication grooves 12f1 and 13f1. Therefore, it is possible to prevent occurrence of unfilling even when the size of the gap G is increased due to a large package. In the present embodiment, the communication grooves 12f1 and 13f1 are arranged two by two assuming that the resin 20 is filled via the suspension leads 19g, but one or more may be provided. You may arrange.
このように本実施例は、複数のＬＥＤパッケージに対応する樹脂２０が互いに分離して成形された（マトリックスタイプの）ＬＥＤパッケージ用基板を形成する点でも、複数のＬＥＤパッケージに対応する樹脂２０が連続的かつ一体的に成形された（マップタイプの）ＬＥＤパッケージ用基板を形成する前記各実施例とは異なる。 As described above, the present embodiment also has a resin matrix 20 corresponding to a plurality of LED packages, in that the resin 20 corresponding to the plurality of LED packages forms a (matrix type) LED package substrate which is molded separately from each other. This is different from the above-described embodiments in which the LED package substrate formed continuously and integrally (map type) is formed.
続いてステップＳ１０４において、一次カットを行う。すなわち、吊りリード１９ｇ、１９ｈ及びダムバー１９ｉのうち、吊りリード１９ｈのみを残すように切断装置を用いて切り落す。この場合、この工程を行うための切断装置としては、パンチ及びダイを備えて、切断位置をパンチで打ち抜くことにより切断する打抜き式切断装置を用いることができる。 Subsequently, in step S104, a primary cut is performed. That is, of the suspension leads 19g and 19h and the dam bar 19i, the cutting leads are used to cut off only the suspension leads 19h. In this case, as a cutting device for performing this process, a punching type cutting device that includes a punch and a die and cuts the cutting position by punching can be used.
なお、ダムバー１９ｉの内側に充填された樹脂２０も同時に切断されることにより、図１９、２０において塗りつぶして示した樹脂２０の領域と、吊りリード１９ｈとを残すような一次カットが行われる。これにより、本実施例におけるＬＥＤパッケージの外形が成形される。 Note that the resin 20 filled inside the dam bar 19i is also cut at the same time, so that a primary cut is made so as to leave the region of the resin 20 filled in FIGS. 19 and 20 and the suspension leads 19h. Thereby, the external shape of the LED package in a present Example is shape | molded.
図２１は、ＬＥＤパッケージ用基板（一次カット後）の平面図である。図２１に示されるように、リードフレーム１０ｆの一次カット後、隣接する単位リードフレーム（一つのＬＥＤパッケージに対応するリードフレームの部位）は、吊りリード１９ｈのみにより接続される。このため、図中では上下方向においてのみ隣接する単位リードフレームが互いに接続されることになる。この吊りリード１９ｈは、電極部１２ｆ、１３ｆから電気的に分離されたダイパッド１１ｆ同士を接続しているため、一つのＬＥＤパッケージに相当する領域に対する外部接続端子１６ｆ、１７ｆを用いた電気的なテストが可能となっており、個片化されたパッケージをテストするよりも効率的にテストを行うことができる。 FIG. 21 is a plan view of the LED package substrate (after the primary cut). As shown in FIG. 21, after the primary cutting of the lead frame 10f, adjacent unit lead frames (lead frame portions corresponding to one LED package) are connected only by the suspension leads 19h. For this reason, in the figure, the unit lead frames adjacent only in the vertical direction are connected to each other. Since this hanging lead 19h connects the die pads 11f electrically separated from the electrode portions 12f and 13f, an electrical test using the external connection terminals 16f and 17f for a region corresponding to one LED package. This enables testing more efficiently than testing individualized packages.
続いてステップＳ１０５において、複数のＬＥＤチップ３０を各ダイパッド１１ｆの上に搭載する（図２２Ａ，２２Ｂ参照）。図２２Ａ，２２Ｂに示されるように、複数のＬＥＤチップ３０をダイパッド１１ｆの上に搭載する。この場合、電極部１２ｆ、１３ｆは連通溝１２ｆ１、１３ｆ１により分割されているが、樹脂２０の内部で一体となっているため、連通溝１２ｆ１、１３ｆ１で分離されていても任意の位置にワイヤボンドすることができる。 Subsequently, in step S105, a plurality of LED chips 30 are mounted on each die pad 11f (see FIGS. 22A and 22B). As shown in FIGS. 22A and 22B, a plurality of LED chips 30 are mounted on the die pad 11f. In this case, the electrode portions 12f and 13f are divided by the communication grooves 12f1 and 13f1, but since they are integrated inside the resin 20, wire bonding can be performed at an arbitrary position even if separated by the communication grooves 12f1 and 13f1. can do.
続いてステップＳ１０６において、ＬＥＤチップ実装後のＬＥＤパッケージ用基板において、所望の電流を流した際に適切に発光しているか、各ＬＥＤチップが均一に発光しているか、所定の電流・電圧特性が得られるかといった封止前に実施可能な基本的なテストを行う。この場合、一部のＬＥＤチップが適切に発光していないときには、当該ＬＥＤチップを交換し、又は、配線を修正するなどの対応も行うことができ、歩留まりを向上させることができる。 Subsequently, in step S106, the LED package substrate after the LED chip is mounted properly emits light when a desired current is passed, whether each LED chip emits light uniformly, or has a predetermined current / voltage characteristic. Perform basic tests that can be performed before sealing. In this case, when some of the LED chips do not emit light appropriately, it is possible to take measures such as exchanging the LED chips or correcting the wiring, thereby improving the yield.
続いてステップＳ１０７において、透光性樹脂４０を成形する（レンズ成形を行う）。なお、このステップ１０７の後にテストを行ってもよい。この工程では、ＬＥＤパッケージとしての性能を評価するためにレンズを介して放出される光が所望の輝度や色彩となっているかといった封止（レンズ成形）後に実施可能な付加的なテストを行うことができる。この場合、例えばＬＥＤパッケージから放出される光が所望の色彩となっていないときには、レンズの外側に任意に蛍光体層を追加するなどの修正対応も行うことができ、歩留まりを向上させることができる。このテストとステップＳ１０６のテストとは両方行ってもよいし、いずれか一方のみを行ってもよいが、リードフレーム１０ｆの最終的な切断を行う前にテストと必要に応じて修正対応とを行うことができ、製造工程を容易かつ効率的に進めることができる。なお、これらのテストは両方行わなくてもよいし、個片化した後に行ってもよい。 Subsequently, in step S107, the translucent resin 40 is molded (lens molding is performed). A test may be performed after this step 107. In this process, in order to evaluate the performance as an LED package, an additional test that can be performed after sealing (lens molding) is performed to determine whether the light emitted through the lens has a desired luminance or color. Can do. In this case, for example, when the light emitted from the LED package does not have a desired color, it is possible to perform corrections such as arbitrarily adding a phosphor layer outside the lens, thereby improving the yield. . Both the test and the test in step S106 may be performed, or only one of them may be performed. However, the test and the correction are performed as necessary before the final cutting of the lead frame 10f. And the manufacturing process can be carried out easily and efficiently. Note that both of these tests may not be performed, or may be performed after singulation.
最後に、ステップＳ１０８において、複数のＬＥＤパッケージが一体的に構成された状態において残りの吊りリード１９ｈを切断することにより、ＬＥＤパッケージを個片化する。これにより、ＬＥＤパッケージが製造される。 Finally, in step S108, the remaining suspension leads 19h are cut in a state where the plurality of LED packages are integrally formed, so that the LED packages are separated into pieces. Thereby, an LED package is manufactured.
図２２Ａは、二次カット後ＬＥＤパッケージ１００ｆの平面図であり、図２２Ｂは、図２２Ａに示したＬＥＤパッケージ１００ｆの等価回路である。このように、１つのパッケージは複数のＬＥＤチップ３０が直列に接続された列が複数列並列に接続されると共に、これらにツェナーダイオード３２が並列に接続されることになる。 22A is a plan view of the LED package 100f after the secondary cut, and FIG. 22B is an equivalent circuit of the LED package 100f shown in FIG. 22A. In this way, in one package, a plurality of LED chips 30 connected in series are connected in parallel, and a zener diode 32 is connected in parallel.
図２２Ａに示されるように、リードフレーム１０ｆのニ次カット後、隣接する単位リードフレーム（一つのＬＥＤパッケージに対応するリードフレームの部位）は、吊りリード１９ｈが中間位置で切断されることにより、貫通孔１９ｈ１が分割され、凹部１９ｈ２が形成される。本実施例では、凹部１９ｈ２を設けることにより、ボルトなどの固定具によってＬＥＤパッケージを簡易に固定することができるようにしている。なお、凹部１９ｈ２を形成するためにパッケージ側面から露出したリードフレームは放熱用に用いることもでき、放熱面積を増大して放熱性を向上することでもきる。本実施例を含めて、高出力のＬＥＤパッケージを用いる製品の１形態として電球照明などが挙げられる。このような照明装置では、ＬＥＤパッケージの実装エリアが丸形であることが多いため、本実施例のように六角形のＬＥＤパッケージのほうが例えば四角形のＬＥＤパッケージよりも電球装置の実装エリアを有効に使用でき、より広い発光面とすることもでき、高輝度化が可能となる。 As shown in FIG. 22A, after the secondary cutting of the lead frame 10f, the adjacent unit lead frame (the part of the lead frame corresponding to one LED package) is cut by the suspension lead 19h at the intermediate position. The through hole 19h1 is divided to form a recess 19h2. In the present embodiment, the recess 19h2 is provided so that the LED package can be easily fixed by a fixing tool such as a bolt. Note that the lead frame exposed from the side surface of the package in order to form the recess 19h2 can be used for heat dissipation, and can also be improved by increasing the heat dissipation area. Including this embodiment, one form of a product using a high-power LED package is a light bulb illumination. In such an illuminating device, the mounting area of the LED package is often round, so the hexagonal LED package is more effective than the rectangular LED package, for example, as in this embodiment. It can be used and can have a wider light-emitting surface, and high luminance can be achieved.
なお、本実施例において、ＬＥＤパッケージの各領域が吊りリード１９ｈで接続されたままのリードフレーム１０ｆでテストやそれに付随する修正工程を行うため、一次カット二次カットを別に行う例について説明したが、このテストを行わないときはこれらのカット工程を同時に行ってもよい。 In this embodiment, the example in which the primary cut and the secondary cut are separately performed has been described in order to perform the test and the accompanying correction process on the lead frame 10f in which each region of the LED package is connected to the suspension lead 19h. When this test is not performed, these cutting steps may be performed simultaneously.
次に、図２３Ａ～２３Ｅ乃至図２６Ａ，２６Ｂを参照して、本発明の実施例５について説明する。本実施例におけるＬＥＤチップのモールド工程は、実施例３に示すモールド工程と類似しており、リフレクタの成形について特徴があるため、この特徴点について主に説明する。 Next, Embodiment 5 of the present invention will be described with reference to FIGS. 23A to 23E to FIGS. 26A and 26B. The LED chip molding process in the present embodiment is similar to the molding process shown in the third embodiment and is characterized by the formation of the reflector. Therefore, this characteristic point will be mainly described.
図２３Ａ～２３Ｅ乃至図２５Ａ～２５Ｅは、本実施例におけるＬＥＤパッケージの製造工程図であり、図２３Ａ～２３Ｅ、図２４Ａ、２４Ｂ、及び、図２５Ａ～２５Ｅの順に、ＬＥＤパッケージ１００ｇの完成までの製造工程が示されている。図２６Ａ，２６Ｂは、本実施例におけるリードフレーム１０ｇの構成図であり、図２６Ａはリードフレーム１０ｇの全体平面図、図２６Ｂは図２６Ａ中のＢ－Ｂ線の拡大断面図をそれぞれ示している。 FIGS. 23A to 23E to 25A to 25E are manufacturing process diagrams of the LED package in this example. In order of FIGS. 23A to 23E, FIGS. 24A and 24B, and FIGS. 25A to 25E, the LED package 100g is completed. The manufacturing process is shown. 26A and 26B are configuration diagrams of the lead frame 10g in the present embodiment, FIG. 26A is an overall plan view of the lead frame 10g, and FIG. 26B is an enlarged sectional view taken along line BB in FIG. 26A. .
図２６Ａ、２６Ｂに示されるように、リードフレーム１０ｇには、格子枠状に構成された吊りリード１９ｌの各辺において平面方向に突起した電極部１２ｇの一部を厚み方向に突起するように折り曲げて形成した外部接続端子１６ｇが設けられている。そして、図２３Ａに示されるように、ステンレス等のキャリア７０（基材）の上に、接着部材７２を介して複数のＬＥＤチップ３０が配置される。また、接着部材７２の上には、リードフレーム１０ｇが載置される。この場合、図２６Ｂに示される電極部１２ｇが接着部材７２に接着されることで、電極部１２ｇの一端は自由端であるものの、外部接続端子１６ｇは任意の角度を維持して支持される。 As shown in FIGS. 26A and 26B, the lead frame 10g is bent so that a part of the electrode portion 12g protruding in the planar direction on each side of the suspension lead 19l configured in a lattice frame protrudes in the thickness direction. The external connection terminal 16g formed in this way is provided. Then, as shown in FIG. 23A, a plurality of LED chips 30 are arranged on a carrier 70 (base material) such as stainless steel via an adhesive member 72. On the adhesive member 72, the lead frame 10g is placed. In this case, the electrode portion 12g shown in FIG. 26B is bonded to the adhesive member 72, so that the external connection terminal 16g is supported while maintaining an arbitrary angle, although one end of the electrode portion 12g is a free end.
続いて、図２３Ｂに示されるように、金型（一方金型５０ｇ、他方金型６０ｇ）を用いて、図２３ＡのＬＥＤチップ３０及びリードフレーム１０ｇを搭載したキャリア７０をクランプする。このときキャリア７０は、他方金型６０ｇの凹部６２ｇに載置されている。一方金型５０ｇには、カル１５１、ランナ１５２、ゲート１５３、キャビティ１５４、１６１が設けられている。また、ポット６９の内部には、熱硬化性樹脂等をタブレット（円柱状）に成形した樹脂タブレット２０ａが配置される。 Subsequently, as shown in FIG. 23B, the carrier 70 on which the LED chip 30 and the lead frame 10g of FIG. 23A are mounted is clamped using a mold (one mold 50g, the other mold 60g). At this time, the carrier 70 is placed in the recess 62g of the other mold 60g. On the other hand, the mold 50g is provided with a cull 151, a runner 152, a gate 153, and cavities 154 and 161. Inside the pot 69, a resin tablet 20a in which a thermosetting resin or the like is formed into a tablet (columnar shape) is disposed.
この場合、キャビティ１５４は、リードフレーム１０ｇを収容可能な幅及び深さを有する格子状の溝部として形成されて、ゲート１５３が接続されることで樹脂２０が充填される。一方、キャビティ１６１は、ＬＥＤチップ３０を収容可能な矩形状の凹部として構成されているが、ゲート１５３が接続されず樹脂２０は充填されないようになっている。 In this case, the cavity 154 is formed as a grid-like groove having a width and depth that can accommodate the lead frame 10g, and the resin 20 is filled by connecting the gate 153. On the other hand, the cavity 161 is configured as a rectangular recess capable of accommodating the LED chip 30, but the gate 153 is not connected and the resin 20 is not filled.
続いて、予熱された他方金型６０ｇのポット６９内の樹脂タブレット２０ａを溶融させるとともにプランジャ６８を上動させて溶融した樹脂２０を圧送する。これにより、樹脂２０は、カル１５１、ランナ１５２、ゲート１５３、及び、キャビティ１５４の内部に順に充填されていく。なお、キャビティ１６１は、樹脂２０の通り路からは独立して構成されているため、キャビティ１６１の内部は樹脂２０で充填されない。この結果、図２３Ｃに示されるように、一方金型５０ｇと他方金型６０ｇとの間が樹脂２０で充填される。そして、一方金型５０ｇ及び他方金型６０ｇをキャリア７０から取り外す（離型する）ことにより、図２３Ｄに示されるようにＬＥＤチップ３０とリフレクタ部材とがキャリア７０上に成形される。このとき、キャビティ１５４の深さと外部接続端子１６ｇの高さとを等しくすることで、クランプ時にキャビティ１５４の底面は外部接続端子１６ｇと接することとなる。従って、外部接続端子１６ｇを樹脂２０から露出させることができる。このように、本実施例は、実施例３のようにリフレクタ部材の成形を別に行う工程ではなく、一連の成形工程において実施する点で異なる。 Subsequently, the resin tablet 20a in the pot 69 of the other pre-molded mold 60g is melted and the plunger 68 is moved upward to pump the melted resin 20. As a result, the resin 20 is sequentially filled into the cull 151, the runner 152, the gate 153, and the cavity 154. In addition, since the cavity 161 is configured independently from the passage of the resin 20, the inside of the cavity 161 is not filled with the resin 20. As a result, as shown in FIG. 23C, the space between the one mold 50g and the other mold 60g is filled with the resin 20. Then, by removing (releasing) the one mold 50g and the other mold 60g from the carrier 70, the LED chip 30 and the reflector member are formed on the carrier 70 as shown in FIG. 23D. At this time, by making the depth of the cavity 154 equal to the height of the external connection terminal 16g, the bottom surface of the cavity 154 comes into contact with the external connection terminal 16g during clamping. Therefore, the external connection terminal 16g can be exposed from the resin 20. Thus, the present embodiment is different from the third embodiment in that the reflector member is not formed in a separate process as in the third embodiment but in a series of forming processes.
続いて図２３Ｅに示されるように、透光性樹脂４０のディスペンサからそのノズル８２を介して、複数のＬＥＤチップ３０を覆うように、ＬＥＤチップ実装用領域２５ｇ中に透光性樹脂４０を供給する。なお、本実施例としては、透光性樹脂４０を供給することで、透光性樹脂４０でＬＥＤチップ３０を覆った状態として硬化させることでレンズ成形を完了としてもよい。ただし、本実施例としては透光性樹脂４０の硬化の促進と任意形状に成形するために図２４Ａ、２４Ｂに示される工程を行っている。 Subsequently, as shown in FIG. 23E, the translucent resin 40 is supplied into the LED chip mounting region 25g from the dispenser of the translucent resin 40 through the nozzle 82 so as to cover the plurality of LED chips 30. To do. In this embodiment, the lens molding may be completed by supplying the translucent resin 40 and curing the LED chip 30 with the translucent resin 40 covered. However, as a present Example, in order to accelerate | stimulate hardening of the translucent resin 40, and shape | mold in arbitrary shapes, the process shown by FIG. 24A and 24B is performed.
続いて、図２４Ａに示されるように、他方金型６５ｇの上に、図２３Ｅに示されるキャリア７０を載置する。他方金型６５ｇとともに用いられる一方金型５５ｇは、クランパ５８ｇ及びキャビティ駒５７ｇを備えて、クランパ５８ｇの内周面とキャビティ駒の端面で構成されるキャビティ凹部の深さを可変に構成されている。また、一方金型５５ｇの金型面にはリリースフィルム７４が吸着保持される。なお、リリースフィルム７４は離型や連続成形に有効であるが必ずしも使用する必要はない。 Subsequently, as shown in FIG. 24A, the carrier 70 shown in FIG. 23E is placed on the other mold 65g. The one mold 55g used together with the other mold 65g includes a clamper 58g and a cavity piece 57g, and is configured so that the depth of the cavity recess formed by the inner peripheral surface of the clamper 58g and the end face of the cavity piece is variable. Also, the release film 74 is held by suction on the mold surface of the one mold 55g. The release film 74 is effective for mold release and continuous molding, but is not necessarily used.
続いて、図２４Ｂに示されるように、一方金型５５ｇと他方金型６５ｇとを型閉じしキャリア７０をクランプする。この際に、透光性樹脂４０がキャビティ駒５７ｇに加熱加圧されることでレンズ成形が完了する。その後、一方金型５５ｇ及び他方金型６５ｇをＬＥＤパッケージ用基板から取り外す（離型する）ことにより、図２５Ａに示されるようにレンズ成形後（透光性樹脂４０の充填後）のＬＥＤチップ３０とリフレクタ部材とがキャリア７０上に成形される。 Subsequently, as shown in FIG. 24B, the one mold 55 g and the other mold 65 g are closed to clamp the carrier 70. At this time, the lens molding is completed by heating and pressurizing the translucent resin 40 to the cavity piece 57g. Thereafter, the one die 55g and the other die 65g are removed (released) from the LED package substrate, whereby the LED chip 30 after lens molding (after filling with the translucent resin 40) as shown in FIG. 25A. And the reflector member are formed on the carrier 70.
続いて、レンズ成形後のＬＥＤチップ３０とリフレクタ部材から接着部材７２及びキャリア７０を取り外した後、図２５Ｂに示されるように上下反転して、ＬＥＤチップ３０の下面に再配線層８０を形成する。この再配線層８０は、ＬＥＤチップ３０の電極同士を接続し、またＬＥＤチップ３０の電極及び電極部１２ｇを接続する配線層と、それらに介在して絶縁する絶縁層（誘電体層）とを有する。 Subsequently, after removing the adhesive member 72 and the carrier 70 from the LED chip 30 and the reflector member after lens molding, the rewiring layer 80 is formed on the lower surface of the LED chip 30 by turning upside down as shown in FIG. 25B. . The rewiring layer 80 includes a wiring layer that connects the electrodes of the LED chip 30 and connects the electrodes of the LED chip 30 and the electrode portion 12g, and an insulating layer (dielectric layer) that is interposed therebetween to insulate the wiring layer. Have.
再配線層８０は、ＬＥＤチップ３０の電極（アノード電極、カソード電極）及びリードフレーム１０ｇ（電極部）の位置と接続するように形成される。 The rewiring layer 80 is formed so as to be connected to the position of the electrode (anode electrode, cathode electrode) of the LED chip 30 and the lead frame 10g (electrode part).
続いて、図２５Ｃに示されるように、リードフレーム１０ｇの外部接続端子１６ｇの中央部（所定の位置）にて分離するようにブレード式切断装置を用いて切断することにより、内側の外部接続端子１６ｇ１と外側の外部接続端子１６ｇ２を形成することができる。なお、この工程においては、外部接続端子１６ｇのみを分割するように切断すればよく、樹脂２０の全部は切断しない。その後、図２５Ｄに示されるように、吊りリード１９ｌの位置（Ｄで示される位置）において、樹脂２０を吊りリード１９ｌの幅より広く切断して個片化することによりＬＥＤパッケージが得られる。これにより、図２５Ｅに示されるような一例としてのＬＥＤパッケージ１００ｇが製造される。 Subsequently, as shown in FIG. 25C, the external connection terminal on the inner side is cut by using a blade-type cutting device so as to be separated at the center (predetermined position) of the external connection terminal 16g of the lead frame 10g. 16g1 and the external connection terminal 16g2 on the outside can be formed. In this step, only the external connection terminal 16g may be cut so as to be divided, and the entire resin 20 is not cut. Thereafter, as shown in FIG. 25D, the LED package is obtained by cutting the resin 20 wider than the width of the suspension lead 19l at the position of the suspension lead 19l (position indicated by D). Thereby, an LED package 100g as an example as shown in FIG. 25E is manufactured.
これによれば、図２５Ｅに示されるように、再配線層８０は、例えば、２つのＬＥＤチップ３０の電極同士を接続すると共に、２つのＬＥＤチップ３０の電極と一対の外部接続端子１６ｇ１、１６ｇ２とを接続するような構成とすることができる。したがって、２つのＬＥＤチップ３０を外部接続端子１６ｇ１、１６ｇ２で駆動することにより、一対の外部接続端子１６ｇ１、１６ｇ２毎に接続されたＬＥＤチップ３０を個別に駆動することができる。 According to this, as shown in FIG. 25E, the redistribution layer 80 connects, for example, the electrodes of the two LED chips 30 and the electrodes of the two LED chips 30 and the pair of external connection terminals 16g1, 16g2. And can be configured to be connected. Therefore, by driving the two LED chips 30 with the external connection terminals 16g1 and 16g2, the LED chips 30 connected to the pair of external connection terminals 16g1 and 16g2 can be individually driven.
このようなＬＥＤパッケージ１００ｇは、例えばＬＥＤパッケージの搭載可能な領域を有する基板９０の上に実装される。そして、多数の外部接続端子１６ｇ１、１６ｇ２は、ワイヤ９５を用いて、例えばドライバ回路等の周辺回路を含む基板９０の電極９２、９３と電気的に接続される。 Such an LED package 100g is mounted on a substrate 90 having a region where the LED package can be mounted, for example. The large number of external connection terminals 16g1 and 16g2 are electrically connected to the electrodes 92 and 93 of the substrate 90 including peripheral circuits such as a driver circuit using wires 95, for example.
このように、本実施例によれば、多数の外部接続端子１６ｇ１、１６ｇ２を高密度に配置することができ、ＬＥＤパッケージ１００ｇの発光状態を細かく制御することができるため、例えば表示装置として用いることも可能となる。 As described above, according to the present embodiment, a large number of external connection terminals 16g1 and 16g2 can be arranged with high density, and the light emission state of the LED package 100g can be finely controlled. Is also possible.
なお、１対の外部接続端子１６ｇ１、１６ｇ２に接続するＬＥＤチップの数や接続パターンは再配線層８０の構成により自在に変更することができ、例えば、１つのＬＥＤチップ３０を１対の外部接続端子１６ｇ１、１６ｇ２に接続することで、全てのＬＥＤチップ３０を個別に駆動することもできる。また、外部接続端子１６を一対の外部接続端子１６ｇ１、１６ｇ２に切断せずに、１つの外部接続端子１６として用いることもできる。さらに、外部接続端子１６は、吊りリード１９ｌによって矩形に形成される領域を１つのパッケージとして用いており、四辺の全ての吊りリード１９ｌに電極部１２ｇを設ける構成だけでなく、対向する二辺の吊りリード１９ｌのみに電極部１２ｇを設ける構成としてもよい。 The number and connection pattern of the LED chips connected to the pair of external connection terminals 16g1 and 16g2 can be freely changed according to the configuration of the rewiring layer 80. For example, one LED chip 30 is connected to a pair of external connection terminals. By connecting to the terminals 16g1 and 16g2, all the LED chips 30 can be driven individually. Further, the external connection terminal 16 can be used as one external connection terminal 16 without being cut into a pair of external connection terminals 16g1 and 16g2. Further, the external connection terminal 16 uses a region formed in a rectangular shape by the suspension leads 19l as one package. The external connection terminal 16 has not only a configuration in which the electrode portions 12g are provided on all the suspension leads 19l on four sides, but also two opposing sides. The electrode portion 12g may be provided only on the suspension lead 19l.
次に、図２７Ａ～２７Ｄを参照して、本発明の実施例６について説明する。図２７Ａ～２７Ｄは、本実施例におけるＬＥＤパッケージの製造工程図であり、図２７Ａ～２７Ｄの順に時系列で示している。本実施例のＬＥＤパッケージは、上述した実施例のうちダイパッドを有する適宜のＬＥＤパッケージ用基板を用いることができ、ワイヤを用いずにＬＥＤチップの電気的接続を行うように構成されている。 Next, Embodiment 6 of the present invention will be described with reference to FIGS. 27A to 27D. 27A to 27D are manufacturing process diagrams of the LED package in this embodiment, which are shown in time series in the order of FIGS. 27A to 27D. The LED package of the present embodiment can use an appropriate LED package substrate having a die pad among the embodiments described above, and is configured to electrically connect the LED chip without using a wire.
まず、図２７Ａに示されるように、リードフレーム１０ｈは、ダイパッド１１ｈ、電極部１２ｈ、１３ｈを備えている。また、電極部１２ｈ、１３ｈには、外部接続端子１６ｈ、１７ｈがそれぞれ設けられている。そして、このように加工されたリードフレーム１０ｈに対して樹脂２０を成形することにより、ＬＥＤパッケージ用基板が得られる。本実施例では、その後、電極部１２ｈ、１３ｈの少なくとも一部とダイパッド１１ｈの上に、絶縁層２０１を形成する。絶縁層２０１は、半硬化状態とすることによりダイアタッチ材として用いることができる。また、例えば下面においても発光するＬＥＤチップを用いるときには、絶縁層２０１は透明または半透明であることが好ましい。本実施例において、絶縁層２０１は、例えば絶縁性で熱伝導性のフィラーを含んだシリコーン樹脂であるが、これに熱伝導性のフィラーを含んでいなくても良いし、シリコーン樹脂に限定されるものではない。 First, as shown in FIG. 27A, the lead frame 10h includes a die pad 11h and electrode portions 12h and 13h. The electrode portions 12h and 13h are provided with external connection terminals 16h and 17h, respectively. Then, the LED package substrate is obtained by molding the resin 20 on the lead frame 10h thus processed. In this embodiment, thereafter, an insulating layer 201 is formed on at least a part of the electrode portions 12h and 13h and the die pad 11h. The insulating layer 201 can be used as a die attach material in a semi-cured state. For example, when an LED chip that emits light on the lower surface is used, the insulating layer 201 is preferably transparent or translucent. In this embodiment, the insulating layer 201 is, for example, a silicone resin containing an insulating and thermally conductive filler. However, the insulating layer 201 may not contain a thermally conductive filler, and is not limited to a silicone resin. It is not something.
続いて、図２７Ｂに示されるように、絶縁層２０１を介してダイパッド１１ｈの上に複数のＬＥＤチップ３０を搭載する。ただし本実施例は、これに限定されるものではなく、一つのＬＥＤチップ３０のみを搭載する構成についても適用可能である。また本実施例において、ＬＥＤチップ３０の電極（アノード電極、カソード電極）を上面側に向けるように（ＬＥＤチップ３０の電極面を絶縁層２０１との搭載面とは反対側を向けるように）、ＬＥＤチップ３０を搭載する。 Subsequently, as shown in FIG. 27B, a plurality of LED chips 30 are mounted on the die pad 11 h via the insulating layer 201. However, the present embodiment is not limited to this, and can be applied to a configuration in which only one LED chip 30 is mounted. In this embodiment, the electrodes (anode electrode, cathode electrode) of the LED chip 30 are directed to the upper surface side (the electrode surface of the LED chip 30 is directed to the side opposite to the mounting surface with the insulating layer 201). The LED chip 30 is mounted.
続いて、図２７Ｃに示されるように、絶縁層２０３を形成する。絶縁層２０３は、続く工程で形成する配線層３５１の位置の下に線状又は面状に形成される。本実施例において、絶縁層２０３は例えば透光性を有するシリコーン樹脂が適当であるが、これに限定されるものではない。 Subsequently, as shown in FIG. 27C, an insulating layer 203 is formed. The insulating layer 203 is formed in a linear shape or a planar shape under the position of the wiring layer 351 to be formed in a subsequent process. In this embodiment, the insulating layer 203 is suitably a translucent silicone resin, but is not limited thereto.
続いて、図２７Ｄに示されるように、隣接する２つのＬＥＤチップ３０のうち一方のＬＥＤチップ３０の一方の電極と、他方のＬＥＤチップ３０の他方の電極とを電気的に接続するように配線層３５１（導電層）を形成する。また、配線層３５１により、直列的に接続される複数のＬＥＤチップ３０のうち端部に位置するＬＥＤチップ３０の電極をリードフレーム１０ｈの電極部１２ｈに電気的に接続される。最後に、前述の実施例と同様に透光性樹脂（レンズ樹脂）を成形して個片化することにより、ＬＥＤパッケージが完成する。 Subsequently, as shown in FIG. 27D, wiring is performed so as to electrically connect one electrode of one LED chip 30 and the other electrode of the other LED chip 30 among the two adjacent LED chips 30. A layer 351 (a conductive layer) is formed. In addition, the wiring layer 351 electrically connects the electrodes of the LED chip 30 located at the end of the plurality of LED chips 30 connected in series to the electrode portion 12h of the lead frame 10h. Finally, the light-transmitting resin (lens resin) is molded and separated into pieces as in the above-described embodiment, thereby completing the LED package.
次に、図２８Ａ～２８Ｃを参照して、本実施例の変形例について説明する。図２８Ａ～２８Ｃは、本実施例の変形例としてのＬＥＤパッケージの製造工程図であり、図２８Ａ～２８Ｃの順に時系列で示している。 Next, a modification of this embodiment will be described with reference to FIGS. 28A to 28C. 28A to 28C are manufacturing process diagrams of an LED package as a modification of the present embodiment, which are shown in time series in the order of FIGS. 28A to 28C.
図２８Ａは、図２７Ａと同様の構成を示しており、ダイパッド１１ｈの上には絶縁層２０１が形成される。続いて、図２８Ｂに示されるように、絶縁層２０１を介してダイパッド１１ｈの上に複数の配線層３５２（導電層）を形成する。そして、図２８Ｃに示されるように、複数のＬＥＤチップ３０を実装する。本変形例において、ＬＥＤチップ３０は、その電極を下に向けて（ＬＥＤチップ３０の電極面をダイパッド１１ｈ側に向けて）搭載することで実装が完了する。このとき、ＬＥＤチップ３０の電極は、対応する配線層３５２と電気的に接続される。 FIG. 28A shows a configuration similar to FIG. 27A, and an insulating layer 201 is formed on the die pad 11h. Subsequently, as shown in FIG. 28B, a plurality of wiring layers 352 (conductive layers) are formed on the die pad 11h with the insulating layer 201 interposed therebetween. Then, as shown in FIG. 28C, a plurality of LED chips 30 are mounted. In the present modification, the mounting of the LED chip 30 is completed by mounting the LED chip 30 with the electrodes facing downward (with the electrode surface of the LED chip 30 facing the die pad 11h). At this time, the electrode of the LED chip 30 is electrically connected to the corresponding wiring layer 352.
配線層３５２により、ＬＥＤチップ３０の電極とリードフレーム１０ｈの電極部１２ｈ、１３ｈとの間、及び、ＬＥＤチップ３０の電極の間がそれぞれ電気的に接続される。最後に、前述の実施例と同様に、透光性樹脂（レンズ樹脂）を成形して個片化することにより、ＬＥＤパッケージが完成する。 By the wiring layer 352, the electrodes of the LED chip 30 and the electrode portions 12h and 13h of the lead frame 10h and the electrodes of the LED chip 30 are electrically connected. Finally, similar to the above-described embodiments, a light-transmitting resin (lens resin) is molded and separated into pieces, thereby completing an LED package.
また本実施例において、ＬＥＤチップとして、上面（第１の主面）及び下面（第２の主面）のそれぞれに電極を有するＬＥＤチップ（２つの電極が互いに異なる主面上に設けられているＬＥＤチップ）を用いる場合、図２７Ａ～２７Ｄ及び図２８Ａ～２８Ｃを参照して説明した製造工程を併用してもよい。 In this embodiment, the LED chip has an LED chip having two electrodes on the upper surface (first main surface) and the lower surface (second main surface) (two electrodes are provided on different main surfaces). When the LED chip) is used, the manufacturing process described with reference to FIGS. 27A to 27D and FIGS. 28A to 28C may be used in combination.
次に、図２９Ａ、２９Ｂ乃至図３１を参照して、本発明の実施例７について説明する。図２９Ａ、２９Ｂ及び図３０Ａ，３０Ｂは、本実施例におけるＬＥＤパッケージの製造工程図（平面図）であり、図２９Ａ、２９Ｂ、及び、図３０Ａ、３０Ｂの順に時系列で示している。 Next, Embodiment 7 of the present invention will be described with reference to FIGS. 29A and 29B to FIG. 29A and 29B and FIGS. 30A and 30B are manufacturing process diagrams (plan views) of the LED package in this example, which are shown in time series in the order of FIGS. 29A and 29B and FIGS. 30A and 30B.
このとき、図２９Ａ、２９Ｂ及び図３０Ａ，３０Ｂに示されるように、例えば、コモンラインと駆動ラインのいずれかとして機能する配線をＬＥＤチップ３０ａの上下に形成し、具体的には、ＬＥＤチップ３０ａの下側に一方の配線を形成し、ＬＥＤチップ３０ａの上側に他方の配線を形成することで、コモンラインと駆動ラインとを利用した表示装置として機能させることもできる。このコモンラインは、ＬＥＤチップ３０ａの一方の電極に接続され、例えば駆動電流を流すラインを選択するために用いられる。また、駆動ラインは、例えば任意の電流または電圧で駆動電流を流すための各駆動電源に接続するためにＬＥＤチップ３０ａの他方の電極に接続される。この場合、図３１に示されるように、本実施例に示される配線構造のＬＥＤパッケージが適切に利用できる。 At this time, as shown in FIGS. 29A and 29B and FIGS. 30A and 30B, for example, wirings functioning as either a common line or a drive line are formed above and below the LED chip 30a. Specifically, the LED chip 30a By forming one wiring on the lower side and forming the other wiring on the upper side of the LED chip 30a, it is possible to function as a display device using the common line and the drive line. This common line is connected to one electrode of the LED chip 30a and is used, for example, to select a line through which a drive current flows. In addition, the drive line is connected to the other electrode of the LED chip 30a in order to connect to each drive power source for flowing a drive current at an arbitrary current or voltage, for example. In this case, as shown in FIG. 31, the LED package having the wiring structure shown in this embodiment can be used appropriately.
まず、図２９Ａは、ＬＥＤチップ実装前のＬＥＤパッケージ用基板の平面図を示している。本実施例において、外部接続端子１６ｈ、１７ｈをそれぞれ備えた複数の電極部１２ｈ、１３ｈが形成されている。例えば、図２９Ａに示されるように、矩形のダイパッド１１ｈの上辺及び下辺に沿って複数の電極部１２ｈが配置されている。また、ダイパッド１１ｈの右辺及び左辺に沿って複数の電極部１３ｈが配置されている。換言すれば、ダイパッド１１ｈは、ｎ行ｍ列に配置されるＬＥＤチップ３０ａを無駄なく実装できるように矩形に形成された実装エリアを有し、四隅で外部に接続されて支持される構成となっている。また、電極部１２ｈ、１３ｈは、ダイパッド１１ｈを挟んでそれぞれ対向する辺において露出するように配置され、ＬＥＤチップ３０ａに接続可能となっている。換言すれば、複数の電極部１２ｈは、複数の電極部１３ｈが配置された辺に隣接する辺に配置されている。 First, FIG. 29A shows a plan view of an LED package substrate before LED chip mounting. In the present embodiment, a plurality of electrode portions 12h and 13h having external connection terminals 16h and 17h, respectively, are formed. For example, as shown in FIG. 29A, a plurality of electrode portions 12h are arranged along the upper side and the lower side of the rectangular die pad 11h. A plurality of electrode portions 13h are arranged along the right and left sides of the die pad 11h. In other words, the die pad 11h has a mounting area formed in a rectangular shape so that the LED chips 30a arranged in n rows and m columns can be mounted without waste, and is supported by being connected to the outside at four corners. ing. Further, the electrode portions 12h and 13h are arranged so as to be exposed at opposite sides across the die pad 11h, and can be connected to the LED chip 30a. In other words, the plurality of electrode portions 12h are disposed on the side adjacent to the side on which the plurality of electrode portions 13h are disposed.
この状態において、図２９Ｂに示されるように、絶縁層と配線層とを連続して成形することで、絶縁層を跨ぎながら、対向する電極部１２ｈ同士を接続する配線層を形成する。これにより、コモンライン（または駆動ライン）としての配線層３５２を形成する。続いて、図３０Ａに示されるように、配線層３５２と電気的に接続されるようにＬＥＤチップ３０ａを搭載する。これにより、ＬＥＤチップ３０ａの第１の電極が配線層３５２（この場合コモンライン）と接続される。続いて、図３０Ｂに示されるように、ＬＥＤチップ３０ａの上面に駆動ラインとしての配線層３５１を形成する。これにより、ＬＥＤチップ３０ａの第２の電極が駆動ライン（またはコモンライン）として形成される配線層３５１と接続される。なお、配線層３５１を形成する前には、図２７Ｃと同様に絶縁層を成形しておくことが好ましい。 In this state, as shown in FIG. 29B, the insulating layer and the wiring layer are continuously formed to form a wiring layer that connects the opposing electrode portions 12h while straddling the insulating layer. As a result, a wiring layer 352 as a common line (or drive line) is formed. Subsequently, as illustrated in FIG. 30A, the LED chip 30 a is mounted so as to be electrically connected to the wiring layer 352. Thereby, the 1st electrode of LED chip 30a is connected with wiring layer 352 (in this case common line). Subsequently, as shown in FIG. 30B, a wiring layer 351 as a drive line is formed on the upper surface of the LED chip 30a. Accordingly, the second electrode of the LED chip 30a is connected to the wiring layer 351 formed as a drive line (or common line). Note that before the wiring layer 351 is formed, an insulating layer is preferably formed in the same manner as in FIG. 27C.
最後に、前述と同様に透光性樹脂（レンズ樹脂）を成形して個片化することにより、図３１に示されるようなＬＥＤパッケージが完成する。図３１は、本実施例のＬＥＤパッケージの斜視図である。このように構成された、ＬＥＤパッケージは、複数の外部接続端子１６ｈ、１７ｈに外部の駆動回路を有する基板側の端子にそれぞれ接続することで、表示装置として利用することができる。この場合、ＬＥＤチップ３０ａを接続する配線を共通させない場合と比較して少ない端子で表示装置を駆動でき、情報表示可能なパッケージを安価に製造することができる。 Finally, a light-transmitting resin (lens resin) is molded and separated into pieces as described above to complete the LED package as shown in FIG. FIG. 31 is a perspective view of the LED package of the present example. The LED package configured as described above can be used as a display device by connecting to a plurality of external connection terminals 16h and 17h, respectively, on a substrate side terminal having an external drive circuit. In this case, the display device can be driven with fewer terminals than in the case where the wiring for connecting the LED chip 30a is not shared, and a package capable of displaying information can be manufactured at low cost.
なお実施例６及び本実施例において、配線層や絶縁層は、例えば静電噴霧や静電塗布により形成することができる。ただし本実施例はこれに限定されるものではなく、静電気力を利用しない他の塗布方法により配線層や絶縁層を形成してもよい。また、配線層としては例えば金及び銀やこれらの合金などを用いることができるが、銀を用いることでＬＥＤチップからの光の反射率を向上することができる。また、ワイヤによらず配線層を用いているため、ＬＥＤチップ３０ａから放出された光が屈曲するように張られたワイヤによって不規則に反射してしまうことを防止でき、表示品質を向上することもできる。 In Example 6 and this example, the wiring layer and the insulating layer can be formed by electrostatic spraying or electrostatic coating, for example. However, the present embodiment is not limited to this, and the wiring layer and the insulating layer may be formed by another coating method that does not use electrostatic force. In addition, as the wiring layer, for example, gold, silver, or an alloy thereof can be used, but the reflectance of light from the LED chip can be improved by using silver. Moreover, since the wiring layer is used regardless of the wire, it is possible to prevent the light emitted from the LED chip 30a from being irregularly reflected by the wire stretched so as to be bent, and to improve the display quality. You can also.
なお、本実施例において説明したＬＥＤパッケージ用基板は、上述したような配線構造のみならず、ワイヤを用いた配線構造により一列に並べられたＬＥＤチップを接続してもよい。また、図３１に示されるようなＬＥＤパッケージ用基板に搭載されたＬＥＤチップは、駆動ラインとコモンラインとで構成されるような配線以外の配線で接続されてもよい。例えば、複数のＬＥＤチップで構成されるエリアを複数有するようなエリア分割構成として、エリア毎に発光制御してもよい。 Note that the LED package substrate described in the present embodiment may be connected not only to the wiring structure as described above but also to LED chips arranged in a line by a wiring structure using wires. Further, the LED chips mounted on the LED package substrate as shown in FIG. 31 may be connected by wirings other than the wiring constituted by the drive line and the common line. For example, the light emission control may be performed for each area as an area division configuration having a plurality of areas constituted by a plurality of LED chips.
次に、図３２Ａ，３２Ｂ乃至図３５を参照して、本発明の実施例８について説明する。本実施例は、単位リードフレーム（一つのＬＥＤパッケージに対応するＬＥＤパッケージ用基板）の平面が実施例４と同様に六角形である構成について説明する。ただし本実施例は、単位リードフレームの各電極部において複数の外部接続端子が設けられている点で、実施例４とは異なる。好ましくは、各電極部は、六角形の各頂点の近傍に設けられている。また好ましくは、各電極部は六角形の頂点（平面上で頂点の端部）よりも内側に設けられており、各々のＬＥＤパッケージをその側面において接触しても外部接続端子同士が電気的に接続されないように配置可能に構成される。これにより、高密度かつ高出力の発光装置を自由に構成できるＬＥＤパッケージを提供することができる。 Next, an eighth embodiment of the present invention will be described with reference to FIGS. 32A and 32B to FIG. In the present embodiment, a configuration in which the plane of the unit lead frame (LED package substrate corresponding to one LED package) is a hexagon like the fourth embodiment will be described. However, the present embodiment is different from the fourth embodiment in that a plurality of external connection terminals are provided in each electrode portion of the unit lead frame. Preferably, each electrode part is provided in the vicinity of each vertex of the hexagon. Preferably, each electrode portion is provided on the inner side of the hexagonal apex (the end portion of the apex on the plane), and the external connection terminals are electrically connected to each other even if each LED package is contacted on the side surface. It is configured to be arranged so as not to be connected. Thereby, the LED package which can comprise freely the light emitting apparatus of a high density and a high output can be provided.
図３２Ａは本実施例におけるリードフレーム１０ｋの平面図、図３２Ｂは、本実施例におけるＬＥＤパッケージ用基板の平面図である。図３３は、本実施例におけるＬＥＤパッケージ用基板の斜視図である。本実施例では、図３２Ａに示されるように、六角形のリードフレーム１０ｋ（単位リードフレーム）は、ダイパッド１１ｋ及び電極部１２ｋ、１３ｋを有する。電極部１２ｋには、複数の外部接続端子１６ｋ（本実施例では３つの外部接続端子１６ｋ）が形成されている。同様に、電極部１３ｋには、複数の外部接続端子１７ｋ（本実施例では３つの外部接続端子１７ｋ）が形成されている。リードフレーム１０ｋに対して樹脂２０を成形することにより、図３２Ｂ及び図３３に示されるようなＬＥＤパッケージ用基板（一つのＬＥＤパッケージに相当する領域）が形成される。 FIG. 32A is a plan view of the lead frame 10k in this embodiment, and FIG. 32B is a plan view of the LED package substrate in this embodiment. FIG. 33 is a perspective view of the LED package substrate in the present embodiment. In this embodiment, as shown in FIG. 32A, the hexagonal lead frame 10k (unit lead frame) includes a die pad 11k and electrode portions 12k and 13k. A plurality of external connection terminals 16k (three external connection terminals 16k in this embodiment) are formed on the electrode portion 12k. Similarly, a plurality of external connection terminals 17k (three external connection terminals 17k in this embodiment) are formed on the electrode portion 13k. By molding the resin 20 on the lead frame 10k, an LED package substrate (an area corresponding to one LED package) as shown in FIGS. 32B and 33 is formed.
このように本実施例のＬＥＤパッケージ用基板は、複数の外部接続端子１６ｋ、１７ｋが設けられており、特に、六角形の各頂点（角部）に外部接続端子１６ｋ、１７ｋが設けられている。また外部接続端子１６ｋ、１７ｋは、図３２Ｂに示されるように、各頂点から離れて（各頂点よりも内側に）設けられている。 As described above, the LED package substrate of this embodiment is provided with a plurality of external connection terminals 16k and 17k, and in particular, the external connection terminals 16k and 17k are provided at each vertex (corner) of the hexagon. . Further, as shown in FIG. 32B, the external connection terminals 16k and 17k are provided apart from each vertex (inside from each vertex).
図３４Ａ，３４Ｂ及び図３５は、本実施例におけるＬＥＤパッケージ１００ｋの利用形態を説明するための平面図である。図３２Ｂ及び図３３に示されるＬＥＤパッケージ用基板にＬＥＤチップを実装しレンズ部を成形してＬＥＤパッケージ１００ｋを製造する。このＬＥＤパッケージ１００ｋを利用する方法として、図３４Ａに示されるようにＬＥＤパッケージ１００ｋを一次元状に配列接続して発光装置２００ａとして用いることができる。発光装置２００ａは、外部接続端子１６ｋ（電極部１２ｋ）及び外部接続端子１７ｋ（電極部１３ｋ）を交互に接続して構成する（図３４Ａ中の矢印で示されるように、外部接続端子１６ｋ、ＬＥＤチップ３０、及び、外部接続端子１７ｋの順に電流を流すように構成する）ことにより、３個のＬＥＤパッケージ１００ｋが直列に接続された直列回路が構成される。または、図３４Ｂに示されるようにＬＥＤパッケージ１００ｋを一次元状に配列接続して発光装置２００ｂとして用いることもできる。発光装置２００ｂは、隣接するＬＥＤパッケージ１００ｋのうち近接する外部接続端子１６ｋ、１７ｋを接続するだけでよい。即ち、外部接続端子１６ｋ（電極部１２ｋ）同士を接続し、また、外部接続端子１７ｋ（電極部１３ｋ）同士を接続して構成される。これにより、３個のＬＥＤパッケージ１００ｋが並列に接続され、図３４Ｂ中の端子Ａから端子Ｂへ電流を流すような並列回路を構成することができる。 34A, 34B and FIG. 35 are plan views for explaining usage patterns of the LED package 100k in the present embodiment. The LED package is mounted on the LED package substrate shown in FIG. 32B and FIG. 33, and the lens part is molded, thereby manufacturing the LED package 100k. As a method of using the LED package 100k, as shown in FIG. 34A, the LED packages 100k can be arranged and connected in a one-dimensional manner to be used as the light emitting device 200a. The light emitting device 200a is configured by alternately connecting the external connection terminal 16k (electrode part 12k) and the external connection terminal 17k (electrode part 13k) (as indicated by the arrows in FIG. 34A, the external connection terminal 16k, the LED By configuring the chip 30 and the external connection terminal 17k in order of current), a series circuit in which three LED packages 100k are connected in series is configured. Alternatively, as shown in FIG. 34B, the LED packages 100k can be arranged and connected in a one-dimensional manner to be used as the light emitting device 200b. The light emitting device 200b only needs to connect the adjacent external connection terminals 16k and 17k among the adjacent LED packages 100k. That is, the external connection terminals 16k (electrode parts 12k) are connected to each other, and the external connection terminals 17k (electrode parts 13k) are connected to each other. Thereby, the three LED packages 100k are connected in parallel, and a parallel circuit in which current flows from the terminal A to the terminal B in FIG. 34B can be configured.
この場合、これらの発光装置２００ａ、２００ｂは同数のＬＥＤパッケージ１００ｋを同様に配列しているが、外部接続端子１６ｋ、１７ｋが各頂点から離れて設けられているため、配線する外部接続端子を選択的に用いることができ、照明装置などにおいて要求される輝度や発光面の面積などに応じて、簡易に回路構成を切り替えることができる。 In this case, the light emitting devices 200a and 200b have the same number of LED packages 100k arranged in the same manner. However, since the external connection terminals 16k and 17k are provided away from the vertices, the external connection terminals to be wired are selected. The circuit configuration can be easily switched according to the luminance required for the lighting device or the like, the area of the light emitting surface, and the like.
なお、各頂点のそれぞれに外部接続端子を設ける構成としては、六角形のみならず他の正多角形のパッケージでも構成可能であり、上述したような四角形のＬＥＤパッケージ１００において樹脂２０内に存在する電極部１２、１３の角部を露出させることにより同様に実施することができる。なお、実施例４の製造方法においても同様に実施することもできる。 In addition, as a structure which provides an external connection terminal in each of each vertex, it can comprise not only a hexagon but another regular polygon package, and it exists in the resin 20 in the square LED package 100 as mentioned above. It can implement similarly by exposing the corner | angular part of the electrode parts 12 and 13. FIG. In addition, it can implement similarly also in the manufacturing method of Example 4. FIG.
または、図３５に示されるように７個のＬＥＤパッケージ１００ｋを隙間無く二次元状に配列接続して発光装置２００ｃとして用いてもよい。発光装置２００ｃは、図３５中の矢印で示されるように電流を流すような直列回路を構成することもできる。このように、六角形のＬＥＤパッケージ１００ｋであるため例えば四角形のＬＥＤパッケージと比較してパッケージを高密度に配置できる。なお、ＬＥＤパッケージ１００ｋを並べる個数は何個であってもよく、発光装置２００ｃを固定する領域の面積に応じて任意の個数を任意配置で設置することができる。 Alternatively, as shown in FIG. 35, seven LED packages 100k may be arranged and connected in a two-dimensional manner without a gap and used as the light emitting device 200c. The light emitting device 200c can also be configured as a series circuit that allows current to flow as shown by the arrows in FIG. As described above, since the hexagonal LED package 100k is used, the package can be arranged at a higher density than, for example, a rectangular LED package. Note that the number of the LED packages 100k arranged may be any number, and any number can be installed in any arrangement according to the area of the region where the light emitting device 200c is fixed.
また、外部接続端子１６ｋ、１７ｋは、二等辺三角形となっていることで、各頂点を構成する２辺に対して同じ距離で離れているため、これらの２辺のうち所望の辺を挟んで配置されたＬＥＤパッケージ１００ｋの外部接続端子１６ｋ、１７ｋに接続することができる。これにより自由な接続が可能となる。この場合、上述した通り、外部接続端子１６ｋ、１７ｋにボルトの固定用の貫通孔を形成しておけば、配線をボルトで締め付けるなどといった非常に簡易な作業で所望の配置を行うことができる。勿論、配線は半田と銅線などを用いて接続してもよく、配線構造と固定構造を備えた固定部材を介して配置して用いてもよい。また、電気的に接続しない外部接続端子１６ｋ、１７ｋ同士を電気的な接続のない接続手段で接続しておくことで発光装置としての強度も向上することもでき、発光装置におけるＬＥＤパッケージの分離なども防止することもできる。 Further, since the external connection terminals 16k and 17k are isosceles triangles and are separated by the same distance from the two sides constituting each vertex, the desired sides of these two sides are sandwiched between them. It can be connected to the external connection terminals 16k and 17k of the arranged LED package 100k. This allows free connection. In this case, as described above, if a through hole for fixing a bolt is formed in the external connection terminals 16k and 17k, a desired arrangement can be performed by a very simple operation such as tightening the wiring with the bolt. Of course, the wiring may be connected using solder and copper wire, or may be arranged and used via a fixing member having a wiring structure and a fixing structure. Moreover, the strength as a light emitting device can be improved by connecting the external connection terminals 16k and 17k which are not electrically connected by a connection means without electrical connection, and separation of LED packages in the light emitting device, etc. Can also be prevented.
次に、図３６乃至図４１Ａ，４１Ｂを参照して、本発明の実施例９について説明する。図３６は、本実施例における変形例としてのＬＥＤパッケージの構成図である。図３６に示されるように球体状に近い切頂二十面体の２０面の六角形の位置にＬＥＤパッケージ１００ｋを三次元状に配列接続して立体型の発光装置２００ｄを構成することもできる。発光装置２００ｄは、公園やアミューズメント施設等の照明装置に適して用いられる。また、このような構成においては、切頂二十面体における１２面の五角形の位置に五角形のＬＥＤパッケージを配置することで、合計３２面のＬＥＤパッケージを発光させることができ、非常に高光束の発光装置とすることもできる。 Next, Embodiment 9 of the present invention will be described with reference to FIGS. 36 to 41A and 41B. FIG. 36 is a configuration diagram of an LED package as a modification of the present embodiment. As shown in FIG. 36, a three-dimensional light-emitting device 200d can be configured by three-dimensionally connecting LED packages 100k at 20 hexagonal positions on a truncated icosahedron that is nearly spherical. The light emitting device 200d is suitably used for a lighting device such as a park or an amusement facility. Further, in such a configuration, by arranging the pentagonal LED package at the position of the 12-sided pentagon in the truncated icosahedron, a total of 32 LED packages can be made to emit light, and a very high luminous flux It can also be set as a light emitting device.
五角形のＬＥＤパッケージの製造方法としては、一方の電極部を一体としたダイパッドと他方の電極部と有するリードフレームを、五角形状のキャビティを有する金型で樹脂２０を成形することにより製造することができる。この場合、一方の電極部として３つの頂点に外部接続端子を配置し、他方の電極部として２つの頂点に外部接続端子を配置することで、六角形のＬＥＤパッケージ１００ｋと同様に選択的に接続可能なＬＥＤパッケージとすることができる。 As a method for manufacturing a pentagonal LED package, a lead frame having a die pad integrated with one electrode portion and the other electrode portion may be manufactured by molding the resin 20 with a mold having a pentagonal cavity. it can. In this case, the external connection terminals are arranged at three vertices as one electrode part, and the external connection terminals are arranged at two vertices as the other electrode part, thereby selectively connecting like the hexagonal LED package 100k. Possible LED packages can be obtained.
図３７は、本実施例における発光装置２００ｄを備えた発光システム３００の構成図である。発光システム３００は、ＬＥＤパッケージ１００ｋを三次元状に配置することで図３６に示されるように構成された発光装置２００ｄを有する。発光システム３００は、発光装置２００ｄを放熱するための放熱構造を備える。例えばこの放熱構造には、発光装置２００ｄの温度上昇を抑制するため、ＬＥＤパッケージ１００ｋの内部には第一放熱部材３０１を設けることが好ましい。また、発光装置２００ｄを反射カップ部材３０２（リフレクタ）の内部に収容し、各ＬＥＤパッケージ１００ｋの主面から放出された光を所定の方向に反射させることで一定方向に放出するように構成することができる。この場合、発光システム３００は、高輝度かつ狭角な発光が求められるスポットライトや高所照明のような用途に利用することもできる。ただし、発光システムとしては、反射カップ部材３０２は必ずしも必要ではなく、これを用いないことにより、広角に発光可能な発光システムとして用いることもできる。 FIG. 37 is a configuration diagram of a light emitting system 300 including the light emitting device 200d in the present embodiment. The light emitting system 300 includes a light emitting device 200d configured as illustrated in FIG. 36 by arranging the LED packages 100k in a three-dimensional manner. The light emitting system 300 includes a heat dissipation structure for radiating heat from the light emitting device 200d. For example, in this heat dissipation structure, it is preferable to provide the first heat dissipation member 301 inside the LED package 100k in order to suppress the temperature rise of the light emitting device 200d. Further, the light emitting device 200d is accommodated in the reflection cup member 302 (reflector), and the light emitted from the main surface of each LED package 100k is reflected in a predetermined direction to be emitted in a certain direction. Can do. In this case, the light-emitting system 300 can also be used for applications such as spotlights and high-lights that require high-luminance and narrow-angle light emission. However, the reflection cup member 302 is not necessarily required as the light emitting system, and by using this, the light emitting system can be used as a light emitting system capable of emitting light at a wide angle.
また、第一放熱部材３０１がＬＥＤパッケージ１００ｋから伝えられた熱を任意の媒体３０３（気体や液体）を介して、凹凸として構成される放熱用フィンなどの放熱構造を有する第二放熱部材３０４にさらに伝え、放熱ファン３０５で強制的に放熱することで、発熱の大きなＬＥＤパッケージ１００ｋが多数配置されている場合であっても放熱を行うことができる。このような構成により、高密度かつ高出力のＬＥＤパッケージを用いた高光束の発光システム３００を提供することができる。 Further, the heat radiated from the LED package 100k by the first heat radiating member 301 is transferred to the second heat radiating member 304 having a heat radiating structure such as a heat radiating fin configured as irregularities via an arbitrary medium 303 (gas or liquid). Further, by forcibly radiating heat with the heat radiating fan 305, heat can be radiated even when a large number of LED packages 100k with large heat generation are arranged. With such a configuration, it is possible to provide a high luminous flux light emitting system 300 using a high density and high output LED package.
図３８は、本実施例の発光システム３００におけるＬＥＤパッケージの配列の一例とその接続構成の説明図である。同図に示される構成では、一例として、２０個のＬＥＤパッケージ１００ｋを並列に接続する場合のＬＥＤパッケージ１００ｋの展開図として示されている。同図において外部接続端子１６ｋ、１７ｋ間に接続されるように示される２点差線と、ハッチングされた矩形領域で示される部分は、電気的な配線を意味する。この電気的な接続にはコネクタなどを利用することができる。このように切頂二十面体の六角形の位置にＬＥＤパッケージ１００ｋを配置し接続することで、発光装置２００ｄにおける図３９に示されるような発光システム３００の回路を構成することができる。 FIG. 38 is an explanatory diagram of an example of the arrangement of LED packages and the connection configuration thereof in the light emitting system 300 of the present embodiment. In the configuration shown in the figure, as an example, a development view of the LED package 100k when 20 LED packages 100k are connected in parallel is shown. In the same figure, a two-point difference line shown to be connected between the external connection terminals 16k and 17k and a portion indicated by a hatched rectangular area mean an electrical wiring. A connector or the like can be used for this electrical connection. Thus, by arranging and connecting the LED package 100k to the hexagonal position of the truncated icosahedron, a circuit of the light emitting system 300 as shown in FIG. 39 in the light emitting device 200d can be configured.
図３９において、２０個のＬＥＤパッケージ１００ｋの各々において多数含まれるＬＥＤチップのグループによって構成される発光ダイオード構造Ｄｇ１～Ｄｇ２０は、電極部１２ｋ、１３ｋと図３８においてハッチングされた矩形領域で示される配線とによって実質的に構成される高圧側の共通配線Ｈ１～Ｈ５と低圧側の共通配線Ｌ１～Ｌ５との間に接続されることになる。一例として低圧側の共通配線Ｌ１は、図３８及び図３９に示されるように、図３８におけるに最左の列の２つのＬＥＤパッケージ１００ｋにおいて外部接続端子１７ｋを含む電極部１３ｋと、同図におけるに左から２番目の列の２つのＬＥＤパッケージ１００ｋにおいて外部接続端子１６ｋを含む電極部１２ｋと、配線とによって構成される。 In FIG. 39, the light emitting diode structures Dg1 to Dg20 constituted by a group of LED chips included in each of the 20 LED packages 100k are connected to the electrode parts 12k and 13k and the hatched rectangular areas in FIG. Are connected between the high-voltage side common wires H1 to H5 and the low-voltage side common wires L1 to L5. As an example, as shown in FIG. 38 and FIG. 39, the common wiring L1 on the low voltage side includes the electrode portion 13k including the external connection terminal 17k in the two LED packages 100k in the leftmost column in FIG. In the second LED package 100k in the second column from the left, the electrode portion 12k including the external connection terminal 16k and the wiring are configured.
これらの共通配線Ｈ１～Ｈ５、Ｌ１～Ｌ５に接続された端部のＬＥＤパッケージ１００ｋは、外部接続コネクタ３０６を介して電源や駆動回路に接続される。この外部接続コネクタ３０６は、５角形に構成されて、高圧側の共通配線Ｈ１～Ｈ５と低圧側の共通配線Ｌ１～Ｌ５の端部に相当する外部接続端子１６ｋ、１７ｋがそれぞれ接続可能となるように、角部に一対の接続端子３０６ａ、３０６ｂを有する。これらの接続端子３０６ａ、３０６ｂは、電源や駆動回路に接続される一対の端子３０６ｃ、３０６ｄに接続される。これにより、図３６、図３８及び図３９に示されるように接続される２０個のＬＥＤパッケージ１００ｋは、実質的に全て並列に接続されることになる。 The LED package 100k at the end connected to the common wirings H1 to H5 and L1 to L5 is connected to a power source and a driving circuit via an external connection connector 306. The external connection connector 306 has a pentagonal shape so that the external connection terminals 16k and 17k corresponding to the ends of the high-voltage side common wires H1 to H5 and the low-voltage side common wires L1 to L5 can be connected to each other. In addition, a pair of connection terminals 306a and 306b are provided at the corners. These connection terminals 306a and 306b are connected to a pair of terminals 306c and 306d connected to a power source and a drive circuit. As a result, the 20 LED packages 100k connected as shown in FIGS. 36, 38 and 39 are substantially all connected in parallel.
図４０Ａ，４０Ｂは、一例として示す本実施例におけるＬＥＤパッケージ用基板の切断工程図である。ＬＥＤパッケージ１００ｋの六辺の各辺において、側面に所定の角度をつけた傾斜面となるように加工する場合について説明する。図３６に示されるように、ＬＥＤパッケージ１００ｋを切頂二十面体の六角形の位置に配置するように組み立てた場合、隣接するＬＥＤパッケージ１００ｋの主面同士のなす小さい方の角側の角度は約１３８．２度となる。この場合、ＬＥＤパッケージ１００ｋにおける表面の主面と側面とのなす角を６９．１度とすることで、ＬＥＤパッケージ１００ｋ同士の隙間を無くし、ＬＥＤパッケージ１００ｋの側面同士で支持し合うように組み立てることができ、発光装置２００ｄを強度の高い構造で製造することができる。 40A and 40B are cutting process diagrams of the LED package substrate in the present embodiment shown as an example. A case will be described in which each of the six sides of the LED package 100k is processed so as to have an inclined surface with a predetermined angle on the side surface. As shown in FIG. 36, when the LED package 100k is assembled so as to be arranged at the hexagonal position of the truncated icosahedron, the angle on the smaller corner side formed by the main surfaces of the adjacent LED packages 100k is It will be about 138.2 degrees. In this case, the angle between the main surface and the side surface of the LED package 100k is set to 69.1 degrees so that the gap between the LED packages 100k is eliminated and the LED packages 100k are assembled to be supported by the side surfaces. The light emitting device 200d can be manufactured with a high strength structure.
このようなＬＥＤパッケージ１００ｋの切断工程では、例えば、図１７に示されるリードフレーム１０ｆにおいて、ダムバー１９ｉを省き、単位リードフレームの向きを９０度傾けたような配列とすればよい。このリードフレームを樹脂２０によるＭＡＰ成形で外形矩形状に封止することにより、ＬＥＤパッケージ用基板を製造しておく。この場合、この矩形領域に並べられる六角形の単位リードフレームの領域は３方向に向けられた複数の平行なダイシングラインにより分割され個片化される。即ち、この単位リードフレームの領域は、ＬＥＤパッケージの対向する２辺間の幅に相当する所定幅で離間した平行な複数の第一のダイシングラインと、第一のダイシングラインに対して第一の方向に６０度傾けられると共に所定幅で離間した平行な複数の第二のダイシングラインと、第一のダイシングラインに対して第一の方向と反対の方向に６０度傾けられると共に所定幅で離間した平行な複数の第三のダイシングラインとにより切断することにより、矩形に封止されたＬＥＤパッケージ用基板から六角形のＬＥＤパッケージ、又は、個片化されたＬＥＤパッケージ用基板を得ることができる。この切断工程において、図４０Ａに示されるように、リフレクタが成形されたＬＥＤパッケージ用基板の裏面から、外部接続端子１６ｋ、１７ｋの間を先端の角度が約４１．８度のブレードＢで切断することにより、図４０Ｂに示されるようなＬＥＤパッケージ１００ｋが製造される。これによれば、ＬＥＤパッケージ１００ｋの六辺の各辺において主面と側面とのなす鋭角側の角度が６９．１度となるパッケージ成形することができる。 In such a cutting process of the LED package 100k, for example, in the lead frame 10f shown in FIG. 17, the dam bar 19i may be omitted and the unit lead frame may be inclined 90 degrees. An LED package substrate is manufactured by sealing the lead frame into a rectangular outer shape by MAP molding with resin 20. In this case, the hexagonal unit lead frame region arranged in the rectangular region is divided and divided into pieces by a plurality of parallel dicing lines oriented in three directions. That is, the unit lead frame region includes a plurality of parallel first dicing lines spaced by a predetermined width corresponding to the width between two opposing sides of the LED package, and a first dicing line with respect to the first dicing line. A plurality of parallel second dicing lines that are inclined 60 degrees in the direction and separated by a predetermined width, and inclined by 60 degrees in a direction opposite to the first direction with respect to the first dicing line and separated by a predetermined width By cutting with a plurality of parallel third dicing lines, a hexagonal LED package or an individualized LED package substrate can be obtained from a rectangularly sealed LED package substrate. In this cutting step, as shown in FIG. 40A, the external connection terminals 16k and 17k are cut by a blade B having a tip angle of about 41.8 degrees from the back surface of the LED package substrate on which the reflector is formed. As a result, the LED package 100k as shown in FIG. 40B is manufactured. According to this, it is possible to form a package in which the acute angle formed between the main surface and the side surface is 69.1 degrees on each of the six sides of the LED package 100k.
なお、ＬＥＤパッケージ１００ｋは発光面を外面に向ける場合だけでなく、内面に向けて発光させるように配置してもよい。この場合、ＬＥＤパッケージ１００ｋの六辺の各辺において裏面における主面と側面とのなす鋭角側の角を６９．１度とするようにしてもよい。このように発光装置の内側に向けて発光するような構成とすることで、例えば内面に極めて強い可視光、紫外光または赤外光を照射することができるため、照明装置として用い、又は、加熱装置として用いることもできる。 Note that the LED package 100k may be arranged to emit light not only when the light emitting surface faces the outer surface but also toward the inner surface. In this case, the acute angle side angle between the main surface and the side surface on the back surface of each of the six sides of the LED package 100k may be 69.1 degrees. By adopting a structure that emits light toward the inside of the light emitting device in this manner, for example, the inner surface can be irradiated with extremely strong visible light, ultraviolet light, or infrared light. It can also be used as a device.
また、ＬＥＤパッケージの各辺において先端角度が９０度未満のブレードを用いて裏面側から切断する場合の効果としては、パッケージの側面から露出する吊りリード同士が誤って接触しないようにすることができる。同様な効果を奏するために、吊りリードの部分は厚みの厚いブレードで切断することで、側面に段をつけることで吊りリードの端部をパッケージ側面から凹ませるようにしてもよい。 Further, as an effect when cutting from the back surface side using a blade having a tip angle of less than 90 degrees on each side of the LED package, the suspension leads exposed from the side surface of the package can be prevented from accidentally contacting each other. . In order to achieve the same effect, the suspension lead portion may be cut with a thick blade so that the end portion of the suspension lead is recessed from the side surface of the package by providing a step on the side surface.
図４１Ａ，４１Ｂは、本実施例における変形例としてのリードフレームとＬＥＤパッケージの平面図である。図４１Ａは本変形例におけるリードフレーム１０ｌの平面図、図４１Ｂは、本変形例におけるＬＥＤパッケージ用基板の平面図である。本変形例では、図４１Ａに示されるように、六角形のリードフレーム１０ｌ（単位リードフレーム）は、ダイパッド１１ｌ及び電極部１２ｌ、１３ｌを有する。電極部１２ｌ、１３ｌには、それぞれ３つの外部接続端子１６ｌ、１７ｌが形成されている。 41A and 41B are plan views of a lead frame and an LED package as modifications of the present embodiment. FIG. 41A is a plan view of the lead frame 101 in the present modification, and FIG. 41B is a plan view of an LED package substrate in the present modification. In the present modification, as shown in FIG. 41A, a hexagonal lead frame 101 (unit lead frame) includes a die pad 11l and electrode portions 121 and 13l. Three external connection terminals 16l and 17l are formed on the electrode portions 12l and 13l, respectively.
リードフレーム１０ｌに対して樹脂２０を成形することにより、図４１Ｂに示されるようなＬＥＤパッケージ用基板（一つのＬＥＤパッケージに相当する領域）が形成される。この場合、樹脂２０により、ＬＥＤチップ実装用領域を２つに分離する分離部２１も合わせて成形される。 By molding the resin 20 on the lead frame 101, an LED package substrate (an area corresponding to one LED package) as shown in FIG. 41B is formed. In this case, the separation portion 21 that separates the LED chip mounting region into two parts is also molded by the resin 20.
このように本変形例のＬＥＤパッケージ用基板は、複数のＬＥＤチップ実装用領域を有することで、これらの領域に搭載されるＬＥＤチップの種類を変更したり、このＬＥＤチップに対してレンズ成形する透光性樹脂４０の種類を変更したりすることができる。なお、ＬＥＤチップ実装用領域の分割形状は、平行する分離部２１を複数設けてもよいし、十字形状のように分離部を交差させて設けることで３つや４つ以上に分割してもよいし、それ以上に分割してもよい。このような場合は、一対の電極部１２ｌ、１３ｌが分割されたＬＥＤチップ実装用領域のそれぞれに露出するようなリードフレームの形状とすればよい。 As described above, the LED package substrate according to the present modification has a plurality of LED chip mounting regions, so that the types of LED chips mounted in these regions can be changed, or lenses can be molded to the LED chips. The kind of translucent resin 40 can be changed. The divided shape of the LED chip mounting region may be provided with a plurality of parallel separating portions 21 or may be divided into three or four or more by providing the separating portions so as to cross each other like a cross shape. However, it may be further divided. In such a case, the shape of the lead frame may be such that the pair of electrode portions 12l and 13l are exposed in each of the divided LED chip mounting regions.
また、図４１Ｂに示されるＬＥＤパッケージ用基板を分離部２１において同図に示される破線の上下に分離するように切断することで、台形状の２個のＬＥＤパッケージ用基板としてもよい。この場合、電極部１２ｌ、１３ｌが両方に均等に切り分けられるため、同等形状の２個のＬＥＤパッケージ用基板を得ることができる。 Moreover, it is good also as two trapezoidal LED package board | substrates by cut | disconnecting the board | substrate for LED packages shown by FIG. 41B so that it may isolate | separate to the upper and lower sides of the broken line shown by the figure in the isolation | separation part 21. In this case, since the electrode parts 12l and 13l are equally cut into both, two LED package substrates having the same shape can be obtained.
この場合、図４１Ａ，４１Ｂに示される構成では、それぞれの外部接続端子１６ｌ、１７ｌのうち中央の外部接続端子１６ｌ、１７ｌは、外部接続端子１６ｌ１、１６ｌ２、１７ｌ１、１７ｌ２に分割されている。このため、分離部２１で分離するときでも接続端子１６ｌ１、１６ｌ２、１７ｌ１、１７ｌ２を樹脂２０の側面から露出させずに配置することができる。 In this case, in the configuration shown in FIGS. 41A and 41B, the central external connection terminals 16l and 17l among the external connection terminals 16l and 17l are divided into external connection terminals 16l1, 16l2, 17l1, and 17l2. For this reason, even when separating by the separating portion 21, the connection terminals 16 l 1, 16 l 2, 17 l 1, 17 l 2 can be arranged without being exposed from the side surface of the resin 20.
台形状のＬＥＤパッケージ用基板とする場合の利用形態は、例えば、実施例８におけるＬＥＤパッケージ１００ｋと組み合わせることで半円球状の発光装置とすることもできる。具体的には、台形状ＬＥＤパッケージ用基板により製造される５個のＬＥＤパッケージと５個のＬＥＤパッケージ１００ｋとを組み合わせることで、図３６に示される発光装置２００ｄの上半分又は下半分のような半球形状の発光装置を製造することができる。これによれば、均一輝度で広角に発光可能な発光装置を提供することができる。 When the trapezoidal LED package substrate is used, for example, a hemispherical light emitting device can be obtained by combining with the LED package 100k in the eighth embodiment. Specifically, by combining five LED packages manufactured using a trapezoidal LED package substrate and five LED packages 100k, such as the upper half or the lower half of the light emitting device 200d shown in FIG. A hemispherical light emitting device can be manufactured. According to this, it is possible to provide a light emitting device capable of emitting light with a uniform luminance and a wide angle.
以上の通り具体的に説明した発光装置２００ａ、２００ｂ、２００ｃ、２００ｄは、平面視で多角形の板状に形成されると共にＬＥＤチップ３０が実装されたＬＥＤパッケージ１００ｋを複数備えている。この場合、ＬＥＤパッケージ１００ｋは、図３３に示されるように、ＬＥＤチップ３０の第１の電極と電気的に接続された外部接続端子１６ｋと、ＬＥＤチップの第２の電極と電気的に接続された外部接続端子１７ｋとのうちのいずれかの外部接続端子１６ｋ、１７ｋ（外部接続端子１６ｋ、１７ｋの少なくとも一方）が同一の主面における各角部に選択的に配置されて構成される。また、複数のＬＥＤパッケージ１００ｋはその辺同士を近接又は接触させて並べることで一次元状、二次元状または三次元状に配列される。そして、各辺を挟んで隣接して配列されたＬＥＤパッケージ１００ｋの外部接続端子１６ｋと外部接続端子１７ｋとを選択的に電気接続することで複数のＬＥＤパッケージ１００ｋが電気的に接続されて構成されることで、発光装置２００ａ、２００ｂ、２００ｃ、２００ｄは構成されている。このように複数のＬＥＤパッケージ１００ｋを簡易に配置して利用できるため、一次元状、二次元状または三次元状に配置されたＬＥＤパッケージ１００ｋを備える発光装置を効率的に製造して提供することができる。 The light emitting devices 200a, 200b, 200c, and 200d specifically described as described above include a plurality of LED packages 100k that are formed in a polygonal plate shape in plan view and on which the LED chip 30 is mounted. In this case, the LED package 100k is electrically connected to the external connection terminal 16k electrically connected to the first electrode of the LED chip 30 and the second electrode of the LED chip, as shown in FIG. The external connection terminals 16k and 17k (at least one of the external connection terminals 16k and 17k) of the external connection terminals 17k are selectively arranged at each corner on the same main surface. Further, the plurality of LED packages 100k are arranged in a one-dimensional shape, a two-dimensional shape, or a three-dimensional shape by arranging the sides close to or in contact with each other. A plurality of LED packages 100k are electrically connected by selectively electrically connecting the external connection terminals 16k and the external connection terminals 17k of the LED packages 100k arranged adjacent to each other across each side. Thus, the light emitting devices 200a, 200b, 200c, and 200d are configured. As described above, since the plurality of LED packages 100k can be easily arranged and used, a light-emitting device including the LED packages 100k arranged in a one-dimensional shape, a two-dimensional shape, or a three-dimensional shape is efficiently manufactured and provided. Can do.
なお、この場合に用いられるＬＥＤパッケージとしては、ＬＥＤパッケージ１００ｋ以外でもよく、平面視で多角形の板状に形成されることで、各辺が同一長さとなって隙間無く配列できればどのような構成のものでも採用することができる。例えば、このＬＥＤパッケージとしては、一例としては四角形や五角形であってもよい。また、同一の形状のＬＥＤパッケージだけを組合せるもののほか、五角形のＬＥＤパッケージと六角形のＬＥＤパッケージとを組合せることで形成される切頂二十面体構造のように、２種類以上の形状のＬＥＤパッケージを組合せて用いることもできる。 The LED package used in this case may be other than the LED package 100k, and any configuration can be used as long as each side has the same length and can be arranged without a gap by being formed into a polygonal plate shape in plan view. Can also be adopted. For example, the LED package may be a quadrangle or a pentagon as an example. In addition to the combination of LED packages having the same shape, two or more types of shapes such as a truncated icosahedron structure formed by combining a pentagonal LED package and a hexagonal LED package. A combination of LED packages can also be used.
また、外部接続端子は少なくとも２組以上設けられていれば選択的に接続することで配線を容易に変更できるという付加的な効果を奏することもできるが、外部接続端子は１組だけ設けられているだけでも高密度にＬＥＤパッケージを配列できる。さらに、リードフレームを用いない構成であってもよく、配線パターンが形成された金属基板上に発光チップを実装することで外部接続端子を備えたＬＥＤパッケージであってもよい。このように、発光装置に用いられるＬＥＤパッケージは上述の実施例に示されるものに限られるものでなく、効果を奏するのに必要な構成を備えていれば自由に変更したＬＥＤパッケージを用いることができる。 In addition, if at least two sets of external connection terminals are provided, an additional effect that the wiring can be easily changed by selective connection can be achieved, but only one set of external connection terminals is provided. LED packages can be arranged at high density just by being present. Furthermore, the structure which does not use a lead frame may be sufficient, and the LED package provided with the external connection terminal by mounting a light emitting chip on the metal substrate in which the wiring pattern was formed may be sufficient. Thus, the LED package used in the light-emitting device is not limited to that shown in the above-described embodiment, and an LED package that is freely changed may be used as long as it has a configuration necessary to achieve the effect. it can.
次に、図４２Ａ，４２Ｂ及び図４３Ａ，４３Ｂを参照して、本発明の実施例１０について説明する。図４２Ａ，４２Ｂは、本実施例におけるＬＥＤパッケージの構成図である。図４３Ａ，４３Ｂは、本実施例におけるＬＥＤパッケージの利用形態を説明するための断面図である。なお、図４２Ｂ及び図４３Ａ、４３Ｂに示される断面は、図４２Ａにおける矢視断面における断面形状を示している。なお、本実施例におけるリードフレーム１０ｋ及びＬＥＤパッケージ用基板の基本的な形状は、磁石Ｍを含んで成形される点を除き、図３２Ａに示されるものと同等のものであるため、重複する点についての説明は省略する。なお、本実施例の図面においては、一例としてＮ極を平行線のハッチングで示した側とし、Ｓ極を交差線のハッチングで示した側とする。 Next, Embodiment 10 of the present invention will be described with reference to FIGS. 42A and 42B and FIGS. 43A and 43B. 42A and 42B are configuration diagrams of the LED package in the present embodiment. FIGS. 43A and 43B are cross-sectional views for explaining a usage form of the LED package in the present embodiment. Note that the cross sections shown in FIG. 42B and FIGS. 43A and 43B show the cross-sectional shapes in the cross section indicated by the arrow in FIG. 42A. Note that the basic shapes of the lead frame 10k and the LED package substrate in this embodiment are the same as those shown in FIG. The description about is omitted. In the drawings of the present embodiment, as an example, the N pole is a side indicated by hatching of parallel lines, and the S pole is a side indicated by hatching of crossing lines.
本実施例におけるＬＥＤパッケージ１００ｋの六辺の各辺においては、同じ磁極がＬＥＤパッケージ１００ｋの側面に向けられるように２個の磁石Ｍが配置されている。また、ＬＥＤパッケージ１００ｋの六辺のうち対向する一対の辺においては逆の磁極がパッケージ側面に向けられるように配置されることで、図３５に示されるように複数のＬＥＤパッケージ１００ｋを接続して用いる場合に、図４３Ａに示されるように、隣接するＬＥＤパッケージ１００ｋにおいて対向する辺に配置された磁石Ｍ同士が引き合うことで、簡易に固定状態で配列して利用することができる。この場合、隣接するＬＥＤパッケージ１００ｋにおいて対向する辺に配置された磁石Ｍ同士が同じ磁極となったときには固定されないため、誤接続防止などに用いることもできる。 In each of the six sides of the LED package 100k in the present embodiment, two magnets M are arranged so that the same magnetic pole is directed to the side surface of the LED package 100k. Further, by arranging the opposite magnetic poles on the pair of opposite sides of the six sides of the LED package 100k so as to face the side of the package, a plurality of LED packages 100k are connected as shown in FIG. When used, as shown in FIG. 43A, the magnets M arranged on opposite sides in the adjacent LED package 100k attract each other, so that they can be easily arranged and used in a fixed state. In this case, since the magnets M arranged on the opposite sides in the adjacent LED package 100k are not fixed when they have the same magnetic pole, they can be used for preventing erroneous connection.
また、図３４Ａ，３４Ｂに示されるように、一次元状にＬＥＤパッケージ１００ｋを接続して用いる場合にも同様の効果を奏することができる。なお、図３６に示されるようにＬＥＤパッケージ１００ｋを三次元状に配列接続して用いるときには、図４３Ｂに示されるように、ＬＥＤパッケージ１００ｋの側面が傾斜面となるように切断された形状とすることで、ＬＥＤパッケージ１００ｋを三次元状に容易に組み立てることができる。 Further, as shown in FIGS. 34A and 34B, the same effect can be obtained when the LED package 100k is connected and used in a one-dimensional manner. 36, when the LED package 100k is arranged and connected in a three-dimensional manner as shown in FIG. 36, the LED package 100k is cut so that the side surface of the LED package 100k becomes an inclined surface as shown in FIG. 43B. Thus, the LED package 100k can be easily assembled in a three-dimensional manner.
なお、図４２Ａに示される構成では、ＬＥＤパッケージ１００ｋの１個の辺では同じ磁極がパッケージ側面に向けられるように２個の磁石Ｍが配置されている例について説明したが、全ての辺において、これらの２個の磁石Ｍが逆の磁極に向けられていてもＬＥＤパッケージ１００ｋを簡易に固定状態で配列して利用することができる。また、六角形のＬＥＤパッケージ１００ｋの例について説明したが、四角形のＬＥＤパッケージであっても１個の辺に２個の磁石Ｍが配置されることで、上述の例と同様にＬＥＤパッケージを接続用に容易に配置することができる。 In the configuration shown in FIG. 42A, the example in which the two magnets M are arranged so that the same magnetic pole is directed to the package side surface on one side of the LED package 100k has been described. Even if these two magnets M are directed to opposite magnetic poles, the LED package 100k can be easily arranged and used in a fixed state. In addition, the example of the hexagonal LED package 100k has been described. However, even in the case of a square LED package, two magnets M are arranged on one side so that the LED package can be connected in the same manner as in the above example. Can be easily arranged.
さらに、磁石Ｍを外部接続端子１６ｌ、１７ｌに電気的に接続した構成とすることで、磁石Ｍ同士の連結により隣接したＬＥＤパッケージ１００ｋ同士の電極を接続させることもできる。 Furthermore, by adopting a configuration in which the magnet M is electrically connected to the external connection terminals 16l and 17l, the electrodes of the LED packages 100k adjacent to each other can be connected by coupling the magnets M to each other.
次に、図４４Ａ，４４Ｂ乃至図４７を参照して、本発明の実施例１１について説明する。図４４Ａ、４４Ｂは、本実施例におけるリードフレーム１０ｍとＬＥＤパッケージ用基板のそれぞれの斜視図である。本実施例においては、樹脂２０の剥離防止のため、ダイパッド１１ｍの外縁がほとんど全て樹脂２０に覆われている点が他の実施例と異なる。リードフレーム１０ｍ（単位リードフレーム）は、ダイパッド１１ｍ及び電極部１２ｍ、１３ｍを有する。電極部１２ｍ、１３ｍには、外部接続端子１６ｍ、１７ｍが形成されている。 Next, Embodiment 11 of the present invention will be described with reference to FIGS. 44A and 44B to FIG. 44A and 44B are perspective views of the lead frame 10m and the LED package substrate in this embodiment. This embodiment is different from the other embodiments in that the outer edge of the die pad 11m is almost entirely covered with the resin 20 in order to prevent the resin 20 from peeling off. The lead frame 10m (unit lead frame) includes a die pad 11m and electrode portions 12m and 13m. External connection terminals 16m and 17m are formed on the electrode portions 12m and 13m.
ダイパッド１１ｍには、その外縁において例えば外部接続端子１６ｍ、１７ｍに向けて一対の凹部１１ｍ１、１１ｍ２を備える。また、電極部１２ｍには、凹部１１ｍ１に対して差し込まれるように縁部が凸部となった内部接続部１２ｍ１が形成されている。同様に、電極部１３ｍには、凹部１１ｍ２に対して差し込まれるように縁部が凸部となった内部接続部１３ｍ１が形成されている。 The die pad 11m is provided with a pair of recesses 11m1 and 11m2 at the outer edge, for example, toward the external connection terminals 16m and 17m. Further, the electrode part 12m is formed with an internal connection part 12m1 whose edge part is a convex part so as to be inserted into the concave part 11m1. Similarly, the electrode part 13m is formed with an internal connection part 13m1 whose edge part is a convex part so as to be inserted into the concave part 11m2.
図４４Ａに示されるリードフレーム１０ｍに対して樹脂２０を成形することにより、図４４Ｂに示されるような反射面Ｒを有するＬＥＤパッケージ用基板（一つのＬＥＤパッケージに相当する領域）が形成される。この場合、反射面Ｒにおいては、電極部１２ｍ、１３ｍにおける内部接続部１２ｍ１、１３ｍ１の位置を除いて段部Ｒ１が形成されている。換言すれば、その位置を除いてダイパッド１１ｍが樹脂２０で覆われることになるため、ダイパッド１１ｍと樹脂２０との接触面積を広くすることができる。 By molding the resin 20 on the lead frame 10m shown in FIG. 44A, an LED package substrate (an area corresponding to one LED package) having the reflective surface R as shown in FIG. 44B is formed. In this case, on the reflection surface R, a step portion R1 is formed except for the positions of the internal connection portions 12m1 and 13m1 in the electrode portions 12m and 13m. In other words, since the die pad 11m is covered with the resin 20 except for the position, the contact area between the die pad 11m and the resin 20 can be increased.
この場合、段部Ｒ１は反射面Ｒにおいて内部接続部１２ｍ１、１３ｍ１を挟んで２つ形成されることになる。段部Ｒ１と内部接続部１２ｍ１、１３ｍ１との上には配線パターンＰ（配線層）が形成されている。このように、配線パターンＰがいずれかの段部Ｒ１上といずれかの内部接続部１２ｍ１、１３ｍ１上とを接続するように形成されているため、ＬＥＤチップからの配線を配線パターンＰに接続することによって、ＬＥＤチップと外部接続端子１６ｍ、１７ｍとを接続することができる。 In this case, two step portions R1 are formed on the reflection surface R with the internal connection portions 12m1 and 13m1 being sandwiched therebetween. A wiring pattern P (wiring layer) is formed on the step portion R1 and the internal connection portions 12m1 and 13m1. Thus, since the wiring pattern P is formed so as to connect any one of the step portions R1 and any one of the internal connection portions 12m1 and 13m1, the wiring from the LED chip is connected to the wiring pattern P. Thus, the LED chip can be connected to the external connection terminals 16m and 17m.
このように、本実施例によれば、ダイパッド１１ｍと樹脂２０との接触面積を広くすることができる。つまり、ダイパッド１１ｍの側面だけでなくその上面も樹脂２０と接触させることができ、例えばダイパッド１１ｍを大型化したときに相対的に大きくなる熱膨張によって樹脂２０とダイパッド１１ｍとの間に起こり得る剥離を抑制することができ、ＬＥＤパッケージの大型化することができる。 Thus, according to the present embodiment, the contact area between the die pad 11m and the resin 20 can be increased. That is, not only the side surface of the die pad 11m but also the upper surface thereof can be brought into contact with the resin 20. For example, peeling that may occur between the resin 20 and the die pad 11m due to relatively large thermal expansion when the die pad 11m is enlarged. And the size of the LED package can be increased.
なお、段部Ｒ１はＬＥＤチップと同等の高さとしてもよい。また、段部Ｒ１を複数設けることで、複数の配線パターンＰを配置し、ＬＥＤチップを複数の異なる外部接続端子に接続可能な構成とすることもできる。さらに、段部は必ずしも設ける必要はなく反射面Ｒの斜面に対して配線パターンＰを成形してもよい。この場合、静電塗布により傾斜面に配線パターンＰを成形してもよい。また、配線パターンＰは箔材料を貼り付けて成形してもよい。 The step portion R1 may have a height equivalent to that of the LED chip. Further, by providing a plurality of step portions R1, it is possible to arrange a plurality of wiring patterns P and connect the LED chip to a plurality of different external connection terminals. Further, the stepped portion is not necessarily provided, and the wiring pattern P may be formed on the inclined surface of the reflecting surface R. In this case, the wiring pattern P may be formed on the inclined surface by electrostatic coating. The wiring pattern P may be formed by attaching a foil material.
図４５Ａ～４５Ｃは、本実施例における変形例としてのＬＥＤパッケージの製造工程図である。図４５Ａに示されるリードフレーム１０ｎ（単位リードフレーム）は、ダイパッド１１ｎ及び３組の電極部１２ｎ、１３ｎを有する。各電極部１２ｎ、１３ｎには、外部接続端子１６ｎ、１７ｎが形成されている。ダイパッド１１ｎは電極部１２ｎ、１３ｎの近接する位置における縁部が凹まされた矩形状を有する。 45A to 45C are manufacturing process diagrams of an LED package as a modification of the present embodiment. A lead frame 10n (unit lead frame) shown in FIG. 45A includes a die pad 11n and three sets of electrode portions 12n and 13n. External connection terminals 16n and 17n are formed on the electrode portions 12n and 13n, respectively. The die pad 11n has a rectangular shape with a recessed edge at a position where the electrode portions 12n and 13n are close to each other.
リードフレーム１０ｎに対して樹脂２０を成形することにより、図４５Ｂに示されるように、電極部１２ｎ、１３ｎ毎に設けられた開口部２２と、一対の配線パターン成形部２３とが形成される。開口部２２は、例えば樹脂２０の成形用の金型に電極部１２ｎ、１３ｎの先端位置をクランプする突起部を設けることで成形可能であり、矩形状の反射面Ｒにおいて電極部１２ｎ、１３ｎの先端位置が露出するように開口して形成される。配線パターン成形部２３は、例えば樹脂２０の成形用の金型においてダイパッド１１ｎから離間した面を設けることで成形可能であり、樹脂２０によりダイパッド１１ｎの上面が覆われた形状に成形される。 By molding the resin 20 on the lead frame 10n, as shown in FIG. 45B, an opening 22 provided for each of the electrode portions 12n and 13n and a pair of wiring pattern molding portions 23 are formed. The opening 22 can be formed, for example, by providing a protrusion for clamping the tip positions of the electrode portions 12n and 13n on a mold for molding the resin 20, and the electrode portions 12n and 13n can be formed on the rectangular reflecting surface R. An opening is formed so that the tip position is exposed. The wiring pattern forming part 23 can be formed, for example, by providing a surface separated from the die pad 11n in a mold for forming the resin 20, and is formed into a shape in which the upper surface of the die pad 11n is covered with the resin 20.
この場合、図４５Ｃに示されるように、各配線パターン成形部２３に３列の配線パターンＰ１～Ｐ３を平行に成形すると共に、各配線パターンＰ１～Ｐ３を３組の電極部１２ｎ、１３ｎにそれぞれ接続する。これにより、ＬＥＤパッケージ用基板が完成する。このＬＥＤパッケージ用基板において、３列の配線パターンＰ１～Ｐ３に例えば光の三原色のＬＥＤチップ３０Ｒ、３０Ｇ、３０Ｂをそれぞれ直列に複数列接続することで、三原色のＬＥＤチップの輝度を個別に可変可能なＬＥＤパッケージ１００ｎを製造することができる。同図に示されるように、三原色のＬＥＤチップ３０Ｒ、３０Ｇ、３０Ｂの列を交互に設けることで、ＬＥＤパッケージ１００ｎ全面において均一に色を変更することができる。 In this case, as shown in FIG. 45C, three rows of wiring patterns P1 to P3 are formed in parallel in each wiring pattern forming portion 23, and each wiring pattern P1 to P3 is formed in three sets of electrode portions 12n and 13n, respectively. Connecting. Thus, the LED package substrate is completed. In this LED package substrate, for example, the three primary color LED chips 30R, 30G, and 30B are connected in series to the three rows of wiring patterns P1 to P3, so that the brightness of the three primary color LED chips can be individually varied. LED package 100n can be manufactured. As shown in the figure, by providing the rows of the three primary color LED chips 30R, 30G, and 30B alternately, the color can be uniformly changed over the entire surface of the LED package 100n.
なお、本実施例では、三原色のＬＥＤチップの輝度を個別に可変とするために３組の電極部１２ｎ、１３ｎを設ける例について説明したが、１組又は２組であってもよし、４組以上であってもよい。例えば、２組の電極部１２ｎ、１３ｎと２列の配線パターンを設けると共に、直列接続された２系統のＬＥＤチップの列をいずれかの配線パターンに接続することができる。この場合、このＬＥＤパッケージを弱く発光させるときには一方の組の電極部１２ｎ、１３ｎに電流を流し、強く発光させるときには両方の組の電極部１２ｎ、１３ｎに電流を流すことで、ＬＥＤパッケージとしての輝度を制御することもできる。また、例えば白色発光させるためのＬＥＤチップのグループと、赤みがかった発光をさせるためのＬＥＤチップのグループとを設け、電流量を制御することで色温度を調整可能な構成としてもよい。 In this embodiment, an example in which three sets of electrode portions 12n and 13n are provided in order to individually change the luminance of the three primary color LED chips has been described. It may be the above. For example, two sets of electrode portions 12n and 13n and two rows of wiring patterns can be provided, and two series of LED chip rows connected in series can be connected to any wiring pattern. In this case, when the LED package emits light weakly, a current is supplied to one set of electrode portions 12n and 13n, and when a strong light emission is applied, a current is supplied to both sets of electrode portions 12n and 13n, so that the brightness as an LED package is obtained. Can also be controlled. Alternatively, for example, a group of LED chips for emitting white light and a group of LED chips for emitting reddish light may be provided, and the color temperature may be adjusted by controlling the amount of current.
このように電流を流す電極部の組の数を増減することでＬＥＤパッケージとしての輝度を制御する構成としては、図４６に示されるＬＥＤパッケージ１００ｐのような構成とすることもできる。この場合、例えばアノード側として機能する電極部が一対の電極部１２Ｐ１、１２Ｐ２で構成されると共に、例えばカソード側として機能する電極部が一対の電極部１３Ｐ１、１３Ｐ２で構成される。これによれば、２系統のＬＥＤチップ３０の組を電極部１２Ｐ１、１２Ｐ２、１３Ｐ１、１３Ｐ２間に接続することで、これらに接続された１系統目の外部接続端子１６Ｐ１、１７Ｐ１間だけに電流を流し、又は、２系統目の外部接続端子１６Ｐ２、１７Ｐ２間にも電流を流すことができる。 As a configuration for controlling the luminance as the LED package by increasing / decreasing the number of pairs of electrode portions through which current flows as described above, a configuration such as an LED package 100p shown in FIG. 46 may be used. In this case, for example, the electrode portion functioning as the anode side is configured by a pair of electrode portions 12P1 and 12P2, and the electrode portion functioning as the cathode side is configured by a pair of electrode portions 13P1 and 13P2. According to this, by connecting a set of two LED chips 30 between the electrode portions 12P1, 12P2, 13P1, and 13P2, a current is supplied only between the external connection terminals 16P1 and 17P1 of the first system connected thereto. Current can also flow between the external connection terminals 16P2 and 17P2 of the second system.
また、本実施例における別の機能として、樹脂２０による配線パターン成形部２３の変形例として、図４７に示されるＬＥＤパッケージ１００ｑのように、配線パターン成形部２３ａを成形することもできる。この場合、配線パターン成形部２３ａは電極部１２、１３間でＬＥＤチップの電流の流れる方向に対して直交するように同図では縦方向に延在して隣接するＬＥＤチップ間を横切るように配置される。配線パターン成形部２３ａは、例えば樹脂２０の成形用の金型においてダイパッド１１ｎから離間するように複数の溝部を設けることで樹脂２０を充填して複数の矩形の領域を反射面Ｒ内に成形することができる。配線パターン成形部２３ａの上面には配線パターンＰが成形されることにより、ＬＥＤチップ３０から接続されたワイヤ３５を接続して、ＬＥＤチップ３０同士のワイヤ３５で直接接続を行うことなく配線することが可能となる。 Further, as another function in the present embodiment, as a modification of the wiring pattern forming portion 23 made of the resin 20, the wiring pattern forming portion 23a can be formed as in the LED package 100q shown in FIG. In this case, the wiring pattern forming portion 23a extends in the vertical direction in the figure so as to cross between adjacent LED chips so as to be orthogonal to the direction in which the LED chip current flows between the electrode portions 12 and 13. Is done. For example, the wiring pattern molding portion 23a is provided with a plurality of groove portions so as to be separated from the die pad 11n in a mold for molding the resin 20, thereby filling the resin 20 and molding a plurality of rectangular regions in the reflection surface R. be able to. By forming the wiring pattern P on the upper surface of the wiring pattern forming portion 23a, the wires 35 connected from the LED chips 30 are connected, and wiring is performed without directly connecting the wires 35 between the LED chips 30. Is possible.
配線パターンＰは、同図に示されるように複数のＬＥＤチップ３０間を接続するように成形してもよいし、一対のＬＥＤチップ間だけを接続するように成形してもよい。なお、配線パターンＰには金や銀を用いることができるが、銀を用いることでＬＥＤチップからの光を効率的に反射することができる。さらに、配線パターン成形部２３ａは静電塗布によりリフレクタの成形とは別に成形してもよい。 The wiring pattern P may be molded so as to connect a plurality of LED chips 30 as shown in the figure, or may be molded so as to connect only a pair of LED chips. In addition, although gold | metal | money and silver can be used for the wiring pattern P, the light from an LED chip can be reflected efficiently by using silver. Further, the wiring pattern forming portion 23a may be formed separately from the forming of the reflector by electrostatic coating.
各実施例において、第１の電極部は、ＬＥＤパッケージを構成する樹脂のＬＥＤチップ搭載側の主面から露出するように折り曲げられた第１の外部接続端子を有する。また、第２の電極部は、樹脂のＬＥＤチップ搭載側の主面（第１の主面）から露出するように折り曲げられた第２の外部接続端子を有する。好ましくは、ダイパッドは、第１の主面及び第２の主面を有し、第１の主面の上にＬＥＤチップを搭載するように構成されており、第２の主面から第１の主面へ向かう方向を第１の方向とするとき、第１の外部接続端子及び第２の外部接続端子は、第１の電極部及び第２の電極部をそれぞれ第１の方向に折り曲げることにより形成されている。 In each embodiment, the first electrode portion has a first external connection terminal that is bent so as to be exposed from the main surface on the LED chip mounting side of the resin that constitutes the LED package. The second electrode portion has a second external connection terminal that is bent so as to be exposed from the main surface (first main surface) on the resin LED chip mounting side. Preferably, the die pad has a first main surface and a second main surface, and is configured to mount an LED chip on the first main surface, from the second main surface to the first main surface. When the direction toward the main surface is the first direction, the first external connection terminal and the second external connection terminal are formed by bending the first electrode portion and the second electrode portion in the first direction, respectively. Is formed.
各実施例によれば、ＬＥＤパッケージの外部接続端子をＬＥＤパッケージの上面側（ＬＥＤチップ搭載面側）に設けることで容易に利用可能なリードフレーム、ＬＥＤパッケージ用基板、リフレクタ部材、ＬＥＤパッケージ、及び、それらの製造方法を提供することができる。 According to each embodiment, a lead frame, an LED package substrate, a reflector member, an LED package, and an LED package that can be easily used by providing external connection terminals of the LED package on the upper surface side (LED chip mounting surface side) of the LED package; And manufacturing methods thereof.
以上、本発明の実施例を具体的に説明した。ただし、本発明は、上記各実施例にて説明した事項に限定されるものではなく、本発明の技術思想を逸脱しない範囲内で適宜変更可能である。 In the above, the Example of this invention was described concretely. However, the present invention is not limited to the matters described in the above embodiments, and can be appropriately changed without departing from the technical idea of the present invention.
例えば、図１１、１２に示された構成以外でも、ダイパッドといずれかの電極部とを連結した構成にとしてもよい。また、リードフレームの電極部１２、１３において折り曲げる位置をハーフエッチングして薄くすることにより折り曲げ易くしておくことで、一方金型５０及び他方金型６０で型閉じするときに各突起部で押圧することで上述したような形状に折り曲げることもできる。また、折り曲げる位置は、ダイとパンチを用いて潰しこむことで薄肉化するコイニング工程によって薄くすることもできる。これらの場合、リードフレームを折り曲げる別途の工程が不要となり、安価にＬＥＤパッケージを製造することができる。また、上述した実施例では、外部露出部１８は、ダイパッド１１に接続されてＬＥＤチップ３０とは電気的に接続されていない構成とする例について説明したが、電極部１２、１３から接続する部位にテスト用に露出させた端子を設けてもよい。この場合、電極部１２、１３を裏面側に露出させることで外部装置への接続は裏面の電極部１２、１３を用いて行うこともできる。 For example, in addition to the configuration shown in FIGS. 11 and 12, a configuration in which the die pad and any of the electrode portions are connected may be used. In addition, the positions of the lead frames 12 and 13 of the lead frame that are bent are half-etched and thinned so that they can be easily bent. By doing so, it can be bent into the shape as described above. Further, the folding position can be thinned by a coining process for thinning by crushing using a die and a punch. In these cases, a separate process for bending the lead frame is not required, and the LED package can be manufactured at low cost. In the above-described embodiment, the example in which the externally exposed portion 18 is configured to be connected to the die pad 11 and not electrically connected to the LED chip 30 has been described. An exposed terminal may be provided for testing. In this case, by exposing the electrode parts 12 and 13 to the back side, connection to an external device can be performed using the electrode parts 12 and 13 on the back side.
また、上述した実施例では、透光性樹脂４０として蛍光体を含む場合や、蛍光体を含まない場合について説明したが、蛍光体を含まない無色透明の透光性樹脂４０でＬＥＤチップ３０を封止した後に、一層又は多層の蛍光体層を成形し、又は、ＬＥＤチップ３０上に一層又は多層の蛍光体層を成形した後に無色透明な透光性樹脂４０で封止してもよい。また、リフレクタ成形に用いる樹脂２０とレンズ成形に用いる透光性樹脂４０とは、熱硬化性樹脂でなく熱可塑性樹脂でもよい。 In the above-described embodiments, the case where the phosphor is included as the translucent resin 40 or the case where the phosphor is not included has been described. However, the LED chip 30 is formed with the colorless and transparent translucent resin 40 that does not include the phosphor. After sealing, a single-layer or multi-layer phosphor layer may be molded, or a single-layer or multi-layer phosphor layer may be formed on the LED chip 30 and then sealed with a colorless and transparent translucent resin 40. Further, the resin 20 used for reflector molding and the translucent resin 40 used for lens molding may be thermoplastic resins instead of thermosetting resins.
また、ダイパッドの縁部断面において表面又は裏面に凹凸を設けることで、この凹部内に樹脂２０に入り込ませて樹脂２０の脱落を防止してもよい。この場合、特に裏面に設けることで、脱落の防止しながら搭載面積の防止を図ることができ好ましい。 Further, by providing irregularities on the front surface or the back surface in the edge cross section of the die pad, the resin 20 may enter the concave portion to prevent the resin 20 from falling off. In this case, it is preferable to provide it on the back surface, in particular, because it is possible to prevent the mounting area while preventing dropout.
また、ＬＥＤチップ用のダイパッドだけでなくそれ以外のチップ用のパッド部を設けてもよい。この場合、例えば単位リードフレーム（第一の単位リードフレーム）における電極部１２、１３から隣接する単位リードフレーム（第二の単位リードフレーム）における電極部１２、１３間に挟まれるように構成されるパッド部を設けてもよい。このパッド部には、ＬＥＤ以外の半導体チップを搭載可能とすることができる。この場合、この領域には、例えばツェナーダイオードを搭載してパッド部に電気的に接続されることで、このパッド部とツェナーダイオードとを電極部１２、１３に接続することができる。これによれば、ＬＥＤチップが接続される電極部１２、１３に接続されるＬＥＤチップに対して並列にツェナーダイオードを接続することができる。 Further, not only the die pad for the LED chip but also a pad portion for another chip may be provided. In this case, for example, it is configured to be sandwiched between the electrode portions 12 and 13 in the adjacent unit lead frame (second unit lead frame) from the electrode portions 12 and 13 in the unit lead frame (first unit lead frame). A pad portion may be provided. A semiconductor chip other than the LED can be mounted on the pad portion. In this case, for example, a Zener diode is mounted in this region and is electrically connected to the pad portion, so that the pad portion and the Zener diode can be connected to the electrode portions 12 and 13. According to this, a Zener diode can be connected in parallel to the LED chip connected to the electrode parts 12 and 13 to which the LED chip is connected.
また、このようなパッド部や電極部１２、１３にはツェナーダイオードだけでなく、定電流回路用のＩＣチップや電子部品を搭載して並列接続してもよい。また、電極部１２、１３に対して並列に接続するだけでなく、定電流回路用のＩＣチップや電子部品は、ＬＥＤチップに対して直列に接続してもよい。この場合、電極部１２、１３のいずれかを分割し、これらの間に定電流ダイオードや抵抗のようにＬＥＤチップを定電流で駆動するための電子部品やＩＣチップなどを接続するパッド部を配置する。これによれば、これらの定電流回路用の電子部品などをＬＥＤチップに直列に接続することもできる。また、一対の電極部１２、１３間、各電極部１２、１３に、スイッチング回路や整流回路のようなＬＥＤ用の駆動回路用の電子部品を接続してもよい。これらの電子部品は電極部１２、１３に搭載して用いてもよい。 Further, not only a Zener diode but also an IC chip for a constant current circuit and an electronic component may be mounted on the pad portion and the electrode portions 12 and 13 and connected in parallel. Further, not only the electrodes 12 and 13 are connected in parallel, but the IC chip and electronic component for the constant current circuit may be connected in series to the LED chip. In this case, one of the electrode parts 12 and 13 is divided, and a pad part for connecting an electronic component or an IC chip for driving the LED chip with a constant current, such as a constant current diode or a resistor, is arranged between them. To do. According to this, these electronic components for a constant current circuit can be connected in series to the LED chip. Moreover, you may connect the electronic component for LED drive circuit like a switching circuit or a rectifier circuit between a pair of electrode parts 12 and 13 and each electrode part 12 and 13. FIG. These electronic components may be mounted on the electrode portions 12 and 13 for use.
以上に説明したＬＥＤの駆動回路用の電子部品などはＬＥＤパッケージの樹脂２０内に配置することで封止して保護することもできる。この場合、外部装置にこれらの機能を設ける必要がなくなる。また、ＬＥＤチップから放出される光に含まれる紫外線などにより劣化してしまうのを防止することもできる。さらに、例えば外部には駆動電源が設けられていればよくすることもでき、簡易な接続だけでＬＥＤパッケージを適切に発光させることができる。この場合、駆動回路を別途設計する必要もなくなり、簡易に電球製品などに利用できるＬＥＤチップを提供することもできる。 The electronic components for the LED drive circuit described above can be sealed and protected by being placed in the resin 20 of the LED package. In this case, it is not necessary to provide these functions in the external device. Further, it is possible to prevent deterioration due to ultraviolet rays contained in light emitted from the LED chip. Further, for example, it may be sufficient if a driving power source is provided outside, and the LED package can appropriately emit light by simple connection. In this case, it is not necessary to separately design the drive circuit, and an LED chip that can be easily used for a light bulb product can be provided.
上述した実施例では、１個のＬＥＤパッケージには１枚のリードフレームを適切に切り分けて電極部やダイパッド部とする例について説明したが、ダイパッド用のリードフレームと電極部用のリードフレームとの２枚のリードフレームを用いることもできる。この場合、この２枚のリードフレームを離間した状態で積層させるように一方金型５０及び他方金型６０でクランプして樹脂２０でリフレクタを成形することでＬＥＤパッケージとすることもできる。即ち、電極部用のリードフレームは、他方金型６０の突起部６４、６６により一方金型５０側に押付けることができる。また、ダイパッド用のリードフレームダイパッド用のリードフレームは、一方金型５０の凸部５２により他方金型６０側に押し付けることができる。このように、電極部用のリードフレームとダイパッド用のリードフレームとをＬＥＤパッケージ内に積層された状態で配置することができ、これらを別部材とすることができる。この場合、１個のパッケージにおけるダイパッド用のリードフレームの占有面積を増大させることができ、ダイパッドの露出面積を増大させることができるため、ＬＥＤパッケージの放熱性を向上させることができる。 In the above-described embodiment, an example in which one lead frame is appropriately cut into one LED package to form an electrode portion or a die pad portion has been described. However, a lead frame for a die pad and a lead frame for an electrode portion are described. Two lead frames can also be used. In this case, an LED package can be formed by clamping the two lead frames in a separated state with one mold 50 and the other mold 60 and molding the reflector with the resin 20. That is, the lead frame for the electrode part can be pressed against the one mold 50 side by the protrusions 64 and 66 of the other mold 60. Further, the lead frame for the die pad can be pressed against the other mold 60 side by the convex portion 52 of the one mold 50. In this way, the lead frame for the electrode part and the lead frame for the die pad can be arranged in a stacked state in the LED package, and these can be used as separate members. In this case, the area occupied by the lead frame for the die pad in one package can be increased, and the exposed area of the die pad can be increased, so that the heat dissipation of the LED package can be improved.
また、上述する実施例においてＬＥＤパッケージを三次元的に配置する例として、球体状にする例について説明したが、円柱状としてもよい。この場合、四角形のＬＥＤパッケージでもよいし六角形のＬＥＤパッケージでもよい。 Moreover, although the example which makes a spherical shape was demonstrated as an example which arrange | positions an LED package three-dimensionally in the Example mentioned above, it is good also as a column shape. In this case, a rectangular LED package or a hexagonal LED package may be used.
以上に説明したとおり各実施例における構成や目的によっては、外部接続端子は上面に露出していなくても同様の効果を奏することができる場合もある。これらについては、外部接続端子が上面に露出する構成が必ずしも必要ではなく、外部接続端子が下面に露出されて外部装置と接続可能となっていてもよい。もちろん、配線構成の変更の容易さや外部の放熱構造との連結を想定した場合には、外部接続端子が上面に露出していることが有用となるが、例えば実施例１０においても説明したように、これらは必ずしも必須の要件にならない場合があるので、個別の構成における効果との対応関係により発明を理解されるべきものである。 As described above, depending on the configuration and purpose in each embodiment, the external connection terminal may have the same effect even if it is not exposed on the upper surface. For these, the configuration in which the external connection terminals are exposed on the upper surface is not necessarily required, and the external connection terminals may be exposed on the lower surface and connectable to an external device. Of course, it is useful that the external connection terminals are exposed on the upper surface when it is assumed that the wiring configuration can be easily changed or connected to an external heat dissipation structure. For example, as described in the tenth embodiment, too. Since these are not necessarily essential requirements, the invention should be understood from the correspondence with the effects in the individual configurations.
１０　リードフレーム
１１　ダイパッド
１２、１３　電極部
１６、１７　外部接続端子
２０　樹脂
３０　ＬＥＤチップ
４０　透光性樹脂
１００　ＬＥＤパッケージ
２００ａ、２００ｂ、２００ｃ、２００ｄ　発光装置
３００　発光システム DESCRIPTION OF SYMBOLS 10 Lead frame 11 Die pad 12, 13 Electrode part 16, 17 External connection terminal 20 Resin 30 LED chip 40 Translucent resin 100 LED package 200a, 200b, 200c, 200d Light-emitting device 300 Light-emitting system

Claims (18)

  1. 　ＬＥＤチップを搭載するためのダイパッドと、
    　前記ＬＥＤチップの第１の電極と電気的に接続するための第１の電極部と、
    　前記ＬＥＤチップの第２の電極と電気的に接続するための第２の電極部と、を有し、
    　前記第１の電極部は、ＬＥＤパッケージを構成する樹脂のＬＥＤチップ搭載側の主面から露出するように折り曲げられた第１の外部接続端子を有し、
    　前記第２の電極部は、前記樹脂の前記ＬＥＤチップ搭載側の主面から露出するように折り曲げられた第２の外部接続端子を有する、ことを特徴とするリードフレーム。     A die pad for mounting an LED chip;
    A first electrode portion for electrically connecting to the first electrode of the LED chip;
    A second electrode portion for electrically connecting to the second electrode of the LED chip,
    The first electrode portion has a first external connection terminal that is bent so as to be exposed from the main surface on the LED chip mounting side of the resin that constitutes the LED package;
    The lead frame, wherein the second electrode part has a second external connection terminal bent so as to be exposed from a main surface of the resin on the LED chip mounting side.
  2. 　前記ダイパッドは、第１の主面及び第２の主面を有し、該第１の主面の上に前記ＬＥＤチップを搭載するように構成されており、
    　前記第２の主面から前記第１の主面へ向かう方向を第１の方向とするとき、前記第１の外部接続端子及び前記第２の外部接続端子は、前記第１の電極部及び前記第２の電極部をそれぞれ該第１の方向に折り曲げることにより形成されていることを特徴とする請求項１に記載のリードフレーム。     The die pad has a first main surface and a second main surface, and is configured to mount the LED chip on the first main surface;
    When the direction from the second main surface toward the first main surface is a first direction, the first external connection terminal and the second external connection terminal are the first electrode portion and the The lead frame according to claim 1, wherein each of the second electrode portions is formed by bending in the first direction.
  3. 　前記第１の電極部は、複数の前記第１の外部接続端子を有し、
    　前記第２の電極部は、複数の前記第２の外部接続端子を有することを特徴とする請求項１または２に記載のリードフレーム。     The first electrode portion has a plurality of the first external connection terminals,
    3. The lead frame according to claim 1, wherein the second electrode portion has a plurality of the second external connection terminals. 4.
  4. 　前記ダイパッドは、前記樹脂のＬＥＤチップ搭載側の前記主面から露出するように折り曲げられた第３の外部接続端子を有することを特徴とする請求項１乃至３のいずれか１項に記載のリードフレーム。 4. The lead according to claim 1, wherein the die pad has a third external connection terminal that is bent so as to be exposed from the main surface on the LED chip mounting side of the resin. 5. flame.
  5. 　請求項１乃至４のいずれか１項に記載のリードフレームと、
    　前記第１の電極部及び前記第２の電極部のそれぞれ少なくとも一部の上に成形された樹脂と、を有することを特徴とするＬＥＤパッケージ用基板。     The lead frame according to any one of claims 1 to 4,
    An LED package substrate, comprising: a resin molded on at least a part of each of the first electrode portion and the second electrode portion.
  6. 　前記樹脂は、前記ＬＥＤチップからの光を反射させるリフレクタとして機能する熱硬化性樹脂であることを特徴とする請求項５に記載のＬＥＤパッケージ用基板。 The LED package substrate according to claim 5, wherein the resin is a thermosetting resin that functions as a reflector that reflects light from the LED chip.
  7. 　ＬＥＤチップからの光を反射するリフレクタを樹脂によって形成されたリフレクタ部材であって、
    　前記ＬＥＤチップの第１の電極と電気的に接続するための第１の電極部と、
    　前記ＬＥＤチップの第２の電極と電気的に接続するための第２の電極部と、を有し、
    　前記第１の電極部は、一方の主面において前記樹脂から露出して前記ＬＥＤチップに電気的に接続されるとともに、他方の主面において前記樹脂から露出するように折り曲げられた第１の外部接続端子を有し、
    　前記第２の電極部は、一方の主面において前記樹脂から露出して前記ＬＥＤチップに電気的に接続されるとともに、他方の主面において前記樹脂から露出するように折り曲げられた第２の外部接続端子を有する、ことを特徴とするリフレクタ部材。     A reflector member formed of resin as a reflector that reflects light from an LED chip,
    A first electrode portion for electrically connecting to the first electrode of the LED chip;
    A second electrode portion for electrically connecting to the second electrode of the LED chip,
    The first electrode portion is exposed from the resin on one main surface and is electrically connected to the LED chip, and is bent to be exposed from the resin on the other main surface. Having a connection terminal,
    The second electrode portion is exposed from the resin on one main surface and is electrically connected to the LED chip, and is bent to be exposed from the resin on the other main surface. A reflector member having a connection terminal.
  8. 　ダイパッド、第１の電極部、及び、第２の電極部を有するリードフレームと、
    　前記ダイパッドの上に搭載されたＬＥＤチップと、
    　前記第１の電極部及び前記第２の電極部のそれぞれ少なくとも一部の上に成形された樹脂と、を有し、
    　前記第１の電極部は、前記ＬＥＤチップの第１の電極と電気的に接続されており、折り曲げて形成された第１の外部接続端子を有し、
    　前記第２の電極部は、前記ＬＥＤチップの第２の電極と電気的に接続されており、折り曲げて形成された第２の外部接続端子を有し、
    　前記第１の外部接続端子及び前記第２の外部接続端子は、前記樹脂のＬＥＤチップ搭載側の主面から露出している、ことを特徴とするＬＥＤパッケージ。     A lead frame having a die pad, a first electrode portion, and a second electrode portion;
    An LED chip mounted on the die pad;
    A resin molded on at least a part of each of the first electrode part and the second electrode part,
    The first electrode portion is electrically connected to the first electrode of the LED chip, and has a first external connection terminal formed by bending,
    The second electrode portion is electrically connected to the second electrode of the LED chip, and has a second external connection terminal formed by bending,
    The LED package, wherein the first external connection terminal and the second external connection terminal are exposed from a main surface on the LED chip mounting side of the resin.
  9. 　前記ＬＥＤチップを覆うように前記ダイパッドの上に成形された透光性樹脂を更に有することを特徴とする請求項８に記載のＬＥＤパッケージ。 The LED package according to claim 8, further comprising a translucent resin formed on the die pad so as to cover the LED chip.
  10. 　前記ダイパッド、第１の電極部、及び、第２の電極部のいずれかに搭載された保護素子を更に有し、
    　前記保護素子は、前記第１の電極部と前記第２の電極部との間に電気的に接続されていることを特徴とする請求項８または９に記載のＬＥＤパッケージ。     A protective element mounted on any one of the die pad, the first electrode portion, and the second electrode portion;
    The LED package according to claim 8 or 9, wherein the protection element is electrically connected between the first electrode portion and the second electrode portion.
  11. 　第１の電極部及び第２の電極部を有するリードフレームと、
    　配線層を介して基板の上に実装されたＬＥＤチップと、
    　前記第１の電極部及び前記第２の電極部のそれぞれ少なくとも一部の上に成形された樹脂と、を有し、
    　前記第１の電極部は、前記ＬＥＤチップの第１の電極と電気的に接続されており、折り曲げて形成された第１の外部接続端子を有し、
    　前記第２の電極部は、前記ＬＥＤチップの第２の電極と電気的に接続されており、折り曲げて形成された第２の外部接続端子を有し、
    　前記第１の外部接続端子及び前記第２の外部接続端子は、前記樹脂の主面から露出している、ことを特徴とするＬＥＤパッケージ。     A lead frame having a first electrode portion and a second electrode portion;
    An LED chip mounted on a substrate via a wiring layer;
    A resin molded on at least a part of each of the first electrode part and the second electrode part,
    The first electrode portion is electrically connected to the first electrode of the LED chip, and has a first external connection terminal formed by bending,
    The second electrode portion is electrically connected to the second electrode of the LED chip, and has a second external connection terminal formed by bending,
    The LED package, wherein the first external connection terminal and the second external connection terminal are exposed from the main surface of the resin.
  12. 　平面視で多角形の板状に形成されると共にＬＥＤチップが実装された複数のＬＥＤパッケージを備えた発光装置であって、
    　前記ＬＥＤパッケージは、前記ＬＥＤチップの第１の電極と電気的に接続された第１の外部接続端子と、該ＬＥＤチップの第２の電極と電気的に接続された第２の外部接続端子との少なくとも一方の外部接続端子が同一の主面における各角部に選択的に配置されて構成され、
    　前記複数のＬＥＤパッケージは、該ＬＥＤパッケージの辺同士を近接又は接触させて並べることで一次元状、二次元状または三次元状に配列され、
    　各辺を挟んで隣接して配列された前記ＬＥＤパッケージの前記第１の外部接続端子と前記第２の外部接続端子とを選択的に電気接続することで、前記複数のＬＥＤパッケージが電気的に接続されて構成されている、ことを特徴とする発光装置。     A light emitting device including a plurality of LED packages formed in a polygonal plate shape in plan view and mounted with LED chips,
    The LED package includes a first external connection terminal electrically connected to the first electrode of the LED chip, and a second external connection terminal electrically connected to the second electrode of the LED chip. At least one external connection terminal is selectively arranged at each corner on the same main surface,
    The plurality of LED packages are arranged in a one-dimensional shape, a two-dimensional shape, or a three-dimensional shape by arranging the sides of the LED packages close to or in contact with each other,
    The plurality of LED packages are electrically connected by selectively electrically connecting the first external connection terminals and the second external connection terminals of the LED packages arranged adjacent to each other across each side. A light-emitting device characterized by being connected.
  13. 　請求項１２に記載の発光装置と、
    　前記発光装置の放熱を行うための放熱構造と、を有することを特徴とする発光システム。     A light emitting device according to claim 12,
    And a heat dissipation structure for radiating heat of the light emitting device.
  14. 　ＬＥＤチップを搭載するためのダイパッド、該ＬＥＤチップの第１の電極と電気的に接続するための第１の電極部、及び、該ＬＥＤチップの第２の電極と電気的に接続するための第２の電極部、を有するリードフレームを加工するステップと、
    　前記第１の電極部及び前記第２の電極部のそれぞれ少なくとも一部の上に樹脂を成形するステップと、を有し、
    　前記リードフレームを加工する際に、前記第１の電極部を折り曲げて第１の外部接続端子を形成し、前記第２の電極部を折り曲げて第２の外部接続端子を形成し、
    　前記樹脂は、該樹脂のＬＥＤチップ搭載側の主面において、前記第１の外部接続端子及び前記第２の外部接続端子を露出するように成形される、ことを特徴とするＬＥＤパッケージ用基板の製造方法。     A die pad for mounting the LED chip, a first electrode portion for electrically connecting with the first electrode of the LED chip, and a first electrode for electrically connecting with the second electrode of the LED chip Processing a lead frame having two electrode portions;
    Forming a resin on at least a part of each of the first electrode portion and the second electrode portion, and
    When processing the lead frame, the first electrode portion is bent to form a first external connection terminal, the second electrode portion is bent to form a second external connection terminal,
    The resin is molded so that the first external connection terminal and the second external connection terminal are exposed on a main surface of the resin on the LED chip mounting side. Production method.
  15. 　前記樹脂は、前記リードフレームの前記第１の外部接続端子及び前記第２の外部接続端子を一方金型のクランプ面で押し付けた状態で成形されることを特徴とする請求項１４に記載のＬＥＤパッケージ用基板の製造方法。 The LED according to claim 14, wherein the resin is molded in a state where the first external connection terminal and the second external connection terminal of the lead frame are pressed against a clamp surface of one mold. A method for manufacturing a package substrate.
  16. 　前記樹脂は、前記第１の外部接続端子及び前記第２の外部接続端子を他方金型に設けられた支持部で支持した状態で成形されることを特徴とする請求項１４または１５に記載のＬＥＤパッケージ用基板の製造方法。 The said resin is shape | molded in the state which supported the said 1st external connection terminal and the said 2nd external connection terminal in the support part provided in the other metal mold | die. Manufacturing method of substrate for LED package.
  17. 　ダイパッド、ＬＥＤチップの第１の電極と電気的に接続するための第１の電極部、及び、該ＬＥＤチップの第２の電極と電気的に接続するための第２の電極部、を有するリードフレームを加工するステップと、
    　前記第１の電極部及び前記第２の電極部のそれぞれ少なくとも一部の上に樹脂を成形するステップと、
    　前記ダイパッドの上に前記ＬＥＤチップを搭載するステップと、を有し、
    　前記リードフレームを加工する際に、前記第１の電極部を折り曲げて第１の外部接続端子を形成し、前記第２の電極部を折り曲げて第２の外部接続端子を形成し、
    　前記樹脂は、該樹脂のＬＥＤチップ搭載側の主面において、前記第１の外部接続端子及び前記第２の外部接続端子を露出するように成形される、ことを特徴とするＬＥＤパッケージの製造方法。     A lead having a die pad, a first electrode part for electrical connection with the first electrode of the LED chip, and a second electrode part for electrical connection with the second electrode of the LED chip Processing the frame;
    Molding a resin on at least a part of each of the first electrode portion and the second electrode portion;
    Mounting the LED chip on the die pad,
    When processing the lead frame, the first electrode portion is bent to form a first external connection terminal, the second electrode portion is bent to form a second external connection terminal,
    The method of manufacturing an LED package, wherein the resin is molded so as to expose the first external connection terminal and the second external connection terminal on a main surface of the resin on the LED chip mounting side. .
  18. 　前記リードフレームの前記第１の電極部と前記ＬＥＤチップの前記第１の電極との間、及び、該リードフレームの前記第２の電極部と該ＬＥＤチップの前記第２の電極との間のそれぞれを、配線層により電気的に接続するステップを更に有し、
    　前記配線層は、静電噴霧又は静電塗布により形成されることを特徴とする請求項１７に記載のＬＥＤパッケージの製造方法。     Between the first electrode part of the lead frame and the first electrode of the LED chip, and between the second electrode part of the lead frame and the second electrode of the LED chip. Each further comprising the step of electrically connecting each via a wiring layer;
    The method of manufacturing an LED package according to claim 17, wherein the wiring layer is formed by electrostatic spraying or electrostatic coating.
PCT/JP2014/005329 2013-12-26 2014-10-21 Lead frame, substrate for led package, reflector member, led package, light emitting device, light emitting system, method for manufacturing substrate for led package, and method for manufacturing led package WO2015097955A1 (en)

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