KR20120014420A - Light emitting device package and method for manufacutring body of light emitting device pacakge - Google Patents

Light emitting device package and method for manufacutring body of light emitting device pacakge Download PDF

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Publication number
KR20120014420A
KR20120014420A KR1020100076469A KR20100076469A KR20120014420A KR 20120014420 A KR20120014420 A KR 20120014420A KR 1020100076469 A KR1020100076469 A KR 1020100076469A KR 20100076469 A KR20100076469 A KR 20100076469A KR 20120014420 A KR20120014420 A KR 20120014420A
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KR
South Korea
Prior art keywords
light emitting
emitting device
metal structure
device package
light
Prior art date
Application number
KR1020100076469A
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Korean (ko)
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KR101797755B1 (en
Inventor
이은선
Original Assignee
엘지이노텍 주식회사
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Priority to KR1020100076469A priority Critical patent/KR101797755B1/en
Publication of KR20120014420A publication Critical patent/KR20120014420A/en
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Abstract

A light emitting device package according to an embodiment includes a body including a metal structure and an insulating material, the body including an electrode layer; And a light emitting device positioned on the body and electrically connected to the electrode layer. The metal structure has a net shape, and the insulating material fills in the net of the metal structure.

Description

LIGHT EMITTING DEVICE PACKAGE AND METHOD FOR MANUFACUTRING BODY OF LIGHT EMITTING DEVICE PACAKGE}

Embodiments relate to a light emitting device package and a method of manufacturing a body for a light emitting device package.

Light emitting diodes (LEDs) are a type of semiconductor device that converts electrical energy into light. The light emitting diode has advantages of low power consumption, semi-permanent life, fast response speed, safety and environmental friendliness compared to conventional light sources such as fluorescent and incandescent lamps.

Accordingly, many researches have been conducted to replace the existing light source with light emitting diodes, and the use of light emitting diodes as a light source for lighting devices such as various lamps, liquid crystal displays, electronic signs, and street lamps that are used indoors and outdoors is increasing. to be.

The embodiment provides a light emitting device package and a method of manufacturing a body for a light emitting device package capable of improving heat dissipation characteristics.

A light emitting device package according to an embodiment includes a body including a metal structure and an insulating material, the body including an electrode layer; And a light emitting device positioned on the body and electrically connected to the electrode layer. The metal structure has a net shape, and the insulating material fills in the net of the metal structure.

Method of manufacturing a body for a light emitting device package according to an embodiment, comprising the steps of placing a metal structure having a hollow in the frame; And filling the mold with an insulating material.

The light emitting device package according to the embodiment may include a body having excellent heat dissipation characteristics, thereby minimizing temperature increase during use.

The method of manufacturing a light emitting device package body according to the embodiment may produce a body having excellent heat dissipation characteristics by a simple method.

1 is a cross-sectional view of a light emitting device package according to a first embodiment.
2 is a perspective view of the light emitting device package according to the first embodiment, except for the lens.
3A to 3F are cross-sectional views illustrating processes of a method of manufacturing a light emitting device package according to the first embodiment.
4 is a cross-sectional view of a light emitting device package according to a second embodiment.
5 is a cross-sectional view of a light emitting device package according to a third embodiment.
6 is a cross-sectional view of a light emitting device package according to a fourth embodiment.
7 is a view illustrating a backlight unit including a light emitting device package according to an embodiment.
8 is a view illustrating a lighting unit including a light emitting device package according to an embodiment.

In the description of embodiments, each layer, region, pattern, or structure may be “on” or “under” the substrate, each layer, region, pad, or pattern. Substrate formed in ”includes all formed directly or through another layer. Criteria for the top / bottom or bottom / bottom of each layer will be described with reference to the drawings.

The thickness or the size of each layer (film), region, pattern or structure in the drawings may be modified for clarity and convenience of explanation, and thus does not entirely reflect the actual size.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a cross-sectional view of a light emitting device package according to a first embodiment, and FIG. 2 is a perspective view of the light emitting device package according to the first embodiment, except for a lens.

1 and 2, the light emitting device package 100 according to the present embodiment includes a metal structure 12 and an insulating material 14 and includes first and second electrode layers 41 and 42. A body 10, a light emitting element 50 on the body 10 and electrically connected to the first and second electrode layers 41 and 42, and a molding member 60 for molding the light emitting element 50. ).

This will be described in more detail as follows.

The body 10 is formed to include a metal structure 12 and an insulating material 14. The metal structure 12 may have a hollow structure, for example, a net shape in which fine metal wires are entangled with each other. The insulating material 14 may be formed while filling the hollow of the metal structure 12 and the space between the first metal structure 12a and the second metal structure 12b.

Accordingly, the body 10 includes the first portion A in which the metal structure 12 and the insulating material 14 are formed together, and the insulating material 14 between the metal structure 12a and the second metal structure 12b. ) May comprise a second part B in which only.

The metal structure 12 is a metal having excellent heat dissipation properties, for example, aluminum (Al), iron (Fe), copper (Cu), nickel (Ni), zinc (Zn) or an alloy containing any one of them. It may include at least one. The insulating material 14 may be a resin or a ceramic that is cured or sintered at a lower temperature than the metal structure 12. As the resin, polyphthalamide (PPA), liquid crystal polymer (LCP), polyamide 9T (polyamid9T, PA9T), epoxy, acryl, etc. may be used.

In the embodiment, since the body 10 includes a metal structure 12 formed of a metal having excellent heat dissipation characteristics, heat emitted from the light emitting device 50 and the first and second electrode layers 41 and 42 is transferred to the body 10. It can be released smoothly through the metal structure (12) of. Accordingly, the body 10 of the embodiment may have excellent heat dissipation characteristics as compared to a conventional body having low thermal conductivity using only ceramic or insulating material. Accordingly, the characteristics of the light emitting device package 100 including the body 10 can be improved.

At this time, since the metal structure 12 is formed in a net shape and filled with the insulating material 14, the heat generated from the light emitting device 50 and the first and second electrode layers 41 and 42 may be discharged. The voltage applied to the first and second electrode layers 41 and 42 may be minimized through the metal structure 12.

In addition, a contact hole 16 penetrating the body 10 is formed in the first portion A, so that an electrical connection with another component (for example, a printed circuit board, etc.) (not shown) can be made smoothly. You can do that. Alternatively, heat dissipation may be further improved by transferring heat generated in the light emitting device 50 or the first and second electrode layers 41 and 42 through the contact hole 16 more smoothly.

In FIG. 2, a portion of the light emitting device 50 is formed on the first portion A, and the contact hole 16 is positioned in the portion to efficiently dissipate heat generated by the light emitting device 50. It was. However, the embodiment is not limited thereto, and the contact hole 16 may be disposed between the light emitting element 50 and the first and second electrode layers 41 and 42, or the first and second portions at the metal structure 12. Of course, it can be formed in a variety of positions, such as the lower electrode layer (41, 42).

The contact hole 16 may be formed together in the process of making the first and second electrode layers 41 and 42, and may be made of the same material as the first and second electrode layers 41 and 42. However, the embodiment is not limited thereto and may be formed in a separate process from the electrode layers 41 and 42 to be formed of a material different from that of the electrode layers 41 and 42.

In this embodiment, the metal structure 12 includes a first metal structure 12a positioned at one side of the body 10 and a second metal structure 12b spaced apart from the second metal structure 12b positioned at the other side of the body 10. can do. The first electrode layer 41 may be formed on the first metal structure 12a, and the second electrode layer 42 may be formed on the second metal structure 12b. In the present embodiment, since the metal structure 12 includes the first and second metal structures 12a and 12b spaced apart from each other by the insulating material 14, the metal structure 12 may be included in the light emitting device 50 while including the metal structure 12. The first and second electrode layers 41 and 42 to be connected may be prevented from being electrically shorted.

The first and second electrode layers 41 and 42 may be made of a metal having excellent conductivity. Such metals include titanium (Ti), copper (Cu), nickel (Ni), gold (Au), chromium (Cr), tantalum (Ta), platinum (Pt), tin (Sn), silver (Ag), and the like. There is this. The first and second electrode layers 41 and 42 may be formed by plating or the like. However, the embodiment is not limited thereto, and the first and second electrode layers 41 and 42 may be formed of metal plates having a predetermined thickness.

The light emitting device 50 is positioned on the body 10 while being electrically connected to the first and second electrode layers 41 and 42.

In an embodiment, two electrode layers (not shown) of the light emitting device 50 may be connected to the first electrode layer 41 and the second electrode layer 42 using wires 52a and 52b, respectively. However, the embodiment is not limited thereto. That is, the light emitting device 50 and the first and second electrode layers 41 and 42 may be electrically connected to each other by die bonding or flip chip in addition to wire bonding.

The light emitting device 50 may include a light emitting diode (LED), and the LED chip may be implemented as a colored LED such as a red LED, a blue LED, or a green LED, or may be implemented as an ultraviolet (UV) LED. The embodiment is not limited to the type and number of such LEDs. In addition, the body 10 may be equipped with a protection element (for example, a zener diode, a varistor) (not shown) for protecting the LED.

The molding member 60 is formed while surrounding the light emitting device 50 and the wires 52a and 52b. The molding member 60 may be made of a light transmissive material such as silicone or epoxy. The molding member 60 may include a fluorescent material that absorbs light emitted from the light emitting device 50 and emits different wavelengths. At this time, the molding member 60 may have a hemispherical shape to function as a lens to improve light extraction efficiency.

The light emitting device package 100 may include a body 10 including a metal structure 12 and an insulating material 14 to improve heat dissipation characteristics.

Hereinafter, a method of manufacturing a light emitting device package body and a method of manufacturing the light emitting device package using the same will be described in detail with reference to FIGS. 3A to 3F. For the sake of clarity and simplicity, the foregoing description will be omitted.

3A to 3F are cross-sectional views illustrating processes of a method of manufacturing a light emitting device package according to the first embodiment.

First, as shown in FIG. 3A, the first and second metal structures 12a and 12b are spaced apart from each other in the mold 110 having an opening having a shape corresponding to the body (reference numeral 10 in FIG. 3F). Position it. At this time, the first metal structure 12a is located in close contact with one side (left side of the drawing) of the mold 110 and the second metal structure 12b is located at the other side (right side of the drawing) of the mold 110.

Subsequently, as shown in FIG. 3B, the mold 110 is filled with an insulating material 14 of resin or ceramic and cured or sintered so that the hollow interior of the first and second metal structures 12a and 12b, and An insulating material 14 is filled between the first metal structure 12a and the second metal structure 12b. As a result, the first and second metal structures 12a and 12b and the insulating material 14 are integrated with each other to form the body 10. In this case, the insulating material 14 may use a material whose curing temperature or sintering temperature is lower than the melting temperatures of the first and second metal structures 12a and 12b. As a result, the first and second metal structures 12a and 12b may be prevented from being melted or damaged during the curing of the insulating material 14.

Subsequently, as shown in FIG. 3C, a hole 16a may be formed in the body 10. The holes 16a may be formed by various methods, for example, etching, drilling, and the like, but embodiments are not limited thereto.

Subsequently, as shown in FIG. 3D, the metal layer 44 is formed on the body 10, and as shown in FIG. 3E, the metal layer 44 is patterned to form the first and second electrode layers 41 and 42. A contact hole 16 filled with a metal may be formed in the hole (reference numeral 16a of FIG. 3C). Here, the metal layer 44 may be formed by various methods such as plating and sputtering, and the metal layer 44 may be patterned by a photoresist process or dry or wet etching using a mask.

In the present exemplary embodiment, the metal layer 44 is patterned to form the contact holes 16 simultaneously with the first and second electrode layers 41 and 42, but the exemplary embodiment is not limited thereto. Therefore, the contact hole 16 may be filled with a metal material before or after the first and second electrode layers 41 and 42 are formed. In addition, the first and second electrode layers 41 and 42 may be formed by attaching a plate having a predetermined thickness without forming the metal layer 44 by plating or the like.

Subsequently, as shown in FIG. 3F, the light emitting device 50 is positioned on the body 10, and then, using the wires 52a and 52b, the light emitting device 50 and the first and second electrode layers 41,. After the 42 is electrically connected, the light emitting device package 100 may be formed by molding the molding member 60.

In the present embodiment, the body 10 and the light emitting device package 100 using the same may be formed by providing a metal structure 12 and an insulating material 14 by a simple process.

Hereinafter, a light emitting device package and a method of manufacturing the same according to the second to fourth embodiments will be described with reference to FIGS. 4 to 6. For the sake of clarity and simplicity, the descriptions of the light emitting device package and the manufacturing method thereof according to the first embodiment will not be described in detail, and different parts will be described in detail.

4 is a cross-sectional view of a light emitting device package according to a second embodiment.

Referring to FIG. 4, the light emitting device package 102 according to the present exemplary embodiment may be a first portion A in which a central portion of the body 10a is formed of a metal structure 122 and an insulating material 142. Both sides of the body 10a are second portions B in which only the insulating material 142 is located. In this case, the light emitting device 50 is positioned in the first portion A, and the first and second electrode layers 41 and 42 are positioned in the second portion B.

As a result, the heat generated by the light emitting device 50 can be quickly dissipated by the metal structure 122. In this case, the contact hole 162 may be disposed in the first portion A to more smoothly discharge heat generated by the light emitting device 50. However, the exemplary embodiment is not limited thereto, and the contact hole 162 may be disposed under the first and second electrode layers 41 and 42 to help electrical connection with other components.

In addition, the first and second electrode layers 41 and 42 may be positioned at portions of the insulating material 142 to prevent the voltage applied to the first and second electrode layers 41 and 42 from flowing to other portions. have.

The method of manufacturing the body 10a according to the present embodiment is as follows. When placing the metal structure 122 in the mold of FIG. 3A (reference 110, hereinafter the same), after placing the metal structure 122 in the center of the mold 110, the insulating material 124 is filled and sintered and cured. The body 10a can be manufactured. Since the method of forming the contact hole 162, the first and second electrode layers 41 and 42, the light emitting device 50, and the like is the same as in FIGS. 3B to 3F, detailed description thereof will be omitted.

5 is a cross-sectional view of a light emitting device package according to a third embodiment.

Referring to FIG. 5, in the light emitting device package 104 according to the present exemplary embodiment, a cavity 20 having an open upper portion is formed in the body 10b, and the light emitting device 50 is positioned in the cavity 20. .

Sides of the cavity 20 may be perpendicular or inclined to the bottom surface of the cavity 20. When the cavity 20 has an inclined side surface, an angle formed between the side surface and the bottom surface of the cavity 20 may be 100 degrees to 170 degrees. At this time, the angle is set to 120 degrees or more, so that the light emitted from the light emitting device 50 can be reflected well.

In the present exemplary embodiment, the cavity 20 may be provided to reflect light emitted from the light emitting device 50 to improve light efficiency.

In the drawing, the first and second electrode layers 41 and 42 are positioned on the upper surface of the body 10, but the first and second electrode layers 41 and 42 penetrate the body 10 to form the cavity 20. It is also possible to be located on the floor. In the drawing, the planar shape of the cavity 20 is illustrated in a circle, but is not limited thereto. Therefore, the cavity 20 may have a planar shape having a polygonal shape including a quadrangle.

The body 10b according to the present embodiment may be manufactured by forming the cavity 20 in the body 10b before placing the light emitting device 50 in the body 10b. The cavity 20 may be formed by various methods, for example, etching or the like.

6 is a cross-sectional view of a light emitting device package according to a fourth embodiment.

Referring to FIG. 6, in the light emitting device package 106 according to the present exemplary embodiment, the light emitting device 50a may be formed as a vertical chip. As a result, one electrode (not shown) of the light emitting device 50a positioned in the body 10c is directly connected to the second electrode layer 42 to be electrically connected thereto, and the other electrode (not shown) is connected to the wire 52. It is electrically connected to the first electrode layer 41 through.

In this case, since the second electrode layer 42 is positioned under the light emitting device 50a, the first metal structure 126a is relatively small among the metal structures 126, and the second metal structure 126b is relatively large. Can be formed.

As described above, in the present exemplary embodiment, the second metal structure 126b is positioned on the light emitting device 50a and the lower part of the first and second electrode layers 41 and 42 so that the light emitting device 50a and the first and second electrodes are positioned. The heat generated in the electrode layers 41 and 42 can be quickly dissipated.

In the present embodiment, a plurality of second portions B made of only the insulating material 146 are provided. In the drawing, although the second portion B is illustrated as having two, the embodiment is not limited thereto.

The light emitting device package according to the above embodiments may function as a lighting system such as a backlight unit, an indicator device, a lamp, and a street lamp. This will be described with reference to FIGS. 7 and 8.

7 is a view illustrating a backlight unit including a light emitting device package according to an embodiment. However, the backlight unit 1100 of FIG. 7 is an example of a lighting system, but is not limited thereto.

Referring to FIG. 7, the backlight unit 1100 may be disposed on a bottom cover 1140, a light guide member 1120 disposed in the bottom cover 1140, and at least one side or a bottom surface of the light guide member 1120. The light emitting module 1110 may be included. In addition, a reflective sheet 1130 may be disposed under the light guide member 1120.

The bottom cover 1140 may be formed in a box shape having an upper surface open to accommodate the light guide member 1120, the light emitting module 1100, and the reflective sheet 1130, and may be formed of metal or resin. Can be. However, the present invention is not limited thereto.

The light emitting module 1110 may include a plurality of light emitting device packages 600 mounted on the substrate 700. The plurality of light emitting device packages 600 provides light to the light guide member 1120.

As shown, the light emitting module 1110 may be disposed on at least one of the inner surfaces of the bottom cover 1140, thereby providing light toward at least one side of the light guide member 1120. .

However, the light emitting module 1110 may be disposed under the light guide member 1120 in the bottom cover 1140 to provide light toward the bottom surface of the light guide member 1120. This may be variously modified according to the design of the backlight unit 1100.

The light guide member 1120 may be disposed in the bottom cover 1140. The light guide member 1120 may surface-light the light provided from the light emitting module 1110 and guide the light guide member to a display panel (not shown).

The light guide member 1120 may be, for example, a light guide panel (LGP). The light guide plate may be, for example, an acrylic resin such as polymethyl methacrylate (PMMA), polyethylene terephthalate (PET), a cyclic olefin copolymer (COC), or a polycarbonate (PC). It may be formed of one of polyethylene naphthalate resin.

The optical sheet 1150 may be disposed above the light guide member 1120.

The optical sheet 1150 may include at least one of, for example, a diffusion sheet, a light collecting sheet, a luminance rising sheet, and a fluorescent sheet. For example, the optical sheet 1150 may be formed by stacking a diffusion sheet, a light collecting sheet, a luminance rising sheet, and a fluorescent sheet. In this case, the diffusion sheet 1150 evenly diffuses the light emitted from the light emitting module 1110, and the diffused light may be focused onto a display panel (not shown) by the light collecting sheet. At this time, the light emitted from the light collecting sheet is light that is randomly polarized. The luminance rising sheet can increase the degree of polarization of light emitted from the light collecting sheet. The light collecting sheet can be, for example, a horizontal or / and vertical prism sheet. In addition, the brightness rising sheet may be, for example, a dual brightness enhancement film. In addition, the fluorescent sheet may be a translucent plate or film containing phosphors.

The reflective sheet 1130 may be disposed under the light guide member 1120. The reflective sheet 1130 may reflect light emitted through the lower surface of the light guide member 1120 toward the exit surface of the light guide member 1120. The reflective sheet 1130 may be formed of a resin having good reflectance, for example, PET, PC, poly vinyl chloride, resin, or the like, but is not limited thereto.

8 is a view illustrating a lighting unit including a light emitting device package according to an embodiment. However, the lighting unit 1200 of FIG. 8 is an example of a lighting system, but is not limited thereto.

Referring to FIG. 8, the lighting unit 1200 includes a case body 1210, a light emitting module 1230 installed in the case body 1210, and a connection terminal installed in the case body 1210 and receiving power from an external power source. 1220.

The case body 1210 is preferably formed of a material having good heat dissipation, for example, may be formed of a metal or a resin.

The light emitting module 1230 may include a substrate 700 and at least one light emitting device package 600 mounted on the substrate 700.

The substrate 700 may be a circuit pattern printed on the insulator, for example, a printed circuit board (PCB), a metal core PCB, a flexible PCB, a ceramic PCB, and the like. It may include.

In addition, the substrate 700 may be formed of a material that efficiently reflects light, or the surface may be formed of a color in which the light is efficiently reflected, for example, white, silver, or the like.

At least one light emitting device package 600 may be mounted on the substrate 700.

Each of the light emitting device packages 600 may include at least one light emitting diode (LED). The light emitting device may include a colored light emitting device for emitting colored light of red, green, blue or white color, and a UV light emitting device for emitting ultraviolet light (UV, UltraViolet).

The light emitting module 1230 may be arranged to have a combination of various light emitting devices to obtain color and luminance. For example, the white light emitting device, the red light emitting device, and the green light emitting device may be combined to secure high color rendering (CRI). In addition, a fluorescent sheet may be further disposed on a traveling path of light emitted from the light emitting module 1230, and the fluorescent sheet changes the wavelength of light emitted from the light emitting module 1230. For example, when the light emitted from the light emitting module 1230 has a blue wavelength band, the fluorescent sheet may include a yellow phosphor, and the light emitted from the light emitting module 1230 may be finally viewed as white light after passing through the fluorescent sheet. do.

The connection terminal 1220 may be electrically connected to the light emitting module 1230 to supply power. According to FIG. 8, the connection terminal 1220 is inserted into and coupled to an external power source in a socket manner, but is not limited thereto. For example, the connection terminal 1220 may be formed in a pin shape and inserted into an external power source, or may be connected to the external power source by wiring.

In the lighting system as described above, at least one of a light guide member, a diffusion sheet, a light collecting sheet, a luminance rising sheet, and a fluorescent sheet may be disposed on a propagation path of light emitted from the light emitting module to obtain a desired optical effect.

As described above, the lighting system according to the embodiment includes a light emitting device package having improved heat dissipation characteristics, thereby improving reliability.

The features, structures, effects and the like described in the foregoing embodiments are included in at least one embodiment of the present invention and are not necessarily limited to one embodiment. In addition, the features, structures, effects, and the like illustrated in the embodiments may be combined or modified with respect to other embodiments by those skilled in the art to which the embodiments belong. Therefore, it should be understood that the present invention is not limited to these combinations and modifications.

In addition, the above description has been made with reference to the embodiments, which are merely examples and are not intended to limit the invention. It will be appreciated that various modifications and applications are possible. For example, each component specifically shown in the embodiments may be modified and implemented. It is to be understood that the present invention may be embodied in many other specific forms without departing from the spirit or essential characteristics thereof.

Claims (11)

A body comprising a metal structure and an insulating material; And
An electrode layer on the body;
A light emitting device electrically connected to the electrode layer on the body
Including,
And the metal structure has a net shape, and the insulating material fills in the net of the metal structure. The method of claim 1,
The body,
A first portion in which the metal structure and the insulating material are located together; And
And a second portion in which only the insulating material is located. The method of claim 2,
The light emitting device package, wherein the electrode layer is located on the first portion. The method of claim 3,
The electrode layer comprises a first electrode layer and a second electrode layer,
The metal structure comprises a first metal structure and the second metal structure insulated by the insulating material,
The first electrode layer is located on the first metal structure, the second electrode layer is a light emitting device package located on the second metal structure. The method of claim 2,
At least a portion of the light emitting element is located on the first portion. The method of claim 5,
The light emitting device package, wherein the entire light emitting device is located on the first portion, the electrode layer is located on the second portion. The method of claim 2,
The light emitting device package having a contact hole penetrating the body in the first portion. The method of claim 2,
A light emitting device package comprising a plurality of the second portion. The method of claim 1,
The light emitting device package is used for the light emitting device package lighting system. Positioning a metal structure having a hollow in the frame; And
Filling the mold with an insulating material
Method of manufacturing a body for a light emitting device package comprising a. The method according to claim 10,
Method of manufacturing a light emitting device package body having the metal structure has a net shape.
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Cited By (3)

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KR20140109673A (en) * 2013-03-06 2014-09-16 삼성전자주식회사 Light Emitting diode package having flip-chip bonding structure
CN107731757A (en) * 2017-09-27 2018-02-23 开发晶照明（厦门）有限公司 Electrooptical device and its substrate
KR20200019538A (en) * 2018-08-14 2020-02-24 엘지이노텍 주식회사 Light emitting device package and light source unit

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030057421A1 (en) 2001-09-27 2003-03-27 Tzer-Perng Chen High flux light emitting diode having flip-chip type light emitting diode chip with a transparent substrate

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140109673A (en) * 2013-03-06 2014-09-16 삼성전자주식회사 Light Emitting diode package having flip-chip bonding structure
US9203005B2 (en) 2013-03-06 2015-12-01 Samsung Electronics Co., Ltd. Light-emitting diode (LED) package having flip-chip bonding structure
CN107731757A (en) * 2017-09-27 2018-02-23 开发晶照明（厦门）有限公司 Electrooptical device and its substrate
CN107731757B (en) * 2017-09-27 2019-11-08 开发晶照明（厦门）有限公司 Electrooptical device and its substrate
KR20200019538A (en) * 2018-08-14 2020-02-24 엘지이노텍 주식회사 Light emitting device package and light source unit

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