KR101637590B1 - Light emitting device package and lighting system - Google Patents

Light emitting device package and lighting system Download PDF

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Publication number
KR101637590B1
KR101637590B1 KR1020100056786A KR20100056786A KR101637590B1 KR 101637590 B1 KR101637590 B1 KR 101637590B1 KR 1020100056786 A KR1020100056786 A KR 1020100056786A KR 20100056786 A KR20100056786 A KR 20100056786A KR 101637590 B1 KR101637590 B1 KR 101637590B1
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KR
South Korea
Prior art keywords
light emitting
emitting element
accommodating portion
accommodating
emitting device
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Application number
KR1020100056786A
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Korean (ko)
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KR20110136647A (en
Inventor
김충열
Original Assignee
엘지이노텍 주식회사
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Priority to KR1020100056786A priority Critical patent/KR101637590B1/en
Publication of KR20110136647A publication Critical patent/KR20110136647A/en
Application granted granted Critical
Publication of KR101637590B1 publication Critical patent/KR101637590B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

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  • Led Device Packages (AREA)

Abstract

The light emitting device package according to the present embodiment includes a body including a cavity and a plurality of light emitting element accommodating portions formed on a bottom surface of the cavity; And a plurality of light emitting elements individually positioned within the plurality of light emitting element accommodating portions. The at least two light emitting element accommodating portions of the plurality of light emitting element accommodating portions have different volumes.

Description

[0001] LIGHT EMITTING DEVICE PACKAGE AND LIGHTING SYSTEM [0002]

Embodiments relate to a light emitting device package and an illumination system.

Light emitting diodes (LEDs) are a type of semiconductor devices that convert electrical energy into light. The light emitting diode has advantages of low power consumption, semi-permanent lifetime, fast response speed, stability and environment friendliness compared to conventional light sources such as fluorescent lamps and incandescent lamps.

Therefore, much research has been conducted to replace an existing light source with a light emitting diode, and there is an increasing tendency to use a light emitting element as a light source for various lamps used in indoor and outdoor, liquid crystal display devices, electric sign boards, to be.

Embodiments provide a light emitting device package and an illumination system capable of uniformly emitting light.

The light emitting device package according to the present embodiment includes a body including a cavity and a plurality of light emitting element accommodating portions formed on a bottom surface of the cavity; And a plurality of light emitting elements individually positioned within the plurality of light emitting element accommodating portions. The at least two light emitting element accommodating portions of the plurality of light emitting element accommodating portions have different volumes.

The illumination system according to the present embodiment includes: a substrate; And a light emitting device package including a light emitting device package disposed on the substrate. The light emitting device package includes: a body including a cavity and a plurality of light emitting element accommodating portions formed on a bottom surface of the cavity; And a plurality of light emitting elements individually positioned within the plurality of light emitting element accommodating portions. The at least two light emitting element accommodating portions of the plurality of light emitting element accommodating portions have different volumes.

According to this embodiment, the accommodating portion, the resin material, and the individual lenses are individually provided corresponding to the respective light emitting elements. The light emitted from the light emitting device can be uniformized by adjusting the amount of the resin material containing the fluorescent material in consideration of the efficiency of each light emitting device and the fluorescent material.

The amount of the resin water can be easily adjusted by changing the plane area and depth of the receiving part in which the resin water is received, and the like.

It is possible to separately form the accommodating portions corresponding to the respective light emitting elements and to include resin materials having different fluorescent materials, and thus various light emitting device packages and illumination systems can be manufactured according to desired characteristics. In addition, the efficiency of the light emitting device package and the illumination system can be improved by using individual lenses of a shape capable of having excellent efficiency.

1 is a perspective view of a light emitting device package according to a first embodiment.
FIG. 2 is a perspective view of the light emitting device package of FIG. 1, with the individual lenses, the common lens, and the resin material removed.
3 is a plan view of Fig.
4 is a cross-sectional view taken along the line IV-IV 'of FIG.
5 is a cross-sectional view of a light emitting device package according to the second embodiment.
6 is a cross-sectional view of a light emitting device package according to the third embodiment.
7 is a view illustrating a backlight unit including a light emitting device package according to an embodiment.
8 is a view for explaining a lighting unit including the light emitting device package according to the embodiment.

In the description of the embodiments, the description that each layer (film), region, pattern or structure is formed on or on a substrate, each layer (film), region, pad or patterns, All of which are formed interposed therebetween. The thickness or the size of each layer (film), region, pattern or structure in the drawings may be modified for clarity and convenience of explanation, and thus does not entirely reflect the actual size.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a perspective view of a light emitting device package according to a first embodiment, FIG. 2 is a perspective view of a light emitting device package of FIG. 1, in which individual lenses, a common lens, and resin materials are removed, and FIG.

1 to 3, the light emitting device package 100 of the present embodiment includes a body 10 including a cavity 20 and a plurality of light emitting element accommodating portions (hereinafter, " accommodating portions ") 30, A first electrode 41 and a second electrode 42, and a plurality of individual lenses 60, which are individually located in the first and second portions 30, respectively. And a common lens 70 that covers a plurality of individual lenses 60. [

This will be described in more detail as follows.

The body 10 may be formed of a resin such as polyphthalamide (PPA), liquid crystal polymer (LCP), polyamide 9T or PA9T, a metal, a photo sensitive glass, a sapphire 2 O 3 ), ceramics, printed circuit boards (PCB), and the like. However, this embodiment is not limited to these materials.

The body 10 may have various shapes depending on the use and design of the light emitting device package 100. For example, the planar shape of the body 10 may have various shapes such as a rectangular shape and a circular shape.

The body (10) is provided with a cavity (20) having an open top. In the drawing, the planar shape of the cavity 20 is shown as a circle, but the present invention is not limited thereto. Accordingly, the cavity 20 may have a planar shape of a polygonal shape including a quadrangle.

The side surface of the cavity (20) may be perpendicular or inclined to the bottom surface of the cavity (20). The angle formed by the side surface and the bottom surface of the cavity 20 (θ1 in FIG. 4, the same applies hereinafter) when the cavity 20 has a sloped side may be 100 degrees to 170 degrees. At this time, the angle [theta] 1 may be 120 degrees or more so that the light emitted from the light emitting element 50 can be well reflected.

A plurality of receiving portions 30 are formed on the bottom surface of the cavity 20. [ The plurality of accommodating portions 30a and 30b are formed to accommodate the plurality of light emitting elements 50 individually. Although the planar shape of the accommodating portion 30 is circular in the figure, the embodiment is not limited thereto. Therefore, the accommodating portion 30 may have a polygonal planar shape including a rectangle.

The side surface of the receiving portion 30 may be perpendicular or inclined to the bottom surface of the receiving portion 30. [ The angle formed between the side surface of the accommodating portion 30 and the bottom surface (the same in Fig. 4, hereinafter the same) may be 100 degrees to 170 degrees when the accommodating portion 30 has an inclined side surface. At this time, when the angle 2 is 120 degrees or more, the light emitted from the light emitting element 50 can be well reflected.

The body 10 having the cavities 20 and the plurality of receiving portions 30 may be formed by laminating a plurality of layers or may be formed by injection molding or the like. It is needless to say that the body 10 can be formed by various other methods.

A first electrode 41 and a second electrode 42 electrically connected to the light emitting device 50 are disposed in the body 10. The first electrode 41 and the second electrode 42 may be formed of a metal plate having a predetermined thickness, and another metal layer may be plated on the surface of the first electrode 41 and the second electrode 42. The first electrode 41 and the second electrode 42 may be formed of a metal having excellent conductivity. Examples of such metals include titanium (Ti), copper (Cu), nickel (Ni), gold (Au), chromium (Cr), tantalum (Ta), platinum (Pt), tin .

A portion of the first electrode 41 and the second electrode 42 may be exposed through the receiving portion 30 and the remaining portion may pass through the inside of the body 10 and be exposed to the outside. In this embodiment, the first electrode 41 and the second electrode 42 are formed in contact with the bottom surface of the receiving portion 30, but the present invention is not limited thereto. Accordingly, the first electrode 41 and the second electrode 42 may be formed in contact with the bottom surface of the cavity 20, or may be formed in contact with the upper surface of the body 10.

The light emitting device 50 is positioned in the receiving portion 30 while being electrically connected to the first electrode 41 and the second electrode 42. The light emitting device 50 may be electrically connected to the first electrode 41 and the second electrode 42 by wire bonding through the wire 52. [

The light emitting device 50 may be a horizontal chip disposed such that two electrode layers (not shown) are exposed in the upward direction, or a vertical chip having two electrode layers disposed on opposite sides of the light emitting layer. At this time, the horizontal chip may be connected to the first electrode 41 and the second electrode 42 by wires 52, respectively. In the vertical chip, one electrode of the first electrode 41 and the second electrode 42 is formed in contact with the electrode layer, and the other electrode is connected to the electrode layer by the wire 52. In FIGS. 2 and 3, the horizontal chip is used as an example.

However, the embodiment is not limited thereto. That is, the light emitting device 50 and the first and second electrodes 41 and 42 may be electrically connected by die bonding or a flip chip method in addition to wire bonding.

Then, the resin material (reference numeral 80 in Fig. 4, the same applies hereinafter) is filled while sealing the light emitting element 50 in the accommodating portion 30. [ This resin material 80 may be made of a light-transmitting material such as silicone or epoxy. The resin material 80 may include a fluorescent material that absorbs light emitted from the light emitting element 50 and emits a different wavelength.

An individual lens 60 having a convex shape is placed on the resin material 80. The individual lens 60 may be formed by molding a resin or the like, or may be attached with a separately manufactured lens. Although the resin 80 and the individual lens 60 are shown and described as being different in the drawings and the description, the resin 80 and the individual lenses 60 may be formed together in the same process. At least a portion of this individual lens 60 may be in contact with the bottom surface of the cavity 20.

In this embodiment, the plurality of individual lenses 60 may be formed at a predetermined distance from the side surface of the cavity 20, and may have a convex shape on each light emitting element 50.

When a lens corresponding to a plurality of light emitting devices 50 is formed by only one lens as in the conventional case, the surface of the lens has a gentle curved surface. As a result, the total reflection occurs on the surface of the lens and the efficiency can be reduced. On the other hand, when an individual lens 60 is provided to correspond to each light emitting element 50 as in the present embodiment, the surface of the lens can have a relatively large curvature, and total reflection can be reduced, have.

At this time, each individual lens 60 may have an approximately hemispherical shape in consideration of efficiency. When a single lens is used for a plurality of light emitting devices 50 as in the related art, the thickness of the light emitting device package 100 may become too thick if a hemispherical lens is used, so that a hemispherical lens can not be used. On the other hand, in the present embodiment, the individual lens 60 is provided and can have an excellent hemispherical shape in terms of efficiency.

In addition, since the individual lenses 60 are provided, the shapes, materials, and the like of the individual lenses 60 can be made different from each other in consideration of the characteristics of the plurality of light emitting devices 50. [ Thus, the light emitting device package 100 having various structures can be formed.

A common lens 70 is formed on the cavity 20 while covering the individual lens 60. The common lens 70 may be formed by molding a resin or the like, or may be attached with a separately manufactured lens. When the common lens 70 is made of a resin or the like, it may include a fluorescent material. The common lens 70 may be disposed apart from the individual lenses 60. [

The refractive index of the common lens 70 can be made smaller than that of the individual lenses 60, and the light extraction efficiency can be further improved. That is, light can pass from a material having a high refractive index to a material having a low refractive index, thereby minimizing loss due to Fresnel reflection or the like.

However, the embodiment is not limited thereto. It is also possible that either the individual lens 60 or the common lens 70 is not formed.

The cavity 20, the accommodating portion 30, the light emitting element 50 and the resin material 80 of the present embodiment will be described in more detail with reference to FIG. 4 together with FIG. 4 is a cross-sectional view taken along the line IV-IV 'of FIG.

In this embodiment, one cavity 20 is formed with a plurality of accommodating portions 30a and 30b for individually accommodating a plurality of light emitting devices 50a and 50b.

The plurality of light emitting elements 50 include a first light emitting element 50a and a second light emitting element 50b and a plurality of receiving portions 30a and 30b are formed in the first receiving portion 30a and the second receiving portion 30b, And a portion 30b. The first individual lens 60a may be positioned on the first accommodating portion 30a and the second individual lens 60b may be positioned on the second accommodating portion 30b.

The depth H2 of the first and second accommodating portions 30a and 30b may be greater than the thickness of the first and second light emitting devices 50a and 50b so that the first and second fluorescent materials may be included in a sufficient amount . For example, the depth H2 of the first and second receiving portions 30a and 30b may be at least 30 mu m or more larger than the first and second light emitting devices 50a and 50b. The depth H1 of the cavity 20 may be smaller than the depth H2 of the first and second accommodating portions 30a and 30b. This is because if the depth H1 of the cavity 20 is excessively large, the amount of light lost due to reflection becomes large.

As described above, in this embodiment, the depth H1 of the cavity 20 and the depth H2 of the accommodating portions 30a and 30b can be optimized to further improve the efficiency of the light emitting device package 100.

In this case, the first and second light emitting devices 50a and 50b may be light emitting devices of the same type emitting light of the same wavelength, or different types of light emitting devices emitting light of different wavelengths.

The first fluorescent material is located in the first accommodating portion 30a and the second fluorescent material is located in the second accommodating portion 30b. The first fluorescent material and the second fluorescent material may be the same kind of fluorescent material or different kinds of fluorescent materials. As the first and second fluorescent materials, various fluorescent materials such as a sulfide type, a silicate type, a yttrium-aluminum-garnet (YAG) type, a nitric oxide type, and a nitride type can be used.

In other words, since only one resin material can be used in the related art, it is impossible to use different resins for the plurality of light emitting devices 50a and 50b. Since the first and second light emitting devices 50a and 50b are positioned in the first and second receiving portions 30a and 30b in this embodiment, the first fluorescent material and the second fluorescent material are formed of different materials It is also possible to do. Accordingly, the fluorescent material can be used in consideration of the characteristics of the first and second light emitting devices 50a and 50b.

In addition, since different kinds of fluorescent materials can be placed in the different receiving spaces 32, 34 and / or the cavity 20, it is possible to prevent problems caused by mixing different kinds of fluorescent materials. For example, when a red fluorescent material is mixed with another fluorescent material, the red fluorescent material may absorb light of a wavelength converted from another fluorescent material, thereby lowering brightness and efficiency as a whole. In the present embodiment, such a red fluorescent material can be placed in a space different from other fluorescent materials to prevent a decrease in luminance.

In this embodiment, the efficiency of the first light emitting device 50a and the first fluorescent material may be greater than that of the second light emitting device 50b and the second fluorescent material.

For example, the first and second light emitting devices 50a and 50b are light emitting devices that emit blue light, and the first fluorescent material of the first resin material 82 is a fluorescent material emitting yellow light (hereinafter, Material ") and the second fluorescent material of the second resin material 84 emits green light (hereinafter, referred to as" green fluorescent substance "). And the fluorescent substance of the common lens 70 may be a fluorescent substance emitting red light (hereinafter referred to as "red fluorescent substance").

Here, referring to FIG. 3, the second receiving portion 30b is formed to be larger than the plane area of the first receiving portion 30a. That is, as shown in Fig. 4, the diameter W2 of the second accommodating portion 30b can be made larger than the diameter W1 of the first accommodating portion 30a. Then, the volume of the second accommodating portion 30b is formed larger than the volume of the first accommodating portion 30a.

Thereby, the amount of the second resin material 84 located in the second accommodating portion 30b can be increased more than the amount of the first resin material 82 located in the first accommodating portion 30a. By thus increasing the amount of the second resin material 84, the amount of the second fluorescent material contained in the second resin material 84 can be increased. That is, in this embodiment, the combination of the second light emitting device 50b and the second fluorescent material has a relatively low efficiency, so that the amount of the second fluorescent material is increased beyond the amount of the first fluorescent material, have. That is, the amount of light emitted by the second light emitting element 50b and the second fluorescent material is increased by increasing the amount of the second fluorescent material having a low efficiency, and the amount of light emitted by the first light emitting element 50a and the first fluorescent material It can be improved to a level similar to the amount. As a result, the amount of light emitted by the first light emitting element 50a and the second light emitting element 50b can be made uniform.

As described above, in this embodiment, even when the light emitting element and / or the fluorescent material having different efficiencies are used in different volumes of the first accommodating portion 50a and the second accommodating portion 50b, the amount of light can be made uniform.

Hereinafter, the light emitting device package according to the second and third embodiments will be described in detail with reference to FIGS. 5 and 6. FIG. For the sake of clarity, the same or extremely similar components as those of the first embodiment will not be described in detail and only different configurations will be described in detail.

5 is a cross-sectional view of a light emitting device package according to the second embodiment.

Referring to FIG. 5, in this embodiment, the depth D1 of the first accommodating portion 30a in which the first resin material 82 including the first fluorescent material is located is smaller than the depth D1 of the second accommodating portion 30a, The depth D2 of the second accommodating portion 30b where the resin material 84 is located is larger. At this time, the efficiency of the first light emitting device 50a and the first fluorescent material may be higher than that of the second light emitting device 50b and the second fluorescent material.

A step 22 is formed at a portion where the first accommodating portion 30a is formed in the body so that the depth D1 of the first accommodating portion 30a is made smaller than that of the second accommodating portion 30b . However, the embodiment is not limited thereto, and the first accommodating portion 30a may be formed to be shallower than the second accommodating portion 30b without a step 22.

In this embodiment, the depths of the first and second accommodating portions 30a and 30b are adjusted so that the volume of the second accommodating portion 30b is larger than the volume of the first accommodating portion 30a. Thus, the amount of the second fluorescent material accommodated in the second accommodating portion 30b can be increased, and the difference in efficiency of the different light emitting devices and / or fluorescent materials can be compensated.

6 is a cross-sectional view of a light emitting device package according to the third embodiment.

6, three cavities 30a, 30b, and 30c, three light emitting devices 50a, 50b, and 50c, and three separate lenses 60a and 60b are formed in one cavity 20, 60c.

Here, the first to third light emitting devices 50a, 50b, and 50c may be light emitting devices of the same type emitting light of the same wavelength, or different types of light emitting devices emitting light of different wavelengths. The first, second, and third resin materials 82, 84, and 86 may respectively include first, second, and third fluorescent materials. The first to third fluorescent materials may be the same material or different kinds of fluorescent materials.

The efficiency of the first light emitting device 50a and the first fluorescent material is higher than that of the second light emitting device 50b and the second fluorescent material, and the efficiency of the second light emitting device 50b and the second fluorescent material Efficiency may be superior to that of the third light emitting device 50c and the third fluorescent material.

For example, the first to third light emitting devices 50a, 50b, and 50c are light emitting devices that emit blue light, and the fluorescent materials of the first, second, and third resin materials 82, 84, , Green and red fluorescent materials.

As another example, the first to third light emitting elements 50a, 50b and 50c are light emitting elements emitting ultraviolet rays (UV), and the fluorescent materials of the first, second and third resin materials 82, 84 and 86 And may be a fluorescent material that emits yellow, green, and red light, respectively.

It goes without saying that various combinations of light emitting devices and fluorescent materials may be used.

The diameter W2 of the second accommodating portion 30b is set to be larger than the diameter W1 of the first accommodating portion 30a and the diameter W2 of the second accommodating portion 30b The diameter W3 of the third accommodating portion 30c can be made larger than that of the third accommodating portion 30c. Whereby the amount of the third fluorescent material having a relatively low efficiency can be made larger than that of the second fluorescent material and the amount of the second fluorescent material can be made larger than the amount of the first fluorescent material having a relatively high efficiency. Accordingly, the light amount by the first to third light emitting devices 50a, 50b, and 50c and the first to third fluorescent materials can be equalized by compensating different efficiencies.

In FIG. 6, the three receiving portions 30a, 30b and 30c are formed as one row, but the embodiment is not limited thereto. Accordingly, four or more receptacles may be formed, and they may be arranged in a polygonal structure or two or more rows.

In FIG. 6, the first through third accommodating portions 30a, 30b, and 30c have different planar widths, but they may have different depths and different volumes. Furthermore, although the three receiving portions 30a, 30b and 30c have different volumes in FIG. 6, it is also possible that two or more of the three receiving portions 30a, 30b and 30c have different volumes.

The light emitting device package according to the above-described embodiments can function as a backlight unit, a pointing device, or an illumination system such as a lamp, a lighting unit of a streetlight. This will be described with reference to FIGS. 7 and 8. FIG.

7 is a view illustrating a backlight unit including a light emitting device package according to an embodiment. However, the backlight unit 1100 of Fig. 7 is an example of the illumination system, and is not limited thereto.

7, the backlight unit 1100 includes a bottom cover 1140, a light guide member 1120 disposed in the bottom cover 1140, a light guide member 1120 disposed on at least one side or bottom surface of the light guide member 1120 A light emitting module 1110 may be included. Further, a reflective sheet 1130 may be disposed below the light guide member 1120.

The bottom cover 1140 may be formed in a box shape having an opened upper surface to accommodate the light guide member 1120, the light emitting module 1100 and the reflective sheet 1130, . However, the present invention is not limited thereto.

The light emitting module 1110 may include a plurality of light emitting device packages 600 mounted on the substrate 700. A plurality of light emitting device packages (600) provide light to the light guide member (1120).

As shown, the light emitting module 1110 may be disposed on at least one of the inner surfaces of the bottom cover 1140, thereby providing light toward at least one side of the light guide member 1120 .

The light emitting module 1110 may be disposed under the light guide member 1120 in the bottom cover 1140 to provide light toward the bottom surface of the light guide member 1120. It can be variously modified according to the design of the backlight unit 1100.

The light guide member 1120 may be disposed in the bottom cover 1140. The light guide member 1120 can guide the light provided from the light emitting module 1110 to a display panel (not shown) by converting the light into a surface light source.

Such a light guide member 1120 may be, for example, a light guide panel (LGP). The light guiding plate may be made of, for example, acrylic resin such as polymethyl methacrylate (PMMA), polyethylene terephthalate (PET), cyclic olefin copolymer (COC), polycarbonate (PC) , And polyethylene naphthalate resin.

The optical sheet 1150 can be disposed on the upper side of the light guide member 1120.

This optical sheet 1150 may include at least one of, for example, a diffusion sheet, a light condensing sheet, a brightness increasing sheet, and a fluorescent sheet. For example, the optical sheet 1150 may be formed by laminating a diffusion sheet, a light condensing sheet, a brightness increasing sheet, and a fluorescent sheet. In this case, the diffusion sheet 1150 spreads the light emitted from the light emitting module 1110 evenly, and the diffused light can be condensed by the condensing sheet into a display panel (not shown). At this time, the light emitted from the light condensing sheet is randomly polarized light. The brightness increasing sheet can increase the degree of polarization of the light emitted from the light condensing sheet. The light collecting sheet may be, for example, a horizontal or / and a vertical prism sheet. The brightness enhancement sheet may be, for example, a dual brightness enhancement film. Further, the fluorescent sheet may be a translucent plate or film in which the phosphor is spun.

A reflective sheet 1130 may be disposed below the light guide member 1120. The reflective sheet 1130 can reflect light emitted through the lower surface of the light guide member 1120 toward the exit surface of the light guide member 1120. The reflective sheet 1130 may be formed of a resin having high reflectance, for example, PET, PC, poly vinyl chloride, resin, or the like, but is not limited thereto.

8 is a view for explaining a lighting unit including the light emitting device package according to the embodiment. However, the illumination unit 1200 of Fig. 8 is an example of the illumination system, and is not limited thereto.

8, the lighting unit 1200 includes a case body 1210, a light emitting module 1230 installed in the case body 1210, a connection terminal 1220 installed in the case body 1210, (1220).

The case body 1210 is preferably formed of a material having a good heat dissipation property, and may be formed of, for example, a metal or a resin.

The light emitting module 1230 may include a substrate 700 and at least one light emitting device package 600 mounted on the substrate 700.

The substrate 700 may be a circuit pattern printed on an insulator. For example, the substrate 700 may be a general printed circuit board (PCB), a metal core PCB, a flexible PCB, a ceramic PCB . ≪ / RTI >

Further, the substrate 700 may be formed of a material that efficiently reflects light, or may be formed of a color whose surface is efficiently reflected, for example, white, silver, or the like.

At least one light emitting device package 600 may be mounted on the substrate 700.

The light emitting device package 600 may include at least one light emitting diode (LED). The light emitting device may include a colored light emitting device that emits red, green, blue, or white colored light, and a UV light emitting device that emits ultraviolet (UV) light.

The light emitting module 1230 may be arranged to have various combinations of light emitting elements to obtain color and brightness. For example, a white light emitting element, a red light emitting element, and a green light emitting element may be disposed in combination in order to secure a high color rendering index (CRI). Further, a fluorescent sheet may be further disposed on the path of the light emitted from the light emitting module 1230, and the fluorescent sheet changes the wavelength of the light emitted from the light emitting module 1230. For example, when the light emitted from the light emitting module 1230 has a blue wavelength band, the fluorescent sheet may include a yellow phosphor, and the light emitted from the light emitting module 1230 may be seen through the fluorescent sheet as white light do.

The connection terminal 1220 may be electrically connected to the light emitting module 1230 to supply power. 8, the connection terminal 1220 is connected to the external power supply by being inserted into the socket, but the present invention is not limited thereto. For example, the connection terminal 1220 may be formed in a pin shape and inserted into an external power source or may be connected to an external power source by wiring.

In the above-described illumination system, at least one of a light guide member, a diffusion sheet, a light condensing sheet, a brightness increasing sheet, and a fluorescent sheet is disposed on the path of light emitted from the light emitting module to obtain a desired optical effect.

As described above, the illumination system can have excellent light efficiency and characteristics by including the light emitting device package that has improved light efficiency and emits uniform light.

The features, structures, effects and the like described in the foregoing embodiments are included in at least one embodiment of the present invention and are not necessarily limited to one embodiment. Further, the features, structures, effects, and the like illustrated in the embodiments may be combined or modified in other embodiments by those skilled in the art to which the embodiments belong. Therefore, it should be understood that the present invention is not limited to these combinations and modifications.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is clearly understood that the same is by way of illustration and example only and is not to be construed as limiting the scope of the present invention. It can be seen that various modifications and applications are possible. For example, each component specifically shown in the embodiments may be modified and implemented. It is to be understood that the present invention may be embodied in many other specific forms without departing from the spirit or essential characteristics thereof.

10: Body
20: cavity
30: Light emitting element accommodating portion
41: first electrode
42: second electrode
50: Light emitting element
60: Individual lens
70: a common lens
80: resin water
100: Light emitting device package

Claims (13)

A body including a cavity and a plurality of light emitting element accommodating portions formed on a bottom surface of the cavity; And
And a plurality of light emitting elements individually positioned in the plurality of light emitting element accommodating portions,
Wherein the plurality of light emitting elements include a first light emitting element and a second light emitting element,
The plurality of light emitting element accommodating portions include a first accommodating portion for accommodating the first light emitting element and a second accommodating portion for accommodating the second light emitting element,
Wherein the first accommodating portion and the second accommodating portion have different volumes from each other,
Wherein the first accommodating portion and the second accommodating portion comprise a resin material containing different fluorescent materials,
Wherein a height of the cavity is smaller than a depth of the first accommodating portion and the second accommodating portion.
delete The method according to claim 1,
A first fluorescent material is positioned in the first accommodation portion, a second fluorescent material different from the first fluorescent material is positioned in the second accommodation portion,
Wherein efficiency of the first light emitting device and the first fluorescent material is higher than efficiency of the second light emitting device and the second fluorescent material,
Wherein a volume of the second accommodating portion is larger than a volume of the first accommodating portion. The method of claim 3,
Wherein a plane area of the second accommodation portion is larger than a plane area of the first accommodation portion. The method of claim 3,
Wherein a depth of the second accommodating portion is larger than a depth of the first accommodating portion. The method according to claim 1,
The plurality of light emitting elements further includes a third light emitting element,
Wherein the plurality of light emitting element accommodating portions further include a third accommodating portion for accommodating the third light emitting element. The method according to claim 6,
Wherein at least two of the first accommodating portion, the second accommodating portion, and the third accommodating portion have different volumes. The method according to claim 1,
Wherein the body includes a stepped portion formed in at least one of the light emitting element accommodating portions. The method according to claim 1,
And a plurality of individual lenses separately disposed on the plurality of light emitting element accommodating portions. 10. The method of claim 9,
And an entire lens covering the plurality of individual lenses. Board; And
And a light emitting device package including a light emitting device package disposed on the substrate
/ RTI >
The light emitting device package includes: a body including a cavity and a plurality of light emitting element accommodating portions formed on a bottom surface of the cavity; And a plurality of light emitting elements individually disposed in the plurality of light emitting element accommodating portions,
Wherein the plurality of light emitting elements include a first light emitting element and a second light emitting element,
The plurality of light emitting element accommodating portions include a first accommodating portion for accommodating the first light emitting element and a second accommodating portion for accommodating the second light emitting element,
Wherein the first accommodating portion and the second accommodating portion have different volumes from each other,
Wherein the first accommodating portion and the second accommodating portion comprise a resin material containing different fluorescent materials,
Wherein the height of the cavity is smaller than the depth of the first receiving portion and the second receiving portion. delete 12. The method of claim 11,
A first fluorescent material is positioned in the first accommodation portion, a second fluorescent material different from the first fluorescent material is positioned in the second accommodation portion,
Wherein efficiency of the first light emitting device and the first fluorescent material is higher than efficiency of the second light emitting device and the second fluorescent material,
Wherein a volume of the second accommodating portion is larger than a volume of the first accommodating portion.
KR1020100056786A 2010-06-15 2010-06-15 Light emitting device package and lighting system KR101637590B1 (en)

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Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200413741Y1 (en) * 2005-12-08 2006-04-13 타이완 오아시스 테크놀러지 컴퍼니 리미티드 Light emitting diode

Family Cites Families (2)

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Publication number Priority date Publication date Assignee Title
KR100944085B1 (en) * 2008-06-23 2010-02-24 서울반도체 주식회사 Light emitting device
KR100982994B1 (en) * 2008-10-15 2010-09-17 삼성엘이디 주식회사 Led package module

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200413741Y1 (en) * 2005-12-08 2006-04-13 타이완 오아시스 테크놀러지 컴퍼니 리미티드 Light emitting diode

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