KR101637582B1 - Light emitting module and light unit using the same - Google Patents

Light emitting module and light unit using the same Download PDF

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Publication number
KR101637582B1
KR101637582B1 KR1020100027789A KR20100027789A KR101637582B1 KR 101637582 B1 KR101637582 B1 KR 101637582B1 KR 1020100027789 A KR1020100027789 A KR 1020100027789A KR 20100027789 A KR20100027789 A KR 20100027789A KR 101637582 B1 KR101637582 B1 KR 101637582B1
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KR
South Korea
Prior art keywords
light emitting
light
connection structures
connection
emitting module
Prior art date
Application number
KR1020100027789A
Other languages
Korean (ko)
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KR20110108541A (en
Inventor
최정기
Original Assignee
엘지이노텍 주식회사
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Priority to KR1020100027789A priority Critical patent/KR101637582B1/en
Publication of KR20110108541A publication Critical patent/KR20110108541A/en
Application granted granted Critical
Publication of KR101637582B1 publication Critical patent/KR101637582B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Abstract

A light emitting module according to an embodiment includes a plurality of first connection structures coupled to be rotatable with respect to each other; A plurality of second connection structures coupled to be rotatable with each other and arranged in rows with the plurality of first connection structures; And a plurality of light emitting elements which are provided between the plurality of first connection structures and the plurality of second connection structures and are electrically connected to the plurality of first connection structures and the plurality of second connection structures, .

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a light emitting module,

The embodiment relates to a light emitting module and a light unit using the same.

Light emitting diodes (LEDs) are a type of semiconductor devices that convert electrical energy into light. The light emitting diode has advantages of low power consumption, semi-permanent lifetime, fast response speed, safety, and environmental friendliness compared with conventional light sources such as fluorescent lamps and incandescent lamps. Accordingly, much research has been conducted to replace an existing light source with a light emitting diode, and a light emitting diode has been increasingly used as a light source for various lamps used in indoor / outdoor, a liquid crystal display, a display board, and a streetlight.

Embodiments provide a light emitting module having a novel structure and a light unit using the same.

Embodiments provide a light emitting module coupled to be rotatable and a light unit using the same.

Embodiments provide a light emitting module and a light unit using the same that can be easily replaced and combined.

A light emitting module according to an embodiment includes a plurality of first connection structures coupled to be rotatable with respect to each other; A plurality of second connection structures coupled to be rotatable with each other and arranged in rows with the plurality of first connection structures; And a plurality of light emitting elements which are provided between the plurality of first connection structures and the plurality of second connection structures and are electrically connected to the plurality of first connection structures and the plurality of second connection structures, .

A backlight unit according to an embodiment includes a light guide member; And a light emitting module for providing light to the light guide member, wherein the light emitting module includes a plurality of first connection structures rotatably coupled to each other, and a plurality of first connection structures and heat A plurality of second connection structures arranged between the plurality of first connection structures and the plurality of second connection structures and electrically connected to the plurality of first connection structures and the plurality of second connection structures, And a plurality of light emitting elements connected to each other to generate light.

The embodiment can provide a light emitting module having a new structure and a light unit using the same.

Embodiments can provide a light emitting module coupled to be rotatable and a light unit using the same.

Embodiments can provide a light emitting module and a light unit using the same that can be easily replaced and combined.

1 is a perspective view showing a light emitting module according to an embodiment;
2 and 3 are top plan views of the light emitting module according to the embodiment
4 is a view showing a coupling relationship of a connection structure of a light emitting module according to an embodiment;
5 is a view showing a light emitting module according to another embodiment;
6 is a cross-sectional view of the light emitting device provided in the light emitting module according to the embodiment
7 is an exploded perspective view of the backlight unit using the light emitting module according to the embodiment.

In the description of the embodiments, it is to be understood that each layer (film), region, pattern or structure is formed "on" or "under" a substrate, each layer The terms " on "and " under " encompass both being formed" directly "or" indirectly " In addition, the criteria for above or below each layer will be described with reference to the drawings.

The thickness and size of each layer in the drawings are exaggerated, omitted, or schematically shown for convenience and clarity of explanation. Also, the size of each component does not entirely reflect the actual size.

Hereinafter, a light emitting module according to an embodiment and a light unit using the same will be described with reference to the accompanying drawings.

FIG. 1 is a perspective view showing a light emitting module according to an embodiment, FIGS. 2 and 3 are top views of a light emitting module according to an embodiment, and FIG. 4 is a view showing a coupling relation of connection structures of a light emitting module according to an embodiment .

1 to 4, the light emitting module according to the embodiment includes a plurality of first connection structures 200A coupled to be rotatable with each other, a plurality of first connection structures 200A and 200B coupled to be rotatable with each other, And a plurality of second connection structures (200B) disposed between the plurality of first connection structures (200A) and the plurality of second connection structures (200B), wherein the plurality of first connection structures And a plurality of light emitting devices 100 electrically connected to the plurality of second connection structures 200B to generate light.

The light emitting module according to the embodiment is designed such that the first and second connection structures 200A and 200B are rotatable. Therefore, not only the plurality of light emitting devices 100 may be installed along a straight line as shown in FIG. 2, but the plurality of light emitting devices 100 may be installed along a curve as shown in FIG. That is, the light emitting module according to the embodiment has a small restriction on the installation position, so that flexible mounting is possible.

In addition, in the light emitting module according to the embodiment, the plurality of light emitting devices 100 are installed between the first and second connection structures 200A and 200B. In this case, the interval between the plurality of light emitting devices 100 (pitch). Accordingly, the light emitting module according to the embodiment can efficiently provide light with less variation in brightness by adjusting the interval between the plurality of light emitting devices 100 according to the light distribution area.

The light emitting module according to the embodiment includes a structure in which a plurality of connection structures 200 are coupled to each other. Since the coupling structure of the connection structures 200 is simple in principle, The connection structure 200 or the light emitting device 100 can be easily replaced when defects or failures occur in the light emitting device 100. [

Hereinafter, each component of the light emitting module according to the embodiment will be described in detail.

1 to 4, the plurality of first connection structures 200A and the plurality of first connection structures 200B may be formed in the same shape and arranged in a line, And may include a plurality of connection structures 200.

The connection structure 200 includes a body 210 extending in one direction, a first connection part 220 formed at one end of the body 210, and a connection part 220 formed at the other end of the body 210 And a second connection part 230 coupled to the first connection part 220 of the first connection part 200.

The body 210 may include, for example, a body made of synthetic resin and a circuit pattern formed in the body. Alternatively, the body 210 may be formed of a metal having electrical conductivity, but the present invention is not limited thereto.

At least one groove 240 may be formed on the side surface of the body 210. The body 210 may be coupled to any one of the at least one groove 240 by inserting the electrodes 31 and 32 of the plurality of light emitting devices 100, As shown in FIG.

The pitch between the plurality of light emitting devices 100 may vary depending on which of the at least one groove 240 the electrodes 31 and 32 are inserted into. Therefore, the pitch between the plurality of light emitting devices 100 can be easily changed according to the application of the light emitting module according to the embodiment.

The first connection part 220 may be formed at one end of the body 210 and the second connection part 230 may be formed at the other end of the body 210. The first and second connection portions 220 and 230 may be formed to correspond to each other so that the connection structures 200 adjacent to each other may be connected to each other by rotation of the first and second connection portions 220 and 230 .

For example, as shown, the first connection part 220 includes an insertion groove 225, and the second connection part 230 includes a protrusion 235 inserted into the insertion groove 225 .

It is preferable that the protrusion 235 and the insertion groove 225 have a circular shape when viewed from above in order to allow the first connection part 220 and the second connection part 230 to rotate with respect to each other. The present invention is not limited thereto.

The first and second connection portions 220 and 230 may be formed to include an electrically conductive material so that the adjacent connection structures 200 and the plurality of light emitting devices 100 may be electrically connected to each other.

For example, the protrusions 235 and the insertion grooves 225 are formed of a metal material, and the peripheral regions of the protrusions 235 and the insertion grooves 225 are formed of resin And may be formed of a material. Alternatively, the first and second connection portions 220 and 230 may be formed of a metal material, but the present invention is not limited thereto.

5 is a view illustrating a light emitting module according to another embodiment. The light emitting module of FIG. 5 is the same as the light emitting module of FIG. 1 except for the shape of the electrode of the light emitting element and the position of the groove formed in the connecting structure.

Referring to FIG. 5, the light emitting module may include a plurality of first connection structures 200A, a plurality of second connection structures 200B, and a plurality of light emitting devices 100. Referring to FIG.

Each of the plurality of first and second connection structures 200A and 200B includes a plurality of connection structures 200.

The connection structure 200 includes a body 210 extending in one direction, a first connection part 220 formed at one end of the body 210, and a connection part 220 formed at the other end of the body 210 And a second connection part 230 coupled to the first connection part 220 of the first connection part 200.

At least one groove 240a may be formed on the upper surface of the body 210.

A part of the electrodes 31 and 32 of the plurality of light emitting devices 100 may be inserted into the at least one groove 240a so that the plurality of light emitting devices 100 are electrically connected to the first, 2 connection structures 200A and 200B and can be electrically connected.

5, protrusions 31a and 32a inserted into the at least one groove 240a may be formed on the lower surfaces of the electrodes 31 and 32 of the plurality of light emitting devices 100. For example, have.

The protrusions 31a and 32a are formed, for example, in a cylindrical shape for ease of rotation, and the at least one groove 240a may be formed as a cylindrical groove, but the present invention is not limited thereto.

6 is a cross-sectional view of the light emitting device 100. FIG.

1 and 6, the light emitting device 100 includes a package body 10, a first electrode 31 and a second electrode 32 provided on the package body 10, A light emitting chip 20 mounted on the light emitting chip 10 and electrically connected to the first electrode 31 and the second electrode 32 to generate light and a molding member 40 sealing the light emitting chip 20, . ≪ / RTI >

The package body 10 may be formed of a resin material such as polyphthalamide (PPA), a silicon (Si), a metal material, a photo sensitive glass (PSG), a sapphire (Al 2 O 3 ), a printed circuit board And may be formed as at least one.

When the package body 10 is formed of an electrically conductive material, an insulating layer (not shown) is further formed on the surface of the package body 10 so that the package body 10 is electrically connected to the first and second electrodes 31, It is possible to prevent electrical short-circuiting between the electrodes 32 and 32.

The top surface of the package body 10 may have various shapes such as a rectangular shape, a polygonal shape, and an elliptical shape.

A cavity 15 may be formed in the package body 10 such that the upper portion of the package body 10 is opened. The cavity 15 may have a cup shape, a concave shape, or the like. The inner surface of the cavity 15 may be a side surface perpendicular to the bottom surface or a side surface inclined.

The first electrode 31 and the second electrode 32 may be disposed on the package body 10 so as to be electrically separated from each other.

The first electrode 31 and the second electrode 32 may be electrically connected to the light emitting chip 20 to supply power to the light emitting chip 20.

One end of the first electrode 31 and the second electrode 32 protrude to the outside of the package body 10 so that at least one of the first and second connection structures 200A and 200B And can be inserted into the groove 240.

That is, the first electrode 31 is inserted into at least one groove 240 formed in the first connection structure 200A and the second electrode 32 is connected to the second connection structure 200B May be inserted into any one of the formed at least one groove (240). The first and second electrodes 31 and 32 are electrically connected to the first and second connection structures 200A and 200B to supply power to the light emitting chip 20.

The first and second electrodes 31 and 32 may be formed of a metal material such as titanium, copper, nickel, gold, chromium, tantalum, And may include at least one of platinum (Pt), tin (Sn), silver (Ag), and phosphorus (P).

The light emitting chip 20 may be installed in the cavity 15 of the package body 10.

Each of the light emitting chips 20 may include at least one light emitting diode (LED), for example, a colored light emitting diode that emits light of red, green, blue, A white light emitting diode that emits light, or a UV (Ultra Violet) light emitting diode that emits ultraviolet light. However, the present invention is not limited thereto.

Although the light emitting chip 20 is electrically connected to the first and second electrodes 31 and 32 by a wire bonding method, the light emitting chip 20 may be formed by a flip chip method, a chip bonding method, And may be electrically connected to the first and second electrodes 31 and 32, but the present invention is not limited thereto.

The molding body 40 may be formed on the package body 10 to seal the light emitting chip 20. That is, the cavity 15 may be filled with the molding member 40.

The molding member 40 may be formed of silicon or a resin material having translucency. In addition, the molding member 40 may include a phosphor, which is excited by the first light emitted from the light emitting chip 20 to generate a second light. For example, when the light emitting chip 20 is a blue light emitting diode and the phosphor is a yellow phosphor, the yellow phosphor may be excited by blue light to emit yellow light, and the blue light and the yellow light may be mixed Accordingly, the light emitting device 100 may provide white light. However, the present invention is not limited thereto.

On the other hand, a lens (not shown) is further formed on the molding member 40 to control the light distribution of the light emitted from the light emitting device 100. A zener diode or the like may be further provided on the package body 10 of the light emitting element 1 to improve the withstand voltage.

Meanwhile, various light units can be implemented using the light emitting module according to the embodiment. For example, the light emitting module may be used for a light unit for illumination to provide light to indoor or outdoor, or a backlight unit serving as a light source of a display device.

7 is an exploded perspective view of a backlight unit using a light emitting module according to an embodiment.

7, the backlight unit includes a light guide member 3, a light emitting module 1 according to an embodiment disposed on at least one side of the light guide member 3, And a bottom cover 5 for receiving the light emitting module 1.

The light guiding member 3 may be, for example, a light guiding panel (LGP), and the light guiding plate may be formed of an acrylic resin such as PMMA (polymethyl methacrylate), a polyethylene terephthalate (PET) poly carbonate, COC, and polyethylene naphthalate (PEN) resin.

The light guide member 3 may function to diffuse the light provided from the light emitting module 1 to make it a surface light source. Light that is converted into a surface light source by the light guide member 3 is provided to a display panel (not shown) or the like to be used for realizing an image.

The light emitting module 1 may be disposed on at least one side of the light guide member 3 to provide light to the light guide member 3. Alternatively, the light emitting module 1 may be disposed on the lower surface of the light guide member 3 in the form of heat, but the present invention is not limited thereto.

The bottom cover 5 may be formed in a box shape having an open upper surface to accommodate the light guide member 3 and the light emitting module 1, but the present invention is not limited thereto. The bottom cover 5 may be formed of a metal material or a resin material.

The features, structures, effects and the like described in the embodiments are included in at least one embodiment of the present invention and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects and the like illustrated in the embodiments can be combined and modified by other persons skilled in the art to which the embodiments belong. Therefore, it should be understood that the present invention is not limited to these combinations and modifications.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is clearly understood that the same is by way of illustration and example only and is not to be taken by way of illustration, It can be seen that various modifications and applications are possible. For example, each component specifically shown in the embodiments can be modified and implemented. It is to be understood that all changes and modifications that come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

10: package body 20: light emitting chip
31, 32: electrode 40: molding member
100: light emitting device 200: connection structure
200A: a plurality of first connection structures 200B: a plurality of second connection structures
210: body 220: first connection part
230: second connection part 240:

Claims (13)

A plurality of first connection structures rotatably coupled to each other;
A plurality of second connection structures coupled to be rotatable with each other and arranged in rows with the plurality of first connection structures; And
And a plurality of light emitting devices disposed between the plurality of first connection structures and the plurality of second connection structures and electrically connected to the plurality of first connection structures and the plurality of second connection structures to generate light In addition,
Each of the plurality of first and second connection structures includes: a body extending in one direction; A first connection part formed at one end of the body; And a second connection portion formed at the other end of the body and coupled to the first connection portion of the adjacent connection structure,
Wherein the body includes at least one groove,
Wherein the light emitting element includes an outwardly projecting electrode,
Wherein the electrode is partially inserted into one of the at least one groove. The method according to claim 1,
Wherein the body includes a circuit pattern in a body of a synthetic resin material. 3. The method of claim 2,
Wherein the first and second connection portions include a material having electrical conductivity. 4. The method according to any one of claims 1 to 3,
Wherein the at least one groove is formed on a side surface of the body. 4. The method according to any one of claims 1 to 3,
Wherein the at least one groove is formed on an upper surface of the body. 6. The method of claim 5,
Wherein a protrusion is formed on the lower surface of the electrode of the light emitting element and the protrusion is inserted into the at least one groove. The method according to claim 6,
Wherein the protrusion has a cylindrical shape and the at least one groove has a shape corresponding to the shape of the protrusion. 4. The method according to any one of claims 1 to 3,
Wherein the body, the first connection portion, and the second connection portion are electrically connected to each other. 4. The method according to any one of claims 1 to 3,
Wherein the first connection portion includes an insertion groove, and the second connection portion includes a protrusion inserted into the insertion groove. 10. The method of claim 9,
Wherein the protrusion and the insertion groove are circular in shape when viewed from above. 4. The method according to any one of claims 1 to 3,
The light emitting device includes a package body, a first electrode and a second electrode disposed on the package body, and a light emitting chip disposed in the package body and electrically connected to the first electrode and the second electrode to generate light, Emitting module. A light guide member; And
And a light emitting module for providing light to the light guide member,
Wherein the light emitting module is any one of claims 1 to 3. A light unit comprising the light emitting module according to any one of claims 1 to 3.
KR1020100027789A 2010-03-29 2010-03-29 Light emitting module and light unit using the same KR101637582B1 (en)

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Publication number Priority date Publication date Assignee Title
JP2006317801A (en) * 2005-05-13 2006-11-24 Toshiba Transport Eng Inc Image display device and lighting system

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KR101331904B1 (en) * 2006-06-30 2013-11-22 엘지디스플레이 주식회사 Light emitting diode array and and backlight unit using the same

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Publication number Priority date Publication date Assignee Title
JP2006317801A (en) * 2005-05-13 2006-11-24 Toshiba Transport Eng Inc Image display device and lighting system

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