KR20110108541A - Light emitting module and light unit using the same - Google Patents

Light emitting module and light unit using the same Download PDF

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Publication number
KR20110108541A
KR20110108541A KR1020100027789A KR20100027789A KR20110108541A KR 20110108541 A KR20110108541 A KR 20110108541A KR 1020100027789 A KR1020100027789 A KR 1020100027789A KR 20100027789 A KR20100027789 A KR 20100027789A KR 20110108541 A KR20110108541 A KR 20110108541A
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KR
South Korea
Prior art keywords
light emitting
emitting module
light
connection structures
connection
Prior art date
Application number
KR1020100027789A
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Korean (ko)
Other versions
KR101637582B1 (en
Inventor
최정기
Original Assignee
엘지이노텍 주식회사
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Priority to KR1020100027789A priority Critical patent/KR101637582B1/en
Publication of KR20110108541A publication Critical patent/KR20110108541A/en
Application granted granted Critical
Publication of KR101637582B1 publication Critical patent/KR101637582B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Abstract

The light emitting module according to the embodiment includes a plurality of first connection structures that are rotatably coupled to each other; A plurality of second connecting structures rotatably coupled to each other and arranged in rows with the plurality of first connecting structures; And a plurality of light emitting devices disposed between the plurality of first connection structures and the plurality of second connection structures, the plurality of light emitting devices electrically connected to the plurality of first connection structures and the plurality of second connection structures to generate light. Include.

Description

LIGHT EMITTING MODULE AND LIGHT UNIT USING THE SAME}

An embodiment relates to a light emitting module and a light unit using the same.

Light emitting diodes (LEDs) are a type of semiconductor device that converts electrical energy into light. Light emitting diodes have the advantages of low power consumption, semi-permanent life, fast response speed, safety and environmental friendliness compared to conventional light sources such as fluorescent and incandescent lamps. Accordingly, many researches are being conducted to replace existing light sources with light emitting diodes, and the use of light emitting diodes is increasing as a light source for lighting devices such as various lamps, liquid crystal displays, electronic displays, and street lamps that are used indoors and outdoors.

The embodiment provides a light emitting module having a new structure and a light unit using the same.

The embodiment provides a light emitting module and a light unit using the same that are rotatably coupled.

The embodiment provides a light emitting module and a light unit using the same that can be easily replaced and combined.

The light emitting module according to the embodiment includes a plurality of first connection structures that are rotatably coupled to each other; A plurality of second connecting structures rotatably coupled to each other and arranged in rows with the plurality of first connecting structures; And a plurality of light emitting devices disposed between the plurality of first connection structures and the plurality of second connection structures, the plurality of light emitting devices electrically connected to the plurality of first connection structures and the plurality of second connection structures to generate light. Include.

The backlight unit according to the embodiment includes an optical guide member; And a light emitting module for providing light to the optical guide member, wherein the light emitting module is coupled to the plurality of first connection structures rotatably coupled to each other, and is rotatably coupled to each other, and is connected to the plurality of first connection structures. A plurality of second connection structures disposed between the plurality of first connection structures and the plurality of second connection structures, and electrically connected to the plurality of first connection structures and the plurality of second connection structures. It includes a plurality of light emitting elements connected to generate light.

The embodiment can provide a light emitting module having a new structure and a light unit using the same.

The embodiment can provide a light emitting module and a light unit using the same that are rotatably coupled.

The embodiment can provide a light emitting module and a light unit using the same that can be easily replaced and combined.

1 is a perspective view showing a light emitting module according to an embodiment
2 and 3 are top views of the light emitting module according to the embodiment.
4 is a view illustrating a coupling relationship of a connection structure of a light emitting module according to an embodiment;
5 is a diagram illustrating a light emitting module according to another embodiment;
6 is a cross-sectional view of a light emitting device installed in the light emitting module according to the embodiment;
7 is an exploded perspective view of a backlight unit using a light emitting module according to an embodiment;

In the description of the embodiments, it is to be understood that each layer (film), region, pattern or structure is formed "on" or "under" a substrate, each layer The terms " on "and " under " encompass both being formed" directly "or" indirectly " In addition, the criteria for the top or bottom of each layer will be described with reference to the drawings.

In the drawings, the thickness or size of each layer is exaggerated, omitted, or schematically illustrated for convenience and clarity of description. In addition, the size of each component does not necessarily reflect the actual size.

Hereinafter, a light emitting module and a light unit using the same according to an embodiment will be described with reference to the accompanying drawings.

1 is a perspective view illustrating a light emitting module according to an embodiment, FIGS. 2 and 3 are top views of a light emitting module according to an embodiment, and FIG. 4 is a view illustrating a coupling relationship of a connection structure of a light emitting module according to an embodiment. .

1 to 4, a light emitting module according to an embodiment includes a plurality of first connection structures 200A that are rotatably coupled to each other, and a plurality of first connection structures 200A that are rotatably coupled to each other. A plurality of second connection structures 200B arranged in a row, and installed between the plurality of first connection structures 200A and the plurality of second connection structures 200B, and the plurality of first connection structures ( 200A) and a plurality of light emitting devices 100 electrically connected to the plurality of second connection structures 200B to generate light.

The light emitting module according to the embodiment is designed to rotate the plurality of first and second connection structures 200A and 200B. Therefore, not only the plurality of light emitting devices 100 may be installed along a straight line as shown in FIG. 2, but the plurality of light emitting devices 100 may be installed along a curve as shown in FIG. 3. That is, the light emitting module according to the embodiment has little restriction on the installation position, and thus flexible installation is possible.

In addition, in the light emitting module according to the embodiment, the plurality of light emitting devices 100 are installed between the plurality of first and second connection structures 200A and 200B. In this case, a gap between the plurality of light emitting devices 100 is provided. It is designed to adjust the pitch. Accordingly, the light emitting module according to the embodiment may provide light with little variation in luminance by adjusting the distance between the plurality of light emitting devices 100 according to the light distribution area.

In addition, the light emitting module according to the embodiment includes a structure in which a plurality of connection structures 200 are coupled. Since the principle of the coupling of the connection structures 200 is simple, some connection structures 200 or light emitting devices ( If a defect or failure occurs in the 100, there is an advantage that the connection structure 200 or the light emitting device 100 can be easily replaced.

Hereinafter, each component of the light emitting module according to the embodiment will be described in detail.

1 to 4, the plurality of first connection structures 200A and the plurality of first connection structures 200B may be formed in the same shape and arranged in a line with each other, and may be rotatably coupled to each other. It may include a plurality of connection structure (200).

The connection structure 200 includes a body 210 that extends in one direction, a first connection portion 220 formed at one end of the body 210, and another connection structure formed at the other end of the body 210. It may include a second connecting portion 230 coupled to the first connecting portion 220 of the 200.

The body 210 may include, for example, a body made of synthetic resin and a circuit pattern formed inside the body. Alternatively, the body 210 may be formed of a metal material having electrical conductivity, but is not limited thereto.

At least one groove 240 may be formed at a side of the body 210. Any one of the at least one groove 240 may be coupled by inserting the electrodes 31 and 32 of the plurality of light emitting devices 100. Accordingly, the body 210 may be coupled to the plurality of light emitting devices 100. ) Can be electrically connected.

The pitch between the plurality of light emitting devices 100 may vary depending on which of the at least one groove 240 is inserted into the electrodes 31 and 32. Therefore, the pitch between the plurality of light emitting devices 100 may be easily changed according to the use of the light emitting module according to the embodiment.

One end of the body 210 may be formed with the first connection part 220 and the other end with the second connection part 230. The first and second connectors 220 and 230 may be formed in a shape corresponding to each other, and thus, the connection structures 200 adjacent to each other may be rotatably connected to each other by a combination of the first and second connectors 220 and 230. .

For example, as illustrated, the first connection part 220 may include an insertion groove 225, and the second connection part 230 may include a protrusion 235 that is inserted into and coupled to the insertion groove 225. Can be.

At this time, in order for the first connection part 220 and the second connection part 230 to be rotatably coupled to each other, the protrusion 235 and the insertion groove 225 are preferably circular in shape as viewed from the top. It is not limited to.

In addition, the first and second connectors 220 and 230 may be formed to include a material having electrical conductivity, such that the adjacent connection structures 200 and the plurality of light emitting devices 100 may be electrically connected to each other.

For example, the first and second connection parts 220 and 230 may include the protrusion 235 and the insertion groove 225 formed of a metal material, and the peripheral area of the protrusion 235 and the insertion groove 225 may be made of resin. It may be formed of a material. Alternatively, the first and second connection parts 220 and 230 may be formed of a metal material, but are not limited thereto.

5 is a view showing a light emitting module according to another embodiment. The light emitting module of FIG. 5 is the same as the light emitting module of FIG. 1 except for the shape of the electrode of the light emitting device and the position of the groove formed in the connection structure.

Referring to FIG. 5, the light emitting module may include a plurality of first connection structures 200A, a plurality of second connection structures 200B, and a plurality of light emitting devices 100.

Each of the plurality of first and second connection structures 200A and 200B includes a plurality of connection structures 200.

The connection structure 200 includes a body 210 that extends in one direction, a first connection portion 220 formed at one end of the body 210, and another connection structure formed at the other end of the body 210. It may include a second connecting portion 230 coupled to the first connecting portion 220 of the 200.

At least one groove 240a may be formed on an upper surface of the body 210.

A portion of the electrodes 31 and 32 of the plurality of light emitting devices 100 may be inserted into the at least one groove 240a. Accordingly, the plurality of light emitting devices 100 may include the plurality of first, 2 may be electrically connected to the connection structure (200A, 200B).

For example, as illustrated in FIG. 5, protrusions 31a and 32a inserted into the at least one groove 240a may be formed on the bottom surfaces of the electrodes 31 and 32 of the light emitting devices 100. have.

The protrusions 31a and 32a may be formed, for example, in a cylindrical shape for ease of rotation, and the at least one groove 240a may be formed in a cylindrical groove, but is not limited thereto.

6 is a cross-sectional view of the light emitting device 100.

1 and 6, the light emitting device 100 includes a package body 10, a first electrode 31 and a second electrode 32 installed on the package body 10, and the package body. The light emitting chip 20 installed at 10 and electrically connected to the first electrode 31 and the second electrode 32 to generate light, and the molding member 40 to seal the light emitting chip 20. It may include.

The package body 10 may be formed of a resin material such as polyphthalamide (PPA: polyphthalamide), silicon (Si), metal, photo sensitive glass (PSG), sapphire (Al 2 O 3 ), and a printed circuit board (PCB). It may be formed of at least one.

When the package body 10 is formed of a material having electrical conductivity, an insulating film (not shown) is further formed on the surface of the package body 10 so that the package body 10 may be formed of the first and second electrodes 31 and 31. 32) can be prevented from being electrically shorted.

The shape of the upper surface of the package body 10 may have a variety of shapes, for example, rectangular, polygonal, oval.

A cavity 15 may be formed in the package body 10 so that an upper portion thereof is opened. The cavity 15 may be formed in a cup shape, a concave container shape, or the like, and the inner surface of the cavity 15 may be a side perpendicular to the bottom surface or an inclined side surface.

The first electrode 31 and the second electrode 32 may be spaced apart from each other to be electrically separated from each other, and may be installed in the package body 10.

The first electrode 31 and the second electrode 32 may be electrically connected to the light emitting chip 20 to supply power to the light emitting chip 20.

In addition, one end of the first electrode 31 and the second electrode 32 protrudes to the outside of the package body 10, and at least one of the plurality of first and second connection structures 200A and 200B. It may be inserted into the groove 240.

That is, the first electrode 31 is inserted into any one of at least one groove 240 formed in the first connection structure 200A, and the second electrode 32 is inserted into the second connection structure 200B. It may be inserted into any one of the at least one groove 240 formed. Accordingly, the first and second electrodes 31 and 32 may be electrically connected to the plurality of first and second connection structures 200A and 200B to supply power to the light emitting chip 20.

The first and second electrodes 31 and 32 may be formed of a metal material, for example, titanium (Ti), copper (Cu), nickel (Ni), gold (Au), chromium (Cr), tantalum (Ta), It may include at least one of platinum (Pt), tin (Sn), silver (Ag), phosphorus (P).

The light emitting chip 20 may be installed in the cavity 15 of the package body 10.

Each of the light emitting chips 20 may include, for example, at least one light emitting diode (LED), wherein the light emitting diodes are colored light emitting diodes emitting white light such as red, green, and blue, and white. It may include, but is not limited to, at least one of a white light emitting diode emitting light or a UV (ultra violet) light emitting diode emitting ultraviolet light.

As illustrated, the light emitting chip 20 is electrically connected to the first and second electrodes 31 and 32 by a wire bonding method, but the light emitting chip 20 may be a flip chip method or a chip bonding method. It may be electrically connected to the first and second electrodes 31 and 32, but is not limited thereto.

The molding member 40 may be formed in the package body 10 to seal the light emitting chip 20. That is, the molding member 40 may be filled in the cavity 15.

The molding member 40 may be formed of a silicone or resin material having transparency. In addition, the molding member 40 may include a phosphor, and the phosphor may be excited by the first light emitted from the light emitting chip 20 to generate a second light. For example, when the light emitting chip 20 is a blue light emitting diode and the phosphor is a yellow phosphor, the yellow phosphor may be excited by blue light to emit yellow light, and the blue light and yellow light are mixed. Accordingly, the light emitting device 100 may provide white light. However, this is not limitative.

On the other hand, a lens (not shown) is further formed on the molding member 40 to adjust the light distribution of the light emitted from the light emitting device 100. In addition, a Zener diode may be further installed on the package body 10 of the light emitting device 1 to improve the breakdown voltage.

Meanwhile, various light units may be implemented using the light emitting module according to the embodiment. For example, the light emitting module may be used in an illumination light unit for providing light indoors or outdoors, or may be used in a backlight unit serving as a light source of a display device.

7 is an exploded perspective view of a backlight unit using a light emitting module according to an embodiment.

Referring to FIG. 7, the backlight unit includes an optical guide member 3, a light emitting module 1 according to an exemplary embodiment disposed on at least one side of the optical guide member 3, and the optical guide member 3. And a bottom cover 5 that accommodates the light emitting module 1.

The light guide member 3 may be, for example, a light guide panel (LGP), and the light guide plate may be, for example, an acrylic resin-based resin such as PMMA (polymethyl metaacrylate), PET (polyethylene terephthlate), or PC ( polycarbonate), COC and polyethylene naphthalate (PEN) resin.

The light guide member 3 may serve to make a surface light source by diffusing the light provided from the light emitting module 1. In addition, the surface light source generated by the light guide member 3 is provided to a display panel (not shown) to be used to implement an image.

The light emitting module 1 may be disposed on at least one side of the light guide member 3 to provide light to the light guide member 3. Alternatively, the light emitting module 1 may be arranged on the bottom surface of the light guide member 3 in a row, but the embodiment is not limited thereto.

The bottom cover 5 may be formed in a box shape having an upper surface open to accommodate the light guide member 3 and the light emitting module 1, but is not limited thereto. The bottom cover 5 may be formed of a metal material or a resin material.

Features, structures, effects, and the like described in the above embodiments are included in at least one embodiment of the present invention, and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects, and the like illustrated in each embodiment may be combined or modified with respect to other embodiments by those skilled in the art to which the embodiments belong. Therefore, it should be understood that the present invention is not limited to these combinations and modifications.

In addition, the above description has been made with reference to the embodiment, which is merely an example, and is not intended to limit the present invention. Those skilled in the art to which the present invention pertains will be illustrated as above without departing from the essential characteristics of the present embodiment. It will be appreciated that various modifications and applications are possible. For example, each component specifically shown in the embodiment can be modified. And differences relating to such modifications and applications will have to be construed as being included in the scope of the invention defined in the appended claims.

10: package body 20: light emitting chip
31,32 electrode 40 molding member
100 light emitting device 200 connection structure
200A: A plurality of first connection structures 200B: A plurality of second connection structures
210: body 220: first connection portion
230: second connection portion 240: groove

Claims (12)

A plurality of first connection structures rotatably coupled to each other;
A plurality of second connecting structures rotatably coupled to each other and arranged in rows with the plurality of first connecting structures; And
A plurality of light emitting devices disposed between the plurality of first connection structures and the plurality of second connection structures, and electrically connected to the plurality of first connection structures and the plurality of second connection structures to generate light. Light emitting module. The method of claim 1,
Each of the plurality of connection structures,
A body extending in one direction;
A first connection part formed at one end of the body; And
A light emitting module formed at the other end of the body and including a second connection portion coupled to the first connection portion of an adjacent connection structure. The method of claim 2,
The body includes at least one groove,
The light emitting device includes an electrode protruding outward,
The electrode is a light emitting module, a portion of which is inserted into any one of the at least one groove. The method of claim 3, wherein
The at least one groove is a light emitting module formed on the side of the body. The method of claim 3, wherein
The at least one groove is a light emitting module formed on the upper surface of the body. 6. The method of claim 5,
A light emitting module having a protrusion formed on a bottom surface of the electrode of the light emitting device, the protrusion being inserted into the at least one groove. The method of claim 6,
The protrusion has a cylindrical shape, and the at least one groove has a shape corresponding to the shape of the protrusion. The method of claim 2,
The light emitting module of the body, the first connector and the second connector is electrically connected. The method of claim 2,
The first connecting portion includes an insertion groove, and the second connection portion includes a light emitting module including a projection is inserted into the insertion groove. The method of claim 9,
A light emitting module having a circular shape in which the protrusion and the insertion groove are viewed from above. The method of claim 1,
The light emitting device includes a package body, a first electrode and a second electrode installed on the package body, and a light emitting chip installed on the package body and electrically connected to the first electrode and the second electrode to generate light. Light emitting module comprising. Optical guide member; And
It includes a light emitting module for providing light to the optical guide member,
The light emitting module may include a plurality of first connection structures that are rotatably coupled to each other, a plurality of second connection structures that are rotatably coupled to each other, and arranged in a row with the plurality of first connection structures, and the plurality of first connection structures. And a plurality of light emitting devices disposed between the first connecting structure and the plurality of second connecting structures and electrically connected to the plurality of first connecting structures and the plurality of second connecting structures to generate light.




KR1020100027789A 2010-03-29 2010-03-29 Light emitting module and light unit using the same KR101637582B1 (en)

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Application Number Priority Date Filing Date Title
KR1020100027789A KR101637582B1 (en) 2010-03-29 2010-03-29 Light emitting module and light unit using the same

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KR20110108541A true KR20110108541A (en) 2011-10-06
KR101637582B1 KR101637582B1 (en) 2016-07-07

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101974849B1 (en) * 2018-11-20 2019-05-03 유스테크 유한책임회사 Testing Device for Sensing Quality of Camera Image Having Geodesic Dome

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006317801A (en) * 2005-05-13 2006-11-24 Toshiba Transport Eng Inc Image display device and lighting system
KR20080002652A (en) * 2006-06-30 2008-01-04 엘지.필립스 엘시디 주식회사 Light emitting diode array and and backlight unit using the same

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006317801A (en) * 2005-05-13 2006-11-24 Toshiba Transport Eng Inc Image display device and lighting system
KR20080002652A (en) * 2006-06-30 2008-01-04 엘지.필립스 엘시디 주식회사 Light emitting diode array and and backlight unit using the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101974849B1 (en) * 2018-11-20 2019-05-03 유스테크 유한책임회사 Testing Device for Sensing Quality of Camera Image Having Geodesic Dome

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