KR20120072737A - Light emitting device package - Google Patents

Light emitting device package Download PDF

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Publication number
KR20120072737A
KR20120072737A KR1020100134617A KR20100134617A KR20120072737A KR 20120072737 A KR20120072737 A KR 20120072737A KR 1020100134617 A KR1020100134617 A KR 1020100134617A KR 20100134617 A KR20100134617 A KR 20100134617A KR 20120072737 A KR20120072737 A KR 20120072737A
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KR
South Korea
Prior art keywords
light emitting
emitting device
device package
light
height
Prior art date
Application number
KR1020100134617A
Other languages
Korean (ko)
Inventor
성진석
Original Assignee
엘지이노텍 주식회사
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Publication date
Application filed by 엘지이노텍 주식회사 filed Critical 엘지이노텍 주식회사
Priority to KR1020100134617A priority Critical patent/KR20120072737A/en
Publication of KR20120072737A publication Critical patent/KR20120072737A/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)

Abstract

The light emitting device package according to the embodiment includes a body including a cavity, a light source unit mounted in the cavity, and a resin layer formed in the cavity, and the height of the resin layer is lower than the depth of the cavity.

Description

Light Emitting Device Package

An embodiment relates to a light emitting device package.

Currently, semiconductor light emitting devices such as LEDs are applied to various devices including televisions, monitors, notebooks, mobile phones, and other display devices, and in particular, are widely used as backlight units in place of existing CCFLs.

Light Emitting Diode (LED) is a device that converts an electric signal into a light form using the characteristics of a compound semiconductor, and is used for home appliances, remote controllers, electronic displays, indicators, and various automation devices. There is a trend.

In such an LED, it is an important subject to improve the light converging effect and to improve the luminous efficiency.

On the other hand, in the case of LED, when it is combined with the panel in the side view method according to the trend of light weight and slimming, the side mounting is being conducted.

According to the embodiment, the height of the resin layer is formed to be lower than the height of the cavity, thereby increasing the light condensing effect of the light source, thereby improving luminous efficiency, and more reliable when the light emitting device package is mounted on the substrate in a side view. There is provided a light emitting device package that can be mounted.

The light emitting device package according to the embodiment includes a body including a cavity, a light source unit mounted in the cavity, and a resin layer formed in the cavity, and the height of the resin layer is formed to be lower than the depth of the cavity.

The body also includes a wall portion.

In addition, it further includes a reflective layer.

In addition, the inner surface of the wall portion includes an inclined surface.

It also contains a phosphor.

In addition, it further comprises a photo-excited film.

The light emitting device package according to the embodiment has the effect of increasing the light collecting effect of the light emitting device package to improve the luminous efficiency, productivity and economics. In addition, when the light emitting device package is side mounted on the substrate in a side view method, the contact area is enlarged to enable stable mounting or soldering.

1A is a perspective view illustrating a light emitting device package according to an embodiment;
1B is a sectional view showing a cross section of a light emitting device package according to the embodiment;
1C is a cross-sectional view illustrating a cross section of a light emitting device package according to an embodiment;
1D is a perspective view illustrating a light emitting device package according to the embodiment;
2 is a cross-sectional view showing a cross section of a light emitting device package according to the embodiment;
3A is a cross-sectional view showing a cross section of a light emitting device package according to the embodiment;
3B is a sectional view showing a cross section of a light emitting device package according to the embodiment;
3C is a sectional view showing a cross section of a light emitting device package according to the embodiment;
4A is a perspective view illustrating an illumination system including a light emitting device package according to an embodiment;
4b is a sectional view taken along the line AA ′ of the illumination system of FIG. 4a;
5 is an exploded perspective view of a liquid crystal display device including a light emitting device package according to an embodiment; and
6 is an exploded perspective view of a liquid crystal display including a light emitting device package according to the embodiment.

In the drawings, the thickness or size of each component is exaggerated, omitted, or schematically illustrated for convenience and clarity of description. In addition, the size and area of each component does not necessarily reflect the actual size or area.

1A and 1D are perspective views illustrating a light emitting device package according to an embodiment, and FIGS. 1B, 1C, and 1E are cross-sectional views illustrating a light emitting device package according to an embodiment.

Hereinafter, in order to describe the shape of the light emitting device package 100 according to the embodiment in more detail, the longitudinal direction (Z) of the light emitting device package 100, the horizontal direction (Y) perpendicular to the longitudinal direction (Z), And it will be described in the height direction (X) perpendicular to the longitudinal direction (Z) and the horizontal direction (Y).

That is, FIG. 1B is a cross-sectional view of the light emitting device package 100 of FIG. 1A cut in the longitudinal direction (Z) and the height direction (X) and viewed in the horizontal direction (Y), and FIG. 1E is the light emitting device package of FIG. 1D. It is sectional drawing which cut | disconnected 100 to the surface of the horizontal direction Y and the height direction X, and viewed it in the longitudinal direction Z. As shown to FIG.

1A to 1E, the light emitting device package 100 according to the embodiment may be formed in the body 110 including the cavity 130, the light source 120 mounted on the body 110, and the cavity 130. It may include the strata 140.

The body 110 is made of a resin material such as polyphthalamide (PPA), silicon (Si), aluminum (Al), aluminum nitride (AlN), photosensitive glass (PSG), polyamide 9T (PA9T) ), Shin Geotactic Polystyrene (SPS), Metal, Sapphire (Al 2 O 3 ), Beryllium Oxide (BeO), Printed Circuit Board (PCB) , Ceramic Board It may be formed of at least one of. The body 110 may be formed by injection molding, etching, or the like, but is not limited thereto.

The body 110 may include a cavity 130.

The cavity 130 may be formed by recessing at least one region of the body 110, but is not limited thereto.

The light source unit 120 may be mounted on the bottom surface of the cavity 130. For example, the light source unit 120 may be a light emitting diode. The light emitting diode may be, for example, a light emitting diode emitting light or ultraviolet rays such as red, green, blue, and white, but is not limited thereto. In addition, one or more light emitting diodes may be mounted.

Meanwhile, as the cavity 130 is formed in the body 110, the body 110 may include a wall 115 forming a side surface of the cavity 130.

The light emitting diode is applicable to both a horizontal type in which the electrical terminals are formed on the upper surface, or to a vertical type or flip chip formed on the upper and lower surfaces.

Although not shown in the drawings, the body 110 may include an electrode (not shown). The electrode (not shown) may be electrically connected to the light source unit 120 to supply power to the light source unit 120.

Electrode (not shown) is a metal material, for example, titanium (Ti), copper (Cu), nickel (Ni), gold (Au), chromium (Cr), tantalum (Ta), platinum (Pt), tin (Sn), silver (Ag), phosphorus (P), aluminum (Al), indium (In), palladium (Pd), cobalt (Co), silicon (Si), germanium (Ge), hafnium (Hf), ruthenium (Ru) and iron (Fe) may include one or more materials or alloys. In addition, the electrode (not shown) may be formed to have a single layer or a multilayer structure, but is not limited thereto.

The resin layer 140 may be formed in the cavity 130 and may include fused silica.

The resin layer 140 may be formed of transparent silicone, epoxy, and other resin materials.

In addition, the resin layer 140 may include a phosphor. The phosphor may be selected according to the wavelength of the light emitted from the light source unit 120 so that the light emitting device package 100 may implement light having an arbitrary color.

The phosphor included in the resin layer 140 may be a blue light emitting phosphor, a cyan light emitting phosphor, a green light emitting phosphor, a yellow green light emitting phosphor, a yellow light emitting phosphor, a yellow red light emitting phosphor, or an orange light emitting phosphor according to a wavelength of light emitted from the light source unit 120. One of, and a red light emitting phosphor can be applied.

That is, the phosphor may be excited by the light having the first light emitted from the light source unit 120 to generate the second light. For example, when the light source unit 120 is a blue light emitting diode and the phosphor is a yellow phosphor, the yellow phosphor may be excited by blue light to emit yellow light, and may be excited by blue light and blue light generated from the blue light emitting diode. As the generated yellow light is mixed, the light emitting device package 100 may provide white light. In addition, the light emitting device package 100 may provide blue light, red light, etc. in addition to white light, but is not limited thereto.

Similarly, when the light source unit 120 is a green light emitting diode, a magenta phosphor or a blue and red phosphor is mixed. When the light source unit 120 is a red light emitting diode, a cyan phosphor or a blue and green phosphor is used. For example.

Such phosphor may be a known phosphor such as YAG, TAG, sulfide, silicate, aluminate, nitride, carbide, nitridosilicate, borate, fluoride or phosphate.

The material of the wall portion 115 may be the same material as the material of the body 110, but is not limited thereto. The wall 115 may be formed by injection molding the body 100 in which the cavity 130 is formed, or by etching or pressing the body 100, but is not limited thereto.

The height of the resin layer 140 may be lower than the depth of at least one region of the cavity 130. Therefore, at least one region of the side surface of the body 110 may be formed higher than the height of the resin layer 140.

Since the height of at least one region of the side of the body 110 is higher than the height of the resin layer 140, the light emitted from the light source 120 may be further concentrated by the body 110. Therefore, the light converging effect of the light emitting device package 100 may be increased, thereby improving light emission efficiency.

On the other hand, when the body 110 includes the wall 115, the height of the entire region of the resin layer 140 may be formed lower than the height of at least one region of the wall 115. Therefore, at least one region of the wall 115 may be formed higher than the height of the resin layer 140. In the drawing, the regions forming both sides of the wall portion 115 are formed higher than the height of the resin layer 140, but at least one region of the wall portion 115 may be formed higher than the height of the resin layer 140. However, the present invention is not limited as shown in FIGS. 1A to 1E. In addition, as shown in FIGS. 1A and 1E, the height h1 of the wall portion 115 may have different values h1 and h1 ′ according to each region, and the shape of the wall portion 115 may be in the horizontal direction (Y). ), Or symmetric in the longitudinal direction Z, or asymmetric in at least one direction as shown in FIGS. 1D and 1E, but is not limited thereto. In addition, when the wall 115 is viewed from above, the shape of the outer circumference and the inner circumference of the wall 115 may be rectangular, polygonal, circular, or the like, and is not limited as shown in each drawing.

Meanwhile, the resin layer 140 may be partially formed in the cavity 130 to form a wall portion formed higher than the resin layer 140, or as shown in FIG. 1C, the resin layer may be formed on the entirety of the cavity 130. The wall portion 115 formed higher than the resin layer 140 may be formed by combining the member 118 forming the 140 and additionally forming the wall portion 115 higher, but is not limited thereto.

Since the height of at least one region of the wall portion 115 is higher than the height of the resin layer 140, the light emitted from the light source portion 120 may be further concentrated by the wall portion 115. Therefore, the light converging effect of the light emitting device package 100 may be increased, thereby improving light emission efficiency.

Meanwhile, in the case of the side view light emitting device package 100 in which the wall 115 contacts the substrate (not shown), the wall 115 and the substrate (not shown) are formed by the wall 115 formed to be high. The contact area of can be enlarged.

For example, when the wall 115 is attached to a substrate (not shown) through soldering or adhesion by a conductive adhesive material, this increase in contact area may enable reliable attachment. Therefore, the reliability, stability and economy of the light emitting device package 100 may be improved. In addition, by forming a wall portion opposed to the wall portion forming the attachment surface at the same time, reliable attachment of the light emitting device package and increase in the light collecting effect can be achieved together.

On the other hand, preferably the height (h1, h1 ') of the wall portion 115 may be formed within the range of 110% to 200% of the height (h2) of the resin layer 140. If the height h1, h1 ′ of the wall 115 is less than 110% of the height h2 of the resin layer 140, the improvement of the light condensing effect by the wall 115 may not be guaranteed, and the side view may be improved. In the case of the light emitting device package 100, reliability improvement of mounting on a substrate (not shown) of the light emitting device package 100 may not be guaranteed. On the other hand, if the height h1, h1 ′ of the wall 115 is greater than 200% of the height h2 of the resin layer 140, the size of the light emitting device package 100 is increased, so that the economic efficiency of the light emitting device package 100 is increased. Can be degraded.

Preferably, an inclined surface may be formed in at least one region of the inner surface of the wall portion 115. The angle of reflection of the light emitted from the light source unit 120 may vary according to the angle of the inclined surface, thereby adjusting the directivity of the light emitted to the outside. As the directivity of the light decreases, the concentration of light emitted from the light source 120 to the outside increases. On the contrary, the greater the directivity of the light, the less the concentration of light emitted from the light source 120 to the outside. Preferably, the wall portion 115 may be formed to be inclined so that the cross-sectional area of the cavity 130 gradually increases in the upward direction.

On the other hand, the shape viewed from above the cavity 130 formed in the body 110 may be a shape of a circle, a square, a polygon, an oval, and the like, in particular, may be a curved shape of the corner, but is not limited thereto. In addition, the shape of the cavity 130 may be symmetrical or asymmetrical depending on the cross section depending on the height of the wall 115 or the shape of the wall 115, but is not limited thereto.

2 is a cross-sectional view showing a cross section of a light emitting device package according to the embodiment.

Referring to FIG. 2, the light emitting device package 200 according to the embodiment has a cavity 230, a body 210 including a wall portion 215, a light source unit 220 mounted on the body 210, and a cavity ( The resin layer 240 formed on the 230 may be included. In addition, the height of at least one region of the wall portion 215 may be higher than the height of the resin layer 240. In addition, the light emitting device package 200 may include a reflective layer 250. The reflective layer 250 may be formed on the inner side of the wall portion 215. The reflective layer 250 may be formed of a metal or an alloy including at least one of highly reflective silver (Ag), aluminum (Al), platinum (Pt), palladium (Pd), or copper (Cu), or high light It may be formed of a plate having a reflectance, or a resin having a light reflecting ability may be applied to an inner surface of the wall portion 215, but is not limited thereto.

Since the reflective layer 250 is formed on the inner side of the wall 215, the light loss may be reduced by reflecting the light generated from the light source 220, and the luminous efficiency of the light emitting device package 200 may be improved.

Although not shown, an adhesive layer (not shown) may be formed between the reflective layer 250 and the wall portion 215 to enhance the interfacial bonding force between the two layers, but is not limited thereto.

3A to 3C are cross-sectional views illustrating a cross section of a light emitting device package according to an embodiment.

3A to 3C, the light emitting device package 300 according to the embodiment includes a body 310 including a cavity 330 and a wall portion 315, a light source unit 320 mounted on the body 310, and It may include a resin layer 340 formed in the cavity 330. In addition, the height of at least one region of the wall portion 315 may be higher than the height of the resin layer 340. In addition, the light emitting device package 300 may include an optical excitation film 360. The light excitation film 360 may be attached to an upper surface of the wall 315 to cover the cavity 330, but is not limited thereto. The light excitation film 360 may include a phosphor selected according to a wavelength of light emitted from the light source unit 320, and the light emitting device package 300 may implement light having white light, blue light, green light, and any color. It is not limited to this.

The photoexcited film 360 may be formed of a matrix resin layer, and the matrix resin layer may be formed of polyethylene terephthalate (PET), polycarbonate (PC), and poly (polyethylene terephthalate) having excellent light transmittance and heat resistance. It may be formed of a thermosetting resin such as methyl methacrylate (PMMA) and silicone resin. The photoexcited film 360 may be manufactured by uniformly dispersing the particles of the phosphor in such a resin and then performing UV curing or thermosetting.

The matrix layer of the resin layer may further include a curing agent, a dispersing agent, etc., the curing agent is used to cure the liquid thermosetting resin, the dispersing agent is a liquid thermosetting of particles such as titanium dioxide (TiO 2 ) It can be used to evenly disperse the resin.

When the light emitting device package 300 includes the photoexcited film 360, the resin layer 340 may not include a phosphor, or the resin layer 340 and the photoexcited film 360 have different kinds of phosphors. It may also include. Therefore, the light emitting efficiency of the light emitting device package 300 may be improved, and various types of light emission may be possible. On the other hand, the phosphor may be coated on the periphery of the light source 320 (Conformal Coating) and the cavity may be filled with the resin layer, but is not limited thereto.

3B and 3C, the photoexcited film 360 may be formed to be attached to the side of the wall 315, or the photoexcited film 360 when the wall 315 is asymmetrically formed. At least one region of may be attached to the upper portion of the wall portion 315 and the other at least one region may be formed to be attached to the side of the wall portion 315, but is not limited thereto. On the other hand, when the light excitation film 360 is attached to the side of the wall portion 315, a step 317 is formed in at least one region of the side of the wall portion 315 to more reliably attach the light excitation film 360. It is possible to, but not limited to.

Figure 4a is a perspective view showing a lighting system including a light emitting device package according to an embodiment, Figure 4b is a cross-sectional view showing a cross-section A 'A of the lighting system of Figure 4a.

Hereinafter, in order to describe the shape of the lighting system 600 according to the embodiment in more detail, the longitudinal direction (Z) of the illumination system 600, the horizontal direction (Y) perpendicular to the longitudinal direction (Z), and the length The height direction X perpendicular to the direction Z and the horizontal direction Y will be described.

That is, FIG. 4B is a cross-sectional view of the illumination system 600 of FIG. 4A cut in the plane of the longitudinal direction Z and the height direction X, and viewed in the horizontal direction Y. As shown in FIG.

4A and 4B, the lighting system 600 may include a body 610, a cover 630 fastened to the body 610, and a closing cap 650 positioned at both ends of the body 610. have.

The lower surface of the body 610 is fastened to the light emitting device module 640, the body 610 is conductive so that heat generated in the light emitting device package 644 can be discharged to the outside through the upper surface of the body 610 And it may be formed of a metal material having an excellent heat dissipation effect.

The light emitting device package 644 may be mounted on the PCB substrate 642 in a multi-colored, multi-row array to form an array. The light emitting device package 644 may be mounted at the same interval or may be mounted at various separation distances as necessary to adjust brightness. have. The PCB substrate 642 may be a metal core PCB (MCPCB) or a PCB made of FR4.

In particular, the light emitting device package 644 may have a height of a body (not shown) higher than a height of a resin layer (not shown), thereby improving luminous efficiency, and further, a contact area when the side is mounted on the PCB 642. Since it can be enlarged, the reliability and economical efficiency of the light emitting device package 644 and the light emitting device module 640 can be improved.

The cover 630 may be formed in a circular shape to surround the lower surface of the body 610, but is not limited thereto.

The cover 630 protects the light emitting device module 640 from the outside and the like. In addition, the cover 630 may include diffusing particles to prevent the glare of the light generated from the light emitting device package 644 and to uniformly emit light to the outside, and at least of the inner and outer surfaces of the cover 630 A prism pattern or the like may be formed on either side. In addition, a phosphor may be applied to at least one of an inner surface and an outer surface of the cover 630.

On the other hand, since the light generated from the light emitting device package 644 is emitted to the outside through the cover 630, the cover 630 should have excellent light transmittance, and has sufficient heat resistance to withstand the heat generated by the light emitting device package 644. The cover 630 is preferably formed of a material including polyethylene terephthalate (PET), polycarbonate (PC), polymethyl methacrylate (PMMA), or the like. .

Closing cap 650 is located at both ends of the body 610 may be used for sealing the power supply (not shown). In addition, the closing cap 650, the power pin 652 is formed, the lighting system 600 according to the embodiment can be used immediately without a separate device to the terminal from the existing fluorescent lamps.

Meanwhile, the lighting system 600 including the light emitting device package 644 according to the embodiment may include a backlight unit, a lighting device, and the like, and the lighting system 600 and the lighting system 600 shown in each drawing are shown. It is not limited to.

5 is an exploded perspective view of a liquid crystal display device including a light emitting device package according to an embodiment.

5 is an edge-light method, and the liquid crystal display 700 may include a liquid crystal display panel 710 and a backlight unit 770 for providing light to the liquid crystal display panel 710.

The liquid crystal display panel 710 may display an image using light provided from the backlight unit 770. The liquid crystal display panel 710 may include a color filter substrate 712 and a thin film transistor substrate 714 facing each other with the liquid crystal interposed therebetween.

The color filter substrate 712 may implement a color of an image displayed through the liquid crystal display panel 710.

The thin film transistor substrate 714 is electrically connected to the printed circuit board 718 on which a plurality of circuit components are mounted through the driving film 717. The thin film transistor substrate 714 may apply a driving voltage provided from the printed circuit board 718 to the liquid crystal in response to a driving signal provided from the printed circuit board 718.

The thin film transistor substrate 714 may include a thin film transistor and a pixel electrode formed of a thin film on another substrate of a transparent material such as glass or plastic.

The backlight unit 770 changes the light provided from the light emitting device module 720, the light emitting device module 720 into a surface light source, and provides the light guide plate 730 and the light guide plate to the liquid crystal display panel 710. Reflective sheet for reflecting the light emitted to the light guide plate 730 to the plurality of films 750, 766, 764 and the light guide plate 730 to uniform the luminance distribution of the light provided from the 730 and improve the vertical incidence ( 740.

The light emitting device module 720 may include a PCB substrate 722 such that a plurality of light emitting device packages 724 and a plurality of light emitting device packages 724 are mounted to form an array.

In particular, the light emitting device package 724 has a height of a body (not shown) is formed higher than the height of a resin layer (not shown) can improve the luminous efficiency, and also the contact area during side mounting on the PCB substrate 722 Since it can be enlarged, the reliability and economical efficiency of the light emitting device package 724 and the light emitting device module 720 can be improved.

Meanwhile, the backlight unit 770 includes a diffusion film 766 for diffusing light incident from the light guide plate 730 toward the liquid crystal display panel 710, and a prism film 750 for condensing the diffused light to improve vertical incidence. It may be configured as), and may include a protective film 764 for protecting the prism film 750.

6 is an exploded perspective view of a liquid crystal display including a light emitting device package according to the embodiment. However, the parts shown and described in Fig. 5 are not repeatedly described in detail.

6 illustrates a direct method, the liquid crystal display 800 may include a liquid crystal display panel 810 and a backlight unit 870 for providing light to the liquid crystal display panel 810.

Since the liquid crystal display panel 810 is the same as that described with reference to FIG. 5, a detailed description thereof will be omitted.

The backlight unit 870 includes a plurality of light emitting device modules 823, a reflective sheet 824, a lower chassis 830 in which the light emitting device modules 823 and the reflective sheet 824 are accommodated, and an upper portion of the light emitting device module 823. It may include a diffusion plate 840 and a plurality of optical film 860 disposed in the.

The light emitting device module 823 may include a plurality of light emitting device packages 822, and a plurality of light emitting device packages 822, and a PCB substrate 821 to form an array.

In particular, the light emitting device package 822 has a height of a body (not shown) is higher than a height of a resin layer (not shown), thereby improving luminous efficiency, and also has a contact area during side mounting on the PCB substrate 821. Since it can be enlarged, the reliability and economical efficiency of the light emitting device package 822 and the light emitting device module 820 can be improved.

The reflective sheet 824 reflects the light generated from the light emitting device package 822 in the direction in which the liquid crystal display panel 810 is located to improve light utilization efficiency.

On the other hand, the light generated from the light emitting device module 823 is incident on the diffusion plate 840, the optical film 860 is disposed on the diffusion plate 840. The optical film 860 includes a diffusion film 866, a prism film 850, and a protective film 864.

In addition, the above description has been made with reference to the embodiment, which is merely an example, and is not intended to limit the present invention. Those skilled in the art to which the present invention pertains will be illustrated as above without departing from the essential characteristics of the present embodiment. It will be appreciated that various modifications and applications are possible. For example, each component specifically shown in the embodiment can be modified. And differences relating to such modifications and applications will have to be construed as being included in the scope of the invention defined in the appended claims.

100: light emitting device package 110: the body
115: wall portion 120: light source portion
130: cavity 140: resin layer
250: reflective layer 360: optical excitation film

Claims (16)

A body including a cavity;
A light source unit mounted in the cavity; And
It includes; the resin layer formed in the cavity,
The height of the resin layer is a light emitting device package is formed lower than the depth of the cavity. The method of claim 1,
The body further comprises a wall portion forming a side of the cavity,
And a height of at least one region of the wall portion is higher than a height of the entire region of the resin layer. The method of claim 2,
The wall portion includes at least one region having a different height light emitting device package. The method of claim 2,
The wall portion is a light emitting device package formed to have a height forming an asymmetry in at least one of the horizontal direction, the longitudinal direction. The method of claim 2,
The light source unit is a light emitting device package. The method of claim 2,
The resin layer is a light emitting device package comprising a phosphor. The method of claim 2,
Further comprising a reflective layer,
The reflective layer is a light emitting device package formed on at least one region of the inner surface of the wall portion. The method of claim 2,
The wall portion light emitting device package including at least one inclined surface. The method of claim 2,
The height of the wall portion is a light emitting device package 110% to 200% of the height of the resin layer. The method of claim 2,
A light emitting device package further comprising a photoexcited film. The method of claim 10,
The optical excitation film is a light emitting device package formed on the upper portion of the wall. The method of claim 10,
At least one region of the photoexcited film is attached to at least one region of the side portion of the wall. The method of claim 12,
The wall portion includes a step formed in at least one region of the inner surface,
At least one region of the optical excitation film is a light emitting device package attached to the step. The method of claim 10,
The optical excitation film is a light emitting device package comprising at least one of a curing agent and a dispersant. The method of claim 10,
The optical excitation film is a light emitting device package comprising a phosphor. An illumination system comprising the light emitting device package of claim 1.
KR1020100134617A 2010-12-24 2010-12-24 Light emitting device package KR20120072737A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170086299A (en) * 2016-01-18 2017-07-26 엘지이노텍 주식회사 Light emitting package, backlight unit and lighting device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170086299A (en) * 2016-01-18 2017-07-26 엘지이노텍 주식회사 Light emitting package, backlight unit and lighting device

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