KR101894933B1

KR101894933B1 - Light Emitting Device Package

Info

Publication number: KR101894933B1
Application number: KR1020110115344A
Authority: KR
Inventors: 안상현
Original assignee: 엘지이노텍 주식회사
Priority date: 2011-11-07
Filing date: 2011-11-07
Publication date: 2018-09-04
Also published as: KR20130050147A

Abstract

A light emitting device package according to an embodiment of the present invention includes a body having a cavity formed therein, first and second lead frames mounted on the body and having at least one region including an exposed region extending to the outside of the body, And a light emitting device electrically connected to the first and second lead frames, wherein the hole includes a first region overlapping with the body in the vertical direction, and a second region extending outward from the body.

Description

[0001] Light Emitting Device Package [0002]

An embodiment relates to a light emitting device package.

Light Emitting Diode (LED) is a device that converts electrical signals into light by using the characteristics of compound semiconductors. It is widely used in household appliances, remote control, electric signboard, display, and various automation devices. There is a trend.

On the other hand, when the light emitting device package is mounted on a predetermined substrate, it is necessary to secure the reliability of the connection between the light emitting device package and the substrate.

10-2000-0072321 (hereinafter referred to as Prior Art 1) discloses a light emitting device package including a lead frame having a solder attaching groove formed therein. However, the solder may be difficult to be filled in the groove, and it may be difficult to ensure the reliability improvement effect of the mounting of the light emitting device package.

An embodiment provides a light emitting device package in which a hole is formed in at least one region of a lead frame.

A light emitting device package according to an embodiment includes a lead frame having at least one hole formed therein. At least one region of the hole overlaps the body in a vertical direction, and at least one region is exposed to the outside of the body, And the mounting of the light emitting device package can be reliably formed.

1 is a perspective view illustrating a light emitting device package according to an embodiment;
2 is a cross-sectional view illustrating a light emitting device package according to an embodiment,
FIG. 3 is a partial perspective view showing the area A shown in FIG. 1,
4 is a partial perspective view showing an area A according to another embodiment,
5 is a cross-sectional view illustrating a light emitting device package according to another embodiment,
6A is a perspective view illustrating a lighting apparatus including a light emitting device package according to an embodiment,
6B is a cross-sectional view illustrating a lighting device including a light emitting device package according to an embodiment,
7 is an exploded perspective view illustrating a liquid crystal display device including a light emitting device package according to an embodiment, and FIG.
8 is an exploded perspective view illustrating a liquid crystal display device including a light emitting device package according to an embodiment.

BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention, and the manner of achieving them, will be apparent from and elucidated with reference to the embodiments described hereinafter in conjunction with the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. To fully disclose the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims. Like reference numerals refer to like elements throughout the specification.

The terms spatially relative, "below", "beneath", "lower", "above", "upper" May be used to readily describe a device or a relationship of components to other devices or components. Spatially relative terms should be understood to include, in addition to the orientation shown in the drawings, terms that include different orientations of the device during use or operation. For example, when inverting an element shown in the figures, an element described as "below" or "beneath" of another element may be placed "above" another element. Thus, the exemplary term "below" can include both downward and upward directions. The elements can also be oriented in different directions, so that spatially relative terms can be interpreted according to orientation.

The terminology used herein is for the purpose of illustrating embodiments and is not intended to be limiting of the present invention. In the present specification, the singular form includes plural forms unless otherwise specified in the specification. It is noted that the terms "comprises" and / or "comprising" used in the specification are intended to be inclusive in a manner similar to the components, steps, operations, and / Or additions.

Unless defined otherwise, all terms (including technical and scientific terms) used herein may be used in a sense commonly understood by one of ordinary skill in the art to which this invention belongs. Also, commonly used predefined terms are not ideally or excessively interpreted unless explicitly defined otherwise.

The thickness and size of each layer in the drawings are exaggerated, omitted, or schematically shown for convenience and clarity of explanation. Also, the size and area of each component do not entirely reflect actual size or area.

Further, the angle and direction mentioned in the description of the structure of the light emitting device in the embodiment are based on those shown in the drawings. In the description of the structure of the light emitting device in the specification, reference points and positional relationship with respect to angles are not explicitly referred to, refer to the related drawings.

Hereinafter, embodiments will be described in detail with reference to the drawings.

FIG. 1 is a perspective view showing a light emitting device package according to an embodiment, FIG. 2 is a cross-sectional view illustrating a light emitting device package according to an embodiment, and FIG. 3 is a partial perspective view showing an area A shown in FIG.

In order to describe the shape of the light emitting device package 100 according to the embodiment in detail, the longitudinal direction Z of the light emitting device package 100, the horizontal direction Y perpendicular to the longitudinal direction Z, And a height direction X perpendicular to the longitudinal direction Z and the horizontal direction Y. [

1 to 3, a light emitting device package 100 according to an embodiment includes a body 110 having a cavity 120 formed therein, a first substrate 110 having a hole 170 formed in at least one region thereof, And the light emitting element 130 electrically connected to the first and second lead frames 140 and 150 and the hole 170 is formed in a direction perpendicular to the body 110 And a second region 174 that is exposed to the outside of the body 110. The first region 172 is formed to overlap with the first region 172,

The body 110 may be made of a resin material such as polyphthalamide (PPA), silicon (Si), aluminum (Al), aluminum nitride (AlN), liquid crystal polymer (PSG), polyamide 9T (SPS), a metal material, sapphire (Al ₂ O ₃ ), beryllium oxide (BeO), and a printed circuit board (PCB). The body 110 may be formed by injection molding, etching, or the like, but is not limited thereto.

In addition, the body 110 may include a predetermined photocatalyst. For example, the photocatalyst may form the light generated in the light source unit 130 as white light, and may be a predetermined pigment such as TiO ₂ .

A cavity 120 may be formed on the body 110, and an inner surface of the cavity 120 may be formed with an inclined surface. The reflection angle of the light emitted from the light emitting device 130 can be changed according to the angle of the inclined surface, and thus the directivity angle of the light emitted to the outside can be controlled.

Concentration of light emitted to the outside from the light emitting device 130 increases as the directional angle of light decreases. Conversely, as the directional angle of light increases, the concentration of light emitted from the light emitting device 130 to the outside decreases.

The shape of the cavity 120 formed in the body 110 may be circular, square, polygonal, elliptical, or the like, and may have a curved shape, but the present invention is not limited thereto.

The light emitting device 130 is electrically connected to the first and second lead frames 140 and 150. The light emitting device 130 may be a light emitting diode.

The light emitting diode may be, for example, a colored light emitting diode that emits light such as red, green, blue, or white, or a UV (Ultra Violet) light emitting diode that emits ultraviolet light. In addition, one or more light emitting diodes may be mounted.

In addition, the light emitting diode is applicable to both a horizontal type in which all the electric terminals are formed on the upper surface, a vertical type formed in the upper and lower surfaces, or a flip chip .

The resin layer 160 may be filled in the cavity 120 so as to cover the light emitting device 130.

The resin layer 160 may be formed of silicon, epoxy, or other resin material. The resin layer 160 may be filled with a predetermined resin in the cavity 120, and then may be formed by UV or thermal curing.

The resin layer 160 may include a phosphor (not shown), and a phosphor (not shown) may be selected to a wavelength of light emitted from the light emitting device 130 so that the light emitting device package 100 realizes white light can do.

These phosphors (not shown) may emit red, green, and blue phosphors depending on the wavelength of light emitted from the light emitting device 130, such as a blue light emitting phosphor, a blue light emitting phosphor, a green light emitting phosphor, a yellow green light emitting phosphor, a yellow light emitting phosphor, One of the luminescent phosphors can be applied.

That is, the phosphor (not shown) may be excited by the light having the first light emitted from the light emitting device 130 to generate the second light. For example, when the light emitting element 130 is a blue light emitting diode and the phosphor is a yellow phosphor, the yellow phosphor may be excited by blue light to emit yellow light, and blue light and blue light emitted from the blue light emitting diode As the excited yellow light is excited, the light emitting device package 100 can provide white light.

Similarly, when the light emitting device 130 is a green light emitting diode, a magenta fluorescent substance or a mixture of blue and red fluorescent materials is used. When the light emitting device 130 is a red light emitting diode, a cyan fluorescent material or a mixture of blue and green fluorescent materials For example.

Such a fluorescent material (not shown) may be a known fluorescent material such as YAG, TAG, sulfide, silicate, aluminate, nitride, carbide, nitridosilicate, borate, fluoride or phosphate .

The first and second lead frames 140 and 150 may be formed of a metal material such as titanium, copper, nickel, gold, chromium, tantalum, (Pt), tin (Sn), silver (Ag), phosphorus (P), aluminum (Al), indium (In), palladium (Pd), cobalt (Co), silicon (Si), germanium , Hafnium (Hf), ruthenium (Ru), and iron (Fe). Also, the first and second lead frames 140 and 150 may have a single-layer structure or a multi-layer structure, but the present invention is not limited thereto.

The first and second lead frames 140 and 150 are separated from each other and electrically separated from each other. The light emitting device 130 is mounted on the first lead frame 140 and the first lead frame 140 can be electrically connected to the light emitting device 130 directly or through a conductive material . Also, the second lead frame 150 may be electrically connected to the light emitting device 130 by the wire 134, but is not limited thereto. Accordingly, when power is supplied to the first and second lead frames 140 and 150, power may be applied to the light emitting device 130. Meanwhile, a plurality of lead frames (not shown) may be mounted in the body 110 and each lead frame (not shown) may be electrically connected to the light emitting device (not shown).

Meanwhile, the first and second lead frames 140 and 150 may include an exposed region in which at least one region in the longitudinal direction extends outside the body.

Meanwhile, according to the embodiment, the first and second lead frames 140 and 150 may include the holes 170 in at least one region.

The hole 170 may be formed in at least one region of at least one of the first and second lead frames 140 and 150.

For example, the hole 170 may be formed by removing at least one region of the first and second lead frames 140 and 150, but is not limited thereto. On the other hand, the shape of the hole 170 may be a circle, a shape having a curvature, or an arbitrary polygonal shape in addition to a quadrangle, but is not limited thereto. In addition, the number of holes may be plural, but is not limited thereto.

Meanwhile, the hole 170 may include first and second regions 172 and 174.

The first region 172 may be formed to overlap with the body 110 in the vertical direction. That is, at least one region of the hole 170 may be filled with the material forming the body 110.

A hole 170 is formed in at least one region of at least one of the first and second lead frames 140 and 150. The hole 170 includes a first region 172 and a first region 172 May be filled with the material forming the body 110 so that the contact area between the body 110 and the first and second lead frames 140 and 150 may increase. Therefore, the coupling between the first and second lead frames 140 and 150 and the body 110 can be more reliably formed.

Also, the second region 172 may be exposed to the outside of the body 110. That is, at least one region of the hole 170 may be formed outside the body 110 and exposed.

At least one region of the hole 170 is exposed to the outside of the body 110 so that the solder and the first and second lead frames (not shown) are soldered during the soldering process for mounting the light emitting device package 100 on the substrate 140 and 150 may be increased.

That is, for example, when the light emitting device package 110 is soldered onto a substrate (not shown), the melted soldering members may be filled in the holes 170 formed in the first and second lead frames 140 and 150, Therefore, the contact area between the soldering member and the first and second lead frames 140 and 150 can be increased.

Therefore, the coupling between the soldering member and the first and second lead frames 140 and 150 can be formed more reliably. In addition, the connection between the light emitting device package 100 and the substrate (not shown) can be more reliably formed.

On the other hand, since the soldering member can be easily filled in the hole 170, the reliability improvement effect of the light emitting device package 100 can be more easily ensured.

On the other hand, if the second region 174 is too large, it may be difficult for the light emitting device package 100 to be mounted on the substrate (not shown) densely. If the second region 174 is too small, 100 can be reduced. Accordingly, the length L1 in the longitudinal direction of the second region 174 may be 0.1 mm to 0.2 mm, and the length L2 in the horizontal direction of the second region 174 may be 0.8 mm to 1 mm.

The ratio of the longitudinal length L1 of the second region 174 to the longitudinal length M1 of the exposed regions of the first and second lead frames 140 and 150 may be 1: 2 to 3. The ratio of the horizontal length L2 of the second area 174 to the horizontal length M2 of the exposed areas of the first and second lead frames 140 and 150 may be 0.8: 1 to 1.5.

4 is a partial perspective view illustrating region A according to another embodiment. Referring to FIG. 4, the light emitting device package of the embodiment differs from the embodiment of FIG. 1 in that two holes 170 are formed.

Here, although two holes 170 are shown as being formed, a plurality of holes 170 may be formed to enlarge the contact area between the solder and the lead frame 140. [ Therefore, the lifetime of the light emitting device package can be extended and the reliability can be improved.

5 is a cross-sectional view illustrating a light emitting device package according to another embodiment.

Referring to FIG. 5, the light emitting device package 200 of the embodiment differs from the embodiment of FIG. 1 in that the lead frame 240 further includes a horizontal hole 280.

Here, the horizontal holes 280 may be formed horizontally in the longitudinal direction. The shape of the horizontal hole 280 may have various shapes such as, for example, a circle, a square, and a triangle, but is not limited thereto. The horizontal hole 280 can further enlarge the contact area between the solder and the lead frame 240. [

The horizontal hole 280 may be formed to communicate with the hole 270. When the horizontal hole 280 communicates with the hole 270, the melted solder flows more easily toward the hole 270, so that the adhesion between the lead frame 240 and the substrate (not shown) can be improved. Therefore, lifetime and reliability of the light emitting device package 200 can also be improved.

FIG. 6A is a perspective view illustrating a lighting device including a light emitting device package according to an embodiment, and FIG. 6B is a cross-sectional view taken along the line C-C 'of the lighting device of FIG. 6A.

6B is a cross-sectional view of the lighting apparatus 400 of FIG. 6A cut in the longitudinal direction Z and the height direction X and viewed in the horizontal direction Y. FIG.

6A and 6B, the lighting device 400 may include a body 410, a cover 430 coupled to the body 410, and a finishing cap 450 positioned at opposite ends of the body 410 have.

The light emitting device module 440 is coupled to a lower surface of the body 410. The body 410 is electrically connected to the light emitting device package 444 through a conductive material such that heat generated from the light emitting device package 444 can be emitted to the outside through the upper surface of the body 410. [ And may be formed of a metal material having excellent heat dissipation effect, but is not limited thereto.

The light emitting device package 444 may be mounted on the substrate 442 in a multi-color, multi-row manner to form a module. The light emitting device package 444 may be mounted at equal intervals or may be mounted with various spacings as needed. As such a substrate 442, MCPCB (Metal Core PCB) or FR4 PCB can be used.

The cover 430 may be formed in a circular shape so as to surround the lower surface of the body 410, but is not limited thereto.

The cover 430 protects the internal light emitting device module 440 from foreign substances or the like. The cover 430 may include diffusion particles to prevent glare of the light generated in the light emitting device package 444 and uniformly emit light to the outside and may include at least one of an inner surface and an outer surface of the cover 430 A prism pattern or the like may be formed on one side. Further, the phosphor may be coated on at least one of the inner surface and the outer surface of the cover 430.

Since the light generated from the light emitting device package 444 is emitted to the outside through the cover 430, the cover 430 must have a high light transmittance and sufficient to withstand the heat generated from the light emitting device package 444. [ The cover 430 may be made of polyethylene terephthalate (PET), polycarbonate (PC), polymethyl methacrylate (PMMA), or the like. It is preferable that it is formed of a material.

The finishing cap 450 is located at both ends of the body 410 and can be used for sealing the power supply unit (not shown). In addition, the fin 450 is formed on the finishing cap 450, so that the lighting device 400 according to the embodiment can be used immediately without a separate device on the terminal from which the conventional fluorescent lamp is removed.

7 is an exploded perspective view of a liquid crystal display device including an optical sheet according to an embodiment.

7, the liquid crystal display 500 may include a backlight unit 570 for providing light to the liquid crystal display panel 510 and the liquid crystal display panel 510 in an edge-light manner.

The liquid crystal display panel 510 can display an image using the light provided from the backlight unit 570. The liquid crystal display panel 510 may include a color filter substrate 512 and a thin film transistor substrate 514 facing each other with a liquid crystal therebetween.

The color filter substrate 512 can realize the color of an image to be displayed through the liquid crystal display panel 510.

The thin film transistor substrate 514 is electrically connected to a printed circuit board 518 on which a plurality of circuit components are mounted via a driving film 517. The thin film transistor substrate 514 may apply a driving voltage provided from the printed circuit board 518 to the liquid crystal in response to a driving signal provided from the printed circuit board 518.

The thin film transistor substrate 514 may include a thin film transistor and a pixel electrode formed as a thin film on another substrate of a transparent material such as glass or plastic.

The backlight unit 570 includes a light emitting device module 520 that outputs light, a light guide plate 530 that changes the light provided from the light emitting device module 520 into a surface light source and provides the light to the liquid crystal display panel 510, A plurality of films 550, 566, and 564 that uniformly distribute the luminance of light provided from the light guide plate 530 and improve vertical incidence, and a reflective sheet (not shown) that reflects light emitted to the rear of the light guide plate 530 to the light guide plate 530 540).

The light emitting device module 520 may include a PCB substrate 522 to mount a plurality of light emitting device packages 524 and a plurality of light emitting device packages 524 to form a module.

The backlight unit 570 includes a diffusion film 566 for diffusing light incident from the light guide plate 530 toward the liquid crystal display panel 510 and a prism film 550 for enhancing vertical incidence by condensing the diffused light And may include a protective film 564 for protecting the prism film 550. [

8 is an exploded perspective view of a liquid crystal display device including an optical sheet according to an embodiment. However, the parts shown and described in Fig. 7 are not repeatedly described in detail.

8, the liquid crystal display 600 may include a liquid crystal display panel 610 and a backlight unit 670 for providing light to the liquid crystal display panel 610 in a direct-down manner.

Since the liquid crystal display panel 610 is the same as that described with reference to FIG. 7, a detailed description thereof will be omitted.

The backlight unit 670 includes a plurality of light emitting element modules 623, a reflective sheet 624, a lower chassis 630 in which the light emitting element module 623 and the reflective sheet 624 are accommodated, And a plurality of optical films 660 disposed on the diffuser plate 640.

The light emitting device module 623 may include a PCB substrate 621 to mount a plurality of light emitting device packages 622 and a plurality of light emitting device packages 622 to form a module.

The reflective sheet 624 reflects light generated from the light emitting device package 622 in a direction in which the liquid crystal display panel 610 is positioned, thereby improving light utilization efficiency.

The light emitted from the light emitting element module 623 is incident on the diffusion plate 640 and the optical film 660 is disposed on the diffusion plate 640. The optical film 660 is composed of a diffusion film 666, a prism film 650, and a protective film 664.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, It should be understood that various modifications may be made by those skilled in the art without departing from the spirit and scope of the present invention.

110: body 120: cavity
130: light source part 140: first lead frame
150: second lead frame 170: hole
172: first area 174: second area

Claims

A body formed with a cavity;
First and second lead frames mounted on the body and having at least one region including an exposed region extended to the outside of the body and having holes in at least one region; And
A light emitting element electrically connected to the first and second lead frames; / RTI >
The hole includes a first region overlapping with the body in a vertical direction, and a second region extending outward from the body,
Wherein the first region comprises:
A body of which is filled with a material forming the body,
Wherein the second region comprises:
A first lead frame formed in the exposed region and surrounded by the first lead frame and the second lead frame,
Wherein the first and second lead frames are formed by:
And a horizontal hole formed horizontally in the longitudinal direction of the first and second lead frames,
The horizontal hole
Wherein the light emitting device package is formed at an exposed region extending to the outside of the body, and communicates with the second region through a side of the lead frame in a direction in which the second region is formed.

The method according to claim 1,
Wherein the first region comprises:
Wherein the light emitting device package is filled with a material forming the body.

The method according to claim 1,
Wherein the second region comprises:
(L1) from the outer surface of the body to the second region and a length (L2) of the second region perpendicular to the L1,
L1 is 0.1 mm to 0.2 mm,
And L2 is 0.8 mm to 1 mm.

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The method according to claim 1,
The ratio of the length (L1) from the outer surface of the body to the second area and the length (M1) from the outer surface of the body to the exposed area,
1: 2 to 3,
The ratio of the length (L2) of the second region perpendicular to the L1 to the length (M2) of the exposure region perpendicular to the M1,
0.8: 1 to 1.5.

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