KR20130061421A - Light emitting package - Google Patents

Light emitting package Download PDF

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Publication number
KR20130061421A
KR20130061421A KR1020110127721A KR20110127721A KR20130061421A KR 20130061421 A KR20130061421 A KR 20130061421A KR 1020110127721 A KR1020110127721 A KR 1020110127721A KR 20110127721 A KR20110127721 A KR 20110127721A KR 20130061421 A KR20130061421 A KR 20130061421A
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KR
South Korea
Prior art keywords
light emitting
lead frame
emitting device
device package
light
Prior art date
Application number
KR1020110127721A
Other languages
Korean (ko)
Inventor
김진성
한은정
Original Assignee
엘지이노텍 주식회사
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Publication date
Application filed by 엘지이노텍 주식회사 filed Critical 엘지이노텍 주식회사
Priority to KR1020110127721A priority Critical patent/KR20130061421A/en
Publication of KR20130061421A publication Critical patent/KR20130061421A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502—Wavelength conversion materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Abstract

PURPOSE: A light emitting device package is provided to form a first lead frame in a body and to secure integration. CONSTITUTION: A first lead frame(110) includes a hole adjacent to an optical source part(130). A first lead frame forms a body. A second lead frame(120) is arranged in a hole. An insulating layer is arranged between the hole and the second lead frame. The optical source part is electrically connected to the first lead frame and the second lead frame.

Description

Light emitting device package

Embodiment relates to a light emitting device package

As a typical example of a light emitting device, a light emitting diode (LED) is a device for converting an electric signal into an infrared ray, a visible ray, or a light using the characteristics of a compound semiconductor, and is used for various devices such as household appliances, remote controllers, Automation equipment, and the like, and the use area of LEDs is gradually widening.

In general, miniaturized LEDs are made of a surface mounting device for mounting directly on a PCB (Printed Circuit Board) substrate, and an LED lamp used as a display device is also being developed as a surface mounting device type . Such a surface mount device can replace a conventional simple lighting lamp, which is used for a lighting indicator for various colors, a character indicator, an image indicator, and the like.

As the use area of the LED is widened as described above, it is important to increase the luminance of the LED as the brightness required for a lamp used in daily life and a lamp for a structural signal is increased.

On the other hand, a light emitting device package in which such a light emitting device is mounted is being studied to increase light extraction efficiency and heat dissipation characteristics.

The embodiment provides a light emitting device package that can efficiently generate heat generated in the light source unit and improve the divinity in use.

The light emitting device package according to the embodiment includes a light source unit, a first lead frame on which the light source unit is mounted, and includes a hole adjacent to the light source unit, and forms a body, a second lead frame disposed inside the hole, and the hole and the An insulating layer may be disposed between the second lead frames, wherein the light source unit may be electrically connected to the first lead frame and the second lead frame, and the first and second lead frames may have electrical conductivity.

The embodiment has an effect that the first lead frame forms a body, so that heat generated from the light source unit can be efficiently discharged to the outside through the first lead frame.

In addition, since the embodiment is manufactured integrally, it is possible to improve reliability in the use of the light emitting device package.

1 is a perspective view showing a light emitting device package according to an embodiment.
FIG. 2 is a cross-sectional view taken along line AA of the light emitting device package of FIG. 1.
3 is a cross-sectional view showing a light emitting device package according to another embodiment.
4 is a cross-sectional view showing a light emitting device package according to another embodiment.
5 is a cross-sectional view showing a light emitting device package according to another embodiment.
6 is a plan view illustrating a light emitting device package according to another exemplary embodiment.
7 is a cross-sectional view taken along line BB of the light emitting device package of FIG. 6.
8 is a cross-sectional view showing a light emitting device package according to another embodiment.
9 is a perspective view illustrating a light emitting device array according to an embodiment.
10 is an exploded perspective view illustrating a printed circuit board.
11 is a perspective view illustrating a lighting device including a light emitting device package according to an embodiment.
12 is a cross-sectional view illustrating a CC ′ section of the lighting apparatus of FIG. 11.
13 is an exploded perspective view of a liquid crystal display including the light emitting device package according to the embodiment.
14 is an exploded perspective view of a liquid crystal display including the light emitting device package according to the embodiment.

Advantages and features of the present invention and methods for achieving them will be apparent with reference to the embodiments described below in detail with the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. To fully disclose the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims. Like reference numerals refer to like elements throughout.

The terms spatially relative, "below", "beneath", "lower", "above", "upper" May be used to readily describe a device or a relationship of components to other devices or components. Spatially relative terms should be understood to include, in addition to the orientation shown in the drawings, terms that include different orientations of the device during use or operation. For example, when flipping a device shown in the figure, a device described as "below" or "beneath" of another device may be placed "above" of another device. Thus, the exemplary term "below" can include both downward and upward directions. The device can also be oriented in other directions, so that spatially relative terms can be interpreted according to orientation.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. In the present specification, the singular form includes plural forms unless otherwise specified in the specification. It is noted that the terms "comprises" and / or "comprising" used in the specification are intended to be inclusive in a manner similar to the components, steps, operations, and / Or additions.

Unless otherwise defined, all terms (including technical and scientific terms) used in the present specification may be used in a sense that can be commonly understood by those skilled in the art. Also, commonly used predefined terms are not ideally or excessively interpreted unless explicitly defined otherwise.

The thickness and size of each layer in the drawings are exaggerated, omitted, or schematically shown for convenience and clarity of explanation. Also, the size and area of each component do not entirely reflect actual size or area.

Further, the angle and direction mentioned in the description of the structure of the light emitting device in the embodiment are based on those shown in the drawings. In the description of the structure of the light emitting device in the specification, reference points and positional relationship with respect to angles are not explicitly referred to, refer to the related drawings.

1 is a perspective view illustrating a light emitting device package according to an embodiment, and FIG. 2 is a cross-sectional view taken along line A-A of the light emitting device package of FIG. 1.

1 and 2, the light emitting device package 100 according to the embodiment includes a light source unit 130 and a light source unit 130 mounted thereon, including a hole 113 adjacent to the light source unit 130 to form a body. The first lead frame 110 may include a second lead frame 120 disposed inside the hole 113 and an insulating layer 160 disposed between the hole 113 and the second lead frame 120. have. Here, the light source unit 130 may be electrically connected to the first lead frame 110 and the second lead frame 120, and the first lead frame 110 and the second lead frame 120 may have electrical conductivity. .

Here, the light source unit 130 is electrically connected to the first lead frame 110 and the second lead frame 120, the light source unit 130 may be, for example, a light emitting diode.

As shown in FIG. 2, the light source unit 130 may be mounted on the first lead frame 110 and bonded to the second lead frame 120 and the wire 140. Alternatively, the light source unit 130 may be bonded to the first lead frame 110 and the second lead frame 120 and the wire 140, and the light source unit 130 is mounted on the second lead frame 120. The lead frame 110 and the wire 140 may be bonded. However, the present invention is not limited thereto, and the light source unit 130 may be electrically connected to the first lead frame 110 and the second lead frame 120 in various ways.

The light emitting diode may be, for example, a colored light emitting diode that emits light such as red, green, blue, or white, or a UV (Ultra Violet) light emitting diode that emits ultraviolet light. In addition, one or more light emitting diodes may be mounted.

In addition, the light emitting diode is applicable to both a horizontal type in which the electrical terminals are formed on the upper surface, or to a vertical type or flip chip formed on the upper and lower surfaces. .

The first lead frame 110 may form a body of the light emitting device package 100 and include a hole 113 formed adjacent to a location where the light source unit 130 is mounted.

In addition, the first lead frame 110 is connected to the bottom 111 and the end of the bottom 111 forming the bottom wall 112 forming a cavity (C) providing a space for the light source 130 is located. ) May be included.

An inner surface of the wall 112 may be formed with an inclined surface. The angle of reflection of the light emitted from the light source unit 130 may vary according to the angle of the inclined surface, thereby adjusting the directivity angle of the light emitted to the outside.

As the direction angle of the light decreases, the concentration of light emitted from the light source 130 to the outside increases. On the contrary, as the direction angle of light increases, the concentration of the light emitted from the light source 130 to the outside decreases.

The shape of the cavity C formed on the first lead frame 110 as viewed from above may be circular, rectangular, polygonal, elliptical, or the like, and the shape may be curved, but is not limited thereto.

In addition, the sidewall of the cavity C and the upper surface of the first lead frame 110 may include a reflective layer. In other words, a reflective layer (not shown) may be formed on the inner surface of the wall 112.

The reflective layer may be formed of a material having high light reflectivity. For example, it may be formed of a metal or an alloy including at least one of Ag, Ni, Al, Rh, Pd, Ir, Ru, Mg, Zn, Pt, Au, or Hf. Alternatively, the metal or alloy may be formed in a multilayer using light transmitting conductive materials such as ITO, IZO, IZTO, IAZO, IGZO, IGTO, AZO, and ATO, and specifically, IZO / Ni, AZO / Ag, and IZO. / Ag / Ni, AZO / Ag / Ni, Ag / Cu, Ag / Pd / Cu. That is, since a plurality of layers having different refractive indices are stacked, most of the light generated by the light source unit 130 is totally reflected to the upper portion of the light emitting device package 100, thereby increasing light extraction efficiency.

The hole 113 is formed in the first lead frame 110. Preferably, the hole 113 may be formed in the bottom portion 111 of the first lead frame 110. The hole 113 is a through hole and may penetrate the first lead frame 110. The shape of the hole 113 may include any one of a circle, a rectangle, and a polygon. However, the present invention is not limited thereto. In this case, the second lead frame 120 may be located in the hole 113 of the first lead frame 110 and may be formed to correspond to the shape of the hole 113.

If the area of the hole 113 is too large, there is a problem in reducing the area of the first lead frame 110 to release the heat generated from the light source unit 130, if the area of the hole 113 is too narrow, the hole Since the area of the second lead frame 120 positioned inside the 113 is reduced, there is a problem in that the area that is wire-bonded with the light source 130 is reduced. Therefore, the area of the hole 113 may include 10% to 20% of the area of the bottom 111 of the first lead frame 110.

The second lead frame 120 may be disposed at the same position as the first lead frame 110 or may have a height difference from the first lead frame 110. In addition, the second lead frame 120 may be formed to correspond to the width and shape of the hole 113.

The first lead frame 110 and the second lead frame 120 may have electrical conductivity, and the first lead frame 110 and the second lead frame 120 may be made of a metal material, for example, titanium (Ti). , Copper (Cu), nickel (Ni), gold (Au), chromium (Cr), tantalum (Ta), platinum (Pt), tin (Sn), silver (Ag), phosphorus (P), aluminum (Al ), Indium (In), palladium (Pd), cobalt (Co), silicon (Si), germanium (Ge), hafnium (Hf), ruthenium (Ru), may include one or more materials or alloys of iron (Fe) Can be. In addition, the lead frames 140 and 142 may be formed to have a single layer or a multilayer structure, but the embodiment is not limited thereto.

The insulating layer 160 may be disposed between the hole 113 and the second lead frame 120. The insulating layer 160 may include an insulating material, for example, SiO 2 , synthetic resin, acrylic, rubber, or the like. However, the present invention is not limited thereto.

Therefore, as described above, when the first lead frame 110 is integrally formed and the light source unit 130 is mounted on the first lead frame 110, the heat generated from the light source unit 130 is first lead frame. Through 110 may be efficiently discharged to the outside.

3 is a cross-sectional view showing a light emitting device package according to another embodiment.

Referring to FIG. 3, in the light emitting device package 100A according to the embodiment, an encapsulant 150A may be disposed in the cavity C as compared with the embodiment of FIG. 1.

The encapsulant 150A is formed to protect and surround the light source unit 130, and the shape of the encapsulant 150A may have various shapes. As shown in FIG. 3, the shape of the central portion of the encapsulant 150A is convex, so that light generated from the light source 130 may be diffused.

The encapsulant 150A may be formed of silicon, epoxy, or other resin material, and may be formed by filling the cavity, and then ultraviolet or thermal curing it. The encapsulant 150A may have a transparent color. It is not limited to this.

Meanwhile, the encapsulant 150A may further include a light diffuser 152A for diffusing light emitted from the light source unit 130. Here, the light diffusion material is any one of titanium dioxide TiO 2 ), barium oxide (BaO), silicon dioxide (SiO 2 ), magnesium oxide (MgO), and Y 2 O 3 , which is a white metal oxide, or titanium dioxide TiO 2 ) At least two or more of barium oxide (BaO), silicon dioxide (SiO 2 ), magnesium oxide (MgO), and Y 2 O 3 may be mixed. The light diffuser may be used to induce diffuse reflection of light generated from the light source unit 130.

In addition, the encapsulant 150A may further include a phosphor 151A, which will be described later.

The phosphor 151A may be selected according to the wavelength of the light emitted from the light source unit 130 so that the light emitting device package 100A may implement white light.

The phosphor 151A is a blue light emitting phosphor, a blue green light emitting phosphor, a green light emitting phosphor, a yellow green light emitting phosphor, a yellow light emitting phosphor, a yellow red light emitting phosphor, an orange light emitting phosphor, and a red light emitting phosphor according to the wavelength of light emitted from the light source unit 130. One of the can be applied.

That is, the phosphor 151A may be excited by the light having the first light emitted from the light source unit 130 to generate the second light. For example, when the light source unit 130 is a blue light emitting diode and the phosphor 151A is a yellow phosphor, the yellow phosphor may be excited by blue light to emit yellow light, and blue light and blue light generated from the blue light emitting diode As the yellow light generated by the excitation is mixed, the light emitting device package 100A may provide white light.

Similarly, when the light source unit 130 is a green light emitting diode, a magenta phosphor or a mixture of blue and red phosphors is mixed. When the light source unit 130 is a red light emitting diode, a cyan phosphor or a blue and green phosphor is used. For example.

The phosphor 151A may be a known phosphor such as YAG, TAG, sulfide, silicate, aluminate, nitride, carbide, nitridosilicate, borate, fluoride or phosphate.

4 is a cross-sectional view showing a light emitting device package according to another embodiment.

Referring to FIG. 4, the light emitting device package 100B according to the embodiment has a difference in shape of the encapsulant 150B as compared with the embodiment of FIG. 3.

As shown in FIG. 4, the encapsulant 150B may have a concave shape in the center thereof to improve the concentration of light generated by the light source 130.

5 is a cross-sectional view showing a light emitting device package according to another embodiment.

Referring to FIG. 5, the light emitting device package 100C according to the exemplary embodiment of the present invention has a first lead frame 110C, a second lead frame 120C, a hole 113C, and an insulating layer 160C as compared to the embodiment of FIG. 1. There is a difference in the shape of).

The hole 113C may be divided into an upper region and a lower region at the bottom 111C of the first lead frame 110C, and the width of the lower region may be greater than the width of the upper region. However, the present invention is not limited thereto, and the hole 113C may be divided into a plurality of regions, and in this case, the width of the lower region may be large. In this case, the first lead frame 110C and the second lead frame 120C may be formed to correspond to the shape of the hole 113C, and the insulating layer 160C may be formed of the first lead frame 110C and the second lead frame. May be disposed between 120C. That is, the first lead frame 110C and the second lead frame 120C may include a step.

Therefore, since the area of the bottom portion of the second lead frame 120C is increased, the area mounted on the substrate can be secured, and the first lead frame 110C is integrally formed so that heat generated from the light source 130 can be effectively prevented. It may be released.

6 is a plan view illustrating a light emitting device package according to another embodiment, and FIG. 7 is a cross-sectional view taken along line B-B of the light emitting device package of FIG. 6.

6 and 7, the light emitting device package 200 according to the embodiment has a shape of the first lead frame 210 and a cavity on the first lead frame 210 as compared with the embodiment of FIG. 1. There is a difference further comprising a body 270 forming C).

Here, the first lead frame 210 may provide a bottom surface of the light emitting device package 200.

The body 270 may provide a cavity C in which the light source unit 230 is accommodated.

The body 270 is made of a resin material such as polyphthalamide (PPA), silicon (Si), aluminum (Al), aluminum nitride (AlN), liquid crystal polymer (PSG, photo sensitive glass), polyamide 9T (PA9T) ), Neo geotactic polystyrene (SPS), a metal material, sapphire (Al 2 O 3 ), beryllium oxide (BeO), may be formed of at least one of a printed circuit board (PCB, Printed Circuit Board). The body 270 may be formed by injection molding, etching, or the like, but is not limited thereto.

An inner surface of the body 270 may have an inclined surface. The angle of reflection of the light emitted from the light source unit 230 may vary according to the angle of the inclined surface, thereby adjusting the directing angle of the light emitted to the outside.

As the direction angle of the light decreases, the concentration of light emitted from the light source unit 230 to the outside increases, and conversely, as the direction angle of light increases, the concentration of light emitted to the outside from the light source unit 230 decreases.

On the other hand, the shape of the cavity formed in the body 270 as viewed from above may be circular, rectangular, polygonal, elliptical, or the like, the shape may be a curved corner, but is not limited thereto.

The sidewall of the cavity C may include a reflective layer. In other words, a reflective layer (not shown) is formed on the inner surface of the body 270.

The reflective layer may be formed of a material having high light reflectivity. For example, it may be formed of a metal or an alloy including at least one of Ag, Ni, Al, Rh, Pd, Ir, Ru, Mg, Zn, Pt, Au, or Hf. Alternatively, the metal or alloy may be formed in a multilayer using light transmitting conductive materials such as ITO, IZO, IZTO, IAZO, IGZO, IGTO, AZO, and ATO, and specifically, IZO / Ni, AZO / Ag, and IZO. / Ag / Ni, AZO / Ag / Ni, Ag / Cu, Ag / Pd / Cu. That is, since a plurality of layers having different refractive indices are stacked, most of the light generated by the light source unit 230 is totally reflected to the upper portion of the light emitting device package 200, thereby increasing light extraction efficiency.

The body 270 may be disposed to extend from an upper surface of the first lead frame 210 to a circumference of the first lead frame 210.

8 is a cross-sectional view showing a light emitting device package according to another embodiment.

Referring to FIG. 8, the light emitting device package 200A according to the embodiment may include the first lead frame 210A, the second lead frame 220A, the hole 213A, and the insulating layer 260A, as compared with the embodiment of FIG. 7. ), The first lead frame 210A further includes a protrusion 214A, and the cavity C further includes an encapsulant 250A.

The hole 213A may be divided into an upper region and a lower region of the first lead frame 210A, and the width of the lower region may be greater than the width of the upper region. However, the present invention is not limited thereto, and the hole 213A may be divided into a plurality of regions, and in this case, the width of the lower region may be large. In this case, the first lead frame 210A and the second lead frame 220A may be formed to correspond to the shape of the hole 213A, and the insulating layer 260A may have the first lead frame 210A and the second lead frame. May be disposed between 220A. That is, the first lead frame 210A and the second lead frame 220A may include a step.

Therefore, since the area of the bottom portion of the second lead frame 220A is increased, the area mounted on the substrate can be secured, and the first lead frame 210A is integrally formed so that the heat generated from the light source 230 can be effectively prevented. It may be released.

The encapsulant 250A is formed to protect and surround the light source unit 230, and the shape of the encapsulant 250A may have various shapes.

The encapsulant 250A may be formed of silicon, epoxy, or other resin material, and may be formed by filling the cavity and then UV or heat curing the same. The encapsulant 250A may have a transparent color. It is not limited to this.

Meanwhile, the encapsulant 250A may further include a light diffuser 252A for diffusing light emitted from the light source unit 230. Here, the light diffusion material is any one of titanium dioxide TiO 2 ), barium oxide (BaO), silicon dioxide (SiO 2 ), magnesium oxide (MgO), and Y 2 O 3 , which is a white metal oxide, or titanium dioxide TiO 2 ) At least two or more of barium oxide (BaO), silicon dioxide (SiO 2 ), magnesium oxide (MgO), and Y 2 O 3 may be mixed. The light diffuser may be used to induce diffuse reflection of light generated from the light source unit 130.

In addition, the encapsulant 250A may further include a phosphor 251A, which will be described later.

The phosphor 251A may be selected according to the phosphor 251A according to the wavelength of the light emitted from the light source 230 so that the light emitting device package 200A may implement white light.

The phosphor 251A is a blue light emitting phosphor, a cyan light emitting phosphor, a green light emitting phosphor, a yellow green light emitting phosphor, a yellow light emitting phosphor, a yellow red light emitting phosphor, an orange light emitting phosphor, and a red light emitting phosphor according to the wavelength of light emitted from the light source unit 230. One of the can be applied.

That is, the phosphor 251A may be excited by the light having the first light emitted from the light source unit 230 to generate the second light. For example, when the light source unit 230 is a blue light emitting diode and the phosphor 251A is a yellow phosphor, the yellow phosphor may be excited by blue light to emit yellow light, and blue light and blue light generated from the blue light emitting diode As the yellow light generated by excitation is mixed, the light emitting device package 200A may provide white light.

Similarly, when the light source unit 230 is a green light emitting diode, a magenta phosphor or a mixture of blue and red phosphors is used. When the light source unit 230 is a red light emitting diode, a cyan phosphor or a blue and green phosphors are used. For example.

The phosphor 251A may be a known phosphor such as YAG, TAG, sulfide, silicate, aluminate, nitride, carbide, nitridosilicate, borate, fluoride or phosphate.

9 is a perspective view illustrating a light emitting device array according to an embodiment, and FIG. 10 is an exploded perspective view illustrating a printed circuit board.

9 and 10, the light emitting device array 300 according to the embodiment may include a light emitting device package 200 and a printed circuit board 310 on which the light emitting device package 200 is mounted.

The configuration of the light emitting device package 200 is as described above.

The printed circuit board 310 may include a material having insulation. For example, it may be formed of FR-4, or may be formed of polyimide, liquid crystal polymer and polyester PEN (polyethylene naphthalate), PET (polyethylene terephthalate), LCP (liquid crystal polymer) , But is not limited thereto. In addition, the printed circuit board 310 may have a thin structure or may be formed of a light transmissive resin such that the electrode patterns 321 and 322 mounted therein may be visually sensed from the outside, but are not limited thereto. In addition, the printed circuit board 310 may be formed of a thin plate formed of a flexible synthetic resin or the like, or a film to form a flexible printed circuit board (FPCB), or may include several layers. ) May be formed, but is not limited thereto.

Meanwhile, the printed circuit board 310 is formed on the base layer 312 and the base layer 312 forming the base of the printed circuit board 310, and the insulating layer 314 and the insulating layer 314 formed of an insulating material. The cover layer 316 may be formed on the electrode pattern 120 and cover the electrode pattern 120. The base layer 112 may further include a reinforcing member (not shown) for reinforcing the strength of the printed circuit board 310.

Also, the printed circuit board 310 may have an opening 340 to expose at least one region of the electrode patterns 321 and 322 mounted therein, but is not limited thereto. Electrical and electronic devices may be electrically connected to the electrode patterns 321 and 322 exposed through the opening part 340, and external power may be supplied to the electrical and electronic devices. Here, the shape of the opening portion 340 is not limited, it is usually a rectangular shape.

Meanwhile, the connector unit 318 may be disposed in at least one region of the printed circuit board 310.

The connector 318 may be disposed on at least one region on the printed circuit board 310, or one region of the printed circuit board 310 protrudes to connect other electrical and electronic devices with the printed circuit board 310. It may be formed to be, but is not limited thereto. An opening portion 340 is formed in at least one region of the connector portion 318 so that at least one region of the electrode patterns 321 and 322 may be exposed to the outside. The printed circuit board 310 is electrically connected to other electric and electronic devices through the connector unit 318, so that the electric, electronic device and other electric and electronic devices mounted on the printed circuit board 310 may be electrically connected. In addition, power may be supplied to electrical and electronic devices mounted on the printed circuit board 310.

Although not shown, a heat dissipation unit (not shown) and a via hole (not shown) may be included to facilitate heat dissipation of electric and electronic devices mounted on the printed circuit board 310. It is not limited.

The electrode patterns 321 and 322 are formed to correspond to the first electrode pattern 321 and the second lead frame 220 in contact with the first lead frame 210 and are in contact with the second lead frame 220. It may include an insulating portion 330 disposed around the electrode pattern 322 and the second electrode pattern 322.

The electrode patterns 321 and 322 may have electrical conductivity. For example, the electrode patterns 120 and 322 may be a thin copper film having electrical conductivity, but are not limited thereto. The electrode patterns 120 may be formed of a metal material, for example. , Titanium (Ti), copper (Cu), nickel (Ni), gold (Au), chromium (Cr), tantalum (Ta), platinum (Pt), tin (Sn), silver (Ag), phosphorus (P ), Aluminum (Al), indium (In), palladium (Pd), cobalt (Co), silicon (Si), germanium (Ge), hafnium (Hf), ruthenium (Ru), iron (Fe) Or an alloy, or may be composed of an electrically conductive polymer material.

The electrode patterns 321 and 322 may be formed by forming a conductive layer by a method such as sputtering, electrolytic / electroless plating, or the like by etching a conductive material such as copper, but are not limited thereto.

In addition, the electrode patterns 321 and 322 may be formed to have one layer, or may be formed to have several layers, but is not limited thereto.

Although not illustrated in FIG. 10, the electrode patterns 321 and 322 may further include dummy patterns (not shown).

For example, the electrode patterns 321 and 322 may be electrode patterns electrically connected to external electric and electronic devices to supply power. Meanwhile, at least one region of the electrode patterns 321 and 322 may be exposed through the opening part 340 formed on the printed circuit board 310, and the opening part 340 on which the electrode patterns 321 and 322 are exposed may be exposed. External electrical and electronic devices may be electrically connected to the electrode patterns 321 and 322 through the electronic device.

Therefore, there is an advantage of providing a light emitting device array 300 that is easy to heat dissipation.

FIG. 11 is a perspective view illustrating a lighting device including a light emitting device package according to an embodiment, and FIG. 12 is a cross-sectional view illustrating a C-C 'cross section of the lighting device of FIG. 11.

11 and 12, the lighting device 600 may include a body 610, a cover 630 fastened to the body 610, and a closing cap 650 located at both ends of the body 610. have.

A light emitting device module 640 is coupled to a lower surface of the body 610. The body 610 is electrically conductive so that heat generated from the light emitting device package 644 can be emitted to the outside through the upper surface of the body 610. [ And a metal material having an excellent heat dissipation effect.

The light emitting device package 644 may be mounted on the PCB 642 in a multi-color, multi-row manner to form an array. The light emitting device package 644 may be mounted at equal intervals or may be mounted with various spacings as required. As the PCB 642, MPPCB (Metal Core PCB) or FR4 material PCB can be used.

Since the light emitting device package 644 may have an improved heat dissipation function including an extended lead frame (not shown), reliability and efficiency of the light emitting device package 644 may be improved, and the light emitting device package 622 and the light emitting device may be improved. The service life of the lighting device 600 including the device package 644 may be extended.

The cover 630 may be formed in a circular shape so as to surround the lower surface of the body 610, but is not limited thereto.

The cover 630 protects the internal light emitting element module 640 from foreign substances or the like. The cover 630 may include diffusion particles so as to prevent glare of light generated in the light emitting device package 644 and uniformly emit light to the outside, and may include at least one of an inner surface and an outer surface of the cover 630 A prism pattern or the like may be formed on one side. Further, the phosphor may be applied to at least one of the inner surface and the outer surface of the cover 630.

On the other hand, since the light generated from the light emitting device package 644 is emitted to the outside through the cover 630, the cover 630 should have excellent light transmittance, and has sufficient heat resistance to withstand the heat generated from the light emitting device package 644. The cover 630 is preferably formed of a material including polyethylene terephthalate (PET), polycarbonate (PC), polymethyl methacrylate (PMMA), or the like. .

The finishing cap 650 is located at both ends of the body 610 and can be used to seal the power supply unit (not shown). In addition, the finishing cap 650 is provided with the power supply pin 652, so that the lighting apparatus 600 according to the embodiment can be used immediately without a separate device on the terminal from which the conventional fluorescent lamp is removed.

13 is an exploded perspective view of a liquid crystal display including the light emitting device package according to the embodiment.

FIG. 13 illustrates an edge-light method, and the liquid crystal display 700 may include a liquid crystal display panel 710 and a backlight unit 770 for providing light to the liquid crystal display panel 710.

The liquid crystal display panel 710 can display an image using light provided from the backlight unit 770. The liquid crystal display panel 710 may include a color filter substrate 712 and a thin film transistor substrate 714 facing each other with a liquid crystal therebetween.

The color filter substrate 712 can realize the color of an image to be displayed through the liquid crystal display panel 710.

The thin film transistor substrate 714 is electrically connected to a printed circuit board 718 on which a plurality of circuit components are mounted via a driving film 717. The thin film transistor substrate 714 may apply a driving voltage provided from the printed circuit board 718 to the liquid crystal in response to a driving signal provided from the printed circuit board 718. [

The thin film transistor substrate 714 may include a thin film transistor and a pixel electrode formed as a thin film on another substrate of a transparent material such as glass or plastic.

The backlight unit 770 includes a light emitting element module 720 that outputs light, a light guide plate 730 that changes the light provided from the light emitting element module 720 into a surface light source and provides the light to the liquid crystal display panel 710, A plurality of films 752, 766, and 764 for uniformly distributing the luminance of light provided from the light guide plate 730 and improving vertical incidence and a reflective sheet (reflective plate) for reflecting light emitted to the rear of the light guide plate 730 to the light guide plate 730 747).

The light emitting device module 720 may include a PCB substrate 722 for mounting a plurality of light emitting device packages 724 and a plurality of light emitting device packages 724 to form an array. In this case, the reliability of the mounting of the bent light emitting device package 724 can be improved.

Meanwhile, the backlight unit 770 includes a diffusion film 766 that diffuses light incident from the light guide plate 730 toward the liquid crystal display panel 710, and a prism film 752 that concentrates the diffused light to improve vertical incidence. It may be configured as), and may include a protective film 764 for protecting the prism film 750.

14 is an exploded perspective view of a liquid crystal display including the light emitting device package according to the embodiment. However, the parts shown and described in FIG. 13 will not be repeatedly described in detail.

14 is a direct view, the liquid crystal display device 800 may include a liquid crystal display panel 810 and a backlight unit 870 for providing light to the liquid crystal display panel 810.

Since the liquid crystal display panel 810 is the same as that described with reference to FIG. 13, a detailed description thereof will be omitted.

The backlight unit 870 includes a plurality of light emitting element modules 823, a reflective sheet 824, a lower chassis 830 in which the light emitting element module 823 and the reflective sheet 824 are accommodated, And a plurality of optical films 860. The diffuser plate 840 and the plurality of optical films 860 are disposed on the light guide plate 840. [

LED Module 823 A plurality of light emitting device packages 822 and a plurality of light emitting device packages 822 may be mounted to include a PCB substrate 821 to form an array.

The reflective sheet 824 reflects light generated from the light emitting device package 822 in a direction in which the liquid crystal display panel 810 is positioned, thereby improving light utilization efficiency.

Light generated in the light emitting element module 823 is incident on the diffusion plate 840 and an optical film 860 is disposed on the diffusion plate 840. The optical film 860 may include a diffusion film 866, a prism film 850, and a protective film 864.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is clearly understood that the same is by way of illustration and example only and is not to be taken by way of illustration, It can be seen that various modifications and applications are possible. For example, each component specifically shown in the embodiments can be modified and implemented. It is to be understood that all changes and modifications that come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

Claims (18)

A light source;
A first lead frame on which the light source unit is mounted, including a hole positioned adjacent to the light source unit, and forming a body;
A second lead frame disposed in the hole;
An insulation layer disposed between the hole and the second lead frame;
The light source unit is electrically connected to the first lead frame and the second lead frame, the first and second lead frame is a light emitting device package having an electrical conductivity. The method of claim 1,
The first lead frame,
Bottom; And
Light emitting device package comprising a wall connected to the end of the bottom to form a cavity. The method of claim 1,
The light emitting device package further comprises a reflective layer on the upper surface of the first lead frame. The method of claim 1,
The first lead frame is a light emitting device package including a step. The method of claim 1,
The second lead frame is a light emitting device package including a step. The method of claim 1,
The hole
The light emitting device package is divided into an upper region and a lower region, the width of the lower region is larger than the width of the upper region. The method of claim 1,
The cross-sectional shape of the hole is a light emitting device package including any one of a circle, a rectangle, a polygon. The method of claim 2,
The hole area is 10% to 20% of the area of the bottom of the first lead frame light emitting device package. The method of claim 2,
The hole is a light emitting device package formed in the bottom portion of the first lead frame. The method according to claim 6,
The second lead frame is a light emitting device package formed to correspond to the width of the hole. The method of claim 1,
On the first leadframe
A light emitting device package further comprising a body forming a cavity. The method of claim 11,
The body is a light emitting device package extending to the circumference of the first lead frame. The method of claim 11,
The first lead frame,
The light emitting device package further comprises a protrusion located in an area in contact with the body. The method of claim 11,
The body is a light emitting device package including an insulating material. The method according to claim 2 or 11, wherein
The light emitting device package is disposed in the cavity the sealing material. 16. The method of claim 15,
The encapsulant,
A light emitting device package comprising a phosphor or a light diffuser. 16. The method of claim 15,
The encapsulant includes a light emitting device package having a central portion of which is convex or concave. The method of claim 1,
The light source device package includes a light source device.
KR1020110127721A 2011-12-01 2011-12-01 Light emitting package KR20130061421A (en)

Priority Applications (1)

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Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
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Publications (1)

Publication Number Publication Date
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Family Applications (1)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170077511A (en) * 2015-12-28 2017-07-06 엘지이노텍 주식회사 Light emitting device, and lighting module

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170077511A (en) * 2015-12-28 2017-07-06 엘지이노텍 주식회사 Light emitting device, and lighting module

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