KR20130079921A - Printed circuit board - Google Patents

Printed circuit board Download PDF

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Publication number
KR20130079921A
KR20130079921A KR1020120000692A KR20120000692A KR20130079921A KR 20130079921 A KR20130079921 A KR 20130079921A KR 1020120000692 A KR1020120000692 A KR 1020120000692A KR 20120000692 A KR20120000692 A KR 20120000692A KR 20130079921 A KR20130079921 A KR 20130079921A
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KR
South Korea
Prior art keywords
light emitting
printed circuit
circuit board
emitting device
electrode pattern
Prior art date
Application number
KR1020120000692A
Other languages
Korean (ko)
Inventor
김성호
Original Assignee
엘지이노텍 주식회사
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Filing date
Publication date
Application filed by 엘지이노텍 주식회사 filed Critical 엘지이노텍 주식회사
Priority to KR1020120000692A priority Critical patent/KR20130079921A/en
Publication of KR20130079921A publication Critical patent/KR20130079921A/en

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/27—Retrofit light sources for lighting devices with two fittings for each light source, e.g. for substitution of fluorescent tubes
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/20—Electroluminescent [EL] light sources
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]

Abstract

PURPOSE: A printed circuit board (PCB) is provided to form a groove corresponding to the burr of a light emitting element package, thereby improving the generation of a gap between the package and the PCB and the tilt of the package. CONSTITUTION: A printed circuit board (PCB) includes an electrode pattern (120) and a body (110). The pattern is electrically conductive. The insulating body surrounds the pattern, and has an opening part through which the part of the pattern is exposed. The body has a groove (130) adjacent to the corner region of the opening part.

Description

Printed Circuit Board

Embodiments relate to a printed circuit board.

In a printed circuit board, predetermined electric and electronic devices are mounted and arranged, and an external power source is connected to the electric and electronic devices to supply power. The printed circuit board on which the electric and electronic devices are mounted in this way is arranged in a predetermined electric and electronic device so that the electric and electronic devices described above can be reliably disposed and function in the electric and electronic device. Therefore, printed circuit boards are widely used throughout electric and electronic devices such as mobile phones, notebook computers, display devices, and the like.

Meanwhile, a predetermined device such as, for example, a light emitting device package may be connected to the printed circuit board. These devices generate heat at the same time they are powered on, and this heat can affect the reliability of electrical appliances. Therefore, the heat radiation function of the printed circuit board is a very important problem.

In particular, when the light emitting device package is mounted on a printed circuit board, the adhesion between the two is a very important problem for the reliability of the product.

The embodiment provides a printed circuit board which improves the adhesion between the light emitting device package and the printed circuit board and improves the reliability of the product.

The printed circuit board according to the embodiment includes an electrode pattern having electrical conductivity and a body having insulation and surrounding the electrode pattern and including an opening portion through which an area of the electrode pattern is exposed, wherein the body has a corner of the opening portion. It may include a groove formed adjacent to the area.

The printed circuit board according to the embodiment may form a groove corresponding to the burr of the light emitting device package, thereby preventing lifting between the light emitting device package and the printed circuit board and preventing the tilt of the light emitting device package.

In addition, it is possible to improve the reliability and convenience of assembly of the light emitting device module.

1 is a perspective view illustrating a printed circuit board according to an embodiment.
2 is an exploded perspective view illustrating a printed circuit board according to an embodiment.
3 is a partially enlarged view of a region A of the printed circuit board of FIG. 1.
4 is a cross-sectional view illustrating a cross-section taken along line BB ′ of FIG. 3.
5 is a cross-sectional view illustrating a cross section of BB ′ according to another embodiment.
6 is a perspective view illustrating a printed circuit board according to another exemplary embodiment.
7 is a perspective view illustrating a light emitting device module including a printed circuit board according to an embodiment.
8 is a perspective view illustrating the light emitting device package of FIG. 7.
9 is a cross-sectional view illustrating the light emitting device package of FIG. 7.
10 is a perspective view illustrating a lighting device including a light emitting device module according to an embodiment.
11 is a cross-sectional view showing a CC 'cross-section of the illumination device of FIG.
12 is an exploded perspective view of a liquid crystal display including the light emitting device module according to the embodiment.
13 is an exploded perspective view of a liquid crystal display including the light emitting device module according to the embodiment.

Advantages and features of the present invention and methods for achieving them will be apparent with reference to the embodiments described below in detail with the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. To fully disclose the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims. Like reference numerals refer to like elements throughout.

The terms spatially relative, "below", "beneath", "lower", "above", "upper" May be used to readily describe a device or a relationship of components to other devices or components. Spatially relative terms should be understood to include, in addition to the orientation shown in the drawings, terms that include different orientations of the device during use or operation. For example, when flipping a device shown in the figure, a device described as "below" or "beneath" of another device may be placed "above" of another device. Thus, the exemplary term "below" can include both downward and upward directions. The device can also be oriented in other directions, so that spatially relative terms can be interpreted according to orientation.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. In the present specification, the singular form includes plural forms unless otherwise specified in the specification. It is noted that the terms "comprises" and / or "comprising" used in the specification are intended to be inclusive in a manner similar to the components, steps, operations, and / Or additions.

Unless otherwise defined, all terms (including technical and scientific terms) used in the present specification may be used in a sense that can be commonly understood by those skilled in the art. Also, commonly used predefined terms are not ideally or excessively interpreted unless explicitly defined otherwise.

The thickness and size of each layer in the drawings are exaggerated, omitted, or schematically shown for convenience and clarity of explanation. Also, the size and area of each component do not entirely reflect actual size or area.

Further, the angle and direction mentioned in the description of the structure of the light emitting device in the embodiment are based on those shown in the drawings. In the description of the structure of the light emitting device in the specification, reference points and positional relationship with respect to angles are not explicitly referred to, refer to the related drawings.

1 is a perspective view showing a printed circuit board according to an embodiment, FIG. 2 is an exploded perspective view showing a printed circuit board according to an embodiment, FIG. 3 is a partially enlarged view of a region A of the printed circuit board of FIG. Sectional drawing which shows the cross section of BB 'of 3, FIG. 5 is sectional drawing which shows the cross section of BB' according to another embodiment.

Referring to FIGS. 1 and 2, the printed circuit board 100 according to the exemplary embodiment may include an electrode pattern 120 having electrical conductivity and an electrode pattern 120 having insulation and enclosing the electrode pattern 120. The body 110 having the opening 140 exposed, the body 110 may include a groove 130 formed adjacent to the corner region of the opening 140.

The body 110 may include a material having insulation. For example, the body 110 may be formed of FR-4, or may be made of polyimide, liquid crystal polymer, and polyester PEN (polyethylene naphthalate), PET (polyethylene terephthalate), or LCP. It may include at least one of (liquid crystal polymer), but is not limited thereto. In addition, the body 110 may have a thin structure or may be formed of a light transmissive resin such that the electrode pattern 120 mounted therein may be visually sensed from the outside, but is not limited thereto. In addition, the body 110 may be formed of a thin plate or film formed of a flexible synthetic resin or the like to form a flexible printed circuit board (FPCB), or may include several layers to form a multilayer printed circuit board (Multi-Layer Board). It can form, but it is not limited to this.

Meanwhile, the body 110 is formed on the base layer 112 and the base layer 112 forming the base of the body 110 and formed on the insulating layer 114 and the insulating layer 114 formed of an insulating material. And a cover layer 116 covering the electrode pattern 120. Although not shown in FIG. 2, a reinforcing member (not shown) for reinforcing the strength of the printed circuit board 100 may be further included below the base layer 112.

In addition, the body 110 may have the opening part 140 to expose at least one region of the electrode pattern 120 mounted therein, but is not limited thereto. Electrical and electronic devices may be electrically connected to the electrode pattern 120 exposed through the opening 140, and external power may be supplied to the electrical and electronic devices. Here, the shape of the opening part 140 is not limited, but usually has a rectangular shape.

The connector 118 may be disposed in at least one region of the body 110.

The connector portion 118 may be disposed on at least one region on the body 110 as shown in FIG. 1, or one region of the body 110 protrudes to allow other electrical and electronic devices and a printed circuit board 100 to be disposed. ) May be connected to each other, but is not limited thereto. The opening part 140 may be formed in at least one region of the connector 118 so that at least one region of the electrode pattern 120 may be exposed to the outside. The printed circuit board 100 is electrically connected to other electric and electronic devices through the connector unit 118, so that the electric, electronic device and other electric and electronic devices mounted on the printed circuit board 100 may be electrically connected. In addition, power may be supplied to electrical and electronic devices mounted on the printed circuit board 100.

In addition, although not shown, the body 110 includes a heat dissipation unit (not shown) and a via hole (not shown) to facilitate heat dissipation of electric and electronic devices mounted on the printed circuit board 100. It is possible to, but not limited to.

The electrode pattern 120 may have electrical conductivity and may be mounted in the body 110. The electrode pattern 120 may be, for example, a thin copper film having electrical conductivity, but is not limited thereto. The electrode pattern 120 may be formed of a metal material, for example, titanium (Ti), copper ( Cu), nickel (Ni), gold (Au), chromium (Cr), tantalum (Ta), platinum (Pt), tin (Sn), silver (Ag), phosphorus (P), aluminum (Al), indium (In), palladium (Pd), cobalt (Co), silicon (Si), germanium (Ge), hafnium (Hf), ruthenium (Ru), may include one or more materials or alloys of iron (Fe), Or it may be composed of an electrically conductive polymer material. In addition, the electrode pattern 120 may have a first electrode pattern 121 and a second electrode pattern 122 spaced apart from the first electrode pattern 121. However, the present invention is not limited thereto and may have various numbers of electrode patterns 120.

The electrode pattern 120 may be formed by forming a conductive layer on the body 110 by a method such as sputtering, electrolytic / electroless plating, etc., and then etching the conductive layer, but is not limited thereto. .

In addition, the electrode pattern 120 may be formed to have one layer as shown in FIG. 3, or may be formed to have several layers, but is not limited thereto.

Although not illustrated in FIG. 2, the electrode pattern 120 may further include a dummy pattern (not shown).

For example, the electrode pattern 120 may be an electrode pattern electrically connected to external electric and electronic devices to supply power. Meanwhile, at least one region of the electrode pattern 120 may be exposed through the opening part 140 formed in the body 110, and the external electrical and electronic device may be exposed through the opening part 140 where the electrode pattern 120 is exposed. May be electrically connected to the electrode pattern 120.

Meanwhile, the dummy pattern may be formed between the electrode patterns 120 or on one side thereof. For example, the dummy pattern may be a ground for grounding electrical and electronic devices mounted on the printed circuit board 100. It may be a pattern (ground pattern).

On the other hand, according to an embodiment, the body 110 may include a groove 130 formed adjacent to the corner area of the opening portion 140.

The number of the grooves 130 is not limited and may be arranged to form at least one or more rows on the body 110. Here, when the opening part 140 has a quadrangular shape, four grooves 130 may be formed at corner portions of the quadrangle as shown in FIG. 2. In addition, although the groove 130 is illustrated as being located in the cover layer 116 of the body 110 in FIG. 2, it may be located up to the insulating layer 114 or the base layer 112.

The groove 130 is formed at a position where a burr generated when cutting the light emitting device package is seated, thereby preventing the light emitting device package from being lifted up when mounted on the printed circuit board 100, and the reliability of the light emitting device module. Can improve.

3 and 4, the groove 130 may have a triangular shape as viewed from above. In particular, it is usually a right isosceles triangle. However, the present invention is not limited thereto and may have various shapes.

In addition, the cross-sectional shape of the groove 130 may be a right triangle. That is, it may have a structure in which the depth increases along the hypotenuse (a). When the angle between the hypotenuse a and the base b is too large, the reliability of the printed circuit board 100 may be degraded. If the angle is too small, the adhesion between the printed circuit board 100 and the light emitting device package may be secured. Therefore, the angle θ formed by the hypotenuse side a and the base side b of the right triangle may be 75 degrees to 80 degrees. Here, the hypotenuse a is an imaginary line positioned on the same line as the upper surface of the body 110 (for example, the upper surface of the cover layer 116). However, the present invention is not limited thereto. Here, the hypotenuse a may have a curvature as shown in FIG. 5.

In addition, if the depth (c) of the groove 130 is too deep, the reliability of the printed circuit board 100 is lowered, and if it is too shallow, adhesion between the light emitting device package and the printed circuit board 100 may not be secured. Depth (c) of 130 may be 0.5mm to 0.9mm. Here, the depth c means the farthest distance between the hypotenuse a and the base b.

6 is a perspective view illustrating a printed circuit board according to another exemplary embodiment.

Referring to FIG. 6, the printed circuit board 100A according to the embodiment has a difference in the connector portion 118A compared to the embodiment of FIG. 1.

The connector 118A may be connected to one end of the body 110. In this case, since the thickness of the printed circuit board 100A is reduced, it may help to reduce the weight of the product.

7 is a perspective view showing a light emitting device module including a printed circuit board according to an embodiment, FIG. 8 is a perspective view showing a light emitting device package of FIG. 7, and FIG. 9 is a sectional view showing a light emitting device package of FIG. 7.

Referring to FIG. 7, the light emitting device module 200 according to the embodiment may largely include a printed circuit board 100 and a light emitting device package 220.

Here, the configuration of the printed circuit board 100 is as described above.

8 and 9, the light emitting device package 220

 Body 221 having a cavity c formed therein, first and second lead frames 222a and 222b mounted on the body 221, and light emission electrically connected to the first and second lead frames 222a and 222b. The device 223 may include an encapsulant (not shown) filled in the cavity c to cover the light emitting device 223.

The body 221 is made of a resin material such as polyphthalamide (PPA), silicon (Si), aluminum (Al), aluminum nitride (AlN), photosensitive glass (PSG), polyamide 9T (PA9T) ), Neo geotactic polystyrene (SPS), a metal material, sapphire (Al 2 O 3 ), beryllium oxide (BeO), may be formed of at least one of a printed circuit board (PCB, Printed Circuit Board). The body 221 may be formed by injection molding, an etching process, but is not limited thereto.

An inner surface of the body 221 may be formed with an inclined surface. The angle of reflection of the light emitted from the light emitting element 223 may vary according to the angle of the inclined surface, thereby adjusting the directivity angle of the light emitted to the outside.

As the directivity of the light decreases, the concentration of light emitted from the light emitting device 223 to the outside increases. On the contrary, the greater the directivity of the light, the less the concentration of light emitted from the light emitting device 223 to the outside.

On the other hand, the shape of the cavity c formed on the body 221 as viewed from above may be circular, rectangular, polygonal, elliptical, or the like, and may have a curved edge, but is not limited thereto.

The body 221 may include a burr 225 formed to correspond to the groove 130. Burr 225 may be formed, for example, around the bottom of the body. However, the present invention is not limited thereto. The burr 225 refers to a thinly curled processing mark generated at the edge portion of the body 221 when the body 221 is cut. That is, the burr 225 may be seated in the groove 130 of the printed circuit board 100.

The light emitting device 223 is mounted on the first lead frame 222a and may be, for example, a light emitting device emitting light of red, green, blue, white, or UV (ultraviolet) light emitting device emitting ultraviolet light. But it is not limited thereto. In addition, one or more light emitting devices 223 may be mounted.

Further, the light emitting element 223 may be a horizontal type in which all of its electrical terminals are formed on an upper surface, or a vertical type or flip chip formed on upper and lower surfaces. Applicable

The encapsulant (not shown) may be filled in the cavity c to cover the light emitting device 223.

The encapsulant (not shown) may be formed of silicon, epoxy, and other resin materials, and may be formed by filling in the cavity (c) and then UV or thermosetting it.

In addition, the encapsulant (not shown) may include a phosphor, and the phosphor may be selected from a wavelength of light emitted from the light emitting device 223 so that the light emitting device package 500 may realize white light.

The phosphor is one of a blue light emitting phosphor, a blue green light emitting phosphor, a green light emitting phosphor, a yellow green light emitting phosphor, a yellow light emitting phosphor, a yellow red light emitting phosphor, an orange light emitting phosphor, and a red light emitting phosphor according to a wavelength of light emitted from the light emitting element 223. Can be applied.

That is, the phosphor may be excited by the light having the first light emitted from the light emitting element 223 to generate the second light. For example, when the light emitting element 223 is a blue light emitting diode and the phosphor is a yellow phosphor, the yellow phosphor may be excited by blue light to emit yellow light, and the blue light and blue light generated by the blue light emitting diode may be used. As the generated yellow light is mixed, the light emitting device package 500 may provide white light.

Similarly, when the light emitting element 223 is a green light emitting diode, a magenta phosphor or a mixture of blue and red phosphors is used. When the light emitting element 223 is a red light emitting diode, a cyan phosphor or a blue and green phosphor is used. For example,

Such a fluorescent material may be a known fluorescent material such as a YAG, TAG, sulfide, silicate, aluminate, nitride, carbide, nitridosilicate, borate, fluoride or phosphate.

The first and second lead frames 222a and 222b may be formed of a metal material, for example, titanium (Ti), copper (Cu), nickel (Ni), gold (Au), chromium (Cr), and tantalum (Ta). , Platinum (Pt), tin (Sn), silver (Ag), phosphorus (P), aluminum (Al), indium (In), palladium (Pd), cobalt (Co), silicon (Si), germanium (Ge) It may include one or more materials or alloys of hafnium (Hf), ruthenium (Ru), iron (Fe). In addition, the first and second lead frames 222a and 222b may be formed to have a single layer or a multilayer structure, but are not limited thereto.

The first second lead frames 222a and 222b are spaced apart from each other and electrically separated from each other. The light emitting element 223 is mounted on the first and second lead frames 222a and 222b, and the first and second lead frames 222a and 222b are in direct contact with the light emitting element 223 or a soldering member (not shown). May be electrically connected through a material having conductivity such as C). In addition, the light emitting device 223 may be electrically connected to the first and second lead frames 222a and 222b through the wire bonding 224, but is not limited thereto. Therefore, when power is connected to the first and second lead frames 222a and 222b, power may be applied to the light emitting device 223. Meanwhile, several lead frames (not shown) may be mounted in the body 221, and each lead frame (not shown) may be electrically connected to the light emitting device 223, but is not limited thereto.

FIG. 10 is a perspective view illustrating a lighting device including a light emitting device module according to an embodiment, and FIG. 11 is a cross-sectional view illustrating a C-C 'cross section of the lighting device of FIG. 10.

10 and 11, the lighting device 600 may include a body 610, a cover 630 coupled to the body 610, and a finishing cap 650 positioned at either end of the body 610 have.

A light emitting device module 640 is coupled to a lower surface of the body 610. The body 610 is electrically conductive so that heat generated from the light emitting device package 644 can be emitted to the outside through the upper surface of the body 610. [ And a metal material having an excellent heat dissipation effect.

The light emitting device package 644 may be mounted on the PCB 642 in a multi-color, multi-row manner to form an array. The light emitting device package 644 may be mounted at equal intervals or may be mounted with various spacings as required. As the PCB 642, MPPCB (Metal Core PCB) or FR4 material PCB can be used.

Since the light emitting device package 644 may have an improved heat dissipation function including an extended lead frame (not shown), reliability and efficiency of the light emitting device package 644 may be improved, and the light emitting device package 622 and the light emitting device may be improved. The service life of the lighting device 600 including the device package 644 may be extended.

The cover 630 may be formed in a circular shape so as to surround the lower surface of the body 610, but is not limited thereto.

The cover 630 protects the internal light emitting element module 640 from foreign substances or the like. The cover 630 may include diffusion particles so as to prevent glare of light generated in the light emitting device package 644 and uniformly emit light to the outside, and may include at least one of an inner surface and an outer surface of the cover 630 A prism pattern or the like may be formed on one side. Further, the phosphor may be applied to at least one of the inner surface and the outer surface of the cover 630.

Since the light generated in the light emitting device package 644 is emitted to the outside through the cover 630, the cover 630 must have a high light transmittance and sufficient heat resistance to withstand the heat generated in the light emitting device package 644 The cover 630 is preferably formed of a material including polyethylene terephthalate (PET), polycarbonate (PC), polymethyl methacrylate (PMMA), or the like .

The finishing cap 650 is located at both ends of the body 610 and can be used to seal the power supply unit (not shown). In addition, the finishing cap 650 is provided with the power supply pin 652, so that the lighting apparatus 600 according to the embodiment can be used immediately without a separate device on the terminal from which the conventional fluorescent lamp is removed.

12 is an exploded perspective view of a liquid crystal display including the light emitting device module according to the embodiment.

12, the liquid crystal display 700 may include a liquid crystal display panel 710 and a backlight unit 770 for providing light to the liquid crystal display panel 710 in an edge-light manner.

The liquid crystal display panel 710 can display an image using light provided from the backlight unit 770. The liquid crystal display panel 710 may include a color filter substrate 712 and a thin film transistor substrate 714 facing each other with a liquid crystal therebetween.

The color filter substrate 712 can realize the color of an image to be displayed through the liquid crystal display panel 710.

The thin film transistor substrate 714 is electrically connected to a printed circuit board 718 on which a plurality of circuit components are mounted via a driving film 717. The thin film transistor substrate 714 may apply a driving voltage provided from the printed circuit board 718 to the liquid crystal in response to a driving signal provided from the printed circuit board 718. [

The thin film transistor substrate 714 may include a thin film transistor and a pixel electrode formed as a thin film on another substrate of a transparent material such as glass or plastic.

The backlight unit 770 includes a light emitting element module 720 that outputs light, a light guide plate 730 that changes the light provided from the light emitting element module 720 into a surface light source and provides the light to the liquid crystal display panel 710, A plurality of films 752, 766, and 764 for uniformly distributing the luminance of light provided from the light guide plate 730 and improving vertical incidence and a reflective sheet (reflective plate) for reflecting light emitted to the rear of the light guide plate 730 to the light guide plate 730 747).

The light emitting device module 720 may include a PCB substrate 722 for mounting a plurality of light emitting device packages 724 and a plurality of light emitting device packages 724 to form an array. In this case, the reliability of the mounting of the bent light emitting device package 724 can be improved.

Meanwhile, the backlight unit 770 includes a diffusion film 766 that diffuses light incident from the light guide plate 730 toward the liquid crystal display panel 710, and a prism film 752 that concentrates the diffused light to improve vertical incidence. It may be configured as), and may include a protective film 764 for protecting the prism film 750.

13 is an exploded perspective view of a liquid crystal display including the light emitting device module according to the embodiment. However, the parts shown and described in Fig. 12 are not repeatedly described in detail.

13 is a direct view, the liquid crystal display 800 may include a liquid crystal display panel 810 and a backlight unit 870 for providing light to the liquid crystal display panel 810.

Since the liquid crystal display panel 810 is the same as that described with reference to FIG. 12, a detailed description thereof will be omitted.

The backlight unit 870 includes a plurality of light emitting element modules 823, a reflective sheet 824, a lower chassis 830 in which the light emitting element module 823 and the reflective sheet 824 are accommodated, And a plurality of optical films 860. The diffuser plate 840 and the plurality of optical films 860 are disposed on the light guide plate 840. [

LED Module 823 A plurality of light emitting device packages 822 and a plurality of light emitting device packages 822 may be mounted to include a PCB substrate 821 to form an array.

The reflective sheet 824 reflects light generated from the light emitting device package 822 in a direction in which the liquid crystal display panel 810 is positioned, thereby improving light utilization efficiency.

Light generated in the light emitting element module 823 is incident on the diffusion plate 840 and an optical film 860 is disposed on the diffusion plate 840. The optical film 860 may include a diffusion film 866, a prism film 850, and a protective film 864.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is clearly understood that the same is by way of illustration and example only and is not to be taken by way of illustration, It can be seen that various modifications and applications are possible. For example, each component specifically shown in the embodiments can be modified and implemented. It is to be understood that all changes and modifications that come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

Claims (14)

An electrode pattern having electrical conductivity; And
It includes an insulation having a body surrounding the electrode pattern, the body including an opening that exposes a region of the electrode pattern,
The body,
And a groove formed adjacent to a corner region of the opening portion. The method of claim 1,
The electrode pattern includes a first electrode pattern and a second electrode pattern spaced apart from the first electrode pattern. The method of claim 1,
The opening portion,
Printed circuit board having a rectangular shape. The method of claim 3,
The groove is, four printed circuit board is formed in the corner portion of the rectangle. The method of claim 1,
The groove is arranged to form at least one column. The method of claim 1,
The cross-sectional shape of the groove is a right triangle triangle printed circuit board. The method according to claim 6,
The hypotenuse of the right triangle has a curvature. The method according to claim 6,
The angle formed by the hypotenuse and the base of the right triangle is 75 to 80 degrees. The method of claim 1,
The depth of the groove is 0.5mm to 0.9mm printed circuit board. The method of claim 1,
Printed circuit board in the shape of the groove viewed from above. The method of claim 1,
The body further comprises a connector portion connected to the other electronic device. Printed circuit board; And
Including a light emitting device package,
Wherein the printed circuit board includes:
An electrode pattern having electrical conductivity; And
It includes an insulation having a body surrounding the electrode pattern, the body including an opening that exposes a region of the electrode pattern,
The body,
A groove formed adjacent to a corner region of the opening portion,
The light emitting device package,
Light emitting device module comprising a burr formed corresponding to the groove. Lighting device comprising a light emitting device module of claim 12. A backlight unit comprising the light emitting device module of claim 12.
KR1020120000692A 2012-01-03 2012-01-03 Printed circuit board KR20130079921A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020120000692A KR20130079921A (en) 2012-01-03 2012-01-03 Printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020120000692A KR20130079921A (en) 2012-01-03 2012-01-03 Printed circuit board

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160081034A (en) * 2014-12-30 2016-07-08 엘지디스플레이 주식회사 Backlight unit
JP2019067903A (en) * 2017-09-29 2019-04-25 日亜化学工業株式会社 Light emitting device and method of manufacturing the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160081034A (en) * 2014-12-30 2016-07-08 엘지디스플레이 주식회사 Backlight unit
JP2019067903A (en) * 2017-09-29 2019-04-25 日亜化学工業株式会社 Light emitting device and method of manufacturing the same

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