KR101781047B1 - Light emitting device package - Google Patents

Abstract

An embodiment relates to a light emitting device package. A light emitting device package according to an embodiment includes a body including a cavity, first and second lead frames mounted on the body and spaced apart from each other, a light emitting element electrically connected to the first and second lead frames, And at least one reinforcing portion which is disposed on at least one of the inside and the outside of the reinforcing portion and is made of a material different from the body, and the reinforcing portion is characterized in that at least one region in the longitudinal direction corresponds to a region between the first and second lead frames . Thus, the reliability of the light emitting device package can be improved by increasing the durability.

Description

A light emitting device package

An embodiment relates to a light emitting device package.

BACKGROUND ART An LED (Light Emitting Diode) is a device that converts an electric signal into an infrared ray, a visible ray, or a light using the characteristics of a compound semiconductor. The LED is used in household appliances, remote controllers, display boards, The use area is gradually widening.

In general, miniaturized LEDs are made of a surface mounting device for mounting directly on a PCB (Printed Circuit Board) substrate, and an LED lamp used as a display device is also being developed as a surface mounting device type . Such a surface mount device can replace a conventional simple lighting lamp, which is used for a lighting indicator for various colors, a character indicator, an image indicator, and the like.

On the other hand, when the light emitting device package including the light emitting diode is formed to extend in one direction, it is necessary to secure the durability of the light emitting device package because the light emitting device package tends to break at the central region in the longitudinal direction of the light emitting device package.

It is an object of the present invention to provide a light emitting device package including a reinforcing portion and having improved durability and reliability.

A light emitting device package according to an embodiment includes a body including a cavity, first and second lead frames mounted on the body and spaced apart from each other, a light emitting element electrically connected to the first and second lead frames, And at least one reinforcing portion which is disposed on at least one of the inside and the outside of the reinforcing portion and is made of a material different from that of the body, and the reinforcing portion is characterized in that at least one region in the longitudinal direction corresponds to a region between the first and second lead frames .

The light emitting device package according to the embodiment includes the reinforcing portion to increase the durability, thereby improving the reliability.

In the light emitting device package according to the embodiment, the reinforcing portion is formed continuously with at least one of the first and second lead frames, thereby improving the heat radiation function and the reliability.

1A is a perspective view illustrating a light emitting device package according to an embodiment.
1B to 1C are cross-sectional views illustrating a light emitting device package according to an embodiment.
1D is a perspective view illustrating a light emitting device package according to an embodiment.
1E is a cross-sectional view illustrating a light emitting device package according to an embodiment.
1F to 1G are perspective views illustrating a light emitting device package according to an embodiment.
2A is a perspective view illustrating a light emitting device package according to an embodiment.
2B to 2C are cross-sectional views illustrating a light emitting device package according to an embodiment.
2D is a perspective view illustrating a light emitting device package according to an embodiment.
3 is a cross-sectional view illustrating a light emitting device package according to an embodiment.
4A is a perspective view illustrating an illumination system including a light emitting device package according to an embodiment.
4B is a cross-sectional view illustrating an illumination system including a light emitting device package according to an embodiment.
5 to 6 are exploded perspective views illustrating a liquid crystal display device including a light emitting device package according to an embodiment.

BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention and the manner of achieving them will become apparent with reference to the embodiments described in detail below with reference to the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Is provided to fully convey the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims. Thus, in some embodiments, well known process steps, well known device structures, and well-known techniques are not specifically described to avoid an undesirable interpretation of the present invention. Like reference numerals refer to like elements throughout the specification.

The terms spatially relative, "below", "beneath", "lower", "above", "upper" May be used to readily describe a device or a relationship of components to other devices or components. Spatially relative terms should be understood to include, in addition to the orientation shown in the drawings, terms that include different orientations of the device during use or operation. For example, when inverting an element shown in the figures, an element described as "below" or "beneath" of another element may be placed "above" another element. Thus, the exemplary term "below" can include both downward and upward directions. The elements can also be oriented in different directions, so that spatially relative terms can be interpreted according to orientation.

The terminology used herein is for the purpose of illustrating embodiments and is not intended to be limiting of the present invention. In the present specification, the singular form includes plural forms unless otherwise specified in the specification. It is noted that the terms "comprises" and / or "comprising" used in the specification are intended to be inclusive in a manner similar to the components, steps, operations, and / Or additions.

Unless defined otherwise, all terms (including technical and scientific terms) used herein may be used in a sense commonly understood by one of ordinary skill in the art to which this invention belongs. Also, commonly used predefined terms are not ideally or excessively interpreted unless explicitly defined otherwise.

Although the terms first, second, etc. may be used to describe various elements, components, regions, layers and / or regions, these elements. Ingredients. Areas. Layers and / or regions should not be limited by these terms.

The thickness and size of each layer in the drawings are exaggerated, omitted, or schematically shown for convenience and clarity of explanation. Also, the size of the component does not entirely reflect the actual size.

Hereinafter, embodiments will be described in detail with reference to FIGS. 1 to 6 attached hereto.

1A is a perspective view illustrating a light emitting device package according to an embodiment, FIGS. 1B through 1C are sectional views of a light emitting device package shown in FIG. 1A, FIG. 1D is a perspective view illustrating a light emitting device package according to an embodiment, FIG. 1E is a cross-sectional view of the light emitting device package shown in FIG. 1D, and FIGS. 1F to 1G are perspective views illustrating the light emitting device package according to the embodiment.

In order to describe the shape of the light emitting device package 100 according to the embodiment in detail, the longitudinal direction Z of the light emitting device package 100, the horizontal direction Y perpendicular to the longitudinal direction Z, And a height direction X perpendicular to the longitudinal direction Z and the horizontal direction Y. [

1B is a cross-sectional view of the light emitting device package 100 of FIG. 1A cut in a horizontal direction (Y) and a height direction (X) and viewed in a longitudinal direction (Z) 1D is a sectional view of the light emitting device package 100 of FIG. 1D in the horizontal direction Y and the height direction Y of the light emitting device package 100 of FIG. Sectional view taken along the longitudinal direction (Z) and cut in the direction (X).

1A to 1G, a light emitting device package 100 includes a body 110 including a cavity 120, first and second lead frames 140 and 140 mounted on the body 110 and spaced apart from each other, A light emitting device 130 electrically connected to the first and second lead frames 140 and 150 and a reinforcement 160 mounted on the body 110 and formed of a material different from the body 110 . At least one region in the longitudinal direction of the reinforcing portion 160 may be formed corresponding to a region between the first and second lead frames 140 and 150.

The body 110 may be made of a resin material such as polyphthalamide (PPA), silicon (Si), aluminum (Al), aluminum nitride (AlN), liquid crystal polymer (PSG), polyamide 9T (SPS), a metal material, sapphire (Al ₂ O ₃ ), beryllium oxide (BeO), and a printed circuit board (PCB). The body 110 may be formed by injection molding, etching, or the like, but is not limited thereto.

The body 110 may include a cavity 120 forming an inner surface of the body 110. As the cavity 120 is formed in the body 110, a wall forming the wall surface of the cavity 120 may be formed on the side surface of the body 110. An inner surface of the wall portion may be formed with an inclined surface. The reflection angle of the light emitted from the light emitting device 130 can be changed according to the angle of the inclined surface, and thus the directivity angle of the light emitted to the outside can be controlled.

Concentration of light emitted to the outside from the light emitting device 130 increases as the directional angle of light decreases. Conversely, as the directional angle of light increases, the concentration of light emitted from the light emitting device 130 to the outside decreases.

The wall portion may further include a reflective layer (not shown) on the inner side, thereby improving the brightness and the light efficiency. The reflective layer (not shown) may be formed of a metal or an alloy including at least one of silver (Ag), aluminum (Al), platinum (Pt), palladium (Pd), and copper Not. An adhesive layer (not shown) may be formed between the reflective layer (not shown) and the inner surface of the wall to reinforce the bonding force between the reflective layer and the wall. When a reflective layer (not shown) is formed on the inner surface of the wall portion, light scattering is prevented, and the light emitting efficiency of the light emitting device package 100 can be improved.

The shape of the cavity 120 formed in the body 110 may be circular, square, polygonal, elliptical, or the like, and may have a curved shape, but the present invention is not limited thereto.

The light emitting device 130 may be, for example, a light emitting diode. The light emitting diode may be, for example, a light emitting diode that emits light such as red, green, blue, or white, or a UV (Ultra Violet) light emitting diode that emits ultraviolet rays. In addition, one or more light emitting diodes may be mounted.

In addition, the light emitting diode may be a horizontal type in which all the electric terminals are formed on the upper surface, a vertical type formed on the upper and lower surfaces, or a flip chip type.

Meanwhile, a resin layer (not shown) may be formed in the cavity 120 to cover the light emitting device 130.

The resin layer (not shown) may be formed of silicon, epoxy, and other resin materials.

In addition, the resin layer (not shown) may include a fluorescent material, and the fluorescent material may be selected in a wavelength range of the light emitted from the light emitting device 130 so that the light emitting device package 100 may emit white light, . ≪ / RTI >

The phosphor may be one of a blue light emitting phosphor, a blue light emitting phosphor, a green light emitting phosphor, a yellow light emitting phosphor, a yellow light emitting phosphor, a yellow red light emitting phosphor, an orange light emitting phosphor, and a red light emitting phosphor depending on the wavelength of light emitted from the light emitting device 130. , But is not limited thereto.

That is, the phosphor may be excited by the light having the first light emitted from the light emitting device 130 to generate the second light. For example, when the light emitting element 130 is a blue light emitting diode and the phosphor is a yellow phosphor, the yellow phosphor may be excited by blue light to emit yellow light, and blue light and blue light emitted from the blue light emitting diode As the excited yellow light is excited, the light emitting device package 100 can provide white light. Also, the light emitting device package 100 may provide green light, blue light, and the like, but is not limited thereto.

Similarly, when the light emitting device 130 is a green light emitting diode, a magenta fluorescent substance or a mixture of blue and red fluorescent materials is used. When the light emitting device 130 is a red light emitting diode, a cyan fluorescent material or a mixture of blue and green fluorescent materials For example.

Such a fluorescent material may be a known fluorescent material such as a YAG, TAG, sulfide, silicate, aluminate, nitride, carbide, nitridosilicate, borate, fluoride or phosphate.

The first and second lead frames 140 and 150 may be disposed at both longitudinally opposite lateral regions of the light emitting device package 100 and may be bent at least once more as shown in FIG. But it is not limited thereto. The first lead frame 140 and the second lead frame 150 may be separated from each other and electrically separated as shown in FIG. 1C, and the first and second lead frames 140 and 150 may be spaced apart in the longitudinal direction Can be formed.

The first and second lead frames 140 and 150 may be formed of a metal material such as titanium, copper, nickel, gold, chromium, tantalum, (Pt), tin (Sn), silver (Ag), phosphorus (P), aluminum (Al), indium (In), palladium (Pd), cobalt (Co), silicon (Si), germanium , Hafnium (Hf), ruthenium (Ru), and iron (Fe). Further, the first and second lead frames 140 and 150 may be formed to have a single layer or a multi-layer structure, and the first and second lead frames 140 and 150 or several lead frames And the like), but the present invention is not limited thereto.

The light emitting device 130 may be electrically connected to the first and second lead frames 140 and 150. For example, the light emitting device 130 may be mounted on the first lead frame 140 and the light emitting device 130 and the second lead frame 150 may be wire-bonded by wires (not shown).

The first and second lead frames 140 and 150 may be separated from each other and electrically separated from each other. The first and second lead frames 140 and 150 and the light emitting device 130 may be directly connected to each other or may be connected by wire bonding through a conductive wire. The first and second lead frames 140 and 150 are respectively protruded to the outside of the body 110 to be electrically connected to an external power source. The first and second lead frames 140 and 150 protruded to the outside may have various shapes and may be bent in various shapes. When an external power source is connected to the first and second lead frames 140 and 150, power may be applied to the light emitting device 130.

The reinforcing portion 160 may be disposed outside the body 110 to expose at least one region as shown in FIGS. 1A, 1F, and 1G, or may be disposed outside the body 110 as shown in FIGS. 1D and 1E, But it is not limited thereto.

Although the reinforcing portion 160 is shown as a rectangular plate in FIGS. 1A to 1G, the reinforcing portion 160 may have a circular or polygonal shape, or may have a concavo-convex portion (not shown), a perforated But it is not limited thereto.

At least one region in the longitudinal direction of the reinforcing portion 160 may be disposed to correspond to the region A between the first lead frame 140 and the second lead frame 150. [ Therefore, it is possible to compensate for a defect in which cracks are generated in the region A where the strength is weak.

1B, 1E, and 1G illustrate side views in the horizontal direction. Each of the reinforcing portions 160 may be exposed to the outside of the body 110 (FIG. 1B) (FIG. 1G) and may be located inside the body 110 (FIG. 1E)

 The reinforcing portion 160 may be formed of a material different from that of the body 110. Preferably, the reinforcing portion 160 may include at least one of a metal material and an insulating material, but is not limited thereto .

1E and 1E, the reinforcing portion 160 is formed in one region of the longitudinal center portion of the body 110. However, as shown in FIGS. 1F and 1G, the reinforcing portion 160 is formed in the body 110 , Or may be formed over any area of the body 110, but is not limited thereto. The reinforcing portion 160 may be formed so as to correspond to at least a portion of the side surface of the region A between the first lead frame 140 and the second lead frame 150 even if the reinforcing portion 160 is formed over an arbitrary region of the body 110. [ It may be preferable to be formed in an arbitrary region of the body 110.

Preferably, as shown in FIG. 1F and FIG. 1G, when the reinforcing portion 160 is made of a metal, electrical shorting of the first and second lead frames 140 and 150 through the reinforcing portion 160 is prevented The reinforcing portion 160 and the first and second lead frames 140 and 150 may be spaced apart from each other.

1G, the reinforcing portion 160 is formed so as to correspond to the region A between the first lead frame 140 and the second lead frame 150 in the height direction X The region can be formed to be further enlarged. In order to further improve the reinforcing function, the reinforcing portion 160 may be further expanded in the horizontal direction Y of the body as shown in FIG. 1G. That is, the reinforcing portion 160 may increase the thickness in the horizontal direction (Y) to reinforce the strength of the region A when more reinforcing strength is required in the horizontal direction (Y).

1G, the reinforcing portion 160 is formed in a region corresponding to the region A between the first lead frame 140 and the second lead frame 150 at the time of cutting in the longitudinal direction Z, Sectional area of the other region may be larger than the cross-sectional area of the other region.

That is, the reinforcing portion 160 is formed to be higher in the height direction X at a portion corresponding to the region A between the first lead frame 140 and the second lead frame 150, The area of the region corresponding to the side surface of the region between the first lead frame 140 and the second lead frame 150 can be increased. Thus, the strength of the region between the first lead frame 140 and the second lead frame 150 can be further reinforced.

Therefore, when the light emitting device package 100 is cut in the height direction X and the longitudinal direction Z, the reinforcing portion 160 can be formed in a shape corresponding to the region A when viewed from the cross section in the horizontal direction Y The cross-sectional area of the portion can be made wider, and the cross-sectional area of the remaining portion can be formed to be relatively narrower.

Specifically, since cracks can occur due to the space between the first lead frame 140 and the second lead frame 150, the strength between the first lead frame 140 and the second lead frame 150 The reinforcing portion 160 may be formed to correspond to an area between the first lead frame 140 and the second lead frame 150 to reinforce the first lead frame 140 and the second lead frame 150. [

A reinforcement 160 is formed on the inside or the outside of the body 110 and is disposed in a longitudinal direction corresponding to an area A between the first lead frame 140 and the second lead frame 150, And the second lead frame 150 can be reinforced. That is, since the first and second lead frames 140 and 150 are not formed, the strength of the weak region is reinforced, so that the durability of the body 110 can be improved. Accordingly, the durability and reliability of the light emitting device package 100 can be improved.

In addition, the reinforcing function can be further improved by increasing the thickness of the reinforcing portion 160 in the horizontal direction Y of the body. 1D and 1E, when the reinforcing portion 160 has heat resistance and is disposed in the body 110, it is possible to prevent deterioration of the inner surface of the body 110 due to heat generated from the light emitting element 130 .

FIG. 2A is a perspective view illustrating a light emitting device package according to an embodiment, FIGS. 2B to 2C are sectional views illustrating a light emitting device package according to an embodiment, and FIG. 2D is a perspective view illustrating a light emitting device package according to an embodiment.

Referring to FIGS. 2A to 2D, the body 210 may include a groove 270 formed in at least one region, and the reinforcement 260 may be coupled to the groove 270.

The groove 270 may be formed by recessing at least one region of the body 210. The groove 270 may be formed over the entire circumference of the outer surface of the body 210, But not limited thereto.

2A and 2B, the depth of the groove 270 is set to be greater than the thickness of the reinforcing portion 260 in the horizontal direction (Y) so that the reinforcing portion 260 is entirely inserted into the body 210 .

2C, a portion of the reinforcing portion 260 may be formed to have a size smaller than the thickness of the reinforcing portion 260 so that the reinforcing portion 260 is inserted into the body 210. That is, the entire reinforcing portion 260 may be coupled into the groove 270 formed in at least a part of the periphery of the body 210. Or at least a portion of the reinforcing portion 260 protrudes in the horizontal direction Y or the longitudinal direction Z of the body 210. In this case,

On the other hand, the shape of the groove 270 may vary depending on the shape of the reinforcing portion 260, as shown in FIG. 2D. Therefore, the groove 270 corresponding to the shape of the reinforcing portion 260 may be formed, but is not limited thereto. It is preferable that the groove 270 having the best coupling force between the reinforcing portion 260 and the body 210 is formed.

The body 210 includes a groove 270 formed in at least one region and the reinforcing portion 260 is coupled to the groove 270 so that the coupling force between the body 210 and the reinforcing portion 260 can be improved.

3 is a cross-sectional view illustrating a light emitting device package according to an embodiment.

Referring to FIG. 3, the reinforcing portion 360 may be connected to the first lead frame 340.

The connection between the reinforcement 360 and the first lead frame 340 may be achieved by bending or bending the first lead frame 340 and injection molding the first lead frame 340 to reinforce the first lead frame 340 The first lead frame 340 and the reinforcing portion 360 may be formed separately by integrally forming the first lead frame 340 or by connecting a separate member (not shown) to the first lead frame 340, Not limited.

3, the first lead frame 340 may be connected to the reinforcing portion 360 or the second lead frame (not shown) may be connected to the reinforcing portion 360, and a plurality of lead frames (not shown) And a plurality of reinforcing portions 360 connected to the reinforcing portions 360 may be formed.

Since the reinforcing portion 360 is connected to the first lead frame 340, the reinforcing portion 360 can be formed and arranged more easily. The heat sink function of the first lead frame 340 can be further improved by connecting the reinforcing portion 360 to the first lead frame 340 and the heat radiation function of the light emitting device package 300 can be further improved. And reliability can be further improved.

FIG. 4A is a perspective view illustrating a lighting device including the light emitting device package according to the embodiment, and FIG. 4B is a cross-sectional view taken along the line C-C 'of the lighting device of FIG. 4A.

4B is a cross-sectional view of the lighting device 400 of FIG. 4A cut in the longitudinal direction Z and the height direction X and viewed in the horizontal direction Y. FIG.

4A and 4B, the lighting apparatus 400 may include a body 410, a cover 430 coupled to the body 410, and a finishing cap 450 positioned at both ends of the body 410 have.

The light emitting device module 440 is coupled to a lower surface of the body 410. The body 410 is electrically conductive so that heat generated from the light emitting device package 444 can be emitted to the outside through the upper surface of the body 410. [ And a metal material having an excellent heat dissipation effect.

In particular, the light emitting device package 444 includes a reinforcing portion (not shown) to improve durability and reliability, thereby enabling a more reliable lighting device 400 to be realized.

The light emitting device package 444 may be mounted on the PCB 442 in a multi-color, multi-row manner to form an array. The light emitting device package 444 may be mounted at equal intervals or may be mounted with various distances as required. As the PCB 442, MPPCB (Metal Core PCB) or FR4 material PCB can be used.

The cover 430 may be formed in a circular shape so as to surround the lower surface of the body 410, but is not limited thereto.

The cover 430 protects the internal light emitting device module 440 from foreign substances or the like. The cover 430 may include diffusion particles to prevent glare of the light generated in the light emitting device package 444 and uniformly emit light to the outside and may include at least one of an inner surface and an outer surface of the cover 430 A prism pattern or the like may be formed on one side. Further, the phosphor may be coated on at least one of the inner surface and the outer surface of the cover 430.

Since the light generated in the light emitting device package 444 is emitted to the outside through the cover 430, the cover 430 should have a high light transmittance and sufficient heat resistance to withstand the heat generated in the light emitting device package 444 The cover 430 is preferably made of a material including polyethylene terephthalate (PET), polycarbonate (PC), or polymethyl methacrylate (PMMA) Do.

The finishing cap 450 is located at both ends of the body 410 and can be used for sealing the power supply unit (not shown). In addition, the fin 450 is formed on the finishing cap 450, so that the lighting device 400 according to the embodiment can be used immediately without a separate device on the terminal from which the conventional fluorescent lamp is removed.

5 is an exploded perspective view of a liquid crystal display device according to an embodiment.

5, the liquid crystal display device 500 may include a liquid crystal display panel 510 and a backlight unit 570 for providing light to the liquid crystal display panel 510 in an edge-light manner.

The liquid crystal display panel 510 can display an image using the light provided from the backlight unit 570. The liquid crystal display panel 510 may include a color filter substrate 512 and a thin film transistor substrate 514 facing each other with a liquid crystal therebetween.

The color filter substrate 512 can realize the color of an image to be displayed through the liquid crystal display panel 510.

The thin film transistor substrate 514 is electrically connected to a printed circuit board 518 on which a plurality of circuit components are mounted via a driving film 517. The thin film transistor substrate 514 may apply a driving voltage provided from the printed circuit board 518 to the liquid crystal in response to a driving signal provided from the printed circuit board 518. [

The thin film transistor substrate 514 may include a thin film transistor and a pixel electrode formed as a thin film on another substrate of a transparent material such as glass or plastic.

The backlight unit 570 includes a light emitting device module 520 that outputs light, a light guide plate 530 that changes the light provided from the light emitting device module 520 into a surface light source and provides the light to the liquid crystal display panel 510, A plurality of films 550, 566, and 564 for uniformly distributing the luminance of light provided from the light guide plate 530 and improving vertical incidence, and a reflective sheet (not shown) for reflecting light emitted to the rear of the light guide plate 530 to the light guide plate 530 540).

The light emitting device module 520 may include a PCB substrate 522 for mounting a plurality of light emitting device packages 524 and a plurality of light emitting device packages 524 to form an array.

In particular, the light emitting device package 524 includes a reinforcing portion (not shown) to improve durability and reliability, thereby making it possible to realize a more reliable backlight unit 570.

The backlight unit 570 includes a diffusion film 566 for diffusing light incident from the light guide plate 530 toward the liquid crystal display panel 510 and a prism film 550 for enhancing vertical incidence by condensing the diffused light And may include a protective film 564 for protecting the prism film 550. [

6 is an exploded perspective view of a liquid crystal display device according to an embodiment. However, the parts shown and described in Fig. 5 are not repeatedly described in detail.

6, the liquid crystal display 600 may include a liquid crystal display panel 610 and a backlight unit 670 for providing light to the liquid crystal display panel 610 in a direct-down manner.

Since the liquid crystal display panel 610 is the same as that described with reference to FIG. 5, detailed description is omitted.

The backlight unit 670 includes a plurality of light emitting element modules 623, a reflective sheet 624, a lower chassis 630 in which the light emitting element module 623 and the reflective sheet 624 are accommodated, And a plurality of optical films 660 disposed on the diffuser plate 640.

The light emitting device module 623 may include a PCB substrate 621 for mounting a plurality of light emitting device packages 622 and a plurality of light emitting device packages 622 to form an array.

In particular, the light emitting device package 622 includes a reinforcing portion (not shown) to improve durability and reliability, thereby realizing a more reliable backlight unit 670.

The reflective sheet 624 reflects light generated from the light emitting device package 622 in a direction in which the liquid crystal display panel 610 is positioned, thereby improving light utilization efficiency.

The light emitted from the light emitting element module 623 is incident on the diffusion plate 640 and the optical film 660 is disposed on the diffusion plate 640. The optical film 660 is composed of a diffusion film 666, a prism film 650, and a protective film 664.

On the other hand, the illumination device, the liquid crystal display device, or the backlight unit (BLU) described in Figs. 4 to 6 may all be included in the illumination system.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, It should be understood that various modifications may be made by those skilled in the art without departing from the spirit and scope of the present invention.

110: body 120: cavity
140: first lead frame 160: reinforcing portion
270: Home

Claims (11)

A body including a cavity;
First and second lead frames mounted on the body and spaced apart from each other;
A light emitting element electrically connected to the first and second lead frames; And
At least one reinforcing portion disposed on at least one of the inside and the outside of the body and formed of a material different from the body; And
And a groove formed in at least one region of the body,
The reinforcing portion
At least one region in the longitudinal direction corresponds to a region between the first and second lead frames, and a width of the corresponding region is formed wider than an area of the region excluding the corresponding region,
The groove
Wherein the light emitting device package is formed over an entire circumference of an outer surface of the body. The method according to claim 1,
Wherein the reinforcing portion is made of at least one of a metal material and an insulating material. The method according to claim 1,
Wherein the reinforcing portion is formed so as to surround the periphery of the body. The method according to claim 1,
Wherein the reinforcing portion has a predetermined thickness in a horizontal direction. delete delete The method according to claim 1,
The depth of the groove
And the thickness of the reinforcing portion is equal to or deeper than the thickness of the reinforcing portion. The method according to claim 1,
The shape of the groove,
And the shape of the reinforcing portion corresponds to the shape of the reinforcing portion. The method according to claim 1,
The reinforcing portion
And at least one of the first and second lead frames. The method according to claim 1,
The reinforcing portion
Wherein the light emitting device package has at least one of a circular shape, a polygonal shape, or a concave-convex portion and a perforation. An illumination system comprising the light emitting device package according to any one of claims 1 to 4 and 10 to 10.

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