KR20120072743A - Light emitting device package - Google Patents

Abstract

PURPOSE: A light emitting device package is provided to improve reliability by increasing durability through a reinforcement unit. CONSTITUTION: A body(110) includes a cavity(120). A first lead frame is separated from a second lead frame(150). A light emitting device is electrically connected to the first lead frame and the second lead frame. A reinforcement unit(160) is arranged in an inner side or outer side of the body and is made of metal or insulation materials.

Description

Light emitting device package

An embodiment relates to a light emitting device package.

LED (Light Emitting Diode) is a device that converts an electric signal into infrared, visible light or light by using the characteristics of compound semiconductor.It is used in home appliances, remote controls, electronic signs, indicators, and various automation devices. Increasingly, the usage area is expanding.

In general, miniaturized LEDs are made of a surface mounting device for mounting directly on a PCB (Printed Circuit Board) substrate, and an LED lamp used as a display device is also being developed as a surface mounting device type . Such a surface mount device can replace a conventional simple lighting lamp, which is used for a lighting indicator for various colors, a character indicator, an image indicator, and the like.

On the other hand, when the light emitting device package including the light emitting diode is formed to extend in one direction, since damage easily occurs in the central region of the light emitting device package longitudinal direction, it is necessary to secure the durability of the light emitting device package.

An embodiment is to provide a light emitting device package including a reinforcement portion and further improved durability and reliability.

The light emitting device package according to the embodiment includes a body including a cavity, first and second lead frames mounted on the body and spaced apart from each other, a light emitting device electrically connected to the first and second lead frames, and a body. At least one reinforcement part disposed on at least one of an inner and an outer part of the body and formed of a material different from the body, wherein the reinforcement part corresponds to an area between the first and second lead frames in a longitudinal direction. It is done.

The light emitting device package according to the embodiment may include a reinforcement part to increase durability, thereby improving reliability.

In addition, in the light emitting device package according to the embodiment, the reinforcement portion is continuously formed with at least one of the first and second lead frames, thereby improving heat dissipation function and reliability.

1A is a perspective view illustrating a light emitting device package according to an embodiment.
1B to 1C are cross-sectional views illustrating a light emitting device package according to an embodiment.
1D is a perspective view illustrating a light emitting device package according to an embodiment.
1E is a cross-sectional view illustrating a light emitting device package according to an embodiment.
1F to 1G are perspective views illustrating a light emitting device package according to the embodiment.
2A is a perspective view illustrating a light emitting device package according to an embodiment.
2B to 2C are cross-sectional views illustrating a light emitting device package according to an embodiment.
2D is a perspective view showing a light emitting device package according to the embodiment.
3 is a cross-sectional view showing a light emitting device package according to the embodiment.
4A is a perspective view illustrating a lighting system including a light emitting device package according to an embodiment.
4B is a cross-sectional view illustrating a lighting system including a light emitting device package according to an embodiment.
5 to 6 are exploded perspective views showing a liquid crystal display device including a light emitting device package according to the embodiment.

Advantages and features of the present invention and methods for achieving them will be apparent with reference to the embodiments described below in detail with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in various forms, and only the present embodiments are intended to complete the disclosure of the present invention, and the general knowledge in the art to which the present invention pertains. It is provided to fully convey the scope of the invention to those skilled in the art, and the present invention is defined only by the scope of the claims. Thus, in some embodiments, well known process steps, well known device structures, and well-known techniques are not specifically described to avoid an undesirable interpretation of the present invention. Like reference numerals refer to like elements throughout.

The terms spatially relative, "below", "beneath", "lower", "above", "upper" May be used to readily describe a device or a relationship of components to other devices or components. Spatially relative terms should be understood to include, in addition to the orientation shown in the drawings, terms that include different orientations of the device during use or operation. For example, when flipping a device shown in the figure, a device described as "below" or "beneath" of another device may be placed "above" of another device. Thus, the exemplary term "below" can include both downward and upward directions. The device can also be oriented in other directions, so that spatially relative terms can be interpreted according to orientation.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. In the present specification, the singular form includes plural forms unless otherwise specified in the specification. As used herein, “comprises” and / or “comprising” refers to the presence of one or more other components, steps, operations and / or elements. Or does not exclude additions.

Unless otherwise defined, all terms (including technical and scientific terms) used in the present specification may be used in a sense that can be commonly understood by those skilled in the art. Also, commonly used predefined terms are not ideally or excessively interpreted unless explicitly defined otherwise.

Although the terms first, second, etc. may be used to describe various elements, components, regions, layers and / or regions, such elements. Ingredients. Areas. It will be appreciated that the layers and / or regions should not be limited by this term.

In the drawings, the thickness or size of each layer is exaggerated, omitted, or schematically illustrated for convenience and clarity of description. Also, the size of the component does not fully reflect its actual size.

Hereinafter, embodiments will be described in more detail with reference to FIGS. 1 to 6.

1A is a perspective view illustrating a light emitting device package according to an embodiment, FIGS. 1B to 1C are cross-sectional views of the light emitting device package shown in FIG. 1A, and FIG. 1D is a perspective view illustrating a light emitting device package according to an embodiment. 1E is a cross-sectional view of the light emitting device package illustrated in FIG. 1D, and FIGS. 1F to 1G are perspective views illustrating a light emitting device package according to an embodiment.

Hereinafter, in order to describe the shape of the light emitting device package 100 according to the embodiment in more detail, the longitudinal direction (Z) of the light emitting device package 100, the horizontal direction (Y) perpendicular to the longitudinal direction (Z), The height direction X perpendicular to the longitudinal direction Z and the horizontal direction Y will be described.

That is, FIG. 1B is a cross-sectional view of the light emitting device package 100 of FIG. 1A cut in the horizontal direction (Y) and the height direction (X) and viewed in the longitudinal direction (Z), and FIG. 1C is the light emitting device package of FIG. (100) is a cross-sectional view cut in the plane of the height direction (X) and the longitudinal direction (Z), and viewed in the horizontal direction (Y), Figure 1E is a light emitting device package 100 of Figure 1D in the horizontal direction (Y) and height It is sectional drawing cut in the surface of the direction X, and viewed in the longitudinal direction Z.

1A to 1G, the light emitting device package 100 includes a body 110 including a cavity 120, and first and second lead frames 140 mounted on the body 110 and spaced apart from each other. 150, a light emitting device 130 electrically connected to the first and second lead frames 140 and 150, and a reinforcement part 160 mounted on the body 110 and formed of a material different from that of the body 110. Include. In addition, the reinforcement unit 160 may be formed by at least one region corresponding to a region between the first and second lead frames 140 and 150 in the longitudinal direction.

The body 110 is made of a resin material such as polyphthalamide (PPA), silicon (Si), aluminum (Al), aluminum nitride (AlN), photosensitive glass (PSG), polyamide 9T (PA9T) ), Neo geotactic polystyrene (SPS), a metal material, sapphire (Al ₂ O ₃ ), beryllium oxide (BeO), may be formed of at least one of a printed circuit board (PCB, Printed Circuit Board). The body 110 may be formed by injection molding, etching, or the like, but is not limited thereto.

The body 110 may include a cavity 120 forming an inner surface of the body 110. As the cavity 120 is formed in the body 110, a wall portion forming the wall surface of the cavity 120 may be formed on the side surface of the body 110. An inclined surface may be formed on the inner surface of the wall portion. The angle of reflection of the light emitted from the light emitting device 130 may vary according to the angle of the inclined surface, thereby adjusting the directivity of the light emitted to the outside.

As the directivity of the light decreases, the concentration of light emitted from the light emitting device 130 to the outside increases. On the contrary, the greater the directivity of the light, the less the concentration of light emitted from the light emitting device 130 to the outside.

The wall portion may further include a reflective layer (not shown) on the inner side surface, thereby improving the luminous intensity and light efficiency. The reflective layer (not shown) may be formed of a metal or an alloy including at least one of silver (Ag), aluminum (Al), platinum (Pt), palladium (Pd), or copper (Cu) having high reflectance, and the like. Not. Meanwhile, an adhesive layer (not shown) may be formed between the reflective layer (not shown) and the inner surface of the wall portion to enhance the interface bonding force, but is not limited thereto. If a reflective layer (not shown) is formed on the inner side of the wall portion, light scattering may be prevented to improve light emission efficiency of the light emitting device package 100.

On the other hand, the shape of the cavity 120 formed on the body 110 as viewed from above may be circular, rectangular, polygonal, elliptical, or the like, and may have a curved shape, but is not limited thereto.

The light emitting device 130 may be, for example, a light emitting diode. The light emitting diode may be, for example, a light emitting diode emitting light of red, green, blue, white, or the like, or an ultraviolet (Ultra Violet) light emitting diode emitting ultraviolet light, but is not limited thereto. In addition, one or more light emitting diodes may be mounted.

In addition, the light emitting diode may be a horizontal type in which all of its electrical terminals are formed on the upper surface, or may be a vertical type or a flip chip type formed on the upper and lower surfaces.

Meanwhile, the resin layer (not shown) may be formed in the cavity 120 to cover the light emitting device 130.

The resin layer (not shown) may be formed of silicon, epoxy, and other resin materials.

In addition, the resin layer (not shown) may include a phosphor, and the kind of the phosphor is selected by the wavelength of the light emitted from the light emitting device 130 so that the light emitting device package 100 may have white light, blue light, or any color. Can be implemented.

The phosphor is one of a blue light emitting phosphor, a blue green light emitting phosphor, a green light emitting phosphor, a yellow green light emitting phosphor, a yellow light emitting phosphor, a yellow red light emitting phosphor, an orange light emitting phosphor, and a red light emitting phosphor according to a wavelength of light emitted from the light emitting element 130. Is applicable, but is not limited thereto.

That is, the phosphor may be excited by the light having the first light emitted from the light emitting device 130 to generate the second light. For example, when the light emitting element 130 is a blue light emitting diode and the phosphor is a yellow phosphor, the yellow phosphor may be excited by blue light to emit yellow light, and the blue light and blue light generated by the blue light emitting diode As the generated yellow light is mixed, the light emitting device package 100 may provide white light. In addition, the light emitting device package 100 may provide green light, blue light, and the like, but is not limited thereto.

Similarly, when the light emitting device 130 is a green light emitting diode, a magenta phosphor or a mixture of blue and red phosphors is mixed. When the light emitting device 130 is a red light emitting diode, a cyan phosphor or a blue and green phosphor is mixed. For example,

Such phosphor may be a known phosphor such as YAG, TAG, sulfide, silicate, aluminate, nitride, carbide, nitridosilicate, borate, fluoride or phosphate.

Each of the first and second lead frames 140 and 150 may be disposed at both side surfaces of the light emitting device package 100 in the longitudinal direction, and may be bent at least one or more times as shown in FIG. It may be disposed to contact the lower region, but is not limited thereto. As shown in FIG. 1C, the first lead frame 140 and the second lead frame 150 may be separated from each other and electrically separated from each other, and the first and second lead frames 140 and 150 may be spaced apart in the longitudinal direction. The region A can be formed.

The first and second lead frames 140 and 150 may be formed of a metal material, for example, titanium (Ti), copper (Cu), nickel (Ni), gold (Au), chromium (Cr), and tantalum (Ta). , Platinum (Pt), tin (Sn), silver (Ag), phosphorus (P), aluminum (Al), indium (In), palladium (Pd), cobalt (Co), silicon (Si), germanium (Ge) It may include one or more materials or alloys of hafnium (Hf), ruthenium (Ru), iron (Fe). In addition, the first and second lead frames 140 and 150 may be formed to have a single layer or a multilayer structure, and as shown, the first and second lead frames 140 and 150 or several lead frames (not shown). May be arranged, but is not limited thereto.

The light emitting device 130 may be electrically connected to the first and second lead frames 140 and 150. For example, the light emitting device 130 may be mounted on the first lead frame 140, and the light emitting device 130 and the second lead frame 150 may be wire bonded by a wire (not shown).

The first and second leadframes 140 and 150 may be spaced apart from each other and electrically separated from each other. The first and second lead frames 140 and 150 and the light emitting device 130 may be directly bonded or wire-bonded through a conductive wire. The first and second lead frames 140 and 150 protrude out of the body 110 to be electrically connected to an external power source, respectively. The first and second lead frames 140 and 150 protruding to the outside may have various shapes and may be bent in various shapes. When external power is connected to the first and second lead frames 140 and 150, power may be applied to the light emitting device 130.

The reinforcement 160 is disposed outside the body 110 so that at least one region is exposed as shown in FIGS. 1A, 1F, and 1G, or as shown in FIGS. 1D and 1E. It may be disposed inside the invisible appearance, but is not limited thereto.

In FIGS. 1A to 1G, the reinforcement part 160 is illustrated in a rectangular plate shape, but the reinforcement part 160 may have a circular or polygonal shape, or may include an uneven part (not shown), a perforation (not shown), or the like. It may have any shape, but is not limited thereto.

At least one region of the reinforcement unit 160 may be disposed to correspond to the region A between the first lead frame 140 and the second lead frame 150 in the longitudinal direction. Therefore, the defect which a crack generate | occur | produces in the area | region A of weak strength can be compensated.

1B, 1E, and 1G illustrate side views in a horizontal direction, in which the reinforcement 160 may be exposed to the outside of the body 110 (FIG. 1B), or the body may be exposed. 110 may be fitted inside (FIG. 1G), or may be located inside the body 110 (FIG. 1E).

 The reinforcement unit 160 may be formed of a material different from the material forming the body 110. Preferably, the reinforcement unit 160 may include at least one of a metal material and an insulation material, but is not limited thereto. .

Meanwhile, in FIGS. 1A to 1E, the reinforcement part 160 is illustrated to be formed in one region of the longitudinal center of the body 110, but as shown in FIGS. 1F and 1G, the reinforcement part 160 is the body 110. It may be formed over the entire circumferential region of the), or over any region of the body 110, but is not limited thereto. However, even if the reinforcement 160 is formed over an arbitrary area of the body 110, the side surface and at least a part of the area A between the first lead frame 140 and the second lead frame 150 correspond to each other. It would be desirable to be formed in any area of the body 110.

Preferably, as shown in FIGS. 1F and 1G, when the reinforcement 160 is made of metal, to prevent electrical short of the first and second lead frames 140 and 150 through the reinforcement 160. The reinforcement 160 and the first and second lead frames 140 and 150 may be spaced apart from each other.

In addition, in order to improve the reinforcement function, as shown in FIG. 1G, the reinforcement part 160 corresponds to an area A between the first lead frame 140 and the second lead frame 150 in the height direction X. The area can be formed to be further enlarged. In addition, to further improve the reinforcement function, as shown in FIG. 1G, the reinforcement part 160 may be further enlarged in the horizontal direction Y of the body. That is, the reinforcement unit 160 may increase the thickness of the A region by increasing the thickness in the horizontal direction (Y) when more reinforcing force is required in the horizontal direction (Y).

In addition, as shown in FIG. 1G, the reinforcement part 160 corresponds to an area A between the first lead frame 140 and the second lead frame 150 when cut in the longitudinal direction Z. FIG. The cross sectional area of the cross section may be larger than the cross sectional area of the other area.

That is, the reinforcement unit 160 is formed higher in the height direction X at a portion corresponding to the area A between the first lead frame 140 and the second lead frame 150, so that the first lead frame An area of the region corresponding to the side surface of the region between the 140 and the second lead frame 150 may be increased. As a result, the strength of the region between the first lead frame 140 and the second lead frame 150 may be further reinforced.

Therefore, the reinforcement unit 160 corresponds to the area A when the light emitting device package 100 is cut in the height direction (X) and the length direction (Z) when looking at the cross section in the horizontal direction (Y). The cross-sectional area of the part may be wider and the cross-sectional area of the remaining part may be formed relatively narrower.

Specifically, since cracks may occur due to the empty area between the first lead frame 140 and the second lead frame 150, the strength between the first lead frame 140 and the second lead frame 150 may be increased. In order to reinforce, the reinforcement unit 160 may be formed to correspond to an area between the first lead frame 140 and the second lead frame 150.

A reinforcement part 160 is formed inside or outside the body 110, and is disposed to correspond to an area A between the first lead frame 140 and the second lead frame 150 in the longitudinal direction, so that the first lead frame 140 is formed. ) And the strength of the region A between the second lead frame 150. That is, since the first and second lead frames 140 and 150 are not formed, the strength of the weak region may be reinforced, so that the durability of the body 110 may be improved. Therefore, durability and reliability of the light emitting device package 100 may be improved.

In addition, the thickness of the body of the reinforcing portion 160 in the horizontal direction (Y) to increase the thickness can further improve the reinforcement function. In addition, as shown in FIGS. 1D and 1E, when the reinforcement 160 has heat resistance and is disposed in the body 110, the inner surface of the body 110 may be prevented from being deteriorated by heat generated from the light emitting device 130. Can be.

Figure 2a is a perspective view showing a light emitting device package according to the embodiment, Figures 2b to 2c is a sectional view showing a light emitting device package according to the embodiment, Figure 2d is a perspective view showing a light emitting device package according to the embodiment.

2A to 2D, the body 210 may include a groove 270 formed in at least one region, and a reinforcement part 260 may be coupled to the groove 270.

The groove 270 may be formed by recessing at least one region of the body 210, and as shown in FIG. 2A, the groove 270 may be formed over the entire circumference of the outer surface of the body 210. It is not limited to this.

Meanwhile, as illustrated in FIGS. 2A and 2B, the depth of the groove 270 may be greater than or equal to the thickness in the horizontal direction Y of the reinforcement part 260 such that the reinforcement part 260 is entirely inserted into the body 210. Can be formed.

In addition, as shown in FIG. 2C, one region of the reinforcement part 260 may be formed to have a size equal to or less than a thickness of the reinforcement part 260 so as to be inserted into the body 210. That is, the entire reinforcement part 260 may be coupled into the groove 270 formed in at least a portion of the circumference of the body 210. Alternatively, only a part of the reinforcement part 260 may be directly coupled, and at least a part of the reinforcement part 260 may protrude in the horizontal direction Y or the length direction Z of the body 210.

Meanwhile, as shown in FIG. 2D, the shape of the groove 270 may vary according to the shape of the reinforcement part 260. Therefore, the groove 270 corresponding to the shape of the reinforcing portion 260 may be formed, but is not limited thereto. It is preferable that the groove 270 having the best coupling force between the reinforcement part 260 and the body 210 is formed.

The body 210 includes a groove 270 formed in at least one region, and the reinforcement part 260 is coupled to the groove 270, so that the coupling force between the body 210 and the reinforcement part 260 may be improved.

3 is a cross-sectional view showing a light emitting device package according to the embodiment.

Referring to FIG. 3, the reinforcement part 360 may be connected to the first lead frame 340.

Connection of the reinforcement part 360 and the first lead frame 340 may be performed by bending the first lead frame 340 or injection molding the bent first lead frame 340 to reinforce the first lead frame 340. The first lead frame 340 and the reinforcement part 360 may be separately formed by integrally forming the part 360 or by connecting a separate member (not shown) to the first lead frame 340. It is not limited.

Meanwhile, as shown in FIG. 3, the first lead frame 340 and the reinforcement part 360 may be connected, or the second lead frame (not shown) and the reinforcement part 360 may be connected, and several lead frames (not shown). A plurality of reinforcement parts 360 connected to) may be formed, but are not limited thereto.

Since the reinforcement part 360 is connected to the first lead frame 340, the formation and arrangement of the reinforcement part 360 may be more easily performed. In addition, since the reinforcement part 360 is connected to the first lead frame 340, the heat sink function of the first lead frame 340 may be further improved, and the heat dissipation function of the light emitting device package 300 may also be improved. And reliability can be further improved.

4A is a perspective view illustrating a lighting device including a light emitting device package according to an embodiment, and FIG. 4B is a cross-sectional view illustrating a C-C ′ cross section of the lighting device of FIG. 4A.

That is, FIG. 4B is a cross-sectional view of the lighting device 400 of FIG. 4A cut in the plane of the longitudinal direction Z and the height direction X, and viewed in the horizontal direction Y. As shown in FIG.

4A and 4B, the lighting device 400 may include a body 410, a cover 430 fastened to the body 410, and a closing cap 450 positioned at both ends of the body 410. have.

The light emitting device module 440 is fastened to the lower surface of the body 410, and the body 410 is conductive so that heat generated from the light emitting device package 444 can be discharged to the outside through the upper surface of the body 410. And it may be formed of a metal material having an excellent heat dissipation effect.

In particular, the light emitting device package 444 may include a reinforcing part (not shown) to improve durability and reliability, thereby enabling a more reliable lighting device 400 to be implemented.

The light emitting device package 444 may be mounted on the PCB 442 in multiple colors and in multiple rows to form an array. The light emitting device package 444 may be mounted at the same interval or may be mounted with various separation distances as necessary to adjust brightness. As the PCB 442, a metal core PCB (MPPCB) or a PCB made of FR4 may be used.

The cover 430 may be formed in a circular shape to surround the lower surface of the body 410, but is not limited thereto.

The cover 430 protects the light emitting device module 440 from the outside and the like. In addition, the cover 430 may include diffusing particles to prevent glare of the light generated from the light emitting device package 444 and to uniformly emit light to the outside, and may also include at least one of an inner surface and an outer surface of the cover 430. A prism pattern or the like may be formed on either side. In addition, a phosphor may be applied to at least one of an inner surface and an outer surface of the cover 430.

On the other hand, since the light generated from the light emitting device package 444 is emitted to the outside through the cover 430, the cover 430 should have excellent light transmittance, and has sufficient heat resistance to withstand the heat generated from the light emitting device package 444. The cover 430 is preferably formed of a material including polyethylene terephthalate (PET), polycarbonate (PC), polymethyl methacrylate (PMMA), or the like. Do.

Closing cap 450 is located at both ends of the body 410 may be used for sealing the power supply (not shown). In addition, the closing cap 450 has a power pin 452 is formed, the lighting device 400 according to the embodiment can be used immediately without a separate device in the terminal from which the existing fluorescent light is removed.

5 is an exploded perspective view of a liquid crystal display according to an embodiment.

5 is an edge-light method, and the liquid crystal display 500 may include a liquid crystal display panel 510 and a backlight unit 570 for providing light to the liquid crystal display panel 510.

The liquid crystal display panel 510 may display an image by using light provided from the backlight unit 570. The liquid crystal display panel 510 may include a color filter substrate 512 and a thin film transistor substrate 514 facing each other with a liquid crystal interposed therebetween.

The color filter substrate 512 may implement colors of an image displayed through the liquid crystal display panel 510.

The thin film transistor substrate 514 is electrically connected to the printed circuit board 518 on which a plurality of circuit components are mounted through the driving film 517. The thin film transistor substrate 514 may apply a driving voltage provided from the printed circuit board 518 to the liquid crystal in response to the driving signal provided from the printed circuit board 518.

The thin film transistor substrate 514 may include a thin film transistor and a pixel electrode formed of a thin film on another substrate of a transparent material such as glass or plastic.

The backlight unit 570 may convert the light provided from the light emitting device module 520, the light emitting device module 520 into a surface light source, and provide the light guide plate 530 to the liquid crystal display panel 510. Reflective sheet for reflecting the light emitted from the rear of the light guide plate 530 and the plurality of films 550, 566, 564 to uniform the luminance distribution of the light provided from the 530 and improve the vertical incidence ( 540.

The light emitting device module 520 may include a PCB substrate 522 so that a plurality of light emitting device packages 524 and a plurality of light emitting device packages 524 may be mounted to form an array.

In particular, the light emitting device package 524 may include a reinforcing part (not shown) to improve durability and reliability, thereby enabling a more reliable backlight unit 570 to be implemented.

Meanwhile, the backlight unit 570 includes a diffusion film 566 for diffusing light incident from the light guide plate 530 toward the liquid crystal display panel 510, and a prism film 550 for condensing the diffused light to improve vertical incidence. ), And may include a protective film 564 to protect the prism film 550.

6 is an exploded perspective view of a liquid crystal display according to an embodiment. However, the parts shown and described in Fig. 5 are not repeatedly described in detail.

6 is a direct view, the liquid crystal display device 600 may include a liquid crystal display panel 610 and a backlight unit 670 for providing light to the liquid crystal display panel 610.

Since the liquid crystal display panel 610 is the same as that described with reference to FIG. 5, a detailed description thereof will be omitted.

The backlight unit 670 may include a plurality of light emitting device modules 623, a reflective sheet 624, a lower chassis 630 in which the light emitting device modules 623 and the reflective sheet 624 are accommodated, and an upper portion of the light emitting device module 623. It may include a diffusion plate 640 and a plurality of optical film 660 disposed in the.

LED Module 623 A plurality of light emitting device packages 622 and a plurality of light emitting device packages 622 may be mounted to include a PCB substrate 621 to form an array.

In particular, the light emitting device package 622 includes a reinforcement part (not shown), thereby improving durability and reliability, thereby enabling a more reliable backlight unit 670 to be implemented.

The reflective sheet 624 reflects the light generated from the light emitting device package 622 in the direction in which the liquid crystal display panel 610 is positioned to improve light utilization efficiency.

On the other hand, the light generated from the light emitting device module 623 is incident on the diffusion plate 640, the optical film 660 is disposed on the diffusion plate 640. The optical film 660 includes a diffusion film 666, a prism film 650, and a protective film 664.

Meanwhile, all of the lighting apparatus, the liquid crystal display, or the backlight unit BLU described with reference to FIGS. 4 to 6 may be included in the lighting system.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, It should be understood that various modifications may be made by those skilled in the art without departing from the spirit and scope of the present invention.

110: body 120: cavity
140: first lead frame 160: reinforcement
270: home

Claims (10)

A body including a cavity;
First and second lead frames mounted on the body and spaced apart from each other;
A light emitting device electrically connected to the first and second lead frames; And
And at least one reinforcing part disposed on at least one of the inside and the outside of the body and formed of a material different from the body.
The reinforcing part of the light emitting device package, characterized in that at least one area in the longitudinal direction corresponding to the area between the first and second lead frame. The method of claim 1,
The reinforcing part, the light emitting device package consisting of at least one of a metal material or an insulating material. The method of claim 1,
The reinforcing part, the light emitting device package formed to surround the circumference of the body. The method of claim 1,
The reinforcing part of the light emitting device package having a predetermined thickness in the horizontal direction. The method of claim 1,
The reinforcing part, the area of the light emitting device package is wider than the area of the area excluding the corresponding area. The method of claim 1,
The body includes a groove formed in at least one region,
The reinforcement part is a light emitting device package coupled to the groove. The method according to claim 6,
The depth of the groove,
The light emitting device package is equal to or deeper than the thickness of the reinforcement. The method according to claim 6,
The shape of the groove,
The light emitting device package corresponding to the shape of the reinforcing portion. The method of claim 1,
The reinforcement part,
The light emitting device package is connected to at least one of the first and second lead frame. 10. An illumination system comprising the light emitting device package of any one of claims 1-9.

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