KR101978942B1 - Light Emitting Device Package - Google Patents

Abstract

A light emitting device package according to an embodiment of the present invention includes a body having a cavity in which the light source unit is located; A lead frame supplying power to the light source unit and forming at least one region of a bottom surface of the cavity; And at least two engaging portions inserted into the groove formed in the substrate and opposed to each other, wherein the engaging portions extend downward of the body; And a bent portion that is connected to one end of the extended portion and is bent in the direction of the facing coupling portion and inserted into the groove.

Description

[0001] Light Emitting Device Package [0002]

The present invention relates to a light emitting device package, and more particularly, to a light emitting device package that prevents tilting of a light emitting device package and is easy to assemble.

As a typical example of a light emitting device, a light emitting diode (LED) is a device for converting an electric signal into an infrared ray, a visible ray, or a light using the characteristics of a compound semiconductor, and is used for various devices such as household appliances, remote controllers, Automation equipment, and the like, and the use area of LEDs is gradually widening.

In general, miniaturized LEDs are made of a surface mounting device for mounting directly on a PCB (Printed Circuit Board) substrate, and an LED lamp used as a display device is also being developed as a surface mounting device type . Such a surface mount device can replace a conventional simple lighting lamp, which is used for a lighting indicator for various colors, a character indicator, an image indicator, and the like.

As the use area of the LED is widened as described above, it is important to increase the luminance of the LED as the brightness required for a lamp used in daily life and a lamp for a structural signal is increased.

On the other hand, such a light emitting device is provided in the package, and the light emitting device package is coupled to the substrate.

The present invention provides a light emitting device package having improved bonding strength with a substrate to be solved and easy to be bonded.

According to an aspect of the present invention, there is provided a light emitting device package comprising: a body having a cavity in which the light source unit is located; A lead frame supplying power to the light source unit and forming at least one region of a bottom surface of the cavity; And at least two engaging portions inserted into the groove formed in the substrate and opposed to each other, wherein the engaging portions extend downward of the body; And a bent portion that is connected to one end of the extended portion and is bent in the direction of the facing coupling portion and inserted into the groove.

In an embodiment, the light emitting device package includes a coupling portion to prevent tilting of the light emitting device package.

In addition, there is an advantage of excellent heat dissipation generated in the light source portion by using the metal coupling portion.

In addition, since the coupling portion is fitted to the substrate, the bonding force between the light emitting device package and the substrate is excellent, and the operation of applying the solder using the mask to the substrate can be omitted.

1 is a cross-sectional view illustrating a light emitting device package according to an embodiment of the present invention.
Fig. 2 is an enlarged view of the area A in Fig. 1. Fig.
3 is a cross-sectional view illustrating a light emitting device package according to another embodiment of the present invention.
4 is an exploded perspective view illustrating a light emitting device module according to an embodiment of the present invention.
5 is a perspective view illustrating a light emitting device module according to an embodiment of the present invention.
6 is a cross-sectional view illustrating a light emitting device module according to an embodiment of the present invention.
7 is a perspective view illustrating a lighting device including a light emitting device module according to an embodiment.
8 is a cross-sectional view showing a CC 'cross-section of the illumination device of FIG.
9 is an exploded perspective view of a liquid crystal display device including a light emitting device module according to an embodiment.
10 is an exploded perspective view of a liquid crystal display device including a light emitting device module according to an embodiment

BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention and the manner of achieving them will become apparent with reference to the embodiments described in detail below with reference to the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. To fully disclose the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims. Like reference numerals refer to like elements throughout the specification.

The terms spatially relative, "below", "beneath", "lower", "above", "upper" Can be used to easily describe the correlation of components with other components. Spatially relative terms should be understood as terms that include different orientations of components during use or operation in addition to those shown in the drawings. For example, when inverting an element shown in the figures, an element described as "below" or "beneath" of another element may be placed "above" another element . Thus, the exemplary term " below " can include both downward and upward directions. The components can also be oriented in different directions, so that spatially relative terms can be interpreted according to orientation.

The terminology used herein is for the purpose of illustrating embodiments and is not intended to be limiting of the present invention. In the present specification, the singular form includes plural forms unless otherwise specified in the specification. &Quot; comprises " and / or " comprising ", as used herein, unless the recited component, step, and / or step does not exclude the presence or addition of one or more other elements, steps and / I never do that.

Unless defined otherwise, all terms (including technical and scientific terms) used herein may be used in a sense commonly understood by one of ordinary skill in the art to which this invention belongs. Also, commonly used predefined terms are not ideally or excessively interpreted unless explicitly defined otherwise.

In the drawings, the thickness and the size of each component are exaggerated, omitted, or schematically shown for convenience and clarity of explanation. Also, the size and area of each component do not entirely reflect actual size or area.

Further, the angles and directions mentioned in the description of the structure of the embodiment are based on those shown in the drawings. In the description of the structures constituting the embodiments in the specification, reference points and positional relationships with respect to angles are not explicitly referred to, reference is made to the relevant drawings.

Hereinafter, the present invention will be described with reference to the drawings for explaining a light emitting device package according to embodiments of the present invention.

FIG. 1 is a cross-sectional view illustrating a light emitting device package according to an embodiment of the present invention, and FIG. 2 is an enlarged view of a region A of FIG. 1 enlarged.

1, the light emitting device package 100 according to the embodiment includes at least two light source units 110 for generating light, a body 160 having a cavity in which the light source unit 110 is located, a light source unit A lead frame 140 for supplying power to at least one region of the bottom surface of the cavity 110 and at least two engaging portions inserted and joined to the grooves formed in the substrate.

The light source unit 110 generates light. The light source unit 110 may include any configuration for generating light. The light source unit 110 may include, for example, at least one light emitting diode. The light source unit 110 may be a light emitting device that emits light such as red, green, blue, or white, or a UV (Ultra Violet) light emitting device that emits ultraviolet light. In addition, one or more light emitting elements can be mounted.

The light emitting diode is applicable to both a horizontal type whose electrical terminals are all formed on the upper surface, a vertical type formed on the upper and lower surfaces, or a flip chip.

The light source unit 110 may include at least two or more light emitting devices, and the light emitting devices may emit different colors to emit white light.

The lead frame 140 is electrically connected to the light source unit 110 to supply power to the light emitting device. The lead frame 140 may include at least two lead frames 141, 142.

Each of the lead frames 141 and 142 is made of a metal material such as titanium (Ti), copper (Cu), nickel (Ni), gold (Au), chromium (Cr), tantalum Pt, Sn, Ag, P, Al, In, Pd, Co, Si, Ge, Hf), ruthenium (Ru), iron (Fe), or the like. Further, each of the lead frames 141 and 142 may be formed to have a single layer or a multilayer structure, and two lead frames 140 and 142 or several lead frames (not shown) may be mounted And is not limited thereto.

Each of the lead frames 140 and 142 may be provided on the body 160. Each of the lead frames 141 and 142 is composed of a first lead frame 141 and a second lead frame 142. The first lead frame 140 and the second lead frame 142 may be separated from each other and electrically separated from each other. The first lead frame 141 may be in direct contact with the light source unit 110 or may be electrically connected through a conductive material.

The lead frame 140 may form at least one region of the bottom surface of the cavity. That is, the lead frame 140 may form a bottom surface of the cavity to reflect light generated in the light source unit 110 and to supply power to the light source unit 110.

For example, the first light source unit 111 may be disposed on the first lead frame 141, and may be electrically connected to the second lead frame 142 by the wire 150.

Accordingly, when power is supplied to each of the lead frames 141 and 142, power may be applied to the light source unit 110.

The body 160 has a cavity in which the lead frames 141 and 142 are exposed.

One end of each lead frame 141 and 142 is exposed to the outside of the body 160 and connected to an external power source.

The body 160 may be formed of a resin material such as polyphthalamide (PPA), silicon (Si), aluminum (Al), aluminum nitride (AlN), photo sensitive glass (PSG), polyamide 9T ), Syndiotactic polystyrene (SPS), a metal material, sapphire (Al ₂ O ₃ ), and beryllium oxide (BeO). The body 160 may be formed by injection molding, etching, or the like, but is not limited thereto.

The body 160 has a bottom portion 161 forming a bottom and a cavity formed therein, thereby forming a wall portion 162 surrounding the cavity. The inner surface of the wall portion 162 may be formed with an inclined surface. The reflection angle of the light emitted from the light source 110 can be changed according to the angle of the inclined surface, and thus the directivity angle of the light emitted to the outside can be controlled.

Concentration of the light emitted to the outside from the light source unit 110 increases as the directivity angle of light decreases. Conversely, as the directivity angle of the light increases, the concentration of light emitted from the light source unit 110 decreases.

The cavity is a space in which the light source unit 110 is located. Preferably, the bottom surface of the cavity is formed by a lead frame 140, and the side surface of the cavity is formed by a wall portion 162 of the body 160.

The width and height of the cavity are formed to be larger than the width and height of the light source unit 110.

It is preferable that a reflective material that reflects light generated from the light source unit 110 is applied on the inner surface of the wall portion 162.

A molding material 130 for covering the light source 110 and protecting the light source 110 is filled in the cavity.

The molding material 130 preferably has a shape covering the upper and side surfaces of the light source unit 110, and may have a concave upper shape and a flat upper shape. When the molding material 130 has a hemispherical shape, the directivity angle of the light emitted to the outside increases, and the concentration of the light decreases. On the contrary, when the molding material 130 has a concave shape at the top, the directivity angle of the light emitted to the outside becomes small and the light concentration increases.

The molding material 130 separates the light source unit 110 from the outside. The molding material 130 isolates the light source unit 110 from the outside to protect the light source unit 110 from external invasion or the like.

The molding material 130 may be formed of a silicone, epoxy, or other resin material having excellent water-tightness, corrosion resistance, and insulation, and may be formed in a manner of ultraviolet ray or thermosetting.

The molding material 130 may further include a plurality of phosphors 131 for converting the wavelength of light generated in the light source unit 110. The phosphors 131 may be selected in a wavelength range of light emitted from the light source unit 110 The light emitting device package 100 can realize white light.

The phosphor 131 may be a blue phosphor, a blue-green light-emitting phosphor, a green light-emitting phosphor, a yellow-green light-emitting phosphor, a yellow light-emitting phosphor, a yellow-red light-emitting phosphor, Can be applied.

That is, the phosphor 131 is excited by the light having the first light emitted from the light source unit 110 to generate the second light. For example, when the light source 110 is a blue light emitting diode and the phosphor 131 is a yellow phosphor, the yellow phosphor may be excited by blue light to emit yellow light, and blue light and blue light The light emitting device package 100 can provide white light according to the mixing of the yellow light generated by excitation by the light emitting device package 100. [

Similarly, when the light source unit 110 is a green light emitting diode, the magenta phosphor 131 or the blue and red phosphors 131 are mixed. When the light source unit 110 is a red light emitting diode, Green phosphors are mixed with each other.

The phosphor 131 may be a known phosphor 131 such as YAG, TAG, sulfide, silicate, aluminate, nitride, carbide, nitridosilicate, borate, fluoride, .

The molding material 130 may further include a light diffusing material 132 for dispersing light generated in the light source unit 110.

When the light diffusing material 132 is formed of a metal, the light extraction efficiency of the light emitting device package 100 is improved by surface plasmon resonance .

On the other hand, when the metal layer has a flat surface, the surface plasmon wave generated by excitation by light has a characteristic that it is not propagated from the metal surface to the inside or outside. Therefore, it is necessary to radiate the surface plasmon waves to the outside through the light, so that the light diffusion material 132 may have a spherical shape.

Meanwhile, it is preferable that the metal forming the light diffusion material 132 is formed of at least one of gold, silver, copper, and aluminum having a negative dielectric constant, which facilitates the emission of electrons by an external stimulus.

The coupling portion 120 may be inserted into the groove 230 formed in the substrate 210, and two coupling portions 120 may be formed at positions facing each other. For example, two coupling portions 120 may be disposed on both ends of the light emitting device package 100 to face each other, and four coupling portions 120 may be arranged to face each other in pairs. However, the present invention is not limited to this and can have a free arrangement.

The location of the coupling portion 120 is not limited, but is preferably disposed at the lower end of the body 160. This is to provide an elastic restoring force in the direction of the engaging portion 120 located in the opposite direction.

The coupling portion 120 may be formed by extending the body 160, and the lead frame 140 may be extended. In FIG. 1, the coupling part 120 is formed by extending the lead frame 140. The engaging portion 120 is formed to extend from the body 160 as will be described later.

The engaging portion 120 may be formed of the same material as the lead frame 140. [ For example, the coupling portion 120 may be made of a metal material having elasticity. Thus, when the engaging portion 120 is coupled to the substrate 210, it provides an elastic restoring force.

The engaging portion 120 may have a shape that is inserted into the substrate 210 and hooked thereto. The shape of the coupling portion 120 is not limited. For example, the coupling portion 120 may include the extension portion 121 and the bending portion 123.

The extension portion 121 extends downwardly of the body 160. In FIG. 1, the extension portion 121 extends from the lead frame 140 and extends downwardly of the body 160. The position where the extension portion 121 is engaged is not limited and may be coupled to the side surface of the body 160 and extend downward. Of course, at this time, the engaging portion 120 may be connected to the lead frame 140.

The bent portion 123 is connected to one end of the extended portion 121 and is bent in the direction of the facing coupling portion 120. The bent portion 123 is fitted into the groove 230 formed in the substrate 210. That is, the bent portion 123 is fitted into the groove 230 formed in the substrate 210 by the elastic restoring force of the extended portion 121. Further, in order to improve the bonding strength, the bent portion 123 may be filled with solder.

Therefore, the light emitting device package 100 having the coupling portion 120 can prevent the tilting of the light emitting device package 100. [ In addition, there is an advantage that the heat generated in the light source portion is excellent by using the metal coupling portion 120.

In addition, since the coupling portion 120 is fitted to the substrate 210, the bonding force between the light emitting device package 100 and the substrate 210 is excellent and the operation of applying the solder to the substrate 210 using the mask is omitted There is an advantage that the work time can be reduced.

Referring to FIG. 2, a plurality of protrusions 125 are formed in the bent portion 123. The concavity and convexity 125 improves the frictional force between the light emitting device package 100 and the substrate 210, thereby improving the bonding force. There is no limitation on the shape of the concavity and convexity 125, but preferably the upper portion may be formed to have a sharp mountain shape. In addition, the concavities and convexities 125 also serve to improve adhesion with the solder.

The length b of the coupling part 120 may be 30% to 60% of the thickness of the substrate 210. If the length b of the coupling part 120 is shorter than 30% of the thickness of the substrate 210, the coupling force of the light emitting device package 100 to the substrate 210 may be weak, If the length is longer than 60% of the thickness of the substrate 210, the groove 230 formed in the substrate 210 is also formed to be long, so that the substrate 210 may be destroyed. The length b of the coupling part 120 is equal to the length of the extension part 121 and the length of the bending part 123 and is the length from the lower end of the body 160 to the end of the bending part 123 .

The bent portion 123 may protrude from the extended portion 121 to 50% to 100% of the width of the extended portion 121. That is, the protrusion height a of the bent portion 123 may be 50% to 100% of the width of the extended portion 121. If the projecting height a of the bent portion 123 is less than 50% of the width of the extended portion 121, the bent portion 123 is difficult to fit into the groove 230 formed in the substrate 210, 123 is greater than 100% of the width of the extended portion 121, the width of the groove 230 formed in the substrate 210 becomes too large. Here, the projecting height a of the bent portion 123 means the length from the side of the extended portion 121 to the end of the bent portion 123.

The angle? Formed by the bent portion 123 and the extending portion 121 may be 90 to 170 degrees. When the angle? Between the bent portion 123 and the extended portion 121 is less than 90, the groove 230 formed in the substrate 210 and the bent portion 123 are hardly fitted to each other by the elastic restoring force And the bent portion 123 is fitted into the groove 230 formed in the substrate 210 when the angle? Formed by the bent portion 123 and the extended portion 121 is greater than 170 degrees, the bent portion 123 Is not caught in the groove 230. [0064]

3 is a cross-sectional view illustrating a light emitting device package according to another embodiment of the present invention.

Referring to FIG. 3, the light emitting device package 100A according to the embodiment differs from the light emitting device package 100A of FIG. 1 in that the coupling portion 120A extends from the body 160. FIG. Hereinafter, differences from FIG. 1 will be mainly described.

The engaging portion 120A may extend from the body 160 and may be integrally formed with the body 160. [ At this time, the lead frame 140 is freely deformable in a range where the protruded region of the body 160 exists.

The material of the coupling portion 120A is made of the same material as that of the body.

In addition, although not shown in the drawing, a coupling portion 120 extending from the body 160 and a coupling portion 120 extending from the lead frame 140 may be included at the same time.

FIG. 4 is an exploded perspective view illustrating a light emitting device module according to an embodiment of the present invention, FIG. 5 is an assembled perspective view illustrating a light emitting device module according to an embodiment of the present invention, FIG. 6 is a cross- Fig.

The light emitting device module 200 according to the embodiment includes a substrate to which the light emitting device package and the light emitting device package are coupled.

The light emitting device package is as described above.

The substrate 210 includes an electrode pattern 220 having electrical conductivity and a main body having an insulation property and surrounding the electrode pattern 220 and having an opening 240 through which one region of the electrode pattern 220 is exposed, And a groove 230 into which the coupling portion 120 is inserted.

The main body may include a material having an insulating property. For example, the main body may be formed of FR-4, or may be formed of polyimide, liquid crystal polymer and polyester PEN (polyethylene naphthalate), PET (polyethylene terephthalate), LCP Polymer), but is not limited thereto. In addition, the body may have a thin structure or may be formed of a light-transmitting resin so that the electrode pattern 220 mounted therein may be visually perceived from the outside, but the present invention is not limited thereto. The main body may be formed of a thin plate formed of soft synthetic resin or the like, or a film or the like to form a flexible printed circuit board (FPCB), or a multilayer printed circuit board including several layers And shall not be limited to this.

On the other hand, for example, the main body includes a base layer 212 forming the base of the main body, and an insulating layer 214 formed on the base layer 212 and formed of an insulating material and an insulating layer 214 formed on the insulating layer 214, And a cover layer 216 covering the pattern 220. Although not shown in the drawing, a reinforcing member (not shown) for reinforcing the strength of the substrate 210 may further be provided under the base layer 212.

In addition, the main body may have the opening portion 240 so that at least one region of the electrode pattern 220 mounted therein may be exposed, but is not limited thereto. The electrical and electronic devices may be electrically connected to the exposed electrode pattern 220 through the opening 240, and an external power source may be supplied to the electrical and electronic devices. Here, the shape of the opening 240 is not limited, but it is usually rectangular.

On the other hand, the connector portion 218 may be disposed in at least one region of the main body.

The connector portion 218 may be disposed on at least one area on the main body as shown in FIG. 4, or may be formed such that one area of the main body protrudes to connect the other electrical and electronic devices to the substrate 210 , But not limited to. At least one region of the connector portion 218 may have an opening 240 to expose at least one region of the electrode pattern 220 to the outside. The substrate 210 is electrically connected to other electrical and electronic devices through the connector unit 218 so that electrical and electronic devices mounted on the substrate 210 can be electrically connected to other electrical and electronic devices, 210 may be powered by an electrical or electronic device.

Although not shown, the body may include a heat dissipating unit (not shown) and a via hole (not shown) for facilitating heat dissipation of electrical and electronic devices mounted on the substrate 210, Not limited.

The electrode pattern 220 may have electrical conductivity and may be mounted in the body. The electrode pattern 220 may be formed of a metal material such as titanium (Ti), copper (Cu), or the like. The electrode pattern 220 may be a thin copper film having electrical conductivity, Cu, Ni, Au, Cr, Ta, Pt, Sn, Ag, P, Al, And may include at least one material or alloy selected from the group consisting of In, Pd, Co, Si, Ge, Hf, Ru, Or an electrically conductive polymer material. The electrode pattern 220 may have a first electrode pattern 221 and a second electrode pattern 222 spaced apart from the first electrode pattern 221. However, the present invention is not limited thereto and various electrode patterns 220 may be provided.

The electrode pattern 220 may be formed by forming a conductive layer of a conductive material such as copper by sputtering, electrolytic / electroless plating, and the like, and then etching the conductive layer. However, the present invention is not limited thereto.

In addition, the electrode pattern 220 may be formed to have one layer, or may be formed to have several layers, but is not limited thereto.

For example, the electrode pattern 220 may be an electrode pattern electrically connected to an external electrical or electronic device to supply power. At least one region of the electrode pattern 220 may be exposed through the opening 240 formed in the main body and may be exposed through the opening 240 in which the electrode pattern 220 is exposed, And the electrode pattern 220 may be electrically connected to each other.

The groove 230 is formed to be inserted and coupled with the coupling portion 120. And may be formed to correspond to the shape of the coupling portion 120.

The groove 230 has a width greater than the width of the coupling portion 120 so that the coupling portion 120 can be easily fitted into the groove 230. [

FIG. 7 is a perspective view illustrating a lighting device including a light emitting device module according to an embodiment, and FIG. 8 is a cross-sectional view taken along the line C-C 'of the lighting device of FIG.

7 and 8, the lighting apparatus 600 may include a body 610, a cover 630 coupled to the body 610, and a finishing cap 650 positioned at opposite ends of the body 610 have.

A light emitting device module 640 is coupled to a lower surface of the body 610. The body 610 is electrically conductive so that heat generated from the light emitting device package 644 can be emitted to the outside through the upper surface of the body 610. [ And a metal material having an excellent heat dissipation effect.

The light emitting device package 644 may be mounted on the PCB 642 in a multi-color, multi-row manner to form an array. The light emitting device package 644 may be mounted at equal intervals or may be mounted with various spacings as required. As the PCB 642, MPPCB (Metal Core PCB) or FR4 material PCB can be used.

The light emitting device package 644 may include an extended lead frame (not shown) so as to have an improved heat dissipation function, so that the reliability and efficiency of the light emitting device package 644 can be improved. The service life of the illumination device 600 including the element package 644 can be extended.

The cover 630 may be formed in a circular shape so as to surround the lower surface of the body 610, but is not limited thereto.

The cover 630 protects the internal light emitting element module 640 from foreign substances or the like. The cover 630 may include diffusion particles so as to prevent glare of light generated in the light emitting device package 644 and uniformly emit light to the outside, and may include at least one of an inner surface and an outer surface of the cover 630 A prism pattern or the like may be formed on one side. Further, the phosphor may be applied to at least one of the inner surface and the outer surface of the cover 630.

Since the light generated in the light emitting device package 644 is emitted to the outside through the cover 630, the cover 630 must have a high light transmittance and sufficient heat resistance to withstand the heat generated in the light emitting device package 644 The cover 630 is preferably formed of a material including polyethylene terephthalate (PET), polycarbonate (PC), polymethyl methacrylate (PMMA), or the like .

The finishing cap 650 is located at both ends of the body 610 and can be used to seal the power supply unit (not shown). In addition, the finishing cap 650 is provided with the power supply pin 652, so that the lighting apparatus 600 according to the embodiment can be used immediately without a separate device on the terminal from which the conventional fluorescent lamp is removed.

9 is an exploded perspective view of a liquid crystal display device including a light emitting device module according to an embodiment.

9, the liquid crystal display 700 may include a liquid crystal display panel 710 and a backlight unit 770 for providing light to the liquid crystal display panel 710 in an edge-light manner.

The liquid crystal display panel 710 can display an image using light provided from the backlight unit 770. The liquid crystal display panel 710 may include a color filter substrate 712 and a thin film transistor substrate 714 facing each other with a liquid crystal therebetween.

The color filter substrate 712 can realize the color of an image to be displayed through the liquid crystal display panel 710.

The thin film transistor substrate 714 is electrically connected to a printed circuit board 718 on which a plurality of circuit components are mounted via a driving film 717. The thin film transistor substrate 714 may apply a driving voltage provided from the printed circuit board 718 to the liquid crystal in response to a driving signal provided from the printed circuit board 718. [

The thin film transistor substrate 714 may include a thin film transistor and a pixel electrode formed as a thin film on another substrate of a transparent material such as glass or plastic.

The backlight unit 770 includes a light emitting element module 720 that outputs light, a light guide plate 730 that changes the light provided from the light emitting element module 720 into a surface light source and provides the light to the liquid crystal display panel 710, A plurality of films 752, 766, and 764 for uniformly distributing the luminance of light provided from the light guide plate 730 and improving vertical incidence and a reflective sheet (reflective plate) for reflecting light emitted to the rear of the light guide plate 730 to the light guide plate 730 747).

The light emitting device module 720 may include a PCB substrate 722 for mounting a plurality of light emitting device packages 724 and a plurality of light emitting device packages 724 to form an array. In this case, the reliability of the mounting of the bent light emitting device package 724 can be improved.

The backlight unit 770 includes a diffusion film 766 for diffusing light incident from the light guide plate 730 toward the liquid crystal display panel 710 and a prism film 752 for enhancing vertical incidence by condensing the diffused light. , And may include a protective film 764 for protecting the prism film 750.

10 is an exploded perspective view of a liquid crystal display device including a light emitting device module according to an embodiment. However, the parts shown and described in Fig. 9 are not repeatedly described in detail.

10, the liquid crystal display device 800 may include a liquid crystal display panel 810 and a backlight unit 870 for providing light to the liquid crystal display panel 810 in a direct manner.

The liquid crystal display panel 810 is the same as that described with reference to FIG. 9, and a detailed description thereof will be omitted.

The backlight unit 870 includes a plurality of light emitting element modules 823, a reflective sheet 824, a lower chassis 830 in which the light emitting element module 823 and the reflective sheet 824 are accommodated, And a plurality of optical films 860. The diffuser plate 840 and the plurality of optical films 860 are disposed on the light guide plate 840. [

The light emitting device module 823 may include a PCB substrate 821 to mount a plurality of light emitting device packages 822 and a plurality of light emitting device packages 822 to form an array.

The reflective sheet 824 reflects light generated from the light emitting device package 822 in a direction in which the liquid crystal display panel 810 is positioned, thereby improving light utilization efficiency.

Light generated in the light emitting element module 823 is incident on the diffusion plate 840 and an optical film 860 is disposed on the diffusion plate 840. The optical film 860 may include a diffusion film 866, a prism film 850, and a protective film 864.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, It should be understood that various modifications may be made by those skilled in the art without departing from the spirit and scope of the present invention.

Claims (18)

A light source for generating light;
A body having a cavity in which the light source unit is located;
A lead frame forming at least one region of a bottom surface of the cavity; And
And at least two engaging portions at positions facing each other,
The engaging portions,
An extension extending downwardly of the body; And a bent portion connected to one end of the extended portion and bent in the direction of the facing coupling portion and disposed in the groove formed in the substrate,
Wherein the bending portion includes a plurality of irregularities,
The plurality of concavities and convexities are formed in a mountain shape having a sharp top,
The angle formed between the bent portion and the extended portion is 90 to 170 degrees,
Wherein the bent portion protrudes from the extended portion by 50% to 100% of the width of the extended portion,
Wherein a length of the coupling portion is 30% to 60% of a thickness of the substrate, delete The method according to claim 1,
Wherein the coupling portion has an elastic restoring force in the direction of another facing coupling portion. delete delete delete The method according to claim 1,
And the coupling portion is disposed around the body. The method according to claim 1,
And the coupling portion extends from the lead frame. The method according to claim 1,
And the coupling portion extends from the body. The method according to claim 1,
Wherein the coupling portion is inserted into a groove formed in the substrate.
delete delete delete delete delete delete delete delete

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