KR101735310B1 - Light Emitting Device Package - Google Patents

Light Emitting Device Package Download PDF

Info

Publication number
KR101735310B1
KR101735310B1 KR1020100099968A KR20100099968A KR101735310B1 KR 101735310 B1 KR101735310 B1 KR 101735310B1 KR 1020100099968 A KR1020100099968 A KR 1020100099968A KR 20100099968 A KR20100099968 A KR 20100099968A KR 101735310 B1 KR101735310 B1 KR 101735310B1
Authority
KR
South Korea
Prior art keywords
light emitting
emitting device
device package
lead frames
light
Prior art date
Application number
KR1020100099968A
Other languages
Korean (ko)
Other versions
KR20120038289A (en
Inventor
김재욱
Original Assignee
엘지이노텍 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지이노텍 주식회사 filed Critical 엘지이노텍 주식회사
Priority to KR1020100099968A priority Critical patent/KR101735310B1/en
Publication of KR20120038289A publication Critical patent/KR20120038289A/en
Application granted granted Critical
Publication of KR101735310B1 publication Critical patent/KR101735310B1/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Led Device Packages (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)

Abstract

A light emitting device package according to an embodiment includes a body formed with a cavity, first and second lead frames mounted on the body, a light emitting element electrically connected to the first and second lead frames, and a cavity And the body includes a depression formed in a region where the bottom surface of the cavity and the wall surface are in contact with each other, and the depression is filled with a resin material.

Description

[0001] Light Emitting Device Package [0002]

An embodiment relates to a light emitting device package.

Light Emitting Diode (LED) is a device that converts electrical signals into light by using the characteristics of compound semiconductors. It is widely used in household appliances, remote control, electric signboard, display, and various automation devices. There is a trend.

On the other hand, the light emitting device package includes a body formed of an insulating resin to form an outer appearance of the light emitting device package, and a lead frame having electrical conductivity to be mounted on the body. Reliable bonding of the body and the lead frame is an important problem in ensuring the durability, reliability, and economy of the light emitting device package.

The embodiment can increase the contact area between the body or the lead frame of the light emitting device package and the resin to thereby more reliably connect the body of the light emitting device package and the lead frame and the resin material, .

A light emitting device package according to an embodiment includes a body formed with a cavity, first and second lead frames mounted on the body, a light emitting element electrically connected to the first and second lead frames, and a cavity The body includes a depression formed in a region where the bottom surface and the wall surface of the cavity are in contact with each other, and the depression is filled with a resin material.

Further, the body includes the concave and convex portions.

Further, the lead frame includes concave and convex portions.

Further, the lead frame includes barrier ribs.

It also includes an optical sheet.

The light emitting device package according to the embodiment increases the contact area between the body or the lead frame and the resin material so that the body of the light emitting device package and the lead frame and the resin material can be more reliably combined, The reliability can be improved.

1A is a perspective view illustrating a light emitting device package according to an embodiment,
1B is a cross-sectional view illustrating a light emitting device package according to an embodiment,
2 is a cross-sectional view illustrating a light emitting device package according to an embodiment,
3 is a cross-sectional view illustrating a light emitting device package according to an embodiment,
4 is a cross-sectional view illustrating a light emitting device package according to an embodiment,
5 is a cross-sectional view illustrating a light emitting device package according to an embodiment,
6A is a perspective view showing a lighting device including a light emitting device package,
6B is a cross-sectional view illustrating a lighting device including a light emitting device package,
7 is an exploded perspective view illustrating a liquid crystal display device including a light emitting device package according to an embodiment, and FIG.
8 is an exploded perspective view illustrating a liquid crystal display device including a light emitting device package according to an embodiment.

The thickness and size of each layer in the drawings are exaggerated, omitted, or schematically shown for convenience and clarity of explanation. Also, the size of each component does not entirely reflect the actual size. The same reference numerals are used for the same components.

Hereinafter, embodiments will be described in detail with reference to the drawings.

1A to 1C are a perspective view and a cross-sectional view illustrating a light emitting device package according to an embodiment.

In order to describe the shape of the light emitting device package 100 according to the embodiment in detail, the longitudinal direction Z of the light emitting device package 600, the horizontal direction Y perpendicular to the longitudinal direction Z, And a height direction X perpendicular to the longitudinal direction Z and the horizontal direction Y. [

1B and 1C are cross-sectional views of the light emitting device package 100 of FIG. 1A cut in the longitudinal direction Z and the height direction X and viewed in the horizontal direction Y. FIG.

1A to 1C, a light emitting device package 100 includes a body 110 having a cavity 120 formed therein, first and second lead frames 140 and 150 mounted on the body 110, And a resin material 125 filled in the cavity 120 to cover the light emitting device 130. The body 110 may include a light emitting element 130 electrically connected to the first lead frame 140 and the second lead frame 140, And a depression 160 formed in an area where the inner surface of the body 110 and the lead frames 140 and 150 are in contact with each other. The depression 160 may be filled with the resin 125.

The body 110 may be made of a resin material such as polyphthalamide (PPA), silicon (Si), aluminum (Al), aluminum nitride (AlN), liquid crystal polymer (PSG), polyamide 9T (SPS), a metal material, sapphire (Al 2 O 3 ), beryllium oxide (BeO), and a printed circuit board (PCB). The body 110 may be formed by injection molding, etching, or the like, but is not limited thereto.

The inner surface of the body 110 may be formed with an inclined surface. The reflection angle of the light emitted from the light emitting device 130 can be changed according to the angle of the inclined surface, and thus the directivity angle of the light emitted to the outside can be controlled.

Concentration of light emitted to the outside from the light emitting device 130 increases as the directional angle of light decreases. Conversely, as the directional angle of light increases, the concentration of light emitted from the light emitting device 130 to the outside decreases.

The shape of the cavity 120 formed in the body 110 may be circular, square, polygonal, elliptical, or the like, and may have a curved shape, but the present invention is not limited thereto.

The light emitting device 130 is electrically connected to the first and second lead frames 140 and 150. The light emitting device 130 may be a light emitting diode.

The light emitting diode may be, for example, a colored light emitting diode that emits light such as red, green, blue, or white, or a UV (Ultra Violet) light emitting diode that emits ultraviolet light. In addition, one or more light emitting diodes may be mounted.

In addition, the light emitting diode is applicable to both a horizontal type in which all the electric terminals are formed on the upper surface, a vertical type formed in the upper and lower surfaces, or a flip chip .

The resin material 125 may be filled in the cavity 120 so as to cover the light emitting element 130.

The resin material 125 may be formed of silicon, epoxy, or other resin material. The resin material 125 may be filled in the cavity 120, and then the resin material may be ultraviolet or thermally cured.

Also, the resin material 125 may include a phosphor, and the phosphor may be selected to be a wavelength of light emitted from the light emitting device 130 so that the light emitting device package 100 may emit white light.

The phosphor may be one of a blue light emitting phosphor, a blue light emitting phosphor, a green light emitting phosphor, a yellow light emitting phosphor, a yellow light emitting phosphor, a yellow red light emitting phosphor, an orange light emitting phosphor, and a red light emitting phosphor depending on the wavelength of light emitted from the light emitting device 130. Can be applied.

That is, the phosphor may be excited by the light having the first light emitted from the light emitting device 130 to generate the second light. For example, when the light emitting element 130 is a blue light emitting diode and the phosphor is a yellow phosphor, the yellow phosphor may be excited by blue light to emit yellow light, and blue light and blue light emitted from the blue light emitting diode As the excited yellow light is excited, the light emitting device package 100 can provide white light.

Similarly, when the light emitting device 130 is a green light emitting diode, a magenta fluorescent substance or a mixture of blue and red fluorescent materials is used. When the light emitting device 130 is a red light emitting diode, a cyan fluorescent material or a mixture of blue and green fluorescent materials For example.

Such a fluorescent material may be a known fluorescent material such as a YAG, TAG, sulfide, silicate, aluminate, nitride, carbide, nitridosilicate, borate, fluoride or phosphate.

The first and second lead frames 140 and 150 may be formed of a metal material such as titanium, copper, nickel, gold, chromium, tantalum, (Pt), tin (Sn), silver (Ag), phosphorus (P), aluminum (Al), indium (In), palladium (Pd), cobalt (Co), silicon (Si), germanium , Hafnium (Hf), ruthenium (Ru), and iron (Fe). Also, the first and second lead frames 140 and 150 may have a single-layer structure or a multi-layer structure, but the present invention is not limited thereto.

The first and second lead frames 140 and 150 are separated from each other and electrically separated from each other. The light emitting device 130 is mounted on the first lead frame 140 and the first lead frame 140 can be electrically connected to the light emitting device 130 directly or through a conductive material . In addition, the second lead frame 150 may be electrically connected to the light emitting device 130 by the wire bonding 135, but is not limited thereto. Accordingly, when power is supplied to the first and second lead frames 140 and 150, power may be applied to the light emitting device 130. Meanwhile, a plurality of lead frames (not shown) may be mounted in the body 110 and each lead frame (not shown) may be electrically connected to the light emitting device (not shown).

The body 110 may include a depression 160 formed in an area where the inner surface of the body 110 and the first and second lead frames 140 and 150 are in contact with each other.

The depression 160 is formed by etching or pressing a region where the body 110 and the first and second lead frames 140 and 150 are in contact or by injection molding the body 110 in which the depression 160 is formed But not limited to,

A depression 160 is formed in a region where the body 110 and the first and second lead frames 140 and 150 are in contact with each other so that the depression 160 is filled with the resin 125, The area in which the two lead frames 140 and 150 are in contact with the resin material 125 can be further increased.

1A and 1B, a depression 160 having an arbitrary shape may be formed in several regions of the inner surface of the body 110, 1a and 1b.

The depression 160 is formed in the body 110 and the contact area between the body 110 and the first and second lead frames 140 and 150 and the resin 125 is increased by the depression 160 Accordingly, the coupling between the body 110 and the first and second lead frames 140 and 150 can be more reliably formed. In addition, since the coupling between the body 110 and the first and second lead frames 140 and 150 is reliably formed, penetration of foreign matter into the light emitting device package 100 can be more effectively prevented, The durability and reliability of the package 100 can be further improved.

Preferably, the outer surface of the depression 160 includes a rounded portion 165 as shown in FIG. The outer surface of the depression 160 includes the rounded portion 165 so that the resin 125 can be more easily filled in the depression 160. [

2 is a cross-sectional view illustrating a light emitting device package according to an embodiment.

Referring to FIG. 2, the body 210 may have a recess 260.

The concave and convex portions 260 may be formed by etching or pressing at least one region of the body 210 or by injection molding the body 210 having the concave and convex portions 260 formed therein. 2, protrusions 260 are formed on both sides of the inner surface of the body 210, but the present invention is not limited thereto. Any number and shape of protrusions and depressions (not shown) As shown in FIG.

As the area of contact between the body 210 and the resin material 225 increases as the protrusions 260 are formed in the body 210, the coupling between the body 210 and the resin material 225 is more reliably formed Therefore, the durability and the reliability of the light emitting device package 200 can be further improved because the penetration of foreign matter into the light emitting device package 200 can be more effectively prevented.

The concavo-convex portion 260 may be a negative concavo-convex portion 260 that is formed by recessing several regions of the body 210, so that the convex portion 260 is not protruded from the inner surface of the body 210. When the concave and convex portion 260 is formed as a cathode, scattering or blocking of light by the concave and convex portion 260 can be alleviated, and the luminous efficiency of the light emitting device package 200 can be improved

3 is a cross-sectional view illustrating a light emitting device package according to an embodiment.

Referring to FIG. 3, the first and second lead frames 340 and 350 may include a recess 360.

The concave and convex portions 360 may be formed by etching and pressing at least one region of the first and second lead frames 340 and 350 or the first and second lead frames 340 and 350 having the concave- But is not limited thereto. The concave and convex portion 360 may be formed of several protrusions and depressions.

3, the protrusions 360 are formed on the first and second lead frames 340 and 350. However, the lead frames 340 and 350 of the first and second lead frames 340 and 350, (Not shown) may be formed in the lead frame (not shown), and concavo-convex portions (not shown) may be formed in the respective lead frames (not shown).

As the area in which the concave and convex portions 360 are formed in the first and second lead frames 340 and 350 and the contact area between the first and second lead frames 340 and 350 and the resin material 325 increases, The coupling between the first and second lead frames 340 and 350 can be reliably formed and the penetration of foreign matter into the light emitting device package 300 can be more effectively prevented, The durability and reliability of the battery 300 can be further improved.

The concave-convex portion 360 may be formed by recessing several regions of the first and second lead frames 340 and 350 so that the first and second lead frames 340 and 350 are not protruded from the surface of the first and second lead frames 340 and 350, And may be a concave / convex portion 360. When the concave and convex portion 360 is formed as a cathode, scattering or blocking of light by the concave and convex portions 360 can be mitigated, so that the luminous efficiency of the light emitting device package 300 can be improved.

4 is a cross-sectional view illustrating a light emitting device package according to an embodiment.

Referring to FIG. 4, the light emitting device package 400 may include a partition 470 formed between a region where the concave and convex portions 460 are formed and a region where the light emitting device 430 is mounted.

The barrier ribs 470 may be formed continuously with the first and second lead frames 440 and 450 and may be formed by etching or pressing the first and second lead frames 440 and 450, And may be formed by injection molding the first and second lead frames 440 and 450, but is not limited thereto.

The partition walls 470 are formed in the first and second lead frames 440 and 450 to prevent light scattering or loss by the concave and convex portions 460 formed in the first and second lead frames 440 and 450 Emitting efficiency of the light emitting device package 400 can be improved. The height of the barrier ribs 470 may be lower than the height of the light emitting device 430. If the height of the barrier ribs 470 is lower than the height of the light emitting device 430, the light generated from the light emitting device 430 can be prevented from being excessively blocked by the barrier ribs 470.

Preferably, the inner surface of the partition wall 470 may include an inclined surface. The inclined surface may form an angle with the bottom surface of the cavity 420 and is not limited as shown in FIG. It is possible to prevent the light generated from the light emitting device 430 from being scattered by the barrier ribs 470 and to improve the luminous efficiency of the light emitting device package 400 by forming the inclined surface on the inner surface of the partition wall 470 have.

5 is a cross-sectional view illustrating a light emitting device package according to an embodiment.

Referring to FIG. 5, the light emitting device package 500 may include an optical sheet 580, and the optical sheet 580 may include a base portion 582 and a prism pattern 584. FIG.

The base portion 582 is made of a transparent material having excellent thermal stability as a support for forming the prism pattern 584 and is made of, for example, polyethylene terephthalate, polycarbonate, polypropylene, polyethylene, polystyrene, But the present invention is not limited thereto.

Further, the base portion 582 may include a phosphor (not shown). For example, the base portion 582 can be formed by curing the fluorescent material (not shown) evenly dispersed in the material forming the base portion 582. When the base portion 582 is formed as described above, the phosphor (not shown) can be uniformly distributed throughout the base portion 582. Meanwhile, the phosphor may be unevenly distributed along the concave-convex portion 560 formed on the body 510 and the concave-convex portion 570 formed on the first and second lead frames 540 and 550. Accordingly, when the optical sheet 580 including the phosphor is attached to the light emitting device package 100, uniformity and distribution of light of the light emitting device package 500 can be improved.

On the other hand, a three-dimensional prism pattern 584 for refracting and condensing light may be formed on the base portion 582. The material constituting the prism pattern 584 may be acrylic resin, but is not limited thereto.

The prism patterns 584 include a plurality of linear prisms arranged in parallel with one another along one direction on one side of the base portion 582 and the vertical section with respect to the axial direction of the linear prism may be triangular.

When the optical sheet 580 is attached to the light emitting device package 500 of FIG. 5, the straightness of the light is improved and the luminance of the light emitted from the light emitting device package 500 is increased by the prism pattern 584 Can be improved.

Meanwhile, the prism pattern 584 may include a phosphor (not shown).

The phosphors (not shown) are dispersed in the prism pattern 584 to form a prism pattern 584, for example, mixed with an acrylic resin to form a paste or a slurry state, .

When a phosphor (not shown) is included in the prism pattern 584, the uniformity and distribution of the light of the light emitting device package 500 is improved, and in addition to the light focusing effect by the prism pattern 584, The orientation angle of the light emitting device package 500 can be improved.

FIG. 6A is a perspective view illustrating a lighting device including a light emitting device package according to an embodiment, and FIG. 6B is a cross-sectional view taken along the line C-C 'of the lighting device of FIG. 6A.

6A and 6B, the lighting device 600 may include a body 610, a cover 630 coupled to the body 610, and a finishing cap 650 positioned at opposite ends of the body 610 have.

A light emitting device module 640 is coupled to a lower surface of the body 610. The body 610 is electrically conductive so that heat generated from the light emitting device package 644 can be emitted to the outside through the upper surface of the body 610. [ And a metal material having an excellent heat dissipation effect.

The light emitting device package 644 may be mounted on the PCB 642 in a multi-color, multi-row manner to form an array. The light emitting device package 644 may be mounted at equal intervals or may be mounted with various spacings as required. As the PCB 642, MPPCB (Metal Core PCB) or FR4 material PCB can be used.

Particularly, the light emitting device package 644 includes a resin material (not shown) and a body (not shown) including a recessed portion (not shown) or a recessed portion (not shown) in an inner surface of a body (Not shown) and a lead frame (not shown) are formed more reliably, and penetration of foreign matter or the like from the outside is more effectively prevented, so that reliability and durability can be improved.

The light emitting device package 644 may include an extended lead frame (not shown) so as to have an improved heat dissipation function, so that the reliability and efficiency of the light emitting device package 644 can be improved. The service life of the illumination device 600 including the element package 644 can be extended.

The cover 630 may be formed in a circular shape so as to surround the lower surface of the body 610, but is not limited thereto.

The cover 630 protects the internal light emitting element module 640 from foreign substances or the like. The cover 630 may include diffusion particles so as to prevent glare of light generated in the light emitting device package 644 and uniformly emit light to the outside, and may include at least one of an inner surface and an outer surface of the cover 630 A prism pattern or the like may be formed on one side. Further, the phosphor may be applied to at least one of the inner surface and the outer surface of the cover 630.

Since the light generated in the light emitting device package 644 is emitted to the outside through the cover 630, the cover 630 must have a high light transmittance and sufficient heat resistance to withstand the heat generated in the light emitting device package 644 The cover 630 is preferably formed of a material including polyethylene terephthalate (PET), polycarbonate (PC), polymethyl methacrylate (PMMA), or the like .

The finishing cap 650 is located at both ends of the body 610 and can be used to seal the power supply unit (not shown). In addition, the finishing cap 650 is provided with the power supply pin 652, so that the lighting apparatus 600 according to the embodiment can be used immediately without a separate device on the terminal from which the conventional fluorescent lamp is removed.

7 is an exploded perspective view of a liquid crystal display device including a light emitting device package according to an embodiment.

7, the liquid crystal display 700 may include a liquid crystal display panel 710 and a backlight unit 770 for providing light to the liquid crystal display panel 710 in an edge-light manner.

The liquid crystal display panel 710 can display an image using light provided from the backlight unit 770. The liquid crystal display panel 710 may include a color filter substrate 712 and a thin film transistor substrate 714 facing each other with a liquid crystal therebetween.

The color filter substrate 712 can realize the color of an image to be displayed through the liquid crystal display panel 710.

The thin film transistor substrate 714 is electrically connected to a printed circuit board 718 on which a plurality of circuit components are mounted via a driving film 717. The thin film transistor substrate 714 may apply a driving voltage provided from the printed circuit board 718 to the liquid crystal in response to a driving signal provided from the printed circuit board 718. [

The thin film transistor substrate 714 may include a thin film transistor and a pixel electrode formed as a thin film on another substrate of a transparent material such as glass or plastic.

The backlight unit 770 includes a light emitting element module 720 that outputs light, a light guide plate 730 that changes the light provided from the light emitting element module 720 into a surface light source and provides the light to the liquid crystal display panel 710, A plurality of films 750, 766, and 764 for uniformly distributing the luminance of light provided from the light guide plate 730 and improving vertical incidence and a reflective sheet (not shown) for reflecting the light emitted to the rear of the light guide plate 730 to the light guide plate 730 740).

The light emitting device module 720 may include a PCB substrate 722 for mounting a plurality of light emitting device packages 724 and a plurality of light emitting device packages 724 to form an array.

Particularly, the light emitting device package 724 includes a resin material (not shown) and a body (not shown) including a recessed portion (not shown) or a recessed portion (not shown) in an inner surface of a body (Not shown) and a lead frame (not shown) are formed more reliably, and penetration of foreign matter or the like from the outside is more effectively prevented, so that reliability and durability can be improved.

The backlight unit 770 includes a diffusion film 766 for diffusing light incident from the light guide plate 730 toward the liquid crystal display panel 710 and a prism film 750 for enhancing vertical incidence by condensing the diffused light , And may include a protective film 764 for protecting the prism film 750.

8 is an exploded perspective view of a liquid crystal display device including a light emitting device package according to an embodiment. However, the parts shown and described in Fig. 7 are not repeatedly described in detail.

8, the liquid crystal display device 800 may include a liquid crystal display panel 810 and a backlight unit 870 for providing light to the liquid crystal display panel 810 in a direct manner.

Since the liquid crystal display panel 810 is the same as that described with reference to FIG. 7, detailed description is omitted.

The backlight unit 870 includes a plurality of light emitting element modules 823, a reflective sheet 824, a lower chassis 830 in which the light emitting element module 823 and the reflective sheet 824 are accommodated, And a plurality of optical films 860. The diffuser plate 840 and the plurality of optical films 860 are disposed on the light guide plate 840. [

The light emitting device module 823 may include a PCB substrate 821 to mount a plurality of light emitting device packages 822 and a plurality of light emitting device packages 822 to form an array.

Particularly, the light emitting device package 822 includes a resin material (not shown) and a body (not shown) including a depression (not shown) or a recessed portion (not shown) in an inner surface or a lead frame (Not shown) and a lead frame (not shown) are formed more reliably, and penetration of foreign matter or the like from the outside is more effectively prevented, so that reliability and durability can be improved.

The reflective sheet 824 reflects light generated from the light emitting device package 822 in a direction in which the liquid crystal display panel 810 is positioned, thereby improving light utilization efficiency.

Light generated in the light emitting element module 823 is incident on the diffusion plate 840 and an optical film 860 is disposed on the diffusion plate 840. The optical film 860 is composed of a diffusion film 866, a prism film 850, and a protective film 864.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, It should be understood that various modifications may be made by those skilled in the art without departing from the spirit and scope of the present invention.

110: Body 125: Resin
160: depression portion 260: concave and convex portion
480: partition wall 580: optical sheet
582: base portion 584: prism pattern

Claims (13)

A body formed with a cavity;
First and second lead frames mounted on the body;
A light emitting element electrically connected to the first and second lead frames; And
And a resin filled in the cavity to cover the light emitting element,
Wherein the body includes a depression formed in an area where the inner surface of the body contacts at least one of the first and second lead frames, the depression is filled with the resin,
Wherein at least one of the first and second lead frames includes a concavo-convex portion,
A barrier rib is formed between the concave-convex portion and the light emitting element,
The height of the barrier rib is lower than the height of the light emitting device,
And a negative electrode concavo-convex portion formed by several depressions on the wall surface of the cavity. The method according to claim 1,
Wherein the depressed portion includes at least one rounded portion formed in one region. delete delete The method according to claim 1,
Wherein the concavo-convex portion is formed in a region where the first and second lead frames contact the resin material. delete delete The method according to claim 1,
Wherein the barrier rib includes an inclined surface formed in at least one region. The method according to claim 1,
Further comprising an optical sheet,
Wherein the optical sheet is disposed on an upper portion of the body. 10. The method of claim 9,
Wherein the optical sheet includes a base portion and a prism pattern formed on the base portion. 11. The method of claim 10,
Wherein the base portion or the prism pattern comprises a phosphor. A lighting device comprising the light emitting device package according to any one of claims 1, 2, 5, and 8 to 11. 12. A backlight unit comprising the light emitting device package according to any one of claims 1, 2, 5, and 8 to 11.
KR1020100099968A 2010-10-13 2010-10-13 Light Emitting Device Package KR101735310B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020100099968A KR101735310B1 (en) 2010-10-13 2010-10-13 Light Emitting Device Package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020100099968A KR101735310B1 (en) 2010-10-13 2010-10-13 Light Emitting Device Package

Publications (2)

Publication Number Publication Date
KR20120038289A KR20120038289A (en) 2012-04-23
KR101735310B1 true KR101735310B1 (en) 2017-05-29

Family

ID=46139122

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020100099968A KR101735310B1 (en) 2010-10-13 2010-10-13 Light Emitting Device Package

Country Status (1)

Country Link
KR (1) KR101735310B1 (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003282955A (en) * 2001-07-19 2003-10-03 Rohm Co Ltd Semiconductor light-emitting device having reflector case
JP2007234846A (en) * 2006-03-01 2007-09-13 Ngk Spark Plug Co Ltd Ceramic package for light-emitting element

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003282955A (en) * 2001-07-19 2003-10-03 Rohm Co Ltd Semiconductor light-emitting device having reflector case
JP2007234846A (en) * 2006-03-01 2007-09-13 Ngk Spark Plug Co Ltd Ceramic package for light-emitting element

Also Published As

Publication number Publication date
KR20120038289A (en) 2012-04-23

Similar Documents

Publication Publication Date Title
KR101659357B1 (en) Light emitting device
US8613533B2 (en) Optical sheet and light emitting device package having the same
KR101655463B1 (en) Light emitting device package and light unit having the same
KR101734539B1 (en) Light emitting device, method for fabricating the light emitting device, lighting unit comprising the light emitting device, and lighting device
KR20120045539A (en) Light emitting device package
KR101766720B1 (en) Light Emitting Device Package
KR101941512B1 (en) Light emitting device
KR20150008718A (en) Light Emitting Device Package
KR101797968B1 (en) Light Emitting Device Package
KR101781043B1 (en) Light-emitting element array
KR101724699B1 (en) Light emitting apparatus and lighting system
KR101735310B1 (en) Light Emitting Device Package
KR101824882B1 (en) Light emitting package
KR20140098523A (en) Light-emitting device
KR101877410B1 (en) Light-emitting device
KR101904263B1 (en) Light Emitting Device Package
KR101818752B1 (en) Light emitting device array
KR101781047B1 (en) Light emitting device package
KR101741613B1 (en) Light emitting device package
KR101722627B1 (en) Light Emitting Device Module
KR101778151B1 (en) Light emitting device package
KR101766717B1 (en) Light Emitting Device Package
KR101883344B1 (en) Light Emitting Device Array
KR101807097B1 (en) Light emitting device module
KR101874903B1 (en) Light emitting device module and lighting system including the same

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant