KR101781043B1 - Light-emitting element array - Google Patents

Abstract

In an embodiment, the light emitting device array according to the embodiment may easily emit heat generated between connection patterns connecting adjacent light emitting device packages. In an embodiment, the first and second light emitting device packages, the first and second light emitting device packages Wherein the printed circuit board includes a first electrode pattern on which the first light emitting device package is mounted, a second electrode pattern on which the second light emitting device package is mounted, and a second electrode pattern on which the first and second electrode patterns And a connection pattern in which a hole is formed.

Description

A light-emitting element array

Embodiments relate to a light emitting device array, and more particularly, to a light emitting device array that facilitates emitting heat generated between connection patterns connecting adjacent light emitting device packages.

As a typical example of a light emitting device, a light emitting diode (LED) is a device for converting an electric signal into an infrared ray, a visible ray, or a light using the characteristics of a compound semiconductor, and is used for various devices such as household appliances, remote controllers, Automation equipment, and the like, and the use area of LEDs is gradually widening.

In general, miniaturized LEDs are made of a surface mounting device for mounting directly on a PCB (Printed Circuit Board) substrate, and an LED lamp used as a display device is also being developed as a surface mounting device type . Such a surface mount device can replace a conventional simple lighting lamp, which is used for a lighting indicator for various colors, a character indicator, an image indicator, and the like.

As the use area of the LED is widened as described above, it is important to increase the luminance of the LED as the brightness required for a lamp used in daily life and a lamp for a structural signal is increased.

It is an object of the present invention to provide a light emitting device array which is easy to emit heat generated between connection patterns connecting adjacent light emitting device packages.

A light emitting device array according to an embodiment includes a first and a second light emitting device package, a printed circuit board on which the first and second light emitting device packages are mounted, and the printed circuit board is mounted on the first light emitting device package And a connection pattern connecting the first electrode pattern, the second electrode pattern on which the second light emitting device package is mounted, and the first and second electrode patterns and formed with holes.

The light emitting device array according to the embodiment may be formed by forming holes in a connection pattern connecting adjacent first and second light emitting device packages so that heat generated during the light emitting operation of the first and second light emitting device packages and power supply Since the heat can be discharged through the holes, there is an advantage in improving manufacturing cost and reliability.

Further, the light emitting element array according to the embodiment has an advantage that the heat radiation effect can be increased by forming the heat radiation pattern in the heat radiation holes corresponding to the holes formed on the connection pattern and the heat radiation holes.

1 is a top view of a light emitting device array according to an embodiment.
Fig. 2 is a cross-sectional view showing a cut-away surface according to the first embodiment in the direction of the light-emitting element array shown in Fig.
Figs. 3 to 14 are plan views showing various embodiments of a plane viewed from the connection pattern shown in Fig. 2 in a direction B. Fig.
Fig. 15 is a cross-sectional view showing a cut-away surface according to the second embodiment in the direction of the light-emitting element array shown in Fig.
16 is a perspective view illustrating a lighting device including a light emitting device package according to an embodiment.
17 is a cross-sectional view of a CC section of the illumination device shown in Fig.
18 is an exploded perspective view of a liquid crystal display device including the light emitting device package according to the first embodiment.
19 is an exploded perspective view of a liquid crystal display device including a light emitting device package according to the second embodiment.

Before describing an embodiment, it is to be understood that the word "on", "under" (or "on") a substrate, an area, a pad, quot ;, " on ", and " under " includes everything that is "directly" or "indirectly formed" In addition, the criteria for above or below each layer will be described with reference to the drawings.

In the drawings, the thickness and size of each layer are exaggerated, omitted, or schematically illustrated for convenience and clarity. Therefore, the size of each component does not entirely reflect the actual size.

Further, the angles and directions mentioned in the description of the structure of the light-emitting element array in the present specification are based on those described in the drawings. In the description of the structure of the light emitting element array in the specification, reference points and positional relationship with respect to angles are not explicitly referred to.

1 is a top view of a light emitting device array according to an embodiment.

1 and 2, the light emitting device array 100 includes a first through a sixth light emitting device packages 111 through 116 and first through sixth light emitting device packages 111 through 116, And may include a circuit board 120.

Here, the printed circuit board 120 may be a single-sided PCB (Print circuit Board), a double-sided PCB (Print circuit board), or a PCB ), But the present invention is not limited thereto.

The printed circuit board 120 may be an FR-4 material, and other materials may be used.

2 is a cross-sectional view of a light emitting device array shown in FIG. 1 taken along a line A-A in FIG.

2, the printed circuit board 120 may include a base substrate 122, a copper foil pattern 124, and an insulating member 126.

The base substrate 122 may be made of FR-4 material and may include a first layer (not shown) comprising glass fibers and a second layer (not shown) comprising a resin, Structure can be formed.

The copper foil pattern 124 is stacked on a first surface (not shown) of the base substrate 122 and is connected to the outside to receive a connector pattern (not shown) supplied with external power, first through sixth light emitting device packages 111 The electrode patterns 124a on which the lead frames (not shown) are mounted and the connection patterns 124b connecting between the electrode patterns 124a.

Here, the electrode pattern 124a and the connection pattern 124b may be connected to each other through the first to sixth light emitting device packages 111 to 116 to form a serial or parallel circuit.

At this time, a hole h1 may be formed in the connection pattern 124b. At least one hole h1 may be formed, and the number of holes h1 and the width of the hole h1 are not limited.

A heat dissipation hole h2 may be formed in the base substrate 122 at a position corresponding to the hole h1.

The width d1 of the hole h1 may be equal to the width d2 of the heat dissipating hole h2 or may be smaller than the width d2 of the heat dissipating hole h2, The width d1 of the heat dissipating hole h2 is equal to the width d2 of the heat dissipating hole h2.

Here, metal of a conductive material is coated on the inner surfaces of the holes h1 and h2, and the coated metal can be filled with air.

A material having higher thermal conductivity than the connection pattern 124b may be disposed in the hole h1 and the heat dissipation hole h2.

That is, the heat absorbed by the connection pattern 124b may be absorbed by the high thermal conductivity material and may be discharged to the second surface (not shown) opposite to the first surface of the base substrate 122.

Here, an insulating layer (not shown) may be formed on the second surface of the base substrate 122, but the present invention is not limited thereto.

The insulating member 126 may be a PSR ink and an insulating film, and may be the same as the insulating layer, but is not limited thereto.

The first to sixth light emitting device packages 111 to 116 may have the same configuration, and the first light emitting device package 111 will be described as an example.

The first light emitting device package 111 may include a body 105 having a cavity s in which the light emitting device 102 and the light emitting device 102 are mounted.

Here, the body 105 may be formed of a resin material such as polyphthalamide (PPA), silicon (Si), aluminum (Al), aluminum nitride (AlN), AlOx, photo sensitive glass Amide 9T (PA9T), syndiotactic polystyrene (SPS), a metal material, sapphire (Al2O3), beryllium oxide (BeO), ceramics, and a printed circuit board (PCB).

The body 105 may be formed by injection molding, etching, or the like, but is not limited thereto.

The top surface shape of the body 105 may have various shapes such as a triangle, a quadrangle, a polygon, and a circle depending on the use and design of the light emitting device 102.

Sectional shape of the cavity s may be formed in a cup shape or a concave container shape and an inner side face of the body 105 constituting the cavity s may be inclined downward.

The shape of the front surface of the cavity s may be circular, square, polygonal, elliptical, or the like, but is not limited thereto.

A lead frame (not shown) including first and second lead frames 103 and 104 is disposed on the lower surface of the body 105. The first and second lead frames 103 and 104 are made of a metal material, (Ti), copper (Cu), nickel (Ni), gold (Au), chromium (Cr), tantalum (Ta), platinum (P), aluminum (Al), indium (In), palladium (Pd), cobalt Co, silicon Si, germanium Ge, hafnium Hf, ruthenium Ru, Or more of the above materials or alloys.

In addition, the first and second lead frames 103 and 104 may be formed to have a single layer or a multilayer structure, but the present invention is not limited thereto.

The inner side surface of the body 105 is inclined at a predetermined inclination angle with respect to any one of the first and second lead frames 103 and 104. The reflection angle of light emitted from the light emitting device 102 varies depending on the inclination angle So that the directing angle of the light emitted to the outside can be adjusted. The concentration of light emitted to the outside from the light emitting device 102 increases as the directivity angle of light decreases, while the concentration of light emitted from the light emitting device 102 to the outside decreases as the directivity angle of light increases.

The inner surface of the body 105 may have a plurality of inclination angles, but is not limited thereto.

The first and second lead frames 103 and 104 are electrically connected to the light emitting element 102 and are connected to the positive and negative poles of an external power source ). ≪ / RTI >

The light emitting element 102 is mounted on the first lead frame 103 and the light emitting element 102 is die-bonded to the first lead frame 103. The light emitting element 102 is connected to the second lead frame 104 by a wire (not shown) And can be supplied with power from the first and second lead frames 103 and 104 by wire bonding.

Here, the light emitting element 102 may be wire-bonded or die-bonded to the first and second lead frames 103 and 104, respectively, but is not limited thereto.

In addition, a cathode mark (not shown) may be formed on the body 105. The cathode mark separates the polarity of the light emitting element 102, that is, the polarity of the first and second lead frames 103 and 104, so that when the first and second lead frames 103 and 104 are electrically connected, .

The light emitting device 102 may be a light emitting diode. The light emitting diode may be, for example, a colored light emitting diode that emits light such as red, green, blue, or white, or a UV (Ultra Violet) light emitting diode that emits ultraviolet light. However, A plurality of light emitting devices 102 may be mounted on the frame 103 and at least one light emitting device 102 may be mounted on the first and second lead frames 103 and 104, 102 are not limited to the number and the mounting positions of the mounting portions.

Further, the body 105 may further include a resin material 106 filled in the cavity s. That is, the resin material 106 may be formed in a double molding structure or a triple molding structure, but is not limited thereto.

Further, the resin material 106 may be formed in a film shape, and may include at least one of a phosphor and a light diffusion material, and a translucent material that does not include a phosphor and a light diffusion material may be used. Do not.

Figs. 3 to 11 are plan views showing various embodiments of a plane viewed from the connection pattern shown in Fig. 2 in a direction B. Fig.

Referring to FIG. 3, the connection pattern 124b may be formed between the first and second light emitting device packages 111 and 112, which are formed below the insulating member 126 and face each other.

At this time, a plurality of holes h1 are formed in the connection pattern 124b, and heat dissipating holes (not shown) may be formed on the printed circuit board 120 at positions corresponding to the plurality of holes h1.

The heat dissipating hole may have a width equal to the width d1 of the hole h1 or a width larger than the width d1 of the hole h1 as described above.

In addition, the heat dissipation hole may be formed to correspond to two or more holes h1, and the number may be smaller than the number of holes h1, but is not limited thereto.

Here, the intervals between the plurality of holes h1 may be the same or different from each other, but are not limited thereto.

It is preferable that the cross-sectional area occupied by the plurality of holes h1 is 20% to 60% of the total area of the connection pattern 124b. If the cross-sectional area occupied by the plurality of holes h1 is less than 20% The emission efficiency is extremely weak. If it is larger than 60%, the rigidity of the connection pattern 124b is affected and the risk of disconnection may increase.

Although the widths d1 of the plurality of holes h1 have been described as being the same, they may be different from each other and are not limited thereto.

Referring to FIG. 4, an extension 131 may be formed on one side of the connection pattern 124b.

The length b1 of the extension 131 may vary depending on the distance p1 between the first light emitting device package 111 and the printed circuit board 120 and may range from 30% %. ≪ / RTI >

Although the hole h1 is shown in the extension 131, the hole h1 may not be formed, and the hole h1 is not limited thereto.

Here, although the extension part 131 is shown as being perpendicular to the contact surface with the connection pattern 124b, the extension part 131 may have an acute angle and an obtuse angle, but is not limited thereto.

Referring to FIG. 5, an extension 131 may be formed on one side of the connection pattern 124b. This is the same as that shown in Fig.

However, the extension portion 131 may be formed to have a curvature r at least in a portion contacting the connection pattern 124b and at an edge portion of the extension portion 131. [ At this time, the curvature r of the extended portion 131 is the same as the curvature r of the portion contacting the connection pattern 124b and the edge portion of the extended portion 131, but they are not limited thereto.

That is, when a force acting between the connection pattern 124b and the extension part 131 is generated by the curvature r, the extension part 131 can disperse the force so as to prevent cracking and breakage.

6, the connection pattern 12b is formed with a first extension portion 131 protruding in a first direction (not shown) and a second extension portion 131 protruding in a second direction (not shown) opposite to the first direction (Not shown).

At this time, the length b1 of the first extension part 131 may be different from or equal to the length b2 of the second extension part 132, but is not limited thereto.

That is, a distance p1 between one side surface of the first light emitting device package 111 and the printed circuit board 120 and a distance p2 between the other side surface and the printed circuit board 120, the lengths b1 and b2 of the first and second extension portions 131 and 132 may vary in proportion to the distances p1 and p2.

Of course, even if the distances p1 and p2 are the same, the lengths b1 and b2 of the first and second extension portions 131 and 132 can be varied in proportion to the distances p1 and p2, Do not.

Referring to FIG. 7, first and second extension portions 131 and 132 protruding in directions opposite to each other may be formed in the connection pattern 124b. This is the same as that shown in Fig.

However, the first and second extension portions 131 and 132 may be formed to have a curvature r in at least one of a portion contacting the connection pattern 124b and an edge portion of the extension portion 131. [ The curvature r of the extension portions 131 and 132 is the same as the curvature r of the portion contacting the connection pattern 124b and the edge portion of the extension portion 131 but may be different from each other.

That is, when the force acting between the connection pattern 124b and the extension part 131 is generated by the curvature r, the expansion parts 131 and 132 can disperse the forces to prevent cracks and breakage.

8 and 9, a semicircular extended portion 131 may be formed on one side of the connection pattern 124b.

The maximum length b1 of the extension part 131 may vary depending on the distance p1 between the first light emitting device package 111 and the printed circuit board 120 and may be 30% to 50% Lt; / RTI >

Although the hole h1 is shown in the extension 131, the hole h1 may not be formed, and the hole h1 is not limited thereto.

Here, the extending portion 131 may have an acute angle with respect to the connection pattern 124b, but is not limited thereto.

In this case, the extended portion 131 shown in FIG. 8 has a shape in which the portion contacting the connection pattern 124b is angled, but the extended portion 131 shown in FIG. 9 may have a curvature.

10 and 11 can be overlapped with the parts described in Figs. 6 to 9, and are briefly described.

That is, the connection pattern 124b shown in FIG. 10 can be formed in first and second directions in which the first and second extension portions 131 and 132, which are the same semicircular shapes, are opposite to each other, 131 and 132 are angled at a portion contacting the connection pattern 124b. However, the first and second extension portions 131 and 132 shown in FIG. 11 may be formed to have a curvature.

8 to 11 are briefly described by overlapping with the contents in Figs. 3 to 7, but there is no limitation on the shape of the extension portion.

Figs. 12 to 14 briefly explain or omit the parts overlapping with Figs. 3 to 11. Fig.

That is, referring to FIG. 12, the extension 131 may be formed only on one side of the connection pattern 124b. At this time, the extension part 131 may be partially overlapped with the adjacent first and second light emitting device packages 111 and 112.

As described above, by expanding the area of the expansion portion 131, heat can be easily released.

13, the connecting pattern 124b includes a first extending portion 131 protruding in a first direction (not shown) and a second extending portion 131b extending in a second direction opposite to the first direction And a second extension portion 132 protruding from the second extension portion 132.

At this time, the length b1 of the first extension part 131 may be different from or equal to the length b2 of the second extension part 132, but is not limited thereto.

That is, a distance p1 between one side surface of the first light emitting device package 111 and the printed circuit board 120 and a distance p2 between the other side surface and the printed circuit board 120, the lengths b1 and b2 of the first and second extension portions 131 and 132 may vary in proportion to the distances p1 and p2.

Of course, even if the distances p1 and p2 are the same, the lengths b1 and b2 of the first and second extension portions 131 and 132 can be varied in proportion to the distances p1 and p2, Do not.

In this case, although the contact surfaces of the first and second extension parts 131 and 132 shown in FIG. 13 are perpendicular to the connection pattern 124b, they may have an acute angle and an obtuse angle, but are not limited thereto.

However, the first and second extension portions 131 and 132 shown in FIG. 14 may have first and second extension portions 131 and 132 protruded in opposite directions. The first and second extension parts 131 and 132 are formed on at least one of the part contacting the connection pattern 124b and the edge part of the extension part 131, As shown in FIG. The curvature r of the extension portions 131 and 132 is the same as the curvature r of the portion contacting the connection pattern 124b and the edge portion of the extension portion 131 but may be different from each other.

That is, when the force acting between the connection pattern 124b and the extension part 131 is generated by the curvature r, the expansion parts 131 and 132 can disperse the forces to prevent cracks and breakage.

15 is a cross-sectional view of a light emitting device array shown in FIG. 1 taken along a line A-A according to a second embodiment.

FIG. 15 briefly explains or omits contents overlapping with those described in FIG.

15, the printed circuit board 120 may include a base substrate 122, a copper foil pattern 124, an insulating member 126, an insulating layer 128, and a heat radiating pattern 144.

The copper foil pattern 124 formed on the first surface (not shown) of the base substrate 122 is electrically connected to the electrode patterns 124a (not shown) on which the lead frames (not shown) of the first to sixth light emitting device packages 111 to 116 are mounted, And a connection pattern 124b connecting between the electrode patterns 124a.

A hole h1 may be formed in the connection pattern 124b. At least one hole h1 may be formed and a heat dissipating hole h2 may be formed in the base substrate 122 at a position corresponding to the hole h1.

The connection pattern 124b according to the embodiment may have any one of the shapes of FIGS. 3 to 14, but may be formed in other shapes, but is not limited thereto.

The width d1 of the hole h1 may be equal to the width d2 of the heat dissipating hole h2 or may be smaller than the width d2 of the heat dissipating hole h2, The width d1 of the heat dissipating hole h2 is equal to the width d2 of the heat dissipating hole h2.

Materials having higher thermal conductivity than the connection pattern 124b may be disposed in the holes h1 and h2.

A heat radiation pattern 144 may be formed on a second surface of the base substrate 122 opposite to the first surface.

Here, the heat radiation pattern 144 may have an area equal to or smaller than that of the connection pattern 124b, but is not limited thereto.

In addition, the width of the heat radiation pattern 144 may be the same as or different from the width of the connection pattern 124b, but is not limited thereto.

That is, the heat radiation pattern 144 is disposed under the heat dissipation hole h2 to diffuse the heat absorbed in the heat dissipation hole h2 to increase the heat dissipation effect.

A plurality of heat radiation patterns 144 may be formed, and the plurality of heat radiation patterns 144 may be spaced apart from each other, but are not limited thereto.

Here, the insulating layer 128 may be disposed under the heat radiating pattern 144, and the insulating layer 128 may be a PSR ink and an insulating film in the same manner as the insulating member 126, but is not limited thereto.

In an embodiment, the insulating layer 128 is disposed to cover the heat radiation pattern 144, but may be arranged such that at least a portion of the heat radiation pattern 144 is exposed to the outside, but is not limited thereto.

The description of the first to sixth light emitting device packages 111 to 116 will be omitted in FIG. 2.

FIG. 16 is a perspective view showing a lighting device including a light emitting device package according to an embodiment, and FIG. 17 is a cross-sectional view showing a C-C cross section of the lighting device shown in FIG.

In order to describe the shape of the illumination device 300 according to the embodiment in detail, the longitudinal direction Z of the illumination device 300, the horizontal direction Y perpendicular to the longitudinal direction Z, The direction Z and the horizontal direction Y and the vertical direction X perpendicular to the horizontal direction Y will be described.

17 is a cross-sectional view of the lighting device 300 of FIG. 16 cut in the longitudinal direction Z and the height direction X and viewed in the horizontal direction Y. In FIG.

16 and 17, the lighting device 300 may include a body 310, a cover 330 coupled to the body 310, and a finishing cap 350 positioned at opposite ends of the body 310 have.

The light emitting device module 340 is coupled to a lower surface of the body 310. The body 310 is electrically conductive so that heat generated from the light emitting device package 344 can be emitted to the outside through the upper surface of the body 310. [ And a metal material having an excellent heat dissipation effect.

The light emitting device package 344 is mounted on the PCB 342 in a multi-color, multi-row manner to form an array. The light emitting device package 344 can be mounted at equal intervals or can be mounted with various spacings as needed. As the PCB 342, MCPCB (Metal Core PCB) or FR4 material can be used.

Meanwhile, the light emitting device package 344 may include a film formed of a plurality of holes and made of a conductive material.

Since a film formed of a conductive material such as a metal generates a large amount of optical interference, the intensity of a light wave can be enhanced by the interaction of light waves, so that light can be extracted and diffused effectively. It is possible to effectively extract light through interference and diffraction of light. Thus, the efficiency of the illumination device 300 can be improved. At this time, it is preferable that the size of the plurality of holes formed in the film is smaller than the wavelength of light generated in the light source portion.

The cover 330 may be formed in a circular shape so as to surround the lower surface of the body 310, but is not limited thereto.

The cover 330 protects the internal light emitting element module 340 from foreign substances or the like. In addition, the cover 330 may include diffusion particles to prevent glare of light generated in the light emitting device package 344 and uniformly emit light to the outside, and may include at least one of an inner surface and an outer surface of the cover 330 A prism pattern or the like may be formed on one side. Further, the phosphor may be coated on at least one of the inner surface and the outer surface of the cover 330.

Meanwhile, since the light generated in the light emitting device package 344 is emitted to the outside through the cover 330, the cover 330 should have a high light transmittance and sufficient heat resistance to withstand the heat generated in the light emitting device package 344 The cover 330 is preferably formed of a material including polyethylene terephthalate (PET), polycarbonate (PC), or polymethyl methacrylate (PMMA) .

The finishing cap 350 is located at both ends of the body 310 and can be used for sealing the power supply unit (not shown). In addition, the finishing cap 350 is provided with the power pin 352, so that the lighting device 300 according to the embodiment can be used immediately without a separate device on the terminal from which the conventional fluorescent lamp is removed.

18 is an exploded perspective view of a liquid crystal display device including the light emitting device package according to the first embodiment.

18, the liquid crystal display device 400 may include a liquid crystal display panel 410 and a backlight unit 470 for providing light to the liquid crystal display panel 410 in an edge-light manner.

The liquid crystal display panel 410 can display an image using the light provided from the backlight unit 470. The liquid crystal display panel 410 may include a color filter substrate 412 and a thin film transistor substrate 414 facing each other with a liquid crystal therebetween.

The color filter substrate 412 can realize the color of the image to be displayed through the liquid crystal display panel 410.

The thin film transistor substrate 414 is electrically connected to a printed circuit board 418 on which a plurality of circuit components are mounted through a driving film 417. The thin film transistor substrate 414 may apply a driving voltage provided from the printed circuit board 418 to the liquid crystal in response to a driving signal provided from the printed circuit board 418.

The thin film transistor substrate 414 may include a thin film transistor and a pixel electrode formed as a thin film on another substrate of a transparent material such as glass or plastic.

The backlight unit 470 includes a light emitting device module 420 that outputs light, a light guide plate 430 that changes the light provided from the light emitting device module 420 into a surface light source to provide the light to the liquid crystal display panel 410, A plurality of films 450, 466 and 464 for uniforming the luminance distribution of the light provided from the light guide plate 430 and improving the vertical incidence property and a reflective sheet 430 for reflecting the light emitted to the rear of the light guide plate 430 to the light guide plate 430 440).

The light emitting device module 420 may include a PCB substrate 422 for mounting a plurality of light emitting device packages 424 and a plurality of light emitting device packages 424 to form an array.

In particular, since the light emitting device package 424 includes a film having a plurality of holes in its light emitting surface, the lens can be omitted, a slim light emitting device package can be realized, and light extraction efficiency can be improved at the same time. Therefore, it becomes possible to realize the backlight unit 470 which is thinner.

The backlight unit 470 includes a diffusion film 466 for diffusing light incident from the light guide plate 430 toward the liquid crystal display panel 410 and a prism film 450 for enhancing vertical incidence by condensing the diffused light. And may include a protective film 464 for protecting the prism film 450.

19 is an exploded perspective view of a liquid crystal display device including a light emitting device package according to the second embodiment.

However, the parts shown and described in Fig. 18 are not repeatedly described in detail.

19, the liquid crystal display device 500 may include a liquid crystal display panel 510 and a backlight unit 570 for providing light to the liquid crystal display panel 510 in a direct-down manner.

The backlight unit 570 includes a plurality of light emitting element modules 523, a reflective sheet 524, a lower chassis 530 housing the light emitting element module 523 and the reflective sheet 524, A plurality of optical films 560, and a diffuser plate 540 disposed on the diffuser plate 540. [

The light emitting device module 523 may include a PCB substrate 521 for mounting a plurality of light emitting device packages 522 and a plurality of light emitting device packages 522 to form an array.

In particular, since the light emitting device package 522 is formed of a conductive material and a film including a plurality of holes is formed on the light emitting surface, the lens can be omitted, thereby realizing a slim light emitting device package, Can be improved. Therefore, it becomes possible to realize the backlight unit 570 which is thinner.

The reflection sheet 524 reflects light generated from the light emitting device package 522 in a direction in which the liquid crystal display panel 510 is positioned, thereby improving light utilization efficiency.

The light generated from the light emitting device module 523 is incident on the diffusion plate 540 and the optical film 560 is disposed on the diffusion plate 540. The optical film 560 may include a diffusion film 566, a prism film 550, and a protective film 564.

Here, the illumination device 300 and the liquid crystal display devices 400 and 500 may be included in the illumination system. In addition, the illumination device may include a light emitting device package and an illumination device.

The features, structures, effects and the like described in the embodiments are included in at least one embodiment of the present invention and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects and the like illustrated in the embodiments can be combined and modified by other persons skilled in the art to which the embodiments belong. Therefore, it should be understood that the present invention is not limited to these combinations and modifications.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is clearly understood that the same is by way of illustration and example only and is not to be taken by way of illustration, It will be appreciated that various modifications and applications are possible without departing from the scope of the present invention. For example, each component specifically shown in the embodiments can be modified and implemented. It is to be understood that all changes and modifications that come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

Claims (22)

First and second light emitting device packages;
And a printed circuit board on which the first and second light emitting device packages are mounted,
Wherein the printed circuit board includes:
A first electrode pattern on which the first light emitting device package is mounted;
A second electrode pattern on which the second light emitting device package is mounted; And
And a connection pattern connecting the first and second electrode patterns and having holes formed therein,
The hole occupies at least one of the holes and the area occupied by the holes is 20% to 60% of the total area of the connection pattern,
Wherein the connection pattern is formed with an extension, the length of the extension being 30% to 50% of the distance between the first light emitting device package and the printed circuit board,
Wherein the extension part overlaps with at least one of the first and second light emitting device packages,
And the hole is formed in the extending portion. The plasma display apparatus according to claim 1, wherein the first and second electrode patterns
Wherein the first electrode pattern and the second electrode pattern are symmetrical to each other with respect to a center of the first and second electrode patterns. delete delete delete [3] The apparatus of claim 2,
Wherein at least one of the length and the width is different. delete The apparatus of claim 1,
A light emitting device array having a polygonal or semicircular shape. delete delete delete The method according to claim 1,
Wherein the printed circuit board includes a base plate on which a heat dissipating hole corresponding to the hole is formed,
The width of the hole
The width of the heat dissipating hole is smaller than the width
Or the width of the heat dissipating hole. The heat sink according to claim 12, wherein at least one of the hole and the heat dissipating hole has,
A light emitting device array coated with a conductive metal. delete delete delete delete delete delete The method according to claim 1,
And an insulating member laminated on the connection pattern,
Wherein the insulating member
PSR ink or an insulating film. delete An illumination system comprising a light emitting device array according to any one of claims 1, 2, 6, 8, 12, 13 and 20.

Images