WO2018194386A1

WO2018194386A1 - Led package set and led bulb comprising same

Info

Publication number: WO2018194386A1
Application number: PCT/KR2018/004534
Authority: WO
Inventors: 정영
Original assignee: 서울반도체주식회사
Priority date: 2017-04-21
Filing date: 2018-04-19
Publication date: 2018-10-25
Also published as: CN110121769A; CN110121769B

Abstract

The present invention relates to an LED package set and an LED bulb comprising the same. The LED package set according to one embodiment of the present invention comprises: a substrate; an LED array including a plurality of LED chips, which are mounted on at least one surface of the substrate and are electrically connected; a plurality of LED packages respectively including a pair of electrode pads, which are respectively arranged on both ends of the substrate and are electrically connected to the LED array; and a connection lead for connecting electrode pads of one end between two neighboring LED packages. Electrode pads of the other end between the two neighboring LED packages are separated from each other, the plurality of LED packages are electrically connected in series, and the connection lead is integrated with the connected electrode pads.

Description

LED package set and LED bulb including the same

The present invention relates to an LED package set and an LED bulb comprising the same.

Conventionally, incandescent lamps using filaments have been widely used as lighting devices. In general, an incandescent lamp using a filament is operated on a principle that light is obtained by temperature radiation while the tungsten filament wire is heated to a high temperature when a tungsten filament wire is put into a glass of vacuum.

Conventional incandescent bulbs are difficult to use for a long time because most of the energy is emitted as heat and only a part of the energy is converted to light, and thus the thermal efficiency is very low and the filament itself is short in life.

Recently, a light emitting diode (LED) having a long lifetime and high energy efficiency has been used for a lighting device.

The problem to be solved by the present invention is to provide a LED package set and a LED bulb comprising the same, which has a long life and low heat generation economically high efficiency.

Another object of the present invention is to provide an LED package set and an LED bulb including the same that can improve productivity by reducing a manufacturing process, manufacturing time, and material cost.

Another object of the present invention is to provide an LED package set and an LED bulb including the same that can emit light evenly in various directions by emitting light in different directions.

According to an embodiment of the present disclosure, an LED package set may include a substrate, an LED array including a plurality of LED chips mounted on at least one surface of the substrate and electrically connected to each other, and disposed at both ends of the substrate to be electrically connected to the LED array. And a plurality of LED packages each including a pair of electrode pads, and a connection lead connecting one end of the electrode pads between two LED packages adjacent to each other. The electrode pads of the other end are separated from each other between the two adjacent LED packages, the plurality of LED packages are electrically connected in series, and the connection lead is integrated with the connected electrode pads.

According to another embodiment of the present invention, an LED package set includes a transparent substrate, an LED array including a plurality of LED chips disposed on one surface of the transparent substrate and connected in series, a wavelength conversion layer covering one surface of the transparent substrate and the LED array. A first LED package and a second LED package including an anode electrode pad connected to one end of the LED array, and a cathode electrode pad connected to the other end of the LED array, and an anode electrode pad of the first LED package; It includes one connection lead for connecting the cathode electrode pad of the second LED package. The connection lead is integrally formed with the anode electrode pad of the first LED package and the cathode electrode pad of the second LED package. In addition, the cathode electrode pad of the first LED package and the anode electrode pad of the second LED package are spaced apart.

According to another embodiment of the present invention, the LED package set is a transparent substrate, an LED array composed of a plurality of LED chips disposed on one surface of the transparent substrate and connected in series, a wavelength covering one surface of the transparent substrate and the LED array A first to fourth LED package, an anode electrode pad of the first LED package, and a conversion layer, an anode electrode pad connected to one end of the LED array, and a cathode electrode pad connected to the other end of the LED array, respectively. A first connection lead connecting the cathode electrode pad of the second LED package, a second connection lead connecting the anode electrode pad of the second LED package and the cathode electrode pad of the third LED package, and a third LED package of the third LED package A third connecting the anode electrode and the cathode electrode pad of the fourth LED package And a connection lead. The first, second and third connection leads are integrally formed with the connected anode and cathode electrode pads. In addition, the cathode electrode pad of the first LED package and the anode electrode pad of the fourth LED package are separated from other electrode pads.

According to another embodiment of the present invention, the LED bulb is a base portion formed with a pair of external electrodes connected to an external power source, an LED array consisting of a plurality of LED chips electrically connected and a pair connected to both ends of the LED array, respectively At least one LED package set each comprising a plurality of LED packages including electrode pads of the plurality of LED pads, and connecting leads connecting electrode pads of neighboring LED packages so that the plurality of LED packages are electrically connected in series; At least one pair of lead wires electrically connecting the electrodes and the electrode pads not connected by the connecting leads of the LED package set, and the LED package set and the pair of lead wires, one end of which is coupled to the base portion It includes a translucent cover. The connecting lead and the electrode pads connected to the connecting lead are integral.

According to another embodiment of the present invention, an LED package set including a plurality of LED packages and connection leads is provided. The plurality of LED packages includes a substrate, an LED array including a plurality of LED chips mounted on at least one surface of the substrate, and a pair of electrode pads disposed at both ends of the substrate and electrically connected to the LED array, respectively. In addition, the connection lead electrically connects the electrode pads disposed at one end of the plurality of LED packages. Here, the connecting lead is integral with the connected electrode pad, and the plurality of LED packages are electrically connected in parallel.

According to another embodiment of the present invention, a base having a plurality of external electrodes connected to an external power source, at least one LED package set including a plurality of LED packages and connection leads, and electrically connecting the external electrodes and the LED package set of the base An LED bulb is provided including a plurality of lead wires connected to each other, and a LED cover set surrounding the LED package set and the plurality of lead wires, the translucent cover having one end coupled to the base part.

The LED package set includes a plurality of LED packages and connection leads. The plurality of LED packages includes a substrate, an LED array including a plurality of LED chips mounted on at least one surface of the substrate, and a pair of electrode pads disposed at both ends of the substrate and electrically connected to the LED array, respectively. In addition, the connection lead electrically connects the electrode pads disposed at one end of the plurality of LED packages. Here, the connecting lead is integral with the connected electrode pad, and the plurality of LED packages are electrically connected in parallel.

According to the exemplary embodiment of the present invention, the LED package set and the LED bulb including the same may use an LED package instead of a tungsten filament wire, thereby improving economic efficiency by having a long life and low heat generation.

According to another embodiment of the present invention, the LED package set can increase the material utilization rate by using the metal material between the electrode pads, which are conventionally disposed when individually configuring each LED package, as a connection lead between the LED packages. In addition, by employing such an LED package set in the LED bulb, the connection process between the LED packages can be omitted, thereby improving productivity by reducing the manufacturing process, manufacturing time and material cost of the LED bulb.

According to another exemplary embodiment of the present invention, the LED package set may change the light emission direction of each LED package by using a curved portion, so that the LED bulb emits light evenly in all directions.

1 to 6 are exemplary views showing a method of manufacturing an LED package set and an LED package set according to the first embodiment of the present invention.

7 is an exemplary view showing an LED bulb according to a first embodiment of the present invention.

8 to 10 are exemplary views showing a method of manufacturing an LED package set and an LED package set according to the second embodiment of the present invention.

11 is an exemplary view showing an LED bulb according to a second embodiment of the present invention.

12 is another exemplary view illustrating an LED package set according to a second embodiment of the present invention.

13 is another exemplary view illustrating an LED package set according to a second embodiment of the present invention.

14 is another exemplary view illustrating an LED bulb according to a third embodiment of the present invention.

15 and 16 are exemplary views illustrating a method of manufacturing an LED package set and an LED package set according to the third embodiment of the present invention.

17 and 18 are exemplary diagrams showing the LED bulb according to the fourth and fifth embodiments of the present invention.

19 and 20 are exemplary views illustrating a method of manufacturing an LED package set and an LED package set according to the fourth embodiment of the present invention.

21 is an exemplary view showing an LED bulb according to a sixth embodiment of the present invention.

22 to 26 are exemplary views illustrating a method of manufacturing an LED package set and an LED package set according to the seventh embodiment of the present invention.

27 is an exemplary view showing an LED bulb according to a seventh embodiment of the present invention.

28 and 29 are exemplary views illustrating a method of manufacturing an LED package set and an LED package set according to the eighth embodiment of the present invention.

30 is an exemplary view showing an LED bulb according to an eighth embodiment of the present invention.

31 and 32 are exemplary views illustrating a method of manufacturing an LED package set and an LED package set according to the ninth embodiment of the present invention.

33 is an exemplary view showing an LED bulb according to a ninth embodiment of the present invention.

The objects, specific advantages and novel features of the present invention will become more apparent from the following detailed description and preferred embodiments in conjunction with the accompanying drawings. The embodiments introduced below are provided as examples to sufficiently convey the spirit of the present invention to those skilled in the art. Therefore, the present invention is not limited to the embodiments described below and may be embodied in other forms. In the present specification, in adding reference numerals to the components of each drawing, it should be noted that the same components as possible, even if displayed on different drawings have the same number as possible. In addition, terms such as "first", "second", "one side", "other side", "top side", "bottom", "top", "bottom", and the like are to distinguish one component from another component. As used herein, the components are not limited by the above terms.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

The LED package set includes two LED packages, the electrode pads of one end of the two LED packages are connected by the connection leads, and the electrode pads of the other ends are separated from each other.

The LED package set includes three or more LED packages. In this case, except for the two LED packages located at both ends, the remaining LED packages are connected to each other through the connection lead and the different LED packages neighboring the electrode pads. In addition, the two LED packages located at both ends include electrode pads that are not coupled to the connection leads.

Further comprising a mark for distinguishing the polarity of the electrode pad of the plurality of LED packages.

The connecting lead further includes a first curved portion bent to bring two connected LED packages into proximity to each other.

The electrode pad of the LED package further includes a second curved portion bent to bring the connected connection lead and the substrate into close proximity.

The substrate of each of the plurality of LED packages is a light transmissive substrate.

Each of the plurality of LED packages further includes a wavelength converter configured to cover at least one surface of the substrate and the LED array.

Each of the plurality of LED packages further includes a wavelength converter configured to cover both sides of the substrate and the LED array.

Each of the plurality of LED packages emits white light.

The connecting lead includes at least one first royal portion configured to be bent perpendicularly to the major axis direction.

A second curved portion is further formed on the anode electrode pad of the first LED package and the cathode electrode pad of the second LED package connected to the connection lead so as to be bent perpendicularly to the major axis direction, respectively.

The connecting leads each include a first curved portion configured to be bent perpendicularly to the major axis direction.

The LED package set includes two LED packages. In this case, the electrode pads at one end of the two LED packages are connected by the connection lead, and the electrode pads at the other end are separated from each other.

The LED package set includes three or more LED packages. In this case, except for the two LED packages located at both ends, the remaining LED packages are connected to each other through the connection lead and the different LED packages adjacent to each of the electrode pads. In addition, the two LED packages located at both ends include electrode pads that are not coupled to the connection leads.

Marks are further formed to distinguish polarities of electrode pads of the plurality of LED packages.

The mark is formed on at least one electrode pad in each LED package set.

The connection lead further includes a first curved portion bent so that two connected LED packages are close to each other, so that the two connected LED packages are dimmed in different directions.

The electrode pad of the LED package further includes a second curved portion to bring the connected connection lead and the substrate into close proximity, and each of the LED packages dims toward an upper portion of the LED bulb.

The lead wire is connected to the electrode pad that is not connected to the connection lead at the other end of the plurality of LED packages.

The LED bulb is disposed inside the translucent cover, and further includes a support extending in an upward direction from the base portion.

The connecting lead is supported or adhered to the upper or upper surface of the support.

There are a plurality of LED package sets, each of the plurality of LED package sets being distinguished and electrically connected to the base.

According to another embodiment of the present invention, the LED package set includes a plurality of LED packages and connection leads. The plurality of LED packages includes a substrate, an LED array including a plurality of LED chips mounted on at least one surface of the substrate and electrically connected to each other, and a pair of electrode pads disposed at both ends of the substrate and electrically connected to the LED array, respectively. Include. In addition, the connection lead electrically connects the electrode pads disposed at one end of the plurality of LED packages. Here, the connection lead is integrated with the electrode pad connected thereto, and the plurality of LED packages are electrically connected in parallel.

The electrode pads disposed at the other ends of the plurality of LED packages are separated from each other.

The connection lead further includes a first curved portion in which adjacent LED packages connected to the connection lead are bent to approach each other.

The electrode pad connected to the connection lead may further include a second curved portion bent such that the substrate and the connection lead are close to each other.

Marks for distinguishing polarities are further formed on the electrode pads.

The substrate is a light transmissive substrate.

The LED package further includes a wavelength converter formed to cover at least one surface of the substrate and the LED array.

The plurality of LED packages emit white light.

The LED package set further includes a connection lead formed at the other end of the plurality of LED packages and electrically connecting the electrode pads disposed at the other end of the plurality of LED packages.

Here, the connection leads formed at the other ends of the plurality of LED packages are integral with the electrode pads connected thereto.

In addition, the connection lead formed at the other end of the plurality of LED packages is further formed with a first curved portion that is bent so that neighboring LED packages connected to the connection lead close to each other.

According to another embodiment of the present invention, the LED bulb is a set of at least one LED package including a base, a plurality of LED packages and a connection lead formed with a plurality of external electrodes connected to an external power source, the external electrode of the base and A plurality of lead lines for electrically connecting the LED package set, and a transparent cover surrounding the LED package set and the plurality of lead lines, one end is coupled to the base portion.

The LED package set includes a plurality of LED packages and connection leads. The plurality of LED packages includes a substrate, an LED array including a plurality of LED chips mounted on at least one surface of the substrate and electrically connected to each other, and a pair of electrode pads disposed at both ends of the substrate and electrically connected to the LED array, respectively. Include. In addition, the connection lead electrically connects the electrode pads disposed at one end of the plurality of LED packages. Here, the connection lead is integrated with the electrode pad connected thereto, and the plurality of LED packages are electrically connected in parallel.

Marks for distinguishing polarities are further formed on the electrode pads.

The substrate is a light transmissive substrate.

The plurality of LED packages emit white light.

It is disposed inside the transparent cover, and further includes a support extending in the upper direction from the base portion. The connecting lead is supported or adhered to the upper or upper surface of the support.

The electrode pads disposed at the other ends of the plurality of LED packages are separated from each other. In this case, the lead lines are respectively connected to the electrode pads disposed at the other ends of the plurality of LED packages.

In addition, the lead wire is connected to the connection leads formed at the other ends of the plurality of LED packages.

The LED package set is a plurality. The apparatus may further include a connection line for electrically connecting the plurality of LED package sets. The connection line is electrically connected to the connection leads formed at one end of the plurality of LED packages to electrically connect the plurality of LED package sets in series.

Referring to FIG. 1, a plurality of LED packages 40 are provided. Although not shown in the drawings, the LED package 40 is disposed on a plate on which a process is to be performed. Each LED package 40 includes an LED array 32 and a substrate 31 on which the LED array 32 is mounted. In addition, the LED package 40 may further include a wavelength converter 34. In FIG. 2, the LED package 40 does not include the wavelength converter 34, but the wavelength converter 34 is formed later.

In the embodiment of the present invention, the LED array 32 is composed of a plurality of LED chips 33 connected in series. For example, each of the plurality of LED chips 33 is electrically connected to its own anode electrode and the cathode electrode of the neighboring LED chip 33 by wire bonding. At this time, wire bonding is not performed on the anode electrode of the LED chip 33 disposed at one end of the LED array 32 and the cathode electrode of the LED chip 33 disposed at the other end opposite to the end. In the following description, an anode electrode of the LED chip 33 disposed at one end of the LED array 32 is represented as an anode electrode of the LED array 32 or an anode electrode of the LED package 40. In addition, the cathode electrode of the LED chip 33 disposed at the other end of the LED array 32 is represented as a cathode electrode of the LED array 32 or a cathode electrode of the LED package 40.

In FIG. 1, the LED package 40 includes one LED array 32 in which a plurality of LED chips 33 are connected in series. However, the LED package 40 may include a plurality of LED arrays 32. For example, the LED package 40 may include a plurality of LED arrays 32, and the plurality of LED arrays 32 may be connected in series, in parallel, or in parallel with the series.

The substrate 31 may be a light transmissive substrate formed of a light transmissive material. When the substrate 31 is a light transmissive substrate, the light emitted from the LED array 32 may be emitted through the lower surface of the substrate 31 as well as the front surface of the LED array 32. Here, the lower surface of the substrate 31 is opposite to the surface on which the LED array 32 is mounted. Then, the front surface may be represented by the upper surface, the lower surface may be represented by the rear surface according to the arrangement of the configuration portion in the description. For example, the material of the substrate 31 may be glass.

According to the exemplary embodiment of the present invention, the plurality of LED packages 40 are arranged such that their polarities are opposite to the neighboring LED packages 40. That is, the plurality of LED packages 40 are disposed such that the positions of the anode electrode and the cathode electrode of the neighboring LED package 40 and the LED array 32 are reversed.

Referring to FIG. 2, the lead frame 10 is disposed on the plurality of LED packages 10. The lead frame 10 has a structure in which a plurality of electrode pads 12 protrude to one side or the other side of the connection lead 11. For example, the lead frame 10 is formed of a conductive metal such as copper or aluminum.

For convenience of description of the present invention, the lead frame 10 will be described by dividing it into the connection lead 11 and the electrode pad 12, but the connection lead 11 and the electrode pad 12 are made of the same material, Formed by one piece. For example, the lead frame 10 may be formed by performing a punching process on a metal plate. Alternatively, the lead frame 10 may be formed by injecting and solidifying a metal dissolved in a mold. In addition, if the connecting lead 11 and the electrode pad 12 is formed integrally, the lead frame 10 may be formed in various ways according to the choice of those skilled in the art.

The lead frame 10 is disposed at one end and the other end of the LED package 40, respectively. At this time, the upper surfaces of both ends of the substrate 31 are in contact with the lower surface of the electrode pad 12, respectively.

The electrode pad 12 is divided into a first electrode pad 13 and a second electrode pad 14. The first electrode pad 13 is an anode electrode pad, and the second electrode pad 14 is a cathode electrode pad.

The first electrode pad 13 is connected to the anode electrode of the LED array 32, and the second electrode pad 14 is connected to the cathode electrode of the LED array 32. The first electrode pad 13 and the second electrode pad 14 may be a part of the LED package 40 later.

Marks 16 are formed on at least some of the plurality of electrode pads 12. The mark 16 is formed later to distinguish between the anode electrode and the cathode electrode, which are polarities across the LED package 40. That is, the mark 16 is a mark for distinguishing the first electrode pad 13 and the second electrode pad 14. In addition, the mark 16 is an electrode pad 12 to which the positive power and the negative power of the external power are connected when the LED package 40 or the LED package set 110 is connected to the external power. ) Can also be used to distinguish between them.

In the exemplary embodiment of the present invention, the mark 16 is formed on the first electrode pad 13. Therefore, the lead frame 10 has a structure in which the first electrode pad 13 having the mark 16 formed on the connecting lead 11 and the second electrode pad 14 having the mark 16 not formed alternately arranged. .

The position at which the mark 16 is formed may be variously changed. In another embodiment, the mark 16 may be formed on the second electrode pad 14. In another embodiment, the marks 16 may be formed on the first electrode pad 13 and the second electrode pad 14 in different shapes.

The marks 16 may be formed in any way and form that can be visually identified, such as intaglio structures or penetrating structures or marked with ink.

After arranging the lead frames 10 on the plurality of LED packages 40, wire bonding is performed on the LED packages 40 and the lead frames 10. The anode electrode of each LED package 40 is electrically connected to the first electrode pad 13 through a wire. In addition, the cathode electrode of each LED package 40 is electrically connected to the second electrode pad 14 through a wire.

Referring to FIG. 3, the wavelength converter 34 is formed to surround the LED array 32. The wavelength converter 34 converts the wavelength of the light emitted from the LED chip 33 to emit light of a different color. The wavelength converter 34 is formed of a resin containing a phosphor.

4 is a side cross-sectional view A1-A2 of FIG. Referring to FIG. 4, the wavelength converter 34 is formed to surround the top and bottom surfaces of the substrate 31 on which the LED array 32 is disposed. Alternatively, the wavelength converter 34 may be formed to surround the LED array 32, but may be formed only on the top surface of the substrate 31. That is, if the wavelength converter 34 is formed to surround the LED array 32, it may be formed in any form according to the choice of those skilled in the art.

In an embodiment of the present invention, the LED package 40 may emit white light or light of another color desired by the user. The light emitted from the LED array 32 passes through the wavelength converter 34 and the wavelength is converted to emit white light or light of another color desired by the user. In this case, when the substrate 31 is a light-transmissive substrate, when the wavelength converter 34 is formed to surround the bottom surface of the substrate 31, the LED package 40 may be white light or a user desired through the bottom surface of the substrate 31. It can emit light of color.

In another embodiment, the light emitted from the LED array 32 may be white light or light of a color desired by a user. In this case, in the LED package 40, the wavelength converter 34 may be omitted. The LED array 32 may be configured by mixing the LED chip 33 which emits light of different colors to emit white light or light of a color desired by the user. Alternatively, the plurality of LED chips emitting light of different colors may be mixed so that each LED chip 33 emits white light or light of a color desired by a user.

5 shows a cut line C of the lead frame 10. The cutting line C is a line indicating a portion where the lead frame 10 is cut when the cutting process is performed.

In an exemplary embodiment of the present invention, the cutting line C is a portion of the lead frame 10 in which the LED packages 40 and the electrode pads 12 are disposed at both ends of the plurality of LED packages 40 arranged side by side. Both sides are formed to be separated. In addition, the cutting line C is formed to cut the connection lead 11 from the outside of the electrode pad 12 connected to one end of two LED packages 40 adjacent to each other.

The six LED packages 40 shown in FIG. 5 are divided into first LED packages 41 to sixth LED packages 46 to be described. For example, the cutting line C is between the first electrode pad 13 of the second LED package 42 and the second electrode pad 14 of the third LED package 43 and the fourth LED package 44. The connection lead 11 is formed to be cut between the first electrode pad 13 and the second electrode pad 14 of the fifth LED package 45. In addition, the cutting line C is formed to cut between the electrode pad 12 and the connection lead 11 connected to the other ends of the two LED packages 40.

When the cutting process is performed along the cutting line C, the at least one LED package set 110 is separated from the lead frame 10.

6 is an LED package set 110 separated from the lead frame 10 by a cutting process along the cutting line C of FIG. 5. The LED package set 110 according to the first embodiment includes a configuration in which two LED packages 40 are connected in series. The LED package set 110 includes two LED packages 40, a connection lead 11 and an electrode pad 12.

The second electrode pad 14 of the LED package 40 and the first electrode pad 13 of the other LED package 40 are integrally formed with the connection lead 11. Thus, the two LED packages 40 constituting the LED package set 110 are connected in series. Hereinafter, for convenience of description, the two LED packages 40 will be described by being divided into the first LED package 41 and the second LED package 42.

Conventionally, a plurality of LED packages are separately separated from the lead frame. Therefore, in order to electrically connect a plurality of LED packages, a component such as a wire is required, which has to be manufactured separately.

However, according to the exemplary embodiment of the present invention, the first LED package 41 and the second LED package 42 are disposed so that the electrode directions thereof are opposite to each other, and are electrically connected to each other by the connecting leads 11 of the lead frame 10. Is connected.

Therefore, in the method of manufacturing the LED package set 110 according to the embodiment of the present invention, a process of manufacturing a separate component for connection between the LED packages 40 may be omitted. In addition, in the manufacturing method of the LED package set 110, it is possible to omit the step of electrically connecting the LED package 40 using a separately manufactured component. That is, in the related art, a wire is used for electrical connection between the plurality of LED packages 40. However, according to an embodiment of the present invention, there is no need for a wire for electrical connection between the plurality of LED packages 40, there is no need for a process of connecting the wires to the LED package 40. Since the manufacturing process of the LED package set 110 is simplified and manufacturing time and material cost are reduced, the productivity of the bulb manufactured using the LED package set 110 is also improved.

The LED bulb 100 according to the first exemplary embodiment includes a base 120, a support 130, an LED package set 110, an introduction line 140, and a transparent cover 150.

The base unit 120 is configured to be coupled with a socket for connection with an external power source. The first external electrode 121 and the second external electrode 122 electrically connected to the socket are formed on the outer surface of the base 120.

Translucent cover 150 is coupled to the base portion 120, is formed to cover the internal components of the LED bulb 100, such as the support 130, the LED package set 110 and the lead line 140.

The light transmissive cover 150 is formed of a light transmissive material for passing the light emitted from the LED package set 110. For example, the transparent cover 150 is formed of glass.

The support 130 is located inside the base 120 and the transparent cover 150, and supports the LED package set 110. The lower portion of the support 130 is located inside the base portion 120, and the upper portion of the support 130 is formed to protrude long to the upper portion of the base portion 120.

In one embodiment, the support 130 may be integrally formed with the transparent cover 150. In this case, the support 130 is fixed to the transparent cover 150. When the transparent cover 150 and the base part 120 are coupled to each other, the lower portion of the support 130 is positioned inside the base part 120. In another embodiment, the support 130 may be formed as individual components that are not integral with the transparent cover 150. In this case, the lower portion of the support 130 may be fixed inside the base portion 120. Whether the support 130 is integral with the light transmissive cover 150 or a separate component, and thus, the method of fixing the support 130 to the base 120 and the light transmissive cover 150 may vary according to the choice of those skilled in the art. Can be changed.

The support 130 is formed of a transparent insulating material. The support 130 may be formed of the same material as the transparent cover 150. For example, the support 130 may be formed of glass.

Two LED package sets 110 are positioned inside the transparent cover 150. Here, the LED package set 110 includes two LED packages 40 of the first embodiment connected in series by the connection leads 11.

The LED package set 110 is adhered to the support 130 so that the LED chip 33 faces the inner surface of the transparent cover 150. The connecting lead 11 of the LED package set 110 is bonded to the upper portion of the support 130. At this time, an adhesive (not shown) is interposed between the connection lead 11 and the support 130. The adhesive is formed of a transparent adhesive material. For example, the adhesive can be a transparent paste.

In addition, the two LED package sets 110 are arranged to emit light in different directions. In an embodiment of the present invention, two LED package sets 110 are disposed to face each other. In addition, the two LED package set 110 may be arranged to be inclined slightly upward by the lead line 140. Therefore, the LED bulb 100 may emit light not only in the side but also in the upper direction.

Although two LED package sets 110 are described as an example in the present invention, the number of LED package sets 110 is not limited thereto. The number of the LED package set 110 may be changed, and the arrangement structure of the LED package set 110 may also be changed according to the number of the LED package set 110.

The lead line 140 is connected to the external electrodes of the LED package set 110 and the base unit 120, respectively. The external power applied to the external electrode of the base unit 120 by the lead line 140 is applied to the LED package set 110. For example, the positive power of the external power source is connected to the first electrode pad 13 of the LED package set 110 by the first external electrode 121 and the lead line 140 of the base unit 120. In addition, the negative power of the external power source is connected to the second electrode pad 14 of the LED package set 110 by the second external electrode 122 and the lead line 140 of the base unit 120.

At least a portion of the lead line 140 penetrates the support 130 to connect the external electrode and the LED package set 110. Therefore, the introduction line 140 may be fixed and protected from being moved by the support 130.

The lead wire 140 may be a duty wire having the iron-nickel alloy as a center line and the surface thereof covered with copper. However, the introduction line 140 is not limited to the duty line, and the material of the introduction line 140 may be any of conductive metals. In addition, the lead line 140 may have a strength sufficient to support the LED package set 110 so that the LED package set 110 is fixed in a tilted upward direction.

The conventional filament bulb has a high heat generation, and the filament becomes thinner due to the high heat generation temperature, thereby ending its life. In addition, the filament bulb often breaks the filament when a current is suddenly applied while the filament bulb is turned off. However, the LED bulb 100 according to the embodiment of the present invention uses an LED package set 110 to which an LED chip having a long life and low heat generation is applied instead of tungsten filament. Therefore, the LED bulb 100 is economically more efficient than the conventional filament bulb with low calorific value and long life.

The LED bulb 100 according to the exemplary embodiment of the present invention uses the LED package set 110 in which the plurality of LED packages 40 are electrically connected to each other. Accordingly, the LED bulb 100 has a lead line 140 connected to the first external electrode 121 and the second external electrode 122 per one LED package set 110 irrespective of the number of the LED packages 40. Only one of each is needed. Therefore, the LED bulb 100 according to the embodiment of the present invention is cost-effective because the lead line 140 does not need to be added even if the number of the LED packages 40 is increased.

Hereinafter, in the description of the other embodiments, the same configuration or overlapping description as the first embodiment will be omitted. The omitted contents will be described with reference to FIGS. 1 to 7.

Referring to FIG. 8, a plurality of LED packages 40 are mounted on the lead frame 10. At this time, the electrode position of the LED package 40 is disposed on the lead frame 10 so that the two LED packages 40 are reversed. For example, two neighboring LED packages 40 are disposed such that the positions of the anode electrode and the cathode electrode are the same. In addition, two LED packages 40 arranged side by side on one side thereof are arranged such that the positions of the anode electrode and the cathode electrode are opposite to these. For convenience of description, the plurality of LED packages 40 disposed on the lead frame 10 in FIG. 8 to FIG. 10 are sequentially described as first LED packages 41 to 8 LED packages 48. .

In an embodiment of the present invention, the cutting line C is formed such that the two LED package sets 210 are staggered from each other. For example, the cutting line C may be a connection lead 11 of the fourth LED package 44 and the fifth LED package 45 so that the fourth LED package 44 and the fifth LED package 45 are separated from each other. Is formed.

Further, the cutting line C may be formed between the first electrode pad 13 of the third LED package 43 and the first electrode pad 13 of the fourth LED package 44 and the first electrode pad 13 of the seventh LED package 47. The connection lead 11 is formed between the first electrode pad 13 and the first electrode pad 13 of the eighth LED package 48.

In addition, the cutting line C may be formed between the first electrode pad 13 of the first LED package 41 and the first electrode pad 13 of the second LED package 42 and the first electrode pad 13 of the fifth LED package 45. The connection lead 11 is formed between the first electrode pad 13 and the first electrode pad 13 of the sixth LED package 46.

In addition, the cutting line C is connected to the first electrode pad 13 of the first LED package 41, the fifth LED package 45, the fourth LED package 44, and the eighth LED package 48. It is formed to be separated from (11).

In addition, the cutting line C is connected to the second electrode pad 14 of the second LED package 42, the third LED package 43, the sixth LED package 46, and the seventh LED package 47. It is formed to be separated from (11).

When the cutting process is performed along the cutting line C of FIG. 8, the LED package set 210 is separated from the lead frame 10 as shown in FIG. 9. In this case, in the separated LED package set 210, two LED packages 40 are connected in series by the connection leads 11. In addition, the LED package set 210 may not include a neighboring LED package 40 but two odd-numbered LED packages 40 or two even-numbered LED packages 40. Therefore, the distance between two LED packages 40 is longer than in the first embodiment.

In addition, in the exemplary embodiment of the present invention, the curved portion 50 is formed in the lead frame 10. The curved portion 50 is formed to bend the connecting lead 11 and the electrode pad 12 at a predetermined angle.

The curved portion 50 may be formed in any shape and method as long as the connecting lead 11 and the electrode pad 12 can be bent. For example, the curved portion 50 may be formed by half etching a portion of the connection lead 11 and the electrode pad 12. Alternatively, the curved portion 50 may be formed to include at least one through hole penetrating a portion of the connection lead 11 and the electrode pad 12. Alternatively, the curved portion 50 may be formed by a mark in which a portion of the connecting lead 11 and the electrode pad 12 is pressed with a sharp object.

The curved portion 50 includes a first curved portion 51 formed on the connection lead 11 and a second curved portion 52 formed on the electrode pad 12 connected to the connection lead 11. The first curved portion 51 is formed between the electrode pads 12 in the connection lead 11 and is formed in the length direction of the LED package 40. That is, the first curved portion 51 is formed to be bent perpendicularly to the long axis direction of the connecting lead 11. In addition, the second curved portion 52 is formed in the width direction of the LED package 40 in the electrode pad 12. That is, the second curved portion 52 is formed to be bent perpendicularly to the long axis direction of the electrode pad 12. Here, the length of the LED package 40 is the distance between both side surfaces on which the first electrode pad 13 and the second electrode pad 14 are formed. In addition, the width of the LED package 40 is a distance between both sides of the LED package 40 between the first electrode pad 13 and the second electrode pad 14. Therefore, the length direction of the LED package 40 is a linear direction parallel to the length of the LED package 40, the width direction of the LED package 40 is a linear direction parallel to the width of the LED package 40.

Referring to FIG. 10, in the LED package set 210, the connecting lead 11 may be bent from side to side between two LED packages 40 by the first curved portion 51. As the connecting lead 11 is bent from side to side with respect to the first curved portion 51, the positions of the two LED packages 40 or the side direction in which the light is directed may be changed. Therefore, the first LED package 41 and the second LED package 42 may emit light in different lateral directions. Here, the direction in which the LED package 40 emits light is the direction in which the mounting surface of the substrate 31 of the LED package 40 faces. That is, the mounting surfaces of the substrate 31 on which the LED chips 31 of the first LED package 41 and the second LED package 42 are mounted face each other by the first curved portion 51. Can be deployed. Here, the lateral direction is the width direction of the LED package 40. In an embodiment of the present disclosure, the connection lead 11 may be bent such that the mounting surfaces of the substrate 31 of the first LED package 41 and the second LED package 42 are close to each other.

In addition, in the LED package set 210, the electrode pad 12 may be bent in an upward direction or a downward direction by the second curved portion 52. As the electrode pad 12 is bent upward or downward in the second curved portion 52, the vertical direction in which the mounting surface of the substrate 31 of the LED package 40 faces may be changed. Accordingly, the first LED package 41 may emit more light in the upward direction, and the second LED package 42 may emit more light in the downward direction.

The two LED packages 40 may emit light in different directions by bending the connection lead 11 and the electrode pad 12 by the first curved portion 51 and the second curved portion 52. . Therefore, the LED package set 210 may disperse light not only in the lateral direction but also in the vertical direction.

In the present embodiment, for convenience of description, the direction in which the mounting surface of the substrate 31 of the LED package 40 faces is expressed as the direction in which the LED package 40 emits light or the direction in which the LED package 40 faces. However, this expression is for convenience of description and is not limited to the LED package 40 of the present invention emits light only from one surface. It is apparent to those skilled in the art that the LED package 40 of the present invention emits light in all directions when the substrate 31 is a light transmissive substrate. Hereinafter, the same expression is also applied to other embodiments.

The LED bulb 200 according to the second embodiment includes two LED package sets 210 according to the second embodiment.

The LED package set 210 is attached to the upper surface of the support 130, the lower surface of the connecting lead 11 is erected inside the transparent cover 150. In this case, the first LED package 41 and the second LED package 42 constituting the LED package set 210 are arranged such that the connecting lead 11 is bent to face different side directions. In addition, the electrode pad 12 is bent so that the first LED package 41 faces upward and the second LED package 42 faces downward.

In the LED bulb 200, the two LED package sets 210 are disposed to face each other. As a result, the four LED packages 40 may be arranged to emit light in different directions. Therefore, the LED bulb 200 according to the embodiment of the present invention may allow the light to be emitted evenly in the upper direction and the lower direction as well as the side direction of the transparent cover 150.

Referring to FIG. 12, according to the second embodiment, the LED package set 210 has a structure in which the first LED package 41 and the second LED package 42 face different side directions. In this case, the connection lead 11 may be bent at the first curved portion 51 such that the mounting surfaces of the substrates 31 of the first LED package 41 and the second LED package 42 are close to each other.

In addition, the LED package set 210 has a structure in which the electrode pad 12 connected to the connection lead 11 is bent such that both the first LED package 41 and the second LED package 42 face upwards.

When the LED package set 210 having such a structure is applied to the LED bulb 200 as shown in FIG. 11, the LED package set 210 may emit light not only in the side surface of the transparent cover 150 but also in the upper direction.

Referring to FIG. 13, the LED package set 210 according to the second embodiment may include the first LED package 41 and the second LED package 42 at the first curved portion 51 such that the first LED package 41 and the second LED package 42 face different side directions. The connecting lead 11 can be bent. In this case, the connection lead 11 may be bent such that the mounting surfaces of the substrates 31 of the first LED package 41 and the second LED package 42 are separated from each other.

In addition, the LED package set 210 may include a connection pad 12 at the second curved portion 52 such that a mounting surface of the substrate 31 of the first LED package 41 and the second LED package 41 faces upward. ) Can be bent. In this case, more light may be emitted in the lateral direction and the upper direction of the LED package set 210.

The LED package 300 is applied to the LED package set 210 of FIG. 13.

The two LED package sets 210 are attached to the upper portion of the support 130 to the rear of the connection lead 11 is standing inside the transparent cover 150. Here, the rear surface of the connection lead 11 is one surface close to each other when the connection lead 11 is bent in the first curved portion 51 as shown in FIG. In addition, when the two LED package set 210 is bonded to the support, the connecting lead 11 of each of the LED package set 210 is disposed to face the back.

Since the LED package set 210 has a large area in which the connection lead 11 is in contact with the upper portion of the support 130, the LED package set 210 may be stably fixed to the support 130.

In addition, according to an embodiment of the present invention, the upper portion of the support 130 of the LED bulb 300 is formed to have a large circumference. The circumference of the upper portion of the support 130 is such that when the two LED package sets 210 are bonded to the upper portion of the support 130, each connection lead 11 or each LED package set 210 does not contact each other. Has the size of.

Therefore, the contact area between the LED package set 210 and the support 130 is improved, so that the LED package set 210 can be more stably fixed to the support 130.

In addition, since the two LED package sets 210 are not in contact with each other, they are insulated from each other. Accordingly, a separate insulating material for insulation between the two LED package sets 210 may be omitted.

Through various embodiments of the LED package set 210 according to the second embodiment, it has been described that the direction in which each LED package 40 emits light by the curved portion 50 may be adjusted. Furthermore, it was confirmed that the direction, range, distribution, etc. of the light emitted from the LED package set 210 and the

LED bulbs

200 and 300 may be adjusted by the royal curve 50.

Referring to FIG. 15, a plurality of LED packages 40 are disposed on the lead frame 10. The plurality of LED packages 40 are disposed such that the positions of the anode and cathode electrodes are opposite to the neighboring LED packages 40.

For example, in the odd numbered LED package 40 in FIG. 15, the cathode electrode is disposed in one direction of the lead frame 10 and the anode electrode is located in the other direction. In addition, the even numbered LED package 40 is disposed such that the anode electrode is located in one direction of the lead frame 10 and the cathode electrode is located in the other direction.

In the embodiment of the present invention, four LED packages 40 arranged side by side become one LED package set 310. Therefore, the cutting line C is formed such that one side and the other side of the lead frame 10 are cut for every four LED packages 40. In addition, the cutting line C is formed such that one side of the lead frame 10 between the second LED package 42 and the third LED package 43 is cut based on one LED package set 310. In addition, the cutting line C may have the other side of the lead frame 10 between the first LED package 41 and the second LED package 42 and between the third LED package 43 and the fourth LED package 44. It is formed to be cut. In addition, the cutting line C is formed such that the first LED package 41 and the fourth LED package 44 and the first electrode pad 13 are separated from the lead frame 10.

In addition, in the embodiment of the present invention, the first curved portion 51 is formed on one side of the lead frame 10 between the second LED package 42 and the third LED package 43. In addition, the first curved portion 51 on the other side of the lead frame 10 between the first LED package 41 and the second LED package 42 and between the third LED package 43 and the fourth LED package 44. ) Is formed. When the cutting process is performed according to the cutting line C, the LED package set 310 according to the third embodiment shown in FIG. 16 is formed. The LED package set 310 is connected to the second electrode pad 14 of the first LED package 41 and the first electrode pad 13 of the second LED package 42 by a connection lead 11. Accordingly, the first LED package 41 and the second LED package 42 are connected in series.

In addition, the second electrode pad 14 of the second LED package 42 and the first electrode pad 13 of the third LED package 43 are connected to the connection lead 11. Accordingly, the second LED package 42 and the third LED package 43 are connected in series.

In addition, the second electrode pad 14 of the third LED package 43 and the first electrode pad 13 of the fourth LED package 44 are connected to the connection lead 11. Thus, the third LED package 43 and the fourth LED package 44 are connected in series.

Thus, the first LED package 41 to the fourth LED package 44 of the LED package set 310 is connected in series.

The

LED bulbs

400 and 500 according to the fourth and fifth embodiments include the LED package set 310 according to the third embodiment.

In the LED package set 310, the connecting lead 11 is bent by the first curved portion 51 so that four LED packages 40 are arranged in the form of a square pillar. When the number of LED packages 40 included in the LED package set 310 is changed, the LED packages 40 may be arranged in the form of other polygonal pillars.

By the LED package set 310 having such a structure, the

LED bulbs

400 and 500 may emit light evenly in all lateral directions.

In the LED package set 310, the first electrode pad 13 that is not connected to the connection lead 11 is connected to the first external electrode 121 of the base part 120 by the lead line 140. In addition, in the LED package set 310, the second electrode pad 14 that is not connected to the connection lead 11 is connected to the second external electrode 122 of the base part 120 by the lead line 140. The first electrode pad 13 and the second electrode pad 14 connected to the lead line 140 are positioned under the LED package set 310.

Referring to FIG. 17, in the LED bulb 400 according to the fourth embodiment, the LED package set 310 is erected inside the transparent cover 150 by the lead line 140. The first LED package 41 to the fourth LED package 44 are supported by the connection lead 11 located above the LED package set 310 and the connection lead 11 positioned below the LED package set 310. In this case, the lead line 140 may be formed to have a strength capable of supporting the LED package set 310. By the structure of the LED package set 310 and the lead line 140, the LED package set 310 may be fixed and built up inside the transparent cover 150 even without a columnar upper portion of the support 130.

Referring to FIG. 18, in the LED bulb 500 according to the fifth embodiment, the LED package set 310 is adhered to the support 130 to stand in the light transmissive cover 150. The connecting lead 11 located at the top of the LED package set 310 is adhesively bonded to the top of the support 130 with an adhesive.

In addition, the LED bulb 500 may support the lower portion of the LED package set 310 using the lead line 140 as in the fourth embodiment. In this case, the LED package set 310 may be more firmly fixed to the inside of the transparent cover 150 because the upper portion is fixed by the support 130, the lower portion is supported by the lead line 140.

Referring to FIG. 19, a plurality of LED packages 40 are mounted on the lead frame 10.

The lead frame 10 includes two internal spaces 15 in which a plurality of LED packages 40 are disposed, and the two internal spaces 15 share a connection lead 11 formed therebetween. The electrode pad 12 is formed integrally with the connection lead 11 formed between the two internal spaces 15 and the connection lead 11 facing one side and the other side of the connection lead 11.

The plurality of LED packages 40 are arranged side by side in the two interior space (15). The LED package 40 disposed in one inner space 15 is divided into a first LED package 41, and the LED package 40 disposed in another inner space 15 is divided into a second LED package 42. To explain. The plurality of LED packages 40 are disposed such that both the anode electrode and the cathode electrode face the same direction.

The cutting line C is formed such that the electrode pads 12 of the first LED package 41 and the second LED package 42 are separated from both sides of the lead frame 10. In addition, the cutting line C is formed such that the connection lead 11 between the LED package 40 and the neighboring LED package 40 is cut in one internal space 15. In this case, the first LED package 41 and the second LED package 42 arranged side by side via the two inner spaces 15 are connected by connecting leads 11 positioned between the two inner spaces 15. . That is, the cutting line C is formed to be separated from the lead frame 10 in a state where the first LED package 41 and the second LED package 42 in the same row are connected.

In addition, a second curved portion 52 may be formed between the connection lead 11 and the electrode pad 12 between the two inner spaces 15.

Referring to FIG. 20, the LED package set 410 according to the fourth embodiment, which is cut along the cutting line C and separated from the lead frame 10, is illustrated.

In the LED package set 410 according to the fourth embodiment, the second electrode pad 14 of the first LED package 41 and the first electrode pad 13 of the second LED package 42 are connected to the lead 11. Is electrically connected by Accordingly, the LED package set 410 according to the fourth exemplary embodiment includes a first LED package 41 and a second LED package 42 connected in series and arranged in a line.

The LED bulb 600 according to the sixth embodiment includes the LED package set 410 according to the fourth embodiment.

In the LED package set 410, second curved portions 52 are formed on electrode pads 12 connected to both sides of the connection lead 11, respectively. In the LED package set 410, the electrode pad 12 is bent downward in each second curved portion 52. Accordingly, the LED package set 410 has a structure in which two LED packages 40 face opposite sides of each other.

In the embodiment of the present invention, two LED package sets 410 included in the LED bulb 600 will be described by dividing them into a first LED package set 411 and a second LED package set 412.

The connecting lead 11 of the first LED package set 411 is positioned on the upper surface of the support 130, and is bonded to the upper surface of the support 130. In this case, an insulating adhesive 610 is interposed between the connection lead 11 and the support 130 of the first LED package set 411. When the first LED package set 411 is bonded to the support 130, the two LED packages 40 of the first LED package set 411 emit light in opposite lateral directions with respect to the support 130. Is arranged to.

The connection lead 11 of the second LED package set 412 is positioned on the top surface of the support 130 and the top surface of the connection lead 11 of the first LED package set 411. In this case, the second LED package set 412 is arranged such that the connection lead 11 is crossed with the connection lead 11 of the first LED package set 411. An insulating adhesive 610 is interposed between the connecting lead 11 of the second LED package set 412 and the upper surface of the connecting lead 11 of the first LED package set 411. In addition, an insulating adhesive 610 may be interposed between the connecting lead 11 of the second LED package set 412 and the upper surface of the support 130. The two LED packages 40 of the second LED package set 412 are arranged to emit light in opposite lateral directions relative to the support 130.

In addition, the first LED package set 411 and the second LED package set 412 are disposed so that the LED package 40 does not overlap. Therefore, since the LED bulb 600 includes a plurality of LED packages 40 disposed to face different side directions, the LED bulb 600 may emit light evenly through the side surface of the transparent cover 150.

In addition, the LED package set 410 may vary the angle at which the electrode pad 12 is bent. For example, as shown in FIG. 21, the LED package set 410 may have a structure in which the LED package 40 is inclined upward. Therefore, since the LED bulb 600 may emit light not only in the side direction of the transparent cover 150 but also in the upper direction, the LED bulb 600 may eventually emit light evenly in the side direction and the upper direction of the transparent cover 150.

According to the exemplary embodiment of the present invention, the plurality of LED packages 40 are disposed to have the same polarity as the neighboring LED packages 40. That is, the plurality of LED packages 40 are all disposed such that the anode electrode and the cathode electrode of the LED array 32 face the same direction.

Referring to FIG. 23, the lead frame 20 is disposed on the plurality of LED packages 40. The lead frame 20 has a structure in which a plurality of electrode pads 12 protrude to one side or the other side of the connection lead 11. The lead frame 20 is disposed at one end and the other end of the LED package 40, respectively. At this time, the upper surfaces of both ends of the substrate 31 are in contact with the lower surface of the electrode pad 12, respectively.

The electrode pad 12 is divided into a first electrode pad 13 and a second electrode pad 14. The first electrode pad 13 is an anode electrode pad, and the second electrode pad 14 is a cathode electrode pad. That is, the first electrode pad 13 is connected to the anode electrode of the LED array 32, and the second electrode pad 14 is connected to the cathode electrode of the LED array 32.

Marks 16 are formed on at least some of the plurality of electrode pads 12. In the exemplary embodiment of the present invention, the mark 16 is formed on the first electrode pad 13. After arranging the lead frames 20 on the plurality of LED packages 40, wire bonding is performed on the LED packages 40 and the lead frames 20. The anode electrode of each LED package 40 is electrically connected to the first electrode pad 13 through a wire. In addition, the cathode electrode of each LED package 40 is electrically connected to the second electrode pad 14 through a wire.

Referring to FIG. 24, the wavelength converter 34 is formed to surround the LED array 32.

25 shows a cut line C of the lead frame 20. The cutting line C is a line indicating a portion where the lead frame 20 is cut when the cutting process is performed.

For convenience of explanation, the plurality of LED packages 40 disposed on the lead frame 20 will be described by being divided into first LED packages 41 to sixth LED packages 46 in order.

In an embodiment of the present invention, the cutting line C is formed such that the three LED packages 40 are connected in parallel by the connection leads 11. For example, the cutting line C may be a connection lead 11 between the third LED package 43 and the fourth LED package 44 such that the third LED package 43 and the fourth LED package 44 are separated from each other. Is formed. When the cutting process is performed along the cutting line C, the at least one LED package set 710 is separated from the lead frame 20.

FIG. 26 is a set of LED packages 710 separated from the lead frame 20 by a cutting process along the cutting line C of FIG. 25. The LED package set 710 according to the seventh embodiment has a structure in which three LED packages 40 are connected in parallel. The LED package set 710 includes three LED packages 40, connection leads 11, and electrode pads 12. Here, the first electrode pad 13 and the second electrode pad 14 are integrated with the connection lead 11 connected to each other.

When the lead frame 20 is cut along the cutting line C, as shown in FIG. 26, the first electrode pads 13 of the first LED package 41 to the third LED package 43 may be separated by one. It is connected by the connection lead 11. In addition, the second electrode pads 14 of the first LED package 41 to the third LED package 43 are connected by the other connection lead 11.

In addition, in the fourth LED packages 44 to sixth LED package 46, the first electrode pads 13 are all connected to one connection lead 11, and the second electrode pads 14 are all the other. Is connected to the connecting lead 11.

Accordingly, two LED package sets 710 according to the seventh exemplary embodiment, in which three LED packages 40 are connected in parallel, are formed.

However, according to the exemplary embodiment of the present invention, the LED packages 40 are not separately separated from the lead frame, but are electrically connected to each other using the lead frame.

Therefore, in the method of manufacturing the LED package set 710 according to an embodiment of the present invention, a process of manufacturing a separate component for connecting the LED packages 40 may be omitted. In addition, the manufacturing method of the LED package set 710 may omit the step of electrically connecting the LED package 40 using a separately manufactured component. That is, in the related art, a wire is used for electrical connection between the plurality of LED packages 40. However, according to an embodiment of the present invention, there is no need for a wire for electrical connection between the plurality of LED packages 40, there is no need for a process of connecting the wires to the LED package 40. Since the manufacturing process of the LED package set 710 is simplified and manufacturing time and material cost are reduced, the productivity of the bulb manufactured using the LED package set 710 is also improved.

Hereinafter, for convenience of description, the two LED package sets 710 are divided into a first LED package set 711 and a second LED package set 712 to be described.

Referring to FIG. 27, the LED bulb 700 according to the seventh exemplary embodiment may include a base 120, a support 130, an LED package set 710, an introduction line 140, a transparent cover 150, and a connection 160. ).

Two LED package sets 710 are positioned inside the transparent cover 150. Here, the two LED package sets 710 are the first LED package set 711 and the second LED package set 712 according to the seventh embodiment.

The first LED package set 711 and the second LED package set 712 are bonded to the support 130 to stand so that the LED chip 33 faces the inner side of the translucent cover 150. In addition, the first LED package set 711 and the second LED package set 712 may be arranged such that the electrodes face in different directions. For example, the first LED package set 711 is disposed so that the second electrode pad 14 faces upward, and the second LED package set 712 has the first electrode pad 13 facing upward. It may be arranged to.

At this time, each of the first LED package set 711 and the second LED package set 712 is bonded to the upper portion of the support 130, each connecting lead 11 facing upward. In addition, the first LED package set 711 and the second LED package set 712 may be arranged to emit light in different directions. For example, the first LED package set 711 and the second LED package set 712 may be disposed to face each other. In addition, the first LED package set 711 and the second LED package set 712 may be arranged to be inclined slightly upward by the lead line 140. Therefore, the LED bulb 700 may emit light not only in the side but also in the upper direction.

Although two LED package sets 710 are described as an example in the present invention, the number of LED package sets 710 is not limited thereto. The number of the LED package set 710 may be changed, and the arrangement structure of the LED package set 710 may also be changed according to the number of the LED package set 710.

The connection unit 160 may include a connection lead 11 connected to the second electrode pad 14 in the first LED package set 711 and a connection lead connected to the first electrode pad 13 in the second LED package set 712. 11) is electrically connected. Accordingly, the first LED package set 711 and the second LED package set 712 are electrically connected in series.

The connection lead 11 connected to the first electrode pad 13 of the first LED package set 711 is connected to the first external electrode 121 and the lead line 140 of the base 120 to supply a positive amount of external power. Connected with In addition, the connection lead 11 connected to the second electrode pad 14 of the second LED package set 712 is connected to the negative electrode of the external power source through the second external electrode 122 and the lead line 140 of the base 120. Is connected to the power supply. The lead line 140 at least partially penetrates the support 130 to connect the first external electrode 121 and the first LED package set 711, and the second external electrode 122 and the second LED package set 122. ). Thus, the lead line 140 is fixed so as not to move by the support 130, it can be protected.

In addition, the lead line 140 may have a strength sufficient to support the LED package set 710 so that the first LED package set 711 and the second LED package set 712 are fixed in a tilted upward direction. Can be.

The LED bulb 700 according to the embodiment of the present invention may emit light evenly in the lateral direction and the upper direction by the structure of the LED package set 710, the support 130, and the lead line 140 according to the seventh embodiment. Can be.

Hereinafter, in the description of other embodiments, the same configuration or overlapping description as the seventh embodiment will be omitted. The omitted contents will be described with reference to FIGS. 22 to 27.

Referring to FIG. 28, a plurality of listed LED packages 40 and lead frames 20 are connected. A method of connecting the LED package 40 and the lead frame 20 will be described with reference to FIGS. 22 to 25. The plurality of LED packages 40 are disposed such that the positions of the anode electrode and the cathode electrode are the same.

In an embodiment of the present invention, the cutting line C is formed such that the three LED packages 40 are connected in parallel by the connection leads 11. For example, the cutting line C is formed in the connection lead 11 between the third LED package 43 and the fourth LED package 44. In addition, the first lead portion 51 is formed in the connection lead 11 between each of the LED package 40.

The first curved portion 51 is formed between the electrode pads 12 in the connection lead 11 and is formed in the length direction of the LED package 40. That is, the first curved portion 51 is formed to be bent perpendicularly to the long axis direction of the connecting lead 11. Here, the length of the LED package 40 is the distance between both side surfaces on which the first electrode pad 13 and the second electrode pad 14 are formed. Therefore, the longitudinal direction of the LED package 40 is a linear direction parallel to the length of the LED package 40.

The first curved portion 51 is formed to bend the connecting lead 11 at a predetermined angle. The first curved portion 51 may be formed in any form and method as long as the connecting lead 11 can be bent. For example, the first curved portion 51 may be formed by half etching a portion of the connection lead 11. Alternatively, the first curved portion 51 may be formed as at least one through hole penetrating a portion of the connection lead 11. Alternatively, the first curved portion 51 may be formed as a mark pressing a part of the connection lead 11 with a pointed object.

Referring to FIG. 28, the first curved portion 51 is formed in the connection lead 11 between the respective LED packages 40, and the connection lead 11 is formed to bend to the left and right.

When the lead frame 20 is cut along the cutting line C, two LED package sets 810 are formed.

The first LED package set 811 has a structure in which the first LED package 41 to the third LED package 43 are connected in parallel by the connection leads 11. The first electrode pads 13 of the first LED package 41 to the third LED package 43 are all connected to one connection lead 11, and the second electrode pads 14 are connected to the other connection lead ( 11).

In addition, the second LED package set 812 has a structure in which the fourth LED packages 44 to sixth LED packages 46 are connected in parallel by the connection leads 11. The first electrode pads 13 of the fourth LED package 44 to the sixth LED package 46 are all connected to one connection lead 11, and the second electrode pads 14 are connected to the other connection lead ( 11).

When the two LED package sets 810 separated from the lead frame 20 are bent along the first curved portion 51 of the connecting lead 11, the LED package set 810 shown in FIG. 29 becomes.

Referring to FIG. 29, when the connecting lead 11 is bent along the first curved portion 51, three LED packages 40 included in one LED package set 810 are disposed to face different side directions. Can be. Thus, each LED package 40 may emit light in different lateral directions. Here, the direction in which the LED package 40 emits light is a direction in which the mounting surface of the substrate 31 on which the LED array 32 is mounted in the LED package 40 faces. In addition, the lateral direction is the width direction of the LED package 40. The width of the LED package 40 is a distance between both sides of the LED package 40 between the first electrode pad 13 and the second electrode pad 14. Therefore, the width direction of the LED package 40 is a linear direction parallel to the width of the LED package 40.

In the LED package set 810 according to the eighth embodiment of the present invention, the connecting lead 11 is bent such that the rear surfaces of the LED packages 40 disposed at both ends of the LED package set 810 are close to each other. Here, the rear surface is the opposite surface of the mounting surface of the substrate 31.

As such, the LED package set 810 according to the embodiment of the present invention may be formed such that each of the LED packages 40 emits light in different lateral directions by the first curved portion 51.

The LED package set 810 according to the eighth embodiment of the present invention has a structure in which the connecting lead 11 is bent so that the rear surfaces of the LED packages 40 disposed at both ends thereof are close to each other. However, on the contrary, the LED package set 810 may have a structure in which the connection lead 11 is bent such that mounting surfaces of the LED packages 40 disposed at both ends are close to each other.

Referring to FIG. 30, the LED bulb 800 according to the eighth embodiment includes two LED package sets 810 according to the eighth embodiments.

The first LED package set 811 may be disposed so that the second electrode pad 14 faces upward, and the second LED package set 812 may be disposed so that the first electrode pad 13 faces upward. have.

In this case, the first LED package set 811 and the second LED package set 812 are bonded to the upper portion of the support 130, each connecting lead 11 facing in the upper direction.

In addition, the first LED package set 811 and the second LED package set 812 are serially connected to each other by the connection unit 160.

According to the eighth embodiment, the first LED package set 811 and the second LED package set 812 formed to emit light in different lateral directions are disposed to face each other. As a result, six LED packages 40 may be arranged to surround the support 130. Thus, the LED bulb 800 may emit light evenly through the entire side rather than a portion of the side.

In addition, the lead line 140 may support the lower portion of the LED package set 810 such that the LED package set 810 is inclined in an upward direction as shown in FIG. 30. The LED package set 810 is disposed to be inclined upwardly, so that the LED bulb 800 may emit light in the upward direction.

Therefore, the LED bulb 800 according to the embodiment of the present invention evenly in the lateral direction and the upper direction by the structure, the support 130, the lead line 140 of the LED package set 810 according to the eighth embodiment. Can be released.

In another embodiment, the LED bulb 800 that emits light only in a predetermined range by using the LED package set 810, the connecting lead 11 is bent so that the mounting surface of the LED package 40 disposed at both ends close to each other It is also possible to produce.

Referring to FIG. 31, the plurality of LED packages 40 are disposed such that the positions of the anode electrode and the cathode electrode are reversed every three LED packages 40. That is, the first LED package 41 to the third LED package 43 is disposed such that the cathode electrode is located in one direction of the lead frame 20 and the anode electrode is located in the other direction. The fourth LED packages 44 to sixth LED packages 46 are disposed such that an anode electrode is positioned in one direction of the lead frame 20 and a cathode electrode is positioned in the other direction.

One side of the lead frame 20 has a cutting line C formed between the third LED package 43 and the fourth LED package 44. In addition, a cut line C is formed at the other side of the lead frame 20 so that all the electrode pads 12 and the connection leads 11 are separated.

In addition, the first lead portion 51 is formed between the respective LED packages 40 on the connection lead 11 on one side of the lead frame 20. In addition, a second curved portion 52 is formed in the electrode pad 12 connected to the connection lead 11. The second curved portion 52 is formed in the width direction of the LED package 40 in the electrode pad 12. That is, the second curved portion 51 is formed to be bent perpendicularly to the long axis direction of the electrode pad 12. The first curved portion 51 is formed to bend the connecting lead 11, and the second curved portion 52 is formed to bend the electrode pad 12.

When the cutting is performed along the cutting line C and the connecting lead 11 and the electrode pad 12 are bent along the first and second

curved portions

51 and 52, the ninth embodiment of FIG. According to the LED package set 910 is formed.

In the LED package set 910 according to the ninth embodiment, three LED packages 40 are connected in parallel by one connection lead 11. Only the second electrode pads 14 are connected to one connection lead 11 in the first LED package set 911, and the first electrode pads 13 are separated from each other. In addition, only the first electrode pads 13 are connected to one connection lead 11 in the second LED package set 912, and the second electrode pads 14 are separated from each other.

In addition, in the first LED package set 911 and the second LED package set 912, the connection lead 11 may be bent left and right by the first curved portion 51.

In the embodiment of the present invention, the first lead package set 911 has the connection lead 11 bent such that the rear surfaces of the first LED package 41 and the third LED package 43 are close to each other. In the second LED package set 912, the connecting lead 11 is bent such that the rear surfaces of the fourth LED package 44 and the sixth LED package 46 are close to each other. Accordingly, the LED packages 40 including the first LED package set 911 and the second LED package set 912 may emit light toward different side directions.

In addition, in the first LED package set 911 and the second LED package set 321, the electrode pad 12 may be bent upward or downward by the second curved portion 52.

In the embodiment of the present invention, the first LED package set 911 is bent in the vertical direction different from the second electrode pad 14 of the first LED package 41 to the third LED package 43, respectively. In addition, in the second LED package set 912, the first electrode pads 13 of the fourth LED packages 44 to sixth LED package 46 are bent in different vertical directions, respectively. Accordingly, the LED packages 40 including the first LED package set 911 and the second LED package set 912 may emit light toward different vertical directions.

The LED bulb 900 according to the ninth embodiment includes the LED package set 910 according to the ninth embodiment.

The first LED package set 911 and the second LED package set 912 are bonded to the upper portion of the support 130 and fixed to the support 130. In addition, the first LED package set 911 and the second LED package set 912 are disposed to face each other.

The connection unit 160 electrically connects the connection lead 11 of the first LED package set 911 and the connection lead 11 of the second LED package set 912. Therefore, the first LED package set 911 and the second LED package set 912 are connected in series by the connection unit 160.

The first electrode pad 13 of the first LED package set 911 is connected to the first external electrode 121 of the base unit 120 through the lead line 140. In addition, the second electrode pad 14 of the second LED package set 912 is connected to the second external electrode 122 of the base part 120 through the lead line 140.

The LED packages 40 of the first LED package set 911 and the second LED package set 912 may both emit light in different directions. Therefore, the LED bulb 900 according to the ninth embodiment may emit light evenly in the upper direction and the lower direction, as well as the side of the transparent cover 150.

While describing various embodiments of the present disclosure, it has been described by way of example that an LED package set includes three LED packages. However, the number of LED packages included in the LED package set is not limited thereto, and the number of LED packages may be changed by a person skilled in the art.

While describing various embodiments of the present disclosure, it has been described by way of example that an LED package set includes two to four LED packages. However, the number of LED packages included in the LED package set is not limited thereto. According to the selection of a person skilled in the art, the number of LED packages included in the LED package set may be changed.

In the above, various embodiments of the present invention have been described, but the present invention is not limited to the various embodiments and features described above, and various modifications may be made without departing from the technical spirit of the claims of the present invention. Changes are possible.

Claims

A plurality of LED packages including a substrate, an LED array including a plurality of LED chips mounted on at least one surface of the substrate and electrically connected to each other, and a pair of electrode pads respectively disposed at both ends of the substrate and electrically connected to the LED array. ; And

And connecting leads connecting one end of the electrode pads between two LED packages adjacent to each other.

The electrode pads of the other end are separated from each other between the two adjacent LED packages,

The plurality of LED packages are electrically connected in series,

And the connection lead is integral with the electrode pad connected thereto.
The method according to claim 1,

The LED package set includes two LED packages,

And one electrode pad at one end of the two LED packages is connected by the connection lead, and the electrode pads at the other end are separated from each other.
The method according to claim 1,

The LED package set includes three or more LED packages,

Except for the two LED packages located at both ends, the remaining LED packages are connected to each other through the connection lead and the different LED packages adjacent to each other's electrode pads.

Two LED packages located at both ends of the LED package set including an electrode pad that is not coupled to the connecting lead.
The method according to claim 1,

And the connecting lead further comprises a first curved portion bent to bring two connected LED packages into proximity to each other.
The method according to claim 1,

The electrode package of the LED package further comprises a second curved portion bent to bring the connection lead and the substrate in close proximity to the LED package set.
The method according to claim 1,

An LED package set in which the substrate of each of the plurality of LED packages is a transparent substrate.
The method according to claim 1,

Each of the plurality of LED packages further comprises a wavelength conversion unit formed to cover at least one surface of the substrate and the LED array.
The method according to claim 6,

Each of the plurality of LED packages further comprises a wavelength conversion unit formed to cover both sides of the substrate and the LED array.
A transparent substrate, an LED array including a plurality of LED chips disposed on one surface of the transparent substrate and connected in series, a wavelength conversion layer covering one surface of the transparent substrate and the LED array, an anode electrode pad connected to one end of the LED array, And a first LED package and a second LED package each including a cathode electrode pad connected to the other end of the LED array. And

And one connection lead connecting the anode electrode pad of the first LED package and the cathode electrode pad of the second LED package.

The connection lead is integrally formed with the anode electrode pad of the first LED package and the cathode electrode pad of the second LED package,

And a cathode electrode pad of the first LED package and an anode electrode pad of the second LED package are spaced apart from each other.
The method according to claim 9,

And at least one first royal portion configured to be bent in a direction perpendicular to a long axis direction of the connection lead.
The method according to claim 9,

The LED package set of the anode electrode pad of the first LED package and the cathode electrode pad of the second LED package connected to the connection lead are further formed to be bent in the vertical direction in the longitudinal direction, respectively.
A transparent substrate, an LED array including a plurality of LED chips disposed on one surface of the transparent substrate and connected in series, a wavelength conversion layer covering one surface of the transparent substrate and the LED array, an anode electrode pad connected to one end of the LED array, And first to fourth LED packages including cathode electrode pads connected to the other ends of the LED array, respectively. And

A first connection lead connecting the anode electrode pad of the first LED package and the cathode electrode pad of the second LED package, a second connecting the anode electrode pad of the second LED package and the cathode electrode pad of the third LED package And a third connection lead connecting the second connection lead and the anode electrode of the third LED package and the cathode electrode pad of the fourth LED package.

The first, second and third connection leads are integrally formed with the connected anode and cathode electrode pads,

And a cathode electrode pad of the first LED package and an anode electrode pad of the fourth LED package are separated from other electrode pads.
The method according to claim 12,

And each of the connection leads includes a first curved portion configured to be bent perpendicularly to a long axis direction.
A base part having a pair of external electrodes connected to an external power source;

A plurality of LED packages including a substrate, an LED array mounted on at least one surface of the substrate and electrically connected to the plurality of LED chips, and a pair of electrode pads connected to both ends of the LED array, and the plurality of LED packages At least one LED package set each including a connection lead connecting electrode pads of neighboring LED packages to be electrically connected in series;

At least one pair of lead wires electrically connecting the external electrode of the base portion to the electrode pads not connected by the connection leads of the LED package set; And

And a translucent cover that surrounds the LED package set and the pair of lead lines and has one end coupled to the base portion.

LED bulb connected to the connecting lead and the connecting lead is integral.
The method according to claim 14,

The LED package set includes two LED packages,

LED bulbs of one end of the two LED package is connected by the connecting lead, the electrode pads of the other end is separated from each other.
The method according to claim 14,

The LED package set includes three or more LED packages,

Except for two LED packages located at both ends, the remaining LED packages are connected to each other through the connection lead and the different LED packages adjacent to the electrode pads at both ends.

LED bulbs located at both ends include an electrode pad that is not coupled to the connection lead.
The method according to claim 14,

The connecting lead further includes a first curved portion bent so that the two connected LED packages are in close proximity to each other, the LED bulb that the two connected LED packages are dimmed in different directions.
The method according to claim 14,

The LED package of the LED package further comprises a second curved portion so that the connection lead and the substrate is in close proximity, each of the LED package is a LED bulb that is directed toward the top of the LED bulb.
The method according to claim 14,

The LED bulb of each of the plurality of LED package is a light-transmissive substrate.
The method according to claim 14,

Each of the plurality of LED package further comprises a wavelength conversion unit formed to cover at least one surface of the substrate and the LED array.
The method according to claim 14,

Each of the plurality of LED package further comprises a wavelength conversion unit formed to cover both sides of the substrate and the LED array.
The method according to claim 14,

The lead wire is connected to the electrode pad that is not connected to the connection lead at the other end of the plurality of LED packages.
The method according to claim 14,

It is disposed inside the transparent cover, and further comprising a support extending in an upward direction from the base portion,

LED bulb that the connecting lead is supported on the upper or upper surface of the support.
The method according to claim 14,

It is disposed inside the transparent cover, and further comprising a support extending in an upward direction from the base portion,

LED bulb to which the connecting lead is attached to the upper or upper surface of the support.
The method according to claim 14,

The LED package set is a plurality,

An LED bulb each of the plurality of LED package set is distinguished and electrically connected to the base portion.
A plurality of LED packages including a substrate, an LED array including a plurality of LED chips mounted on at least one surface of the substrate and electrically connected to each other, and a pair of electrode pads respectively disposed at both ends of the substrate and electrically connected to the LED array. ; And

A connection lead electrically connecting the electrode pads disposed at one end of the plurality of LED packages;

Including,

The connection lead is integral with the electrode pad connected thereto.

And a plurality of LED packages are electrically connected in parallel.
The method of claim 26,

The LED package set of the electrode pads disposed on the other end of the plurality of LED packages are separated from each other.
The method of claim 26,

And the connection lead further comprises a first curved portion bent such that neighboring LED packages connected to the connection lead are close to each other.
The method of claim 26,

And the electrode pad connected to the connection lead further includes a second curved portion bent such that the substrate and the connection lead are close to each other.
The method of claim 26,

And the substrate is a light transmissive substrate.
The method of claim 26,

The LED package further comprises a wavelength conversion unit formed to cover at least one surface of the substrate and the LED array.
The method of claim 26,

The LED package set is formed on the other end of the plurality of LED packages, further comprising a connection lead for electrically connecting the electrode pads disposed on the other end of the plurality of LED packages.
The method according to claim 32,

And a connection lead formed at the other end of the plurality of LED packages is integrated with the electrode pads connected thereto.
The method according to claim 32,

The LED package set is further formed in the connection lead formed on the other end of the plurality of LED package is a first curved portion that is bent so that neighboring LED packages connected to the connection lead is close to each other.
A base part having a plurality of external electrodes connected to an external power source;

A plurality of LED packages including a substrate, an LED array including a plurality of LED chips mounted on at least one surface of the substrate and electrically connected to each other, and a pair of electrode pads respectively disposed at both ends of the substrate and electrically connected to the LED array. And at least one LED package set including connection leads for electrically connecting the electrode pads disposed at one end of the plurality of LED packages.

A plurality of lead lines electrically connecting the external electrode of the base portion to the LED package set; And

A translucent cover surrounding the LED package set and the plurality of lead lines and having one end coupled to the base part;

Including;

The connection lead is integral with the electrode pad connected thereto.

LED bulbs of the plurality of LED packages are electrically connected in parallel.
The method of claim 35, wherein

The connection lead LED bulb further comprises a first curved portion bent so that adjacent LED packages connected to the connection lead to each other.
The method of claim 35, wherein

The electrode pad connected to the connection lead further includes a second curved portion bent so that the substrate and the connection lead close to each other.
The method of claim 35, wherein

LED substrate is a light-transmissive substrate.
The method of claim 35, wherein

The LED package further comprises a wavelength conversion unit formed to cover at least one surface of the substrate and the LED array.
The method of claim 35, wherein

It is disposed inside the transparent cover, and further comprising a support extending in the upper direction from the base portion,

LED bulb that the connection lead is supported or bonded to the upper or upper surface of the support.
The method of claim 35, wherein

LED bulbs disposed on the other end of the plurality of LED packages are separated from each other.
The method of claim 41,

LED lead lines are respectively connected to the electrode pads disposed at the other ends of the plurality of LED packages.
The method of claim 35, wherein

The LED bulb is formed on the other end of the plurality of LED packages, further comprising a connection lead for electrically connecting the electrode pads disposed on the other end of the plurality of LED packages.
The method of claim 43,

LED bulbs formed on the other end of the plurality of LED packages are integral with the electrode pads connected.
The method of claim 43,

LED bulbs are further formed in the connection leads formed on the other end of the plurality of LED packages bent so that neighboring LED packages connected to the connection leads are adjacent to each other.
The method of claim 43,

The lead bulb is connected to the LED lead formed on the other end of the plurality of LED packages.
The method of claim 35, wherein

The LED package set is a plurality of LED bulbs.
The method of claim 47,

Further comprising a connection line for electrically connecting the plurality of LED package sets,

And the connection line is electrically connected to the connection leads formed at one end of the plurality of LED packages to electrically connect the plurality of LED package sets in series.