KR101849127B1 - Light emitting device array - Google Patents

Abstract

An embodiment includes a light emitting device package and a substrate on which the light emitting device package is disposed and including a base layer, an insulating layer, and a substrate including a copper foil layer between the base layer and the insulating layer, And a first distance from a side of the base layer adjacent to the first side.

Description

[0001] The present invention relates to a light emitting device array

An embodiment relates to a light emitting element array.

As a typical example of a light emitting device, a light emitting diode (LED) is a device for converting an electric signal into an infrared ray, a visible ray, or a light using the characteristics of a compound semiconductor, and is used for various devices such as household appliances, remote controllers, Automation equipment, and the like, and the use area of LEDs is gradually widening.

In general, miniaturized LEDs are made of a surface mounting device for mounting directly on a PCB (Printed Circuit Board) substrate, and an LED lamp used as a display device is also being developed as a surface mounting device type . Such a surface mount device can replace a conventional simple lighting lamp, which is used for a lighting indicator for various colors, a character indicator, an image indicator, and the like.

As the use area of LEDs is widening as such, researches are being conducted to remove the luminance and the odor in the air of LEDs required for living lamps and structural signal lamps.

The embodiment is to provide a light emitting element array in which the reliability of the insulating layer disposed in the base layer can be easily improved.

The light emitting device array according to the embodiment includes a base layer, an insulating layer, and a substrate including a copper foil layer between the base layer and the insulating layer, wherein the light emitting device package and the light emitting device package are disposed, The first side may be spaced a first distance from a side of the base layer adjacent the first side.

A light emitting device array according to an embodiment includes a base layer, an insulating layer, and a substrate including a copper foil layer between the base layer and the insulating layer, wherein the light emitting device package and the light emitting device package are disposed, , An upper portion and at least one side of the base layer.

In the light emitting device array according to the embodiment, the insulating layer is disposed on the upper surface of the base layer so as to be spaced from the side surface of the base layer, or disposed on the upper surface and the side surface of the base layer. There is an advantage that breakage can be prevented.

1 is an exploded perspective view schematically showing a light emitting device module including a light emitting device array according to an embodiment.
2 is a perspective view illustrating an embodiment of the light emitting device package shown in FIG.
3 is a perspective view showing the substrate shown in the first embodiment.
4 is a cross-sectional view of the substrate shown in Fig. 3 taken along the line P1-P1.
5 is a cross-sectional view showing the P2-P2 section of the substrate shown in Fig.
6 is a perspective view showing the substrate shown according to the second embodiment.
7 is a cross-sectional view showing a P3-P3 section of the substrate shown in Fig.
8 is a cross-sectional view of the substrate shown in Fig. 6 taken along the line P4-P4.
9 is a perspective view illustrating a lighting device including a light emitting device array according to an embodiment.
10 is a cross-sectional view showing a cross-section taken along the line AA 'of the lighting apparatus shown in Fig.
11 is an exploded perspective view of a liquid crystal display including the light emitting element array according to the first embodiment.
12 is an exploded perspective view of a liquid crystal display device including a light emitting element array according to the second embodiment.

In the description of this embodiment, in the case where a device is described as being formed "on or under" another device, the upper (upper) or lower (lower) on or under includes both the two devices being in direct contact with each other or one or more other devices being indirectly formed between the two devices. Also, when expressed as "on or under", it may include not only an upward direction but also a downward direction with respect to one device.

In the drawings, the thickness and size of each layer are exaggerated, omitted, or schematically illustrated for convenience and clarity. Therefore, the size of each component does not entirely reflect the actual size.

Further, the angles and directions mentioned in the description of the structure of the light-emitting element array in the present specification are based on those described in the drawings. In the description of the structure of the light emitting element array in the specification, reference points and positional relationship with respect to angles are not explicitly referred to.

1 is an exploded perspective view schematically showing a light emitting device module including a light emitting device array according to an embodiment.

Referring to FIG. 1, the light emitting device module 200 may include a power control module 210, a light emitting device array 100, and a connector 130.

The power supply control module 210 generates power consumed by the light emitting device package 110 mounted on the light emitting device array 100 and controls the operation of the power supply 212 and the power supply 212 214 and a connector connection part 216 to which one side of the connector 130 is connected.

At this time, the power supply 212 operates under the control of the control unit 214 and generates the power consumed by the light emitting device array 100.

The control unit 214 can control the operation of the power supply 212 according to an externally input command.

In this case, the command input from the outside may be a command output from an input device (not shown) connected directly to the light emitting device module 200 and a remote control for commanding the operation of the device including the light emitting device module 200, It is not limited to this.

The connector connection unit 216 is connected to one side of the connector 130 and can supply the power supplied from the power supply 212 to the connector 130.

The light emitting device array 100 may include a light emitting device package 110 and a light emitting device package 110 and a substrate 120 on which the other side of the connector 130 is disposed.

At this time, the light emitting device package 110 is disposed on the upper surface of the substrate 120, and the connector 130 is disposed on the lower surface of the substrate 120.

The connector 130 and the other side of the connector 130 are formed in the form of a flexible circuit board having a connector 130 and a fixing member 130 disposed on the board 120, (Not shown), and the shape of the connector 130 is not limited.

The substrate 120 may be a printed circuit board, a flexible printed circuit board, or a metal core PCB (MCPCB). In the case of the printed circuit board, a printed circuit board (PCB) A printed circuit board (PCB) or a printed circuit board (PCB) having a plurality of layers can be used. In the embodiment, the printed circuit board includes a base layer (not shown) made of FR4 material, .

The plurality of light emitting device packages 110 may be divided into a plurality of groups (not shown), and the light emitting device packages 110 disposed in the plurality of groups may be connected in series.

At this time, the number of the light emitting device packages 110 included in the plurality of groups is not limited.

At least two or more light emitting device packages 110 having different colors may be alternately mounted on the plurality of light emitting device packages 110. The light emitting device packages 110 may be mounted in groups according to the package size, The light emitting device package 110 may be mounted. Further, the present invention is not limited thereto.

For example, when the light emitting device array 100 emits white light, the plurality of light emitting device packages 110 may be implemented by using a light emitting device package that emits red light and a light emitting device package that emits blue light . Accordingly, the light emitting device packages that emit red light and blue light may be alternately mounted, and may be formed of red light, blue light, and green light.

The power supply control module 210 shown in FIG. 1 represents a power supply, that is, a power supply for supplying external power. The power supply control module 210 may be a device for explaining the light emitting device array 100 according to the embodiment, but is not limited thereto.

2 is a perspective view illustrating an embodiment of the light emitting device package shown in FIG.

FIG. 2 is a perspective view showing a part of the light emitting device package 110. In the embodiment, the light emitting device package 110 is a top view type, but it may be a side view type.

Referring to FIG. 1, the light emitting device package 110 may include a body 20 having a light emitting device 10 and a light emitting device 10 disposed thereon.

The body 20 may include a first partition 22 disposed in a first direction (not shown) and a second partition 24 disposed in a second direction (not shown) that intersects the first direction And the first and second barrier ribs 22 and 24 may be integrally formed with each other, and may be formed by injection molding, etching, or the like, but are not limited thereto.

That is, the first and second barrier ribs 22 and 24 are made of a resin material such as polyphthalamide (PPA), silicon (Si), aluminum (Al), aluminum nitride (AlN), AlO _x , liquid crystal polymer , photo sensitive glass), polyamide 9T (PA9T), new geo syndiotactic polystyrene (SPS), metal materials, sapphire (Al ₂ O _3), beryllium oxide (BeO), ceramic, and a printed circuit board (PCB, printed circuit board ). ≪ / RTI >

The shape of the upper surface of the first and second barrier ribs 22 and 24 may have various shapes such as a triangular shape, a square shape, a polygonal shape, and a circular shape depending on the use and design of the light emitting device 10.

The first and second barrier ribs 22 and 24 form a cavity s in which the light emitting device 10 is disposed and the cavity s may have a cup shape or a concave shape. The first and second barrier ribs 22 and 24 forming the cavity s may be inclined downward.

The plane shape of the cavity s may have various shapes such as a triangular shape, a square shape, a polygonal shape, and a circular shape, but is not limited thereto.

The first and second lead frames 13 and 14 may be formed of a metal material such as titanium (Ti), copper (Au), chrome (Cr), tantalum (Ta), platinum (Pt), tin (Sn), silver (Ag), phosphorus (P) And may include one or more materials or alloys of indium (In), palladium (Pd), cobalt (Co), silicon (Si), germanium (Ge), hafnium (Hf), ruthenium (Ru) .

The first and second lead frames 13 and 14 may be formed to have a single layer or a multilayer structure, but are not limited thereto.

The inner surfaces of the first and second barrier ribs 22 and 24 are inclined at a predetermined inclination angle with respect to any one of the first and second lead frames 13 and 14, The reflection angle of the emitted light can be changed, and thus the directivity angle of the light emitted to the outside can be controlled. The concentration of light emitted to the outside from the light emitting device 10 increases as the directivity angle of light decreases, while the concentration of light emitted from the light emitting device 10 to the outside decreases as the directivity angle of light increases.

The inner surface of the body 20 may have a plurality of inclination angles, but is not limited thereto.

The first and second lead frames 13 and 14 are electrically connected to the light emitting element 10 and are respectively connected to positive and negative poles of an external power source ). ≪ / RTI >

In the embodiment, the light emitting element 10 is disposed on the first lead frame 13, the second lead frame 14 is separated from the first lead frame 13, Bonded with the first lead frame 13 and wire-bonded with the second lead frame 14 by a wire (not shown), so that power can be supplied from the first and second lead frames 13 and 14.

Here, the light emitting element 10 may be bonded to the first lead frame 13 and the second lead frame 14 with different polarities.

Further, the light emitting element 10 can be wire-bonded or die-bonded to the first and second lead frames 13 and 14, and the connection method is not limited.

In the embodiment, the light emitting element 10 is disposed on the first lead frame 13, but the present invention is not limited thereto.

Then, the light emitting element 10 can be adhered to the first lead frame 13 by an adhesive member (not shown).

Here, between the first and second lead frames 13 and 14, an insulating dam 16 for preventing electrical short-circuiting of the first and second lead frames 13 and 14 may be formed.

In an embodiment, the insulation dam 16 may be formed in a semicircular shape at the top, but is not limited thereto.

A cathode mark (17) may be formed on the body (13). The cathode mark 17 distinguishes the polarity of the light emitting element 10, that is, the polarity of the first and second lead frames 13 and 14 so that when the first and second lead frames 13 and 14 are electrically connected, Lt; / RTI >

The light emitting device 10 may be a light emitting diode. The light emitting diode may be, for example, a colored light emitting diode that emits light such as red, green, blue, or white, or a UV (Ultra Violet) light emitting diode that emits ultraviolet light. However, A plurality of light emitting devices 10 may be mounted on the frame 13 and at least one light emitting device 10 may be mounted on the first and second lead frames 13 and 14, 10 and the mounting position of the semiconductor device.

The body 20 may include a resin material 18 filled in the cavity s. That is, the resin material 18 may be formed in a double molding structure or a triple molding structure, but is not limited thereto.

The resin material 18 may be formed in a film form and may include at least one of a phosphor and a light diffusing material, and a light-transmitting material not including a phosphor and a light diffusing material may be used. Do not.

FIG. 3 is a perspective view showing the substrate shown in FIG. 3 according to the first embodiment, FIG. 4 is a sectional view showing a section P1-P1 of the substrate shown in FIG. 3, to be.

3 to 5, the substrate 120 may include a base layer 121, a copper foil layer 123, and an insulating layer 125.

At this time, the base layer 121 is made of FR4 material, but is not limited thereto.

Here, the copper foil layer 123 is disposed on the base layer 121 having an insulating property, and the electrode pattern (not shown) and the connector pattern (not shown) in which the light emitting device package 110 and the connector 13 shown in FIG. And a connection pattern (not shown) for electrically connecting the electrode pattern and the connector pattern.

The copper foil layer 123 shown in FIGS. 3 to 5 may be exposed so that the light emitting device package 110 is disposed by etching after the insulating layer 125 is disposed on the base layer 121 and the copper foil layer 123 have.

The insulating layer 125 is disposed on the base layer 121 and the copper foil layer 123 to prevent breakage of the copper foil layer 123 due to short circuit or moisture infiltration.

In addition, the insulating layer 125 may be made of a material having a high reflectivity, and may reflect the light incident on the insulating layer 125 when the light emitting device package 110 emits light.

The insulating layer 125 may be a film type or an ink type and is not limited in thickness.

The insulating layer 125 may be a PSR film and a PSR ink, but is not limited thereto.

Here, the insulating layer 125 may be disposed on a part of the upper surface of the base layer 121.

4, a first side (not shown) of the insulating layer 125 may be spaced a first distance d1 from a side of the base layer 121 adjacent to the first side.

In other words, the major axis length t1 of the base layer 121 is longer than the major axis length t2 of the insulating layer 125, and the second side of the insulating layer 125 and the second side opposite to the first side The side (not shown) may be spaced apart from the side of the base layer 121 at a third distance d3.

Here, the third distance d3 may be the same as or different from the first distance d1, but is not limited thereto.

5, a second side (not shown) intersecting the first side of the insulating layer 125 extends from a side of the base layer 121 adjacent the second side to a second distance d2 And a fourth side (not shown) of the insulating layer 125 opposite to the second side is spaced apart from the side of the base layer 121 adjacent to the fourth side by a fourth distance d4 .

At this time, the second distance d2 may be the same as or different from the fourth distance d4, but is not limited thereto.

That is, since the short axis length k1 of the base layer 121 is longer than the short axis length k2 of the insulating layer 125, the second and fourth distances d2 and d4 can be determined when the insulating layer 125 is disposed have.

Referring again to FIGS. 4 and 5, the first distance d1 can be 0.1 mm to 0.3 mm, and when the light emitting device package 110 is placed in a reflow process at less than 0.1 mm, The side surface of the insulating layer 125 may be broken by the impact and the minor axis length k2 of the base layer 121 may be widened if it is longer than 0.3 mm or the short axis length k2 of the copper layer 123 The layout area may be reduced or a portion of the copper foil layer 123 may be exposed and broken.

Also, the first distance d1 may be equal to or longer than the second distance d2, and the second distance d2 may be from 0.1 mm to 0.35 mm.

That is, the second distance d2 is set to be shorter than the major axis length t1 by the short axis length k1 of the base layer 121, so that the second distance d2 is longer than the first distance d1 by 0.1 mm to longer than the first distance d1 0.35 mm.

The major axis length t2 of the insulating layer 125 is formed to be shorter than the sum of the first distance d1 and the first and third distances d1 and d3 from the major axis length t1 of the base layer 121 And the short axis length k2 of the insulating layer 125 is shorter than the short axis length k1 of the base layer 121 to be shorter than the sum of the second distance d2 and the second and fourth distances d2 and d4 .

As described above, the substrate 120 according to the first embodiment has a structure in which the insulating layer 125 is disposed on a portion of the upper portion of the base layer 121, thereby preventing the insulating layer 125 of the substrate 120 from being broken Can be minimized.

The edges (edges) of the first and second side surfaces of the insulating layer 125 may have a curvature, but are not limited thereto.

6 is a cross-sectional view showing a P3-P3 section of the substrate shown in FIG. 6, and FIG. 8 is a sectional view showing a P4-P4 section of the substrate shown in FIG. 6 to be.

6 to 8, the substrate 120 may include a base layer 121, a copper foil layer 123, and an insulating layer 125. [

In FIGS. 6 to 8, the redundant description will be simplified or omitted from the configuration described in FIG. 3 to FIG.

The insulating layer 125 may be disposed on top and at least one side (not shown) of the base layer 121.

That is, the insulating layer 125 may have a longer axis and a shorter axis length (not shown) longer than the longer axis and the shorter axis length (not shown) of the base layer 121.

In the embodiment, the insulating layer 125 is shown to be disposed on all four sides of the base layer 121, but is not limited thereto.

7 and 8, the insulating layer 125 may be disposed on the side of the base layer 121 with a first length b1 and a second length b2.

Here, the first and second lengths b1 and b2 may be equal to each other, but are not limited thereto.

At least one of the first and second lengths (b1, b2) may be 0.1 mm to 1 mm, and if it is less than 0.1 mm, it is impossible to prevent cracking during the reflow process or movement. If it is longer than 1 mm, It may be the same as when the insulating layer 125 is prevented from cracking by 1 mm.

At this time, a pattern (not shown) may be formed on a part of the insulating layer 121 disposed on the side surface of the base layer 121, but the present invention is not limited thereto.

FIG. 9 is a perspective view showing a lighting device including a light-emitting element array according to an embodiment, and FIG. 10 is a cross-sectional view taken along the line A-A 'of the lighting device shown in FIG.

In order to describe the shape of the illumination device 300 according to the embodiment in detail, the longitudinal direction Z of the illumination device 300, the horizontal direction Y perpendicular to the longitudinal direction Z, The direction Z and the horizontal direction Y and the vertical direction X perpendicular to the horizontal direction Y will be described.

10 is a cross-sectional view of the lighting apparatus 300 of FIG. 9 cut in the longitudinal direction Z and the height direction X and viewed in the horizontal direction Y. FIG.

9 and 10, the lighting device 300 may include a body 310, a cover 330 coupled to the body 310, and a finishing cap 350 positioned at opposite ends of the body 310 have.

A light emitting device array 340 is coupled to the lower surface of the body 310. The body 310 is electrically conductive so that heat generated from the light emitting device package 344 can be emitted to the outside through the upper surface of the body 310. [ And a metal material having an excellent heat dissipation effect.

The light emitting device array 340 may include a light emitting device package 344 and a substrate 342.

The light emitting device package 344 is mounted on the substrate 342 in a multi-color, multi-row manner to form an array. The light emitting device package 344 can be mounted at equal intervals or can be mounted with various distances as needed. As the substrate 342, MCPCB (Metal Core PCB) or FR4 material PCB may be used.

The cover 330 may be formed in a circular shape so as to surround the lower surface of the body 310, but is not limited thereto.

Here, the cover 330 can protect the internal light emitting device array 340 from foreign substances or the like.

The cover 330 prevents glare of light generated in the light emitting device package 344 and a prism pattern or the like may be formed on at least one of the inner and outer surfaces of the cover 330. Further, the phosphor may be coated on at least one of the inner surface and the outer surface of the cover 330.

Meanwhile, since the light generated in the light emitting device package 344 is emitted to the outside through the cover 330, the cover 330 should have a high light transmittance and sufficient heat resistance to withstand the heat generated in the light emitting device package 344 The cover 330 is preferably formed of a material including polyethylene terephthalate (PET), polycarbonate (PC), or polymethyl methacrylate (PMMA) .

The finishing cap 350 is located at both ends of the body 310 and can be used for sealing the power supply unit (not shown). In addition, the finishing cap 350 is provided with the power pin 352, so that the lighting device 300 according to the embodiment can be used immediately without a separate device on the terminal from which the conventional fluorescent lamp is removed.

11 is an exploded perspective view of a liquid crystal display including the light emitting element array according to the first embodiment.

11, the liquid crystal display device 400 may include a liquid crystal display panel 410 and a backlight unit 470 for providing light to the liquid crystal display panel 410 in an edge-light manner.

The liquid crystal display panel 410 can display an image using the light provided from the backlight unit 470. The liquid crystal display panel 410 may include a color filter substrate 412 and a thin film transistor substrate 414 facing each other with a liquid crystal therebetween.

The color filter substrate 412 can realize the color of the image to be displayed through the liquid crystal display panel 410.

The thin film transistor substrate 414 is electrically connected to a printed circuit board 418 on which a plurality of circuit components are mounted through a driving film 417. The thin film transistor substrate 414 may apply a driving voltage provided from the printed circuit board 418 to the liquid crystal in response to a driving signal provided from the printed circuit board 418.

The thin film transistor substrate 414 may include a thin film transistor and a pixel electrode formed as a thin film on another substrate of a transparent material such as glass or plastic.

The backlight unit 470 includes a light emitting device array 420 for outputting light, a light guide plate 430 for converting light provided from the light emitting device array 420 into a surface light source and providing the light to the liquid crystal display panel 410, A plurality of films 450, 466 and 464 for uniforming the luminance distribution of the light provided from the light guide plate 430 and improving the vertical incidence property and a reflective sheet 430 for reflecting the light emitted to the rear of the light guide plate 430 to the light guide plate 430 447).

The light emitting device array 420 may include a PCB substrate 422 so that a plurality of light emitting device packages 424 and a plurality of light emitting device packages 424 are mounted to form an array.

The backlight unit 470 includes a diffusion film 466 for diffusing light incident from the light guide plate 430 toward the liquid crystal display panel 410 and a prism film 450 for enhancing vertical incidence by condensing the diffused light. And may include a protective film 464 for protecting the prism film 450.

12 is an exploded perspective view of a liquid crystal display device including a light emitting element array according to the second embodiment.

However, the parts shown and described in Fig. 11 are not repeatedly described in detail.

12, the liquid crystal display device 500 may include a liquid crystal display panel 510 and a backlight unit 570 for providing light to the liquid crystal display panel 510 in a direct-down manner.

Since the liquid crystal display panel 510 is the same as that described with reference to FIG. 11, detailed description is omitted.

The backlight unit 570 includes a plurality of light emitting element arrays 523, a reflective sheet 524, a lower chassis 530 in which the light emitting element array 523 and the reflective sheet 524 are accommodated, A plurality of optical films 560, and a diffuser plate 540 disposed on the diffuser plate 540. [

The light emitting device array 523 may include a PCB substrate 521 such that a plurality of light emitting device packages 522 and a plurality of light emitting device packages 522 are mounted to form an array.

The reflection sheet 524 reflects light generated from the light emitting device package 522 in a direction in which the liquid crystal display panel 510 is positioned, thereby improving light utilization efficiency.

The light emitted from the light emitting element array 523 is incident on the diffusion plate 540 and the optical film 560 is disposed on the diffusion plate 540. The optical film 560 may include a diffusion film 566, a prism film 550, and a protective film 564.

Here, the illumination device 300 and the liquid crystal display devices 400 and 500 may be included in the illumination system. In addition, the illumination device may include a light emitting device package and a device for illumination purposes.

The features, structures, effects and the like described in the embodiments are included in at least one embodiment of the present invention and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects and the like illustrated in the embodiments can be combined and modified by other persons skilled in the art to which the embodiments belong. Therefore, it should be understood that the present invention is not limited to these combinations and modifications.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is clearly understood that the same is by way of illustration and example only and is not to be taken by way of illustration, It will be appreciated that various modifications and applications are possible without departing from the scope of the present invention. For example, each component specifically shown in the embodiments can be modified and implemented. It is to be understood that all changes and modifications that come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

Claims (11)

A light emitting device package; And
And a substrate on which the light emitting device package is disposed, the substrate including a base layer, an insulating layer, and a copper foil layer between the base layer and the insulating layer,
Wherein the first side of the insulating layer
Spaced a first distance from a side of the base layer adjacent the first side,
Wherein the insulating layer has a second side intersecting the first side,
The second aspect,
A second distance from a side of the base layer adjacent the second side,
The first distance,
Is equal to the second distance or longer than the second distance
Emitting element array. delete delete delete 2. The method of claim 1,
0.1 to 0.35 mm. The method according to claim 1,
Wherein the insulating layer
A third side corresponding to the first side spaced from the side of the base layer adjacent to the first side and a third side corresponding to the first side spaced from the side of the base layer adjacent the second side, And a fourth aspect corresponding to the second aspect,
In the third aspect,
A third distance from a side of the base layer adjacent the third side,
In the fourth aspect,
And a fourth distance from a side of the base layer adjacent to the fourth side. The method of claim 6, wherein the major axis length of the insulating layer
Wherein the base layer is shorter than the long axis length by a sum of the first distance and the first and third distances. The method according to claim 6, wherein the short axis length of the insulating layer
Wherein the second distance is shorter than the short axis length of the base layer by a sum of the second distance and the fourth distance. delete delete 9. An illumination system comprising a light emitting device array according to any one of claims 1 to 8.

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