KR101929402B1 - Light emitting device package - Google Patents

Abstract

An embodiment of the present invention provides a light emitting device comprising a body including a light emitting element, a light emitting element, and a support member made of a light transmitting material, wherein a cavity is formed on the support member, a resin filled in the cavity, There is provided a light emitting device package including a device and a conductive member bonded with a wire.

Description

A light emitting device package

An embodiment relates to a light emitting device package.

As a typical example of a light emitting device, a light emitting diode (LED) is a device for converting an electric signal into an infrared ray, a visible ray, or a light using the characteristics of a compound semiconductor, and is used for various devices such as household appliances, remote controllers, Automation equipment, and the like, and the use area of LEDs is gradually widening.

In general, miniaturized LEDs are made of a surface mounting device for mounting directly on a PCB (Printed Circuit Board) substrate, and an LED lamp used as a display device is also being developed as a surface mounting device type . Such a surface mount device can replace a conventional simple lighting lamp, which is used for a lighting indicator for various colors, a character indicator, an image indicator, and the like.

As the use area of LEDs is widening as such, researches are being conducted to remove the luminance and the odor in the air of LEDs required for living lamps and structural signal lamps.

The embodiment provides a light emitting device package having a structure that facilitates heat dissipation against heat generated in the light emitting device.

A light emitting device package according to an embodiment includes a body having a light emitting element, a light emitting element disposed therein and a support member made of a light transmitting material, a cavity formed on the support member, a resin filled in the cavity, And a conductive member bonded to the light emitting device and the wire.

In the light emitting device package according to the embodiment, the light emitting element is disposed on a support member of a light transmitting material, and the light emitting element is disposed at a position spaced apart from the substrate, thereby easily dissipating heat generated from the light emitting element to the outside, When the light emitting device emits light, the light efficiency is improved as the light is emitted to the outside through the support member.

1 is an exploded perspective view schematically illustrating a light emitting device module including a light emitting device package according to an embodiment.
2 is a perspective view showing the light emitting device package shown in FIG.
3 is a cross-sectional view of the light emitting device package shown in FIG.
4 is an exploded perspective view showing the light emitting element array shown in Fig.
5 is a perspective view illustrating a lighting device including a light emitting device package according to an embodiment.
6 is a cross-sectional view showing a cross-section taken along line AA 'of the lighting apparatus shown in Fig.
7 is an exploded perspective view of a liquid crystal display device including the light emitting device package according to the first embodiment.
8 is an exploded perspective view of a liquid crystal display device including the light emitting device package according to the second embodiment.

In the description of this embodiment, in the case where a device is described as being formed "on or under" another device, the upper (upper) or lower (lower) on or under includes both the two devices being in direct contact with each other or one or more other devices being indirectly formed between the two devices. Also, when expressed as "on or under", it may include not only an upward direction but also a downward direction with respect to one device.

In the drawings, the thickness and size of each layer are exaggerated, omitted, or schematically illustrated for convenience and clarity. Therefore, the size of each component does not entirely reflect the actual size.

Further, the angles and directions mentioned in the description of the structure of the light emitting device package in this specification are based on those shown in the drawings. In the description of the structure of the light emitting device package in the specification, reference points and positional relationship with respect to angles are not explicitly referred to, refer to the related drawings.

1 is an exploded perspective view schematically illustrating a light emitting device module including a light emitting device package according to an embodiment.

Referring to FIG. 1, the light emitting device module 200 may include a power control module 210, a light emitting device array 100, and a connector 130.

The power supply control module 210 generates power consumed by the light emitting device package 110 mounted on the light emitting device array 100 and controls the operation of the power supply 212 and the power supply 212 214 and a connector connection part 216 to which one side of the connector 130 is connected.

At this time, the power supply 212 operates under the control of the control unit 214 and generates the power consumed by the light emitting device array 100.

The control unit 214 can control the operation of the power supply 212 according to an externally input command.

In this case, the command input from the outside may be a command output from an input device (not shown) connected directly to the light emitting device module 200 and a remote control for commanding the operation of the device including the light emitting device module 200, It is not limited to this.

The connector connection unit 216 is connected to one side of the connector 130 and can supply the power supplied from the power supply 212 to the connector 130.

The light emitting device array 100 includes a light emitting device package 110, a substrate 120 on which the light emitting device package 110 is mounted, and a connector terminal 122 on which the other side of the connector 130 is connected. can do.

At this time, the connector terminal 122 may be electrically connected to the connector connecting portion 216 through the connector 130, and a detailed description of the connector terminal 122 will be given later.

The substrate 120 may be a printed circuit board or a flexible printed circuit board. In the case of the printed circuit board, a printed circuit board (PCB), a printed circuit board A PCB (Print Circuit Board) having a plurality of layers may be used. In the embodiment, the PCB is a Print Circuit Board (PCB), but the present invention is not limited thereto.

It will be described that the plurality of light emitting device packages 110 are divided into the first to fourth groups P1 to P4 and six light emitting device packages 110 are mounted in each of the groups P1 to P4, The number of the light emitting device packages 110 or the number of groups is not limited.

That is, six light emitting device packages 110 are connected in series in the first to fourth groups P1 to P4, and the first to fourth groups P1 to P4 may be connected in parallel to each other.

In the embodiment, six light emitting device packages 110 are connected in series to form one group. However, the connection mode of the light emitting device package 110 is not limited.

In the light emitting device package 100 included in the first to fourth groups P1 to P4, at least two or more light emitting device packages 110 having different colors may be alternately mounted, May be mounted in a group according to the size, and may be mounted with the light emitting device package 110 having a single color. Further, the present invention is not limited thereto.

For example, when the light emitting device array 100 emits white light, the plurality of light emitting device packages 110 may be implemented by using a light emitting device package that emits red light and a light emitting device package that emits blue light . Accordingly, the light emitting device packages that emit red light and blue light may be alternately mounted, and may be formed of red light, blue light, and green light.

The power supply control module 210 shown in FIG. 1 represents a power supply, that is, a power supply for supplying external power. The power supply control module 210 may be a device for explaining the light emitting device array 100 according to the embodiment, but is not limited thereto.

FIG. 2 is a perspective view illustrating the light emitting device package shown in FIG. 1, and FIG. 3 is a cross-sectional view illustrating the light emitting device package shown in FIG.

FIG. 2 is a perspective view showing a part of the light emitting device package 110. In the embodiment, the light emitting device package 110 is a top view type, but it may be a side view type.

2 and 3, the light emitting device package 110 may include a body 20 including a light emitting element 10 and a support member 13 on which the light emitting element is disposed.

The body 20 may include a first partition 22 disposed in a first direction (not shown) and a second partition 24 disposed in a second direction (not shown) that intersects the first direction And the first and second barrier ribs 22 and 24 may be integrally formed with each other, and may be formed by injection molding, etching, or the like, but are not limited thereto.

That is, the first and second barrier ribs 22 and 24 are made of a resin material such as polyphthalamide (PPA), silicon (Si), aluminum (Al), aluminum nitride (AlN), AlO _x , liquid crystal polymer , photo sensitive glass), polyamide 9T (PA9T), new geo syndiotactic polystyrene (SPS), metal materials, sapphire (Al ₂ O _3), beryllium oxide (BeO), ceramic, and a printed circuit board (PCB, printed circuit board ). ≪ / RTI >

The shape of the upper surface of the first and second barrier ribs 22 and 24 may have various shapes such as a triangular shape, a square shape, a polygonal shape, and a circular shape depending on the use and design of the light emitting device 10.

The first and second barrier ribs 22 and 24 form a cavity s in which the light emitting device 10 is disposed and the cavity s may have a cup shape or a concave shape. The first and second barrier ribs 22 and 24 forming the cavity s may be inclined downward.

The plane shape of the cavity s may have various shapes such as a triangular shape, a square shape, a polygonal shape, and a circular shape, but is not limited thereto.

The support member 13 can be adhered and disposed by the adhesive (not shown) or an adhesive film (not shown).

At this time, the support member 13 may include a light-transmitting material, for example, a light-transmitting electrode such as ITO, ZTO, or the like.

Here, the support member 13 allows the light generated in the light emitting element 10 to pass therethrough.

The thickness (not shown) of the support member 13 may be equal to or greater than the thickness of the light emitting element 10 in order to support the light emitting element 10.

The inner surfaces of the first and second barrier ribs 22 and 24 are inclined with a predetermined inclination angle with respect to the support member 13 and the angle of reflection of light emitted from the light emitting device 10 may vary according to the inclination angle, Accordingly, the directing angle of the light emitted to the outside can be adjusted. The concentration of light emitted to the outside from the light emitting device 10 increases as the directivity angle of light decreases, while the concentration of light emitted from the light emitting device 10 to the outside decreases as the directivity angle of light increases.

The inner surface of the body 20 may have a plurality of inclination angles, but is not limited thereto.

The body 20 may include a resin material 14 filled in the cavity s. That is, the resin material 18 may be formed in a double molding structure or a triple molding structure, but is not limited thereto.

The resin material 14 may be formed in a film form, and may include at least one of a phosphor and a light diffusing material. Further, a translucent material that does not include a phosphor and a light diffusion material may be used. Do not.

The light emitting device package 110 may include a light emitting element 10 and a conductive member 17 bonded to the upper surface of the resin material 14 by wires.

The conductive member 17 may comprise first and second conductive members 15, 16 spaced from one another. The first and second conductive members 15 and 16 are made of a metal material such as titanium (Ti), copper (Cu), nickel (Ni), gold (Au), chromium (Cr), tantalum ), Platinum (Pt), tin (Sn), silver (Ag), phosphorous (P), aluminum (Al), indium (In), palladium (Pd), cobalt ), Hafnium (Hf), ruthenium (Ru), and iron (Fe).

The first and second conductive members 15 and 16 may be formed to have a single layer or a multi-layer structure, but are not limited thereto.

The first and second conductive members 15 and 16 are electrically connected to the light emitting element 10 and are connected to the positive and negative poles of an external power source ). ≪ / RTI >

An insulating layer (not shown) may be formed between the first and second conductive members 15 and 16 to prevent electrical shorting of the first and second conductive members 15 and 16, Do not limit.

The thickness d of the first and second conductive members 15 and 16 is in the range of 0.2 mm to 0.4 mm. When the thickness is less than 0.2 mm, the contact ratio with the wire is lowered to increase the risk of disconnection. Thickness can have the same electrical characteristics as in the case of 0.4 mm, but the manufacturing cost can be increased.

The first and second conductive members 15 and 16 may have a reflectance of 80% to 100% so as to reflect the light emitted from the light emitting element 10, have.

That is, when the first and second conductive members 15 and 16 have a reflectance of less than 80%, the light efficiency may be lowered, and when the reflectance is higher, the light efficiency may be improved.

Here, the light emitting device 10 may be a light emitting diode, for example, a colored light emitting diode that emits light such as red, green, blue, and white, or an ultraviolet (UV) light emitting diode that emits ultraviolet light, It is not limited to this.

The light emitting element 10 includes a support substrate 25, a first semiconductor layer 25a, a second semiconductor layer 25b and a light emitting structure including the active layer 25c between the first and second semiconductor layers 25a and 25b 26 and a first electrode 27 on the first semiconductor layer 25a and a second electrode 28 on the second semiconductor layer 25b.

The first electrode 27 is bonded to the first conductive member 15 and the wire w and the second electrode 28 can be bonded to the second conductive member 16 and the wire w .

The light emitting device package 110 may be formed such that the first and second conductive members 15 and 16 are in contact with the substrate 120 and the supporting member 13 is spaced apart from the substrate 120, Since the light emitting device package 110 can emit the reflected light reflected from the first and second conductive members 15 and 16 to the outside, the light emitting device package 110 can be used as indirect lighting.

4 is an exploded perspective view showing the light emitting element array shown in Fig.

Referring to FIG. 4, the substrate 120 of the light emitting device array 100 may include a base layer 120a, a first copper foil layer 120b, and an insulating layer 120c.

Here, the first copper layer 120b and the insulating layer 120c disposed on the upper surface of the base layer 120a may be represented. Although the substrate 120 shown in the embodiment is shown using only a single section, if a double-sided substrate is used, a second copper layer (not shown) may be disposed on the backside of the substrate, but is not limited thereto.

The base layer 120a may be made of FR4 material, but other insulating materials may be used, but the present invention is not limited thereto.

The first copper layer 120b is disposed on the upper surface of the base layer 120a and includes a first copper layer 120b electrically contacting the first and second conductive members 15 and 16 of the light emitting device 110 shown in Figs. A two-electrode pattern 124a, 124b, and a connector pattern 124c on which a connector (not shown) is disposed.

The first copper layer 120b may include a connection pattern (not shown) connecting between the first and second electrode patterns 124a and 124b and the connector pattern 124c.

The insulating layer 120c may be disposed on the first copper layer 120b and the base layer 120a so that the first and second electrode patterns 124a and 124b and the connector pattern 124c are exposed to the outside, The device package 112 and the first and second open regions 122a and 122b and the connector open region 122c that are opened to dispose the connector can be formed.

Here, the insulating layer 120c may be formed in a plate shape by first and second electrode open regions 122a and 122b and a connector open region 122c by an etching process.

The insulating layer 120c may be formed of any one of PSR ink and insulating film, but is not limited thereto.

In addition, the insulating layer 120c may be a material having high reflectivity that can reflect light emitted from the light emitting device package 110. [

FIG. 5 is a perspective view illustrating a lighting device including a light emitting device package according to an embodiment, and FIG. 6 is a cross-sectional view taken along line A-A 'of the lighting device shown in FIG.

In order to describe the shape of the illumination device 300 according to the embodiment in detail, the longitudinal direction Z of the illumination device 300, the horizontal direction Y perpendicular to the longitudinal direction Z, The direction Z and the horizontal direction Y and the vertical direction X perpendicular to the horizontal direction Y will be described.

6 is a cross-sectional view of the lighting apparatus 300 of FIG. 5 cut in the longitudinal direction Z and the height direction X and viewed in the horizontal direction Y. FIG.

5 and 6, the lighting device 300 may include a body 310, a cover 330 coupled to the body 310, and a finishing cap 350 positioned at opposite ends of the body 310 have.

A light emitting device array 340 is coupled to the lower surface of the body 310. The body 310 is electrically conductive so that heat generated from the light emitting device package 344 can be emitted to the outside through the upper surface of the body 310. [ And a metal material having an excellent heat dissipation effect.

The light emitting device array 340 may include a light emitting device package 344 and a substrate 342.

The light emitting device package 344 is mounted on the substrate 342 in a multi-color, multi-row manner to form an array. The light emitting device package 344 can be mounted at equal intervals or can be mounted with various distances as needed. As the substrate 342, MCPCB (Metal Core PCB) or FR4 material PCB may be used.

The cover 330 may be formed in a circular shape so as to surround the lower surface of the body 310, but is not limited thereto.

Here, the cover 330 can protect the internal light emitting device array 340 from foreign substances or the like.

The cover 330 prevents glare of light generated in the light emitting device package 344 and a prism pattern or the like may be formed on at least one of the inner and outer surfaces of the cover 330. Further, the phosphor may be coated on at least one of the inner surface and the outer surface of the cover 330.

Meanwhile, since the light generated in the light emitting device package 344 is emitted to the outside through the cover 330, the cover 330 should have a high light transmittance and sufficient heat resistance to withstand the heat generated in the light emitting device package 344 The cover 330 is preferably formed of a material including polyethylene terephthalate (PET), polycarbonate (PC), or polymethyl methacrylate (PMMA) .

The finishing cap 350 is located at both ends of the body 310 and can be used for sealing the power supply unit (not shown). In addition, the finishing cap 350 is provided with the power pin 352, so that the lighting device 300 according to the embodiment can be used immediately without a separate device on the terminal from which the conventional fluorescent lamp is removed.

7 is an exploded perspective view of a liquid crystal display device including the light emitting device package according to the first embodiment.

7, the liquid crystal display device 400 may include a liquid crystal display panel 410 and a backlight unit 470 for providing light to the liquid crystal display panel 410 in an edge-light manner.

The liquid crystal display panel 410 can display an image using the light provided from the backlight unit 470. The liquid crystal display panel 410 may include a color filter substrate 412 and a thin film transistor substrate 414 facing each other with a liquid crystal therebetween.

The color filter substrate 412 can realize the color of the image to be displayed through the liquid crystal display panel 410.

The thin film transistor substrate 414 is electrically connected to a printed circuit board 418 on which a plurality of circuit components are mounted through a driving film 417. The thin film transistor substrate 414 may apply a driving voltage provided from the printed circuit board 418 to the liquid crystal in response to a driving signal provided from the printed circuit board 418.

The thin film transistor substrate 414 may include a thin film transistor and a pixel electrode formed as a thin film on another substrate of a transparent material such as glass or plastic.

The backlight unit 470 includes a light emitting device array 420 for outputting light, a light guide plate 430 for converting light provided from the light emitting device array 420 into a surface light source and providing the light to the liquid crystal display panel 410, A plurality of films 450, 466 and 464 for uniforming the luminance distribution of the light provided from the light guide plate 430 and improving the vertical incidence property and a reflective sheet 430 for reflecting the light emitted to the rear of the light guide plate 430 to the light guide plate 430 447).

The light emitting device array 420 may include a PCB substrate 422 so that a plurality of light emitting device packages 424 and a plurality of light emitting device packages 424 are mounted to form an array.

The backlight unit 470 includes a diffusion film 466 for diffusing light incident from the light guide plate 430 toward the liquid crystal display panel 410 and a prism film 450 for enhancing vertical incidence by condensing the diffused light. And may include a protective film 464 for protecting the prism film 450.

8 is an exploded perspective view of a liquid crystal display device including the light emitting device package according to the second embodiment.

However, the parts shown and described in Fig. 7 are not repeatedly described in detail.

8, the liquid crystal display device 500 may include a liquid crystal display panel 510 and a backlight unit 570 for providing light to the liquid crystal display panel 510 in a direct-down manner.

Since the liquid crystal display panel 510 is the same as that described with reference to FIG. 6, detailed description is omitted.

The backlight unit 570 includes a plurality of light emitting element arrays 523, a reflective sheet 524, a lower chassis 530 in which the light emitting element array 523 and the reflective sheet 524 are accommodated, A plurality of optical films 560, and a diffuser plate 540 disposed on the diffuser plate 540. [

The light emitting device array 523 may include a PCB substrate 521 such that a plurality of light emitting device packages 522 and a plurality of light emitting device packages 522 are mounted to form an array.

The reflection sheet 524 reflects light generated from the light emitting device package 522 in a direction in which the liquid crystal display panel 510 is positioned, thereby improving light utilization efficiency.

The light emitted from the light emitting element array 523 is incident on the diffusion plate 540 and the optical film 560 is disposed on the diffusion plate 540. The optical film 560 may include a diffusion film 566, a prism film 550, and a protective film 564.

Here, the illumination device 300 and the liquid crystal display devices 400 and 500 may be included in the illumination system. In addition, the illumination device may include a light emitting device package and a device for illumination purposes.

The features, structures, effects and the like described in the embodiments are included in at least one embodiment of the present invention and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects and the like illustrated in the embodiments can be combined and modified by other persons skilled in the art to which the embodiments belong. Therefore, it should be understood that the present invention is not limited to these combinations and modifications.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is clearly understood that the same is by way of illustration and example only and is not to be taken by way of illustration, It will be appreciated that various modifications and applications are possible without departing from the scope of the present invention. For example, each component specifically shown in the embodiments can be modified and implemented. It is to be understood that all changes and modifications that come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

Claims (15)

A light emitting element;
A body including a support member having a light transmitting property and disposed with the light emitting device, and a cavity formed on the support member;
A resin filled in the cavity; And
And a conductive member disposed on the resin material and bonded with the light emitting element and the wire. The light emitting device according to claim 1,
A light emitting structure including a first semiconductor layer, a second semiconductor layer, and an active layer between the first and second semiconductor layers;
A first electrode on the first semiconductor layer; And
And a second electrode on the second semiconductor layer. The method according to claim 1,
The light emitting element is of the horizontal type,
Wherein the support member is a light-transmitting material. delete delete The image forming apparatus according to claim 1,
Lt; RTI ID = 0.0 > ITO < / RTI > or ZTO. 2. The resin composition according to claim 1,
A phosphor, and a light diffusing material,
The thickness of the resin material,
Wherein the light emitting device package is smaller than the vertical height of the body. delete The method according to claim 1,
The light-
A light emitting structure including a first semiconductor layer, a second semiconductor layer, and an active layer between the first and second semiconductor layers;
A first electrode on the first semiconductor layer; And
And a second electrode on the second semiconductor layer,
The conductive member includes:
A first conductive member bonded to the first electrode and the wire; And
And a second conductive member bonded to the second electrode and the wire, the second conductive member being spaced apart from the first conductive member,
And an insulating layer disposed between the first and second conductive members and insulating the first and second conductive members. delete The method according to claim 1,
The thickness of the conductive member is 0.2 mm to 0.4 mm,
The reflectance of the conductive member is 80% to 100%
The conductive member includes:
And at least one of silver, gold, copper, and aluminum. delete delete A light emitting device, comprising: a body including a light emitting element and a support member made of a light transmitting material; a cavity formed on the support member; a resin filled in the cavity; A light emitting device package including a conductive member bonded thereto; And
And a substrate in which the light emitting device package is disposed, and which is in electrical contact with the conductive member. An illumination system comprising the light emitting device package according to any one of claims 1 to 3, 6 to 7, 9 and 11, or the light emitting device array according to claim 14.

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