KR101141323B1 - Light emitting element package - Google Patents

Abstract

PURPOSE: A light emitting device package is provided to multiply coherence by forming an unevenness pattern on one or more lower surfaces of a first frame and a second frame and enlarging a contact area with a body. CONSTITUTION: A light emitting device(140) is mounted in a cavity(s) of a body(110). The inner side of the body is formed to slope to a lower direction. A cathode mark(180) is formed in the body. A lead frame including first and second frames(120, 130) is arranged in the lower surface of the body. A resin(150) is formed into a double-molding structure or a three-molding structure. An unevenness pattern including a first protrusion and a second protrusion is formed in the first lead frame. The second lead frame is separated from the first lead frame.

Description

Light emitting element package

The embodiment relates to a light emitting device package, and more particularly, to a light emitting device package that is easy to expand and release heat of the first and second lead frames due to heat generated when the light emitting device emits light.

As a typical example of a light emitting device, a light emitting diode (LED) is a device for converting an electric signal into an infrared ray, a visible ray, or a light using the characteristics of a compound semiconductor, and is used for various devices such as household appliances, remote controllers, Automation equipment, and the like, and the use area of LEDs is gradually widening.

In general, miniaturized LEDs are made of a surface mounting device for mounting directly on a PCB (Printed Circuit Board) substrate, and an LED lamp used as a display device is also being developed as a surface mounting device type . Such a surface mount device can replace a conventional simple lighting lamp, which is used for a lighting indicator for various colors, a character indicator, an image indicator, and the like.

As the use area of the LED is widened as described above, it is important to increase the luminance of the LED as the brightness required for a lamp used in daily life and a lamp for a structural signal is increased.

An object of the embodiment is to provide a light emitting device package that is easy to expand and release heat of the first and second lead frames due to heat generated during light emitting device light emitting.

The light emitting device package according to the embodiment includes a light emitting device, a body having a cavity formed on the first lead frame on which the light emitting device is mounted, and a second lead frame spaced apart from the first lead frame, and the first lead frame Silver may include a first surface on which the light emitting device is mounted and a second surface opposite to the first surface, and an uneven pattern may be formed on a region not overlapping the light emitting device.

In the light emitting device package according to the embodiment, by forming a concave-convex pattern on the lower surface of the first lead frame on which the light emitting device is mounted, it is possible to reduce the expansion of the first lead frame by the heat generated when the light emitting device emits light, There is an advantage that it is easy to release.

In addition, the light emitting device package according to the embodiment has the advantage that by forming an uneven pattern on the lower surface of at least one of the first, second lead frame, it is possible to increase the bonding force by expanding the contact area with the body.

1 is a top view illustrating a light emitting surface of a light emitting device package according to an embodiment.
FIG. 2 is a cross-sectional view of the first exemplary embodiment in which the light emitting device package illustrated in FIG. 1 is cut in the AA direction.
FIG. 3 is an enlarged view illustrating a first embodiment of a block 'Y1' shown in FIG. 2.
4 is a partial perspective view illustrating first and second surfaces of the first lead frame illustrated in FIG. 3.
FIG. 5 is an enlarged view illustrating a second embodiment of the block 'Y1' shown in FIG. 2.
FIG. 6 is a cross-sectional view according to a second exemplary embodiment in which the light emitting device package illustrated in FIG. 1 is cut in the AA direction.
FIG. 7 is an enlarged view illustrating a first embodiment of a block 'Y2' shown in FIG. 6.
FIG. 8 is a partial perspective view illustrating first and second surfaces of the first lead frame illustrated in FIG. 7.
9 is a perspective view illustrating a lighting device including a light emitting device package according to an embodiment.
10 is a cross-sectional view showing a CC cross section of the lighting apparatus shown in FIG. 9.
11 is an exploded perspective view of a liquid crystal display including the light emitting device package according to the first embodiment.
12 is an exploded perspective view of a liquid crystal display including the light emitting device package according to the second embodiment.

Prior to the description of the embodiments, the substrate, each layer region, pad, or pattern of each layer (film), region, pattern, or structure referred to herein is "on", "below ( "on" and "under" include all that is formed "directly" or "indirectly" through other layers. In addition, the criteria for the top or bottom of each layer will be described with reference to the drawings.

In the drawings, the thickness or size of each layer is exaggerated, omitted, or schematically illustrated for convenience and clarity of description. Thus, the size of each component does not fully reflect its actual size.

In addition, angles and directions mentioned in the process of describing the structure of the light emitting device array in the present specification are based on those described in the drawings. In the description of the structure of the light emitting device array in the specification, if the reference point and the positional relationship with respect to the angle is not clearly mentioned, reference is made to related drawings.

1 is a top view illustrating a light emitting surface of a light emitting device package according to an embodiment.

Referring to FIG. 1, the light emitting device package 100 may include a light emitting device 140 and a body 110 having a cavity s in which the light emitting device 140 is mounted.

Here, the body 110 is made of a resin material such as polyphthalamide (PPA), silicon (Si), aluminum (Al), aluminum nitride (AlN), AlOx, photosensitive glass (PSG), poly It may be formed of at least one of amide 9T (PA9T), neogeotactic polystyrene (SPS), metal, sapphire (Al2O3), beryllium oxide (BeO), ceramic, and a printed circuit board (PCB).

The body 110 may be formed by injection molding, an etching process, or the like, but is not limited thereto.

The upper surface shape of the body 110 may have various shapes such as triangles, squares, polygons, and circles depending on the use and design of the light emitting device 140.

The cross-sectional shape of the cavity s may be formed in a cup shape, a concave container shape, or the like, and the inner surface of the body 110 constituting the cavity s may be inclined downward.

In addition, the front shape of the cavity s may be a shape such as a circle, a rectangle, a polygon, an oval, and the like, but is not limited thereto.

In this case, a lead frame (not shown) including the first and second lead frames 120 and 130 is disposed on the lower surface of the body 110, and the first and second lead frames 120 and 130 are made of a metal material, for example. For example, titanium (Ti), copper (Cu), nickel (Ni), gold (Au), chromium (Cr), tantalum (Ta), platinum (Pt), tin (Sn), silver (Ag), phosphorus (P), aluminum (Al), indium (In), palladium (Pd), cobalt (Co), silicon (Si), germanium (Ge), hafnium (Hf), ruthenium (Ru) and iron (Fe) It may contain the above materials or alloys.

In addition, the first and second lead frames 120 and 130 may be formed to have a single layer or a multilayer structure, but the embodiment is not limited thereto.

The inner surface of the body 110 is formed to be inclined with a predetermined inclination angle based on any one of the first and second lead frames 120 and 130, and the reflection angle of the light emitted from the light emitting device 140 varies according to the inclination angle. In this way, it is possible to adjust the directivity angle of the light emitted to the outside. Concentration of light emitted from the light emitting device 140 to the outside increases as the directivity of the light decreases, while concentration of light emitted from the light emitting device 140 to the outside decreases as the directivity of the light increases.

The inner surface of the body 110 may have a plurality of inclination angles, but is not limited thereto.

The first and second lead frames 120 and 130 are electrically connected to the light emitting device 140, and are connected to the positive and negative poles of an external power source (not shown), respectively, to emit light. ) Can be powered.

The light emitting device 140 is mounted on the first lead frame 120, the light emitting device 140 is die-bonded with the first lead frame 120, and the wires are formed by the second lead frame 130 and the wire 170. Bonded, power may be supplied from the first and second lead frames 120 and 130.

Here, the light emitting device 140 may be wire bonded or die bonded to each of the first and second lead frames 120 and 130, but is not limited thereto.

In addition, a cathode mark 180 may be formed on the body 110. The cathode mark 180 distinguishes the polarity of the light emitting device 140, that is, the polarity of the first and second lead frames 120 and 130, so that the cathode mark 180 is electrically confused when the first and second lead frames 120 and 130 are electrically connected to each other. May be used to prevent this.

The light emitting device 140 may be a light emitting diode. The light emitting diode may be, for example, a colored light emitting diode emitting red, green, blue, or white light, or an ultraviolet (UV) emitting diode emitting ultraviolet light, but is not limited thereto. A plurality of light emitting devices 140 may be mounted on the frame 120, and at least one light emitting device 140 may be mounted on the first and second lead frames 120 and 130, respectively. There is no limitation on the number and mounting positions of 140).

In addition, the body 110 may further include a resin material 150 filled in the cavity (s). That is, the resin material 150 may be formed in a double molding structure or a triple molding structure, but is not limited thereto.

In addition, the resin material 150 may be formed in a film shape, may include at least one of a phosphor and a light diffusing material, and a translucent material that does not include the phosphor and the light diffusing material may be used. Do not.

FIG. 2 is a cross-sectional view illustrating a light emitting device package shown in FIG. 1 in the AA direction, and FIG. 3 is an enlarged view illustrating a first embodiment of the 'Y1' block shown in FIG. 2, and FIG. 4. 3 is a partial perspective view showing first and second surfaces of the first lead frame illustrated in FIG. 3.

2 to 4 briefly describe or omit the contents overlapping with those described in FIG. 1.

2 to 4, the light emitting device package 100 may include a body 110 and a light emitting device 140.

In this case, the body 110 may include a first lead frame 120 on which the light emitting device 140 is mounted, and a second lead frame 130 spaced apart from the first lead frame 120.

Here, the inner surface (not shown) of the body 110 forming the cavity s may be in contact with the first lead frame 120 and may be inclined with the first lead frame 120.

The first lead frame 120 includes a first surface 122 on which the light emitting device 140 is mounted and a second surface 124 opposite to the first surface 122, and the second lead frame 130 is It may include a third surface 132 disposed on the same line as the first surface 122 of the first lead frame 120 and a fourth surface 134 opposite to the third surface 132.

In an embodiment, the uneven pattern n is formed on the second surface 124 of the first lead frame 120, and the uneven pattern is not formed on the fourth surface 134 of the second lead frame 130. As described above, the uneven pattern n formed on the second surface 124 may also be formed on the fourth surface 134 of the second lead frame 140, but is not limited thereto.

2 and 3, the uneven pattern n may include a plurality of protrusions n1 to n5, and the plurality of protrusions n1 to n5 protrude in a direction opposite to the cavity s direction. Can be.

That is, the plurality of protrusions n1 to n5 may be formed to protrude on the second surface 124, and the plurality of protrusions n1 to n5 may be formed to have the same width d1 and thickness h1.

In this case, the width d1 of the plurality of protrusions n1 to n5 may be equal to the width bd of the light emitting device 140 or smaller than the width bd of the light emitting device 140. When the width 140 of the device 140 is greater than the width bd, the number of the plurality of protrusions n1 to n5 may be small, and thus it may not be easy to absorb the generated heat.

In addition, the thickness h1 of the plurality of protrusions n1 to n5 may be the same as or smaller than the thickness h0 between the first and second surfaces 122 and 124 of the first lead frame 120. In addition, it is preferable that the thickness of the light emitting device 140 is equal to or thicker, or most preferably, 0.1 mm to 0.2 mm.

That is, the thickness h1 of the plurality of protrusions n1 to n5 may enlarge the contact area with the body 110, and the bending force may be caused by the contact with the body 110 by a force acting between the protrusions by the absorbed heat. Can be reduced. However, when the thickness of the first and second surfaces 122 and 124 is greater than the thickness h0, the degree of warpage may not be reduced and cracks may occur in the body 110.

Here, the lower surfaces of the plurality of protrusions n1 to n5 may be located below the second surface 124.

In addition, the separation distance e1 between the plurality of protrusions n1 to n5 may be formed to be the same as or different from each other, but is not limited thereto.

Referring to FIG. 4, (a) is a partial perspective view of the first surface 122 of the first leadframe 120, and (b) is a view of the second surface 124 of the first leadframe 120. Partial perspective view.

Referring to (a), the light emitting device 140 may be mounted in a predetermined region (not shown) on the first surface 122 of the first lead frame 120.

In this case, the first surface 122 may be formed in a plane.

Referring to (b), the second surface 124 of the first lead frame 120 may exclude the first region p1 and the first region p1 corresponding to the predetermined region of the first surface 122. It may include a second region p2.

In this case, an uneven pattern n including the plurality of protrusions n1 to n5 may be formed in a part of the second region p2.

That is, the lower surfaces of the plurality of protrusions n1 to n5 may be located on a line different from the second surface 124, but the present invention is not limited thereto.

In addition, although the plurality of protrusions n1 to n5 have been described as having a line shape in a polygonal shape, they may be formed in a dot shape, but are not limited thereto.

The plurality of protrusions n1 to n5 may be formed in a semicircular shape. In addition, the plurality of protrusions n1 to n5 have been described as being formed in a part of the second region p2 instead of the boundary surfaces of the first and second regions p1 and p2, but may be formed from the boundary surface. There is no limit.

FIG. 5 is an enlarged view illustrating a second embodiment of the block 'Y1' shown in FIG. 2.

FIG. 5 briefly describes or omits contents overlapping with those described in FIG. 3.

Referring to FIG. 5, the uneven pattern n formed on the second surface 124 of the first lead frame 120 may include a plurality of protrusions n1 to n5, and a plurality of protrusions n1 to n5. May protrude in a direction opposite to the direction of the resin material 150).

That is, the plurality of protrusions n1 to n5 are formed to protrude with the same thickness h1 on the second surface 124, and the width d11 of the first protrusion n1 adjacent to the light emitting device 140 is It may be different from the width of the remaining projections (n2 ~ n5).

That is, the width d11 of the first protrusion n1 may be greater than the width d12 of the second protrusion n2 and may be larger than the width d13 of the third to fourth protrusions n3 to n5. .

In an embodiment, the width d11 of the first protrusion n1 adjacent to the light emitting device 140 is described as being larger than the remaining protrusions n2 to n5, but the width d11 of the first protrusion n1 is the remainder. It may be smaller than the protrusions n2 to n5, but the present invention is not limited thereto.

That is, the width d11 of the first protrusion n1 is larger than the width d12 of the second protrusion n2 and the width d13 of the third protrusion n3, thereby reducing heat generated by the light emitting device 140. By increasing the absorption, the heat dissipation effect can be increased.

In an embodiment, the plurality of protrusions n1 to n5 have the same thickness h1, but the present invention is not limited thereto, and the thickness h1 may vary in proportion to the width of the plurality of protrusions n1 to n5. May be used without limitation.

FIG. 6 is a cross-sectional view illustrating a second embodiment in which the light emitting device package illustrated in FIG. 1 is cut along an AA direction, and FIG. 7 is an enlarged view illustrating a first embodiment of the 'Y2' block illustrated in FIG. 6, and FIG. 8. 7 is a partial perspective view showing first and second surfaces of the first lead frame illustrated in FIG. 7.

6, 7, and 8 briefly describe or omit contents overlapping with those described in FIG. 1.

6, 7 and 8, the light emitting device package 100 may include a body 110 and a light emitting device 140.

In this case, the body 110 may include a first lead frame 120 on which the light emitting device 140 is mounted, and a second lead frame 130 spaced apart from the first lead frame 120.

Here, the inner surface (not shown) of the body 110 forming the cavity s may be in contact with the first lead frame 120 and may be inclined with the first lead frame 120.

The first lead frame 120 includes a first surface 122 on which the light emitting device 140 is mounted and a second surface 124 opposite to the first surface 122, and the second lead frame 130 is It may include a third surface 132 disposed on the same line as the first surface 122 of the first lead frame 120 and a fourth surface 134 opposite to the third surface 132.

In an embodiment, the uneven pattern v is formed on the second surface 124 of the first lead frame 120, and the uneven pattern is not formed on the fourth surface 134 of the second lead frame 130. Although described, the uneven pattern v formed on the second surface 124 may also be formed on the fourth surface 134 of the second lead frame 140, but is not limited thereto.

6 and 7, the uneven pattern v may include a plurality of grooves v1 to v5, and the plurality of grooves v1 to v5 are recessed in an upper direction of the resin material 150. Can be.

That is, the plurality of grooves v1 to v5 are formed to be recessed in the second surface 124, and the plurality of grooves v1 to v5 may be formed to have the same width d2 and depth h2.

At this time, the width d2 of the plurality of grooves v1 to v5 may be equal to the width bd of the light emitting device 140 or smaller than the width bd1 of the light emitting device 140, which is light emission. When the width of the device 140 is greater than the width bd1, the number of the plurality of grooves v1 to v5 is small, so that the generated heat may not be easily released to the body.

In addition, the depth h2 of the plurality of grooves v1 to v5 may be formed to be smaller than the thickness h0 between the first and second surfaces 122 and 124 of the first lead frame 120, and may be 0.1 mm to 0.2. may be mm.

That is, the depth h2 of the plurality of grooves v1 to v5 may enlarge the contact area with the body 110, and may adjust the bending degree by contacting the body 110 with the force acting between the grooves by the absorbed heat. Can be reduced.

Referring to FIG. 8, (a) is a partial perspective view of the first surface 122 of the first leadframe 120, and (b) is a view of the second surface 124 of the first leadframe 120. Partial perspective view.

Referring to (a), the light emitting device 140 may be mounted in a predetermined region (not shown) on the first surface 122 of the first lead frame 120.

In this case, the first surface 122 may be formed in a plane.

Referring to (b), the second surface 124 of the first lead frame 120 may exclude the first region p1 and the first region p1 corresponding to the predetermined region of the first surface 122. It may include a second region p2.

In this case, the uneven pattern v including the plurality of grooves v1 to v5 may be formed in a part of the second region p2.

In addition, although the plurality of grooves v1 to v5 have been described as having a line shape in a polygonal shape, they may be formed in a dot shape, but are not limited thereto.

In addition, the plurality of grooves v1 to v5 may be formed in a semicircular shape. In addition, the plurality of grooves v1 to v5 have been described as being formed in a part of the second region p2 instead of the boundary surfaces of the first and second regions p1 and p2, but may be formed from the boundary surface. There is no limit.

In addition, at least one of the plurality of grooves v1 to v5 may be different from the depth and width of the remaining grooves, but is not limited thereto.

9 is a perspective view illustrating a lighting apparatus including a light emitting device package according to an embodiment, and FIG. 10 is a cross-sectional view illustrating a C-C cross section of the lighting apparatus illustrated in FIG. 9.

Hereinafter, in order to describe the shape of the lighting apparatus 300 according to the embodiment in more detail, the longitudinal direction (Z) of the lighting apparatus 300, the horizontal direction (Y) perpendicular to the longitudinal direction (Z), and the length The height direction X perpendicular to the direction Z and the horizontal direction Y will be described.

That is, FIG. 10 is a cross-sectional view of the lighting apparatus 300 of FIG. 9 cut in the plane of the longitudinal direction Z and the height direction X, and viewed in the horizontal direction Y. As shown in FIG.

9 and 10, the lighting device 300 may include a body 310, a cover 330 fastened to the body 310, and a closing cap 350 positioned at both ends of the body 310. have.

The lower surface of the body 310 is fastened to the light emitting device module 340, the body 310 is conductive so that the heat generated in the light emitting device package 344 can be discharged to the outside through the upper surface of the body 310 And it may be formed of a metal material having an excellent heat dissipation effect.

The light emitting device package 344 may be mounted on the PCB 342 in a multi-colored, multi-row array to form an array. The light emitting device package 344 may be mounted at the same interval or may be mounted with various separation distances as necessary to adjust brightness. The PCB 342 may be a metal core PCB (MCPCB) or a PCB made of FR4.

Meanwhile, the light emitting device package 344 may include a plurality of holes and a film made of a conductive material.

Since a film formed of a conductive material such as a metal causes a lot of interference of light, the intensity of the light wave may be strengthened by the interaction of the light wave, thereby effectively extracting and diffusing the light. The interference and diffraction of the light can effectively extract the light. Therefore, the efficiency of the lighting device 300 can be improved. At this time, the size of the plurality of holes formed in the film is preferably smaller than the wavelength of the light generated from the light source.

The cover 330 may be formed in a circular shape to surround the lower surface of the body 310, but is not limited thereto.

The cover 330 protects the light emitting device module 340 from the outside and the like. In addition, the cover 330 may include diffusing particles to prevent glare of the light generated from the light emitting device package 344, and to uniformly emit light to the outside, and at least of the inner and outer surfaces of the cover 330 A prism pattern or the like may be formed on either side. In addition, a phosphor may be applied to at least one of an inner surface and an outer surface of the cover 330.

On the other hand, since the light generated from the light emitting device package 344 is emitted to the outside through the cover 330, the cover 330 should have excellent light transmittance, and has sufficient heat resistance to withstand the heat generated by the light emitting device package 344. The cover 330 is preferably formed of a material including polyethylene terephthalate (PET), polycarbonate (PC), polymethyl methacrylate (PMMA), or the like. .

Closing cap 350 is located at both ends of the body 310 may be used for sealing the power supply (not shown). In addition, the closing cap 350 is formed with a power pin 352, the lighting device 300 according to the embodiment can be used immediately without a separate device to the terminal from which the existing fluorescent lamps are removed.

11 is an exploded perspective view of a liquid crystal display including the light emitting device package according to the first embodiment.

11 is an edge-light method, the liquid crystal display device 400 may include a liquid crystal display panel 410 and a backlight unit 470 for providing light to the liquid crystal display panel 410.

The liquid crystal display panel 410 may display an image using light provided from the backlight unit 470. The liquid crystal display panel 410 may include a color filter substrate 412 and a thin film transistor substrate 414 facing each other with the liquid crystal interposed therebetween.

The color filter substrate 412 may implement a color of an image displayed through the liquid crystal display panel 410.

The thin film transistor substrate 414 is electrically connected to the printed circuit board 418 on which a plurality of circuit components are mounted through the driving film 417. The thin film transistor substrate 414 may apply a driving voltage provided from the printed circuit board 418 to the liquid crystal in response to a driving signal provided from the printed circuit board 418.

The thin film transistor substrate 414 may include a thin film transistor and a pixel electrode formed of a thin film on another substrate of a transparent material such as glass or plastic.

The backlight unit 470 may convert the light provided from the light emitting device module 420, the light emitting device module 420 into a surface light source, and provide the light guide plate 430 to the liquid crystal display panel 410. Reflective sheet reflecting the light emitted to the light guide plate 430 to the plurality of films 450, 466, 464 and the light guide plate 430 to uniform the luminance distribution of the light provided from the light source 430 and to improve vertical incidence ( 440).

The light emitting device module 420 may include a PCB substrate 422 such that a plurality of light emitting device packages 424 and a plurality of light emitting device packages 424 may be mounted to form an array.

In particular, the light emitting device package 424 includes a film in which a plurality of holes are formed on the light emitting surface, so that the lens may be omitted, thereby implementing a slim light emitting device package and simultaneously improving light extraction efficiency. Therefore, the thinner backlight unit 470 can be implemented.

On the other hand, the backlight unit 470 is a diffusion film 466 for diffusing light incident from the light guide plate 430 toward the liquid crystal display panel 410, and a prism film 450 for condensing the diffused light to improve vertical incidence. ), And may include a protective film 464 for protecting the prism film 450.

12 is an exploded perspective view of a liquid crystal display device including the light emitting device package according to the second embodiment.

However, the parts shown and described in FIG. 11 will not be repeatedly described in detail.

12 is a direct view, the liquid crystal display 500 may include a liquid crystal display panel 510 and a backlight unit 570 for providing light to the liquid crystal display panel 510.

Since the liquid crystal display panel 510 is the same as that described with reference to FIG. 10, detailed description thereof will be omitted.

The backlight unit 570 includes a plurality of light emitting device modules 523, a reflective sheet 524, a lower chassis 530 in which the light emitting device modules 523 and the reflective sheet 524 are accommodated, and an upper portion of the light emitting device module 523. It may include a diffusion plate 540 and a plurality of optical film 560 disposed in the.

The light emitting device module 523 may include a PCB substrate 521 such that a plurality of light emitting device packages 522 and a plurality of light emitting device packages 522 are mounted to form an array.

In particular, the light emitting device package 522 is formed of a conductive material, and by providing a film including a plurality of holes on the light emitting surface, it is possible to omit the lens to implement a slim light emitting device package, at the same time light extraction efficiency Can improve. Therefore, it becomes possible to realize the backlight unit 570 which is thinner.

The reflective sheet 524 reflects the light generated from the light emitting device package 522 in the direction in which the liquid crystal display panel 510 is positioned to improve light utilization efficiency.

On the other hand, the light generated from the light emitting device module 523 is incident on the diffusion plate 540, the optical film 560 is disposed on the diffusion plate 540. The optical film 560 may include a diffusion film 566, a prism film 550, and a protective film 564.

Here, the lighting device 300 and the liquid crystal display device (400, 500) may be included in the lighting system, in addition to the light emitting device package, and the purpose of the lighting may also be included in the lighting system.

Features, structures, effects, and the like described in the above embodiments are included in at least one embodiment of the present invention, and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects, and the like illustrated in each embodiment may be combined or modified with respect to other embodiments by those skilled in the art to which the embodiments belong. Therefore, it should be understood that the present invention is not limited to these combinations and modifications.

In addition, the above description has been made with reference to the embodiment, which is merely an example, and is not intended to limit the present invention. It will be appreciated that various modifications and applications are possible. For example, each component specifically shown in the embodiment can be modified. And differences relating to such modifications and applications will have to be construed as being included in the scope of the invention defined in the appended claims.

Claims (19)

A light emitting element; And
The light emitting device is disposed, and includes a first lead frame having a concave-convex pattern including first and second protrusions and a second lead frame spaced apart from the first lead frame and different from the first lead frame. And a body having a cavity formed on the two lead frames;
The first lead frame,
A first surface on which the light emitting element is disposed; And
Concave-convex including a first region which is opposite to the first surface and overlaps the light emitting element, and the first protrusion formed adjacent to the first region and the second protrusion formed adjacent to the first protrusion in addition to the first region. A second surface including a patterned second region;
The first and second protrusions,
Protrudes from the surface of the second surface in the direction of the lower surface of the body opposite to the cavity direction, is formed the same as or thinner than the thickness between the first and second surfaces,
The first protrusion is,
The light emitting device package is formed to be wider than the width of the second protrusion, the same or thicker than the thickness of the second protrusion. delete delete delete The method of claim 1,
The uneven pattern is,
And a third protrusion adjacent to the second protrusion;
The third projection is,
At least one of the width and thickness of the second protrusion is the same light emitting device package. delete The thickness of any one of the first and second protrusions,
Light emitting device package of 0.1mm to 0.2mm. The method of claim 1, wherein at least one of the first and second protrusions is
Polygon or semi-circular light emitting device package. The method of claim 1, wherein the first protrusion,
Equal to the width of the light emitting element,
Or a light emitting device package smaller than the width of the light emitting device. delete delete delete delete delete delete delete delete delete delete

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