KR102075522B1 - Light-emitting device - Google Patents

Abstract

The light emitting device package according to the embodiment includes a package body in which a cavity is formed and a light emitting device mounted in the cavity, and the package body includes a protrusion and a bottom part formed to surround the side surface of the substrate of the light emitting device, and the cavity The space includes a space formed by separating the protrusion and the bottom portion, the portion of the space may be filled with a bonding material.

Description

Light emitting device package

Embodiments relate to a light emitting device package.

Light Emitting Diode (LED) is a device that converts an electric signal into a light form using the characteristics of a compound semiconductor. It is used in home appliances, remote controls, electronic displays, indicators, and various automation devices, and its use area is gradually increasing. There is a trend.

In general, miniaturized LEDs are made of a surface mount device type in order to directly mount on a printed circuit board (PCB) board. Accordingly, LED lamps, which are used as display elements, are also being developed as surface mount device types. . Such a surface mount device can replace a conventional simple lighting lamp, which is used as a lighting display that emits various colors, a character display, and an image display.

As the usage area of the LED is widened as described above, the luminance and reliability required for electric light used for living, electric light for rescue signals, etc. are increased, and it is important to increase the luminance and reliability of the LED.

On the other hand, the light generated in the light emitting device is absorbed and dissipated by the substrate portion has a problem that the light extraction efficiency of the light emitting device package is reduced.

Korean Patent Laid-Open Publication No. 10-2012-0100626 discloses a light emitting device package in which the side surface of the light emitting device is sealed with a molding material so that side light can be concentrated on the light emitting device.

An embodiment provides a light emitting device package that surrounds a side surface of a light emitting device substrate by a package body and includes a space part in which a bonding material is filled, thereby improving light extraction efficiency and reliability factors of the light emitting device package.

The light emitting device package according to the embodiment includes a package body in which a cavity is formed and a light emitting device mounted in the cavity, and the package body includes a protrusion and a bottom part formed to surround the side surface of the substrate of the light emitting device, and the cavity The space includes a space formed by separating the protrusion and the bottom portion, the portion of the space may be filled with a bonding material.

The light emitting device package according to the embodiment may include a protruding portion to surround a portion of the side surface of the light emitting device substrate to increase light extraction efficiency, and to form a space portion in which a bonding material is filled, thereby preventing short circuit of the light emitting device. It is possible to improve the reliability of the light emitting device package.

1A is a cross-sectional view illustrating a cross section of a light emitting device package according to an embodiment, and FIG. 1B is a plan view illustrating a plane of a light emitting device package according to an embodiment.
2 is an enlarged view illustrating an enlarged portion A of FIG. 1A.
3 is a cross-sectional view showing a cross section of a light emitting device package according to the embodiment.
4 is a cross-sectional view showing a cross section of a light emitting device package according to the embodiment.
5A is a perspective view illustrating a lighting device including a light emitting device package according to an embodiment, and FIG. 5B is a cross-sectional view illustrating a DD ′ cross section of the lighting device of FIG. 5A.
6 is an exploded perspective view illustrating a backlight unit including a light emitting device package according to an embodiment.
7 is an exploded perspective view illustrating a backlight unit including a light emitting device package according to an embodiment.

Advantages and features of the present invention, and methods for achieving them will be apparent with reference to the embodiments described below in detail in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but may be embodied in various different forms, and the present embodiments merely make the disclosure of the present invention complete, and those of ordinary skill in the art to which the present invention belongs. It is provided to fully inform the person having the scope of the invention, which is defined only by the scope of the claims. Like reference numerals refer to like elements throughout.

The spatially relative terms " below ", " beneath ", " lower ", " above ", " upper " It can be used to easily describe the correlation of a device or components with other devices or components. Spatially relative terms are to be understood as terms that include different directions of the device in use or operation in addition to the directions shown in the figures. For example, when flipping a device shown in the figure, a device described as "below" or "beneath" of another device may be placed "above" of another device. Thus, the exemplary term "below" can encompass both an orientation of above and below. The device can also be oriented in other directions, so that spatially relative terms can be interpreted according to orientation.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. In this specification, the singular also includes the plural unless specifically stated otherwise in the phrase. As used herein, “comprises” and / or “comprising” refers to the presence of one or more other components, steps, operations and / or elements. Or does not exclude additions.

Unless otherwise defined, all terms used in the present specification (including technical and scientific terms) may be used in a sense that can be commonly understood by those skilled in the art. In addition, the terms defined in the commonly used dictionaries are not ideally or excessively interpreted unless they are specifically defined clearly.

In the drawings, the thickness or size of each layer is exaggerated, omitted, or schematically illustrated for convenience and clarity of description. In addition, the size and area of each component does not necessarily reflect the actual size or area.

In addition, the angle and direction mentioned in the process of describing the structure of the light emitting device in the embodiment are based on those described in the drawings. In the description of the structure of the light emitting device in the specification, if the reference point and the positional relationship with respect to the angle is not clearly mentioned, reference is made to related drawings.

1A is a cross-sectional view illustrating a cross section of a light emitting device package according to an embodiment, FIG. 1B is a plan view illustrating a plane of the light emitting device package according to the embodiment of FIG. 1A, and FIG. 2 is an enlarged view of portion A of FIG. 1A. .

1A and 1B, the light emitting device package 100 may include a package body 110 in which a cavity C is formed, a light emitting device 130 mounted on the cavity C, and a lead frame 120. The package body 110 may include a protrusion 110a and a bottom portion 110b formed to surround the side surface of the substrate of the light emitting device 130. In addition, the cavity C may include a space 150 formed by spaced apart from the protrusion 110a and the bottom 110b, and a portion of the space 150 may be filled with a bonding material.

The light emitting device package body 110 serves as a housing, and a cavity C is formed at a central portion thereof, so that the light emitting device 130 may be mounted inside the cavity C.

In addition, the package body 110 wraps and supports the lead frame 120 and includes a resin material such as polyphthalamide (PPA), silicon (Si), aluminum (Al), aluminum nitride (AlN), and liquid crystal polymer. (PSG, photo sensitive glass), Polyamide 9T (PA9T), Syndiotactic Polystyrene (SPS), Metal, Sapphire (Al ₂ O ₃ ), Beryllium Oxide (BeO), Printed Circuit Board (PCB) It may be formed of at least one of. The package body 110 may be formed by injection molding, an etching process, or the like, but is not limited thereto.

The package body 110 may have a cavity C having an upper side opened to expose the light emitting device 130 to the outside, and the cavity C may be formed to be inclined inside the package body 110. The angle of reflection of the light emitted from the light emitting device 130 may vary according to the angle of the inclined surface, thereby adjusting the directivity of the light emitted to the outside.

As the directivity of the light decreases, the concentration of light emitted from the light emitting device 130 to the outside increases. On the contrary, as the directivity of the light increases, the concentration of light emitted to the outside from the light emitting device 130 decreases.

On the other hand, the shape viewed from above the cavity (C) formed in the package body 110 may be a shape of a circle, a square, a polygon, an oval, and the like, in particular may be a curved shape of the corner, but is not limited thereto.

In this case, a reflective coating film (not shown) may be formed on side and bottom surfaces of the cavity C constituting the inner wall of the cavity C. Here, the surface of the package body 110 on which the reflective coating film (not shown) is formed may be formed to have a smooth or predetermined roughness, and may be made of silver (Ag), aluminum (Al), or the like. .

Lead frame 120 is a metal material, for example, titanium (Ti), copper (Cu), nickel (Ni), gold (Au), chromium (Cr), tantalum (Ta), platinum (Pt), tin (Sn), silver (Ag), phosphorus (P), aluminum (Al), indium (In), palladium (Pd), cobalt (Co), silicon (Si), germanium (Ge), hafnium (Hf), ruthenium (Ru) and iron (Fe) may include one or more materials or alloys. In addition, the lead frame 120 may be formed to have a single layer or a multilayer structure, but is not limited thereto.

In addition, the lead frame 120 may be configured of the first lead frame 121 and the second lead frame 122 to apply different power. Here, the first lead frame 121 and the second lead frame 122 may be formed spaced apart from each other at a predetermined interval and may be partially wrapped by the package body 110.

The light emitting device 130 may be mounted on an upper surface of any one of the first lead frame 121 and the second lead frame 122, and will be described below as being mounted on the first lead frame 121.

The light emitting device 130 is a kind of semiconductor device that emits light having a predetermined wavelength by a power source applied from the outside, and includes GaN (gallium nitride), AlN (aluminum nitride), InN (indium nitride), GaAs (gallium arsenide), and the like. It can be implemented based on the Group 3 and 5 compounds of. For example, the light emitting device 130 may be a light emitting diode.

The light emitting diode may be, for example, a colored light emitting diode emitting light of red, green, blue, white, or the like, or an Ultra Violet (UV) emitting diode emitting ultraviolet light, but is not limited thereto. In the exemplary embodiment, a single light emitting diode is illustrated as being provided in the center portion, but the present invention is not limited thereto, and a plurality of light emitting diodes may be provided.

In addition, the light emitting diode is applicable to both a horizontal type in which the electrical terminals are formed on the upper surface, or to a vertical type formed on the upper and lower surfaces.

Referring to FIG. 2, the light emitting device 130 may include a substrate 131 and a light emitting structure 132.

The light emitting structure 132 is disposed on the substrate 131 and may include a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer, and may include a first conductive semiconductor layer and a second conductive semiconductor layer. The active layer may be formed in between.

On the other hand, the light emitting device substrate 131 may be formed of a conductive material, for example, gold (Au), nickel (Ni), tungsten (W), molybdenum (Mo), copper (Cu), aluminum (Al) ), Tantalum (Ta), silver (Ag), platinum (Pt), chromium (Cr), Si, Ge, GaAs, ZnO, GaN, Ga ₂ O ₃ or any one selected from SiC, SiGe, CuW or two or more It may be formed of an alloy, it may be formed by stacking two or more different materials.

In addition, in consideration of the role of the support layer, the electrical conductivity, and the thermal conductivity of the substrate 131, the height h3 of the substrate 131 may be 80 to 100 μm.

The substrate 131 may improve the thermal stability of the light emitting device by facilitating the emission of heat generated from the light emitting device 130, but the light generated from the light emitting device 130 may be emitted from the side of the substrate 131. There is a problem that the light emitting device package efficiency is lowered by being absorbed or dissipated.

Accordingly, the protrusion 110a may be formed to surround a part of the side surface of the substrate 131 of the light emitting device 130. The protrusion 110a may be formed of the same material as the package body 110 as part of the package body 110.

In this case, the height h1 of the protrusion 110a may be 60 to 80 μm.

When the height h1 of the protrusion is smaller than 60 μm, the side region of the substrate 131 that is not surrounded by the protrusion 110a may increase, thereby increasing absorption and annihilation of light generated from the light emitting device 130. .

On the other hand, when the height h1 of the protrusion is greater than 80um, the light emitting structure 132 may be covered by the protrusion 110a, so that the extraction efficiency of light generated in the light emitting structure 132 may be reduced, and the space portion ( It may be difficult to secure the area of 150). Therefore, the height h1 of the protrusion 110a may be 60 to 80 μm.

Referring back to FIG. 2, the light emitting device 130 may be mounted on the first lead frame 121. The light emitting device 130 may be bonded to the first lead frame 121 by a bonding material, and the bonding method may be utero bonding.

Bonding materials are, for example, AuSn, titanium (Ti), gold (Au), tin (Sn), nickel (Ni), chromium (Cr), gallium (Ga), indium (In), bismuth (Bi), copper (Cu), silver (Ag) or tantalum (Ta).

As the light emitting device 130 is bonded to the first lead frame 121 by the bonding material 160, a portion of the bonding material 160 remaining after bonding flows out to the side and the top surface of the light emitting structure 132, thereby providing a light emitting device ( 130 may be shorted.

To prevent this, the space 150 may be formed between the protrusion 110a and the bottom 110b.

When the space part 150 is formed, a portion of the bonding material 160 remaining after the light emitting device 130 is bonded to the first lead frame 121 fills a part of the space part 150, and thus, the bonding material 160 ) Can be prevented from flowing to the side and top of the light emitting structure (132).

At this time, the height (h2) of the space portion 150 may be 25 to 35um, the width (w2) of the space (h2) may be 70 to 130um.

When the height h2 of the space portion 150 is smaller than 25 μm or the width w2 is smaller than 70 μm, the volume of the space portion 150 is smaller than the amount of the remaining bonding material 160, so that the bonding material 160 is reduced. The light emitting structure 132 may flow to the side and the upper surface.

On the other hand, if the height h2 of the space 150 is greater than 35um or the width w2 is greater than 130um, the volume of the space 150 is excessively large compared to the amount of remaining bonding material, and the bonding material 160 Empty spaces that are not filled by) increase, resulting in lower structural stability of the light emitting device package 100.

On the other hand, the space 150 may be filled with the bonding material 160 30% to 80% of the total volume of the space.

If the volume of the space 150 filled by the bonding material 160 is less than 30% of the total volume of the space 150, as described above, there are many empty spaces not filled by the bonding material 160. The structural stability of the light emitting device package 100 may be lowered.

On the other hand, if the volume of the space 150 filled by the bonding material 160 is greater than 80% of the total volume of the space 150, the bonding material 160 expands and contracts due to thermal shock or external environment change. By repeating, the bonding may become unstable, and the reliability of the bonding may be degraded.

Referring back to FIGS. 1A and 1B, the light emitting device 130 may be electrically connected to the second lead frame 122 by a wire. In order to connect as described above, the light emitting device 130 may include an electrode pad 133 on an upper surface thereof, and the second lead frame 122 is formed to be bent, such that the upper surface of the second lead frame 122 is a protrusion ( 110a) may be exposed to the top.

The resin material 140 may be filled in the cavity C to seal the light emitting device 130 and the wire. At this time, the resin material 140 may be formed of a light-transmissive resin material such as silicon or epoxy, and may be formed by filling the material in the cavity C and then UV or heat curing the material.

The surface of the resin material 140 may be formed in a concave lens shape, a convex lens shape, a flat shape, and the like, and a direction angle of light emitted from the light emitting device 130 may vary according to the shape of the resin material 140. have.

In addition, another lens-shaped resin material may be formed or attached on the resin material 140, but is not limited thereto.

The resin material 140 may include a phosphor. Here, the phosphor may be selected according to the wavelength of the light emitted from the light emitting device 130 to allow the light emitting device package 100 to realize white light.

That is, the phosphor may be excited by the light having the first light emitted from the light emitting device 130 to generate the second light. For example, the light emitting device 130 is a blue light emitting diode and the phosphor is a yellow phosphor. In this case, the yellow phosphor may be excited by blue light to emit yellow light. As the yellow light generated by blue light and blue light generated by the blue light emitting diode is mixed, the light emitting device package 100 may be white light. Can be provided.

Similarly, when the light emitting device 130 is a green light emitting diode, a magenta phosphor or a mixture of blue and red phosphors is mixed. When the light emitting device 130 is a red light emitting diode, a cyan phosphor or a blue and green phosphor is mixed. For example,

Such phosphor may be a known phosphor such as YAG, TAG, sulfide, silicate, aluminate, nitride, carbide, nitridosilicate, borate, fluoride or phosphate.

Referring to FIG. 3, the heat dissipation pad 230 may be further included in contact with the bottom surface of the first lead frame 121.

Heat generated from the light emitting device 130 may be transferred to the heat dissipation pad 230 through the first lead frame 121, and heat may be efficiently discharged by the heat dissipation pad 230.

In this case, an area of the heat dissipation pad 230 may be wider than that of the light emitting device 130, and the heat dissipation pad 230 may be formed of a metal having excellent passion and electrical conductivity.

For example, titanium (Ti), copper (Cu), nickel (Ni), gold (Au), chromium (Cr), tantalum (Ta), platinum (Pt), tin (Sn), silver (Ag), Of phosphorus (P), aluminum (Al), indium (In), palladium (Pd), cobalt (Co), silicon (Si), germanium (Ge), hafnium (Hf), ruthenium (Ru), iron (Fe) It may include one or more materials or alloys.

Referring to FIG. 4, the light emitting device package 300 may further include a cover 340.

The cover 340 may be positioned to cover the cavity C and to contact a region of the body 110. The cover 340 may seal the cavity C in which the light emitting device 130 is mounted, to prevent moisture or foreign foreign matter from penetrating into the light emitting device 130, and may protect wire bonding (not shown). .

In addition, the cover 340 may be formed of a transparent material having a light transmittance, and may emit light generated from the light emitting device 130 to the outside of the light emitting device package 100. For example, the cover 340 may be formed using glass.

Meanwhile, the transparent resin may be filled in the cavity C defined by the cover 340, or may be filled with normal air.

The cover 340 may include an antireflection film or a light extraction structure. The anti-reflection film or the light extracting structure may be formed on at least one of the upper and lower surfaces of the cover 340.

The upper surface of the cover 340 is in contact with the outside air, and when the refractive index of the material constituting the cover 340 is greater than the refractive index of the air when the light is emitted from the cover 340 to the outside of the light emitting device package 300, the cover Total reflection may occur at the lower surface or the upper surface of the 340 to prevent light from being emitted. Therefore, by forming an anti-reflection film or light extraction structure on the upper or lower surface of the cover 340, it is possible to prevent the total reflection occurs.

5A is a perspective view illustrating a lighting device including a light emitting device package according to an embodiment, and FIG. 5B is a cross-sectional view illustrating a cross-sectional view taken along line D-D 'of the lighting device of FIG. 5A.

Hereinafter, in order to describe the shape of the lighting device 400 according to the embodiment in more detail, the longitudinal direction (Z), the horizontal direction (Y) perpendicular to the longitudinal direction (Z), and the length of the lighting device 400 It will be described in the height direction X perpendicular to the direction Z and the horizontal direction Y.

That is, FIG. 5B is a cross-sectional view of the lighting apparatus 400 of FIG. 5A cut in the plane of the longitudinal direction Z and the height direction X, and viewed in the horizontal direction Y. As shown in FIG.

5A and 5B, the lighting device 400 may include a body 410, a cover 430 fastened to the body 410, and a closing cap 450 positioned at both ends of the body 410. have.

The light emitting device module 440 is fastened to the lower surface of the body 410, and the body 410 is conductive so that heat generated from the light emitting device package 444 can be discharged to the outside through the upper surface of the body 410. And it may be formed of a metal material excellent in the heat dissipation effect.

The light emitting device package 444 may be mounted on the PCB 442 in a multi-colored, multi-row array to form an array. The light emitting device package 444 may be mounted at the same interval or may be mounted at various separation distances as necessary to adjust brightness. . As the PCB 442, a metal core PCB (MCPCB) or a PCB made of FR4 may be used.

Meanwhile, the light emitting device package 444 may include a plurality of holes and a film made of a conductive material.

Since a film formed of a conductive material such as a metal causes a lot of interference of light, the intensity of the light wave may be strengthened by the interaction of the light wave, thereby effectively extracting and diffusing the light. The interference and diffraction of the light can effectively extract the light. Thus, the efficiency of the lighting device 400 can be improved. At this time, the size of the plurality of holes formed in the film is preferably smaller than the wavelength of the light generated from the light source.

The cover 430 may be formed in a circular shape to surround the lower surface of the body 410, but is not limited thereto.

The cover 430 protects the light emitting device module 440 from the outside and the like. In addition, the cover 430 may include diffusing particles to prevent glare of the light generated from the light emitting device package 444 and to uniformly emit light to the outside, and also includes at least one of an inner surface and an outer surface of the cover 430. A prism pattern or the like may be formed on either side. In addition, a phosphor may be applied to at least one of an inner surface and an outer surface of the cover 430.

On the other hand, since the light generated in the light emitting device package 444 is emitted to the outside through the cover 430, the cover 430 should be excellent in light transmittance, and has sufficient heat resistance to withstand the heat generated in the light emitting device package 444. The cover 430 is preferably formed of a material including polyethylene terephthalate (PET), polycarbonate (PC), polymethyl methacrylate (PMMA), or the like. .

Closing cap 450 is located at both ends of the body 410 may be used for sealing the power supply (not shown). In addition, the closing cap 450 has a power pin 452 is formed, the lighting device 400 according to the embodiment can be used immediately without a separate device in the terminal from which the existing fluorescent light is removed.

6 is an exploded perspective view illustrating a backlight unit including a light emitting device package according to an embodiment.

FIG. 6 illustrates an edge-light method, and the liquid crystal display 500 may include a liquid crystal display panel 510 and a backlight unit 570 for providing light to the liquid crystal display panel 510.

The liquid crystal display panel 510 may display an image using light provided from the backlight unit 570. The liquid crystal display panel 510 may include a color filter substrate 512 and a thin film transistor substrate 514 facing each other with a liquid crystal interposed therebetween.

The color filter substrate 512 may implement colors of an image displayed through the liquid crystal display panel 510.

The thin film transistor substrate 514 is electrically connected to the printed circuit board 518 on which a plurality of circuit components are mounted through the driving film 517. The thin film transistor substrate 514 may apply a driving voltage provided from the printed circuit board 518 to the liquid crystal in response to a driving signal provided from the printed circuit board 518.

The thin film transistor substrate 514 may include a thin film transistor and a pixel electrode formed of a thin film on another substrate of a transparent material such as glass or plastic.

The backlight unit 570 may convert the light provided from the light emitting device module 520, the light emitting device module 520 into a surface light source, and provide the light guide plate 530 to the liquid crystal display panel 510. Reflective sheet for reflecting the light emitted from the rear of the light guide plate 530 and the plurality of films 550, 560, 564 to uniform the luminance distribution of the light provided from the 530 and improve the vertical incidence ( 540.

The light emitting device module 520 may include a PCB substrate 522 such that a plurality of light emitting device packages 524 and a plurality of light emitting device packages 524 are mounted to form an array.

In particular, the light emitting device package 524 includes a film in which a plurality of holes are formed on the light emitting surface, so that the lens may be omitted, thereby implementing a slim light emitting device package and simultaneously improving light extraction efficiency. Therefore, the thinner backlight unit 570 can be implemented.

Meanwhile, the backlight unit 570 includes a diffusion film 560 for diffusing light incident from the light guide plate 530 toward the liquid crystal display panel 510, and a prism film 550 for condensing the diffused light to improve vertical incidence. It may be configured as), and may include a protective film 564 for protecting the prism film 550.

7 is an exploded perspective view illustrating a backlight unit including a light emitting device package according to an embodiment.

However, the parts shown and described in FIG. 6 will not be repeatedly described in detail.

7 is a direct view, the liquid crystal display 600 may include a liquid crystal display panel 610 and a backlight unit 670 for providing light to the liquid crystal display panel 610.

Since the liquid crystal display panel 610 is the same as that described with reference to FIG. 6, a detailed description thereof will be omitted.

The backlight unit 670 may include a plurality of light emitting device modules 623, a reflective sheet 624, a lower chassis 630 in which the light emitting device modules 623 and the reflective sheet 624 are accommodated, and an upper portion of the light emitting device module 623. It may include a diffusion plate 640 and a plurality of optical film 660 disposed in the.

Light emitting device module 623 A plurality of light emitting device packages 622 may be mounted to include a PCB substrate 621 to form an array.

In particular, the light emitting device package 622 is formed of a conductive material, and by providing a film including a plurality of holes on the light emitting surface, it is possible to omit the lens to realize a slim light emitting device package, at the same time light extraction efficiency Can improve. Therefore, the thinner backlight unit 670 can be implemented.

The reflective sheet 624 reflects the light generated by the light emitting device package 622 in the direction in which the liquid crystal display panel 610 is located to improve light utilization efficiency.

Meanwhile, light generated from the light emitting device module 623 is incident on the diffusion plate 640, and the optical film 660 is disposed on the diffusion plate 640. The optical film 660 includes a diffusion film 666, a prism film 650, and a protective film 664.

Although the above has been shown and described with respect to preferred embodiments of the present invention, the present invention is not limited to the above-described specific embodiments, it is intended in the technical field to which the invention belongs without departing from the spirit of the invention claimed in the claims. Various modifications can be made by those skilled in the art, and these modifications should not be individually understood from the technical spirit or the prospect of the present invention.

100, 200, 300: light emitting device package 110: package body
120: lead frame 130: light emitting device
140: resin 150: space
160: bonding material

Claims (14)

A package body in which a cavity is formed;
A first lead frame and a second lead frame mounted in the cavity and spaced apart at predetermined intervals;
A light emitting device mounted on an upper surface of the first lead frame;
A wire electrically connecting the second lead frame and the light emitting element; And
It includes a heat dissipation pad in contact with the lower surface of the first lead frame,
The package body includes a protrusion and a bottom portion formed to surround the side of the substrate portion of the light emitting device,
The cavity includes a space portion formed by separating the protrusion and the bottom portion, the space portion is filled with a bonding material,
The bonding material fills 30 to 80% of the total volume of the space,
The bonding material includes at least one of AuSn and Ag,
The height h3 of the substrate of the light emitting device, which is a height from an upper surface of the first lead frame to an upper surface of the substrate, is 80 to 100 μm,
The height h1 of the protrusion from the uppermost surface where the bonding material is located to the upper surface of the protrusion is 60 to 80 um,
The height h2 of the space portion, which is the height from the upper surface of the first lead frame to the uppermost surface on which the bonding material is located, is 25 to 35 μm,
The width of the space portion is a light emitting device package of 70 to 130um. delete delete delete delete delete delete delete delete delete The method of claim 1,
Further comprising a cover for covering the cavity,
The cavity is filled with resin,
The resin material is a light emitting device package comprising a phosphor. delete delete An illumination system comprising the light emitting device package of claim 1.

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