KR101978941B1 - Light Emitting Device Package - Google Patents

Abstract

A light emitting device according to an embodiment of the present invention includes a body on which a cavity is formed; A lead frame including a first lead frame and a second lead frame arranged to be spaced apart from the first lead frame; And a light emitting element which is electrically connected to the lead frame and is disposed in the cavity, wherein at least one of the lead frames has a body portion arranged to be in contact with the body, and a contact portion extending from one end of the body portion, And the lower surface of the contact portion is higher than the upper surface of the second lead frame.

Description

[0001] Light Emitting Device Package [0002]

The present invention relates to a light emitting device package, and more particularly, to a light emitting device provided in a flip chip.

Light Emitting Diode (LED) is a device that converts electrical signals into light by using the characteristics of compound semiconductors. It is widely used in household appliances, remote control, electric signboard, display, and various automation devices. There is a trend.

When a forward voltage is applied to the light emitting device, electrons in the n-layer and holes in the p-layer are coupled to emit energy corresponding to the energy gap between the conduction band and the valance band. It is mainly emitted in the form of heat or light, and when emitted in the form of light, it becomes an LED.

As the use area of the LED is widened as described above, it is important to increase the luminance of the LED as the brightness required for a lamp used in daily life and a lamp for a structural signal is increased. In addition, a light emitting device package including an LED is also used as a light source in a backlight unit of a display device such as an LCD, and slimming of the light emitting device package in accordance with the trend of thinning of the display device is also demanded.

The light emitting device package may cause various defects due to thermal expansion or deterioration of each material due to heat energy generated in the light emitting device. Therefore, it is an important issue to efficiently discharge the heat generated from the light emitting element to the outside.

A problem to be solved by the present invention is to maximize the efficiency of heat emission by adjusting the contact relationship between the lead frame and the light emitting element.

The problems of the present invention are not limited to the above-mentioned problems, and other problems not mentioned can be clearly understood by those skilled in the art from the following description.

According to an aspect of the present invention, there is provided a light emitting device including: a body on which a cavity is formed; A lead frame including a first lead frame and a second lead frame arranged to be spaced apart from the first lead frame; And a light emitting element which is electrically connected to the lead frame and is disposed in the cavity, wherein at least one of the lead frames has a body portion arranged to be in contact with the body, and a contact portion extending from one end of the body portion, And the lower surface of the contact portion is higher than the upper surface of the second lead frame.

The details of other embodiments are included in the detailed description and drawings.

The light emitting device package according to an embodiment of the present invention can transmit heat generated from the light emitting device to the lead frame by the structure change of the lead frame to facilitate heat emission.

The effects of the present invention are not limited to the effects mentioned above, and other effects not mentioned can be clearly understood by those skilled in the art from the description of the claims.

1 to 4 are cross-sectional views illustrating a light emitting device package according to an embodiment of the present invention,
5A is a perspective view illustrating a lighting device including a light emitting device package according to an embodiment,
5B is a cross-sectional view illustrating a lighting device including a light emitting device package according to an embodiment,
6 is a conceptual view illustrating a liquid crystal display device including a light emitting device package according to an embodiment,
7 is a conceptual diagram illustrating a liquid crystal display device including a light emitting device package according to an embodiment.

BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention and the manner of achieving them will become apparent with reference to the embodiments described in detail below with reference to the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. To fully disclose the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims. Like reference numerals refer to like elements throughout the specification.

The terms spatially relative, "below", "beneath", "lower", "above", "upper" May be used to readily describe a device or a relationship of components to other devices or components. Spatially relative terms should be understood to include, in addition to the orientation shown in the drawings, terms that include different orientations of the device during use or operation. For example, when inverting an element shown in the figures, an element described as "below" or "beneath" of another element may be placed "above" another element. Thus, the exemplary term " below " can include both downward and upward directions. The elements can also be oriented in different directions, so that spatially relative terms can be interpreted according to orientation.

The terminology used herein is for the purpose of illustrating embodiments and is not intended to be limiting of the present invention. In the present specification, the singular form includes plural forms unless otherwise specified in the specification. It is noted that the terms "comprises" and / or "comprising" used in the specification are intended to be inclusive in a manner similar to the components, steps, operations, and / Or additions.

Unless defined otherwise, all terms (including technical and scientific terms) used herein may be used in a sense commonly understood by one of ordinary skill in the art to which this invention belongs. Also, commonly used predefined terms are not ideally or excessively interpreted unless explicitly defined otherwise.

The thickness and size of each layer in the drawings are exaggerated, omitted, or schematically shown for convenience and clarity of explanation. Also, the size and area of each component do not entirely reflect actual size or area.

Further, the angle and direction mentioned in the description of the structure of the light emitting device in the embodiment are based on those shown in the drawings. In the description of the structure of the light emitting device in the specification, reference points and positional relationship with respect to angles are not explicitly referred to, refer to the related drawings.

A preferred light emitting device package may be modified by a person skilled in the art, and in the embodiment of the present invention is a light emitting device package.

1 to 4 are cross-sectional views illustrating a light emitting device package according to an embodiment of the present invention, respectively.

Referring to FIG. 1, a light emitting device package according to the present invention includes a lead frame 120, a light emitting device 130, and a molding unit (not shown) disposed on a body 110.

The body 110 may be made of a resin material such as polyphthalamide (PPA), silicon (Si), aluminum (Al), aluminum nitride (AlN), liquid crystal polymer (PSG), polyamide 9T (SPS), a metal material, sapphire (Al2O3), beryllium oxide (BeO), and a printed circuit board (PCB). The body 110 may be formed by injection molding, etching, or the like, but is not limited thereto.

The upper surface of the body 110 may be flat, and a plurality of light emitting devices 130 may be installed on the body 110.

The light emitting device 130 may be disposed in a cavity of the body 110. The light emitting device 130 may be electrically connected to the lead frame 120. The molding member may cover the light emitting device 130. The lead frame includes a first lead frame 121 and a second lead frame 122 that are electrically separated from each other and provide power to the light emitting element 130. [

The lead frame 120 may increase the light efficiency by reflecting the light generated from the light emitting device 130 and may discharge the heat generated from the light emitting device 130 to the outside.

The light emitting device 130 is electrically connected to the first lead frame 121 and the second lead frame 122 and may be connected by a wire method, a die bonding method, a flip chip method, or the like, but is not limited thereto.

In the embodiment, the light emitting device 130 according to the first embodiment is illustrated, and the light emitting device 130 can be electrically connected without a wire as in the case of a flip chip method.

The molding member (not shown) may be disposed to surround the light emitting device 130 to protect the light emitting device 130. In addition, the molding member may include a phosphor to change the wavelength of light emitted from the light emitting device 130.

A molding member (not shown) may be filled in the cavity so as to cover the light emitting device 130.

The molding member (not shown) may be formed of silicon, epoxy, or other resin material. The molding member may be filled in the cavity, and then may be formed by ultraviolet ray or thermal curing.

The molding member (not shown) may include a phosphor, and the phosphor may be selected to have a wavelength of light emitted from the light emitting device 130 so that the light emitting device package may emit white light.

The phosphor may be one of a blue light emitting phosphor, a blue light emitting phosphor, a green light emitting phosphor, a yellow light emitting phosphor, a yellow light emitting phosphor, a yellow red light emitting phosphor, an orange light emitting phosphor, and a red light emitting phosphor depending on the wavelength of light emitted from the light emitting device 130. Can be applied.

The phosphor may be excited by the light having the first light emitted from the light emitting device 130 to generate the second light. For example, when the light emitting element 130 is a blue light emitting diode and the phosphor is a yellow phosphor, the yellow phosphor may be excited by blue light to emit yellow light, and blue light and blue light emitted from the blue light emitting diode As the excited yellow light is excited, the light emitting device package can provide white light.

Similarly, when the light emitting device 130 is a green light emitting diode, when a magenta fluorescent substance or a blue and red fluorescent substance are mixed, when the light emitting device 130 is a red light emitting diode, And a green phosphor are mixed with each other.

Such a fluorescent material may be a known fluorescent material such as a YAG, TAG, sulfide, silicate, aluminate, nitride, carbide, nitridosilicate, borate, fluoride or phosphate.

Each of the lead frames 120 may be formed of a metal material such as Ti, Cu, Ni, Au, Cr, Ta, Pt, (Al), indium (In), palladium (Pd), cobalt (Co), silicon (Si), germanium (Ge), hafnium (Hf), tin (Sn), silver (Ag) , Ruthenium (Ru), iron (Fe), or the like. In addition, the lead frame 120 may be formed to have a single layer or a multilayer structure, and two lead frames or several lead frames may be mounted as shown, but the present invention is not limited thereto.

The lead frame 120 is mounted on the body 110, and the first lead frame 121 and the second lead frame 122 may be separated from each other and electrically separated from each other. The first lead frame 121 and the second lead frame 122 may be in direct contact with the light emitting device 130 or may be electrically connected through the electrode material 150.

The first lead frame 121 and the second lead frame 122 may be wire-bonded by wires to be electrically connected to the light emitting device 130. When power is supplied to each of the lead frames 121 and 122, power may be applied to the light emitting device 130.

The light emitting device package of one embodiment may include a body portion disposed in contact with the body 110 and a contact portion 140 protruding upward from one end of the body portion. The upper surface of the contact portion 140 is brought into contact with the lower surface of the light emitting element 130. The upper surface of the contact portion 140 may be flat. The upper surface of the light emitting element 130 and the contact portion 140 can be in surface contact with each other. And electrodes (not shown) disposed at both ends of the light emitting element 130. [

The electrode material 150 may further include a contact portion 140 contacting the center of the bottom surface of the light emitting device 130 and an electrode (not shown) of the light emitting device 130 connected to the lead frame 120.

The electrode (not shown) may be formed of a conductive material, and may be formed of a metal such as indium (In), cobalt (Co), silicon (Si), germanium (Ge), gold (Au), palladium (Ru), iridium (Ir), tungsten (W), titanium (Ti), tantalum (Ru), rhenium (Re), magnesium (Mg), zinc (Zn), hafnium ), Silver (Ag), chrome (Cr), molybdenum (Mo), niobium (Nb), aluminum (Al), nickel (Ni), and copper , Or by stacking two or more different materials.

The electrode material 150 may electrically connect the light emitting device 130 and the lead frame 120. Referring to FIG. 2, the electrode material 150 may be in contact with an electrode (not shown) and may include a first electrode material and a second electrode material. The first electrode material may connect the first lead frame 121 and the light emitting element 130 and the second electrode material may be extended to the second lead frame 122. [ The first electrode material and the second electrode material may be made of the same conductive material so that the lead frame 120 electrically connected to the light emitting device 130 can be electrically connected to each other.

Hereinafter, the operation of the light emitting device package according to the present invention will be described.

1 is a cross-sectional view showing a light emitting device package according to an embodiment of the present invention. The contact portion 140 of the first lead frame 121 electrically connected to the light emitting device package according to an embodiment of the present invention is electrically connected to the electrode (not shown) at one end of the light emitting device 130 at the bottom center of the light emitting device 130 The contact portion 140 formed to the electrode (not shown) and the contact portion 140 separated from the central portion of the light emitting element 130 may affect the heat generation.

And a contact portion 140 extending from one end of the body portion and the body portion of the lead frame 120 and projecting upward. The upper surface of the contact portion 140 may be flat. The lower surface of the foot coperator 130 and the upper surface of the contact portion 140 can be in surface contact with each other. In the light emitting device 130, electrodes may be disposed under both ends.

The upper surface of the contact portion 140 can be in contact with the lower surface of the light emitting element 130. The lower surface of the contact portion 140 may be 50 to 250 탆 higher than the upper surface of the second lead frame 122. If the lower surface of the contact portion 140 is not higher than the upper surface of the second lead frame 122 by 50 mu m or more, the contact portion 140 may not contact the light emitting element 130, If it is higher than 250 탆, the light emitting device 130 may be disposed too high in the cavity, which may cause difficulty in designing the light directing angle.

㎛ 내지 150

㎛로 형성될 수 있다. 리드프레임(120)의 두께가 100

㎛ 미만인 경우, 발광소자(130)로부터 열을 받아, 팽창과 수축을 반복하면서, 결함이 발생할 우려가 있고, 두께가 150

㎛ 초과인 경우, 과도하게 두꺼워져서 패키지의 크기를 키우고, 열에 의한 팽창시, 몸체(110)에 결함을 발생시킬 수 있다. When the body 110 surrounds the first and second lead frames, if the thickness of the first and second lead frames is 100

Mu m to 150 <

Mu m. When the thickness of the lead frame 120 is 100

If the thickness is less than 1 mu m, heat may be absorbed from the light emitting element 130, and repeatedly expanding and contracting may occur,

If it is more than 탆, it becomes excessively thick to increase the size of the package and cause defects in the body 110 when expanded by heat.

The second lead frame 122 may have an electrode material 150 on its upper surface. The electrode material 150 can electrically connect an electrode (not shown) of the light emitting device 130 and the lead frame 120. The electrode material 150 may be a conductive adhesive material such as solder balls such as paste Ag, gold (Au) -tin (Sn), lead containing solder (Pb), or the like. The electrode material 150 may transmit the power of the lead frame 120 to the light emitting element 130.

The thicker the first and second lead frames 121 and 122, the more efficient heat dissipation can be. In the present embodiment, when the body covers the first and second lead frames 121 and 122, the thicknesses of the first and second lead frames 121 and 122 may be 100 to 150 mu m.

The contact portion 140 may have one side of the lead frame 120 extended. The contact portion 140 may be in the form of a conductive material additionally attached to one side of the lead frame 120 according to the embodiment, but is not limited thereto.

The contact portion 140 may be bent at one side of the lead frame 120. The contact portion 140 may be a portion where the lead frame 120 is bent at one side and the height of the top surface is higher than the other top surface of the lead frame 120. [ The contact portion 140 may be a portion raised in height so as to be in contact with the lower surface of the light emitting element 130.

The height of the electrode material 150 may vary depending on the difference in height between the upper surface of the first lead frame 121 and the upper surface of the second lead frame 122. The upper surface of the electrode material 150 and the upper surface of the contact portion 140 may have the same height. The electrode material 150 may be connected to one electrode of the light emitting device 130 and the contact portion 140 may be connected to another electrode of the light emitting device 130.

The heat generated in the light emitting device 130 is transmitted to the contact portion 140 and the electrode material 150 and is transmitted to the first and second lead frames 121 and 122 to be radiated to the outside.

2 is a cross-sectional view illustrating a light emitting device package according to another embodiment of the present invention. The components described above with reference to Fig. 1 are denoted by the same reference numerals and will not be described in further detail.

The upper surface of the contact portion 240 of the first lead frame 221 and the center of the lower surface of the light emitting device 230 are brought into contact with each other. The contact portion 240 can be in contact with the center portion of the lower surface of the light emitting element 230. The light emitting device 230 and the lead frame 220 may be connected to the electrode strip 250.

The electrode material 250 may be two. The two electrode materials 250 can be connected to each of the two electrodes of the light emitting element 230. The two electrode materials 250 may be connected to the first and second lead frames 221 and 222, respectively.

The upper surface of the contact portion 240 can be in contact with the lower surface of the light emitting element. The electrode material 250 is two connected to the two electrodes of the light emitting element, respectively, and the contact portion 240 can be disposed between the two electrode materials 250.

The upper surface of the contact portion 240 of the first lead frame 221 is formed higher than the upper surface of the second lead frame 222 so that both ends of the light emitting element 230 are in contact with the first and second lead frames 221 and 222 Do not.

The electrode material 250 may be arranged to contact the first and second lead frames 221 and 222 and the electrode (not shown) so that heat of the light emitting element 230 may be emitted through the lead frame 220.

3 is a cross-sectional view illustrating a light emitting device package according to another embodiment of the present invention. Elements similar to those described above with respect to Fig. 1 are denoted by the same reference numerals, and detailed description thereof is omitted.

In another embodiment of the present invention, the light emitting device 330 may further include a heat transfer material 360 for transferring heat generated by the light emitting device 330 to the contact portion 340. The heat transfer material 360 is disposed on the upper surface of the contact portion 340 formed in the first lead frame 321 in a state where the height of the first lead frame 321 and the second lead frame 322 are the same, And comes into contact with the center. The heat transfer material 360 may be a material having high thermal conductivity.

The contact portion 340 may have a shape in which one side of the lead frame 320 is curved. The lower surface of the contact portion 340 may be higher than the upper surface of the second lead frame 323.

Depending on the thickness of the heat transfer material 360, electrodes (not shown) disposed at both ends of the light emitting element 330 may not contact the first and second lead frames 321 and 322. The electrode material 350 may be arranged to electrically connect the first and second lead frames 322 and the electrodes (not shown) so that heat of the light emitting element 330 may be emitted through the lead frame 320 .

4 is a cross-sectional view illustrating a light emitting device package according to another embodiment of the present invention. Elements similar to those described above with respect to Fig. 1 are denoted by the same reference numerals, and detailed description thereof is omitted.

The first lead frame 421 and the second lead frame 422 may include a contact portion 440. The first lead frame 421 and the second lead frame 422 may be bent at one side to form the contact portions 440 and 470. For convenience of explanation, the contact portion 440 of the first lead frame is referred to as a first contact portion, and the contact portion 470 of the second lead frame is referred to as a second contact portion.

In another embodiment of the present invention, the lower surface of the first contact portion 440 may be formed higher than the upper surface of the second lead frame 422 except for the second contact portion 470. The second contact portion 470 may be formed so that one end of the second lead frame 422 is equal to the height of the upper surface of the first contact portion 440 so as to be in contact with the electrode (not shown) of the light emitting element 430.

Each of the lead frames 420 may have a plurality of regions having different heights on the upper surface. For example, the two lead frames 420 may be bent on one side, and the heights of the upper surfaces may be different from each other. For example, the lead frame 420 may have different heights of a portion where the contact portion is formed and a portion where the contact portion is not formed. The two lead frames 420 may have a height greater than a height of a portion connected to the light emitting device 430.

A light guide plate, a prism sheet, a diffusion sheet, a fluorescent sheet, and the like, which are optical members, may be disposed on a path of light emitted from the light emitting device package. The light emitting device package, the substrate, and the optical member may function as a backlight unit. Yet another embodiment may be implemented as a lighting unit comprising the light emitting device or the light emitting device package described in the above embodiments, for example, the lighting unit may include a display device, a pointing device, a lamp, have.

FIG. 5A is a perspective view showing an illumination system 400 including a light emitting device according to an embodiment, and FIG. 5B is a cross-sectional view showing a D-D 'cross-section of the illumination system of FIG. 5A.

5B is a cross-sectional view of the illumination system 400 of FIG. 5A cut in the longitudinal direction Z and the height direction X and viewed in the horizontal direction Y. FIG.

5A and 5B, the lighting system 400 may include a body 410, a cover 430 coupled to the body 410, and a finishing cap 450 positioned at opposite ends of the body 410 have.

The light emitting device module 443 is coupled to a lower surface of the body 410. The body 410 is electrically connected to the light emitting device package 444 through the upper surface of the body 410, And may be formed of a metal material having excellent heat dissipation effect, but is not limited thereto.

The light emitting device package 444 includes a light emitting element (not shown).

The light emitting device package 444 may be mounted on the substrate 442 in a multi-color, multi-row manner to form a module. The light emitting device package 444 may be mounted at equal intervals or may be mounted with various spacings as needed. As the substrate 442, MCPCB (Metal Core PCB) or FR4 PCB can be used.

The cover 430 may be formed in a circular shape so as to surround the lower surface of the body 410, but is not limited thereto.

The cover 430 can protect the internal light emitting element module 443 from foreign substances or the like. The cover 430 may include diffusion particles to prevent glare of light generated in the light emitting device package 444 and uniformly emit light to the outside, and may include at least one of an inner surface and an outer surface of the cover 430 A prism pattern or the like may be formed on the surface. Further, the phosphor may be coated on at least one of the inner surface and the outer surface of the cover 430.

The light generated from the light emitting device package 444 is emitted to the outside through the cover 430 so that the cover 430 should have excellent light transmittance and sufficient heat resistance to withstand the heat generated from the light emitting device package 444 The cover 430 may be made of a material including polyethylene terephthalate (PET), polycarbonate (PC), polymethyl methacrylate (PMMA), or the like .

The finishing cap 450 is located at both ends of the body 410 and can be used for sealing the power supply unit (not shown). The finishing cap 450 is formed with the power pin 452, so that the lighting system 400 according to the embodiment can be used immediately without a separate device on the terminal from which the conventional fluorescent lamp is removed.

6 is an exploded perspective view of a liquid crystal display device including a light emitting device according to an embodiment.

6, the liquid crystal display device 500 may include a backlight unit 570 for providing light to the liquid crystal display panel 510 and the liquid crystal display panel 510 in an edge-light manner.

The liquid crystal display panel 510 can display an image using the light provided from the backlight unit 570. The liquid crystal display panel 510 may include a color filter substrate 512 and a thin film transistor substrate 514 facing each other with a liquid crystal therebetween.

The color filter substrate 512 can realize the color of an image to be displayed through the liquid crystal display panel 510.

The thin film transistor substrate 514 is electrically connected to a printed circuit board 518 on which a plurality of circuit components are mounted via a driving film 517. The thin film transistor substrate 514 may apply a driving voltage provided from the printed circuit board 518 to the liquid crystal in response to a driving signal provided from the printed circuit board 518. [

The thin film transistor substrate 514 may include a thin film transistor and a pixel electrode formed as a thin film on another substrate of a transparent material such as glass or plastic.

The backlight unit 570 includes a light emitting device module 520 for outputting light, a light guide plate 530 for changing the light provided from the light emitting module 520 into a surface light source to provide the light to the liquid crystal display panel 510, A plurality of films 550, 560, and 564 that uniformly distribute the luminance of light provided from the light guide plate 530 and improve vertical incidence, and a reflective sheet (not shown) that reflects light emitted to the rear of the light guide plate 530 to the light guide plate 530 540).

The light emitting device module 520 may include a PCB substrate 522 to mount a plurality of light emitting device packages 524 and a plurality of light emitting device packages 524 to form a module.

The light emitting device package 524 includes a light emitting element (not shown).

The backlight unit 570 includes a diffusion film 566 for diffusing light incident from the light guide plate 530 toward the liquid crystal display panel 510 and a prism film 550 for enhancing vertical incidence by condensing the diffused light And may include a protective film 564 for protecting the prism film 550.

7 is an exploded perspective view of a liquid crystal display device including a light emitting device according to an embodiment. However, the parts shown and described in Fig. 6 are not repeatedly described in detail.

7 is a direct-view liquid crystal display device 600 according to the embodiment. The liquid crystal display device 600 may include a liquid crystal display panel 610 and a backlight unit 670 for providing light to the liquid crystal display panel 610. Since the liquid crystal display panel 610 is the same as that described with reference to FIG. 6, detailed description is omitted.

The backlight unit 670 includes a plurality of light emitting element modules 623, a reflective sheet 624, a lower chassis 630 in which the light emitting element module 623 and the reflective sheet 624 are accommodated, And a plurality of optical films 660 disposed on the diffuser plate 640.

The light emitting device module 623 may include a PCB substrate 621 to mount a plurality of light emitting device packages 622 and a plurality of light emitting device packages 622 to form a module.

The light emitting device package 622 includes a light emitting element (not shown).

The reflective sheet 624 reflects light generated from the light emitting device package 622 in a direction in which the liquid crystal display panel 610 is positioned, thereby improving light utilization efficiency.

The light emitted from the light emitting element module 623 is incident on the diffusion plate 640 and the optical film 660 is disposed on the diffusion plate 640. The optical film 660 is composed of a diffusion film 666, a prism film 650, and a protective film 664.

The configuration and the method of the embodiments described above are not limitedly applied, but the embodiments may be modified so that all or some of the embodiments are selectively combined so that various modifications can be made. .

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, It should be understood that various modifications may be made by those skilled in the art without departing from the spirit and scope of the present invention.

110: Body
120: Lead frame
121: first lead frame
122: second lead frame
130: Light emitting element
140:
150: Electrode material
360: Heat transfer material

Claims (12)

A body on which the cavity is formed;
A lead frame including a first lead frame and a second lead frame arranged to be spaced apart from the first lead frame; And
And a light emitting element electrically connected to the lead frame and disposed in the cavity,
At least one lead frame of the lead frame includes a body portion arranged to be in contact with the body and a contact portion extending from one end of the body portion and projecting upward,
The lower surface of the contact portion is higher than the upper surface of the second lead frame,
Two electrodes are disposed under both ends of the light emitting element,
The contact portion is in contact with the lower surface of the light emitting element,
And an electrode material connecting the electrode of the light emitting element and the lead frame,
Wherein the electrode material is two connected to the two electrodes of the light emitting element,
And the contact portion is disposed between the two electrode materials. The method according to claim 1,
And the upper surface of the contact portion is formed flat. The method according to claim 1,
And a lower surface of the light emitting element is in surface contact with an upper surface of the contact portion. delete delete delete The method according to claim 1,
And the upper surface of the contact portion is in contact with the lower surface of the light emitting element. The method according to claim 1,
And a heat transfer material disposed on an upper surface of the contact portion. The method according to claim 1,
Wherein a portion of the second lead frame connected to an electrode of the light emitting device is bent to form a contact portion. The method according to claim 1,
And the lower surface of the contact portion is 50 to 250 占 퐉 higher than the upper surface of the second lead frame. The method according to claim 1,
Wherein when the body surrounds the first and second lead frames, the thickness of the first and second lead frames is 100 to 150 占 퐉.

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