KR20120073929A - Light emitting device package - Google Patents

Light emitting device package Download PDF

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Publication number
KR20120073929A
KR20120073929A KR1020100135856A KR20100135856A KR20120073929A KR 20120073929 A KR20120073929 A KR 20120073929A KR 1020100135856 A KR1020100135856 A KR 1020100135856A KR 20100135856 A KR20100135856 A KR 20100135856A KR 20120073929 A KR20120073929 A KR 20120073929A
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KR
South Korea
Prior art keywords
light emitting
emitting device
device package
light
light source
Prior art date
Application number
KR1020100135856A
Other languages
Korean (ko)
Inventor
성진석
Original Assignee
엘지이노텍 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 엘지이노텍 주식회사 filed Critical 엘지이노텍 주식회사
Priority to KR1020100135856A priority Critical patent/KR20120073929A/en
Publication of KR20120073929A publication Critical patent/KR20120073929A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Led Device Packages (AREA)

Abstract

PURPOSE: A light emitting display package is provided to decrease the height and distance for wire bonding by mounting a light source unit in a groove unit formed in a lead frame. CONSTITUTION: A first lead frame(140) and a second lead frame(150) are mounted on a body(110). A cavity(120) is formed in the body. A light source unit is electrically connected to the first lead frame. The second lead frame is electrically connected to the light source unit with a wire(160). The first lead frame includes a groove unit(170).

Description

Light Emitting Device Package

Embodiments relate to a light emitting device package including a lead frame.

Light Emitting Diode (LED) is a device that converts an electric signal into a light form using the characteristics of a compound semiconductor, and is used for home appliances, remote controllers, electronic displays, indicators, and various automation devices. There is a trend.

The light emitting device package may include a light source unit emitting light when power is applied, and a lead frame electrically connected to the light source unit to transfer current. The light source unit may be directly mounted to the lead frame or electrically connected to the lead frame by wire bonding.

When the lead frame and the light source are electrically connected by wire bonding, the height and length of the wire, that is, the height and distance required for wire bonding, are important factors for determining the size of the light emitting device package. As the height and distance required for wire bonding become larger, the size of the light emitting device package may increase, which may lower economic efficiency, workability, and utility. Therefore, shortening the height and distance required for wire bonding remains a big problem in the manufacture of light emitting device packages.

Embodiments provide a light emitting device package in which a light source unit is mounted in a groove formed in a lead frame to shorten a height and a distance required for wire bonding, and a size of a light emitting device package is reduced, thereby improving economic efficiency, workability, and efficiency. .

The light emitting device package according to the embodiment includes a body having a cavity, first and second lead frames mounted on the body, a light source unit electrically connected to the first and lead frames, a second lead frame and the light source unit electrically It includes a wire for connecting, the first lead frame includes a groove portion and the light source portion is mounted on the groove portion.

The groove also includes a bottom and a side surface.

The side also includes an inclined surface.

In addition, the bottom surface includes an inclined surface.

In the light emitting device package according to the embodiment, since the groove is formed in the lead frame and the light source is mounted on the bottom of the groove, the height of the wire is lowered and the distance between the points where the wire is bonded is shortened, thereby reducing the size of the light emitting device package. Therefore, the economy, workability, and utility of the light emitting device package can be increased.

1A is a perspective view of a light emitting device package according to an embodiment;
1B is a sectional view showing a light emitting device package according to the embodiment;
2 is a cross-sectional view showing a light emitting device package according to the embodiment;
3 is a cross-sectional view showing a light emitting device package according to the embodiment;
4A is a perspective view of a lighting device including a light emitting device package according to an embodiment;
4B is a sectional view showing a lighting apparatus including a light emitting device package according to an embodiment;
5 is an exploded perspective view showing a liquid crystal display device including a light emitting device package according to the embodiment;
6 is an exploded perspective view illustrating a liquid crystal display including a light emitting device package according to an embodiment.

In the drawings, the thickness or size of each component is exaggerated, omitted, or schematically illustrated for convenience and clarity of description. In addition, the size of each component does not necessarily reflect the actual size. In addition, the same code | symbol is used about the same structure.

Hereinafter, exemplary embodiments will be described in more detail with reference to the accompanying drawings.

1A and 1B are a perspective view and a cross-sectional view of a light emitting device package according to an embodiment.

1A and 1B, the light emitting device package 100 according to the embodiment may include a body 110 having a cavity 120 and first and second lead frames 140 and 150 mounted on the body 110. ), A light source unit 130 electrically connected to the first lead frame 140, and a wire 160 electrically connecting the second lead frame 150 and the light source unit 130. The first lead frame 140 may include a groove 170 formed in at least one region, and the light source 130 may be mounted in the groove 170.

The body 110 is made of a resin material such as polyphthalamide (PPA), silicon (Si), aluminum (Al), aluminum nitride (AlN), photosensitive glass (PSG), polyamide 9T (PA9T) ), Neo geotactic polystyrene (SPS), a metal material, sapphire (Al 2 O 3 ), beryllium oxide (BeO), may be formed of at least one of a printed circuit board (PCB, Printed Circuit Board). The body 110 may be formed by injection molding, etching, or the like, but is not limited thereto.

The inner side surface of the wall portion 112 forming the side surface of the cavity 120 may be an inclined surface. The angle of reflection of the light emitted from the light source unit 130 may vary according to the angle of the inclined surface, thereby adjusting the directivity angle of the light emitted to the outside.

As the direction angle of the light decreases, the concentration of light emitted from the light source 130 to the outside increases. On the contrary, as the direction angle of light increases, the concentration of the light emitted from the light source 130 to the outside decreases.

On the other hand, the shape of the cavity 120 formed on the body 110 as viewed from above may be circular, rectangular, polygonal, elliptical, or the like, and may have a curved shape, but is not limited thereto.

The light source unit 130 is connected to the first and second lead frames 140 and 150, and when power is connected to the first and second lead frames 140 and 150, the light source unit 130 may be applied to the light source unit 130. It may be electrically connected to the first and second lead frames 140 and 150. Meanwhile, the height Q of the light source 130 may be smaller than the height of the wall 112.

The light source unit 130 may be, for example, a light emitting diode. The light emitting diode may be, for example, a light emitting diode that emits light of red, green, blue, white, or the like, or an ultraviolet (Ultra Violet) light emitting diode that emits ultraviolet light, but is not limited thereto. In addition, one or more light emitting diodes may be mounted.

In addition, the light emitting diode is applicable to both a horizontal type in which the electrical terminals are formed on the upper surface, or to a vertical type or flip chip formed on the upper and lower surfaces. .

The resin layer (not shown) may be filled in the cavity 120 to cover the light source 130.

The resin layer (not shown) may be formed of silicon, epoxy, and other resin materials.

In addition, the resin layer (not shown) may include a phosphor, and the phosphor may be selected as the wavelength of the light emitted from the light source unit 130 so that the light emitting device package 100 may realize white light, red light, green light, or the like. It is not limited to this.

The phosphor may be one of a blue light emitting phosphor, a blue green light emitting phosphor, a green light emitting phosphor, a yellow green light emitting phosphor, a yellow light emitting phosphor, a yellow red light emitting phosphor, an orange light emitting phosphor, and a red light emitting phosphor according to a wavelength of light emitted from the light source unit 130. Can be applied.

That is, the phosphor may be excited by the light having the first light emitted from the light source unit 130 to generate the second light. For example, when the light source unit 130 is a blue light emitting diode and the phosphor is a yellow phosphor, the yellow phosphor may be excited by blue light to emit yellow light, and excited by blue light and blue light generated from the blue light emitting diode. As the generated yellow light is mixed, the light emitting device package 100 may provide white light.

Similarly, when the light source unit 130 is a green light emitting diode, a magenta phosphor or a mixture of blue and red phosphors is mixed. When the light source unit 130 is a red light emitting diode, a cyan phosphor or a blue and green phosphor is used. For example.

Such phosphor may be a known phosphor such as YAG, TAG, sulfide, silicate, aluminate, nitride, carbide, nitridosilicate, borate, fluoride or phosphate.

The first and second lead frames 140 and 150 may be formed of a metal material, for example, titanium (Ti), copper (Cu), nickel (Ni), gold (Au), chromium (Cr), and tantalum (Ta). , Platinum (Pt), tin (Sn), silver (Ag), phosphorus (P), aluminum (Al), indium (In), palladium (Pd), cobalt (Co), silicon (Si), germanium (Ge) It may include one or more materials or alloys of hafnium (Hf), ruthenium (Ru), iron (Fe). In addition, the first and second lead frames 140 and 150 may be formed to have a single layer or a multilayer structure, but the embodiment is not limited thereto.

The first lead frame 140 and the second lead frame 150 are separated from each other and electrically separated from each other. The first lead frame 140 is in direct contact with the light source 130 or electrically connected through a conductive material (not shown). On the other hand, several lead frames (not shown) may be mounted in the body 110, but is not limited thereto.

The wire 160 may be wire bonded between the light source unit 130 and the second lead frame 150. The wire 160 may be formed of a material having electrical conductivity to electrically connect the light source unit 130 and the second lead frame 150 to each other. The wire 160 may have a shape extending like a curve having a maximum height R. Preferably, the size of the highest height R of the wire 160 may be smaller than the height of the wall portion 112. Preferably, the wire 160 may be formed like a thin thread to minimize the light emission efficiency of the light emitting device package 100.

Meanwhile, although the light source unit 130 and the second lead frame 150 are wire-bonded by the wire 160 in FIGS. 1A and 1B, the light source unit 130 and the first lead frame 140 are connected as shown in FIG. 1C. A wire bonding wire 180 may be included, but is not limited as shown in the drawing. In addition, several lead frames (not shown) or several light sources (not shown) are mounted in the body 110, and several wires (not shown) are several light sources (not shown) and several lead frames (not shown). May be wire bonded, but is not limited thereto.

The groove 170 may be formed in one region of the first lead frame 140, and the light source 130 may be mounted in the region where the groove 170 is formed. The groove 170 may be formed by etching, pressing, or injection molding the first lead frame 140, but is not limited thereto. The groove 170 may have a depth P.

On the other hand, the shape of the groove 170 as viewed from above may be a rectangular shape, a polygonal shape, an elliptical shape, or the like as shown in the drawings, and may be a curved shape of the corner, but is not limited thereto. In addition, the shape of the groove 170 may be formed to correspond to the shape of the light source, but is not limited thereto. In addition, the groove 170 may include a bottom 172 and a side 174 surrounding the bottom 172 to form a side surface of the groove 170, but is not limited thereto.

Since the groove 170 is formed in the first lead frame 140 and the light source 130 is mounted in the groove 170, the light source 130 may be mounted as low as the depth P of the groove 170. As the height of the light source 130 is lowered, the height of the wire bonding point may also be lowered, and thus the height and distance of the wire bonding may be shortened. By reducing the height and distance required for wire bonding, the size of the light emitting device package 100 may be reduced, and economical efficiency, workability, and utility of the light emitting device package 100 may be improved.

Preferably, the depth P of the groove 170 may have a size of 0.1 times to 0.5 times the height Q of the light source 130. When the depth of the groove 170 is less than 0.1 times the height of the light source 130, it may be difficult to achieve the effect of lowering the height of the wire 160 and shortening the distance between the points at which the wire 160 is bonded. have. On the other hand, when the depth P of the groove 170 is greater than 0.5 times the height Q of the light source 130, the light source 130 is mounted too deep, and the light generated from the light source 130 is applied to the side surface 174 of the groove 170. Since it may be blocked by the light emitting efficiency of the light emitting device package 100 may be reduced.

2 is a cross-sectional view showing a light emitting device package according to the embodiment.

Referring to FIG. 2, the side surface 274 of the groove 270 may include an inclined surface.

As the side surface 274 of the groove portion 270 forms an inclined surface, the side surface 274 and the bottom surface 272 may form k and k ', respectively. Meanwhile, the entire area or one area of the side surface 274 of the groove part 270 may be an inclined surface, but is not limited thereto. On the other hand, the side surface 274 may include several areas formed of inclined surfaces having different inclination angles, but are not limited thereto.

Since the side surface 274 of the groove portion 270 includes an inclined surface, the light generated from the light source unit 230 may be prevented from being blocked by the side surface 274 of the groove portion 270. The luminous efficiency can be further improved.

Preferably, the angles k and k 'formed by the side surface 274 and the bottom surface 272 may be an obtuse angle. When each of k and k 'is an acute angle, light generated from the light source unit 230 may be blocked by the side surface 274 of the groove 270 to reduce the light emitting efficiency of the light emitting device package 100.

3 is a cross-sectional view showing a light emitting device package according to the embodiment.

Referring to FIG. 3, the bottom 372 of the groove 370 may include an inclined surface.

Since the bottom 372 of the groove 370 forms an inclined surface, the bottom 372 of the groove 370 and the bottom 342 of the cavity 320 may form j. Meanwhile, the entire area or one area of the bottom 372 of the groove 370 may be an inclined surface, and the bottom 372 may include several areas formed of inclined surfaces having different inclination angles, but are not limited thereto. .

Since the bottom surface 372 of the groove 370 includes an inclined surface, the light source unit 330 may be inclined so that the point where the wire 360 and the light source unit 330 are bonded may be lowered. Accordingly, the size and size of the light emitting device package 300 may be reduced by reducing the height and distance required for bonding the wire 360, and the economics, workability, and utility of the light emitting device package 300 may be improved.

Preferably, each j may be acute. When j is greater than 90 °, light generated from the light source unit 330 may be blocked by the side surface 374 of the groove 370 to reduce the luminous efficiency of the light emitting device package 300. FIG. 4 is a perspective view illustrating a lighting device including a light emitting device package according to the present invention, and FIG. 4B is a cross-sectional view illustrating a CC ′ section of the lighting device of FIG. 4A.

Hereinafter, in order to describe the shape of the lighting apparatus 400 according to the embodiment in more detail, the longitudinal direction (Z) of the lighting apparatus 400, the horizontal direction (Y) perpendicular to the longitudinal direction (Z), and the length The height direction X perpendicular to the direction Z and the horizontal direction Y will be described.

That is, FIG. 4B is a cross-sectional view of the lighting apparatus 400 of FIG. 4A cut in the plane of the longitudinal direction Z and the height direction X, and viewed in the horizontal direction Y. As shown in FIG.

4A and 4B, the lighting device 400 may include a body 410, a cover 430 fastened to the body 410, and a closing cap 450 positioned at both ends of the body 410. have.

The light emitting device module 440 is fastened to the lower surface of the body 410, and the body 410 is conductive so that heat generated from the light emitting device package 444 can be discharged to the outside through the upper surface of the body 410. And it may be formed of a metal material having an excellent heat dissipation effect.

The light emitting device package 444 may be mounted on the PCB 442 in multiple colors and in multiple rows to form an array. The light emitting device package 444 may be mounted at the same interval or may be mounted with various separation distances as necessary to adjust brightness. As the PCB 442, a metal core PCB (MPPCB) or a PCB made of FR4 may be used.

In particular, the light emitting device package 444 may have a smaller size due to a shorter distance of wire bonding, so that the light emitting device package 444 may be more easily mounted on the PCB 442 and at the same time, more compactly mounted, thereby further improving functionally. The light emitting device module 440 may be implemented.

The cover 430 may be formed in a circular shape to surround the lower surface of the body 410, but is not limited thereto.

The cover 430 protects the light emitting device module 440 from the outside and the like. In addition, the cover 430 may include diffusing particles to prevent the glare of the light generated from the light emitting device package 444 and to uniformly emit light to the outside, and at least of the inner and outer surfaces of the cover 430 A prism pattern or the like may be formed on either side. In addition, a phosphor may be applied to at least one of an inner surface and an outer surface of the cover 430.

On the other hand, since the light generated from the light emitting device package 444 is emitted to the outside through the cover 430, the cover 430 should have excellent light transmittance, and has sufficient heat resistance to withstand the heat generated from the light emitting device package 444. The cover 430 is preferably formed of a material including polyethylene terephthalate (PET), polycarbonate (PC), polymethyl methacrylate (PMMA), or the like. .

Closing cap 450 is located at both ends of the body 410 may be used for sealing the power supply (not shown). In addition, the fin 450 is formed on the finishing cap 450, so that the lighting device 400 according to the embodiment can be used immediately without a separate device on the terminal from which the conventional fluorescent lamp is removed.

5 is an exploded perspective view of a liquid crystal display including the light emitting device package according to the embodiment.

5 is an edge-light method, and the liquid crystal display 500 may include a liquid crystal display panel 510 and a backlight unit 570 for providing light to the liquid crystal display panel 510.

The liquid crystal display panel 510 may display an image by using light provided from the backlight unit 570. The liquid crystal display panel 510 may include a color filter substrate 512 and a thin film transistor substrate 514 facing each other with a liquid crystal interposed therebetween.

The color filter substrate 512 may implement colors of an image displayed through the liquid crystal display panel 510.

The thin film transistor substrate 514 is electrically connected to the printed circuit board 518 on which a plurality of circuit components are mounted through the driving film 517. The thin film transistor substrate 514 may apply a driving voltage provided from the printed circuit board 518 to the liquid crystal in response to a driving signal provided from the printed circuit board 518.

The thin film transistor substrate 514 may include a thin film transistor and a pixel electrode formed of a thin film on another substrate of a transparent material such as glass or plastic.

The backlight unit 570 may convert the light provided from the light emitting device module 520, the light emitting device module 520 into a surface light source, and provide the light guide plate 530 to the liquid crystal display panel 510. Reflective sheet for reflecting the light emitted from the rear of the light guide plate 530 and the plurality of films 550, 566, 564 to uniform the luminance distribution of the light provided from the 530 and improve the vertical incidence ( 540.

The light emitting device module 520 may include a PCB substrate 522 so that a plurality of light emitting device packages 524 and a plurality of light emitting device packages 524 may be mounted to form an array.

In particular, since the light emitting device package 524 has a small size due to a shorter distance of wire bonding, the light emitting device package 524 may be more easily mounted on the PCB substrate 522 and at the same time, more compactly mounted, thereby further improving functionally. Implementation of unit 570 is possible.

Meanwhile, the backlight unit 570 includes a diffusion film 566 for diffusing light incident from the light guide plate 530 toward the liquid crystal display panel 510, and a prism film 550 for condensing the diffused light to improve vertical incidence. ), And may include a protective film 564 to protect the prism film 550.

6 is an exploded perspective view of a liquid crystal display including the light emitting device package according to the embodiment. However, the parts shown and described in Fig. 5 are not repeatedly described in detail.

6 illustrates a direct method, the liquid crystal display 600 may include a liquid crystal display panel 610 and a backlight unit 670 for providing light to the liquid crystal display panel 610.

Since the liquid crystal display panel 610 is the same as that described with reference to FIG. 5, a detailed description thereof will be omitted.

The backlight unit 670 may include a plurality of light emitting device modules 623, a reflective sheet 624, a lower chassis 630 in which the light emitting device modules 623 and the reflective sheet 624 are accommodated, and an upper portion of the light emitting device module 623. It may include a diffusion plate 640 and a plurality of optical film 660 disposed in the.

LED Module 623 A plurality of light emitting device packages 622 and a plurality of light emitting device packages 622 may be mounted to include a PCB substrate 621 to form an array.

In particular, since the light emitting device package 622 has a small size due to a shorter distance of wire bonding, the light emitting device package 622 may be more easily mounted on the PCB substrate 621 and at the same time, more compactly mounted, thereby further improving functionally. Implementation of unit 670 becomes possible.

The reflective sheet 624 reflects the light generated from the light emitting device package 622 in the direction in which the liquid crystal display panel 610 is positioned to improve light utilization efficiency.

On the other hand, the light generated from the light emitting device module 623 is incident on the diffusion plate 640, the optical film 660 is disposed on the diffusion plate 640. The optical film 660 includes a diffusion film 666, a prism film 650, and a protective film 664.

Meanwhile, the lighting system including the light emitting device package according to the embodiment may include a backlight, a lighting device, and the like, but is not limited thereto.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, It should be understood that various modifications may be made by those skilled in the art without departing from the spirit and scope of the present invention.

110: body 130: light source
140: first lead frame 150: second lead frame
160: wire 170: groove

Claims (7)

A cavity formed body;
First and second lead frames mounted to the body;
A light source unit electrically connected to the first lead frame; And
And a wire electrically connecting the second lead frame and the light source unit.
The first lead frame includes a groove portion,
The light source unit package is mounted on the light source portion. The method of claim 1,
The depth of the groove portion is a light emitting device package of 0.1 times to 0.5 times the height of the light source. The method of claim 1,
The groove portion includes a bottom surface and a side surface,
The side surface is a light emitting device package including at least one inclined surface. The method of claim 3, wherein
The angle formed by the inclined surface and the bottom surface is an obtuse angle light emitting device package. The method of claim 1,
The groove portion includes a bottom forming a bottom surface, and a side forming a side,
The bottom surface is a light emitting device package including at least one inclined surface. The method of claim 5
The angle formed by the inclined surface and the bottom of the cavity is an acute angle light emitting device package. An illumination system comprising the light emitting device package of any one of claims 1 to 6.
KR1020100135856A 2010-12-27 2010-12-27 Light emitting device package KR20120073929A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022128281A1 (en) * 2020-12-16 2022-06-23 Ams-Osram International Gmbh Component with structured leadframe and method for producing a component

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022128281A1 (en) * 2020-12-16 2022-06-23 Ams-Osram International Gmbh Component with structured leadframe and method for producing a component

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