KR102042208B1 - Printed Circuit Board - Google Patents

Printed Circuit Board Download PDF

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Publication number
KR102042208B1
KR102042208B1 KR1020130006437A KR20130006437A KR102042208B1 KR 102042208 B1 KR102042208 B1 KR 102042208B1 KR 1020130006437 A KR1020130006437 A KR 1020130006437A KR 20130006437 A KR20130006437 A KR 20130006437A KR 102042208 B1 KR102042208 B1 KR 102042208B1
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KR
South Korea
Prior art keywords
light emitting
emitting device
printed circuit
circuit board
light
Prior art date
Application number
KR1020130006437A
Other languages
Korean (ko)
Other versions
KR20140094138A (en
Inventor
김성호
Original Assignee
엘지이노텍 주식회사
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Priority to KR1020130006437A priority Critical patent/KR102042208B1/en
Publication of KR20140094138A publication Critical patent/KR20140094138A/en
Application granted granted Critical
Publication of KR102042208B1 publication Critical patent/KR102042208B1/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/0015—Fastening arrangements intended to retain light sources
    • F21V19/0025—Fastening arrangements intended to retain light sources the fastening means engaging the conductors of the light source, i.e. providing simultaneous fastening of the light sources and their electric connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/70—Light sources with three-dimensionally disposed light-generating elements on flexible or deformable supports or substrates, e.g. for changing the light source into a desired form
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]

Abstract

Embodiments relate to an array of light emitting devices. The printed circuit board according to the embodiment includes a light emitting device mounting portion on which a light emitting device package is mounted and a neck end extending from the light emitting device mounting portion, and the neck end includes a body, a connector pattern, and a flexible layer containing a plasticizer. Can be.

Figure R1020130006437

Description

Printed Circuit Board

An embodiment relates to a printed circuit board.

Light Emitting Diode (LED) is a device that converts an electric signal into a light form using the characteristics of a compound semiconductor, and is used for home appliances, remote controllers, electronic displays, indicators, and various automation devices. There is a trend.

In general, miniaturized LEDs are made of a surface mount device type for direct mounting on a printed circuit board, and accordingly, LED lamps used as display elements are also developed as a surface mount device type. have. Such a surface mounting element can replace a conventional simple lighting lamp, which is used as a lighting display for various colors, a character display and an image display.

As such, there is a problem in that a lighting system using LEDs has to produce differently printed circuit boards used in light emitting device arrays depending on the type of lighting system.

In Korean Registered Utility Model No. 20-0462227, including a perforated line on a printed circuit board, it is possible to manufacture a lighting device for each printed circuit board unit separated by a perforated line, thereby increasing production efficiency.

Embodiments provide a printed circuit board on which a neck end of a printed circuit board includes a flexible layer containing a plasticizer, thereby manufacturing a light emitting device array of various types.

The printed circuit board according to the embodiment includes a light emitting device mounting portion on which a light emitting device package is mounted and a neck end extending from the light emitting device mounting portion, and the neck end includes a body, a connector pattern, and a flexible layer containing a plasticizer. Can be.

The light emitting device array according to the embodiment includes a flexible printed circuit board including a light emitting device mounting part including an electrode pattern and a neck end extending from the light emitting device mounting part, and a light emitting device package mounted on the electrode pattern. The portion may include a flexible layer containing a body, a connector pattern, and a plasticizer.

The printed circuit board according to the embodiment may change the shape of the neck end, and thus, various types of light emitting device arrays may be configured by one type of printed circuit board. Therefore, manufacturing efficiency can be improved by unifying and simplifying the printed circuit board manufacturing process.

1 illustrates a light emitting device array including a printed circuit board according to an exemplary embodiment.
2 is a view showing a light emitting device module including a light emitting device array according to the embodiment.
3 is a view showing the light emitting device package of FIG.
4 and 5 illustrate a printed circuit board according to an embodiment.
6 is a view showing a folded form of the printed circuit board according to the embodiment.
7A is a perspective view illustrating a lighting device including a light emitting device module according to an embodiment, and FIG. 7B is a cross-sectional view illustrating C-C ′ of the lighting device of FIG. 7A.
8 and 9 are exploded perspective views of a liquid crystal display device including the optical sheet according to the embodiment.

Advantages and features of the present invention and methods for achieving them will be apparent with reference to the embodiments described below in detail with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but can be implemented in various different forms, and only the embodiments make the disclosure of the present invention complete, and the general knowledge in the art to which the present invention belongs. It is provided to fully inform the person having the scope of the invention, which is defined only by the scope of the claims. Like reference numerals refer to like elements throughout.

The spatially relative terms " below ", " beneath ", " lower ", " above ", " upper " It may be used to easily describe the correlation of a device or components with other devices or components. Spatially relative terms are to be understood as terms that include different directions of the device in use or operation in addition to the directions shown in the figures. For example, when flipping a device shown in the figure, a device described as "below" or "beneath" of another device may be placed "above" of another device. Thus, the exemplary term "below" can encompass both an orientation of above and below. The device can also be oriented in other directions, so that spatially relative terms can be interpreted according to orientation.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. In this specification, the singular also includes the plural unless specifically stated otherwise in the phrase. As used herein, “comprises” and / or “comprising” refers to the presence of one or more other components, steps, operations and / or elements. Or does not exclude additions.

Unless otherwise defined, all terms (including technical and scientific terms) used in the present specification may be used in a sense that can be commonly understood by those skilled in the art. In addition, the terms defined in the commonly used dictionaries are not ideally or excessively interpreted unless they are specifically defined clearly.

In the drawings, the thickness or size of each layer is exaggerated, omitted, or schematically illustrated for convenience and clarity of description. In addition, the size and area of each component does not necessarily reflect the actual size or area.

In addition, the angle and direction mentioned in the process of describing the structure of the light emitting device in the embodiment are based on those described in the drawings. In the description of the structure constituting the light emitting device in the specification, if the reference point and the positional relationship with respect to the angle is not clearly mentioned, reference is made to related drawings.

1 is a view showing a light emitting device array including a printed circuit board according to an embodiment, FIG. 2 is a view showing a light emitting device module including a light emitting device array according to an embodiment, Figure 3 is a light emitting device of FIG. A diagram showing a package.

Referring to FIG. 1, the light emitting device array 200 may include a printed circuit board 100 and a plurality of light emitting device packages 210.

The printed circuit board 100 may include a light emitting device mounting unit A1 on which the light emitting device package 210 is mounted, and a neck end A2 extending from the light emitting device mounting unit A1.

The light emitting device mounting portion A1 and the neck portion A2 may include a body 110 and a pattern 120 having electrical conductivity.

The body 110 may include a base layer 112 and an insulating layer 114 formed on the base layer 112, and a cover layer covering the pattern 120 on the insulating layer 114 (not shown). ) May be further included.

The base layer 112 is formed of FR4, polyimide, liquid crystal polymer and polyester, PEN (polyethylene naphthalate), PET (polyethylene terephthalate), LCP (liquid crystal polymer) It may include at least one of, but is not limited thereto. It may be a material, and the glass fiber and the epoxy resin may form a plurality of layers.

In addition, it may be formed of a thin plate or film formed of a flexible synthetic resin or the like to form a flexible printed circuit board (FPCB), or may include several layers to form a multi-layer board (Multi-Layer Board), It is not limited to this.

The insulating layer 114 may be made of a polymer resin which is an insulating material. For example, the insulating layer 114 may be formed of an epoxy resin, a phenol resin, an acrylic resin, a polycarbonate resin, a polyester resin, a melamine resin, a silicone resin, a polyimide resin, or a fluorine resin. Can be done.

The pattern 120 may be electrically conductive and may be formed on the insulating layer 114. The pattern 120 may be, for example, a thin copper film having electrical conductivity, but is not limited thereto. The pattern 120 may be formed of a metal material, for example, titanium (Ti) or copper (Cu). , Nickel (Ni), gold (Au), chromium (Cr), tantalum (Ta), platinum (Pt), tin (Sn), silver (Ag), phosphorus (P), aluminum (Al), indium (In ), Palladium (Pd), cobalt (Co), silicon (Si), germanium (Ge), hafnium (Hf), ruthenium (Ru), iron (Fe) may include one or more materials or alloys, or It may be composed of a conductive polymer material.

The pattern 120 may be formed by forming a conductive layer on the insulating layer 114 by sputtering, electrolytic / electroless plating, or the like, and then etching the conductive layer, but is not limited thereto. .

The pattern 120 may include an electrode pattern 121, a connector pattern 122, and a connection pattern (not shown) for electrically connecting the connector pattern 122 and the electrode pattern 121.

On the other hand, the neck end (A2) of the printed circuit board 100 according to an embodiment of the present invention may further include a flexible layer 130 containing a plasticizer, the flexible layer 130 is the upper surface of the body 110 Or it may be formed in contact with the lower surface.

Referring back to FIG. 1, the flexible layer 130 may be formed to contact the upper edge region of the body 110. In this case, the flexible layer 130 may be formed in the longitudinal direction of the neck end A2, and may be formed in both edge regions facing each other. In addition, the length of the flexible layer 130 may be equal to or less than the length of the neck end.

The flexible layer 130 may be formed of an insulating material, and may be formed of a plastic material containing a plasticizer to increase the flexibility of the flexible layer 130.

Plasticizers are low volatility organic compounds added to plastics or rubber to weaken the intermolecular forces and lower the glass transition temperature to impart flow properties, flexibility, extension, elasticity, adhesion, and processability. Can be used.

When the plasticizer is contained, the pulling force between the molecules of the material constituting the flexible layer 130 may be weakened and bend well. In addition, the plasticizer should be of a property that can mix well with the plastic, that is, compatibility. In addition, the plasticizer may increase plasticity and improve other properties such as heat resistance, cold resistance, flame resistance, and electrical properties of the printed circuit board 100.

Meanwhile, the length d2 of the neck end A2 may be 0.08 to 0.35 compared to the total length d1 of the printed circuit board 100.

If the length d2 of the neck end is smaller than 0.08 compared to the total length d1 of the printed circuit board, the shape of the printed circuit board 100 that may be formed by folding or bending the neck A2 may be limited.

On the other hand, if the length d2 of the neck portion A2 is larger than 0.35 compared to the total length d1 of the printed circuit board 100, the electrode pattern 121 and the neck portion (ie, positioned in the light emitting element mounting portion A1) A2) As the length of the connection pattern (not shown) connecting the connector pattern 122 positioned at one end increases, reliability of the electrical connection may decrease.

In addition, the length d2 of the neck portion A2 may be 22 mm to 90 mm.

If the length d2 of the neck end is smaller than 22 mm, the shape of the printed circuit board 100 that may be formed by folding or bending the neck end A2 may be limited.

On the other hand, if the length (d2) of the neck portion is greater than 90mm, the connection pattern for connecting the electrode pattern 121 positioned in the light emitting element mounting portion (A1) and the connector pattern 122 located at one end of the neck portion (A2) ( As the length of the (not shown) increases, the reliability of the electrical connection may decrease.

Meanwhile, referring to FIG. 2, the light emitting device module 300 according to the embodiment may further include a power control module 310 and a connector 330 in addition to the light emitting device array 200 of FIG. 1.

The power control module 310 shown in FIG. 2 is a power supply, that is, a supply device for supplying external power. The power control module 310 may be a device for describing the light emitting device array 200 according to an embodiment, but is not limited thereto.

Here, the power control module 310 generates a power consumed by the light emitting device package 210 mounted on the light emitting device array 200 to control the operation of the power supply 312, the power supply 312 ( 314 and a connector connection part 316 to which one side of the connector 330 is connected may be included.

In this case, the power supply 312 operates under the control of the control unit 314 and generates the power consumed by the light emitting element array 320.

The controller 314 may control the operation of the power supply 312 according to a command input from the outside.

In this case, the externally input command may be a command output from a remote control for directing the operation of a device including the light emitting device module 300 and an input device (not shown) directly connected to the light emitting device module 300. It does not limit to this.

In addition, the connector connection portion 316 is connected to one side of the connector 330, it can supply the power supplied from the power supply 312 to the connector 330.

The connector pattern 122 positioned at one end of the neck A2 may be connected to the other side of the connector 330 to receive power.

Meanwhile, a plurality of light emitting device packages 210 may be mounted on the electrode pattern 121 positioned in the light emitting device mounting portion A1.

The plurality of light emitting device packages 210 may be divided into a plurality of groups (not shown), and the light emitting device packages 210 disposed in the plurality of groups may be connected in series.

In this case, the number of light emitting device packages 210 included in the plurality of groups is not limited.

In the plurality of light emitting device packages 210, at least two or more light emitting device packages 210 having different colors may be alternately mounted, and may be mounted in groups according to package sizes, and have a single color. It may be mounted as a light emitting device package. In addition, there is no limitation to this.

For example, when the white light is emitted from the light emitting device array 200, the plurality of light emitting device packages 210 may be implemented by using a light emitting device package emitting red light and a light emitting device package emitting blue light. . Therefore, the light emitting device packages emitting red light and blue light may be alternately mounted, and may be formed of red light, blue light, and green light.

3 is a cross-sectional view of the light emitting device package of FIG. 1.

Referring to FIG. 3, the light emitting device package 210 may include a body 211 having a cavity C, a lead frame 212, a light emitting device 213, a wire 215, and a resin 216. have.

The body 211 serves as a housing and includes a first lead frame 217 and a second lead frame 218. The body 211 is made of a resin material such as polyphthalamide (PPA), silicon (Si), aluminum (Al), aluminum nitride (AlN), liquid crystal polymer (PSG, photo sensitive glass), polyamide 9T (PA9T) ), Neogeotactic polystyrene (SPS), metal, sapphire (Al2O3), beryllium oxide (BeO), can be formed of at least one of the printed circuit board (PCB, Printed Circuit Board), formed by injection molding, etching process, etc. It may be, but is not limited to this.

In the body 211, a cavity C having an open upper side may be formed to expose the light emitting device 213 to the outside, so that the light emitting device 213 may be located inside the cavity C. In addition, the inside of the body 211 is formed to be inclined, the reflection angle of the light emitted from the light emitting element 213 may be different according to the angle of the inclined surface.

Accordingly, the directivity angle of the light emitted to the outside can be adjusted, and as the directivity angle of the light decreases, the concentration of the light emitted from the light emitting device 213 to the outside increases. The concentration of light emitted is reduced.

On the other hand, the shape of the cavity C formed on the body 211 as viewed from above may be circular, rectangular, polygonal, elliptical, or the like, and in particular, the corner may be curved, but is not limited thereto.

In this case, a reflective coating film (not shown) may be formed on side and bottom surfaces of the cavity C forming the inner wall of the cavity C. Here, the surface of the body 211 on which the reflective coating film (not shown) is formed may be formed to have a smooth or predetermined roughness, and may be made of silver (Ag), aluminum (Al), or the like.

The lead frame 212 is a metal material, for example, titanium (Ti), copper (Cu), nickel (Ni), gold (Au), chromium (Cr), tantalum (Ta), platinum (Pt), tin (Sn), silver (Ag), phosphorus (P), aluminum (Al), indium (In), palladium (Pd), cobalt (Co), silicon (Si), germanium (Ge), hafnium (Hf), ruthenium (Ru) and iron (Fe) may include one or more materials or alloys. In addition, the lead frame 212 may be formed to have a single layer or a multilayer structure, but is not limited thereto.

In addition, the lead frame 212 may be configured of the first lead frame 217 and the second lead frame 218 to apply different power. The light emitting device 213 may be disposed on the second lead frame 218, and the second lead frame 218 may be formed to be spaced apart from the first lead frame 217 by a predetermined distance.

The light emitting device 213 is a kind of semiconductor device mounted on the second lead frame 218 and emitting light having a predetermined wavelength by a power source applied from the outside. GaN (gallium nitride), AlN (aluminum nitride), InN (Indium nitride), GaAs (gallium arsenide) and the like can be implemented based on Group 3 and Group 5 compounds. For example, the light emitting device 213 may be a light emitting diode.

The light emitting diode may be, for example, a colored light emitting diode emitting light of red, green, blue, white, or the like, or an Ultra Violet (UV) emitting diode emitting ultraviolet light, but is not limited thereto. In the exemplary embodiment, a single light emitting diode is illustrated as being provided at the center portion, but the present invention is not limited thereto, and a plurality of light emitting diodes may be provided.

In addition, the light emitting device 213 is a horizontal type in which all of its electrical terminals are formed on an upper surface, or a flip type formed on all lower surfaces, or a vertical type formed on upper and lower surfaces. Applicable to both.

The light emitting device 213 is electrically connected to the first lead frame 217 and the second lead frame 218 through a wire 215 to receive external power. In this case, the horizontal light emitting device uses a wire bonding method through two wires, and the vertical light emitting device uses a wire bonding method through one wire.

The resin 216 may be filled in the cavity C to seal the light emitting device 213 and the wire 215. At this time, the resin material 216 may be formed of a light-transmissive resin material such as silicone or epoxy, and may be formed by filling the material in the cavity and then UV or heat curing the material.

The surface of the resin material 216 may be formed in a concave lens shape, a convex lens shape, a flat shape, and the like, and a direction angle of light emitted from the light emitting element 213 may be changed according to the shape of the resin material 216. have.

In addition, another lens-shaped resin material may be formed or attached on the resin material 216, but is not limited thereto.

The resin 216 may include a phosphor. Here, the phosphor may be selected according to the wavelength of the light emitted from the light emitting element 213 so that the light emitting element package 210 may realize white light.

That is, the phosphor may be excited by the light having the first light emitted from the light emitting element 213 to generate the second light. For example, the light emitting element 213 is a blue light emitting diode and the phosphor is a yellow phosphor. In this case, the yellow phosphor may be excited by blue light to emit yellow light. As the yellow light generated by blue light and blue light generated by the blue light emitting diode is mixed, the light emitting device package 210 may be white light. Can be provided.

Similarly, when the light emitting element 213 is a green light emitting diode, a magenta phosphor or a mixture of blue and red phosphors is used. When the light emitting element 213 is a red light emitting diode, a cyan phosphor or a blue and green phosphor is used. For example,

Such phosphor may be a known phosphor such as YAG, TAG, sulfide, silicate, aluminate, nitride, carbide, nitridosilicate, borate, fluoride or phosphate.

4 and 5 are views illustrating a printed circuit board according to another exemplary embodiment.

Referring to FIG. 4, the width w2 of the neck end A2 may be smaller than the width w1 of the light emitting device mounting portion A1. As shown in FIG. 4A, the neck end A2 may be formed to have a constant width, or as shown in FIG. 4B, the width w2 may be formed to become smaller.

As described above, when the width w2 of the neck portion A2 is reduced, the neck portion A2 can be easily folded or bent.

Referring to FIG. 5, the flexible layer 130 may be formed to contact the entire upper surface of the body 110 of the neck end.

When the flexible layer 130 is formed to contact the entire upper surface of the body 110 of the neck end, the entire upper surface of the neck A2 is formed of the soft layer 130, the flexibility of the neck A2 increases, Part A2 can be easily bent or folded. Although the drawing illustrates a case in which the flexible layer 130 is in contact with the upper surface of the neck end A2, the flexible layer 130 is not limited thereto. The flexible layer 130 may be formed to contact the entire lower surface of the neck end.

6 is a diagram illustrating a folded form of a printed circuit board according to an exemplary embodiment.

Referring to FIG. 6, as shown in FIG. 6A, the neck A2 may be folded into a first shape once downward, and as shown in FIG. 6B, the neck A2 may be formed. The second form may be folded once in the downward direction and again folded once in the right direction.

As described above, the printed circuit board 100 may be formed in various forms according to the number of times the folding of the neck A2, the folding angle, the folding direction, and the like. Accordingly, various light emitting device arrays 200 may be formed by using one type of printed circuit board 100 and may be applied to various lighting systems.

7A is a perspective view illustrating a lighting device including a light emitting device module according to an embodiment, and FIG. 7B is a cross-sectional view illustrating C-C ′ of the lighting device of FIG. 7A.

That is, FIG. 7B is a cross-sectional view of the lighting apparatus 400 of FIG. 7A cut in the plane of the longitudinal direction Z and the height direction X, and viewed in the horizontal direction Y. FIG.

7A and 7B, the lighting apparatus 400 may include a body 410, a cover 430 fastened to the body 410, and a closing cap 450 positioned at both ends of the body 410. have.

The lower surface of the body 410 is fastened to the light emitting device module 440, the body 410 is conductive and so that the heat generated from the light emitting device package 444 can be discharged to the outside through the upper surface of the body 410 The heat dissipation effect may be formed of an excellent metal material, but is not limited thereto.

In particular, the light emitting device module 440 may include a sealing part (not shown) surrounding the light emitting device package 444 to prevent penetration of foreign matters, thereby improving reliability, and also providing reliable lighting apparatus 400. Implementation of.

The light emitting device package 444 may be mounted on the substrate 442 in multiple colors and in multiple rows to form a module. The light emitting device package 444 may be mounted at the same interval or may be mounted at various separation distances as necessary to adjust brightness. The substrate 442 may be the printed circuit board 100 described above.

The cover 430 may be formed in a circular shape to surround the lower surface of the body 410, but is not limited thereto.

The cover 430 protects the light emitting device module 440 from the outside and the like. In addition, the cover 430 may include diffusing particles to prevent glare of the light generated from the light emitting device package 444 and to uniformly emit light to the outside, and may also include at least one of an inner surface and an outer surface of the cover 430. A prism pattern or the like may be formed on either side. In addition, a phosphor may be applied to at least one of an inner surface and an outer surface of the cover 430.

On the other hand, since the light generated from the light emitting device package 444 is emitted to the outside through the cover 430, the cover 430 should be excellent in the light transmittance, sufficient to withstand the heat generated in the light emitting device package 444 The cover 430 is formed of a material including polyethylene terephthalate (PET), polycarbonate (PC), or polymethyl methacrylate (PMMA). It is desirable to be.

Closing cap 450 is located at both ends of the body 410 may be used for sealing the power supply (not shown). In addition, the closing cap 450 is a power pin 452 is formed, the lighting device 400 according to the embodiment can be used immediately without a separate device in the terminal from which the existing fluorescent lamps are removed.

8 and 9 are exploded perspective views of a liquid crystal display device including the optical sheet according to the embodiment.

8 is an edge-light method, the liquid crystal display 500 may include a liquid crystal display panel 510 and a backlight unit 570 for providing light to the liquid crystal display panel 510.

The liquid crystal display panel 510 may display an image by using light provided from the backlight unit 570. The liquid crystal display panel 510 may include a color filter substrate 512 and a thin film transistor substrate 514 facing each other with a liquid crystal interposed therebetween.

The color filter substrate 512 may implement colors of an image displayed through the liquid crystal display panel 510.

The thin film transistor substrate 514 is electrically connected to the printed circuit board 518 on which a plurality of circuit components are mounted through the driving film 517. The thin film transistor substrate 514 may apply a driving voltage provided from the printed circuit board 518 to the liquid crystal in response to a driving signal provided from the printed circuit board 518.

The thin film transistor substrate 514 may include a thin film transistor and a pixel electrode formed of a thin film on another substrate of a transparent material such as glass or plastic.

The backlight unit 570 may convert the light provided from the light emitting device module 520, the light emitting device module 520 into a surface light source, and provide the light guide plate 530 to the liquid crystal display panel 510. Reflective sheet for reflecting the light emitted from the rear of the light guide plate 530 and the plurality of films 550, 566, 564 to uniform the luminance distribution of the light provided from the 530 and improve the vertical incidence ( 540.

The light emitting device module 520 may include a PCB substrate 522 so that a plurality of light emitting device packages 524 and a plurality of light emitting device packages 524 may be mounted to form a module.

In particular, the light emitting device module 520 may include a sealing part (not shown) surrounding the light emitting device package 524 to prevent foreign matter from penetrating, thereby improving reliability, and also providing reliable backlight unit 570. Implementation of.

Meanwhile, the backlight unit 570 includes a diffusion film 566 for diffusing light incident from the light guide plate 530 toward the liquid crystal display panel 510, and a prism film 550 for condensing the diffused light to improve vertical incidence. ), And may include a protective film 564 to protect the prism film 550.

9 is an exploded perspective view of a liquid crystal display device including the optical sheet according to the embodiment. However, the parts shown and described in FIG. 8 will not be repeatedly described in detail.

9, the liquid crystal display 600 may include a liquid crystal display panel 610 and a backlight unit 670 for providing light to the liquid crystal display panel 610.

Since the liquid crystal display panel 610 is the same as that described with reference to FIG. 8, a detailed description thereof will be omitted.

The backlight unit 670 may include a plurality of light emitting device modules 623, a reflective sheet 624, a lower chassis 630 in which the light emitting device modules 623 and the reflective sheet 624 are accommodated, and an upper portion of the light emitting device module 623. It may include a diffusion plate 640 and a plurality of optical film 660 disposed in the.

LED Module 623 A plurality of light emitting device packages 622 and a plurality of light emitting device packages 622 may be mounted to include a PCB substrate 621 to form a module.

In particular, the light emitting device module 623 may include a sealing part (not shown) surrounding the light emitting device package 622 to prevent foreign matter from penetrating, thereby improving reliability, and also providing reliable backlight unit 670. Implementation of.

The reflective sheet 624 reflects the light generated from the light emitting device package 622 in the direction in which the liquid crystal display panel 610 is positioned to improve light utilization efficiency.

On the other hand, the light generated from the light emitting device module 623 is incident on the diffusion plate 640, the optical film 660 is disposed on the diffusion plate 640. The optical film 660 includes a diffusion film 666, a prism film 650, and a protective film 664.

Although the above has been illustrated and described with respect to preferred embodiments of the present invention, the present invention is not limited to the specific embodiments described above, but in the art to which the invention pertains without departing from the spirit of the invention as claimed in the claims. Various modifications can be made by those skilled in the art, and these modifications should not be individually understood from the technical spirit or the prospect of the present invention.

110: base layer 120: coating layer
125: protective layer 130: insulating layer
140: copper foil layer

Claims (15)

A light emitting device mounting unit in which a light emitting device package is mounted; And
It includes a neck end extending from the light emitting device mounting portion,
The neck end,
A flexible layer containing a body, a connector pattern, and a plasticizer,
The length of the neck end is 22mm to 90mm,
The plasticizer is a phthalate-based material,
The neck end is formed in a first form and a second form according to the number of folding and folding angle, folding method,
The length of the neck end is 0.08 to 0.35 compared to the total length of the printed circuit board,
The first form includes a form in which the neck end is folded once in the downward direction,
The second form includes the form in which the neck end is folded once in the downward direction, once again in the right direction,
The width of the neck end is smaller than the width of the light emitting device mounting portion. delete delete The method of claim 1,
The flexible layer is in contact with the upper or lower surface of the body,
The length of the flexible layer is a printed circuit board the same as or less than the length of the neck end. delete delete delete delete delete delete delete delete delete delete delete
KR1020130006437A 2013-01-21 2013-01-21 Printed Circuit Board KR102042208B1 (en)

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KR1020130006437A KR102042208B1 (en) 2013-01-21 2013-01-21 Printed Circuit Board

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Application Number Priority Date Filing Date Title
KR1020130006437A KR102042208B1 (en) 2013-01-21 2013-01-21 Printed Circuit Board

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KR20140094138A KR20140094138A (en) 2014-07-30
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Publication number Priority date Publication date Assignee Title
TWI708908B (en) * 2019-06-10 2020-11-01 聯嘉光電股份有限公司 Slim linear led lighting device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006312561A (en) * 2005-05-06 2006-11-16 Ngk Insulators Ltd Method for production of ceramic substrate

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Publication number Priority date Publication date Assignee Title
KR20120029854A (en) * 2010-09-17 2012-03-27 엘지이노텍 주식회사 Light-emitting element array

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006312561A (en) * 2005-05-06 2006-11-16 Ngk Insulators Ltd Method for production of ceramic substrate

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