KR20120125858A

KR20120125858A - Light emitting device array

Info

Publication number: KR20120125858A
Application number: KR1020110043562A
Authority: KR
Inventors: 박형화
Original assignee: 엘지이노텍 주식회사
Priority date: 2011-05-09
Filing date: 2011-05-09
Publication date: 2012-11-19

Abstract

The light emitting device array according to the embodiment has a new structure and the manufacturing process yield and reliability is improved, the embodiment includes a substrate and a plurality of light emitting device packages disposed on the substrate, the plurality of light emitting device packages, First, second, and third light emitting device packages disposed in a first area of the substrate and emitting light of different colors, and are mounted in a second area of the substrate adjacent to the first area. A light emitting device array including a fourth light emitting device package emitting light of a color different from that of a third light emitting device package is provided.

Description

Light emitting device array

Embodiments relate to an array of light emitting devices.

As a typical example of a light emitting device, a light emitting diode (LED) is a device for converting an electric signal into an infrared ray, a visible ray, or a light using the characteristics of a compound semiconductor, and is used for various devices such as household appliances, remote controllers, Automation equipment, and the like, and the use area of LEDs is gradually widening.

In general, miniaturized LEDs are made of a surface mounting device for mounting directly on a PCB (Printed Circuit Board) substrate, and an LED lamp used as a display device is also being developed as a surface mounting device type . Such a surface mount device can replace a conventional simple lighting lamp, which is used for a lighting indicator for various colors, a character indicator, an image indicator, and the like.

As the use area of the LED is widened as described above, it is important to increase the luminance of the LED as the brightness required for a lamp used in daily life and a lamp for a structural signal is increased.

The embodiment provides a light emitting device package having a new structure and having improved manufacturing process yield and reliability.

The light emitting device array according to the embodiment includes a substrate and a plurality of light emitting device packages disposed on the substrate, wherein the plurality of light emitting device packages are disposed in the first region of the substrate and emit light of different colors. A fourth light emitting device package mounted on the first, second and third light emitting device packages and a second area of the substrate adjacent to the first area, and emitting light having a different color from that of the first, second and third light emitting device packages; It may include.

In the light emitting device array according to the embodiment, when the white light is generated by the first, second, and third light emitting device packages emitting red, green, and blue light on the first area of the substrate, the light emitting device array except the first area of the substrate may be formed. By mounting a fourth light emitting device package emitting white light in two regions, the color difference can be reduced in the edge portion of the substrate and the white light formed by the first to third light emitting device packages can be compensated for. Reliability can be improved when the backlight device and other lighting system are applied, and further, manufacturing process yield can be improved.

1 is an exploded perspective view briefly showing a light emitting device module including a light emitting device array according to the embodiment.
FIG. 2 is an exploded perspective view illustrating the light emitting device array illustrated in FIG. 1.
FIG. 3 is an enlarged view illustrating one light emitting device package among the first to fourth light emitting device packages shown in FIG. 2.
4 is a perspective view illustrating a lighting device including a light emitting device package according to an embodiment.
FIG. 5 is a cross-sectional view taken along line AA ′ of the lighting apparatus shown in FIG. 4.
6 is an exploded perspective view of a liquid crystal display including the light emitting device package according to the first embodiment.
7 is an exploded perspective view of a liquid crystal display including the light emitting device package according to the second embodiment.

In the description of the present embodiment, when one device is described as being formed "on or under" of another device, the device may be (up) or down (down) ( on or under includes both the two devices are in direct contact with each other (directly) or one or more other devices are formed indirectly between the two devices (indirectly). In addition, when expressed as “on” or “under”, it may include the meaning of the downward direction as well as the upward direction based on one device.

In the drawings, the thickness or size of each layer is exaggerated, omitted, or schematically illustrated for convenience and clarity of description. Thus, the size of each component does not fully reflect its actual size.

In addition, the angle and direction mentioned in the process of describing the structure of the light emitting device module herein are based on those described in the drawings. In the description of the structure constituting the light emitting device module in the specification, if the reference point and the positional relationship with respect to the angle is not clearly mentioned, refer to the related drawings.

1 is an exploded perspective view briefly showing a light emitting device module including a light emitting device array according to the embodiment.

Referring to FIG. 1, the light emitting device module 200 may include a power control module 210, a light emitting device array 100, and a connector 130.

Here, the power control module 210 generates a power consumed by the light emitting device package 110 mounted on the light emitting device array 100 to control the operation of the power supply 212 and the power supply 212 ( 214 and a connector connector 216 to which one side of the connector 130 is connected may be included.

In this case, the power supply 212 operates under the control of the control unit 214 and generates the power consumed by the light emitting device array 100.

The controller 214 may control the operation of the power supply 212 according to a command input from the outside.

In this case, the externally input command may be a command output from a remote control for directing an operation of a device including the light emitting device module 200 and an input device (not shown) directly connected to the light emitting device module 200. There is no limitation to this.

In addition, the connector connecting portion 216 is connected to one side of the connector 130, it can supply the power supplied from the power supply 212 to the connector 130.

The light emitting device array 100 includes a substrate 120 on which the first to fourth light emitting device packages 111 to 114, and the first to fourth light emitting device packages 111 to 114 are mounted, and a connector on the board 120. The other side of the 130 may include a connector terminal 122 is connected.

In this case, the connector terminal 122 may be electrically connected to the connector connector 216 through the connector 130.

The substrate 120 may be a printed circuit board or a flexible printed circuit board, and in the case of the printed circuit board, a single-sided printed circuit board, a double-sided printed circuit board, or the like. A printed circuit board (PCB) having a plurality of layers may be used, and the exemplary embodiment is described as a single-sided printed circuit board (PCB), but is not limited thereto.

The first to fourth light emitting device packages 111 to 114 may be divided into a plurality of groups to form a group, and the present invention is not limited thereto.

The first to fourth light emitting device packages 111 to 114 are described as emitting light of different single colors, but the present invention is not limited thereto.

The power control module 210 shown in FIG. 1 illustrates a power supply device, that is, a supply device for supplying external power, and may be a device for describing the light emitting device array 100 according to the embodiment, but is not limited thereto.

The first to fourth light emitting device packages 111 to 114 shown in FIG. 1 are shown in side view type, and the first to fourth light emitting device packages 111 to 114 may be mounted in the same direction on the substrate 120. Can be.

In this case, when the first to fourth light emitting device packages 111 to 114 are in the top view type, the mounting direction of the fourth light emitting device package 114 may be different from that of the first to third light emitting device packages 111 to 113. May be used without limitation.

FIG. 2 is an exploded perspective view illustrating the light emitting device array illustrated in FIG. 1, and FIG. 3 is an enlarged view illustrating one light emitting device package among the first to fourth light emitting device packages illustrated in FIG. 2.

The first to fourth light emitting device packages 111 to 114 illustrated in FIG. 2 are described as having the same package size, and may be different from each other, and the present invention is not limited thereto.

Referring to FIG. 2, the light emitting device array 100 may include a substrate 120 on which first to fourth light emitting device packages 111 to 114 and first to fourth light emitting device packages 111 to 114 are mounted. Can be.

Here, the substrate 120 may include a base layer (not shown) and a copper foil layer 129 disposed on the base layer and having the first to fourth light emitting device packages 111 to 114 soldered and supplying power. .

The copper foil layer 129 may include an electrode pattern 124 on which the connector pattern 122 and the first to fourth light emitting device packages 111 to 114 are soldered.

Here, the copper foil layer 129 may include a connection pattern (not shown) for electrically connecting the connector pattern 122 and the electrode pattern 124. In addition, when the substrate 120 is a double-sided pcb, the connection pattern may be formed on the top and bottom surfaces of the base layer, and may be connected by a via hole (not shown), but is not limited thereto.

In this case, the first to third light emitting device packages 111 to 113 are mounted in the first area U1 of the substrate 120, and the fourth light emitting device package 114 is the first area U1 of the substrate 120. It may be mounted in the second region U2 except for).

Here, the first region U1 may be a central region of the substrate 120, and the second region U2 may be an edge region on both sides of the first region U1.

That is, the second area U2 may include a first auxiliary area U2a located on the left side of the first area U1 and a second auxiliary area U2b located on the right side of the first area U2.

In an embodiment, the second area U2 is shown as including the first and second auxiliary areas U2a and U2b, but may include one auxiliary area, but is not limited thereto.

Here, the first to third light emitting device packages 111 to 113 mounted in the first area U1 emit light of different colors, which are mixed to emit white light when used in a backlight device and a lighting device. The first to third light emitting device packages 111 to 113 may be periodically mounted on the substrate 120.

That is, the first to third light emitting device packages 111 to 113 may be formed as one group in the first region U1, and a plurality of the groups may be mounted.

Here, at least one fourth light emitting device package 114 may be mounted in the first and second auxiliary regions U2a and U2b and may be mounted in different numbers, but is not limited thereto.

However, the fourth light emitting device package 114 emits white light, thereby compensating for the mixed white light emitted from the first to third light emitting device packages 111 to 113 mounted in the first region U1. Can give

That is, the first to third light emitting device packages 111 to 113 may emit red light, green light, and blue light to be mixed with white light.

Here, the fourth light emitting device package 114 is described as having the same package size as the first to third light emitting device packages 111 to 113, but is larger than the first to third light emitting device packages 111 to 113 and the package size. It may be large, but not limited thereto.

The fourth light emitting device package 114 mounted in the first auxiliary region U2a may be mounted adjacent to the first light emitting device package 111, and the fourth light emitting diode mounted in the second auxiliary region U2b may be used. The device package 114 may be mounted adjacent to the third light emitting device package 113.

This is because the first to third light emitting device packages 111 to 113 mounted in the first area U1 are formed as a group so that the light emitting devices are mounted adjacent to the first and second auxiliary areas U2a and U2b. The packages may be different.

In the embodiment, the fourth light emitting device package 114 is shown as being mounted on the first and second auxiliary regions U2a and U2b one by one, but may be mounted up to three, and may be mounted differently from each other. There is no limit.

When the fourth light emitting device package 114 is used in a backlight device (not shown), a portion of the fourth light emitting device package 114 may intersect with the light guide plate (not shown), thereby reducing color in the light guide plate corresponding to the first area U1. There is an advantage that the colors in the light guide plate corresponding to the two regions U2 can be made the same.

Here, intervals (not shown) between the first to third light emitting device packages 111 to 113 may be identical to each other, and the first and third light emitting device packages 111 and 113 adjacent to the fourth light emitting device package 114 may be the same. May be the same as or different from each other (not shown).

In an embodiment, the first to fourth light emitting device packages 111 to 114 are shown as a side view type, but may be a top view type.

In this case, when the first to fourth light emitting device packages 111 to 114 are in the top view type, the fourth light emitting device package 114 may be different from the mounting direction of the first to third light emitting device packages 111 to 113. It may be implemented as, but is not limited thereto.

Referring to FIG. 3, the light emitting device package illustrated in FIG. 3 has the same basic structure as the first to fourth light emitting device packages 111 to 114, and at least one of the color of the phosphor and the light emitted from the light emitting device may be different. Can be.

Therefore, the light emitting device package illustrated in FIG. 3 is described as the fourth light emitting device package 114.

The fourth light emitting device package 114 may include a light emitting device 11 and a body 12 on which the light emitting device 11 is disposed.

The body 12 is made of a resin material such as polyphthalamide (PPA), silicon (Si), aluminum (Al), aluminum nitride (AlN), AlOx, photosensitive glass (PSG), polyamide 9T (PA9T), neogeotactic polystyrene (SPS), metal, sapphire (Al ₂ O ₃ ), beryllium oxide (BeO), ceramic, and may be formed of at least one of a printed circuit board (PCB, Printed Circuit Board).

The body 12 may be formed by an injection molding, an etching process, or the like, without being limited thereto.

The upper surface shape of the body 12 may have various shapes such as triangles, squares, polygons, and circles depending on the use and design of the light emitting device 11, but is not limited thereto.

In addition, the body 12 forms a cavity (s) in which the light emitting element 11 is disposed, and the cross-sectional shape of the cavity (s) may be formed in a cup shape, a concave container shape, or the like, and forms a cavity (s). The inner surface of the body 12 may be formed to be inclined downward.

In addition, the planar shape of the cavity s may form various shapes such as a circle, a rectangle, a polygon, and an oval, but is not limited thereto.

In this case, the first and second lead frames 13 and 14 may be disposed on the lower surface of the body 12, and the first and second lead frames 13 and 14 may be formed of a metal material, for example, titanium (Ti). , Copper (Cu), nickel (Ni), gold (Au), chromium (Cr), tantalum (Ta), platinum (Pt), tin (Sn), silver (Ag), phosphorus (P), aluminum (Al ), Indium (In), palladium (Pd), cobalt (Co), silicon (Si), germanium (Ge), hafnium (Hf), ruthenium (Ru) and iron (Fe) may include one or more materials or alloys. Can be.

In addition, the first and second lead frames 13 and 14 may be formed to have a single layer or a multilayer structure, but the present invention is not limited thereto.

The inner surface of the body 12 is formed to be inclined with a predetermined inclination angle with respect to any one of the first and second lead frames 13 and 14, and the reflection angle of the light emitted from the light emitting element 11 varies according to the inclination angle. In this way, it is possible to adjust the directivity angle of the light emitted to the outside. As the directivity of light decreases, the concentration of light emitted from the light emitting device 11 to the outside increases, while the directivity of light increases to the outside of the light emitted from the light emitting device 11.

The inner surface of the body 12 may have a plurality of inclination angles, but is not limited thereto.

The first and second lead frames 13 and 14 are electrically connected to the light emitting element 11, and are connected to the positive and negative poles of an external power source (not shown), respectively, to emit the light emitting element 11. ) Can be powered.

The light emitting device 11 is mounted on the first lead frame 13, and the light emitting device 11 is die-bonded with the first lead frame 13 and is formed by the second lead frame 14 and the wire (not shown). The wire may be bonded to receive power from the first and second lead frames 13 and 14.

Here, the light emitting element 11 may be wire bonded or die bonded to each of the first and second lead frames 13 and 14, but is not limited thereto.

In addition, a cathode mark (not shown) may be formed on the body 12. The cathode mark distinguishes the polarity of the light emitting element 11, that is, the polarity of the first and second lead frames 13 and 14, and thus prevents confusion when the first and second lead frames 13 and 14 are electrically connected to each other. It can be used to

The light emitting element 11 may be a light emitting diode. The light emitting diode may be, for example, a colored light emitting diode emitting red, green, blue, or white light, or an ultraviolet (UV) emitting diode emitting ultraviolet light, but is not limited thereto. There may be a plurality of light emitting devices 11 mounted on the frame 13, at least one light emitting device 11 may be mounted on the first and second lead frames 13 and 14, and the light emitting devices 11 may be mounted on the first and second lead frames 13 and 14. There is no limitation on the number of mounting positions and mounting positions.

In the embodiment, the light emitting element 11 is described as using a blue light emitting element that emits blue light.

In addition, the body 11 may include a resin material 17 filled in the cavity (s). That is, the resin 17 may be formed in a double molding structure or a triple molding structure, but is not limited thereto.

In addition, the resin material 17 may be formed in a film form, and may include at least one of a phosphor and a light diffusing material, and a translucent material that does not include the phosphor and the light diffusing material may be used. Do not.

In an embodiment, the resin material 17 may include the first and second phosphors 15 and 16, and may be mixed with a silicon material (not shown), or may be formed in a dual structure, without being limited thereto. .

That is, the first and second phosphors 15 and 16 may be red phosphors and green phosphors by the light emitting element 11 emitting blue light when the first light emitting element package 112 emits white light.

In the embodiment, the first and second phosphors 15 and 16 have been described as including, but may include a single color phosphor, wherein the single color phosphor may be a yellow phosphor, but is not limited thereto.

If the light emitting device 11 emits red or green light, the fourth light emitting device package 114 may use a mixture of a blue phosphor and a green phosphor or a blue phosphor and a red phosphor to emit white light. can do.

4 is a perspective view showing a lighting device including a light emitting device package according to the embodiment, Figure 5 is a cross-sectional view showing a cross-section A 'A of the lighting device shown in FIG.

Hereinafter, in order to describe the shape of the lighting apparatus 300 according to the embodiment in more detail, the longitudinal direction (Z) of the lighting apparatus 300, the horizontal direction (Y) perpendicular to the longitudinal direction (Z), and the length The height direction X perpendicular to the direction Z and the horizontal direction Y will be described.

That is, FIG. 5 is a cross-sectional view of the lighting apparatus 300 of FIG. 4 cut in the plane of the longitudinal direction Z and the height direction X, and viewed in the horizontal direction Y. As shown in FIG.

4 and 5, the lighting device 300 may include a body 310, a cover 330 fastened to the body 310, and a closing cap 350 positioned at both ends of the body 310. have.

The lower surface of the body 310 is fastened to the light emitting device module 340, the body 310 is conductive so that the heat generated in the light emitting device package 344 can be discharged to the outside through the upper surface of the body 310 And it may be formed of a metal material having an excellent heat dissipation effect.

The light emitting device module 340 may include a light emitting device array (not shown) including a light emitting device package 344 and a printed circuit board 342.

The light emitting device package 344 may be mounted on the PCB 342 in a multi-colored, multi-row array to form an array. The light emitting device package 344 may be mounted at the same interval or may be mounted with various separation distances as necessary to adjust brightness. The PCB 342 may be a metal core PCB (MCPCB) or a PCB made of FR4.

The cover 330 may be formed in a circular shape to surround the lower surface of the body 310, but is not limited thereto.

The cover 330 protects the light emitting device module 340 from the outside and the like. In addition, the cover 330 may include diffusing particles to prevent glare of the light generated from the light emitting device package 344, and to uniformly emit light to the outside, and at least of the inner and outer surfaces of the cover 330 A prism pattern or the like may be formed on either side. In addition, a phosphor may be applied to at least one of an inner surface and an outer surface of the cover 330.

On the other hand, since the light generated from the light emitting device package 344 is emitted to the outside through the cover 330, the cover 330 should have excellent light transmittance, and has sufficient heat resistance to withstand the heat generated by the light emitting device package 344. The cover 330 is preferably formed of a material including polyethylene terephthalate (PET), polycarbonate (PC), polymethyl methacrylate (PMMA), or the like. .

Closing cap 350 is located at both ends of the body 310 may be used for sealing the power supply (not shown). In addition, the closing cap 350 is formed with a power pin 352, the lighting device 300 according to the embodiment can be used immediately without a separate device to the terminal from which the existing fluorescent lamps are removed.

6 is an exploded perspective view of a liquid crystal display including the light emitting device package according to the first embodiment.

FIG. 6 illustrates an edge-light method, and the liquid crystal display device 400 may include a liquid crystal display panel 410 and a backlight unit 470 for providing light to the liquid crystal display panel 410.

The liquid crystal display panel 410 may display an image using light provided from the backlight unit 470. The liquid crystal display panel 410 may include a color filter substrate 412 and a thin film transistor substrate 414 facing each other with the liquid crystal interposed therebetween.

The color filter substrate 412 may implement a color of an image displayed through the liquid crystal display panel 410.

The thin film transistor substrate 414 is electrically connected to the printed circuit board 418 on which a plurality of circuit components are mounted through the driving film 417. The thin film transistor substrate 414 may apply a driving voltage provided from the printed circuit board 418 to the liquid crystal in response to a driving signal provided from the printed circuit board 418.

The thin film transistor substrate 414 may include a thin film transistor and a pixel electrode formed of a thin film on another substrate of a transparent material such as glass or plastic.

The backlight unit 470 may convert the light provided from the light emitting device module 420, the light emitting device module 420 into a surface light source, and provide the light guide plate 430 to the liquid crystal display panel 410. Reflective sheet for reflecting the light emitted from the rear of the light guide plate 430 and the plurality of films 450, 464, 466 to uniform the luminance distribution of the light provided from the 430 and improve the vertical incidence ( 447).

The light emitting device module 420 may include a PCB substrate 422 such that a plurality of light emitting device packages 424 and a plurality of light emitting device packages 424 may be mounted to form an array.

The plurality of light emitting device packages 424 may emit red light, green light, and blue light, respectively, and may include first to third light emitting device packages (not shown) disposed in a central area of the PCB substrate 422 and left and right sides of the central area. It may include a fourth light emitting device package (not shown) disposed in at least one edge region of the right side to emit white light.

The first to fourth light emitting device packages referred to in the embodiment will be described as the first to fourth light emitting device packages 111 to 114 mentioned in FIGS. 1 to 3.

That is, the fourth light emitting device package may be disposed to cross on one line of the light guide plate 430.

This is because when the light guide plate 430 is coupled, when the line on one side of the light guide plate 430 crosses the light emitting device package due to an error in the manufacturing process, the fourth light emitting device package emits white light. 3 When the light emitted from the light emitting device package is mixed to disperse and scatter the white light, it is possible to reduce the color difference, and there is an advantage to compensate.

On the other hand, the backlight unit 470 is a diffusion film 466 for diffusing light incident from the light guide plate 430 toward the liquid crystal display panel 410, and a prism film 450 for condensing the diffused light to improve vertical incidence. ), And may include a protective film 464 for protecting the prism film 450.

7 is an exploded perspective view of a liquid crystal display including the light emitting device package according to the second embodiment.

However, the parts shown and described in Fig. 6 are not repeatedly described in detail.

7 is a direct view, the liquid crystal display device 500 may include a liquid crystal display panel 510 and a backlight unit 570 for providing light to the liquid crystal display panel 510.

Since the liquid crystal display panel 510 is the same as that described with reference to FIG. 6, a detailed description thereof will be omitted.

The backlight unit 570 includes a plurality of light emitting device modules 523, a reflective sheet 524, a lower chassis 530 in which the light emitting device modules 523 and the reflective sheet 524 are accommodated, and an upper portion of the light emitting device module 523. It may include a diffusion plate 540 and a plurality of optical film 560 disposed in the.

The light emitting device module 523 may include a PCB substrate 521 such that a plurality of light emitting device packages 522 and a plurality of light emitting device packages 522 are mounted to form an array.

The reflective sheet 524 reflects the light generated from the light emitting device package 522 in the direction in which the liquid crystal display panel 510 is positioned to improve light utilization efficiency.

On the other hand, the light generated from the light emitting device module 523 is incident on the diffusion plate 540, the optical film 560 is disposed on the diffusion plate 540. The optical film 560 may include a diffusion film 566, a prism film 550, and a protective film 564.

Here, the lighting device 300 and the liquid crystal display device (400, 500) may be included in the lighting system, in addition to the light emitting device package, and the purpose of the lighting may also be included in the lighting system.

Features, structures, effects, and the like described in the above embodiments are included in at least one embodiment of the present invention, and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects, and the like illustrated in each embodiment may be combined or modified with respect to other embodiments by those skilled in the art to which the embodiments belong. Therefore, it should be understood that the present invention is not limited to these combinations and modifications.

In addition, the above description has been made with reference to the embodiment, which is merely an example, and is not intended to limit the present invention. It will be appreciated that various modifications and applications are possible. For example, each component specifically shown in the embodiments can be modified and implemented. It is to be understood that all changes and modifications that come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

Claims

Board; And
A plurality of light emitting device packages disposed on the substrate;
The plurality of light emitting device packages,
First, second and third light emitting device packages disposed in the first region of the substrate and emitting light of different colors; And
And a fourth light emitting device package mounted on a second area of the substrate adjacent to the first area, the fourth light emitting device package emitting light of a color different from that of the first, second and third light emitting device packages.

The method of claim 1, wherein the second region,
A first auxiliary region adjacent to the first light emitting device package; And
And a second auxiliary region adjacent to the third light emitting device package.

The method of claim 2, wherein the first and second auxiliary regions,
1 to 3, wherein the fourth light emitting device package is disposed.

The method of claim 2, wherein the first and second auxiliary regions,
The light emitting device array in which the fourth light emitting device package is arranged in different numbers.

The method of claim 1,
The first light emitting device package,
Emits red light,
The second light emitting device package,
Emit green light,
The third light emitting device package,
An array of light emitting devices emitting blue light.

The method of claim 1, wherein the fourth light emitting device package,
An array of light emitting devices emitting white light.

The method of claim 1, wherein the fourth light emitting device package,
The first light emitting device package and the same package size,
Or a light emitting device array larger than a package size of the first light emitting device package.

The method of claim 1, wherein the fourth light emitting device package,
A light emitting device array comprising at least one of red, green, blue and yellow phosphors.

The method of claim 1, wherein the substrate,
A light emitting device array, which is a printed circuit board or a flexible printed circuit board.

A light emitting device array comprising a substrate and a plurality of light emitting device packages disposed on the substrate; And
And a light guide plate disposed adjacent to the light emitting device array and scattering and dispersing light incident from the plurality of light emitting device packages.
The plurality of light emitting device packages,
First, second and third light emitting device packages disposed in the first region of the substrate and emitting light of different colors; And
A fourth light emitting device package disposed in a second area of the substrate adjacent to the first area and emitting light of a color different from that of the first, second and third light emitting device packages, and crossing the line on one side of the light guide plate; Including a backlight unit.