KR101873999B1 - Light emitting device package module and lighting system including the same - Google Patents

Abstract

The light emitting device package module of the embodiment includes a circuit board on which a plurality of light emitting device package arrays are arranged, a connector disposed on the circuit board on one side of the plurality of light emitting device package arrays, Wherein a width of the first wiring is different according to a distance from the connector to each of the plurality of light emitting device package arrays, the first wiring and the second wiring electrically connecting the first wiring and the second wiring.

Description

TECHNICAL FIELD [0001] The present invention relates to a light emitting device package module and a lighting system including the light emitting device package module.

The embodiment relates to a light emitting device package module, and relates to an improvement in reliability of the light emitting device package module.

BACKGROUND ART Light emitting devices such as a light emitting diode (LED) or a laser diode (LD) using a semiconductor material of Group 3-5 or 2-6 group semiconductors have been developed with thin film growth technology and device materials, Green, blue, and ultraviolet rays. By using fluorescent materials or combining colors, it is possible to realize a white light beam having high efficiency. In addition, the light emitting device has advantages of low power consumption, semi-permanent lifetime, fast response speed, safety, and environmental friendliness compared to conventional light sources such as fluorescent lamps and incandescent lamps.

A light emitting device package in which a light emitting device is mounted on a package body and is electrically connected is widely used as a light source of a display device. Particularly, a COB (Chip on Board) type light emitting module is formed by die bonding a light emitting element, for example, LED chips directly on a substrate, and electrically connecting the LED chip by wire bonding, Are often used in the form of arrayed light emitting device package arrays.

In general, the COB type light emitting module may include a substrate, LED chips arranged in a line on the substrate, a molding portion surrounding the LED chips, and a lens positioned on the molding portion.

The embodiment intends to improve the reliability of the light emitting device package module.

The light emitting device package module of the embodiment includes a circuit board on which a plurality of light emitting device package arrays are arranged, a connector disposed on the circuit board on one side of the plurality of light emitting device package arrays, Wherein a width of the first wiring is different according to a distance from the connector to each of the plurality of light emitting device package arrays, the first wiring and the second wiring electrically connecting the first wiring and the second wiring.

Wherein the plurality of light emitting device package arrays are divided into a first light emitting device package array closest to the first light emitting device package array and a second light emitting device package array farthest from the first light emitting device package array according to a distance from the connector, The first wiring and the first wiring connected to the second light emitting device package array are divided into a second section and the first wiring of the first section is formed to have a first width, The wiring may be formed with a second width.

The first width and the second width may be formed so that the resistance of the first section resistance is equal to the resistance of the second section.

The first width and the second width may be formed in proportion to the distance that the first wiring is connected from the connector.

The second width may be relatively wider than the first width.

The width of the first wiring may be proportional to the width of the cross-sectional area of the first wiring.

The first wiring may be a wiring of the anode electrode, and the second wiring may be wiring of the cathode electrode.

The light emitting device package module of another embodiment includes a circuit board on which a first wiring and a second wiring are disposed, a light emitting device package disposed on the circuit board and connected to the first wiring and the second wiring, Two light emitting elements and a connecting portion for electrically connecting the two light emitting elements, and the second wiring may be disposed between the two light emitting elements and the connecting portion.

The second wiring may be a cathode electrode wiring, and the first wiring may be an anode electrode wiring.

The cathode electrode wiring may be a plurality of electrode wirings and the second electrode wiring may be an electrode wiring closest to the light emitting device package among the plurality of electrode wirings.

The light emitting devices may be spaced apart from each other on the same plane, and the connection unit may be disposed on a vertical line extending between the light emitting devices and spaced apart from the light emitting devices.

The illumination system of another embodiment may include the aforementioned light emitting device package module.

The embodiment can improve the reliability of the light emitting device package module.

1 is a sectional view of an embodiment of a light emitting device package,
2 is a plan view schematically showing the light emitting device package array of the embodiment,
3 is a plan view of a light emitting device package module according to an embodiment,
4 is a perspective view of a light emitting device package for explaining a light emitting device package module according to another embodiment,
5 is a plan view of a circuit board on which the light emitting device package is mounted,
6 is a view illustrating an embodiment of a lighting apparatus in which a light emitting device package is disposed,
7 is a view showing an embodiment of a display device in which a light emitting device package is disposed.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

In the description of the embodiment according to the present invention, in the case of being described as being formed "on or under" of each element, the upper (upper) or lower (lower) or under are all such that two elements are in direct contact with each other or one or more other elements are indirectly formed between the two elements. Also, when expressed as "on or under", it may include not only an upward direction but also a downward direction with respect to one element.

The thickness and size of each layer in the drawings are exaggerated, omitted, or schematically shown for convenience and clarity of explanation. Also, the size of each component does not entirely reflect the actual size.

1 is a cross-sectional view of an embodiment of a light emitting device package.

A light emitting device package 1 according to an embodiment includes a body 2, a first lead frame 3 and a second lead frame 4 provided on the body 2, A light emitting device 5 according to an embodiment in which the light emitting device 5 is electrically connected to the first lead frame 3 and the second lead frame 4, (8).

The body 2 may be formed of a silicon material, a synthetic resin material, or a metal material. When the body 2 is made of a conductive material such as a metal material, an insulating layer is coated on the surface of the body 2 to prevent short circuiting between the first and second lead frames 3 and 4 can do.

The first lead frame 3 and the second lead frame 4 are electrically separated from each other and supply current to the light emitting element 5. The first lead frame 3 and the second lead frame 4 can increase the light efficiency by reflecting the light generated from the light emitting device 5 and the heat generated from the light emitting device 5 To the outside.

The light emitting device 5 may be a horizontal type light emitting device, a vertical type light emitting device or a flip type light emitting device. The light emitting device 5 may be mounted on the body 2 or may be mounted on the first lead frame 3 or the second lead frame 4 As shown in FIG. The first lead frame 3 and the light emitting element 5 are electrically connected through the conductive adhesive layer 6 and the second lead frame 4 and the light emitting element 5 are electrically connected to the wire 7 Respectively. The light emitting device 5 may be connected to the lead frames 3 and 4 by a flip chip method or a die bonding method in addition to the wire bonding method.

The molding part 8 surrounds and protects the light emitting device 5. [ The molding part 8 may include a phosphor 9 to change the wavelength of the light emitted from the light emitting device 5. The molding part 8 may be formed to cover at least the light emitting element 5 and the wire 7.

The light of the first wavelength range emitted from the light emitting device 5 is excited by the phosphor 9 to be converted into the light of the second wavelength range and the light of the second wavelength range is transmitted through the lens (not shown) The optical path can be changed while passing through the optical path changing unit such as the optical path changing unit.

The lens may be emitted from the light emitting element 5 to convert the optical path through refraction of the wavelength-converted light in the phosphor. In particular, the directivity angle can be adjusted when the light emitting device package is used in the backlight unit.

The lens is made of a material having a high light transmittance. For example, the lens may be made of polymethyl methacrylate (PMMA), polycarbonate (PC), polyethylene (PE), or resin injection molding.

2 is a plan view schematically showing the light emitting device package array of the embodiment.

2, the light emitting device package arrays 31, 32, and 33, the connector 40, and the metal wiring L may be disposed on the circuit board 10.

The circuit board 10 may be implemented as a single layer or a multilayer substrate, and the substrate may be a resin such as FR-4 or CEM-3 (CEM: Composite Epoxy Materials Grade 3), a ceramic material, A metal material can be used. If the substrate is a single-layer substrate, a plurality of wiring lines may be formed on the top layer, that is, the top surface. The wiring line may be a layer plated with Cu or Cu. The circuit board 10 may be at least one of a general printed circuit board (PCB), a metal core PCB, and a flexible PCB. However, the circuit board 10 is not limited thereto.

The metal wiring L includes a metal material such as aluminum (Al), copper (Cu), platinum (Pt), silver (Ag), titanium (Ti), chromium (Cr), gold (Au) ), Or a metal material containing at least one metal element selected from the group consisting of gold, silver, and silver.

A plurality of light emitting devices 1 may be arranged in a line on the front surface of the circuit board 10. [ The embodiment can disclose a group of light emitting device package arrays 31, 32, and 33 in which four light emitting devices 1 are grouped. For example, four light emitting devices may be provided so that four pairs of light emitting devices of the same color that can be simultaneously driven are provided, but four or more light emitting devices may be arranged in a predetermined arrangement, but the present invention is not limited thereto. The light emitting devices 1 in the light emitting device package arrays 31, 32 and 33 may be connected in series to one another. At one end of the circuit substrate 10 on which the light emitting device package arrays 31, 32, and 33 are disposed, The connector 40 of the electrical pathway means for supplying power to the package array 31, 32, 33 may be arranged. The light emitting device package arrays 31, 32, and 33 and the connector 40 may be connected to each other through a metal wiring line L. For example, the anode power supply for supplying the light emitting device package arrays 31, 32, and 33 may be connected by a metal wiring L having an integral structure.

In the embodiment, a plurality of metal wires L for supplying anode power to the light emitting device package arrays 31, 32, and 33 are provided for the light emitting device package arrays 31, 32, and 33 according to the distance from the connector 40 .

That is, the metal wiring L adjacent to the first light emitting device package array 31 closest to the connector 40 is electrically connected to the first section L1, the metal wiring L And the metal wiring L adjacent to the third light emitting device package array 33 farthest from the light emitting device package can be divided into a third section L3 and a third section L3.

3 is a plan view of a light emitting device package module according to an embodiment.

The light emitting device package module includes a circuit board 10, at least two light emitting device package arrays 31, 32 and 33, a first electrode wiring 30, a second electrode wiring 20, 21 and 22, ).

The connector 40 receives power from an external power source and supplies power to the first electrode wiring 30 and the second electrode wiring 20, 21, 22, respectively.

The first electrode wiring 30 may be electrically connected to the connector 40 to provide power to the light emitting device package arrays 31, 32, and 33. The first electrode wiring 30 is electrically connected to the light emitting device package arrays 31, 32 and 33 at one end and electrically connected to the connector 40 at the other end connected to the external power supply. .

The second electrode wirings 20, 21, and 22 may be electrically connected to the connector 40 to provide power to the light emitting device package arrays 31, 32, and 33. The second electrode lines L1, L2 and L3 are wired on the circuit board 10 and one end is electrically connected to the light emitting device package arrays 31 to 32 and the other end is connected to the external power supply 40, respectively.

The first electrode wirings 30 and the second electrode wirings 20 and 21 may be formed of a metal material such as aluminum (Al), copper (Cu), platinum (Pt), silver (Ag) ), Chromium (Cr), gold (Au), and nickel (Ni) may be formed by a method such as vapor deposition, sputtering, or plating.

The first electrode wiring 30 may be an anode electrode connected to a positive power supply and the negative electrode power supply is connected to a cathode electrode of the second electrode wiring 20, .

The first electrode wiring 30 of the embodiment may be integrally formed as a common electrode in the light emitting device package arrays 31, 32, 33 and connected in series.

Specifically, the light emitting device package array includes the first light emitting device package array 31 closest to the connector 40, the second light emitting device package array 32 at the middle, and the third light emitting device package 32 closest to the connector 40 in the distance from the connector 40 And a light emitting device package array 33.

The first electrode line 30 is connected to the first section L1 adjacent to the first light emitting device package array 31, the second section L2 adjacent to the second light emitting device package array 32, And a third section L3 adjacent to the third section 33. [ The first section L1 is a part of the first electrode wiring 30 connected in a direction orthogonal to the first light emitting device package array 31 and is connected to the first light emitting device package array 31 through the first connection wiring P1. And the second section L2 is a part of the first electrode wiring 30 connected in a direction orthogonal to the second light emitting device package array 32 through the second connection wiring P2, And the third section L3 is electrically connected to the element package array 32. The third section L3 is a part of the first electrode wiring 30 connected in the direction orthogonal to the third light emitting device package array 33, The first light emitting device package may be electrically connected to the third light emitting device package array.

The embodiment can form a wide width t of the electrode wiring 30 connected to the light emitting device package array from the connector 40. [

That is, the width t1 of the first section L1 connected to the first light emitting device package array 31 closest to the connector 40 is the narrowest, The width t3 of the third section L3 connected to the package array 33 may be the widest.

The resistance of the electrode wiring is defined as being proportional to the length of the electrode wiring and inversely proportional to the cross-sectional area.

The length of the first electrode wiring 30 from the connector 40 to the first light emitting device package array 31 is the shortest and the length of the first electrode wiring 30 to the second light emitting device package array 32 is The length of the first electrode wiring 30 from the middle to the third light emitting device package array 33 is the longest.

Therefore, in order to maintain the same resistance in each of the first to third sections L1 to L3 of the first electrode wiring 30 connected in series, the first electrode wiring 30 in each of the sections L1 to L3, The cross-sectional areas of the first and second guide grooves can be adjusted differently.

It can be seen that the cross-sectional area of the first electrode wiring 30 is proportional to the length of the width t. Although the cross-sectional area of the first electrode wiring 30 is not shown, it may be circular, elliptical, square, or triangular. When the cross-sectional area of a typical electrode wiring is circular, the length of the width of the electrode wiring can be said to be the diameter of the above circle.

Therefore, the first width t1 of the first section L1 of the first electrode wiring 30 connected in the shortest length from the connector 40 can be relatively narrowed to reduce the cross-sectional area of the electrode wiring, The third width t3 of the third section L3 of the first electrode wiring 30 connected with the longest length from the first electrode section 40 can be relatively widest to increase the cross sectional area of the electrode wiring.

In this way, the resistance values in the first section L1, the second section L2 and the third section L3 can be kept equal to each other.

In this way, the embodiment can reduce the error of the resistance values of the first electrode wiring 30, which occurs according to the distance connected from the conventional connector 40. [

The first connection wiring P1, the second connection wiring P2 and the third connection wiring P3 can be formed to have the same length and width as each other when the resistance values of the first connection wiring P1, the second connection wiring P2 and the third connection wiring P3 are small. Alternatively, the width of each of the wirings of the first connection wiring P1, the second connection wiring P2, and the third connection wiring P3 may be adjusted in the same manner as the method of adjusting the width of the first electrode wiring 30, The resistance values of the first connection wiring P1 to the third connection wiring P3 can be kept the same by keeping the ratio of the length and the cross-sectional area of the connection wiring.

The width of the electrode wirings can be adjusted in units of a plurality of light emitting device package arrays as a unit of a plurality of light emitting device package units, It is possible to simplify the process of forming the semiconductor device, which is advantageous in the process.

The length of the first electrode wiring 30 can be adjusted by adjusting the width of the first electrode wiring 30 according to the distance between the connector 40 and the light emitting device package array 31, By maintaining the ratio of the contrast sectional area to be the same, it is possible to reduce the error in the resistance value between the electrode wirings connected in series, thereby improving the reliability of the light emitting device package module.

In the embodiment, the light emitting device package arrays 31, 32 and 33, the first electrode wirings 30, the second electrode wirings 20, 21 and 22, and the connector 40 are arranged on the entire surface of the circuit board 10 The first electrode wirings 30 and the second electrode wirings 20 and 21 and 22 are arranged on the rear surface of the circuit board 10 in such a way that the light emitting device package arrays 31, So that the front surface and the rear surface of the circuit board 10 can be electrically connected to each other through the connector 40.

4 is a perspective view of a light emitting device package for explaining a light emitting device package module of another embodiment.

The light emitting device package 200 includes a body 210, a first reflective cup 222, a second reflective cup 224, a connection pad 226, a first light emitting element 232, a second light emitting element 234, A lead frame 242, a zener diode 150, an insulating member 209, and wires 251 to 159. [

The body 210 may be formed of at least one of a resin material such as polyphthalamide (PPA), a silicon (Si), a metal material, a photo sensitive glass (PSG), a sapphire (Al2O3) have.

The body 210 may be formed of a conductor having conductivity. When the body 210 is made of an electrically conductive material, an insulating film (not shown) is formed on the surface of the body 210 so that the body 210 is divided into the first reflective cup 222, the second reflective cup 224, May be configured to prevent electrical shorting with the connection pad 226.

The shape of the upper surface 206 of the body 210 viewed from above may have various shapes such as a triangle, a rectangle, a polygon, and a circle depending on the use and design of the light emitting device package 200.

The body 210 includes an upper surface 203 and a reflective wall 202. The reflective wall 202 is positioned on the upper surface 203 of the body 210 and may extend upwardly from the upper surface 203 of the body 210.

The body 210 has a cavity 205 (hereinafter referred to as "body cavity ") having an open top and including a side 202 and a bottom 103.

The bottom 203 of the cavity 205 may have a first cavity 262 having an open top and a side and a bottom and the first reflective cup 222 may be disposed in the first cavity 262.

The second reflective cup 224 may be a structure that is spaced apart from the first cavity 262 and is open at an upper portion which is recessed from the bottom surface of the cavity 205. For example, the bottom 203 of the cavity 205 may have a second cavity 264 having an open top and a side and a bottom, and a second reflective cup 224 may be disposed within the second cavity 264 . At this time, the second cavity 264 may be separated from the first cavity 262.

One end 242 of the first reflective cup 222 and one end 244 of the second reflective cup 224 may be formed in various shapes such as a rectangular shape, a square shape, or a U shape.

A part of the bottom 203 of the cavity 205 is located between the first reflective cup 222 and the second reflective cup 224 and the first reflective cup 222 and the second reflective cup 224, The reflecting cup 224 can be spaced apart and isolated.

The shapes of the first cavity 262 and the second cavity 264 viewed from above may be formed in a cup shape, a concave container shape, or the like, and each side may be perpendicular or inclined to the respective bottom.

The connection pad 226 is disposed within the upper surface of the body 210, away from the first reflective cup 222 and the second reflective cup 224. The second connection pad 228 may be disposed on the upper surface of the body 210 so as to be spaced apart from the first reflection cup 222, the second reflection cup 224, and the connection pad 226.

The first light emitting device 232 may be disposed in the first cavity 262 and the second light emitting device 234 may be disposed in the second cavity 264. [

The wires 252 to 258 electrically connect the first light emitting device 232, the second light emitting device 234, and the connection pad 226. The wires 259-1 and 259-2 electrically connect the first reflective cup 222 and the second reflective cup 224 to the Zener diode 250, respectively.

The first wire 252 connects the first light emitting device 222 and the first reflective cup 232 and the second wire 254 connects the first light emitting device 222 and the connection pad 226, The third wire 256 connects the connection pad 226 and the second light emitting device 224 and the fourth wire 258 connects the second light emitting device 224 and the second reflective cup 234 .

The connection pad 226 is electrically isolated from the first light emitting device 222 and the second light emitting device 224 because the connection pad 226 is separated from the first reflective cup 222 and the second reflective cup 224 and is electrically isolated .

5 is a plan view of a circuit board on which the light emitting device package described in FIG. 4 is mounted.

4 and 5, the circuit board 300 of the embodiment includes electrode wirings C1 to C8 and a1 for electrical connection of the light emitting device package, A connection pad 226, and a second light emitting device 224. The second light emitting device 224 may be a light emitting diode.

The first light emitting device 222 and the second light emitting device 224 are spaced from each other on the same plane of the circuit board 300 and the connection pad 226 is electrically connected to the first light emitting device 222 and the second light emitting device 224. [ (224). ≪ / RTI >

The electrode wirings may be composed of a first wiring (a1) and N second wirings (C1 to C8). The first wirings a1 and the second wirings C1 to C8 may be arranged in a predetermined arrangement under the light emitting device packages 222, 224, and 226.

The first wiring a1 may be an anode electrode wiring, and the second wirings C1-C8 may be a cathode electrode wiring.

The embodiment arranges the second wiring C1 closest to the light emitting device packages 222, 224 and 226 between the first and second light emitting devices 222 and 224 and the connection pad 226.

The layout in which the second wiring C1 is wired so as to be spaced apart from the connection pad 226 between the first and second light emitting devices 222 and 224 is achieved by forming the second wiring C1 in the lower part of the connection pad 226 It is easier to prevent a short circuit between the connection pad 226 and the second wiring C1 than a layout in which the second wiring C2 is wired in a straight line.

The arrangement of the uppermost second wiring C1 between the first and second light emitting devices 222 and 224 and the connection pad 226 has the effect of reducing the interval occupied by the second wirings C1 to C8 So that the margin in the circuit board 300 can be increased.

A plurality of light emitting device packages according to embodiments may be arranged on a substrate, and a light guide plate, a prism sheet, a diffusion sheet, and the like may be disposed on the light path of the light emitting device package. Such a light emitting device package, a substrate, and an optical member can function as a light unit. Still another embodiment may be implemented as a display device, an indicating device, a lighting system including the semiconductor light emitting device or the light emitting device package described in the above embodiments, for example, the lighting system may include a lamp, a streetlight .

Hereinafter, the illumination device and the backlight unit will be described as an embodiment of the illumination system in which the above-described light emitting device package is disposed.

5 is a view showing an embodiment of a lighting apparatus in which a light emitting device package is disposed.

The illumination device according to the embodiment includes a light source 600 for projecting light, a housing 400 in which the light source 600 is embedded, a heat dissipation unit 500 for emitting heat of the light source 600, And a holder 700 for coupling the heat dissipating unit 500 to the housing 400.

The housing 400 includes a socket coupling part 410 coupled to an electric socket and a package body 420 connected to the socket coupling part 410 and having a light source 600 embedded therein. One air flow hole 430 may be formed through the package body 420.

A plurality of air flow openings 430 are provided on the package body 420 of the housing 400. The air flow openings 430 may be formed of one air flow openings or a plurality of flow openings may be formed in a radial Various arrangements other than placement are also possible.

The light source 600 includes a plurality of the light emitting device packages 650 on a circuit board 610. Here, the circuit board 610 may be inserted into the opening of the housing 400, and may be made of a material having a high thermal conductivity to transmit heat to the heat dissipating unit 500, as described later.

A holder 700 is provided under the light source. The holder 700 may include a frame and another air flow hole. Although not shown, an optical member may be provided under the light source 100 to diffuse, scatter, or converge light projected from the light emitting device package 150 of the light source 100.

6 is a view showing an embodiment of a display device in which a light emitting device package is disposed.

The display device 800 according to the present embodiment includes the light source modules 830 and 835, the reflection plate 820 on the bottom cover 810, the light source module 830 disposed on the front of the reflection plate 820, A first prism sheet 850 and a second prism sheet 860 disposed in front of the light guide plate 840 and a second prism sheet 860 disposed in front of the light guide plate 840, A panel 870 disposed in front of the panel 870 and a color filter 880 disposed in the front of the panel 870.

The light source module includes the light emitting device package 835 described above on the circuit board 830. [ Here, the circuit board 830 may be a PCB or the like, and the light emitting device package 835 is the same as that described with reference to FIG.

The bottom cover 810 may house the components in the display device 800. The reflection plate 820 may be formed as a separate component as shown in the drawing, or may be formed to be coated on the rear surface of the light guide plate 840 or on the front surface of the bottom cover 810 with a highly reflective material Do.

Here, the reflection plate 820 can be made of a material having a high reflectance and can be used in an ultra-thin shape, and polyethylene terephthalate (PET) can be used.

The light guide plate 840 scatters light emitted from the light emitting device package module so that the light is uniformly distributed over the entire screen area of the LCD. Accordingly, the light guide plate 840 is made of a material having a good refractive index and transmittance. The light guide plate 840 may be formed of polymethyl methacrylate (PMMA), polycarbonate (PC), or polyethylene (PE). An air guide system is also available in which the light guide plate is omitted and light is transmitted in a space above the reflective sheet 820.

The first prism sheet 850 is formed on one side of the support film with a transparent and elastic polymeric material, and the polymer may have a prism layer in which a plurality of steric structures are repeatedly formed. As shown in the drawings, the plurality of patterns may be repeatedly provided with a stripe pattern.

In the second prism sheet 860, the edges and the valleys on one surface of the support film may be perpendicular to the edges and the valleys on one surface of the support film in the first prism sheet 850. This is to disperse the light transmitted from the light source module and the reflection sheet evenly in all directions of the panel 870.

In the present embodiment, the first prism sheet 850 and the second prism sheet 860 form an optical sheet, which may be formed of other combinations, for example, a microlens array or a diffusion sheet and a microlens array Or a combination of one prism sheet and a microlens array, or the like.

The panel 870 may include a liquid crystal display (LCD), and may include other types of display devices that require a light source.

In the panel 870, the liquid crystal is positioned between the glass bodies, and the polarizing plate is placed on both glass bodies to utilize the polarization of light. Here, the liquid crystal has an intermediate property between a liquid and a solid, and liquid crystals, which are organic molecules having fluidity like a liquid, are regularly arranged like crystals. The liquid crystal has a structure in which the molecular arrangement is changed by an external electric field And displays an image.

A liquid crystal display panel used in a display device is an active matrix type, and a transistor is used as a switch for controlling a voltage supplied to each pixel.

A color filter 880 is provided on the front surface of the panel 870 so that light projected from the panel 870 transmits only red, green, and blue light for each pixel.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, It will be understood that various modifications and applications are possible. For example, each component specifically shown in the embodiments can be modified and implemented. It is to be understood that all changes and modifications that come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

10: circuit board, 31, 32, 33: light emitting device package array
30: first electrode wiring, L1, L2, L3: first section, second section, third section
40: Connector, a1: Anode electrode wiring
20, 21, 22: Cathode electrode wiring

Claims (12)

A circuit board on which a plurality of light emitting device package arrays are disposed;
A connector disposed on the circuit board; And
And a first wiring and a second wiring electrically connecting the connector and the plurality of light emitting device package arrays, respectively,
Wherein the first wiring includes:
One electrode wiring; And
And a plurality of connection wirings branched at different points of the one electrode wiring and connected to the plurality of light emitting device package arrays,
Wherein,
And the plurality of light emitting device package arrays each have a plurality of sections having different widths at the different points according to distances from the connector. The method according to claim 1,
Wherein the plurality of light emitting device package arrays are divided into a first light emitting device package array closest to the distance from the connector and a second light emitting device package array farthest from the connector array,
Wherein the plurality of sections are divided into a first section of the electrode wiring connected to the first light emitting device package array and a second section of the electrode wiring connected to the second light emitting device package array,
The electrode wirings of the first section are formed to have a first width, the electrode wirings of the second section are formed to have a second width,
Wherein the first width and the second width are formed such that a resistance of the first section and a resistance of the second section are equal to each other. delete 3. The method of claim 2,
Wherein the first width and the second width of the electrode wiring are formed in proportion to a distance between the first light emitting device package array and the second light emitting device package array and the connector,
Wherein the second width is relatively wider than the first width,
Wherein the first wiring is a wiring of an anode electrode, and the second wiring is a wiring of a cathode electrode. delete The method according to claim 1,
Wherein a ratio of a width and a cross-sectional area of each of the plurality of sections of the electrode wiring is constant,
Wherein a ratio of a length to a cross-sectional area of each of the plurality of connection wirings is equal to each other. delete A circuit board on which a first wiring and a second wiring are arranged;
A light emitting device package disposed on the circuit board and connected to the first wiring and the second wiring respectively; And
The light emitting device package
At least two light emitting elements; And
And a connection part electrically connected to the two light emitting devices through a wire,
Wherein the second wiring is disposed between a region corresponding to the two light emitting elements of the circuit board and a region corresponding to the connecting portion in a plan view and a region corresponding to the two light emitting elements and a region corresponding to the connecting portion, Respectively,
The light emitting elements are disposed on the same plane so as to be spaced apart from each other,
Wherein the connection portion is disposed on a vertical line extending between the light emitting elements so as to be spaced apart from the light emitting elements. 9. The method of claim 8,
The second wiring is a cathode electrode wiring, the first wiring is an anode electrode wiring,
Wherein the cathode electrode wiring is a plurality of electrode wirings and the second wiring is an electrode wiring closest to the light emitting device package among the plurality of electrode wirings. delete delete An illumination system comprising a light emitting device package module according to any one of claims 1, 2, 6, 8 and 9.

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