KR101850434B1 - Light emitting device module and lighting system including the same - Google Patents

Abstract

An embodiment includes a flexible circuit board on which a conductive pattern is disposed; A light emitting device package array disposed on a first side of the circuit board; And a heat radiation array disposed on a second surface of the circuit board and corresponding to each light emitting device package, the second surface being opposite to the first surface.

Description

[0001] The present invention relates to a light source module and a lighting system including the light source module,

Embodiments relate to a light source module and an illumination system including the same.

Light emitting devices such as light emitting diodes and laser diodes using semiconductor materials of Group 3-5 or Group 2-6 compound semiconductors can realize various colors such as red, green, blue and ultraviolet rays through the development of thin film growth techniques and device materials, By using fluorescent materials or by combining colors, it is possible to realize a white light beam having high efficiency.

With the development of such technology, not only display devices but also transmission modules of optical communication means, light-emitting diode backlights replacing CCFL (Cold Cathode Fluorescence Lamp) constituting the backlight of LCD (Liquid Crystal Display) White light emitting diodes (LED) lighting devices, automotive headlights, and traffic lights.

Here, the structure of the LED is such that the P electrode, the active layer, and the N electrode are sequentially laminated on the substrate, and the substrate and the N electrode are wire-bonded, so that currents can be mutually energized.

At this time, when current is applied to the substrate, a current is supplied to the P electrode and the N electrode, so that positive (+) is emitted from the P electrode to the active layer, and electrons (-) are emitted from the N electrode to the active layer. Therefore, the energy level is lowered as the holes and electrons are combined in the active layer, and the energy level is lowered, and the emitted energy is emitted in the form of light.

When a light emitting diode (LED) is used for a lighting device or a backlight unit, a light source module in which a light emitting device package is disposed on a metal cored printed circuit board (MCPCB) circuit board can be used.

The temperature of the illumination device or the backlight unit rises due to the heat emitted from the plurality of light emitting devices and the circuit board, and the heat radiation is highlighted as an important characteristic of the light source module. If the light source module is not radiated, the circuit board may be bent, and the warpage of the circuit board may not change the projection angle or appropriately project light for each pixel in the illumination device or the backlight unit, .

Conventionally, there is an attempt to improve the heat radiating effect by adding a heat radiating pattern with a material having a high thermal conductivity to the light source module, but the weight of the light source module may be increased.

The embodiment is intended to provide a flexible light source module with excellent heat dissipation effect.

An embodiment includes a flexible circuit board on which a conductive pattern is disposed; A light emitting device package array disposed on a first side of the circuit board; And a heat radiation array disposed on a second surface of the circuit board and corresponding to each light emitting device package, the second surface being opposite to the first surface.

Another embodiment includes a flexible circuit board on which a conductive pattern is disposed; A light emitting device package array disposed on a first side of the circuit board; And a second substrate disposed on a second surface of the circuit board and patterned to expose the circuit board corresponding to an area between adjacent light emitting device packages, the second surface being opposite to the first surface Direction of the light source module.

The circuit board may include an insulating layer, a conductive pattern, and a second insulating layer.

At least one of the insulating layer and the second insulating layer may be made of polyimide.

The conductive pattern may be disposed between the first insulating layer and the second insulating layer through an adhesive.

Each light emitting device package may be disposed at a distance of 2.5 to 3.5 micrometers.

The heat sink array may include at least one of copper, aluminum, and anodized aluminum.

The second substrate may include at least one of copper, aluminum, and anodized aluminum.

The thickness of the second substrate or heat spreader array may be between 1 and 5 millimeters.

The width of each of the heat dissipation units may be wider than the width of each of the light emitting device packages.

The light source module may further include a thermally conductive member penetrating through the circuit board and in contact with the respective light emitting device package and the respective heat radiating parts.

The light source module may further include a thermally conductive member passing through the circuit board and in contact with the respective light emitting device package and the second substrate.

The first substrate and the second substrate may be made of different materials.

Another embodiment provides an illumination system in which the above-described light source module is disposed.

In the light source module according to the embodiment, the heat emitted from the light emitting device package is discharged through the heat dissipating portion through the second substrate, and the second substrate to the heat dissipating portion array are patterned and arranged. As a result, The heat dissipating portion to the second substrate can also be turned in the same direction.

1 is a sectional view of an embodiment of a light source module,
2 is a cross-sectional view of the light emitting device package of FIG. 1,
3 is a cross-sectional view of the circuit board of Fig. 1,
FIG. 4 is a plan view of the light source module of FIG. 1,
5 is a view showing the positional relationship between the light emitting device package and the heat dissipating unit in the light source module,
FIG. 6 is a diagram illustrating the operation of the light source module of FIG. 1,
7 is a cross-sectional view of another embodiment of the light source module,
Fig. 8 is a plan view of Fig. 7,
9 is a perspective view of the light source module of FIG. 7,
10 is a view showing an embodiment of a lighting device in which a light source module is disposed,
11 is a view showing an embodiment of an image display device in which a light source module is arranged.

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

In describing the above embodiments, it is to be understood that each layer (film), area, pattern or structure may be referred to as being "on" or "under" the substrate, each layer Quot; on "and " under" include both being formed "directly" or "indirectly" In addition, the criteria for above or below each layer will be described with reference to the drawings.

The thickness and size of each layer in the drawings are exaggerated, omitted, or schematically shown for convenience and clarity of explanation. Also, the size of each component does not entirely reflect the actual size.

FIG. 1 is a cross-sectional view of an embodiment of a light source module, FIG. 2 is a cross-sectional view of the light emitting device package of FIG. 1, and FIG. 3 is a cross-sectional view of the circuit substrate of FIG.

The light source module includes a circuit board 100, an array of light emitting device packages 200 disposed on the first surface of the circuit board 100, and an array of heat dissipating units 300 disposed on the second surface of the circuit board 100 .

The circuit board 100 is provided with a thermally conductive member 310 in a via-hole type so that the heat emitted from the light emitting device package 200 is transferred to the heat dissipating unit 300. The heat conductive member 310 may be provided for each heat dissipation unit 300 corresponding to each light emitting device package 200.

The thermally conductive member 310 is made of a material having a high thermal conductivity. For example, metal such as copper or aluminum may be used. However, the thermally conductive member 310 may be disposed so as not to be electrically short-circuited with a conductive pattern in a circuit board 100 described later.

The light emitting device package 200 array includes at least two light emitting device packages 200 arranged therein. The structure of the light emitting device package 200 is as follows.

Referring to FIG. 2, a light emitting device package 200 according to an embodiment may include a lead frame in a package body 210. The lead frame may include a first lead frame 221 electrically isolated from the first lead frame 221, Frame 222 as shown in FIG.

The light emitting device 230 may be disposed on the package body 210 and may be bonded to the first lead frame 221 and / or the second lead frame 222 and the wires 250. The light emitting device 230 may be fixed to the first lead frame 221 through the conductive adhesive layer 240. The light emitting device 230 may be a horizontal type light emitting device, a vertical type light emitting device, and a flip chip type light emitting device.

A cavity is formed in the package body 210, and the light emitting device 230 is disposed on a bottom surface of the cavity. Specifically, the upper portion of the body 210 is opened so that the side surface and the bottom surface can form a cavity.

In addition, the package body 210 around the light emitting device 230 may form an inclined surface to increase light extraction efficiency. The resin layer 260 is filled in the cavity, and the phosphor 270 may be disposed in the resin layer 260. The wavelength of light emitted from the light emitting device 230 may be changed by the phosphor 270.

Although the surface of the resin layer 260 is shown as being flat in the figure, the center may be convex or concave. A lens (not shown) is disposed on the resin layer 260, so that the directivity angle of the light emitting device package can be adjusted.

The thermally conductive member 310 of FIG. 1 may contact the first lead frame 221 indicated by 'A', so that the first lead frame 221, which contacts the light emitting device 230, Because. The second lead frame 222 is electrically disconnected from the thermally conductive member 310 so that the first and second lead frames 221 and 222 are not short-circuited through the heat dissipation unit 300. The thermally conductive member 310 may further promote heat dissipation from the light emitting device package 200 to the heat dissipating unit 300. [

Referring to FIG. 3, the circuit board 100 is disposed with a conductive pattern and can be flexible.

The circuit board 100 includes a first insulating layer 150, a conductive pattern 130 and a second insulating layer 110. The conductive pattern 130 is electrically connected to the conductive pattern 130 through the adhesive layers 120 and 140, 1,2 insulation layer (110, 150).

The first and second insulating layers 150 and 110 may be made of an insulating material such as polyimide and the thickness t ₅ and t _{1 of the first} and second insulating layers 150 and 110 may be 20 to 30 micrometers Lt; / RTI >

The conductive pattern 130 is formed of a conductive material such as copper (Cu) in a predetermined pattern, and may be disposed at a thickness (t ₃ ) of 30 to 45 micrometers.

The two adhesives 120, 140 may be made of a non-conductive material or a conductive material, each having a thickness (t ₄ , t ₂ ) of 8 to 12 micrometers. A conductive pattern 130 is disposed on the first insulating layer 150 through an adhesive 140 and a second insulating layer 110 is disposed on the conductive pattern 130 through an adhesive 120.

The array of heat sinks 300 may be disposed of a material having high thermal conductivity, and may include at least one of copper (Cu), aluminum (Al), and anodized aluminum.

Each of the arrays of the heat dissipation units 300 may have a thickness of 1 to 5 micrometers. If the thickness is too thin, the heat dissipation unit 300 may not be sufficient for heat dissipation. If the thickness is too large, the volume or mass of the light source module may increase, Implementation of a flexible light source module may be difficult.

FIG. 4 is a plan view of the light source module of FIG. 1. FIG.

(a) and (b) show the light source module in the direction of the array of heat sinks 300, and the array of light emitting device packages 200 in the opposite direction are shown in dotted lines.

(a), the array of light emitting device packages 200 is arranged in one line, and the array of the heat dissipating unit 300 is arranged corresponding to the array of the light emitting device packages 200. (b), the array of light emitting device packages 200 is arranged in two rows, and the array of heat emitting units 300 is arranged in two rows corresponding to the array of the light emitting device packages 200.

In FIG. 4, the sizes of the array of light emitting device packages 200 and the array of heat dissipating units 300 may be different, and the positional relationship will be described with reference to FIG. 5 is a view showing the positional relationship between the light emitting device package and the heat dissipating unit in the light source module.

Each light emitting device package 200 may be spaced apart by a distance of 2.5 to 3.5 micrometers, which is the distance between the opposite edges of the adjacent light emitting device package 200.

The width w of each of the heat dissipation units 300 may be greater than the width of the light emitting device package 200 to increase the heat dissipation effect. As shown in FIG.

The distance d that the heat dissipation unit 300 protrudes from the corresponding light emitting device package 200 may be less than 1 micrometer.

The thermally conductive member 310 may be disposed at a central region of the light emitting device package 200. However, the thermally conductive member 310 may be biased toward the first lead frame 221 in consideration of the structure of the light emitting device package 200 of FIG.

6 is a diagram showing the operation of the light source module of FIG.

When the heat emitted from the light emitting device package 200 is transmitted to the circuit board 100, the heat can be discharged to the outside through the heat dissipating unit 300. Since the circuit board 100 is flexible and can receive a force indicated by an arrow, the plurality of heat-dissipating units 300 are spaced apart from each other by a predetermined distance. Therefore, in the bending direction of the circuit board 100, .

When heat is concentrated on the array of heat dissipation units 300 and the area of each heat dissipation unit 300 is increased, the entire deflection direction of the light source module may be opposite to that of FIG.

FIG. 7 is a sectional view of another embodiment of the light source module, FIG. 8 is a plan view of FIG. 7, and FIG. 9 is a perspective view of the light source module of FIG.

The light source module according to the present embodiment includes a flexible printed circuit board 100 on which conductive patterns are disposed, a light emitting device package 200 array disposed on the first surface of the circuit substrate, And a second substrate 350 disposed on the second substrate 350.

The circuit board 100 may serve as a first substrate and the second substrate 350 may be patterned to expose the circuit board 100 corresponding to an area between adjacent light emitting device packages 200. [ That is, the second substrate 350 can be opened without forming the second substrate 350 on the second surface corresponding to the region where the light emitting device package 200 is not disposed on the first surface of the circuit substrate 100.

The configurations of the circuit board 100 and the light emitting device package 200 are the same as those in the above embodiment. The second substrate 350 may have a thickness of 1 to 5 millimeters and may include at least one of copper, aluminum, and anodized aluminum. Since the second substrate 350 emits heat from the first substrate 100, the second substrate 350 may be made of a material different from that of the circuit board 100.

The thermally conductive member 310 contacts each light emitting device package 200 and the second substrate 350 and may be disposed in the via hole type in the circuit board 100.

8 shows the light source module in the direction of the second substrate 350, and the light emitting device package 200 is shown with a dotted line. The second substrate 350 is patterned and opened in an area between the light emitting device packages 200, and the circuit substrate 100 is exposed in the open area.

9 (a) is a perspective view of the light source module in the direction of the light emitting device package 200, and FIG. 9 (b) is a perspective view of the light source module in the direction of the second substrate 350.

(a), the three light emitting device packages 200 are spaced apart from each other by a predetermined distance, and the distance between the light emitting device packages 200 is the same as in the above embodiment. the second substrate 350 is patterned in a region corresponding to the region between the light emitting device package 200 and the light emitting device package 200, and the circuit substrate 100 is exposed in the patterned region.

The second substrate 350 functions as a heat dissipation part, and the area between the light emitting device packages 200 may have a relatively small heat to be transmitted, so that the heat dissipation part may not be formed. This configuration can be expected to reduce the material of the second substrate 350 and thereby reduce the volume, while it is sufficient for the heat dissipation of the light source module. In the case of the volume expansion of the second substrate 350 due to heat, So that lifting between the substrate 100 and the second substrate 350 can be prevented.

A light guide plate, a prism sheet, a diffusion sheet, and the like may be disposed on the light path of the light source module according to the embodiment. The light source module and the optical member can function as a backlight unit. Further, the light source module described in the embodiments may be implemented as an image display device, an indicating device, an illumination system, for example, the illumination system may include a lamp, a landscape, and the like.

10 is a view showing an embodiment of a lighting device in which a light source module is disposed.

The illumination device according to the embodiment includes a light source module 600 for projecting light, a housing 400 in which the light source module 600 is installed, a heat sink 500 for emitting heat of the light source module 600, And a holder 700 for coupling the module 600 and the heat dissipating unit 500 to the housing 400.

The housing 400 includes a socket coupling portion 410 coupled to an electrical socket and a body portion 420 connected to the socket coupling portion 410 and having a light source module 600 embedded therein. The body 420 may have one air flow hole 430 formed therethrough.

A plurality of air flow openings 430 are provided on the body portion 420 of the housing 400. The air flow openings 430 may be formed of one air flow openings or a plurality of flow openings may be radially arranged Various other arrangements are also possible.

The configuration of the light source module 600 is the same as that described with reference to FIG. 1 to FIG.

A holder 700 is provided under the light source module 600. The holder 700 may include a frame and another air flow port. Although not shown, an optical member may be provided under the light source module 600 to diffuse, scatter, or converge the light projected from the light source module 600.

11 is a view showing an embodiment of an image display device in which a light source module is arranged.

As shown in the figure, the image display device 800 according to the present embodiment includes a light source module, a reflection plate 820 on the bottom cover 810, a light guide plate 820 disposed in front of the reflection plate 820, A first prism sheet 850 and a second prism sheet 860 disposed in front of the light guide plate 840 and a second prism sheet 860 disposed between the first prism sheet 860 and the second prism sheet 860, And a color filter 880 disposed at the front of the panel 870. The panel 870 includes a front panel 870,

The light source module includes the above-described light emitting device package 835 on the circuit board 830, and the above-described heat radiating portion may be disposed on the back surface of the circuit board 830.

The bottom cover 810 may house the components in the image display device 800. The reflection plate 820 may be formed as a separate component as shown in the drawing, or may be formed to be coated on the rear surface of the light guide plate 840 or on the front surface of the bottom cover 810 with a highly reflective material Do.

Here, the reflection plate 820 can be made of a material having a high reflectance and can be used in an ultra-thin shape, and polyethylene terephthalate (PET) can be used.

The light guide plate 840 scatters light emitted from the light emitting device package module so that the light is uniformly distributed over the entire screen area of the LCD. Accordingly, the light guide plate 840 is made of a material having a good refractive index and transmittance. The light guide plate 840 may be formed of polymethyl methacrylate (PMMA), polycarbonate (PC), or polyethylene (PE). An air guide system is also available in which the light guide plate is omitted and light is transmitted in a space above the reflective sheet 820.

The first prism sheet 850 is formed on one side of the support film with a transparent and elastic polymeric material, and the polymer may have a prism layer in which a plurality of steric structures are repeatedly formed. As shown in the drawings, the plurality of patterns may be repeatedly provided with a stripe pattern.

In the second prism sheet 860, the edges and the valleys on one surface of the support film may be perpendicular to the edges and the valleys on one surface of the support film in the first prism sheet 850. This is to disperse the light transmitted from the light source module and the reflection sheet evenly in all directions of the panel 870.

In the present embodiment, the first prism sheet 850 and the second prism sheet 860 form an optical sheet, which may be formed of other combinations, for example, a microlens array or a diffusion sheet and a microlens array Or a combination of one prism sheet and a microlens array, or the like.

The panel 870 may include a liquid crystal display (LCD), and may include other types of display devices that require a light source.

In the panel 870, the liquid crystal is positioned between the glass bodies, and the polarizing plate is placed on both glass bodies to utilize the polarization of light. Here, the liquid crystal has an intermediate property between a liquid and a solid, and liquid crystals, which are organic molecules having fluidity like a liquid, are regularly arranged like crystals. The liquid crystal has a structure in which the molecular arrangement is changed by an external electric field And displays an image.

A liquid crystal display panel used in a video display device is an active matrix type, and a transistor is used as a switch for adjusting a voltage supplied to each pixel.

A color filter 880 is provided on the front surface of the panel 870 so that light projected from the panel 870 transmits only red, green, and blue light for each pixel.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, It will be understood that various modifications and applications are possible. For example, each component specifically shown in the embodiments can be modified and implemented. It is to be understood that all changes and modifications that come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

100: circuit board 200: light emitting device package
210: package body 221, 222: first and second lead frames
230: light emitting element 240: conductive adhesive layer
250: wire 260: resin layer
270: phosphor layer 300:
310: thermally conductive member 350: second substrate
400: housing 500:
600: light source module 700: holder
800: Display device 810: Bottom cover
820: reflector 830: circuit board module
840: light guide plate 850, 860: first and second prism sheets
870: Panel 880: Color filter

Claims (15)

A flexible circuit board on which a conductive pattern is disposed;
A light emitting device package array including at least one light emitting device package disposed on a first side of the circuit board;
A heat dissipating unit array disposed at a predetermined distance on a second surface opposite to the first surface of the circuit board and including at least one heat dissipating unit corresponding to the at least one light emitting device package; And
And a heat conducting member disposed between the at least one light emitting device package and the at least one heat emitting member and penetrating the circuit board and contacting the at least one light emitting device package and the at least one heat emitting portion, . A flexible circuit board on which a conductive pattern is disposed;
A light emitting device package array including at least one light emitting device package disposed on a first side of the circuit board;
Wherein the circuit board is disposed on a second surface opposite to the first surface of the circuit board so that the circuit board corresponding to a region between the adjacent light emitting device packages is exposed, At least one second substrate disposed on the substrate; And
And a thermally conductive member disposed on the at least one light emitting device package and the at least one second substrate, the thermally conductive member passing through the circuit substrate and in contact with the at least one light emitting device package and the at least one second substrate Light source module. 3. The method according to claim 1 or 2,
Wherein each of the light emitting device packages is disposed at a distance of 2.5 to 3.5 micrometers. The method according to claim 1,
Wherein the heat dissipating unit array includes at least one of copper, aluminum, and anodized aluminum. 3. The method of claim 2,
Wherein the second substrate comprises at least one of copper, aluminum, and anodized aluminum. The method according to claim 1,
Wherein the heat dissipating unit array has a thickness of 1 to 5 millimeters. 3. The method of claim 2,
And the thickness of the second substrate is 1 to 5 millimeters. The method according to claim 1,
Wherein the width of each of the heat dissipation units is greater than the width of the at least one light emitting device package. delete delete 3. The method of claim 2,
Wherein the circuit board and the second substrate are made of different materials. A light source module according to any one of claims 1, 2, 4 to 8, and 11;
A housing housing the light source module;
A heat dissipation unit for dissipating heat generated in the light source module,
A holder for coupling the light source module and the heat dissipation unit to the housing,
. delete delete delete

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