KR20120014490A - Light emitting package having lead frame - Google Patents

Abstract

PURPOSE: A light emitting device package which includes a lead frame is provided to prevent separation or displacement of the lead frame, thereby improving productivity of the light emitting device package. CONSTITUTION: An inner terminal(221,231) of a lead frame(220,230) is arranged within a body(210). An outer terminal(222,232) of the lead frame are consecutively arranged with the inner terminal. The outer terminal arranges an electrode by being projected to the outside of the body. The inner terminal includes an end part arranged on the lower part of a wall. A protrusion(223,233) is arranged on the end part.

Description

Light emitting device package including a lead frame {Light emitting package having lead frame}

Embodiments relate to a light emitting device package including a lead frame including a protrusion.

Light Emitting Diode (LED) is a device that converts an electric signal into a light form using the characteristics of a compound semiconductor, and is used for home appliances, remote controllers, electronic displays, indicators, and various automation devices. There is a trend.

In general, miniaturized LEDs are made of a surface mounting device for mounting directly on a PCB (Printed Circuit Board) substrate, and an LED lamp used as a display device is also being developed as a surface mounting device type . Such a surface mount device can replace a conventional simple lighting lamp, which is used for a lighting indicator for various colors, a character indicator, an image indicator, and the like.

Meanwhile, bending of the lead frame is performed during manufacturing of the light emitting device package to form an electrode of the light emitting device package. Force applied to the lead frame for this bending may cause displacement or departure of the lead frame.

This increases the likelihood of occurrence of a defective light emitting device package, and thus, the reliability, economy, and productivity of the light emitting device package may be deteriorated.

The embodiment is to reliably mount the lead frame on the body and to form the electrode of the light emitting device package reliably, thereby improving the reliability, economy and productivity of the light emitting device package.

The light emitting device package according to the embodiment includes a body formed with a cavity and a wall; A lead frame mounted to the body; And a light source unit electrically connected to the lead frame, wherein the lead frame includes an inner terminal positioned in the body and an outer terminal continuously formed with the inner terminal and protruding outside the body to form an electrode, wherein the inner terminal is a wall. And an end portion positioned below the portion, the protrusion being formed at the end portion.

In addition, the bent portion is formed in the protruding portion.

In addition, the protrusions and protrusions are formed.

Also, perforations are formed in the protrusions.

The light emitting device package according to the embodiment may be prevented from displacement or separation of the lead frame, thereby improving the reliability, economy and productivity of the light emitting device package.

1 is a front view showing the structure of a light emitting device package including a lead frame including a protrusion according to an embodiment.
2 is a partial perspective view illustrating a light emitting device package including a lead frame including a protrusion according to an exemplary embodiment.
3 is a partial perspective view illustrating a light emitting device package including a lead frame including a protrusion formed with a bent portion according to an embodiment.
4 is a cross-sectional view illustrating a light emitting device package including a lead frame including a protrusion having a bent portion according to an embodiment.
5 is a partial perspective view illustrating a light emitting device package including a lead frame including a protrusion having protrusions and protrusions formed thereon according to an exemplary embodiment.
FIG. 6 is a partial perspective view illustrating a light emitting device package including a lead frame including a protrusion formed with a perforation according to an embodiment. FIG.
7A is a perspective view illustrating a lighting device including a light emitting device package according to an embodiment.
FIG. 7B is a cross-sectional view illustrating the AA ′ cross section of the lighting apparatus of FIG. 7A.
8 is an exploded perspective view of a liquid crystal display including the optical sheet according to the embodiment.
9 is an exploded perspective view of a liquid crystal display including the optical sheet according to the embodiment.

In the description of the embodiments, the drawings are exaggerated, omitted, or schematically illustrated for convenience and clarity of description. In addition, the size of each component does not necessarily reflect the actual size.

Hereinafter, exemplary embodiments will be described in more detail with reference to the accompanying drawings.

1 is a front view showing the structure of a light emitting device package including a lead frame including a protrusion according to an embodiment.

Referring to FIG. 1, the light emitting device package 100 includes a body 110 having a cavity and wall portions 111 and 112, lead frames 140 and 150 mounted on the body 110, and lead frames 140 and 150. ) May include a light source unit 130 electrically connected to the light source unit 130. Portions of the light emitting device package 100 that are not visible in appearance are shown by dotted lines.

The body 110 is made of a resin material such as polyphthalamide (PPA), silicon (Si), aluminum (Al), aluminum nitride (AlN), photosensitive glass (PSG), polyamide 9T (PA9T) ), Neo geotactic polystyrene (SPS), a metal material, sapphire (Al ₂ O ₃ ), beryllium oxide (BeO), may be formed of at least one of a printed circuit board (PCB, Printed Circuit Board). The body 110 may be formed by injection molding, etching, or the like, but is not limited thereto.

The inner surface of the body 110 may be formed inclined surface. The angle of reflection of the light emitted from the light source unit 130 may vary according to the angle of the inclined surface, thereby adjusting the directivity angle of the light emitted to the outside.

As the direction angle of the light decreases, the concentration of light emitted from the light source 130 to the outside increases. On the contrary, as the direction angle of light increases, the concentration of the light emitted from the light source 130 to the outside decreases.

On the other hand, the shape viewed from above the cavity formed in the body 110 may be a shape of a circle, a square, a polygon, an oval, etc., may be a curved shape of the corner, but is not limited thereto.

The light source unit 130 is electrically connected to the lead frames 140 and 150, and the light source unit 130 may be, for example, a light emitting diode.

The light emitting diode may be, for example, a colored light emitting diode emitting light of red, green, blue, white, or the like, or an Ultra Violet (UV) emitting diode emitting ultraviolet light, but is not limited thereto. In addition, one or more light emitting diodes may be mounted.

In addition, the light emitting diode is applicable to both a horizontal type in which the electrical terminals are formed on the upper surface, or to a vertical type or flip chip formed on the upper and lower surfaces. .

The encapsulant 120 may be filled in the cavity to cover the light source 130.

The encapsulant 120 may be formed of silicon, epoxy, and other resin materials, and may be formed by filling in a cavity and then UV or thermal curing.

In addition, the encapsulant 120 may include a phosphor, and a kind of the phosphor may be selected as a wavelength of light emitted from the light source 130 to allow the light emitting device package 100 to realize white light.

The phosphor may be one of a blue light emitting phosphor, a blue green light emitting phosphor, a green light emitting phosphor, a yellow green light emitting phosphor, a yellow light emitting phosphor, a yellow red light emitting phosphor, an orange light emitting phosphor, and a red light emitting phosphor according to a wavelength of light emitted from the light source unit 130. Can be applied.

That is, the phosphor may be excited by the light having the first light emitted from the light source unit 130 to generate the second light. For example, when the light source unit 130 is a blue light emitting diode and the phosphor is a yellow phosphor, the yellow phosphor may be excited by blue light to emit yellow light, and excited by blue light and blue light generated from the blue light emitting diode. As the generated yellow light is mixed, the light emitting device package 100 may provide white light.

Similarly, when the light source unit 130 is a green light emitting diode, a magenta phosphor or a mixture of blue and red phosphors is mixed. When the light source unit 130 is a red light emitting diode, a cyan phosphor or a blue and green phosphor is used. For example.

Such phosphor may be a known phosphor such as YAG, TAG, sulfide, silicate, aluminate, nitride, carbide, nitridosilicate, borate, fluoride or phosphate.

Each lead frame 140 and 150 may be formed of a metal material, for example, titanium (Ti), copper (Cu), nickel (Ni), gold (Au), chromium (Cr), tantalum (Ta), or platinum ( Pt, Tin (Sn), Silver (Ag), Phosphorus (P), Aluminum (Al), Indium (In), Palladium (Pd), Cobalt (Co), Silicon (Si), Germanium (Ge), Hafnium ( Hf), ruthenium (Ru), iron (Fe) may include one or more materials or alloys. In addition, the lead frames 140 and 150 may be formed to have a single layer or a multilayer structure, but is not limited thereto.

Each lead frame 140, 150 is mounted on the body 110, and each lead frame 140, 150 includes a first lead frame 140 and a second lead frame 150. The first lead frame 140 and the second lead frame 150 are separated from each other and electrically separated from each other. The first lead frame 140 is in direct contact with the light source 130 or electrically connected through a conductive material (not shown). In addition, the second lead frame 150 is electrically connected to the light source unit 130 by wire bonding (not shown). Therefore, when power is connected to each of the lead frames 140 and 150, power may be applied to the light source unit 130.

The first lead frame 140 includes a first inner terminal 141 and a first outer terminal 142. In addition, the second lead frame 150 includes a second internal terminal 151 and a second external terminal 152. One region of each of the inner terminals 141 and 151 forms one region of the bottom of the cavity formed in the body, and an end of each of the inner terminals 141 and 151 is formed under the wall 111 and 112. do. The light source unit 130 is mounted on the first internal terminal 141.

Each of the external terminals 142 and 152 is formed continuously with each of the internal terminals 141 and 151 and is exposed to the outside of the body 110. In order to form an electrode of the light emitting device package 100, each of the external terminals 142 and 152 may be bent to contact the body 110.

The lead frames 140 and 150 of the light emitting device package 100 according to the embodiment may include protrusions 143 and 153 formed at ends of the respective inner terminals 141 and 151. The protrusions 143 and 153 may include a bent portion (not shown) and an uneven portion (not shown), and perforations (not shown) may be formed in the protrusions 143 and 153. When the lead frames 140 and 150 are bent, the protrusions 143 and 153 may support the lead frames 140 and 150 so as not to be displaced or separated. By the structure of the lead frames 140 and 150, more reliable installation of the lead frames 140 and 150 and electrode formation can be ensured. This will be described later in detail with reference to FIGS. 2 to 6.

2 is a partial perspective view illustrating a light emitting device package including a lead frame including a protrusion according to an exemplary embodiment.

In a preferred embodiment, protrusions 223 and 233 may be formed in the respective internal terminals 221 and 231. The protrusions 223 and 233 may be formed at end portions of the internal terminals 221 and 231 positioned below the wall portion (not shown) of the body 210. The protrusions 223 and 233 may be continuously formed with the inner terminals 221 and 231 and may protrude in the longitudinal direction of the inner terminals 221 and 231. The protrusions 223 and 233 may support the lead frames 220 and 230 so that the lead frames 220 and 230 are not displaced or separated when the lead frames 220 and 230 are bent. By the structure of the lead frames 220 and 230, more reliable installation of the lead frames 220 and 230 and electrode formation can be ensured.

In a preferred embodiment, the angle θ formed between the side surfaces of the protrusions 223 and 233 and the side surfaces of the external terminals 222 and 232 may be 90 ° or less. When the angle θ formed between the side surfaces of the protrusions 223 and 233 and the side surfaces of the external terminals 222 and 232 is 90 degrees or less, the protrusions 223 and 233 may have an effective anchoring effect. Therefore, when the lead frames 220 and 230 are bent, displacement or departure of the lead frames 220 and 230 may be more effectively prevented. By the structure of the lead frames 220 and 230, more reliable installation of the lead frames 220 and 230 and electrode formation can be ensured.

3 and 4 are partial perspective views and cross-sectional views showing a light emitting device package including a lead frame including a protrusion formed with a bent portion according to an embodiment.

In one preferred embodiment, the protrusions 323, 333 may include one or more bends 324, 334. Although each of the bent portions 324 and 334 is shown to be formed in an upward direction in the drawing, the protrusions 323 and 333 may be bent several times in several directions to form several bent portions 324 and 334. It is not limited.

When the bent portions 324 and 334 are formed in the protrusions 323 and 333, the protrusions 323 and 333 and the body 310 may contact each other at several positions to support the lead frames 220 and 230. Therefore, displacement or separation of the lead frames 320 and 330 can be prevented more effectively. By the structure of the lead frames 320 and 330, more reliable installation of the lead frames 320 and 330 and electrode formation can be ensured.

5 is a partial perspective view illustrating a light emitting device package including a lead frame including a protrusion having protrusions and protrusions formed thereon according to an exemplary embodiment.

In one preferred embodiment, the protrusions 523 and 533 may include irregularities 524 and 534. Although the shape of each of the uneven parts 524 and 534 has a quadrangular shape in the drawing, the shapes of the uneven parts 524 and 534 may be a sawtooth shape or a wave shape, but are not limited thereto.

When the uneven portions 524 and 534 are formed in the protrusions 523 and 533, the protrusions 523 and 533 and the body 510 may contact each other at several positions to support the lead frames 520 and 530. Therefore, displacement or departure of the lead frames 520 and 530 can be prevented more effectively. By the structure of the lead frames 520 and 530, more reliable installation of the lead frames 520 and 530 and electrode formation can be ensured.

FIG. 6 is a partial perspective view illustrating a light emitting device package including a lead frame including a protrusion formed with a perforation according to an embodiment. FIG.

In one preferred embodiment, projections 623 and 633 may be formed with perforations 624 and 634. In the drawing, although each of the protrusions 623 and 633 has one perforation 624 and 634 formed in a quadrangular shape, the perforations 624 and 634 may be polygonal, circular, or the like, and the number may be several. It is not limited thereto. Perforations 624 and 634 are filled with a portion of body 610.

When the perforations 624 and 634 are formed in the protrusions 623 and 633, the perforations 624 and 634 serve to fix the lead frames 620 and 630 to the body 610, thereby leading to the lead frames 620 and 630. The lead frames 620 and 630 may be supported so that the lead frames 620 and 630 are not displaced or dislodged when they are bent. Therefore, displacement or departure of the lead frames 620 and 630 can be more effectively prevented. By the structure of the lead frames 620 and 630, more reliable installation of the lead frames 620 and 630 and electrode formation can be ensured.

FIG. 7A is a perspective view illustrating a lighting device including a light emitting device package according to an embodiment, and FIG. 7B is a cross-sectional view illustrating a cross-sectional view taken along line A-A 'of the lighting device of FIG. 7A.

Hereinafter, in order to describe the shape of the lighting apparatus 700 according to the embodiment in more detail, the longitudinal direction (Z) of the lighting apparatus 700, the horizontal direction (Y) perpendicular to the longitudinal direction (Z), and the length The height direction X perpendicular to the direction Z and the horizontal direction Y will be described.

That is, FIG. 7B is a cross-sectional view of the lighting apparatus 700 of FIG. 7A cut in the longitudinal direction Z and the height direction X, and viewed in the horizontal direction Y. As shown in FIG.

7A and 7B, the lighting apparatus 700 may include a body 710, a cover 730 fastened to the body 710, and a closing cap 750 positioned at both ends of the body 710. have.

The lower surface of the body 710 is fastened to the light emitting device module 740, the body 710 is conductive so that heat generated in the light emitting device package 744 can be discharged to the outside through the upper surface of the body 710 And it may be formed of a metal material having an excellent heat dissipation effect.

The light emitting device package 744 may be mounted on the PCB 742 in a multi-colored, multi-row array to form an array. The light emitting device package 744 may be mounted at the same interval or may be mounted with various separation distances as necessary to adjust brightness. . As the PCB 742, a metal core PCB (MCPCB) or a PCB made of FR4 may be used.

The cover 730 may be formed in a circular shape to surround the lower surface of the body 710, but is not limited thereto.

The cover 730 protects the light emitting device module 740 from the outside and the like. In addition, the cover 730 may include diffusing particles to prevent the glare of the light generated from the light emitting device package 744 and to uniformly emit light to the outside, and at least of the inner and outer surfaces of the cover 730 A prism pattern or the like may be formed on either side. In addition, a phosphor may be applied to at least one of an inner surface and an outer surface of the cover 730.

On the other hand, since the light generated from the light emitting device package 744 is emitted to the outside through the cover 730, the cover 730 should have excellent light transmittance, and has sufficient heat resistance to withstand the heat generated in the light emitting device package 744 The cover 730 is preferably formed of a material including polyethylene terephthalate (PET), polycarbonate (PC), polymethyl methacrylate (PMMA), or the like. .

The closing cap 750 is located at both ends of the body 710 may be used for sealing the power supply (not shown). In addition, the closing cap 750 is formed with a power pin 752, the lighting device 700 according to the embodiment can be used immediately without a separate device to the terminal from which the existing fluorescent lamps are removed.

8 is an exploded perspective view of a liquid crystal display including the optical sheet according to the embodiment.

8 is an edge-light method, the liquid crystal display 800 may include a liquid crystal display panel 810 and a backlight unit 870 for providing light to the liquid crystal display panel 810.

The liquid crystal display panel 810 may display an image using light provided from the backlight unit 870. The liquid crystal display panel 810 may include a color filter substrate 812 and a thin film transistor substrate 814 facing each other with a liquid crystal interposed therebetween.

The color filter substrate 812 may implement colors of the image displayed through the liquid crystal display panel 810.

The thin film transistor substrate 814 is electrically connected to the printed circuit board 818 on which a plurality of circuit components are mounted through the driving film 817. The thin film transistor substrate 814 may apply a driving voltage provided from the printed circuit board 818 to the liquid crystal in response to the driving signal provided from the printed circuit board 818.

The thin film transistor substrate 814 may include a thin film transistor and a pixel electrode formed of a thin film on another substrate of a transparent material such as glass or plastic.

The backlight unit 870 may convert the light provided from the light emitting device module 820, the light emitting device module 820 into a surface light source, and provide the light guide plate 830 to the liquid crystal display panel 810. Reflective sheet for reflecting the light emitted from the rear of the light guide plate 830 and the plurality of films 850, 866, 864 to uniform the luminance distribution of the light provided from the 830 and improve the vertical incidence ( 840).

The light emitting device module 820 may include a PCB substrate 822 such that a plurality of light emitting device packages 824 and a plurality of light emitting device packages 824 are mounted to form an array.

The backlight unit 870 includes a diffusion film 866 that diffuses light incident from the light guide plate 830 toward the liquid crystal display panel 810, and a prism film 850 that concentrates the diffused light to improve vertical incidence. ), And may include a protective film 864 for protecting the prism film 850.

9 is an exploded perspective view of a liquid crystal display including the optical sheet according to the embodiment. However, the parts shown and described in FIG. 8 will not be repeatedly described in detail.

9 is a direct view, the liquid crystal display device 900 may include a liquid crystal display panel 910 and a backlight unit 970 for providing light to the liquid crystal display panel 910.

Since the liquid crystal display panel 910 is the same as described with reference to FIG. 7, detailed description thereof will be omitted.

The backlight unit 970 includes a plurality of light emitting device modules 923, a reflective sheet 924, a lower chassis 930 in which the light emitting device modules 923 and the reflective sheet 924 are accommodated, and an upper portion of the light emitting device modules 923. It may include a diffusion plate 940 and a plurality of optical film 960 disposed in the.

LED Module 923 A plurality of LED package 922 and a plurality of LED package 922 may be mounted to include a PCB substrate 921 to form an array.

In particular, the light emitting device package 922 is formed of a conductive material, and by providing a film including a plurality of holes on the light emitting surface, it is possible to omit the lens to implement a slim light emitting device package, at the same time light extraction efficiency Can improve. Therefore, the thinner backlight unit 970 can be implemented.

The reflective sheet 924 reflects the light generated from the light emitting device package 922 in the direction in which the liquid crystal display panel 910 is located to improve light utilization efficiency.

Meanwhile, the light generated by the light emitting device module 923 is incident on the diffusion plate 940, and the optical film 960 is disposed on the diffusion plate 940. The optical film 960 includes a diffusion film 966, a prism film 950, and a protective film 964.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, It should be understood that various modifications may be made by those skilled in the art without departing from the spirit and scope of the present invention.

140: first lead frame 141: first internal terminal
142: first external terminal 150: second lead frame
223, 233: protrusion 324, 334: bend
524, 534: uneven portion 624, 634: perforation

Claims (10)

A cavity in which the cavity and the wall are formed;
A lead frame mounted to the body;
And a light source unit electrically connected to the lead frame.
The lead frame includes an inner terminal positioned in the body, and an outer terminal continuously formed with the inner terminal and protruding outside the body to form an electrode.
The inner terminal includes an end portion positioned below the wall portion, the end of the light emitting device package is formed with a protrusion. The method of claim 1,
The cavity is filled with an encapsulant covering the light source portion. The method of claim 2,
The encapsulant comprises a phosphor package. The method of claim 1,
The light source unit is a light emitting device package. The method of claim 1,
The angle formed by the side of the protrusion and the side of the external terminal is less than 90 ° light emitting device package. The method of claim 1,
The protrusion is a light emitting device package including a bent portion. The method of claim 1,
The protrusion is a light emitting device package including an uneven portion. The method of claim 1
The protrusion is formed in the light emitting device package. An illumination device comprising the light emitting device package of any one of claims 1 to 8. A backlight unit comprising the light emitting device package of any one of claims 1 to 8.

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